Refrigerator

Abstract

The invention relates to the technical field of refrigeration, in particular to a refrigerator. According to the refrigerator, the memory alloy spring is arranged at the air inlet of the air duct, the memory alloy spring is heated to deform when sensing that the air temperature of the evaporation cavity rises, and the air door is driven to move to shield the air inlet. The auxiliary heating device is arranged to supply power to the memory alloy spring, so that the memory alloy spring is heated, the temperature of the memory alloy spring rapidly reaches the complete phase change temperature, the memory alloy spring rapidly drives the air door to completely close the air inlet, and defrosting heat is prevented from entering the storage chamber through the air inlet. And moreover, the memory alloy spring is used as a heating body, so that the overall temperature rise of the memory alloy spring has better consistency, the memory alloy spring can be smoothly and reliably deformed, and the possibility of jamming caused by inconsistent deformation of the memory alloy spring is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of refrigeration, in particular to a refrigerator. BACKGROUND

[0002] In the use of the refrigerator, the air in the storage compartment contains moisture, and the air will freeze when passing through the evaporator. When the frost condenses to a certain thickness, it will affect the smoothness of the air flowing through the evaporator, and further affect the refrigeration effect. Therefore, defrosting needs to be performed regularly. A heater is usually arranged below the evaporator, and the heat generated by the heater melts the frost. However, since the chamber where the evaporator is located is communicated with the storage compartment, the heat generated by the defrosting enters the storage compartment through the air duct, causing the temperature in the storage compartment to rise, which affects the storage quality.

[0003] In some refrigerators, the ability of a memory alloy part to deform in response to temperature is used to drive the air door to move, so as to block the path of defrosting heat entering the storage compartment, or open the path of cold air entering the storage compartment.

[0004] However, the memory alloy part has a temperature difference between the start temperature and the end temperature of the phase change, so that the deformation time of the memory alloy part is relatively long, and thus the time required for the air door to close during defrosting is relatively long, resulting in that part of the defrosting heat can still enter the storage compartment, affecting the quality of the storage compartment. SUMMARY

[0005] The present application provides a refrigerator which can improve the closing speed of the air door and reduce the defrosting heat entering the storage compartment.

[0006] In a first aspect, the embodiments of the present application provide a refrigerator, which comprises:

[0007] a cabinet, wherein an evaporation cavity and a storage compartment are arranged in the cabinet, an evaporator and a defrosting heater for defrosting the evaporation cavity are installed in the evaporation cavity;

[0008] an air duct component located between the evaporation cavity and the storage compartment, and configured to form an air duct for the cold air in the evaporation cavity to flow into the storage compartment; the air duct component is further configured to form an air inlet, and the air inlet is communicated with the air duct and the evaporation cavity;

[0009] an air door mechanism located in the evaporation cavity and opposite to the air inlet along the depth direction of the cabinet, the air door mechanism comprises:

[0010] an air door configured to shield or open the air inlet;

[0011] A memory alloy spring is connected to the air door and the air duct component respectively, and is configured to deform in response to temperature change of the evaporating cavity to drive the air door to move relative to the air inlet;

[0012] An auxiliary heating device includes a power supply component and a power supply wire, the power supply component is electrically connected to the memory alloy spring through the power supply wire, and the power supply component is configured to supply power to the memory alloy spring to heat the memory alloy spring after the defrosting heater is started.

[0013] The refrigerator of the embodiments of the present application is provided with a memory alloy spring at the air inlet of the air duct, which deforms in response to temperature rise of the evaporating cavity and drives the air door to move to shield the air inlet. The auxiliary heating device is provided to supply power to the memory alloy spring to heat the memory alloy spring, so that the temperature of the memory alloy spring quickly reaches the complete phase change temperature, thereby quickly driving the air door to completely close the air inlet and avoiding defrosting heat from entering the storage compartment through the air inlet. Moreover, the memory alloy spring itself is used as a heating body, which can make the overall temperature of the memory alloy spring rise uniformly, thereby making the deformation of the memory alloy spring smooth and reliable and reducing the possibility of jam caused by inconsistent deformation of the memory alloy spring.

[0014] In some embodiments of the present application, one end of the memory alloy spring forms a first connecting part, the first connecting part is electrically connected to the cable of the power supply wire, and the first connecting part is fixed relative to the air duct component.

[0015] The other end of the memory alloy spring forms a second connecting part, the second connecting part is electrically connected to the cable of the power supply wire, and the second connecting part is fixed relative to the air door.

[0016] In the embodiments of the present application, the first connecting part and the second connecting part are respectively formed at the two ends of the memory alloy spring, and the first connecting part and the second connecting part are respectively electrically connected to the power supply wire. The first connecting part is fixed relative to the air duct component, and the second connecting part is fixed relative to the air door. In this way, the two ends of the memory alloy spring are respectively fixed relative to the air door and the rear cover plate of the air duct component of the air duct component, so that the electrical connection structure of the two ends of the memory alloy spring is fixed and does not move with the deformation of the memory alloy spring, which helps to improve the reliability of the electrical connection structure.

[0017] In some embodiments of the present application, the air door mechanism further includes a first connecting piece, the first connecting piece is fixedly connected to the air duct component and fixes the first connecting part to the air duct component, and the first connecting piece and the air duct component are both insulating pieces.

[0018] In this way, the first connecting member is fixedly connected with the rear cover plate of the air duct component, and the first connecting part is fixed, so that the memory alloy spring is fixedly connected with the air duct component, the electrical connection between the first connecting part and the power supply wire is fixed, and the structure is simple and reliable. The first connecting member and the rear cover plate of the air duct component are insulating members, which provide insulation for the power supply of the memory alloy spring and improve the safety of the air door mechanism.

[0019] In some embodiments of the present application, the air door mechanism further comprises a second connecting member, which is fixedly connected with the air door and fixes the second connecting part to the air door. The second connecting member and the air door are insulating members.

[0020] The second connecting member is fixedly connected with the air door, and the second connecting part is fixed, so that the memory alloy spring is fixedly connected with the air door, the electrical connection between the second connecting part and the power supply wire is fixed, and the structure is simple and reliable. The second connecting member and the air door are insulating members, for example, plastic members, which provide insulation for the power supply of the memory alloy spring and improve the safety of the air door mechanism.

[0021] In some embodiments of the present application, one end of one cable of the power supply wire is provided with a first connecting terminal, and the first connecting part is inserted into the first connecting terminal.

[0022] The other end of the other cable of the power supply wire is provided with a second connecting terminal, and the second connecting part is inserted into the second connecting terminal.

[0023] The first connecting part is inserted into the first connecting terminal, and the second connecting part is inserted into the second connecting terminal, so as to realize the electrical connection between the memory alloy spring and the power supply wire. The connection mode is simple and reliable.

[0024] In some embodiments of the present application, a plurality of memory alloy springs are arranged along the circumference of the air inlet in a spaced manner, and the plurality of memory alloy springs are connected in series.

[0025] By arranging a plurality of memory alloy springs, sufficient driving force is ensured to drive the air door to move. The plurality of memory alloy springs are connected in series, so that the heating power of each memory alloy spring is the same, thereby improving the consistency of temperature rise of the plurality of memory alloy springs, and further improving the consistency of deformation of the plurality of memory alloy springs, so as to smoothly push the air door to move and reduce the possibility of air door jamming.

[0026] In some embodiments of the present application, the power supply wire comprises:

[0027] A first cable, two ends of the first cable are respectively electrically connected with a positive electrode of the power supply component and one end of one of the memory alloy springs;

[0028] A second cable, two ends of the second cable are electrically connected to a negative pole of the power supply component and one end of another memory alloy spring respectively.

[0029] Thus, the first cable and the second cable form a power supply loop to supply power to the memory alloy spring.

[0030] In some embodiments of the present application, the power supply wire further comprises a third cable;

[0031] Two ends of the third cable are electrically connected to two ends of the memory alloy spring fixed relative to the air door respectively.

[0032] The air door is provided with a first limiting piece on a side away from the air inlet to limit the third cable to the air door.

[0033] Thus, the third cable can be fixed to the air door, so that the third cable can move with the air door, and the third cable can be fixed relative to the air door to ensure the reliability of the electrical connection between the two adjacent memory alloy springs. The third cable can also be kept away from the air inlet to avoid affecting the air resistance.

[0034] In some embodiments of the present application, the air door is provided with a matching hole;

[0035] The air duct component forms a guide column, and the guide column passes through the matching hole.

[0036] The memory alloy spring is a columnar spring and is sleeved on the guide column; the memory alloy spring is located on a side of the air door away from the air inlet; and one end of the memory alloy spring is fixedly connected to the guide column.

[0037] In the embodiments of the present application, the matching hole and the guide column are matched between the air door and the air duct component to guide the movement of the air door. The memory alloy spring is sleeved on the guide column to limit the deformation direction of the memory alloy spring. Moreover, the guide column is located on the inner side of the memory alloy spring, which does not affect the arrangement of the power supply wire, so that the arrangement of the power supply wire is simpler.

[0038] In some embodiments of the present application, a part of the power supply wire close to the memory alloy spring is a shapeable cable, the shapeable cable is connected to the memory alloy spring and has a gap between the shapeable cable and the memory alloy spring.

[0039] By arranging the shapeable cable, a gap is formed between the shapeable cable and the memory alloy spring to avoid affecting the expansion and deformation of the memory alloy spring, and the structure is simple.

[0040] In some embodiments of the present application, the power supply wire is a flexible cable, and a second limiting member is arranged on the air duct component. The power supply wire is connected to the memory alloy spring after being limited by the second limiting member, so that a space is formed between the part of the power supply wire close to the memory alloy spring and the memory alloy spring.

[0041] By arranging the second limiting member on the air duct component, a space is formed between the part of the power supply wire close to the memory alloy spring and the memory alloy spring, so that the cable does not affect the expansion and contraction of the memory alloy spring. In addition, the flexible cable has good strength and toughness, which facilitates wiring and arrangement.

[0042] In a second aspect, the embodiments of the present application provide a refrigerator, which comprises:

[0043] a cabinet, an evaporation cavity and a storage compartment are arranged in the cabinet, an evaporator and a defrosting heater for defrosting the evaporation cavity are arranged in the evaporation cavity;

[0044] an air duct component, which is located between the evaporation cavity and the storage compartment and is configured to form an air duct for the cold air in the evaporation cavity to flow into the storage compartment; the air duct component is also configured to form an air inlet, which is connected to the air duct and the evaporation cavity;

[0045] a damper mechanism, which is located in the evaporation cavity and is opposite to the air inlet along the depth direction of the cabinet; the damper mechanism comprises:

[0046] a damper, which is configured to shield or open the air inlet;

[0047] a memory alloy spring, which is connected to the damper and the air duct component respectively; the memory alloy spring is configured to deform in response to the temperature change of the evaporation cavity, so as to drive the damper to move relative to the air inlet;

[0048] a power supply of the refrigerator is configured to intermittently supply power to the memory alloy spring after the defrosting heater is started, so that the memory alloy spring generates heat.

[0049] By intermittently heating the memory alloy spring by using the power supply of the refrigerator, the speed of closing the air inlet by the damper can be improved, and the defrosting heat can be reduced to be dissipated towards the storage compartment through the air inlet. The intermittent heating mode can not only avoid overheating of the memory alloy spring for a long time, which damages the performance of the memory alloy itself, but also saves energy consumption, and keeps the memory alloy spring in a completely phase change state, so as to keep the state of closing the air inlet by the damper.

[0050] In a third aspect, the embodiments of the present application provide a refrigerator, which comprises:

[0051] A cabinet, which is provided with an evaporation cavity and a storage compartment inside, and which is provided with an evaporator and a defrosting heater for defrosting the evaporation cavity inside;

[0052] An air duct component, which is located between the evaporation cavity and the storage compartment and is configured to form an air duct for cold air in the evaporation cavity to flow into the storage compartment; and which is configured to form an air inlet communicating the air duct and the evaporation cavity;

[0053] An air door mechanism, which is located in the evaporation cavity and is opposite to the air inlet along the depth direction of the cabinet, and which comprises:

[0054] An air door, which is configured to shield or open the air inlet;

[0055] A memory alloy spring, which is connected to the air door and the air duct component respectively;

[0056] In which, the memory alloy spring is connected in series to a circuit, when the circuit is powered on, the memory alloy spring generates heat due to its resistance property, and then deforms to drive the air door to move to gradually shield the air inlet; after the circuit is powered off, the temperature of the memory alloy spring gradually decreases and recovers deformation, thereby driving the air door to move to gradually open the air inlet.

[0057] The refrigerator of the embodiments of the present application connects the air door and the air duct component by the memory alloy spring, and connects the memory alloy spring in series to a circuit. The circuit is used to power the memory alloy spring, the memory alloy spring generates heat due to its resistance property, and then deforms to drive the air door to move to gradually shield the air inlet, so as to avoid the defrosting heat entering the storage compartment through the air inlet. After the circuit is powered off, the temperature of the memory alloy spring gradually decreases and recovers deformation, thereby driving the air door to move to gradually open the air inlet, so that the cold air in the evaporation cavity enters the storage compartment through the air inlet and the air duct, and the temperature of the storage compartment is reduced. The embodiments of the present application utilize the heat generated by the memory alloy spring itself, which can have good consistency of the overall temperature of the memory alloy spring, so as to make the deformation of the memory alloy spring smooth and reliable, and reduce the possibility of jam caused by inconsistent deformation of the memory alloy spring. Moreover, the structure is simple and easy to implement. BRIEF DESCRIPTION OF DRAWINGS

[0058] Figure 1 A memory alloy spring provided by the embodiments of the present application is provided with a phase transition temperature and strain relationship diagram;

[0059] Figure 2 A structure schematic diagram of a refrigerator provided by some embodiments of the present application is provided;

[0060] Figure 3 A cold air flow direction schematic diagram of a refrigerator provided by some embodiments of the present application is provided;

[0061] Figure 4 A schematic view of hot air emission during defrosting of a refrigerator according to some embodiments of the present application;

[0062] Figure 5 An exploded view of the air duct component and the damper mechanism according to some embodiments of the present application;

[0063] Figure 6 A schematic view of the air inlet closed by the damper according to some embodiments of the present application;

[0064] Figure 7 A rear view of the air inlet closed by the damper according to some embodiments of the present application;

[0065] Figure 8 A cross-sectional view along A-A in Figure 7

[0066] A schematic view of the air inlet opened by the damper according to some embodiments of the present application; Figure 9

[0067] A cross-sectional view along A-A in Figure 10

[0068] A schematic view of the memory alloy spring and the power supply wire according to some embodiments of the present application; Figure 11

[0069] A schematic view of the air duct component and the damper mechanism according to some other embodiments of the present application; Figure 12

[0070] A schematic view of the connection between the first connecting member and the guide column according to some embodiments of the present application; Figure 13

[0071] A schematic view of the first connecting member according to some embodiments of the present application; Figure 14

[0072] A cross-sectional view along B-B in Figure 15 Figure 7 An enlarged view of the P region in

[0073] Figure 16 Figure 15 A schematic view of the second connecting member according to some embodiments of the present application;

[0074] Figure 17 A schematic view of the air duct rear cover plate and the damper mechanism according to some other embodiments of the present application;

[0075] Figure 18 A schematic view of the air duct rear cover plate and the damper mechanism according to some other embodiments of the present application;

[0076] ​​Figure 19 An exploded view of the air duct rear cover plate and the air door mechanism is provided for some embodiments of the present application.

[0077] Legend:

[0078] 100: cabinet; 101: storage compartment; 102: evaporation cavity; 110: cabinet body; 120: rear wall of the cabinet body; 200: door body;

[0079] 300: air duct component; 301: air duct; 302: return air inlet; 310: air duct rear cover plate; 311: air inlet; 312: guide column; 3121: first clamping opening; 313: second limiting member; 320: air duct front cover plate; 321: air outlet; 322: guide groove; 323: wiring groove; 324: connecting protrusion; 330: fan;

[0080] 400: evaporator; 410: defrosting heater;

[0081] 500: air door mechanism; 510: air door; 511: lug; 5111: matching hole; 5112: second clamping opening; 5113: mounting sleeve; 520, 520a, 520b, 520c: memory alloy spring; 521: first connecting part; 522: second connecting part; 523: fixed part; 530: first connecting member; 531: connecting column part; 532: end plate part; 533: clamping protrusion; 534: limiting buckle; 540: second connecting member; 541: plate body part; 542: inner ring part; 543: outer ring part; 544: buckle; 545: second limiting groove; 546: notch part; 550: first limiting member;

[0082] 600: auxiliary heating device; 610: power supply line; 611: first cable; 612: second cable; 613: connecting terminal; 614: intermediate cable; 615, 615a, 615b: third cable; 620: power supply component. DETAILED DESCRIPTION

[0083] In order to make the purpose and embodiments of the present application more clear, the exemplary embodiments of the present application will be described clearly and completely below in combination with the drawings of the exemplary embodiments of the present application. Obviously, the described exemplary embodiments are only some of the embodiments of the present application, but not all of the embodiments of the present application.

[0084] It should be noted that the brief description of the terms in the present application is only for the convenience of understanding the subsequently described embodiments, and is not intended to limit the embodiments of the present application. Unless otherwise specified, these terms should be understood according to their ordinary and general meanings.

[0085] Moreover, the terms "first", "second", "third", etc. are used herein for descriptive purposes and are not to be construed as indicating or implying relative importance or a significant nature of the indicated elements or method steps. It is to be understood that a "first", "second", "third", etc. item or step presented could be changed with a "second", "third" or other item or step. Unless otherwise stated, the term "plurality" means two or more in the description of the application.

[0086] In the description of the present application, it needs to be understood that the terms "center", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0087] The terms "first", "second", "third", etc. are used herein for descriptive purposes and are not to be construed as indicating or implying relative importance or a significant nature of the indicated elements or method steps. It is to be understood that a "first", "second", "third", etc. item or step presented could be changed with a "second", "third" or other item or step. Unless otherwise stated, the term "plurality" means two or more in the description of the application.

[0088] In the description of the present application, it needs to be understood that the terms "installation", "connection", "connection" should be understood in a broad sense unless otherwise specified and limited, for example, it can be fixed connection, or detachable connection, or integral connection; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be the communication between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0089] A heater is arranged below the evaporator of the refrigerator, and the heat generated by the heater melts frost. However, since the chamber where the evaporator is located is communicated with the storage compartment, the heat generated by defrosting enters the storage compartment through the air duct, causing the temperature in the storage compartment to rise, affecting the storage quality.

[0090] In the related art, the ability of the shape memory alloy part to deform in response to temperature is used to drive the air door to move, blocking the path of defrosting heat entering the storage compartment during defrosting; during refrigeration, the path of cold air entering the storage compartment is opened. However, the memory alloy part has a temperature difference between the start temperature and the end temperature of the phase change, which makes the deformation time of the memory alloy part relatively long, and thus the time required for the air door to close during defrosting is relatively long, causing part of the defrosting heat to still enter the storage compartment, affecting the quality of the storage compartment.

[0091] The embodiment of the application drives the air door to move by using a memory alloy spring. When defrosting, the air door shields the air inlet to block the defrosting heat from entering the storage compartment through the air inlet. When refrigerating, the air door opens the air inlet to enable the cold air of the evaporating cavity to enter the storage compartment through the air inlet. The air inlet is arranged on the back plate of the air duct.

[0092] In combination Figure 1 A phase transition temperature and strain relationship diagram of the memory alloy spring is shown. Taking a double-path memory alloy spring as an example, the memory alloy spring in a high-temperature austenite state will undergo a phase transition from austenite to martensite when the temperature decreases (corresponding to refrigeration), the phase transition starting temperature is Ms, and the phase transition ending temperature is Mf. The memory alloy spring starts to undergo phase transition when the temperature sensed by the memory alloy spring reaches Ms. The phase transition is completed when the temperature sensed by the memory alloy spring reaches Mf, at which time the deformation of the memory alloy spring reaches a maximum value. When the temperature increases (corresponding to defrosting), the low-temperature martensite reversely phase transitions to austenite, the phase transition starting temperature is As, and the ending temperature is Af. The memory alloy spring starts to undergo phase transition when the temperature sensed by the memory alloy spring increases to As. The phase transition is completed when the temperature sensed by the memory alloy spring reaches Af, at which time the memory alloy spring returns to the high-temperature original state, and the deformation is restored. The martensite phase transition temperature curve of the memory alloy spring is not the same as the reverse martensite phase transition temperature curve, as shown in Figure 1 The four phase transition temperature relationships are Mf < Ms < As < Af. This makes the double-path memory alloy spring have a relatively wide phase transition temperature band. Af is the complete phase transition temperature of the martensite phase transition to austenite, and Mf is the complete phase transition temperature of the austenite phase transition to martensite.

[0093] The transformation temperature range refers to the entire temperature region covered by all the phase transition temperatures (Mf, Ms, As, and Af) of the memory alloy spring during the temperature increasing and decreasing processes, and characterizes the temperature span of the phase transition of the memory alloy spring when the temperature changes.

[0094] Under the defrosting working condition, the temperature sensed by the memory alloy spring needs to increase to As to start the phase transition, and Af to end the phase transition, so that the memory alloy spring at a relatively high temperature completely restores the deformation, that is, the required time for completely closing the air inlet is long, which will enable part of the defrosting heat to still enter the storage compartment, causing the temperature rise of the storage compartment.

[0095] It can be understood that the hysteresis width of the memory alloy spring affects the required time for the air door to close and open the air inlet. The hysteresis width refers to the difference between the phase transition temperatures of the memory alloy spring during the temperature increasing and decreasing processes, that is, the interval between the austenite transition temperatures (As and Af) and the martensite transition temperatures (Mf and Ms). The initial phase transition hysteresis is As minus Mf, and the complete phase transition hysteresis is Af minus Ms.

[0096] Taking Mf=-5℃, Ms=0℃, As=25℃, Af=30℃ as an example, the hysteresis width of the memory alloy spring is As-Mf=25℃-(-5℃)=30℃. After the defrosting heating starts, the temperature of the memory alloy spring rises from Mf(-5℃) to As(25℃) before it starts to drive the damper to move and start the action of closing the air inlet; until the temperature of the memory alloy spring rises to Af(30℃), the air inlet is completely closed. The large hysteresis width(30℃) makes the temperature rising process of the memory alloy spring last for a long time, which causes the closing action of the damper to the air inlet to be delayed, and thus the heat generated by defrosting can enter the storage compartment in this time period, affecting the storage temperature of the storage compartment.

[0097] Of course, after the evaporator starts to cool, the temperature of the memory alloy spring drops from Af(30℃) to Ms(0℃) before it starts to drive the damper to move and start the action of opening the air inlet; until the temperature of the memory alloy spring drops to Mf(-5℃), the air inlet is completely opened. Although the large hysteresis width(30℃) also makes the temperature dropping process of the memory alloy spring last for a long time, as long as the air inlet is opened, cold air can spread towards the storage compartment, which has little effect on the cooling process.

[0098] Therefore, based on the movement of the damper driven by the double-way memory alloy spring relative to the air inlet to open or close the air inlet, the auxiliary heating device is used to assist in heating the memory alloy spring, so as to promote the memory alloy spring to quickly recover the deformation, drive the damper to quickly close the air inlet, and thus reduce the defrosting heat entering the storage compartment through the air inlet.

[0099] In this way, the memory alloy spring itself is used as a heating body to generate heat for the memory alloy spring, which can not only make the memory alloy spring quickly rise to the complete phase change temperature, but also make the overall temperature of the memory alloy spring rise uniformly, so that the deformation of the memory alloy spring is smooth and reliable, and the possibility of local deformation of the memory alloy spring is reduced.

[0100] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of the present application.

[0101] In combination with Figure 2 , some embodiments of the present application provide a refrigerator, which includes a cabinet 100, and the cabinet 100 can be configured to form a storage compartment 101 with a taking and placing opening for storing articles.

[0102] The storage compartments 101 can be provided in plurality to expand the storage space. According to different storage temperatures of the storage compartments 101, the storage compartments 101 can include at least one refrigeration compartment and at least one freezing compartment. The internal temperature of the refrigeration compartment can be maintained at about 0℃ to 5℃ to store the articles in refrigeration mode; the internal temperature of the freezing compartment can be maintained at about -30℃ to 0℃ to store the articles in freezing mode.

[0103] In some possible implementations, at least one of the storage compartments 101 can also be provided as a vacuum chamber or a variable-temperature chamber, and the like, which will not be described herein any further.

[0104] Exemplarily, the storage compartments 101 can be provided in two, and the two storage compartments 101 can be provided in vertical stacking or side by side in horizontal direction. One of the two storage compartments 101 can be provided as a refrigeration compartment, and the other one can be provided as a freezing compartment.

[0105] In some embodiments, in combination with Figure 2 and Figure 3 , the cabinet 100 can include a cabinet body 110 and a cabinet shell. The cabinet body 110 can be configured to form the storage compartment 101 with a front opening as a taking and placing opening. The cabinet shell can be connected to the outside of the cabinet body 110 to form the appearance of the refrigerator.

[0106] The refrigerator according to the embodiments of the present application can further include a refrigeration system for reducing the air temperature of the storage compartment 101. Exemplarily, the refrigeration system can be provided in the cabinet 100. The refrigeration system can include a compressor, a condenser, a throttling device and an evaporator 400 connected in circulation.

[0107] When the refrigeration system is running, the compressor compresses the refrigerant vapor to generate high-temperature and high-pressure refrigerant vapor, and delivers the refrigerant vapor to the condenser. The condenser liquefies the high-temperature and high-pressure refrigerant vapor to generate high-temperature and low-pressure refrigerant liquid, and delivers the refrigerant liquid to the throttling device. The throttling device reduces the pressure of the refrigerant liquid to convert the high-pressure and low-temperature refrigerant liquid into low-pressure and low-temperature refrigerant liquid, and delivers the refrigerant liquid to the evaporator 400. The evaporator 400 receives the low-pressure and low-temperature refrigerant liquid and boils it under isobaric conditions to absorb heat and vaporize to form refrigerant vapor, so as to reduce the temperature in the storage compartment 101.

[0108] Continuing to refer to Figure 2 , the refrigerator according to the embodiments of the present application can further include a door body 200 rotatably connected to the cabinet 100 to open or close the taking and placing opening. Exemplarily, the door body 200 is hinged to the cabinet 100.

[0109] Each storage compartment 101 can be provided with one door body 200; or, each storage compartment 101 can be provided with two door bodies 200, and the two door bodies 200 can rotate in opposite directions to open or close the storage compartment 101.

[0110] Of course, in some possible implementation manners, a drawer is arranged in the storage compartment 101, and an outer end of the drawer is configured to form the door body 200.

[0111] In the embodiment of the present application, the box body 100 is provided with the storage compartment 101 and the evaporation cavity 102, the evaporation cavity 102 is provided with the evaporator 400 and the defrosting heater 410 for defrosting the evaporator 400; the evaporation cavity 102 and the storage compartment 101 are provided with the air duct 301 for the cold air in the evaporation cavity 102 to flow into the storage compartment 101, and the air inlet 311 of the air duct 301 is opened in the evaporation cavity 102.

[0112] In combination with Figure 3 and Figure 4 , the refrigerator can further include an air duct component 300 configured to form the air duct 301. The air duct component 300 is mounted in the box body 110, and the air duct component 300 has a spacing between the air duct component 300 and the rear wall 120 of the box body 110. Thus, the air duct component 300 divides the space in the box body 110 into the evaporation cavity 102 and the storage compartment 101, and the evaporation cavity 102 is located at the rear side of the storage compartment 101.

[0113] In combination with Figure 3 , the air duct component 300 is configured to form the air inlet 311, the air inlet 311 is connected to the air duct 301 and the evaporation cavity 102, and the air inlet 311 is located on the side of the air duct component 300 facing the evaporation cavity 102. In the height direction of the refrigerator (corresponding to the Z-axis direction in Figure 3 , the air inlet 311 is located above the evaporator 400, so that the air inlet 311 is connected to the top of the evaporation cavity 102, and thus the cold air after heat exchange of the evaporator 400 can enter the air duct 301 through the air inlet 311.

[0114] The air duct 301 is connected to the storage compartment 101 to guide the cold air after heat exchange of the evaporator 400 into the storage compartment 101 to reduce the temperature of the storage compartment 101. The side of the air duct component 300 facing the storage compartment 101 is provided with the air outlet 321, and the air outlet 321 is connected to the air duct 301 and the storage compartment 101. The air outlet 321 can be provided with a plurality of air outlets 321, some of the air outlets 321 can be arranged in the width direction of the refrigerator, and some of the air outlets 321 can be arranged in the height direction of the refrigerator to improve the uniformity of the temperature in the storage compartment 101.

[0115] In some embodiments, the bottom end of the air duct component 300 is spaced apart from the box body 110 to form a return air opening 302. The return air opening 302 is located below all the supply air openings 321. The return air opening 302 communicates with the bottom of the storage compartment 101 and the evaporation cavity 102, and the communication position of the return air opening 302 with the evaporation cavity 102 is located below the evaporator 400, so that the cold air of the return air opening 302 can pass through the evaporator 400 and exchange heat.

[0116] In some embodiments, a fan 330 is further installed in the air duct 301 to provide power for the circulation of the cold air between the storage compartment 101 and the evaporation cavity 102. The fan 330 is opposite to the air inlet 311, so that a negative pressure can be formed at the air inlet 311, thereby improving the efficiency of the cold air in the evaporation cavity 102 entering the storage compartment 101.

[0117] For example, the air inlet 311 is a circular opening, so as to match the shape of the fan 330.

[0118] Through the above arrangement, in combination with the air duct component 300, the fan 330, the evaporator 400, and the air inlet 311 and the supply air opening 321, the cold air in the evaporation cavity 102 can be circulated between the storage compartment 101 and the evaporation cavity 102. Figure 3 Under the action of the fan 330, the cold air in the evaporation cavity 102 after heat exchange with the evaporator 400 enters the air duct 301 through the air inlet 311, and then enters the storage compartment 101 through the supply air opening 321; the air in the storage compartment 101 returns to the evaporation cavity 102 through the return air opening 302 and exchanges heat with the evaporator 400. This cycle reduces the temperature of the storage compartment 101. Figure 3 The dashed line with an arrow indicates the flow direction of the cold air.

[0119] In some embodiments, Figure 3 The storage compartment 101 shown in FIG. 6 is a freezing compartment. A refrigerating air duct is communicated with the top end of the air duct component 300, and the refrigerating air duct is communicated with a refrigerating compartment to provide cold air for the refrigerating compartment.

[0120] Continuing to refer to FIG. 6, Figure 3 In some embodiments, the air duct component 300 includes an air duct rear cover plate 310 and an air duct front cover plate 320, which are fixedly connected and enclose the air duct 301. The air duct rear cover plate 310 is located at the rear side of the air duct front cover plate 320, so that the air duct rear cover plate 310 faces the evaporation cavity 102, and the air duct front cover plate 320 faces the storage compartment 101. The air inlet 311 is arranged on the air duct rear cover plate 310, and the supply air opening 321 is arranged on the air duct front cover plate 320.

[0121] Continuing to refer to FIG. 6, Figure 3 The refrigerator further includes a damper mechanism 500 located in the evaporation cavity 102. The damper mechanism 500 is located in the upper portion of the evaporation cavity 102 and above the evaporator 400. The damper mechanism 500 is communicated with the air inlet 311 along the depth direction of the refrigerator body 100 (corresponding to the direction of the arrow A in FIG. 6).Figure 3 The air door mechanism 500 is configured to open the air inlet 311 when the evaporator 400 is cooling, so that the cold air passing through the evaporator 400 can enter the air duct 301 through the air inlet 311 and enter the storage compartment 101.

[0122] As shown in FIG. 5, the air door mechanism 500 is configured to close the air inlet 311 when the evaporator 400 is defrosting. The defrosting heater 410 generates heat, which accumulates in the evaporating cavity 102 to defrost the evaporator 400. Since the air inlet 311 is closed, the hot air generated during defrosting is blocked by the air door mechanism 500 and cannot enter the storage compartment 101 through the air inlet 311, thereby reducing temperature fluctuations in the storage compartment 101. Figure 3 As shown in FIG. 5, the air door mechanism 500 is configured to close the air inlet 311 when the evaporator 400 is defrosting. The defrosting heater 410 generates heat, which accumulates in the evaporating cavity 102 to defrost the evaporator 400. Since the air inlet 311 is closed, the hot air generated during defrosting is blocked by the air door mechanism 500 and cannot enter the storage compartment 101 through the air inlet 311, thereby reducing temperature fluctuations in the storage compartment 101.

[0123] Figure 4 In some embodiments of the present application, the air door mechanism 500 can be mounted on the air duct back cover plate 310, so that the air door mechanism 500 can be mounted on the air duct back cover plate 310 first, and then assembled into the box body 110. The relative position of the air door mechanism 500 and the air inlet 311 is accurate, and the installation is convenient.

[0124] The air door mechanism 500 can include an air door 510 configured to shield or open the air inlet 311.

[0125] The air door 510 can be generally plate-shaped to reduce the space occupation of the air door mechanism 500 in the depth direction of the refrigerator. In some embodiments, the main body of the air door 510 can be circular, and a connecting structure can be provided on the edge of the air door 510 to mount the memory alloy spring 520.

[0126] The air door mechanism 500 can include a memory alloy spring 520 connected to the air door 510 and the air duct component 300, respectively; the memory alloy spring 520 is configured to deform in response to temperature changes in the evaporating cavity 102 to drive the air door 510 to move relative to the air inlet 311.

[0127] The memory alloy spring 520 is configured to deform when heated by the rising air temperature in the evaporating cavity 102, and drive the air door 510 to move to shield the air inlet 311.

[0128] At least part of the memory alloy spring 520 is exposed to the evaporating cavity 102 to better perceive the air temperature changes in the evaporating cavity 102 and ensure the quick response of the air door 510 to open and close.

[0129] At least part of the memory alloy spring 520 is exposed to the evaporating cavity 102 to better perceive the air temperature changes in the evaporating cavity 102 and ensure the quick response of the air door 510 to open and close.

[0130] ​The memory alloy spring 520 is configured to sense the air temperature change in the evaporation cavity 102 and move along the axial direction of the air inlet 311 to open or close the air inlet 311. Of course, this is not a limitation on the deformation direction of the memory alloy spring 520. For example, the memory alloy spring 520 can also deform in a vertical plane, so that the damper 510 is offset relative to the air inlet 311 in the vertical plane to open and close the air inlet 311. The vertical plane corresponds to the YZ plane in the drawing.

[0131] In some embodiments, the memory alloy spring 520 is a spiral spring. For example, the memory alloy spring 520 adopts a cylindrical spiral spring, which is simple in structure and easy to process.

[0132] The axial direction of the memory alloy spring 520 is parallel to the axial direction of the air inlet 311, so that the deformation of the memory alloy spring 520 in the axial direction acts on the damper 510, so that the movement of the damper 510 is more sensitive and rapid.

[0133] In the embodiments of the present application, a plurality of memory alloy springs 520 are arranged along the circumference of the damper 510, so as to ensure that the damper 510 is driven to move by sufficient driving force.

[0134] The plurality of memory alloy springs 520 can be uniformly arranged along the circumference of the damper 510, so that the force acting on the damper 510 in the circumferential direction is uniform, and the possibility of the damper 510 being stuck is reduced.

[0135] The plurality of memory alloy springs 520 can be arranged at the same horizontal height, which helps to improve the consistency of the temperature sensed by the memory alloy spring 520, and further improve the consistency of the deformation of the memory alloy spring 520, so as to help to improve the uniformity of the driving of the damper 510, reduce the movement and deformation of the damper 510 due to uneven force, and affect the sealing of the air inlet 311.

[0136] For example, two memory alloy springs 520 are arranged in the horizontal direction, and the two memory alloy springs 520 are uniformly arranged along the circumference of the damper 510. This can ensure the driving force of the damper 510, and the number is relatively small, and the structure is simple. In addition, the problem of being stuck due to inconsistent deformation when more memory alloy springs 520 are arranged can be avoided.

[0137] In some embodiments, the shape memory alloy spring 520 can be a two-way shape memory alloy spring. Two-way shape memory alloy is a material that can automatically change shape during heating and cooling. Two-way shape memory alloy returns to a preset high-temperature shape when heated, and automatically changes to another low-temperature shape when cooled. This two-way shape change can be achieved without external force.

[0138] In combination Figures 6 to 8 When the evaporator 400 is cooling, the temperature in the evaporating cavity 102 is relatively low. When the phase transition temperature of the shape memory alloy spring 520 is reached, the shape memory alloy spring 520 changes from austenite to martensite, and the shape memory alloy spring 520 elastically contracts, driving the air door 510 to move away from the air duct back cover plate 310 to open the air inlet 311, so that the cold air of the evaporator 400 can enter the storage compartment 101 through the air inlet 311 and the air duct 301.

[0139] In combination Figure 9 And Figure 10 When the defrosting heater 410 is heating to defrost the evaporator 400, the temperature in the evaporating cavity 102 rises. When the phase transition temperature of the shape memory alloy spring 520 is reached, the shape memory alloy spring 520 changes from martensite to austenite, and the shape memory alloy spring 520 elastically elongates, driving the air door 510 to move towards the air duct back cover plate 310 to close the air inlet 311, so that the defrosting heat can be prevented from entering the storage compartment 101 through the air inlet 311 and the air duct 301, and affecting the temperature of the storage compartment 101.

[0140] It should be noted that in the embodiments of the present application, in combination Figure 3 And Figure 4 Because the space between the air duct back cover plate 310 and the rear tank wall 120 is limited, and the air door 510, the shape memory alloy spring 520 and the guide column 312 are arranged between the air duct back cover plate 310 and the rear tank wall 120. Therefore, the shape memory alloy spring 520 is arranged to be in a fully contracted state, and the air door 510 is in an open maximum position; the shape memory alloy spring 520 is in a fully elongated state, and the air door 510 is in a closed state. Exemplarily, the length of the shape memory alloy spring 520 in the fully contracted state is 25mm, and the length of the shape memory alloy spring 520 in the fully elongated state is 55mm, and the generated thrust can be 1N.

[0141] In some embodiments of the present application, the shape memory alloy spring 520 can be a one-way shape memory alloy spring, which can "remember" a shape at a certain temperature. For example, the one-way shape memory alloy spring can be plastically deformed when it is cooled below its phase transition temperature; when the temperature rises to the phase transition temperature, the one-way shape memory alloy spring will restore to the preset shape.

[0142] At this time, the damper mechanism 500 can further include biasing elastic members connected with the damper 510 and the rear air duct cover plate 310, respectively. When the defrosting heater 410 heats the evaporator 400 to defrost, the temperature in the evaporating cavity 102 rises. When the temperature reaches the phase transition temperature of the shape memory alloy spring 520, the shape memory alloy spring 520 changes from martensite to austenite, and the shape memory alloy spring 520 elastically elongates to compress the biasing elastic members; and drives the damper 510 to move towards the rear air duct cover plate 310 to close the air inlet 311, so as to avoid the defrosting heat entering the storage compartment 101 through the air inlet 311 and the air duct 301 to affect the temperature of the storage compartment 101. When the evaporator 400 is refrigerating, the expansion force of the shape memory alloy spring 520 becomes smaller, and the shape memory alloy spring 520 presents a "forceless" soft state, the biasing elastic members recover the deformation, and drive the damper 510 to move away from the rear air duct cover plate 310 to open the air inlet 311.

[0143] In some embodiments of the present application, the shape memory alloy spring 520 is connected in series in a circuit. When the circuit is powered on, the shape memory alloy spring 520 generates heat due to its own resistance property, and deforms to drive the damper 510 to move to gradually shield the air inlet 311. After the circuit is powered off, the temperature of the shape memory alloy spring 520 gradually decreases and recovers the deformation, thereby driving the damper 510 to move to gradually open the air inlet 311.

[0144] In some embodiments of the present application, the shape memory alloy spring 520 generates heat due to its own resistance property when the circuit is powered on, and the cylindrical shape memory alloy spring 520 elongates along its axial direction to deform, thereby driving the damper 510 to move away from the air inlet 311 to gradually open the air inlet 311. After the circuit is powered off, the temperature of the shape memory alloy spring 520 gradually decreases, and the shape memory alloy spring 520 contracts along its axial direction to recover the deformation, thereby driving the damper 510 to move towards the air inlet 311 to gradually close the air inlet 311.

[0145] In some embodiments of the present application, the shape memory alloy spring 520 generates heat due to its own resistance property when the circuit is powered on, and the cylindrical shape memory alloy spring 520 elongates along its axial direction to deform, thereby driving the damper 510 to move away from the air inlet 311 to gradually open the air inlet 311. After the circuit is powered off, the temperature of the shape memory alloy spring 520 gradually decreases, and the shape memory alloy spring 520 contracts along its axial direction to recover the deformation, thereby driving the damper 510 to move towards the air inlet 311 to gradually close the air inlet 311.

[0146] The memory alloy spring 520 is heated due to the power supply by the circuit, and the memory alloy spring 520 is heated due to the resistance property, and then the memory alloy spring 520 quickly reaches the complete phase change temperature, so that the memory alloy spring 520 quickly deforms, and the time length of the air door 510 closing the air inlet 311 is shortened, and the defrosting heat entering the storage compartment 101 through the air inlet 311 affects the temperature of the storage compartment 101.

[0147] It should be noted that after the circuit is powered off, the compressor of the refrigerator is started and refrigeration is started. The temperature in the evaporating cavity 102 gradually decreases, the temperature of the memory alloy spring 520 gradually decreases and deforms, and then drives the air door 510 to move to gradually open the air inlet 311.

[0148] The above-mentioned circuit can include an electrically connected cable, and the memory alloy spring 520 is powered by the power supply of the refrigerator through the cable. The above-mentioned circuit can include an electrically connected cable and a power supply, and the power supply forms a loop in communication with the memory alloy spring 520 through the cable. When the power supply is turned on, the memory alloy spring 520 is powered through the cable; when the power supply is turned off, the loop is disconnected, and the memory alloy spring 520 is powered off.

[0149] Again, in combination Figure 5 In some embodiments of the present application, the refrigerator can further include an auxiliary heating device 600 configured to heat the memory alloy spring 520 during defrosting.

[0150] The auxiliary heating device 600 includes a power supply component 620 and a power supply line 610, and the power supply component 620 is electrically connected to the memory alloy spring 520 through the power supply line 610; the power supply component 620 is configured to supply power to the memory alloy spring 520 after the defrosting heater 410 is started, so that the memory alloy spring 520 is heated.

[0151] Since the memory alloy spring 520 is a metal part, when the memory alloy spring 520 is powered, the memory alloy spring 520 generates heat and generates heat.

[0152] By supplying power to the memory alloy spring 520, the memory alloy spring 520 is heated, and then the temperature of the memory alloy spring 520 quickly reaches the complete phase change temperature, so that the memory alloy spring 520 quickly drives the air door 510 to completely close the air inlet 311, and avoids the defrosting heat entering the storage compartment 101 through the air inlet 311. Moreover, using the memory alloy spring 520 itself as a heating body can make the overall temperature of the memory alloy spring 520 rise with good consistency, and then the memory alloy spring 520 can deform smoothly and reliably, and reduce the possibility of jam caused by inconsistent deformation of the memory alloy spring 520.

[0153] When the temperature of the memory alloy spring 520 reaches the complete phase transformation temperature Af, the memory alloy spring 520 completely transforms from martensite to austenite, and the memory metal spring is in a fully extended state, thereby closing the air inlet 311 .

[0154] The power supply component 620 may be a separately provided power supply. The power supply component 620 may be the power supply of the refrigerator. The power supply of the refrigerator is connected to the main control board of the refrigerator and converted by the electrical components on the main control board to form a low voltage power supply. For example, the power supply voltage of the power supply component 620 may be 12V. Figure 5 The figure only provides an exemplary description of the power supply component 620 and does not limit the position of the power supply component 620.

[0155] During the defrosting process, the temperature of the memory alloy spring 520 tends to decrease because the temperature inside the evaporation chamber 102 is lower than the complete phase transition temperature of the memory alloy spring 520. Therefore, it is necessary to continuously heat the memory alloy spring 520 to ensure that the memory alloy spring 520 maintains the complete phase transition state and thus keeps the air inlet 311 closed.

[0156] In some embodiments, the auxiliary heating device 600 is configured to continuously supply power to the memory alloy spring 520 after the defrost heater 410 is started, so as to ensure that the memory alloy spring 520 maintains a complete phase change state during the entire defrosting process, thereby maintaining the air inlet 311 in a closed state, and preventing air in the evaporation chamber 102 that is not lower than zero degrees from entering the air inlet 311.

[0157] In other embodiments, the power supply of the refrigerator is electrically connected to the memory alloy spring 520 to supply power to the memory alloy spring 520. The power supply of the refrigerator is configured to intermittently supply power to the memory alloy spring 520 after the defrost heater 410 is started, so that the memory alloy spring 520 heats up.

[0158] Intermittent power supply can be understood as follows: after the refrigerator's power supply supplies power to the memory alloy spring 520 for a first period of time, causing the memory alloy spring 520 to heat up and reach a temperature greater than or equal to the complete phase transition temperature; then, power supply to the memory alloy spring 520 is stopped for a second period of time; and then, heating is resumed. This cycle repeats until the stopping condition is met.

[0159] In some possible implementations, the stop condition of the intermittent heating of the memory alloy spring 520 can be that, after the defrosting heater 410 is turned off, the temperature in the evaporating cavity 102 decreases to 0°C after the compressor is started. This is because, after the defrosting heater 410 is turned off, the temperature in the evaporating cavity 102 is still above zero degrees due to the influence of the defrosting residual heat. At this time, if the driving force of the memory alloy spring 520 on the air door 510 is insufficient and the air inlet 311 is opened, the temperature of the storage compartment 101 will still be affected. Therefore, after the compressor is started and the temperature in the evaporating cavity 102 decreases to 0°C, the intermittent heating of the memory alloy spring 520 is ended, so that the heat in the entire defrosting process can be blocked from entering the storage compartment 101 through the air inlet 311.

[0160] It should be noted again that, in the embodiment of the present application, the memory alloy spring 520 can be a double-path memory alloy spring 520. This is because, by adjusting the material composition, proportion, etc. of the single-path memory alloy spring 520, the single-path memory alloy spring 520 can be quickly closed to the air inlet 311 during defrosting, the scheme is easy to implement, and the cost performance is high. However, by adjusting the material composition, proportion, etc. of the double-path memory alloy spring 520, Figure 1 the possibility of the two curves in the above formula coinciding is low, and the scheme is difficult to implement. By supplying power to the memory alloy spring 520, the memory alloy spring 520 can be quickly phase-changed, the scheme is easy to implement, and the cost performance is high.

[0161] Referring to Figure 11 When the memory alloy spring 520 is a cylindrical spring, the memory alloy spring 520 has two ends along the axial direction. One end of the memory alloy spring 520 forms a first connecting portion 521, and the first connecting portion 521 is electrically connected to the cable of the power supply wire 610.

[0162] Exemplarily, the coil of one end of the memory alloy spring 520 is arranged flat to form the first connecting portion 521, and the structure is simple and easy to implement.

[0163] The first connecting portion 521 is welded to the cable, so that the first connecting portion 521 is electrically connected to the power supply wire 610. Alternatively, the end of the cable of the power supply wire 610 is provided with a first connecting terminal, and the first connecting portion 521 is inserted into the first connecting terminal. The first connecting portion 521 can be columnar, and the first connecting portion 521 can be sheet-shaped, which is inserted into the first connecting terminal to achieve the electrical connection between the first connecting portion 521 and the power supply wire 610. The electrical connection structure is simple and stable.

[0164] Continuing to refer to Figure 11 The other end of the memory alloy spring 520 forms a second connecting portion 522, and the second connecting portion 522 is electrically connected to the cable of the power supply wire 610.

[0165] Exemplarily, the coil of the other end of the memory alloy spring 520 is arranged flat to form the second connecting part 522, which is simple in structure and easy to implement.

[0166] The second connecting part 522 can be welded with the cable, so that the first connecting part 521 is electrically connected with the power supply line 610. Alternatively, the other end of the cable of the power supply line 610 is provided with a second connecting terminal, and the second connecting part 522 is inserted into the second connecting terminal. The second connecting part 522 can be columnar, and the second connecting part 522 can be sheet-shaped, which is inserted into the second connecting terminal to achieve the electrical connection between the second connecting part 522 and the power supply line 610. The electrical connection structure is simple and stable.

[0167] In some embodiments of the present application, the second connecting part 522 is fixed relative to the air door 510, and the first connecting part 521 is fixed relative to the air duct component 300. In this way, the two ends of the memory alloy spring 520 are fixed relative to the air door 510 and the air duct rear cover plate 310 of the air duct component 300 respectively, so that the electrical connection structure of the two ends of the memory alloy spring 520 is fixed and does not move with the deformation of the memory alloy spring 520, which helps to improve the reliability of the electrical connection structure.

[0168] In combination Figure 11 and Figure 12 In some embodiments, a plurality of memory alloy springs 520 are arranged at intervals along the circumference of the air inlet 311 to ensure sufficient driving force to drive the air door 510 to move.

[0169] In some embodiments, the plurality of memory alloy springs 520 are connected in series. In this way, the current I of each memory alloy spring 520 is the same, and the resistance R of each memory alloy spring 520 is the same, and the heating power P = I 2 R of each memory alloy spring 520 is the same, so that the consistency of the temperature rise of the plurality of memory alloy springs 520 can be improved, and in turn the consistency of the deformation of the plurality of memory alloy springs 520 can be improved, so that the air door 510 can be smoothly pushed to move, and the possibility of jamming of the air door 510 can be reduced.

[0170] In embodiments of the present application, the power supply line 610 can include a plurality of cables, so that the plurality of memory alloy springs 520 are connected in series.

[0171] In combination Figure 11 In some embodiments of the present application, the power supply line 610 includes a first cable 611, and the two ends of the first cable 611 are respectively electrically connected with the positive electrode of the power supply component 620 and one end of one of the memory alloy springs 520.

[0172] The power supply wire 610 can further include a second cable 612, two ends of the second cable 612 being electrically connected to the negative pole of the power supply component 620 and the other end of the other memory alloy spring 520 respectively.

[0173] Thus, the power supply circuit is formed by the first cable 611 and the second cable 612 to supply power to the memory alloy spring 520.

[0174] In some embodiments, the end of the first cable 611 away from the memory alloy spring 520 and the end of the second cable 612 away from the memory alloy spring 520 are both connected to a connection terminal 613, and the connection terminal 613 is connected to the power supply component 620 through an intermediate cable 614. In this way, the wiring and arrangement of the cables are simpler.

[0175] Again in combination with Figure 9 and Figure 11 , the power supply wire 610 can further include a third cable 615; the third cable 615 is connected in series to the adjacent two memory alloy springs 520.

[0176] Wherein the ends of the adjacent two memory alloy springs 520 fixed relative to the air door 510 are electrically connected to the two ends of the third cable 615 respectively;

[0177] The side of the air door 510 away from the air inlet 311 is provided with a first limiting piece 550 to limit the third cable 615 to the air door 510.

[0178] The first limiting piece 550 can be a wire harness buckle to limit the third cable 615.

[0179] Thus, the third cable 615 can be fixed to the air door 510, so that the third cable 615 can move with the movement of the air door 510, and the third cable 615 can be fixed relative to the air door 510 to ensure the reliability of the electrical connection between the adjacent two memory alloy springs 520. The third cable 615 can also be kept away from the air inlet 311 to avoid affecting the wind resistance.

[0180] Taking the example that the memory alloy spring 520 is provided with two, as shown in Figure 11 , one end of the first cable 611 is electrically connected to the first connecting part 521 of one of the memory alloy springs 520, the second connecting part 522 of the memory alloy spring 520 is electrically connected to the second connecting part 522 of the other memory alloy spring 520 through the third cable 615, and the first connecting part 521 of the other memory alloy spring 520 is connected through the second cable 612.

[0181] At this time, the third cable 615 is arranged close to the air door 510, so that the arrangement of the third cable 615 is more stable and reliable.

[0182] In combination withFigure 12 In some embodiments, the memory alloy spring 520 is provided with at least three, and the third cable 615 can be provided with at least two. Taking the example of the memory alloy spring 520 being provided with three, an explanation is given. Two third cables 615 are respectively marked as 615a and 615b. The three memory alloy springs 520 are respectively marked as 520a, 520b, and 520c.

[0183] One end of the memory alloy spring 520a is electrically connected with the first cable 611, the other end of the memory alloy spring 520a is electrically connected with one end of the memory alloy spring 520b through the third cable 615a, the other end of the memory alloy spring 520b is electrically connected with one end of the memory alloy spring 520c through the third cable 615b, and the other end of the memory alloy spring 520c is electrically connected with the second cable 612.

[0184] Among them, the two ends of the third cable 615a are respectively electrically connected with the memory alloy spring 520a and the memory alloy spring 520b close to one end of the air door 510, so that the third cable 615a is close to the air door 510, which not only facilitates the fixation of the cable, but also makes the third cable 615a away from the memory alloy spring 520, thereby avoiding the influence of the cable on the deformation of the memory alloy spring 520.

[0185] One end of the third cable 615b is connected with one end of the memory alloy spring 520b away from the air door 510, and the other end of the third cable 615b is connected with one end of the memory alloy spring 520c close to the air door 510, so that the third cable 615b spans the axial length of the memory alloy spring 520. The third cable 615 should be shaped by the cable, or by the limitation of the first limiting piece 550, so that it does not contact the part of the memory alloy spring 520 that elastically deforms, thereby avoiding affecting the elastic deformation of the memory alloy spring 520.

[0186] In some embodiments of the present application, the part of the power supply cable 610 close to the memory alloy spring 520 is a shapeable cable, which is connected with the memory alloy spring 520 and has a gap between the memory alloy spring 520, thereby avoiding the influence of the cable on the expansion and contraction deformation of the memory alloy spring 520, and the structure is simple.

[0187] The shapeable cable refers to a metal wire that can maintain its shape after being bent, such as a copper cable, an aluminum cable, an aluminum-magnesium alloy cable, etc.

[0188] For example, the first cable 611 and the second cable 612 can be shapeable cables, which are bent to have a gap between the first cable 611 and the second cable 612 and the memory alloy spring 520, thereby avoiding the influence of the cable on the expansion and contraction deformation of the memory alloy spring 520.

[0189] In some embodiments of the present application, in combination with Figure 5 and Figure 12 The power supply wire 610 is a flexible cable, the second limiting member 313 is arranged on the air duct component 300, and the power supply wire 610 is connected with the memory alloy spring 520 after being limited by the second limiting member 313, so that the part of the power supply wire 610 close to the memory alloy spring 520 has a spacing with the memory alloy spring 520.

[0190] The flexible cable, the cable that cannot be fixed in shape,

[0191] The second limiting member 313 is arranged on the air duct rear cover plate 310, the second limiting member 313 is arranged with a wire slot, and the cable is clamped in the wire slot.

[0192] By arranging the second limiting member 313 on the air duct component 300, the part of the power supply wire 610 close to the memory alloy spring 520 has a spacing with the memory alloy spring 520, so as to avoid the cable affecting the expansion and contraction of the memory alloy spring 520. Moreover, the strength and toughness of the flexible cable are good, and the wiring and arrangement are convenient.

[0193] It should be noted that the part of the power supply wire 610 close to the memory alloy spring 520 has a spacing with the memory alloy spring 520, which can be understood as that the power supply wire 610 has a spacing with the elastic expansion and contraction part of the memory alloy spring 520.

[0194] In the embodiments of the present application, the memory alloy spring 520 is connected with the air door 510 and the air duct rear cover plate 310 at both ends along the axial direction, so as to drive the air door 510 to move relative to the air duct rear cover plate 310. Moreover, the first connecting part 521 at both ends of the memory alloy spring 520 is fixed relative to the air duct rear cover plate 310 of the air duct component 300, and the second connecting part 522 is fixed relative to the air door 510.

[0195] In some embodiments of the present application, in combination with Figure 5 The air door mechanism 500 further comprises a first connecting member 530, the first connecting member 530 is fixedly connected with the air duct component 300 and fixes the first connecting part 521 to the air duct component 300, and the first connecting member 530 and the air duct component 300 are both insulating members.

[0196] Exemplarily, the first connecting member 530 is connected with the air duct rear cover plate 310, and the first connecting part 521 of the memory alloy spring 520 is fixed between the first connecting member 530 and the air duct rear cover plate 310.

[0197] In this way, the first connecting member 530 is fixedly connected with the air duct rear cover plate 310 of the air duct component 300, and the first connecting portion 521 is fixed, so that the memory alloy spring 520 is fixedly connected with the air duct component 300, and the electrical connection between the first connecting portion 521 and the power supply wire 610 is fixed, and the structure is simple and reliable. The first connecting member 530 and the air duct rear cover plate 310 of the air duct component 300 are both insulating members, for example, plastic members, which provide insulation for the power supply of the memory alloy spring 520, and improve the safety of the damper mechanism 500.

[0198] The damper mechanism 500 further comprises a second connecting member 540, which is fixedly connected with the damper 510 and fixes the second connecting portion 522 to the damper 510; the second connecting member 540 and the damper 510 are both insulating members.

[0199] For example, the second connecting member 540 is clamped with the damper 510, and the second connecting portion 522 of the memory alloy spring 520 is fixed between the second connecting member 540 and the damper 510.

[0200] In combination Figure 5 The edge of the damper 510 forms a lug 511, which is connected with the second connecting member 540 and fixes the end of the memory alloy spring 520 between the lug 511 and the second connecting member 540. In this way, the damper 510 fixes the memory alloy spring 520 by providing the lug 511, without affecting the shielding of the damper 510 to the air inlet 311.

[0201] In this way, the second connecting member 540 is fixedly connected with the damper 510, and the second connecting portion 522 is fixed, so that the memory alloy spring 520 is fixedly connected with the damper 510, and the electrical connection between the second connecting portion 522 and the power supply wire 610 is fixed, and the structure is simple and reliable. The second connecting member 540 and the damper 510 are both insulating members, for example, plastic members, which provide insulation for the power supply of the memory alloy spring 520, and improve the safety of the damper mechanism 500.

[0202] With reference to Figure 5 In some embodiments of the present application, a guide structure is provided between the damper 510 and the air duct rear cover plate 310 of the air duct component 300, to guide and limit the deformation direction of the memory alloy spring 520 and the movement direction of the damper 510.

[0203] The damper 510 is provided with a matching hole 5111, and the lug 511 is provided with the matching hole 5111.

[0204] The air duct component 300 forms a guide column 312, and the guide column 312 is arranged on the air duct back cover plate 310. The guide structure includes the guide column 312 and the matching hole 5111. The extension direction of the guide column 312 can be parallel to the axial direction of the air inlet 311, and the guide column 312 is located on the side of the air duct back cover plate 310 facing the air door 510. The guide column 312 passes through the matching hole 5111 and extends to the side of the air door 510 away from the air inlet 311. The moving direction of the air door 510 is guided and limited by the matching of the guide column 312 and the matching hole 5111.

[0205] The memory alloy spring 520 is a columnar spring, for example, a cylindrical spring, and is sleeved on the guide column 312 to limit and guide the deformation direction of the memory alloy spring 520.

[0206] The memory alloy spring 520 is located on the side of the air door 510 away from the air inlet 311, and one end of the memory alloy spring 520 is fixedly connected with the guide column 312 to realize the fixed connection with the air duct component 300.

[0207] In the embodiments of the present application, the air door 510 and the air duct component 300 are matched through the matching hole 5111 and the guide column 312 to guide the movement of the air door 510. The memory alloy spring 520 is sleeved on the guide column 312 to limit the deformation direction of the memory alloy spring 520. Moreover, the guide column 312 is located on the inner side of the memory alloy spring 520, does not affect the arrangement of the power supply wire 610, and makes the arrangement of the power supply wire 610 simpler.

[0208] The connection between the memory alloy spring 520 and the air door 510 component and the connection between the memory alloy spring 520 and the air door 510 are both located on the side of the air door 510 away from the air duct component 300, which can make the memory alloy spring 520 as much as possible exposed to the evaporation cavity 102, and helps to more accurately perceive the temperature change of the evaporation cavity 102.

[0209] Reference Figure 13 and Figure 14 In some embodiments of the present application, the first connecting piece 530 can include a connecting column part 531 and an end plate part 532 arranged at one end of the connecting column part 531, and the diameter of the end plate part 532 is greater than the diameter of the connecting column part 531. The guide column 312 is provided with a slot at the end away from the air duct back cover plate 310, so that the connecting column part 531 can be inserted into the slot, and the end plate part 532 abuts against the end of the guide column 312 away from the air duct back cover plate 310. Exemplarily, the guide column 312 is a hollow column, which is convenient for molding.

[0210] The first connecting piece 530 can further include a clamping protrusion 533 arranged on a side of the connecting column portion 531 and located at an end of the connecting column portion 531 away from the end plate portion 532. The clamping protrusion 533 is located in the slot, and the guide column 312 is provided with a first clamping hole 3121, so that the clamping protrusion 533 is clamped with the first clamping hole 3121, thereby clamping the first connecting piece 530 to the guide column 312.

[0211] The first connecting piece 530 can further include a limiting buckle 534 connected to an end of the connecting column portion 531 close to the end plate portion 532. The limiting buckle 534 can be provided with a plurality of limiting buckles 534 arranged at intervals along the circumference of the connecting column portion 531. The limiting buckle 534 forms a first limiting slot, and the coil of the memory alloy spring 520 connected with the first connecting portion 521 is clamped into the first limiting slot. In this way, one end of the memory alloy spring 520 is fixed to the first connecting piece 530. The first connecting portion 521 extends out of the first limiting slot, facilitating electrical connection with the power supply wire 610.

[0212] Referring to Figure 15 and Figure 16 In some embodiments of the present application, the lug 511 is provided with a second clamping hole 5112 clamped with the second connecting piece 540.

[0213] In combination Figure 17 , the second connecting piece 540 includes a plate body portion 541, an inner ring portion 542 and an outer ring portion 543, the inner ring portion 542 and the outer ring portion 543 are arranged on the plate body portion 541, and the outer ring portion 543 is sleeved on the outer side of the inner ring portion 542. There is a gap between the outer ring portion 543 and the inner ring portion 542, and the plate body portion 541, the inner ring portion 542 and the outer ring portion 543 form a second limiting slot 545.

[0214] The outer end coil of the memory alloy spring 520 away from the first connecting portion 521 is expanded in diameter to form a fixed portion 523. The end of the fixed portion 523 forms a second connecting portion 522. The fixed portion 523 is clamped in the second limiting slot 545. The second limiting slot 545 is provided with two notch portions 546, one of which is used for allowing the second connecting portion 522 to enter the second limiting slot 545, and the other is used for allowing the second connecting portion 522 to pass out of the second limiting slot 545.

[0215] The second connecting piece 540 can further be provided with a buckle 544 connected to the outer side of the outer ring portion 543. In combination Figure 16 , the buckle 544 is clamped with the second clamping hole 5112, thereby fixing the second connecting piece 540 to the lug 511, so that the second connecting portion 522 is clamped between the second connecting piece 540 and the lug 511.

[0216] In the above embodiments, the guide structure includes the guide column 312 and the matching hole 5111, but this is not a limitation on the guide structure. In combination with Figure 18 and Figure 19 In some embodiments, the air duct rear cover plate 310 is partially recessed away from the air door 510 to form a guide groove 322. The air duct rear cover plate 310 is further provided with a connecting protrusion 324 located on the side of the guide groove 322.

[0217] The lug 511 of the air door 510 forms a mounting sleeve 5113 extending along the axial direction of the air inlet 311. The mounting sleeve 5113 is open at both ends. The mounting sleeve 5113 cooperates with the guide groove 322 to limit the movement direction of the air door 510.

[0218] The memory alloy spring 520 is accommodated in the mounting sleeve 5113 to limit and guide the deformation of the memory alloy spring 520. One end of the memory alloy spring 520 is connected to one end of the mounting sleeve 5113 through the second connecting piece 540, so that the one end of the memory alloy spring 520 is connected to the air door 510. The other end of the memory alloy spring 520 extends out of the other end of the mounting sleeve 5113 and is connected to the connecting protrusion 324 through the first connecting piece 530, so that the other end of the memory alloy spring 520 is fixed to the connecting protrusion 324.

[0219] In the embodiments of the present application, since one end of the memory alloy spring 520 is located in the mounting sleeve 5113. Therefore, the air duct rear cover plate 310 is provided with a wiring groove 323 in communication with the guide groove 322, so that the power supply wire 610 is led out through the wiring groove 323.

[0220] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and are not limited thereto; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement to part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

[0221] In order to facilitate explanation, the above description has been made in combination with specific embodiments. However, the above exemplary discussion is not intended to exhaust or limit the embodiments to the specific forms disclosed above. Various modifications and variations can be derived according to the above teachings. The selection and description of the above embodiments are for better explanation of the principles and practical applications, so that those skilled in the art can better use the embodiments and various different modified embodiments suitable for specific use considerations.

Claims

1. A refrigerator characterized by comprising: The application relates to a refrigerator, which comprises: a cabinet (100) provided with an evaporation cavity (102) and a storage compartment (101), wherein an evaporator (400) and a defrosting heater (410) for defrosting the evaporation cavity (102) are arranged in the evaporation cavity (102); an air duct component (300) arranged between the evaporation cavity (102) and the storage compartment (101) and configured to form an air duct (301) for allowing cold air in the evaporation cavity (102) to flow into the storage compartment (101); the air duct component (300) is also configured to form an air inlet (311) communicating the air duct (301) with the evaporation cavity (102); an air door mechanism (500) arranged in the evaporation cavity (102) and opposite the air inlet (311) along the depth direction of the cabinet (100), wherein the air door mechanism (500) comprises: an air door (510) configured to shield or open the air inlet (311); a memory alloy spring (520) connected to the air door (510) and the air duct component (300) respectively; the memory alloy spring (520) is configured to deform in response to temperature change of the evaporation cavity (102) to drive the air door (510) to move relative to the air inlet (311); an auxiliary heating device (600) comprising a power supply component (620) and a power supply wire (610), wherein the power supply component (620) is electrically connected to the memory alloy spring (520) through the power supply wire (610); the power supply component (620) is configured to supply power to the memory alloy spring (520) after the defrosting heater (410) is started to make the memory alloy spring (520) generate heat.

2. The refrigerator according to claim 1, characterized in that, One end of the memory alloy spring (520) forms a first connecting part (521) electrically connected to the cable of the power supply wire (610); the first connecting part (521) is fixed relative to the air duct component (300); the other end of the memory alloy spring (520) forms a second connecting part (522) electrically connected to the cable of the power supply wire (610); the second connecting part (522) is fixed relative to the air door (510).

3. The refrigerator according to claim 2, characterized in that, The air door mechanism (500) further comprises a first connecting piece (530) fixedly connected to the air duct component (300) and fixing the first connecting part (521) to the air duct component (300); the first connecting piece (530) and the air duct component (300) are both insulating pieces; the air door mechanism (500) further comprises a second connecting piece (540) fixedly connected to the air door (510) and fixing the second connecting part (522) to the air door (510); the second connecting piece (540) and the air door (510) are both insulating pieces.

4. The refrigerator according to claim 2, characterized in that, The end of one cable of the power supply wire (610) is provided with a first connecting terminal, and the first connecting part (521) is inserted into the first connecting terminal; the end of the other cable of the power supply wire (610) is provided with a second connecting terminal, and the second connecting part (522) is inserted into the second connecting terminal.

5. The refrigerator according to any one of claims 1 to 4, characterized in that, A plurality of memory alloy springs (520) are arranged along the circumference of the air inlet (311) in intervals, and the plurality of memory alloy springs (520) are connected in series.

6. The refrigerator according to claim 5, characterized in that, The power supply wire (610) comprises: a first cable (611), two ends of the first cable (611) being electrically connected to a positive electrode of the power supply component (620) and one end of one memory alloy spring (520) respectively; a second cable (612), two ends of the second cable (612) being electrically connected to a negative electrode of the power supply component (620) and one end of another memory alloy spring (520) respectively; a third cable (615), two ends of the third cable (615) being electrically connected to two ends of the third cable (615) respectively, and the two ends being fixed relative to the air door (510) and located on two adjacent memory alloy springs (520) respectively; The air door (510) is provided with a first limiting piece (550) on the side facing away from the air inlet (311) to limit the third cable (615) on the air door (510).

7. The refrigerator according to any one of claims 1 to 4, characterized in that, The air door (510) is provided with a matching hole (5111); The air duct component (300) forms a guide column (312) which passes through the matching hole (5111); The memory alloy spring (520) is a columnar spring and is sleeved on the guide column (312); the memory alloy spring (520) is located on the side of the air door (510) facing away from the air inlet (311); and one end of the memory alloy spring (520) is fixedly connected to the guide column (312).

8. The refrigerator according to any one of claims 1 to 4, characterized in that, The part of the power supply wire (610) close to the memory alloy spring (520) is a shapeable cable, which is connected to the memory alloy spring (520) and has a space between the power supply wire (610) and the memory alloy spring (520); or The power supply wire (610) is a flexible cable, and the air duct component (300) is provided with a second limiting piece (313); the power supply wire (610) is connected to the memory alloy spring (520) after being limited by the second limiting piece (313), so that the part of the power supply wire (610) close to the memory alloy spring (520) has a space between the power supply wire (610) and the memory alloy spring (520).

9. A refrigerator characterized by comprising: It comprises: a box body (100), an evaporation cavity (102) and a storage compartment (101) are arranged in the box body (100), and an evaporator (400) and a defrosting heater (410) for defrosting the evaporation cavity (102) are installed in the evaporation cavity (102); an air duct component (300) located between the evaporation cavity (102) and the storage compartment (101) and configured to form an air duct for cold air in the evaporation cavity (102) to flow into the storage compartment (101); the air duct component (300) is also configured to form an air inlet (311) which communicates the air duct and the evaporation cavity (102); an air door mechanism (500) located in the evaporation cavity (102) and opposite the air inlet (311) along the depth direction of the box body (100), the air door mechanism (500) comprising: an air door (510) configured to shield or open the air inlet (311); A memory alloy spring (520) is connected to the damper (510) and the air duct component (300) respectively, and is configured to deform in response to a temperature change of the evaporation cavity (102) to drive the damper (510) to move relative to the air inlet (311). The power supply of the refrigerator is configured to intermittently supply power to the memory alloy spring (520) after the defrosting heater (410) is started to heat the memory alloy spring (520).

10. A refrigerator characterized by comprising: The refrigerator comprises: a cabinet (100) in which an evaporation cavity (102) and a storage compartment (101) are arranged, and in which an evaporator (400) and a defrosting heater (410) for defrosting the evaporation cavity (102) are installed; an air duct component (300) located between the evaporation cavity (102) and the storage compartment (101) and configured to form an air duct (301) for cold air in the evaporation cavity (102) to flow into the storage compartment (101), and configured to form an air inlet (311) that communicates the air duct (301) and the evaporation cavity (102); a damper mechanism (500) located in the evaporation cavity (102) and opposite the air inlet (311) along the depth direction of the cabinet (100), and comprising: a damper (510) configured to shield or open the air inlet (311); a memory alloy spring (520) connected to the damper (510) and the air duct component (300) respectively; wherein the memory alloy spring (520) is connected in series in a circuit, and when the circuit is powered on, the memory alloy spring (520) heats due to its own resistance property, and deforms due to the heat to drive the damper (510) to move to gradually shield the air inlet (311); and when the circuit is powered off, the temperature of the memory alloy spring (520) gradually decreases and recovers to deform, thereby driving the damper (510) to move to gradually open the air inlet (311).

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