A method and system for automatically assigning maintenance tasks for a wafer packaging test device

Abstract

The application discloses a kind of wafer package test equipment maintenance task automatic dispatching method and system.The method includes: providing the work flow of multiple different maintenance projects corresponding;Current maintenance project is obtained, and work task is established according to corresponding work flow;Subtask is generated in corresponding work site;According to preset order, when the subtask of last work site is confirmed to be completed or verified to pass, only then the subtask of adjacent next work site can be executed.The application is based on the work flow of maintenance project corresponding prepared in advance, and the site order is directly determined according to current maintenance project, so that the site corresponding to each maintenance project is determined, and the staff of each site only needs to work and confirm according to the subtask given in the system, without frequently passing information between each site, avoid the problem that management cost is high and confusion is easily caused by artificial informing and dispatching management, significantly improve the management efficiency of production enterprise.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer packaging test, in particular to a maintenance task automatic dispatching method and system of wafer packaging test equipment. BACKGROUND

[0002] In the production process of wafer packaging test, it is necessary to continuously maintain and maintain the wafer packaging test equipment, including but not limited to replacing consumables, reagents, replacing wear parts, repairing, modifying the structure of the equipment, modifying the program of the equipment, etc. At present, the maintenance and maintenance of most wafer test equipment is based on manual (OP, Operator, refers to the production line operator) subjective arrangement or MES (manufacturing execution system, production execution system) system assisted manual arrangement, but due to the continuous growth of wafer packaging test demand and the increasing scale of the industry, the intensity of wafer packaging test production operation has also increased significantly. The current management method has been difficult to adapt to new demands.

[0003] Specifically, the maintenance process needs the mutual cooperation of OP site, equipment site (this site is mainly for equipment engineers, usually referred to as EE), QC site (Quality control, this site is mainly for quality engineers), for example: device alarm, OP informs the equipment engineer, the equipment engineer confirms whether maintenance is needed and what kind of maintenance is needed, OP is notified to perform first piece verification after maintenance, the first piece is sent to the QC site for inspection and verification, and the verification is passed. After the maintenance is completed, the verification is passed, and the maintenance is completed. The verification is not passed, and the confirmation and repeated maintenance need to be performed again; after the verification is passed and the maintenance is completed, the equipment engineer or other authorized personnel need to be notified to adjust the MES system state to be able to produce.

[0004] And different maintenance projects involve different sites, for example, some maintenance projects only need OP and equipment engineers to participate, and for example, some maintenance projects need LAB (laboratory engineers) to participate in verification, and some maintenance projects do not need LAB to participate in verification, so if the manual notification and supervision method is adopted, it is easy to cause process confusion and production abnormalities.

[0005] It can be seen that the current management method mainly exists the problems of easy judgment error, high management cost, low management efficiency and influence on equipment utilization rate; and due to manual arrangement management, it often causes problems such as task avoidance and responsibility evasion, which brings difficulties to the continuous development of the wafer packaging test industry. SUMMARY

[0006] In view of the deficiencies of the prior art, the purpose of the present application is to provide a maintenance task automatic dispatching method and system of wafer packaging test equipment.

[0007] To achieve the aforementioned technical purposes, the technical scheme adopted by the present application comprises:

[0008] In the first aspect, the present application provides a maintenance task automatic dispatching method for wafer packaging test equipment, which comprises:

[0009] A plurality of work flows corresponding to a plurality of different maintenance projects are provided, and the work flow comprises work stations arranged in a preset order;

[0010] A current maintenance project of the wafer packaging test equipment is obtained, and a work task is established according to a work flow corresponding to the current maintenance project;

[0011] Subtasks are generated in corresponding work stations according to the order of the work stations in the work task;

[0012] According to the preset order, the subtask of the next adjacent work station can be executed only after the subtask of the previous work station is confirmed to be completed or verified to be passed, and the maintenance task ends until the subtasks in all work stations in the work flow are confirmed to be completed or verified to be passed.

[0013] In the second aspect, the present application further provides a maintenance task automatic dispatching system for wafer packaging test equipment, which comprises:

[0014] A custom process module is configured to provide a plurality of work flows corresponding to a plurality of different maintenance projects, and the work flow comprises work stations combined in a preset order;

[0015] A work task module is configured to obtain a current maintenance project of the wafer packaging test equipment and establish a work task according to a work flow corresponding to the current maintenance project;

[0016] A subtask generation module is configured to generate subtasks in corresponding work stations according to the order of the work stations in the work task;

[0017] A task management and control module is configured to execute the subtask of the next adjacent work station only after the subtask of the previous work station is confirmed to be completed or verified to be passed according to the preset order, and the maintenance task ends until the subtasks in all work stations in the work flow are confirmed to be completed or verified to be passed.

[0018] Based on the above technical scheme, compared with the prior art, the present application has at least the following beneficial effects:

[0019] The maintenance task automatic dispatching method and system provided by the application are based on the work flow corresponding to the maintenance project prepared in advance, the site sequence is directly determined according to the current maintenance project, so that the site corresponding to each maintenance project is determined, and the workers of each site only need to work and confirm according to the subtasks given by the system when facing the current maintenance project. After all the subtasks are completed, the system determines that the maintenance project is completed, and the equipment is unlocked or adjusted to a producible system state, without the need to frequently pass information between each site and manually switch the production state of the machine, avoiding the problems of high management cost and easy confusion caused by manual notification and dispatching management. In addition, the machine can be locked and cannot be produced after the maintenance project is dispatched and the device is not disposed by the personnel, and the quality verification device after the maintenance is completed, so as to avoid the continuous production of abnormal products, and significantly improve the management efficiency of the production enterprise.

[0020] The above description is only a summary of the technical scheme of the application, in order to enable those skilled in the art to more clearly understand the technical means of the present application, and can be implemented according to the content of the description, as follows. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 It is the whole process schematic diagram of the maintenance task automatic dispatching method provided by some typical implementation cases of the application;

[0022] Figure 2 It is the process schematic diagram of the maintenance task automatic dispatching method provided by a specific typical implementation case of the application;

[0023] Figure 3 It is the process schematic diagram of the maintenance task automatic dispatching method provided by another specific typical implementation case of the application;

[0024] Figure 4 It is the process schematic diagram of the maintenance task automatic dispatching method provided by another specific typical implementation case of the application;

[0025] Figure 5 It is the process schematic diagram of the maintenance task automatic dispatching method provided by another specific typical implementation case of the application;

[0026] Figure 6 It is the process schematic diagram of the maintenance task automatic dispatching method provided by another specific typical implementation case of the application. DETAILED DESCRIPTION

[0027] In view of the deficiencies in the prior art, the present application has been proposed after long-term research and a large number of practices. The technical scheme, its implementation process and principles will be further explained as follows.

[0028] In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, it will be recognized by one skilled in the art that the present application can be practiced without the specific details and, therefore, the scope of the present application is not limited to the details disclosed herein.

[0029] Moreover, the use of "first", "second", etc., to relate one element to another is merely to distinguish one from another element, and does not require or imply any actual relationship or order between the elements.

[0030] The embodiment of the present application provides a maintenance task automatic dispatching method of a wafer packaging test device, which comprises the following steps:

[0031] S1, providing a plurality of work flows corresponding to a plurality of different maintenance items, wherein each work flow comprises work stations arranged in a preset order;

[0032] S2, obtaining a current maintenance item of the wafer packaging test device, and establishing a work task according to a work flow corresponding to the current maintenance item;

[0033] S3, generating a sub task at a corresponding work station according to an order of the work stations in the work task;

[0034] S4, according to the preset order, the sub task of a next work station adjacent to the last work station can be executed only after the sub task of the last work station is confirmed to be completed or verified to be passed, and the maintenance task ends until the sub tasks in all the work stations in the work flow are confirmed to be completed or verified to be passed.

[0035] The application is mainly developed and designed for the maintenance demand of the semiconductor packaging test production line. In actual production, when the maintenance project is the conventional replacement of consumables and other materials, the requirement for quality verification is lower, and often only OP is involved or OP and QC are jointly involved, without the involvement of equipment engineers; when facing some more complex maintenance projects, such as the replacement / maintenance of key parts of the equipment, the whole process is often significantly more complex, and may require the participation of almost all stations on the production line, and even after QC first piece verification, some outgoing samples need to be continuously sampled and tested by the outgoing detection station for verification, so as to confirm that the maintenance project is completely passed. Therefore, when different maintenance projects occur on a production line, the information exchange between stations will become extremely frequent and complex, resulting in a straight-line increase in management costs; the application determines in advance the work flow, the stations corresponding to different maintenance projects, and the connection sequence between different stations; when the corresponding maintenance project occurs, the system directly generates a work task and sorts the station sequence, and the staff of each station only needs to obtain the corresponding subtask at their own station and execute the subtask; after all subtasks of a certain maintenance task are executed and confirmed to be passed, it is automatically determined that the equipment has completed the current maintenance project, and the equipment is unlocked and turned into a state that can be produced, without frequent information transmission between multiple stations, significantly reducing the communication cost.

[0036] The biggest feature of the above technical solution, which is different from the existing automatic equipment maintenance management platform of many semiconductor enterprises, is the pre-setting of the work flow. A certain work flow is set for a maintenance project, and once the maintenance project occurs, each station executes its own subtask according to the pre-set flow, without the need for coordination and communication between stations. Each station only needs to focus on its own subtask on the management platform, and from the perspective of a certain station, it can simultaneously see the subtask list generated by many different maintenance projects, facilitating the station to make reasonable work arrangements, such as personnel allocation or one-time procurement of materials for subtasks that require the same material.

[0037] As for the types of maintenance projects, in some embodiments, the maintenance projects include material reaching shelf life, material reaching life cycle, switching machine product category, maintenance without part replacement, and maintenance with part replacement. A production line often has several semiconductor packaging test equipment, so multiple current maintenance projects may occur simultaneously on different equipment (different types of equipment or different machines of the same type of equipment) for the production line.

[0038] As to how to determine the current maintenance project, the project can be established manually, a current maintenance project can be newly established by manual input / selection, or in some embodiments, the maintenance task automatic dispatching method can further include the following steps:

[0039] Collecting feedback information of the wafer packaging test equipment, and generating a corresponding current maintenance project for the wafer packaging test equipment when the feedback information meets a preset condition.

[0040] In some embodiments, the preset condition includes any one of a material usage count reaching a set threshold, a same-type equipment alarm frequency reaching a set threshold.

[0041] For example, in some examples, when the material usage count (usage time length or usage times) reaches the shelf life, a maintenance project of the material reaching the shelf life described above is automatically newly established; or when the material usage count reaches the final life span of the material, a maintenance project of the material reaching the life span is automatically newly established; and the performance degradation or damage of a component often leads to equipment alarm, so when the equipment alarm frequency (such as the number of same-type alarms within 1 hour) reaches a set number of times, a maintenance project of maintenance without component replacement or maintenance with component replacement can be automatically newly established according to the alarm type and the alarm frequency.

[0042] As a typical example of the above technical solution, reference can be made to Figure 2 When the maintenance project of the material reaching the shelf life occurs, the system automatically locks the corresponding equipment and converts it into a maintenance state (material to be replaced), an OP logs in the system to take the maintenance subtask, then performs the corresponding material replacement task, and after completion, inputs completion information at the OP workstation to unlock the equipment and convert it into a production state; of course, for some key consumables, the system can automatically determine the machine number, and after taking the record of taking consumables, automatically adds a QC workstation after the OP workstation to assign the OP a subtask of making a first piece and assign a quality engineer a subtask of verifying the first piece.

[0043] Another typical example is shown in Figure 3 When the equipment frequently alarms, and it is determined according to the alarm type that no component needs to be replaced and simple maintenance is sufficient, a maintenance project without component replacement needs to be performed, at this time, the system still performs equipment locking and state conversion, and a device engineer can take (or automatically assign) a corresponding maintenance subtask at the own workstation, and after performing the subtask, the equipment can be unlocked for trial production, and this process can be set to not need the participation of a QC workstation, and a outbound detection workstation (3VI) performs defective product sampling, and when the detection passes without problems, the maintenance task ends.

[0044] Still another typical example is shown in Figure 4As shown, when a more serious situation occurs, such as when materials exceed their shelf life or reach their lifespan limit (usually the shelf life is set to be shorter than the material's lifespan limit), the number of workstations required to participate increases significantly and becomes more complex. In the general order, the equipment workstation first performs the material replacement sub-task, then the QC workstation performs two first-article verification sub-tasks, and finally the equipment workstation performs the confirmation sub-task to determine whether the equipment is ready for production. Only after all sub-tasks are completed and pass the test can the equipment be switched to production mode.

[0045] Other typical implementation cases, for example Figure 5 As shown, when the product output by the equipment changes and adjustments to the equipment are required, the process is similar to... Figure 4 The process shown differs in the specific subtasks.

[0046] When maintenance projects require the replacement of critical components, the overall process becomes more complex, such as... Figure 6 As shown, in Figure 4 and Figure 5 Based on the process shown, this scenario also requires the addition of an outbound inspection workstation (3VI) to perform a defective product sampling inspection. Only after all the sub-tasks of the equipment, QC, and other workstations have been completed in sequence and passed verification can the equipment be switched to production status.

[0047] In any of the above scenarios, if any subtask at any workstation fails to execute or fails verification, the device will be automatically relocked and adjusted to the corresponding abnormal state, such as "quality verification failed" or "requires repair".

[0048] Furthermore, it should be noted that, for ease of demonstration, this application will... Figures 2-6 It was rotated 90° to the left and placed vertically.

[0049] Regarding how the sub-tasks reach the corresponding staff, in some implementation schemes, the sub-tasks are proactively picked up by the staff at the workstation, or directly assigned to designated personnel to receive the sub-tasks.

[0050] In some implementation schemes, the process of directly assigning a designated person to receive the sub-task may specifically include the following steps:

[0051] S10, obtaining maintenance information, the maintenance information including a plurality of wafer packaging test devices corresponding to a current maintenance project, and can also contain a specific auxiliary information of the current maintenance project corresponding to a maintenance duration; also including an expected maintenance project, and can include the occurrence time and the corresponding maintenance duration of the expected maintenance project and other specific auxiliary information; wherein the current maintenance project can be automatically captured by the system according to whether the time is expired, whether the consumables are close to exhaustion, whether the laboratory test is over standard, whether the equipment is alarmed, etc. The current maintenance project can also be added by the manager's manual operation as shown below, while the expected maintenance project can be calculated according to the production plan and the current consumable amount, laboratory test data, etc. It belongs to the planned and expected maintenance project in the foreseeable period (for example, 12h, 24h or even a week, the specific period length is not limited, and it may be different according to different process sites). Each wafer packaging test device has its own maintenance schedule, recording whether there is a current maintenance project, the specific content of the current maintenance project, the future expected maintenance project and its corresponding specific content, occurrence time and maintenance duration (maintenance start to end time).

[0052] S20, generating a subtask sequence for each work site according to the maintenance information, the subtask sequence including a current subtask and an expected subtask; for example, for the consumable replacement maintenance project, the subtask of the OP work site is to replace the consumables, and the subtask of the QC work site is to confirm the quality of the first piece after the consumable replacement, without the participation of other work sites; and for complex component repair and replacement, the subtask of the OP work site is to provide the first piece after repair, the subtask of the device work site is to replace the component, the subtask of the QC work site is to verify the first piece after repair, and the OP is responsible for the continuous sampling inspection of the repaired product at the 3VI (3 visual inspection) work site.

[0053] S30, obtaining personnel information, the personnel information including the work staff of the work site (which can be a personnel list, a work number or an identity number, etc., and the specific limitation is not limited), a list of subtasks that any of the work staff can undertake, and a current work plan of the work staff; wherein the work staff can be a production line OP, a device engineer with equipment maintenance qualification, a process engineer (such as maintaining the reagent), a laboratory quality engineer, etc.; the work plan mainly records when to maintain and repair what equipment and what specific project.

[0054] S40, according to the current subtask and personnel information, the workers capable of performing the current subtask are arranged and combined to form a current dispatch array; wherein the arrangement and combination in the current dispatch array is usually multiple, for example, when the entire site has only one subtask but has N workers capable of performing the subtask, the number of arrangement and combination is N, when there are multiple subtasks and different workers can be selected, the dispatch can be performed through mathematical arrangement and combination.

[0055] S50, in the current dispatch array, the arrangement and combination capable of meeting all expected subtasks of the nearest neighbor are screened as an expected dispatch combination; wherein the nearest neighbor subtask refers to the subtask closest to the current time in the time sequence of the expected maintenance project in a workstation.

[0056] S60, based on the expected dispatch combination, the work plan of the worker is updated to form a dispatch work plan.

[0057] Based on the above technical solution, the present application not only matches the worker qualification with the corresponding maintenance project, but also arranges multiple combinations of the current maintenance project, and selects one combination that can best meet the expected maintenance project from the multiple combinations for dispatch, or selects several feasible combinations for further selection and dispatch by manual selection, which is the most reasonable dispatch method, has high management cost and management efficiency, and avoids the phenomenon of personnel shirking and evasion in manual dispatch.

[0058] And for the continuous production and maintenance project, in some embodiments:

[0059] When any of the current maintenance projects ends, the current work plan of the corresponding worker is updated, and a round of subtask dispatch process is re-executed.

[0060] Or in some embodiments, when a current maintenance project or an expected maintenance project is added in the multiple wafer packaging test devices, a round of subtask dispatch process is re-executed.

[0061] And for some special situations, for example, in some embodiments, when a current maintenance project is added in the wafer packaging test device and the current dispatch array cannot meet all the current subtasks corresponding to all the wafer packaging test devices:

[0062] The current maintenance project is sorted according to the urgency, the extendable project is selected, the extendable project is transferred to the expected maintenance project, and the maintenance information is updated;

[0063] The work plan of the worker is updated based on the updated maintenance information.

[0064] More specifically, in some embodiments, the consideration factor of the urgency ranking includes a criticality level of the current maintenance item, a time length to the end of life, and a corresponding maintenance time length, and the current maintenance item with a higher criticality level, a shorter time length to the end of life, and a longer corresponding maintenance time length is arranged in a higher position in the urgency ranking, and the current maintenance item arranged in a lower position is selected as the extendable item.

[0065] In the above, the criticality level can be manually specified and adjusted, for example, some critical reagents, critical accessories, and critical consumables have the highest criticality level, and other criticality levels can be rated according to their functions and effects on product quality. In addition, some current maintenance items are generated due to reaching a warning threshold, but the time to the end of life is different. When the time to the end of life is close, a higher urgency score needs to be given. In addition, if the maintenance time length of an item is significantly longer than that of other maintenance items, the item needs to be completed urgently to avoid subsequent difficulties in scheduling.

[0066] In combination with the above, the technical solution proposed by the present application is to adjust the dispatch plan in real time as production progresses, and can also accept new maintenance items in real time and make corresponding plan adjustments. In some embodiments, the adding method of the current maintenance item and / or the expected maintenance item can include the following process:

[0067] Automatically generating a maintenance item: when any of the wafer packaging and testing equipment has an abnormal item, matching the maintenance item related to the abnormal item as the added current maintenance item.

[0068] In some embodiments, manual designation of maintenance items can also be performed: that is, by receiving a manual designation operation, and adding the corresponding current maintenance item and / or expected maintenance item.

[0069] In addition, as a common practice in the industry, in some embodiments, when the wafer packaging and testing equipment has a corresponding current maintenance item, the wafer packaging and testing equipment is locked and cannot perform production work. When the current maintenance item is completed and verified, the wafer packaging and testing equipment is unlocked.

[0070] But the application also proposes a more optimal implementation of dynamically adjusting the dispatch plan according to whether the maintenance is completed within the expected duration and verified, that is, in some embodiments, for a certain wafer packaging test equipment, when the current maintenance project is not verified when it exceeds the maintenance duration corresponding to the current maintenance project, the current maintenance project being carried out is copied in the current wafer packaging test equipment to generate a new current maintenance project, and the staff corresponding to the current maintenance project is continued to be allocated in the copied new current maintenance project.

[0071] Correspondingly, the second aspect of the embodiment of the application also provides a maintenance task dispatching system of a wafer packaging test equipment, which comprises:

[0072] A customized process module is configured to provide a plurality of work processes corresponding to a plurality of different maintenance projects, wherein the work processes comprise workstations combined in a preset order;

[0073] A work task module is configured to obtain a current maintenance project of the wafer packaging test equipment and establish a work task according to a work process corresponding to the current maintenance project;

[0074] A subtask generation module is configured to generate a subtask at a corresponding workstation according to an order of the workstations in the work task;

[0075] A task management module is configured to execute a subtask of a next workstation adjacent to the last workstation only when the subtask of the last workstation is confirmed to be completed or verified, until all the subtasks in the work process are confirmed to be completed or verified.

[0076] Finally, according to the method and system provided above, the application can realize dynamic maintenance task dispatching accompanying the production operation process of wafer packaging test. In the embodiment of the application, the current project and the future expected project are planned and dispatched for a plurality of wafer packaging test equipment and a plurality of corresponding staffs. First, a plurality of feasible staff allocation combinations are selected based on the current maintenance project to be carried out, and then the combination that can best meet the future expected maintenance project is screened out, and the work plan of each staff is updated. Not only the spatial intersection of each wafer packaging test equipment and different maintenance projects is comprehensively allocated, but also the balance between the current task and the expected task is fully considered in the time scale, which plays a role in automatically and efficiently dispatching maintenance tasks, and can also significantly reduce the phenomenon of staff dodging tasks and evading responsibilities.

[0077] It should be understood that the above-described embodiments are merely intended to illustrate the technical concept and characteristics of the present application, and the purpose is to enable those skilled in the art to understand the content of the present application and to implement it, and cannot limit the protection scope of the present application. Any equivalent changes or modifications made according to the spirit and principle of the present application should be covered within the protection scope of the present application.

Claims

1. A method for automatically dispatching maintenance tasks for wafer packaging and testing equipment, characterized in that, include: Multiple workflows are provided for different maintenance projects, and the workflows include workstations arranged in a preset order. Obtaining the current maintenance items of the wafer packaging and testing equipment specifically includes: collecting feedback information from the wafer packaging and testing equipment; when the feedback information meets preset conditions, generating a corresponding current maintenance item for the wafer packaging and testing equipment; and then establishing a work task according to the workflow corresponding to the current maintenance item. The preset conditions include any one of the following: material usage count reaches a set threshold, alarm frequency of the same type of equipment reaches a set threshold. Subtasks are generated at the corresponding work stations according to the order of the work stations in the work task. According to the preset order, the subtask of the next adjacent work station can only be executed after the subtask of the previous work station is confirmed to be completed or verified. The maintenance task ends when the subtasks of all work stations in the workflow are confirmed to be completed or verified. The sub-task allocation method includes directly assigning a designated person to receive the sub-task. The process of directly assigning a designated person to receive the sub-task specifically includes: Obtain maintenance information, which includes the current maintenance items and expected maintenance items corresponding to multiple wafer packaging and testing equipment; A subtask sequence is generated for each workstation based on the maintenance information, and the subtask sequence includes the current subtask and the expected subtask. Obtain personnel information, which includes the staff at the workstation, a list of sub-tasks that any of the staff members can perform, and the staff member's current work plan; Based on the current sub-task and personnel information, the staff members who can perform the current sub-task are arranged and combined to form the current assignment array; In the current assignment array, select all permutations and combinations that can satisfy all expected subtasks of the nearest neighbors as expected assignment combinations; Based on the expected assignment combination, update the work plan of the staff.

2. The automatic maintenance task dispatching method according to claim 1, characterized in that, The maintenance items include materials reaching their shelf life, materials reaching their lifespan, switching machine output types, maintenance without parts replacement, and maintenance with parts replacement.

3. The automatic maintenance task dispatching method according to claim 1, characterized in that, The method of allocating sub-tasks also includes: having staff at the workstation actively accept the sub-tasks.

4. The automatic maintenance task dispatching method according to claim 1, characterized in that, Also includes: When any of the current maintenance projects mentioned above is completed, the current work plan of the corresponding staff is updated, and a new round of sub-task assignment is performed. And / or, when a current maintenance item or a planned maintenance item is added to one of the multiple wafer packaging and testing devices, a new round of subtask assignment is performed.

5. The automatic maintenance task dispatching method according to claim 4, characterized in that, When a new maintenance item is added to the wafer packaging and testing equipment, and the current dispatch array cannot fully satisfy all the current sub-tasks corresponding to all the wafer packaging and testing equipment: The current maintenance items are sorted by urgency, and the expandable items are selected. The expandable items are then transferred to the expected maintenance items, and the maintenance information is updated. The staff's work plan is updated with the updated maintenance information.

6. The automatic maintenance task dispatching method according to claim 5, characterized in that, The factors considered in the urgency ranking include the criticality level of the current maintenance item, the time remaining until the end of its service life, and the corresponding maintenance duration. The current maintenance item with the higher criticality level, the shorter the time remaining until the end of its service life, and the longer the corresponding maintenance duration is ranked higher in the urgency ranking. The current maintenance items ranked lower are selected as the extendable items.

7. An automatic maintenance task dispatching system for a wafer packaging and testing equipment for implementing the automatic maintenance task dispatching method according to any one of claims 1-6, characterized in that, include: A customized process module is used to provide multiple workflows corresponding to multiple different maintenance projects. The workflows include workstations combined in a preset order. The work task module is used to obtain the current maintenance items of the wafer packaging and testing equipment and create work tasks according to the workflow corresponding to the current maintenance items. The subtask generation module is used to generate subtasks at the corresponding workstations according to the order of the workstations in the work task. The task management module is used to execute the subtask of the next adjacent workstation only after the subtask of the previous workstation has been confirmed as completed or verified, in the preset order, until all subtasks in all workstations in the workflow have been confirmed as completed or verified.

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