Acoustic transducer array assembly

Abstract

The present disclosure relates to an acoustic transducer array assembly configured to provide acoustic pressure waves to at least one sample location, the acoustic transducer array assembly comprising a printed circuit board having at least one plated through-hole and a matching layer, the matching layer includes an acoustic medium configured to provide acoustic impedance matching between an acoustic impedance of the at least one piezoelectric element and a target sample. The acoustic transducer array assembly also includes at least one acoustic transducer having: at least one signal electrode electrically connected to the at least one plated through hole and acoustically coupled to the matching layer; at least one ground electrode electrically connected to the at least one plated via and acoustically coupled to the matching layer; and at least one piezoelectric element electrically connected to the at least one signal electrode and the at least one ground electrode, in which the at least one piezoelectric element is configured to generate an acoustic pressure wave when a voltage is applied to the piezoelectric element between the at least one signal electrode and the at least one ground electrode.

Description

[0001] Cross-reference to related applications

[0002] This application, filed as a PCT international application on May 10, 2024, claims the benefit and priority of U.S. Provisional Patent Application No. 63 / 501,988, filed on May 12, 2023, the disclosure of which is incorporated herein by reference in its entirety. Background Technology

[0003] Acoustic transducers can be used to convert electrical energy into sound waves suitable for measuring small volumes of liquid. In some examples, piezoelectric elements with electrodes on each side can be attached to a printed circuit board (PCB), making electrical contact between the piezoelectric element and circuitry on the PCB, such as traces or pads. Electrical contact between the PCB circuitry and the piezoelectric electrodes can be facilitated by placing a conductive material between each piezoelectric electrode and the PCB circuitry. When a voltage is applied to each piezoelectric electrode, the piezoelectric element expands or contracts, generating sound pressure waves that travel through solids and liquids, including reflected waves returning to the piezoelectric element. Summary of the Invention

[0004] This disclosure relates to an acoustic transducer. Specifically, it relates to an acoustic transducer comprising one or more piezoelectric elements that are in acoustic contact with the bottom of one or more containers containing a liquid sample. In some applications, the one or more piezoelectric elements are arranged to contain a sample organized in an array, such as a linear array. In some applications, acoustic energy can be used to measure the sample from the container. In some applications, the acoustic transducer array assembly is configured to continuously apply sound pressure waves from multiple acoustic transducers to multiple samples.

[0005] In one example, an acoustic transducer array assembly is configured to provide a sound pressure wave to at least one sample location. The acoustic transducer array assembly includes a printed circuit board having at least one plated via and a matching layer. The matching layer includes an acoustic medium configured to provide acoustic impedance matching between the acoustic impedance of at least one piezoelectric element and the target sample. The acoustic transducer array assembly also includes at least one acoustic transducer having: at least one signal electrode electrically connected to at least one plated via and acoustically coupled to the matching layer; at least one ground electrode electrically connected to at least one plated via and acoustically coupled to the matching layer; and at least one piezoelectric element electrically connected to at least one signal electrode and at least one ground electrode, wherein the at least one piezoelectric element is configured to generate a sound pressure wave when a voltage is applied between the at least one signal electrode and the at least one ground electrode.

[0006] In another example, a method for providing a sound pressure wave to at least one location includes providing an acoustic transducer array assembly, wherein the acoustic transducer array assembly includes: at least one printed circuit board including at least one plated via and at least one matching layer, the at least one matching layer including an acoustic medium configured to provide acoustic impedance matching between at least one piezoelectric element and at least one target sample; and at least one acoustic transducer including at least one signal electrode electrically connected to at least one plated via and acoustically connected to at least one matching layer, at least one ground electrode electrically connected to at least one plated via and acoustically connected to at least one matching layer, and at least one piezoelectric element electrically connected to at least one signal electrode and at least one ground electrode. The method further includes: applying a voltage to at least one piezoelectric element between at least one signal electrode and at least one ground electrode; converting the voltage into a sound pressure wave; and projecting the sound pressure wave to at least one location, wherein at least one signal reflection of the sound pressure wave is minimized due to acoustic impedance matching.

[0007] In yet another example, a method of fabricating an acoustic transducer array assembly includes providing the acoustic transducer array assembly, wherein the acoustic transducer array assembly includes a printed circuit board including at least one plated through-hole and at least one matching layer, the at least one matching layer being configured to provide acoustic impedance matching between at least one piezoelectric element and at least one target sample. The method further includes: electrically connecting at least one signal electrode to the acoustic transducer array assembly and acoustically connecting the at least one signal electrode to the at least one matching layer; electrically connecting at least one ground electrode to the acoustic transducer array assembly and acoustically connecting the at least one ground electrode to the at least one matching layer; and electrically connecting at least one piezoelectric element to the at least one signal electrode and the at least one ground electrode.

[0008] Various additional aspects will be set forth in the following description. These aspects may involve individual features or combinations of features. It should be understood that both the foregoing general description and the following detailed description are exemplary and illustrative only, and do not limit the broad inventive concept on which the examples disclosed herein are based. Attached Figure Description

[0009] The following figures illustrate examples of this disclosure and therefore do not limit the scope of this disclosure. Examples of this disclosure will be described below in conjunction with the figures, wherein the same reference numerals denote the same elements.

[0010] Figure 1 A block diagram of an acoustic transducer array assembly is shown, which includes a PCB and at least one acoustic transducer.

[0011] Figure 2It shows Figure 1 A three-dimensional view of an acoustic transducer and an acoustic transducer array assembly, wherein the acoustic transducer array assembly includes multiple acoustic transducers.

[0012] Figure 3 It shows Figure 1 Top-view isometric view of the acoustic transducer.

[0013] Figure 4 It shows Figure 1 An isometric view of the acoustic transducer from below.

[0014] Figure 5 It shows Figure 3 A cross-sectional view of the acoustic transducer.

[0015] Figure 6 It shows Figure 1 An exploded view of an acoustic transducer array assembly, wherein the piezoelectric elements include piezoelectric disks positioned at each through-hole.

[0016] Figure 7 It shows Figure 6 A side-view exploded view of the acoustic transducer array assembly.

[0017] Figure 8 It shows Figures 6 to 7 A cross-sectional view of the acoustic transducer array assembly.

[0018] Figure 9 It shows Figures 6 to 8 A cross-sectional view of an acoustic transducer array assembly, which includes a matching layer integrated into a PCB.

[0019] Figure 10 It shows Figure 1 An exploded view of another embodiment of the acoustic transducer array assembly, wherein the piezoelectric element includes a piezoelectric plate.

[0020] Figure 11 It shows Figure 10 A side-view exploded view of the acoustic transducer array assembly.

[0021] Figure 12 It shows Figure 1 An exploded view of another embodiment of the acoustic transducer array, wherein the acoustic transducer array includes at least one high-density connector and the piezoelectric element includes a piezoelectric disk positioned at each plated through-hole.

[0022] Figure 13 It shows Figure 12 A side-view exploded view of the acoustic transducer array assembly.

[0023] Figure 14 It shows Figure 12A cross-sectional view of the acoustic transducer array assembly.

[0024] Figure 15 It shows Figure 12 An exploded view of another embodiment of the acoustic transducer array, wherein the acoustic transducer array includes a matching layer and a lens.

[0025] Figure 16 It shows Figure 15 A side-view exploded view of the acoustic transducer array assembly.

[0026] Figure 17 It shows Figure 15 A cross-sectional view of the acoustic transducer array assembly.

[0027] Figure 18 An example side view of an acoustic transducer is shown, in which various signal connectors are arranged in parallel.

[0028] Figure 19 An example side view of an acoustic transducer is shown, in which various signal connectors are arranged in series.

[0029] Figure 20 A bottom view of a PCB or flexible circuit is shown, illustrating the first layer of a PCB or flexible circuit with multiple columns of multiplexed traces.

[0030] Figure 21 A top view of a PCB or flexible circuit is shown, illustrating the first layer of a PCB or flexible circuit with multiple row multiplexing traces.

[0031] Figure 22 A flowchart is shown for a method of providing acoustic vibrations to at least one sample test location.

[0032] Figure 23 A schematic diagram of the electronic system used to operate the acoustic transducer array assembly is shown.

[0033] In the accompanying drawings, similar parts and / or features may have the same reference numerals. Detailed Implementation

[0034] Various examples will be described in detail with reference to the accompanying drawings, in which the same reference numerals denote the same parts and components throughout several views.

[0035] Generally, this disclosure relates to acoustic transducer array assemblies configured to provide sound pressure waves to various laboratory materials. In some examples, the acoustic transducer array assembly provides acoustically driven pressure waves through solid and liquid materials. In some embodiments, and by way of non-limiting examples, the acoustic transducer array assembly is configured to provide sound pressure waves to at least one sample test location.

[0036] While the term "printed circuit board" (PCB) is sometimes used to refer to a flat, rigid board comprising one or more non-conductive substrate materials, such as fiberglass or plastic, it is not intended to be so limited in this disclosure. For example, in some embodiments, the PCB is a flexible circuit (also referred to as a flexible electronic device) or includes flexible circuits (also referred to as flexible electronic devices). A PCB may include a variety of possible non-conductive substrate materials for mechanically supporting components within a transducer array assembly, and conductive materials (such as traces, conductive pads, ground planes, etc.) for electrically connecting electronic components. Specifically, examples of printed circuit boards include rigid printed circuit boards (typically comprising fiberglass or plastic) or flexible circuits (including flexible substrates such as polyimide or conductive polyester films). Therefore, the PCB described herein may include rigid circuit boards, flexible circuit boards, or combinations thereof.

[0037] Furthermore, this disclosure relates to an acoustic transducer array assembly configured to provide a plurality of acoustic transducers that work together to improve the efficiency of automated manufacturing processes and reduce the cost of automated manufacturing processes.

[0038] Figure 1 A block diagram of an acoustic transducer array assembly 100 including a PCB 102 and at least one acoustic transducer 108 is shown.

[0039] PCB 102 is used for electrical connections and organization of electronic components. PCB 102 has multiple conductive pads 105 (as per...). Figures 18 and 19 (As illustrated and described in further detail), conductive pad 105 is configured to be electrically connected to other electronic components via conductive connections, such as solder connections. In some embodiments, PCB 102 is a flexible circuit comprising a flexible substrate such as polyimide or conductive polyester film. The flexible circuit is configured to be electrically connected to and mechanically coupled to multiple electronic devices. In some examples, the flexible circuit can be fabricated using similar components included within a rigid PCB 102. In some examples, it is desirable to include a flexible circuit because the flexible substrate includes acoustic impedance characteristics that provide impedance matching between the acoustic impedance of at least one piezoelectric element 114 and the target sample. In some examples, the flexible circuit includes a matching layer 106 integrated into the flexible circuit.

[0040] PCB 102 includes at least one plated via 104, which serves as an electrical connection between copper layers in PCB 102. The plated via 104 can be created by drilling through two or more adjacent layers of PCB 102. In some embodiments, the plated via 104 includes a copper plating layer that electrically connects components of PCB 102 to component leads received at the plated via 104. In some embodiments, PCB 102 includes a plurality of plated vias 104. In some embodiments, PCB 102 includes a plurality of plated vias 104 arranged in a linear array. In some embodiments, PCB 102 includes a plurality of plated vias 104 ranging from 1 to 384. In some embodiments, PCB 102 includes a plurality of plated vias 104 arranged in a one-dimensional array. In some embodiments, PCB 102 includes ninety-six plated vias 104 arranged in an 8×12 two-dimensional linear array with a center-to-center spacing of nine millimeters. In some embodiments, PCB 102 includes 384 plated through-holes 104 arranged in a 16×24 linear array. In some embodiments, PCB 102 includes 384 plated through-holes 104 arranged in a symmetrical linear array with a center-to-center spacing of 4.5 mm. In some embodiments, the spacing between each plated through-hole 104 ranges from 4.5 mm to 36 mm. In some embodiments, the PCB includes more than 384 plated through-holes.

[0041] Furthermore, PCB 102 includes at least one matching layer 106, which includes an acoustic medium configured to provide acoustic impedance matching between the acoustic impedance of at least one piezoelectric element 114 and the target sample. In some examples, matching layer 106 provides acoustic impedance matching to layers adjacent to matching layer 106. In some examples, matching layer 106 provides acoustic impedance matching between piezoelectric element 114 and lens 302. Figures 3 to 8 This is illustrated and described in further detail. In some embodiments, the acoustic medium comprises a polymer material. In some embodiments, the polymer material comprises at least one of polyimide, polyester, polystyrene, polyvinylidene fluoride (PDVF), aluminum, glass, polyphenylene ether, or polypropylene. Impedance matching is desired to maximize power transfer while minimizing signal reflections that produce destructive interference. References are made below. Figures 6 to 14 Further discussion includes PCB 102, plated via 104, and at least one mating layer.

[0042] At least one acoustic transducer 108 is configured to be electrically connected to and acoustically coupled to PCB 102 to generate sound pressure waves. In some examples, the input voltage signal includes a frequency range between 1 MHz and 20 MHz. In some embodiments, at least one acoustic transducer 108 is acoustically coupled to and electrically connected to PCB 102 at each plated via 104. In some embodiments, the acoustic transducer 108 is electrically connected to PCB 102 using solder joints or conductive epoxy. In some embodiments, the acoustic transducer 108 is coaxially aligned with the plated via 104 to provide two-dimensional alignment of its components. The acoustic transducer 108 includes at least one signal electrode 110, at least one ground electrode, at least one electrical connection 112, and at least one piezoelectric element 114.

[0043] At least one signal electrode 110 is configured to generate a signal output within the acoustic transducer array assembly 100. The at least one signal electrode 110 is electrically connected to at least one ground electrode 111. A potential exists between the at least one signal electrode and the at least one ground electrode, allowing a voltage to be applied to a component between the signal electrode 110 and the ground electrode 111, such as a piezoelectric element 114 as described below. In some examples, the at least one ground electrode includes an electrical ground used in a radio frequency system (“RF ground”). It is desirable to establish an electrical ground, such as an RF ground, to provide voltage from the signal electrode 110 to the ground electrode 111 across at least one piezoelectric element 114 (discussed below). In some examples, it is desirable to establish a good electrical connection between the signal electrode 110 and the ground electrode 111 to reduce electromagnetic interference and improve the efficiency and performance of the acoustic transducer array assembly 100.

[0044] In some embodiments, at least one acoustic transducer 108 includes at least one electrical connection 112. In some examples, at least one electrical connection 112 provides an electrical connection between a ground electrode 111 and a second layer 102B of the PCB. In some examples, at least one electrical connection 112 provides an electrical connection between a signal electrode 110 and a first layer 102A of the PCB. In some examples, the electrical connection 112 includes a conductive or non-conductive connection between the ground electrode 111 and the second layer 102B of the PCB. In some examples, the electrical connection 112 includes a conductive or non-conductive connection between the signal electrode 110 and the first layer 102A of the PCB.

[0045] In some examples, the conductive bonding element includes a solder joint. In some examples, the conductive bonding element includes conductive epoxy resin, such as silver-impregnated epoxy resin, positioned within a plated via 104 that electrically connects at least one signal electrode 110 to a first layer 102A of the PCB and at least one ground electrode 111 to a second layer 102B of the PCB.

[0046] In some examples, the non-conductive connection includes a capacitive connection that includes a potential between the signal electrode 110 and the ground electrode 111. In some examples, the non-conductive connection includes using a metallic material such as aluminum to connect the piezoelectric element 114 and the ground electrode 111. In some examples, the metallic material contacts the piezoelectric element 114 to facilitate voltage transfer from the electric field to the piezoelectric element 114. In some examples, the metallic material includes an aluminum plate.

[0047] In some examples, the acoustic transducer array assembly includes signal electrodes 110 positioned between each plated via 104 on a PCB 102. In some examples, at least one connector 1101 is provided on the acoustic transducer array assembly, which provides voltage to each acoustic transducer 108 via PCB traces. (About...) Figures 12 to 17 At least one connector 1101 is illustrated and described in further detail.

[0048] At least one piezoelectric element 114 is configured to generate sound pressure waves through a process known as the inverse piezoelectric effect, in which electrical energy is converted into mechanical energy in the form of sound waves. The piezoelectric element 114 performs this function by receiving voltage and releasing energy in the form of sound pressure waves.

[0049] In some embodiments, at least one piezoelectric element 114 includes a piezoelectric plate spanning one or more plated through-holes 104. In some applications, a single piezoelectric plate may be desirable because it improves the manufacturing efficiency of piezoelectric elements 114 for multiple acoustic transducers 108 while reducing production costs. Regarding Figures 10 to 12 The piezoelectric element, including the piezoelectric plate, is described and illustrated in further detail.

[0050] In some embodiments, at least one piezoelectric element 114 includes at least one piezoelectric disk positioned at each plated through-hole 104. It may be desirable to include a separate piezoelectric disk within each acoustic transducer 108, as this disconnects the piezoelectric element 114 of each acoustic transducer 108 from each other when multiple acoustic transducers 108 are included on a single acoustic transducer array assembly 100, and allows the piezoelectric disk to expand or contract freely. Regarding Figures 6 to 9 The piezoelectric element 114, comprising at least one piezoelectric disc, is described and illustrated in further detail.

[0051] In some embodiments, at least one acoustic transducer array assembly 100 is arranged in an orientation as shown in the figure, wherein components are stacked on top of each other. In some examples, the two layers 102A, 102B of the PCB include an integrated matching layer 106 as part of a flexible circuit and plated vias 104. As described above, the two layers 102A, 102B of the PCB are electrically connected to the acoustic transducer 108 via electrical connectors 112. Furthermore, the acoustic transducer 108 includes a signal electrode 110 electrically connected to the first layer 102A of the PCB and a ground electrode 111 electrically connected to the second layer 102B of the PCB. A potential exists between the signal electrode 110 and the ground electrode 111 to allow voltage to be transferred to the piezoelectric element.

[0052] The following text refers to Figures 3 to 5 Further discussion includes the acoustic transducer 108, at least one signal electrode 110, at least one ground electrode 111, at least one electrical connector 112, and at least one piezoelectric element 114.

[0053] Figure 2 It shows Figure 1 A perspective view of an acoustic transducer 108 and an acoustic transducer array assembly 100, wherein the acoustic transducer array assembly 100 includes a plurality of acoustic transducers 108.

[0054] The desired objectives are: (1) to provide acoustic pressure waves to multiple sample points; (2) to provide electrical connections to each acoustic transducer 108 on an easily accessible acoustic transducer array assembly; and (3) to maximize the power transfer of the acoustic pressure waves while minimizing unwanted signal reflections that cause destructive interference. The figure illustrates the location of multiple acoustic transducers 108 arranged in an 8×12 linear array within the acoustic transducer array assembly 100. The linear array of acoustic transducers provides acoustic pressure waves to multiple sample points while easily integrating into existing laboratory glassware employing a similar linear array pattern. Furthermore, each plated via 104 positioned on the PCB 102 provides an accessible connection between the acoustic transducer 108 and the PCB 102. Additionally, a matching layer 106 is configured to provide acoustic impedance matching between the acoustic impedance of at least one piezoelectric element 114 and the target sample.

[0055] Figure 3 It shows Figure 1 Top isometric view of the acoustic transducer 108.

[0056] In this figure, the acoustic transducer 108 includes a PCB 102, plated vias 104, and a piezoelectric element 114. In this embodiment, the piezoelectric element 114 is a piezoelectric disk configured to receive voltage through the potential between the signal electrode 110 and the ground electrode 111. The PCB 102 includes a first layer 102A and a second layer 102B. In some examples, the first layer 102A is configured to receive voltage from the signal electrode 110 and transmit the voltage to the piezoelectric element 114 via an electrical connector 112. The second layer 102B is configured to ground the acoustic transducer 108. In some examples, the acoustic transducer 108 includes a single acoustic transducer 108.

[0057] The acoustic transducer 108 also includes discrete components, namely an acoustic lens 302, an acoustic transducer matching layer 304, and a piezoelectric substrate material 306. The acoustic lens 302 is configured to focus sound waves at a desired frequency and amplitude to a desired target location. In some embodiments, the acoustic transducer matching layer 304 may be configured to be combined with the matching layer 106 to further tune the acoustic impedance of the acoustic transducer array assembly 100. The piezoelectric substrate material 306 is configured to absorb acoustic energy, reduce reflections of sound pressure waves returning to the piezoelectric element 114, and focus transmitted sound waves on the front side of the piezoelectric element. In some embodiments, the various components of the acoustic transducer 108 are assembled by connecting the layers to a liquid epoxy resin layer as a cured solid. In some examples, the piezoelectric substrate material 306 includes at least one of tungsten powder and epoxy resin, conductive epoxy resin, and other polymers.

[0058] Additionally, the figure includes a signal electrode 110 positioned on the top side of the piezoelectric element 114. Relative to... Figure 1 The electrical connection between signal electrode 110 and the first layer 102A of the PCB is illustrated and described in further detail. Relative to... Figure 1 The electrical connection between the ground electrode 111 and the second layer 102B of the PCB is illustrated and described in further detail.

[0059] Figure 4 It shows Figure 1 An isometric view of the acoustic transducer 108 from below.

[0060] The diagram includes Figure 3 Similar components discussed in the figure. Furthermore, the figure includes a ground electrode 111 positioned on the bottom side of the piezoelectric element 114. Relative to... Figure 1 The electrical connection between signal electrode 110 and the first layer 102A of the PCB is illustrated and described in further detail. Relative to... Figure 1 The electrical connection between the ground electrode 111 and the second layer 102B of the PCB is illustrated and described in further detail.

[0061] Figure 5It shows Figure 3 Cross-sectional view of the acoustic transducer 108.

[0062] The diagram includes many related... Figure 3 The components are identical to those in the PCB 102. An acoustic transducer 108 is positioned at a plated via 104 on the PCB 102. An acoustic lens 302 is positioned on the front side of the acoustic transducer 108. A piezoelectric element 114 is positioned between two sections of the PCB 102, including a first layer 102A and a second layer 102B. An acoustic transducer mating layer 304 is positioned on the front side of the piezoelectric element 114 between the acoustic lens 302 and the piezoelectric element 114, and a piezoelectric substrate material 306 is positioned on the back side of the piezoelectric element 114. In this configuration, the plated via 104 also serves to coaxially position the components with the piezoelectric element 114 and provides a receiving portion for the piezoelectric substrate material 306 until it hardens.

[0063] Figure 6 It shows Figure 1 An exploded view of the acoustic transducer array assembly, wherein the piezoelectric element 114 includes a piezoelectric disk positioned at each plated through-hole 104.

[0064] The plated through-hole 104, PCB 102, and discrete components (including acoustic lens 302, acoustic transducer matching layer 304, and piezoelectric element 114) are similar to the components discussed above. The acoustic transducer array assembly 100 includes an acoustic transducer array assembly frame 502 and an acoustic transducer array assembly bracket 508, which are used to fix the components within the acoustic transducer array assembly 100 and to mount the acoustic transducer array assembly 100 to other devices within the assembly.

[0065] In this figure, the acoustic transducer array assembly 100 includes a plurality of signal electrodes 110 electrically connected to a PCB 102A. In some embodiments, the signal electrodes 110 are electrically connected to the PCB 102A using direct connectors, such as solder connectors. In some embodiments, the signal electrodes 110 are electrically connected to the PCB 102A using direct connection cables that are directly press-fitted into the PCB 102.

[0066] Furthermore, the acoustic transducer array assembly 100 includes an electrical connector 112 configured to supply voltage to the piezoelectric element 114. As shown in the figure, and in some embodiments, the electrical connector 112 may include direct connections, such as multiple conductor rings 308 configured to electrically connect to the periphery of each plated through-hole 104 of the PCB 102. When voltage is applied from the electrical connector 112 through the piezoelectric element 114, the piezoelectric element 114 expands and contracts to generate sound waves. Figures 3 to 5As described and illustrated, acoustic lenses 302 are used to focus sound waves onto a desired target. Furthermore, each acoustic transducer 108 may include an acoustic transducer matching layer 304 for providing acoustic impedance matching between the acoustic impedance of at least one piezoelectric element 114 and the target sample. Each element of the acoustic transducer is secured to the front side of the acoustic transducer array assembly via the top layer of the PCB 102 and the acoustic transducer array assembly frame 502.

[0067] Figure 7 It shows Figure 6 An exploded side view of the acoustic transducer array assembly 100. This view includes... Figure 6 The components are identical, and the layering of each component of the acoustic transducer array assembly 100 is illustrated from a side view. In some embodiments, the assembly of the various components of the acoustic transducer 108 is achieved by connecting the layers using a liquid epoxy resin layer as a cured solid.

[0068] Figure 8 It shows Figures 6 to 7 A cross-sectional view of the acoustic transducer array assembly 100. The cross-sectional view includes the acoustic transducer 108 centered in the figure. The acoustic transducer 108 includes many of the same components discussed above. In some embodiments, a piezoelectric element 114 receives a voltage between a signal electrode 110 electrically connected to a first layer 102A of the PCB and a ground electrode 111 electrically connected to a second layer 102B of the PCB. The voltage passes through a conductor ring 308, through a piezoelectric substrate material 306, and reaches the piezoelectric element 114 (shown here as a piezoelectric disk). The piezoelectric element 114 then expands and / or contracts upon receiving the voltage. The expansion / contraction of the piezoelectric element 114 generates an acoustic pressure wave that travels through the acoustic transducer matching layer 304 to match the impedance of the piezoelectric element 114 to the target sample. The acoustic pressure wave is then focused toward the desired target by an acoustic lens 302. Additional acoustic pressure waves traveling in the opposite direction from the back side of the piezoelectric element 114 are absorbed by the piezoelectric substrate material 306.

[0069] Figure 9 It shows Figures 6 to 8A cross-sectional view of an acoustic transducer array assembly 100, which includes a matching layer 106 integrated into a PCB 102. In some embodiments, it is desirable to include the matching layer 106 integrated into the PCB 102 to maximize the power transfer of the acoustic pressure wave while minimizing signal reflection. Furthermore, the integrated matching layer 106 provides the desired impedance matching characteristics without requiring an additional impedance matching layer. In some embodiments, the integrated matching layer 106 comprises at least one of polyimide or polyester. In some embodiments, the matching layer 106 is integrated into a second layer 102B of the PCB, which serves as a ground plane. In some embodiments, a piezoelectric element 114 is positioned below the PCB 102 and the integrated matching layer 106.

[0070] Figure 10 It shows Figure 1 An exploded view of another embodiment of the acoustic transducer array assembly 100, wherein the piezoelectric element 114 includes a piezoelectric plate and flexible circuitry. In some examples, the flexible circuitry may replace the PCB 102.

[0071] The diagram includes Figures 1 to 9 Many of the same elements of the acoustic transducer array assembly 100 discussed herein include the acoustic transducer array assembly support 508, signal electrode 110, first layer 102A of PCB, conductor ring 308, plated via 104, piezoelectric substrate layer 306, and second layer 102B of PCB in the form of a flexible circuit, which serves as a ground layer for the voltage field across the piezoelectric element 114.

[0072] Furthermore, the figure includes at least one piezoelectric element 114, shown as a piezoelectric plate. The piezoelectric plate is supported by a non-conductive alumina or epoxy resin substrate material 902, which also contacts the conductor rings 308. The alumina or epoxy resin substrate material 902 is placed between the conductor rings 308 filled with a conductive substrate material 306 to prevent short circuits in the voltage field between the signal electrodes 110. In some examples, the conductive substrate material includes tungsten metal or conductive epoxy resin. Additionally, the piezoelectric plate is secured to the front side of the piezoelectric plate using an acoustic transducer array assembly frame 502. The acoustic transducer array assembly frame 502 is electrically connected to a second layer 102B of a PCB in the form of a flexible circuit, which serves as a ground layer. In some embodiments, a matching layer 106 is positioned on top of the second layer 102B of the PCB to provide acoustic impedance matching to the target sample for acoustic pressure waves generated by the expansion and contraction of the piezoelectric plate.

[0073] Figure 11 It shows Figure 10An exploded side view of the acoustic transducer array assembly. This figure includes components similar to those described above. In some embodiments, the assembly of the various components of the acoustic transducer array assembly 100 is achieved by bonding the layers using a liquid epoxy resin as a cured solid.

[0074] Figure 12 It shows Figure 1 An exploded view of another embodiment of the acoustic transducer array 100, wherein the acoustic transducer array 100 includes at least one connector 1101, and the piezoelectric element 114 includes a piezoelectric disk positioned at each plated through-hole 104.

[0075] In this figure, the acoustic transducer array 100 includes a plurality of [unclear text - likely related to acoustic transducer arrays]. Figures 6 to 8 The components are the same as those in the PCB 102, including a second layer 102B of the PCB 102 in the form of a flexible circuit, which serves as a ground plane, an acoustic transducer array assembly frame 502, a piezoelectric element 114, a second layer 102A of the PCB 102 serving as a signal connection layer, and a discrete piezoelectric substrate layer 306.

[0076] Furthermore, in this figure, the acoustic transducer array 100 includes at least one connector 1101. In some examples, connector 1101 includes electrical connector pins for electrical connection at a second layer 102B via a first end 1107 to a PCB 102. The electrical connector pins provide voltage to the second layer 102B, which electrically connects various components via PCB traces. In some examples, at least one connector 1101 includes 64 electrical connector pins for connecting piezoelectric element 114 and signal electrode 110 to multiplexing electronics (not shown). In some examples, at least one connector 1101 includes two connectors 1101 positioned at opposite ends of the second layer 102B. In some examples, connector 1101 includes a receiving portion 1103.

[0077] Furthermore, in this figure, the acoustic transducer array 100 includes a spacer 1105 for providing a gap between the first layer 102A and the second layer 102B. In some examples, the spacer 1105 allows the piezoelectric element 114 to be precisely laterally positioned within the plated via 104 of the PCB 102. In some examples, the spacer 1105 has a thickness substantially the same as that of the piezoelectric element 114.

[0078] Figure 13 yes Figure 12 An exploded side view of the acoustic transducer array assembly. This figure includes components similar to those described above. In some embodiments, the assembly of the various components of the acoustic transducer array assembly 100 is achieved by bonding the layers using a liquid epoxy resin as a cured solid.

[0079] Figure 14 It shows Figure 12 A cross-sectional view of the acoustic transducer array assembly. The figure includes components similar to those described above, including piezoelectric element 114, piezoelectric substrate material 306, a first layer 102A of PCB 102 used as a signal conduction layer, a second layer 102B of PCB 102 used as a ground layer, and spacer 1105.

[0080] Figure 15 It shows Figure 12 An exploded view of another embodiment of the acoustic transducer array assembly 100, wherein the acoustic transducer array assembly 100 includes an acoustic transducer discrete matching layer 304 and a lens 302.

[0081] Figure 16 It shows Figure 15 An exploded side view of the acoustic transducer array assembly. This figure includes components similar to those described above. In some embodiments, the assembly of the various components of the acoustic transducer array assembly 100 is achieved by bonding the layers using a liquid epoxy resin as a cured solid.

[0082] Figure 17 It shows Figure 15 A cross-sectional view of the acoustic transducer array assembly. The figure includes components similar to those described above, including piezoelectric element 114, piezoelectric substrate material 306, a first layer 102A of PCB 102 serving as a signal conduction layer, a second layer 102B of PCB serving as a ground layer, spacer 1105, lens 302, and acoustic transducer matching layer 304, wherein spacer 1105 provides precise lateral positioning between the piezoelectric pad and the plated vias 104 of PCBs 102A and 102B.

[0083] Figure 18 A block diagram of an acoustic transducer 108 is shown, in which various acoustic connectors are arranged in parallel.

[0084] In this figure, the acoustic transducer 108 includes components similar to those discussed above. The acoustic components within the acoustic transducer 108 are arranged in parallel, wherein sound pressure waves generated by the piezoelectric element 114 can pass through an integrated layer including signal connectors located at plated vias 104 and a piezoelectric substrate material 306 or acoustic matching material 304. Signal electrodes 110 and ground electrodes 111 are electrically connected to the PCB 102 at a first layer 102A and a second layer 102B, respectively. The first layer 102A and the second layer 102B include annular rings surrounding the acoustic matching layer 304 and the piezoelectric substrate layer 306, respectively. Furthermore, the acoustic transducer 108 includes signal electrodes 110 and ground electrodes 111 electrically connected to opposite ends of the piezoelectric element 114. Additionally, the first layer 102A includes the piezoelectric substrate layer 306, and the second layer 102B includes the acoustic matching layer 304.

[0085] Figure 19 A block diagram of an acoustic transducer 108 is shown, in which various acoustic connectors are arranged in series.

[0086] In this figure, the acoustic transducer assembly 100 includes similar components discussed above. The acoustic components within the acoustic transducer 108 are arranged in series, wherein the sound pressure wave generated by the piezoelectric element 114 can pass through multiple layers, including signal connectors at conductive pads 105 on the PCB 102 and piezoelectric substrate material 306 or acoustic matching material 304. Signal electrode 110 and ground electrode 111 are electrically connected to the PCB 102 at conductive pads 105 on the PCB 102 at the first layer 102A and the second layer 102B, respectively.

[0087] Figure 20 A bottom view of PCB 102 or flexible circuitry is shown, illustrating the first layer 102A of a PCB or flexible circuitry with multiple columns of multiplexing traces 1200.

[0088] The column multiplexing trace 1200 provides electrical connections between acoustic transducers 108 located within a single column on the transducer array assembly 100. In some examples, the column multiplexing trace 1200 provides voltage to one acoustic transducer 108 at a time. In some examples, the column multiplexing trace 1200 continuously provides voltage to acoustic transducers along its length. In some examples, it may be desirable to excite a single acoustic transducer 108 within the column multiplexing trace 1200 without stimulating adjacent acoustic transducers to prevent destructive interference of sound pressure waves received from adjacent acoustic transducers 108.

[0089] In some examples, the transducer array assembly 100 includes eight or twelve multiplexed traces 1200 configured to provide electrical connections within the acoustic transducer array assembly having an 8×12 arrangement of acoustic transducers 108. In some examples, the transducer array assembly 100 includes sixteen or twenty-four multiplexed traces 1200 configured to provide electrical connections within the acoustic transducer array assembly having a 16×24 arrangement of acoustic transducers 108.

[0090] Figure 21 A bottom view of PCB 102 or flexible circuitry is shown, illustrating the first layer 102A of a PCB or flexible circuitry with multiple row multiplexing traces 1202.

[0091] The row multiplexing trace 1202 provides electrical connections between acoustic transducers 108 within a single row located on the transducer array assembly 100. In some examples, the row multiplexing trace 1202 provides voltage to one acoustic transducer 108 at a time. In some examples, the row multiplexing trace 1202 continuously provides voltage to acoustic transducers along the row multiplexing trace 1202. In some examples, it may be desirable to excite a single acoustic transducer 108 within the row multiplexing trace 1202 without stimulating adjacent acoustic transducers to prevent destructive interference of sound pressure waves received from adjacent acoustic transducers 108.

[0092] In some examples, the acoustic transducer array assembly 100 includes eight or twelve rows of multiplexed traces 1202 configured to provide electrical connections within the acoustic transducer array assembly having an 8×12 arrangement of acoustic transducers 108. In some examples, the transducer array assembly 100 includes sixteen or twenty-four rows of multiplexed traces 1202 configured to provide electrical connections within the acoustic transducer array assembly having a 16×24 arrangement of acoustic transducers 108. In some examples, the transducer array assembly 100 includes more than twenty-four rows or columns containing column multiplexed traces 1200 and / or row multiplexed traces 1202.

[0093] In some examples, column multiplexing traces 1200 and row multiplexing traces 1200 provide the ability to excite any individual acoustic transducer 108 located on the acoustic transducer array assembly 100 by providing specific columns and rows to supply electrical power to them.

[0094] In some examples, it is desirable to use column multiplexed traces 1200 or row multiplexed traces 1202 to reduce the number of PCB traces required to electrically connect the acoustic transducers 108 located at each plated via 104. Furthermore, in some examples, the use of column multiplexed traces 1200 or row multiplexed traces 1202 reduces the cost of assembling the acoustic transducer array assembly 100. Additionally, in some examples, the use of column multiplexed traces 1200 or row multiplexed traces 1202 reduces the time required to assemble the acoustic transducer array assembly 100.

[0095] Figure 22 A flowchart is shown for a method of providing acoustic pressure waves to at least one sample location 1400.

[0096] Method 1400 includes a first step 1402 of providing an acoustic transducer array assembly 100, the acoustic transducer array assembly 100 including at least one piezoelectric element 114 receiving a voltage between at least one signal electrode 110 and at least one ground electrode 111.

[0097] The method includes a second step 1404 of providing voltage to at least one piezoelectric element 114 using at least one signal electrode 110 and at least one ground electrode 111. In some embodiments, at least one signal electrode 110 and at least one ground electrode 111 provide voltage to at least one piezoelectric element 114 at a single location. In some embodiments, at least one signal electrode 110 and at least one ground electrode 111 provide voltage to at least one piezoelectric element 114 at multiple locations.

[0098] The method includes a third step 1406 of converting voltage into sound pressure waves using at least one piezoelectric element 114. The at least one piezoelectric element 114 is configured to receive voltage from a signal electrode 110 and a ground electrode 111, and to expand or contract to generate sound pressure waves.

[0099] The method includes a fourth step 1408 of projecting a sound pressure wave onto at least one sample location, wherein at least one signal reflection of the sound pressure wave is minimized due to acoustic impedance matching between the acoustic impedance of at least one piezoelectric element 114 and the target sample. In some examples, the sound pressure wave generated by the acoustic transducer array assembly 100 is transmitted within the electronic system 1500, as shown in FIG24. In this example, when the switch 1504 is in the receiving position, it is desirable to maximize the reflection of the desired signal amplified by the signal receiving amplifier 1514 and transmitted to the multiplexer 1502. In this example, it is desirable to minimize unintended signal reflections caused by impedance mismatch between adjacent layers or interfaces. In some embodiments, acoustic impedance matching is achieved by providing a matching layer 106 or an acoustic transducer matching layer 304 for each individual acoustic transducer 108.

[0100] Figure 23 A schematic diagram of an electronic system 1500 for operating an acoustic transducer array assembly 100 is shown.

[0101] As described above, the acoustic transducer array assembly 100 provides acoustic pressure waves to the target sample. Furthermore, the acoustic transducer array assembly 100 transmits and receives signals from the multiplexer 1502. In some examples, an input voltage signal covering a frequency range between 1 MHz and 20 MHz is provided to the acoustic transducer array assembly.

[0102] Multiplexer 1502 is configured to receive input signals from acoustic transducer array assembly 100 or to provide output signals to acoustic transducer array assembly 100. Multiplexer 1502 can forward selected signals received from acoustic transducer array or signal receiving amplifier 1514 to output lines within electronic system 1500. In some examples, multiplexer 1502 can combine multiple input signals into a single output signal. In some examples, multiplexer 1502 can be implemented using logic gates.

[0103] The signal output from multiplexer 1502 is received by switch 1504, which determines whether to transmit the signal received from multiplexer 1502 to signal transmission amplifier 1506 or the signal received from signal reception amplifier 1514 to multiplexer 1502. In some examples, switch 1504 includes an RX switch and / or a transmit / receive (TR) switch.

[0104] The signal transmission amplifier 1506 is configured to receive a signal from the multiplexer 1502 when the switch 1504 is in the signal transmission position. The signal transmission amplifier 1506 increases the amplitude of the signal received by the multiplexer 1502 and transmits the signal to the signal capture device 1508.

[0105] The signal acquisition device 1508 captures the electronic signals received by the signal transmission amplifier 1506 and converts the analog signals into digital signals. It is intended that the signal acquisition device 1508 converts real-world signals (such as audio, video, or other sensor data) into digital signals that can be processed by the computing device 1510.

[0106] The computing device 1510 receives a signal from the signal acquisition device and processes the signal before transmitting it to the analog signal generation device 1512. In some examples, the signal includes a chirped signal or a pulse signal. In some examples, the chirped signal or pulse signal includes a square wave voltage signal.

[0107] In some examples, computing device 1510 includes at least one processing device, such as a central processing unit (CPU). In some examples, the computing device also includes system memory and a system bus that connects various system components, including the system memory, to the processing device. The system bus is one type of bus architecture among any number of types of bus architectures, including a memory bus or memory controller, a peripheral bus, and a local bus using any of the various bus architectures.

[0108] System memory includes read-only memory and random access memory. Read-only memory typically stores a basic input / output system, which contains basic routines for transferring information within the computing device, such as during startup. Some implementations include non-transitory media. Furthermore, such computer-readable storage media can include local storage or cloud-based storage.

[0109] In some implementations, a user provides input to the computing device 1510 via one or more input devices. These inputs may include commands that generate signals at the acoustic transducer array assembly 100. The input devices are typically connected to the processing device via input / output interfaces coupled to a system bus. These input devices can be connected via any number of input / output interfaces, such as parallel ports, serial ports, game ports, or universal serial buses. In some possible implementations, wireless communication between the input devices and the interfaces is also possible, and may include infrared, Wireless technology, 802.11a / b / g / n, cellular or other radio frequency communication systems.

[0110] Computer-readable storage media include volatile and non-volatile, removable and non-removable media implemented in any means configured to store information such as computer-readable instructions, data structures, program modules, or other data. Computer-readable storage media include, but are not limited to, random access memory, read-only memory, electrically erasable programmable read-only memory, flash memory or other memory technologies, optical disc read-only memory, digital versatile disks or other optical storage, magnetic tape cassettes, magnetic tape, disk storage or other magnetic storage devices, or any other medium that can be used to store desired information and can be accessed by a computing device. Computer-readable storage media do not include computer-readable communication media.

[0111] The analog signal generating device 1512 receives digital signals generated by the computing device 1510 and converts the digital signals into analog signals. In some examples, the analog signal generating device 1512 generates analog waveforms, such as audio signals or control signals, from digital data.

[0112] The signal receiving amplifier 1514 is configured to receive an analog signal from the analog signal generating device 1512, amplify the signal, and transmit the signal to the multiplexer 1502 when the switch 1504 is in the signal receiving position.

[0113] The above description is illustrative and not restrictive. Many variations of the invention will become apparent to those skilled in the art upon reading this disclosure. Therefore, the scope of the invention should not be determined by reference to the foregoing description, but rather by reference to the pending claims and their full scope or equivalents.

[0114] Without departing from the scope of the invention, one or more features from any embodiment may be combined with one or more features from any other embodiment.

Claims

1. An acoustic transducer array assembly configured to provide a sound pressure wave to at least one sample location, the acoustic transducer array assembly comprising: Printed circuit board, the printed circuit board comprising: At least one plated through-hole; and A matching layer, comprising an acoustic medium configured to provide acoustic impedance matching between the acoustic impedance of at least one piezoelectric element and a target sample; and at least one acoustic transducer comprising: At least one signal electrode, the at least one signal electrode being electrically connected to the at least one plated through-hole and acoustically coupled to the matching layer; At least one ground electrode, the at least one ground electrode being electrically connected to the at least one plated through-hole and acoustically coupled to the mating layer; and The at least one piezoelectric element is electrically connected to the at least one signal electrode and the at least one ground electrode, wherein the at least one piezoelectric element is configured to generate the sound pressure wave when a voltage is applied to the piezoelectric element between the at least one signal electrode and the at least one ground electrode.

2. The acoustic transducer array assembly according to claim 1, wherein, The matching layer comprises a polymer material.

3. The acoustic transducer array assembly according to claim 2, wherein, The polymer material includes at least one of polyimide, polyester, polyphenylene ether, or polypropylene.

4. The acoustic transducer array assembly according to any one of claims 1 to 3, wherein, The printed circuit board includes a plurality of plated through-holes arranged in a linear array.

5. The acoustic transducer array assembly according to claim 4, wherein, The at least one acoustic transducer includes a plurality of signal electrodes, a plurality of ground electrodes, and a plurality of piezoelectric elements arranged in a linear array.

6. The acoustic transducer array assembly according to claim 5, wherein, The linear array includes a row-column configuration having at least one column and at least one row, wherein the at least one column includes the plurality of signal electrodes, the plurality of ground electrodes and the plurality of piezoelectric elements electrically connected in series.

7. The acoustic transducer array assembly according to claim 5, wherein, The linear array includes a row-column configuration having at least one column and at least one row, wherein the at least one row includes the plurality of signal electrodes, the plurality of ground electrodes and the plurality of piezoelectric elements electrically connected in parallel.

8. The acoustic transducer array assembly according to any one of claims 1 to 7, wherein, The printed circuit board includes a positive side and a negative side.

9. The acoustic transducer array assembly according to any one of claims 1 to 8, wherein, Acoustic connectors are arranged in series within the acoustic transducer.

10. The acoustic transducer array assembly according to any one of claims 1 to 9, wherein, Acoustic connectors are arranged in parallel within the acoustic transducer.

11. The acoustic transducer array assembly according to any one of claims 1 to 10, wherein, The at least one piezoelectric element includes at least one piezoelectric disk.

12. The acoustic transducer array assembly according to any one of claims 1 to 11, wherein, The at least one piezoelectric element includes at least one piezoelectric plate.

13. A method for providing sound pressure waves to at least one location, the method comprising: An acoustic transducer array assembly is provided, wherein the acoustic transducer array assembly includes: At least one printed circuit board, the printed circuit board including at least one plated through-hole and at least one matching layer, the at least one matching layer including an acoustic medium configured to provide acoustic impedance matching between at least one piezoelectric element and at least one target sample; and At least one acoustic transducer, the at least one acoustic transducer comprising at least one signal electrode electrically connected to the at least one plated through-hole and acoustically connected to the at least one matching layer, at least one ground electrode electrically connected to the at least one plated through-hole and acoustically connected to the at least one matching layer, and at least one piezoelectric element electrically connected to the at least one signal electrode and the at least one ground electrode; A voltage is applied between the at least one signal electrode and the at least one ground electrode to the at least one piezoelectric element; Convert the voltage into the sound pressure wave; and The sound pressure wave is projected onto the at least one location, wherein at least one signal reflection of the sound pressure wave is minimized due to the acoustic impedance matching.

14. The method according to claim 13, wherein, The at least one matching layer comprises a polymer material.

15. The method according to claim 14, wherein, The polymer material includes at least one of polyimide, polyester, polyphenylene ether, or polypropylene.

16. The method according to any one of claims 13 to 15, wherein, The printed circuit board includes a plurality of plated vias arranged in a linear array and a plurality of acoustic transducers configured to engage with the plurality of plated vias.

17. The method according to any one of claims 13 to 16, further comprising using a plurality of acoustic transducers to continuously project the sound pressure wave onto the at least one location.

18. A method for manufacturing an acoustic transducer array assembly, the method comprising: The acoustic transducer array assembly is provided, wherein the acoustic transducer array assembly includes a printed circuit board, the printed circuit board including at least one plated through-hole and at least one matching layer, the at least one matching layer being configured to provide acoustic impedance matching between at least one piezoelectric element and at least one target sample; At least one signal electrode is electrically connected to the acoustic transducer array assembly, and the at least one signal electrode is acoustically connected to the at least one matching layer; At least one ground electrode is electrically connected to the acoustic transducer array assembly, and the at least one ground electrode is acoustically connected to the at least one matching layer; and The at least one piezoelectric element is electrically connected to the at least one signal electrode and the at least one ground electrode.

19. The method of claim 18, further comprising encapsulating the acoustic transducer array assembly within an enclosure.

20. The method according to any one of claims 18 to 19, further comprising acoustically connecting at least one piezoelectric substrate material to the back side of the at least one piezoelectric element.

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