Light emitting device

Abstract

This light-emitting device is provided with: a substrate; a plurality of first light-emitting elements mounted on the upper surface of the substrate so as to form a plurality of first light-emitting element groups extending in a first direction; a first resin disposed so as to cover at least a part of a side surface of each of the plurality of first light-emitting elements; and a plurality of second light-emitting elements attached so as to be adjacent to the plurality of first light-emitting element groups. The angle (theta) formed by the normal direction of any one of the four side surfaces of each of the plurality of first light-emitting elements and the first direction is 15-75 degrees (inclusive).

Description

Technical Field

[0001] This disclosure relates to a light-emitting device. Background Art

[0002] The following light-emitting device is known: multiple LED chips are arranged in a vertical stripe or mosaic pattern to form multiple light-emitting element groups, and the multiple light-emitting element groups are respectively covered with multiple types of phosphor layers with different color temperatures of emitted light (for example, see Japanese Patent Application Publication No. 2014-45089 (hereinafter referred to as Patent Document 1)). The light-emitting device described in Patent Document 1 can improve the color mixing of multiple different lights emitted from multiple light-emitting element groups. Summary of the Invention

[0003] However, in the light-emitting device described in Patent Document 1, multiple types of phosphor layers are required to cover multiple light-emitting element groups in a vertical stripe or mosaic pattern, which increases the spacing between the multiple light-emitting element groups and makes it difficult to miniaturize.

[0004] Therefore, the purpose of this disclosure is to provide a light-emitting device that can narrow the spacing between multiple light-emitting element groups.

[0005] The light-emitting device disclosed herein includes: a substrate; a plurality of first light-emitting elements, which are mounted on the upper surface of the substrate in such a way as to form a plurality of first light-emitting element groups extending along a first direction; a first resin configured to cover at least a portion of each side of the plurality of first light-emitting elements; and a plurality of second light-emitting elements, which are mounted adjacent to the plurality of first light-emitting element groups; wherein the angle θ between the normal direction of any one of the four sides of each of the plurality of first light-emitting elements and the first direction is 15 degrees or more and 75 degrees or less.

[0006] Furthermore, in the light-emitting device disclosed herein, the angle θ is preferably 30 degrees or more and 60 degrees or less.

[0007] Furthermore, in the light-emitting device disclosed herein, the first resin preferably contains a first phosphor and is configured to also cover the upper surface of each of the plurality of first light-emitting elements.

[0008] Furthermore, the light-emitting device disclosed herein preferably also includes a barrier material and a second resin, the barrier material being disposed around a plurality of first light-emitting elements and a plurality of second light-emitting elements, and the second resin being disposed on the inner side of the barrier material in such a manner as to cover the plurality of first light-emitting elements, the plurality of second light-emitting elements and the first resin.

[0009] Furthermore, in the light-emitting device disclosed herein, it is preferable that the second resin contains a second phosphor that is different from the first phosphor.

[0010] Furthermore, in the light-emitting device disclosed herein, the second resin preferably contains a diffusion material.

[0011] Furthermore, the light-emitting device of this disclosure preferably also includes a third resin containing a third phosphor, configured to cover the upper surface and side surface of each of the plurality of second light-emitting elements, the plurality of second light-emitting elements being configured to form a plurality of second light-emitting element groups extending along a first direction, and the angle between the normal direction of any one of the four side surfaces of each of the plurality of second light-emitting elements and the first direction being 15 degrees or more and 75 degrees or less.

[0012] Furthermore, the light-emitting device of this disclosure preferably also includes a reflective resin disposed between the end of each of the plurality of first light-emitting element groups and the plurality of second light-emitting element groups in a first direction and a barrier material.

[0013] Furthermore, in the light-emitting device disclosed herein, the first resin is preferably disposed between the end of each of the plurality of first light-emitting element groups in the first direction and the barrier material.

[0014] Furthermore, in the light-emitting device disclosed herein, it is preferable that the angle between the normal direction of any one of the four sides of each of the plurality of second light-emitting elements and the first direction is angle θ or less.

[0015] Furthermore, in the light-emitting device disclosed herein, it is preferable that the plurality of first light-emitting elements have a square planar shape.

[0016] Furthermore, the light-emitting device disclosed herein preferably also includes bonding lines and a transparent resin film, the bonding lines connecting a plurality of first light-emitting elements to each other, and the transparent resin film being formed on at least a portion between the bonding lines and the upper surface of the substrate.

[0017] Furthermore, in the light-emitting device disclosed herein, it is preferable that the minimum value of the angle between the extension direction of the bonding line and the first direction when viewed from above is less than the angle θ.

[0018] The light-emitting device disclosed herein can provide a light-emitting device that can narrow the spacing between multiple light-emitting element groups. Attached Figure Description

[0019] Figure 1 (a) is a plan view of the light-emitting device according to the first embodiment. Figure 1 (b) is Figure 1 (a) shows the A-A' cross-sectional view of the light-emitting device. Figure 2 for Figure 1 An enlarged view of region B shown in (a). Figure 3 To indicate Figure 1 The flowchart of the manufacturing process of the light-emitting device shown in (a) is as follows. Figure 4 For illustrative purposes Figure 3 The diagram shows the first resin preparation process. Figure 5 (a) is a graph showing the relationship between the amount of liquid added (D) and the maximum width (W) when the angle θ is 0°. Figure 5 (b) is a graph showing the relationship between the amount of liquid added (D) and the maximum width (W) when the angle θ is 15°. Figure 5 (c) is a graph showing the relationship between the amount of liquid added (D) and the maximum width (W) when the angle θ is 30°. Figure 5 (d) is a graph showing the relationship between the amount of liquid added (D) and the maximum width (W) when the angle θ is 45°. Figure 6 (a) is a graph showing the maximum width W when the amount of liquid added, D, is D1. Figure 6 (b) is a graph showing the maximum width W when the amount of liquid added, D, is D2. Figure 6 (c) is a graph representing the maximum width W when the amount of liquid added is D3. Figure 7 (a) is a plan view of the light-emitting device of the first modified example of the first embodiment. Figure 7 (b) is Figure 7 (a) shows the A-A' cross-sectional view of the light-emitting device. Figure 8 (a) is a plan view of the light-emitting device of the second modification of the first embodiment. Figure 8 (b) is Figure 8 (a) shows the A-A' cross-sectional view of the light-emitting device. Figure 9 (a) is a plan view of the light-emitting device according to the second embodiment. Figure 9 (b) is Figure 9 (a) shows the A-A' cross-sectional view of the light-emitting device. Figure 10 (a) is a plan view of the light-emitting device according to the third embodiment. Figure 10 (b) is Figure 10 (a) is a cross-sectional view of the light-emitting device along line A-A'. Figure 11 (a) is a plan view of the light-emitting device according to the fourth embodiment. Figure 11 (b) is Figure 11 (a) is a cross-sectional view of the light-emitting device along line A-A'. Figure 12 This diagram illustrates a transparent resin film formed between the bonding line and the upper surface of the substrate. Figure 13 (a) is a plan view of the light-emitting device according to the fifth embodiment. Figure 13 (b) is Figure 13(a) is a cross-sectional view of the light-emitting device along line A-A'. Figure 14 (a) is a plan view of the light-emitting device according to the sixth embodiment. Figure 14 (b) is Figure 14 (a) is a cross-sectional view of the light-emitting device along line A-A'. Figure 15 To indicate Figure 14 The flowchart of the manufacturing process of the light-emitting device shown in (a) is as follows. Figure 16 (a) is a plan view of the light-emitting device of the first modification of the sixth embodiment. Figure 16 (b) is Figure 16 (a) is a cross-sectional view of the light-emitting device along line A-A'. Figure 16 (c) is Figure 16 (a) is a cross-sectional view of the light-emitting device along line B-B'. Detailed Implementation

[0020] Various embodiments of this disclosure will now be described with reference to the accompanying drawings. However, please note that the scope of this disclosure is not limited to these embodiments, but covers the invention as described in the claims and its equivalents.

[0021] (Light-emitting device according to the first embodiment) Figure 1 (a) is a plan view of the light-emitting device 1 according to the first embodiment. Figure 1 (b) is Figure 1 (a) is a cross-sectional view of the light-emitting device 1 along line A-A'.

[0022] The light-emitting device 1 has a substrate 10, a plurality of light-emitting elements 11A and 11B mounted on the substrate 10, a first resin 12, a second resin 13, a barrier material 14, and a bonding wire 15. The plurality of light-emitting elements 11A are also referred to as the first light-emitting element, and the plurality of light-emitting elements 11B are also referred to as the second light-emitting element. Figure 1 In the middle, the second resin 13 is represented by a dashed line.

[0023] The substrate 10 is a flat substrate formed from an insulating resin such as glass epoxy resin or ceramic. The substrate 10 has a square planar shape, and a first electrode pair 16A and 16B and a second electrode pair 17A and 17B are disposed on its upper surface. The substrate 10 may also be formed from a mounting substrate and an insulating circuit board. The mounting substrate is formed from a component with high thermal conductivity, such as aluminum, and the insulating circuit board forms a wiring pattern including the first electrode pair 16A and 16B and the second electrode pair 17A and 17B.

[0024] The first electrode pair 16A and 16B and the second electrode pair 17A and 17B are formed on the upper surface of the substrate 10 by conductive components such as gold-plated parts, and supply power from an external power source (not shown) to the anode and cathode terminals of the plurality of light-emitting elements 11A and 11B respectively. A mounting region 10a is formed in the center of the substrate 10. The mounting region 10a has a generally rectangular planar shape and is used to mount the plurality of light-emitting elements 11A and 11B. The planar shape of the mounting region 10a is not limited to a rectangle, and may also be other shapes such as ellipse or polygon.

[0025] Light-emitting elements 11A and 11B are LED (Light Emitting Diode) chips that emit blue light. A total of 16 light-emitting elements 11A and 11B are arranged within the mounting area 10a. The upper surface of each light-emitting element 11A and 11B, when viewed from above, has a square shape with one side length of 650 μm. The light-emitting elements 11A and 11B are mounted on the mounting area 10a of the substrate 10. The emission color and number of light-emitting elements 11A and 11B are not limited to those described above; other emission colors and arbitrary numbers can be used. Furthermore, the shape of the upper surface of the light-emitting elements 11A and 11B when viewed from above can also be a rectangular shape other than a square.

[0026] Except for a portion of the first electrode pairs 16A and 16B and a portion of the second electrode pairs 17A and 17B, and a mounting area 10a, the upper surface of the substrate 10 is coated with solder resist 18 to prevent short circuits, etc.

[0027] The first resin 12 contains a phosphor, also known as the first phosphor, in a transparent resin such as polysiloxane. The first phosphor may contain a garnet-based phosphor activated with cerium (e.g., YAG(Y3(Al,Ga)5O)). 12 :Ce 3+ (and LuAG), europium-activated nitride-based phosphors (e.g., CASN and SCACN ((Sr,Ca)AlSiN3:Eu) 2+ The first phosphor is either a fluoride-based phosphor activated with manganese (e.g., KSF). The first phosphor primarily absorbs blue light emitted by the light-emitting element 11A and emits red, green, and yellow light. The first resin 12 is formed by curing under heat. The first resin 12 is configured to cover the upper surface and sides of the plurality of light-emitting elements 11A.

[0028] The second resin 13, also known as a sealing material, is a transparent resin such as polysiloxane that fills the space in the mounting area 10a inside the barrier material 14, sealing the multiple light-emitting elements 11A and 11B and the first resin 12. The second resin 13 contains a phosphor, also called a second phosphor, which is different from the first phosphor, and a diffusion material. The second phosphor, for example, is YAG, which absorbs blue light emitted from the light-emitting elements 11A and 11B and emits red, green, yellow, or other colors of light. The color of the light emitted from the second phosphor is different from the color of the light emitted from the first phosphor. The second phosphor contained in the second resin 13 can be dispersed or settled within the second resin 13. The diffusion material diffuses the light emitted from the light-emitting elements 11A and 11B, the first phosphor, and the second phosphor. Furthermore, the second resin 13 may contain the second phosphor without the diffusion material, may contain the diffusion material without the second phosphor, or may contain neither the second phosphor nor the diffusion material.

[0029] The light-emitting device 1 has two rows of first light-emitting element groups 21, each first light-emitting element group 21 being formed by four light-emitting elements 11A arranged in a row, covered by a first resin 12 and extending adjacently in a straight line. Furthermore, the light-emitting device 1 has two rows of second light-emitting element groups 22, each second light-emitting element group being formed by four light-emitting elements 11B arranged in a row, not covered by the first resin 12, and extending adjacent to the first light-emitting element groups 21. One row of the two second light-emitting element groups 22 is formed by light-emitting elements 11B mounted between the two rows of first light-emitting element groups 21, and the other row of the two second light-emitting element groups 22 is formed by light-emitting elements 11B mounted between one row of the two rows of first light-emitting element groups 21 and the barrier material 14. In the first light-emitting element group 21, the four light-emitting elements 11A are connected in series between the first electrode pairs 16A and 16B by bonding wires 15. In the second light-emitting element group 22, four light-emitting elements 11B are connected in series between the second electrode pair 17A and 17B by a bonding wire 15.

[0030] The barrier material 14 is a frame material formed of opaque polysiloxane resin mixed with white particles as a reflective material, which prevents the second resin 13 filled in the mounting area 10a from flowing out. In addition, the barrier material 14 reflects the light emitted from the light-emitting element 11A, the light-emitting element 11B, the first phosphor, and the second phosphor.

[0031] Figure 2 for Figure 1 An enlarged view of region B shown in (a). Figure 2 The image shows two adjacent light-emitting elements 11A and a portion of a first resin 12 configured to cover the two light-emitting elements 11A. Figure 2In this context, one of the light-emitting elements 11A is referred to as the first adjacent light-emitting element 11A-1, and the other of the light-emitting elements 11A is referred to as the second adjacent light-emitting element 11A-2. Figure 2 The bonding line 15 and the first resin 12 disposed on the upper surface of the light-emitting element 11A are omitted. Figure 2 In the above, the direction connecting the center point O1 of the upper surface of the first adjacent light-emitting element 11A-1 and the center point O2 of the upper surface of the second adjacent light-emitting element 11A-2 is called the first direction, and the direction orthogonal to the first direction is called the second direction.

[0032] like Figure 2 As shown, the first adjacent light-emitting element 11A-1 has a first side 31s, a second side 32s adjacent to the right side of the first side 31s, a third side 33s adjacent to the right side of the second side 32s, and a fourth side 34s adjacent to the right side of the third side 33s and adjacent to the left side of the first side 31s. The first adjacent light-emitting element 11A-1 also has a first side 31v, a second side 32v, a third side 33v, and a fourth side 34v. The first side 31v is disposed between the first side 31s and the second side 32s, and the second side 32v is disposed between the second side 32s and the third side 33s. The third side 33v is disposed between the third side 33s and the fourth side 34s, and the fourth side 34v is disposed between the fourth side 34s and the first side 31s. The second adjacent light-emitting element 11A-2 has a fifth side 35s, a sixth side 36s adjacent to the right side of the fifth side 35s, a seventh side 37s adjacent to the right side of the sixth side 36s, and an eighth side 38s adjacent to the right side of the seventh side 37s and adjacent to the left side of the fifth side 35s. The second adjacent light-emitting element 11A-2 also has a fifth side 35v, a sixth side 36v, a seventh side 37v, and an eighth side 38v. The fifth side 35v is disposed between the fifth side 35s and the sixth side 36s, the sixth side 36v is disposed between the sixth side 36s and the seventh side 37s, the seventh side 37v is disposed between the seventh side 37s and the eighth side 38s, and the eighth side 38v is disposed between the eighth side 38s and the fifth side 35s.

[0033] The first adjacent light-emitting element 11A-1 and the second adjacent light-emitting element 11A-2 are configured such that, when viewed from above, the angle between the normal direction V1 of the first side surface 31s and the first direction is set to angle θ, the angle between the normal direction V2 of the fifth side surface 35s and the first direction is also the same as angle θ. In this embodiment, angle θ is 45°, and the interval between points O1 and O2 is, for example, 1060 μm. 1060 μm is the spacing distance that allows for stable mounting when light-emitting elements with a side width of 650 μm are configured with angle θ changed to 45° during the light-emitting element mounting process.

[0034] A space 30 is provided between the first adjacent light-emitting element 11A-1 and the second adjacent light-emitting element 11A-2. The space 30 takes the first side surface 31s, the second side surface 32s, the seventh side surface 37s, the eighth side surface 38s, an imaginary rectangular surface with the third side surface 32v and the sixth side surface 36v as two opposing sides, and an imaginary rectangular surface with the fourth side surface 34v and the eighth side surface 38v as two opposing sides as two opposing sides, and takes the upper surface of the substrate 10 as the bottom surface.

[0035] The first resin 12 before curing is dripped onto the bottom surface of the space 30. The first resin 12 dripped onto the bottom surface of the space 30 fills the space 30 by wetting and diffusing between the bottom surface, the first side surface 31s, the second side surface 32s, the seventh side surface 37s, and the eighth side surface 38s. The first resin 12 filling the space 30 gradually wets and diffuses in the second direction due to capillary action between the first side surface 31s and the eighth side surface 38s, and between the second side surface 32s and the seventh side surface 37s. When the amount of the first resin 12 dripped into the space 30 exceeds a certain amount, convex shapes 30a and 30b, which are held in place by surface tension, are formed on the outer side of the space 30 when viewed from above. When the first resin 12 is cured by heating or the like, a first resin region 30c with convex shapes 30a and 30b is formed.

[0036] The first resin region 30c protrudes along the second direction with a maximum width W at the position between the first adjacent light-emitting element 11A-1 and the second adjacent light-emitting element 11A-2. The value of the maximum width W varies depending on the angle θ and the amount of resin added D. The amount of resin added D is the amount of the first resin 12 before curing that is added to the bottom surface of the space 30.

[0037] The light-emitting element 11B of the second light-emitting element group 22, which is adjacent to the first light-emitting element group 21 in the second direction, is arranged in a manner isolated from the first resin region 30c. By arranging the light-emitting element 11B in a manner isolated from the first resin region 30c, the first resin 12 is less likely to come into contact with the light-emitting element 11B, thereby maintaining the shape of the first resin 12 forming the first resin region 30c during manufacturing. Furthermore, the light-emitting element 11B of the second light-emitting element group 22, which is adjacent to the first light-emitting element group 21 in the second direction, is preferably arranged in a manner isolated from the position of the first resin region 30c protruding with its maximum width W in the second direction.

[0038] By narrowing the maximum width W of the first resin region 30c, the distance between the light-emitting element 11A forming the first light-emitting element group 21 and the light-emitting element 11B forming the second light-emitting element group 22 can be narrowed. By narrowing the maximum width W, the interval between the first light-emitting element group 21 and the second light-emitting element group 22 can be narrowed.

[0039] Figure 3 A flowchart illustrating the manufacturing process of the light-emitting device 1.

[0040] First, in the substrate preparation process, a substrate 10 with first electrode pairs 16A and 16B and second electrode pairs 17A and 17B is prepared (S1). Next, in the light-emitting element mounting process, multiple light-emitting elements 11A and 11B are mounted onto the mounting area 10a of the substrate 10 (S2). Next, in the wire bonding process, the first electrode pairs 16A and 16B are connected via multiple light-emitting elements 11A and bonding wires 15, and the second electrode pairs 17A and 17B are connected via multiple light-emitting elements 11B and bonding wires 15 (S3).

[0041] Next, in the barrier material preparation process, barrier material 14 is prepared around the first light-emitting element group 21 and the second light-emitting element group 22 (S4).

[0042] Next, in the first resin preparation step, the first resin 12 before curing is dripped onto the nozzle of the dripping device (not shown) in an appropriate amount to cover multiple light-emitting elements 11A. Then, the first resin 12 is cured by a prescribed heat treatment (S5). The first resin 12 comprises polysiloxane resin, a scattering material, a YAG phosphor and an SCASN phosphor, and a thickener. The viscosity coefficient of the first resin 12 before curing is 98 Pa·s.

[0043] Figure 4 This is a diagram used to illustrate the first resin preparation process. Figure 4 The positions marked with the symbol "+" shown, 12a to 12d, indicate that... Figure 3 In the first resin preparation step shown in S5, in Figure 1 The positions and sequence in which the first resin 12 is dripped from the nozzle of the dripping device (not shown) within the area shown in (a). Specifically, the nozzle moves in the area shown in B in the order of positions 12a, 12b, 12c and 12d, and drips a predetermined amount of the first resin 12 before curing at each position 12a, 12b, 12c and 12d.

[0044] Finally, in the second resin preparation step, the second resin 13 before curing is prepared inside the barrier material 14 to seal the first light-emitting element group 21, the second light-emitting element group 22, and the first resin 12. Then, the second resin 13 is cured by a predetermined heat treatment (S6), completing the light-emitting device 1. When the second phosphor contained in the second resin 13 settles within the second resin 13, a settling time is provided before the heat treatment. Furthermore, when the second phosphor contained in the second resin 13 is dispersed within the second resin 13, the second resin 13 before curing is stirred to uniformly distribute the second phosphor within the second resin 13 before curing, and curing is performed by heat treatment without setting a settling time.

[0045] By reference Figure 3 The manufacturing process described above enables the production of a light-emitting device 1 capable of emitting warm white light with a color temperature of 2200K and cool white light with a color temperature of 5000K. The warm white light is the first light emitted from the light-emitting element 11A included in the first light-emitting element group 21, passing through both the first resin 12 and the second resin 13. The cool white light is the second light emitted from the light-emitting element 11B included in the second light-emitting element group 22, passing through the second resin 13. Furthermore, the color temperatures of the first and second lights are determined by adjusting the type and amount of the first and second phosphors. For example, the color temperature of the first light can also be a warm white light such as 2700K, and the color temperature of the second light can also be a cool white light such as 6500K.

[0046] Figure 5 To indicate the angle θ of the light-emitting element 11A, which is the same as the light-emitting device 1, and the droplet added to Figure 4 The graph shows the change in the maximum width W when the amount of liquid added, D, changes at positions 12b and 12c. Figure 6 This is a graph showing the relationship between the angle θ and the maximum width W when the amount of liquid added changes. Figure 5 (a) shows the relationship between the amount of liquid added (D) and the maximum width (W) when the angle θ is 0°. Figure 5 (b) shows the relationship between the amount of liquid added (D) and the maximum width (W) when the angle θ is 15°. Figure 5 (c) shows the relationship between the amount of liquid added (D) and the maximum width (W) when the angle θ is 30°. Figure 5 (d) shows the relationship between the amount of liquid added (D) and the maximum width (W) when the angle θ is 45°. Figure 6 (a) shows the maximum width W when the added amount D is 0.37 mg (hereinafter referred to as D1). Figure 6 (b) shows the maximum width W when the drip volume D is 0.43 mg (hereinafter referred to as D2). Figure 6 (c) shows the maximum width W when the amount of liquid added, D, is 0.61 mg (hereinafter referred to as D3). Figure 5 The regions shown in (a) to (d) correspond to Figure 1 The region shown in (a) is region B. Figure 6 In (a) to (c), the vertical axis represents the maximum width W (in [μm]), and the horizontal axis represents the angle θ (in [°]).

[0047] Figure 5 In (a), the angles formed by the normal direction V1 of the first side surface 31s and the first direction, and the angle θ formed by the normal direction V2 of the fifth side surface 35s and the first direction, when viewed from above, are both 0°. The shape of the first resin region 30c when the amount of first resin 12 added to positions 12b and 12c before curing is D1 is denoted by 12-1, and the maximum width of the first resin region 30c is denoted by W-11. The shape of the first resin region 30c when the amount of first resin 12 added to positions 12b and 12c before curing is D2 is denoted by 12-2, and the maximum width of the first resin region 30c is denoted by W-12. The shape of the first resin region 30c when the amount of the first resin 12 before curing is D3 at positions 12b and 12c is denoted by 12-3, and the maximum width of the first resin region 30c is denoted by W-13.

[0048] Figure 5 In (b) to (d), the maximum width of the first resin region 30c when the drop volume is D1 is represented by W-21, W-31, and W-41, and the maximum width of the first resin region 30c when the drop volume is D2 is represented by W-22, W-32, and W-42. Furthermore, the maximum width of the first resin region 30c when the drop volume is D3 is represented by W-23, W-33, and W-43.

[0049] If the value of angle θ is set to θ1, then when θ1 is below 0°, the maximum width W becomes the same as when the value of angle θ is |θ1|.

[0050] Regarding the value θ1 of angle θ, when θ1 is between 90° and 180°, the maximum width W becomes the same as when the value of angle θ is (180° - θ1). Furthermore, when θ1 is between 180° and 270°, the maximum width W becomes the same as when the value of angle θ is (θ1 - 180°). Moreover, when θ1 is between 270° and 360°, the maximum width W becomes the same as when the value of angle θ is (360° - θ1).

[0051] Furthermore, in this embodiment, the first adjacent light-emitting element 113A-1 and the second adjacent light-emitting element 113A-2 have a square shape when viewed from above. Therefore, when the value of angle θ1 is 45° or more and 90° or less, the maximum width W becomes the same as when the value of angle θ is (90° - θ1).

[0052] like Figure 6 As shown in (a) to (c), the maximum width W is very large when the angle θ is less than 15°. When the angle θ is less than 15°, the volume of space 30 is small, so the convex shapes 30a and 30b protrude, thus increasing the maximum width W. Furthermore, when the angle θ is 15° or more but less than 30°, the maximum width W decreases, and further, when the angle θ is 30° or more but less than 45°, the maximum width W decreases even further.

[0053] Figure 6 In (a) to (c), when the value of angle θ exceeds 45° and is 60°, 75° and 90°, the maximum width W becomes the same as the maximum width W when the angle θ is 30°, 15° and 0°.

[0054] To narrow the maximum width W of the first resin region 30c and thus the interval between the first light-emitting element group 11 and the adjacent second light-emitting element group 22, the angle θ is preferably 15° or more and 75° or less, more preferably 30° or more and 60° or less.

[0055] When the light-emitting element 11A is square, the maximum width W is minimized when the angle θ is 45°, so the angle θ is more preferably around 45°. Here, "around" means a range of ±10°, and more preferably a range of ±5° (the same applies below, "around" related to the angle means a range of ±10°, and more preferably a range of ±5°).

[0056] The shape of the light-emitting element 11A when viewed from above can also be rectangular. When the shape of the light-emitting element 11A when viewed from above is a rectangle with a short side of length a and a long side of length b (≥ a), the volume of space 30 reaches its maximum and the maximum width W reaches its minimum when the angle θ between the normal direction of any side of the four light-emitting elements 11A with the short side as one side and the first direction is arctan(b / a). Therefore, the angle θ is preferably near arctan(b / a).

[0057] Furthermore, the ratio (b / a) of the length b of the longer side to the length a of the shorter side is preferably 1.0 to 1.4, more preferably 1.0 to 1.1. When the ratio (b / a) is 1.4, the maximum width W is minimized in the range of approximately 54.5° (45°) angle θ. When the ratio (b / a) is 1.1, the maximum width W is minimized in the range of approximately 47.7° (45°), more preferably, angle θ. When the ratio (b / a) is 1.0, the maximum width W is minimized at an angle θ of 45°.

[0058] (Light-emitting device of the first modification of the first embodiment) Figure 7 (a) is a plan view of the light-emitting device 1a of the first modification of the first embodiment. Figure 7 (b) is Figure 7 (a) is a cross-sectional view of the light-emitting device along line A-A'. In light-emitting device 1a, the same symbols are used for the same components as in light-emitting device 1, and the descriptions are omitted.

[0059] Figure 7 The only difference between the light-emitting device 1a and the light-emitting device 1 is that the orientation of the four light-emitting elements 11B in the second light-emitting element group 22a is different. In the second light-emitting element group 22a, the four light-emitting elements 11B are mounted on the substrate 10 in a row along the first direction, and the angle between the normal direction of any one of the four sides of each of the four light-emitting elements 11B and the first direction is 0°.

[0060] Although Figure 7 The angle between the normal direction of any one of the four sides of each of the four light-emitting elements 11B and the first direction is 0°, but it is acceptable as long as the angle between the normal direction of any one of the four sides of each of the four light-emitting elements 11A and the first direction is less than θ. By setting the angle between the normal direction of any one of the four sides of each of the four light-emitting elements 11B and the first direction to an angle smaller than angle θ, the interval between the first light-emitting element group 21 and the second light-emitting element group 22a can be further narrowed. Furthermore, it is more preferable that the angle between the normal direction of any one of the four sides of each of the four light-emitting elements 11B and the first direction is close to 0°.

[0061] The shape of the light-emitting element 11B when viewed from above can also be rectangular. When the shape of the light-emitting element 11B when viewed from above is a rectangle with a short side and a long side, the angle between the normal direction of any one of the sides with the short side as one side of each of the four light-emitting elements 11B and the first direction is more preferably around 0°.

[0062] (Light-emitting device of the second variation of the first embodiment) Figure 8 (a) is a plan view of the light-emitting device 1b of the second modification of the first embodiment. Figure 8 (b) is Figure 8 (a) shows a cross-sectional view of the light-emitting device along line A-A'. In light-emitting device 1b, the same symbols are used for the same components as in light-emitting device 1, and the descriptions are omitted.

[0063] The only difference between the light-emitting device 1b and the light-emitting device 1 is that it has a third resin 23 covering the second light-emitting element group 22 and containing the third phosphor. The second resin 13 seals the first resin 12 and the third resin 23.

[0064] The third resin 23 contains a phosphor, also known as a third phosphor, in a transparent resin such as polysiloxane. It primarily absorbs the blue light emitted by the light-emitting element 11B and emits red, green, and yellow light. The color of the light emitted from the third phosphor differs from the color of the light emitted from the first and second phosphors. The third phosphor includes garnet-based phosphors activated with cerium, including YAG and LuAG; nitride-based phosphors activated with europium, including CASN and SCACN; or fluoride-based phosphors activated with manganese, including KSF. The third resin 23 is cured by heating. By arbitrarily selecting the first, second, and third phosphors, the degree of freedom in selecting the light emitted from the light-emitting device 1b is increased. Furthermore, by setting the angle between the normal direction of any one of the four sides of each of the light-emitting elements 11B and the first direction to 15° or more and 75° or less, the maximum width of the third resin 23 can be controlled, allowing the second light-emitting element group 22 to be arranged close to the first light-emitting element group 21. Furthermore, by setting the angle between the normal direction of any one of the four sides of each of the light-emitting elements 11B and the first direction to 30° or more and 60° or less, the maximum width of the third resin 23 can be controlled, allowing the second light-emitting element group 22 to be arranged closer to the first light-emitting element group 21. Moreover, when the shape of the light-emitting element 11B in top view is square, the angle between the normal direction of any one of the four sides of each of the light-emitting elements 11B and the first direction is more preferably around 45°.

[0065] When the shape of the light-emitting element 11B as viewed from above is a rectangle with a short side of length a and a long side of length b (≥ a), the angle between the normal direction of any one of the short side surfaces of the light-emitting element 11B and the first direction is preferably near arctan(b / a).

[0066] Furthermore, the ratio (b / a) of the length b of the longer side to the length a of the shorter side is preferably 1.0 to 1.4, more preferably 1.0 to 1.1. When the ratio (b / a) is 1.4, the maximum width W is minimized in the range of approximately 54.5° (45°) angle θ. When the ratio (b / a) is 1.1, the maximum width W is minimized in the range of approximately 47.7° (45°), more preferably, angle θ. When the ratio (b / a) is 1.0, the maximum width W is minimized at an angle θ of 45°.

[0067] (Light-emitting device according to the second embodiment) Figure 9 (a) is a plan view of the light-emitting device 2 according to the second embodiment. Figure 9 (b) is Figure 9 (a) shows a cross-sectional view of the light-emitting device along line A-A'. In light-emitting device 2, the same symbols are used for the same components as in light-emitting device 1, and the descriptions are omitted.

[0068] In the light-emitting device 2, the configuration of the first resin 12 differs from that in the light-emitting device 1. In the light-emitting device 1, the first resin 12 is configured to cover the side and top surface of the light-emitting element 11A facing the side of the adjacent light-emitting element A, but not to cover the side of the light-emitting element 11A facing the barrier material 14. In the light-emitting device 2, the first resin 12 is configured to cover all sides and top surface of the light-emitting element 11A, including the side facing the barrier material 14.

[0069] The difference between the manufacturing method of light-emitting device 2 and the manufacturing method of light-emitting device 1 lies in that... Figure 3 In the first resin preparation step shown in S5, the first resin 12 before curing is dripped between the barrier material 14 and the end of the first light-emitting element group 21. In the manufacturing method of the light-emitting device 2, the substrate preparation step, the light-emitting element mounting step, the wire bonding step, the barrier material preparation step, and the second resin preparation step are the same as those in the manufacturing method of the light-emitting device 1, so the description is omitted.

[0070] The light-emitting device 1 has the following drawback: When the first resin 12 disposed on the upper surface of the light-emitting element 11A adjacent to the barrier material 14 is cured in a state where it protrudes from the upper surface toward the barrier material 14, a protrusion is formed protruding from the upper surface of the light-emitting element 11A toward the barrier material 14. When the second phosphor is deposited, if the first resin 12 forms a protrusion protruding from the upper surface of the light-emitting element 11A toward the barrier material 14, the second phosphor contained in the second resin 13 will settle on the upper surface of the protrusion and not between the upper surface of the substrate 10 and the lower surface of the protrusion. Since the second phosphor does not settle between the upper surface of the substrate 10 and the lower surface of the protrusion, the amount of light emitted from the side of the light-emitting element 11A with the protrusion towards the barrier material 14 and absorbed by the second phosphor is different from the amount of light emitted from the side of the light-emitting element 11A without the protrusion towards the barrier material 14 and absorbed by the second phosphor. Because the amount of light emitted from the side of the light-emitting element 11A with protrusions toward the barrier material 14 is absorbed by the second phosphor differently than the amount of light emitted from the side of the light-emitting element 11A without protrusions, the light-emitting device 1 is at risk of color unevenness occurring near the barrier material 14. In the light-emitting device 2, the first resin 12 is configured to cover all sides of the light-emitting element 11A, including the side facing the barrier material 14, so no protrusions are formed from the upper surface of the light-emitting element 11A toward the barrier material 14, thus reducing the risk of color unevenness occurring near the barrier material 14.

[0071] In the light-emitting device 2, a first resin 12 is disposed between the barrier material 14 and the first light-emitting element group 21 of the light-emitting device 1. Similarly, in light-emitting devices 1a and 1b, the first resin 12 may be disposed between the first light-emitting element group formed by the light-emitting element 11A and the barrier material, as in the light-emitting device 2. Furthermore, in the light-emitting device 1b, a third resin 23 may be disposed between the second light-emitting element group 22 formed by the light-emitting element 11B and the barrier material 14.

[0072] (Light-emitting device according to the third embodiment) Figure 10 (a) is a plan view of the light-emitting device 3 according to the third embodiment. Figure 10 (b) is Figure 10 (a) is a cross-sectional view of the light-emitting device along line A-A'. In light-emitting device 3, the same symbols are used for the same components as in light-emitting device 1, and the descriptions are omitted.

[0073] In the light-emitting device 3, the shapes of the barrier material 14a, the mounting area 10b, the first electrode pair 26A and 26B, and the second electrode pair 27A and 27B are different from those of the barrier material 14a, the mounting area 10a, the first electrode pair 16A and 16B, and the second electrode pair 17A and 17B. The mounting area 10b is a circular area inside the barrier material 14a, which has a planar annular shape. Furthermore, the arrangement of the first resin 12 in the light-emitting device 3 is different from that in the light-emitting device 1. In addition, the number of light-emitting elements 11A forming the first light-emitting element group 21a is 8, and the number of light-emitting elements 11A forming the other first light-emitting element groups 21b is 4. In the first light-emitting element groups 21a and 21b, the light-emitting elements 11A are arranged such that the angle θ between the normal direction of any one of their four sides and the first direction is 45°, and they are covered by the first resin 12. Furthermore, a first resin 12 is disposed between the barrier material 14a and the first light-emitting element groups 21a and 21b. A second light-emitting element group 22c, which is not covered by the first resin 12 and is formed of light-emitting elements 11B, is disposed between the first light-emitting element groups 21a and 21b. In the second light-emitting element group 22c, the light-emitting elements 11B are arranged such that the angle between the normal direction of any one of their four sides and the first direction is 0°.

[0074] The number of light-emitting elements 11A forming the first light-emitting element group 21a and the number of light-emitting elements 11A forming a pair of first light-emitting element groups 21b connected in series are the same, eight in total, each connected in series between the first electrode pairs 26A and 26B. The eight light-emitting elements 11B forming the second light-emitting element group 22c are connected in series between the second electrode pairs 27A and 27B.

[0075] A pair of first light-emitting element groups 21b are each separately disposed outside the first light-emitting element group 21a and the second light-emitting element group 22c, and are formed by four light-emitting elements 11A. The light-emitting elements 11A forming each pair of first light-emitting element groups 21b are connected in series below the barrier material 14a. Since the pair of first light-emitting element groups 21b are each separately disposed outside the first light-emitting element group 21a and the second light-emitting element group 22c, the light-emitting elements 11A and 11B can be evenly arranged within the circular mounting area 10b.

[0076] The light-emitting element 11A forming the first light-emitting element group 21a and 21b and the light-emitting element 11B forming the second light-emitting element group 22c may be offset outwards by at least one of them. When the light-emitting element 11A forming the first light-emitting element group 21a and 21b and the light-emitting element 11B forming the second light-emitting element group 22c are offset outwards, the light-emitting elements 11A and 11B can be evenly arranged within the circular mounting area 10b.

[0077] In the light-emitting device 3, the light-emitting elements 11A forming the first light-emitting element groups 21a and 21b are arranged such that the angle θ between the normal direction of any one of their four sides and the first direction is 15° or more and 75° or less, so the spacing between adjacent second light-emitting element groups can be narrowed for the arrangement.

[0078] (Light-emitting device according to the fourth embodiment) Figure 11 (a) is a plan view of the light-emitting device 4 according to the fourth embodiment. Figure 11 (b) is Figure 11 (a) is a cross-sectional view of the light-emitting device along line A-A'. In the light-emitting device 4, the same symbols are used for the same components as in the light-emitting device 1, and the descriptions are omitted.

[0079] The light-emitting device 4 differs from the light-emitting device 1 in that it has a reflective resin 40. The reflective resin 40, like the barrier material 14, is formed of an opaque polysiloxane resin mixed with white particles that serve as reflective material, and is disposed between the barrier material 14 and the first light-emitting element group 21 and the second light-emitting element group 22.

[0080] The difference between the manufacturing method of light-emitting device 4 and the manufacturing method of light-emitting device 1 lies in that... Figure 3 The first resin preparation process shown in S5 is similar to... Figure 3 The second resin preparation process shown in S6 includes a reflective resin preparation process. In the manufacturing method of the light-emitting device 4, the substrate preparation process, the light-emitting element mounting process, the wire bonding process, the barrier material preparation process, the first resin preparation process, and the second resin preparation process are the same as those in the manufacturing method of the light-emitting device 1, so their descriptions are omitted.

[0081] In the reflective resin preparation step of the manufacturing method of the light-emitting device 4, the uncured reflective resin 40 is dripped from the nozzle of the dripping device (not shown) onto the vicinity of the sides of the light-emitting elements 11A and 11B of the first light-emitting element group 21 and the second light-emitting element group 22 located at their ends in the first direction, facing the barrier material 14, while being held by the lateral tension and wetting and spreading. The viscosity coefficient of the uncured reflective resin 40 is the same as that of the uncured first resin 12, and it is cured by a prescribed heat treatment.

[0082] Since the light-emitting device 4 has a reflective resin 40 disposed between the barrier material 14 and the first light-emitting element group 21 and the second light-emitting element group 22, no matter what the distance between the barrier material 14 and the ends of the first light-emitting element group 21 and the second light-emitting element group 22 is, a yellow ring caused by the second phosphor contained in the second resin 13 will not be generated.

[0083] The light-emitting device 4 has a reflective resin 40 disposed between the barrier material 14 of the light-emitting device 1 and the first light-emitting element group 21 and the second light-emitting element group 22. In the light-emitting devices 1a and 1b, the reflective resin 40 may also be disposed between the first light-emitting element group and the second light-emitting element group formed by light-emitting elements 11A and 11B and the barrier material, similar to the light-emitting device 4.

[0084] (A variation of the above-mentioned light-emitting device) The aforementioned light-emitting device has synthetic resins such as the first resin 12 and the second resin 13 directly disposed on the substrate 10, the light-emitting elements 11A and 11B, and the bonding line 15. Alternatively, the light-emitting device of the embodiment may have a transparent resin disposed between the substrate 10, the light-emitting elements 11A and 11B, the bonding line 15, and the synthetic resins such as the first resin 12 and the second resin 13. The transparent resin is a film composed of a transparent synthetic resin, which includes acrylic resin, polysiloxane resin, and fluorinated compounds. By having a transparent resin, the light-emitting device of the embodiment can prevent the light-emitting elements 11A and 11B from peeling off from the substrate 10 and prevent damage to the bonding line 15.

[0085] When the light-emitting device of the embodiment has a transparent resin, in the manufacturing process of the light-emitting device of the embodiment, in Figure 3 A transparent resin preparation step is performed between the barrier material preparation step shown in S4 and the first resin preparation step shown in S5. In the transparent resin preparation step, a transparent resin before curing is applied to the entire surface of the substrate 10, the light-emitting elements 11A and 11B, and the bonding line 15. Then, the substrate 10 is heated to prepare the transparent resin.

[0086] Furthermore, the light-emitting device of the embodiment may also have a transparent resin film formed between the bonding line 15 and the upper surface of the substrate 10. The transparent resin film is formed of the same resin as the transparent resin disposed between the substrate 10, the light-emitting elements 11A and 11B, and the bonding line 15 and synthetic resins such as the first resin 12 and the second resin.

[0087] Figure 12 This diagram shows the transparent resin film formed between the bonding line 15 and the upper surface of the substrate 10. Figure 12 It is the same as observing from the side. Figure 1 The diagram corresponding to region B in (a). Figure 12 The components other than the substrate 10, the first adjacent light-emitting element 11A-1 and the second adjacent light-emitting element 11A-2, the bonding line 15 and the transparent resin are omitted.

[0088] A transparent resin film 19 is formed across the entire surface between the bonding line 15 connecting the light-emitting elements 11A and the bonding line 15 connecting the light-emitting elements 11B and the substrate 10.

[0089] By having a transparent resin film 19 formed between the bonding line 15 and the upper surface of the substrate 10, the light-emitting device of the embodiment allows the first resin 12 before curing to easily accumulate near the bonding line 15 when it is dropped on. Since the first resin 12 before curing easily accumulates near the bonding line 15, the light-emitting device of the embodiment can further reduce the maximum width W of the first resin region 30c.

[0090] Furthermore, the transparent resin film 19 may also be formed on at least a portion of the bonding line 15 connecting the light-emitting elements 11A and the bonding line 15 connecting the light-emitting elements 11B and the substrate 10. The transparent resin film 19 may also be formed with an opening that does not span the entire surface between the bonding line 15 and the substrate 10. Even when the transparent resin film 19 formed between the bonding line 15 and the substrate 10 has an opening, the maximum width W of the first resin region 30c can be reduced due to the formation of the transparent resin film 19.

[0091] (Light-emitting device according to the fifth embodiment) Figure 13 (a) is a plan view of the light-emitting device 5 according to the fifth embodiment. Figure 13 (b) is Figure 13 (a) is a cross-sectional view of the light-emitting device along line A-A'. In the light-emitting device 5, the same symbols are used for the same components as in the light-emitting device 1, and the descriptions are omitted.

[0092] The light-emitting device 5 differs from the light-emitting device 1 in that it has a first fluorescent resin 41. Furthermore, unlike the light-emitting device 1, it has a first resin 42 instead of a first resin 12. The first fluorescent resin 41, like the first resin 12, contains a phosphor, also called a first phosphor. The type of phosphor contained in the first fluorescent resin 41 is the same as that contained in the first resin 12.

[0093] The first fluorescent resin 41 is configured to cover at least a portion of the sides and the upper surface of the plurality of light-emitting elements 11A. The first fluorescent resin 41 is configured to cover the upper surface of all light-emitting elements 11A, and is configured to cover the sides of the light-emitting elements 11A that are not facing the barrier material 14. The first fluorescent resin 41 is not disposed on the sides of the light-emitting elements 11A that face the barrier material 14.

[0094] The first resin 42, like the barrier material 14, is formed of an opaque polysiloxane resin mixed with white particles as a reflective material. It is configured to cover the side of the light-emitting element 11A opposite to the barrier material 14 and is a resin that reflects light emitted from the light-emitting elements 11A and 11B. The first resin 42, like the first resin 12, is disposed between a pair of sides of the two light-emitting elements 11A, which are arranged in a manner that separates as they approach the barrier material 14. Furthermore, the first resin 42, like the first resin 12, is disposed between a pair of sides of the two light-emitting elements 11B, which are arranged in a manner that separates as they approach the barrier material 14. Additionally, the first resin 42 is also disposed in each of the plurality of first light-emitting element groups formed from the light-emitting elements 11A and the plurality of second light-emitting element groups formed from the light-emitting elements 11B. Figure 2 The end in the first direction shown is between the barrier material 14.

[0095] The difference between the manufacturing method of the light-emitting device 5 and the manufacturing method of the light-emitting device 1 is that the first fluorescent resin preparation step is replaced by... Figure 3 The first resin preparation step is shown in S5. Furthermore, the manufacturing method of the light-emitting device 5 is as follows: Figure 3 The barrier material preparation process shown in S4 is similar to... Figure 3 A transparent resin film preparation step is performed between the first resin preparation step shown in S5. In the transparent resin film preparation step, a transparent resin before curing is applied to the entire surface of the substrate 10, light-emitting elements 11A and 11B, and bonding lines 15. Then, the substrate 10 is heat-treated to form a transparent resin film between the bonding lines 15 and the upper surface of the substrate 10. Furthermore, the manufacturing method of the light-emitting device 5 differs from that of the light-emitting device 1 in that... Figure 3 The first resin preparation process shown in S5 is similar to... Figure 3 The first resin preparation step is located between the second resin preparation step shown in S6. In the manufacturing method of the light-emitting device 5, the substrate preparation step, the light-emitting element mounting step, the wire bonding step, the barrier material preparation step, and the second resin preparation step are the same as those in the manufacturing method of the light-emitting device 1, so the description is omitted.

[0096] In the first fluorescent resin preparation step, the uncured first fluorescent resin 41 is added dropwise in the order of positions 12a, 12c, and 12d, and not in... Figure 4 The first fluorescent resin 41 before curing is added at position 12b as shown, except for... Figure 3 The first resin preparation process shown in S5 is the same.

[0097] In the first resin preparation step of the manufacturing method of the light-emitting device 5, the first resin 42 before curing is dripped from the nozzle of the dripping device (not shown) to the vicinity of the sides of the light-emitting elements 11A and 11B facing the barrier material 14. The first resin 42, like the first resin 12, is dripped between a pair of sides of the two light-emitting elements 11A and 11B, which are configured to separate as they approach the barrier material 14, and is wetted and diffused while being held by the tension between the pairs of sides. The viscosity coefficient of the first resin 42 before curing is the same as that of the first resin 12 before curing, and it is cured by a prescribed heat treatment.

[0098] Because of the reflective first resin 42 disposed between the light-emitting elements 11A and 11B and the barrier material 14, the light-emitting device 5 is not at risk of light emitted from the light-emitting elements 11A and 11B becoming stray light between the light-emitting elements 11A and 11B and the barrier material 14. Since the light emitted from the light-emitting elements 11A and 11B does not become stray light between the light-emitting elements 11A and 11B and the barrier material 14, the light-emitting device 5 is not at risk of reduced luminous efficiency due to stray light.

[0099] In the embodiment of the light-emitting device, when the transparent resin film 19 is present, the angle between the extending direction of the bonding line 15 connecting two adjacent light-emitting elements 11A and the first direction when viewed from above is preferably less than angle θ, and more preferably near 0°. By making the angle between the extending direction of the bonding line 15 and the first direction when viewed from above less than angle θ, the first resin 12 before curing can be stably added during the first resin preparation step, thus suppressing deviations in the maximum width W. By suppressing deviations in the maximum width W, the light-emitting device of the embodiment can narrow the spacing between multiple light-emitting element groups.

[0100] In the embodiment of the light-emitting device, when the transparent resin film 19 is provided, the bonding line 15 connecting two adjacent light-emitting elements 11A is preferably arranged in a point-symmetric manner with respect to the midpoint between the centers of the two light-emitting elements 11A connected by the bonding line 15. By arranging the bonding line 15 in a point-symmetric manner with respect to the midpoint between the centers of the two connected light-emitting elements 11A, the first resin 12 before curing can be stably dripped in the first resin preparation step, thus suppressing the deviation of the maximum width W. By suppressing the deviation of the maximum width W, the light-emitting device of the embodiment can narrow the spacing between multiple light-emitting element groups.

[0101] In the embodiment of the light-emitting device, when the transparent resin film 19 is provided, the bonding line 15 connecting two adjacent light-emitting elements 11A is more preferably arranged to be linearly symmetrical about the center line connecting the centers of the two light-emitting elements 11A connected by the bonding line 15. For example, the bonding line 15 is arranged to coincide with the center line connecting the centers of the light-emitting elements 11A, thereby being arranged to be linearly symmetrical about the center line connecting the centers of the light-emitting elements 11A connected by the bonding line 15. By arranging the bonding line 15 in a linearly symmetrical manner about the center line connecting the centers of the light-emitting elements 11A, the light-emitting device of the embodiment can stably drip the first resin 12 before curing in the first resin preparation step, thus suppressing the deviation of the maximum width W. By suppressing the deviation of the maximum width W, the light-emitting device of the embodiment can narrow the spacing between multiple light-emitting element groups.

[0102] Furthermore, the first resin is formed by dripping and curing a first resin at positions 12a, 12b, 12c, and 12d in the aforementioned light-emitting device. However, in the light-emitting device of the embodiment, the resin dripped to positions 12a and 12d may be different from the resin dripped to positions 12b and 12c. For example, the resin dripped to positions 12a and 12d may contain a phosphor, while the resin dripped to positions 12b and 12c may contain a reflective material.

[0103] Furthermore, the first resin is formed by dripping and curing the first resin at positions 12a, 12b, 12c, and 12d in the aforementioned light-emitting device. In the light-emitting device of the embodiment, the first resin may also be formed by continuously coating the light-emitting element 11A forming the first light-emitting element group with the first resin before curing in the first direction.

[0104] When the first resin before curing is continuously coated in the first direction to form the first resin, the viscosity coefficient of the first resin before curing is preferably 50 Pa·s or more and 150 Pa·s or less. In addition, the amount of the first resin before curing filling the space 30 is preferably 0.4 mg or more and 0.6 mg or less.

[0105] Furthermore, in the aforementioned light-emitting device, a barrier material 14 is disposed around the light-emitting elements 11A and 11B. However, in the light-emitting device of the embodiment, the barrier material 14 may be omitted. In the light-emitting device of the embodiment, when the barrier material 14 is not present, the first resin is retained by capillary action occurring between the sides of the light-emitting elements.

[0106] (Light-emitting device according to the sixth embodiment) Figure 14 (a) is a plan view of the light-emitting device 6 according to the sixth embodiment. Figure 14 (b) is Figure 14 (a) is a cross-sectional view of the light-emitting device along line A-A'.

[0107] The light-emitting device 6 includes a substrate 50, a plurality of light-emitting elements 51A and 51B mounted on the substrate 50, a first resin 52, a first phosphor sheet 53, and a second phosphor sheet 54. The substrate 50 has the same structure as the substrate 10, and a first electrode pair 56A and 56B and a second electrode pair 57A and 57B are disposed on the upper surface.

[0108] The first electrode pair 56A and 56B and the second electrode pair 57A and 57B are formed on the upper surface of the substrate 50 by conductive components such as gold-plated parts, and power supplied from an external power source (not shown) is supplied to the anode terminal and cathode terminal of each of the plurality of light-emitting elements 51A and 51B.

[0109] Light-emitting elements 51A and 51B are LED chips that emit blue light. A total of 16 light-emitting elements 51A and 51B are mounted on the substrate 50. The upper surface of each of the light-emitting elements 51A and 51B has a square shape when viewed from above. The light-emitting elements 51A and 51B are mounted on the substrate 50 with their faces facing downwards. The emission color and number of light-emitting elements 51A and 51B are not limited to those described above; other emission colors and any number can be used. Furthermore, the upper surface of the light-emitting elements 51A and 51B can also be a rectangular shape other than a square when viewed from above.

[0110] The light-emitting elements 51A and 51B are arranged in a roughly square configuration (4 rows, 4 columns) when viewed from above. Four light-emitting elements 51A are arranged in column 1 (61) and column 3 (63), and four light-emitting elements 51B are arranged in column 2 (62) and column 4 (64). The light-emitting elements 51A and 51B are arranged alternately in rows 1 (65) to 4 (68). Each of the light-emitting elements 51A and 51B is arranged such that, when viewed from above, its side is tilted at 45° relative to the row and column directions in which they are arranged.

[0111] The four light-emitting elements 51A arranged in the first column 61 and the third column 63 are connected in series between the first electrode pair 56A and 56B, and the four light-emitting elements 51B arranged in the second column 62 and the fourth column 64 are connected in series between the second electrode pair 57A and 57B.

[0112] The first resin 52 is formed from an opaque polysiloxane resin incorporating white particles as a reflective material. The first resin 52 functions as a sealing material to seal the light-emitting elements 51A and 51B, and also as a reflective material to reflect light emitted from the light-emitting elements 51A and 51B. The outer edge of the first resin 52 is formed by retaining the first resin before curing due to capillary action occurring between the sides of the light-emitting elements.

[0113] The first fluorescent sheet 53 is a sheet with a rectangular planar shape and containing phosphors. The first fluorescent sheet 53 is configured to cover the upper surface of the light-emitting element 11A. The type of phosphor contained in the first fluorescent sheet 53 is the same as the phosphor contained in the first resin 12. The first fluorescent sheet 53 is configured such that its side surface is parallel to the side surface of the light-emitting element 51A, and is arranged such that, when viewed from above, its side surface is tilted at 45° relative to the row and column directions in which the light-emitting elements 51A are arranged.

[0114] The second fluorescent sheet 54 is a sheet with a rectangular planar shape and containing a phosphor. The second fluorescent sheet 54 is configured to cover the upper surface of the light-emitting element 11B. The second fluorescent sheet 54 contains a second phosphor, just like the second resin 13. The second fluorescent sheet 54 is configured such that its side surface is parallel to the side surface of the light-emitting element 51B, and is arranged such that, when viewed from above, its side surface is tilted at 45° relative to the row and column directions in which the light-emitting elements 51B are arranged.

[0115] Figure 15 A flowchart illustrating the manufacturing method of the light-emitting device 6.

[0116] First, in the substrate preparation process, a substrate 50 with first electrode pairs 56A and 56B and second electrode pairs 57A and 57B is prepared (S11). Next, in the light-emitting element mounting process, multiple light-emitting elements 51A and 51B are mounted on the upper surface of the substrate 50 of the substrate 10 by flip-chip bonding (S12).

[0117] Next, in the first phosphor sheet preparation step, the first phosphor sheet 53 is bonded to the upper surface of the light-emitting element 51A using a transparent adhesive (S13). The adhesive material for bonding the first phosphor sheet 53 to the upper surface of the light-emitting element 51A is cured to form a transparent resin covering the sides of the light-emitting element 51A. Next, in the second phosphor sheet preparation step, the second phosphor sheet 54 is bonded to the upper surface of the light-emitting element 51B using a transparent adhesive (S14). The adhesive material for bonding the second phosphor sheet 54 to the upper surface of the light-emitting element 51B is cured to form a transparent resin covering the sides of the light-emitting element 51B.

[0118] Finally, in the first resin preparation step, the first resin 52 before curing is dripped onto the nozzle of the dripping device (not shown) in an appropriate amount to cover multiple light-emitting elements 11A and 11B, and then cured to form the light-emitting device 5 (S15). The first resin 52 comprises polysiloxane resin, reflective material, and thickener. The viscosity coefficient of the first resin 52 before curing is the same as that of the first resin 12 before curing, and it is cured by a prescribed heat treatment.

[0119] (Light-emitting device of the first modification of the sixth embodiment) Figure 16 (a) is a plan view of the light-emitting device 6a of the first modification of the sixth embodiment. Figure 16 (b) is Figure 16 (a) is a cross-sectional view of the light-emitting device along line A-A'. Figure 16 (c) is Figure 16 (a) is a cross-sectional view of the light-emitting device along line B-B'. In the light-emitting device 6a, the same symbols are used for the same components as in the light-emitting device 6, and the descriptions are omitted.

[0120] In the light-emitting device 6a, the number of light-emitting elements 51A and 51B arranged and their arrangement shape are different from those in the light-emitting device 6. In the light-emitting device 6a, the total number of light-emitting elements 51A and 51B mounted on the substrate 50 is 24, which is 1.5 times the total number of light-emitting elements 51A and 51B mounted on the substrate 50 in the light-emitting device 6.

[0121] Light-emitting elements 51A and 51B are mounted such that four light-emitting elements 51A are arranged in column 1 71, column 3 73, and column 5 75, and four light-emitting elements 51B are arranged in row 2 72, column 4 74, and row 6 76. Each of the light-emitting elements 51A and 51B is arranged such that, when viewed from above, its side is tilted at 45° relative to the row and column directions in which the light-emitting elements 51A and 51B are arranged.

[0122] The four light-emitting elements 51A arranged in the first column 71, the third column 73 and the fifth column 75 are connected in series between the first electrode pair 56A and 56B, and the four light-emitting elements 51B arranged in the second column 72, the fourth column 74 and the sixth column 76 are connected in series between the second electrode pair 57A and 57B.

[0123] The first row 81 of light-emitting element 51A is positioned outside the first row 82 of light-emitting element 51B. The first row 82 of light-emitting element 51B is positioned between the first row 81 and the second row 83 of light-emitting element 51A. The second row 83 of light-emitting element 51A is positioned between the first row 82 and the second row 84 of light-emitting element 51B. The second row 84 of light-emitting element 51B is positioned between the second row 83 and the third row 85 of light-emitting element 51A. The third row 85 of light-emitting element 51A is positioned between the second row 84 and the third row 86 of light-emitting element 51B. The third row 86 of light-emitting element 51B is positioned between the third row 85 and the fourth row 87 of light-emitting element 51A. The fourth row 87 of light-emitting element 51A is positioned between the third row 86 and the fourth row 88 of light-emitting element 51B. The fourth row 88 of the light-emitting element 51B is configured to be located on the outside relative to the fourth row 87 of the light-emitting element 51A.

[0124] By staggering the row direction arrangement of light-emitting elements 51A and the row direction arrangement of light-emitting elements 51B, light-emitting device 6a can mount light-emitting elements 51A and 51B at a higher density than light-emitting device 6.

[0125] Please understand that those skilled in the art can make various changes, substitutions, and modifications to this invention without departing from its scope. For example, the above-described embodiments and variations can be implemented in combination as appropriate within the scope of this invention.

Claims

1. A light-emitting device, characterized in that, have: substrate; A plurality of first light-emitting elements are mounted on the upper surface of the substrate in such a manner as to form a plurality of first light-emitting element groups extending along a first direction; A first resin, configured to cover at least a portion of the side surface of each of the plurality of first light-emitting elements; as well as A plurality of second light-emitting elements are mounted adjacent to the plurality of first light-emitting element groups; The angle θ between the normal direction of any one of the four sides of each of the plurality of first light-emitting elements and the first direction is greater than 15 degrees and less than 75 degrees.

2. The light-emitting device according to claim 1, characterized in that, The angle θ is greater than 30 degrees and less than 60 degrees.

3. The light-emitting device according to claim 1 or 2, characterized in that, The first resin contains a first phosphor and is configured to also cover the upper surface of each of the plurality of first light-emitting elements.

4. The light-emitting device according to claim 3, characterized in that, It also has: A barrier material disposed around the plurality of first light-emitting elements and the plurality of second light-emitting elements; as well as The second resin is disposed on the inner side of the barrier material in such a way that it covers the plurality of first light-emitting elements, the plurality of second light-emitting elements, and the first resin.

5. The light-emitting device according to claim 4, characterized in that, The second resin contains a second phosphor that is different from the first phosphor.

6. The light-emitting device according to claim 4 or 5, characterized in that, The second resin contains a diffusion material.

7. The light-emitting device according to claim 4, characterized in that, It also includes a third resin containing a third phosphor, configured to cover the upper surface and side surfaces of each of the plurality of second light-emitting elements. The plurality of second light-emitting elements are configured to form a plurality of second light-emitting element groups extending along the first direction. The angle between the normal direction of any one of the four sides of each of the plurality of second light-emitting elements and the first direction is more than 15 degrees and less than 75 degrees.

8. The light-emitting device according to claim 4, characterized in that, It also includes a reflective resin disposed between the end of each of the plurality of first light-emitting element groups and the plurality of second light-emitting element groups in the first direction and the barrier material.

9. The light-emitting device according to claim 4, characterized in that, The first resin is also disposed between the end of each of the plurality of first light-emitting element groups in the first direction and the barrier material.

10. The light-emitting device according to any one of claims 1 to 4, characterized in that, The angle between the normal direction of any one of the four sides of each of the plurality of second light-emitting elements and the first direction is less than or equal to the angle θ.

11. The light-emitting device according to any one of claims 1 to 8, characterized in that, The plurality of first light-emitting elements have a square planar shape.

12. The light-emitting device according to any one of claims 1 to 11, characterized in that, It also has: Connecting wires that interconnect the plurality of first light-emitting elements; and A transparent resin film is formed on at least a portion between the bonding line and the upper surface of the substrate.

13. The light-emitting device according to claim 12, characterized in that, When viewed from above, the angle between the extension direction of the joining line and the first direction is less than the angle θ.

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