Display device and electronic device including the same

Abstract

A display device and an electronic apparatus including the same are disclosed. The display device includes a substrate including a display area, a first peripheral area positioned in a direction away from the display area, an integrated circuit area spaced apart from the first peripheral area in which a data driver is arranged, and a bendable area positioned between the first peripheral area and the integrated circuit area. A data distributor is positioned between the integrated circuit region and the bendable region. The first data connection line group and the second data connection line group are electrically connected to the data distributor and output different signals from the data driver in response to different distribution selection signals. A wire is positioned between the first data connection line set and the second data connection line set. The fourth power line is arranged in a different layer from the first data connection line group and the second data connection line group, and is electrically connected to the conductive line to supply the first power voltage to the conductive line.

Description

Technical Field

[0001] The embodiments relate to display devices. More specifically, the embodiments relate to display devices that prevent coupling and minimize line resistance, and electronic devices including display devices. Background Technology

[0002] With the development of information technology, the importance of display devices that provide a connection medium between users and information is becoming increasingly prominent. For example, the use of display devices such as liquid crystal displays (LCDs), organic light-emitting diode displays (OLEDs), plasma display panels (PDPs), and quantum dot displays is increasing.

[0003] Typically, a display device includes a display panel and drivers. The display panel includes multiple gate lines, multiple data lines, and multiple pixels. The display panel displays images based on an input image. The drivers include gate drivers, data drivers, and a controller. The gate drivers output gate signals to the gate lines. The data drivers output data signals to the data lines. The controller controls the gate drivers and data drivers.

[0004] The driver may include a demultiplexing circuit. The demultiplexing circuit may branch the first emission data and the second emission data.

[0005] The demultiplexing circuit can be arranged adjacent to an integrated circuit included as a data driver or a portion thereof. In this case, a display device in which the demultiplexing circuit is arranged adjacent to the integrated circuit may have a greater number of floating lines on the display panel than a display device in which the demultiplexing circuit is arranged adjacent to the display panel. Summary of the Invention

[0006] Embodiments of this disclosure provide a display device with reduced dead zone and improved reliability.

[0007] Embodiments of this disclosure provide an electronic device including a display device.

[0008] A display device according to an embodiment includes: a substrate comprising a display area and a peripheral area, the peripheral area including a first peripheral area positioned in a direction away from the display area, an integrated circuit area spaced apart from the first peripheral area, and a flexible area positioned between the first peripheral area and the integrated circuit area; a data driver disposed in the integrated circuit area on the substrate; a data distributor positioned between the integrated circuit area and the flexible area on the substrate; a first data connection line group electrically connected to the data distributor and configured to receive a first data signal output from the data driver in response to a first distribution selection signal; a second data connection line group electrically connected to the data distributor and configured to receive a second data signal output from the data driver in response to a second distribution selection signal; a conductor positioned between the first data connection line group and the second data connection line group; and a fourth power line disposed in a layer different from the first data connection line group and the second data connection line group in a cross-sectional view and electrically connected to the conductor through a contact hole to provide a first power voltage to the conductor.

[0009] In this implementation, the first data connection line group, the second data connection line group, and the wires can be positioned on the same layer.

[0010] In an embodiment, the display device, in a cross-sectional view, may further include a first insulating layer disposed on a substrate, a second insulating layer disposed on the first insulating layer, a third insulating layer disposed on the second insulating layer, a fourth insulating layer disposed on the third insulating layer, and a fifth insulating layer disposed on the fourth insulating layer, wherein the first data connection line group, the second data connection line group, and the conductor may be covered by the fourth insulating layer, and the fourth power line may be covered by the fifth insulating layer.

[0011] In an implementation, in a cross-sectional view, the width of the fourth electric field line may be greater than the width of each of the conductors.

[0012] In an embodiment, the display device may also include additional power lines electrically connected to the conductors via contact holes in a layer different from the fourth and fifth insulating layers, as shown in the cross-sectional view.

[0013] In an implementation, the width of the additional power line may be greater than the width of each of the conductors.

[0014] In one implementation, the additional power line may include a first power line covered by a first insulation layer and a second power line covered by a second insulation layer and electrically connected to the first power line and the conductor through a contact hole.

[0015] In an embodiment, the display device may further include a sixth insulating layer disposed on the fifth insulating layer and a fifth power line covered by the sixth insulating layer.

[0016] In one implementation, the additional power line may include a first power line covered by a first insulation layer and electrically connected to the conductor through a contact hole.

[0017] In one implementation, the additional power line may include a second power line covered by a second insulation layer and electrically connected to the conductor through a contact hole.

[0018] In one implementation, the additional power line may include a third power line covered by a third insulation layer and electrically connected to the conductor through a contact hole.

[0019] In one implementation, the additional power line may include a second power line covered by a second insulation layer and a third power line covered by a third insulation layer and electrically connected to the second power line and the conductor through a contact hole.

[0020] In one embodiment, the additional power line may include a first power line covered by a first insulation layer and a third power line covered by a third insulation layer and electrically connected to the first power line and the conductor through a contact hole.

[0021] In an embodiment, in a cross-sectional view, additional electric field lines disposed under the fourth insulating layer may include a first metal, and additional electric field lines disposed on the fourth insulating layer may include a second metal different from the first metal.

[0022] In this embodiment, the resistivity of the second metal may be less than that of the first metal.

[0023] In an implementation, in a cross-sectional view, the first data connection line group, the second data connection line group, and the wires may be spaced apart from each other in a direction intersecting with one direction.

[0024] In one embodiment, a bending line is defined in the bendable region, the substrate can be folded along the bending line, and when viewed from the side, with the substrate folded along the bending line, pixels can be arranged in the display area on the substrate, and data distributors and data drivers can be positioned below the substrate.

[0025] A display device according to an embodiment includes: a substrate comprising a display area and a peripheral area, the peripheral area including a first peripheral area positioned in a direction away from the display area, an integrated circuit area spaced apart from the first peripheral area, and a flexible area positioned between the first peripheral area and the integrated circuit area; a data driver disposed in the integrated circuit area on the substrate; a data distributor positioned between the integrated circuit area and the flexible area on the substrate; a first data connection line group electrically connected to the data distributor and configured to receive a first data signal output from the data driver in response to a first distribution selection signal; a second data connection line group electrically connected to the data distributor and configured to receive a second data signal output from the data driver in response to a second distribution selection signal; a conductor positioned between the first data connection line group and the second data connection line group and configured to receive a first power voltage; and a fourth power line arranged on the first data connection line group and the second data connection line group in a cross-sectional view and having a width greater than the width of each of the conductors.

[0026] In an embodiment, the display device may also include additional power lines arranged below the conductors in the cross-sectional view and electrically connected to the conductors through contact holes.

[0027] In one embodiment, the display device may further include additional power lines arranged on the fourth power line in the cross-sectional view and electrically connected to the conductor through contact holes. In another embodiment, in the cross-sectional view, the additional power lines arranged below the conductor may include a first metal, and the additional power lines arranged on the fourth power line may include a second metal, the resistivity of which may be less than that of the first metal.

[0028] An electronic device according to an embodiment includes: a power module for supplying power and a display device for receiving power. The display device includes: a substrate comprising a display area and a peripheral area, the peripheral area including a first peripheral area positioned in a direction away from the display area, an integrated circuit area spaced apart from the first peripheral area, and a flexible area positioned between the first peripheral area and the integrated circuit area; a data driver disposed in the integrated circuit area on the substrate; a data distributor positioned between the integrated circuit area and the flexible area on the substrate; a first data connection line group electrically connected to the data distributor and configured to receive a first data signal output from the data driver in response to a first distribution selection signal; a second data connection line group electrically connected to the data distributor and configured to receive a second data signal output from the data driver in response to a second distribution selection signal; a conductor positioned between the first data connection line group and the second data connection line group and configured to receive a first power voltage; and a fourth power line arranged in cross-sectional view on the first data connection line group and the second data connection line group and having a width greater than the width of each of the conductors.

[0029] In an embodiment, the display device may also include additional power lines arranged below the conductors in the cross-sectional view and electrically connected to the conductors through contact holes.

[0030] In an embodiment, the display device may also include an additional power line arranged on the fourth power line in the cross-sectional view and electrically connected to the conductor through a contact hole.

[0031] In the display device and electronic device according to the embodiment, wires can be arranged between groups of data connection lines branching from the bottom of the flexible area of ​​the display panel, and additional power lines with large-area contact power lines can be arranged in the wires. Therefore, coupling between output signals can be prevented, and the increase in resistance of the power lines can be minimized.

[0032] Furthermore, additional power lines can be placed above or below the conductors. This prevents coupling between output signals and minimizes the increase in resistance of the power lines.

[0033] Furthermore, the resistivity of the metallic material included in the additional electric field lines arranged on the conductor can be lower than the resistivity of the metallic material included in the additional electric field lines arranged below the conductor. Therefore, the increase in the resistance of the electric field lines can be further minimized.

[0034] However, the effects of this disclosure are not limited to those described above, and can be extended in various ways to a degree that does not depart from the spirit and scope of this disclosure. Attached Figure Description

[0035] Figure 1 This is a block diagram illustrating a display device according to an embodiment of the present disclosure.

[0036] Figure 2 It is shown Figure 1 A plan view of the implementation of the display panel and data drive.

[0037] Figure 3 It is shown Figure 2 A view of the implementation of the second peripheral region.

[0038] Figure 4 It is shown Figure 1 A circuit diagram illustrating an embodiment of pixels included in a display device.

[0039] Figure 5 This is a timing diagram illustrating an example of coupling occurring in a demultiplexing switch structure.

[0040] Figure 6 , Figure 7 , Figure 8 , Figure 9 , Figure 10 , Figure 11 and Figure 12 This is a view showing an embodiment of the conductors and power lines.

[0041] Figure 13 This is a block diagram illustrating an electronic device according to an embodiment of the present disclosure.

[0042] Figure 14 It is shown that Figure 13 A diagram illustrating an example of an electronic device implemented as a smartphone.

[0043] Figure 15 It is shown Figure 14 A view of an implementation of a smartphone in a bent state.

[0044] Figure 16 This is a block diagram illustrating an electronic device according to an embodiment of the present disclosure. Detailed Implementation

[0045] In the following, embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. In the drawings, the same reference numerals are used for the same components, and redundant descriptions of the same components will be omitted.

[0046] Figure 1 This is a block diagram illustrating a display device according to an embodiment of the present disclosure.

[0047] Reference Figure 1 The display device 1000 may include a display panel 100 and a display panel driver.

[0048] The display panel 100 may include pixels PX, gate lines GL, and data lines DL.

[0049] The display panel 100 may be defined with a display area AA and a peripheral area PA.

[0050] Pixels PX can be arranged in the display area AA. For example, there can be multiple pixels PX. Multiple pixels PX can be arranged repeatedly along a first direction D1 and a second direction D2. For example, the first direction D1 and the second direction D2 can intersect each other. For example, the first direction D1 can be perpendicular to the second direction D2.

[0051] The peripheral region PA can be adjacent to the display region AA. For example, the peripheral region PA can surround the display region AA. Various components (e.g., driver chips, etc.) can be arranged in the peripheral region PA to drive the pixels PX.

[0052] However, this disclosure is not limited thereto. For example, an image may also be displayed in the peripheral area PA.

[0053] Each of the gate line GL and the data line DL can be electrically connected to the pixel PX. For example, the gate line GL may extend in a first direction D1. The data line DL may extend in a second direction D2.

[0054] Pixel PX can receive gate signals via gate line GL. Additionally, pixel PX can receive data signals via data line DL. Pixel PX can be filled with data signals in response to the gate signals.

[0055] In some embodiments, the image may be displayed in a direction perpendicular to the display surface (e.g., a plane defined by a first direction D1 and a second direction D2). However, this disclosure is not limited thereto. For example, the image may be displayed on the side, back, or other surfaces of the display panel 100.

[0056] The display panel driver may include a drive controller 200, a gate driver 300, a gamma reference voltage generator 400, and a data driver 500.

[0057] In some implementations, the drive controller 200 and the data driver 500 may be integrally formed. For example, a drive module that includes at least the integrally formed drive controller 200 and data driver 500 may be called a timing controller embedded data driver (TED).

[0058] In one implementation, the drive controller 200, the gamma reference voltage generator 400, and the data driver 500 may be integrated into one unit.

[0059] The drive controller 200 can receive input image data IMG and input control signal CONT from external devices.

[0060] In one implementation, the input image data IMG may include red image data, green image data, and blue image data. However, this disclosure is not limited thereto. For example, the input image data IMG may include white image data. For example, the input image data IMG may include magenta image data, yellow image data, and cyan image data.

[0061] In this implementation, the input control signal CONT may include a master clock signal and a data enable signal. However, this disclosure is not limited thereto. For example, the input control signal CONT may also include a vertical synchronization signal, a horizontal synchronization signal, etc.

[0062] The drive controller 200 can generate a first control signal CONT1, a second control signal CONT2, a third control signal CONT3, and a data signal DATA based on the input image data IMG and the input control signal CONT.

[0063] The drive controller 200 can generate a first control signal CONT1 for controlling the operation of the gate driver 300 based on the input control signal CONT, and output the first control signal CONT1 to the gate driver 300. The first control signal CONT1 may also include a vertical start signal and a gate clock signal.

[0064] The drive controller 200 can generate a second control signal CONT2 for controlling the operation of the data driver 500 based on the input control signal CONT, and output the second control signal CONT2 to the data driver 500. The second control signal CONT2 may include a horizontal start signal and a load signal.

[0065] The drive controller 200 can generate a data signal DATA based on the input image data IMG. The drive controller 200 can output the data signal DATA to the data driver 500.

[0066] The drive controller 200 can generate a third control signal CONT3 based on the input control signal CONT for controlling the operation of the gamma reference voltage generator 400, and output the third control signal CONT3 to the gamma reference voltage generator 400.

[0067] The gate driver 300 can generate a gate signal to drive the gate line GL in response to a first control signal CONT1 received from the drive controller 200. The gate driver 300 can output the gate signal to the gate line GL.

[0068] In one embodiment, the gate driver 300 may be disposed in the peripheral region PA. For example, the gate driver 300 may be mounted on the peripheral region PA. However, this disclosure is not limited thereto. For example, the gate driver 300 may be integrated on the peripheral region PA of the display panel 100.

[0069] The gamma reference voltage generator 400 generates a gamma reference voltage VGREF in response to a third control signal CONT3 received from the drive controller 200. The gamma reference voltage generator 400 provides the gamma reference voltage VGREF to the data driver 500. The gamma reference voltage VGREF may have a value corresponding to the level of the data signal DATA.

[0070] In one embodiment, the gamma reference voltage generator 400 may be arranged in the drive controller 200. However, this disclosure is not limited thereto. For example, the gamma reference voltage generator 400 may be arranged in the data driver 500.

[0071] The data driver 500 can receive a second control signal CONT2 and a data signal DATA from the drive controller 200. Furthermore, the data driver 500 can receive a gamma reference voltage VGREF from the gamma reference voltage generator 400. The data driver 500 can use the gamma reference voltage VGREF to convert the data signal DATA into a data voltage of analog type. The data driver 500 can output the data voltage to the data line DL.

[0072] Figure 2 It is shown Figure 1 A plan view of the implementation of the display panel and data drive. Figure 3 It is shown Figure 2 A view of the implementation of the second peripheral region.

[0073] Reference Figure 1 , Figure 2 and Figure 3 The display device 1000 according to embodiments of the present disclosure may include a display panel 100, a data driver 500, and a data distributor DXA.

[0074] As described above, the display panel 100 may include a display area AA and a peripheral area PA. Accordingly, the display panel 100 may include a substrate (e.g., Figure 6 , Figure 7 , Figure 8 , Figure 9 , Figure 10 , Figure 11 and Figure 12 (Substrate SUB).

[0075] In one embodiment, the display area AA may have a rectangular shape in a plan view, and the edges of the display area AA may be rounded and bent; however, this disclosure is not limited thereto.

[0076] In this implementation, pixels PX may be arranged in the display area AA. Pixel PX may include multiple sub-pixels.

[0077] In this implementation, each of the plurality of sub-pixels may emit a different color of light. For example, each of the plurality of sub-pixels may include a first sub-pixel, a second sub-pixel, and a third sub-pixel. The first sub-pixel may emit red light. The second sub-pixel may emit green light. The third sub-pixel may emit blue light.

[0078] However, this disclosure is not limited thereto. For example, each of the plurality of sub-pixels may emit light of the same color, each of the plurality of sub-pixels may emit white light, or the color type of light emitted by each of the plurality of sub-pixels may be changed.

[0079] In one embodiment, the peripheral region PA may be adjacent to the display region AA. In another embodiment, the peripheral region PA may include a first peripheral region PA1 and a second peripheral region PA2. The first peripheral region PA1 may be positioned in a direction away from the display region AA (e.g., a second direction D2). The second peripheral region PA2 may be positioned from the first peripheral region PA1 in that direction.

[0080] In an implementation, the second peripheral region PA2 may include a flexible region BA and an integrated circuit region ICA.

[0081] In one implementation, the bendable region BA can be positioned between the first peripheral region PA1 and the integrated circuit region ICA.

[0082] In one embodiment, a bend line BL may be defined in the bendable region BA, folding to the rear surface of the display panel 100. The bendable region BA may be a folded portion of the display panel 100. For example, the rear surface of the display panel 100 may be opposite to the display surface of the display panel 100. For example, the rear surface and the display surface may be opposite each other in the direction of displaying an image.

[0083] In one implementation, the data distributor DXA can be positioned between the integrated circuit region ICA and the flexible region BA. In another implementation, as... Figure 2 and Figure 3 As shown, the portion of the bendable region BA near the data distributor DXA may include region SH, and the data line DL and the conductor PL can be connected to the data connection line in the data distributor DXA through region SH.

[0084] In one implementation, the data distributor DXA may include demultiplexing circuitry. The demultiplexing circuitry may be arranged along a first direction D1.

[0085] In this implementation, there may be multiple data distributors DXA. For example, multiple data distributors DXA may be spaced apart from each other along a first direction D1. However, this disclosure is not limited thereto. There may be only one DXA.

[0086] In the case of the display device according to the comparative embodiment, the data distributor DXA may be positioned adjacent to the display surface of the display panel 100. For example, the data distributor DXA may be arranged in the first peripheral region PA1. In this case, in the case of the display device according to the comparative embodiment, the dead zone (i.e., the area where no image is displayed) may be the same size as the data distributor DXA.

[0087] However, the display device 1000 according to embodiments of the present disclosure may have a data distributor DXA positioned on the rear surface of the display panel 100 (e.g., between the data driver chip DIC and the flexible region BA).

[0088] In an embodiment, in a side view, with the display panel 100 folded along the bending line BL (i.e., in a bent state), the data driver 500 (e.g., data driver chip DIC) and the data distributor DXA may be positioned on the back of the display panel 100.

[0089] In other words, in a bent state, the data distributor DXA included in the display panel 100 can overlap with the first peripheral region PA1 or the display region AA on a plane (e.g., a plane defined by the first direction D1 and the second direction D2). Therefore, the dead zone of the display device 1000 according to embodiments of the present disclosure can be reduced.

[0090] A detailed description of the display panel 100 in its curved state along the curvature line BL will be provided below. Figure 15 Describe it.

[0091] In one implementation, the integrated circuit region ICA may be spaced apart from the first peripheral region PA1 in one direction (e.g., in the second direction D2).

[0092] In one implementation, the data driver 500 may be arranged in an integrated circuit region (ICA). For example, the data driver 500 may be formed in the form of a data driver chip (DIC).

[0093] exist Figure 1 , Figure 2 and Figure 3 In this process, the data line DL may include a vertical line (e.g., a line extending in a direction parallel to the second direction D2), however, this disclosure is not limited thereto. For example, the display panel 100 may also include a horizontal line (e.g., a line extending in a direction parallel to the first direction D1). Data voltage can be transmitted to the pixel PX via the vertical line electrically connected to the horizontal line.

[0094] The display device 1000 described above is illustrative, and the components included in the display device 1000 may be omitted, or additional components may be included.

[0095] In some embodiments, the display device 1000 may also include a light-emitting driver, a light-emitting control line, a spiderline, a data transmission line, etc.

[0096] In one implementation, the light-emitting driver can generate a light-emitting control signal to control the brightness.

[0097] In this implementation, the light emission control line can provide the light emission control signal to the pixel PX.

[0098] In this implementation, the crosshair can connect the data driver 500 and the data distributor DXA.

[0099] In this implementation, the data transmission line may connect the data line DL and the data distributor DXA. For example, the data transmission line may include a data fan-out line in the first peripheral region PA1 connected to the data line DL, a data bend line in the flexible region BA connected to the data fan-out line, and a data connection line in the data distributor DXA connected to the data bend line (e.g., ...). Figure 3 The first data connection line DCL1, the second data connection line DCL2, the third data connection line DCL3, and the fourth data connection line DCL4.

[0100] In the implementation method, such as Figure 3 As shown, Figure 2 The display device 1000 may include a data connection cable group (DCL). For example, the data connection cable group (DCL) may include a first data connection cable group and a second data connection cable group. For example, the first data connection cable group may include a first data connection cable (DCL1) and a second data connection cable (DCL2). The second data connection cable group may include a third data connection cable (DCL3) and a fourth data connection cable (DCL4).

[0101] In one implementation, the first data connection line group may be electrically connected to the data distributor DXA and may receive output data signals from the data driver 500 (e.g., the data driver chip DIC) in response to a first distribution selection signal.

[0102] In one implementation, the second data connection line group may be electrically connected to the data distributor DXA and may receive output data signals from the data driver 500 (e.g., the data driver chip DIC) in response to a second distribution selection signal.

[0103] In one embodiment, in a cross-sectional view, the first data connection group, the second data connection group, and the conductor may be spaced apart from each other in a direction intersecting with a direction (e.g., a first direction D1). In another embodiment, the conductor PL may be arranged between the first and second data connection groups. Therefore, the data connection groups can be grouped.

[0104] In this implementation, the first data connection line group (e.g., the first data connection line DCL1 and the second data connection line DCL2) may be adjacent to each other. The second data connection line group (e.g., the third data connection line DCL3 and the fourth data connection line DCL4) may be adjacent to each other. The first data connection line group and the second data connection line group may be separated by a conductor (e.g., the first conductor PL1). That is, the first data connection line group, the conductor PL, and the second data connection line group may be arranged sequentially and repeatedly along the first direction D1.

[0105] However, this disclosure is not limited thereto. For example, the number of wires included in the data connection line group (e.g., included in the first data connection line group and the second data connection line group respectively), the number of conductors PL positioned between the first data connection line group and the second data connection line group, etc., can be varied. For example, each of the first data connection line group and the second data connection line group positioned on both sides of the first conductor PL1 may include four data connection lines.

[0106] In an implementation, the pad PP may include a first pad P1, a second pad P2, a third pad P3, and a fourth pad P4.

[0107] In one embodiment, each of the pads PP can be connected to two sets of data connection lines. Therefore, each of the pads PP can selectively (alternatingly) provide data signals to the two sets of data connection lines. However, this disclosure is not limited thereto.

[0108] In one implementation, a first data connection line DCL1 and a second data connection line DCL2 may branch from a first pad P1. The first data connection line DCL1 may be connected to a first data line DL1. The first data line DL1 may be supplied with a data signal in response to a first allocation selection signal. The second data connection line DCL2 may be connected to a second data line DL2. The second data line DL2 may be supplied with a data signal in response to a second allocation selection signal.

[0109] The third data connection line DCL3 and the fourth data connection line DCL4 can branch from the third pad P3. The third data connection line DCL3 can be connected to the third data line DL3. The third data line DL3 can be supplied with a data signal in response to a first allocation selection signal. The fourth data connection line DCL4 can be connected to the fourth data line DL4. The fourth data line DL4 can be supplied with a data signal in response to a second allocation selection signal.

[0110] In one embodiment, conductors PL may be disposed on a substrate, and each conductor PL may be positioned between one of a first data connection group and one of a second data connection group. In another embodiment, each conductor PL may be supplied with a first electrical voltage.

[0111] In an implementation, the conductor PL may include a first conductor PL1 and a second conductor PL2.

[0112] In one implementation, the first conductor PL1 may receive a first electrical voltage (e.g., ELVDD) from a first electrical pad (e.g., a second pad P2). The first electrical voltage may be supplied to the pixel PX via the first conductor PL1.

[0113] In one implementation, the second conductor PL2 may receive a first electrical voltage from a second electrical pad (e.g., a fourth pad P4). The first electrical voltage may be supplied to the pixel PX via the second conductor PL2.

[0114] In one embodiment, the first conductor PL1 and the second conductor PL2 may be spaced apart from each other in the first direction D1 and extend in the second direction D2.

[0115] In one implementation, the conductor PL may receive a second electrical voltage (e.g., ELVSS) from a power pad (e.g., a first power pad or a second power pad). The second electrical voltage may be supplied to the pixel PX via the conductor PL.

[0116] Because each conductor in the PL is positioned between one in the first data connection group and one in the second data connection group, coupling between the first and second data connection groups is prevented (see, for example, see...). Figure 5 ).

[0117] Figure 4 It is shown Figure 1 A circuit diagram illustrating an embodiment of pixels included in a display device.

[0118] Each pixel PX may include a pixel circuit PC and a light-emitting element LED. The pixel circuit PC may have substantially the same structure. In the following, a pixel PX connected to the m-th data line DLm and the i-th scan line SLi (gate line) will be described, where each of m and i may be a natural number greater than 0.

[0119] Reference Figure 4 For example, the pixel circuit PC may include a first pixel transistor T1, a second pixel transistor T2, a third pixel transistor T3, a fourth pixel transistor T4, a fifth pixel transistor T5, a sixth pixel transistor T6, and a seventh pixel transistor T7, as well as a storage capacitor CST.

[0120] The first pixel transistor T1 may include a gate electrode connected to a first node N1, a first electrode connected to a second node N2, and a second electrode connected to a third node N3.

[0121] The second pixel transistor T2 may include a gate electrode connected to the i-th scan line SLi, a first electrode connected to the m-th data line DLm, and a second electrode connected to the second node N2.

[0122] The third pixel transistor T3 may include a gate electrode connected to the i-th scan line SLi, a first electrode connected to the first node N1, and a second electrode connected to the third node N3.

[0123] The fourth pixel transistor T4 may include a gate electrode connected to the (i-1)th scan line SLi-1, a first electrode to which an initialization signal VINT is applied, and a second electrode connected to the first node N1.

[0124] The fifth pixel transistor T5 may include a gate electrode connected to the i-th emitter control line EMLi, a first electrode to which a first power voltage ELVDD is applied, and a second electrode connected to the second node N2. The first power voltage ELVDD may be a high power voltage.

[0125] The sixth pixel transistor T6 may include a gate electrode connected to the i-th emission control line EMLi, a first electrode connected to the third node N3, and a second electrode connected to the first electrode (e.g., the anode) of the light-emitting element LED.

[0126] The seventh pixel transistor T7 may include a gate electrode connected to the (i-1)th scan line SLi-1, a first electrode to which an initialization signal VINT is applied, and a second electrode connected to the first electrode of the light-emitting element LED.

[0127] The storage capacitor CST may include a first electrode to which a first electrical voltage ELVDD is applied and a second electrode connected to a first node N1.

[0128] The light-emitting element (LED) may include a first electrode and a second electrode (e.g., a cathode) to which a second electrical voltage ELVSS is applied. The second electrical voltage ELVSS may be a low electrical voltage. The LED may emit light based on a drive current supplied from the pixel circuit PC. For example, the LED may include an organic light-emitting diode, an inorganic light-emitting diode, a quantum dot light-emitting diode, a micro light-emitting diode, etc.

[0129] Figure 4 For illustrative purposes, pixel PX may include various circuit structures. For example, the first pixel transistor T1, the second pixel transistor T2, the third pixel transistor T3, the fourth pixel transistor T4, the fifth pixel transistor T5, the sixth pixel transistor T6, and the seventh pixel transistor T7 are shown as p-channel metal-oxide-semiconductor (PMOS) transistors; however, this disclosure is not limited thereto. For example, the third pixel transistor T3 and the fourth pixel transistor T4 may be n-channel metal-oxide-semiconductor (NMOS) transistors. Alternatively, for example, all of the first pixel transistor T1, the second pixel transistor T2, the third pixel transistor T3, the fourth pixel transistor T4, the fifth pixel transistor T5, the sixth pixel transistor T6, and the seventh pixel transistor T7 may be NMOS transistors.

[0130] also, Figure 4 The number of pixel transistors and capacitors shown are merely examples and can be varied depending on the implementation.

[0131] Figure 5 This is a timing diagram illustrating an example of coupling occurring in a demultiplexing switch structure.

[0132] Reference Figure 5 In the implementation, the data comes from the data drive (e.g., Figure 2 The first and second data signals of the data driver chip (DIC) can be based on the data distributor (e.g., Figure 2 The first allocation selection signal of the data distributor (DXA) (e.g., Figure 5 CLA) and second allocation selection signal (e.g., Figure 5 The output is the CLB.

[0133] For example, coupling may occur between the first allocation selection signal and the second allocation selection signal.

[0134] For example, CLA can output green pixel data. CLB can output red pixel data and blue pixel data.

[0135] However, this disclosure is not limited thereto. For example, the CLA can output red pixel data and blue pixel data. The CLB can output green pixel data.

[0136] The color of the data to be demultiplexed by the CLA can be GG. For example, the data can be applied to the first data line DL1. For example, the color of the data to be demultiplexed by the CLB can be RB. The data can be applied to the second data line DL2. For example, the color of the data to be demultiplexed at the first scan timing can be R, and the color of the data to be demultiplexed at the second scan timing can be G. However, this disclosure is not limited thereto.

[0137] The timing of gate signal being turned on at its location (e.g., Figure 5 The GW ON can be synchronized with the timing of the CLA maintaining a low or high level therein and the timing of the CLB changing from a high level to a low level or from a low level to a high level therein.

[0138] like Figure 5 The timing depicted, where the gate signal is turned on, may include a first timing sequence and a second timing sequence. The brightness of the green pixel (G) may be increased due to coupling at the first timing sequence (see dashed line). Therefore, display quality may degrade. For example, the image may appear green.

[0139] However, this is illustrative and the disclosure is not limited thereto. For example, the disclosure can prevent distortion of image quality caused by the coupling of the first allocation selection signal and the second allocation selection signal.

[0140] In embodiments, the display device 1000 according to embodiments of the present disclosure can group data corresponding to CLA and CLB. For example, such as Figure 3 As described, demultiplexed data from the CLA can be applied to the first data line DL1 and the third data line DL3, and demultiplexed data from the CLB can be applied to the second data line DL2 and the fourth data line DL4. Therefore, degradation of display quality due to coupling can be prevented.

[0141] Furthermore, the data output path synchronized with the CLA and the data output path synchronized with the CLB can be separated from each other. For example, as Figure 3 As depicted, the first power line PL1 can be arranged between the first data connection line group (e.g., the first data line DL1 and the third data line DL3) and the second data connection line group (e.g., the second data line DL2 and the fourth data line DL4). Therefore, degradation of display quality due to coupling can be further prevented.

[0142] Figure 6 , Figure 7 , Figure 8 , Figure 9 , Figure 10 , Figure 11 and Figure 12 This is a view showing an embodiment of the conductors and power lines.

[0143] Figure 6 , Figure 7 and Figure 8 It is along Figure 3 A cross-sectional view of the display device according to the first embodiment of the present disclosure, taken by line I-I'. Figure 9 It is along Figure 3 A cross-sectional view of the display device according to the second embodiment of the present disclosure, taken by line I-I'. Figure 10 , Figure 11 and Figure 12 It is along Figure 3 A cross-sectional view of the display device according to the third embodiment of the present disclosure, taken by line I-I'.

[0144] In an embodiment, in a cross-sectional view, each of the display devices according to embodiments of the present disclosure may include a substrate SUB, a plurality of electrodes, and a plurality of insulating layers. For example, the plurality of insulating layers may insulate the plurality of electrodes from each other.

[0145] The substrate SUB can be an insulating substrate formed of a transparent or opaque material. For example, the substrate SUB can include plastic and be flexible.

[0146] In the implementation method, refer to the above. Figure 1Similarly, the substrate SUB may include a display area and a peripheral area adjacent to the display area. The peripheral area may include a first peripheral area, a flexible area, and an integrated circuit area positioned adjacent to the display area in one direction.

[0147] Reference Figure 6 In the cross-sectional view, the display device according to the first embodiment of this disclosure may include a first pattern EP1, a first contact pattern CE1, a third pattern EP3, a fourth pattern EP4, a fifth pattern EP5, a sixth pattern EP6, a second contact pattern CE2, a third contact pattern CE3, a fourth contact pattern CE4, a first insulating layer IL1, a second insulating layer IL2, a third insulating layer IL3, a third insulating layer IL4, and a fifth insulating layer IL5 on a substrate SUB. For example, Figure 3 The first data connection line group includes first data connection line DCL1 and third data connection line DCL3, which can correspond to third pattern EP3 and fourth pattern EP4. The second data connection line group includes second data connection line DCL2 and fourth data connection line DCL4, which can correspond to fifth pattern EP5 and sixth pattern EP6. First conductor PL1 can correspond to second contact pattern CE2. Second conductor PL2 can correspond to third contact pattern CE3.

[0148] References will be omitted or simplified in the following text. Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 The described display device (e.g., Figure 2 Overlapping description of the display device 1000.

[0149] The first pattern EP1 may be disposed on the substrate SUB. For example, the first pattern EP1 may include oxide semiconductors, silicon semiconductors, organic semiconductors, etc. For example, the oxide semiconductor may include at least one oxide of indium (In), gallium (Ga), tin (Sn), zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium (Ge), chromium (Cr), titanium (Ti), and zinc (Zn). The silicon semiconductor may include amorphous silicon, polycrystalline silicon, etc.

[0150] In one embodiment, a first insulating layer IL1 covering the first pattern EP1 may be disposed on a substrate SUB. For example, the first insulating layer IL1 may comprise an inorganic insulating material.

[0151] A first contact pattern CE1 may be disposed on a first pattern EP1. The first contact pattern CE1 may penetrate the first insulating layer IL1 and contact the first pattern EP1. For example, the first contact pattern CE1 may include a conductive material. For example, the conductive material may include a metal, an alloy, a conductive metal nitride, a conductive metal oxide, a transparent conductive material, etc. For example, the first contact pattern CE1 may include molybdenum (Mo). However, this disclosure is not limited thereto.

[0152] In one embodiment, a second insulating layer IL2 covering the first contact pattern CE1 may be disposed on the first insulating layer IL1. A third insulating layer IL3 may be disposed on the second insulating layer IL2. For example, each of the second insulating layer IL2 and the third insulating layer IL3 may comprise an inorganic insulating material.

[0153] Each of the third pattern EP3, the fourth pattern EP4, the fifth pattern EP5, the sixth pattern EP6, the second contact pattern CE2, and the third contact pattern CE3 may be arranged on the first contact pattern CE1. For example, each of the third pattern EP3, the fourth pattern EP4, the fifth pattern EP5, the sixth pattern EP6, the second contact pattern CE2, and the third contact pattern CE3 may include a conductive material. For example, each of the third pattern EP3, the fourth pattern EP4, the fifth pattern EP5, the sixth pattern EP6, the second contact pattern CE2, and the third contact pattern CE3 may include aluminum (Al). However, this disclosure is not limited thereto.

[0154] In an implementation, the first data connection line group (e.g., the third pattern EP3 and the fourth pattern EP4), the second data connection line group (e.g., the fifth pattern EP5 and the sixth pattern EP6) and the wires (e.g., the second contact pattern CE2 and the third contact pattern CE3) may be positioned on the same layer.

[0155] In one embodiment, the conductor (e.g., the second contact pattern CE2 and the third contact pattern CE3) can penetrate the third insulating layer IL3 and the second insulating layer IL2 and contact the first contact pattern CE1.

[0156] In an implementation, the wires (e.g., the second contact pattern CE2 and the third contact pattern CE3) may be arranged between the first data connection line group (e.g., the third pattern EP3 and the fourth pattern EP4) and the second data connection line group (e.g., the fifth pattern EP5 and the sixth pattern EP6).

[0157] In one embodiment, a fourth insulating layer IL4 covering the first data connection line group, the second data connection line group, and the conductors may be disposed on the third insulating layer IL3. For example, the fourth insulating layer IL4 may comprise an inorganic insulating material.

[0158] A fourth contact pattern CE4 may be disposed on the first data connection line group, the second data connection line group, and the conductor. In an embodiment, a first electrical voltage may be applied to the fourth contact pattern CE4. (Hereinafter, for the convenience of description, the fourth contact pattern CE4 is also referred to as the fourth power line). In other words, in an embodiment, the fourth power line (i.e., the fourth contact pattern CE4) may be disposed on a different layer from the first data connection line group (e.g., the third pattern EP3 and the fourth pattern EP4) and the second data connection line group (e.g., the fifth pattern EP5 and the sixth pattern EP6), and may be electrically connected to the conductor (e.g., the second contact pattern CE2 and the third contact pattern CE3) through contact holes, and provides the first electrical voltage.

[0159] In one embodiment, a fifth insulating layer IL5 covering the fourth power line (i.e., the fourth contact pattern CE4) may be disposed on the fourth insulating layer IL4. For example, the fifth insulating layer IL5 may comprise an organic insulating material.

[0160] In one embodiment, an additional power line (e.g., first pattern EP1 and first contact pattern CE1) may be included in a layer different from the fourth insulating layer IL4 and the fifth insulating layer IL5, electrically connected to the conductors (e.g., second contact pattern CE2 and third contact pattern CE3) via contact holes. In another embodiment, the additional power line (e.g., first pattern EP1 and first contact pattern CE1) may be arranged below the fourth power line (e.g., fourth contact pattern CE4).

[0161] A first electrical voltage may be provided to an additional power line. In an embodiment, the additional power line may include a first power line (e.g., a first pattern EP1) and a second power line (e.g., a first contact pattern CE1). The first power line may be covered by a first insulating layer IL1. The second power line may be covered by a second insulating layer IL2 and may be electrically connected to the first power line and the conductor via a contact hole.

[0162] In some implementations, the additional power lines can be formed over a large area in order to minimize line resistance.

[0163] In an implementation, in a cross-sectional view, the width of the fourth power line (e.g., the fourth contact pattern CE4) may be greater than the width of each of the conductors (e.g., each of the second contact pattern CE2 and the third contact pattern CE3).

[0164] In one embodiment, the additional electric lines (e.g., the first pattern EP1 and the first contact pattern CE1) disposed below the fourth electric line may include a first metal, and the fourth electric line (e.g., the fourth contact pattern CE4) may include a second metal different from the first metal. In another embodiment, the resistivity of the second metal may be less than that of the first metal. For example, the first metal may include molybdenum (Mo), and the second metal may include aluminum (Al). However, this disclosure is not limited thereto.

[0165] In the implementation method, refer to Figure 7 In the cross-sectional view, the display device according to the first embodiment may include a first pattern EP1, a first contact pattern CE11, a third pattern EP3, a fourth pattern EP4, a fifth pattern EP5, a sixth pattern EP6, a second contact pattern CE21, a third contact pattern CE31, a fourth contact pattern CE4, a first insulating layer IL1, a second insulating layer IL2, a third insulating layer IL3, a fourth insulating layer IL4, and a fifth insulating layer IL5.

[0166] Figure 7 Display device and Figure 6 The difference in the display device is that the first pattern EP1 covered by the first insulating layer IL1 is in contact with the first contact pattern CE11 covered by the third insulating layer IL3.

[0167] In one embodiment, an additional power line may be arranged below the fourth power line (i.e., the fourth contact pattern CE4). In another embodiment, the additional power line may include a first power line (e.g., the first pattern EP1) and a third power line (e.g., the first contact pattern CE11). The first power line may be covered by a first insulating layer IL1. The third power line may be covered by a third insulating layer IL3. The third power line may be electrically connected to the first power line and conductors (e.g., the second contact pattern CE21 and the third contact pattern CE31) through contact holes.

[0168] In some implementations, the additional power lines can be formed over a large area in order to minimize line resistance.

[0169] In one implementation, a first electrical voltage may be provided to an additional power line (e.g., a first pattern EP1 and a first contact pattern CE11).

[0170] In an implementation, in a cross-sectional view, the width of the fourth power line (e.g., the fourth contact pattern CE4) may be greater than the width of each of the conductors (e.g., each of the second contact pattern CE21 and the third contact pattern CE31).

[0171] In one embodiment, the additional electric field lines (e.g., the first pattern EP1 and the first contact pattern CE11) disposed below the fourth electric field line may include a first metal, and the fourth electric field line (e.g., the fourth contact pattern CE4) may include a second metal different from the first metal. In another embodiment, the resistivity of the second metal may be less than that of the first metal.

[0172] In the implementation method, refer to Figure 8 According to the first embodiment of the present disclosure, the display device may include a second pattern EP2, a first contact pattern CE12, a third pattern EP3, a fourth pattern EP4, a fifth pattern EP5, a sixth pattern EP6, a second contact pattern CE22, a third contact pattern CE33, a fourth contact pattern CE4, a first insulating layer IL1, a second insulating layer IL2, a third insulating layer IL3, a fourth insulating layer IL4, and a fifth insulating layer IL5 on a substrate SUB.

[0173] Figure 8 Display device and Figure 6 The difference in the display device is that the second pattern EP2, which is covered by the second insulating layer IL2, is in contact with the first contact pattern CE12, which is covered by the third insulating layer IL3.

[0174] In one embodiment, an additional power line may be arranged below the fourth power line (i.e., the fourth contact pattern CE4). In another embodiment, the additional power line may include a second power line (e.g., the second pattern EP2) and a third power line (e.g., the first contact pattern CE12). The second power line may be covered by a second insulating layer IL2. The third power line may be covered by a third insulating layer IL3. The third power line may be electrically connected to the second power line and conductors (e.g., the second contact pattern CE22 and the third contact pattern CE33) through contact holes.

[0175] In some implementations, the additional power lines can be formed over a large area in order to minimize line resistance.

[0176] In one implementation, a first electrical voltage may be provided to an additional power line (e.g., a second pattern EP2 and a first contact pattern CE12).

[0177] In an implementation, in a cross-sectional view, the width of the fourth power line (e.g., the fourth contact pattern CE4) may be greater than the width of each of the conductors (e.g., each of the second contact pattern CE22 and the third contact pattern CE33).

[0178] In one embodiment, the additional electric field lines (e.g., the second pattern EP2 and the first contact pattern CE12) disposed below the fourth electric field line may include a first metal, and the fourth electric field line (e.g., the fourth contact pattern CE4) may include a second metal different from the first metal. In another embodiment, the resistivity of the second metal may be less than that of the first metal.

[0179] In the implementation method, refer to Figure 6 and Figure 9 The display device according to the second embodiment of this disclosure may include a third pattern EP3, a fourth pattern EP4, a fifth pattern EP5, a sixth pattern EP6, a second contact pattern CE2, a third contact pattern CE3, a fourth contact pattern CE4, a seventh pattern EP7, a first insulating layer IL1, a second insulating layer IL2, a third insulating layer IL3, a fourth insulating layer IL4, a fifth insulating layer IL5, and a sixth insulating layer IL6. For ease of explanation, the first to third insulating layers (IL1, IL2, and IL3) are omitted. Figure 6 Those overlapping descriptions.

[0180] Figure 9 Display device and Figure 6 The difference in the display device is that it also includes a seventh pattern EP7 arranged on the fourth contact pattern CE4.

[0181] In some embodiments, the fourth power line (e.g., the fourth contact pattern CE4) may also include additional power lines. For example, a fifth power line (e.g., the seventh pattern EP7) may be arranged on the fourth power line. For example, the fifth power line may include a conductive material.

[0182] In one embodiment, a sixth insulating layer IL6 may be disposed on top of a fifth insulating layer IL5. The sixth insulating layer IL6 may cover the fifth electric field line. For example, the sixth insulating layer IL6 may comprise an organic insulating material.

[0183] In an implementation, the first power voltage may be supplied to an additional power line (e.g., pattern EP7).

[0184] In an implementation, in a cross-sectional view, the width of the fourth power line (e.g., the fourth contact pattern CE4) may be greater than the width of each of the conductors (e.g., each of the second contact pattern CE2 and the third contact pattern CE3).

[0185] In an implementation, additional power lines (e.g., seventh pattern EP7) disposed on the fourth power line may include a first metal, and additional power lines (e.g., below the fourth power line (e.g., fourth contact pattern CE4) may be disposed below the fourth power line (e.g., fourth contact pattern CE4). Figure 6 First pattern EP1 or Figure 6The first contact pattern (CE1) may include a second metal different from the first metal. In an embodiment, the resistivity of the second metal may be greater than that of the first metal.

[0186] In some implementations, the additional power lines can be formed over a large area in order to minimize line resistance.

[0187] In the implementation, Figure 9 The display device can have more than Figure 6 , Figure 7 and Figure 8 The display device has a significant effect on reducing line resistance, but may require more masks. Because the additional power lines arranged on the fourth power line include a metal (e.g., a first metal) with a lower resistivity than the additional power lines arranged below the fourth power line, the line resistance of the fourth power line can be much lower than if the additional power lines on the fourth power line were not included.

[0188] In the implementation method, refer to Figure 10 , Figure 11 and Figure 12 In the cross-sectional view, the display device according to the third embodiment may include a first pattern on the substrate SUB. Figure 10 EP13, Figure 11 EP14 or Figure 12 EP15), third pattern EP3, fourth pattern EP4, fifth pattern EP5, sixth pattern EP6, second contact pattern ( Figure 10 CE23, Figure 11 CE24 or Figure 12 CE25), third contact pattern ( Figure 10 CE33, Figure 11 CE34 or Figure 12 The fourth contact pattern CE4, the first insulating layer IL1, the second insulating layer IL2, the third insulating layer IL3, the fourth insulating layer IL4 and the fifth insulating layer IL5.

[0189] Figure 10 , Figure 11 and Figure 12 Display device and Figure 6 The difference in the display device is that the arrangement of the second contact pattern is omitted. Figure 6 CE2, Figure 10 CE23, Figure 11 CE24 or Figure 12 CE25) and third contact pattern ( Figure 6 CE3, Figure 10 CE33, Figure 11 CE34 or Figure 12 The first contact pattern CE1 below CE35.

[0190] In the implementation method, such as Figure 10 As depicted, the additional power lines arranged below the fourth power line may be covered by the first insulating layer IL1 and may include a first power line (e.g., first pattern EP13) electrically connected to the conductor (e.g., second contact pattern CE23 and third contact pattern CE33) through contact holes. However, this disclosure is not limited thereto.

[0191] In the implementation method, such as Figure 11 As depicted, the additional power lines arranged below the fourth power line may be covered by the second insulation layer IL2, and may include a second power line (e.g., the first pattern EP14) electrically connected to the conductor (e.g., the second contact pattern CE24 and the third contact pattern CE34) through contact holes.

[0192] In the implementation method, such as Figure 12 As depicted, the additional power lines arranged below the fourth power line may be covered by the third insulating layer IL3, and may include a third power line (e.g., the first pattern EP15) electrically connected to the conductor (e.g., the second contact pattern CE25 and the third contact pattern CE35) through contact holes.

[0193] In an implementation, to minimize line resistance, an additional power line (e.g., ) is arranged below the fourth power line. Figure 10 First pattern EP13 Figure 11 First pattern EP14 or Figure 12 The first pattern (EP15) can be formed in a large area.

[0194] In an implementation, the first power voltage may be provided to an additional power line (e.g., Figure 10 First pattern EP13 Figure 11 First pattern EP14 or Figure 12 The first pattern (EP15).

[0195] In an implementation, in a cross-sectional view, the width of the fourth electric field line (e.g., the fourth contact pattern CE4) may be greater than that of the conductor (e.g., the second contact pattern CE4). Figure 6 CE2, Figure 10 CE23, Figure 11 CE24, or Figure 12 CE25) and third contact pattern ( Figure 6 CE3, Figure 10 CE33, Figure 11 CE34 or Figure 12 The width of each in CE35).

[0196] In the implementation, an additional power line (e.g., arranged below the fourth power line) is provided. Figure 10 First pattern EP13 Figure 11 First pattern EP14 or Figure 12 The first pattern (EP15) may include a first metal, and the fourth power line (e.g., the fourth contact pattern CE4) may include a second metal different from the first metal. In an embodiment, the resistivity of the second metal may be less than that of the first metal.

[0197] In the implementation method, with Figure 6 , Figure 7 and Figure 8 Compared to display devices, Figure 10 , Figure 11 and Figure 12 The display device may not include the first contact pattern CE1. Therefore, fewer masks can be used in the manufacturing process of the display device, and the coupling effect between other lines (e.g., data lines) can be minimized.

[0198] As described above, in the display device according to embodiments of the present disclosure, conductors may be arranged between groups of data connection lines (e.g., a first group of data connection lines and a second group of data connection lines) that can branch from the data distributor DXA below the flexible region BA, and additional power lines (e.g., at least one or a combination of the first power line, the second power line, the third power line, and the fifth power line) with a large contact area with the fourth power line may be arranged. Therefore, coupling between the CLA / CLB output signals can be prevented, and the increase in resistance of the fourth power line can be minimized.

[0199] Furthermore, additional power lines (e.g., a first power line, a second power line, a third power line, or a fifth power line) can be arranged on / below the fourth power line. This prevents coupling between the CLA / CLB output signals and minimizes the increase in resistance of the fourth power line. Additionally, the resistivity of the metallic material included in the additional power lines (e.g., the fifth power line) arranged on the conductor can be lower than the resistivity of the metallic material included in the additional power lines (e.g., the first, second, or third power lines) arranged below the conductor. This further minimizes the increase in resistance of the power lines.

[0200] Figure 13 This is a block diagram illustrating an electronic device according to an embodiment of the present disclosure. Figure 14 It is shown that Figure 13 A diagram illustrating an example of an electronic device implemented as a smartphone.

[0201] Reference Figure 13 and Figure 14 Electronic devices may include Figure 2The display device 1000. The electronic device may include a processor 1010, a memory device 1020, a storage device 1030, an input / output (I / O) device 1040, a power supply 1050, and a display device 1060. Here, the display device 1060 may be... Figure 1 and Figure 2 The display device 1000. In addition, the electronic device may include multiple ports for communication with video cards, sound cards, memory cards, universal serial bus (USB) devices, other electronic devices, etc.

[0202] In the implementation method, such as Figure 14 The electronic device depicted can be a smartphone. However, this is illustrative, and the electronic device is not limited to this. For example, the electronic device can be a cellular phone, video phone, smartboard, smartwatch, tablet PC, car navigation system, computer monitor, laptop computer, head-mounted display (HMD) device, etc.

[0203] The processor 1010 can be a microprocessor, a central processing unit (CPU), an application processor (AP), etc. The processor 1010 can be coupled to other components via address buses, control buses, data buses, etc. Furthermore, the processor 1010 can be coupled to an expansion bus, such as a peripheral component interconnect (PCI) bus.

[0204] Processor 1010 can output input image data IMG and input control signal CONT to Figure 1 The drive controller 200.

[0205] The memory device 1020 can store data for the operation of an electronic device. For example, the memory device 1020 may include: at least one non-volatile memory device, such as an erasable programmable read-only memory (EPROM) device, an electrically erasable programmable read-only memory (EEPROM) device, a flash memory device, a phase-change random access memory (PRAM) device, a resistive random access memory (RRAM) device, a nano-floating gate memory (NFGM) device, a polymer random access memory (PoRAM) device, a magnetic random access memory (MRAM) device, a ferroelectric random access memory (FRAM) device, etc.; or at least one volatile memory device, such as a dynamic random access memory (DRAM) device, a static random access memory (SRAM) device, a mobile DRAM, etc.

[0206] Storage device 1030 may include solid-state drive (SSD) devices, hard disk drive (HDD) devices, CD-ROM devices, etc. I / O device 1040 may include input devices such as keyboards, keypads, mice, touchpads, touchscreens, etc., and output devices such as printers, speakers, etc. In some embodiments, display device 1060 may be included in I / O device 1040. Power supply 1050 provides power for the operation of the electronic device. Display device 1060 may be coupled to other components via a bus or other communication link.

[0207] Figure 15 It is shown Figure 14 A view of an implementation of a smartphone in a bent state.

[0208] Reference Figure 2 , Figure 14 and Figure 15 In one embodiment, the display device 1000 (e.g., a smartphone) may include a substrate SUB. A bending line BL may be defined in a bendable region BA of the substrate SUB. The substrate SUB may be folded along the bending line BL.

[0209] In the implementation, in the cross-sectional view, the circuit layer CL, the display element layer PXL, the input sensing layer ISP, the anti-reflection layer RPL, and the window WN can be arranged on the substrate SUB in a state where the substrate SUB is folded along the bending line BL.

[0210] The circuit layer CL can be disposed on the substrate SUB. For example, the circuit layer CL may include at least one insulating layer, driving elements, signal lines, and signal pads. For this purpose, patterns and semiconductor patterns can be disposed in the circuit layer CL. The insulating layer, semiconductor layer, and conductor layer are formed by a patterning process, and the insulating layer, driving elements, signal lines, and signal pads are also formed.

[0211] The display element layer PXL can be disposed on the circuit layer CL. The display element layer PXL may include a plurality of pixels arranged to overlap with the display area AA (e.g., Figure 1 (Pixels PX). Each of the multiple pixels can be electrically connected to a driving element and can output light according to the signal from the driving element.

[0212] Therefore, a display panel comprising a circuit layer CL and a display element layer PXL arranged sequentially on a substrate SUB can be formed.

[0213] The input sensing layer ISP can be disposed on the display panel. The input sensing layer ISP can be disposed on the display panel without additional adhesive members. However, this disclosure is not limited thereto. After the input sensing layer ISP is formed separately, adhesive members can be used to attach the input sensing layer ISP to the display panel.

[0214] The input sensing layer ISP can detect external input applied from outside the display device 1000 and acquire the coordinate information of the external input. For example, the input sensing layer ISP can be driven in various ways (including capacitive, resistive, infrared, pressure, etc.). However, this disclosure is not limited thereto.

[0215] An anti-reflective layer RPL can be disposed on the input sensing layer ISP. The anti-reflective layer RPL can be disposed on the input sensing layer ISP without additional adhesive members. However, this disclosure is not limited thereto. After the anti-reflective layer RPL is formed separately, adhesive members can be used to attach the anti-reflective layer RPL to the input sensing layer ISP.

[0216] An anti-reflective layer RPL reduces the reflectivity of external light incident from the top of the display device 1000. For example, the anti-reflective layer RPL may include a phase retarder, a polarizer, and a color filter. These may be used individually or in combination with each other. However, this disclosure is not limited thereto.

[0217] Therefore, a display module comprising an input sensing layer (ISP) and an anti-reflective layer (RPL) arranged sequentially on a display panel can be formed.

[0218] A window (WN) can be placed on the display module. The window (WN) can cover the display module to protect it from external impacts. For example, the window (WN) can include glass, sapphire, polymer, etc. These can be used individually or in combination.

[0219] In the implementation, in a side view, with the substrate SUB folded along the bend line BL, the data distributor DXA and the data driver (e.g., Figure 2 The data driver chip (DIC), bending protective layer (BPL), and lower component (CSL) can be arranged under the substrate (SUB).

[0220] The bend protection layer BPL can be arranged at a position corresponding to the bendable area BA. Therefore, when the display device 1000 is bent, tensile stress can be released to protect the bendable area BA.

[0221] The lower component CSL can be disposed on the rear surface of the display panel. The lower component CSL may include cushioning material. For example, the cushioning material may include sponge, foam, polyurethane resin, flexible polymer material, etc. These can be used alone or in combination with each other. The lower component CSL protects the rear surface of the display panel from external impacts.

[0222] However, Figure 15 For illustrative purposes, the components of the display device 1000 may be modified in various ways (e.g., replaced or omitted).

[0223] Figure 16 This is a block diagram illustrating an electronic device according to an embodiment of the present disclosure.

[0224] Reference Figure 16 The electronic device 101 outputs various information through the display module 140 in the operating system. When the processor 110 runs the application stored in the memory 120, the display module 140 provides the application information to the user through the display panel 141.

[0225] The processor 110 receives external input via the input module 130 or the sensor module 161 and runs the application corresponding to the external input. For example, when a user selects the camera icon displayed on the display panel 141, the processor 110 receives user input via the input sensor 161-2 and activates the camera module 171. The processor 110 transmits the image data corresponding to the captured image obtained by the camera module 171 to the display module 140. The display module 140 can display the image corresponding to the captured image via the display panel 141.

[0226] In this implementation, when personal information authentication is performed in the display module 140, the fingerprint sensor 161-1 obtains the input fingerprint information as input data. The processor 110 compares the input data obtained by the fingerprint sensor 161-1 with the authentication data stored in the memory 120, and runs the application based on the comparison result. The display module 140 can display the information executed according to the application logic via the display panel 141.

[0227] In this implementation, when a music stream icon displayed on the display module 140 is selected, the processor 110 obtains user input through the input sensor 161-2 and activates the music stream application stored in the memory 120. When a music run command is entered in the music stream application, the processor 110 activates the sound output module 163 to provide the user with the sound information corresponding to the music run command.

[0228] The operation of electronic device 101 has been briefly described above. The configuration of electronic device 101 is described in detail below. Some of the components of electronic device 101, described later, may be integrated and provided as a single component, or a single component may be separated into two or more components.

[0229] Electronic device 101 can communicate with external electronic device 102 via a network (e.g., a short-range wireless communication network or a long-range wireless communication network). According to embodiments, electronic device 101 may include a processor 110, a memory 120, an input module 130, a display module 140, a power module 150, an embedded module 160, and an external module 170. According to embodiments, at least one of the above-mentioned components may be omitted from electronic device 101, or one or more other devices may be added. According to embodiments, some of the above-mentioned components (e.g., sensor module 161, antenna module 162, or audio output module 163) may be integrated into another component (e.g., display module 140).

[0230] The processor 110 can run software to control at least one other element (e.g., hardware or software element) connected to the electronic device 101 and perform various data processing or operations. According to embodiments, as at least part of the data processing or operation, the processor 110 can store instructions or data received from other elements (e.g., input module 130, sensor module 161, or communication module 173) in volatile memory 121, can process the instructions or data stored in volatile memory 121, and can store the result data of the processing in non-volatile memory 122.

[0231] Processor 110 may include a main processor 111 and an auxiliary processor 112. Main processor 111 may include at least one of a central processing unit (CPU) 111-1 and an application processor (AP). Main processor 111 may also include any one or more of a graphics processing unit (GPU) 111-2, a communication processor (CP), and an image signal processor (ISP). Main processor 111 may also include a neural network processing unit (NPU) 111-3. Neural network processing unit 111-3 is a processor specifically designed for processing artificial intelligence models. Artificial intelligence models can be generated through machine learning. Artificial intelligence models may include multiple artificial neural networks. Artificial neural networks may be one or more of deep neural networks (DNN), convolutional neural networks (CNN), recurrent neural networks (RNN), restricted Boltzmann machines (RBM), deep belief networks (DBN), bidirectional recurrent deep neural networks (BRDNN), and deep Q-networks, or a combination of two or more of these. However, artificial neural networks are not limited to the examples above. In addition to hardware architecture, artificial intelligence models may also include software architecture, or, instead of hardware architecture, may include software architecture. At least two of the aforementioned processing units and processors may be implemented as integrated elements (e.g., a single chip), or each may be implemented as an independent element (e.g., implemented as multiple chips).

[0232] The auxiliary processor 112 may include a controller. The controller may include interface conversion circuitry and timing control circuitry. The controller receives image signals from the main processor 111, converts the data format of the image signals to meet the interface specifications with the display module 140, and outputs the image data. The controller may output various control signals for driving the display module 140.

[0233] The auxiliary processor 112 may also include a data conversion circuit 112-2, a gamma correction circuit 112-3, and a rendering circuit 112-4. The data conversion circuit 112-2 receives image data from the controller and can compensate the image data to display the image at a desired brightness based on the characteristics of the electronic device 101 or user settings, or can convert the image data to reduce power consumption or compensate for image retention. The gamma correction circuit 112-3 converts image data or a gamma reference voltage to give the image displayed on the electronic device 101 the desired gamma characteristics. The rendering circuit 112-4 receives image data from the controller and can render the image data based on the pixel arrangement of the display panel 141 included in the electronic device 101. At least one of the data conversion circuit 112-2, the gamma correction circuit 112-3, and the rendering circuit 112-4 may be integrated into another component (e.g., the main processor 111 or the controller). At least one of the data conversion circuit 112-2, the gamma correction circuit 112-3, and the rendering circuit 112-4 may be integrated into the data driver 143, which will be described later.

[0234] The memory 120 may store various data used by at least one element of the electronic device 101 (e.g., processor 110 or sensor module 161), as well as input or output data for commands associated therewith. The memory 120 may include at least one of volatile memory 121 and non-volatile memory 122.

[0235] The input module 130 can receive commands or data from outside the electronic device 101 (e.g., from a user or external electronic device 102) for components of the electronic device 101 (e.g., processor 110, sensor module 161, or sound output module 163).

[0236] Input module 130 may include a first input module 131 for receiving commands or data from a user and a second input module 132 for receiving commands or data from an external electronic device 102. The first input module 131 may include a microphone, mouse, keyboard, buttons (e.g., keypads), or pen (e.g., a passive or active pen). The second input module 132 may support a specified protocol that enables wired or wireless connection to the external electronic device 102. According to embodiments, the second input module 132 may include an High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, an SD card interface, or an audio interface. The second input module 132 may include a connector physically connected to the external electronic device 102, such as an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0237] Display module 140 visually presents information to the user. Display module 140 may include display panel 141, scan driver 142, and data driver 143. Display module 140 may also include a window, chassis, and bracket to protect display panel 141.

[0238] Display panel 141 may include a liquid crystal display panel, an organic light-emitting display panel, or an inorganic light-emitting display panel. There are no particular limitations on the type of display panel 141. Display panel 141 may be rigid or flexible, capable of being rolled or folded. Display module 140 may also include a support member or heat dissipation member supporting the display panel 141.

[0239] The scan driver 142 may be mounted as a driver chip on the display panel 141. Alternatively, the scan driver 142 may be integrated on the display panel 141. For example, the scan driver 142 may include an amorphous silicon TFT gate driver circuit (ASG), a low-temperature polycrystalline silicon (LTPS) TFT gate driver circuit, or an oxide semiconductor TFT gate driver circuit (OSG) integrated on the display panel 141. The scan driver 142 receives control signals from the controller and outputs scan signals to the display panel 141 in response to the control signals.

[0240] The display module 140 may further include a light-emitting driver. The light-emitting driver outputs a light-emitting control signal to the display panel 141 in response to a control signal received from the controller. The light-emitting driver may be formed independently of the scan driver 142. Alternatively, the light-emitting driver and the scan driver 142 may be formed integrally.

[0241] The data driver 143 receives a control signal from the controller and, in response to the control signal, converts the image data into an analog voltage (e.g., a data voltage) and outputs the data voltage to the display panel 141.

[0242] The data driver 143 can be integrated into another component (e.g., a controller). The functions of the interface conversion circuitry and timing control circuitry of the controller described above can be integrated into the data driver 143.

[0243] The display module 140 may also include a voltage generation circuit. The voltage generation circuit can output various voltages for driving the display panel 141.

[0244] Power module 150 supplies power to components of electronic device 101. Power module 150 may include a battery that supplies power voltage. The battery may include a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. Power module 150 may include a power management integrated circuit (PMIC). The PMIC optimizes the power supply to each of the modules described above and later. Power module 150 may include a wireless power transmitting / receiving component electrically connected to the battery. The wireless power transmitting / receiving component may include multiple antenna radiators in the form of coils.

[0245] The electronic device 101 may also include an embedded module 160 and an external module 170. The embedded module 160 may include a sensor module 161, an antenna module 162, and a sound output module 163. The external module 170 may include a camera module 171, an optical module 172, and a communication module 173.

[0246] Sensor module 161 can detect input via the user's body or via a pen in the first input module 131 and generate an electrical signal or data value corresponding to the input. Sensor module 161 may include at least one of fingerprint sensor 161-1, input sensor 161-2, and digitizer 161-3.

[0247] The fingerprint sensor 161-1 can generate data values ​​corresponding to a user's fingerprint. The fingerprint sensor 161-1 may include one of an optical fingerprint sensor and a capacitive fingerprint sensor.

[0248] Input sensor 161-2 generates data values ​​corresponding to coordinate information of input via the user's body or via a pen. Input sensor 161-2 generates data values ​​from capacitance changes caused by the input. Input sensor 161-2 can detect input via a passive pen, or send data to / receive data from an active pen.

[0249] Input sensor 161-2 can measure biosignals such as blood pressure, water content, or body fat. For example, when a user touches a part of their body to the sensor layer or sensing panel and does not move it for a certain period of time, input sensor 161-2 can detect biosignals based on changes in the electric field caused by the body part, so that display module 140 can output the information desired by the user.

[0250] The digitizer 161-3 generates data values ​​corresponding to coordinate information input via a pen. The digitizer 161-3 generates data values ​​from electromagnetic changes caused by the input. The digitizer 161-3 can detect input via a passive pen, or send data to / receive data from an active pen.

[0251] At least one of the fingerprint sensor 161-1, input sensor 161-2, and digitizer 161-3 can be formed as a sensor layer on the display panel 141 via a continuous process. The fingerprint sensor 161-1, input sensor 161-2, and digitizer 161-3 can be arranged on the display panel 141. At least one of the fingerprint sensor 161-1, input sensor 161-2, and digitizer 161-3 (e.g., digitizer 161-3) can be arranged below the display panel 141.

[0252] Two or more of the fingerprint sensor 161-1, input sensor 161-2, and digitizer 161-3 can be integrated into the sensing panel through the same process. When two or more of the fingerprint sensor 161-1, input sensor 161-2, and digitizer 161-3 are integrated into the sensing panel, the sensing panel can be arranged between the display panel 141 and a window arranged on the upper surface of the display panel 141. According to an embodiment, the sensing panel can be arranged on the window. The inventive concept is not limited to the position of the sensing panel.

[0253] At least one of the fingerprint sensor 161-1, the input sensor 161-2, and the digitizer 161-3 may be embedded in the display panel 141. For example, at least one of the fingerprint sensor 161-1, the input sensor 161-2, and the digitizer 161-3 may be formed simultaneously with the display panel 141 through the process of forming the elements (e.g., light-emitting elements, transistors, etc.) included in the display panel 141.

[0254] In addition, sensor module 161 can generate electrical signals or data values ​​corresponding to the internal or external states of electronic device 101. For example, sensor module 161 may also include a gesture sensor, gyroscope sensor, barometric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biosensor, temperature sensor, humidity sensor, or illuminance sensor.

[0255] Antenna module 162 may include one or more antennas for transmitting or receiving signals or power to or from an external source. According to an embodiment, communication module 173 may transmit or receive signals to or from external electronic device 102 via an antenna suitable for a communication method. The antenna pattern of antenna module 162 may be integrated with elements of display module 140 (e.g., display panel 141) or input sensors 161-2.

[0256] The sound output module 163 is a means for outputting sound signals to the outside of the electronic device 101. For example, the sound output module 163 may include a speaker for general purposes such as playing multimedia or recording, and an answering machine specifically for receiving calls. According to embodiments, the answering machine may be integrated with the speaker or formed separately from the speaker. The sound output pattern of the sound output module 163 may be integrated with the display module 140.

[0257] Camera module 171 can capture still images and moving images. According to one embodiment, camera module 171 may include one or more lenses, an image sensor, or an image signal processor. Camera module 171 may also include an infrared camera capable of determining the presence or absence of a user, the user's location, and the user's gaze.

[0258] The optical module 172 can provide light. The optical module 172 may include a light-emitting diode or a xenon lamp. The optical module 172 can operate in conjunction with the camera module 171 or operate independently.

[0259] Communication module 173 supports the establishment of wired or wireless communication channels between electronic device 101 and external electronic device 102, and communication through the established communication channels. Communication module 173 may include one or both of wireless communication modules (such as cellular communication modules, short-range wireless communication modules, or Global Navigation Satellite System (GNSS) communication modules) and wired communication modules (such as local area network (LAN) communication modules or power line communication modules). Communication module 173 can communicate with external electronic device 102 via short-range communication networks such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA) or long-range communication networks such as cellular networks, the Internet, or computer networks (e.g., LANs or WANs). The various types of communication modules 173 described above can be implemented as a single chip or as discrete chips.

[0260] The input module 130, sensor module 161, and camera module 171 can be used in conjunction with the processor 110 to control the operation of the display module 140.

[0261] The processor 110 outputs commands or data to the display module 140, sound output module 163, camera module 171, or optical module 172 based on the input data received from the input module 130. For example, the processor 110 may generate image data corresponding to the input data applied by a mouse or active pen and output the generated image data to the display module 140, or the processor 110 may generate command data corresponding to the input data and output the generated command data to the camera module 171 or optical module 172. When no input data is received from the input module 130 for a certain period of time, the processor 110 switches the operating mode of the electronic device 101 to a low-power mode or a sleep mode to reduce the power consumption of the electronic device 101.

[0262] Processor 110 outputs commands or data to display module 140, sound output module 163, camera module 171, or light module 172 based on sensing data received from sensor module 161. For example, processor 110 can compare authentication data applied by fingerprint sensor 161-1 with authentication data stored in memory 120, and then run an application based on the comparison result. Processor 110 can run commands or output corresponding image data to display module 140 based on sensing data sensed by input sensor 161-2 or digitizer 161-3. When sensor module 161 includes a temperature sensor, processor 110 can receive temperature data for the temperature measured from sensor module 161, and can further perform brightness correction on image data based on the temperature data.

[0263] Processor 110 may receive determination data from camera module 171 regarding the presence or absence of a user, the user's position, and the user's gaze. Processor 110 may further perform brightness correction on image data based on the determination data. For example, processor 110, which determines the presence or absence of a user based on input from camera module 171, may provide image data with brightness corrected by data conversion circuit 112-2 or gamma correction circuit 112-3 to display module 140.

[0264] Some of the above components can be connected to each other via peripheral communication methods (such as bus, general purpose input / output (GPIO), serial peripheral interface (SPI), mobile industrial processor interface (MIPI), or ultrapath interconnect (UPI) link) to exchange signals (e.g., commands or data). Processor 110 can communicate with display module 140 via an agreed interface. For example, processor 110 can communicate with display module 140 via any of the above communication methods. This disclosure is not limited to the above communication methods.

[0265] The electronic device 101 according to the various embodiments disclosed in this disclosure can be of various types. For example, the electronic device 101 may include at least one of portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, and home appliances. The electronic device 101 according to the embodiments of this disclosure is not limited to the aforementioned devices.

[0266] In the implementation, Figure 1 The display panel 100 can correspond to Figure 16 Display panel 141. For example, Figure 1 The drive controller 200 can correspond to Figure 16 The controller of the auxiliary processor 112. For example. Figure 1 The gate driver 300 can correspond to Figure 16 The scan driver 142. For example. Figure 1 Data drive 500 can correspond to Figure 16 Data drive 143.

[0267] This disclosure can be applied in the manufacture of any of computers (e.g., notebook computers), mobile phones, smart boards, portable multimedia players (PMPs), personal digital assistants (PDAs), MP3 players, etc.

[0268] Although embodiments have been described with reference to the accompanying drawings, the embodiments shown are provided as examples, and modifications and alterations can be made by those skilled in the art without departing from the spirit of the technology set forth in the appended claims.

Claims

1. A display device, comprising: The substrate includes a display area and a peripheral area, the peripheral area including a first peripheral area positioned in a direction away from the display area, an integrated circuit area spaced apart from the first peripheral area, and a flexible area positioned between the first peripheral area and the integrated circuit area; A data driver is disposed in the integrated circuit region on the substrate; A data distributor is positioned between the integrated circuit region and the flexible region on the substrate; A first data connection line group is electrically connected to the data distributor and configured to receive a first data signal output from the data driver in response to a first distribution selection signal; The second data connection line group is electrically connected to the data distributor and configured to receive a second data signal output from the data driver in response to a second distribution selection signal; The wire is positioned between the first data connection line group and the second data connection line group; as well as A fourth power line, arranged in a different layer from the first data connection line group and the second data connection line group in the cross-sectional view, is electrically connected to the conductor through a contact hole to provide a first power voltage to the conductor.

2. The display device according to claim 1, wherein, The first data connection line group, the second data connection line group, and the wire are positioned on the same layer.

3. The display device according to claim 1, further comprising, in the cross-sectional view: A first insulating layer is disposed on the substrate; A second insulating layer is disposed on the first insulating layer; A third insulating layer is disposed on the second insulating layer; A fourth insulating layer is disposed on the third insulating layer; as well as The fifth insulating layer is disposed on the fourth insulating layer, and The first data connection line group, the second data connection line group, and the conductor are covered by the fourth insulation layer, and The fourth power line is covered by the fifth insulation layer.

4. The display device according to claim 3, wherein, In the cross-sectional view, the width of the fourth electric field line is greater than the width of each of the conductors.

5. The display device according to claim 4, further comprising: An additional power line, in the cross-sectional view, is electrically connected to the conductor through contact holes in a layer different from the fourth and fifth insulating layers.

6. The display device according to claim 5, wherein, The width of the additional power line is greater than the width of each of the conductors.

7. The display device according to claim 5, wherein, The additional power lines include: A first electric field line, covered by the first insulation layer; and The second power line is covered by the second insulation layer and is electrically connected to the first power line and the conductor through a contact hole.

8. The display device according to claim 5, further comprising: The sixth insulating layer is disposed on the fifth insulating layer; as well as The fifth power line is covered by the sixth insulation layer.

9. The display device according to claim 5, wherein, The additional power lines include at least one of a first power line covered by the first insulation layer and electrically connected to the conductor through a contact hole, a second power line covered by the second insulation layer and electrically connected to the conductor through a contact hole, and a third power line covered by the third insulation layer and electrically connected to the conductor through a contact hole.

10. The display device according to claim 5, wherein, In the sectional view, The additional electric field lines disposed beneath the fourth insulation layer comprise a first metal, and The additional power lines arranged on the fourth insulating layer comprise a second metal different from the first metal.

11. The display device according to claim 10, wherein, The resistivity of the second metal is less than that of the first metal.

12. The display device according to claim 1, wherein, In the cross-sectional view, the first data connection line group, the second data connection line group, and the conductor are spaced apart from each other in a direction intersecting the direction.

13. The display device according to claim 1, wherein, A bend line is defined in the bendable region, and the substrate is folded along the bend line. When viewed from the side, with the substrate folded along the curvature, pixels are arranged in the display area on the substrate, and the data distributor and the data driver are positioned below the substrate.

14. A display device, comprising: The substrate includes a display area and a peripheral area, the peripheral area including a first peripheral area positioned in a direction away from the display area, an integrated circuit area spaced apart from the first peripheral area, and a flexible area positioned between the first peripheral area and the integrated circuit area; A data driver is disposed in the integrated circuit region on the substrate; A data distributor is positioned between the integrated circuit region and the flexible region on the substrate; A first data connection line group is electrically connected to the data distributor and configured to receive a first data signal output from the data driver in response to a first distribution selection signal; The second data connection line group is electrically connected to the data distributor and configured to receive a second data signal output from the data driver in response to a second distribution selection signal; A conductor is positioned between the first data connection line group and the second data connection line group, and is configured to receive a first power voltage; as well as A fourth power line, arranged in cross-sectional view on the first data connection line group and the second data connection line group, has a width greater than that of each of the conductors.

15. The display device according to claim 14, further comprising: An additional power line is arranged below the conductor in the cross-sectional view and electrically connected to the conductor through a contact hole.

16. The display device according to claim 15, further comprising: An additional power line is arranged on the fourth power line in the cross-sectional view and electrically connected to the conductor through a contact hole.

17. The display device according to claim 16, wherein, In the cross-sectional view, the additional electric field line arranged below the conductor includes a first metal, and The additional electric field line arranged on the fourth electric field line includes a second metal with a resistivity less than that of the first metal.

18. An electronic device comprising: Power module, supplying electricity; as well as The display device receives power from the power module, and The display device includes: The substrate includes a display area and a peripheral area, the peripheral area including a first peripheral area positioned in a direction away from the display area, an integrated circuit area spaced apart from the first peripheral area, and a flexible area positioned between the first peripheral area and the integrated circuit area; A data driver is disposed in the integrated circuit region on the substrate; A data distributor is positioned between the integrated circuit region and the flexible region on the substrate; A first data connection line group is electrically connected to the data distributor and configured to receive a first data signal output from the data driver in response to a first distribution selection signal; The second data connection line group is electrically connected to the data distributor and configured to receive a second data signal output from the data driver in response to a second distribution selection signal; A conductor, positioned between the first data connection line group and the second data connection line group, and configured to receive a first power voltage; and A fourth power line, arranged in cross-sectional view on the first data connection line group and the second data connection line group, has a width greater than that of each of the conductors.

19. The electronic device according to claim 18, wherein, The display device further includes: An additional power line is arranged below the conductor in the cross-sectional view and electrically connected to the conductor through a contact hole.

20. The electronic device according to claim 19, wherein, The display device further includes: An additional power line is arranged on the fourth power line in the cross-sectional view and electrically connected to the conductor through a contact hole.

Images