Light-emitting assembly, light-emitting substrate, preparation method of light-emitting substrate and display device

Abstract

The embodiment of the invention provides a light-emitting assembly, a light-emitting substrate, a preparation method of the light-emitting substrate and a display device, relates to the technical field of display, and aims to solve the problem of flickering of a display picture and improve the display effect. The light-emitting assembly comprises a first substrate, a light-emitting device, a driving circuit layer and a first bonding pad. The light-emitting device is arranged on one side of the first substrate; the light emitting device includes a first electrode and a second electrode. The driving circuit layer is arranged between the first substrate and the light-emitting device. Moreover, the driving circuit layer comprises a pixel circuit, and the pixel circuit is connected with the first electrode of the light-emitting device, and is configured to provide a driving current signal for the connected light-emitting device. The pixel circuit comprises a signal input end. The first bonding pad is connected with a signal input end of the pixel circuit or a second electrode of the light-emitting device; the first pad is configured to be connected to the driving backplane. The light-emitting assembly is used for the light-emitting substrate.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a light-emitting component, a light-emitting substrate, a method for preparing the same, and a display device. Background Technology

[0002] With the development of LED technology, display devices using LEDs at the sub-millimeter (Mini) or even micrometer (Micro) scale have been widely adopted. This allows display devices using Micro LEDs or Mini LEDs to achieve the same contrast ratio as Organic Light Emitting Diode (OLED) displays, while retaining the advantages of LCDs such as low cost, high brightness, and high reliability, thereby improving display quality and providing users with a superior visual experience.

[0003] In related technologies, Micro / Mini LED display devices suffer from screen flickering when displaying a single frame of an image. Summary of the Invention

[0004] The purpose of this disclosure is to provide a light-emitting component, a light-emitting substrate, a method for preparing the same, and a display device to improve the flickering problem of the display screen and enhance the display effect.

[0005] To achieve the above objectives, the embodiments of this disclosure provide the following technical solutions:

[0006] On one hand, a light-emitting component is provided. The light-emitting component includes a first substrate, a light-emitting device, a driving circuit layer, and a first pad. The light-emitting device is disposed on one side of the first substrate; the light-emitting device includes a first electrode and a second electrode. The driving circuit layer is disposed between the first substrate and the light-emitting device. Furthermore, the driving circuit layer includes a pixel circuit, which is connected to the first electrode of the light-emitting device and configured to provide a driving current signal to the connected light-emitting device. The pixel circuit includes a signal input terminal, which includes at least one of a data signal terminal, a scan signal terminal, a reset signal terminal, an initialization signal terminal, an enable signal terminal, and a first power signal terminal. The first pad is connected to the signal input terminal of the pixel circuit or the second electrode of the light-emitting device; the first pad is configured to connect to a driving backplane.

[0007] The light-emitting component provided in this embodiment, after being fixed to the driving backplate, allows the pixel circuits within the light-emitting component to continuously provide driving current to the light-emitting devices during the display of one frame of image. This enables the light-emitting devices to continuously emit light, thereby improving the flickering problem of the displayed image and enhancing the display effect. Furthermore, the light-emitting devices in each light-emitting component can be controlled by independent pixel circuits, providing high independent controllability. This reduces crosstalk between the pixel circuits connected to the light-emitting devices and other pixel circuits, improving brightness uniformity and contrast, and ultimately enhancing the display effect.

[0008] In some embodiments, the first pad includes a first pad disposed on the side of the driving circuit layer away from the first substrate and offset from the light-emitting device.

[0009] In some embodiments, the light-emitting component further includes a second substrate, a second pad, and a first conductive line. The second substrate is disposed on the side of the first substrate away from the driving circuit layer. The second pad includes a third pad, a fourth pad, and a second connection portion. The third pad is disposed on the side of the second substrate close to the first substrate, the fourth pad is disposed on the side of the second substrate away from the first substrate, and the second connection portion penetrates the second substrate and is connected to the third pad and the fourth pad. The first conductive line is connected to the first pad and the third pad.

[0010] In some embodiments, at least a portion of the edge of the second substrate extends beyond the first substrate; and the second pad is disposed on the edge portion of the second substrate that extends beyond the first substrate.

[0011] In some embodiments, the first pad further includes a second pad and a first connection portion. The second pad is disposed on the side of the first substrate away from the light-emitting device, and the first connection portion penetrates the driving circuit layer and the first substrate, and is connected to the first pad and the second pad.

[0012] In some embodiments, the light-emitting component further includes a third substrate disposed on the side of the first substrate away from the driving circuit layer. The second pad is disposed on the side of the third substrate away from the light-emitting device, and the first connecting portion extends through the third substrate.

[0013] In some embodiments, the light-emitting component includes a first light-emitting device, a second light-emitting device, and a third light-emitting device, wherein the first light-emitting device emits a first color, the second light-emitting device emits a second color, and the third light-emitting device emits a third color; and the first color, the second color, and the third color are three primary colors.

[0014] In some embodiments, the signal input terminal includes a data signal terminal, and the signal input terminal further includes at least one of a scan signal terminal, a reset signal terminal, an initialization signal terminal, an enable signal terminal, and a first power supply signal terminal. The pixel circuit includes a first pixel circuit, a second pixel circuit, and a third pixel circuit, which are respectively connected to the first electrodes of the first light-emitting device, the second light-emitting device, and the third light-emitting device.

[0015] The data signal terminals of the first pixel circuit, the second pixel circuit, and the third pixel circuit are each connected to different first pads. The signal input terminals of the first pixel circuit, the second pixel circuit, and the third pixel circuit, excluding the data signal terminals, are each connected to the same first pad.

[0016] In some embodiments, the first color is red, the second color is green, and the third color is blue. The second electrodes of the second and third light-emitting devices are connected to the same first pad. Furthermore, the second electrodes of the first and second light-emitting devices are connected to different first pads.

[0017] In some embodiments, the light-emitting component further includes a first encapsulation layer that covers the light-emitting device.

[0018] On the other hand, a light-emitting substrate is provided. The light-emitting substrate includes a driving backplate and a light-emitting component as described in any of the above embodiments. The driving backplate is provided with a plurality of third pads, and a first pad of the light-emitting component is connected to the third pads.

[0019] In some embodiments, the first pad includes a first liner, and the light-emitting substrate further includes a second conductor connected to the first liner and the third pad.

[0020] In some embodiments, the first pad includes a second pad and a first connection portion, wherein the second pad is connected to the third pad.

[0021] In some embodiments, the light-emitting component includes a second substrate and a second pad, wherein a fourth pad of the second pad is connected to the third pad.

[0022] In another aspect, a display device is provided. The display device includes a light-emitting substrate as described in any of the above embodiments.

[0023] In another aspect, a method for fabricating a light-emitting substrate is provided. The method includes: fabricating a light-emitting component. The light-emitting component includes a first substrate, a light-emitting device, a driving circuit layer, and a first pad. The light-emitting device is disposed on one side of the first substrate, and the light-emitting device includes a first electrode and a second electrode. The driving circuit layer is disposed between the first substrate and the light-emitting device. The driving circuit layer includes a pixel circuit, which is connected to the first electrode of the light-emitting device and configured to provide a driving current signal to the connected light-emitting device. The pixel circuit includes a signal input terminal, which includes at least one of a data signal terminal, a scan signal terminal, a reset signal terminal, an initialization signal terminal, an enable signal terminal, and a first power supply signal terminal. The first pad is connected to the signal input terminal of the pixel circuit or the second electrode of the light-emitting device and is configured to connect to a driving backplane. A driving backplane is fabricated. The driving backplane has a plurality of third pads. The light-emitting component is fixed to the driving backplane, and the first pad of the light-emitting component is connected to the third pads.

[0024] The above-described light-emitting substrate, display device, and method for preparing the light-emitting substrate have the same structure and beneficial technical effects as the light-emitting components provided in some of the above embodiments, and will not be described again here. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0026] Figure 1 This is a structural diagram of a display device according to some embodiments;

[0027] Figure 2 This is a structural diagram of another display device according to some embodiments;

[0028] Figure 3 for Figure 1 A sectional view along section line AA;

[0029] Figure 4 for Figure 1 Another sectional view along section line AA;

[0030] Figure 5 This is a top view of a light-emitting substrate according to some embodiments;

[0031] Figure 6 This is a structural diagram of a light-emitting component according to some embodiments;

[0032] Figure 7 for Figure 6 The diagram shown illustrates the structure of the light-emitting component with a first encapsulation layer.

[0033] Figure 8 A circuit diagram of a pixel circuit according to some embodiments;

[0034] Figure 9 This is a structural diagram of a light-emitting substrate according to some embodiments;

[0035] Figure 10 for Figure 6 A top view of a light-emitting component is shown;

[0036] Figure 11 for Figure 6 A top view of another light-emitting component shown;

[0037] Figure 12 This is a structural diagram of another light-emitting component according to some embodiments;

[0038] Figure 13 for Figure 12 The diagram shown illustrates the structure of the light-emitting component with a first encapsulation layer.

[0039] Figure 14 This is a structural diagram of another light-emitting substrate according to some embodiments;

[0040] Figure 15 for Figure 12 A top view of a light-emitting component is shown;

[0041] Figure 16 for Figure 12 A top view of another light-emitting component shown;

[0042] Figure 17 This is a structural diagram of another light-emitting component according to some embodiments;

[0043] Figure 18 for Figure 17 The diagram shown illustrates the structure of the light-emitting component with a first encapsulation layer.

[0044] Figure 19 This is a structural diagram of another light-emitting substrate according to some embodiments;

[0045] Figure 20 This is a structural diagram of yet another light-emitting component according to some embodiments;

[0046] Figure 21 for Figure 20The diagram shown illustrates the structure of the light-emitting component with a first encapsulation layer.

[0047] Figure 22 This is a structural diagram of yet another light-emitting substrate according to some embodiments;

[0048] Figure 23 for Figure 20 A top view of a light-emitting component is shown;

[0049] Figure 24 for Figure 20 A top view of another light-emitting component shown;

[0050] Figure 25 This is a flowchart of a method for fabricating a light-emitting substrate according to some embodiments;

[0051] Figure 26 This is a flowchart of a method for fabricating a light-emitting component according to some embodiments;

[0052] Figure 27 This is a diagram illustrating the fabrication steps of a method for fabricating a light-emitting component according to some embodiments;

[0053] Figure 28 A flowchart illustrating another method for fabricating a light-emitting component according to some embodiments;

[0054] Figure 29 This is a diagram illustrating the fabrication steps of another method for fabricating a light-emitting component according to some embodiments;

[0055] Figure 30 A flowchart illustrating another method for fabricating a light-emitting component according to some embodiments;

[0056] Figure 31 This is a diagram illustrating the fabrication steps of another method for fabricating a light-emitting component according to some embodiments;

[0057] Figure 32 This is a flowchart of another method for fabricating a light-emitting component according to some embodiments;

[0058] Figure 33 This describes the preparation steps of another method for preparing a light-emitting component according to some embodiments. Detailed Implementation

[0059] The technical solutions in some embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0060] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiment," "example," or "some examples" are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples.

[0061] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more.

[0062] In describing some embodiments, the term "connection" and its derivative expressions may be used. For example, the term "connection" as used in describing some embodiments should be interpreted broadly, such as referring to a mechanical connection or an electrical connection; a fixed connection or a detachable connection or an integral connection; a direct connection or an indirect connection through an intermediate medium; or a connection within two components. Those skilled in the art will understand the specific meaning of the above terms herein according to the specific circumstances.

[0063] "At least one of A, B and C" has the same meaning as "at least one of A, B or C", both including the following combinations of A, B and C: only A, only B, only C, combinations of A and B, combinations of A and C, combinations of B and C, and combinations of A, B and C.

[0064] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.

[0065] The use of “applies to” or “configured to” in this article implies an open and inclusive language that does not preclude applicability to or configuration to devices that perform additional tasks or steps.

[0066] As used herein, “parallel,” “perpendicular,” and “equal” include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where an acceptable range of deviation for approximate parallelism may be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where an acceptable range of deviation for approximate perpendicularity may also be, for example, within 5°; “equal” includes absolute equality and approximate equality, where an acceptable range of deviation for approximate equality may be, for example, a difference between the two equals being less than or equal to 5% of either one.

[0067] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on another layer or substrate, or that there is an intermediate layer between the layer or element and another layer or substrate.

[0068] This document describes exemplary embodiments with reference to cross-sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as being limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. For example, etched areas shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the areas of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0069] The term “overlapping” or “overlapping” means that the first object may be above or below the second object or to the side of the second object, and vice versa. Additionally, the term “overlapping” may include layering, stacking, facing or oriented, extending over, covering or partially covering, or any other suitable term that will be understood and appreciated by one of ordinary skill in the art.

[0070] When an element is described as “not overlapping” or “will not overlap” with another element, this may include the elements being spaced apart from each other, offset from each other, or separated from each other, or any other suitable terminology that will be understood and appreciated by one of ordinary skill in the art.

[0071] The term "relative" means that the first element can be directly or indirectly relative to the second element. In the case where the third element is between the first and second elements, although they are still relative to each other, the first and second elements can be understood as being indirectly relative to each other.

[0072] The transistors used in the circuits provided in the embodiments of this disclosure can be thin-film transistors, field-effect transistors (e.g., oxide thin-film transistors) or other switching devices with the same characteristics. The embodiments of this disclosure are all described using thin-film transistors as an example.

[0073] In this document, the control electrode of each transistor is the gate of the transistor, the first electrode is one of the source and drain of the transistor, and the second electrode is the other of the source and drain of the transistor. Since the source and drain of a transistor can be structurally symmetrical, they can be structurally indistinguishable. That is, the first and second electrodes of the transistors in the embodiments of this disclosure can be structurally indistinguishable. For example, in the case of a P-type transistor, the first electrode is the source and the second electrode is the drain; for example, in the case of an N-type transistor, the first electrode is the drain and the second electrode is the source.

[0074] In the circuits provided in the embodiments of this disclosure, nodes do not represent actual components, but rather represent junctions of related electrical connections in the circuit diagram. In other words, these nodes are equivalent to junctions of related electrical connections in the circuit diagram.

[0075] In the embodiments of this disclosure, the capacitor can be a capacitor device fabricated separately through a process, such as by fabricating dedicated capacitor electrodes. Each capacitor electrode can be implemented using a metal layer, a semiconductor layer (e.g., doped polysilicon), etc. The capacitor can also be the parasitic capacitance between transistors, or it can be implemented through the transistor itself and other devices or circuits, or it can utilize the parasitic capacitance between the circuit's own lines.

[0076] like Figure 1 As shown, some embodiments of this disclosure provide a display device 1000, which can be any device that displays images, whether moving (e.g., video) or fixed (e.g., still images) and whether it is text or images.

[0077] For example, see Figure 1 The display device 1000 can be any product or component with display function, such as a television, laptop, tablet, mobile phone, personal digital assistant (PDA), navigator, wearable device, virtual reality (VR) device, etc.

[0078] For example, such as Figure 1 As shown, the display device 1000 can be a portable display product; for example, the display device 1000 can be... Figure 1The mobile phone shown. For example, see [link to relevant documentation]. Figure 2 The display device 1000 can be a wearable device; for example, the display device 1000 can be... Figure 2 The watch shown.

[0079] It should be noted that the shape of the display surface of the display device 1000 is not unique depending on the application scenario. The shape of the display surface of the display device 1000 can be any of the following: circular, elliptical, or polygonal. This embodiment of the present disclosure does not impose any specific limitation.

[0080] In some embodiments, see Figure 3 and Figure 4 The display device 1000 includes a light-emitting substrate 100, a housing 200, and a cover plate 300.

[0081] The housing 200 can be a box-shaped structure with an opening, the light-emitting substrate 100 can be disposed inside the housing 200, and the cover plate 300 is disposed on the light-emitting side of the light-emitting substrate 100 and located at the opening of the housing 200.

[0082] It should be noted that the light-emitting substrate 100 has a light-emitting side and a non-light-emitting side, where the light-emitting side refers to the side of the light-emitting substrate 100 that can emit light. Figure 3 The upper side of the light-emitting substrate 100), the non-light-emitting side refers to the side opposite to the light-emitting side ( Figure 3 (Lower side of the light-emitting substrate 100).

[0083] For example, see Figure 3 The light-emitting substrate 100 can directly emit light of multiple colors, thereby achieving full-color display. Alternatively, see [link to relevant documentation]. Figure 4 The display device 1000 also includes a plurality of optical films 400 disposed between the light-emitting substrate 100 and the cover plate 300. At this time, the light-emitting substrate 100 can also emit monochromatic light (e.g., white or blue light), which is then emitted after color conversion and light homogenization by the plurality of optical films 400, thereby realizing full-color display.

[0084] In some embodiments, see Figure 3 and Figure 4 The light-emitting substrate 100 includes a driving backplate 10 and a light-emitting component 20. The driving backplate 10 is provided with a plurality of third pads 11. The light-emitting component 20 can be disposed on the driving backplate 10 and connected to the third pads 11.

[0085] Among them, such as Figure 5 As shown, the drive backplate 10 has a light-emitting area A and a peripheral area B located on at least one side of the light-emitting area A. The light-emitting area A can be configured to house the light-emitting component 20, and the peripheral area B can be configured to house circuit traces.

[0086] For example, such as Figure 5 As shown, multiple light-emitting components 20 are arranged in multiple rows and columns on the driving backplate 10. Each row includes at least two light-emitting components 20 arranged along a first direction X, and each column includes at least two light-emitting components 20 arranged along a second direction Y. The first direction X intersects the second direction Y, for example, the first direction X is perpendicular to the second direction Y.

[0087] The following example illustrates some embodiments of this disclosure by arranging multiple light-emitting components 20 in multiple rows and columns on the driving backplate 10. However, the implementation of this disclosure is not limited to this, and any other arrangement can be considered as long as the same technical concept is applied.

[0088] In some embodiments, see Figure 6 and Figure 7 The light-emitting component 20 includes a first substrate 21, a light-emitting device 22, a driving circuit layer 23, and a first pad 24.

[0089] like Figure 6 and Figure 7 As shown, the first substrate 21 can be a single-layer structure or a multi-layer structure. Exemplarily, the first substrate 21 is a single-layer structure, and the material of the first substrate 21 can include a flexible material, including at least one of epoxy resin, triazine, silicone resin, and polyimide. For example, the material of the first substrate 21 includes polyimide. In this case, the driving circuit layer 23 can be directly formed on the first substrate 21 using thin-film growth technology. The first substrate 21 can act as a buffer and protector, which is beneficial for improving production yield.

[0090] like Figure 6 and Figure 7 As shown, the light-emitting device 22 is disposed on one side of the first substrate 21, and the light-emitting device 22 includes a first electrode 201 and a second electrode 202. The light-emitting device 22 may include one or more of a micro light-emitting diode (Micro LED) and / or a sub-millimeter light-emitting diode (Mini LED).

[0091] It should be noted that the size (e.g., length) of Micro LED is less than 50 micrometers, for example, 10 micrometers to 50 micrometers. The size (e.g., length) of Mini LED is 50 micrometers to 150 micrometers, for example, 80 micrometers to 120 micrometers.

[0092] like Figure 6 and Figure 7As shown, the driving circuit layer 23 is disposed between the first substrate 21 and the light-emitting device 22. Furthermore, the driving circuit layer 23 includes a pixel circuit 230, which is connected to the first electrode 201 of the light-emitting device 22 and configured to provide a driving current signal to the connected light-emitting device 22, driving the light-emitting device 22 to emit light. See also... Figure 8 The pixel circuit 230 includes a signal input terminal IN, which includes at least one of a data signal terminal DATA, a scan signal terminal GATE, a reset signal terminal RESET, an initialization signal terminal VINIT, an enable signal terminal EM, and a first power supply signal terminal VDD.

[0093] like Figure 7 , Figure 8 and Figure 9 As shown, the first pad 24 is connected to the signal input terminal IN of the pixel circuit 230 or the second electrode 202 of the light-emitting device 22, and is configured to connect to the driving backplane 10 to receive at least one of a data signal, a scan signal, a reset signal, an initialization signal, an enable signal, a first power signal, and a second power signal. Exemplarily, the first pad 24 of the light-emitting component 20 may be connected to the third pad 11 of the driving backplane 10.

[0094] In this configuration, during the display of one frame of an image, the pixel circuit 230 can continuously provide driving current to the light-emitting device 22, enabling the light-emitting device 22 to continuously emit light, thereby improving the flickering problem of the displayed image and enhancing the display effect. Furthermore, the light-emitting device 22 in each light-emitting component 20 can be controlled by an independent pixel circuit 230, giving the light-emitting device 22 high independent controllability. This reduces crosstalk between the pixel circuits 230 connected to the light-emitting device 22 and other pixel circuits 230, improving brightness uniformity and contrast, and ultimately enhancing the display effect.

[0095] In some embodiments, such as Figure 6 and Figure 7 As shown, the first pad 24 includes a first pad 241, which is disposed on the side of the driving circuit layer 23 away from the first substrate 21 and is offset from the light-emitting device 22.

[0096] In some examples, such as Figure 6 , Figure 7 and Figure 9 As shown, the first substrate 21 can be directly connected to the drive backplate 10 by adhesive bonding. For example, a first adhesive layer 310 is also provided between the first substrate 21 and the drive backplate 10. In this case, the first pad 24 and the third pad 11 can be indirectly connected by wires.

[0097] For example, such as Figure 9As shown, the light-emitting substrate 100 may also include a second wire 25, the two ends of which are connected to the first pad 241 and the third pad 11 respectively, thereby making the first pad 24 of the light-emitting component 20 electrically connected to the third pad 11 of the driving backplate 10.

[0098] At this time, the top view of the light-emitting component 20 can be as follows: Figure 10 As shown, along the first direction X, the first pad 241 can be disposed on opposite sides of the light-emitting device 22; or, the top view of the light-emitting component 20 can be as shown... Figure 11 As shown, the first pad 241 can be arranged around the periphery of the light-emitting device 22.

[0099] Based on this, refer to Figure 7 The light-emitting component 20 may also include a first encapsulation layer 360, which covers the light-emitting device 22 to prevent water and oxygen from corroding the light-emitting device 22.

[0100] For example, such as Figure 7 As shown, the first encapsulation layer 360 is disposed on the side of the driving circuit layer 23 away from the first substrate 21, covering the light-emitting device 22. Furthermore, the first encapsulation layer 360 exposes the first pad 241 to facilitate the connection of the second wire 25 to the first pad 241.

[0101] In addition, see Figure 9 The light-emitting substrate 100 may also include a second encapsulation layer 370, which covers the first pad 241 and the third pad 11 to protect the first pad 241 and the third pad 11.

[0102] For example, such as Figure 5 and Figure 9 As shown, the second encapsulation layer 370 is disposed on the side of the driving backplate 10 near the light-emitting component 20, covering the entire light-emitting area A of the driving backplate 10. Furthermore, the second encapsulation layer 370 is a continuous, single-layer structure.

[0103] In other examples, such as Figure 12 and Figure 13 As shown, the light-emitting component 20 may also include a second substrate 27, a second pad 28 and a first wire 29, with the second substrate 27 disposed on the side of the first substrate 21 away from the driving circuit layer 23.

[0104] It should be noted that the second substrate 27 can be connected to the first substrate 21 by adhesive bonding. For example, a second adhesive layer 320 is also provided between the second substrate 27 and the first substrate 21.

[0105] The second pad 28 includes a third pad 281, a fourth pad 282, and a second connecting portion 283. The third pad 281 is disposed on the side of the second substrate 27 closest to the first substrate 21, and the fourth pad 282 is disposed on the side of the second substrate 27 away from the first substrate 21. The second connecting portion 283 penetrates the second substrate 27 and is connected to the third pad 281 and the fourth pad 282. The first conductor 29 is connected to the first pad 241 and the third pad 281.

[0106] like Figure 12 and Figure 13 As shown, at least a portion of the edge of the second substrate 27 may extend beyond the first substrate 21. Furthermore, the second pad 28 may be disposed on the edge portion of the second substrate 27 that extends beyond the first substrate 21. In this case, the fabrication of the second pad 28 is not interfered with by the upper first substrate 21, the light-emitting device 22, and the driving circuit layer 23, resulting in a simple process and low cost.

[0107] Furthermore, the second substrate 27 can be a single-layer structure or a multi-layer structure. For example, the second substrate 27 can be an FR4 type printed circuit board (PCB). For instance, the material of the second substrate 27 can include one or more ceramic materials such as silicon nitride, AlN, and Al2O3, or it can include metals or metal compounds, such as a metal core PCB or a metal copper clad laminate (MCCL).

[0108] In this case, during the process of forming the via through the second substrate 27, the second substrate 27 has greater strength, which can provide good support, reduce the difficulty of drilling, reduce the risk of deformation of the second substrate 27, facilitate the preparation of the second pad 28, and improve the production yield.

[0109] Furthermore, see Figure 14 The fourth pad 282 and the third pad 11 can be directly connected by a soldering process. In this way, the third pad 11 can be connected to the first pad 241 in sequence through the fourth pad 282, the second connecting part 283, the third pad 281 and the first wire 29, so that the driving backplane 10 provides display driving signals to the pixel circuit 230.

[0110] At this time, the top view of the light-emitting component 20 can be as follows: Figure 15 As shown, along the first direction X, the first pad 241 can be disposed on opposite sides of the light-emitting device 22, and the second pad 28 can be disposed on one side of the connected first pad 241; or, the top view of the light-emitting component 20 can be as shown. Figure 16As shown, the first pad 241 can be arranged around the periphery of the light-emitting device 22, and the second pad 28 can be arranged around the periphery of the first pad 241.

[0111] Based on this, refer to Figure 13 The light-emitting component 20 may also include a first encapsulation layer 360, which covers the light-emitting device 22 to prevent water and oxygen from corroding the light-emitting device 22.

[0112] For example, such as Figure 13 As shown, the first encapsulation layer 360 is disposed on the side of the driving circuit layer 23 away from the first substrate 21, covering the light-emitting device 22. Furthermore, the first encapsulation layer 360 can also cover the first pad 241, the third pad 281, and the first wire 29 to protect the first pad 241, the third pad 281, and the first wire 29.

[0113] In addition, see Figure 13 and Figure 14 The light-emitting substrate 100 may also include a second encapsulation layer 370, which may cover the area between the light-emitting components 20 and the area between the light-emitting components 20 and the driving backplate 10 to protect the light-emitting components 20 and the third pad 11.

[0114] For example, such as Figure 5 and Figure 14 As shown, the second encapsulation layer 370 is disposed on the side of the driving backplate 10 near the light-emitting component 20, covering the entire light-emitting area A of the driving backplate 10. Furthermore, the second encapsulation layer 370 is a continuous, single-layer structure.

[0115] In other embodiments, such as Figure 17 and Figure 18 As shown, the light-emitting component 20 includes a first substrate 21, a light-emitting device 22, a driving circuit layer 23, and a first pad 24. The first pad 24 includes a first pad 241, a second pad 242, and a first connection portion 243.

[0116] The first pad 241 is disposed on the side of the driving circuit layer 23 away from the first substrate 21 and is offset from the light-emitting device 22. The second pad 242 is disposed on the side of the first substrate 21 away from the light-emitting device 22. The first connecting portion 243 passes through the driving circuit layer 23 and the first substrate 21 and is connected to the first pad 241 and the second pad 242.

[0117] In addition, such as Figure 18 As shown, the light-emitting component 20 may also include a third adhesive layer 330, which is disposed between the second pad 242 and the first substrate 21 so that the second pad 242 is connected to the first substrate 21, which facilitates the preparation of the first pad 24. For details, please refer to the preparation method.

[0118] In some examples, such as Figure 18 and Figure 19 As shown, the second pad 242 and the third pad 11 can be directly connected via a soldering process. In this way, the third pad 11 can be connected to the first pad 241 in sequence through the second pad 242 and the first connecting part 243, so that the driving backplane 10 provides display driving signals to the pixel circuit 230.

[0119] At this time, the top view of the light-emitting component 20 can be as follows: Figure 10 As shown, along the first direction X, the first pads 24 can be disposed on opposite sides of the light-emitting device 22; or, the top view of the light-emitting component 20 can be as shown... Figure 11 As shown, the first pad 24 can be arranged around the periphery of the light-emitting device 22.

[0120] Based on this, refer to Figure 18 The light-emitting component 20 may also include a first encapsulation layer 360, which covers the light-emitting device 22 to prevent water and oxygen from corroding the light-emitting device 22.

[0121] For example, such as Figure 18 As shown, the first encapsulation layer 360 is disposed on the side of the driving circuit layer 23 away from the first substrate 21, covering the light-emitting device 22. Furthermore, the first encapsulation layer 360 exposes the first pad 241 to facilitate the formation of the first pad 241, the second pad 242, and the first connection portion 243.

[0122] In addition, see Figure 19 The light-emitting substrate 100 may also include a second encapsulation layer 370, which may cover the area between the first pad 241 and the light-emitting component 20 to protect the first pad 241 and the third pad 11.

[0123] For example, such as Figure 5 and Figure 19 As shown, the second encapsulation layer 370 is disposed on the side of the driving backplate 10 near the light-emitting component 20, covering the entire light-emitting area A of the driving backplate 10. Furthermore, the second encapsulation layer 370 is a continuous, single-layer structure.

[0124] In other examples, such as Figure 20 and Figure 21 As shown, the light-emitting component 20 may also include a third substrate 26, which is disposed on the side of the first substrate 21 away from the driving circuit layer 23, and the first connecting portion 243 also penetrates the third substrate 26.

[0125] It should be noted that the third substrate 26 can be connected to the first substrate 21 by adhesive bonding. For example, a fourth adhesive layer 340 is also provided between the third substrate 26 and the first substrate 21.

[0126] The third substrate 26 can be a single-layer structure or a multi-layer structure. For example, the third substrate 26 can be an FR4 type printed circuit board (PCB). For instance, the material of the third substrate 26 can include one or more ceramic materials such as silicon nitride, AlN, and Al2O3, or it can include metals or metal compounds, such as a metal core PCB or a metal copper clad laminate (MCCL).

[0127] In this case, during the process of forming the vias through the driving circuit layer 23, the first substrate 21 and the third substrate 26, the third substrate 26 has greater strength and can provide good support, reducing the risk of deformation of the driving circuit layer 23, the first substrate 21 and the third substrate 26, which is beneficial to the preparation of the first pad 24 and can improve the production yield.

[0128] Furthermore, the second pad 242 and the third pad 11 can be directly connected via a soldering process. In this way, the third pad 11 can be connected to the first pad 241 in sequence through the second pad 242 and the first connecting part 243, so that the driving backplane 10 provides display driving signals to the pixel circuit 230.

[0129] At this time, the top view of the light-emitting component 20 can be as follows: Figure 23 As shown, along the first direction X, the first pads 24 can be disposed on opposite sides of the light-emitting device 22; or, the top view of the light-emitting component 20 can be as shown... Figure 24 As shown, the first pad 24 can be arranged around the periphery of the light-emitting device 22.

[0130] Based on this, refer to Figure 21 The light-emitting component 20 may also include a first encapsulation layer 360, which covers the light-emitting device 22 to prevent water and oxygen from corroding the light-emitting device 22.

[0131] For example, such as Figure 21 As shown, the first encapsulation layer 360 is disposed on the side of the driving circuit layer 23 away from the first substrate 21, covering the light-emitting device 22. Furthermore, the first encapsulation layer 360 may also cover the first pad 241 to protect the first pad 241.

[0132] In addition, see Figure 22 The light-emitting substrate 100 may also include a second encapsulation layer 370, which may cover the area between the light-emitting components 20 and the area between the light-emitting components 20 and the driving backplate 10 to protect the light-emitting components 20 and the third pad 11.

[0133] For example, such as Figure 5 and Figure 22 As shown, the second encapsulation layer 370 is disposed on the side of the driving backplate 10 near the light-emitting component 20, covering the entire light-emitting area A of the driving backplate 10. Furthermore, the second encapsulation layer 370 is a continuous, single-layer structure.

[0134] Understandably, see Figure 6 , Figure 10 and Figure 11 The light-emitting component 20 mentioned above includes at least one light-emitting device 22. For example, the light-emitting component 20 may include one, two, three, four or more light-emitting devices 22.

[0135] In some embodiments, such as Figure 6 As shown, the light-emitting component 20 includes a first light-emitting device 221, a second light-emitting device 222, and a third light-emitting device 223. The first light-emitting device 221 emits a first color, the second light-emitting device 222 emits a second color, and the third light-emitting device 223 emits a third color. Furthermore, the first color, the second color, and the third color are three primary colors.

[0136] For example, such as Figure 6 As shown, the first light-emitting device 221 emits red light, the second light-emitting device 222 emits green light, and the third light-emitting device 223 emits blue light. That is, the first color is red, the second color is green, and the third color is blue.

[0137] The following uses red as the first color, green as the second color, and blue as the third color as an example to illustrate some embodiments of this disclosure. However, the implementation of this disclosure is not limited to this, and any other colors can be considered as long as the same technical concept is applied.

[0138] It should be understood that the structure of the pixel circuit 230 described above includes various types, and can be selected and configured according to actual needs. For example, the structure of the pixel circuit 230 may include "2T1C", "3T1C", "6T1C", "7T1C", "8T1C", "6T2C" or "7T2C", etc. Here, "T" represents a transistor, and the number before "T" indicates the number of transistors; "C" represents a storage capacitor, and the number before "C" indicates the number of storage capacitors.

[0139] For example, see Figure 8 The pixel circuit 230 includes 7 transistors T and 1 capacitor C. That is, the structure of the pixel circuit 230 is 7T1C.

[0140] like Figure 8As shown, the first terminal of the first transistor T1 is connected to the first initial switching signal terminal VINIT1, the second terminal of the first transistor T1 is connected to the first node N1, and the control terminal of the first transistor T1 is connected to the first reset signal terminal RESET1.

[0141] like Figure 8 As shown, the first terminal of the second transistor T2 is connected to the third node N3, the second terminal of the second transistor T2 is connected to the first node N1, and the control terminal of the second transistor T2 is connected to the first scan signal terminal GATE1.

[0142] like Figure 8 As shown, the first terminal of the third transistor T3 is connected to the second node N2, the second terminal of the third transistor T3 is connected to the third node N3, and the control terminal of the third transistor T3 is connected to the first node N1.

[0143] like Figure 8 As shown, the first terminal of the fourth transistor T4 is connected to the data signal terminal DATA, the second terminal of the fourth transistor T4 is connected to the second node N2, and the control terminal of the third transistor T3 is connected to the second scan signal terminal GATE2.

[0144] like Figure 8 As shown, the first terminal of the fifth transistor T5 is connected to the first voltage signal terminal VDD, the second terminal of the fifth transistor T5 is connected to the second node N2, and the control terminal of the fifth transistor T5 is connected to the first enable signal terminal EM1.

[0145] like Figure 8 As shown, the first terminal of the sixth transistor T6 is connected to the third node N3, the second terminal of the sixth transistor T6 is connected to the fourth node N4, and the control terminal of the sixth transistor T6 is connected to the second enable signal terminal EM2. The fourth node N4 is connected to the light-emitting device 22.

[0146] like Figure 8 As shown, the first terminal of the seventh transistor T7 is connected to the second initial switching signal terminal VINIT2, the second terminal of the seventh transistor T7 is connected to the fourth node N4, and the control terminal of the seventh transistor T7 is connected to the second reset signal terminal RESET2.

[0147] like Figure 8 As shown, the first plate of capacitor C is connected to the first voltage signal terminal VDD, and the second plate of capacitor C is connected to the first node N1.

[0148] Among them, at least one of the first initial switching signal terminal VINIT1, the second initial switching signal terminal VINIT2, the first reset signal terminal RESET1, the second reset signal terminal RESET2, the first scan signal terminal GATE1, the second scan signal terminal GATE2, the first enable signal terminal EM1, and the second enable signal terminal EM2 receives the same signal, or any two receive different signals.

[0149] For example, see Figure 8 The signals received by the first scan signal terminal GATE1 and the second scan signal terminal GATE2 are the same. The signals received by the first enable signal terminal EM1 and the second enable signal terminal EM2 are the same. The signals received by the first initial switching signal terminal VINIT1 and the second initial switching signal terminal VINIT2 are the same. The signals received by any other two signal terminals are different.

[0150] The second reset signal terminal RESET2 receives the same signal as the first scan signal terminal GATE1 of the pixel circuit 230 in the next row. That is, the second reset signal terminal RESET2 of a pixel circuit 230 can be connected to the same signal line as the first scan signal terminal GATE1 of the pixel circuit 230 in the next row. This simplifies the circuit routing design on the drive backplane 10 and reduces the manufacturing cost.

[0151] In some embodiments, see Figure 8 The signal input terminal IN includes the data signal terminal DATA, and also includes at least one of the scan signal terminal GATE, the reset signal terminal RESET, the initialization signal terminal VINIT, the enable signal terminal EM, and the first power supply signal terminal VDD.

[0152] For example, the structure of the pixel circuit 230 is the 7T1C described above. The signal input terminal IN includes the data signal terminal DATA, the scan signal terminal GATE, the reset signal terminal RESET, the initialization signal terminal VINIT, the enable signal terminal EM, and the first power supply signal terminal VDD.

[0153] Among them, the scan signal terminal GATE includes the first scan signal terminal GATE1 and the second scan signal terminal GATE2, the reset signal terminal RESET includes the first reset signal terminal RESET1 and the second reset signal terminal RESET2, the initialization signal terminal VINIT includes the first initial switching signal terminal VINIT1 and the second initial switching signal terminal VINIT2, and the enable signal terminal EM includes the first enable signal terminal EM1 and the second enable signal terminal EM2.

[0154] Based on this, such as Figure 6 and Figure 8As shown, the pixel circuit 230 includes a first pixel circuit 231, a second pixel circuit 232, and a third pixel circuit 233. The first pixel circuit 231, the second pixel circuit 232, and the third pixel circuit 233 are respectively connected to the first electrode 201 of the first light-emitting device 221, the second light-emitting device 222, and the third light-emitting device 223.

[0155] At this time, the data signal terminals DATA of the first pixel circuit 231, the second pixel circuit 232, and the third pixel circuit 233 are respectively connected to different first pads 24. Among the signal input terminals IN of the first pixel circuit 231, the second pixel circuit 232, and the third pixel circuit 233, the other signal input terminals IN besides the data signal terminal DATA are respectively connected to the same first pad 24.

[0156] Specifically, the first scan signal terminal GATE1 of the first pixel circuit 231, the second pixel circuit 232, and the third pixel circuit 233 is connected to the same first pad 24; the second scan signal terminal GATE2 of the first pixel circuit 231, the second pixel circuit 232, and the third pixel circuit 233 is also connected to the same first pad 24. The first reset signal terminal RESET1 of the first pixel circuit 231, the second pixel circuit 232, and the third pixel circuit 233 is also connected to the same first pad 24; the second reset signal terminal RESET2 of the first pixel circuit 231, the second pixel circuit 232, and the third pixel circuit 233 is also connected to the same first pad 24. The first initial switching signal terminal VINIT1 of the first pixel circuit 231, the second pixel circuit 232, and the third pixel circuit 233 is also connected to the same first pad 24; the second initial switching signal terminal VINIT2 of the first pixel circuit 231, the second pixel circuit 232, and the third pixel circuit 233 is also connected to the same first pad 24. The first enable signal terminals EM1 of the first pixel circuit 231, the second pixel circuit 232, and the third pixel circuit 233 are connected to the same first pad 24; the second enable signal terminals EM2 of the first pixel circuit 231, the second pixel circuit 232, and the third pixel circuit 233 are also connected to the same first pad 24. This configuration reduces the number of first pads 24 on the light-emitting component 20, decreases the number of connection steps between the light-emitting component 20 and the driving backplane 10, simplifies the process flow, and reduces manufacturing costs.

[0157] When the signals received by the first scanning signal terminal GATE1 and the second scanning signal terminal GATE2 are the same, the first scanning signal terminal GATE1 and the second scanning signal terminal GATE2 of the first pixel circuit 231, the second pixel circuit 232 and the third pixel circuit 233 can also be connected to the same first pad 24 to further reduce the number of first pads 24 of the light-emitting component 20.

[0158] When the signals received by the first enable signal terminal EM1 and the second enable signal terminal EM2 are the same, the first enable signal terminal EM1 and the second enable signal terminal EM2 of the first pixel circuit 231, the second pixel circuit 232 and the third pixel circuit 233 can also be connected to the same first pad 24 to further reduce the number of first pads 24 of the light-emitting component 20.

[0159] When the signals received by the first initial switching signal terminal VINIT1 and the second initial switching signal terminal VINIT2 are the same, the first initial switching signal terminals VINIT1 and the second initial switching signal terminals VINIT2 of the first pixel circuit 231, the second pixel circuit 232 and the third pixel circuit 233 can also be connected to the same first pad 24 to further reduce the number of first pads 24 of the light-emitting component 20.

[0160] In some embodiments, see Figure 6 and Figure 8 The first color can be red, the second color can be green, and the third color can be blue.

[0161] Based on this, the second electrodes 202 of the second light-emitting device 222 and the third light-emitting device 223 are connected to the same first pad 24 to further reduce the number of first pads 24 of the light-emitting component 20. Furthermore, the second electrodes 202 of the first light-emitting device 221 and the second light-emitting device 222 are connected to different first pads 24.

[0162] In this case, the second power supply signal received by the second electrode 202 of the first light-emitting device 221 may be different from the second power supply signals received by the second electrodes 202 of the second light-emitting device 222 and the third light-emitting device 223. For example, the voltage of the second power supply signal of the second electrode 202 of the first light-emitting device 221 may be greater than the voltage of the second power supply signals received by the second electrodes 202 of the second light-emitting device 222 and the third light-emitting device 223. This can reduce the power consumption of the second pixel circuit 232 and the third pixel circuit 233 connected to the second light-emitting device 222 and the third light-emitting device 223 respectively, thereby reducing the power consumption of the light-emitting substrate 100.

[0163] Some embodiments of this disclosure also provide a method for preparing a light-emitting substrate 100, used to prepare the light-emitting substrate 100 of any of the above embodiments, such as... Figure 25 As shown, the preparation method includes steps S100 to S300.

[0164] S100: Prepare the light-emitting component 20.

[0165] In the above steps, the light-emitting component 20 includes a first substrate 21, a light-emitting device 22, a driving circuit layer 23, and a first pad 24. The light-emitting device 22 is disposed on one side of the first substrate 21 and includes a first electrode 201 and a second electrode 202. The driving circuit layer 23 is disposed between the first substrate 21 and the light-emitting device 22.

[0166] The driving circuit layer 23 includes a pixel circuit 230, which is connected to the first electrode 201 of the light-emitting device 22 and configured to provide a driving current signal to the connected light-emitting device 22. The pixel circuit 230 includes a signal input terminal IN, which includes at least one of a data signal terminal DATA, a scan signal terminal GATE, a reset signal terminal RESET, an initialization signal terminal VINIT, an enable signal terminal EM, and a first power supply signal terminal VDD. A first pad 24 is connected to the signal input terminal IN of the pixel circuit 230 or the second electrode 202 of the light-emitting device 22 and is configured to connect to the driving backplane 10.

[0167] In some embodiments, see Figure 6 The light-emitting component 20 includes a first substrate 21, a light-emitting device 22, a driving circuit layer 23 and a first pad 24. The first pad 24 includes a first pad 241, which is disposed on the side of the driving circuit layer 23 away from the first substrate 21 and is offset from the light-emitting device 22.

[0168] Based on this, refer to Figure 26 and Figure 27 The above S100 includes S111 to S115.

[0169] S111: A first substrate 211 is formed on the first substrate 41.

[0170] In the above steps, the first substrate 211 can be directly formed on the first substrate 41 by an attachment process. The material of the first substrate 41 includes glass and / or polymethyl methacrylate (PMMA) to provide support and facilitate the fabrication of the light-emitting component 20.

[0171] S112: A driving circuit layer 23 is formed on the side of the first substrate 211 away from the first substrate 41.

[0172] In the above steps, the driving circuit layer 23 can be formed on the first substrate 211 by thin film growth technology. The first substrate 211 can play a buffering and protective role, which is conducive to improving the production yield.

[0173] S113: Fix the light-emitting device 22 onto the driving circuit layer 23 and form the first pad 24.

[0174] In the above steps, the first pad 24 includes a first pad 241, which is disposed on the side of the driving circuit layer 23 away from the first substrate 21 and is offset from the light-emitting device 22.

[0175] In this process, the first electrode 201 of the light-emitting device 22 can be connected to the pixel circuit 230 in the driving circuit layer 23 through a die bonding process, so that the light-emitting device 22 is fixed on the driving circuit layer 23.

[0176] S114: Remove the first substrate 41.

[0177] In the above steps, the first substrate 41 can be removed by at least one of laser debonding, thermal sliding debonding, chemical debonding and mechanical debonding.

[0178] S115: Cut the driving circuit layer 23 and the first substrate 211 to form the light-emitting component 20.

[0179] In the above steps, mechanical cutting and / or laser cutting can be used to cut the driving circuit layer 23 and the first substrate 211 between the light-emitting devices 22 to form multiple light-emitting components 20. Each light-emitting component 20 includes a first substrate 21, a driving circuit layer 23, at least one light-emitting device 22, and a first pad 24. Figure 27 The following is an illustration using a single light-emitting device as an example.

[0180] In other embodiments, see Figure 12 The light-emitting component 20 includes a first substrate 21, a light-emitting device 22, a driving circuit layer 23 and a first pad 24. The first pad 24 includes a first pad 241, which is disposed on the side of the driving circuit layer 23 away from the first substrate 21 and is offset from the light-emitting device 22.

[0181] Furthermore, the light-emitting component 20 also includes a second substrate 27, a second pad 28, and a first conductive line 29. The second substrate 27 is disposed on the side of the first substrate 21 away from the driving circuit layer 23. The second pad 28 includes a third pad 281, a fourth pad 282, and a second connecting portion 283. The third pad 281 is disposed on the side of the second substrate 27 close to the first substrate 21, and the fourth pad 282 is disposed on the side of the second substrate 27 away from the first substrate 21. The second connecting portion 283 penetrates the second substrate 27 and is connected to the third pad 281 and the fourth pad 282. The first conductive line 29 is connected to the first pad 281 and the third pad 281.

[0182] Based on this, refer to Figure 28 and Figure 29 The above S100 includes S121 to S127.

[0183] S121: A plurality of first substrates 21 are formed on the first substrate 41.

[0184] In the above steps, multiple first substrates 21 are spaced apart. Specifically, a first substrate 211 can be formed on a first substrate 41 using an attachment process, and then the first substrate 211 can be patterned to form multiple first substrates 21.

[0185] S122: A driving circuit layer 23 is formed on the side of the first substrate 21 away from the first substrate 41.

[0186] In the above steps, a driving circuit layer 23 is formed on a first substrate 21. The driving circuit layer 23 can be formed on the first substrate 21 using thin film growth technology.

[0187] S123: Fix the light-emitting device 22 onto the driving circuit layer 23 and form the first pad 24.

[0188] In the above steps, the first pad 24 includes a first pad 241, which is disposed on the side of the driving circuit layer 23 away from the first substrate 21 and is offset from the light-emitting device 22.

[0189] In this process, the first electrode 201 of the light-emitting device 22 can be connected to the pixel circuit 230 in the driving circuit layer 23 through a die bonding process, so that the light-emitting device 22 is fixed on the driving circuit layer 23.

[0190] S124: Remove the first substrate 41 to form multiple intermediate light-emitting components 20'.

[0191] In the above steps, the first substrate 41 can be removed by at least one of laser debonding, thermal sliding debonding, chemical debonding and mechanical debonding.

[0192] S125: Fix multiple intermediate light-emitting components 20' onto the second substrate 271 to form a second pad 28.

[0193] In the above steps, a plurality of intermediate light-emitting components 20' are spaced apart on the second substrate 271, and the second pad 28 is located between the plurality of intermediate light-emitting components 20'.

[0194] The second pad 28 includes a third pad 281, a fourth pad 282, and a second connecting portion 283. The third pad 281 is disposed on the side of the second substrate 27 close to the first substrate 21, and the fourth pad 282 is disposed on the side of the second substrate 27 away from the first substrate 21. The second connecting portion 283 penetrates the second substrate 27 and is connected to the third pad 281 and the fourth pad 282.

[0195] S126: Connect the first pad 241 and the third pad 281 through the first wire 29.

[0196] In the above steps, the first conductor 29 can be formed by a printing process, thereby connecting the first conductor 29 to the first pad 241 and the third pad 281. Alternatively, the first conductor 29 can be directly connected to the first pad 241 and the third pad 281 by a bonding process. The material of the first conductor 29 includes metals, such as at least one of silver, copper, and gold.

[0197] S127: Cut the second substrate 271 to form the light-emitting component 20.

[0198] In the above steps, mechanical cutting and / or laser cutting can be used to cut between the intermediate light-emitting components 20' to form multiple light-emitting components 20. Each light-emitting component 20 includes a first substrate 21, a light-emitting device 22, a driving circuit layer 23, a first pad 24, a second substrate 27, a second pad 28, and a first conductive line 29. Figure 29 The following is an illustration using a single light-emitting device as an example.

[0199] In some examples, see Figure 28 Between S126 and S127, the above-mentioned S100 may also include S128.

[0200] S128: Form the first encapsulation layer 360.

[0201] In the above steps, the first encapsulation layer 360 is disposed on the side of the driving circuit layer 23 away from the first substrate 21, covering the light-emitting device 22. Furthermore, the first encapsulation layer 360 can also cover the first pad 241, the third pad 281, and the first wire 29 to protect the first pad 241, the third pad 281, and the first wire 29.

[0202] In some other embodiments, see [reference] Figure 17 The light-emitting component 20 includes a first substrate 21, a light-emitting device 22, a driving circuit layer 23, and a first pad 24. The first pad 24 includes a first pad 241, a second pad 242, and a first connection portion 243.

[0203] The first pad 24 includes a first pad 241, a second pad 242, and a first connection portion 243. The first pad 241 is disposed on the side of the driving circuit layer 23 away from the first substrate 21 and is offset from the light-emitting device 22. The second pad 242 is disposed on the side of the first substrate 21 away from the light-emitting device 22. The first connection portion 243 passes through the driving circuit layer 23 and the first substrate 21 and is connected to the first pad 241 and the second pad 242.

[0204] Based on this, such as Figure 30 and Figure 31 As shown, S100 includes S131 to S137.

[0205] S131: A first substrate 211 is formed on the first substrate 41.

[0206] In the above steps, the first substrate 211 can be directly formed on the first substrate 41 by an attachment process. The material of the first substrate 41 includes glass and / or PMMA to provide support and facilitate the fabrication of the light-emitting component 20.

[0207] S132: A driving circuit layer 23 is formed on the side of the first substrate 211 away from the first substrate 41.

[0208] In the above steps, the driving circuit layer 23 can be formed on the first substrate 211 by thin film growth technology. The first substrate 211 can play a buffering and protective role, which is conducive to improving the production yield.

[0209] S133: Fix the light-emitting device 22 onto the driving circuit layer 23 and form a first pad 241.

[0210] In the above steps, the first pad 241 is disposed on the side of the driving circuit layer 23 away from the first substrate 21 and is offset from the light-emitting device 22.

[0211] In this process, the first electrode 201 of the light-emitting device 22 can be connected to the pixel circuit 230 in the driving circuit layer 23 through a die bonding process, so that the light-emitting device 22 is fixed on the driving circuit layer 23.

[0212] S134: Remove the first substrate 41.

[0213] In the above steps, the first substrate 41 can be removed by at least one of laser debonding, thermal sliding debonding, chemical debonding and mechanical debonding.

[0214] S135: Cut the driving circuit layer 23 and the first substrate 211 to form the intermediate light-emitting component 20'.

[0215] In the above steps, mechanical cutting and / or laser cutting can be used to cut the driving circuit layer 23 and the first substrate 211 between the light-emitting devices 22 to form multiple intermediate light-emitting components 20'.

[0216] S136: A second pad 242 is formed on the side of the first substrate 211 away from the driving circuit layer 23.

[0217] In the above steps, the second pad 242 and the first pad 241 can be arranged opposite to each other; and the orthographic projections of the second pad 242 and the first pad 241 on the first substrate 211 can coincide.

[0218] S137: A first via 510 is formed through the first pad 241, the drive circuit layer 23 and the first substrate 211, and a first connection portion 243 is formed in the first via 510.

[0219] Among them, see Figure 31 After S136, S137 can be fabricated on the driving backplate 10 after the intermediate light-emitting component 20' is connected to the driving backplate 10. This embodiment of the present disclosure does not specifically limit this step.

[0220] In some other embodiments, see [reference] Figure 20 The light-emitting component 20 includes a first substrate 21, a light-emitting device 22, a driving circuit layer 23, and a first pad 24. The first pad 24 includes a first pad 241, a second pad 242, and a first connection portion 243.

[0221] The first pad 24 includes a first pad 241, a second pad 242, and a first connection portion 243. The first pad 241 is disposed on the side of the driving circuit layer 23 away from the first substrate 21 and is offset from the light-emitting device 22. The second pad 242 is disposed on the side of the first substrate 21 away from the light-emitting device 22. The first connection portion 243 passes through the driving circuit layer 23 and the first substrate 21 and is connected to the first pad 241 and the second pad 242.

[0222] Furthermore, the light-emitting component 20 may also include a third substrate 26, which is disposed on the side of the first substrate 21 away from the driving circuit layer 23, and the first connecting portion 243 also penetrates the third substrate 26.

[0223] Based on this, such as Figure 32 and Figure 33 As shown, S100 includes S141 to S148.

[0224] S141: A first substrate 211 is formed on the first substrate 41.

[0225] In the above steps, the first substrate 211 can be directly formed on the first substrate 41 by an attachment process. The material of the first substrate 41 includes glass and / or PMMA to provide support and facilitate the fabrication of the light-emitting component 20.

[0226] S142: A driving circuit layer 23 is formed on the side of the first substrate 211 away from the first substrate 41.

[0227] In the above steps, the driving circuit layer 23 can be formed on the first substrate 211 by thin film growth technology. The first substrate 211 can play a buffering and protective role, which is conducive to improving the production yield.

[0228] S143: Fix the light-emitting device 22 onto the driving circuit layer 23 and form a first pad 241.

[0229] In the above steps, the first pad 241 is disposed on the side of the driving circuit layer 23 away from the first substrate 21 and is offset from the light-emitting device 22. The first electrode 201 of the light-emitting device 22 can be connected to the pixel circuit 230 in the driving circuit layer 23 via a die bonding process, thereby fixing the light-emitting device 22 onto the driving circuit layer 23.

[0230] S144: Remove the first substrate 41.

[0231] In the above steps, the first substrate 41 can be removed by at least one of laser debonding, thermal sliding debonding, chemical debonding and mechanical debonding.

[0232] S145: Fix the first substrate 211 exposed after removing the first substrate 41 onto the third substrate 261.

[0233] In the above steps, the first substrate 211 can be fixed to the third substrate 261 by an adhesive bonding process.

[0234] S146: A second pad 242 is formed on the side of the third substrate 261 away from the driving circuit layer 23.

[0235] In the above steps, the second pad 242 and the first pad 241 can be arranged opposite to each other; and the orthographic projections of the second pad 242 and the first pad 241 on the first substrate 211 can coincide.

[0236] S147: A second via 520 is formed through the first pad 241, the drive circuit layer 23, the first substrate 211 and the third substrate 261, and a first connection portion 243 is formed in the second via 520.

[0237] S148: Cut the driving circuit layer 23, the first substrate 211, and the third substrate 261 to form the light-emitting component 20.

[0238] In the above steps, mechanical cutting and / or laser cutting can be used to cut between the intermediate light-emitting components 20' to form multiple light-emitting components 20. Each light-emitting component 20 includes a first substrate 21, a light-emitting device 22, a driving circuit layer 23, a first pad 24, and a third substrate 26. Figure 33 The following is an illustration using a single light-emitting device as an example.

[0239] In some examples, see Figure 32 and Figure 33 Between S147 and S148, the above-mentioned S100 may also include S149.

[0240] S149: Form the first encapsulation layer 360.

[0241] In the above steps, the first encapsulation layer 360 is disposed on the side of the driving circuit layer 23 away from the first substrate 21, covering the light-emitting device 22. Furthermore, the first encapsulation layer 360 may also cover the first pad 241.

[0242] S200: Fabrication of drive backplate 10.

[0243] In the above steps, the drive backplane 10 is provided with a plurality of third pads 11.

[0244] S300: See Figure 9 , Figure 14 , Figure 19 and Figure 22 The light-emitting component 20 is fixed on the driving backplate 10, and the first pad 24 of the light-emitting component 20 is connected to the third pad 11.

[0245] In some embodiments, see Figure 25 Following the S300, it also includes the S400.

[0246] S400: See Figure 9 , Figure 14 , Figure 19 and Figure 22 A second encapsulation layer 370 is formed on the drive backplane 10.

[0247] In the above steps, the second encapsulation layer 370 is disposed on the side of the driving backplate 10 near the light-emitting component 20, covering the entire light-emitting area A of the driving backplate 10. The second encapsulation layer 370 can be formed by at least one of deposition, coating, and bonding processes; this embodiment does not specifically limit the specific process.

[0248] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A light-emitting component, characterized in that, include: First substrate; A light-emitting device is disposed on one side of the first substrate; the light-emitting device includes a first electrode and a second electrode; A driving circuit layer is disposed between the first substrate and the light-emitting device; and the driving circuit layer includes a pixel circuit, which is connected to the first electrode of the light-emitting device and configured to provide a driving current signal to the connected light-emitting device. The pixel circuit includes a signal input terminal, which includes at least one of a data signal terminal, a scan signal terminal, a reset signal terminal, an initialization signal terminal, an enable signal terminal, and a first power supply signal terminal. The first pad is connected to the signal input terminal of the pixel circuit or the second electrode of the light-emitting device; the first pad is configured to connect to the driving backplane.

2. The light-emitting component according to claim 1, characterized in that, The first pad includes a first pad, which is disposed on the side of the driving circuit layer away from the first substrate and offset from the light-emitting device.

3. The light-emitting component according to claim 2, characterized in that, Also includes: The second substrate is disposed on the side of the first substrate away from the driving circuit layer; The second pad includes a third pad, a fourth pad, and a second connection portion. The third pad is disposed on the side of the second substrate close to the first substrate, and the fourth pad is disposed on the side of the second substrate away from the first substrate. The second connection portion penetrates the second substrate and is connected to the third pad and the fourth pad. The first conductor is connected to the first pad and the third pad.

4. The light-emitting component according to claim 3, characterized in that, At least a portion of the edge of the second substrate extends beyond the first substrate; and the second pad is disposed on the portion of the second substrate that extends beyond the first substrate.

5. The light-emitting component according to claim 2, characterized in that, The first pad also includes: The second pad is disposed on the side of the first substrate away from the light-emitting device; The first connection portion extends through the driving circuit layer and the first substrate, and is connected to the first pad and the second pad.

6. The light-emitting component according to claim 5, characterized in that, Also includes: The third substrate is disposed on the side of the first substrate away from the driving circuit layer; the second pad is disposed on the side of the third substrate away from the light-emitting device, and the first connecting portion also penetrates the third substrate.

7. The light-emitting component according to any one of claims 1 to 6, characterized in that, It includes a first light-emitting device, a second light-emitting device, and a third light-emitting device. The first light-emitting device emits a first color, the second light-emitting device emits a second color, and the third light-emitting device emits a third color. Furthermore, the first color, the second color, and the third color are three primary colors.

8. The light-emitting component according to claim 7, characterized in that, The signal input terminal includes a data signal terminal, and the signal input terminal further includes at least one of a scan signal terminal, a reset signal terminal, an initialization signal terminal, an enable signal terminal, and a first power supply signal terminal; The pixel circuit includes a first pixel circuit, a second pixel circuit, and a third pixel circuit, wherein the first pixel circuit, the second pixel circuit, and the third pixel circuit are respectively connected to the first electrode of the first light-emitting device, the second light-emitting device, and the third light-emitting device; The data signal terminals of the first pixel circuit, the second pixel circuit, and the third pixel circuit are respectively connected to different first pads; the signal input terminals of the first pixel circuit, the second pixel circuit, and the third pixel circuit, other than the data signal terminals, are respectively connected to the same first pad.

9. The light-emitting component according to claim 8, characterized in that, The first color is red, the second color is green, and the third color is blue; The second electrodes of the second light-emitting device and the third light-emitting device are connected to the same first pad; and the second electrodes of the first light-emitting device and the second light-emitting device are connected to different first pads.

10. The light-emitting component according to any one of claims 1 to 6, characterized in that, It also includes a first encapsulation layer that covers the light-emitting device.

11. A light-emitting substrate, characterized in that, include: The driver backplane has multiple third pads. The light-emitting component as described in any one of claims 1 to 10, wherein the first pad of the light-emitting component is connected to the third pad.

12. The light-emitting substrate according to claim 11, characterized in that, The first pad includes a first pad, and the light-emitting substrate further includes a second conductor, which is connected to the first pad and the third pad.

13. The light-emitting substrate according to claim 11, characterized in that, The first pad includes a second pad and a first connection portion, wherein the second pad is connected to the third pad.

14. The light-emitting substrate according to claim 11, characterized in that, The light-emitting component includes a second substrate and a second pad, wherein a fourth pad of the second pad is connected to the third pad.

15. A display device, characterized in that, It includes the light-emitting substrate as described in any one of claims 11 to 14.

16. A method for preparing a light-emitting substrate, characterized in that, include: Fabricating a light-emitting component; the light-emitting component includes a first substrate, a light-emitting device, a driving circuit layer, and a first pad, the light-emitting device is disposed on one side of the first substrate, the light-emitting device includes a first electrode and a second electrode; the driving circuit layer is disposed between the first substrate and the light-emitting device; and the driving circuit layer includes a pixel circuit, the pixel circuit is connected to the first electrode of the light-emitting device, and is configured to provide a driving current signal to the connected light-emitting device; The pixel circuit includes a signal input terminal, which includes at least one of a data signal terminal, a scan signal terminal, a reset signal terminal, an initialization signal terminal, an enable signal terminal, and a first power signal terminal; the first pad is connected to the signal input terminal of the pixel circuit or the second electrode of the light-emitting device, and is configured to connect to a driving backplane; A drive backplane is fabricated; the drive backplane is provided with a plurality of third pads. The light-emitting component is fixed to the driving backplate, and the first pad of the light-emitting component is connected to the third pad.

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