A soldering device for an array of crimping pins and a method for crimping an array of pins

Abstract

The application discloses a kind of auxiliary crimping needle shaking array tin lining device and crimping needle shaking array method, including the second layer tooling of splicing connection, third layer tooling, fourth layer tooling, fifth layer tooling and sixth layer tooling, and according to demand, different structures and shapes of through hole are set in each layer tooling, and the inside of slope perforation is provided with inclined side wall, can guide crimping needle to be converted from horizontal direction to vertical direction, cooperate with transition hole to guide crimping needle to be finally inserted in pin hole, tin lining operation, only need to take away fifth layer tooling can obtain the crimping needle that has been automatically vertically inserted, the orderly arrangement of crumpled needle in disorder, realizes the stable positioning of crimping needle, the height of tin lining position of crimping needle can be guaranteed by the constraint of pin hole, makes tin lining surface fully exposed, tin liquid is attached, tin lining consistency is good, effectively avoid tin lining bad and pull sharp problem caused by improper position, realize the batch, efficient tin lining operation of crimping needle, improve the stability of product quality.

Description

Technical Field

[0001] This invention belongs to the field of gold and tin plating technology for electronic components, and relates to a tin plating device and a method for tin plating an auxiliary crimping pin shaking array. Background Technology

[0002] With the rapid development of science and technology, products are showing a trend towards mass production and multi-functionality, placing more stringent demands on product complexity and high reliability. In the product manufacturing process, direct connection between conductors and printed circuit boards (PCBs) presents risks such as insufficient layout space, difficulty in inspecting for excess material in stacked wire harnesses, inability to secure wire harnesses, and easy breakage. Flexible interconnect technology is a crucial step in ensuring signal transmission stability. For reliability reasons, conductors cannot be directly connected to the PCB; they must first be crimped using a crimping process, and then the crimp pins are soldered to the PCB. This process, through dual fixation of mechanical crimping and soldering, significantly improves the conductors' resistance to breakage in complex product application environments such as extreme temperatures and strong vibrations, thus strengthening the product quality protection.

[0003] However, as the application scenarios of crimping pin technology in product design continue to expand and deepen, the usage of crimping pins is growing exponentially. The efficiency bottleneck of traditional tinning processes is becoming increasingly prominent. Because the surface of the crimping pins has a gold plating layer, a gold-removing tinning process must be performed before crimping to ensure welding quality. The current manual operation mode requires operators to use tweezers to hold each crimping pin individually before completing the tinning operation in the tin pot. This is not only extremely inefficient, but the irregular cylindrical structure of the crimping pins also makes them prone to springing off during the holding process. This not only increases material waste but also leads to uneven tinning height due to poor operational stability. Numerous technical pain points exist in the tinning process, seriously affecting tinning quality and making it difficult to meet production plan requirements.

[0004] 1) Significant production capacity bottleneck: The annual demand for crimping pins is huge. Based on the efficiency of manual operation, it averages 29 seconds per pin, or 1,000 pins per person per day, which is difficult to meet the needs of large-scale production.

[0005] 2) Complex process: The crimping pin has a gold-plated layer on its surface. To prevent "gold brittleness", it needs to undergo gold removal treatment in a gold-removing pot and tin-plating pot. The tin-plating process is twice as complex as the tin-plating process for ordinary components, which further restricts production efficiency.

[0006] 3) High difficulty in quality control: Manual tinning makes it difficult to precisely control the tinning height, easily resulting in inconsistent tinning heights. At the same time, solder tip pull-out is a frequent problem. During the crimping process, the crimping pin tip must be tightly pressed against the bottom of the crimping hole in the crimping pliers to complete a qualified crimp. If a tip pull-out occurs, it will cause the crimping position to shift, resulting in insufficient crimping tension and a potential quality hazard of the crimping pin pulling off the wire. Summary of the Invention

[0007] The purpose of this invention is to solve the problems in the prior art where the irregular cylindrical structure of the crimping pins makes them prone to flying off during clamping, and the poor stability of manual operation leads to uneven soldering height, affecting the soldering quality. This invention provides a soldering device and a method for assisting the crimping pin shaking array.

[0008] To achieve the above objectives, the present invention employs the following technical solution:

[0009] A tinning device for an auxiliary crimping pin wobbling array includes a second layer tooling, a third layer tooling, a fourth layer tooling, a fifth layer tooling, and a sixth layer tooling that can be assembled and connected.

[0010] The second layer of the fixture has several crimping pin placement grooves, the third layer of the fixture has several sloping through holes, the fourth layer of the fixture has several transition holes, and the fifth layer of the fixture has several pin insertion holes.

[0011] Several crimping pin placement grooves, several sloping through holes, several transition holes and several pin holes are connected in a corresponding manner. The sloping through holes include an upper horizontal port and a lower vertical port. The sloping through holes are provided with inclined sidewalls inside.

[0012] When preparing for soldering, the crimping pin to be soldered is placed horizontally in the crimping pin placement groove, and then enters the sloping through hole through the transverse port in the horizontal direction. After being guided and limited by the inclined side wall, it is vertically inserted through the transition hole along the vertical port, and finally vertically inserted into the pin hole to start soldering.

[0013] A further improvement of the present invention is that:

[0014] The interior of the sloping perforation includes relatively distributed vertical sidewalls and inclined sidewalls. The starting ends of the vertical sidewalls and inclined sidewalls are respectively connected to the two ends of the transverse port, and the ends of the vertical sidewalls and inclined sidewalls converge at the vertical port.

[0015] The angle between the inclined sidewall and the transverse port is 55°-65°.

[0016] The sixth layer tooling has a positioning groove inside, and the fifth layer tooling is placed in the positioning groove.

[0017] When the fourth and sixth layer tooling are assembled, the fifth layer tooling is clamped between the fourth and sixth layer tooling.

[0018] The sixth layer of tooling has a plate-removing groove, which is located on the side of the positioning groove. The vertical depth of the positioning groove is greater than the vertical depth of the plate-removing groove.

[0019] It also includes a first layer of tooling, on which a through-hole limiting groove is provided. When the first layer of tooling is assembled with the second layer of tooling, the grooves for placing several crimping pins are all located inside the limiting groove.

[0020] It also includes a seventh layer of tooling, which has a through tinning tank inside. When tinning begins, the fifth layer of tooling is placed inside the tinning tank.

[0021] The seventh layer of tooling is equipped with a tin-plated handle.

[0022] The diameter of the transition hole is larger than the diameter of the pin hole.

[0023] A method for shaking an array of crimp pins includes the following steps:

[0024] Place the crimping pins to be tinned horizontally in each crimping pin placement groove;

[0025] The third, fourth, fifth, and sixth layer fixtures are sequentially inverted on top of the second layer fixture, and then the second, third, fourth, fifth, and sixth layer fixtures are simultaneously rotated vertically.

[0026] At this time, the crimping pin in the crimping pin placement groove enters the horizontal port horizontally. Inside the sloping perforation, it is guided by the inclined side wall limit. During the falling process, the crimping pin is gradually adjusted from the horizontal direction to the vertical direction and then passes through the vertical port vertically.

[0027] After passing through the vertical port, the crimping pin goes through the transition hole in a vertical direction and is finally inserted vertically into the pin hole;

[0028] Disassemble the fourth, fifth, and sixth layer fixtures, remove the fifth layer fixture, obtain all the vertically arranged crimping pins, and begin soldering.

[0029] Compared with the prior art, the present invention has the following beneficial effects:

[0030] This invention discloses a soldering device for an auxiliary crimping pin shaking array, comprising a second, third, fourth, fifth, and sixth layer of fixtures that can be assembled and connected. Each layer of fixture has through holes of different structures and shapes, and the inclined through holes have sloping sidewalls to guide the crimping pins from a horizontal to a vertical orientation. These, along with transition holes, guide the crimping pins to finally insert into the pin holes. During soldering, simply removing the fifth layer of fixture retrieves the automatically vertically inserted crimping pins, arranging the previously disordered pins in an orderly manner and achieving stable positioning. The constraint of the pin holes ensures uniform soldering height, fully exposing the soldering surface for easy solder adhesion and good soldering consistency. This effectively avoids poor soldering and tipping problems caused by improper positioning, enabling batch and efficient soldering of crimping pins and improving product quality stability.

[0031] Furthermore, in this invention, a positioning groove is formed inside the sixth layer tooling, and the fifth layer tooling is placed in the positioning groove. The fifth layer tooling is clamped by the fourth layer tooling and the sixth layer tooling, which ensures the stability of the positioning process and improves the positioning accuracy.

[0032] Furthermore, in this invention, a plate-removing groove is provided on the sixth layer tooling. The plate-removing groove is located on one side of the positioning groove. The vertical depth of the positioning groove is greater than the vertical depth of the plate-removing groove, so that after positioning is completed, the fifth layer tooling can be directly and quickly removed from the positioning groove through the plate-removing groove.

[0033] Furthermore, in this invention, when the first layer of tooling is assembled with the second layer of tooling, several crimping pin placement grooves are all located inside the limiting groove. When placing crimping pins into the crimping pin placement grooves, the crimping pins can be scattered above several crimping pin placement grooves, and then the second layer of tooling can be shaken to make the crimping pins fall into each crimping pin placement groove. At this time, the limiting groove surrounds the periphery of all crimping pin placement grooves, which can prevent the crimping pins from falling during the shaking process.

[0034] Furthermore, in this invention, a through tinning tank is opened inside the seventh layer tooling. When tinning begins, the fifth layer tooling is placed inside the tinning tank to facilitate the stable positioning of the crimping pins in subsequent processing. Attached Figure Description

[0035] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0036] Figure 1This is an overall structural diagram of the device of the present invention;

[0037] Figure 2 This is an exploded view of the device of the present invention;

[0038] Figure 3 This is a diagram of the first layer tooling structure of the present invention;

[0039] Figure 4 This is a diagram of the second layer tooling structure of the present invention;

[0040] Figure 5 This is the third layer tooling structure of the present invention. Figure 1 ;

[0041] Figure 6 This is the third layer tooling structure of the present invention. Figure 2 ;

[0042] Figure 7 This is a structural diagram of the fourth layer tooling of the present invention;

[0043] Figure 8 This is a structural diagram of the fifth layer tooling of the present invention;

[0044] Figure 9 This is a structural diagram of the sixth layer tooling of the present invention;

[0045] Figure 10 This is a structural diagram of the seventh layer tooling of the present invention;

[0046] Wherein: 1-; 2-First layer tooling; 3-Second layer tooling; 4-Third layer tooling; 5-Fourth layer tooling; 6-Fifth layer tooling; 7-Sixth layer tooling; 8-Sloping through hole; 9-; 10-Crimp pin placement groove; 11-Second positioning pin; 12-Positioning hole; 13-Pin hole; 14-Reinforcing rib; 15-Seventh layer tooling; 16-Handle; 17-Transition hole; 18-Horizontal port; 19-Vertical port; 20-Vertical sidewall; 21-Inclined sidewall; 22-Positioning groove; 23-Limiting groove; 24-Tinning groove; Detailed Implementation

[0047] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0048] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0049] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0050] In the description of the embodiments of the present invention, it should be noted that if terms such as "upper," "lower," "horizontal," or "inner" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of the invention is in use, they are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. Furthermore, terms such as "first" and "second" are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0051] Furthermore, the use of the term "horizontal" does not imply that the component must be absolutely horizontal, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0052] In the description of the embodiments of the present invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the present invention according to the specific circumstances.

[0053] The present invention will now be described in further detail with reference to the accompanying drawings:

[0054] In the field of electronic component manufacturing, the efficiency of the tinning process for crimp pins has a significant impact on production schedule. In-depth research has revealed that crimp pins have an irregular, cylindrical shape, composed of four cylinders of varying diameters. This complex structural design, coupled with the large production volume, makes traditional tinning methods insufficient for high-efficiency production, and low tinning efficiency has become a bottleneck restricting improvements in production efficiency.

[0055] This invention discloses a tinning device for an auxiliary crimping pin shaking array. Firstly, addressing the problem of inefficient positioning due to the large number and irregular shapes of the crimping pins, a precision array technology is employed. Through automated equipment and a high-precision positioning system, the disordered crimping pins are arranged in an orderly manner, laying the foundation for subsequent processes.

[0056] Secondly, after the array is completed, a specially designed 60° inclined fixture cleverly utilizes gravity and the principle of the inclined plane to ensure that the crimping pins are precisely erected on the tinning plate for tinning. This unique fixture design not only achieves stable positioning of the crimping pins but also fully exposes the tinning surface, facilitating solder adhesion and ensuring good tinning consistency. It effectively avoids tinning defects and spikes caused by improper positioning. Through this series of optimization measures, batch and efficient tinning of crimping pins is achieved, significantly shortening the production cycle, reducing labor costs, and improving product quality stability. This provides a strong guarantee for batch tinning of crimping pins, specifically including the following:

[0057] See Figures 1 to 10 The present invention discloses a tinning device for an auxiliary crimping pin shaking array, comprising a second layer tooling 3, a third layer tooling 4, a fourth layer tooling 5, a fifth layer tooling 6 and a sixth layer tooling 7 that can be assembled and connected, wherein the fifth layer tooling 6 is disposed inside the sixth layer tooling 7;

[0058] The second layer tooling 3 has several crimping pin placement grooves 10, the third layer tooling 4 has several inclined through holes 8, the fourth layer tooling 5 has several transition holes 17, and the fifth layer tooling 6 has several pin insertion holes 13.

[0059] When the second layer tooling 3, the third layer tooling 4, the fourth layer tooling 5, the fifth layer tooling 6 and the sixth layer tooling 7 are assembled from top to bottom, a number of crimping pin placement grooves 10, a number of ramp perforations 8, a number of transition holes 17 and a number of pin holes 13 are connected in a one-to-one correspondence. The ramp perforation 8 includes a horizontal port 18 and a vertical port 19, and the ramp perforation 8 is provided with an inclined sidewall inside.

[0060] When preparing for soldering, the crimping pin to be soldered is placed horizontally in the crimping pin placement groove 10, then passes through the horizontal port 18 in the horizontal direction, is limited by the inclined side wall, and then vertically passes through the transition hole 17 along the vertical port 19, and is then vertically inserted into the pin hole 13 to begin soldering.

[0061] See Figure 2 and Figure 4 Furthermore, in this embodiment, the length of the crimping pin placement groove 10 corresponds to the length of the crimping pin, and the width corresponds to the width of the crimping pin, ensuring that only one crimping pin can be placed horizontally in one crimping pin placement groove 10.

[0062] See Figure 5 and Figure 6 Furthermore, in this embodiment, the ramp perforation 8 includes vertical sidewalls 20 and inclined sidewalls 21 that are relatively distributed. The starting ends of the vertical sidewalls 20 and inclined sidewalls 21 are respectively connected to the two ends of the horizontal port 18, and the ends of the vertical sidewalls 20 and inclined sidewalls 21 converge at the vertical port 19. The angle between the inclined sidewalls 21 and the horizontal port 18 is 55°-65°. When the crimping pin passes through the ramp perforation 8, the inclined sidewalls 21 can limit and guide the direction of the crimping pin, changing it from the horizontal direction to the vertical direction.

[0063] Furthermore, in this embodiment, the angle between the inclined sidewall 21 and the transverse port 18 is 60°.

[0064] Furthermore, in this embodiment, a positioning groove 22 is formed inside the sixth layer tooling 7, and the fifth layer tooling 6 is placed inside the positioning groove 22. In this embodiment, two fifth layer tooling 6 are placed horizontally inside the positioning groove 22.

[0065] In practical applications, as long as the fifth layer tooling 6 can correspond to the structure of the positioning groove 22, there is no limit to the number of fifth layer tooling 6 placed.

[0066] See Figure 9 Furthermore, in this embodiment, a plate-removing groove 9 is provided on the sixth layer tooling 7. The plate-removing groove 9 is located on one side of the positioning groove 22. The vertical depth of the positioning groove 22 is greater than the vertical depth of the plate-removing groove 9. Four plate-removing grooves 9 are symmetrically provided. After positioning is completed, the edge of the fifth layer tooling 6 can be clamped by a tool through the plate-removing groove to remove the fifth layer tooling from the positioning groove. The removal process is more stable and avoids tilting and shaking.

[0067] See Figure 3 Furthermore, in this embodiment, a first layer tooling 2 is also included. A through limiting groove 23 is provided on the first layer tooling 2. When the first layer tooling 2 is assembled with the second layer tooling, a number of crimping pin placement grooves 10 are all located inside the limiting groove 23. When the first layer tooling is assembled with the second layer tooling, a number of crimping pin placement grooves are all located inside the limiting groove. When placing crimping pins into the crimping pin placement grooves, the crimping pins can be scattered above the crimping pin placement grooves, and then the second layer tooling can be shaken to make the crimping pins fall into each crimping pin placement groove. At this time, the limiting groove surrounds the periphery of all crimping pin placement grooves, which can prevent the crimping pins from falling during the shaking process.

[0068] See Figure 10Furthermore, in this embodiment, a seventh layer tooling 15 is also included. A through tinning tank 24 is opened inside the seventh layer tooling 15. When tinning begins, the fifth layer tooling 6 is placed in the tinning tank 24. In this embodiment, the fifth layer tooling 6 can also be fixed by additional clamping tools to make it more stable in the tinning tank 24.

[0069] See Figure 10 Furthermore, in this embodiment, a tinning handle 16 is provided on the seventh layer tooling 15, and the tinning operation is carried out through the handle 16, making the operation more convenient.

[0070] See Figure 7 and Figure 8 Furthermore, in this embodiment, the diameter of the through hole 17 is larger than the diameter of the pin hole 13. And since the shape of the crimping pin is irregular, in this embodiment, the diameter of the pin hole 13 is set according to the soldering requirements of the crimping pin, so that the crimping pin can be inserted into the pin hole 13 without falling off, which facilitates the subsequent soldering.

[0071] Furthermore, in this embodiment, positioning holes 12 are provided on the tooling of each layer, and positioning pins 11 are provided in the positioning holes 12. The tooling of each layer is assembled through the corresponding positioning holes 12 and the second positioning pins 11.

[0072] Furthermore, in this embodiment, on the fifth layer tooling 6, reinforcing ribs 14 are provided between each row of pin holes 13.

[0073] This embodiment also discloses a method for shaking an array of crimping pins, including the following steps:

[0074] Step 1: Assemble the first layer tooling 2 and the second layer tooling 3 using the first positioning pin 1. At this time, all the crimping pin placement grooves 10 on the second layer tooling 3 are located in the limiting groove 23. Pour crimping pins into the limiting groove 23, and then gently shake the first layer tooling 2 and the second layer tooling 3. When all the crimping pin placement grooves 10 are filled, remove the first layer tooling 2 and clean up the excess crimping pins on the second layer tooling 3, leaving only the crimping pins in the crimping pin placement grooves 10.

[0075] Step 2: Invert the third layer fixture 4 onto the second layer fixture 3 and assemble it through the positioning hole 12 and the second positioning pin 11;

[0076] Step 3: Place the fifth layer fixture 6 inside the sixth layer fixture 7, and assemble the sixth layer fixture 7 and the fourth layer fixture 5 through the positioning hole 12 and the second positioning pin 11.

[0077] Step 4: Invert the tooling assembled in Step 3 onto the tooling assembled in Step 2. At this point, from bottom to top, the tooling is the second layer 3, the third layer 4, the fourth layer 5, and the sixth layer 7.

[0078] Step 5: Rotate the tooling assembled in Step 4 vertically 180 degrees, and then shake it gently. At this time, from bottom to top, the tooling is the sixth layer 7, the fourth layer 5, the third layer 4, and the second layer 3. After shaking, remove the second layer 3, the third layer 4, and the fourth layer 5. At this time, the crimping pin is inserted into the inclined perforation 8.

[0079] Step 6: Take out the fifth layer fixture 6 through the plate removal groove 9, then place the fifth layer fixture 6 into the seventh layer fixture 15, and hold the handle 16 to perform the gold removal and tinning operation in the tin pot.

[0080] At this point, the first batch of crimping pins has completed the gold-plating process. The process will then be repeated in the order of step one, step two, step three, step four, step five, and step six.

[0081] Production efficiency has seen a leap forward: Before the introduction of the automatic pin-rolling and pin-dispensing tinning device, the average time for a single person to manually complete the gold removal and tinning process for a single pin was 29 seconds. Based on a production volume of 20,000 pins, this would take approximately 20 days to complete. With the automation device, the tinning time per pin has been reduced to 1.5 seconds, increasing production efficiency by up to 20 times. Now, only one operator is needed to complete the same production volume in one day, significantly improving production efficiency while effectively reducing labor costs.

[0082] The tinning process has been fully optimized: This tooling is equipped with a variety of tinning boards of the same specifications. Through the cross-process gold removal and tinning operation mode, it not only strictly follows the process time interval requirements, but also achieves efficient connection between each process, which greatly improves the overall smoothness of operation and production efficiency.

[0083] The soldering quality of crimp pins is significantly improved: By using this tooling for soldering operations, the height of the soldering position of the crimp pins can be ensured to be uniform. The batch operation mode effectively controls the temperature difference between each crimp pin. Combined with a uniform flux coating process, as well as precise solder pot dwell time, soldering angle and withdrawal speed, the occurrence of quality defects such as crimp pin sharpening is greatly reduced, and the stability and reliability of crimp pin soldering are significantly improved.

[0084] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A tinning device for an auxiliary crimping pin shaking array, characterized in that, It includes a second layer tooling (3), a third layer tooling (4), a fourth layer tooling (5), a fifth layer tooling (6), and a sixth layer tooling (7) that can be assembled and connected. The second layer tooling (3) has several crimping pin placement grooves (10), the third layer tooling (4) has several sloping through holes (8), the fourth layer tooling (5) has several transition holes (17), and the fifth layer tooling (6) has several pin holes (13). A number of crimping pin placement grooves (10), a number of sloping through holes (8), a number of transition holes (17) and a number of pin holes (13) are connected in a one-to-one correspondence. The sloping through hole (8) includes a horizontal port (18) at the upper end and a vertical port (19) at the lower end. The sloping through hole (8) is provided with an inclined sidewall inside. When preparing for tinning, the crimping pin to be tinned is placed horizontally in the crimping pin placement groove (10), and then enters the ramp through hole (8) in the horizontal direction through the transverse port (18). After being guided and limited by the inclined side wall, it passes vertically through the transition hole (17) along the vertical port (19), and finally is vertically inserted into the pin hole (13) to start tinning. The slope perforation (8) includes vertical sidewalls (20) and inclined sidewalls (21) that are relatively distributed. The starting ends of the vertical sidewalls (20) and inclined sidewalls (21) are respectively connected to the two ends of the horizontal port (18), and the ends of the vertical sidewalls (20) and inclined sidewalls (21) meet at the vertical port (19). The angle between the inclined sidewall (21) and the transverse port (18) is 55°-65°; It also includes a first layer tooling (2), on which a through limiting groove (23) is opened. When the first layer tooling (2) and the second layer tooling (3) are assembled, several crimping pin placement grooves (10) are located inside the limiting groove (23). It also includes a seventh layer tooling (15), which has a through tinning tank (24) inside. When tinning begins, the fifth layer tooling (6) is placed inside the tinning tank (24).

2. The tinning device for an auxiliary crimping pin shaking array according to claim 1, characterized in that, The sixth layer tooling (7) has a positioning groove (22) inside, and the fifth layer tooling (6) is placed in the positioning groove (22); When the fourth layer tooling (5) and the sixth layer tooling (7) are assembled, the fifth layer tooling (6) is sandwiched between the fourth layer tooling (5) and the sixth layer tooling (7).

3. The tinning device for an auxiliary crimping pin shaking array according to claim 2, characterized in that, The sixth layer tooling (7) has a plate-removing groove (9), which is located on the side of the positioning groove (22). The vertical depth of the positioning groove (22) is greater than the vertical depth of the plate-removing groove (9).

4. The tinning device for an auxiliary crimping pin shaking array according to claim 1, characterized in that, A tin-plated handle (16) is provided on the seventh layer tooling (15).

5. The tinning device for an auxiliary crimping pin shaking array according to claim 1, characterized in that, The diameter of the through hole (17) is larger than the diameter of the pin hole (13).

6. A method for oscillating an array of crimping pins, employing the tinning device as described in claim 1, characterized in that, Includes the following steps: Place the crimping pins to be tinned horizontally in each crimping pin placement groove (10); The third layer tooling (4), the fourth layer tooling (5), the fifth layer tooling (6) and the sixth layer tooling (7) are sequentially upside down on the upper end of the second layer tooling (3), and then the second layer tooling (3), the third layer tooling (4), the fourth layer tooling (5), the fifth layer tooling (6) and the sixth layer tooling (7) are simultaneously rotated vertically (180) degrees. At this time, the crimping pin in the crimping pin placement groove (10) enters the horizontal port (18) horizontally. Inside the inclined perforation (8), the crimping pin is guided by the inclined side wall limit. During the falling process, the crimping pin is gradually adjusted from the horizontal direction to the vertical direction and then passes through the vertical port (19) vertically. After passing through the vertical port (19), the crimping pin passes through the transition hole (17) in the vertical direction and is finally inserted vertically into the pin hole (13); Disassemble the fourth layer fixture (5), the fifth layer fixture (6) and the sixth layer fixture (7), take out the fifth layer fixture (6), obtain all the vertically set crimping pins, and start soldering.

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