Display panel, preparation method thereof and display device

Abstract

The invention provides a display panel, a preparation method thereof and a display device. The display panel comprises a substrate and a blocking dam, the blocking dam comprises a main body part and a first step part, and the first step part is located between the substrate and the main body part; the main body part comprises a main body table top and a main body side wall, the main body table top is located on the surface of one side of the main body part away from the substrate, and the main body side wall is located on one side of the main body table top close to the substrate; the first step part comprises a first table top and a first side wall, the first table top is located on the surface of the side, away from the substrate, of the first step part, and the distance between the main table top and the substrate is larger than that between the first table top and the substrate; the first side wall is located on the side, close to the substrate, of the first table top, the first side wall is obliquely arranged relative to the substrate and forms a first inclination angle, and the first inclination angle is larger than or equal to 20 degrees and smaller than or equal to 40 degrees. According to the invention, the condition that the photoresist is slightly thin in coating at a high abrupt slope boundary due to abrupt change of the height of the substrate is reduced, and the over-etching risk of a film layer in a subsequent process is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display panel, a preparation method thereof and a display device. BACKGROUND

[0002] Organic light emitting diode (OLED) display technology is considered as the most potential new display technology in the next generation. Compared with liquid crystal display technology, OLED display technology has the advantages of low energy consumption, low cost, self-luminous, wide viewing angle and fast response speed.

[0003] In the preparation process of a conventional OLED display panel, a fine metal mask (FMM) is usually used to realize patterning of a light-emitting pixel. The FMM technology is mature and has rich mass production experience. However, the FMM technology also has the problems of limited precision and high cost. The fine metal mask-free technology eliminates the limitations of the conventional OLED process on the size, resolution and other performance of the display screen, and has the advantages of high performance, full-size, and agile delivery. The patents CN118251982A, CN115666161A, CN116648095A, CN117062489A, CN118678742A, CN118785761A, CN115224220A, CN118678729A, CN118660529A and CN118660589A disclose the related content of the fine metal mask-free technology, which are referred to for reference.

[0004] However, there are display defects in the current OLED display products, and the process performance needs to be improved. SUMMARY

[0005] In order to overcome the technical problems mentioned in the above technical background, the embodiments of the first aspect of the present application provide a display panel, which comprises a display area and a non-display area, and comprises:

[0006] a substrate;

[0007] a blocking dam, disposed on one side of the substrate and located in the non-display area; the blocking dam comprises a main body part and a first step part, and the first step part is located between the substrate and the main body part;

[0008] The main body part comprises a main body mesa and a main body sidewall, the main body mesa is located on the surface of the main body part far from the substrate, and the main body sidewall is located on the side of the main body mesa close to the substrate; the first step part comprises a first mesa and a first sidewall, the first mesa is located on the surface of the first step part far from the substrate, and the distance between the main body mesa and the substrate is greater than the distance between the first mesa and the substrate; the first sidewall is located on the side of the first mesa close to the substrate, and the first sidewall is arranged to be inclined relative to the substrate and forms a first inclination angle, the first inclination angle is greater than or equal to 20° and less than or equal to 40°.

[0009] Optionally, the blocking dam further comprises a second step part located between the first step part and the main body part, the second step part comprises a second mesa and a second sidewall, the second mesa is located on the surface of the second step part far from the substrate, and the second sidewall connects the first mesa and the second mesa; the second mesa is located on the surface of the second step part far from the substrate, and the distance between the second mesa and the substrate is less than the distance between the main body mesa and the substrate and greater than the distance between the first mesa and the substrate.

[0010] Optionally, the second sidewall is arranged to be inclined relative to the plane in which the first mesa is located and forms a second inclination angle, the second inclination angle is greater than or equal to 20° and less than or equal to 40°.

[0011] Optionally, the blocking dam comprises a first sub-blocking layer and a second sub-blocking layer, the second sub-blocking layer is at least partially located on the side of the first sub-blocking layer far from the substrate, the main body part and the first step part are located on the second sub-blocking layer, and the orthographic projection of the main body part on the substrate at least partially overlaps the orthographic projection of the first sub-blocking layer on the substrate.

[0012] Optionally, the orthographic projection of the boundary of the first step part close to the side of the main body part on the substrate is located outside the orthographic projection of the first sub-blocking layer on the substrate.

[0013] Optionally, the barrier dam comprises a first sub-barrier layer and a second sub-barrier layer, the second sub-barrier layer is at least partially located on a side of the first sub-barrier layer away from the substrate, the main body portion, the first step portion and the second step portion are located on the second sub-barrier layer, a projection of the first sub-barrier layer on the substrate is located within a projection of the second sub-barrier layer on the substrate, a projection of the main body portion on the substrate at least partially overlaps with a projection of the first sub-barrier layer on the substrate; a projection of the second step portion on the substrate is located between a projection of the first sub-barrier layer on the substrate and a projection of the first step portion on the substrate.

[0014] Optionally, a projection of a boundary of the first step portion on the substrate, which is close to a side of the main body portion, is spaced apart from a projection of a boundary of the first sub-barrier layer on the substrate.

[0015] Optionally, the barrier dam is at least partially arranged around the display area, and a size of the first mesa along an arrangement direction of the display area and the non-display area is 1 μm-10 μm.

[0016] Optionally, the barrier dam is at least partially arranged around the display area, and a size of the second mesa along an arrangement direction of the display area and the non-display area is 1 μm-10 μm.

[0017] Optionally, the main body portion is provided with the first step portion and the second step portion on both sides thereof.

[0018] Optionally, the display panel further comprises:

[0019] a pixel definition layer comprising a plurality of pixel openings located in the display area and a covering portion located in the non-display area, the covering portion is arranged on a side of the barrier dam away from the substrate, and a projection of the barrier dam on the substrate is located within a projection of the covering portion on the substrate;

[0020] Optionally, a surface of the pixel definition layer, which is close to the substrate, is in contact with a surface of the barrier dam, which is away from the substrate.

[0021] Optionally, the display panel further comprises:

[0022] an isolation structure arranged on a side of the pixel definition layer away from the substrate, and the isolation structure encloses a plurality of isolated openings;

[0023] Optionally, the pixel opening and the corresponding isolated opening are in communication, and are used for accommodating a light emitting device.

[0024] Optionally, a normal projection of the pixel opening on the substrate is located in a range of a normal projection of the isolation opening on the substrate.

[0025] Optionally, the isolation structure comprises an isolation part and a blocking part, the blocking part is located at a side of the isolation part away from the substrate, and a normal projection of the isolation part on the substrate is located in a normal projection of the blocking part on the substrate.

[0026] Optionally, the isolation structure further comprises a base part, the base part is located at a side of the isolation part close to the substrate.

[0027] Optionally, a normal projection of the isolation part on the substrate is located in a normal projection of the base part on the substrate.

[0028] Based on the same inventive concept, the embodiments of the second aspect of the present application provide a display panel, the display panel comprises a display area and a non-display area, and the display panel comprises:

[0029] a substrate;

[0030] a blocking dam, disposed at a side of the substrate and located in the non-display area, the blocking dam comprises a main part and one or more step parts, and the step part is located between the substrate and the main part;

[0031] the main part comprises a main terrace and a main sidewall, the main terrace is located at a surface of the main part away from the substrate, and the main sidewall is located at a side of the main terrace close to the substrate; the step part comprises a step terrace and a step sidewall, the step terrace is located at a surface of the step part away from the substrate, a distance between the main terrace and the substrate is greater than a distance between the step terrace and the substrate; the step sidewall is located at a side of the step terrace close to the substrate in the same step part, the step sidewall is inclined relative to the substrate and forms an inclination angle, and the inclination angle is greater than or equal to 20° and less than or equal to 40°.

[0032] Optionally, the step part comprises a first step part and a second step part, the second step part is located between the first step part and the main part, the first step part comprises a first terrace and a first sidewall, the first terrace is located at a surface of the first step part away from the substrate, a distance between the main terrace and the substrate is greater than a distance between the first terrace and the substrate, and the first sidewall is located at a side of the first terrace close to the substrate.

[0033] The second step portion is located between the first step portion and the main body portion, and comprises a second mesa and a second sidewall. The second mesa is located on a surface of the second step portion away from the substrate. The second sidewall connects the first mesa and the second mesa. The second mesa is located on a surface of the second step portion away from the substrate. A distance between the second mesa and the substrate is smaller than a distance between the main body mesa and the substrate, and larger than a distance between the first mesa and the substrate.

[0034] Based on the same inventive concept, the embodiment of the third aspect of the present application provides a preparation method of a display panel having a display area and a non-display area. The method comprises:

[0035] A barrier layer is made on one side of a substrate;

[0036] A barrier dam is formed on the barrier layer by using the same mask plate. The barrier dam comprises a main body portion and a first step portion. The first step portion is located between the substrate and the main body portion. The main body portion comprises a main body mesa and a main body sidewall. The main body mesa is located on a surface of the main body portion away from the substrate. The main body sidewall is located on a side of the main body mesa close to the substrate. The first step portion comprises a first mesa and a first sidewall. The first mesa is located on a surface of the first step portion away from the substrate. A distance between the main body mesa and the substrate is larger than a distance between the first mesa and the substrate. The first sidewall is located on a side of the first mesa close to the substrate. The first sidewall is arranged to be inclined relative to the substrate and forms a first inclination angle. The first inclination angle is greater than or equal to 20° and smaller than or equal to 40°.

[0037] Optionally, the mask plate comprises an opaque area, a second light-transmitting area and a first light-transmitting area. The second light-transmitting area is located between the opaque area and the first light-transmitting area. A light transmittance of the second light-transmitting area is smaller than a light transmittance of the first light-transmitting area.

[0038] The forming of the main body portion and the first step portion on the barrier layer by using the same mask plate comprises:

[0039] Photoresist is coated on the barrier layer. The photoresist is exposed by the mask plate. Then, the barrier layer is etched. The main body portion is formed in a region of the barrier layer corresponding to the opaque area. The first step portion is formed in a region of the barrier layer corresponding to the second light-transmitting area.

[0040] Optionally, the barrier dam includes a first sub-barrier layer and a second sub-barrier layer, the second sub-barrier layer is located on a side of the first sub-barrier layer away from the substrate, a projection of the first sub-barrier layer on the substrate is located within a projection of the second sub-barrier layer on the substrate, a projection of the main body portion on the substrate at least partially overlaps a projection of the first sub-barrier layer on the substrate; a projection of a boundary of the first step portion on the substrate, which is close to a side of the main body portion, is located on a side of a boundary of the first sub-barrier layer on the substrate away from the first sub-barrier layer.

[0041] Optionally, a projection of the boundary of the first step portion on the substrate, which is close to a side of the main body portion, is spaced apart from a projection of the boundary of the first sub-barrier layer on the substrate.

[0042] The forming of the barrier dam on the barrier layer by using the same mask plate includes:

[0043] A second step portion is formed at a position corresponding to a boundary of the light-shielding region and the second light-transmitting region, which is close to a side of the light-shielding region; a projection of the second step portion on the substrate is located between a projection of the first sub-barrier layer on the substrate and a projection of the first step portion on the substrate.

[0044] Optionally, the light-shielding region is provided with the second light-transmitting region and the first light-transmitting region on both sides of the light-shielding region.

[0045] Optionally, the method for manufacturing the display panel further includes:

[0046] A pixel definition layer is manufactured on a side of the barrier dam away from the substrate, the pixel definition layer is subjected to a patterning process to form a plurality of pixel openings located in the display region and a covering portion located in the non-display region, and a projection of the barrier dam on the substrate is located within a projection of the covering portion on the substrate.

[0047] Based on the same inventive concept, the embodiments of the fourth aspect of the present application provide a display device, which includes the display panel of any one of the embodiments of the first aspect or the second aspect, or the display panel obtained by the method for manufacturing the display panel of any one of the embodiments of the third aspect.

[0048] The technical scheme of the embodiment of the present application reduces the situation that the photoresist glue is too thin at the high and steep slope boundary due to the sudden change of the height of the substrate in the related structure, so that the photoresist glue can smoothly transition along the mesa and the sidewall of the corresponding step and be relatively uniformly covered, which can effectively reduce the risk of over-etching of the film layer in the subsequent process, improves the display defect, and improves the process performance. BRIEF DESCRIPTION OF DRAWINGS

[0049] In order to more clearly illustrate the technical scheme of the embodiment of the present application, the drawings required to be used in the embodiment will be briefly introduced below, and it should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0050] Figure 1 A schematic diagram of a partial structure of a display panel in a related technology;

[0051] Figure 2 A schematic diagram of a partial structure of a display panel in an embodiment of the present application;

[0052] Figure 3 A schematic diagram of a partial structure of a display panel in another embodiment of the present application;

[0053] Figure 4 A schematic diagram of a partial structure of a display panel in another embodiment of the present application;

[0054] Figure 5 A schematic diagram of a partial structure of a display panel in another embodiment of the present application;

[0055] Figure 6 A schematic diagram of a partial structure of a display panel in another embodiment of the present application;

[0056] Figure 7 A schematic diagram of a preparation method of a display panel in an embodiment of the present application;

[0057] Figure 8 A schematic diagram of a process in the preparation process of a display panel in an embodiment of the present application;

[0058] Figure 9 A schematic diagram of a process in the preparation process of a display panel in another embodiment of the present application;

[0059] Figure 10 A schematic diagram of a planar structure of a display panel in an embodiment of the present application;

[0060] Figure 11 FIG. 1 is a schematic diagram of a cross-sectional structure of an array substrate of a display panel according to an embodiment of the present application; Figure 10

[0061] Figure 12

[0062] Figure 13

[0063] Figure 14

[0064] Figure 15

[0065] Figure 16

[0066] Figure 17

[0067] Figure 18

[0068] Figure 19

[0069] Figure 20

[0070] Figure 21

[0071] Figure 22

[0072] Figure 23

[0073]

[0074] 10, display device; 100, display panel;

[0075] ​​​​​​​​​​​​​​11, array substrate; 12, isolation structure; 12a, isolation opening; 12a1, first isolation opening; 12a2, second isolation opening; 12a3, third isolation opening; 121, blocking part; 122, isolation part; 123, base part; 13, light emitting device; 131, first electrode; 132, light emitting structure; 133, second electrode; 13a, first light emitting device; 13b, second light emitting device; 13c, third light emitting device; 14, encapsulation part; 140, gap space; 141, first segment; 142, second segment; 14a, first encapsulation part; 14b, second encapsulation part; 14c, third encapsulation part; 15, second encapsulation layer; 16, third encapsulation layer; 17, pixel definition layer; 1701, first sub-layer; 1702, second sub-layer; 17a, pixel opening; 171, covering part; 18, transistor; 19, planarization layer;

[0076] 2, substrate; 3, blocking dam; 30, step part; 31, main body part; 311, main body mesa; 312, main body sidewall; 32, first step part; 321, first mesa; 322, first sidewall; 33, second step part; 331, second mesa; 332, second sidewall; 300, blocking layer; 301, first sub-blocking layer; 302, second sub-blocking layer;

[0077] 4, mask plate; 401, light shielding area; 402, second light transmission area; 403, first light transmission area. DETAILED DESCRIPTION

[0078] In order to make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the following will be combined with the accompanying drawings for the embodiments of the present application to make a clear and complete description of the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the accompanying drawings can be arranged and designed in various different configurations.

[0079] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without making creative efforts are within the scope of protection of the present application.

[0080] It should be noted that: similar reference numerals and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings. It should be noted that, in the case of no conflict, the different features in the embodiments of the present application can be combined with each other.

[0081] For easy understanding, the X-axis, Y-axis and Z-axis that are orthogonal to each other are shown in the drawings. The direction along the X-axis is referred to as the X direction, the direction along the Y-axis is referred to as the Y direction, and the direction along the Z-axis is referred to as the Z direction. The Z direction is the normal direction with respect to the plane containing the X direction and the Y direction. In addition, the case where various elements are observed in parallel with the plane containing the X direction and the Y direction is referred to as a plan view. Alternatively, the plane of the X direction and the Y direction is a plane parallel to the display surface of the display panel, and the Z direction is a direction parallel to the thickness direction of the display panel.

[0082] For some elements, the terms "upper" or "above" are sometimes used when describing the position of an element in the Z direction, and the terms "lower" or "below" are used when describing the position of an element in the opposite direction. In addition, when the terms "upper", "above", "lower", "below", "relative" and the like are used to define the positional relationship between two elements, they not only include the case where the two elements are directly connected, but also include the case where the two elements are separated by a gap, other elements. In addition, the terms "first", "second", "third" and the like are only used for differentiation and cannot be understood as indicating or implying relative importance.

[0083] In the production process of the display panel, many products have display defects such as yellowing in the RA reliability test.

[0084] Reference Figure 1 In the related art, the display panel 100 includes a substrate 2 and a barrier dam 3, and the side wall boundary of the barrier dam 3 is inclined with respect to the substrate 2 to form a steep slope, for example, the slope angle α of the steep slope is about 60 degrees. According to the analysis and research of the inventors, in the subsequent process, such as the preparation process of the pixel definition layer 17 and the light emitting device, when coating the photoresist, due to the height mutation, the photoresist at the boundary of the barrier dam 3 is difficult to form uniform coverage, and the photoresist is thin at the boundary of the steep slope. The thin photoresist cannot effectively protect the underlying film layer in the subsequent etching process, for example, the pixel definition layer 17 is easily over-etched, thereby causing the RA to fail.

[0085] Based on this, the present application provides a display panel solution to solve the above problems.

[0086] Figure 10 is a structural schematic diagram of a display panel 100 according to an embodiment of the present application. The display panel 100 can be an organic light emitting diode display panel (Organic Light Emitting Diode, abbreviated as OLED), a quantum dot electroluminescent display panel (Quantum Dot Light Emitting Diodes, abbreviated as QLED). The display panel 100 includes a display area AA having a display function and a non-display area NA.

[0087] The display area AA of the display panel 100 can be in a rectangular shape, or in a square, circular, or elliptical shape, or other shapes.

[0088] The display area AA includes a plurality of pixels PX arranged in the X direction and the Y direction. The pixel PX includes a plurality of sub-pixels SPX displaying different colors. In some embodiments, the pixel PX includes a first sub-pixel SPX1, a second sub-pixel SPX2, and a third sub-pixel SPX3, for example, the first sub-pixel SPX1 is a blue sub-pixel, the second sub-pixel SPX2 is a green sub-pixel SPX2, and the third sub-pixel SPX3 is a red sub-pixel SPX3. In some embodiments, the pixel PX includes a sub-pixel SPX emitting white or other color light in addition to the sub-pixels SPX1, SPX2, and SPX3.

[0089] The sub-pixel SPX includes a pixel circuit and a light emitting device driven by the pixel circuit to emit light of a corresponding color. The first sub-pixel SPX1 includes a first light emitting device, the second sub-pixel SPX2 includes a second light emitting device, and the third sub-pixel SPX3 includes a third light emitting device. One pixel circuit drives at least one light emitting device to emit light. For example, the display area AA includes a normal display area and a light transmission display area, the light transmission display area is a display area corresponding to a sensor and having light transmission performance, and the normal display area is a display area not corresponding to the sensor. In the normal display area, one pixel circuit drives one light emitting device to emit light, and in the light transmission display area, one pixel circuit drives one or more light emitting devices to emit light.

[0090] Reference Figure 2 In some embodiments provided in the present application, the display panel 100 includes a substrate 2 and a barrier dam 3, the barrier dam 3 is arranged on one side of the substrate 2, and the barrier dam 3 is located in the non-display area NA. The barrier dam 3 includes a main body part 31 and a first step part 32, and the first step part 32 is located between the substrate 2 and the main body part 31.

[0091] The main body part 31 includes a main body mesa 311 and a main body side wall 312, the main body mesa 311 is located on the surface of the main body part 31 away from the substrate 2, and the main body side wall 312 is located on the side of the main body mesa 311 close to the substrate 2; the first step part 32 includes a first mesa 321 and a first side wall 322, the first mesa 321 is located on the surface of the first step part 32 away from the substrate 2, and the distance between the main body mesa 311 and the substrate 2 is greater than the distance between the first mesa 321 and the substrate 2; the first side wall 322 is located on the side of the first mesa 321 close to the substrate 2 and is connected in intersection, and the first side wall 322 is arranged obliquely relative to the substrate 2 and forms a first inclination angle β1, the first inclination angle β1 is greater than or equal to 20° and less than or equal to 40°. For example, the first inclination angle β1 is preferably 30°. The first inclination angle β1 can also be 20°, 25°, 35°, 40°, etc.

[0092] The mesa height of the main body part 31 is greater than the mesa height of the first step part 32, and the substrate 2 is taken as a reference, so that a structure of intermediate thickness and at least one relatively thin side is formed. The range of the first inclination angle limits the side wall of the first step part 32 to be a gentle slope, which is more advantageous than a steep slope structure. When the photoresist is coated in the preparation process, it will gradually transition along the first mesa 321 and the first side wall 322, thereby avoiding the photoresist from being significantly thinned due to a sudden height change, reducing the risk of over-etching of the subsequent film layer, and further improving the display effect. The height difference between the main mesa and the first mesa not only ensures the blocking ability of the blocking dam, but also disperses the film layer stress through the stepped structure, thereby improving the stability in harsh environments (such as double 85 test).

[0093] In addition, when the inclination angle is limited to a range of 20°-40°, the gentle slope structure can make the photoresist transition smoothly along the step side wall and uniformly cover, effectively avoiding over-etching of the film layer. The inclination angle of 30° is the optimal value, at which the photoresist coverage uniformity is best, and the improvement effect on RA failure is most obvious. If the inclination angle is less than 20°, the gentle slope will result in a too large step horizontal size, occupying a large non-display area space, which is not conducive to narrow frame design. If the inclination angle is greater than 40°, it approaches a steep slope structure, and the photoresist is still prone to be thin at the boundary, which cannot effectively solve the problem of film layer over-etching.

[0094] Reference Figure 3 In some embodiments, the blocking dam 3 further includes a second step part 33 located between the first step part 32 and the main body part 31. The second step part 33 includes a second mesa 331 and a second side wall 332. The second mesa 331 is located on the surface of the second step part 33 away from the substrate 2. The second side wall 332 connects the first mesa 321 and the second mesa 331. The distance between the second mesa 331 and the substrate 2 is less than the distance between the main mesa 311 and the substrate 2, and greater than the distance between the first mesa 321 and the substrate 2.

[0095] In optional embodiments, the second side wall 332 is inclined with respect to the plane in which the first mesa 321 is located and forms a second inclination angle β2. The second inclination angle is greater than or equal to 20° and less than or equal to 40°. For example, the second inclination angle β2 is preferably 30°. Of course, the second inclination angle β2 can also be 20°, 25°, 35°, 40°, etc.

[0096] Specifically, the mesa height of the second step portion 33 is between the mesa height of the main body portion 31 and the mesa height of the first step portion 32, and the second step portion 33 can form a transition platform between the first step portion 32 and the main body portion 31. When the photoresist is coated, the multi-step gentle transition of the first mesa 321, the second mesa 331, and the main body mesa 311 can further alleviate the height mutation and increase the uniformity of the photoresist coverage. Through the cooperation of the second inclination angle β2 and the first inclination angle β1, the whole path is realized without steep slope, and the situation of local photoresist thinning is further improved.

[0097] Reference Figure 5 In some embodiments, the blocking dam 3 includes a first sub-blocking layer 301 and a second sub-blocking layer 302, the second sub-blocking layer 302 is at least partially located on the side of the first sub-blocking layer 301 away from the substrate 2, the main body portion 31 and the first step portion 32 are located on the second sub-blocking layer 302, and the orthographic projection of the main body portion 31 on the substrate 2 at least partially overlaps the orthographic projection of the first sub-blocking layer 301 on the substrate 2. The blocking dam 3 adopts a structure of a first sub-blocking layer 301 and a second sub-blocking layer 302 stacked design, the first sub-blocking layer 301 is located below the second sub-blocking layer 302, which can provide stable support for the main body portion 31 and the first step portion 32, and guarantee the reliability of the gentle slope design.

[0098] In optional embodiments, the orthographic projection of the boundary of the first step portion 32 on the side close to the main body portion 31 on the substrate 2 is located outside the orthographic projection of the first sub-blocking layer 301 on the substrate 2, that is, the orthographic projection of the boundary of the first step portion 32 on the side close to the main body portion 31 on the substrate 2 is located on the side of the boundary of the orthographic projection of the first sub-blocking layer 301 on the substrate 2 away from the center of the first sub-blocking layer 301. Specifically, with the center of the first sub-blocking layer 301 as a reference, the boundary of the first step portion 32 on the side close to the main body portion 31 is located on the outside of the first sub-blocking layer 301.

[0099] Exemplarily, the first sub-blocking layer 301 is a first planarization layer, and the second sub-blocking layer 302 is a second planarization layer.

[0100] Reference Figure 4 , Figure 6In some embodiments, the barrier dam 3 comprises a first sub-barrier layer 301 and a second sub-barrier layer 302, the second sub-barrier layer 302 is at least partially located on a side of the first sub-barrier layer 301 away from the substrate 2, the main body part 31 and the first step part 32 are located on the second sub-barrier layer 302, and a projection of the first sub-barrier layer 301 on the substrate 2 is located within a projection of the second sub-barrier layer 302 on the substrate 2. A projection of the main body part 31 on the substrate 2 at least partially overlaps a projection of the first sub-barrier layer 301 on the substrate 2. A projection of the second step part 33 on the substrate 2 is located between a projection of the first sub-barrier layer 301 on the substrate 2 and a projection of the first step part 32 on the substrate 2. The "between" herein can include a case where the projection edges overlap, and also include a case where there is a gap between the projection edges.

[0101] In optional embodiments, a projection of a boundary of the first step part 32 on the substrate 2 on a side close to the main body part 31 is spaced apart from a projection of a boundary of the first sub-barrier layer 301 on the substrate 2. Specifically, a side wall of the main body part 31 forms a climbing profile when a side wall of the first sub-barrier layer 301 is covered by the second sub-barrier layer 302, so that the main body part 31 is shaped like the first sub-barrier layer 301. When the first step part 32 is etched, a second step part 33 is automatically formed between a boundary of the first step part 32 and a boundary of the side wall of the main body part 31, so that a height of the second mesa 331 is between a height of the main mesa 311 and a height of the first mesa 321.

[0102] In optional embodiments, a distance between the main mesa 311 and the second mesa 331 is smaller than a distance between the second mesa 331 and the first mesa 321, and also smaller than a distance between the first mesa 321 and the substrate 2. That is, a step height corresponding to the main body part 31 is lower than step heights of the first step part 32 and the second step part 33. It should be noted that the step height refers to a thickness of the step structure itself, and the mesa height refers to a distance in the thickness direction (i.e., the height direction) between the mesa of the step structure and the substrate.

[0103] In some embodiments, the barrier dam 3 is at least partially arranged around the display area AA, and a size of the first mesa 321 in an arrangement direction of the display area AA and the non-display area NA is 1 μm-10 μm. For example, the size of the first mesa 321 in the arrangement direction of the display area AA and the non-display area NA can be 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, etc. The arrangement direction of the display area AA and the non-display area NA includes a direction in which the display area AA points to the non-display area NA, and a direction in which the non-display area NA points to the display area AA.

[0104] The width of the first mesa 321 ranges from 1 μm to 10 μm, which can ensure that the first step portion 32 has sufficient space to realize the smooth transition of the photoresist, and avoid the photoresist from being too thin due to the narrow platform.

[0105] Specifically, the non-display area NA includes a frame area, the frame area surrounds the frame area of the display area AA, the blocking dam 3 can be located in the frame area, and surrounds the display area AA once, so as to form a closed structure, effectively block the material (such as IJP ink) in the non-display area NA from overflowing to the display area AA, protect the structure in the display area AA, and reduce adverse conditions caused by overflow.

[0106] Of course, it can be understood that, according to the actual product situation, the blocking dam 3 can also be partially arranged around the display area AA.

[0107] In some embodiments, the blocking dam 3 is arranged at least partially around the display area AA, and the size of the second mesa 331 in the arrangement direction of the display area and the non-display area ranges from 1 μm to 10 μm.

[0108] For example, the size of the second mesa 331 in the arrangement direction of the display area AA and the non-display area NA can be 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, etc.

[0109] The width of the second mesa 331 ranges from 1 μm to 10 μm. The width of 1 μm to 10 μm can ensure the transition effect of the second step portion 33, and form a double-platform buffer structure with the first step portion 32, so as to further optimize the uniformity of the photoresist distribution. In a conventional or wider dam (dam) design, that is, in a design of a wider blocking dam, the combination of the double steps and the reasonable width can realize the functions of preventing over-etching and preventing overflow in a limited space.

[0110] In some embodiments, the main body portion 31 is provided with the first step portion 32 and the second step portion 33 on both sides.

[0111] Specifically, the two first step portions 32 are distributed on opposite sides of the main body portion 31, and the two second step portions 33 are distributed on opposite sides of the main body portion 31. The two first step portions 32 and the two second step portions 33 are arranged on opposite sides of the main body portion 31, which can be suitable for the scene that there is a height difference on both sides of the main body portion 31. Through the double-sided step design, the photoresist on both sides can be smoothly transitioned, avoiding the risk of over-etching on the other side due to single-sided optimization, which is helpful to improve the performance of the blocking dam 3, and is especially suitable for the uniformity requirement of a large-size display panel.

[0112] Reference Figure 5 or Figure 6In some embodiments, the display panel 100 further comprises a pixel defining layer 17, the pixel defining layer 17 comprises a plurality of pixel openings 17a located in the display area AA and a cover portion 171 located in the non-display area NA, the cover portion 171 is arranged on the side of the barrier dam 3 away from the substrate 2, and the orthogonal projection of the barrier dam 3 on the substrate 2 is located in the orthogonal projection of the cover portion 171 on the substrate 2.

[0113] Optionally, the surface of the pixel defining layer 17 close to the substrate 2 is in contact with the surface of the barrier dam 3 away from the substrate 2.

[0114] Specifically, the cover portion 171 completely covers the barrier dam 3, on the one hand, it protects the barrier dam 3 from being excessively eroded in the etching process, such as in the etching process of the pixel defining layer 17, on the other hand, it makes the pixel defining layer 17 and the barrier dam 3 form an interlayer wrapping, enhances the overall structure sealing, reduces the penetration of moisture or impurities, and improves the stability in the reliability test such as double 85.

[0115] Reference Figure 11 , the display panel 100 further comprises an isolation structure 12, the isolation structure 12 is arranged on the side of the pixel defining layer 17 away from the substrate 2, and the isolation structure 12 encloses a plurality of isolation openings 12a.

[0116] In an optional embodiment, the pixel opening 17a is in communication with the corresponding isolation opening 12a for accommodating the light emitting device 13.

[0117] In an optional embodiment, the orthogonal projection of the pixel opening 17a on the substrate 2 is located in the range of the orthogonal projection of the isolation opening 12a on the substrate 2.

[0118] Specifically, in an embodiment, Figure 11 shows Figure 10 partial film layer cross-sectional structure schematic diagram of the display panel 100 in the B-B direction. Reference Figure 11 , the display panel 100 comprises an array substrate 11, an isolation structure 12 and a plurality of light emitting devices 13. Among them, the array substrate 11 comprises the substrate 2 in the above-mentioned embodiments.

[0119] Reference Figure 12 , the array substrate 11 comprises a pixel circuit layer and a planarization layer 19, the pixel circuit layer comprises a pixel circuit for driving the light emitting device 13 to emit light, Figure 12 shows a transistor 18 in the pixel circuit, a via is arranged in the planarization layer 19, and the first electrode 131 is electrically connected with the transistor 18 in the pixel circuit layer through the via. In addition, the pixel circuit layer further comprises at least one insulating layer, which can comprise at least one of inorganic layer and organic layer. In addition, the array substrate 11 further comprises a scan line for providing a scan signal Scan for the pixel circuit and a data line for providing a data signal Data.

[0120] Referring to Figure 13 , the pixel circuit comprises a driving transistor T1 and a data transistor T2, a source of the data transistor T2 is connected to a data line providing a data signal Data, a gate of the data transistor T2 is connected to a scan line providing a scan signal Scan, a drain of the data transistor T2 is connected to a gate of the driving transistor T1, two ends of a storage capacitor C1 are connected to the gate and a source of the driving transistor T1 respectively, and a drain of the driving transistor T1 is connected to the light emitting device 13. Figure 13 is an embodiment of the pixel circuit, the pixel circuit of the present application is not limited to Figure 13 the 2T1C pixel circuit shown in the figure, but can also be other pixel circuits, such as 7T1C, 8T1C pixel circuits, etc.

[0121] Referring to Figure 11 , Figure 14 , the isolation structure 12 is located on one side of the array substrate 11 and encloses a plurality of isolation openings 12a, the plurality of isolation openings 12a comprises a plurality of first isolation openings 12a1, a plurality of second isolation openings 12a2 and a plurality of third isolation openings 12a3. The plurality of light emitting devices 13 is located on one side of the array substrate 11, and the plurality of light emitting devices 13 comprises a plurality of first light emitting devices 13a, a plurality of second light emitting devices 13b and a plurality of third light emitting devices 13c, the first light emitting device 13a is arranged corresponding to the first isolation opening 12a1, the second light emitting device 13b is arranged corresponding to the second isolation opening 12a2, and the third light emitting device 13c is arranged corresponding to the third isolation opening 12a3. In an embodiment, one light emitting device 13 is arranged corresponding to one isolation opening 12a, for example, the first light emitting device 13a is arranged corresponding to the first isolation opening 12a1 one by one, the second light emitting device 13b is arranged corresponding to the second isolation opening 12a2 one by one, and the third light emitting device 13c is arranged corresponding to the third isolation opening 12a3 one by one. At least part of the first light emitting device 13a is arranged in the corresponding first isolation opening 12a1, at least part of the second light emitting device 13b is arranged in the corresponding second isolation opening 12a2, and at least part of the third light emitting device 13c is arranged in the corresponding third isolation opening 12a3. In another embodiment, a plurality of light emitting devices 13 are arranged corresponding to one isolation opening 12a, for example, a plurality of light emitting devices with the same color are arranged corresponding to one isolation opening 12a.

[0122] Further, referring to Figure 15 , the isolation structure 12 comprises an isolation portion 122 and a blocking portion 121, the blocking portion 121 is located on a side of the isolation portion 122 away from the substrate 2, and a normal projection of the isolation portion on the substrate 2 is located within a normal projection of the blocking portion on the substrate 2.

[0123] In an optional embodiment, the isolation structure 12 further comprises a base 123 located on the side of the isolation portion 122 close to the substrate 2.

[0124] In an optional embodiment, the orthogonal projection of the isolation portion 122 on the substrate 2 is located within the orthogonal projection of the base 123 on the substrate 2.

[0125] In one example, the isolation structure 12 comprises the isolation portion 122 and the barrier portion 121 stacked in the direction away from the array substrate 11 (i.e. the Z direction), and the width of the barrier portion 121 is greater than the width of the isolation portion 122. Thus, the two end portions of the barrier portion 121 are protrudingly arranged compared to the side surface of the isolation portion 122, and the shape of such isolation structure 12 is also referred to as overhanging. The materials of the isolation portion 122 and the barrier portion 121 are different, and the etching rate of the barrier portion 121 is less than the etching rate of the isolation portion 122. The material of the isolation portion 122 comprises a conductive material, and specifically can comprise at least one of aluminum (Al) and an aluminum alloy, which can comprise at least one of an aluminum-neodymium alloy (AlNd), an aluminum-yttrium alloy (AlY), or an aluminum-silicon alloy (AlSi). The barrier portion 121 can be a single-layer structure or a multi-layer structure. In the case that the barrier portion 121 is a single-layer structure, the material of the barrier portion 121 can comprise at least one of titanium, titanium nitride, molybdenum, tungsten, a molybdenum-tungsten alloy, or a molybdenum-niobium alloy.

[0126] Reference is made to Figure 17 In the case that the barrier portion 121 is a multi-layer structure, one of the materials of the barrier portion 121 comprises at least one of titanium, titanium nitride, molybdenum, tungsten, a molybdenum-tungsten alloy, or a molybdenum-niobium alloy, and the other material of the barrier portion 121 can comprise a conductive oxide or an inorganic insulating material, such as indium tin oxide (ITO) or indium zinc oxide (IZO).

[0127] Reference is made to Figure 15 、 Figure 16 In some embodiments, the isolation structure 12 can further comprise a base 123 located on the side of the isolation portion 122 close to the array substrate 11, the base 123 is protrudingly arranged relative to the isolation portion 122 in the direction towards the isolation opening 12a, and the orthogonal projection of the isolation portion 122 on the array substrate 11 is located within the orthogonal projection of the base 123 on the array substrate 11. The material of the base 123 can comprise at least one of molybdenum (Mo), titanium (Ti), titanium nitride (TiN), a molybdenum-tungsten alloy (MoW), or a molybdenum-niobium alloy (MoNb).

[0128] In an embodiment, the isolation structure 12 is disposed on the pixel defining layer 17. In the display area, the pixel defining layer 17 is provided with pixel openings in communication with the isolation openings 12a, specifically, the pixel defining layer 17 is provided with a first pixel opening in communication with the first isolation opening 12a1, a second pixel opening in communication with the second isolation opening 12a2, and a third pixel opening in communication with the third isolation opening 12a3. The areas of the orthographic projections of the first pixel opening, the second pixel opening, and the third pixel opening on the array substrate 11 are the same or different. The shapes of the orthographic projections of the pixel openings and the corresponding isolation openings 12a on the array substrate 11 can be the same or different. Generally, the area of the orthographic projection of the isolation opening 12a on the array substrate 11 is greater than the area of the orthographic projection of the pixel opening in communication with the isolation opening 12a on the array substrate 11. The orthographic projection of the pixel opening of the light emitting device 13 on the array substrate 11 overlaps with the orthographic projection of the isolation opening 12a on the array substrate 11. The material of the pixel defining layer 17 is an inorganic material, for example, the pixel defining layer 17 is formed of an inorganic insulating material such as at least one of silicon nitride (SiNx), silicon oxide (SiOx), and silicon oxynitride (SiON).

[0129] Reference Figure 18 In an embodiment, the pixel defining layer 17 includes a plurality of sub-layers, and the plurality of sub-layers include a first sub-layer 1701 and a second sub-layer 1702 disposed in sequence away from the array substrate 11, that is, the pixel defining layer 17 can adopt a double-layer design.

[0130] For example, the film-forming property of the first sub-layer 1701 is better than that of the second sub-layer 1702. That is, under the condition of the same thickness, the first sub-layer 1701 can better cover the step structure formed by the first electrode and will not produce cracks. Conversely, to obtain the same step coverage effect, the thickness of the first sub-layer 1701 is required to be thinner than that of the second sub-layer 1702, that is, the thickness requirement of the first sub-layer is relatively low, which is beneficial to the thinning of the product, and in addition, good film-forming property means good coverage of the formed film, which is more compact and is more conducive to the isolation of water vapor.

[0131] For example, the etching resistance of the second sub-layer 1702 is better than that of the first sub-layer 1701. Since the side of the pixel defining layer 17 away from the array substrate 11 will be etched during the preparation of the display panel, by selecting a material with better etching resistance as the second sub-layer 1702, the etching resistance of the pixel defining layer 17 can be improved, and the reliability of the display panel can be further improved.

[0132] For example, the material of the first sub-layer 1701 includes silicon nitride, and the material of the second sub-layer 1702 includes silicon oxide.

[0133] Exemplarily, the thickness of the first sub-layer 1701 is greater than or equal to 1000 angstroms and less than or equal to 5000 angstroms. For example, the thickness of the first sub-layer 1701 is 1000 angstroms, 2000 angstroms, 3000 angstroms, 4000 angstroms, 5000 angstroms, etc.

[0134] Exemplarily, the thickness of the second sub-layer 1702 is greater than or equal to 500 angstroms and less than or equal to 3000 angstroms. For example, the thickness of the second sub-layer 1702 is 500 angstroms, 1000 angstroms, 2000 angstroms, 3000 angstroms, etc.

[0135] In another embodiment, the isolation structure 12 is arranged in the groove of the pixel defining layer 17. Alternatively, the pixel defining layer 17 can not be arranged in the display panel 100, and the isolation structure 12 is arranged on the side of the array substrate 11 and in contact with the side of the array substrate 11.

[0136] The first light emitting device 13a, the second light emitting device 13b and the third light emitting device 13c respectively emit light of different colors; the first light emitting device 13a, the second light emitting device 13b and the third light emitting device 13c each include a first electrode 131, a light emitting structure 132 and a second electrode 133 arranged in a stack. The first electrode 131 is arranged on the array substrate 11, the pixel defining layer 17 covers the end of the first electrode 131, and the pixel defining layer 17 is provided with a pixel opening, and the first electrode 131 is exposed through the pixel opening. The light emitting structure 132 of the first light emitting device 13a, the second light emitting device 13b and the third light emitting device 13c covers the sidewall of the pixel opening of the pixel defining layer 17 and the side of the pixel defining layer 17 away from the array substrate 11. Each light emitting structure 132 is located in the pixel opening and in contact with the first electrode 131.

[0137] The second electrode 133 of the first light emitting device 13a, the second light emitting device 13b and the third light emitting device 13c respectively covers the corresponding light emitting structure 132. The second electrode 133 is electrically connected with the isolation structure 12. For example, referring to Figure 15 , the second electrode 133 is connected with the isolation part 122 of the isolation structure 12, and / or the second electrode 133 is connected with the base part 123 of the isolation structure 12.

[0138] Specifically, referring to Figure 15 , Figure 16 When the isolation structure 12 includes a three-layer structure of the blocking part 121, the isolation part 122 and the base part 123, the second electrode 133 can extend to the side surface of the base part 123 away from the array substrate 11 to be connected with the base part 123. At this time, the second electrode 133 can be connected with the isolation part 122 or not.

[0139] The first electrode 131 can be an anode, and the second electrode 133 can be a cathode. The first electrode 131 of each light emitting device 13 can be connected to the pixel circuit through a via hole, so that the pixel circuit drives the light emitting device 13 to emit light.

[0140] The first electrode 131 can include a multi-layer structure, such as the first electrode 131 including a reflective layer, and a pair of conductive oxide layers covering the upper surface and the lower surface of the reflective layer, respectively. The reflective layer can be formed, for example, using a metal material such as silver, which has excellent light reflectivity. Each conductive oxide layer can be formed, for example, of a transparent conductive oxide such as ITO (indium tin oxide), IZO (indium zinc oxide), or IGZO (indium gallium zinc oxide). The second electrode 133 is formed, for example, of a metal material such as an alloy of magnesium and silver (MgAg).

[0141] Figure 20 is a schematic view of the light emitting structure 132 of one embodiment of the present application. The light emitting structure 132 of at least one of the first light emitting device 13a, the second light emitting device 13b, and the third light emitting device 13c includes a hole injection layer HIL, a hole transport layer HTL, an electron blocking layer EBL, a light emitting material layer EML, a hole blocking layer HBL, an electron transport layer ETL, and an electron injection layer EIL, which are stacked in a direction away from the array substrate 11 (i.e., the Z direction). The light emitting structure 132 can include one light emitting material layer EML, or a stacked light emitting structure including a plurality of light emitting material layers EML.

[0142] In order for the light emitting structure 132 to emit light, a pixel voltage is supplied to the first electrode 131 and a common voltage is supplied to the second electrode 133, a potential difference is formed between the first electrode 131 and the second electrode 133, so that the light emitting structure 132 disposed between the first electrode 131 and the second electrode 133 emits light. In one embodiment, if a potential difference is formed between the first electrode 131 and the second electrode 133 of the first light emitting device 13a, the light emitting material layer EML of the light emitting structure 132 emits blue light, if a potential difference is formed between the first electrode 131 and the second electrode 133 of the second light emitting device 13b, the light emitting material layer EML of the light emitting structure 132 emits green light, and if a potential difference is formed between the first electrode 131 and the second electrode 133 of the third light emitting device 13c, the light emitting material layer EML of the light emitting structure 132 emits red light.

[0143] The pixel voltage of the first electrode 131 is supplied by the pixel circuit, and the common voltage of the second electrode 133 is supplied by the isolation structure 12. Specifically, the second electrode 133 is electrically connected to the isolation structure 12, and the common voltage is supplied to the second electrode 133 by supplying the common voltage to the isolation structure 12. That is, the isolation structure 12 has the function of supplying the common voltage to the second electrode 133.

[0144] The display panel 100 further comprises a first encapsulation layer, the first encapsulation layer comprising a plurality of encapsulation portions 14, the encapsulation portions 14 being located on a side of the second electrodes 133 facing away from the array substrate 11 and extending to a side of the isolation structures 12 facing away from the array substrate 11 via the sidewalls of the isolation structures 12. The plurality of encapsulation portions 14 comprises a plurality of first encapsulation portions 14a corresponding to the plurality of first light emitting devices 13a, a plurality of second encapsulation portions 14b corresponding to the plurality of second light emitting devices 13b, and a plurality of third encapsulation portions 14c corresponding to the plurality of third light emitting devices 13c, the first encapsulation portions 14a being arranged on a side of the corresponding first light emitting devices 13a facing away from the array substrate 11, the second encapsulation portions 14b being arranged on a side of the corresponding second light emitting devices 13b facing away from the array substrate 11, and the third encapsulation portions 14c being arranged on a side of the corresponding third light emitting devices 13c facing away from the array substrate 11. For reference Figure 19 For example, the encapsulation portion 14 comprises a first segment 141 and a second segment 142 connected to each other, the first segment 141 being located in the isolation opening 12a and arranged on a side of the light emitting device 13 facing away from the array substrate 11, and the second segment 142 being located on a side of the isolation structure 12 facing the isolation opening 12a, a side surface of the first segment 141 facing away from the array substrate 11 and a side surface of the second segment 142 facing away from the isolation structure 12 being at least partially connected to each other to form the gap space 140.

[0145] For reference Figure 15 For example, the side surface of the first segment 141 facing away from the array substrate 11 and the side surface of the second segment 142 facing away from the isolation structure 12 can also not be connected.

[0146] As shown in Figure 21 The display panel 10 further comprises a second encapsulation layer 15 and a third encapsulation layer 16, the second encapsulation layer 15 covering the isolation structures 12 and the encapsulation portions 14, and the third encapsulation layer 16 covering the second encapsulation layer 15. The first encapsulation layer and the third encapsulation layer 16 are both inorganic materials, and the materials of the first encapsulation layer and the third encapsulation layer 16 comprise at least one of silicon nitride (SiN), silicon oxide (SiO), and silicon oxynitride (SiON). The second encapsulation layer 15 is an organic insulating material, such as a resin material such as epoxy resin and acrylic resin. The non-display area NA comprises a frame area, and the second encapsulation layer 15 and the third encapsulation layer 16 are continuously arranged at least on the display area AA as a whole, and a part thereof is also arranged in the frame area.

[0147] The display panel 100 can further comprise at least one film layer such as a touch layer, a polarizer, a color film substrate, and a protective cover plate. The film layer can also be bonded to the display panel via an adhesive layer such as OCA (optically clear adhesive).

[0148] Based on the same inventive concept, the present embodiment also provides another display panel, for reference Figure 2 ,Figure 3 The display panel 100 includes a substrate 2 and a barrier dam 3 disposed on one side of the substrate 2, the barrier dam 3 being located in the non-display area NA. The barrier dam 3 includes a main body part 31 and one or more step parts 30 located between the substrate 2 and the main body part 31. The main body part 31 includes a main body terrace 311 located on the surface of the main body part 31 away from the substrate 2 and a main body sidewall 312 located on the side of the main body terrace 311 close to the substrate 2 and connected thereto. The step part 30 includes a step terrace located on the surface of the step part 30 away from the substrate 2, and the distance between the main body terrace 311 and the substrate 2 is greater than the distance between the step terrace and the substrate 2. The step sidewall is located on the side of the corresponding step terrace of the same step part 30 close to the substrate 2, and the step sidewall is inclined with respect to the substrate 2 and forms an inclination angle, the inclination angle being greater than or equal to 20° and less than or equal to 40°. For example, the inclination angle is preferably 30°. In addition, the inclination angle can also be 20°, 25°, 35°, 40°, etc.

[0149] In the display panel 100 provided by the embodiment of the present application, the barrier dam 3 can include one or more step parts 30, and the number of step parts 30 can be flexibly adapted to different scenarios, such as single-step for narrow dam design and multi-step for conventional dam design. At the same time, the inclination angle of the step sidewall is in the range of 20° to 40°, forming a gentle slope design, which can realize the gentle transition of photoresist, thereby solving the over-etching problem of subsequent film layers such as pixel definition layer.

[0150] Further, referring to Figure 3 The step part 30 includes a first step part 32 and a second step part 33, the second step part 33 being located between the first step part 32 and the main body part 31. The first step part 32 includes a first terrace 321 located on the surface of the first step part 32 away from the substrate 2, and the distance between the main body terrace 311 and the substrate 2 is greater than the distance between the first terrace 321 and the substrate 2, and a first sidewall 322 located on the side of the first terrace 321 close to the substrate 2. The second step part 33 is located between the first step part 32 and the main body part 31, and the second step part 33 includes a second terrace 331 located on the surface of the second step part 33 away from the substrate 2 and a second sidewall 332 connecting the first terrace 321 and the second terrace 331. The second terrace 331 is located on the surface of the second step part 33 away from the substrate 2, and the distance between the second terrace 331 and the substrate 2 is less than the distance between the main body terrace 311 and the substrate 2 and greater than the distance between the first terrace 321 and the substrate 2.

[0151] In an optional embodiment, the first side wall 322 is located at one side of the first mesa 321 close to the substrate 2, and is arranged to form a first inclination angle β1 with respect to the substrate 2, the first inclination angle β1 being greater than or equal to 20° and less than or equal to 40°. For example, the first inclination angle β1 is preferably 30°. In addition, the first inclination angle β1 can also be 20°, 25°, 35°, 40°, etc.

[0152] In an optional embodiment, the second side wall 332 is arranged to form a second inclination angle β2 with respect to the plane on which the first mesa 321 is located, the second inclination angle being greater than or equal to 20° and less than or equal to 40°. For example, the second inclination angle β2 is preferably 30°. Of course, the second inclination angle β2 can also be 20°, 25°, 35°, 40°, etc.

[0153] The double slope and height gradient formed by the first step portion 32 and the second step portion 33, i.e., the height of the first mesa is less than the height of the second mesa, which is less than the height of the main mesa, ensures uniform photoresist coverage. When the photoresist is coated, it can pass through the multi-step gentle transition of the first mesa 321, the second mesa 331 and the main mesa 311, which can further alleviate the height mutation and increase the uniformity of the photoresist coverage. Through the cooperation of the second inclination angle β2 and the first inclination angle β1, the full path is realized without steep slope, and the local photoresist thinning condition is improved. This design not only retains the optimization effect of the multi-step, but also simplifies the process control through the clear structural relationship, which is convenient for ensuring the step size and inclination angle precision in mass production, and stably improves the RA failure problem.

[0154] Based on the same inventive concept, the embodiment also provides a preparation method of a display panel, which is used to prepare the display panel 100 in any of the above embodiments. For details, please refer to Figure 7 to Figure 9 , Figure 7 which is a flowchart of the preparation method of the display panel, Figure 8 、 Figure 9 which is a process flowchart corresponding to the preparation method of the display panel. The following will be described in detail in combination with Figure 7 . Figure 7 to Figure 9 , each step of the preparation method of the display panel.

[0155] The preparation method of the display panel 100 specifically includes the following steps:

[0156] Step S10, a barrier layer 300 is made on one side of the substrate 2;

[0157] In step S20, the blocking dam 3 is formed on the blocking layer 300 by using the same mask plate 4, and the blocking dam 3 includes a main body part 31 and a first step part 32 located between the substrate 2 and the main body part 31. The main body part 31 includes a main body mesa 311 located on a surface of the main body part 31 away from the substrate 2 and a main body sidewall 312 located on a side of the main body mesa 311 close to the substrate 2. The first step part 32 includes a first mesa 321 located on a surface of the first step part 32 away from the substrate 2, and a distance between the main body mesa 311 and the substrate 2 is greater than a distance between the first mesa 321 and the substrate 2. The first step part 32 further includes a first sidewall 322 located on a side of the first mesa 321 close to the substrate 2, and the first sidewall 322 is arranged to be inclined relative to the substrate 2 and forms a first inclination angle, and the first inclination angle is greater than or equal to 20° and less than or equal to 40°.

[0158] In some embodiments, the mask plate 4 includes an opaque area 401, a second light-transmitting area 402, and a first light-transmitting area 403, and the second light-transmitting area 402 is located between the opaque area 401 and the first light-transmitting area 403. The light transmittance of the second light-transmitting area 402 is less than the light transmittance of the first light-transmitting area 403, and the light transmittance of the second light-transmitting area 402 is greater than the light transmittance of the opaque area 401.

[0159] In step S20, the blocking dam 3 is formed on the blocking layer 300 by using the same mask plate 4, and the blocking dam 3 includes a main body part 31 and a first step part 32 located between the substrate 2 and the main body part 31. The main body part 31 includes a main body mesa 311 located on a surface of the main body part 31 away from the substrate 2 and a main body sidewall 312 located on a side of the main body mesa 311 close to the substrate 2. The first step part 32 includes a first mesa 321 located on a surface of the first step part 32 away from the substrate 2, and a distance between the main body mesa 311 and the substrate 2 is greater than a distance between the first mesa 321 and the substrate 2. The first step part 32 further includes a first sidewall 322 located on a side of the first mesa 321 close to the substrate 2, and the first sidewall 322 is arranged to be inclined relative to the substrate 2 and forms a first inclination angle, and the first inclination angle is greater than or equal to 20° and less than or equal to 40°.

[0160] In step S20, the blocking dam 3 is formed on the blocking layer 300 by using the same mask plate 4, and the blocking dam 3 includes a main body part 31 and a first step part 32 located between the substrate 2 and the main body part 31. The main body part 31 includes a main body mesa 311 located on a surface of the main body part 31 away from the substrate 2 and a main body sidewall 312 located on a side of the main body mesa 311 close to the substrate 2. The first step part 32 includes a first mesa 321 located on a surface of the first step part 32 away from the substrate 2, and a distance between the main body mesa 311 and the substrate 2 is greater than a distance between the first mesa 321 and the substrate 2. The first step part 32 further includes a first sidewall 322 located on a side of the first mesa 321 close to the substrate 2, and the first sidewall 322 is arranged to be inclined relative to the substrate 2 and forms a first inclination angle, and the first inclination angle is greater than or equal to 20° and less than or equal to 40°.

[0161] In step S20, the blocking dam 3 is formed on the blocking layer 300 by using the same mask plate 4, and the blocking dam 3 includes a main body part 31 and a first step part 32 located between the substrate 2 and the main body part 31. The main body part 31 includes a main body mesa 311 located on a surface of the main body part 31 away from the substrate 2 and a main body sidewall 312 located on a side of the main body mesa 311 close to the substrate 2. The first step part 32 includes a first mesa 321 located on a surface of the first step part 32 away from the substrate 2, and a distance between the main body mesa 311 and the substrate 2 is greater than a distance between the first mesa 321 and the substrate 2. The first step part 32 further includes a first sidewall 322 located on a side of the first mesa 321 close to the substrate 2, and the first sidewall 322 is arranged to be inclined relative to the substrate 2 and forms a first inclination angle, and the first inclination angle is greater than or equal to 20° and less than or equal to 40°.

[0162] In an optional embodiment, the barrier dam 3 comprises a first sub-barrier layer 301 and a second sub-barrier layer 302, the second sub-barrier layer 302 is located on the side of the first sub-barrier layer 301 away from the substrate 2, and the orthographic projection of the first sub-barrier layer 301 on the substrate 2 is located within the orthographic projection of the second sub-barrier layer 302 on the substrate 2. The orthographic projection of the main body part 31 on the substrate 2 at least partially overlaps the orthographic projection of the first sub-barrier layer 301 on the substrate 2. The orthographic projection of the boundary of the first step part 32 on the substrate 2 on the side close to the main body part 31 is located on the side of the orthographic projection of the boundary of the first sub-barrier layer 301 on the substrate 2 away from the first sub-barrier layer 301. Specifically, with the center of the first sub-barrier layer 301 as a reference, the boundary of the first step part 32 on the side close to the main body part 31 is located on the outside of the first sub-barrier layer 301.

[0163] In an optional embodiment, the orthographic projection of the boundary of the first step part 32 on the substrate 2 on the side close to the main body part 31 and the orthographic projection of the boundary of the first sub-barrier layer 301 on the substrate 2 have a spacing therebetween.

[0164] Reference Figure 9 The step S20 of forming the barrier dam 3 on the barrier layer 300 by using the same mask plate 4 comprises:

[0165] The second step part 33 is formed at the position corresponding to the boundary of the barrier layer 300 and the second light-transmitting area 402 on the side close to the light-blocking area 401. The orthographic projection of the second step part 33 on the substrate 2 is located between the orthographic projection of the first sub-barrier layer 301 on the substrate 2 and the orthographic projection of the first step part 32 on the substrate 2.

[0166] Specifically, the second sub-barrier layer 302 covers the first sub-barrier layer 301, and the main body part 31 can be formed. The sidewall of the main body part 31 is a climbing profile formed when the sidewall of the first sub-barrier layer 301 is covered by the second sub-barrier layer 302, so that the main body part 31 is shaped like the first sub-barrier layer 301. When the first step part 32 is etched, the second step part 33 can be automatically formed between the boundary of the first step part 32 and the boundary of the sidewall of the main body part 31, so that the height of the second step 331 is located between the height of the main step 311 and the height of the first step 321.

[0167] Specifically, the mask plate 4 is a half-tone mask plate. The half-tone mask plate (HTM for short) generally has a full light-transmitting area, a half light-transmitting area and a light-blocking area. In this embodiment, the second light-transmitting area 402 is a half light-transmitting area, and the first light-transmitting area 403 is a full light-transmitting area. In the process of making the step part, the barrier layer 300 and the photoresist are stacked on the substrate 2, the photoresist is exposed by using the half-tone mask plate, and finally the barrier layer 300 is etched. Thus, the first step part 32 and / or the second step part 33 are formed, and only one half-tone mask plate is used, so that the manufacturing process is simple.

[0168] In an optional embodiment, the light shielding area 401 is provided with the second light transmission area 402 and the first light transmission area 403 on both sides. Correspondingly, the main body part 31 is provided with the first step part 32 and the second step part 33 on both sides.

[0169] In an optional embodiment, the preparation method of the display panel 100 further includes the following steps:

[0170] In step S30, the pixel definition layer 17 is made on the side of the barrier dam 3 away from the substrate 2, the pixel definition layer 17 is subjected to a patterning process, a plurality of pixel openings 17a located in the display area AA and a cover part 171 located in the non-display area NA are formed, and the orthogonal projection of the barrier dam 3 on the substrate 2 is located within the orthogonal projection of the cover part 171 on the substrate 2.

[0171] Reference Figure 22 In an optional embodiment, the preparation method of the display panel 100 further includes the following steps:

[0172] In step S41, the isolation structure 12 is made on one side of the array substrate 11, and the isolation structure 12 is provided with a plurality of isolation openings 12a, including a plurality of first isolation openings 12a1, a plurality of second isolation openings 12a2, and a plurality of third isolation openings 12a3. The array substrate 11 includes the substrate 2.

[0173] In step S42, the film layer of the first light emitting device 13a is made, and the film layer of the first light emitting device 13a includes the light emitting structure layer and the second electrode layer of the first light emitting device 13a.

[0174] In step S43, the first encapsulation layer of the first light emitting device 13a is made. Since the film layer of the first light emitting device 13a and the first encapsulation layer are both prepared as a whole layer, the positions of the plurality of first isolation openings 12a1, the plurality of second isolation openings 12a2, and the plurality of third isolation openings 12a3 are all provided with the film layer of the first light emitting device 13a and the first encapsulation layer.

[0175] In step S44, the film layer and the first encapsulation layer of the first light emitting device 13a at the positions of the plurality of second isolation openings 12a2 and the plurality of third isolation openings 12a3 are etched and removed, so that only the light emitting structure 132 and the second electrode 133 of the first light emitting device 13a and the first encapsulation part 14a of the first light emitting device 13a are formed at the positions of the plurality of first isolation openings 12a1.

[0176] Based on the steps S42 to S44, the light emitting structure 132 and the second electrode 133 of the second light emitting device 13b and the first encapsulation part 14b of the second light emitting device 13b are arranged at the positions of the plurality of second isolation openings 12a2, and the light emitting structure 132 and the second electrode 133 of the third light emitting device 13c and the first encapsulation part 14c of the third light emitting device 13c are arranged at the positions of the plurality of third isolation openings 12a3.

[0177] In some possible embodiments, with reference to Figure 23 The display device 10 can include a device having image processing capability, for example, a mobile phone, a desktop computer, a notebook computer, a tablet computer, a vehicle display, a wearable device, etc.

[0178] The above-described embodiments only express several embodiments of the present application, which are described in detail and specifically, but should not be understood as a limitation on the scope of the patent. It should be noted that for those skilled in the art, without departing from the concept of the present application, several modifications and improvements can be made, which are all within the scope of protection of the present application. Therefore, the scope of protection of the patent of the present application should be subject to the appended claims.

Claims

1. A display panel, characterized by, The display panel comprises a display area and a non-display area, and the display panel comprises: a substrate; a barrier dam disposed on one side of the substrate and located in the non-display area; the barrier dam comprises a main body part and a first step part located between the substrate and the main body part; the main body part comprises a main body mesa and a main body sidewall, the main body mesa is located on the surface of the main body part away from the substrate, and the main body sidewall is located on the side of the main body mesa close to the substrate; the first step part comprises a first mesa and a first sidewall, the first mesa is located on the surface of the first step part away from the substrate, the distance between the main body mesa and the substrate is greater than the distance between the first mesa and the substrate; the first sidewall is located on the side of the first mesa close to the substrate, and the first sidewall is inclined relative to the substrate and forms a first inclination angle, the first inclination angle is greater than or equal to 20° and less than or equal to 40°.

2. The display panel of claim 1, wherein, The barrier dam further comprises a second step part located between the first step part and the main body part, the second step part comprises a second mesa and a second sidewall, the second mesa is located on the surface of the second step part away from the substrate, and the second sidewall connects the first mesa and the second mesa; the second mesa is located on the surface of the second step part away from the substrate, the distance between the second mesa and the substrate is less than the distance between the main body mesa and the substrate, and greater than the distance between the first mesa and the substrate; Preferably, the second sidewall is inclined relative to the plane where the first mesa is located and forms a second inclination angle, the second inclination angle is greater than or equal to 20° and less than or equal to 40°.

3. The display panel of claim 1, wherein, The barrier dam comprises a first sub-barrier layer and a second sub-barrier layer, the second sub-barrier layer is at least partially located on the side of the first sub-barrier layer away from the substrate, the main body part and the first step part are located in the second sub-barrier layer, and the orthogonal projection of the main body part on the substrate at least partially overlaps the orthogonal projection of the first sub-barrier layer on the substrate; Preferably, the boundary of the side of the first step part close to the main body part has an orthogonal projection on the substrate, which is located outside the orthogonal projection of the first sub-barrier layer on the substrate.

4. The display panel of claim 2, wherein, The barrier dam comprises a first sub-barrier layer and a second sub-barrier layer, the second sub-barrier layer is at least partially located on the side of the first sub-barrier layer away from the substrate, the main body part, the first step part and the second step part are located in the second sub-barrier layer, the orthogonal projection of the first sub-barrier layer on the substrate is located in the orthogonal projection of the second sub-barrier layer on the substrate, and the orthogonal projection of the main body part on the substrate at least partially overlaps the orthogonal projection of the first sub-barrier layer on the substrate; The orthogonal projection of the second step part on the substrate is located between the orthogonal projection of the first sub-barrier layer on the substrate and the orthogonal projection of the first step part on the substrate; Preferably, a normal projection of a boundary of the first step portion on the substrate is spaced from a normal projection of a boundary of the first sub-barrier layer on the substrate.

5. The display panel of claim 1, wherein, The barrier dam is arranged at least partially around the display area, and a size of the first mesa along an arrangement direction of the display area and the non-display area is 1 μm-10 μm.

6. The display panel of claim 2, wherein, The barrier dam is arranged at least partially around the display area, and a size of the second mesa along an arrangement direction of the display area and the non-display area is 1 μm-10 μm.

7. The display panel of claim 2, wherein, The main body portion is provided with the first step portion and the second step portion on both sides thereof.

8. The display panel of claim 1, wherein, The display panel further comprises: A pixel definition layer comprises a plurality of pixel openings in the display area and a covering portion in the non-display area, the covering portion is arranged on a side of the barrier dam away from the substrate, and a normal projection of the barrier dam on the substrate is located within a normal projection of the covering portion on the substrate. Preferably, a surface of the pixel definition layer on a side close to the substrate is in contact with a surface of the barrier dam on a side away from the substrate.

9. The display panel of claim 8, wherein, The display panel further comprises: An isolation structure is arranged on a side of the pixel definition layer away from the substrate, and the isolation structure encloses a plurality of isolation openings. Preferably, the pixel opening is in communication with the corresponding isolation opening, and the isolation opening is used for accommodating a light emitting device. Preferably, a normal projection of the pixel opening on the substrate is located within a range of a normal projection of the isolation opening on the substrate.

10. The display panel of claim 9, wherein, The isolation structure comprises an isolation portion and a barrier portion, the barrier portion is located on a side of the isolation portion away from the substrate, and a normal projection of the isolation portion on the substrate is located within a normal projection of the barrier portion on the substrate. Preferably, the isolation structure further comprises a base portion, and the base portion is located on a side of the isolation portion close to the substrate. Preferably, a normal projection of the isolation portion on the substrate is located within a normal projection of the base portion on the substrate.

11. A display panel, characterized by, The display panel comprises a display area and a non-display area, and the display panel comprises: A substrate; A barrier dam is arranged on a side of the substrate and located in the non-display area, and the barrier dam comprises a main body portion and one or more step portions, the step portion is located between the substrate and the main body portion, the main body portion comprises a main body mesa and a main body side wall, the main body mesa is located on a surface of the main body portion away from the substrate, and the main body side wall is located on a side of the main body mesa close to the substrate, the step portion comprises a step mesa and a step side wall, the step mesa is located on a surface of the step portion away from the substrate, a distance between the main body mesa and the substrate is greater than a distance between the step mesa and the substrate, the step side wall is located on a side of the step mesa close to the substrate in the same step portion, the step side wall is arranged to be inclined relative to the substrate and forms an inclination angle, and the inclination angle is greater than or equal to 20° and less than or equal to 40°.

12. The display panel of claim 11, wherein, The step portion comprises a first step portion and a second step portion, the second step portion is located between the first step portion and the main body portion, the first step portion comprises a first mesa and a first sidewall, the first mesa is located on the surface of the first step portion far away from the substrate, the distance between the main body mesa and the substrate is greater than the distance between the first mesa and the substrate, and the first sidewall is located on the side of the first mesa close to the substrate; The second step portion is located between the first step portion and the main body portion, the second step portion comprises a second mesa and a second sidewall, the second mesa is located on the surface of the second step portion far away from the substrate, and the second sidewall connects the first mesa and the second mesa; the second mesa is located on the surface of the second step portion far away from the substrate, the distance between the second mesa and the substrate is less than the distance between the main body mesa and the substrate, and greater than the distance between the first mesa and the substrate.

13. A method for manufacturing a display panel, characterized by, The display panel has a display area and a non-display area, and the method comprises: A barrier layer is made on one side of a substrate; A barrier dam is formed on the barrier layer by using the same mask plate, the barrier dam comprises a main body portion and a first step portion, and the first step portion is located between the substrate and the main body portion; The main body portion comprises a main body mesa and a main body sidewall, the main body mesa is located on the surface of the main body portion far away from the substrate, and the main body sidewall is located on the side of the main body mesa close to the substrate; the first step portion comprises a first mesa and a first sidewall, the first mesa is located on the surface of the first step portion far away from the substrate, and the distance between the main body mesa and the substrate is greater than the distance between the first mesa and the substrate; the first sidewall is located on the side of the first mesa close to the substrate, the first sidewall is arranged to be inclined relative to the substrate and forms a first inclination angle, the first inclination angle is greater than or equal to 20° and less than or equal to 40°.

14. The method of manufacturing a display panel according to claim 13, wherein, The mask plate comprises an opaque area, a second light-transmitting area and a first light-transmitting area, the second light-transmitting area is located between the opaque area and the first light-transmitting area, and the light transmittance of the second light-transmitting area is less than that of the first light-transmitting area; The barrier dam is formed on the barrier layer by using the same mask plate, comprising: Photoresist is coated on the barrier layer, the photoresist is exposed through the mask plate, and then the barrier layer is etched, the main body portion is formed in the region of the barrier layer corresponding to the opaque area, and the first step portion is formed in the region of the barrier layer corresponding to the second light-transmitting area; Preferably, the barrier dam comprises a first sub-barrier layer and a second sub-barrier layer, the second sub-barrier layer is located on a side of the first sub-barrier layer away from the substrate, a projection of the first sub-barrier layer on the substrate is located within a projection of the second sub-barrier layer on the substrate, a projection of the main body portion on the substrate at least partially overlaps a projection of the first sub-barrier layer on the substrate; a projection of a boundary of the first step portion on the substrate near a side of the main body portion is located on a side of a projection of a boundary of the first sub-barrier layer on the substrate away from the first sub-barrier layer; Preferably, a projection of a boundary of the first step portion on the substrate near a side of the main body portion is spaced apart from a projection of a boundary of the first sub-barrier layer on the substrate; The forming of the barrier dam in the barrier layer using the same mask plate comprises: a second step portion is formed at a position corresponding to a boundary of the second light-transmitting area near the light-shielding area; a projection of the second step portion on the substrate is located between a projection of the first sub-barrier layer on the substrate and a projection of the first step portion on the substrate; Preferably, the light-shielding area is provided with the second light-transmitting area and the first light-transmitting area on both sides of the light-shielding area; Preferably, the preparation method of the display panel further comprises: a pixel definition layer is made on a side of the barrier dam away from the substrate, the pixel definition layer is subjected to a patterning process to form a plurality of pixel openings located in the display area and a cover portion located in the non-display area, a projection of the barrier dam on the substrate is located within a projection of the cover portion on the substrate.

15. A display device comprising: The display panel comprises the display panel of any one of claims 1 to 12, or the display panel obtained by the preparation method of the display panel of claim 13 or 14.

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