Display panel, manufacturing method thereof and display device

Abstract

The invention discloses a display panel, a manufacturing method thereof and a display device. The display panel comprises a substrate, a first interlayer film layer and a conductive part, the first interlayer film layer is arranged on the substrate, an opening is formed in the first interlayer film layer, and the first interlayer film layer is provided with a first surface which is far away from one side of the substrate and located on the peripheral side of the opening; the conductive part is arranged in the opening, and the conductive part is provided with a second surface far away from one side of the substrate; wherein a first distance is formed between the first surface and the substrate, a second distance is formed between the second surface and the substrate, and the absolute value of the difference value between the first distance and the second distance is smaller than the thickness of the conductive part; according to the display panel, the segment difference generated by forming the conductive part can be effectively reduced, the flatness of the film layer is improved, and the performance of the display panel is improved; in addition, the conductive part is located in the opening, the conductive part can be isolated by the first interlayer film layer, migration of metal ions can be reduced, and the probability of short circuit is reduced.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel, a method for manufacturing the same, and a display device. Background Technology

[0002] Organic light-emitting diode (OLED) display devices and glass-based Micro LED (Micro Light-Emitting Diode) display devices include top-emitting and bottom-emitting products.

[0003] Currently, in top-mounted display devices, due to the certain thickness of each electrode and trace, a certain step difference will be generated after the insulating layer covers the electrodes and traces, which will affect the yield of subsequent film layers and the performance of the display device. Summary of the Invention

[0004] This application provides a display panel and its manufacturing method, as well as a display device, which can reduce the step difference caused by forming conductive parts, improve the flatness of the film layer, and improve the performance of the display panel.

[0005] This application provides a display panel, which includes: substrate; A first spacer film layer is disposed on the substrate, an opening is formed in the first spacer film layer, and the first spacer film layer has a first surface on a side away from the substrate and located on the periphery of the opening. A conductive portion is disposed within the opening, and the conductive portion has a second surface on the side away from the substrate; Wherein, the first surface has a first gap with the substrate, the second surface has a second gap with the substrate, and the absolute value of the difference between the first gap and the second gap is less than the thickness of the conductive part.

[0006] In one embodiment of this application, the first spacing is greater than the second spacing.

[0007] In one embodiment of this application, the sidewall of the opening includes a first sidewall and a second sidewall connected to each other. The first sidewall is in contact with the conductive part, and the second sidewall is located on the side of the first sidewall away from the substrate. The included angle between the first sidewall and the second sidewall is greater than 0° and less than or equal to 180°.

[0008] In one embodiment of this application, the orthographic projection of the second sidewall on the substrate is located within the orthographic projection of the conductive portion on the substrate.

[0009] In one embodiment of this application, the end of the second sidewall near the first sidewall contacts the edge of the conductive portion, and the end of the second sidewall away from the first sidewall is inclined toward the center of the opening.

[0010] In one embodiment of this application, the conductive portion has a first side surface connected to the second surface, and the first spacer film layer covers the first side surface and a portion of the second surface. In one embodiment of this application, the orthographic projection of the second sidewall on the substrate is located outside the orthographic projection of the conductive portion on the substrate; The end of the second sidewall closest to the first sidewall contacts the edge of the conductive part, and the end of the second sidewall away from the first sidewall is inclined in a direction away from the center of the opening.

[0011] In one embodiment of this application, the distance from the side of the first sidewall away from the substrate to the center of the opening is greater than the distance from the side of the first sidewall closer to the substrate to the center of the opening.

[0012] In one embodiment of this application, the conductive portion has a first side surface that is opposite to and in contact with the first sidewall, and the distance from the side of the first side surface closer to the substrate to the center of the opening is less than the distance from the side of the first side surface farther from the substrate to the center of the opening.

[0013] In one embodiment of this application, the first spacing is equal to the second spacing.

[0014] In one embodiment of this application, the display panel further includes a second spacer layer disposed between the first spacer layer and the substrate, the conductive portion being disposed on the surface of the second spacer layer away from the substrate, and the etch selectivity of the material of the first spacer layer being different from the etch selectivity of the material of the second spacer layer.

[0015] In one embodiment of this application, the display panel further includes: A light-shielding layer is disposed on the substrate and includes a light-shielding portion; A semiconductor layer is disposed on the side of the light-shielding layer away from the substrate, and includes an active portion disposed on the side of the light-shielding portion away from the substrate; A first conductive layer is disposed on the side of the semiconductor layer away from the light-shielding layer, and includes a source, a drain, and a first fan-out trace, wherein the source and the drain are connected to the active portion; The second conductive layer is disposed on the side of the first conductive layer away from the semiconductor layer, and includes a transition line and a second fan-out trace; An anode layer is disposed on the side of the second conductive layer away from the first conductive layer and includes an anode, and the adapter wire is connected between the source and the anode, or the adapter wire is connected between the drain and the anode; The conductive part includes at least one of the following: the light-shielding part, the source electrode, the drain electrode, the adapter wire, the anode, the first fan-out trace, and the second fan-out trace.

[0016] In one embodiment of this application, when the conductive portion includes at least one of the light-shielding portion, the source electrode, the drain electrode, the adapter line, the first fan-out trace, and the second fan-out trace, the absolute value of the difference between the first spacing and the second spacing is a first difference range. When the conductive portion includes the anode, the absolute value of the difference between the first spacing and the second spacing is the second difference range. The maximum value of the first difference range is less than the maximum value of the second difference range.

[0017] In one embodiment of this application, when the conductive portion includes at least one of the light-shielding portion, the source electrode, the drain electrode, the adapter line, the first fan-out trace, and the second fan-out trace, the absolute value of the difference between the first spacing and the second spacing is greater than or equal to 0 micrometers and less than or equal to 0.3 micrometers. When the conductive portion includes the anode, the absolute value of the difference between the first spacing and the second spacing is greater than or equal to 0 micrometers and less than or equal to 4 micrometers.

[0018] In one embodiment of this application, the display panel further includes a pixel definition layer disposed on the side of the anode layer away from the second conductive layer, the pixel definition layer extending into the opening and covering a portion of the surface of the anode away from the substrate.

[0019] In one embodiment of this application, the display panel includes a plurality of conductive portions located on the same film layer, and the spacing between adjacent conductive portions is greater than 0 and less than 4.5 micrometers.

[0020] In accordance with the above-mentioned objectives of this application, embodiments of this application also provide a method for manufacturing a display panel, comprising: A first spacer film layer is formed on the substrate; An opening and a conductive portion located within the opening are formed in the first spacer film layer; wherein the first spacer film layer has a first surface located on a side away from the substrate and on the periphery of the opening, the first surface having a first gap with the substrate, the conductive portion having a second surface located on a side away from the substrate, the second surface having a second gap with the substrate, and the absolute value of the difference between the first gap and the second gap being less than the thickness of the conductive portion.

[0021] In one embodiment of this application, the step of forming a first spacer film layer on the substrate includes: The first spacer film layer and the third spacer film layer are sequentially formed on the substrate.

[0022] In one embodiment of this application, the step of forming an opening in the first spacer film layer and a conductive portion located within the opening includes: An initial opening is formed that passes through at least the third spacer membrane and the first spacer membrane, and at the inner wall of the initial opening, the side of the first spacer membrane is recessed inward relative to the side of the third spacer membrane in a direction away from the center of the initial opening; A conductive material layer is formed on the third spacer film layer, and the conductive material layer includes a conductive portion formed in the initial opening and a partition portion located on the side of the third spacer film layer away from the substrate, wherein the conductive portion and the partition portion are spaced apart. Remove the partition portion and the third spacer film layer to form the opening at the position of the first spacer film layer corresponding to the initial opening, and the conductive portion is located inside the opening.

[0023] In accordance with the above-mentioned objectives of this application, embodiments of this application also provide a display device, the display device including the display panel as described above.

[0024] This application provides a display panel and its manufacturing method and display device. By forming an opening in a first spacer film layer and then forming a conductive part in the opening, the step difference between the conductive part and the surface of the first spacer film layer is less than the thickness of the conductive part. This effectively reduces the step difference caused by forming the conductive part, improves the flatness of the film layer, and improves the performance of the display panel. In addition, since the conductive part is located in the opening, the conductive part is isolated by the first spacer film layer, which can reduce the migration of metal ions and reduce the probability of short circuit.

[0025] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0027] Figure 1 This is a schematic diagram of a first structure at the conductive portion provided in an embodiment of this application; Figure 2 This is a schematic diagram of a second structure at the conductive portion provided in an embodiment of this application; Figure 3 This is a schematic diagram of a third structure at the conductive portion provided in an embodiment of this application; Figure 4 This is a schematic diagram of a fourth structure at the conductive portion provided in an embodiment of this application; Figure 5 This is a schematic diagram of the structure of a display panel provided in an embodiment of this application; Figure 6 A flowchart illustrating the manufacturing method of the display panel provided in this application embodiment; Figures 7 to 10 This is a schematic diagram of the fabrication process of the conductive part provided in an embodiment of this application; Figures 11 to 18 This is a schematic diagram illustrating the manufacturing process of the display panel provided in an embodiment of this application. Detailed Implementation

[0028] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0029] Please refer to Figure 1 This application provides a display panel, which includes a substrate 10, a first spacer layer 20, and a conductive portion 30.

[0030] A first spacer film 20 is disposed on a substrate 10. An opening 210 is formed in the first spacer film 20. The first spacer film 20 has a first surface 201 located on the periphery of the opening 210 on a side away from the substrate 10. A conductive portion 30 is disposed in the opening 210 and has a second surface 301 on a side away from the substrate 10.

[0031] The first surface 201 has a first distance L1 between itself and the substrate 10, and the second surface 301 has a second distance L2 between itself and the substrate 10. The absolute value of the difference between the first distance L1 and the second distance L2 is less than the thickness of the conductive part 30.

[0032] In the implementation process, this embodiment forms an opening 210 in the first spacer film layer 20 and then forms a conductive part 30 in the opening 210. The step difference between the conductive part 30 and the surface of the first spacer film layer 20 is less than the thickness of the conductive part 30, thereby effectively reducing the step difference caused by forming the conductive part 30, improving the flatness of the film layer, and improving the performance of the display panel. In addition, since the conductive part 30 is located in the opening 210, the conductive part 30 will be isolated by the first spacer film layer 20, which can reduce the migration of metal ions and reduce the probability of short circuit.

[0033] It should be noted that the display panel provided in this application embodiment contains multiple conductive layers, and each conductive layer contains at least one conductive part 30. Since the conductive part 30 has a certain thickness, after the conductive part 30 is formed, a certain step difference will be formed in the film layer. This step difference will affect the preparation and yield of subsequent film layers, and thus affect the performance of the display panel. For example, if the flatness of the film layer at the anode layer is low, it will lead to a low yield of the subsequent light-emitting layer, which will seriously affect the luminous efficiency of the light-emitting layer.

[0034] Therefore, in this embodiment of the application, a first spacer film layer 20 with an opening 210 is first formed between the formation of the conductive portion 30, so that the conductive portion 30 can be formed in the opening 210, effectively reducing the step difference generated by the formation of the conductive portion 30.

[0035] It is understood that the fact that the first spacer layer 20 is disposed on the substrate 10 does not mean that the first spacer layer 20 is disposed on the surface of the substrate 10. The first spacer layer 20 is located on one side of the substrate 10, and other film layers may be disposed between the first spacer layer 20 and the substrate 10. The first spacer layer 20 may also be in contact with the substrate 10.

[0036] Please refer to Figure 1 In one specific embodiment of this application, the first spacing L1 is greater than the second spacing L2.

[0037] Specifically, a first spacer film 20 is disposed on a substrate 10, and an opening 210 is formed in the first spacer film 20, and a conductive portion 30 is disposed in the opening 210, and the top of the conductive portion 30 is lower than the top of the first spacer film 20.

[0038] The first spacer film layer 20 has a first surface 201 away from the substrate 10 and a sidewall 202 of the opening 210; the conductive part 30 has a second surface 301 away from the substrate 10 and a first side surface 302 connected to the second surface 301; that is, the second surface 301 is lower than the first surface 201.

[0039] The sidewall 202 includes a first sidewall 2021 and a second sidewall 2022 connected to each other. The first sidewall 2021 is in contact with the conductive part 30, and the second sidewall 2022 is located on the side of the first sidewall 2021 away from the substrate 10. The included angle α between the first sidewall 2021 and the second sidewall 2022 is greater than 0° and less than or equal to 180°. For example, the included angle α can be 10°, 20°, 30°, 40°, 50°, 60°, 70°, 80°, 90°, 100°, 110°, 120°, 130°, 140°, 150°, 160°, 170° or 180°.

[0040] Furthermore, the included angle α is greater than or equal to 90° and less than or equal to 180°; for example... Figure 1 In the embodiment shown, the included angle α is less than 180° but greater than 90°.

[0041] The distance from the side of the first sidewall 2021 away from the substrate 10 to the center of the opening 210 is greater than the distance from the side of the first sidewall 2021 near the substrate 10 to the center of the opening 210. In other words, the side of the first sidewall 2021 away from the substrate 10 is inclined in a direction away from the center of the opening 210. The end of the second sidewall 2022 near the first sidewall 2021 is in contact with the edge of the conductive part 30, and the end of the second sidewall 2022 away from the first sidewall 2021 is inclined in a direction near the center of the opening 210. The orthographic projection of the second sidewall 2022 on the substrate 10 is located within the orthographic projection of the conductive part 30 on the substrate 10.

[0042] Correspondingly, the first side 302 is in contact with the first sidewall 2021. Therefore, the distance from the side of the first side 302 closest to the substrate 10 to the center of the opening 210 is less than the distance from the side of the first side 302 furthest from the substrate 10 to the center of the opening 210. In other words, the end of the first side 302 furthest from the substrate 10 can be tilted in a direction away from the center of the opening 210.

[0043] It should be noted that the second sidewall 2022 protrudes outward relative to the first sidewall 2021 in a direction close to the center of the opening 210, thereby forming an undercut structure, which is more conducive to separating the conductive part 30 located inside the opening 210 from the film layer located outside the opening 210 when forming the conductive part 30.

[0044] In some embodiments, the display panel further includes a second spacer layer 40 disposed between the first spacer layer 20 and the substrate 10, and the second spacer layer 40 can be used to block etching during the formation of the opening 210 to protect the underlying film layer; therefore, the conductive portion 30 is disposed on the surface of the second spacer layer 40 away from the substrate 10, and the etching selectivity of the material of the first spacer layer 20 is different from that of the material of the second spacer layer 40. Furthermore, the etching rate of the material of the first spacer layer 20 is greater than that of the material of the second spacer layer 40.

[0045] In some embodiments, the material of the first spacer layer 20 may include silicon nitride or photoresist, and the material of the second spacer layer 40 may include silicon oxide or silicon nitride.

[0046] It is understood that the conductive part 30 can be any one or more of the multiple electrodes or traces in the display panel, and the first spacer layer 20 and the second spacer layer 40 are film layers adjacent to the conductive part 30, or they can be insulating film layers adjacent to the electrodes or traces in the display panel; therefore, the second spacer layer 40 can be in contact with the substrate 10, or other film layers can be disposed between the second spacer layer 40 and the substrate 10.

[0047] Please refer to Figure 2 In another specific embodiment of this application, this embodiment is similar to... Figure 1 The difference between the embodiments shown is that: Figure 1 In the illustrated embodiment, the first spacer film 20 covers the first side surface 302 of the conductive portion 30; while in this embodiment, the first spacer film 20 covers the first side surface 302 of the conductive portion 30 and a portion of the second surface 301, that is, the first spacer film 20 also extends to the second surface 301 of the conductive portion 30 and covers the edge of the conductive portion 30.

[0048] Furthermore, the end of the second sidewall 2022 away from the substrate 10 is inclined toward the center of the opening 210.

[0049] Please refer to Figure 3 In another specific embodiment of this application, this embodiment is similar to... Figure 1 The difference between the embodiments shown is that: Figure 1In the illustrated embodiment, the side of the second sidewall 2022 away from the substrate 10 is inclined toward the center of the opening 210; while in this embodiment, the orthographic projection of the second sidewall 2022 on the substrate 10 is outside the orthographic projection of the conductive part 30 on the substrate 10, the end of the second sidewall 2022 near the first sidewall 2021 is in contact with the edge of the conductive part 30, and the end of the second sidewall 2022 away from the first sidewall 2021 is inclined toward the center of the opening 210.

[0050] In some embodiments, the first sidewall 2021 and the second sidewall 2022 have the same inclination angle, that is, the first sidewall 2021 and the second sidewall 2022 are coplanar.

[0051] Following on, Figure 1 , Figure 2 as well as Figure 3 In the illustrated embodiment, during the manufacturing process of the display panel, a third spacer layer can be formed on the first spacer layer 20, and then an undercut opening can be formed in the third spacer layer and the first spacer layer 20. As a result, when the conductive part 30 is formed, the material used to prepare the conductive part 30 is isolated at the undercut opening. Therefore, when removing the material other than the conductive part 30, the etching process will not affect the conductive part 30, thus preventing the loss of the size of the conductive part 30. This results in a smaller spacing between multiple conductive parts 30 in the same film layer structure, increasing the effective wiring space in the display panel and which is beneficial for improving resolution.

[0052] exist Figure 1 , Figure 2 as well as Figure 3 In the embodiment shown, the depth of the opening 210 is equal to the thickness of the first spacer film 20.

[0053] In some embodiments, the display panel includes a plurality of conductive portions 30 located on the same film layer, and the spacing between adjacent conductive portions 30 is greater than 0 and less than 4.5 micrometers; for example, it can be 0.5 micrometers, 1 micrometer, 1.5 micrometers, 2 micrometers, 2.5 micrometers, 3 micrometers, 3.5 micrometers, 4 micrometers or 4.4 micrometers.

[0054] Please refer to Figure 4 In another specific embodiment of this application, this embodiment is similar to... Figure 3 The difference between the embodiments shown is that: Figure 3 In the illustrated embodiment, a second spacer layer 40 is formed between the first spacer layer 20 and the substrate 10; however, in this embodiment, no second spacer layer 40 is formed between the first spacer layer 20 and the substrate 10; and the depth of the opening 210 is less than the thickness of the first spacer layer 20, while the conductive portion 30 is located inside the opening 210, and the thickness of the conductive portion 30 is less than the depth of the opening 210.

[0055] It should be noted that, Figure 4 In the embodiment shown, during the manufacturing process of the display panel, the third spacer layer can be formed on the first spacer layer 20 without forming the second spacer layer 40 below the first spacer layer 20. Then, an undercut opening is formed in the third spacer layer and the first spacer layer 20. As a result, when the conductive part 30 is formed, the material used to prepare the conductive part 30 is isolated at the undercut opening. Therefore, when removing the material other than the conductive part 30, the etching process will not affect the conductive part 30, thus preventing the loss of the size of the conductive part 30. This results in a smaller spacing between multiple conductive parts 30 in the same layer of the same film structure, increasing the effective wiring space in the display panel and which is beneficial for improving the resolution.

[0056] In other embodiments of this application, the first spacing L1 may also be equal to the second spacing L2, that is, the thickness of the conductive part 30 is equal to the depth of the opening 210, and the second surface 301 of the conductive part 30 is flush with the first surface 201 of the first spacer film 20, so as to minimize the step difference and improve the flatness of the film.

[0057] Specifically, the distance from the side of the opening 210 away from the substrate 10 to the center of the opening 210 is greater than the distance from the side of the opening 210 close to the substrate 10 to the center of the opening 210. In other words, the side of the opening 210 away from the substrate 10 is inclined in a direction away from the center of the opening 210. Correspondingly, the distance from the side of the conductive part 30 close to the substrate 10 to the center of the opening 210 is less than the distance from the side of the conductive part 30 away from the substrate 10 to the center of the opening 210. In other words, the side of the conductive part 30 away from the substrate 10 can be inclined in a direction away from the center of the opening 210.

[0058] As described above, in the display panel provided in this application embodiment, each electrode or trace can be configured as shown in the conductive part 30 to improve the flatness of the film layer, reduce the size loss caused by etching, reduce the spacing between line electrodes or traces, and improve the resolution of the display panel. The structure of the conductive part 30 will be further explained below in conjunction with the specific structure of the display panel.

[0059] Please combine Figure 1 , Figure 2 , Figure 3 , Figure 4 as well as Figure 5The display panel includes a substrate 10, a first buffer layer 41 disposed on the substrate 10, a second buffer layer 21 and a light-shielding layer 51 disposed on the first buffer layer 41, a third buffer layer 61 disposed on the second buffer layer 21 and the light-shielding layer 51, a semiconductor layer 52 disposed on the third buffer layer 61, a gate insulating layer 62 disposed on the semiconductor layer 52, a gate 63 disposed on the gate insulating layer 62, an interlayer dielectric layer 64 disposed on the third buffer layer 61, the semiconductor layer 52 and the gate 63, and a first insulating layer 42 disposed on the interlayer dielectric layer 64. The first conductive layer 53 and the second insulating layer 22 are disposed on the first insulating layer 42, the third insulating layer 23 is disposed on the second insulating layer 22 and the first conductive layer 53, the second conductive layer 54 is disposed on the third insulating layer 23, the fourth insulating layer 65 is disposed on the third insulating layer 23 and the second conductive layer 54, the planarization layer 66 is disposed on the fourth insulating layer 65, the fifth insulating layer 43 is disposed on the planarization layer 66, the sixth insulating layer 24 and the anode layer 55 are disposed on the fifth insulating layer 43, and the pixel definition layer 68 is disposed on the sixth insulating layer 24 and the anode layer 55.

[0060] The light-shielding layer 51 is disposed on the substrate 10 and includes a light-shielding portion 31; the semiconductor layer 52 is disposed on the side of the light-shielding layer 51 away from the substrate 10 and includes an active portion 521 disposed on the side of the light-shielding portion 31 away from the substrate 10; the first conductive layer 53 is disposed on the side of the semiconductor layer 52 away from the light-shielding layer 51 and includes a source electrode 32, a drain electrode 33, and a first fan-out trace 34, and the source electrode 32 and the drain electrode 33 are connected to the active portion 521; the second conductive layer 54 is disposed on the side of the first conductive layer 53 away from the semiconductor layer 52 and includes a transition line 35 and a second fan-out trace 36; the anode layer 55 is disposed on the side of the second conductive layer 54 away from the first conductive layer 53 and includes an anode 37, and the transition line 35 is connected between the source electrode 32 and the anode 37, or the transition line 35 is connected between the drain electrode 33 and the anode 37.

[0061] In this embodiment, the conductive part 30 includes at least one of a light-shielding part 31, a source electrode 32, a drain electrode 33, a connecting wire 35, an anode 37, a first outgoing line 34, and a second outgoing line 36; that is, at least one of the light-shielding part 31, the source electrode 32, the drain electrode 33, the connecting wire 35, the anode 37, the first outgoing line 34, and the second outgoing line 36 can be configured using the structure of the conductive part 30 in the above embodiment, and can be adopted... Figures 1 to 4 Set any of the structures in it.

[0062] It is understandable that, since the above-mentioned structures in the display panel can be configured using the structure of the conductive part 30, the light-shielding part 31, source 32, drain 33, transition line 35, and anode 37 do not suffer dimensional loss during patterning, and the adjacent spacing can be made smaller, thereby increasing the effective wiring space and improving the resolution. Furthermore, since the first fan-out trace 34 and the second fan-out trace 36 can be configured using the structure of the conductive part 30, the effective wiring space can be increased, the area of ​​the non-display area can be reduced, and thus it is beneficial to realize a narrow bezel display panel. In addition, since the above-mentioned devices can be configured using the structure of the conductive part 30, it is beneficial to improve the flatness of the film layer in the display panel, which is beneficial to improving the performance of the display panel.

[0063] In some embodiments, the conductive portion 30 may include a light-shielding portion 31, and the first spacer layer 20 may include a second buffer layer 21, while the second spacer layer 40 may include the first buffer layer 41; wherein, the light-shielding portion 31 may employ, for example... Figure 1 Configure the structure shown.

[0064] In some embodiments, the conductive portion 30 may include a source electrode 32, a drain electrode 33, and a first fan-out trace 34, and the first spacer layer 20 may include a second insulating layer 22, and the second spacer layer 40 may include a first insulating layer 42; wherein, the source electrode 32, the drain electrode 33, and the first fan-out trace 34 may be adopted as follows: Figure 1 Configure the structure shown.

[0065] In some embodiments, the conductive portion 30 may include a transition cable 35 and a second outgoing line 36, and the first spacer layer 20 may include a third insulating layer 23; wherein, the transition cable 35 and the second outgoing line 36 may employ, for example... Figure 4 The structure shown is configured such that a second spacer layer 40 is not required.

[0066] The second outgoing cable 36 is connected to the first outgoing cable 34 to realize the switching of the outgoing cable.

[0067] In some embodiments, the conductive portion 30 may include an anode 37, and the first spacer layer 20 may include a sixth insulating layer 24, and the second spacer layer 40 may include a fifth insulating layer 43; wherein, the anode 37 may be made of, for example, Figure 3 Configure the structure shown.

[0068] The pixel definition layer 68 extends into the opening 210 and covers a portion of the surface of the anode 37 away from the substrate 10.

[0069] In this embodiment, when the conductive part 30 needs to be connected to the lower device through the contact hole, the opening 210 can be fabricated together with the contact hole, and a semi-transparent mask can be used for fabrication, thereby saving processes and reducing costs. For example, at the source 32 and the drain 33, the opening 210, the contact hole of the source 32 and the active part 521, and the contact hole of the drain 33 and the active part 521 can be fabricated together. At the anode 37, the opening 210 and the contact hole of the anode 37 and the drain 33 can be fabricated together.

[0070] In some embodiments, when the conductive part 30 includes at least one of the light-shielding part 31, source 32, drain 33, adapter line 35, first fan-out trace 34, and second fan-out trace 36, the absolute value of the difference between the first pitch L1 and the second pitch L2 is a first difference range; when the conductive part 30 includes an anode 37, the absolute value of the difference between the first pitch L1 and the second pitch L2 is a second difference range; wherein, the maximum value of the first difference range is less than the maximum value of the second difference range.

[0071] It is understandable that since a pixel opening needs to be formed at the anode 37, which itself has a large step difference, it is not necessary to control the step difference to be particularly small at the light-shielding part 31, source 32, drain 33, adapter line 35, first fan-out trace 34 and second fan-out trace 36. The step difference range can be slightly larger.

[0072] In some embodiments, when the conductive part 30 includes at least one of the light-shielding part 31, source 32, drain 33, adapter line 35, first outgoing line 34 and second outgoing line 36, the absolute value of the difference between the first spacing L1 and the second spacing L2 is greater than or equal to 0 micrometers and less than or equal to 0.3 micrometers; for example, it can be 0 micrometers, 0.1 micrometers, 0.15 micrometers, 0.2 micrometers, 0.25 micrometers or 0.3 micrometers.

[0073] In some embodiments, when the conductive portion 30 includes an anode 37, the absolute value of the difference between the first spacing L1 and the second spacing L2 is greater than or equal to 0 micrometers and less than or equal to 4 micrometers; for example, it can be 0 micrometers, 0.5 micrometers, 1 micrometer, 1.5 micrometers, 2 micrometers, 2.5 micrometers, 3 micrometers, 3.5 micrometers or 4 micrometers.

[0074] In some embodiments, the display panel may further include a light-emitting layer disposed on the anode 37, a cathode layer disposed on the light-emitting layer, and an encapsulation layer disposed on the cathode layer.

[0075] Continuing from the above, this embodiment of the application forms an opening 210 in the first spacer film layer 20, and then forms a conductive portion 30 within the opening 210. The step difference between the conductive portion 30 and the surface of the first spacer film layer 20 is less than the thickness of the conductive portion 30, thereby effectively reducing the step difference caused by forming the conductive portion 30, improving the film layer flatness, and enhancing the performance of the display panel. Furthermore, since the conductive portion 30 is located within the opening 210, it is isolated by the first spacer film layer 20, reducing the migration of metal ions and lowering the probability of short circuits. Because the above structure in the display panel can be configured using the structure of the conductive portion 30... Furthermore, the light-shielding part 31, source electrode 32, drain electrode 33, adapter line 35, and anode 37 do not suffer dimensional loss during patterning, and the adjacent spacing can be made smaller, which can increase the effective wiring space and improve the resolution. The first fan-out trace 34 and the second fan-out trace 36 can be set with the structure of the conductive part 30, which can further increase the effective wiring space and reduce the area of ​​the non-display area, thus facilitating the realization of a narrow bezel display panel. In addition, since the above-mentioned devices can be set with the structure of the conductive part 30, it is beneficial to improve the flatness of the film layer in the display panel and improve the performance of the display panel.

[0076] In addition, this application embodiment also provides a method for manufacturing the display panel described in the above embodiments. Please refer to... Figure 3 , Figure 6 , Figure 7 , Figure 8 , Figure 9 as well as Figure 10 The manufacturing method of this display panel includes: S10. A first spacer film layer 20 is formed on the substrate 10.

[0077] S20. An opening 210 and a conductive portion 30 located within the opening 210 are formed in the first spacer film layer 20. The first spacer film layer 20 has a first surface 201 located on the side away from the substrate 10 and on the periphery of the opening 210. The first surface 201 and the substrate 10 have a first distance L1. The conductive portion 30 has a second surface 301 located on the side away from the substrate 10. The second surface 301 and the substrate 10 have a second distance L2. The absolute value of the difference between the first distance L1 and the second distance L2 is less than the thickness of the conductive portion 30.

[0078] Specifically, in step S10, a first spacer film layer 20 and a third spacer film layer 70 are sequentially formed on the substrate 10.

[0079] In some embodiments, in step S10, a second spacer layer 40 is first formed on the substrate 10, and then a first spacer layer 20 and a third spacer layer 70 are sequentially formed on the second spacer layer 40, such as... Figure 7 As shown.

[0080] In step S20, an initial opening 701 is formed that passes through at least the third spacer layer 70 and the first spacer layer 20, and at the inner wall of the initial opening 701, the side of the first spacer layer 20 is recessed inward relative to the side of the third spacer layer 70 in a direction away from the center of the initial opening 701. Figure 8 As shown.

[0081] In some embodiments, the etching selectivity ratio of the materials of the first spacer layer 20, the second spacer layer 40, and the third spacer layer 70 is used to make the first spacer layer 20 recessed relative to the third spacer layer 70 during the etching process to form an undercut opening; for example, the etching rate of the first spacer layer 20 is greater than the etching rate of the second spacer layer 40 and the etching rate of the third spacer layer 70.

[0082] Depending on the selection of materials and the control of the etching process, the structure formed by the inward shrinkage of the sidewalls 202 of the first spacer layer 20 will also be different, for example... Figures 1 to 4 As shown.

[0083] In some embodiments, the film stack of the second spacer layer 40, the first spacer layer 20, and the third spacer layer 70 can be SiO / SiN / SiO, SiO / photoresist / SiO, or SiN / photoresist / SiO.

[0084] Then, a conductive material layer is formed on the third spacer film layer 70, and the conductive material layer includes a conductive portion 30 formed in the initial opening 701 and a partition portion 300 located on the side of the third spacer film layer 70 away from the substrate 10. The conductive portion 30 and the partition portion 300 are spaced apart. It can be understood that since an undercut opening is formed between the third spacer film layer 70 and the first spacer film layer 20, the conductive material can be partitioned at the undercut opening. During the subsequent etching process to remove the partition portion 300, the etching solution can be prevented from etching the conductive portion 30, thus avoiding the phenomenon of dimensional loss of the conductive portion 30.

[0085] Next, a photoresist 69 is formed within the initial opening 701, and the photoresist 69 covers the conductive portion 30, such as... Figure 9 As shown.

[0086] Then, the partition 300, part of the third spacer film 70, and part of the photoresist 69 are removed, such as Figure 10 As shown.

[0087] Next, the remaining third spacer layer 70 and photoresist 69 are removed to form an opening 210 at the position of the first spacer layer 20 corresponding to the initial opening 701, with the conductive portion 30 located within the opening 210, as shown. Figure 3 As shown.

[0088] When only the first spacer membrane 20 and the third spacer membrane 70 are formed in step S10, the initial opening 701 does not penetrate the first spacer membrane 20.

[0089] It should be noted that the above embodiments describe the preparation process of the conductive part 30 and the first spacer film layer 20. When the electrodes or traces in the display panel are configured as the structure of the conductive part 30, the preparation process described above can be used as a reference.

[0090] Specifically, please combine Figures 1 to 4 , Figure 5 , Figures 7 to 10 ,as well as Figures 11 to 18 The manufacturing methods for the display panel include: A first buffer layer 41, a second buffer layer 21, and a first sacrificial layer 71 are sequentially formed on the substrate 10; wherein, the first sacrificial layer 71 is the third spacer layer 70, the first buffer layer 41 is the second spacer layer 40, and the second buffer layer 21 is the first spacer layer 20, as shown below. Figure 11 As shown.

[0091] Then, the second buffer layer 21 and the first sacrificial layer 71 are etched, for example, by dry etching, to form multiple initial openings 701. The sidewall of the first sacrificial layer 71 protrudes outward relative to the sidewall of the second buffer layer 21 toward the center of the initial openings 701, to form an undercut opening between the first sacrificial layer 71 and the second buffer layer 21. Figure 12 As shown.

[0092] Next, a light-shielding material layer can be formed on the first sacrificial layer 71 using a physical vapor deposition process. The light-shielding material layer includes a light-shielding portion 31 formed in the initial opening 701 and a partition portion 300 formed on the side of the first sacrificial layer 71 away from the substrate 10. The light-shielding portion 31 is a conductive portion 30.

[0093] Furthermore, photoresist 69 is coated inside the initial opening 701 to cover the light-shielding portion 31, such as... Figure 13 As shown.

[0094] Then, a wet etching process can be used to remove the partition 300; at the same time, a portion of the first sacrificial layer 71 and a portion of the photoresist 69 can also be removed, such as... Figure 14 As shown.

[0095] Next, a dry etching process can be used to remove the remaining first sacrificial layer 71, and a photoresist stripping process can be used to remove the remaining photoresist 69, so as to form an opening 210 in the second buffer layer 21, with the light-shielding portion 31 located within the opening 210, as shown below. Figure 15 As shown.

[0096] Further, a third buffer layer 61 is formed on the second buffer layer 21 and the light-shielding layer 51, a semiconductor layer 52 is formed on the third buffer layer 61, a gate insulating layer 62 is formed on the semiconductor layer 52, a gate 63 is formed on the gate insulating layer 62, an interlayer dielectric layer 64 is formed on the third buffer layer 61, the semiconductor layer 52 and the gate 63, a first insulating layer 42 is formed on the interlayer dielectric layer 64, a first conductive layer 53 and a second insulating layer 22 are formed on the first insulating layer 42, a third insulating layer 23 is formed on the second insulating layer 22 and the first conductive layer 53, a second conductive layer 54 is formed on the third insulating layer 23, a fourth insulating layer 65 is formed on the third insulating layer 23 and the second conductive layer 54, a planarization layer 66 is formed on the fourth insulating layer 65, a fifth insulating layer 43 is formed on the planarization layer 66 and a sixth insulating layer 24 is formed on the fifth insulating layer 43.

[0097] The light-shielding layer 51 is disposed on the substrate 10 and includes a light-shielding portion 31; the semiconductor layer 52 is disposed on the side of the light-shielding layer 51 away from the substrate 10 and includes an active portion 521 disposed on the side of the light-shielding portion 31 away from the substrate 10; the first conductive layer 53 is disposed on the side of the semiconductor layer 52 away from the light-shielding layer 51 and includes a source electrode 32, a drain electrode 33 and a first fan-out trace 34, and the source electrode 32 and the drain electrode 33 are connected to the active portion 521; the second conductive layer 54 is disposed on the side of the first conductive layer 53 away from the semiconductor layer 52 and includes a transition line 35 and a second fan-out trace 36.

[0098] Next, a second sacrificial layer 72 is formed on the sixth insulating layer 24, and the second sacrificial layer 72 is the third spacer layer 70, the sixth insulating layer 24 is the first spacer layer 20, and the fifth insulating layer 43 is the second spacer layer 40.

[0099] The second sacrificial layer 72 and the sixth insulating layer 24 are patterned to form an initial opening 701 in the second sacrificial layer 72 and the sixth insulating layer 24, and the sidewall of the sixth insulating layer 24 is recessed relative to the sidewall of the second sacrificial layer 72 in a direction away from the center of the initial opening 701 to form an undercut opening, such as... Figure 16 As shown.

[0100] Then, an anode material layer is formed on the second sacrificial layer 72, and the anode material layer includes an anode 37 formed in the initial opening 701 and a partition portion 300 located on the side of the second sacrificial layer 72 away from the substrate 10.

[0101] Next, photoresist 69 is coated inside the initial opening 701, and photoresist 69 covers the conductive part 30.

[0102] Furthermore, removing the partition 300 may also involve removing part of the second sacrificial layer 72 and part of the photoresist 69, such as... Figure 17 As shown.

[0103] Then, a dry etching process can be used to remove the remaining second sacrificial layer 72, and a photoresist stripping process can be used to remove the remaining photoresist 69, so as to form an opening 210 in the sixth insulating layer 24, with the anode 37 located within the opening 210, as shown. Figure 18 As shown.

[0104] The adapter wire 35 is connected between the source electrode 32 and the anode 37, or the adapter wire 35 is connected between the drain electrode 33 and the anode 37.

[0105] Next, a pixel definition layer 68 is formed on the sixth insulating layer 24 and the anode layer 55, and the pixel definition layer 68 extends into the opening 210 and covers a portion of the surface of the anode 37 away from the substrate 10.

[0106] It should be noted that the above embodiments only describe the specific preparation process of the light-shielding part 31 and the anode 37, while the other conductive film layers in the display panel can also refer to the above preparation process, and will not be repeated here.

[0107] In some embodiments, the display panel may further include a light-emitting layer disposed on the anode 37, a cathode layer disposed on the light-emitting layer, and an encapsulation layer disposed on the cathode layer.

[0108] In summary, this embodiment of the application forms an opening 210 in the first spacer film layer 20, and then forms a conductive portion 30 within the opening 210. The step difference between the conductive portion 30 and the surface of the first spacer film layer 20 is less than the thickness of the conductive portion 30, thereby effectively reducing the step difference caused by forming the conductive portion 30, improving the film layer flatness, and enhancing the performance of the display panel. Furthermore, since the conductive portion 30 is located within the opening 210, it is isolated by the first spacer film layer 20, reducing the migration of metal ions and lowering the probability of short circuits. Because the above structure in the display panel can be configured using the structure of the conductive portion 30, wherein the bottom-cut opening is formed by the third spacer film layer 70, one By isolating the conductive part 30, the conductive part 30 is not affected by the etching solution. As a result, the light-shielding part 31, source 32, drain 33, transition line 35 and anode 37 do not suffer dimensional loss during the patterning process, and the adjacent spacing can be made smaller, which can increase the effective wiring space and improve the resolution. The first fan-out trace 34 and the second fan-out trace 36 can be set with the structure of the conductive part 30, which can further increase the effective wiring space and reduce the area of ​​the non-display area, thus facilitating the realization of a narrow bezel display panel. In addition, since the above-mentioned devices can be set with the structure of the conductive part 30, it is beneficial to improve the flatness of the film layer in the display panel, which is beneficial to improve the performance of the display panel.

[0109] In addition, this application embodiment also provides a display device, which includes a display panel as described in the above embodiments.

[0110] In some embodiments, the display device may include a mobile phone, television, computer, tablet, vehicle display, and virtual reality display device, etc.

[0111] It is understood that since the display device has the same display panel as in the above embodiments, the display device has the same beneficial effects as the display panel, which will not be repeated here.

[0112] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0113] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0114] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0115] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A display panel, characterized in that, include: substrate; A first spacer film layer is disposed on the substrate, an opening is formed in the first spacer film layer, and the first spacer film layer has a first surface on a side away from the substrate and located on the periphery of the opening. A conductive portion is disposed within the opening, and the conductive portion has a second surface on the side away from the substrate; Wherein, the first surface has a first gap with the substrate, the second surface has a second gap with the substrate, and the absolute value of the difference between the first gap and the second gap is less than the thickness of the conductive part.

2. The display panel according to claim 1, characterized in that, The first spacing is greater than the second spacing.

3. The display panel according to claim 2, characterized in that, The sidewall of the opening includes a first sidewall and a second sidewall connected to each other. The first sidewall is in contact with the conductive part, and the second sidewall is located on the side of the first sidewall away from the substrate. The included angle between the first sidewall and the second sidewall is greater than 0° and less than or equal to 180°.

4. The display panel according to claim 3, characterized in that, The orthographic projection of the second sidewall on the substrate lies within the orthographic projection of the conductive portion on the substrate.

5. The display panel according to claim 3, characterized in that, The end of the second sidewall closest to the first sidewall contacts the edge of the conductive part, and the end of the second sidewall away from the first sidewall is inclined toward the center of the opening.

6. The display panel according to claim 3, characterized in that, The conductive portion has a first side surface connected to the second surface, and the first spacer film layer covers the first side surface and a portion of the second surface.

7. The display panel according to claim 3, characterized in that, The orthographic projection of the second sidewall on the substrate is outside the orthographic projection of the conductive portion on the substrate; The end of the second sidewall closest to the first sidewall contacts the edge of the conductive part, and the end of the second sidewall away from the first sidewall is inclined in a direction away from the center of the opening.

8. The display panel according to claim 3, characterized in that, The distance from the side of the first sidewall away from the substrate to the center of the opening is greater than the distance from the side of the first sidewall closer to the substrate to the center of the opening.

9. The display panel according to claim 3, characterized in that, The conductive portion has a first side surface that is opposite to and in contact with the first sidewall, and the distance from the side of the first side surface closer to the substrate to the center of the opening is less than the distance from the side of the first side surface farther from the substrate to the center of the opening.

10. The display panel according to claim 1, characterized in that, The first spacing is equal to the second spacing.

11. The display panel according to any one of claims 1 to 10, characterized in that, The display panel further includes a second spacer layer disposed between the first spacer layer and the substrate, the conductive portion being disposed on the surface of the second spacer layer away from the substrate, and the etch selectivity of the material of the first spacer layer being different from the etch selectivity of the material of the second spacer layer.

12. The display panel according to any one of claims 1 to 10, characterized in that, The display panel also includes: A light-shielding layer is disposed on the substrate and includes a light-shielding portion; A semiconductor layer is disposed on the side of the light-shielding layer away from the substrate, and includes an active portion disposed on the side of the light-shielding portion away from the substrate; A first conductive layer is disposed on the side of the semiconductor layer away from the light-shielding layer, and includes a source, a drain, and a first fan-out trace, wherein the source and the drain are connected to the active portion; The second conductive layer is disposed on the side of the first conductive layer away from the semiconductor layer, and includes a transition line and a second fan-out trace; An anode layer is disposed on the side of the second conductive layer away from the first conductive layer and includes an anode, and the adapter wire is connected between the source and the anode, or the adapter wire is connected between the drain and the anode; The conductive part includes at least one of the following: the light-shielding part, the source electrode, the drain electrode, the adapter wire, the anode, the first fan-out trace, and the second fan-out trace.

13. The display panel according to claim 12, characterized in that, When the conductive part includes at least one of the light-shielding part, the source electrode, the drain electrode, the adapter line, the first fan-out trace, and the second fan-out trace, the absolute value of the difference between the first spacing and the second spacing is the first difference range. When the conductive portion includes the anode, the absolute value of the difference between the first spacing and the second spacing is the second difference range; The maximum value of the first difference range is less than the maximum value of the second difference range.

14. The display panel according to claim 13, characterized in that, When the conductive part includes at least one of the light-shielding part, the source electrode, the drain electrode, the adapter line, the first fan-out trace, and the second fan-out trace, the absolute value of the difference between the first spacing and the second spacing is greater than or equal to 0 micrometers and less than or equal to 0.3 micrometers. When the conductive portion includes the anode, the absolute value of the difference between the first spacing and the second spacing is greater than or equal to 0 micrometers and less than or equal to 4 micrometers.

15. The display panel according to claim 12, characterized in that, The display panel further includes a pixel definition layer disposed on the side of the anode layer away from the second conductive layer, the pixel definition layer extending into the opening and covering a portion of the surface of the anode away from the substrate.

16. The display panel according to any one of claims 1 to 10, characterized in that, The display panel includes a plurality of conductive portions located on the same film layer, and the spacing between adjacent conductive portions is greater than 0 and less than 4.5 micrometers.

17. A method for manufacturing a display panel, characterized in that, include: A first spacer film layer is formed on the substrate; An opening and a conductive portion located within the opening are formed in the first spacer film layer; wherein the first spacer film layer has a first surface located on a side away from the substrate and on the periphery of the opening, the first surface having a first gap with the substrate, the conductive portion having a second surface located on a side away from the substrate, the second surface having a second gap with the substrate, and the absolute value of the difference between the first gap and the second gap being less than the thickness of the conductive portion.

18. The method for manufacturing a display panel according to claim 17, characterized in that, The step of forming the first spacer film layer on the substrate includes: The first spacer film layer and the third spacer film layer are sequentially formed on the substrate.

19. The method for manufacturing a display panel according to claim 18, characterized in that, The step of forming an opening in the first spacer film layer and a conductive portion located within the opening includes: An initial opening is formed that passes through at least the third spacer membrane and the first spacer membrane, and at the inner wall of the initial opening, the side of the first spacer membrane is recessed inward relative to the side of the third spacer membrane in a direction away from the center of the initial opening; A conductive material layer is formed on the third spacer film layer, and the conductive material layer includes a conductive portion formed in the initial opening and a partition portion located on the side of the third spacer film layer away from the substrate, wherein the conductive portion and the partition portion are spaced apart. Remove the partition portion and the third spacer film layer to form the opening at the position of the first spacer film layer corresponding to the initial opening, and the conductive portion is located inside the opening.

20. A display device, characterized in that, The display device includes a display panel as described in any one of claims 1 to 16.

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