Display panel, preparation method thereof and display device

Abstract

The invention provides a display panel and a preparation method thereof and a display device, the display panel comprises a substrate and a pixel defining layer and a first packaging layer which are located on the substrate, the first packaging layer is located on one side, deviating from the substrate, of the pixel defining layer, the density of at least part of the pixel defining layer is larger than that of the first packaging layer, or the density of at least part of the pixel defining layer is larger than that of the first packaging layer. The refractive index of at least part of the pixel defining layer is larger than that of the first packaging layer. In the display panel, by increasing the density of the pixel defining layer, the etching degree of the pixel defining layer can be reduced in the process of etching the first packaging layer, so that the structure below the pixel defining layer is protected, and the yield of the display panel is ensured.

Description

Display panel and manufacturing method thereof, and display device

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This disclosure claims priority to Chinese Patent Application No. 202410284339.2 filed on March 12, 2024, Chinese Patent Application No. 202410364382.X filed on March 27, 2024, and Chinese Patent Application No. 202410382905.3 filed on March 29, 2024, and the contents of the above-mentioned Chinese patent application disclosures are hereby incorporated by reference in their entirety as part of this application. Technical Field

[0003] The present disclosure relates to the field of display technology, and in particular, to a display panel and a manufacturing method thereof, and a display device. Background Art

[0004] Organic Light-Emitting Diode (OLED) is an organic thin-film electroluminescent unit. It has attracted great attention and is widely used in electronic display products due to its advantages such as simple preparation process, low cost, low power consumption, high brightness, wide viewing angle, high contrast and flexible display.

[0005] However, current electronic display products are limited by their own structural designs, making it difficult to further improve the yield of display panels.

[0006] Summary of the Invention

[0007] A first aspect of the present disclosure provides a display panel, which includes a substrate and a pixel defining layer and a first encapsulation layer located on the substrate. The first encapsulation layer is located on the side of the pixel defining layer facing away from the substrate. The density of at least part of the pixel defining layer is greater than the density of the first encapsulation layer, or the refractive index of at least part of the pixel defining layer is greater than the refractive index of the first encapsulation layer.

[0008] During the preparation of the display panel, the first encapsulation layer will be etched. In the above scheme, by increasing the density or refractive index of the pixel defining layer, the degree of etching of the pixel defining layer can be reduced during the process of etching the first encapsulation layer, so as to protect the structure under the pixel defining layer, thereby ensuring the yield of the display panel.

[0009] A second aspect of the present disclosure provides a display panel, comprising a substrate and a pixel defining layer located on the substrate. The surface of the pixel defining layer facing away from the substrate is a first surface, and the surface of the pixel defining layer closer to the substrate is a second surface. The orthographic projection of the first surface on the substrate is located within the orthographic projection of the second surface on the substrate. The pixel defining layer includes sidewalls connecting the first surface and the second surface, and the sidewalls are inclined relative to the surface of the substrate. The pixel defining layer includes at least two sub-definition layers stacked on the substrate.

[0010] In the above scheme, by designing the pixel defining layer to be composed of at least two sub-definition layers, the structural parameters (such as density, etc.) of different parts of the pixel defining layer can be controlled, thereby controlling the etching degree of different parts of the pixel defining layer and controlling the specific shape of the side wall. For example, the inclination angles of the side walls of at least two sub-definition layers relative to the surface of the substrate can be the same or different, thereby ensuring the film formation quality of the film layer (such as the second electrode described below) on the pixel defining layer.

[0011] A third aspect of the present disclosure provides a display panel comprising a substrate, a pixel defining layer, and a first encapsulation layer located on the substrate. The first encapsulation layer is located on a side of the pixel defining layer facing away from the substrate, and at least a portion of the pixel defining layer has a greater density than the first encapsulation layer; or at least a portion of the pixel defining layer has a greater content of negatively valent elements than the first encapsulation layer, where the negatively valent elements include oxygen and nitrogen.

[0012] A fourth aspect of the present disclosure provides a display panel, comprising a substrate, a pixel defining layer, a light-emitting unit, and an encapsulation structure located on the substrate. The pixel defining layer is disposed on one side of the substrate, the pixel defining layer enclosing a pixel opening, the light-emitting unit being disposed within the pixel opening and on a side of the pixel defining layer away from the substrate, the encapsulation structure being disposed on a side of the light-emitting functional layer away from the substrate, the encapsulation structure comprising a first encapsulation layer proximate to a side of the pixel defining layer, the pixel defining layer comprising a sub-encapsulation layer, the orthographic projection of the first encapsulation layer on the substrate partially overlapping the orthographic projection of the sub-encapsulation layer on the substrate, and the etching rate of the sub-encapsulation layer being lower than the etching rate of the first encapsulation layer.

[0013] In a specific embodiment of the fourth aspect of the present disclosure, the pixel defining layer includes at least two sub-defining layers, namely, a first sub-defining layer and a second sub-defining layer, the first sub-defining layer is located between the second sub-defining layer and the substrate, and under the same etching conditions, the etching rate of the second sub-defining layer is less than the etching rate of the first encapsulation layer.

[0014] A fifth aspect of the present disclosure provides a method for preparing a display panel, which includes: providing a substrate, on which a pixel defining layer is provided, the pixel defining layer having a pixel opening; forming a light-emitting unit in the pixel opening; forming a first encapsulation film on a side of the light-emitting unit facing away from the substrate, and performing an etching process on the first encapsulation film to form a first encapsulation layer, wherein, during the etching process on the first encapsulation film, an etching rate of a material of the pixel defining layer is less than an etching rate of a material of the first encapsulation film.

[0015] A fifth aspect of the present disclosure provides another method for preparing a display panel, which includes: providing a substrate and forming a pixel defining layer on the substrate; forming a first encapsulation layer on the substrate having the pixel defining layer formed thereon, wherein, when the preparation conditions of the pixel defining layer and the first encapsulation layer are the same, the deposition rate of the material of the pixel defining layer is less than the deposition rate of the material of the first encapsulation layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] FIG1 is a schematic diagram of a planar structure of a display panel provided by an embodiment of the present disclosure.

[0017] FIG. 2 is an enlarged view of a region S1 of the display panel shown in FIG. 1 .

[0018] FIG3 is a cross-sectional view of the display panel shown in FIG2 along line MN.

[0019] FIG. 4 is an enlarged view of the S2 region of the display panel shown in FIG. 3 .

[0020] FIG5A is an enlarged view of a partial area of ​​another display panel provided by an embodiment of the present disclosure.

[0021] FIG5B is an enlarged view of a partial area of ​​another display panel provided by an embodiment of the present disclosure.

[0022] FIG6A is an enlarged view of a partial area of ​​another display panel provided by an embodiment of the present disclosure.

[0023] FIG6B is an enlarged view of a partial area of ​​another display panel provided by an embodiment of the present disclosure.

[0024] FIG6C is an enlarged view of a partial area of ​​another display panel provided by an embodiment of the present disclosure.

[0025] FIG. 7A is an enlarged view of a partial area of ​​another display panel provided by an embodiment of the present disclosure.

[0026] FIG. 7B is an enlarged view of a partial area of ​​another display panel provided by an embodiment of the present disclosure.

[0027] FIG8A is an enlarged view of a partial area of ​​another display panel provided by an embodiment of the present disclosure.

[0028] FIG8B is an enlarged view of a partial area of ​​another display panel provided by an embodiment of the present disclosure.

[0029] FIG8C is an enlarged view of a partial area of ​​another display panel provided by an embodiment of the present disclosure.

[0030] FIG9 is an enlarged view of a partial area of ​​another display panel provided by an embodiment of the present disclosure.

[0031] FIG10A is an enlarged view of a partial area of ​​another display panel provided by an embodiment of the present disclosure.

[0032] FIG10B is an enlarged view of a partial area of ​​another display panel provided by an embodiment of the present disclosure.

[0033] FIG11 is a cross-sectional view of a partial area of ​​a display panel provided by an embodiment of the present disclosure.

[0034] FIG12A is a flow chart of a method for manufacturing a display panel provided in an embodiment of the present disclosure.

[0035] FIG12B is a flow chart of another method for manufacturing a display panel provided in an embodiment of the present disclosure.

[0036] FIG12C is a flow chart of another method for manufacturing a display panel provided in an embodiment of the present disclosure.

[0037] 13A to 13I are process diagrams of a method for forming a display panel as shown in FIG. 3 , provided in accordance with an embodiment of the present disclosure.

[0038] FIG14 is a schematic diagram showing the positional relationship between a portion of a film layer of a display panel and an evaporation source during evaporation according to an embodiment of the present disclosure.

[0039] Explanation of reference numerals: 10-display panel; 11-display area; 12-frame area; 100-substrate; 110-flat layer; 200-light-emitting unit; 210-first electrode; 220-light-emitting functional layer; 221-first functional layer; 222-light-emitting layer; 223-second functional layer; 230-second electrode; 300-isolation structure; 301-isolation opening; 302-pixel opening; 302a-first edge; 302b-second edge; 310-support portion; 310a-first material layer; 320-crown portion; 320a-second material layer; 330-pixel defining layer; 330a-pixel defining material layer; 331-first sub-definition layer; 3 31a-straight line segment; 331b-first curved line segment; 332-second sub-definition layer; 332a-straight line segment; 332b-curved line segment; 333-third sub-definition layer; 333a-straight line segment; 333b-second curved line segment; 340-conductive layer; 400-packaging structure; 410-first packaging layer; 410a-first packaging film; 411-packaging unit; 411a-suspended portion; 420-second packaging layer; 430-third packaging layer; 500-photoresist pattern. DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in the embodiments of this specification to clearly and completely describe the technical solutions in the embodiments of this specification. Obviously, the embodiments described are only part of the embodiments of this specification, not all of the embodiments. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of this specification.

[0041] In a display panel, a pixel defining layer is provided to define the position of a light-emitting element (e.g., a light-emitting unit described below). The pixel defining layer covers the anode of the light-emitting unit (e.g., the first electrode described below). During the manufacturing process of the display panel, after the anode and the pixel defining layer are prepared, if the subsequent manufacturing process of the structure includes an etching process, such as the etching process of the first encapsulation layer described below, the etching process may etch into the pixel defining layer. If the pixel defining layer is severely damaged by etching, the quality of the film layer in the light-emitting unit (e.g., the cathode of the light-emitting unit) may be damaged. If the pixel defining layer is even etched through, the anode may be damaged.

[0042] The present disclosure provides a display panel and its preparation method, and a display device to at least solve the above-mentioned technical problems. The display panel includes a substrate and a pixel defining layer and a first encapsulation layer located on the substrate. The first encapsulation layer is located on the side of the pixel defining layer away from the substrate. The density of at least part of the pixel defining layer is greater than the density of the first encapsulation layer, or the refractive index of at least part of the pixel defining layer is greater than the refractive index of the first encapsulation layer. In the process of preparing the display panel, the first encapsulation layer will be etched. If the uniformity of the first encapsulation layer is not enough during the formation process, the etching time of each part of the layer will be different. Therefore, in the area where the film layer of the first encapsulation layer is thin or the film forming quality is poor, there may be over-etching, which may cause the pixel defining layer to be damaged by etching. In the above scheme of the present disclosure, by increasing the density or refractive index of the pixel defining layer, the degree of etching of the pixel defining layer can be reduced in the process of etching the first encapsulation layer, so as to protect the structure below the pixel defining layer (such as the first electrode in the following embodiment), thereby ensuring the yield of the display panel.

[0043] It should be noted that the formation method of the first encapsulation layer and the principle of the risk of over-etching of the pixel definition layer can be found in the detailed description of the embodiments related to Figures 13A to 13I below, and will not be repeated here.

[0044] The structure of the display panel according to at least one embodiment of the present disclosure is described in detail below with reference to the accompanying drawings. Furthermore, in these drawings, a spatial rectangular coordinate system is established with the substrate as a reference to more intuitively present the positional relationships of the relevant structures in the display panel. In this spatial rectangular coordinate system, the X-axis and Y-axis are parallel to the surface of the substrate, and the Z-axis is perpendicular to the surface of the substrate.

[0045] As shown in Figures 1 to 4, the planar area of ​​the display panel 10 can be divided into a display area 11 and a border area 12 surrounding the display area 11. Sub-pixels (which may be referred to as sub-pixels, etc.) may be arranged in the display area 11, such as R, G, and B sub-pixels. The physical structure of the sub-pixels may be the light-emitting units in the following embodiments. Adjacent sub-pixels with different colors of emitted light constitute a pixel (which may be referred to as a pixel unit, a large pixel, etc.). The arrangement density of the pixels in the display area 11 represents the pixel density PPI. It should be noted that in some embodiments of the present disclosure, some of the wiring in the border area 12 can be arranged in the display area 11, so that the border area 12 can be designed as a single-sided border.

[0046] The physical structure of the display panel 10 may include a substrate 100 and a pixel defining layer 330 and a first encapsulation layer 410 located on the substrate 100. The first encapsulation layer 410 is located on the side of the pixel defining layer 330 facing away from the substrate 100. The density of at least part of the pixel defining layer 330 is greater than the density of the first encapsulation layer 410, or the refractive index of at least part of the pixel defining layer 330 is greater than the refractive index of the first encapsulation layer 410. In this way, relative to the first encapsulation layer 410, the etching material used to etch the first encapsulation layer 410 will have difficulty in etching the pixel defining layer 330, thereby reducing the risk of the pixel defining layer 330 being damaged by excessive etching.

[0047] In the embodiments of the present disclosure, the density of the film layer can be the degree of compactness of the internal molecules or atoms of the corresponding prepared material. Density is an important performance indicator for measuring materials, which directly affects the mechanical properties, thermal properties, electrical properties, etc. of the material. Generally speaking, the greater the density, the fewer internal voids and defects in the film layer made of the material, and the tighter the bonding between atoms or molecules. Therefore, the tensile strength, compression strength, bending strength, and corrosion resistance of the film layer will be enhanced. For structures of the same material, higher density has fewer internal voids or less low-density materials than lower density.

[0048] It should be noted that the compactness of the molecules or atoms inside the film layer will also be reflected in the refractive index of the film layer, that is, the greater the compactness of the molecules or atoms, the greater the refractive index of the film layer. In the embodiments of the present disclosure, the refractive index of the film layer can be measured by a device such as an ellipsometer. For example, the measurement principle of the ellipsometer is roughly as follows: the ellipsometry method uses elliptically polarized light to be incident on the sample surface, observes the changes in the polarization state (amplitude and phase) of the reflected light, and then derives the thickness and refractive index of the sample surface film.

[0049] The measurement steps of the ellipsometer are roughly as follows: Steps S1 to S6:

[0050] S1. Calibrate the ellipsometer: Before taking any measurements, the ellipsometer must be calibrated to ensure it can accurately measure the refractive index of the sample. Calibration generally involves two steps: zero bias adjustment and scale adjustment.

[0051] S2. Prepare the sample: Place the sample to be tested on the sample stage of the ellipsometer.

[0052] S3. Measure phase difference: Adjust the parameters on the instrument so that the ellipsometer outputs the minimum signal. The ellipsometer will measure the phase difference of the sample, which is proportional to the refractive index of the sample.

[0053] S4. Calculate the refractive index: According to the working principle of the ellipsometer, the refractive index of the sample is calculated by measuring the phase difference.

[0054] S5. Take the average value of multiple measurements: In order to improve the accuracy of the measurement results, it is generally necessary to take multiple measurements and take the average value. When taking multiple measurements, it is necessary to pay attention to maintaining the stability of the sample and avoiding interference from external factors.

[0055] S6. Control environmental conditions: Temperature and humidity have a certain impact on the refractive index of the sample. Therefore, it is necessary to control the environmental conditions during measurement to keep them stable.

[0056] Thin film thickness measurement is also based on the principle of elliptically polarized light. When elliptically polarized light is incident on the sample surface, it undergoes multiple reflections and refractions by the thin film, causing the polarization state of the reflected light to change. By analyzing this change, the thickness of the film can be determined.

[0057] For example, the measurement range of an ellipsometer generally includes a certain range of transparent film thickness and refractive index, such as a transparent film thickness range of 0-300 nm and a refractive index range of 1.30-2.49.

[0058] For example, the measurement accuracy of the ellipsometer is crucial to the results. Generally, the measurement accuracy of the ellipsometer can reach ±2nm.

[0059] For example, an ellipsometer may use a laser as a light source, such as a helium-neon laser or a semiconductor laser, which typically has a wavelength of 632.8 nm or 635 nm.

[0060] It should be noted that in the embodiments of the present disclosure, the size change trend of the density and refractive index is the same as the strength change trend of the compactness of the molecules or atoms in the film layer. Therefore, when describing the size relationship of the density of two film layers, even if only the size relationship of the density between multiple film layers or the density change law of a single film layer is mentioned, the size relationship or change law can also be replaced by a description of the refractive index.

[0061] In at least one embodiment of the present disclosure, the material composition of at least a portion of the pixel defining layer 330 (the portion with increased density or refractive index) and the first encapsulation layer 410 may be the same or different, and the material composition can be selected based on actual needs. For example, the material composition of at least a portion of the pixel defining layer 330 and the first encapsulation layer 410 may be the same. In this case, by controlling the process conditions of the film layer, such as the equipment power during film deposition and the deposition process type (e.g., chemical vapor deposition and atomic layer deposition), different film layers prepared from the same material can have different densities or refractive indices.

[0062] In a display panel, some functional film layers in the light-emitting units are formed by evaporation, and each light-emitting unit has multiple functional film layers, and some functional film layers (such as the light-emitting layers) in the light-emitting units that emit different light have different material compositions. Therefore, when evaporating these functional film layers through a mask plate (such as a fine mask plate), multiple alignments are required. In order to solve the position offset problem caused by alignment accuracy errors, sufficient space (and a safety margin related to the alignment error) needs to be reserved between different light-emitting units to ensure that the position of the actual light-emitting area of ​​the light-emitting unit can have a certain overlap rate with the designed position (design area), which is equivalent to compressing the designed area of ​​the light-emitting area of ​​the light-emitting unit, which not only limits the light-emitting area of ​​the light-emitting unit, but also prevents the arrangement density of the light-emitting unit from being further increased, making it difficult to further improve the PPI (pixel density) of the display panel.

[0063] In the embodiments of the present disclosure, an isolation structure is provided at the gap between the light-emitting units to separate the functional film layers of adjacent light-emitting units. Thus, in the evaporation process of the functional film layer, it is only necessary to perform evaporation on the entire surface of the display panel without the need to prepare the functional film layer of each light-emitting unit separately with the aid of a mask plate. This process does not need to consider the alignment accuracy during evaporation, so that the gap between the light-emitting units can be designed to be smaller in size to increase the PPI (the principle can be found in the relevant descriptions in the following embodiments related to Figures 13A to 13I).

[0064] It should be noted that when preparing the light-emitting units through the isolation structure, because the light-emitting units are prepared in batches according to different light-emitting colors, after the preparation of the previous batch of light-emitting units is completed, a packaging structure (the first packaging layer below) will be formed thereon for protection, so as to reduce the damage caused to the previous batch of light-emitting units by the preparation process when preparing the next batch of light-emitting units. Accordingly, the packaging structure is also formed multiple times, and the packaging effect of the packaging structure will directly affect the preparation yield of the light-emitting units. In the process of forming the packaging structure, the setting of the isolation structure will affect the film forming quality of some areas of the packaging structure. In this way, in the process of etching the first packaging layer, over-etching is likely to occur, causing damage to the pixel definition layer.

[0065] Patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 100935, PCT / CN2024 / 102785, PCT / CN2024 / 099419, PCT / CN2024 / 099072, and CN116685174A record relevant contents of the isolation structure for reference.

[0066] In at least one embodiment of the present disclosure, as shown in Figures 1 to 4, the display panel 10 may further include a plurality of light-emitting units 200 located in the display area 11. The pixel-defining layer 330 includes a plurality of pixel openings 302, and the pixel openings 302 define the positions of the light-emitting units 200. The light-emitting units 200 include a first electrode 210, a light-emitting functional layer 220, and a second electrode 230, which are sequentially stacked on the substrate 100. The first electrode 210 is located between the pixel-defining layer 330 and the substrate 100. The pixel openings 302 expose a portion of the first electrode 210. The light-emitting functional layer 220 and the second electrode 230 cover the pixel openings 302 and extend to the side of the pixel-defining layer 330 facing away from the substrate 100. The pixel openings 302 define an effective area of ​​the first electrode 210, which corresponds to the effective light-emitting area of ​​the light-emitting unit 200. Thus, the pixel openings 302 actually define the light-emitting area (e.g., position, area, etc.) of the light-emitting unit 200 (or sub-pixel).

[0067] In the above-mentioned display panel, the pixel defining layer 330 covers the first electrode 210 located thereunder, and the surface above it is used to support the second electrode 230. Therefore, the film uniformity of the pixel defining layer 330 will directly affect the film forming quality of the second electrode 230, and if the pixel defining layer 330 is over-etched, it will directly cause damage to the first electrode 210.

[0068] In the embodiments of the present disclosure, there is no restriction on the specific structural design of the light-emitting unit 200. For example, as shown in FIG3 , the light-emitting functional layer 220 may further include a light-emitting layer 222 and a second functional layer 223, and the first functional layer 221, the light-emitting layer 222 and the second functional layer 223 are sequentially stacked on the first electrode 210. The first functional layer 221 may include a hole injection layer, a hole transport layer, an electron blocking layer, etc. The second functional layer 223 may include an electron injection layer, an electron transport layer, a hole blocking layer, etc. It should be noted that one or more light-emitting layers 222 may be provided in the light-emitting unit 200. When multiple light-emitting layers 222 are provided, the light-emitting unit 200 may have a higher light extraction efficiency.

[0069] For example, in at least one embodiment of the present disclosure, the first electrode 210 may be configured as an anode, and the second electrode 230 may be configured as a cathode.

[0070] In at least one embodiment of the present disclosure, as shown in Figures 1 to 4, the display panel 10 may further include an isolation structure 300 located on the substrate 100. The isolation structure 300 is located between the substrate 100 and the first encapsulation layer 410 and includes a plurality of isolation openings 301 corresponding to the pixel openings 302. The light-emitting functional layer 220 and the second electrode 230 are located in the isolation openings 301. The light-emitting functional layer 220 and the second electrode 230 of the light-emitting unit 200 are formed by the isolation structure 300, so that the light-emitting functional layer 220 (which may include multiple film layers) and the second electrode 230 in each light-emitting unit 200 do not experience positional offset, thereby precisely controlling the position and light-emitting area of ​​the light-emitting unit 200. This principle can be described in detail in the embodiments related to Figures 13A to 13I below and will not be repeated here. In addition, due to this effect, a smaller space can be reserved between the light-emitting units 200, that is, a smaller gap can be left between the light-emitting units 200, which is conducive to the display panel having a higher pixel density (PPI).

[0071] In actual process scenarios, the light-emitting unit 200 will be configured to have a microcavity effect (so that the color light corresponding to the light-emitting unit 200 can interfere constructively). Therefore, the film thickness of the light-emitting functional layer 220 of the light-emitting unit 200 (which directly affects the wavelength range of the constructive interference effect) is particularly important. In the embodiments of the present disclosure, light-emitting units 200 of different light-emitting colors are separately prepared based on the isolation structure 300. Therefore, the thickness of each film layer of the light-emitting functional layer 220 (for example, each film layer of the first functional layer 221 and the second functional layer 223) in the light-emitting unit of each light-emitting color can be separately prepared, so that each light-emitting unit 200 can obtain the microcavity effect with the maximum effect. In addition, when the light-emitting unit 200 is configured to include multiple light-emitting layers 222, if the isolation structure 300 is not used to prepare the light-emitting unit 200, then, although the efficiency of the excitation light of the light-emitting unit 200 is increased, the increase in the thickness of the film layer will also cause the microcavity effect of the light-emitting unit 200 of some light-emitting colors to be reduced. In the case of using the isolation structure 300, the thickness of each film layer in the light-emitting unit 200 of each light-emitting color can still be precisely controlled, thereby still ensuring the microcavity effect of the light-emitting unit 200. Therefore, in the scenario where the light-emitting unit 200 is configured to include multiple light-emitting layers 222, the effect of the isolation structure 300 on improving the light-emitting efficiency of the light-emitting unit 200 will be particularly obvious.

[0072] In the process of preparing the light-emitting unit 200 using the isolation structure 300, the first encapsulation layer 410 will be prepared simultaneously, wherein the first encapsulation layer 410 will be formed by an etching process, and the isolation structure 300 will affect the film quality of some areas of the first encapsulation layer 410 (for example, the area adjacent to the support portion and the crown in the first encapsulation layer 410 described below). In this area, the first encapsulation layer 410 is easily etched, thereby making the pixel definition layer 330 below easy to be etched prematurely. If the pixel definition layer 330 is etched too much, it will affect the film quality of the second electrode 230 formed subsequently, and even when the pixel definition layer 330 is etched through, it will cause the first electrode 210 to be etched and damaged. In the above-mentioned scheme of the present disclosure, the above-mentioned problem can be solved by increasing the density of the pixel definition layer 330 to enhance the etching resistance of the pixel definition layer 330. The formation process of the first encapsulation layer 410 in the above-mentioned process can be referred to the specific description in the embodiments related to Figures 13A to 13I below, and will not be repeated here.

[0073] In the embodiments of the present disclosure, the density or refractive index of the entire or a portion of the pixel defining layer can be increased according to different requirements. In the case of partial density or refractive index increase, the density or refractive index of the upper, lower, or middle portion of the pixel defining layer can be increased. The specific structure of the display panel under the above different options is described below through different embodiments.

[0074] In some embodiments of the present disclosure, as shown in Figures 3 to 5A, the density of the pixel defining layer 330 is greater than the density of the first encapsulation layer 410, or the refractive index of the pixel defining layer 330 is greater than the refractive index of the first encapsulation layer 410, that is, the density of any part of the pixel defining layer 330 is greater than the density of any part of the first encapsulation layer 410, and the refractive index of any part of the pixel defining layer 330 is greater than the refractive index of any part of the first encapsulation layer 410.

[0075] For example, in some examples, as shown in Figures 3 and 4, the pixel defining layer 330 is a single-layer structure, which can ensure the structural strength of the pixel defining layer 330 and avoid risks such as interface separation in a multi-layer design.

[0076] For example, in some examples, as shown in Figures 3 and 5A, the pixel defining layer 330 includes a first sub-defining layer 331 and a second sub-defining layer 332, which are stacked. The first sub-defining layer 331 and the second sub-defining layer 332 have equal density. In this way, the range of material options for the pixel defining layer 330 can be increased. For example, the two first sub-defining layers 331 and the second sub-defining layer 332 can be formed of different materials to meet different process requirements (such as the different shapes of the sidewalls of the pixel opening 302 described below).

[0077] In other embodiments of the present disclosure, along the thickness direction of the pixel defining layer 330, the density of the side of the pixel defining layer 330 close to the first encapsulation layer 410 is greater than the density of the first encapsulation layer 410, and the density of the side of the pixel defining layer 330 close to the first encapsulation layer 410 is greater than the density of the side of the pixel defining layer 330 away from the first encapsulation layer 410; or, along the thickness direction of the pixel defining layer 330, the refractive index of the side of the pixel defining layer 330 close to the first encapsulation layer 410 is greater than the refractive index of the first encapsulation layer 410, and the refractive index of the side of the pixel defining layer 330 close to the first encapsulation layer 410 is greater than the refractive index of the pixel defining layer 330 away from the first encapsulation layer 410. For example, as shown in Figures 3 and 5A to 5B, along the Z-axis direction perpendicular to the surface where the substrate 100 is located (equivalent to the thickness direction of the pixel defining layer 330), the density (or refractive index) of the portion of the pixel defining layer 330 facing away from the substrate 100 (the side close to the first encapsulation layer 410, such as the second sub-definition layer 332 or the third sub-definition layer 333) is greater than the density (or refractive index) of the first encapsulation layer 410, and the density (or refractive index) of the portion of the pixel defining layer 330 facing away from the substrate 100 (the side close to the first encapsulation layer 410) is greater than the density (or refractive index) of the other portions of the pixel defining layer 330 (the side away from the first encapsulation layer 410, such as the first sub-definition layer 331 or the second sub-definition layer 332). In this way, the density (or refractive index) of the top portion of the pixel defining layer 330 can be increased, thereby further reducing the extent to which the pixel defining layer 330 is etched during the etching process of the first encapsulation layer 410, thereby improving the integrity of the pixel defining layer 330 and thereby improving the film continuity of the second electrode 230 formed on the pixel defining layer 330.

[0078] For example, the pixel defining layer 330 includes at least two sub-definition layers stacked in sequence on the substrate 100, the density of the sub-definition layer close to the first encapsulation layer 410 is greater than the density of the sub-definition layer away from the first encapsulation layer 410, or the refractive index of the sub-definition layer close to the first encapsulation layer 410 is greater than the refractive index of the sub-definition layer away from the first encapsulation layer 410. For example, as shown in FIG5A , along the thickness direction of the pixel defining layer 330 , the pixel defining layer 330 includes at least two first sub-defining layers 331 and a second sub-defining layer 332 sequentially stacked on the substrate 100 , and the density (or refractive index) of the second sub-defining layer 332 closest to the first encapsulation layer 410 is greater than the density (or refractive index) of the first sub-defining layer 331 ; or, as shown in FIG5B , along the thickness direction of the pixel defining layer 330 , the pixel defining layer 330 includes at least two first sub-defining layers 331, a second sub-defining layer 332 and a third sub-defining layer 333 sequentially stacked on the substrate 100 , and the density (or refractive index) of the third sub-defining layer 333 closest to the first encapsulation layer 410 is greater than the density (or refractive index) of the first sub-defining layer 331 and the second sub-defining layer 332 . When the pixel defining layer 330 is formed by a plurality of sub-defining layers, the difficulty of preparing the pixel defining layer 330 and the material selection can be reduced, thereby facilitating the control of the manufacturing process cost of the display panel.

[0079] In an embodiment of the present disclosure, when describing the relative positions of the various sub-definition layers, if the display panel includes a first encapsulation layer 410, then the sub-definition layer that is closer to the substrate is farther away from the first encapsulation layer 410, and correspondingly, the sub-definition layer that is farther away from the substrate is closer to the first encapsulation layer 410.

[0080] For example, in some examples, as shown in FIG5A , the density (or refractive index) of the first sub-defining layer 331 closest to the substrate 100 is greater than or equal to the density (or refractive index) of the first encapsulation layer 410. Thus, if the second sub-defining layer 332, which is furthest from the substrate 100, has sufficient density (or refractive index) to resist etching, the density (or refractive index) requirements of the other first sub-defining layers 331 of the pixel-defining layer 330 can be reduced, and the first encapsulation layer 410 and the first sub-defining layer 331 closest to the substrate 100 can even be made of the same or similar materials, thereby reducing the manufacturing process cost of the display panel.

[0081] For example, in other examples, the pixel defining layer 330 includes at least three sub-defining layers stacked sequentially on the substrate 100, and the density of the sub-defining layers gradually increases in the direction away from the substrate 100, or the refractive index of the sub-defining layers gradually increases. Exemplarily, as shown in FIG5B , the pixel defining layer 330 includes three first sub-defining layers 331, second sub-defining layers 332, and third sub-defining layers 333 stacked sequentially on the substrate 100, the first sub-defining layers 331, the second sub-defining layers 332, and the third sub-defining layers 333 successively moving away from the substrate 100, and the density (or refractive index) of the first sub-defining layers 331, the second sub-defining layers 332, and the third sub-defining layers 333 successively increasing. In this way, the difficulty of the preparation process of the pixel defining layer 330 can be reduced. For example, the first sub-defining layers 331, the second sub-defining layers 332, and the third sub-defining layers 333 can be directly formed using different materials or different processes to simplify the preparation process of the display panel.

[0082] In other embodiments of the present disclosure, along the thickness direction of the pixel defining layer 330, the density of the middle portion of the pixel defining layer 330 is greater than the density of the first encapsulation layer 410, and the density of the middle portion of the pixel defining layer 330 is greater than the density of other portions of the pixel defining layer 330; or, the refractive index of the middle portion of the pixel defining layer 330 is greater than the refractive index of the first encapsulation layer 410, and the refractive index of the middle portion of the pixel defining layer 330 is greater than the refractive index of the other portions of the pixel defining layer. For example, as shown in Figures 3 and 5B, the pixel defining layer 330 includes three first sub-defining layers 331, second sub-defining layers 332, and third sub-defining layers 333 stacked in sequence on the substrate 100. The first sub-defining layer 331, the second sub-defining layer 332, and the third sub-defining layer 333 are successively farther away from the substrate 100. The density (or refractive index) of the second sub-defining layer 332 (the middle part of the pixel defining layer 330) is greater than the density (or refractive index) of the first encapsulation layer 410, and the density (or refractive index) of the second sub-defining layer 332 is greater than the density (or refractive index) of the first sub-defining layer 331 and the third sub-defining layer 333. In this way, during the etching process of the first encapsulation layer 410, the degree to which the pixel defining layer 330 is etched can be reduced to ensure a certain degree of integrity, while reducing the risk of the pixel defining layer 330 being etched through, thereby improving the quality of the structure formed on the pixel defining layer 330 (such as the film continuity of the second electrode 230 described below) and the integrity of the structure located below the pixel defining layer 330, such as the first electrode 210.

[0083] For example, as shown in Figure 5B, when the pixel defining layer 330 is formed by multiple first sub-defining layers 331, second sub-defining layers 332, and third sub-defining layers 333, the preparation difficulty and material selection of the pixel defining layer 330 can be reduced. For example, the first sub-defining layer 331, the second sub-defining layer 332, and the third sub-defining layer 333 can be directly formed using different materials or different processes, which is beneficial to controlling the preparation process cost of the display panel.

[0084] For example, in some examples, as shown in FIG3 and FIG5B , when the density (or refractive index) of the middle portion of the pixel defining layer 330, such as the second sub-defining layer 332, is greater than the density (or refractive index) of the first encapsulation layer 410, the density (or refractive index) of the third sub-defining layer 333, which is farthest from the substrate 100, can be less than or equal to the density (or refractive index) of the first encapsulation layer 410. In this way, the portion of the sidewall of the pixel defining layer 330 away from the substrate 100 can be made smoother relative to the surface of the substrate 100, thereby improving the continuity of the film layer formed on the sidewall of the pixel defining layer 330.

[0085] For example, in some examples, as shown in Figures 3 and 5B , when the density (or refractive index) of the middle portion of the pixel defining layer 330, such as the second sub-defining layer 332, is greater than the density (or refractive index) of the first encapsulation layer 410, the density (or refractive index) of the third sub-defining layer 333, which is farthest from the substrate 100, is equal to the density (or refractive index) of the first sub-defining layer 331, which is closest to the substrate 100. Alternatively, the density (or refractive index) of the first sub-defining layer 331, which is closest to the substrate 100, is less than or equal to the density (or refractive index) of the first encapsulation layer 410. In this way, during the process of forming the first encapsulation layer 410, the etching resistance of the entire pixel defining layer 330 can be further improved, thereby reducing etching damage to the pixel defining layer 330. Furthermore, the design of the first sub-defining layer 331 can make the sidewalls of the pixel defining layer 330 near the substrate 100 more gentle relative to the surface of the substrate 100, thereby improving the continuity of the film layer formed on the sidewalls of the pixel defining layer 330.

[0086] For example, in some examples, the density (or refractive index) of the first sub-definition layer 331 can be set to be equal to the density (or refractive index) of the first encapsulation layer 410, so that the density (or refractive index) of the entire pixel definition layer 330 is greater than the density (or refractive index) of the first encapsulation layer 410, thereby further improving the etching resistance of the pixel definition layer 330 in the process of the first encapsulation layer 410.

[0087] In other embodiments of the present disclosure, along the thickness direction of the pixel defining layer 330, the density of the pixel defining layer 330 on the side closest to the substrate 100 is greater than the density of the first encapsulation layer 410, and the density of the pixel defining layer 330 on the side closest to the substrate is greater than the density of the rest of the pixel defining layer 330. Alternatively, along the thickness direction of the pixel defining layer 330, the refractive index of the pixel defining layer 330 on the side closest to the substrate is greater than the refractive index of the first encapsulation layer 410, and the refractive index of the portion of the pixel defining layer 330 close to the substrate is greater than the refractive index of the rest of the pixel defining layer 330. For example, as shown in Figures 3 and 5A , along the Z-axis perpendicular to the surface of the substrate 100 (equivalent to the thickness direction of the pixel defining layer 330), the pixel defining layer 330 includes a first sub-defining layer 331 and a second sub-defining layer 332 stacked sequentially on the substrate 100. The density of the first sub-defining layer 331 is greater than the density (or refractive index) of the first encapsulation layer 410, and greater than the density (or refractive index) of the second sub-defining layer 332. In this way, the risk of the pixel defining layer 330 being etched through during the etching process of the first encapsulation layer 410 can be further reduced, thereby further protecting the integrity of the structure located below the pixel defining layer 330; in addition, this design is conducive to improving the inclination (slower slope) of the side wall of the pixel defining layer 330 (which is also equivalent to the side wall of the pixel opening 302) to improve the quality of the structure formed on the pixel defining layer 330 (for example, the film layer continuity of the second electrode 230 described below).

[0088] For example, in some examples, when the pixel defining layer includes at least two sub-defining layers stacked in sequence on the substrate, the density of the sub-defining layer close to the substrate is greater than the density of the other sub-defining layers, or the refractive index of the sub-defining layer close to the substrate is greater than the refractive index of the other sub-defining layers. Exemplarily, as shown in Figures 3 and 5B, the pixel defining layer 330 includes three first sub-defining layers 331, second sub-defining layers 332, and third sub-defining layers 333 stacked in sequence on the substrate 100. The first sub-defining layer 331, the second sub-defining layer 332, and the third sub-defining layer 333 are sequentially away from the substrate 100. The density (or refractive index) of the first sub-defining layer 331 farthest from the first encapsulation layer 410 is greater than the density (or refractive index) of the second sub-defining layer 332 and the third sub-defining layer 333. When the pixel defining layer 330 is formed by multiple first sub-defining layers 331 and second sub-defining layers 332, the difficulty of preparing the pixel defining layer 330 and the selection of materials can be reduced, which is beneficial to controlling the manufacturing process cost of the display panel.

[0089] For example, in some examples, the density of the sub-defining layer adjacent to the first encapsulation layer is greater than or equal to the density of the first encapsulation layer, or the refractive index of the sub-defining layer adjacent to the first encapsulation layer is greater than or equal to the refractive index of the first encapsulation layer. For example, as shown in Figures 3 and 5A, the density (or refractive index) of the second sub-defining layer 332 is greater than or equal to the density (or refractive index) of the first encapsulation layer 410; or, as shown in Figures 3 and 5B, the density (or refractive index) of the third sub-defining layer 333 is greater than or equal to the density (or refractive index) of the first encapsulation layer 410.

[0090] For example, in some examples, as shown in Figures 3 and 5B, the pixel defining layer 330 includes at least three first sub-defining layers 331, a second sub-defining layer 332, and a third sub-defining layer 333, which are sequentially stacked on the substrate 100. The density (or refractive index) of the first sub-defining layer 331, the second sub-defining layer 332, and the third sub-defining layer 333 gradually decreases as they move away from the substrate 100. In this way, during the process of forming the first encapsulation layer 410, the sidewalls of the pixel defining layer 330 can be made smoother, thereby improving the continuity of the film layer formed on the sidewalls of the pixel defining layer 330.

[0091] In at least one embodiment of the present disclosure, the material of the pixel defining layer 330 and the first encapsulation layer 410 may include at least one of silicon nitride, silicon oxide, and silicon oxynitride.

[0092] It should be noted that in the embodiments of the present disclosure, the shape of the sidewalls of the pixel-defining layer 330 (equivalent to the side surfaces of the pixel openings) affects the quality of subsequently deposited film layers. Therefore, controlling the morphology of these sidewalls to ensure the quality of the deposited film layers is particularly important in the display panel manufacturing process. The following describes the configuration of the sidewall shape of the pixel-defining layer 330 in a display panel, in conjunction with specific embodiments.

[0093] At least one embodiment of the present disclosure provides a display panel, as shown in Figures 1, 2, 3 and 6A, wherein the display panel 10 includes a substrate 100 and a pixel defining layer 330 located on the substrate 100, wherein the surface of the pixel defining layer 330 facing away from the substrate 100 is a first surface 3301, and the surface of the pixel defining layer 330 close to the substrate 100 is a second surface 3302, and the orthographic projection of the first surface 3301 on the substrate 100 is located within the orthographic projection of the second surface 3302 on the substrate 100, and the pixel defining layer 330 includes a sidewall connecting the first surface 3301 and the second surface 3302, and the sidewall is inclined relative to the surface of the substrate 100, that is, the sidewall intersects with the surface of the substrate 100 and is not perpendicular. In addition, the pixel defining layer 330 includes at least two sub-defining layers stacked on the substrate 100, such as a first sub-defining layer 331 and a second sub-defining layer 332 ( FIG. 6A shows two such layers). The sidewalls of the first sub-defining layer 331 and the second sub-defining layer 332 contribute to forming the sidewalls of the pixel defining layer 330. The sidewalls of the at least two sub-defining layers can have the same or different inclination angles relative to the surface of the substrate 100. That is, the degree of inclination of the sidewalls of each sub-defining layer can be individually regulated to control the shape of the sidewalls of the pixel defining layer 330. In this way, the degree of etching of each sub-defining layer of the pixel defining layer 330 can be controlled to individually regulate the degree of inclination of the sidewalls of each sub-defining layer, thereby controlling the specific shape of the sidewalls of the pixel defining layer 330. For example, the inclination angles of the sidewalls of the at least two sub-defining layers relative to the surface of the substrate 100 can be the same or different, thereby ensuring the film formation quality of the film layer (e.g., the second electrode described below) on the pixel defining layer.

[0094] It should be noted that the specific setting method of the pixel defining layer 330 in the display panel, as well as other structures that the display panel may include in further design, such as the first encapsulation layer, the light-emitting unit, the isolation structure, etc., can be found in the relevant descriptions in the aforementioned embodiments and will not be repeated here.

[0095] For example, as shown in Figures 3 and 6A, the sidewalls of the pixel defining layer 330 enclose a pixel opening 302. The sidewalls of the pixel defining layer 330 include a first edge 302a (closer to the substrate 100) that intersects with the second surface 3302 and a second edge 302b (away from the substrate 100) that intersects with the first surface 3301. The plane defined by the first edge 302a and the second edge 302b intersects and is not perpendicular to the plane of the substrate 100. This ensures the continuity of the film layer (such as the second electrode 230 mentioned in the aforementioned embodiment) on the sidewalls of the pixel defining layer 330, thereby improving the yield of the display panel.

[0096] For example, the angle between the plane P1 defined by the first edge 302a and the second edge 302b and the plane of the substrate 100 is no greater than 45 degrees. When this angle is met, the quality of the film layer on the sidewall of the pixel defining layer 330 can be guaranteed.

[0097] In some embodiments of the present disclosure, as shown in Figures 6A to 6C and Figures 7A and 7C, the sidewall of the pixel defining layer 330 is a continuous surface. In this way, the continuity of the film layer (such as the light-emitting functional layer 220 and the second electrode 230) formed at the pixel opening 302 on the sidewall can be improved to ensure the display effect of the display panel.

[0098] In some examples, as shown in FIG6A , when the sidewall of the pixel defining layer 330 is a continuous surface, the cross-sectional shape of the sidewall of the pixel defining layer 330 along a direction perpendicular to the surface of the substrate 100 (eg, the direction of the Z axis) is a straight line segment.

[0099] In other examples, as shown in FIG6B (or FIG6C ), the pixel defining layer 330 includes at least two sub-definition layers stacked on the substrate 100, and the sidewalls of the at least two sub-definition layers may have the same or different inclination angles relative to the surface of the substrate 100. Thus, by designing the pixel defining layer 330 to be composed of at least two sub-definition layers, the structural parameters (e.g., density, etc.) of different portions of the pixel defining layer 330 can be controlled, thereby controlling the degree of etching of different portions of the pixel defining layer 330 and controlling the specific shape of the sidewalls to ensure the quality of the film layer (e.g., the second electrode 230) formed on the pixel defining layer.

[0100] In a cross section perpendicular to the surface of the substrate 100, the angle between the straight line on which the sidewall of the sub-definition layer is located and the surface of the substrate 100 is not greater than 45 degrees. For example, the angle is not greater than 40 degrees, such as 39 degrees, 37 degrees, 35 degrees, 32 degrees, and 30 degrees. In this way, the smaller the angle, the more the film layer (such as the second electrode described below) located on the pixel defining layer 330 can be improved on the sidewall of the pixel defining layer 330. The film continuity can thereby be improved, thereby improving the yield of the display panel. In addition, when this value is met, the film formation quality of the film layer located on the pixel defining layer on the sidewall of the pixel defining layer can be guaranteed. Specifically, when the sidewall of the pixel defining layer 330 is a continuous surface, the cross-sectional shape of the sidewall of the pixel defining layer 330, along a direction perpendicular to the surface of the substrate 100, is a line segment connected end to end, such as 331a and 332a (or also including the line segment 333a in FIG6C ), and the acute angles Q at which the lines containing these line segments intersect with the surface of the substrate 100 are different. For example, the line P2 containing the line segment farther from the substrate 100 (such as the line segment 332a) has a smaller acute angle Q at which it intersects with the surface of the substrate 100 (parallel to the line P3). That is, the slope of the line segment 332a is smaller than the slope of the line segment 331a, and the slope of the line segment 333a is smaller than the slope of the line segment 332a. For example, the acute angles Q corresponding to the line segments 331a and 332a are both less than or equal to 45 degrees. In this way, the second electrode 230 film layer can be deposited at the junction of the sidewall of the pixel defining layer 330 and the surface facing away from the substrate 100 , thereby further improving the continuity of the second electrode 230 at the junction.

[0101] In other examples, the structure shown in FIG6B (or FIG6C ) can be modified to convert all straight line segments therein into curved segments. In this way, when the sidewall of the pixel defining layer 330 is a continuous surface, the cross-sectional shape of the sidewall of the pixel defining layer 330 along the direction perpendicular to the surface of the substrate 100 is a line segment composed of multiple curved segments connected end to end, and the curvatures of the multiple curved segments are different. In this way, the intersection of the sidewall of the pixel defining layer 330 and the surface facing away from the substrate 100 can facilitate the deposition of film layers (such as the light-emitting functional layer 220 and the second electrode 230) at that location, thereby further improving the continuity of these film layers at this intersection.

[0102] In other examples, as shown in FIG7A , when the sidewall of the pixel defining layer 330 is a continuous surface, the cross-sectional shape of the sidewall of the pixel defining layer 330, along a direction perpendicular to the surface of the substrate 100, is a line segment consisting of a connected curved segment 332b and a straight segment 331a, with the straight segment 331a located between the curved segment 332b and the substrate 100. In this way, the corner at the junction of the sidewall of the pixel defining layer 330 and the surface facing away from the substrate 100 is approximately rounded, thereby further improving the continuity of the film layers on the pixel defining layer 330.

[0103] For example, as shown in FIG. 7A , the curved segment 332 b and the straight segment 331 a are smoothly connected, and the curved segment 332 b is smoothly connected to the surface of the pixel defining layer 330 facing away from the substrate 100 .

[0104] In other examples, as shown in FIG7B , when the sidewall of the pixel defining layer 330 is a continuous surface, the cross-sectional shape of the sidewall of the pixel defining layer 330, along a direction perpendicular to the surface of the substrate 100, is a line segment consisting of a first curved segment 331b, a straight segment 332a, and a second curved segment 333b connected to each other, with the first curved segment 331b, the straight segment 332a, and the second curved segment 333b increasing in distance from the substrate 100. In this way, the intersection of the sidewall of the pixel defining layer 330 and the surface facing away from the substrate 100, as well as the intersection of the bottom of the pixel opening 302 and the sidewall, can facilitate the deposition of film layers (such as the light-emitting functional layer 220 and the second electrode 230 described below), further improving the continuity of these film layers at these two intersections.

[0105] For example, the middle part of the first curve segment 331b is located on the side of the straight line determined by the two ends of the first curve segment 331b facing the pixel defining layer 330, that is, the first curve segment 331b appears to be a concave surface; the middle part of the second curve segment 333b is located on the side of the straight line determined by the two ends of the second curve segment 333b facing away from the pixel defining layer 330, that is, the second curve segment 333b appears to be a convex surface.

[0106] For example, the first curved segment 331b and the second curved segment 333b are both smoothly connected to the straight segment 332a, the second curved segment 333b is smoothly connected to the surface of the pixel defining layer 330 facing away from the substrate 100, and the tangent line of the end of the first curved segment 331b close to the substrate 100 is parallel to the surface of the substrate 100.

[0107] In at least one embodiment of the present disclosure, as shown in Figures 6A to 6C and Figures 7A and 7C, when the sidewall of the pixel defining layer 330 is a continuous surface, the pixel defining layer 330 includes at least two first sub-defining layers 331 and a second sub-defining layer 332 stacked sequentially on the substrate 100, and the side surfaces of the first sub-defining layer 331, the second sub-defining layer 332, and the third sub-defining layer 333 include straight line segments or curved line segments, that is, each straight line segment or curved line segment corresponds to a cross-section of the side surface of the sub-defining layer. For example, as shown in Figure 6C, straight line segments 331a, 332a, and 333a correspond to the side surfaces of the first sub-defining layer 331, the second sub-defining layer 332, and the third sub-defining layer 333, respectively.

[0108] In other embodiments of the present disclosure, as shown in Figures 8A to 8C , the sidewalls of the pixel defining layer 330 are stepped surfaces. This improves the continuity of the film layers (e.g., the light-emitting functional layer 220 and the second electrode 230) formed at the pixel opening 302 on the sidewalls, thereby ensuring the display effect of the display panel.

[0109] For example, as shown in FIG8A , in the case where the sidewalls of the pixel defining layer 330 are stepped surfaces, the pixel defining layer 330 includes at least two first sub-defining layers 331 and a second sub-defining layer 332 stacked sequentially on the substrate 100. In each adjacent first sub-defining layer 331 and second sub-defining layer 332, the orthographic projection of the second sub-defining layer 332 farther from the substrate 100 is located within the orthographic projection of the first sub-defining layer 331 closer to the substrate 100. That is, the sidewalls of the first sub-defining layer 331 and the second sub-defining layer 332 are not directly connected. In this way, it is easy to prepare a pixel defining layer 330 with stepped sidewalls.

[0110] For example, as shown in FIG8A , along a direction perpendicular to the surface of substrate 100, the cross-sectional shape of the sidewalls of first sub-defining layer 331 and second sub-defining layer 332 is first line segments 331a and 332a. For example, these first line segments 331a and 332a are disconnected. For example, along a direction perpendicular to the surface of substrate 100, the cross-sectional shape of the portion of the surface of first sub-defining layer 331 away from substrate 100 that is exposed relative to second sub-defining layer 332 is second line segment 330b, and the cross-sectional shape of the sidewalls of the pixel defining layer is a line segment connected in sequence by first line segment 331a, second line segment 330b, and first line segment 332a.

[0111] In some examples, as shown in Figure 8A, when the side wall of the pixel defining layer 330 is a stepped surface, the cross-sectional shapes of the side surfaces of the first sub-defining layer 331 and the second sub-defining layer 332 are both straight line segments along the direction perpendicular to the surface of the substrate 100, and these straight line segments are disconnected at the ends and not directly connected.

[0112] In some examples, as shown in FIG8A , the further away from the substrate 100, the smaller the acute angle at which the side surfaces of the first sub-defining layer 331 and the second sub-defining layer 332 intersect with the surface of the substrate 100. That is, the slope of the second sub-defining layer 332 is smaller than the slope of the first sub-defining layer 331. This facilitates the deposition of film layers on the top of the sidewalls of the pixel defining layer 330, thereby further improving the continuity of the film layers on the sidewalls of the pixel defining layer 330.

[0113] In other examples, as shown in FIG8B , where the sidewalls of the pixel defining layer 330 are stepped, the cross-sectional shape of the side surface of the second sub-defining layer 332, which is farthest from the substrate 100, is a curved segment 332b, along a direction perpendicular to the surface of the substrate 100, while the cross-sectional shapes of the side surfaces of the remaining first sub-defining layers 331 are straight segments 331a. In this way, the corner at the intersection of the sidewalls of the pixel defining layer 330 and the surface facing away from the substrate 100 is approximately rounded, further improving the continuity of the second electrode on the pixel defining layer 330.

[0114] For example, as shown in Figure 8B, the side surface of the second sub-defining layer 332 farthest from the substrate 100 is smoothly connected to the surface of the pixel defining layer 330 facing away from the substrate 100, that is, the tangent line at the edge of the side surface of the second sub-defining layer 332 farthest from the substrate 100 is parallel to the surface of the pixel defining layer 330 facing away from the substrate 100.

[0115] In other examples, as shown in Figure 8C, when the side wall of the pixel defining layer 330 is a stepped surface, along the direction perpendicular to the surface where the substrate 100 is located, the cross-sectional shapes of the side surfaces of the first sub-defining layer 331 closest to the substrate 100 and the third sub-defining layer 333 farthest away are curved segments 331b and 333b respectively. For the first sub-defining layer 331 closest to the substrate 100, the middle part of the curved segment 331b is located on the side of the straight line determined by the two ends of the curved segment facing the pixel defining layer 330, that is, the curved segment 331b appears to be a concave surface; for the third sub-defining layer 333 farthest from the substrate 100, the middle part of the curved segment 333b is located on the side of the straight line determined by the two ends of the curved segment away from the pixel defining layer 330, that is, the curved segment 333b appears to be a convex surface. In this way, the junction of the side wall of the pixel defining layer 330 and the surface facing away from the substrate 100, as well as the junction of the bottom and the side wall of the pixel opening 302, can facilitate the deposition of film layers (such as the light-emitting functional layer 220 and the second electrode 230 described below), so as to further improve the continuity of the second electrode at the two junctions.

[0116] For example, as shown in Figure 8C, the side surface of the third sub-defining layer 333 farthest from the substrate 100 is smoothly connected to the surface of the pixel defining layer 330 facing away from the substrate 100, and the tangent of the end of the side surface of the first sub-defining layer 331 closest to the substrate 100 close to the substrate 100 is parallel to the surface where the substrate 100 is located.

[0117] In an embodiment of the present disclosure, the surface roughness of the sidewalls of the pixel defining layer 330 can be less than or equal to 0.05 microns. For example, the sidewalls of the pixel defining layer 330 may have defect structures such as depressions, protrusions, and burrs, and the thickness, diameter, and other dimensions of these defect structures are less than or equal to 0.05 microns. This can prevent problems such as wrinkles on the second electrode caused by excessive surface roughness of the pixel defining layer 330, thereby reducing the impedance of the second electrode. For example, the surface roughness of the sidewalls of the pixel defining layer 330 can be 0 μm, 0.01 μm, 0.02 μm, 0.03 μm, 0.04 μm, 0.05 μm, etc.

[0118] In at least one embodiment of the present disclosure, referring back to FIG. 5A , in a direction away from the substrate 100, the pixel defining layer 330 includes a first sub-defining layer 331 and a second sub-defining layer 332 that are sequentially stacked on the substrate 100, and the first sub-defining layer 331 and the second sub-defining layer 332 have different densities (or refractive indices). For example, the density of the second sub-defining layer 332 is greater than that of the first sub-defining layer 331; or, the refractive index of the second sub-defining layer 332 is greater than that of the first sub-defining layer 331; or, under the same etching conditions, the etching rate of the second sub-defining layer 332 is less than that of the first sub-defining layer 331. In this way, the degree to which the pixel defining layer 330 is etched during the etching process of the first encapsulation layer 410 can be further reduced, thereby improving the integrity of the pixel defining layer 330 and thereby improving the continuity of the film layer formed on the pixel defining layer 330.

[0119] For example, the material of the first sub-defining layer 331 and the second sub-defining layer 332 includes at least one of silicon nitride, silicon oxide, and silicon oxynitride.

[0120] In at least one embodiment of the present disclosure, the thickness of the pixel defining layer 330 is 2000 angstroms to 5000 angstroms, for example, 2000 angstroms, 2500 angstroms, 3000 angstroms, 3500 angstroms, 4000 angstroms, 4500 angstroms, 5000 angstroms, etc.

[0121] In at least one embodiment of the present disclosure, referring back to FIG. 5A , the pixel defining layer 330 includes a first sub-defining layer 331 and a second sub-defining layer 332 sequentially stacked on the substrate 100. The first sub-defining layer 331 may be thicker than the second sub-defining layer 332. For example, the thickness of the first sub-defining layer 331 closest to the substrate 100 is 2000 angstroms to 3000 angstroms, such as 2000 angstroms, 2200 angstroms, 2400 angstroms, 2500 angstroms, 2600 angstroms, 2800 angstroms, 3000 angstroms, etc.; the thickness of the second sub-defining layer 332 farthest from the substrate 100 is 500 angstroms to 1000 angstroms, such as 500 angstroms, 600 angstroms, 700 angstroms, 800 angstroms, 900 angstroms, 1000 angstroms, etc.

[0122] In at least one embodiment of the present disclosure, referring again to FIG. 3B and FIG. 5B , the display panel may further include a planarization layer 110. Planarization layer 110 is an organic film layer located between the pixel defining layer 330 and the substrate 100. The material composition of the first sub-defining layer 331 closest to the substrate 100 includes silicon nitride. Silicon nitride has a higher bonding strength with the organic film layer. This can increase the bonding strength between the pixel defining layer 330 and the planarization layer 110, reduce the risk of film interface agent separation, and thus improve the reliability of the display panel.

[0123] For example, the substrate 100 may include a substrate and a driving circuit layer located on the substrate, the driving circuit layer including a plurality of pixel driving circuits located in the display area, and the display function layer is located on the driving circuit layer. For example, the pixel driving circuit may include a plurality of transistors TFT, capacitors, etc., for example, formed in various forms such as 2T1C (i.e., 2 transistors (TFT) and 1 capacitor (C)), 3T1C or 7T1C. The pixel driving circuit is connected to the light-emitting unit 200 to control the switching state and the luminous brightness of the light-emitting unit 200. In the embodiment of the present disclosure, there is no restriction on the positional relationship between the isolation structure 300 and the driving circuit, and it can be selected according to actual process requirements. For example, as a setting method, referring to Figure 3 again, the orthographic projection of the driving circuit on the substrate 100 partially overlaps with the orthographic projection of the isolation structure 300 on the substrate 100; or, in other settings, the orthographic projection of the driving circuit on the substrate 100 does not overlap with the orthographic projection of the isolation structure 300 on the substrate 100.

[0124] In at least one embodiment of the present disclosure, referring again to FIG. 3 , the display panel includes a plurality of light-emitting units 200, and the pixel openings 302 of the pixel defining layer 330 define the positions of the light-emitting units 200. The specific structure of the light-emitting units 200 and their arrangement relationship with the pixel defining layer 330 can be found in the relevant descriptions of the aforementioned embodiments and are not further described here. For example, the first electrode 210 of the light-emitting unit 200 is located on the side of the planar layer 110 facing away from the substrate 100. The planar layer 110 is used to planarize the drive circuit layer to ensure the flatness of the first electrode 210.

[0125] In at least one embodiment of the present disclosure, the display panel may further include an isolation structure 300. The arrangement relationship between the isolation structure 300 and the light-emitting unit 200 can be referred to the relevant description in the aforementioned embodiment and will not be described in detail here. In the embodiment of the present disclosure, while ensuring that the isolation structure 300 isolates the light-emitting functional layer in the light-emitting unit 200 and can assist in the preparation of the light-emitting unit, the specific design of the isolation structure 300 is not restricted and can be designed according to actual process requirements. Below, several design structures of the isolation structure 300 are described through several specific embodiments.

[0126] In at least one embodiment of the present disclosure, as shown in Figures 3 and 4, the isolation structure 300 is located between the pixel defining layer 330 and the first encapsulation layer 410, and includes a support portion 310 and a crown portion 320. The support portion 310 is located between the crown portion 320 and the substrate 100, and the orthographic projection of the support portion 310 on the substrate 100 is located within the orthographic projection of the crown portion 320 on the substrate 100. That is, the isolation structure 300 as a whole will appear to be wide at the top and narrow at the bottom, so that when some film layers in the light-emitting unit 200 (for example, the light-emitting functional layer 220) are evaporated, they are disconnected at the edge of the isolation structure 300 to reduce the risk of crosstalk between adjacent light-emitting units 200.

[0127] In some embodiments of the present disclosure, the main structure of the isolation structure 300 may tend to be made of a conductive material to reduce the voltage when driving the second electrode 230. For example, as shown in Figures 3 and 4, the support portion 310 is a conductive structure, and the second electrode 230 is electrically connected to the side surface of the support portion 310. In this way, the support portion 310 can be used to assist in connecting the second electrode 230. Because the support portion 310 is located in the gap between the light-emitting unit 200, it can have a higher design thickness (greater than the thickness of the second electrode 230) and can be made of a high-conductivity material. Therefore, when connected to the second electrode 230, the voltage drop problem generated on the second electrode 230 when driving the light-emitting unit 200 can be reduced.

[0128] For example, as shown in FIG9 , based on the support portion 310 being a conductive structure, the isolation structure 300 may further include a conductive layer 340. The conductive layer 340 is located between the support portion 310 and the pixel defining layer 330, and the orthographic projection of the end of the support portion 310 close to the substrate 100 on the substrate 100 is located within the orthographic projection of the conductive layer 340 on the substrate 100. In this way, the conductive layer 340 is used to support the support portion 310, but the surface of the conductive layer 340 facing away from the substrate 100 is not completely covered by the support portion 310. Compared to the side surface of the support portion 310, the material used to form the second electrode 230 is more easily deposited on the surface of the conductive layer 340 facing away from the substrate 100, thereby ensuring that the second electrode 230 has a greater thickness on the conductive layer 340, thereby reducing the impedance at the connection between the second electrode 230 and the isolation structure 300.

[0129] For example, as shown in FIG9 , on the basis that the support portion 310 is a conductive structure, the orthographic projection of the conductive layer 340 on the substrate 100 is located within the orthographic projection of the crown portion 320 on the substrate 100 , thereby ensuring the isolation effect of the isolation structure 300 on the light-emitting functional layer 220 .

[0130] For example, as shown in FIG9 , based on the supporting portion 310 being a conductive structure, the crown portion 320 may also be further designed as a conductive structure. This can further reduce the voltage drop problem on the second electrode 230 when driving the light-emitting unit 200 .

[0131] For example, on the basis that the support portion 310 is a conductive structure, the crown portion 320, the support portion 310 and the conductive layer 340 can be prepared from titanium, aluminum and molybdenum in sequence, and the corrosion resistance of titanium, molybdenum and aluminum decreases in sequence, thereby forming an isolation structure 300 as shown in Figure 9.

[0132] In other embodiments of the present disclosure, the main structure of the isolation structure 300 may be made of an insulating material to ensure strong bonding with other film layers, such as the first encapsulation layer. For example, as shown in Figure 9, the support portion 310 and the crown portion 320 are inorganic insulating layers. The isolation structure 300 also includes a conductive layer 340. The conductive layer 340 is located between the support portion 310 and the pixel defining layer 330. The orthographic projection of the end of the support portion 310 near the substrate 100 on the substrate 100 is located within the orthographic projection of the conductive layer 340 on the substrate 100. The area of ​​the conductive layer 340 on the surface facing away from the substrate 100 that is not covered by the support portion 310 is electrically connected to the second electrode 230. In this way, the conductive layer 340 can connect the second electrodes 230 of each light-emitting unit 200 together to facilitate connection to an external circuit. The support portion 310 and the crown portion 320, as inorganic insulating layers, can provide a high bonding strength with the first encapsulation layer 410, thereby reducing the risk of interface separation between the first encapsulation layer 410 and the isolation structure 300.

[0133] For example, when the crown 320 is an inorganic insulating layer, the thickness of the crown 320 may be 500 angstroms to 1500 angstroms.

[0134] For example, when the support portion 310 and the crown portion 320 are inorganic insulating layers, the thickness of the conductive layer 340 can be greater than that of the second electrode 230 , thereby alleviating the voltage drop problem on the second electrode 230 when driving the light-emitting unit 200 .

[0135] For example, when the support portion 310 and the crown portion 320 are inorganic insulating layers, the orthographic projection of the conductive layer 340 on the substrate 100 is located within the orthographic projection of the crown portion 320 on the substrate 100, thereby ensuring the isolation effect of the isolation structure 300 on the light-emitting functional layer 220.

[0136] For example, when the crown 320 is an inorganic insulating layer, the density of the crown 320 can be set to be greater than the density of the support portion 310. In this way, during the preparation of the isolation structure 300, the support portion 310 can be more easily etched (for example, side-etched) relative to the crown 320, thereby making the size of the crown 320 larger than the size of the support portion 310, so as to ensure the isolation effect of the isolation structure 300 on the light-emitting functional layer 220.

[0137] For example, when the crown 320 is an inorganic insulating layer, the density of the crown 320 is greater than the density of the first encapsulation layer 410. In this way, the damage to the crown 320 in the etching process of preparing the first encapsulation layer 410 can be reduced to ensure the isolation effect of the isolation structure 300 on the light-emitting functional layer 220.

[0138] In at least one embodiment of the present disclosure, referring back to FIG. 3 , the pixel defining layer 330 is an inorganic insulating film layer. Thus, the pixel defining layer 330 can separate the conductive structure and the first electrode 210, thereby enabling a smaller gap between the first electrodes 210. This reduces the pixel gap, thereby increasing the pixel density (PPI) of the display panel. Furthermore, the inorganic layer has high density and strong resistance, thereby reducing the design thickness of the display panel. Furthermore, the inorganic film layer is relatively thin, which allows the pixel opening 302 to have a smaller depth, thereby ensuring the continuity of the film layer (e.g., the second electrode 230) formed at the pixel opening 302. Furthermore, as an inorganic film layer, the pixel defining layer 330 can have a greater bonding strength with the isolation structure 300, thereby reducing the risk of the isolation structure 300 falling off.

[0139] In at least one embodiment of the present disclosure, referring again to FIG. 3 , the first encapsulation layer 410 includes a plurality of encapsulation units 411. The encapsulation units 411 correspond to the isolation openings 301, respectively, and cover the light-emitting units 200 in the corresponding isolation openings 301. During the process of preparing the light-emitting units 200 in batches based on the isolation structure 300, the encapsulation units 411 are formed synchronously with the corresponding light-emitting units 200. After each batch of light-emitting units 200 is prepared, the encapsulation units 411 can encapsulate and protect the already prepared light-emitting units 200 during the process of preparing the next batch of light-emitting units 200, thereby ensuring the luminous effect of the light-emitting units 200.

[0140] When the light-emitting units 200 are divided into multiple types that emit light of different colors, the light-emitting units 200 that emit different light are manufactured independently, but the film layer (evaporated film layer such as the light-emitting functional layer) in each light-emitting unit 200 is evaporated on the entire surface of the display panel during the evaporation. For example, the light-emitting unit 200 is classified into light-emitting units that emit red light (R), green light (G) and blue light (B), respectively. During the preparation process, the light-emitting units R, G, and B are prepared in sequence. When preparing the light-emitting unit R, a light-emitting unit R is formed in each isolation opening 301. A first encapsulation layer 410 is prepared on the display panel to cover the light-emitting unit G. Then, the first encapsulation layer 410 in part of the isolation openings 301 (used to form the light-emitting units G and B in the final product) and the second electrode and the light-emitting functional layer of the light-emitting unit R are removed to obtain the encapsulation unit 411. During this process, the first encapsulation layer 410 is used to protect the light-emitting units R in other isolation openings 301. Based on this method, the light-emitting units G and B are prepared in sequence to finally form the first encapsulation layer 410 as shown in Figure 3. That is, the first encapsulation layer 410 on the entire display panel is prepared in multiple processes.

[0141] It should be noted that in the embodiments of the present disclosure, there is no restriction on the preparation order of the three types of light-emitting units R, G, and B, and it can be designed according to the actual process requirements. For example, the preparation process can also be implemented based on the order of the light-emitting units B, G, and R.

[0142] The reason why the first encapsulation layer 410 is composed of multiple encapsulation units 411 is related to the principle that the light-emitting unit 200 is prepared based on the isolation structure 300. For details, please refer to the relevant descriptions in the embodiments shown in Figures 13A to 13I below, which will not be repeated here.

[0143] In at least one embodiment of the present disclosure, referring back to FIG. 3 , at least in order to improve the packaging effect, the packaging unit 411 may extend to the side of the isolation structure 300 that faces away from the substrate 100. The principle of this may be seen in the following description of the embodiments shown in FIG. 13A to FIG. 13I . In this case, the portion of the packaging unit 411 that overlaps with the upper surface of the isolation structure 300 (the side of the crown facing away from the substrate described below) forms a suspended portion 411a to be spaced apart from the crown 320. For example, the edge of the packaging unit 411 extends to the side of the pixel defining layer 330 that faces away from the substrate 100, and the portion of the packaging unit 411 located on the side of the pixel defining layer 330 that faces away from the substrate 100 forms a suspended portion 411a with the isolation structure 300.

[0144] In at least one embodiment of the present disclosure, as shown in FIG10A , the orthographic projection of the surface of the packaging unit 411 facing away from the substrate 100 on the substrate 100 is located within the orthographic projection of the surface facing the substrate 100 on the substrate 100, so that the side surface of the packaging unit 411 is an inclined surface, that is, the surface where the side surface of the packaging unit 411 is located intersects and is not perpendicular to the surface where the substrate 100 is located. In this way, the side wall of the packaging unit 411 will have a certain slope, so that in the subsequent preparation of the light-emitting unit 200 (not covered by the packaging unit 411 in the subsequent batch), it can be convenient to deposit a protective layer (for example, formed on the same layer as the light-emitting functional layer and the second electrode described below) on the side surface to protect the already formed packaging unit 411.

[0145] For example, the density of the first encapsulation layer 410 gradually decreases in a direction away from the substrate 100 , such that the side surface of the encapsulation unit 411 is a plane as shown in FIG. 10A .

[0146] For example, the encapsulation unit 411 includes multiple stacked sub-encapsulation layers, with the density of the sub-encapsulation layer further from the substrate 100 decreasing. Thus, by controlling the density distribution of the first encapsulation layer 410, a relatively inclined surface can be formed at the side surface of the encapsulation unit 411. For example, as shown in FIG10B , the encapsulation unit 411 (or the first encapsulation layer 410) includes three stacked sub-encapsulation layers, a first sub-encapsulation layer T1, a second sub-encapsulation layer T2, and a third sub-encapsulation layer T3. During the formation of the encapsulation unit 411, in order to form the inclined side surface, different process conditions are used to successively decrease the density of the first sub-encapsulation layer T1, the second sub-encapsulation layer T2, and the third sub-encapsulation layer T3. It should be noted that the density of the first sub-encapsulation layer T1, the second sub-encapsulation layer T2, and the third sub-encapsulation layer T3 can be constant or gradient. In the latter case, the density of each sub-encapsulation layer closer to the substrate 100 is greater. It should be noted that, for the aforementioned sub-encapsulation layers, the greater the density, the greater the degree of compactness. Thus, by controlling the density of different sub-encapsulation layers, the degree of compactness of the different sub-encapsulation layers can be regulated, thereby improving the flatness of the etched surface of the first encapsulation layer 410, thereby enabling the first encapsulation layer 410 to be more effectively protected during the display panel manufacturing process.

[0147] In some embodiments of the present disclosure, the encapsulation units 411 corresponding to different light-emitting units 200 are spaced apart from each other, that is, even the encapsulation units 411 corresponding to adjacent light-emitting units 200 with the same light emission color are spaced apart from each other.

[0148] In some embodiments of the present disclosure, the packaging units 411 corresponding to the light-emitting units 200 with different light-emitting colors are spaced apart from each other, and the packaging units 411 corresponding to the adjacent light-emitting units 200 with the same light-emitting color are connected to each other. In this case, in the gap between the adjacent light-emitting units 200 with the same light-emitting color, the crown 320 is completely covered by the packaging unit 411, and a film layer is filled between the crown 320 and the packaging unit 411. The filled film layer can be in the same layer and made of the same material as the light-emitting functional layer 220 and the second electrode 230 in the adjacent light-emitting unit 200. The principle can be referred to the specific description in the embodiments related to Figures 13A to 13I, and will not be repeated here.

[0149] In at least one embodiment of the present disclosure, as shown in FIG11 , the display panel may further include a second encapsulation layer 420 and a third encapsulation layer 430 covering the first encapsulation layer 410. The second encapsulation layer 420 is located between the first encapsulation layer 410 and the third encapsulation layer 430, and the third encapsulation layer 430 is located on a side of the second encapsulation layer 420 facing away from the substrate 100. The first encapsulation layer 410, the second encapsulation layer 420, and the third encapsulation layer 430 constitute an encapsulation structure 400. For example, the second encapsulation layer 420 is a planarization layer. For example, the second encapsulation layer 420 is an organic film layer, and the third encapsulation layer 430 is an inorganic film layer. For example, the second encapsulation layer 420 and the third encapsulation layer 430 are continuous film layers. The second encapsulation layer 420 can improve the flatness of the display panel surface, so as to facilitate the arrangement of other components on the encapsulation layer; in addition, the second encapsulation layer 420 can have a certain degree of flexibility to relieve the stress of the first encapsulation layer 410 and the third encapsulation layer 430, thereby improving the reliability of the display panel and being more conducive to the application of the display panel in the field of flexible displays; in addition, the third encapsulation layer 430 has high density and has a high barrier effect against water, oxygen, etc., and the third encapsulation layer 430 has higher strength, so as to facilitate the preparation of other components thereon (such as structures related to touch functions, optical film layers, etc.).

[0150] At least one embodiment of the present disclosure provides a display panel, which may be referred to again in Figures 1 to 4 and 5A to 5B. The display panel includes a substrate 100 and a pixel defining layer 330 located on the substrate 100. The pixel defining layer 330 includes a first portion and a second portion of different layers, wherein the density (or refractive index) of the first portion is greater than the density (or refractive index) of the second portion. The first portion and the second portion may correspond to different sub-defining layers in Figures 5A to 5B, that is, the first portion is one of the first sub-defining layer 331, the second sub-defining layer 332, and the third sub-defining layer 333, and the second portion is the other of the first sub-defining layer 331, the second sub-defining layer 332, and the third sub-defining layer 333. By increasing the density (or refractive index) of a portion of the pixel defining layer 330, the ability of the pixel defining layer 330 to resist etching in the subsequent manufacturing process of the display panel can be improved, so as to protect the structure below the pixel defining layer 330, thereby ensuring the yield of the display panel; in addition, this solution facilitates the control of the morphology of the side surface of the pixel defining layer 330 (for example, the side wall of the pixel defining layer 330 described below) to improve the continuity of the film layer formed on the side surface; in addition, this solution can allow different parts of the pixel defining layer 330 to be made of different materials, so as to maintain the bonding strength with different adjacent film layers above and below. The specific structure of the display panel and the further design that can be performed can be found in the relevant description of the aforementioned embodiment and will not be repeated here.

[0151] In the embodiments of the present disclosure, the density or refractive index of the pixel defining layer and the first encapsulation layer (or at least a portion thereof) can be characterized by other properties such as element (e.g., negative valence element) content, etching rate, density, etc., that is, the molecular or atomic compactness of the film layer will affect the above-mentioned properties.

[0152] At least one embodiment of the present disclosure provides a display panel. Referring again to Figures 1 to 4 , the display panel 10 includes a substrate 100, a pixel defining layer 330, and a first encapsulation layer 410 located on the substrate 100. The first encapsulation layer 410 is located on a side of the pixel defining layer 330 facing away from the substrate, and the density of at least a portion of the pixel defining layer 330 is greater than that of the first encapsulation layer 410. The structure of the display panel, the technical problems addressed, the corresponding technical effects, and further improved design structures can be found in the relevant descriptions of the aforementioned embodiments and are not further elaborated here.

[0153] For example, in at least one embodiment of the present disclosure, density is used to measure the density or refractive index of the film layer, that is, when the density of at least a portion of the pixel defining layer 330 is greater than the density of the first encapsulation layer 410, the density of at least a portion of the pixel defining layer 330 is also greater than the density of the first encapsulation layer 410, that is, for the film layer, the greater the density, the greater the density. Density refers to the ratio of the unit mass of a substance to its unit volume. It is usually used to describe the density of solid materials, such as metals, plastics, and glass. Density is a commonly used physical parameter that can be used to compare the density differences between different substances. The unit of density is usually kilograms per cubic meter (kg / m3), sometimes also expressed in grams per cubic centimeter (g / cm3) or pounds per cubic inch (lb / in3). In this way, the calculation formula for density is density = mass / volume, that is, density = mass / volume.

[0154] At least one embodiment of the present disclosure provides a display panel, as shown in Figures 1 to 4 again. The display panel 10 includes a substrate 100 and a pixel defining layer 330 and a first encapsulation layer 410 located on the substrate 100. The first encapsulation layer 410 is located on the side of the pixel defining layer 330 facing away from the substrate 100. The content of negative elements in at least a portion of the pixel defining layer 330 is greater than the content of negative elements in the first encapsulation layer 410. For example, the negative elements may include oxygen and nitrogen. The structure of the display panel, the technical problems solved, the corresponding technical effects, and the further improved design structure, etc., can be found in the relevant descriptions in the aforementioned embodiments and are not described in detail here.

[0155] For example, the oxygen and nitrogen content of the pixel defining layer 330 and the first encapsulation layer 410 can be measured using equipment such as an oxygen and nitrogen analyzer. During the measurement process, a sample is weighed and placed in a sample port. Through a series of chemical reactions and physical processes, the percentages of oxygen and nitrogen are ultimately determined by measuring the light intensity absorbed by the gas and calculating using the Beer-Lambert law.

[0156] For example, in at least one embodiment of the present disclosure, corresponding to the aforementioned relationship between density or refractive index between the pixel defining layer and the first encapsulation layer, when the material composition of at least a portion of the pixel defining layer 330 is the same as that of the first encapsulation layer 410, the content of negatively valent elements in at least a portion of the pixel defining layer 330 is greater than that in the first encapsulation layer 410. In this embodiment, the portion of the pixel defining layer 330 where the density is greater than that of the first encapsulation layer 410 will also have a greater content of negatively valent elements than that of the first encapsulation layer 410. That is, for a film layer, a greater content of negatively valent elements indicates a greater density.

[0157] For example, in at least one embodiment of the present disclosure, the negative valence element includes oxygen or nitrogen. For example, the pixel defining layer 330 and the first encapsulation layer 410 include at least one of silicon nitride, silicon oxide, and silicon oxynitride. For example, at least a portion of the pixel defining layer 330 and the first encapsulation layer 410 may have the same general chemical formula. For example, at least a portion of the pixel defining layer 330 and the first encapsulation layer 410 may both be made of silicon oxide, such as silicon oxide, or at least a portion of the pixel defining layer 330 and the first encapsulation layer 410 may both be made of silicon nitride, such as silicon nitride.

[0158] For example, in some embodiments of the present disclosure, referring again to FIG. 3 and FIG. 4 , the pixel defining layer 330 is a single-layer structure, and the content of negative-valent elements in any part of the pixel defining layer is greater than the content of negative-valent elements in any part of the first encapsulation layer.

[0159] For example, in other embodiments of the present disclosure, referring again to Figures 3, 5A and 5B, along the Z-axis direction perpendicular to the surface where the substrate 100 is located (equivalent to the thickness direction of the pixel defining layer 330), the content of negative-valent elements in the portion of the pixel defining layer 330 facing away from the substrate 100 (the side close to the first encapsulation layer 410, such as the second sub-definition layer 332 or the third sub-definition layer 333) is greater than the content of negative-valent elements in the first encapsulation layer 410, and the content of negative-valent elements in the portion of the pixel defining layer 330 facing away from the substrate 100 (the side close to the first encapsulation layer 410) is greater than the content of negative-valent elements in other portions of the pixel defining layer 330 (the side away from the first encapsulation layer 410, such as the first sub-definition layer 331 or the second sub-definition layer 332).

[0160] For example, as shown in Figure 5A, along the thickness direction of the pixel defining layer 330, the pixel defining layer 330 includes at least two first sub-defining layers 331 and a second sub-defining layer 332 stacked in sequence on the substrate 100, and the content of negative valence elements in the second sub-defining layer 332 closest to the first encapsulation layer 410 is greater than the content of negative valence elements in the first sub-defining layer 331.

[0161] For example, in some examples, as shown in FIG. 5A , the content of the negative-valent element in the first sub-defining layer 331 closest to the substrate 100 is greater than or equal to the content of the negative-valent element in the first encapsulation layer 410 .

[0162] For example, in other examples, as shown in Figure 5B, the pixel defining layer 330 includes three first sub-defining layers 331, the second sub-defining layer 332, and the third sub-defining layer 333 stacked in sequence on the substrate 100. The first sub-defining layer 331, the second sub-defining layer 332, and the third sub-defining layer 333 are successively away from the substrate 100, and the content of negative valence elements in the first sub-defining layer 331, the second sub-defining layer 332, and the third sub-defining layer 333 increases in sequence.

[0163] For example, in some other embodiments of the present disclosure, as shown in Figures 3 and 5B, the pixel defining layer 330 includes three first sub-defining layers 331, the second sub-defining layer 332, and the third sub-defining layer 333 stacked in sequence on the substrate 100, the first sub-defining layer 331, the second sub-defining layer 332, and the third sub-defining layer 333 are successively away from the substrate 100, the content of negative valence elements in the second sub-defining layer 332 (the middle part of the pixel defining layer 330) is greater than the content of negative valence elements in the first encapsulation layer 410, and the content of negative valence elements in the second sub-defining layer 332 is greater than the content of negative valence elements in the first sub-defining layer 331 and the third sub-defining layer 333.

[0164] For example, in some examples, as shown in Figures 3 and 5B, when the content of negative elements in the middle part of the pixel defining layer 330, such as the second sub-defining layer 332, is greater than the content of negative elements in the first encapsulation layer 410, the content of negative elements in the third sub-defining layer 333 farthest from the substrate 100 can be less than or equal to the content of negative elements in the first encapsulation layer 410.

[0165] For example, in some examples, as shown in Figures 3 and 5B, when the content of negative elements in the middle part of the pixel defining layer 330, such as the second sub-defining layer 332, is greater than the content of negative elements in the first encapsulation layer 410, the content of negative elements in the third sub-defining layer 333 farthest from the substrate 100 is equal to the content of negative elements in the first sub-defining layer 331 closest to the substrate 100, or the content of negative elements in the first sub-defining layer 331 closest to the substrate 100 is less than or equal to the content of negative elements in the first encapsulation layer 410.

[0166] For example, in some other embodiments of the present disclosure, as shown in Figures 3 and 5A, along the Z-axis direction perpendicular to the surface of the substrate 100 (equivalent to the thickness direction of the pixel defining layer 330), the pixel defining layer 330 includes a first sub-defining layer 331 and a second sub-defining layer 332 stacked in sequence on the substrate 100, and the density of the first sub-defining layer 331 is greater than the content of negative-valent elements in the first encapsulation layer 410, and greater than the content of negative-valent elements in the second sub-defining layer 332.

[0167] For example, in some examples, as shown in Figures 3 and 5B, the pixel defining layer 330 includes three first sub-defining layers 331, second sub-defining layers 332 and third sub-defining layers 333 stacked in sequence on the substrate 100, and the first sub-defining layers 331, the second sub-defining layers 332 and the third sub-defining layers 333 are successively away from the substrate 100, and the content of negative valence elements in the first sub-defining layer 331 farthest from the first encapsulation layer 410 is greater than the content of negative valence elements in the second sub-defining layers 332 and the third sub-defining layers 333.

[0168] For example, in some examples, as shown in Figures 3 and 5A, the content of negative elements in the second sub-defining layer 332 is greater than or equal to the content of negative elements in the first encapsulation layer 410; or, as shown in Figures 3 and 5B, the content of negative elements in the third sub-defining layer 333 is greater than or equal to the content of negative elements in the first encapsulation layer 410.

[0169] For example, in some examples, as shown in Figures 3 and 5B, the pixel defining layer 330 includes at least three first sub-defining layers 331, a second sub-defining layer 332, and a third sub-defining layer 333 stacked in sequence on the substrate 100. In the direction away from the substrate 100, the content of negative elements in the first sub-defining layer 331, the second sub-defining layer 332, and the third sub-defining layer 333 gradually decreases.

[0170] At least one embodiment of the present disclosure provides a display panel. Referring again to FIG. 1 to FIG. 4 and FIG. 5A , the display panel 10 includes a substrate 100, and a pixel defining layer 330, a light-emitting unit 200, and an encapsulation structure 400 located on the substrate 100. The pixel defining layer 330 is disposed on one side of the substrate 100, enclosing a pixel opening 302. The light-emitting unit 200 is disposed within the pixel opening 302 and on a side of the pixel defining layer 330 away from the substrate 100. The encapsulation structure 400 is disposed on a side of the light-emitting functional layer away from the substrate 100. The encapsulation structure 400 includes a first encapsulation layer 410 proximate to a side of the pixel defining layer 330. The pixel defining layer 330 includes a sub-definition layer. The orthographic projection of the first encapsulation layer 410 on the substrate 100 partially overlaps with the orthographic projection of the sub-definition layer on the substrate 100. The sub-definition layer has an etching rate that is lower than that of the first encapsulation layer 410.

[0171] In the embodiment of the present disclosure, the etching rate may be an etching rate of the pixel defining layer 330 and the first encapsulation layer 410 by the etching material used in the etching process of the first encapsulation layer 410 .

[0172] For example, the etch rate can be measured by the following method as shown in steps 1 to 4:

[0173] Step 1: Select the sample material to be etched, cut and dry the sample to be etched, then weigh it, record the mass before etching, and place the weighed etched sample on the sample table.

[0174] Step 2: Select an etching process according to the type of sample material to be etched, and etch the sample material under certain etching process conditions (ensuring a stable etching environment, such as stable temperature and etching solution concentration).

[0175] Step 3: After etching is completed, the etched sample is cleaned and dried and then weighed again, and the weight after etching is recorded.

[0176] Step 4: Calculate the etching rate using the weight loss method using the following formula: Δmv = Apt. In this formula, v is the etching rate; Δm is the etching mass, which is the difference in mass between the sample before and after etching; A is the etching area; p is the density of the sample; and t is the etching time. It should be noted that the etching rate can also be measured using other factors, such as the thickness, volume, length, or width of the sample.

[0177] For example, as shown in Figure 5A, the pixel defining layer 330 includes at least two sub-defining layers, namely, a first sub-defining layer 311 and a second sub-defining layer 312. The first sub-defining layer 311 is located between the second sub-defining layer 312 and the substrate 100. Under the same etching conditions, the etching rate of the second sub-defining layer 312 is less than the etching rate of the first encapsulation layer 410.

[0178] For example, in some embodiments, as shown in FIG5A , the first sub-defining layer 311 and the second sub-defining layer 312 have different etching rates. For example, the etching rate of the first sub-defining layer 311 is greater than the etching rate of the second sub-defining layer 312. In this way, during the preparation process of the first encapsulation layer 410, the second sub-defining layer 312 can have a higher etching resistance, thereby reducing the degree of etching damage to the pixel defining layer 330.

[0179] For example, as shown in FIG5A , the material composition of the first encapsulation layer 410 is different from the material composition of the second sub-definition layer 312. The material of the first encapsulation layer 410 includes a silicon-based material containing nitrogen, and the material of the second sub-definition layer 312 includes a silicon-based material containing oxygen. For example, the material of the second sub-definition layer 312 is silicon oxide (such as silicon oxide), and the material of the first encapsulation layer 410 is silicon nitride (silicon nitride).

[0180] For example, as shown in FIG5A , the material composition of the first sub-defining layer 311 is different from the material composition of the second sub-defining layer 312. For example, the material of the second sub-defining layer 312 includes a silicon-based material containing oxygen. For example, the material of the second sub-defining layer 312 is silicon oxide (silicon oxide), and the material of the first sub-defining layer 311 is silicon nitride (silicon nitride).

[0181] For example, as shown in FIG5A , under the same etching conditions, the etching rate of the first encapsulation layer 410 is the same as the etching rate of the first sub-definition layer 311, and the material composition of the first sub-definition layer 311 is the same as the material composition of the first encapsulation layer 410. For example, the materials of the first sub-definition layer 311 and the first encapsulation layer 410 are both silicon-based materials containing nitrogen, such as silicon nitride.

[0182] At least one embodiment of the present disclosure provides a method for manufacturing a display panel, as shown in FIG12A . The method includes the following steps S11 to S13 .

[0183] S11, providing a substrate, wherein a pixel defining layer is provided on the substrate, and the pixel defining layer has pixel openings.

[0184] S12, forming a light-emitting unit in the pixel opening.

[0185] S13, forming a first encapsulation film on a side of the light-emitting unit facing away from the substrate, and performing an etching process on the first encapsulation film to form a first encapsulation layer, wherein, during the etching process on the first encapsulation film, an etching rate of the material of the pixel defining layer is less than an etching rate of the material of the first encapsulation film.

[0186] Regarding the structure of the display panel obtained in the above steps S11 to S13, the technical problems solved and the corresponding technical effects, further improvements, etc., please refer to the relevant descriptions in the above embodiments and will not be elaborated here.

[0187] In the preparation method provided in the above embodiment of the present disclosure, as shown in FIG12B , the steps of forming the pixel defining layer, the light emitting unit and the first encapsulation layer in the above steps S12 to S13 include the following steps S21 to S29 .

[0188] S21, forming a plurality of first electrodes on a substrate.

[0189] S22 , forming a pixel defining material layer on the substrate having the first electrode formed thereon.

[0190] S23 , forming an isolation structure on a side of the pixel defining material layer facing away from the substrate, wherein the isolation structure has a plurality of isolation openings.

[0191] S24 , performing a patterning process on the pixel defining material layer to form a pixel opening corresponding to the isolation opening, and the pixel defining material layer is formed into a pixel defining layer.

[0192] S25 , forming a light-emitting functional layer and a second electrode on a side of the isolation structure away from the substrate, wherein the first electrode, the light-emitting functional layer and the second electrode corresponding to each isolation opening constitute a light-emitting unit.

[0193] S26, after forming a first encapsulation film on the side of the isolation structure and the light-emitting unit facing away from the substrate, depositing photoresist on the first encapsulation film, and patterning the photoresist to form a photoresist pattern, wherein the photoresist pattern covers a portion of the isolation opening.

[0194] S27, etching the first packaging film, the light-emitting functional layer and the second electrode using the photoresist pattern as a mask to remove portions of the first packaging film, the light-emitting functional layer and the second electrode that are not covered by the photoresist pattern, wherein the remaining portion of the first packaging film is a packaging unit.

[0195] S28, removing the remaining photoresist pattern.

[0196] S29, repeating the steps of forming the light-emitting functional layer and the second electrode until removing the remaining photoresist pattern, to form light-emitting units and encapsulation units at the isolation openings where no light-emitting units are formed, wherein all the encapsulation units together constitute a first encapsulation layer.

[0197] Regarding the structure of the display panel obtained in the above steps S21 to S29, the technical problems solved and the corresponding technical effects, further improvements, etc., please refer to the relevant descriptions in the above embodiments and will not be repeated here.

[0198] In another specific embodiment of the fourth aspect of the present disclosure, as shown in FIG12C , the steps of forming the pixel defining layer, the light emitting unit and the first encapsulation layer in the above steps S12 to S14 include the following steps S31 to S39 .

[0199] S31, forming a plurality of first electrodes on a substrate.

[0200] S32 , forming a pixel defining material layer on the substrate having the first electrode formed thereon.

[0201] S33 , forming an isolation structure on a side of the pixel defining material layer facing away from the substrate, wherein the isolation structure has a plurality of isolation openings.

[0202] S34 , performing a patterning process on the pixel defining material layer to form a pixel opening corresponding to the partial isolation opening, and the pixel defining material layer is formed into a pixel defining layer.

[0203] S35 , forming a light-emitting functional layer and a second electrode on a side of the isolation structure away from the substrate, and the first electrode, the light-emitting functional layer and the second electrode corresponding to the isolation opening and the pixel opening constitute a light-emitting unit.

[0204] S36, after forming a first encapsulation film on the side of the isolation structure and the light-emitting unit facing away from the substrate, depositing photoresist on the first encapsulation film, and patterning the photoresist to form a photoresist pattern, wherein the photoresist pattern covers a portion of the isolation opening.

[0205] S37, etching the first packaging film, the light-emitting functional layer and the second electrode using the photoresist pattern as a mask to remove portions of the first packaging film, the light-emitting functional layer and the second electrode that are not covered by the photoresist pattern, wherein the remaining portion of the first packaging film is a packaging unit.

[0206] S38, removing the remaining photoresist pattern.

[0207] S39, repeat the above steps of forming pixel openings to removing the remaining photoresist pattern to form pixel openings corresponding to each isolation opening in the pixel defining layer, and form light-emitting units and encapsulation units at the isolation openings where no light-emitting units are formed, wherein all the encapsulation units together constitute a first encapsulation layer.

[0208] Regarding the structure of the display panel obtained in the above steps S31 to S39, the technical problems solved and the corresponding technical effects, further improvements, etc., please refer to the relevant descriptions in the above embodiments and will not be repeated here.

[0209] At least one embodiment of the present disclosure provides another method for preparing a display panel, the method comprising: providing a substrate and forming a pixel defining layer on the substrate; forming a first encapsulation layer on the substrate having the pixel defining layer formed thereon, wherein, under the same preparation conditions as the first encapsulation layer, the deposition rate of the material of the pixel defining layer is less than the deposition rate of the material of the first encapsulation layer. In this preparation method, the density of the prepared pixel defining layer is greater than the density of the first encapsulation layer. Regarding the structure of the display panel obtained by this preparation method, the technical problems solved, the corresponding technical effects, and possible further improvements, please refer to the relevant descriptions in the aforementioned embodiments and will not be elaborated here.

[0210] In the embodiments of the present disclosure, the pixel defining layer has a low deposition rate (low film formation rate) and a high density. The deposition rate can be understood as the film formation rate. Under the same process conditions or power conditions, the lower the deposition rate (the lower the film formation rate), the more material is deposited at the same location, and the denser the film layer formed.

[0211] In the embodiments of the present disclosure, process conditions may include process type, environmental parameters, etc. For example, the process type may include chemical vapor deposition, atomic layer deposition, or other types of film formation methods, and the environmental parameters may include indoor air pressure, humidity, temperature, etc. For example, power may be the power of material input into the film forming equipment. The higher the power, the faster the material input and the faster the film formation rate.

[0212] For example, the step of forming the pixel defining layer may include: forming a pixel defining material layer on the substrate, and performing an etching process on the pixel defining material layer to form the pixel defining layer having pixel openings.

[0213] For example, the step of forming a first encapsulation layer may include: forming a first encapsulation film on the side of the light-emitting unit facing away from the substrate, and performing an etching process on the first encapsulation film to form a first encapsulation layer, the first encapsulation layer is used to participate in the formation of the encapsulation structure, wherein, during the etching process of the first encapsulation film, the pixel defining layer or the pixel defining material layer is etched at a rate less than the etching rate of the first encapsulation film.

[0214] In at least one embodiment of the present disclosure, the above-mentioned preparation method may further include: forming a first encapsulation layer on a substrate having a pixel defining layer formed thereon. In this preparation method, the input power of the material used to form the first encapsulation layer is regulated to be greater than the input power of the material used to form the pixel defining layer, so that the film forming rate of the pixel defining layer is less than the film forming rate of the first encapsulation layer. In this way, the density of the pixel defining layer can be greater than the density of the first encapsulation layer. Regarding the structure of the display panel obtained by this preparation method, the technical problems solved, the corresponding technical effects, and further improvements that can be made, please refer to the relevant descriptions in the aforementioned embodiments and will not be elaborated here.

[0215] In embodiments of the present disclosure, during the deposition process (e.g., a CVD process) used to form the first encapsulation layer, the input power of the device can be controlled to control the growth rate of the first encapsulation layer. When the input power is low, the density of the first encapsulation layer is high, whereas when the input power is high, the density of the first encapsulation layer is low. Thus, by controlling the input power, the density of various parts of the first encapsulation layer can be controlled.

[0216] Next, the preparation process of the display panel shown in FIG. 3 is described with reference to FIG. 13A to FIG. 13I , so as to intuitively demonstrate the principle that the isolation structure can increase the pixel arrangement density PPI.

[0217] As shown in FIG. 13A , a substrate 100 is provided and first electrodes 210 arranged in an array are formed on the substrate 100 .

[0218] As shown in Figure 13B, a pixel defining material layer 330a is deposited on the substrate 100 having the first electrode 210 formed thereon. In this process, the density of the pixel defining material layer 330a can be controlled by controlling the input power of the device during the deposition of the pixel defining material layer 330a.

[0219] 13C , a first material layer 310 a and a second material layer 320 a are formed on the pixel defining material layer 330 a . For example, the first material layer 310 a may be made of aluminum, and the second material layer 320 a may be made of titanium.

[0220] As shown in FIG13D , the first material layer 310a and the second material layer 320a are patterned to form the first material layer 310a into a support portion 310, and the second material layer 320a into a crown portion 320. The support portion 310 and the crown portion 320 define an isolation opening 301 and constitute an isolation structure 300. The specific structure of the isolation structure 300 can be found in the relevant description of the previous embodiment and is not further described here.

[0221] In an embodiment of the present disclosure, the patterning process may be a photolithography patterning process, which may include, for example, coating a photoresist on a structural layer to be patterned, exposing the photoresist using a mask, developing the exposed photoresist to obtain a photoresist pattern, etching the structural layer using the photoresist pattern (optionally wet etching or dry etching), and then optionally removing the photoresist pattern. It should be noted that when the material of the structural layer (e.g., the photoresist pattern 500 described below) includes photoresist, the structural layer may be directly exposed through a mask to form the desired pattern.

[0222] It should be noted that if the corrosion resistance of the second material layer 320a (for example, titanium) is greater than the corrosion resistance of the first material layer 310a (for example, aluminum), the etching rate of the first material layer 310a will be greater than the etching rate of the second material layer 320a, so that the width of the crown 320 will be greater than the width of the support portion 310, thereby forming a structure as shown in Figure 13D.

[0223] As shown in FIG. 13E , the pixel defining material layer 330 a is patterned to form a pixel opening 302 at a location where the partial isolation opening 301 is located. The pixel defining material layer 330 a is formed into a pixel defining layer 330 (not in its final form).

[0224] It should be noted that, in the step shown in FIG. 13E , the pixel opening 302 may be formed using a photolithography patterning process. In this process, the isolation structure 300 may also be used to expose the photoresist, thereby precisely controlling the formation position of the pixel opening 302 .

[0225] As shown in FIG13F , a light-emitting functional layer 220 and a second electrode 230 are evaporated on the substrate 100 to form a light-emitting unit 200 in each isolation opening 301 of the isolation structure 300. No mask is used in this evaporation process, so the evaporated material is also deposited on the crown 320. It should be noted that in actual processes, the evaporated material is deposited on the upper surface of the crown 320 facing away from the substrate 100 and on the sidewalls (not shown in the figure). A first encapsulation film 410a is then deposited to cover the light-emitting unit 200 and the isolation structure 300. In this process, the density of the first encapsulation film 410a during its formation can be controlled by controlling the input power of the device during deposition.

[0226] It should be noted that at the position where the isolation opening 301 is formed but the pixel opening 302 is not formed, the light-emitting functional layer 220 and the first electrode 210 are spaced apart, so the light-emitting functional layer 220 and the first electrode 210 of the light-emitting unit 200 at this position are separated from each other and thus have no light-emitting function.

[0227] As shown in FIG13G , a photoresist is formed (e.g., coated) on the substrate 100 on which the first encapsulation film 410 a is formed, and then patterned to form a photoresist pattern 500. The photoresist pattern 500 only covers a portion of the isolation opening 301 of the isolation structure 300 (the isolation opening 301 corresponding to the pixel opening 302).

[0228] As shown in FIG13H , the surface of the display panel is etched using the photoresist pattern 500 as a mask to remove the first encapsulation film 410a, the second electrode 230 and the light-emitting functional layer 220 that are not covered by the photoresist pattern 500. The remaining portion of the first encapsulation film 410a forms the encapsulation unit 411 of the first encapsulation layer 410. Then, the remaining photoresist pattern 500 is removed.

[0229] It should be noted that due to the presence of the isolation structure 300 (especially the crown 320), the thickness of the first packaging film 410a is thinner at a position close to the isolation structure 300. In this way, in the process of etching the surface of the display panel using the photoresist pattern 500 as a mask, the etching material (etching gas or etching liquid) will easily preferentially etch through the thinner portion of the first packaging film 410a, and further etch the pixel defining layer 330 thereunder, thereby damaging the pixel defining layer 330.

[0230] As shown in FIG. 13I , the pixel definition layer 330 is patterned to form a pixel opening 302 at a location where another portion of the isolation opening 301 is located (where no pixel opening 302 is formed).

[0231] Repeat the steps of FIG. 13E to FIG. 13H to form light emitting units 200 emitting green light and light emitting units 200 emitting blue light in other isolation openings 301 , respectively, and form the display panel shown in FIG. 3 .

[0232] As shown in FIG14 , when evaporating a light-emitting functional layer (e.g., the first functional layer), if the evaporation source P is moved to face the isolation structure 300, the boundaries of its evaporation angle correspond to lines L1 and L2 on the display panel. In this case, the area before lines L1 and L2 will not be evaporated. However, the area on the side of lines L1 and L2 facing away from the isolation structure 300 will be evaporated regardless of the position of the evaporation source P. That is, starting from line L1 or line L2, the thickness of the light-emitting functional layer decreases as it approaches the isolation structure 300. Similarly, the second electrode can also be formed by evaporation, and therefore, the thickness of the second electrode decreases as it approaches the isolation structure 300.

[0233] At least one embodiment of the present disclosure provides a display device, which may include the display panel of the above embodiment. For example, the display device may include a touch structure, an optical film (such as a micro lens, a polarizer), a cover plate, and other structures arranged on the light-emitting side of the display panel.

[0234] For example, the display device may be any product or component with a display function, such as a television, a digital camera, a mobile phone, a watch, a tablet computer, a laptop computer, or a navigator.

[0235] The above description is only a preferred embodiment of this specification and is not intended to limit this specification. Any modifications, equivalent replacements, etc. made within the spirit and principles of this specification should be included in the scope of protection of this specification.

Claims

1. A display panel comprising a substrate, a pixel defining layer and a first encapsulation layer located on the substrate, wherein: The first encapsulation layer is located on a side of the pixel definition layer away from the substrate. The density of at least a portion of the pixel defining layer is greater than the density of the first encapsulation layer, or the refractive index of at least a portion of the pixel defining layer is greater than the refractive index of the first encapsulation layer.

2. The display panel according to claim 1, wherein Along the thickness direction of the pixel defining layer, the density of the side of the pixel defining layer close to the first encapsulation layer is greater than the density of the first encapsulation layer, and the density of the side of the pixel defining layer close to the first encapsulation layer is greater than the density of the side of the pixel defining layer far from the first encapsulation layer; or Along the thickness direction of the pixel defining layer, the refractive index of the side of the pixel defining layer close to the first encapsulation layer is greater than the refractive index of the first encapsulation layer, and the refractive index of the side of the pixel defining layer close to the first encapsulation layer is greater than the refractive index of the side of the pixel defining layer away from the first encapsulation layer.

3. The display panel according to claim 2, wherein: The pixel defining layer includes at least two sub-defining layers stacked in sequence on the substrate, the density of the sub-defining layer close to the first encapsulation layer is greater than the density of the sub-defining layer away from the first encapsulation layer, or the refractive index of the sub-defining layer close to the first encapsulation layer is greater than the refractive index of the sub-defining layer away from the first encapsulation layer.

4. The display panel according to claim 3, wherein: The density of the sub-definition layer away from the first encapsulation layer is greater than or equal to the density of the first encapsulation layer, or the refractive index of the sub-definition layer away from the first encapsulation layer is greater than or equal to the refractive index of the first encapsulation layer.

5. The display panel according to claim 3, wherein: The pixel defining layer includes at least three sub-defining layers sequentially stacked on the substrate, and Along the direction away from the substrate, the density of the sub-defining layer gradually increases, or the refractive index of the sub-defining layer gradually increases. The display panel according to claim 1 , wherein: Along the thickness direction of the pixel defining layer, the density of the middle portion of the pixel defining layer is greater than the density of the first encapsulation layer, and the density of the middle portion of the pixel defining layer is greater than the density of other portions of the pixel defining layer; or The refractive index of the middle portion of the pixel defining layer is greater than the refractive index of the first encapsulation layer, and the refractive index of the middle portion of the pixel defining layer is greater than the refractive index of other portions of the pixel defining layer.

7. The display panel according to claim 6, wherein: The pixel defining layer includes a first sub-defining layer, a second sub-defining layer and a third sub-defining layer stacked in sequence on the substrate, the density of the second sub-defining layer is greater than the density of the first sub-defining layer and the density of the third sub-defining layer, or the refractive index of the second sub-defining layer is greater than the refractive index of the first sub-defining layer and the refractive index of the third sub-defining layer.

8. The display panel according to claim 7, wherein: The density of the third sub-defining layer is less than or equal to the density of the first encapsulation layer, or the refractive index of the third sub-defining layer is less than or equal to the refractive index of the first encapsulation layer; or The density of the first sub-defining layer is less than or equal to the density of the first encapsulation layer, or the refractive index of the first sub-defining layer is less than or equal to the refractive index of the first encapsulation layer; or The density of the first sub-defining layer is equal to the density of the third sub-defining layer, or the refractive index of the first sub-defining layer is equal to the refractive index of the third sub-defining layer.

9. The display panel according to claim 1, wherein: Along the thickness direction of the pixel defining layer, the density of the pixel defining layer close to the substrate is greater than the density of the first encapsulation layer, and the density of the portion of the pixel defining layer close to the substrate is greater than the density of other portions of the pixel defining layer; or Along the thickness direction of the pixel defining layer, the refractive index of the pixel defining layer close to the substrate is greater than the refractive index of the first encapsulation layer, and the refractive index of the portion of the pixel defining layer close to the substrate is greater than the refractive index of other portions of the pixel defining layer.

10. The display panel according to claim 9, wherein: The pixel defining layer includes at least two sub-defining layers stacked in sequence on the substrate, the density of the sub-defining layer close to the substrate is greater than the density of the other sub-defining layers, or the refractive index of the sub-defining layer close to the substrate is greater than the refractive index of the other sub-defining layers.

11. The display panel according to claim 10, wherein: The density of the sub-defining layer close to the first encapsulation layer is greater than or equal to the density of the first encapsulation layer; or A refractive index of the sub-defining layer close to the first encapsulation layer is greater than or equal to a refractive index of the first encapsulation layer.

12. The display panel according to claim 10, wherein: The pixel defining layer includes at least three sub-defining layers sequentially stacked on the substrate. In a direction away from the substrate, the density of the sub-defining layers gradually decreases, or the refractive index of the sub-defining layers gradually decreases.

13. The display panel according to claim 1, wherein: The pixel defining layer is a single-layer structure, the density of the pixel defining layer is greater than the density of the first encapsulation layer, or the refractive index of the pixel defining layer is greater than the refractive index of the first encapsulation layer.

14. The display panel according to claim 1, wherein: The pixel defining layer and the first encapsulation layer include at least one of silicon nitride, silicon oxide, and silicon oxynitride.

15. A display panel, comprising a substrate and a pixel defining layer located on the substrate, wherein a surface of the pixel defining layer facing away from the substrate is a first surface, and a surface of the pixel defining layer close to the substrate is a second surface, an orthographic projection of the first surface on the substrate is located within an orthographic projection of the second surface on the substrate, and the pixel defining layer includes a sidewall connecting the first surface and the second surface, and the sidewall is arranged obliquely relative to a surface on which the substrate is located; The pixel defining layer includes at least two sub-defining layers stacked on the substrate.

16. The display panel according to claim 15, wherein: The side wall is a continuous surface; Along a direction perpendicular to the surface of the substrate, the cross-sectional shape of the sidewall of the pixel defining layer is a straight line segment; or Along a direction perpendicular to the surface of the substrate, the cross-sectional shape of the sidewall of the pixel defining layer is a line segment formed by connecting a plurality of straight line segments end to end, and the angles at which the line including the plurality of line segments intersects with the surface of the substrate are different; or Along a direction perpendicular to the surface of the substrate, a cross-sectional shape of the sidewall of the pixel defining layer is a line segment formed by connecting a plurality of curved segments end to end, and the plurality of curved segments have different curvatures; or Along a direction perpendicular to the surface of the substrate, a cross-sectional shape of the sidewall of the pixel defining layer is a line segment consisting of a first curved segment, a straight segment, and a second curved segment connected to each other.

17. The display panel according to claim 15, wherein: The sidewall of the pixel defining layer is a stepped surface, and the at least two sub-defining layers include a first sub-defining layer and a second sub-defining layer. The first sub-defining layer and the second sub-defining layer are sequentially stacked on one side of the substrate in a direction away from the substrate, and an orthographic projection of the second sub-defining layer on the substrate is located within an orthographic projection of the first sub-defining layer on the substrate. Along a direction perpendicular to the surface of the substrate, the cross-sectional shape of the sidewalls of the first sub-defining layer and the second sub-defining layer is a first line segment, and the plurality of first line segments are arranged in a disconnected manner; Preferably, along a direction perpendicular to the surface of the substrate, the cross-sectional shape of a portion of the first sub-defining layer that is exposed relative to the second sub-defining layer on a surface away from the substrate is a second line segment, and the cross-sectional shape of the side wall of the pixel defining layer is a line segment connected in sequence by the first line segment, the second line segment, and the first line segment.

18. The display panel according to claim 15, wherein: The at least two sub-defining layers include a first sub-defining layer and a second sub-defining layer, and the first sub-defining layer and the second sub-defining layer are sequentially stacked on one side of the substrate in a direction away from the substrate; The density of the second sub-defining layer is greater than that of the first sub-defining layer, or the refractive index of the second sub-defining layer is greater than that of the first sub-defining layer, or under the same etching conditions, the etching rate of the second sub-defining layer is less than that of the first sub-defining layer; Or the material of the first sub-definition layer and the second sub-definition layer includes at least one of silicon nitride, silicon oxide and silicon oxynitride.

19. The display panel according to claim 15, wherein: In a cross section perpendicular to the substrate surface, an angle between a straight line on which a sidewall of the pixel defining layer lies and the substrate surface is no greater than 45 degrees; Alternatively, the angle between the straight line where the sidewall of the pixel defining layer is located and the surface of the substrate is no greater than 40 degrees.

20. The display panel according to claim 15, wherein The at least two sub-defining layers include a first sub-defining layer and a second sub-defining layer. Along the direction away from the substrate, the first sub-defining layer and the second sub-defining layer are stacked in sequence on one side of the substrate, and the thickness of the first sub-defining layer is greater than the thickness of the second sub-defining layer.

21. The display panel according to claim 20, wherein: The thickness of the pixel defining layer is 2000 angstroms to 5000 angstroms, the thickness of the first sub-defining layer is 2000 angstroms to 3000 angstroms, and the thickness of the second sub-defining layer is 500 angstroms to 1000 angstroms.

22. The display panel according to claim 15, further comprising a plurality of light emitting units, wherein The pixel defining layer includes a plurality of pixel openings, and the pixel openings limit the light-emitting unit. The light-emitting unit includes a first electrode, a light-emitting functional layer, and a second electrode stacked in sequence on the substrate. The first electrode is located between the pixel defining layer and the substrate. The pixel opening exposes a partial area of ​​the first electrode. The light-emitting functional layer and the second electrode cover the pixel opening and extend to the side of the pixel defining layer away from the substrate.

23. The display panel according to claim 22, further comprising an isolation structure located on the pixel defining layer, the isolation structure defining a plurality of isolation openings corresponding to the pixel openings, the light emitting functional layer and the second electrode being located in the isolation openings, the second electrode being electrically connected to the isolation structure, and The isolation structure includes a support portion and a crown portion, the support portion is located between the crown portion and the base plate, and an orthographic projection of the support portion on the base plate is located within an orthographic projection of the crown portion on the base plate.

24. The display panel according to claim 23, wherein: The isolation structure includes a conductive layer located between the support portion and the pixel defining layer. The orthographic projection of an end of the support portion close to the substrate on the substrate is located within the orthographic projection of the conductive layer on the substrate.

25. The display panel according to claim 15, wherein The display panel further includes a first encapsulation layer disposed on a side of the pixel defining layer away from the substrate, and The density of at least part of the pixel definition layer is greater than the density of the first encapsulation layer, or The refractive index of at least part of the pixel defining layer is greater than the refractive index of the first encapsulation layer, or Under the same etching conditions, an etching rate of at least a portion of the pixel defining layer is lower than an etching rate of the first encapsulation layer; Alternatively, the pixel definition layer and the first encapsulation layer are made of at least one of silicon nitride, silicon oxide, and silicon oxynitride.

26. A display panel comprising: a substrate, a pixel defining layer and a first encapsulation layer located on the substrate, wherein the first encapsulation layer is located on a side of the pixel defining layer facing away from the substrate, The density of at least a portion of the pixel definition layer is greater than the density of the first encapsulation layer; or A content of negative-valent elements in at least a portion of the pixel defining layer is greater than a content of negative-valent elements in the first encapsulation layer, and the negative-valent elements include oxygen and nitrogen.

27. A display panel comprising: substrate; A pixel defining layer is disposed on one side of the substrate, wherein the pixel defining layer encloses a pixel opening; a light-emitting unit, disposed in the pixel opening and on a side of the pixel definition layer away from the substrate; An encapsulation structure is arranged on a side of the light-emitting functional layer away from the substrate, the encapsulation structure includes a first encapsulation layer close to the pixel defining layer, the pixel defining layer includes a sub-definition layer, the orthographic projection of the first encapsulation layer on the substrate partially overlaps with the orthographic projection of the sub-definition layer on the substrate, and the etching rate of the sub-definition layer is less than the etching rate of the first encapsulation layer.

28. The display panel according to claim 27, wherein: The sub-defining layer includes a first sub-defining layer and a second sub-defining layer, the first sub-defining layer is located between the second sub-defining layer and the substrate, and under the same etching conditions, the etching rate of the second sub-defining layer is lower than the etching rate of the first encapsulation layer; An etching rate of the first sub-defining layer is greater than an etching rate of the second sub-defining layer.

29. The display panel according to claim 27, wherein: The material composition of the first encapsulation layer is different from the material composition of the second sub-definition layer, the material of the first encapsulation layer includes a silicon-based material containing nitrogen, and the material of the second sub-definition layer includes a silicon-based material containing oxygen; The material of the second sub-definition layer is silicon oxide, and the material of the first encapsulation layer is silicon nitride.

30. A method for preparing a display panel, comprising: Providing a substrate, wherein a pixel defining layer is provided on the substrate, and the pixel defining layer has pixel openings; forming a light emitting unit in the pixel opening; forming a first encapsulation film on a side of the light-emitting unit facing away from the substrate, and performing an etching process on the first encapsulation film to form a first encapsulation layer, wherein, during the etching process on the first encapsulation film, an etching rate of the material of the pixel defining layer is lower than an etching rate of the material of the first encapsulation film; or A substrate is provided and a pixel defining layer is formed on the substrate; a first encapsulation layer is formed on the substrate having the pixel defining layer formed thereon, wherein, under the same preparation conditions as those of the first encapsulation layer, a deposition rate of a material of the pixel defining layer is less than a deposition rate of a material of the first encapsulation layer.

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