LED display panel and preparation method thereof

Abstract

The invention is suitable for the technical field of display, and provides an LED display panel and a preparation method thereof.The preparation method comprises the steps that a packaging layer is arranged on the side face of the LED display panel to cover the edge of a printed circuit substrate and the edge of the packaging layer, on one hand, the edge of the LED display panel can be prevented from being scratched, and therefore falling or stripping of the packaging layer is prevented; on the other hand, the LEDs can be optically isolated, light leakage of the side face of the LED display panel is prevented, the display effect of the LED display screen is improved, and on the other hand, the packaging layer is arranged on the side face and can cover the joint of the printed circuit substrate and the packaging layer, waterproof and dampproof effects can be achieved, and the LED light source assembly is protected.

Description

Technical Field

[0001] This application belongs to the field of display technology, and in particular relates to LED display panels and their manufacturing methods. Background Technology

[0002] With the continuous development of outdoor LED (Light Emitting Diode) display technology, chip-on-board (COB) display panels have been widely researched and applied in outdoor advertising, information display and other fields due to their advantages such as high reliability and high protection.

[0003] In the production process of COB display panels, multiple components need to be assembled. First, multiple LED light source components are soldered onto the surface of the printed circuit board. The surface of the printed circuit board is then encapsulated to form an encapsulation layer to protect the LED light source components.

[0004] However, due to the thinness of the encapsulation layer, during repeated assembly processes, if the COB display panel experiences edge scraping or collisions, the encapsulation layer may peel off or detach, leaving it unable to protect the LED light source components within the COB display panel and affecting product quality. Furthermore, if the LED display is lit when the encapsulation layer has peeled off or detached, the light emitted from the detached or peeled area will travel in a different direction than the light emitted from other areas, affecting the display effect. Summary of the Invention

[0005] This application provides an LED display panel and its manufacturing method, which can protect the edges of the LED display panel, prevent the encapsulation layer from peeling or falling off, and improve product quality.

[0006] In a first aspect, embodiments of this application provide an LED display panel, comprising: a printed circuit board; a plurality of LED light source components arranged in an array, the LED light source components being soldered to the surface of the printed circuit board; an encapsulation layer covering the surface of the printed circuit board but not covering the LED light source components; and a protective layer at least partially disposed on the side of the LED display panel to cover the edge of the printed circuit board and the edge of the encapsulation layer.

[0007] Based on the above characteristics, by setting an encapsulation layer on the side of the LED display panel to cover the edge of the printed circuit board and the edge of the encapsulation layer, on the one hand, it can prevent the edge of the LED display panel from being scratched, thereby preventing the encapsulation layer from falling off or peeling off; on the other hand, it can provide optical isolation for the LED light source components, prevent light leakage from the side of the LED display panel, and improve the display effect of the LED display screen; furthermore, setting an encapsulation layer on the side can cover the joint between the printed circuit board and the encapsulation layer, which can be waterproof and moisture-proof, protecting the LED light source components.

[0008] Optionally, in some implementations of the first aspect, the protective layer includes a first portion and a second portion; the first portion is attached to the side of the printed circuit board to cover the edge of the printed circuit board; and the second portion is attached to the side of the encapsulation layer to cover the edge of the encapsulation layer.

[0009] Based on the above features, different parts of the protective layer are attached to the sides of the printed circuit board and the encapsulation layer to protect the printed circuit board and the encapsulation layer and prevent the encapsulation layer from falling off or peeling off.

[0010] Optionally, in some implementations of the first aspect, the first portion is attached to all sides of the printed circuit board to cover all edges of the printed circuit board; or, the first portion is attached to a portion of the sides of the printed circuit board to cover a portion of the edges of the printed circuit board.

[0011] Based on the above characteristics, by covering the printed circuit board with full or partial coverage, the protection of the printed circuit board can be met under different needs. If the edge of the printed circuit board is covered with full coverage, the entire edge of the printed circuit board can be protected, thus improving the protection. If the edge of the printed circuit board is covered with partial coverage, the edge of the printed circuit board can be protected while saving material costs.

[0012] Optionally, in some implementations of the first aspect, the second portion adheres to all sides of the encapsulation layer to cover all edges of the encapsulation layer; or, the second portion adheres to a portion of the sides of the encapsulation layer to cover a portion of the edges of the encapsulation layer.

[0013] Based on the above characteristics, by using full or partial coverage of the encapsulation layer, the protection of the encapsulation layer can be met under different needs. If the edge of the encapsulation layer is fully covered, the entire edge of the encapsulation layer can be protected, thus improving the protection level. If the edge of the encapsulation layer is partially covered, the edge of the encapsulation layer can be protected while saving material costs. Optionally, in some implementations of the first aspect, the first portion and the second portion are located on the same side of the LED display panel; or, the first portion and the second portion are located on different sides of the LED display panel.

[0014] Based on the above features, it is possible to protect the same-side edges of the printed circuit board and the encapsulation layer, or to protect the different-side edges of the printed circuit board and the encapsulation layer.

[0015] Optionally, in some implementations of the first aspect, the printed circuit board and the encapsulation layer form a first bonding position at the edge of the LED display panel; the protective layer is bonded to the first bonding position, and the cross-sectional area of ​​the protective layer is larger than the cross-sectional area of ​​the first bonding position to cover the first bonding position.

[0016] Based on the above characteristics, by bonding the protective layer to the bonding position between the printed circuit board and the encapsulation layer, the bonding between the printed circuit board and the encapsulation layer can be strengthened by the protective layer, preventing the encapsulation layer from peeling or falling off.

[0017] Optionally, in some implementations of the first aspect, the LED display panel includes a first side and a second side; at least a portion of the protective layer is disposed on the first side to cover the edge of the first side; and / or, at least a portion of the protective layer is disposed on the second side to cover the edge of the second side.

[0018] Based on the above characteristics, and according to the edge protection requirements of LED display panels, a protective layer is used to protect one or both edges of the LED display panel.

[0019] Optionally, in some implementations of the first aspect, the cross-section of the encapsulation layer is smaller than the cross-section of the printed circuit board to create a first region, which refers to the area of ​​the printed circuit board not covered by the encapsulation layer, and the first region is close to the edge of the printed circuit board; the protective layer further includes a third portion, which is attached to the first region to cover the surface of the first region.

[0020] Based on the above features, if the encapsulation layer does not completely cover the printed circuit board and a first region is generated, at least part of the protective layer is still attached to the surface of the first region to cover the first region, protect the first region, and further prevent the encapsulation layer from falling off or peeling off.

[0021] Optionally, in some implementations of the first aspect, the material of the protective layer includes, but is not limited to, at least one of epoxy resin, phenolic resin, unsaturated polyester resin, or polyimide resin.

[0022] Optionally, in some implementations of the first aspect, the protective layer is disposed on the side of the LED display panel by at least one of spraying, transfer, printing, printing, dip coating or deposition.

[0023] Optionally, in some implementations of the first aspect, the thickness of the protective layer is set to 2μm-100μm.

[0024] Secondly, embodiments of this application provide a packaging method for an LED display panel, the method being applied to the aforementioned LED display panel, the method comprising: Provides printed circuit boards and multiple LED light source assemblies; The multiple LED light source components are soldered in an array on the surface of the printed circuit board to obtain the assembled circuit board. The assembled circuit board is encapsulated by an encapsulation layer to obtain an encapsulated LED display panel; The packaged LED display panel is subjected to a side coating process to form a protective layer on the side of the packaged LED display panel to cover the edge of the LED display panel.

[0025] Thirdly, embodiments of this application provide an LED display device, which includes at least one LED display panel as described in the first aspect.

[0026] The beneficial effects of the technical solutions provided in this application include at least the following: By setting an encapsulation layer on the side of the LED display panel to cover the edges of the printed circuit board and the encapsulation layer, it can prevent the edges of the LED display panel from being scratched, thereby preventing the encapsulation layer from falling off or peeling off. On the other hand, it can provide optical isolation for the LED light source components, prevent light leakage from the sides of the LED display panel, and improve the display effect of the LED display screen. Furthermore, setting an encapsulation layer on the side can cover the joint between the printed circuit board and the encapsulation layer, which can be waterproofed and moisture-proofed, protecting the LED light source components. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a schematic cross-sectional view of an LED display panel provided in one embodiment of this application; Figure 2This is a schematic cross-sectional view of an LED display panel provided in one embodiment of this application; Figure 3 This is a schematic cross-sectional view of an LED display panel provided in one embodiment of this application; Figure 4 This is a schematic cross-sectional view of an LED display panel provided in one embodiment of this application; Figure 5 This is a schematic diagram of the structure of an LED display screen provided in an embodiment of this application; Figure 6 This is a top view of an LED display panel provided in an embodiment of this application; Figure 7 This is a schematic diagram of another LED display screen provided in an embodiment of this application; Figure 8 This is a schematic diagram of the structure of another LED display screen provided in the embodiments of this application; Figure 9 This is a schematic diagram of the top surface structure of an LED display panel according to an embodiment of this application; Figure 10 This is a schematic diagram of a method for manufacturing an LED display panel according to an embodiment of this application.

[0029] Icon labels: Printed circuit board: 11; LED light source assembly: 12; Encapsulation layer: 13; Protective layer: 14; First part: 15; Second part: 16; Third part: 17; First area: 18; Housing: 19; Metal layer: 20; Non-metal layer: 21; Heat conduction hole: 22; Heat pipe: 23; Working fluid: 24; Solder: 25; Pore: 26; Copper trace: 27; Heat dissipation control module: 28; Heat dissipation fin array: 29; Sensor: 30; Nano heat dissipation coating: 31. Detailed Implementation

[0030] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.

[0031] It should be understood that, when used in this application specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or a collection thereof.

[0032] It should also be understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0033] This is illustrative; please refer to it. Figures 1 to 4 This illustrates a schematic cross-sectional view of an LED display panel provided in an exemplary embodiment of this application, as shown below. Figure 1 As shown, the LED display panel includes a printed circuit board 11, multiple LED light source components 12, an encapsulation layer 13, and a protective layer 14. The multiple LED light source components 12 are soldered in an array arrangement on one side of the printed circuit board 11; therefore, the side of the printed circuit board 11 on which the LED light source components 12 are soldered is considered the surface of the printed circuit board 11.

[0034] As an example, the number of multiple LED light source components 12 can be 2, 4, 6, 8 or even more, and this application embodiment does not limit it.

[0035] Optionally, the LED light source assembly 12 includes at least one of LED lamp posts or light-emitting chips, which is not limited in this application embodiment.

[0036] Continue to refer to Figure 1 The LED display panel also includes an encapsulation layer 13, which covers the surface of the printed circuit board 11 but does not cover the LED light source assembly 12. Therefore, the encapsulation layer 13 is used to encapsulate the printed circuit board 11 without affecting the light emitted by the LED light source assembly 12 when it is lit, thereby improving the luminous efficiency and brightness of the LED display panel.

[0037] The LED display panel also includes a protective layer 14, which is at least partially disposed on the side of the LED display panel to cover the edges of the printed circuit board 11 and the encapsulation layer 13. By covering the edges of the printed circuit board 11 and the encapsulation layer 13, the protective layer 14 further deepens the adhesion between the printed circuit board 11 and the encapsulation layer 13, preventing the encapsulation layer 13 from peeling or falling off when the LED display panel is hit. Furthermore, the protective layer 14 is disposed on the side of the LED display panel to protect the side of the LED display panel and prevent the side of the LED display panel from being scratched.

[0038] Indicatively, the printed circuit board 11 comprises multiple layers, such as 2, 4, 6, 8, or 10 layers or even more.

[0039] Indicatively, the encapsulation layer 13 may be a single-layer material, or the encapsulation layer 13 may consist of multiple layers.

[0040] In the case where the encapsulation layer 13 comprises a multilayer board, the multilayer board is obtained by stacking the boards after each layer is produced in a single process; or, the multilayer board is obtained by stacking the boards after producing the multilayer boards in multiple different processes.

[0041] The stacking method of the multi-layer board includes stacking layer by layer, or, pre-setting the number of stacking layers, stacking multiple boards according to the pre-set number of layers to obtain multiple board groups, and then stacking the multiple board groups in sequence to obtain the encapsulation layer 13.

[0042] Schematic illustration: The LED display panel can be applied to an LED display screen, which may include: an LED display panel, a housing 19, and a heat pipe cooling structure. The LED display panel includes a printed circuit board 11 and a plurality of LED light source components 12 arranged in an array. The printed circuit board includes a metal layer 20 and a non-metal layer 211. The metal layer 20 is disposed on one side of the non-metal layer 211, and the LED light source components 12 are soldered to the side of the metal layer 20 away from the non-metal layer 211. The printed circuit board 11 has at least one heat conduction hole 22 penetrating through the metal layer 20 and the non-metal layer 211. The housing 19 is fixed to the side of the printed circuit board 11 away from the LED light source assembly 12. A receiving space k is provided between the housing 19 and the printed circuit board. The heat pipe heat dissipation structure is located in the receiving space k. The heat pipe heat dissipation structure includes a heat pipe 23 and a working fluid 24. One end of the heat pipe 23 is connected to the heat conduction hole 22, and the other end of the heat pipe 23 is connected to the housing 19. The working fluid 24 is filled in the heat pipe 23. The working fluid 24 is used to move in the heat pipe 23 to dissipate heat from the LED light source assembly 12 when the temperature in the receiving space k is not within the threshold range (18℃-22℃). When the temperature in the receiving space k is within the threshold range (18℃-22℃), it remains stationary in the heat pipe 23.

[0043] In practical applications, the LED display panel in this application embodiment can be a COB display panel, etc. When the LED display panel is a COB display panel, the LED display screen is a COB display screen. (Reference) Figure 6 , Figures 7 to 9As shown, in this embodiment of the COB display panel, an unencapsulated LED light source assembly 12 can be soldered to the surface of the metal layer 20 on the side opposite to the non-metal layer 21 in the printed circuit board 11 using solder 25 (e.g., solder). The LED light source assembly 12 is connected to the circuitry of the metal layer 20, achieving electrical connection between the LED light source assembly 12 and the printed circuit board 11. Since the printed circuit board 11 is energized—specifically, the metal layer 20 is energized while the non-metal layer 21 is not—the printed circuit board 11 can control the LED light source assembly 12 to achieve functions such as light emission. The LED light source assembly 12 is directly connected to the printed circuit board, resulting in a shorter heat dissipation path and better heat dissipation, which improves the stability and reliability of the COB display panel and extends its lifespan. Therefore, COB displays are increasingly widely used in large-scale display scenarios such as outdoor advertising screens, stadium displays, and stage background displays.

[0044] Based on this, after the LED light source component 12 in the COB display panel of this application embodiment is directly connected to the metal layer 20, a gap 26 may appear at the location where the solder 25 is not provided between the LED light source component 12 and the metal layer 20 (generally referring to the gap between the LED light source component 12 and the metal layer 20 or a small hole in the connection interface). Since the gap 26 may expose the internal structure (e.g., pins, solder joints, etc.), the gap 26 is filled with encapsulation material. This encapsulation material can isolate external moisture, dust, corrosive substances, etc., reducing the risk of short circuits between pins or metal oxidation. At the same time, it can fix the pins, reducing the risk of pin displacement or solder joint cracking caused by vibration and thermal expansion and contraction. Furthermore, it can buffer the stress caused by the difference in the coefficient of thermal expansion between the LED light source component 12 and the metal layer 20, reducing problems such as interface fatigue failure (e.g., solder joint detachment), and improving the long-term reliability of the COB display screen.

[0045] It should be noted that the LED light source assembly 12 can be connected to the circuit of the metal layer 20 by wire bonding or other connection methods, depending on the actual application.

[0046] In practical applications, the aforementioned housing 19 is fixed to the side of the printed circuit board 11 facing away from the LED light source assembly 12, and can be as follows: Figure 6 As shown, the cabinet 19 is directly mounted on the non-metallic layer 21. Specifically, the cabinet 19 can be directly mounted around the perimeter of the non-metallic layer 21, or it can be directly mounted on the side of the non-metallic layer 21 facing away from the metallic layer 20. Alternatively, the cabinet can be provided with mounting slots, and the LED display panel can be fixed in these slots using bolts or other structures. There are no specific limitations here, as long as the LED display panel and the cabinet are well connected.

[0047] It should be understood that the other end of the heat pipe 23 is connected to the housing 19, which can be as follows: Figure 6 , Figures 7 to 9 As shown, the other end of the heat pipe 23 is connected to the bottom surface of the housing 19, or the other end of the heat pipe 23 can be connected to the first side or the second side of the housing 19, depending on the actual application.

[0048] The working fluid 24 in the embodiments of this application may include gas, liquid, phase change substance, etc., such as water, refrigerant, liquid organic working fluid, etc.

[0049] The working fluid 24 is in a sealed environment, and its operation can be driven by temperature changes. In this embodiment, the threshold range is 18°C-22°C. Therefore, when the temperature of the containment space k is below 18°C ​​or above 22°C, the working fluid 24 in the heat pipe 23 will move (e.g., flow). However, the movement of the working fluid 24 differs depending on whether the temperature is below 18°C ​​or above 22°C: when the temperature in the containment space k of the housing 19 is below 18°C, the working fluid 24 can move from the bottom of the housing 19 towards the heat conduction hole 22 in the heat pipe 23; while when the temperature in the containment space k of the housing 19 is above 22°C, the working fluid 24 can move from the heat conduction hole 22 towards the bottom of the housing 19 in the heat pipe 23. This allows for rapid heat transfer and cooling.

[0050] Because water has a large specific heat capacity and a large latent heat of vaporization, it can effectively absorb and release heat. In heat pipe 23, a relatively stable temperature can be maintained through the circulation of liquid and gas. Moreover, the temperature of heat pipe 23 with water as working fluid 24 is easy to control at around 20°C. Therefore, water is further selected as the working fluid 24.

[0051] It should be noted that the diameter, length, etc. of the heat pipe 23 in this embodiment can be determined according to the size of the LED display screen to ensure that the heat can be evenly distributed to the edge of the LED display panel and transferred to the outer housing 19.

[0052] Figure 8 This is a top view of 12 LED light-emitting units (or light source components). (Reference) Figure 8As shown, a red LED light source component 1211, a green LED light source component 1212, and a blue LED light source component 1213 constitute a light-emitting unit. The green LED light source component 1212 is located between the red LED light source component 1211 and the blue LED light source component 1213. Any two adjacent LED light source components 12 are separated and spaced apart. The LED light source components 12 and their arrangement are the same in all light-emitting units. Three light-emitting units are arranged in the same row, and four light-emitting units are arranged in the same column. In the first and second rows, LED light source components 12 of the same color in the same column can be connected by a circuit (e.g., copper trace 27). In the third and fourth rows, LED light source components 12 of the same color in the same column can be connected by a circuit (e.g., copper trace 27). At the same time, all LED light source components 12 are soldered onto the metal layer 20. A heat conduction hole 22 is provided through the metal layer 20. The heat generated by the LED light source components 12 and the metal layer 20 after being powered on can be conducted to the heat pipe heat dissipation structure through the heat conduction hole 22.

[0053] It is worth noting that when the printed circuit board 11 has multiple heat conduction holes 22, one end of each heat pipe 23 can be attached to a heat conduction hole 22, and the other end of each heat pipe 23 can be extended to the housing 19. Simultaneously, the other ends of all heat pipes 23 are connected to the same point on the housing 19, for example, all connected to... Figure 6 , Figures 7 to 9 The intelligent heat dissipation control module 28 facilitates the control of the heat pipe heat dissipation structure and is simple to implement. Of course, the other end of all heat pipes 23 may not be connected to the same point on the casing 19, depending on the actual application.

[0054] This application provides an LED display screen using an LED light source assembly 12 as the light source. During operation, the LED light source assembly 12 generates heat. Since the LED light source assembly 12 is directly soldered to one side of the metal layer, the heat can be directly transferred to the metal layer in contact with it. The metal layer's excellent thermal conductivity rapidly absorbs the heat generated by the LED light source assembly 12, achieving rapid heat dissipation and reducing the risk of overheating. Simultaneously, a non-metallic layer is located on the side of the metal layer away from the LED light source assembly 12, exhibiting high thermal stability and good insulation. The composite thermally conductive substrate achieves effective heat conduction while ensuring the electrical safety of the LED display screen, thus improving its performance and reliability. Furthermore, the heat generated by the LED light source assembly 12 and the printed circuit board 11 itself can be transferred to the heat pipe cooling structure through the heat conduction holes. The heat pipes contain a working fluid that changes with temperature, allowing for effective heat dissipation of the LED display panel through the movement of the working fluid. This minimizes the impact of dust and rain on the LED display panel's heat dissipation, improving the reliability and stability of the LED display screen in complex outdoor environments and extending its lifespan.

[0055] In some implementations, reference Figures 3 to 4 As shown, the housing 19 includes a bottom surface, a first side surface, and a second side surface. One end of the first side surface is connected to one end of the second side surface through the bottom surface. The other ends of the first side surface and the other ends of the second side surface are both connected to the LED display panel. The bottom surface is a heat dissipation fin array 29, which includes multiple sub-heat dissipation fins. Two adjacent sub-heat dissipation fins are connected end to end, and each sub-heat dissipation fin has a non-linear shape.

[0056] In practical applications, the shapes of the multiple sub-heating fins can be exactly the same or completely different. For ease of manufacturing and installation, the shapes of the multiple sub-heating fins can be made identical. The specific shape of each sub-heating fin is not limited here. For example, each sub-heating fin may be recessed towards the LED display panel, thus making the heat dissipation fin array 29 wavy; or, each sub-heating fin may be protruding towards the LED display panel, thus making the heat dissipation fin array 29 wavy; or, some sub-heating fins may be recessed towards the LED display panel, while the remaining sub-heating fins may be protruding towards the LED display panel, provided that the recesses and protrusions can connect, thus making the heat dissipation fin array 29 wavy.

[0057] The materials for the heat sink fins can include aluminum alloys, specifically rust-resistant aluminum alloys such as 5A02 and 5A03. This allows the heat sink fins to possess properties such as light weight and good heat dissipation.

[0058] This application provides an LED display screen. By setting the shape of the sub-heat sink fins to a non-linear shape, the entire heat sink fin array becomes non-linear (e.g., wavy), thereby increasing the contact area between the heat sink array and the air. This, combined with the composite heat sink substrate, sealed heat pipes, and heat sink fin array with good protective performance, forms a highly efficient heat dissipation channel. This channel can quickly absorb, transfer, and dissipate the heat generated by the LED chip, reducing heat accumulation in the LED chip, effectively lowering the temperature of the LED display panel, further improving heat dissipation efficiency, protecting the LED chip from light decay, extending the LED chip's lifespan, and reducing the impact of dust and rain on heat dissipation. Overall, this enhances the reliability and stability of the LED display screen in complex outdoor environments.

[0059] In some implementations, reference Figure 4 As shown, the LED display screen also includes a nano heat dissipation coating 31, which can be disposed on the bottom surface of the housing 19 away from the LED display panel.

[0060] Furthermore, the nano heat dissipation coating 31 can be disposed on the side of the heat dissipation fin array 29 away from the LED display panel.

[0061] In practical applications, objects can approach blackbodies in the infrared band (especially 5μm-20μm). Meanwhile, the 8μm-13μm infrared band is a "transparent window" of the Earth's atmosphere (referred to as the atmospheric window). To efficiently convert heat into radiant energy and dissipate it through the nano-heat dissipation coating 31, the material of the aforementioned nano-heat dissipation coating 31 can include nanoscale heat dissipation materials, and more specifically, nanoscale heat dissipation materials with high infrared emissivity, such as metal oxides and ceramics. Among these, metal oxides can include alumina (Al2O3), titanium oxide (TiO2), etc., and ceramics can include aluminum nitride (AlN) nanoceramics, boron nitride (BN) nanoceramics, etc.

[0062] Based on the above, a periodic structure, such as nanoparticles or porous layers, can be provided on the surface of the nano heat dissipation coating 31 away from the LED display panel. The rough or porous structure can increase the radiation surface area and improve the overall heat dissipation efficiency.

[0063] Based on the above, high thermal conductivity fillers, such as graphene and boron nitride, can be added to the nanoscale heat dissipation material of the nano heat dissipation coating 31. This can accelerate the heat transfer from the box 19 to the surface of the nano heat dissipation coating 31 and then dissipate it through radiation.

[0064] The thickness of the nano heat dissipation coating 31 can be 0.05mm-0.5mm. For example, the thickness of the nano heat dissipation coating 31 can be 0.05mm, 0.1mm, 0.2mm, 0.3mm, 0.4mm or 0.5mm, etc.

[0065] This application provides an LED display screen. By providing a nano heat dissipation coating on the side of the cabinet away from the LED display panel, the nano heat dissipation coating can enhance the radiative heat dissipation of infrared rays, efficiently converting heat into infrared radiation (especially in the 8-13μm infrared band), and achieving passive cooling by utilizing atmospheric windows. Under natural convection, it can quickly dissipate heat to the surrounding environment, thereby significantly improving the heat dissipation efficiency of the LED display screen.

[0066] In some implementations, reference Figure 6 , Figures 7 to 9 As shown, the LED display screen may also include a sensor 30 and an intelligent heat dissipation control module 28. The sensor 30 is disposed in the accommodating space k, with one end connected to the bottom surface of the housing 19 and the other end suspended in the accommodating space k. The sensor 30 is used to monitor the temperature in the accommodating space k and transmit signals to the intelligent heat dissipation control module 28. The intelligent heat dissipation control module 28 is disposed in the accommodating space k and is electrically connected to the sensor 30, the heat pipe heat dissipation structure, and the LED display panel. The intelligent heat dissipation control module 28 is used to receive the signals transmitted by the sensor 30 and make judgments. When it is determined that the temperature in the accommodating space k is outside the threshold range, it controls the working fluid 24 to move in the heat pipe 23 to dissipate heat from the LED display panel, and / or controls the brightness of the LED display panel to decrease, and / or controls the power consumption of at least one LED to decrease. When it is determined that the temperature in the accommodating space k is within the threshold range, it controls the working fluid 24 to remain stationary in the heat pipe 23, and / or controls the brightness of the LED display panel to remain unchanged, and / or controls the power consumption of the LED to remain unchanged.

[0067] In practical applications, there is no specific limitation on the type of sensor 30. For example, sensor 30 can be a chip, etc.

[0068] It should be understood that the aforementioned intelligent heat dissipation control module 28 being located in the accommodating space k refers to: (Refer to...) Figure 6 , Figures 7 to 9 As shown, the intelligent heat dissipation control module 28 can be connected to either the bottom surface of the housing 19 or one end of the heat pipe 23. The type of intelligent heat dissipation control module 28 is not specifically limited; for example, it can be a chip, etc. It should be noted that, in the embodiments of this application, the sensor 30 can be connected to the control circuit of the intelligent heat dissipation control module 28, a control program can be written, and temperature and heat dissipation strategies can be set, thereby realizing functions such as heat dissipation control.

[0069] This application provides an LED display screen. By installing a sensor and an intelligent heat dissipation control module in the space between the cabinet and the display panel, the sensor can monitor the temperature of the space (i.e., the temperature of the LED display panel) in real time, ensuring the accuracy of the detection. When the sensor detects that the temperature of the space is outside the threshold range, the intelligent heat dissipation control module is activated. At this time, the intelligent heat dissipation control module can adjust the heat dissipation strategy by adjusting the state of the working fluid in the heat pipe, and / or the brightness of the LED display panel, and / or the power consumption of the LED chip, ensuring that the LED display panel is always within the optimal operating temperature range. While ensuring the normal operation of the LED display screen, it also reduces energy consumption and achieves the goal of energy saving.

[0070] Therefore, based on the heat dissipation function of the printed circuit board 11, the printed circuit board 11 can also be called a composite heat dissipation board.

[0071] Optionally, in this embodiment, the colors of the light emitted by the arrayed multiple LED light source components 12 can be partially the same, all the same, or all different, depending on the actual application. In one example, the multiple LED light source components 12 include red LED light source components 12, green LED light source components 12, and blue LED light source components 12. Each group of red, green, and blue LED light source components 12 constitutes an LED light-emitting unit. Any two adjacent LED light source components 12 are separated and spaced apart, and the LED light source components 12 and their arrangement are the same in all light-emitting units. Therefore, the more LED light source components 12 there are and the more densely they are arranged, the higher the luminous intensity of the LED display panel. The protective layer 13 on the side of the LED display panel not only protects the encapsulation layer 13 and the printed circuit board 11, but also provides optical isolation for the LED light source components 12, preventing light from escaping from the side of the LED display panel when the LED light source components 12 are emitting light, thereby improving the luminous efficiency of the LED display panel.

[0072] In some embodiments, the protective layer 14 includes a first portion 15 and a second portion 16. The first portion 15 is attached to the side of the printed circuit board 11 to cover the edge of the printed circuit board 11; the second portion 16 is attached to the side of the encapsulation layer 13 to cover the edge of the encapsulation layer 13.

[0073] This is illustrative; please refer to it. Figure 2The first portion 15 and the second portion 16 of the protective layer 14 are used as examples. The first portion 15 is attached to the edge of the encapsulation layer 13 to cover the edge of the encapsulation layer 13 and protect the edge of the encapsulation layer 13 from scratches. The second portion 16 is attached to the edge of the printed circuit board 11 to cover the edge of the printed circuit board 11 and prevent scratches.

[0074] Schematic, the side of the LED display panel, that is, the edge of the LED display panel, is formed by the edge of the printed circuit board 11 and the edge of the encapsulation layer 13.

[0075] In some embodiments, the first portion 15 is attached to all sides of the printed circuit board 11 to cover all edges of the printed circuit board 11; or, the first portion 15 is attached to a portion of the sides of the printed circuit board 11 to cover a portion of the edges of the printed circuit board 11.

[0076] In some embodiments, the second portion 16 is bonded to all sides of the encapsulation layer 13 to cover all edges of the encapsulation layer 13; or, the second portion 16 is bonded to a portion of the sides of the encapsulation layer 13 to cover a portion of the edges of the encapsulation layer 13. Therefore, for different protection requirements, if it is necessary to improve the adhesion between the encapsulation layer 13 and the printed circuit board 11, then the first portion 15 and the second portion 16 only need to protect the area where the encapsulation layer 13 and the printed circuit board 11 are bonded. Thus, the first portion 15 can be achieved by covering a portion of the edges of the printed circuit board 11 or by covering all edges of the printed circuit board 11, and the second portion 16 can be achieved by covering a portion of the edges of the encapsulation layer 13 or by covering all edges of the encapsulation layer 13. If it is necessary to improve the scratch resistance to the edges of the encapsulation layer 13, then the second portion 16 must be achieved by covering all edges of the encapsulation layer 13; if it is necessary to improve the scratch resistance to the edges of the printed circuit board 11, then the first portion 15 must be achieved by covering the entire printed circuit board 11.

[0077] This is illustrative; please continue to refer to it. Figure 1 and Figure 2 ,exist Figure 2 As a whole, the protective layer 14 is adhered to all sides of the LED display panel to cover and protect all edges of the LED display panel, or, in Figure 1 As a whole, the protective layer 14 is attached to a portion of the edge of the LED display panel to cover and protect that portion of the edge.

[0078] Furthermore, taking the protective layer 14, which includes the first portion 15 and the second portion 16, as an example, continue to refer to... Figure 1 , Figure 1The first portion 15 and the second portion 16 are not shown. The first portion 15 is attached to a portion of the side surface of the printed circuit board 11 to cover and protect a portion of the edge of the printed circuit board 11; or, continue to refer to Figure 2 The first part 15 is attached to all sides of the printed circuit board 11 to cover and protect all edges of the printed circuit board 11.

[0079] Continue to refer to Figure 1 The second part 16 is bonded to a portion of the side of the encapsulation layer 13 to cover and protect a portion of the edge of the encapsulation layer 13, which can be used to improve the waterproof and moisture-proof capability of the LED light source assembly 12; or, continue to refer to Figure 2 The second part 16 is attached to all sides of the encapsulation layer 13 to cover and protect all edges of the encapsulation layer 13. On the basis of the above, the waterproof and moisture-proof capability of the LED light source assembly 12 is further improved, and the edge anti-scratch capability of the encapsulation layer 13 is improved.

[0080] The side bonding method between the first part 15 and the printed circuit board 11, and the side bonding method between the second part 16 and the encapsulation layer 16 can be freely combined, including the following situations: In the first case, the first part 15 is bonded to a portion of the side surface of the printed circuit board 11, and the second part 16 is bonded to a portion of the side surface of the encapsulation layer 13 (e.g., Figure 1 (as shown), to prevent peeling or detachment between the encapsulation layer 13 and the printed circuit board 11, and to improve the adhesion between the encapsulation layer 13 and the printed circuit board 11; The second type is that the first part 15 is bonded to a portion of the side of the printed circuit board 11, and the second part 16 is bonded to all the sides of the encapsulation layer 13. This not only improves the bonding between the encapsulation layer 13 and the printed circuit board 11, but also, if the edge of the encapsulation layer 13 is thin, further enhances the anti-scratch capability of the edge of the encapsulation layer 13, and makes the LED light source assembly 12 waterproof and moisture-proof. The third type is that the first part 15 is bonded to all sides of the printed circuit board 11, and the second part 16 is bonded to part of the side of the encapsulation layer 13. This not only improves the bonding between the encapsulation layer 13 and the printed circuit board 11, but also, if the edge of the printed circuit board 11 is thin, can further improve the anti-scratch ability of the edge of the printed circuit board 11. Fourthly, the first part 15 is bonded to all sides of the printed circuit board 11, and the second part 16 is bonded to all sides of the encapsulation layer 13 (e.g., Figure 2 As shown, this not only improves the adhesion between the encapsulation layer 13 and the printed circuit board 11, but also further enhances the edge scratch resistance of the printed circuit board 11 and the encapsulation layer 13, and makes the LED light source assembly 12 waterproof and moisture-proof.

[0081] Optionally, when the first part 15 is partially attached to the side of the printed circuit board 11, the length of the first part 15 may be the same as or different from the length of the printed circuit board 11; the width of the first part 15 may be the same as or different from the width of the printed circuit board 11; and the height of the first part 15 may be the same as or different from the height of the printed circuit board 11.

[0082] Optionally, when the second part 16 is attached to a portion of the side of the encapsulation layer 13, the length of the second part 16 may be the same as or different from the length of the encapsulation layer 13; the width of the second part 16 may be the same as or different from the width of the encapsulation layer 13; the width of the second part 16 may be the same as or different from the width of the encapsulation layer 13.

[0083] In some embodiments, the first portion 15 and the second portion 16 are located on the same side of the LED display panel; or, the first portion 15 and the second portion 16 are located on different sides of the LED display panel.

[0084] Optionally, continue to refer to Figure 1 and Figure 2 The first part 15 and the second part 16 are located on the same side of the LED display panel, which is used to protect one side of the LED display panel and strengthen the adhesion between the printed circuit board 11 and the encapsulation layer 13; or, the first part 15 and the second part 16 are located on different sides of the LED display panel, which is used to protect the edge of the printed circuit board 11 and the edge of the encapsulation layer 13, and the edge of the printed circuit board 11 and the edge of the encapsulation layer 13 are on different sides. If there is a protection requirement for the edge of the printed circuit board 11 and the encapsulation layer 13 on different sides, the above-mentioned method of setting the protective layer 14 is to improve the scratch resistance of the edge of the printed circuit board 11 and the edge of the encapsulation layer 13.

[0085] In some embodiments, the LED display panel includes a first side and a second side; at least a portion of the protective layer 14 is disposed on the first side to cover the edge of the first side; and / or at least a portion of the protective layer 14 is disposed on the second side to cover the edge of the second side.

[0086] Continue to refer to Figure 1 and Figure 2 The LED display panel includes a first side and a second side. The protective layer 14 may be disposed only on the first side to cover and protect the edge of the first side, such as... Figure 1 and Figure 2As shown, the protective layer 14 is disposed on the right side of the LED display panel to cover and protect the edge of the right side; or, the protective layer 14 may be disposed only on the second side to cover and protect the edge of the second side; or, the protective layer 14 may be disposed on both the first and second sides to cover and protect the edges of the first and second sides. Therefore, considering the protective layer 14 as a whole, if one edge of the LED display panel is exposed and the other edge is attached to other hardware, the protective layer 14 only needs to be disposed on the exposed edge to improve the scratch resistance of that edge; if both edges of the LED display panel are exposed and not attached to other hardware, the protective layer 14 needs to be disposed on both exposed edges to improve the scratch resistance of both edges.

[0087] In some embodiments, the printed circuit board 11 and the encapsulation layer 13 form a first bonding position at the edge of the LED display panel; the protective layer 14 is bonded to the first bonding position, and the cross-sectional area of ​​the protective layer 14 is larger than the cross-sectional area of ​​the first bonding position to cover the first bonding position.

[0088] This is illustrative; please continue to refer to it. Figure 1 and Figure 2 When the encapsulation layer 13 and the printed circuit board 11 are bonded together, if the edge of the encapsulation layer 13 is aligned with the edge of the printed circuit board 11, a first bonding position is formed. Therefore, when the protective layer 14 is disposed on the side of the LED display panel, the protective layer 14 should cover the first bonding position to strengthen the bonding between the edge of the encapsulation layer 13 and the printed circuit board 11.

[0089] In some embodiments, the cross-section of the encapsulation layer 13 is smaller than the cross-section of the printed circuit board 11 to form a first region 18, which refers to the area of ​​the printed circuit board 11 not covered by the encapsulation layer 13, and the first region 18 is close to the edge of the printed circuit board 11; the protective layer 14 also includes a third portion 17, which is attached to the first region 18 to cover the surface of the first region 18.

[0090] This is illustrative; please refer to it. Figure 3 If the edge of the encapsulation layer 13 is not aligned with the edge of the printed circuit board 11, that is, the cross-sectional area of ​​the encapsulation layer 13 is smaller than the cross-sectional area of ​​the printed circuit board 11 to form the first region 18, the protective layer 14 includes a third part 17, which is attached to the surface of the first region 18 to cover and protect the surface of the first region 18.

[0091] Indicatively, the third part 17 fits into the second part 16, or the third part 17 is a part of the second part 16.

[0092] In some embodiments, the material of the protective layer 14 includes at least one of epoxy resin, phenolic resin, unsaturated polyester resin, or polyimide resin.

[0093] Indicatively, the material of the protective layer 14 includes, but is not limited to, epoxy resin, phenolic resin, unsaturated polyester resin, or polyimide resin.

[0094] In some embodiments, the protective layer 14 is disposed on the side of the LED display panel by at least one of spraying, transfer, printing, printing, dip coating or deposition.

[0095] Schematic, the protective layer 14 is applied to the side of the LED display panel by spraying; or, the protective layer 14 is applied to the side of the LED display panel by transfer printing technology; or, the protective layer 14 is applied to the side of the LED display panel by printing technology; or, the protective layer 14 is applied to the side of the LED display panel by dip coating technology; or, the protective layer 14 is applied to the side of the LED display panel by deposition technology. These technologies are used to form a uniform and dense protective coating on the side area of ​​the display panel to achieve functions such as moisture resistance, dust resistance, antistatic properties, impact resistance, or enhanced structural stability.

[0096] Spray coating technology refers to atomizing liquid protective materials (such as epoxy resin and silicone) with high-pressure airflow and uniformly spraying them onto the sides of the LED display panel to form a thin layer of coverage. Transfer printing technology uses an elastic template (such as a silicone pad) to transfer protective materials from the donor to the sides of the LED display panel, achieving a precisely patterned coating. Printing technology uses a screen to extrude protective materials (such as UV-curable adhesive) onto the sides, forming a coating of a specific thickness. Printing technology uses a high-precision printhead to directly deposit nanoscale protective materials onto the sides. Dip coating technology involves vertically immersing the LED display panel in a protective material solution and controlling the pull-out speed to form a uniform coating. Deposition technologies include chemical vapor deposition (CVD) and physical vapor deposition (PVD). CVD involves decomposing gaseous precursors at high temperatures to deposit a solid protective film (such as silicon nitride) onto the sides of the LED display panel. PVD involves depositing metal or ceramic materials onto the sides of the LED display panel through sputtering or evaporation to form a high-hardness coating.

[0097] In some embodiments, the thickness of the protective layer 14 is set to 2 μm-100 μm.

[0098] Optionally, the thickness of the protective layer 14 is set to be between 2μm and 100μm, including 5μm, 7μm, 20μm, 50μm, etc., and this application embodiment does not limit it.

[0099] The thickness of the protective layer 14 varies depending on the manufacturing process. For example, if the protective layer 14 is obtained by spraying nano-scale materials, its thickness is relatively thin (e.g., between 2μm and tens of μm). If the protective layer 14 is obtained by spraying adhesive (e.g., silicone), its thickness is relatively thick (e.g., between 30μm and 100μm). Therefore, the thickness of the protective layer 14 varies depending on the manufacturing process, which can meet the side edge protection requirements in various scenarios.

[0100] Optionally, the encapsulation material corresponding to the encapsulation layer 13 may include epoxy resin, thermally conductive silicone, optical grade silicone, etc., and this application embodiment does not limit this.

[0101] Indicatively, the printed circuit board 11 includes a metal layer and a non-metal layer, with the metal layer disposed on one side of the non-metal layer, and the LED light source assembly 12 soldered on the side of the metal layer from the non-metal layer.

[0102] Indicatively, package 13 can protect the LED light source assembly 12 and the metal layer.

[0103] This embodiment provides an LED display screen using an LED light source assembly 12 as the light source. During operation, the LED light source assembly 12 generates heat. Since the LED light source assembly 12 is directly soldered to one side of the metal layer, the heat can be directly transferred to the metal layer in contact with the LED light source assembly 12. The metal layer's excellent thermal conductivity rapidly absorbs the heat generated by the LED light source assembly 12, achieving rapid heat dissipation and reducing the risk of overheating. Simultaneously, a non-metallic layer is located on the side of the metal layer away from the LED light source assembly 12. This non-metallic layer possesses high thermal stability and good insulation, ensuring both effective heat conduction and electrical safety of the LED display screen, thus improving its performance and reliability.

[0104] In some embodiments, the metal layer may be a copper (Cu) layer or the non-metal layer may be a ceramic layer or the like.

[0105] In practical applications, when the metal layer is a copper layer, the material of the copper layer can be electrolytic copper.

[0106] Based on this, in the LED display panel of this application embodiment, after the LED light source component is directly connected to the metal layer, gaps (usually referring to the gap between the LED light source component and the metal layer or tiny voids at the connection interface) may appear at the location where no solder is provided between the LED light source component and the metal layer. Since the gaps may expose the internal structure (e.g., pins, solder joints, etc.), encapsulation material is filled into the gaps. This encapsulation material can isolate external moisture, dust, corrosive substances, etc., reducing the risk of short circuits between pins or metal oxidation. At the same time, it can fix the pins, reducing the risk of pin displacement or solder joint cracking caused by vibration and thermal expansion and contraction. Furthermore, it can buffer the stress caused by the difference in thermal expansion coefficients between the LED light source component and the metal layer, reducing problems such as interface fatigue failure (e.g., solder joint detachment), and improving the long-term reliability of the LED display screen.

[0107] It should be noted that the LED light source components can be connected to the circuitry of the metal layer via wire bonding or other connection methods, depending on the actual application.

[0108] This is illustrative; please refer to it. Figure 6 This illustrates a schematic diagram of the top surface structure of an LED display panel provided in an exemplary embodiment of this application, as shown below. Figure 6 As shown, the LED display panel includes a printed circuit board 11, on which multiple arrayed LED light source components 12 are soldered. In addition, an encapsulation layer 13 is provided on the surface of the printed circuit board 11, and a protective layer 14 is provided on the side of the LED display panel to protect the edges of the printed circuit board 11 and the edges of the encapsulation layer 13.

[0109] This embodiment provides an LED display panel. By providing an encapsulation layer on the side of the LED display panel to cover the edges of the printed circuit board and the encapsulation layer, it can prevent the edges of the LED display panel from being scratched, thereby preventing the encapsulation layer from falling off or peeling off. On the other hand, it can provide optical isolation for the LED light source components, prevent light leakage from the sides of the LED display panel, and improve the display effect of the LED display screen. Furthermore, the encapsulation layer on the side can cover the joint between the printed circuit board and the encapsulation layer, which can be waterproof and moisture-proof, protecting the LED light source components.

[0110] This is illustrative; please refer to it. Figure 6 The present application illustrates a method for manufacturing an LED display panel according to an exemplary embodiment of the present application. The method is applied to the LED display panel and includes the following steps.

[0111] S1 provides a printed circuit board and multiple LED light source components.

[0112] To illustrate, first prepare a printed circuit board and multiple LED light source components.

[0113] The structure of the printed circuit board and multiple LED light source components can be referred to in the above embodiments, and will not be repeated here.

[0114] S2, Multiple LE light source components are soldered onto the surface of a printed circuit board in an array arrangement to obtain the assembled circuit board.

[0115] Multiple LED light source components are soldered onto the surface of a printed circuit board in an array to form a printed circuit board assembly (PCBA).

[0116] S3, the assembled circuit board is encapsulated through an encapsulation layer to obtain the encapsulated LED display panel.

[0117] The PCBA is then encapsulated using an encapsulation layer to obtain the encapsulated LED display panel.

[0118] The encapsulation layer structure can be referred to in the above embodiments, and will not be repeated here.

[0119] S4. Apply a side coating to the LED display panel to form a protective layer on the side of the LED display panel to cover the edges of the LED display panel.

[0120] The protective layer structure can be referred to in the above embodiments, and will not be repeated here.

[0121] This embodiment provides a method for manufacturing an LED display panel. By setting an encapsulation layer on the side of the LED display panel to cover the edge of the printed circuit board and the edge of the encapsulation layer, on the one hand, it can prevent the edge of the LED display panel from being scratched, thereby preventing the encapsulation layer from falling off or peeling off; on the other hand, it can provide optical isolation for the LED light source components, prevent light leakage from the side of the LED display panel, and improve the display effect of the LED display screen.

[0122] This section only introduces the content related to the invention point; the rest can be obtained by referring to relevant technologies, and will not be elaborated here.

Claims

1. An LED display panel, characterized in that, include: Printed circuit board (11); Multiple LED light source components (12) are arranged in an array, and the LED light source components (12) are soldered to the surface of the printed circuit board (11); The encapsulation layer (13) covers the surface of the printed circuit board (11) but does not cover the LED light source assembly (12). The protective layer (14) is at least partially disposed on the side of the LED display panel to cover the edge of the printed circuit board (11) and the edge of the encapsulation layer (13).

2. The LED display panel according to claim 1, characterized in that, The protective layer (14) includes a first part (15) and a second part (16); The first part (15) is attached to the side of the printed circuit board (11) to cover the edge of the printed circuit board (11); The second part (16) is attached to the side of the encapsulation layer (13) to cover the edge of the encapsulation layer (13).

3. The LED display panel according to claim 2, characterized in that, The first portion (15) is attached to all sides of the printed circuit board (11) to cover all edges of the printed circuit board (11); or, The first portion (15) is attached to a portion of the side surface of the printed circuit board (11) to cover a portion of the edge of the printed circuit board (11).

4. The LED display panel according to claim 2, characterized in that, The second portion (16) adheres to all sides of the encapsulation layer (13) to cover all edges of the encapsulation layer (13); or, The second part (16) is attached to a portion of the side of the encapsulation layer (13) to cover a portion of the edge of the encapsulation layer (13).

5. The LED display panel according to claim 2, characterized in that, The first portion (15) and the second portion (16) are located on the same side of the LED display panel; or, The first part (15) and the second part (16) are located on different sides of the LED display panel.

6. The LED display panel according to any one of claims 1 to 5, characterized in that, The printed circuit board (11) and the encapsulation layer (13) form a first bonding position at the edge of the LED display panel; The protective layer (14) is attached to the first bonding position, and the cross-sectional area of ​​the protective layer (14) is larger than the cross-sectional area of ​​the first bonding position, so as to cover the first bonding position.

7. The LED display panel according to any one of claims 1 to 5, characterized in that, The LED display panel includes a first side and a second side; At least a portion of the protective layer (14) is disposed on the first side to cover the edge of the first side; and / or, At least a portion of the protective layer (14) is disposed on the second side to cover the edge of the second side.

8. The LED display panel according to any one of claims 1 to 5, characterized in that, The cross-section of the encapsulation layer (13) is smaller than the cross-section of the printed circuit board (11) to generate a first region (18), which is the area of ​​the printed circuit board (11) not covered by the encapsulation layer (13) and is close to the edge of the printed circuit board (11). The protective layer (14) further includes a third portion (17) that is fitted to the first region (18) to cover the surface of the first region (18).

9. The LED display panel according to any one of claims 1 to 5, characterized in that, The protective layer (14) is applied to the side of the LED display panel by at least one of spraying, transfer, printing, printing, dipping or deposition.

10. A method for packaging an LED display panel, characterized in that, The method is applied to the LED display panel according to any one of claims 1 to 9, and the method includes: Provides printed circuit boards and multiple LED light source assemblies; The multiple LED light source components are soldered in an array on the surface of the printed circuit board to obtain the assembled circuit board. The assembled circuit board is encapsulated by an encapsulation layer to obtain an encapsulated LED display panel; The packaged LED display panel is subjected to a side coating process to form a protective layer on the side of the packaged LED display panel to cover the edge of the LED display panel.

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