Composite heat-conducting silicone grease with multi-stage diamond filler and preparation method thereof

By constructing a composite thermal grease with multi-level diamond fillers, and utilizing a three-level thermal conductivity structure of diamond microspheres, nano-thermal bridges, and thermally conductive whiskers, the problem of insufficient thermal conductivity in existing thermal greases is solved, achieving a combination of high thermal conductivity and good fluidity.

CN121293949BActive Publication Date: 2026-06-26ZHONGJING FENGHUO (BEIJING) TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
ZHONGJING FENGHUO (BEIJING) TECHNOLOGY CO LTD
Filing Date
2025-10-24
Publication Date
2026-06-26

AI Technical Summary

Technical Problem

Existing thermal greases have thermal conductivity that is difficult to exceed 5 W/(m·K), which cannot meet the heat dissipation requirements of modern high-power chips. Adding diamond powder using traditional methods has little effect.

Method used

The composite thermal grease using multi-level diamond fillers, including diamond microspheres, nano-thermal bridges and thermal whiskers, constructs a three-level thermal conductivity structure, forming a complex network of spheres, sheets and needles, which enhances mechanical strength and anti-settling properties, and improves the continuity of heat flow channels.

Benefits of technology

It significantly improves thermal conductivity, achieving a thermal conductivity of 35.2~38.0 W/(m·K), while maintaining good thixotropy and fluidity. It is easy to apply and does not settle, solving the fluidity and mechanical strength problems of traditional silicone greases with high filler content.

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Abstract

The present application relates to the technical field of heat conduction, in particular to a multi-stage diamond filler composite heat-conducting silicone grease and a preparation method thereof. The present application provides a multi-stage diamond filler composite heat-conducting silicone grease, which comprises a silicone matrix and fillers distributed in the silicone matrix, wherein the fillers comprise diamond microspheres, nano heat-conducting bridges and heat-conducting whiskers; the nano heat-conducting bridges form heat-conducting bridges between the diamond microspheres, and the heat-conducting whiskers are filled in the gaps between the diamond microspheres and the nano heat-conducting bridges. The present application provides a multi-stage diamond filler composite heat-conducting silicone grease and a preparation method thereof, and can provide a composite heat-conducting silicone grease with excellent heat conduction performance.
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