Miniature sensor for engine ignition monitoring based on thermopile infrared sensor

Abstract

This invention relates to a miniature sensor for engine ignition monitoring based on a thermopile infrared sensor. It includes: a housing, a thermopile infrared detector, and a power module, a main control unit, and a communication unit disposed within the housing. The main control unit is an FPGA chip containing an ARM processor and a SOC core. The power module is connected to the thermopile infrared detector, the main control unit, and the communication unit, respectively, to provide voltages for the corresponding parameters of each device. The communication unit is connected to the main control unit to send monitoring commands and the target area for engine ignition monitoring. The infrared detector is connected to the main control unit, and the main control unit controls the infrared detector to monitor the ignition plume within the target area based on the monitoring commands to obtain raw measurement data. The main control unit is also used to calculate the raw measurement data and determine the engine ignition state based on the calculation results. The miniature sensor designed in this application is lightweight, small in size, and can quickly monitor the engine ignition state.

Description

Technical Field

[0001] This invention relates to the field of aerospace technology, and in particular to a miniature sensor for monitoring engine ignition based on a thermopile infrared sensor. Background Technology

[0002] Reliable ignition of spacecraft engines is critical to the success of missions such as launch into orbit, on-orbit maneuvers, attitude control, and deep space exploration. Ignition failure or anomalies (such as delayed ignition, soft ignition, overpressure, or misfire) can lead to catastrophic consequences. Therefore, real-time and precise monitoring of the engine ignition process is essential.

[0003] Currently, high-resolution infrared sensors, such as focal plane array sensors, are commonly used to monitor engine ignition status. However, these sensors require a TEC cooling structure, and the encapsulated cavity occupies a significant amount of space. The power consumption of these products is also relatively high, resulting in higher costs. Therefore, they are difficult to apply to spacecraft with space constraints and the need for lightweight design in space missions. Furthermore, existing sensors have poor real-time performance during ignition monitoring, requiring a considerable amount of time to determine whether engine ignition has been successful. Therefore, existing sensors cannot meet the spacecraft's requirements for sensor miniaturization and rapid response in engine ignition monitoring.

[0004] Therefore, there is an urgent need for a miniature sensor for engine ignition monitoring based on a thermopile infrared sensor to solve the above problems. Summary of the Invention

[0005] This invention provides a miniature sensor for engine ignition monitoring based on a thermopile infrared sensor. It is lightweight, small in size, and can quickly monitor the engine's ignition status.

[0006] This invention provides a miniature sensor for engine ignition monitoring based on a thermopile infrared sensor, comprising:

[0007] The enclosure, the thermopile infrared detector, and the power module, main control unit and communication unit disposed within the enclosure; the main control unit is an FPGA chip containing an ARM processor and having a SOC core;

[0008] The power module is connected to the thermopile infrared detector, the main control unit, and the communication unit respectively, and is used to provide voltages for corresponding parameters to each device;

[0009] The communication unit is connected to the main control unit to send monitoring commands and the target area for engine ignition monitoring to the main control unit through the communication unit;

[0010] The infrared detector is communicatively connected to the main control unit. The main control unit controls the infrared detector to monitor the ignition plume in the target area based on the monitoring command to obtain raw measurement data. The main control unit is also used to calculate the raw measurement data and determine the ignition state of the engine based on the calculation results.

[0011] This invention provides an engine ignition monitoring system based on a thermopile infrared sensor. By employing a thermopile infrared sensor, a bias circuit is unnecessary, resulting in a small footprint and strong anti-interference capabilities. Furthermore, the thermopile infrared detector, power module, main control unit, and communication unit are all integrated within a single housing, achieving an integrated and lightweight design. Additionally, by using an FPGA chip with an ARM processor and a SOC core, and utilizing this FPGA chip for functions such as temperature measurement control, temperature data processing, and algorithm acceleration, high-speed environmental data acquisition and calculation can be achieved, making it suitable for thermopile sensor array data processing scenarios. Therefore, the miniature sensor designed in this application is lightweight, compact, and can quickly monitor the engine ignition status, making it suitable for temperature monitoring in high-temperature environments such as aerospace engines and gas turbines. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 This is a schematic diagram of the structure of a miniature sensor for engine ignition monitoring based on a thermopile infrared sensor provided in an embodiment of the present invention;

[0014] Figure 2 This is a schematic diagram of the internal circuit principle of a miniature sensor provided in an embodiment of the present invention. Detailed Implementation

[0015] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0016] Please refer to Figure 1This invention provides a miniature sensor for engine ignition monitoring based on a thermopile infrared sensor, comprising:

[0017] The enclosure, the thermopile infrared detector, and the power module, main control unit and communication unit housed within the enclosure; the main control unit is an FPGA chip containing an ARM processor and having a SOC core;

[0018] The power supply module is connected to the thermopile infrared detector, the main control unit, and the communication unit respectively, and is used to provide the corresponding voltage for each device.

[0019] The communication unit is connected to the main control unit to send monitoring commands and engine ignition monitoring target areas to the main control unit through the communication unit;

[0020] The infrared detector and the main control unit are connected in communication. The main control unit controls the infrared detector to monitor the ignition plume in the target area based on the monitoring command to obtain the raw measurement data. The main control unit is also used to calculate the raw measurement data and determine the ignition status of the engine based on the calculation results.

[0021] The miniature sensor provided in this embodiment, by employing a thermopile infrared sensor, eliminates the need for a bias circuit, occupies a small space, and possesses strong anti-interference capabilities. Furthermore, the thermopile infrared detector, power module, main control unit, and communication unit are all integrated within the housing, achieving an integrated and lightweight design. Additionally, by employing an FPGA chip containing an ARM processor and a SOC core, and using this FPGA chip for functions such as controlling the temperature measurement process, processing temperature data, and accelerating algorithms, high-speed environmental data acquisition and calculation can be achieved, making it suitable for thermopile sensor array data processing scenarios. Therefore, the miniature sensor designed in this application is lightweight, small in size, and can quickly monitor the ignition status of engines, making it suitable for temperature monitoring in high-temperature environments such as aerospace engines and gas turbines.

[0022] It should be noted that, in Figure 1 Since the power module, main control unit, and communication unit are all housed within the casing, these components are not shown in the figure. The installation and connection of each component are only required to meet applicable requirements and integrated design; this application does not impose specific limitations. Furthermore, the casing material of this application is a lightweight metal material, characterized by its light weight, heat resistance, and reduced thermal radiation interference. Additionally, the power module's power interface is connected to the casing, providing power to the external main power input and supplying electrical energy to the various components of the sensor.

[0023] In some embodiments, the miniature sensor may also include a power monitoring unit and a micro-communication interface disposed within the housing. Of course, users may also configure other components as needed, and this application does not impose specific limitations.

[0024] like Figure 1 As shown, in actual installation, the infrared detector can be positioned above the housing without occupying circuit board space. Furthermore, the housing structure can be installed in confined spaces or structures. In addition, the infrared detector is a thermopile infrared sensor used to collect infrared radiation signals from the target area and convert them into electrical signals, which are then converted into temperature signals. Furthermore, the infrared detector features small size, low power consumption, high performance, an integrated ADC, and adjustable frame rate and calibration data.

[0025] It should be noted that the temperature measurement unit in the infrared sensor uses a new type of high-temperature resistant material, monocrystalline diamond glass, for heat insulation and protection of the detector lens, thereby improving the upper limit of temperature measurement. This enables rapid real-time measurement of the engine and features a lightweight, compact, low-power design, fast response speed, and strong radiation resistance.

[0026] In some implementations, the infrared detector integrates an infrared lens and a filter;

[0027] Infrared lenses are used to focus the infrared radiation from the engine ignition plume onto the sensor pixel surface;

[0028] The filter is used to selectively transmit the target wavelength band, limit the infrared band being tested, and improve temperature measurement accuracy. This application preferably uses the mid-wave infrared band, which is more suitable for plume testing scenarios. Furthermore, the infrared detector employs a flying wire soldering method, which effectively saves layout and wiring space, enabling a miniaturized layout design.

[0029] In some implementations, the FPGA and processor system are integrated on the same chip for functions such as controlling the temperature measurement process, processing temperature data, and accelerating algorithms. This is suitable for high-speed environmental data acquisition and for data processing scenarios involving thermopile sensor arrays. Furthermore, the main control unit employs a low-power design, eliminating the need for an external configurator and exhibiting low static power consumption. Additionally, the main control unit integrates LVDS conversion functionality, eliminating the need for an external LVDS module and making it suitable for miniaturized and lightweight product designs.

[0030] In some implementations, the infrared detector integrates a compensation calibration function to perform multi-point blackbody calibration of the infrared detector; the blackbody calibration range includes the temperature range of the plume being measured.

[0031] In this embodiment, the blackbody calibration range is set to... The temperature range of the plume is Then the condition is met. , The infrared detector calibration curve is as follows: ,in, To correct the data, The data represents the actual measured data of the detector, where a and b are constant terms.

[0032] In some implementations, such as Figure 2 As shown, the power supply module includes analog power chips and digital power chips. The analog power chip powers the infrared detector. Since the infrared detector has high requirements for voltage source noise, an LDO regulator chip is connected after the voltage converter to reduce low-frequency power supply noise. The digital power chip powers the FPGA, reset chip, and crystal oscillator chip to reduce low-frequency power supply noise. Additionally, the infrared detector communicates with the FPGA via SPI. The FPGA mainly controls the infrared detector, performs image reception, acquisition, and processing, algorithm sorting, and threshold judgment, and also has a threshold injection function. This application uses an FPGA chip with a SOC core, which can accelerate the algorithm. Furthermore, the reset chip is designed as a power monitoring circuit to ensure stable system operation during ignition testing. The crystal oscillator chip provides the system clock for the FPGA. The interface design includes power supply function, LVDS ground detection test, communication interface, and JTAG program writing and injection function. This circuit design uses low-power chips and heat dissipation measures, resulting in a total power consumption of less than 1W.

[0033] It should also be noted that the sensor circuit design, structural design, and infrared detector selection in this application all meet the requirements of lightweight materials, highly integrated chip structure, reduced heat dissipation component size, and integrated functional interface. In the circuit design, for aerospace scenarios, the selected components possess special properties such as high reliability, long lifespan, radiation resistance, and high-temperature resistance. For other harsh environmental scenarios, the selected components meet functions such as stability, safety, and corrosion resistance. The lens material is anti-contamination, high-temperature resistant, and corrosion resistant. This application does not impose specific limitations on the selection and parameters of each component, as long as the detection requirements are met.

[0034] In summary, by selecting the above-mentioned devices and adopting an integrated design, this application can make the size of the miniature sensor no larger than 31×36mm and the weight of the whole device less than 150g.

[0035] In addition, the inventors proposed a new ignition confirmation method that can quickly determine whether the engine has ignited successfully, ensuring the stability of spacecraft operation.

[0036] In some implementations, the communication unit is also used to send equivalent temperature parameter thresholds and pixel thresholds to the main control unit.

[0037] The main control unit calculates the raw measurement data in the following manner and determines the engine's ignition state based on the calculation results:

[0038] A1. Calculate the average equivalent environmental temperature parameter based on the equivalent environmental temperature parameter obtained from each detection subunit in the infrared detector.

[0039] A2, for K frames of images in the unignited state collected by the infrared detector in a cyclic manner, the equivalent temperature parameter pixel compensation value of each pixel in each frame of the image is calculated based on the average equivalent parameter of the ambient temperature.

[0040] A3, calculate the initial temperature parameter for engine ignition based on the maximum equivalent temperature parameter pixel compensation value in each frame of the image;

[0041] A4, for images under ignition state collected by the infrared detector in a loop, execute the following sequentially: calculate the equivalent temperature parameter pixel compensation value of each pixel in the target area of ​​the current frame image, and calculate the difference between each equivalent temperature parameter pixel compensation value and the initial temperature parameter; calculate the number of target pixels whose difference is greater than the equivalent temperature parameter threshold; determine whether the number of target pixels is greater than the pixel threshold; if yes, determine that ignition is successful and stop calculating the next frame image; if no, determine that ignition is unsuccessful and calculate the next frame image; repeat this process until ignition is determined to be successful.

[0042] In this embodiment, after the sensor is powered on, it first completes an initialization operation, setting the target area (i.e., the test image area), the equivalent temperature parameter threshold, and the pixel threshold via the serial port of the communication unit. Additionally, during initialization, the ADC bias circuit, circuit clock, and amplifier common-mode voltage also need to be configured. Furthermore, the equivalent temperature parameter threshold and pixel threshold can be modified, allowing users to adjust them as needed, improving flexibility and applicability.

[0043] It should be noted that the infrared detector has multiple detection sub-units, denoted as M, but the target area only involves a portion of these sub-units. The number of detection sub-units used is set to 1 to N (N ≤ M). Furthermore, the smaller the value of N, the higher the frame rate, with a maximum frame rate reaching [value missing]. .in, This represents the maximum frame rate for all pixels, i.e., when N=M. Specifically, the value of N can be modified.

[0044] The specific implementation methods of steps A1 to A4 are detailed below.

[0045] In step A1, the average equivalent parameter of ambient temperature is calculated using the following formula:

[0046]

[0047] In the formula, is the average equivalent parameter of ambient temperature; M is the total number of detector sub-units in the infrared detector. For the first i Equivalent environmental temperature parameters of each detection subunit i =0~M-1.

[0048] For steps A2-A4, the sensor is powered on before engine ignition, such as 10 seconds before ignition. After power-on, the infrared detector cyclically acquires plume images at a set frequency, including images in the unignited state (such as images within the first second after power-on) and images after ignition (images starting from the 10th second after power-on). The images acquired before ignition can be used to calculate the initial temperature parameters of engine ignition, as detailed in steps A2 and A3; the images acquired after ignition are processed sequentially to determine whether ignition was successful.

[0049] The implementation process of steps A2 to A4 is described in detail below:

[0050] In step A2, the equivalent temperature parameter pixel compensation value for each pixel in any image is calculated using the following formula:

[0051] B1, based on the average equivalent parameter of ambient temperature, the original voltage value, thermal gradient, thermal bias, and scaling factor of each pixel in the image measured by the infrared detector, calculate the thermal compensation value of each pixel;

[0052] B2, based on the thermal compensation value of each pixel and the pixel offset of each pixel in the infrared detector, calculate the electronic compensation value of each pixel respectively;

[0053] B3. Based on the electronic compensation value of each pixel, the VDD power compensation gradient of each pixel in the infrared sensor, the VDD power compensation bias, the standard voltage and ambient temperature equivalent parameter calibration values ​​at different times, the power scaling gradient coefficient and the power scaling coefficient bias value, calculate the VDD power compensation value of each pixel.

[0054] B4. Based on the sensitivity coefficient, minimum sensitivity coefficient, and maximum sensitivity coefficient of each pixel stored in the infrared detector, calculate the sensitivity coefficient correction value for each pixel.

[0055] B5, based on the VDD power compensation value and sensitivity coefficient correction value of each pixel, calculates the equivalent temperature measurement parameter pixel compensation value for each pixel.

[0056] In this step, K is not less than 2. Users can determine the number of images acquired in the unignited state as needed, and this application does not impose specific limitations.

[0057] In step B1, the thermal compensation value for each pixel is calculated using the following formula:

[0058]

[0059] In the formula, for( i,j Thermal compensation value of the pixel at location ) , , , gradscale In the images measured by the infrared detectors ( i,j The original voltage value, thermal gradient, thermal bias, and scaling factor of the pixel at point ( ); i,j ) represents the first in the image i line, number j The pixels in the column.

[0060] In step B2, when a pixel is located in the upper half of the infrared detector's sub-unit, the electronic compensation value for each pixel is calculated using the following formula:

[0061]

[0062] When a pixel is located in the lower half of the infrared detector's sub-unit, the electronic compensation value for each pixel is calculated using the following formula:

[0063]

[0064] In the formula, for( i,j The electronic compensation value of the pixel at position ) elOffset For infrared detectors ( i,j The pixel offset at position (). The size of the focal plane array of the infrared detector; express Compared to y The remainder.

[0065] In step B3, the VDD power compensation value for each pixel is calculated using the following formula;

[0066]

[0067]

[0068] In the formula, for( i,j VDD power compensation value for the pixel at position ) and In the infrared detectors ( i,j VDD power compensation gradient and VDD power compensation bias at pixel ( ). , , , These are the standard voltage and ambient temperature equivalent parameter calibration values ​​at time 1 and time 2, respectively; VDDScGrad For power scaling gradient coefficients; VDDScOff This is the power scaling factor offset value; For the first i The original detection subunits obtained the original VDD data; The average value of each detection subunit VDD data.

[0069] In step B4, the sensitivity coefficient correction value for each pixel is calculated using the following formula:

[0070]

[0071] In the formula, for( i,j The sensitivity coefficient correction value of the pixel at position ) For the built-in storage of infrared detectors ( i,j Sensitivity coefficient of the pixel at position ( ); and These are the minimum sensitivity coefficient and the maximum sensitivity coefficient, respectively.

[0072] In step B5, the equivalent temperature measurement parameter pixel compensation value for each pixel is calculated using the following formula:

[0073]

[0074] In the formula, for( i,j The equivalent temperature measurement parameter pixel compensation value of the pixel at point ).

[0075] In step A3, the average value of the maximum equivalent temperature parameter pixel compensation value in each frame image is taken as the initial temperature parameter for engine ignition, as shown in the following formula:

[0076]

[0077] In the formula, The initial temperature parameter for engine ignition; For the first k The maximum equivalent thermometric parameter pixel compensation value in the frame image. k =1~ K .

[0078] In step A4, since only the target area can characterize the plume features, it is only necessary to calculate the equivalent thermometric parameter pixel compensation value of each pixel within the target area, thereby reducing the amount of computation and improving computational efficiency. The calculation method for the equivalent thermometric parameter pixel compensation value of each pixel in this step is the same as in steps B1-B5, and will not be repeated here.

[0079] After calculating the equivalent temperature measurement parameter pixel compensation value for each pixel, calculate its relationship with... The difference ,like If a pixel is selected as the target pixel, then that pixel is used as the target pixel; and so on, until the number of target pixels is obtained. q ;like If the value is greater than the specified value, ignition is considered successful; otherwise, ignition is considered unsuccessful. The process continues until the next frame is judged to be successful.

[0080] In the above calculation process, express( i,j The difference between the equivalent temperature parameter pixel compensation value of the pixel at point ) and the initial temperature parameter of engine ignition; Indicates the threshold value of the equivalent temperature parameter; This represents the pixel threshold.

[0081] It should be noted that in step A4, the maximum value of the equivalent temperature measurement parameter pixel compensation value in the target area can also be determined and the maximum value can be output to an external device.

[0082] By adopting the above-mentioned determination method, this application can achieve rapid determination of engine plume temperature measurement and engine ignition monitoring, with a test time of less than 32 milliseconds.

[0083] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0084] Those skilled in the art will understand that all or part of the steps of the above method embodiments can be implemented by hardware related to program instructions. The aforementioned program can be stored in a computer-readable storage medium. When the program is executed, it performs the steps of the above method embodiments. The aforementioned storage medium includes various media that can store program code, such as ROM, RAM, magnetic disk, or optical disk.

[0085] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A miniature sensor for monitoring engine ignition based on a thermopile infrared sensor, characterized in that, include: The enclosure, the thermopile infrared detector, and the power module, main control unit and communication unit disposed within the enclosure; the main control unit is an FPGA chip containing an ARM processor and having a SOC core; The power module is connected to the thermopile infrared detector, the main control unit, and the communication unit respectively, and is used to provide voltages for corresponding parameters to each device; The communication unit is connected to the main control unit to send monitoring commands and the target area for engine ignition monitoring to the main control unit through the communication unit; The infrared detector and the main control unit are communicatively connected. The main control unit controls the infrared detector to monitor the ignition plume in the target area based on the monitoring command to obtain raw measurement data. The main control unit is also used to calculate the raw measurement data and determine the ignition status of the engine based on the calculation results. The infrared detector integrates a compensation calibration function to perform multi-point blackbody calibration of the infrared detector; the blackbody calibration range includes the temperature range of the measured plume. The communication unit is also used to send equivalent temperature parameter thresholds and pixel thresholds to the main control unit; The main control unit calculates the raw measurement data in the following manner and determines the engine ignition state based on the calculation results: Based on the equivalent parameters of ambient temperature obtained by each detection subunit in the infrared detector, the average equivalent parameters of ambient temperature are calculated. For the K frames of images in the unfired state collected by the infrared detector in a cyclic manner, the equivalent temperature parameter pixel compensation value of each pixel in each frame image is calculated based on the average equivalent parameter of the ambient temperature. The initial temperature parameter of engine ignition is calculated based on the maximum equivalent temperature parameter pixel compensation value in each frame of the image. For the images under the ignition state collected by the infrared detector in a cyclic manner, the following steps are performed in sequence: calculate the equivalent temperature parameter pixel compensation value of each pixel in the target area in the current frame image, and calculate the difference between each equivalent temperature parameter pixel compensation value and the initial temperature parameter respectively; Calculate the number of target pixels whose difference is greater than the equivalent temperature parameter threshold; determine whether the number of target pixels is greater than the pixel threshold; If yes, ignition is considered successful, and the calculation of the next frame image is stopped; if no, ignition is considered unsuccessful, and the calculation of the next frame image is stopped; this process is repeated until ignition is considered successful.

2. The sensor according to claim 1, characterized in that, The infrared detector integrates an infrared lens and a filter. The infrared lens is used to focus the infrared radiation from the engine ignition plume onto the sensor pixel surface. The filter is used to selectively transmit the target wavelength band.

3. The sensor according to claim 1, characterized in that, The infrared detector is manufactured using a flying wire welding method.

4. The sensor according to claim 1, characterized in that, The main control unit integrates LVDS conversion functionality.

5. The sensor according to claim 1, characterized in that, It also includes reset chips and crystal oscillator chips; The reset chip is a power monitoring circuit used to ensure stable system operation during ignition testing; The crystal oscillator chip is used to provide the system clock for the FPGA.

6. The sensor according to claim 5, characterized in that, The power module includes an analog power chip and a digital power chip; the analog power chip is used to power the infrared detector; the digital power chip is used to power the FPGA, the reset chip, and the crystal oscillator chip.

7. The sensor according to claim 1, characterized in that, The equivalent thermometric parameter pixel compensation value for each pixel in the image is calculated as follows: Based on the average equivalent parameter of the ambient temperature, the original voltage value, thermal gradient, thermal bias, and scaling factor of each pixel in the image measured by the infrared detector, the thermal compensation value of each pixel is calculated. Based on the thermal compensation value of each pixel and the pixel offset of each pixel in the infrared detector, the electronic compensation value of each pixel is calculated respectively. The VDD power compensation value of each pixel is calculated based on the electronic compensation value of each pixel, the VDD power compensation gradient of each pixel in the infrared sensor, the VDD power compensation bias, the standard voltage and ambient temperature equivalent parameter calibration values ​​at different times, the power scaling gradient coefficient and the power scaling coefficient bias value. Based on the sensitivity coefficient, minimum sensitivity coefficient, and maximum sensitivity coefficient of each pixel stored in the infrared detector, the sensitivity coefficient correction value of each pixel is calculated. Based on the VDD power supply compensation value and sensitivity coefficient correction value of each pixel, the equivalent temperature measurement parameter pixel compensation value of each pixel is calculated.

8. The sensor according to claim 1, characterized in that, The average value of the maximum equivalent temperature parameter pixel compensation value in each frame of the image is used as the initial temperature parameter for engine ignition.

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