Power semiconductor module comprising embedded flexible electrical signal connectors and method of producing a power semiconductor module

Abstract

A power semiconductor module (100) is provided, comprising a first module part (1, 1A, 1B), a second module part (2, 2A, 2B), an internal electrical signal connector (12) and a sealing material (3). The internal electrical signal connector (12) is mechanically flexible and comprises at least one electrical isolation structure (4), a first signal conductor (12A) and a second signal conductor (12B), wherein each of the first signal conductor (12A) and the second signal conductor (12B) is electrically connected to at least one of the first module part (1, 1A, 1B) and the second module part (2, 2A, 2B), the first and second signal conductors (12A, 12B) are located on or within the electrical isolation structure (4), and the electrical isolation structure (4) forms a mechanically flexible carrier for the first and second signal conductors (12A, 12B). The internal electrical signal connector (12) is at least partially embedded within the sealing material (3). Due to its mechanical flexibility, the internal electrical signal connector (12) can be configured in three dimensions in the absence of the sealing material (3) and is located at a three-dimensionally pre-designed position in the power semiconductor module (100). Furthermore, a method for producing a power semiconductor module (100) is provided.

Description

Technical Field

[0001] This disclosure relates to a power semiconductor module including at least one embedded flexible electrical signal connector and a method for manufacturing the power semiconductor module. Background Technology

[0002] Power semiconductor modules require not only power connections between power terminals and power semiconductor devices, but also typically multiple signal connections for different purposes, such as controlling power semiconductor devices, sensing power circuits, and / or sensor readouts. These signal connections can be achieved through terminal structures, where interconnections between terminal structures can be provided using terminals made of stamped and bent metal sheets. Alternatively, printed circuit boards can be used to electrically connect the power module substrate to internal or external control electronics.

[0003] Implementing control circuits with multiple signal connections is labor-intensive and costly. If interconnections are achieved via terminals made of sheet metal, it is desirable that multiple terminals with different designs be manufactured through separate stamping and bending processes, resulting in high mold and manufacturing costs. While printed circuit boards (PCBs) may have lower material costs, they require complex manufacturing or assembly processes to connect to external auxiliary terminals and prepare, for example, vertical wire bonding connections between the PCB and the power module substrate to provide internal connectivity. Therefore, it is desirable to reduce the cost and workload of implementing signal connections, for example, within a power semiconductor module.

[0004] Document US 2021 / 296190 A1 describes a semiconductor device in which semiconductor elements and conductive interconnects mounted on a laminated substrate are sealed with a sealing material. The semiconductor device includes a primer layer located at the interface between the sealing material and the sealing members.

[0005] Document US 2011 / 217877 A1 describes a method for simultaneously achieving mechanical and electrical connections between two components that partially overlap each other and have conductive structures. For electrical insulation and / or mechanical and / or chemical protection purposes, at least one of these conductors is extensively covered with an electrically insulating material outside the overlap area and including the connection surface, and an adhesive is brought into a permanent bond state.

[0006] Document US 2009 / 200066 A1 describes a microelectronic chip comprising two parallel main surfaces and side surfaces. At least one of these surfaces includes a recess that houses at least one electrical connection element and forms a housing for a conductive element. The conductive element simultaneously constitutes an electrical connection between the chip and the outside via the connection element, and a flexible mechanical support for the chip.

[0007] Document US 5,508,556 A relates to a semiconductor die mounted on the surface of a power supply. Signal bonding pads on the die are wirebonded to corresponding leads in a lead frame. Power supply bonding pads on the die are wirebonded to the power supply surface. A package surrounds the semiconductor die, the wire bonds, and the power supply surface.

[0008] Document US 2009 / 120668 A1 relates to an assembly for conducting electronic signals. The assembly includes a substrate and an electronic cable. The substrate has different first and second regions for connection to a first circuit board and a second circuit board, respectively. A first through-hole and a second through-hole are formed in the first and second regions of the substrate, respectively. The electronic cable is disposed within the first through-hole and extends out of the first through-hole, adjacent to the substrate, and into the second through-hole. Summary of the Invention

[0009] As claimed in the independent claims, the embodiments of this disclosure address, in whole or in part, the disadvantages of the prior art described above. Further embodiments of the power semiconductor module and the method for manufacturing the power semiconductor module are the subject of the additional claims.

[0010] This invention is set forth by the appended set of claims. In the following description and drawings, portions relating to examples or embodiments not covered by the claims are presented not as embodiments of the invention, but as illustrative examples helpful in understanding the invention. Embodiments of this disclosure are provided by the appended set of claims.

[0011] According to the present invention, a power semiconductor module as described in claim 1 is disclosed.

[0012] Because the internal electrical signal connector is mechanically flexible, and despite this, can have a stable shape even without sealing material (e.g., before sealing material is applied to the signal connector), the internal electrical signal connector can be freely configured in three dimensions and therefore can occupy any pre-designed three-dimensional position within the power semiconductor module. For example, the signal connector is pre-fabricated. The signal connector is electrically connected to a first module portion and / or a second module portion. Once the signal connector is located in its pre-designed three-dimensional position within the power semiconductor module, it can be partially or completely embedded within the sealing material. The signal connector can have a stable shape, thus preventing undesirable changes in shape. However, when the signal connector is arranged inside the power semiconductor module, its shape can be manually adjusted.

[0013] Therefore, one or more flexible interconnects can be provided between different module portions of a power semiconductor module using one or more mechanical flexible connectors. The shape of one or more of the mechanical flexible connectors can be adjusted, for example, during the assembly process according to individual requirements. The mechanical flexible connectors or flexible interconnects can be at least partially or completely embedded in the sealing material of the power semiconductor module itself or embedded in building blocks (such as terminal blocks). Here, at least a portion or one or more of the flexible conductors of the signal connector can be directly embedded in the sealing material, or one or more flexible conductors can be arranged on or within a mechanical flexible electrical isolation structure, for example, in the form of a carrier, before the signal connector is embedded in the sealing material.

[0014] The term "internal electrical signal connector" describes a flexible control / measurement signal distribution element that can act as a mechanically flexible electrical conductor / trunk within a power semiconductor module and provide at least one electrical connection between at least one power device (e.g., a switch) in the power semiconductor module and terminals (e.g., in the form of pins) of the power semiconductor module. The signal connector can be used to establish electrical signal connections between one or more power devices in a power semiconductor module, or to establish external connections for signals originating from or destined for one or more power devices in a power semiconductor module. Internal electrical signal connectors are characterized by their mechanical flexibility or positional flexibility, such as in terms of bending and placement characteristics. For example, the placement can be configured in three dimensions to save space and achieve electromagnetic advantages. The signal connector is at least partially embedded within a sealing material, wherein the signal connector can be secured in space by additional fixing devices.

[0015] The power semiconductor module may also include at least two or more signal-carrying conductors adapted to a single internal electrical signal connector. The two or more signal-carrying conductors can be flexibly positioned relative to each other, wherein the distance, angle, and orientation between the two or more signal-carrying conductors can be adjusted according to design requirements, such as to reduce or adjust electromagnetic coupling, electromagnetic interaction, minimum length, or shielding. Here, length also refers to electromagnetic self-inductance. For example, the signal connector may include multiple wires tightly woven together, and at the same potential, the signal connector can provide planar electrical effects. One or more grounding conductors may also be present between the two signal-carrying conductors to reduce or break capacitive coupling between the two signal conductors and / or achieve additional shielding effects.

[0016] According to the present invention, the internal electrical signal connector includes an electrically isolated structure, wherein the signal conductor is located on or within the electrically isolated structure. For example, the electrically isolated structure forms a mechanically flexible carrier. Alternatively or additionally, in embodiments not construed as part of the invention, the internal electrical signal connection may be formed of a conductive mesh structure or a conductive fabric of several Litz wires or strands. The signal connector may include one or more cables, coaxial or stranded wires / cables, Litz wires (one or more insulated braided wires / strands), wire mesh (braided wire), or one or more conductors having one or more flexible support trunk substrates (e.g., in the form of one or more insulating carriers). A mechanically flexible connector including one or more electrical conductors and a flexible support trunk substrate can be considered as a mechanically flexible printed circuit board.

[0017] According to another embodiment of the invention, the internal electrical signal connector includes at least one signal conductor serving as a first signal conductor, for example, connecting a first module portion to a second module portion, and further includes a second signal conductor, for example, connecting another or the same first module portion to another second module portion. The length of the first signal conductor may differ from the length of the second signal conductor, for example, in the internal electrical signal connector. For example, the length of the first signal conductor may differ from the length of the second signal conductor by at least 10%, 20%, 30%, 50%, 80%, or 150%. The internal electrical signal connector may also include more than two signal conductors, for example, at least three, four, or five.

[0018] According to another embodiment of the power semiconductor module, the positioning of a first signal conductor included in the internal electrical signal connector is at least partially fixed relative to a second signal conductor. However, the position of the first signal conductor included in the internal electrical signal connector can be flexibly positioned relative to the second signal conductor, at least partially. For example, even after the first and / or second signal conductors have been electrically connected to different parts of the module (e.g., electrically connected to different terminals or auxiliary terminals), it is still possible to change the position and orientation of at least a portion of the first signal conductor relative to the second signal conductor. The relative position and orientation between the first and second signal conductors can be fixed by using additional fixing elements before applying sealing material to the electrical signal connector.

[0019] According to the present invention, the power semiconductor module includes at least a first internal electrical signal connector and a second internal electrical signal connector. The first and / or second internal electrical signal connector can be any internal electrical signal connector described herein. The first connector can be flexibly positioned within the power semiconductor module relative to the second connector. For example, the possibility of changing the position and orientation of the first internal signal connector relative to the second internal signal connector remains.

[0020] According to another embodiment of the power semiconductor module, pre-designed three-dimensional positions within the power semiconductor module are arranged to reduce the length of at least one signal conductor and / or reduce and / or adjust the electrical coupling between the signal conductor and at least one of the first and second module portions. Alternatively, it can utilize the available space provided by the module setup, allowing for a smaller module size since no additional space is required for signal interconnection.

[0021] According to another embodiment of the power semiconductor module, the internal electrical signal connector includes an electrically isolated structure. Signal conductors may be located on or within the electrically isolated structure. The electrically isolated structure may be a flexible carrier formed from electrically isolated yarns. For example, the signal conductors are spun together with the electrically isolated yarns. The connector may include multiple different signal conductors spun together with the electrically isolated yarns. If the different signal conductors are used for different purposes, each of them may be insulated. However, if the conductors are used for the same signal, they may be uninsulated.

[0022] According to another embodiment of the power semiconductor module, the internal electrical signal connector includes an electrically isolated structure. Signal conductors are located, for example, on or within the electrically isolated structure, which is a flexible carrier. The flexible carrier can be planar or sheet-like. The flexible carrier can be in the form of an electrically isolated mesh structure, an electrically isolated woven fabric, or a woven sheet.

[0023] According to another embodiment of the power semiconductor module, the internal electrical signal connector includes at least two or more signal conductors that are separated from each other. The at least two or more signal conductors may be located on the top and / or bottom surface of an electrically insulating mesh structure or an electrically insulating woven fabric or sheet. The at least two or more signal conductors may cross or overlap each other. At locations where the at least two or more signal conductors cross each other, they may be located on different surfaces of a flexible carrier that may be planar or sheet-like. Each of the at least two or more signal conductors may also have an electrically insulating shell or coating.

[0024] According to another embodiment of the power semiconductor module, the internal electrical signal connector includes at least two or more signal conductors that are separated from each other. The at least two or more signal conductors can be integrated into an electrically isolated mesh structure or into an electrically isolated woven fabric or sheet. Therefore, in this case, the electrically isolated structure, as a mesh structure, woven fabric, or woven sheet, can electrically isolate the at least two or more signal conductors from each other, for example, in the lateral direction and / or in the thickness direction when overlapping. The distance or orientation of the conductors can be adjusted by the integration method of the conductors in the electrically isolated structure, for example, in the form of uninsulated or insulated wires. Additionally, the shape of the electrically isolated structure (e.g., in the form of a sheet) can be adjusted due to its mechanical flexibility.

[0025] According to another embodiment of the power semiconductor module, the internal electrical signal connector includes an electrically isolated structure, which is a flexible carrier. At least one signal conductor may be located on the flexible carrier. For example, the flexible carrier may be in the form of an electrically isolated rod or tube, wherein at least one signal conductor is wound around and / or arranged along the electrically isolated rod or tube. The electrically isolated rod or tube may also be a stranded wire or fiber. The at least one signal conductor may be an uninsulated or insulated wire or cable. The signal connector may also include multiple signal conductors wound around and / or arranged along the electrically isolated rod or tube.

[0026] According to another embodiment of the invention, the internal electrical signal connector includes an electrically isolated structure, wherein a signal conductor is located on the electrically isolated structure, and the electrically isolated structure is a flexible or bendable carrier. The flexible or bendable carrier includes at least one recessed structure and / or multiple fixing elements. At least one signal conductor is at least partially arranged in at least one recessed structure and / or fixed to the flexible or bendable carrier by the fixing elements.

[0027] The mechanically flexible internal electrical signal connector may include at least two or more signal conductors, wherein different signal conductors form different signal paths. The flexible or bendable carrier may include at least two or more groove-like structures and / or multiple fixing elements. Different signal conductors may be at least partially arranged in different groove-like structures, and / or may be fixed to the flexible or bendable carrier at predetermined positions by multiple fixing elements.

[0028] According to another embodiment of the power semiconductor module, the internal electrical signal connector includes an electrically isolated structure, wherein at least one signal conductor is at least partially located within the electrically isolated structure. The at least one signal conductor includes at least one cable or coaxial cable, wherein the electrically isolated structure forms electrical isolation around the at least one cable and / or around the coaxial cable.

[0029] According to another embodiment of the power semiconductor module, the internal electrical signal connector includes at least two or more signal conductors, wherein different signal conductors form different signal paths isolated from each other. The internal electrical signal conductors may cross or overlap each other, or may be braided together or twisted together.

[0030] According to another example of a power semiconductor module, at least one signal conductor is formed of a conductive mesh structure or a conductive fabric composed of several leitz wires, strands, or knitted yarns. A portion of at least one signal conductor, or at least one signal conductor in its entirety, can be directly embedded in a sealing material, such that the sealing material is in direct contact with the conductive mesh structure or conductive fabric. The conductive mesh structure and the conductive fabric composed of several leitz wires, strands, or knitted yarns are, in their respective cases, formed to have mechanical flexibility. A portion of at least one signal conductor can be embedded in a terminal block.

[0031] According to the present invention, a method for producing a power semiconductor module as described in claim 8 is disclosed.

[0032] The electrical signal connector can be prefabricated. One or more signal conductors of the electrical signal connector are electrically connected to a first module portion and / or a second module portion. The electrical signal connector can be configured in three dimensions prior to the application of sealing material. Due to its mechanical flexibility, the internal electrical signal connector can be adjusted in three dimensions to a pre-designed position. The electrical isolation structure and / or one or more signal conductors of the electrical signal connector can also be configured in three dimensions. For example, the electrical isolation structure or signal conductors can be stretched, bent, coiled, folded, or mechanically deformed to adapt the electrical isolation structure or signal conductors to the geometry or internal space of the power semiconductor module. The position of one or more signal conductors on or within the electrical isolation structure can also be adjusted or adapted prior to the application of sealing material. Therefore, even after interconnection is provided, the geometry of the signal connector or one or more signal conductors can still be adjusted before the sealing step.

[0033] This disclosure includes several aspects of power semiconductor modules and methods for producing power semiconductor modules based on embodiments and examples. Each feature described with respect to one embodiment is also disclosed herein with respect to another embodiment, even if the corresponding feature is not explicitly mentioned in the context of a particular embodiment. For example, the methods described above for producing power semiconductor modules are particularly suitable for producing the power semiconductor modules described herein. Therefore, the features and advantages described in conjunction with power semiconductor modules can thus be used in this method, and vice versa.

[0034] While this disclosure is adaptable to various modifications and alternatives, its details are illustrated by way of example in the accompanying drawings and will be described in detail. However, it should be understood that this disclosure is not intended to be limited to the specific embodiments and examples described. Attached Figure Description

[0035] The accompanying drawings are included to provide further understanding. In the drawings, elements with the same structure and / or function may be given the same reference numerals. It should be understood that the examples shown in the drawings are illustrative and not necessarily drawn to scale.

[0036] Figure 1A and Figure 1B The general concept of a power semiconductor module is illustrated based on two examples.

[0037] Figure 2 A power semiconductor module based on an example is shown.

[0038] Figure 3A power semiconductor module based on another example is shown.

[0039] Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8A , Figure 8B , Figure 8C , Figure 9A and Figure 9B Some specific implementations of flexible signal connectors are shown based on some specific examples.

[0040] Figure 10 and Figure 11 A further example of a power semiconductor module is shown. Detailed Implementation

[0041] Figure 1A A general concept of a power semiconductor module 100 according to an example is shown. The power semiconductor module 100 includes a first module portion 1, a second module portion 2, an internal electrical signal connector 12, and a sealing material 3. The internal electrical signal connector 12 may include one signal conductor 12A or 12B, or at least two or more signal conductors 12A and 12B.

[0042] The internal electrical signal connector 12 is mechanically flexible. The internal electrical signal connector 12 is at least partially or completely embedded within the sealing material 3. In the absence of the sealing material 3, the internal electrical signal connector 12 is geometrically configurable in three dimensions due to its mechanical flexibility. In other words, in the absence of the sealing material 3, the position of the signal connector 12 and / or signal conductors 12A and / or 12B can be adjusted within the power semiconductor module 100. The signal connector 12 can be stretched, bent, coiled, or twisted. With the sealing material present, the internal electrical signal connector 12 or signal conductors 12A or 12B are located at pre-designed three-dimensional positions within the power semiconductor module 100.

[0043] Therefore, the use of the mechanically flexible internal electrical signal connector 12 provides greater freedom in the design of one or more signal paths. Additionally, when signal conductors 12A and 12B are arranged very close to each other or have a coaxial configuration, the coupling inductance of, for example, gate-emitter or gate-source circuits can be reduced. Furthermore, proper positioning of signal conductors 12A and 12B relative to the main terminals (i.e., relative to the power supply terminals) can further facilitate the adjustment of coupling inductance.

[0044] like Figure 1AAs shown, signal conductors 12A or 12B electrically connect the first module portion 1 to the second module portion 2. Typically, the first module portion 1 and / or the second module portion 2 can be a gate, (auxiliary) emitter / source, (auxiliary) collector / drain, or other types of auxiliary terminals or contacts. Therefore, the first module portion 1 can be a terminal, such as a gate terminal, source terminal, or drain terminal of a transistor or switch structure. The second module portion 2 can be a terminal connected to the emitter, a terminal connected to a sensor, or an auxiliary terminal. For example, the first module portion 1 is an internal terminal, and the second module portion 2 is an external auxiliary terminal. Signal conductors 12A or 12B can form a control / measurement signal path between the first module portion 1 and the second module portion 2. The control / measurement signal path is different from the main power supply path. Therefore, the internal electrical signal connector 12 or signal conductors 12A or 12B are not configured, for example, to form a power connection between power terminals. However, connector 12 can be used to contact the main contacts of the chip for sensing purposes, such as for auxiliary emitter / source.

[0045] The first module portion 1 may be a terminal electrically connected to an internal semiconductor device, and the second module portion 2 may be an auxiliary terminal electrically connected to an external or internal control circuit portion associated with the power semiconductor module. This is, for example, in... Figure 1B The diagram is schematically shown. Therefore, the internal electrical signal connector 12 can form an internal electrical signal connection, such as a gate connection, emitter connection, source connection, collector connection, drain connection, or sensor connection. However, module portion 1 may be a main terminal, wherein connector 12 is connected to the main terminal. For example, an auxiliary emitter / source or collector / drain for sensing can be connected to the corresponding main terminal.

[0046] like Figure 1A As shown, the first module portion 1 is located in the bottom region of the power semiconductor module 100. For example, the first module portion 1 is disposed on the substrate of the power semiconductor module 100 or serves as the substrate of the power semiconductor module. Figure 1A In this configuration, the second module portion 2 is located in the top region of the power semiconductor module 100. The second module portion 2 can be a control board or auxiliary terminals with a pin structure. The second module portion 2 can be a terminal for an auxiliary emitter / source, auxiliary collector / drain, gate, or sensor. The first module portion 1 or the second module portion 2 can also form a terminal block. The terminal block can incorporate several main terminals and / or auxiliary terminals. The terminal block can also at least partially incorporate connector 12.

[0047] like Figure 1BAs shown, both the first module portion 1 and the second module portion 2 are located in the bottom region of the power semiconductor module 100. The internal electrical signal connector 12 can, for example, form an internal interconnect between a switch or sensor and a control device.

[0048] Some possible embodiments of the internal electrical signal connector 12 may include a cable, such as a single cable, a cable with multiple conductors, a multi-core conductor, a stranded single cable, a coaxial cable, or a conductive fabric made of a mesh structure or made of multiple Litz wires or strands. Further embodiments of the internal electrical signal connector 12 may include metal filaments arranged around a carrier material, one or more metal filaments integrated into a yarn made of an insulating substrate, one or more metal filaments or yarns wound around an electrically insulating flexible carrier, one or more fine signal lines integrated into an electrically insulating mesh structure or integrated into an electrically insulating woven fabric or sheet, or one or more fine signal lines arranged on a flexible carrier or, for example, fixed to a flexible carrier by clamping.

[0049] Therefore, one or more signal conductors 12A and / or 12B of the signal connector 12 can form one or more flexible electrical connections directly embedded in the sealing material. One or more flexible signal conductors 12A and / or 12B of the signal connector 12 can also be arranged on or within an electrically isolated flexible carrier of the signal connector 12, wherein the signal connector 12 is at least partially or completely embedded in the sealing material 3. The signal connector 12 may include a flexible carrier.

[0050] The use of mechanically flexible internal electrical signal connectors 12 provides a variety of possibilities for implementing signal connections within the power semiconductor module 100, while reducing cost and workload. These possibilities are based on flexible interconnects that are at least partially embedded in the sealing material 3 of the power semiconductor module 100 itself or in terminal blocks, wherein multiple terminals are bonded to the terminal blocks, for example, in the form of resin bodies. Such terminal blocks can combine both main terminals / connectors and signal terminals / connectors.

[0051] The sealing material 3 can be a dielectric gel, rubber material, adhesive, or potting resin, such as epoxy resin. The sealing material may contain fillers, such as inorganic fibers or particles. The sealing material 3 can also be a transfer molding resin or injection molding resin, for example, in the case of terminal blocks. However, the entire module housing can also be prepared by molding. The transfer molding resin can be epoxy resin or thermosetting resin. At least a portion of the seal can be performed during the assembly process of the power semiconductor module 100 (e.g., when the semiconductor module 100 is filled with the sealing material 3 (e.g., dielectric gel, rubber material, adhesive, or potting resin)). Other portions of the internal electrical signal connector 12 can be embedded in separate building blocks (such as terminal blocks), which can be manufactured, for example, by injection or transfer molding of thermoplastic or thermosetting materials.

[0052] The connection between signal conductor 12A or 12B and the first module part 1, or the connection between signal conductor 12A or 12B and the second module part 2, can be performed by methods such as brazing, sintering, gluing, welding, threading, hooking, or clamping (e.g., in the case of a spring).

[0053] Figure 2 An example of a power semiconductor module 100 is shown, which includes an internal electrical signal connector 12 as a cable. A first module portion 1 may be a terminal connected to a first control circuit portion 10, and a second module portion 2 may be an auxiliary terminal connected to a second control circuit portion 20. The second module portion 2 may have a pin structure.

[0054] The signal connector 12 includes an electrically isolated structure 4 and a signal conductor 12A, wherein the signal conductor 12A is located within the electrically isolated structure 4. Therefore, according to Figure 2 The signal connector 12 is a flexible cable, wherein an electrical isolation structure 4 forms electrical isolation around the signal conductor 12A, which is a wire used for electrical signal connection. In this sense, the electrical isolation structure 4 forms a flexible carrier for the signal conductor 12A.

[0055] The signal connector 12 can provide direct interconnection between the first module portion 1 and the second module portion 2, the second module portion being, for example, an external auxiliary terminal. Electrical and mechanical contacts between the signal conductor 12A and the first module portion 1 or between the signal conductor 12A and the second module portion 2 can be achieved by joining methods such as brazing, sintering, gluing, welding, or clamping or hooking (dry contact)).

[0056] Due to the electrical isolation provided by the electrical isolation structure 4, no additional carrier or coating is required except for final embedding into the sealing material 3 of the power semiconductor module 100 or into the building block. Therefore, there is high flexibility in positioning the signal connector 12 inside the power semiconductor module 100. However, the signal connector 12 can be secured to the housing structure, for example, by means of clamps or snap-fit ​​engagement.

[0057] Figure 2 A possible arrangement for signal interconnection between a first control circuit section 10 and a second module section 2, implemented by a signal connector 12, is shown. The second module section is, for example, an auxiliary terminal connected to the second control circuit section 20. Here, the signal connector 12 is implemented, for example, by ultrasonic welding to a mating cable.

[0058] Figure 3 An example of a power semiconductor module 100 constituting part of the present invention is shown, which includes an internal electrical signal connector 12, wherein the signal connector 12 includes at least two signal conductors 12A and 12B. Each of conductors 12A and 12B is surrounded by an electrical isolation structure 4. For example, a first electrical isolation structure 4B and a first signal conductor 12A are formed with... Figure 2 The cable shown is very similar to the first cable. The second electrical isolation structure 4B and the second signal conductor 12B are formed with... Figure 2 The second cable shown is very similar to the cable in the diagram. Therefore, it is similar to... Figure 2 Compared to the examples described in [the text], according to Figure 3 The signal connector 12 includes two cables.

[0059] like Figure 3 As shown, signal conductors 12A and 12B, or the two cables, are twisted or braided together. The signal connector 12 further includes an electrical isolation structure 40, which is a common flexible electrical isolation structure 40, and thus forms a common flexible carrier for signal conductors 12A and 12B. The common flexible electrical isolation structure 40 can be made of plastic or rubber. However, the common flexible electrical isolation structure 40 can be optional. Figure 2 Compared to the example shown, according to Figure 3 The power semiconductor module 100 shown in the example includes a first module portion 1A, a further first module portion 1B, a second module portion 2A, and a further second module portion 2B. The first module portion 1A and the further first module portion 1B can be, for example, metallized patterns on a substrate. The second module portion 2A and the further second module portion 2B can be auxiliary terminals, such as pin-type auxiliary terminals, each auxiliary terminal connected to a second control circuit portion 20. Figure 3The difference is that the signal connector 12 may also include more than two cables, such as at least three or four cables, which may be twisted or braided together.

[0060] Therefore, the signal connector 12 may include an arrangement of multiple cables arranged very closely together to improve electromagnetic behavior, such as to improve and / or adjust the electromagnetic coupling between conductors 12A and 12B of the connector 12 (e.g., between the gate and emitter / source), or to improve electromagnetic shielding. In this case, the signal connector 12 can be considered a multi-core cable, wherein two or more cables are arranged adjacent to each other. To achieve enhanced or adjusted electromagnetic behavior, the two or more cables may have a stranded or braided arrangement. Additionally, shielding effects can be achieved by arranging additional conductors between the sensitive conductor and the interference source, or generally between the conductors, to avoid or reduce any coupling.

[0061] like Figure 4 As shown, the signal connector 12 can be implemented via a coaxial cable, which includes a signal conductor 12A, a further signal conductor 12B, a first electrical isolation structure 4A, and a second electrical isolation structure 4B. The first and second electrical isolation structures 4A and 4B are mechanically flexible and can form flexible carriers for the signal conductors 12A and 12B. The signal conductor 12A is a central core surrounded by the first electrical isolation structure 4A. The further signal conductor 12B forms an outer conductor surrounding the signal conductor 12A and the first electrical isolation structure 4A. The further signal conductor 12B is surrounded by the second electrical isolation structure 4B.

[0062] Signal conductor 12A and another signal conductor 12B can be connected to corresponding module portions of the power semiconductor module, such as to one or more first module portions and one or more second module portions as, for example, auxiliary terminals. Signal conductor 12A, as the central core, can form a gate signal interconnect. The other signal conductor 12B, as an outer conductor, can form an emitter / source auxiliary signal interconnect.

[0063] The signal connector 12 itself or the signal conductor 12A can be formed from a mesh or knitted / woven fabric composed of multiple fine metal lizard wires or strands, such as Figure 5 This is illustrated schematically. In other words, as shown in the diagram. Figure 5 As shown, the signal connector 12 or signal conductor 12B can be formed from a conductive mesh structure or a conductive fabric composed of several Litz wires, strands, or knitted yarns. The metal mesh or fabric achieves a balance in two aspects: it has sufficient flexibility to allow the signal connector 12 to be formed and bent into any geometry; and it has sufficient rigidity after installation so that it does not undergo significant deformation in subsequent sealing processes (e.g., in subsequent potting or molding processes).

[0064] When fabric or mesh is embedded in sealing material 3, sealing material 3 (such as dielectric gel, potting resin, or molding resin) permeates the fabric or mesh. Therefore, signal conductors 12A or 12B can be directly embedded in sealing material 3, allowing direct contact between sealing material 3 and the conductive mesh structure or conductive fabric. Alternatively or additionally, signal conductors 12A or 12B can be at least partially embedded in the material of the terminal block. Furthermore, the conductive mesh structure or conductive fabric composed of several leitz wires, strands, or knitted yarns can also be covered and / or permeated by the electrical isolation structure 4, such as... Figure 5 As shown on the right side.

[0065] Figure 6 and Figure 7 Some further exemplary embodiments of the signal connector 12 are shown. The internal electrical signal connector 12 includes a mechanically flexible electrical isolation structure 4. Signal conductor 12A and / or additional signal conductor 12B are located on or within the electrical isolation structure 4. The electrical isolation structure 4 can serve as a carrier.

[0066] according to Figure 6 The electrically isolated structure 4 is a flexible carrier formed from electrically isolated spun yarn, wherein the signal conductor 12A or 12B is spun together with the electrically isolated yarn. Therefore, the electrically isolated yarn, in the form of fibers or strands, is used as the carrier material. The isolated yarn can be formed from cotton, polyester, etc. The signal conductor 12A or 12B can be a metal filament or metal wire integrated into the woven yarn structure. If multiple conductors are implemented for different purposes, the metal wire can have an additional insulating coating.

[0067] As an alternative, according to Figure 7 The connector 12 includes a flexible carrier in the form of an electrically insulating rod or tube, which can be a strand of wire or fiber. The electrically insulating rod or tube can be considered a flexible bar, wherein one or more conductors 12A and 12B are wound around and / or arranged along the electrically insulating rod or tube. The flexible carrier is bendable and can be bent according to the geometry inside the power semiconductor module 100. If multiple conductors 12A and 12B are implemented, for example, in the form of filaments (which are associated with different signal paths), each layer of conductors 12A and 12B or filaments can be coated with an electrically insulating material to separate conductors 12A and 12B from each other. Alternatively, [the following can be used]... Figure 6 One or more yarns with conductors 12A and 12B bonded together are shown wound around an electrical isolation rod or tube.

[0068] Figure 8A , Figure 8B and Figure 8CSome additional exemplary embodiments of the signal connector 12 are shown, according to which the signal connector 12 includes an electrically isolated structure 4, which is a planar or sheet-like flexible carrier, wherein the flexible carrier is in the form of an electrically isolated mesh structure or an electrically isolated woven fabric or woven sheet, and wherein the signal conductor 12A is located on or within the flexible carrier.

[0069] The signal connector 12 may include at least two or more signal conductors 12A and 12B. At locations where conductors 12A and 12B may intersect or overlap, conductors 12A and 12B may be arranged on different surfaces of a flexible carrier, such as the top and / or bottom surfaces of a planar or sheet-like electrically insulating mesh structure or an electrically insulating woven fabric or sheet. When at least two or more signal conductors 12A and 12B are integrated at different locations within an electrically insulating mesh structure, woven fabric, or woven sheet, they may also be separated from each other.

[0070] Therefore, according to Figures 8A to 8C A mesh structure or sheet of woven fabric made of an electrically insulating material serves as a carrier for one or more conductors 12A and 12B (e.g., in the form of metal filaments). To prevent short circuits between conductors 12A and 12B, conductors 12A and 12B may also be coated with an insulating material. The electrically insulating mesh structure, woven fabric, or woven sheet can be made of a flexible material and form a flexible carrier that achieves a balance between being flexible enough to be formed and bent into any geometry and having sufficient rigidity after installation so that the flexible carrier, together with conductors 12A and 12B, does not deform during subsequent sealing processes (e.g., during subsequent molding or potting processes).

[0071] Figure 9A and Figure 9B Further exemplary embodiments of the signal connector 12, which form part of the present invention, are shown. According to these embodiments, the internal electrical signal connector 12 includes an electrically isolated structure 4, which is a flexible or bendable carrier. Signal conductors 12A and 12B are located on the flexible or bendable carrier. The flexible or bendable carrier may include at least one or more recessed structures for at least partially accommodating the signal conductors 12A and 12B, or a plurality of fixing elements for securing the signal conductors 12A and 12B. Therefore, the signal conductors 12A and 12B may be at least partially arranged in the recessed structure or secured to the flexible or bendable carrier by the fixing elements.

[0072] therefore, Figure 9A and Figure 9BAt least two signal conductors 12A and 12B, for example in the form of metal filaments or wires, are shown. These conductors are arranged on or fixed to a rigid but flexible or bendable carrier, which can be adjusted according to the geometry of the power semiconductor module 100. The carrier itself can be made of an electrically insulating material, such as a flexible or bendable resin or rubber. The signal conductors 12A and 12B can be laid in a recessed structure of the carrier, whose sidewalls provide lateral electrical isolation between the signal conductors 12A and 12B in different signal paths. Alternatively or additionally, the carrier can provide fixing elements, such as clamping structures and / or retainer structures for fixing the signal conductors 12A and 12B.

[0073] Figure 10 and Figure 11 Another example of a power semiconductor module 100 is shown, which includes a mechanically flexible internal electrical signal connector 12. Therefore, the signal connector 12 differs from a printed circuit board, for example, from a rigid printed circuit board on which wires are arranged. The signal connector 12, for example, does not contain a non-flexible or inflexible carrier. However, the signal connector 12 may also include a mechanically flexible printed circuit board.

[0074] Figure 10 and Figure 11 The signal connector 12 shown can be combined Figures 1A to 9B Any of the signal connectors 12 described. Therefore, the features and advantages described in conjunction with the signal connectors 12 shown in 1A to 9B or the power semiconductor module 100 can be used for… Figure 10 or Figure 11 The signal connector 12 or power semiconductor module 100 shown are either the signal connector 12 or the power semiconductor module 100, or vice versa.

[0075] like Figure 10 and Figure 11As shown, the signal connector 12 includes at least two signal conductors 12A and 12B. One signal conductor 12A forms an interconnect between a first module portion 1A and a second module portion 2A, the second module portion being, for example, an auxiliary terminal. The first module portion 1A may be a terminal of a first switch. Another signal conductor 12B forms an interconnect between another first module portion 1B and another second module portion 2A, the other second module portion being, for example, another auxiliary terminal. The other first module portion 1B may be a contact of a second switch or any contact surface. Due to its combination of mechanical flexibility and sufficient rigidity to maintain its shape, the internal electrical signal connector 12 can be configured in three dimensions without the sealing material 3, and therefore can adapt to any internal geometry of the power semiconductor module 100. Thus, the internal electrical signal connector 12, together with the signal conductors 12A and 12B, can be located at any pre-designed three-dimensional position within the power semiconductor module 100. Figure 11 This is illustrated schematically in the image.

[0076] After the position of the internal electrical signal connector 12 or the relative position between signal conductors 12A and 12B has been fixed and / or after signal conductors 12A or 12B have been connected to the first module portion 1 and / or the second module portion 2, sealing material 3 can be applied to, for example, the housing of the power semiconductor module 100. Thus, the internal electrical signal connector 12 can be at least partially or completely embedded within the sealing material 3.

[0077] This invention is defined by the appended claims.

[0078] Figure Labels

[0079] 100 power semiconductor module

[0080] 10 First Control Circuit Section

[0081] Module 1 / First Module

[0082] 1A First Module Part

[0083] 1B Another First Module Part

[0084] 12 Internal Electrical Signal Connectors

[0085] 12A signal conductor

[0086] 12B additional signal conductor

[0087] Module 2 / Second Module

[0088] 2A Second Module Part

[0089] 2B The other second module part

[0090] 20 Second Control Circuit Section

[0091] 3. Sealing materials

[0092] 4 Electrical isolation structure / carrier

[0093] 4A First Electrical Isolation Structure

[0094] 4B Second Electrical Isolation Structure

[0095] 40. Public electrical isolation structure / public carrier.

Claims

1. A power semiconductor module (100) comprising a first module portion (1, 1A, 1B), a second module portion (2, 2A, 2B), an internal electrical signal connector (12), and a sealing material (3), wherein, - The internal electrical signal connector (12) is mechanically flexible and electrically connected to the first module portion (1, 1A, 1B) and / or the second module portion (2, 2A, 2B), wherein the signal conductors (12A, 12B) of the internal electrical signal connector (12) are electrically connected to the first module portion (1, 1A, 1B) and / or electrically connected to the second module portion (2, 2A, 2B). - The internal electrical signal connector (12) is at least partially embedded within the sealing material (3), - Due to its mechanical flexibility, the internal electrical signal connector (12) can be configured in three dimensions without the sealing material (3), and the internal electrical signal connector (12) is located at a pre-designed three-dimensional position in the power semiconductor module (100). - The internal electrical signal connector (12) includes a common electrical isolation structure (4), which is a common mechanical flexible carrier for the signal conductors (12A, 12B) of the internal electrical signal connector (12). - The signal conductors (12A, 12B) include a first signal conductor (12A) and a second signal conductor (12B), the first signal conductor and the second signal conductor being located on or within the common electrical isolation structure (4), and The power semiconductor module (100) is characterized in that it includes an additional feature i or an additional feature ii, namely... i: The common electrical isolation structure (4), which serves as the flexible carrier of the common machinery, is made of plastic or rubber, wherein the signal conductors (12A, 12B) are located within the common electrical isolation structure (4) and twisted or braided together, wherein the signal conductors (12A, 12B) form different signal paths that are isolated from each other, or ii: The signal conductors (12A, 12B) form different signal paths, wherein the common electrical isolation structure (4), which serves as the common mechanical flexible carrier, includes at least two or more groove-shaped structures or multiple fixing elements, and the different signal conductors (12A, 12B) are at least partially arranged in different groove-shaped structures, or fixed to the common mechanical flexible carrier at predetermined positions by the multiple fixing elements.

2. The power semiconductor module (100) according to claim 1, further comprising the additional feature ii, in, The length of the first signal conductor (12A) is different from the length of the second signal conductor (12B).

3. The power semiconductor module (100) according to claim 2, wherein, The first signal conductor (12A) is flexibly and at least partially positioned within the power semiconductor module (100) relative to the second signal conductor (12B), and / or the position of the first signal conductor (12A) included in the internal electrical signal connector (12) is at least partially fixed relative to the second signal conductor (12B).

4. The power semiconductor module (100) according to claim 1, further comprising the additional feature ii, wherein, The pre-designed three-dimensional positions in the power semiconductor module (100) are arranged for... - Reduce the length of the first signal conductor (12A) or the second signal conductor (12B), and / or - Reduce and / or adjust the electrical coupling between the signal conductors (12A, 12B) and at least one of the first module portions (1, 1A, 1B) and the second module portions (2, 2A, 2B).

5. The power semiconductor module (100) according to any one of claims 2 to 3, further comprising the additional feature ii, wherein, The pre-designed three-dimensional positions in the power semiconductor module (100) are arranged for... - Reduce the length of the first signal conductor (12A) or the second signal conductor (12B), and / or - Reduce and / or adjust the electrical coupling between the signal conductors (12A, 12B) and at least one of the first module portions (1, 1A, 1B) and the second module portions (2, 2A, 2B).

6. The power semiconductor module (100) according to any one of claims 1 to 4, further comprising the additional feature ii, wherein, - The public mechanical flexible carrier includes at least two or more groove-shaped structures, and - Different signal conductors (12A, 12B) are arranged at least partially in different groove-shaped structures.

7. The power semiconductor module (100) according to any one of claims 1 to 4, further comprising the additional feature ii, wherein, The public machinery flexible carrier includes the plurality of fixed elements, and Different signal conductors (12A, 12B) are fixed to the common mechanical flexible carrier at predetermined positions by the plurality of fixing elements.

8. The power semiconductor module (100) according to claim 1, further comprising the additional feature i.

9. A method for manufacturing a power semiconductor module (100), the power semiconductor module comprising a first module portion (1, 1A, 1B), a second module portion (2, 2A, 2B), an internal electrical signal connector (12), and a sealing material (3), the method comprising: The power semiconductor module (100) is provided without the sealing material (3). The internal electrical signal connector (12) is mechanically flexible and electrically connected to the first module portion (1, 1A, 1B) and / or the second module portion (2, 2A, 2B). The signal conductors (12A, 12B) of the internal electrical signal connector (12) are electrically connected to the first module portion (1, 1A, 1B) and / or electrically connected to the second module portion (2, 2A, 2B). Due to its mechanical flexibility, the internal electrical signal connector (12) can be configured in three dimensions and adjusted to a pre-designed three-dimensional position within the power semiconductor module (100); and The sealing material (3) is applied to the internal electrical signal connector (12) such that the internal electrical signal connector (12) is at least partially embedded within the sealing material (3). The internal electrical signal connector (12) includes a common electrical isolation structure (4), which is a common mechanical flexible carrier for the signal conductors (12A, 12B) of the internal electrical signal connector (12). The signal conductors (12A, 12B) include a first signal conductor (12A) and a second signal conductor (12B). The first signal conductor (12A) and the second signal conductor (12B) are located on or within the common electrical isolation structure (4), and Its features are, The power semiconductor module (100) includes an additional feature i or an additional feature ii, namely i: The common electrical isolation structure (4) is made of plastic or rubber, wherein the signal conductors (12A, 12B) are located within the common electrical isolation structure (4) and twisted or braided together, wherein the signal conductors (12A, 12B) form different signal paths isolated from each other, or ii: The signal conductors (12A, 12B) form different signal paths, wherein the common mechanical flexible carrier includes at least two or more groove-shaped structures or multiple fixing elements, and the different signal conductors (12A, 12B) are at least partially arranged in different groove-shaped structures, or fixed to the common mechanical flexible carrier at predetermined positions by the multiple fixing elements.

10. The method according to claim 9, in, The power semiconductor module (100) includes the additional feature ii, and The length of the first signal conductor (12A) is different from the length of the second signal conductor (12B).

11. The method of claim 10, wherein The first signal conductor (12A) is flexibly and at least partially positioned within the power semiconductor module (100) relative to the second signal conductor (12B), and / or the position of the first signal conductor (12A) included in the internal electrical signal connector (12) is at least partially fixed relative to the second signal conductor (12B).

12. The method according to claim 9, wherein, The power semiconductor module (100) includes the additional feature ii, and wherein The pre-designed three-dimensional positions in the power semiconductor module (100) are arranged for... - Reduce the length of the first signal conductor (12A) or the second signal conductor (12B), and / or - Reduce and / or adjust the electrical coupling between the signal conductors (12A, 12B) and at least one of the first module portions (1, 1A, 1B) and the second module portions (2, 2A, 2B).

13. The method according to any one of claims 10 to 11, wherein, The power semiconductor module (100) includes the additional feature ii, and wherein The pre-designed three-dimensional positions in the power semiconductor module (100) are arranged for... - Reduce the length of the first signal conductor (12A) or the second signal conductor (12B), and / or - Reduce and / or adjust the electrical coupling between the signal conductors (12A, 12B) and at least one of the first module portions (1, 1A, 1B) and the second module portions (2, 2A, 2B).

14. The method according to any one of claims 9 to 12, wherein - The power semiconductor module (100) includes the additional feature ii. - The public mechanical flexible carrier includes at least two or more groove-shaped structures, and - Different signal conductors (12A, 12B) are arranged at least partially in different groove-shaped structures.

15. The method according to any one of claims 9 to 12, wherein - The power semiconductor module (100) includes the additional feature ii. - The public mechanical flexible carrier includes multiple fixed elements, and - Different signal conductors (12A, 12B) are fixed to the common mechanical flexible carrier at predetermined positions by the plurality of fixing elements.

16. The method according to claim 9, wherein, The power semiconductor module (100) includes the additional feature i.

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