Device for cooling the dispensing module and suppressing condensation.

Abstract

This invention relates to the field of dispensing equipment technology and discloses a device for cooling a dispensing module and suppressing condensation. The device includes an inner insulation board, an outer insulation cover, a heat-conducting block for transferring heat to the mixing tube, a semiconductor cooler, a cooling base, and a sealed end cap. The outer insulation cover has several evenly spaced heat-insulating channels to reduce the temperature difference between the internal cooling space and the external space. These channels are close to the outer wall and away from the inner wall, thus being closer to the external space and further away from the internal cooling space. The heat-conducting block only contacts the positioning groove on the inner insulation board through a positioning boss. This device not only solves the problem of continuously cooling the mixed adhesive to maintain a low temperature, reducing chemical reactivity, and preventing adhesive blockage, but also solves the problem of a sudden drop in heat in the outer cavity of the cooling tube, resulting in a large temperature difference with the external space and the generation of liquefied condensation. This ensures that the dispensing machine does not generate splashed condensation during high-speed, frequent dispensing processes.

Description

Technical Field

[0001] This invention relates to the field of dispensing equipment technology, and more specifically to a device for cooling dispensing modules and suppressing condensation. Background Technology

[0002] Existing dispensing machines on the market have significant problems and shortcomings in their dispensing modules. Typically, dispensing guns use a two-component screw valve for glue supply, where A and B adhesives are mixed to achieve bonding and curing. The mixed adhesives undergo a chemical reaction to generate highly viscous, rapidly curing components for bonding and assembly. However, this active chemical reaction generates heat, and if the heat doesn't dissipate, it accelerates the curing speed of the mixed adhesive. This is fatal for mixed adhesives waiting to be dispensed after the machine has stopped, directly accelerating curing and clogging the dispensing needle, making continuous dispensing impossible.

[0003] To mitigate the chemical reactivity of these mixed adhesives, many companies on the market have adopted measures such as circulating cooling water, refrigeration semiconductor cooling, and fan cooling to directly cool the outer wall of the cavity containing the mixed adhesive and maintain a continuous low temperature. This allows the mixed adhesive to be kept in a cold temperature environment of -15 to 10 degrees Celsius, thereby reducing the chemical reactivity and slowing down the curing speed of the adhesive. The effect of these measures in inhibiting the chemical reaction speed of the adhesive is also very ideal.

[0004] However, while the cavity containing the adhesive mixture is cooled, the external temperature of the dispensing module is higher. Water vapor in the air will inevitably liquefy and adhere to the outer wall of the cavity. This causes the dispensing needle below the cavity to fling out condensed water (i.e., air-liquefied water) from the outer wall each time it moves rapidly and positions itself to the dispensing location. This condensed water splashes onto the worktable in unpredictable directions and locations. If it gets onto the surface of the product to be dispensed, it can cause product defects and make the worktable unclean. Furthermore, as long as the temperature difference between the inside and outside remains sufficient to create liquefaction conditions, condensation will continue to form, and wiping with absorbent paper cannot prevent the continuous liquefaction of air moisture. Therefore, it is necessary to design a device that, while ensuring continuous cooling of the adhesive mixture to maintain a low temperature, significantly reduces the temperature difference between the outer wall of the adhesive mixture cavity and the outside air until the outside air, upon contact with the outer wall of the cavity, no longer meets the liquefaction conditions, thus preventing condensation and ensuring the dispensing process is not affected. Summary of the Invention

[0005] The problems to be solved by the present invention are as follows: In the existing mixed glue, the active chemical reaction process will accumulate heat, and after the temperature rises, the curing speed of the mixed glue will increase, blocking the dispensing needle and making continuous dispensing impossible. It is necessary to provide a device to continuously cool the mixed glue to maintain a low temperature. In addition, the temperature difference between the outer wall of the cavity of the mixed glue maintained at a low temperature and the external air is relatively large, and liquefied condensed water is very likely to appear. The device also needs to greatly reduce the temperature difference between the outer wall of the cavity of the mixed glue and the external air and continuously maintain it until the external air never has the condition of liquefaction when touching the outer wall of the cavity, so as not to generate condensed water and affect the dispensing process production.

[0006] The technical solutions adopted to solve the above problems are as follows:

[0007] A device for cooling a dispensing module and suppressing the generation of condensed water is proposed. The device is wrapped around the outer circumference of the mixing tube and includes

[0008] an inner insulation board, which is in a "return" shape and is arranged around the outer cylindrical surface of the mixing tube. A number of insulation flow channels for reducing the temperature difference between the internal refrigeration space and the external space are evenly spaced and opened. The insulation flow channels include an insulation inflow channel for introducing the coolant and an insulation outflow channel for discharging the coolant.

[0009] an outer insulation cover, which is arranged on the outside of the mixing tube with a gap, cooperates with the inner insulation board to enclose the refrigeration space around the mixing tube, and is hermetically connected to the ports of a number of the insulation outflow channels and insulation inflow channels with a number of return flow channels for reducing the temperature difference between the internal refrigeration space and the external space.

[0010] a heat conduction block for conducting heat to the mixing tube. The heat absorption surface of the heat conduction block is fitted to the mixing tube, and the heat dissipation surface of the heat conduction block is fitted to the heat absorption end of the semiconductor refrigerator to quickly transfer the absorbed heat.

[0011] a semiconductor refrigerator, the heat dissipation end of which is fitted to the inner end face of the refrigeration base to quickly transfer the absorbed heat.

[0012] a refrigeration base, on the outer end face of which a spiral flow groove is provided to quickly conduct the heat absorbed by the semiconductor refrigerator to the coolant, and a converging flow groove is also provided to converge all the coolant flowing through the spiral flow groove, the insulation outflow channel, the return flow channel, and the insulation inflow channel in sequence.

[0013] and a sealing end cover, which is hermetically fitted to the outer end face of the refrigeration base to fully seal the spiral flow groove and the converging flow groove. An inlet is provided at the center of the spiral flow groove on the sealing end cover, and an outlet is provided opposite the converging flow groove. The coolant surges in from the inlet and surges out from the outlet, taking away the heat absorbed by the semiconductor refrigerator.

[0014] Further, a hinge seat is provided on one side of the inner insulation board, and is movably connected to a hinge frame provided on the same side of the outer insulation cover through a hinge shaft.

[0015] Further, a mating hole is provided on the alignment side of the outer insulation cover where the hinge frame is provided. The mating hole is aligned with a locking hole provided at the corresponding position of the inner insulation board, and the two are screwed and locked by a hand-tightening screw.

[0016] Further, the heat preservation flow channel is close to the outer wall and far from the inner wall, and is far from the internal refrigeration space by approaching the external space, so as to supplement the heat absorbed by the outer wall surfaces of the inner insulation board, the outer insulation cover, and the refrigeration base from the refrigeration space, reduce the heat loss of the outer walls of the three, greatly reduce the temperature difference between the three and the external air, and prevent the liquefaction of air moisture from adhering to the surfaces of the three.

[0017] Further, sealing grooves are provided at both port ends of the heat preservation outflow channel and the heat preservation inflow channel, and sealing rings are stuffed in the sealing grooves, so that the inner insulation board is hermetically connected to the outer insulation cover and the inner insulation board is hermetically connected to the refrigeration base.

[0018] Further, sealing grooves are provided at both port ends of the folded return flow channel provided on the outer insulation cover, and sealing rings are stuffed in the sealing grooves. The sealing rings are closely fitted with the inner insulation board to achieve the hermetic connection between the inner insulation board and the outer insulation cover.

[0019] Further, the refrigeration base is provided with a plurality of dispersion channels communicating with the spiral flow grooves and a convergence channel communicating with the convergence flow grooves. Sealing grooves are provided at the outflow port of the dispersion channel and the inflow port of the convergence channel, and sealing rings are stuffed in the sealing grooves. The sealing rings are closely fitted with the inner insulation board to achieve the hermetic connection between the inner insulation board and the refrigeration base.

[0020] Further, the heat conduction block includes a heat absorption surface in the shape of a semi-cylindrical body, a heat dissipation surface for导出热量 (it should be noted that the specific expression here may be incorrect, it might be "for dissipating heat"), and positioning bosses provided at the four corners. The heat absorption surface semi-wraps the mixing glue pipe, and the positioning bosses cooperate with positioning grooves provided on the inner insulation board to achieve the positioning of the heat conduction block.

[0021] Further, there is air between the internal refrigeration space formed by the sequential stacking and fitting of the outer insulation cover, the inner insulation board, and the refrigeration base and the heat conduction block. The heat conduction block is only in contact with the positioning grooves provided on the inner insulation board through the cooperation of the positioning bosses.

[0022] Further, profiling grooves are provided on the outer perimeters of the spiral flow grooves and the convergence flow grooves, and profiling sealing gaskets are stuffed in the profiling grooves to make the refrigeration base hermetically connected to the sealing end cover.

[0023] Furthermore, the upper surfaces of both the outer insulation cover and the inner insulation board are provided with semi-circular limiting grooves, which clamp and limit the mixing tube to be cooled and insulated. The lower surfaces of both the outer insulation cover and the inner insulation board are provided with semi-circular dispensing grooves, which clamp and limit the dispensing needle assembly.

[0024] The beneficial effects of this invention are:

[0025] 1. This device for cooling the dispensing module and suppressing condensation not only solves the problem of continuously cooling the mixed adhesive to maintain a low temperature, reduce chemical reactivity, and prevent adhesive blockage, but also solves the problem of a sudden drop in heat in the outer cavity of the cooling mixing tube, resulting in a large temperature difference with the external space and the generation of liquefied condensation. This ensures that the dispensing machine does not generate splashing condensation in high-speed, frequent dispensing processes.

[0026] 2. By rapidly dissipating heat from the semiconductor cooler by spiraling the coolant into it, the coolant simultaneously connects to the cooling base, inner insulation board, and outer insulation cover surrounding the mixing tube. This replenishes the heat absorbed from the semiconductor cooler to the three components that have cooled down due to the large amount of heat absorbed from the internal cooling space, maintaining a low temperature difference between the three components and the outside air in real time. Therefore, liquefaction will not occur. The coolant serves a dual purpose, which is highly innovative.

[0027] 3. Because the insulation channel is close to the outer wall and far from the inner wall, the structural design of being close to the external space and far from the internal cooling space can first replenish the heat lost from the outer wall, while a small portion of the heat is slowly absorbed by the internal cooling space. In particular, there is a cooling space between the insulation channel, the mixing tube, and the heat-conducting block. The mixing tube, the heat-conducting block, and the semiconductor cooling chip are in close contact. The former conducts heat through air, and the latter conducts heat between high thermal conductivity solid materials. Therefore, the coolant in the insulation channel absorbs a large amount of heat. Apart from most of the heat carried away by the coolant, the remaining heat is mostly used to replenish the cooling base, the inner insulation board, and the outer wall of the outer insulation cover. This ensures that the heat absorbed by the mixing tube is much greater than the heat replenished by the cooling air. Therefore, the cooling and insulation effect of the semiconductor cooler remains unchanged.

[0028] 4. The modular design of each sealing end cap, cooling base, inner insulation board, and outer insulation cover facilitates production, processing, maintenance, and replacement.

[0029] 5. The heat-conducting block only contacts the positioning boss and the positioning groove of the inner insulation plate. The rest of the parts do not contact the outer insulation cover, inner insulation plate, and cooling base, which greatly reduces the contact area between the heat-conducting block and the aforementioned three components, ensuring the cooling and insulation effect of the mixed rubber pipe.

[0030] 6. The coolant is pumped into the device under negative pressure. When the mixing tube needs to be replaced, simply replace it with an air pump to evacuate the coolant from all the flow channels. The outer insulation cover can be opened without obstruction at the interface. After replacing the mixing tube, tighten the outer insulation cover and inner insulation plate, and pump the coolant back in to fill all the flow channels. It is safe and convenient. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the device applied to the dispensing module in this embodiment;

[0032] Figure 2 for Figure 1 A magnified view of a section at point A in the middle;

[0033] Figure 3 This is a perspective view of the device used for cooling the dispensing module and suppressing condensation in this embodiment;

[0034] Figure 4 This is an exploded view of the device used for cooling the dispensing module and suppressing condensation in this embodiment;

[0035] Figure 5 This is a top view of the front side of the hinged outer insulation cover and inner insulation board described in this embodiment;

[0036] Figure 6 This is a rear top view showing the movable hinge of the outer insulation cover and inner insulation board described in this embodiment;

[0037] Figure 7 This is a front view of the internal insulation board described in this embodiment;

[0038] Figure 8 This is a schematic diagram of the structure of the cooling base and the heat-conducting block being attached in this embodiment;

[0039] Figure 9 This is a front view of the device used for cooling the dispensing module and suppressing condensation in this embodiment;

[0040] Figure 10 for Figure 9 Sectional view of section DD;

[0041] Figure 11 for Figure 10 A sectional view of section EE;

[0042] Figure 12 for Figure 10 A schematic diagram showing the external insulation cover in the open state;

[0043] Figure 13 This is an exploded view of the inner insulation board, heat-conducting block, semiconductor cooler, cooling base, and sealing end cap described in this embodiment;

[0044] Wherein: 1-Outer insulation cover, 101-Matching hole, 102-Hinge bracket, 103-Return flow channel inlet, 104-Return flow channel outlet, 105-Gap, 106-Return flow channel, 107-First connecting flow channel, 2-Inner insulation plate, 201-Hinge seat, 202-Heat conduction block mounting hole, 203-Insulation inlet channel outlet, 204-Insulation outlet channel inlet, 205-Insulation inlet channel inlet, 206-Insulation outlet channel outlet, 207-Positioning groove, 208-Mounting hole, 209-Insulation inlet channel, 210-Insulation outlet channel, 211-Locking hole, 3-Refrigeration base, 301-Inner end face of refrigeration base, 302-Liquid inlet, 303-Spiral flow channel outlet 304-Converging Flow Channel Inlet, 305-Spiral Flow Channel, 306-Converging Flow Channel, 307-Shaped Groove, 308-Second Connecting Flow Channel, 309-Connecting Groove, 310-Assembly Through Hole, 311-Liquid Outlet, 4-Sealing End Cap, 401-Liquid Inlet, 402-Liquid Outlet, 403-Counterhead Hole, 5-Plug, 501-Oval Plug, 6-Hinge Shaft, 7-Mixing Tube, 8-Heat Conducting Block, 801-Positioning Boss, 802-Heat Absorbing Surface, 803-Heat Dissipating Surface, 9-Semiconductor Cooler, 11-Sealing Ring, 12-Dispensing Needle Assembly, 13-Dispensing Cylinder, 14-Hand-Tightening Screw, 15-Dispensing Connector, 16-Quantitative Pump, 17-Spare Glue Tank.

[0045] Specifically, B is the dispensing hole, and C is the cooling space. Detailed Implementation

[0046] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. For ease of description, only the parts related to the present invention are shown in the drawings, not the entire structure.

[0047] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0048] In the present invention, unless otherwise clearly specified and defined, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through additional features therebetween. Moreover, the first feature being "above", "over" and "on top of" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "beneath" and "underneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or merely indicates that the horizontal height of the first feature is lower than that of the second feature.

[0049] In the description of this embodiment, the orientation or positional relationship terms such as "above", "below", "left" and "right" are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and thus should not be construed as a limitation to the present invention. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0050] Please refer to Figure 1 and Figure 2 , this embodiment provides a device for cooling the dispensing module and suppressing the generation of condensed water. This device is wrapped around the outer circumference of the mixing tube 7, installed and positioned by the frame through the mounting hole 208. A dispensing hole B for connecting the dispensing needle assembly 12 is provided at the lower end. A pumping glue cylinder 13 is provided at the upper end of the dispensing needle assembly 12. The upper end of the mixing tube 7 is connected to the glue supply joint 15, and the glue is accurately extruded by the metering pump 16. A spare glue tank 17 is also provided at the upper end of the metering pump 16.

[0051] Refer to Figure 3 and Figure 4 , the device for cooling the dispensing module and suppressing the generation of condensed water includes an inner insulation board 2, an outer insulation cover 1, a heat conducting block 8 for conducting heat to the mixing tube 7, a semiconductor cooler 9, a refrigeration base 3 and a sealing end cover 4.

[0052] Specifically, refer to Figure 5 and Figure 6 , the inner insulation board 2 is in a "return" shape, surrounded and arranged around the outer cylindrical surface of the mixing tube 7. A heat conducting block mounting hole 202 is provided in the middle for assembling the heat conducting block 8 with the gap 105. A number of heat preservation channels for reducing the temperature difference between the internal refrigeration space and the external space are evenly opened at the front and rear end faces with a uniform spacing. Refer to Figure 12 , the heat preservation channels include a heat preservation inflow channel 209 for introducing the coolant and a heat preservation outflow channel 210 for discharging the coolant.

[0053] As a further solution of this embodiment, refer to Figure 5 and Figure 6Both sides of the insulated outflow channel 210 and the insulated inflow channel 209 are provided with sealing grooves. Specifically, the insulated inflow channel outlet 203, the insulated outflow channel inlet 204, the insulated inflow channel inlet 205, and the insulated outflow channel outlet 206 are all provided with sealing grooves. The sealing grooves are filled with sealing rings 11, so that the inner insulation board 2 and the outer insulation cover 1, and the inner insulation board 2 and the refrigeration base 3 are all sealed and connected, which fully ensures that the coolant flowing inside does not leak.

[0054] See Figure 6 and Figure 13 The inner insulation plate 2 has a threaded hole in the assembly through hole 310 provided with the refrigeration base 3, and the sealing end cover 4, the refrigeration base 3, and the inner insulation plate 2 are stacked and screwed together to lock them tightly.

[0055] See Figure 5 and Figure 10 The outer insulation cover 1 is located outside the mixing pipe 7, and together with the inner insulation plate 2, it seals the cooling space around the mixing pipe 7, leaving a gap 105 between it and the mixing pipe 7. It is also sealed to several ports of the insulation outlet channel 210 and the insulation inlet channel 209, and has several return channels 106 that reduce the temperature difference between the internal cooling space C and the external space. Specifically, the outlet 203 of the insulation inlet channel is connected to the inlet 103 of the return channel, and the outlet 104 of the return channel is connected to the inlet 204 of the insulation outlet channel.

[0056] See Figure 4 and Figure 8 The heat-absorbing surface 802 of the heat-conducting block 8 is attached to the mixing tube 7, and the heat-dissipating surface 803 of the heat-conducting block 8 is attached to the heat-absorbing end of the semiconductor cooler 9, so as to quickly transfer the absorbed heat. The heat-conducting block 8 includes a semi-cylindrical heat-absorbing surface 802, a heat-dissipating surface 803, and positioning bosses 801 set at the four corners. The heat-absorbing surface 802 partially covers the mixing tube 7, and the positioning bosses 801 cooperate with the positioning grooves 207 set in the inner insulation plate 2 to realize the positioning of the heat-conducting block 8.

[0057] Further implementation plans are as follows, see [link / reference] Figure 10 and Figure 12 The heat dissipation end of the semiconductor cooler 9 is attached to the inner end face of the cooling base 3, which quickly transfers the absorbed heat. If necessary, stable sensors are provided at both the heat absorption end and the heat dissipation end of the semiconductor cooler 9 to monitor temperature changes.

[0058] See Figure 13The outer end face of the cooling base 3 is provided with a spiral flow channel 305. The spiral flow channel 305 spirally fills the heat dissipation end of the semiconductor cooler 9 from the inside to the outside, so as to quickly conduct the heat absorbed by the semiconductor cooler 9 to the coolant. It is connected to all spiral flow channel outlets 303 through the dispersion channel. The spiral flow channel outlets 303 are connected to the heat preservation inflow channel 209. The cooling base 3 is also provided with a converging flow channel 306. The inlet 304 of the converging flow channel is connected to the heat preservation outlet channel 210. It collects all the coolant that flows through the spiral flow channel 305, the heat preservation outlet channel 210, the return flow channel 106 and the heat preservation inflow channel 209 from the outlet of the converging flow channel 306.

[0059] More specifically, see Figure 13 The spiral flow channel 305 is provided with a liquid inlet 302 at its center, and the converging flow channel 306 is provided with a liquid outlet 311. The liquid inlet 302 is connected to the liquid inlet 401 of the sealing end cap 4 for coolant to flow in; the liquid outlet 311 is connected to the liquid outlet 402 of the sealing end cap 4 for coolant to be pumped out.

[0060] See Figure 10 and Figure 13 The sealing end cap 4 is tightly fitted to the outer end face of the cooling base 3 to fully seal the spiral flow channel 305 and the converging flow channel 306. The sealing end cap 4 is provided with an inlet 401 facing the center of the spiral flow channel 305 and an outlet 402 facing the converging flow channel 306. The coolant flows in from the inlet 401 and flows out from the outlet 402, carrying away the heat absorbed by the semiconductor cooler 9. Several countersunk holes 403 are also provided around the outer periphery of the sealing end cap 4. The countersunk holes 403 are tightened with screws to the mounting through hole 310 of the cooling base 3 and the threaded hole of the inner insulation plate 2.

[0061] Further implementation plans are as follows, see [link / reference] Figure 1 and Figure 5 The inner insulation board 2 is provided with a hinge seat 201 on one side, and is movably connected to the hinge frame 102 provided on the same side of the outer insulation cover 1 via a hinge shaft 6. The outer insulation cover 1 is provided with a mating hole 101 on the side where the hinge frame 102 is located. The mating hole 101 is aligned with the locking hole 211 provided at the corresponding position of the inner insulation board 2, and the two are locked together by a hand screw 14.

[0062] Further implementation plans are as follows, see [link / reference] Figure 10 and Figure 12 The heat-insulating flow channel is close to the outer wall and far from the inner wall. By being close to the external space and far from the internal cooling space, it can replenish the heat absorbed by the cooling space from the outer wall surfaces of the inner insulation board 2, outer insulation cover 1, and cooling base 3, reduce the heat loss from the outer walls of the three, significantly reduce the temperature difference between the three and the outside air, and prevent the air moisture from liquefying and adhering to the surface of the three.

[0063] A further solution is to keep the insulation channel away from the inner wall and facilitate processing and production. The insulation channel and the return channel 106 are respectively inserted through the inner insulation plate 2 and the outer insulation cover 1 by means of straight openings, and the opening ports are sealed with plugs 5 to prevent coolant leakage.

[0064] A further embodiment is that the coolant can be a liquid coolant or a gaseous coolant.

[0065] A further implementation scheme is that both ends of the return flow channel 106 provided in the outer heat insulation cover 1 are provided with sealing grooves, and sealing rings 11 are filled in the sealing grooves. The sealing rings 11 are tightly fitted with the inner heat insulation board 2 to achieve a sealed connection between the inner heat insulation board 2 and the outer heat insulation cover 1.

[0066] See Figure 13 The cooling base 3 is provided with several dispersing channels that connect to the spiral flow groove 305 and converging channels that connect to the converging flow groove 306. The outflow port of the dispersing channels and the inflow port of the converging channels are provided with sealing grooves. The sealing grooves are filled with sealing rings 11, which are tightly fitted with the inner insulation plate 2 to achieve a sealed connection between the inner insulation plate 2 and the cooling base 3.

[0067] As a further implementation of this embodiment, see [reference] Figure 11 and Figure 13 To avoid the inability of the inner insulation board 2 and the outer insulation cover 1 to connect, the adjacent folding flow channel 106 is provided with a first connecting flow channel 107 in the outer insulation cover 1, or the adjacent insulation flow channel is provided with a second connecting flow channel 308 in the refrigeration base 3. The folding flow channel 106 connected by the first connecting flow channel 107 and the insulation flow channel connected by the second connecting flow channel 308 are connected in series, so that the coolant can pass through the inner insulation board 2, the outer insulation cover 1 and the refrigeration base 3, fill the heat on the outer walls of the three and reduce the temperature difference.

[0068] For a more specific implementation plan, please refer to... Figure 11 The first connecting channel 107 connects two adjacent foldback channels 106 that are spatially blocked by a slotting method, and a waist-shaped block 501 is sealed on the outside of the slot to prevent coolant leakage.

[0069] For a more specific implementation plan, please refer to... Figure 13 The second connecting channel connects two adjacent insulated flow channels that are spatially isolated by a slotting method, and a connecting groove 309 is provided on the outer periphery of the slot, and a sealing ring is filled in to prevent coolant leakage.

[0070] A particularly important aspect is that the internal cooling space formed by the outer insulation cover 1, the inner insulation board 2, and the cooling base 3 stacked and bonded in sequence is separated from the heat-conducting block 8 by air, and the heat-conducting block 8 only makes contact with the positioning groove 207 provided on the inner insulation board 2 through the positioning boss 801.

[0071] Further implementation plans are as follows, see [link / reference] Figure 13 The outer periphery of the spiral flow channel 305 and the converging flow channel 306 are provided with contoured grooves 307, and the contoured grooves 307 are filled with contoured sealing gaskets to make the cooling base 3 and the sealing end cap 4 tightly connected.

[0072] Further implementation plans are as follows, see [link / reference] Figure 2 and Figure 3 The upper surfaces of the outer insulation cover 1 and the inner insulation board 2 are each provided with a semi-circular limiting groove, which clamps and limits the mixing tube 7 to be cooled and insulated. The lower surfaces of the outer insulation cover 1 and the inner insulation board 2 are each provided with a semi-circular dispensing groove, which clamps and limits the dispensing needle assembly 12.

[0073] It is particularly important to note that the coolant is pumped into the device under negative pressure. When the mixing tube 7 needs to be replaced, simply replace it with an air pump to evacuate the coolant from all the flow channels. The outer insulation cover 1 can be opened without obstruction at the interface. After replacing the mixing tube 7, tighten the outer insulation cover 1 and the inner insulation plate 2, and then pump the coolant back in to fill all the flow channels. This is safe and convenient.

[0074] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. For those skilled in the art, various obvious changes, readjustments, and substitutions can be made without departing from the protection scope of the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the claims of the present invention.

Claims

1. A device for cooling a dispensing module and suppressing condensation, characterized in that: include The inner insulation board (2) is arranged around the outer cylindrical surface of the mixing tube (7) and has several insulation channels with uniform spacing to reduce the temperature difference between the internal cooling space and the external space. The insulation channels include an insulation inlet channel (209) for introducing coolant and an insulation outlet channel (210) for discharging coolant. An outer heat insulation cover (1) is provided with a gap (105) on the outside of the mixing pipe (7). It works with the inner heat insulation plate (2) to seal the cooling space around the outer periphery of the mixing pipe (7). It is also connected to several heat insulation outlet channels (210) and heat insulation inlet channels (209) with several return channels (106) that reduce the temperature difference between the internal cooling space and the external space. A heat-conducting block (8) is used to conduct heat to the mixing tube (7). The heat-absorbing surface (802) of the heat-conducting block (8) is attached to the mixing tube (7), and the heat-dissipating surface (803) of the heat-conducting block (8) is attached to the heat-absorbing end of the semiconductor cooler (9), so as to quickly transfer the absorbed heat out. A semiconductor cooler (9) has its heat dissipation end attached to the inner end face of the cooling base (3), which rapidly dissipates the absorbed heat. The cooling base (3) has a spiral flow groove (305) on its outer end face to quickly transfer the heat absorbed by the semiconductor cooler (9) to the coolant. It also has a converging flow groove (306) to gather all the coolant that flows through the spiral flow groove (305), the heat-insulating outflow channel (210), the return flow channel (106), and the heat-insulating inflow channel (209) in sequence. And a sealing end cap (4), which is sealed and fitted to the outer end face of the cooling base (3) to fully seal the spiral flow channel (305) and the converging flow channel (306). The sealing end cap (4) has an inlet (401) facing the center of the spiral flow channel (305) and an outlet (402) facing the converging flow channel (306). The coolant flows in from the inlet (401) and flows out from the outlet (402), carrying away the heat absorbed by the semiconductor cooler (9). The inner insulation board (2) is provided with a hinge seat (201) on one side, and is movably connected to the hinge frame (102) provided on the same side of the outer insulation cover (1) through a hinge shaft (6). The outer insulation cover (1) is provided with a mating hole (101) on the side where the hinge frame (102) is located. The mating hole (101) is aligned with the locking hole (211) provided at the corresponding position of the inner insulation board (2), and the two are locked together by a hand screw (14). The heat-conducting block (8) includes a semi-cylindrical heat-absorbing surface (802), a heat-dissipating surface (803), and positioning bosses (801) at the four corners. The heat-absorbing surface (802) partially covers the mixing tube (7), and the positioning bosses (801) cooperate with the positioning grooves (207) provided on the inner insulation plate (2). The internal cooling space formed by the stacked and fitted outer insulation cover (1), inner insulation board (2), and cooling base (3) is separated from the heat-conducting block (8) by air. The heat-conducting block (8) is only in contact with the positioning groove (207) provided in the inner insulation board (2) by the positioning boss (801). The outer periphery of both the spiral flow channel (305) and the converging flow channel (306) is provided with a contoured groove (307), and the contoured groove (307) is filled with a contoured sealing gasket that seals the cooling base (3) and the sealing end cap (4). The upper surfaces of the outer insulation cover (1) and the inner insulation board (2) are provided with semi-circular limiting grooves, which clamp and limit the mixing tube (7) to be cooled and insulated. The lower surfaces of the outer insulation cover (1) and the inner insulation board (2) are provided with semi-circular dispensing grooves, which clamp and limit the dispensing needle (12) assembly.

2. The device for cooling a dispensing module and suppressing condensation as described in claim 1, characterized in that: The insulated flow channel is located near the outer wall and far from the inner wall.

3. The device for cooling a dispensing module and suppressing condensation as described in claim 1, characterized in that: Both sides of the heat insulation outflow channel (210) and the heat insulation inflow channel (209) are provided with sealing grooves, and the sealing grooves are filled with sealing rings (11) that seal the inner heat insulation board (2) and the outer heat insulation cover (1) and the inner heat insulation board (2) and the cooling base (3).

4. The device for cooling a dispensing module and suppressing condensation as described in claim 1, characterized in that: The outer insulation cover (1) has sealing grooves at both ends of the return flow channel (106), and sealing rings (11) are filled in the sealing grooves. The sealing rings (11) are in close contact with the inner insulation board (2).

5. The device for cooling a dispensing module and suppressing condensation as described in claim 1, characterized in that: The cooling base (3) is provided with several dispersing channels that connect to the spiral flow channel (305) and converging channels that connect to the converging flow channel (306). The outlet port of the dispersing channel and the inlet port of the converging channel are both provided with sealing grooves. The sealing grooves are filled with sealing rings (11), which are tightly fitted with the inner insulation plate (2).

Images