An IC terminal testing fixture

Abstract

This invention discloses an IC terminal testing fixture. The pressure head in the fixture has rolling positioning structures on its four walls, which can cooperate with the inner walls of the through holes in the connecting plate for positioning. Because the ball bearing structure does not generate hard friction during alignment, it does not produce dust, thus preventing foreign matter contamination of the IC product and improving the overall positioning accuracy of the testing fixture. This avoids excessive friction during precision positioning, which could damage the product. The entire working process of the testing fixture includes coarse positioning, fine positioning, and precision positioning. Before precision positioning, the first ball bearing contacts the through hole in the connecting plate, inhibiting the displacement of the second positioning post. This reduces frictional displacement of the IC product, effectively mitigating the drawbacks of large cumulative tolerances during coarse positioning and excessive friction leading to product damage. The pressure head is connected to the connecting plate through rolling elements, which enhances positioning capability and reduces assembly tolerances.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to an IC terminal testing fixture. Background Technology

[0002] The description in this section provides only background information related to the disclosure of this invention and does not constitute prior art.

[0003] In the field of integrated circuits, the number of ICs (i.e., integrated circuit components) is increasing. Chip performance testing requires machines such as sorting machines and testing machines. Fixtures in sorting machines play a role in carrying, moving, and positioning. The strength of the positioning function directly affects the test yield and product appearance. The existing positioning mechanism for testing is as follows: a pressure head picks up the IC and presses it downwards. Positioning hole bushings mounted on the pressure head and positioning posts on the upper part of the connecting plate limit and guide the movement of the pressure head. A pair of positioning posts on the lower part of the connecting plate also cooperate with positioning holes on the test holder. The positioning posts on the upper and lower parts of the connecting plate control the horizontal movement offset of the IC within a fixed tolerance range, and finally, the IC is transferred to the positioning retaining wall of the test holder for performance testing.

[0004] Before the IC is transferred to the test socket positioning barrier, the components are coarsely positioned with large gaps, creating a possibility of horizontal offset in a certain direction. If all components offset to the left, the maximum horizontal offset is 0.09mm. The IC offsets above the inclined segment of the test socket positioning barrier, interfering with the inclined segment and sliding downwards and to the right with friction until it reaches the straight segment of the test socket positioning barrier, at which point the friction disappears. During this process, significant friction is generated between the IC and the inclined segment of the test socket. As ICs become increasingly thinner and lighter, they can no longer withstand this friction, leading to damage to the IC package casing and even destruction of functional areas.

[0005] The existing positioning method has the following disadvantages: each part has dimensional tolerances, and the positioning between them is coarse, with a total of 3 sets of combined tolerances, resulting in a large cumulative tolerance and poor positioning effect; it is necessary to frequently check and measure the size of the positioning hole and replace it in time.

[0006] It should be noted that the above description of the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions of the present invention and facilitating understanding by those skilled in the art. It should not be assumed that the above technical solutions are known to those skilled in the art simply because they have been described in the background section of this invention. Summary of the Invention

[0007] The technical problem to be solved by the present invention is to provide an IC terminal testing fixture to address the shortcomings of the prior art.

[0008] This application discloses an IC terminal testing fixture, including:

[0009] The test socket is provided with a first positioning hole and a test groove capable of accommodating an IC;

[0010] A connecting plate is provided with a through hole, a first positioning post is provided on the lower surface of the connecting plate, and a second positioning post is provided on the upper surface of the connecting plate. The first positioning post is embedded in the first positioning hole to realize that the test seat is installed above the connecting plate.

[0011] The pressing assembly includes a connecting part and a pressing head below it. The connecting part is provided with a second positioning hole that cooperates with the second positioning post. The pressing head adsorbs the IC and can press the IC into the test groove through the through hole of the connecting plate.

[0012] The outer wall of the pressure head is provided with a rolling positioning structure at the position corresponding to the through hole of the connecting plate, and the rolling positioning structure includes:

[0013] Multiple receiving cavities are disposed on the outer wall of the pressure head;

[0014] Multiple sets of rolling elements are disposed within the receiving cavity;

[0015] A fixed cover connected to the outer wall of the pressure head is used to limit the range of movement of the rolling element within the receiving cavity, so that the rolling element can roll within the receiving cavity without shifting.

[0016] Furthermore, in the aforementioned IC terminal test fixture, the rolling element includes a first ball and a plurality of second balls surrounding the first ball, wherein the diameter of the second balls is smaller than that of the first ball.

[0017] Furthermore, in the aforementioned IC terminal testing fixture, the receiving cavity is provided with a track groove capable of accommodating the second ball. The radius of the receiving cavity is the same as the radius of the first ball, and the depth of the track groove is the same as the diameter of the second ball. Half of the first ball is located inside the receiving cavity, and the second ball is located between the first ball and the inner wall of the track groove.

[0018] Furthermore, in the aforementioned IC terminal testing fixture, the fixed cover is provided with a first mounting hole for connecting with the pressure head and a second mounting hole for engaging with the first ball bearing. The diameter of the second mounting hole gradually decreases along the direction away from the first ball bearing, and the surface of the first ball bearing extends out of the second mounting hole and abuts against the inner wall of the through hole of the connecting plate to form a rolling connection.

[0019] Furthermore, in the aforementioned IC terminal test fixture, the diameter ratio of the first ball and the second ball does not exceed 40:1.

[0020] Furthermore, in the aforementioned IC terminal test fixture, the first ball is subjected to a force of 0.59N in the horizontal direction.

[0021] Furthermore, in the aforementioned IC terminal test fixture, one set of the rolling positioning structure includes three sets of rolling elements, and a set of ball positioning structures is installed on the outer wall of each side of the pressure head.

[0022] Furthermore, in the aforementioned IC terminal test fixture, the test groove is provided with a straight section and an inclined section above it.

[0023] Furthermore, the aforementioned IC terminal testing fixture also includes a positioning sleeve inside the second positioning hole.

[0024] This application also discloses a working method using the IC terminal test fixture described above, including the following steps:

[0025] A test fixture is provided, the test fixture comprising:

[0026] The test socket is provided with a first positioning hole and a test groove capable of accommodating an IC;

[0027] A connecting plate is provided with a through hole, a first positioning post is provided on the lower surface of the connecting plate, and a second positioning post is provided on the upper surface of the connecting plate. The first positioning post is embedded in the first positioning hole to realize that the test seat is installed above the connecting plate.

[0028] The pressing assembly includes a connecting part and a pressing head below it. The connecting part is provided with a second positioning hole that cooperates with the second positioning post. The pressing head adsorbs the IC and can press the IC into the test groove through the through hole of the connecting plate.

[0029] The outer wall of the pressure head is provided with a rolling positioning structure at the position corresponding to the through hole of the connecting plate, and the rolling positioning structure includes:

[0030] Multiple receiving cavities are disposed on the outer wall of the pressure head;

[0031] Multiple sets of rolling elements are disposed within the receiving cavity. Each rolling element includes a first ball and multiple second balls surrounding the first ball, wherein the diameter of the second balls is smaller than that of the first ball.

[0032] A fixed cover connected to the outer wall of the pressure head, the fixed cover being used to limit the range of movement of the rolling element within the receiving cavity, so that the rolling element can roll within the receiving cavity without shifting;

[0033] The second positioning hole of the pressing assembly is fitted onto the second positioning post of the connecting plate to achieve coarse positioning during the testing process;

[0034] Next, the pressure head is embedded in the through hole of the connecting plate, and the rolling positioning structure on the pressure head is rolled to the inner wall of the through hole to achieve fine positioning during the test process.

[0035] Finally, the pressure head passes through the through hole of the connecting plate and places the IC into the straight section of the test groove along the test groove to achieve precise positioning during the test process.

[0036] In summary, the structure adopted in the embodiments of the present invention has the following advantages:

[0037] The IC terminal test fixture of this invention features a rolling positioning structure on the four walls of the pressure head. This structure engages with the inner walls of the through holes in the connecting plate for positioning. Because the ball bearing structure does not generate hard friction during alignment, it prevents dust generation, thus avoiding contamination of the IC product by foreign matter. This improves the overall positioning accuracy of the test fixture and prevents product damage due to excessive friction during precision positioning. The entire test fixture operates through three stages: coarse positioning, fine positioning, and precision positioning. Before precision positioning, the ball bearing contacts the through holes in the connecting plate, inhibiting the displacement of the second positioning post. This reduces frictional displacement of the IC product, effectively mitigating the drawbacks of large cumulative tolerances during coarse positioning and excessive friction that could damage the IC product. The pressure head connects to the connecting plate via rolling elements, enhancing positioning capability and reducing assembly tolerances. The rolling contact connection positioning and alignment process is non-frictional and lossless, therefore the dimensions do not change with use, and there is no positioning failure issue. Furthermore, the rolling positioning structure is a two-stage positioning system, resulting in less impact. The first ball bearing experiences a horizontal force of 0.59N. The first ball bearing is made of SUS304 material, which meets the requirements for resistance to deformation. It does not require frequent dimensional checks, but only periodic lubrication, reducing uncertainty and manpower and cost consumption.

[0038] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are for reference and illustration only and are not intended to limit the present invention. Attached Figure Description

[0039] To more clearly illustrate the technical solutions in the embodiments or prior art of this specification, the drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this specification. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0040] Figure 1 This is an exploded view of the IC terminal test fixture in an embodiment of the present invention;

[0041] Figure 2 This is a cross-sectional schematic diagram of the IC terminal testing fixture in an embodiment of the present invention;

[0042] Figure 3 This is a partially enlarged schematic diagram of the IC terminal testing fixture in an embodiment of the present invention;

[0043] Figure 4 This is a schematic diagram of the connecting plate in an embodiment of the present invention;

[0044] Figure 5 This is a cross-sectional view of the connecting plate in an embodiment of the present invention.

[0045] The reference numerals in the above figures are as follows: 1. Test base; 11. First positioning hole; 12. Test groove; 2. Connecting plate; 21. Through hole; 22. First positioning post; 23. Second positioning post; 3. Pressing assembly; 31. Connecting part; 32. Press head; 33. Second positioning hole; 34. Positioning sleeve; 4. IC; 5. Receiving cavity; 51. Track groove; 6. First ball; 7. Second ball; 8. Fixing cover; 81. First mounting hole; 82. Second mounting hole. Detailed Implementation

[0046] To enable those skilled in the art to better understand the technical solutions in this specification, the technical solutions in the embodiments of this specification will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this specification, and not all embodiments. Based on the embodiments in this specification, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this specification.

[0047] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. Furthermore, the accompanying drawings of the present invention are for simple illustrative purposes only and are not depictions of actual dimensions; this is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of protection of the present invention.

[0048] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more of the related listed items.

[0049] Reference Figures 1 to 5 As shown in the figure, this application discloses an IC terminal test fixture, including:

[0050] Test base 1, the test base 1 is provided with a first positioning hole 11 and a test groove 12 that can accommodate IC4;

[0051] The connecting plate 2 has a through hole 21, a first positioning post 22 on its lower surface, and a second positioning post 23 on its upper surface. The first positioning post 22 is embedded in the first positioning hole 11 to realize that the test seat 1 is installed above the connecting plate 2.

[0052] The pressing assembly 3 includes a connecting part 31 and a pressing head 32 below it. The connecting part 31 is provided with a second positioning hole 33 that cooperates with the second positioning post 23. The pressing head 32 adsorbs the IC4 and can penetrate the through hole 21 of the connecting plate 2 to press the IC4 into the test groove 12.

[0053] The outer wall of the pressure head 32 is provided with a rolling positioning structure at the position corresponding to the through hole 21 of the connecting plate 2. The rolling positioning structure includes:

[0054] Multiple receiving cavities 5 are disposed on the outer wall of the pressure head 32;

[0055] Multiple sets of rolling elements are disposed within the receiving cavity 5;

[0056] A fixed cover 8 is connected to the outer wall of the pressure head 32. The fixed cover 8 is used to limit the movement range of the rolling element in the receiving cavity 5, so that the rolling element can roll in the receiving cavity 5 without shifting.

[0057] A receiving cavity 5 for installing the rolling element is provided at a suitable position of the pressure head 32 of the pressure assembly 3. After the rolling element is placed on it, the fixing cover 8 is locked to fix the rolling element and ensure that it will not shift when it rolls to perform its positioning function.

[0058] Specifically, in this embodiment, the rolling element includes a first ball 6 and a plurality of second balls 7 surrounding the first ball 6, wherein the diameter of the second balls 7 is smaller than that of the first ball 6.

[0059] Specifically, in this embodiment, the receiving cavity 5 is provided with a track groove 51 that can accommodate the second ball 7. The radius of the receiving cavity 5 is the same as the radius of the first ball 6, and the depth of the track groove 51 is the same as the diameter of the second ball 7. Half of the first ball 6 is located inside the receiving cavity 5, and the second ball 7 is located between the first ball 6 and the inner wall of the track groove 51.

[0060] Specifically, in this embodiment, the fixed cover 8 is provided with a first mounting hole 81 for connecting with the pressure head 32 and a second mounting hole 82 for cooperating with the first ball 6. The diameter of the second mounting hole 82 gradually decreases along the direction away from the first ball 6, and the surface of the first ball 6 extends out of the second mounting hole 82 and abuts against the inner wall of the through hole 21 of the connecting plate 2 to form a rolling connection.

[0061] In this embodiment, the fixed cover 8 is connected to the pressure head 32 through the first mounting hole 81 by a fastener. The exposed part of the first ball 6 in the second mounting hole 82 contacts the inner wall of the through hole 21 of the connecting plate 2 to form a rolling connection. Because the ball structure does not generate hard friction during alignment, it will not generate dust, which can avoid foreign matter contaminating the IC4 product, improve the overall positioning accuracy of the test fixture, and avoid excessive friction of the product during precision positioning, which could lead to product damage.

[0062] Specifically, in this embodiment, the diameter ratio of the first ball 6 and the second ball 7 does not exceed 40:1. The larger the diameter ratio of the first ball 6 and the second ball 7, the smoother the ball movement. Therefore, the diameter of the second ball 7 is selected from the smallest ball diameter available on the market, 0.05mm. The diameter of the first ball 6, combined with the spatial position of the test head 32, is taken as the maximum feasible value of 2.0mm.

[0063] Specifically, in this embodiment, the first ball bearing 6 experiences a horizontal force of 0.59N. The rolling positioning structure provides two-stage positioning, resulting in less impact. The first ball bearing 6, made of SUS304 material, meets the deformation resistance requirements, eliminating the need for frequent dimensional checks and requiring only periodic lubrication, thus reducing uncertainty and manpower and cost consumption.

[0064] Specifically, in this embodiment, a set of rolling positioning structures includes three sets of rolling elements, and a set of ball positioning structures is installed on the outer wall of each side of the pressure head 32.

[0065] In this embodiment, the track groove 51 has a cross-shaped structure, and multiple second balls 7 occupy half of the first ball 6. One first ball 6 is matched with 14 second balls 7. The second balls 7 cover half of the area of ​​the first ball 6, and the rolling is smooth. A rolling positioning structure includes three sets of rolling elements. Each outer wall of the pressure head 32 is equipped with a ball positioning structure, which plays a role in limiting the horizontal direction and guiding the vertical direction.

[0066] Specifically, in this embodiment, the test groove 12 has a straight section and an inclined section above it. The straight section of the test groove 12 is used to place the IC4 product to be tested, and the inclined section above the straight section is to avoid friction between the IC4 product and the test groove 12 during the precision positioning process.

[0067] Specifically, in this embodiment, a positioning sleeve 34 is also provided inside the second positioning hole 33.

[0068] This embodiment also provides a working method using the IC4 terminal test fixture described above, including the following steps:

[0069] A test fixture is provided, the test fixture comprising:

[0070] Test base 1, the test base 1 is provided with a first positioning hole 11 and a test groove 12 that can accommodate IC4;

[0071] The connecting plate 2 has a through hole 21, a first positioning post 22 on its lower surface, and a second positioning post 23 on its upper surface. The first positioning post 22 is embedded in the first positioning hole 11 to realize that the test seat 1 is installed above the connecting plate 2.

[0072] The pressing assembly 3 includes a connecting part 31 and a pressing head 32 below it. The connecting part 31 is provided with a second positioning hole 33 that cooperates with the second positioning post 23. The pressing head 32 adsorbs the IC4 and can penetrate the through hole 21 of the connecting plate 2 to press the IC4 into the test groove 12.

[0073] The outer wall of the pressure head 32 is provided with a rolling positioning structure at the position corresponding to the through hole 21 of the connecting plate 2. The rolling positioning structure includes:

[0074] Multiple receiving cavities 5 are disposed on the outer wall of the pressure head 32;

[0075] Multiple sets of rolling elements are disposed within the receiving cavity 5. Each rolling element includes a first ball 6 and a plurality of second balls 7 surrounding the first ball 6. The diameter of the second balls 7 is smaller than that of the first ball 6.

[0076] A fixed cover 8 is connected to the outer wall of the pressure head 32. The fixed cover 8 is used to limit the movement range of the rolling element in the receiving cavity 5, so that the rolling element can roll in the receiving cavity 5 without shifting.

[0077] The second positioning hole 33 of the pressing assembly 3 is fitted onto the second positioning post 23 of the connecting plate 2 to achieve coarse positioning during the testing process;

[0078] Next, the pressure head 32 is embedded in the through hole 21 of the connecting plate 2, and the rolling positioning structure on the pressure head 32 is rolled to the inner wall of the through hole 21 to achieve fine positioning during the test process.

[0079] Finally, the pressure head 32 penetrates the through hole 21 of the connecting plate 2 and places the IC4 into the straight section of the test groove 12 along the test groove 12 to achieve precise positioning during the test process.

[0080] With the above structure, the four walls of the pressure head 32 in the test fixture are provided with a rolling positioning structure, which can cooperate with the inner wall of the through hole 21 of the connecting plate 2 for positioning. Because the ball structure does not generate hard friction during alignment, it will not generate dust, which can avoid foreign matter contaminating the IC4 product, improve the overall positioning accuracy of the test fixture, and avoid excessive friction of the product during precision positioning, which could lead to product damage. The entire working process of the test fixture includes three positioning processes: First, the second positioning hole 33 of the pressure component 3 is fitted onto the second positioning post 23 of the connecting plate 2 through the positioning bushing to achieve coarse positioning in the testing process; then, the pressure head 32 is embedded in the through hole 21 of the connecting plate 2, and the rolling positioning structure on the pressure head 32 is rolled and connected with the inner wall of the through hole 21 to achieve fine positioning in the testing process; finally, the pressure head 32 penetrates the through hole 21 of the connecting plate 2 and places the IC4 into the straight section of the test groove 12 along the test groove 12 to achieve precision positioning in the testing process. Before precision positioning, the first ball 6 contacts the through hole 21 of the connecting plate 2, inhibiting the displacement of the second positioning post 23. This reduces the frictional displacement of the IC4 product, effectively mitigating the drawbacks of large cumulative tolerances in coarse positioning and excessive friction leading to product damage. The test fixture provided in this embodiment, with the pressure head 32 connected to the connecting plate 2 via rolling elements, improves positioning capability and reduces assembly tolerances. The maximum offset in the X / Y directions is reduced from 0.09mm to 0.06mm. The positioning and alignment process of the rolling contact connection is non-frictional and lossless, therefore the dimensions will not change with use, and there will be no positioning failure. Furthermore, the rolling positioning structure is a two-stage positioning system, experiencing less impact; the first ball 6 experiences a horizontal force of 0.59N. The first ball 6 is made of SUS304 material, meeting deformation resistance requirements. Frequent dimensional checks are unnecessary; only periodic lubrication is required, reducing uncertainty and manpower and cost consumption.

[0081] Experimental verification:

[0082] Example

[0083] Eighty-six ICs were subjected to repeated pressure tests 12 times using a test fixture with a rolling positioning structure, totaling 1032 ea. The pin mark offset was 87.7 μm, and one IC was chipped. The test data are shown in Table 1.

[0084] Table 1 Tolerances for Test Fixtures with Rolling Positioning Structure

[0085]

[0086] Comparative Example

[0087] The 82 ICs were repeatedly pressure tested 12 times using existing tools, totaling 984 ea. The needle mark offset was 102.9 μm, and 3 ICs were chipped. The experimental data are shown in Table 2.

[0088] Table 2 Existing test fixture tolerances

[0089]

[0090] Experimental results:

[0091] The test results above show that the test fixture provided in this embodiment reduces the assembly tolerance, improves the positioning capability, improves the product yield, and increases the positioning accuracy by 17.3%.

[0092] The content disclosed above is only a preferred and feasible embodiment of the present invention, and is not intended to limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention specification and drawings are included in the scope of the patent application of the present invention.

[0093] The various embodiments in this specification are described in a progressive manner. The same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on describing the differences from other embodiments.

[0094] Although this application has been described by way of examples, those skilled in the art will know that this application has many modifications and variations without departing from the spirit of this application, and it is intended that the appended embodiments include these modifications and variations without departing from this application.

Claims

1. An IC terminal testing fixture, characterized in that, include: The test socket is provided with a first positioning hole and a test groove capable of accommodating an IC; A connecting plate is provided with a through hole, a first positioning post is provided on the lower surface of the connecting plate, and a second positioning post is provided on the upper surface of the connecting plate. The first positioning post is embedded in the first positioning hole to realize that the test seat is installed above the connecting plate. The pressing assembly includes a connecting part and a pressing head below it. The connecting part is provided with a second positioning hole that cooperates with the second positioning post. The pressing head adsorbs the IC and can press the IC into the test groove through the through hole of the connecting plate. The outer wall of the pressure head is provided with a rolling positioning structure at the position corresponding to the through hole of the connecting plate, and the rolling positioning structure includes: Multiple receiving cavities are disposed on the outer wall of the pressure head; Multiple sets of rolling elements are disposed within the receiving cavity. Each rolling element includes a first ball and multiple second balls surrounding the first ball, wherein the diameter of the second balls is smaller than that of the first ball. A fixed cover connected to the outer wall of the pressure head, the fixed cover being used to limit the range of movement of the rolling element within the receiving cavity, so that the rolling element can roll within the receiving cavity without shifting; The working process of the IC terminal test fixture is as follows: The second positioning hole of the pressing assembly is fitted onto the second positioning post of the connecting plate to achieve coarse positioning during the testing process; Next, the pressure head is embedded in the through hole of the connecting plate, and the rolling positioning structure on the pressure head is rolled to the inner wall of the through hole to achieve fine positioning during the test process. Finally, the pressure head passes through the through hole of the connecting plate and places the IC into the straight section of the test groove along the test groove to achieve precise positioning during the test process.

2. The IC terminal testing fixture according to claim 1, characterized in that, The receiving cavity is provided with a track groove capable of accommodating the second ball. The radius of the receiving cavity is the same as the radius of the first ball, and the depth of the track groove is the same as the diameter of the second ball. Half of the first ball is located inside the receiving cavity, and the second ball is located between the first ball and the inner wall of the track groove.

3. The IC terminal testing fixture according to claim 2, characterized in that, The fixed cover is provided with a first mounting hole for connecting with the pressure head and a second mounting hole for engaging with the first ball bearing. The diameter of the second mounting hole gradually decreases along the direction away from the first ball bearing, and the surface of the first ball bearing extends out of the second mounting hole and abuts against the inner wall of the through hole of the connecting plate to form a rolling connection.

4. The IC terminal testing fixture according to claim 1, characterized in that, The diameter ratio of the first ball to the second ball does not exceed 40:

1.

5. The IC terminal testing fixture according to claim 1, characterized in that, The first ball is subjected to a force of 0.59 N in the horizontal direction.

6. The IC terminal testing fixture according to claim 1, characterized in that, One set of the rolling positioning structure includes three sets of rolling elements, and a set of ball positioning structures is installed on the outer wall of each side of the pressure head.

7. The IC terminal testing fixture according to claim 1, characterized in that, The test groove has a straight section and an inclined section above it.

8. The IC terminal testing fixture according to claim 1, characterized in that, A positioning sleeve is also provided inside the second positioning hole.

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