Earphone

Abstract

The invention relates to an earphone, in particular to the technical field of electronic equipment. The first loudspeaker comprises a first vibrating diaphragm, the first vibrating diaphragm is matched with the movement shell to form a first front cavity and a first rear cavity which are located on the two sides of the first vibrating diaphragm, the second loudspeaker comprises a second vibrating diaphragm and a loudspeaker shell, and the second vibrating diaphragm is matched with the loudspeaker shell and the movement shell to form a second front cavity and a second rear cavity which are located on the two sides of the second vibrating diaphragm; the movement shell is provided with a first sound outlet hole used for conducting sound in the first front cavity to the outside of the movement shell and a second sound outlet hole used for conducting sound in the second front cavity to the outside of the movement shell. The second loudspeaker is further provided with a communication hole for communicating the second rear cavity with the outside of the second loudspeaker.

Description

A headset

[0001] The application relates to the technical field of electronic devices, in particular to a headset.

[0002] With the development of acoustic technology, headsets have been widely used in people's daily life. A headset can use multiple loudspeakers to output sound in combination so as to provide a feast for the user's ears. In the use of a headset, different loudspeakers can be responsible for outputting different frequency bands of sound. Generally, multiple loudspeakers emitting different frequency bands of sound can be driven by a single-channel electrical signal or a multi-channel electrical signal. When a single-channel electrical signal is used for driving, the diaphragm of a loudspeaker responsible for outputting a higher frequency band of sound is usually thin, and thus the diaphragm will appear to break when receiving a low-frequency signal due to an excessively large amplitude, affecting the sound quality and the user's experience.

[0003]

[0004] The application provides a headset, which comprises a core shell, a first loudspeaker, a second loudspeaker and a driving circuit, the core shell is used for accommodating the first loudspeaker and the second loudspeaker, the driving circuit is used for driving the first loudspeaker and the second loudspeaker, and the frequency band of sound output by the first loudspeaker is at least partially lower than the frequency band of sound output by the second loudspeaker.

[0005] The first loudspeaker comprises a first diaphragm, the first diaphragm cooperates with the core shell to form a first front cavity and a first rear cavity located on both sides of the first diaphragm, the second loudspeaker comprises a second diaphragm and a loudspeaker shell, and the second diaphragm cooperates with the loudspeaker shell and the core shell to form a second front cavity and a second rear cavity located on both sides of the second diaphragm.

[0006] The core shell is provided with a first sound outlet hole for conducting sound in the first front cavity to the outside of the core shell and a second sound outlet hole for conducting sound in the second front cavity to the outside of the core shell.

[0007] The second loudspeaker is further provided with a communication hole for communicating the second rear cavity with the outside of the second loudspeaker.

[0008] In some embodiments, when the driving circuit drives the second loudspeaker, the working frequency of the driving circuit comprises a frequency band not higher than 200 Hz.

[0009] In some embodiments, the driving circuit is arranged to drive the first loudspeaker and the second loudspeaker simultaneously by using the same digital-to-analog conversion circuit.

[0010] ​​​In some embodiments, the resonance frequency of the second speaker is not lower than 6 kHz.

[0011] In some embodiments, the acoustic resistance at the communication hole is 5*108 Pa·s / m-1.3*109 Pa·s / m, and / or an acoustic resistance mesh is arranged at the communication hole.

[0012] In some embodiments, the second speaker is further provided with a second magnetic circuit system, the communication hole penetrates through the second magnetic circuit system, and the aperture of the communication hole is 0.8 mm-1.2 mm.

[0013] In some embodiments, in the radial direction of the second diaphragm, the communication hole is arranged centrally relative to the second diaphragm.

[0014] In some embodiments, in a reference plane perpendicular to the axial direction of the first speaker, the orthographic projection of the second speaker on the reference plane at least partially overlaps with the orthographic projection of the first speaker on the reference plane, the axial direction of the second speaker points to the first speaker, and the communication hole is arranged towards the inside of the core shell.

[0015] In some embodiments, the earphone further comprises a communication tube arranged in the core shell, one end of the communication tube communicates with the communication hole, and the other end of the communication tube communicates with the outside of the core shell.

[0016] In some embodiments, the second speaker is located in the first front cavity, and the communication hole communicates the second back cavity and the first front cavity.

[0017] In some embodiments, the audio driving signal output by the driving circuit is arranged to be directly input to the second speaker without frequency division processing.

DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative effort.

[0019] Fig. 1 is a structural schematic diagram of an earphone in some embodiments of the present application;

[0020] Fig. 2 is a structural schematic diagram of the earphone in Fig. 1 from another perspective;

[0021] Fig. 3 is a structural schematic diagram of the earphone in Fig. 1 from yet another perspective;

[0022] Figure 4 is a schematic view of the front profile of the ear of a user or simulator in some embodiments;

[0023] Figure 5 is a schematic view of the earpiece of Figure 1 in a worn state in some embodiments;

[0024] Figure 6 is a cross-sectional view of the earpiece of Figure 1 along line VI-VI in some embodiments;

[0025] Figure 7 is a cross-sectional view of the earpiece of Figure 1 along line VII-VII in some embodiments;

[0026] Figure 8 is a schematic view of the structure of the first housing of Figure 6 in some embodiments;

[0027] Figure 9 is a schematic view of the circuit of the speaker assembly in some embodiments of the present application;

[0028] Figure 10 is a schematic view of the frequency splitting effect of the second speaker 122 of Figure 6 under different frequency splitting processing conditions when the high-pass frequency splitter 1304 is adjusted in some embodiments of the present application;

[0029] Figure 11 is a schematic view of the structure of the second speaker of Figure 7 in some other embodiments;

[0030] Figure 12 is a schematic view of part of the structure of the module of Figure 11 in some other embodiments.

DETAILED DESCRIPTION

[0031] The present application will be described in further detail below with reference to the drawings and embodiments. It is particularly pointed out that the following embodiments are merely for illustration of the present application and do not limit the scope of the present application. Similarly, the following embodiments are only some embodiments of the present application but not all embodiments of the present application, and all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0032] Reference to "embodiments" in this application means that the specific features, structures or characteristics described in connection with the embodiments can be included in at least one embodiment of the present application. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in the present application can be combined with other embodiments.

[0033] The present application describes an earpiece. Please refer to Figures 1, 2 and 3, Figure 1 is a schematic view of the structure of an earpiece in some embodiments of the present application, Figure 2 is a schematic view of the structure of the earpiece of Figure 1 from another perspective, and Figure 3 is a schematic view of the structure of the earpiece of Figure 1 from yet another perspective. The earpiece 100 can include a module 10 and a hook structure 20 connected to the module 10. The module 10 can provide sound to achieve an auditory experience, and of course can also achieve different experiences due to having other functions such as a sound pickup function, a touch function, a press function, a light function, etc. The module 10 can cooperate with the hook structure 20 to achieve wearing.

[0034] Referring to FIG. 4, FIG. 4 is a schematic diagram of a front side profile of an ear of a user or a simulator in some embodiments. The ear 200 can include physiological parts such as an external ear canal 2001, a concha 2002, a cymba 2003, a triangular fossa 2004, an antihelix 2005, a scapha 2006, a helix 2007, and an antitragus 2008. Among them, the external ear canal 2001 has a certain depth and can extend to the eardrum, but for the convenience of description, the external ear canal 2001 can refer to the ear hole of the ear 200 without special indication. In addition, the concha 2002, the cymba 2003, and the triangular fossa 2004 can also have a certain volume and depth. The concha 2002 can be directly communicated with the external ear canal 2001, that is, the ear hole can be considered to be located at the bottom of the concha 2002.

[0035] It can be understood that for users, there can be individual differences between different users, which in turn leads to different sizes of the ear 200 such as shape and size. In order to facilitate description and reduce (or even eliminate) individual differences of different users, a simulator containing a head and its ear (generally including a left ear and a right ear, and here taking one of the ears as an example) 200 can be made based on standards such as ANSI S3.36, S3.25 and IEC: 60318-7, for example, GRAS 45BC KEMAR, HEAD Acoustics, B&K 4128 series or B&K 5128 series, etc., to present the scenario of most users wearing the earphone 100 through the simulator. Taking GRAS KEMAR as an example, the simulator of the ear 200 can be any one of GRAS 45AC, GRAS 45BC, GRAS 45CC or GRAS 43AG. Taking HEAD Acoustics as an example, the simulator of the ear 200 can be any one of HMS II.3, HMS II.3LN or HMS II.3LN HEC.

[0036] It should be noted that in the field of medicine, anatomy, etc., the sagittal plane, the coronal plane and the horizontal plane of the human body or the human body simulator can be defined as three basic planes, and the sagittal axis, the coronal axis and the vertical axis can be defined as three basic axes. Among them, the sagittal plane refers to a plane perpendicular to the ground made along the front-back direction of the body, which divides the human body or the human body simulator into two parts; the coronal plane refers to a plane perpendicular to the ground made along the left-right direction of the body, which divides the human body or the human body simulator into two parts; the horizontal plane refers to a plane parallel to the ground made along the up-down direction of the body, which divides the human body or the human body simulator into two parts. Correspondingly, the sagittal axis refers to an axis perpendicular to the coronal plane along the front-back direction of the body, the coronal axis refers to an axis perpendicular to the sagittal plane along the left-right direction of the body, and the vertical axis refers to an axis perpendicular to the horizontal plane along the up-down direction of the body. Further, the "front side of the ear" in the present application is a concept relative to the "rear side of the ear", the former refers to the side of the ear away from the head, and the latter refers to the side of the ear towards the head, both of which are for the ear 200 of the user or the simulator. Wherein, observing the ear 200 of the human body or the human body simulator along the direction of the coronal axis, as shown in FIG. 4.

[0037] Referring to FIG. 5, FIG. 5 is a schematic diagram of the earphone 100 in some embodiments in a wearing state. The core module 10 is located at the front side of the ear 200 in the wearing state. At least part of the hook structure 20 is located at the rear side of the ear 200 in the wearing state, so that the earphone 100 is hung on the ear 200 in the wearing state.

[0038] In the present application, when describing the process or action of wearing the earphone 100, such as "wearing the earphone 100", "the earphone 100 is in a wearing state" and "in a wearing state", etc., it can be referred to that the earphone 100 is worn on the ear 200. Of course, because different users have individual differences, when the earphone 100 is worn by different users, there may be some differences from the earphone 100 worn on the ear 200 of the simulator, but such differences should be tolerated.

[0039] The core module 10 can be arranged to not block the external auditory canal 2001 in the wearing state, so that the earphone 100 is an "open earphone". It can be understood that the earphone 100 can be in different wearing states, so that the core module 10 can partially block the external auditory canal 2001, but the external auditory canal 2001 is still not blocked.

[0040] Referring to FIG. 1, FIG. 2 and FIG. 3, the core module 10 can have a connecting end CE connected with the hook structure 20 and a free end FE not connected with the hook structure 20. In the wearing state, the free end FE of the core module 10 can extend into the concha cavity 2002, or can only cover at least part of the concha cavity 2002. The core module 10 and the hook structure 20 can be arranged to jointly hold the ear 200 from the front and back of the ear region 200 corresponding to the concha cavity 2002, thereby increasing the resistance of the earphone 100 from falling off the ear 200, and further improving the stability of the earphone 100 in the wearing state.

[0041] The core module 10 can have a thickness direction X, and a length direction Y and a width direction Z perpendicular to the thickness direction X and orthogonal to each other. In some embodiments, the length direction Y can be defined as the direction of the core module 10 approaching or away from the back of the head in the wearing state, the width direction Z can be defined as the direction of the core module 10 approaching or away from the top of the head in the wearing state, and the thickness direction X can be defined as the direction of the core module 10 towards or away from the ear of the user in the wearing state. In some embodiments, the length direction Y can be defined as the direction from the connecting end of the core module 10 to the free end of the core module 10, and the thickness direction X can be defined as the direction of the core module 10 towards or away from the ear of the user in the wearing state. In some embodiments, the free end FE is pressed in the thickness direction X in the concha cavity 2002. For example, the free end FE abuts in the length direction Y and the width direction Z in the concha cavity 2002.

[0042] It should be noted that in the wearing state, in addition to extending into the concha cavity 2002, the free end FE of the core module 10 can also be orthogonally projected on the antihelix 2005, and can also be orthogonally projected on the left and right sides of the head and on the position in front of the ear 200 on the sagittal axis.

[0043] Of course, in other scenarios, at least part of the core module 10 can also be orthogonally projected on the antihelix 2005, and can also be orthogonally projected on the left and right sides of the head and on the position in front of the ear 200 on the sagittal axis.

[0044] In other words, the hook structure 20 can support the core module 10 to be worn to the concha cavity 2002, the antihelix 2005, the front side of the ear 200, etc.

[0045] Referring to FIG. 1, FIG. 2 and FIG. 5, in the wearing state, and viewed in the direction of the coronal axis, the core module 10 can be arranged in a circular shape, an elliptical shape, a rounded square shape, a rounded rectangular shape, etc. Therefore, for ease of description, the present embodiment will be exemplarily described by taking the core module 10 arranged in a rounded rectangular shape as an example. In some embodiments, the length of the core module 10 in the length direction Y can be greater than the width of the core module 10 in the width direction Z.

[0046] The core module 10 can have an inner side IS facing the ear 200 along the thickness direction X in the wearing state, an outer side OS facing away from the ear 200, and a connecting side (e.g., a lower side LS, an upper side US, a rear side RS, etc.) connecting the inner side IS and the outer side OS. Among them, in the wearing state of the core module 10, the upper side US connects the inner side IS and the outer side OS, the lower side LS connects the inner side IS and the outer side OS, the upper side US is closer to the user's head top along the width direction Z, the lower side LS is farther away from the user's head top along the width direction Z, and the rear side RS connects the upper side US and the lower side LS, and can also connect the inner side IS and the outer side OS. The thickness direction X can also be defined as the direction of the core module 10 approaching or moving away from the ear 200 in the wearing state. At least part of the connecting side, for example, the rear side RS, is located in the concha cavity 2002 in the wearing state, and forms a first contact area with the front side of the ear 200 area. That is, the rear side RS can be located at one end of the length direction Y towards the back of the head in the wearing state, and at least partially located in the concha cavity 2002. In some embodiments, the hook structure 20 forms a second contact area with the rear side of the ear 200 area in the wearing state. The second contact area and the first contact area at least partially overlap in the ear thickness direction of the ear 200 area. Further, the core module 10 and the hook structure 20 can jointly hold the ear 200 from the front and back of the ear 200, and the holding force formed is mainly in the form of compressive stress, which is beneficial to improve the stability and comfort of the earphone 100 in the wearing state. In some embodiments, when the core module 10 is arranged in a circular, elliptical or other shape, the connecting side can also refer to the arc side of the core module 10.

[0047] It should be noted that the terms "first", "second", "third", etc. in the present application are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined by the terms "first", "second", "third", etc. can be explicitly or implicitly included at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically limited.

[0048] It can be understood that the core module 10 can also be worn directly or through other means, and can even be connected and cooperated with other structures in cooperation with the hook structure 20 to realize wearing. Further, the function of the core module 10 can not be limited to the embodiments listed in the present application. In some embodiments, the hook structure 20 can be omitted or replaced by other structures.

[0049] In addition, when the wearing manner of the core module 10 changes, the cooperation manner of the core module 10 with the ear part 200 can also change, but in some embodiments, the internal structure and overall structure, external structure, etc. of the core module 10 do not necessarily change. Even in some embodiments, words related to the position, such as the lower side LS, the upper side US, and the rear side RS, etc. do not necessarily form a corresponding relationship with the ear part 200. Of course, in some embodiments, the words such as the connection end CE are only words related to the position, and do not necessarily mean that a certain function is included.

[0050] Furthermore, when the wearing manner of the core module 10 changes, the core module 10 can be worn by cooperating with the hook-shaped structure 20 or other structures at the connection end CE.

[0051] Referring to FIGS. 6 and 7, FIG. 6 is a cross-sectional view of the earphone 100 along line VI-VI in FIG. 1 in some embodiments, and FIG. 7 is a cross-sectional view of the earphone 100 along line VII-VII in FIG. 1 in some embodiments. The core module 10 includes a core shell 11, a speaker assembly 12, and a master control circuit board 13. The core shell 11 can be connected with the hook-shaped structure 20. The core shell 11 can have a mounting space 101 for mounting the speaker assembly 12 and the master control circuit board 13, and of course other electronic elements can also be mounted, which will not be described here. The speaker assembly 12 and the master control circuit board 13 can be arranged in the core shell 11, for example, in the mounting space 101. The master control circuit board 13 can be electrically connected with the speaker assembly 12 for controlling the speaker assembly 12 to work. It can be understood that the core shell 11 serves as the external shell of the core module 10, and the aforementioned inner side IS, outer side OS, and connecting surface (such as the lower side LS, the upper side US, and the rear side RS, etc.) connecting the inner side IS and the outer side OS of the core module 10 are all formed on the core shell 11 as the external surface of the core shell 11. The length direction Y can be defined as the direction in which the core shell 11 approaches or moves away from the back of the head in the wearing state, the width direction Z can be defined as the direction in which the core shell 11 approaches or moves away from the top of the head in the wearing state, and the thickness direction X can be defined as the direction in which the core shell 11 approaches or moves away from the ear of the user in the wearing state. In some embodiments, the length direction Y can be defined as the direction from the connection end of the core shell 11 to the free end of the core module 10, and the thickness direction X can be defined as the direction in which the core shell 11 approaches or moves away from the ear of the user in the wearing state.

[0052] The core shell 11 can include a first shell 111 and a second shell 112 that are buckled to each other along the thickness direction X to form a mounting space 101. The first shell 111 is closer to the ear 200 than the second shell 112 in the wearing state. The first shell 111 and the second shell 112 have a parting surface 102 therebetween to simplify the structure of the core shell 11 and reduce the processing cost. Of course, the core shell 11 can also have other structural forms and is not limited to the embodiments listed in the present application.

[0053] In some embodiments, the core shell 11 can be provided with a first sound outlet 1101 and a second sound outlet 1102 that communicate with the mounting space 101. The first sound outlet 1101 and the second sound outlet 1102 can be respectively matched with the speaker assembly 12, so that the sound waves generated by the speaker assembly 12 can be respectively propagated via the first sound outlet 1101 and the second sound outlet 1102. The first sound outlet 1101 and the second sound outlet 1102 can not be communicated. The provision of two sound outlets can improve the auditory experience of the speaker assembly 12 and avoid interference between multiple speakers.

[0054] Please refer to FIG. 8, which is a structural schematic diagram of the first shell 111 in some embodiments of FIG. 6. In some embodiments, the first sound outlet 1101 and / or the second sound outlet 1102 can be provided on the first shell 111. For example, the first sound outlet 1101 and the second sound outlet 1102 can both be provided on the bottom wall 1111 of the first shell 111. In some embodiments, the bottom wall 1111 can correspond to the inner side IS of the core module 10. When the core module 10 is worn with the free end FE extending into the concha cavity 2002, the portion of the bottom wall 1111 of the core shell 11 corresponding to the inner side IS can have a certain spacing with the concha cavity 2002 due to the certain volume and depth of the concha cavity 2002. Further, the core shell 11 in the wearing state can cooperate with the concha cavity 2002 to form an auxiliary cavity that communicates with the external auditory canal 2001, and the first sound outlet 1101 and the second sound outlet 1102 are at least partially located in the auxiliary cavity. Further, in the wearing state, the sound waves generated by the speaker assembly 12 and propagated out of the first sound outlet 1101 and the second sound outlet 1102 are limited by the auxiliary cavity, that is, the auxiliary cavity can converge the sound waves, so that the sound waves can be more propagated into the external auditory canal 2001, thereby improving the volume and sound quality of the sound heard by the user in the near field, which is conducive to improving the acoustic effect of the earphone 100.

[0055] In some embodiments, the first sound outlet 1101 and the second sound outlet 1102 are closer to the free end FE than to the connecting end CE, so that the first sound outlet 1101 and the second sound outlet 1102 are closer to the external auditory canal 2001 in the wearing state. In some embodiments, since the core module 10 can be arranged to not block the external auditory canal 2001 in the wearing state, the auxiliary cavity can be arranged in a semi-open manner.

[0056] In some embodiments, the first shell 111 includes a first side wall 1112 extending from the edge of the bottom wall 1111 to the side close to the second shell 112. The first sound outlet 1101 and / or the second sound outlet 1102 can not be arranged on the bottom wall 1111, but can be arranged on the side of the first side wall 1112 corresponding to the lower side LS, can also be arranged at the corner between the first side wall 1112 and the bottom wall 1111, or can be arranged on other parts of the core shell 11, such as the inner side IS, the lower side LS, or the corner between the inner side IS and the lower side LS.

[0057] Referring to FIGS. 7 and 8, the first shell 111 can be a plastic part, or can be a structure composed of or combined with multiple materials, and can also be a shell structure made of other materials. In some embodiments, the pressure relief hole 1103 and / or the tuning hole 1104 can be arranged on the first side wall 1112, i.e., the pressure relief hole 1103 and / or the tuning hole 1104 can be arranged on the upper side US or the lower side LS of the core shell 11. Further, a sound resistance net and / or a protective steel net can be arranged at the pressure relief hole 1103 and / or the tuning hole 1104.

[0058] It can be understood that the acoustic holes such as the pressure relief hole 1103 and the tuning hole 1104 can be adjusted according to the needs of those skilled in the art and arranged on the core shell 11, such as the first shell 111. For example, the pressure relief hole 1103 and the tuning hole 1104 can be arranged on the first shell 111 at the position cooperating with the speaker assembly 12, and are not limited to the positions listed herein. For example, the pressure relief hole 1103 and the tuning hole 1104 can be arranged on the first side wall 1112 at the position cooperating with the speaker assembly 12, and are not limited to the positions listed herein. For example, the pressure relief hole 1103 and the tuning hole 1104 can be arranged on opposite sides of the first side wall 1112 along the width direction Z, respectively.

[0059] In addition, since the first sound outlet hole 1101, the pressure relief hole 1103 and the tuning hole 1104 can be arranged on the first housing 111, the structure of the first housing 111 is simpler, which is conducive to reducing the processing cost. In addition, since the pressure relief hole 1103 and the tuning hole 1104 are arranged on opposite sides of the first side wall 1112 along the width direction Z, the parting surface 102 can be symmetrically arranged with respect to a reference surface perpendicular to the width direction Z, which is conducive to improving the appearance quality of the movement module 10.

[0060] Furthermore, the acoustic holes can not be limited to the pressure relief hole 1103 and the tuning hole 1104, and can also include other acoustic holes cooperating with the loudspeaker assembly 12. In some embodiments, at least one of the pressure relief hole 1103 and the tuning hole 1104 can be omitted.

[0061] Referring to FIG. 6, the second housing 112 can be made of plastic, or can be made of a structure composed or combined of multiple materials, and can also be made of other materials. The second housing 112 and the parting surface 102 between the first housing 111, for example, the first side wall 1112, extend or bend to the side of the first housing 111 in the direction close to the free end FE. The second housing 112 can include a top wall 1121 opposite to the first housing 111, for example, the bottom wall 1111, and a second side wall 1122 connected to the top wall 1121 and buckled with the first housing 111, for example, the first side wall 1112.

[0062] It can be understood that, due to the arrangement form of the second side wall 1122, the free end FE is arranged in a tapered manner away from the connection end CE, which is convenient for cooperating with the contour of the user's ear and improves the wearing experience.

[0063] Referring to FIGS. 6 and 7, the loudspeaker assembly 12 can generate sound waves after being powered on, and can propagate out through the first sound outlet hole 1101 and / or the second sound outlet hole 1102 to enter the external auditory canal 2001. The loudspeaker assembly 12 can be coupled with the master control circuit board 13 to allow working under the control of the master control circuit board 13. The loudspeaker assembly 12 can include a first loudspeaker 121 and a second loudspeaker 122 arranged in the movement housing 11, for example, the mounting space 101. The first loudspeaker 121 and the second loudspeaker 122 can be coupled with the master control circuit board 13 to allow working under the control of the master control circuit board 13. The sound waves generated by the first loudspeaker 121 can propagate out through the first sound outlet hole 1101. The sound waves generated by the second loudspeaker 122 can propagate out through the second sound outlet hole 1102. In some embodiments, the sound waves generated by the first loudspeaker 121 can also propagate out through the acoustic holes such as the pressure relief hole 1103 and the tuning hole 1104, and of course, only one of the pressure relief hole 1103 or the tuning hole 1104 can cooperate with the first loudspeaker 121.

[0064] Referring to FIGS. 6 and 7, the first speaker 121 can be fixed in the core casing 11, and an axial direction of the first speaker 121 can be arranged along the thickness direction X. In some embodiments, the first speaker 121 can be fixed on the first casing 111, for example, the bottom wall 1111, and of course, can also be fixed on the first side wall 1112 or other parts of the core casing 11.

[0065] In some embodiments, the first speaker 121 is arranged in a strip structure, matching the core casing 11, for example, the mounting space 101, that is, the first speaker 121 can be arranged to extend in a direction from the connecting end CE to the free end FE, so as to facilitate arranging a first speaker 121 large enough in the core casing 11, for example, the mounting space 101, thereby enhancing the sound volume generated by the earphone 100, optimizing the arrangement, and improving the space utilization.

[0066] Referring to FIG. 7, the first speaker 121 can include a first diaphragm 1211 for vibrating and sounding, and can also include a first magnetic circuit system for driving the first diaphragm 1211 to vibrate and sound, and a support for bearing the first diaphragm 1211 and the first magnetic circuit system, and the technical principle of the first magnetic circuit system driving the first diaphragm 1211 to vibrate and sound is within the understanding of those skilled in the art, and will not be described here.

[0067] The first speaker 121 is arranged in the core casing 11 (for example, in the mounting space 101) and cooperates with the core casing 11 to form a first front cavity 1201 in front of the first diaphragm 1211 of the first speaker 121, and a first rear cavity 1202 behind the first diaphragm 1211, the front side of the first diaphragm 1211 refers to the side of the first diaphragm 1211 away from the first magnetic circuit system, and the rear side of the first diaphragm 1211 refers to the side of the first diaphragm 1211 towards the first magnetic circuit system. In some embodiments, the first front cavity 1201 is located on the side of the first speaker 121 towards the inner side IS of the core casing 11, for example, the side towards the bottom wall 1111 of the first casing 111, and the first rear cavity 1202 is located on the side of the first speaker 121 away from the inner side IS, for example, the side away from the bottom wall 1111 of the first casing 111. In some embodiments, the first front cavity 1201 can be in communication with the first sound outlet 1101, so that the sound waves generated by the first speaker 121 can be propagated through the first sound outlet 1101.

[0068] Referring to FIG. 9, FIG. 9 is a circuit schematic diagram of the loudspeaker assembly 12 in some embodiments of the present application. The loudspeaker assembly 12 can have a first connection terminal 1301 and a second connection terminal 1302 electrically connected with the master circuit board 13 respectively. The first loudspeaker 121 can be connected in series between the first connection terminal 1301 and the second connection terminal 1302, and thus can make sound under the control of the master circuit board 13. In some embodiments, the loudspeaker assembly 12 can further include a low-pass frequency divider 1303 connected in series with the first loudspeaker 121 between the first connection terminal 1301 and the second connection terminal 1302, so as to realize low-pass filtering through the low-pass frequency divider 1303, so that the first loudspeaker 121 receives only low-frequency electrical signals (of course, when the low-pass frequency divider 1303 does not divide the audio driving signal, the audio driving signal is the electrical signal input to the first loudspeaker 121), and thus the first loudspeaker 121 outputs more low-frequency sound. In some embodiments, the audio driving signal is provided by the master circuit board 13, and the low-pass frequency divider 1303 can divide the audio driving signal provided by the master circuit board 13 to the first loudspeaker 121 by one order, so as to reduce the circuit complexity. In some embodiments, the low-pass frequency divider 1303 can include a frequency dividing inductor L. The number of frequency dividing inductors L can be at least one, and at this time the low-pass frequency divider 1303 can divide the audio driving signal provided by the master circuit board 13 to the first loudspeaker 121.

[0069] In the present application, the low-pass frequency divider 1303 can be a one-order frequency divider or a multi-order frequency divider. In some embodiments of the present application, the low-pass frequency divider 1303 is a one-order frequency divider, i.e., the low-pass frequency divider 1303 includes one frequency dividing inductor L. Thus, the design of the low-pass frequency divider 1303 is simpler and the cost is lower. Moreover, when the number of frequency dividing inductors L is selected, the number of frequency dividing inductors L of the one-order frequency divider is less, and thus the occupation of the movement shell 11 such as the mounting space 101 is reduced, so that the movement module 10 is smaller, and when cooperating with the master circuit board 13, the requirement for the master circuit board 13 is reduced, so that the master circuit board 13 is smaller.

[0070] In some embodiments, the audio driving signal provided by the master circuit board 13 can be directly transmitted to the first loudspeaker 121. That is, the audio driving signal can be directly input to the first loudspeaker 121 without frequency division processing. In some embodiments, the frequency range of the audio driving signal can be the same as the working frequency range of the first loudspeaker 121.

[0071] In some embodiments, the main control circuit board 13 comprises a driving circuit 132, the driving circuit 132 is connected with the first speaker 121 and the second speaker 122 to drive the first speaker 121 and the second speaker 122 to work. In some embodiments, the driving circuit 132 can comprise a digital-to-analog conversion circuit 1321, the first speaker 121 and the second speaker 122 are connected with the digital-to-analog conversion circuit 1321. The driving of the first speaker 121 and the second speaker 122 is realized through the digital-to-analog conversion circuit 1321. That is, the driving circuit 132 can input the same audio driving signal to the first speaker 121 and the second speaker 122 to drive the first speaker 121 and the second speaker 122 to work.

[0072] The second speaker 122 is arranged in the mounting space 101 of the core housing 11. Referring to FIGS. 6 and 7, the second speaker 122 can be fixed on the first housing 111, for example, the bottom wall 1111, at this time, the axial direction of the second speaker 122 can be along the thickness direction X. In some embodiments, the second speaker 122 can be located in the first front cavity 1201 of the first speaker 121, at this time, the axial direction of the first speaker 121 and the axial direction of the second speaker 122 are parallel. In other embodiments, the second speaker 122 can of course be fixed on the first side wall 1112 or other parts of the core housing 11, and the axial direction of the second speaker 122 can of course be arranged transversely to the thickness direction X.

[0073] In some embodiments, the second speaker 122 can be embedded in the inner wall of the core housing 11. For example, a groove can be formed on the inner wall of the core housing 11 to accommodate the second speaker 122, so as to realize the embedded arrangement of the second speaker 122. Referring to FIG. 7, the groove accommodating the second speaker 122 can be formed on the bottom wall 1111 of the first housing 111, at this time, in the wearing state, the second speaker 122 is located on the inner wall of the aforementioned inner side IS of the core module 10, and the second speaker 122 is closer to the ear of the user. For another example, the groove accommodating the second speaker 122 can be formed on the inner wall of the lower side or each connecting surface of the aforementioned core module 10, so as to adapt to different wearing situations and bring better auditory experience to the user.

[0074] Referring to FIG. 7, the second speaker 122 can comprise a second diaphragm 1221 for vibrating and sounding, a second magnetic circuit system 1222 for driving the second diaphragm 1221 to vibrate and sound, and a speaker housing 1223 for carrying and mounting the second diaphragm 1221 and the second magnetic circuit system 1222. The technical principle of the second magnetic circuit system 1222 driving the second diaphragm 1221 to vibrate and sound is understood within the scope of the person skilled in the art, and will not be described here.

[0075] The second speaker 122 is located in the movement housing 11 (e.g., the mounting space 101) and cooperates with the movement housing 11. The front side of the second diaphragm 1221 of the second speaker 122 cooperates with the movement housing 11 to form a second front cavity 1203, and the back side of the second diaphragm 1221 cooperates with the speaker housing 1223 to form a second back cavity 1204. The front side of the second diaphragm 1221 refers to the side of the second diaphragm 1221 facing away from the second magnetic circuit system 1222, and the back side of the second diaphragm 1221 refers to the side of the second diaphragm 1221 facing toward the second magnetic circuit system 1222. When the second speaker 122 is located on the inner wall of the corresponding inner side surface IS of the movement module 10, the second front cavity 1203 is located on the side of the second speaker 122 facing the inner side surface IS, and the second back cavity 1204 is located on the side of the second speaker 122 facing away from the inner side surface IS.

[0076] The second front cavity 1203 can be in communication with the second sound hole 1102, so that the sound waves generated by the second speaker 122 can be propagated through the second sound hole 1102. In some embodiments, the movement housing 11 can include a structure such as a partition plate arranged between the second speaker 122 and the first speaker 121 to isolate the cavities coupled to the first speaker 121 and the cavities coupled to the second speaker 122, so that the first sound hole 1101 is only in communication with the first front cavity 1201, and the second sound hole 1102 is only in communication with the second front cavity 1203. In some embodiments, the second speaker 122 can be farther from the connection end CE than from the free end FE to cooperate with the second sound hole 1102.

[0077] In some embodiments, the speaker housing 1223 is a housing structure that is different from the movement housing 11, so as to flexibly mount the second speaker 122 on the movement module 10. In some embodiments, the speaker housing 1223 includes a support member carrying the second diaphragm 1221 and the second magnetic circuit system 1222, and a cover connected to the movement housing 11 to fix the second speaker 122, and the cover is provided with a sound passage hole in communication with the second sound hole 1102. In some embodiments, the speaker housing 1223 only includes a support member carrying the second diaphragm 1221 and the second magnetic circuit system 1222, and is connected to the movement housing 11 through the support member to fix the second speaker 122.

[0078] The frequency range of the sound output by the first speaker 121 is at least partially lower than the frequency range of the sound output by the second speaker 122. In some embodiments, the frequency range of the sound output by the first speaker 121 can be entirely lower than the frequency range of the sound output by the second speaker 122. In other embodiments, the frequency range of the sound output by the first speaker 121 partially overlaps with the frequency range of the sound output by the second speaker 122, and the maximum frequency of the sound output by the first speaker is lower than the maximum frequency of the sound output by the second speaker, such that the frequency band of the sound output by the second speaker 122 can be partially greater than the frequency band of the sound output by the first speaker 121.

[0079] In some embodiments, the frequency range of the sound output by the first speaker 121 can include 20Hz-5kHz, and the frequency range of the sound output by the second speaker 122 can include 5kHz-20kHz. In some embodiments, the frequency range of the sound output by the first speaker 121 and the frequency range of the sound output by the second speaker 122 can have different standards based on actual conditions, for example, the frequency range of the sound output by the first speaker 121 can also be a frequency range not higher than 1kHz, such as 1Hz-1kHz, 100Hz-800Hz, etc.

[0080] In some embodiments, the frequency range of the sound output by the first speaker 121 can be a low frequency band or a low-middle frequency band, and the frequency range of the sound output by the second speaker 122 can be a high frequency band or a middle-high frequency band. In turn, the first speaker 121 can be referred to as a low frequency speaker, and the second speaker 122 can be referred to as a high frequency speaker. The low frequency band can be at least part of a frequency band of generally 20Hz to 500Hz, or at least part of a frequency band of generally 20Hz to 3kHz, and the high frequency band can be at least part of a frequency band of generally 5kHz to 20kHz, or at least part of 6kHz to 16kHz. The middle frequency band can be between the low frequency band and the high frequency band, and can also partially overlap with the low frequency and / or high frequency band. In turn, the low-middle frequency band can be the combination of the low frequency band and the middle frequency band, and the middle-high frequency band can be the combination of the middle frequency band and the high frequency band.

[0081] It can be understood that the above-mentioned frequency band division is only given as an example to roughly give the interval. The definition of the above-mentioned frequency band can change with different industries, different application scenarios and different classification standards. For example, in some other application scenarios, the low frequency band refers to a frequency band of generally 20Hz to 80Hz, the low-middle frequency band can refer to a frequency band of generally 80Hz-160Hz, the middle frequency band can refer to a frequency band of generally 160Hz to 1280Hz, the middle-high frequency band can refer to a frequency band of generally 1280Hz-2560Hz, and the high frequency band can refer to a frequency band of generally 2560Hz to 120kHz.

[0082] In some embodiments, the main control circuit board 13 can provide the same audio driving signal for the first speaker 121 and the second speaker 122, that is, the frequency of the electrical signal received by the first speaker 121 and the second speaker 122 can be the same, and at this time, the second diaphragm 1221 of the second speaker 122 can vibrate under the electrical signal of the frequency band not higher than 200 Hz. If the first speaker 121 is the aforementioned low-frequency speaker and the second speaker 122 is the aforementioned high-frequency speaker, the frequency range of the sound output by the first speaker 121 is at least partially lower than the frequency range of the sound output by the second speaker 122, that is, the sound output effect of the first speaker 121 is good when the frequency band of the sound output by the first speaker 121 is in the lower frequency band, and the sound output effect of the second speaker 122 is better when the frequency band of the sound output by the second speaker 122 is in the higher frequency band.

[0083] In some embodiments, on a reference surface perpendicular to the axial direction of the first speaker 121, the orthographic projection of the second speaker 122 on the reference surface at least partially overlaps the orthographic projection of the first speaker 121 on the reference surface. In some embodiments, on a reference surface perpendicular to the axial direction of the first speaker 121, the orthographic projection of the second speaker 122 on the reference surface fully overlaps the orthographic projection of the first speaker 121 on the reference surface, which optimizes the arrangement and improves the space utilization. In some embodiments, the axial direction of the first speaker 121 can be the vibration direction of the first diaphragm 1211. In some embodiments, the axial direction of the second speaker 122 can be directed to the first speaker 121. In some embodiments, the axial direction of the second speaker 122 can be parallel to the axial direction of the first speaker 121, that is, the included angle between the axial direction of the second speaker 122 and the axial direction of the first speaker 121 is 0°.

[0084] It can be understood that the positional relationship and cooperation relationship between the second speaker 122 and the first speaker 121, and the positional relationship and cooperation relationship with the movement core shell 11 can also be adjusted and changed, and are not limited to the embodiments listed herein.

[0085] Referring to FIG. 7, the main control circuit board 13 can provide an audio driving signal for the second speaker 122, so that the second diaphragm 1221 of the second speaker 122 can vibrate under the electrical signal of the frequency band not higher than 200 Hz. When the second speaker 122 is the aforementioned high-frequency speaker, the sound output effect of the second speaker 122 is better when the frequency band of the sound output by the second speaker 122 is in the higher frequency band, but is poor when the frequency band of the sound output by the second speaker 122 is in the lower frequency band, which causes the second diaphragm 1221 of the second speaker 122 to vibrate under the electrical signal of the frequency band not higher than 200 Hz. There is a phenomenon of breaking the sound.

[0086] Referring to FIG. 9, the second speaker 122 can be connected in series between the first terminal 1301 and the second terminal 1302, and thus can make sound under the control of the master control circuit board 13. In some embodiments, the speaker assembly 12 can further include a high-pass filter 1304 connected in series with the second speaker 122 between the first terminal 1301 and the second terminal 1302, so as to achieve high-pass filtering through the high-pass filter 1304. In some embodiments, the first terminal 1301 and the second terminal 1302 cooperate to receive an audio driving signal of the master control circuit board 13, and can cause the high-pass filter 1304 to filter the audio driving signal to generate an electrical signal received by the second speaker 122, and can cause the electrical signal received by the second speaker 122 to be attenuated at a frequency band below the filtering point, while causing the sound output by the second speaker 122 to be attenuated in the low-frequency band, so as to improve the phenomenon of broken sound of the sound output by the second speaker 122 at a lower frequency band (e.g., below 200 Hz, such as 50-100 Hz).

[0087] In some embodiments, the filtering point at which the high-pass filter 1304 filters the audio driving signal can be no less than 6 kHz, so that the sound pressure level of the sound output by the second speaker 122 can be attenuated at least below 6 kHz, and the second speaker 122 can obtain a good acoustic output effect at a frequency band above 6 kHz. In some embodiments, the filtering point at which the high-pass filter 1304 filters the audio driving signal can be no less than 8 kHz. In some embodiments, the filtering point can be 8 kHz. Since the first speaker 121 has a poor sound output effect at a higher frequency band, the sound pressure level of the second speaker 122 can be compensated for at a frequency band above 8 kHz. In some embodiments, the filtering point at which the high-pass filter 1304 filters the audio driving signal can be no higher than 9 kHz, so as to avoid affecting the sound output of the second speaker 122 at a higher frequency band, and thus the acoustic output capability of the earphone at a full frequency band can be ensured.

[0088] In some embodiments, the setting of the filtering point can cause the sound pressure level of the sound output by the second speaker 122 to be attenuated by no less than 20 dB at a low frequency band (e.g., below 200 Hz, such as 50-100 Hz), so as to alleviate the phenomenon of broken sound of the output of the second speaker 122 at a lower frequency band. In some embodiments, the setting of the filtering point can cause the sound pressure level of the sound output by the second speaker 122 to be attenuated by no less than 30 dB at a low frequency band (e.g., below 200 Hz, such as 50-100 Hz), so as to alleviate the phenomenon of broken sound of the output of the second speaker 122 at a lower frequency band.

[0089] In some embodiments, the frequency division point can be set near the resonance frequency of the second speaker 122, so that the second speaker 122 can receive the electrical signal below the frequency division point to produce attenuation, thereby improving the phenomenon of broken sound of the output of the second speaker 122 in the low frequency (e.g. below 200 Hz) segment. In some embodiments, the ratio of the resonance frequency of the second speaker 122 to the frequency division point is between 0.75-1.25. In some embodiments, the ratio of the resonance frequency of the second speaker 122 to the frequency division point is between 0.9-1.1.

[0090] In some embodiments, the resonance frequency of the second speaker 122 can be no less than 6 kHz, and the second diaphragm 1221 can vibrate under the electrical signal in the frequency segment of at least 1 kHz-20 kHz. In some embodiments, the resonance frequency of the second speaker 122 can be between 6 kHz-9 kHz.

[0091] In some embodiments, the aforementioned high-pass frequency divider 1304 can be used for first-order frequency division processing of the audio driving signal of the main control circuit board 13 to reduce the circuit complexity, while improving the phenomenon of broken sound of the output of the second speaker 122 in the low frequency segment. At this time, the high-pass frequency divider 1304 can include a frequency division capacitor C, and the number of frequency division capacitors C is one. Such a setting reduces the occupation of the movement shell 11, such as the mounting space 101, so that the movement module 10 is smaller. When cooperating with the main control circuit board 13, the requirements for the main control circuit board 13 can be reduced, so that the main control circuit board 13 is smaller. It can be understood that in other embodiments of the present application, the high-pass frequency divider 1304 can also be a multi-order frequency divider, which can be used for multi-order frequency division processing of the audio driving signal of the main control circuit board 13 to achieve better low frequency filtering effect and further improve the phenomenon of broken sound of the output of the second speaker 122 in the low frequency segment.

[0092] Please refer to FIG. 10, which is a schematic diagram of the frequency division effect of the second speaker 122 under different frequency division processing conditions when adjusting the high-pass frequency divider 1304 in some embodiments of the present application. Among them, curve A is the electrical signal curve received by the second speaker 122 when the high-pass frequency divider 1304 is not set, that is, the audio driving signal curve, curves B, C, D and E are the electrical signal curves received by the second speaker 122 after using the high-pass frequency divider 1304 for first-order frequency division, the capacitance of the frequency division capacitor C of the high-pass frequency divider 1304 in curve B is 2 μF, the capacitance of the frequency division capacitor C of the high-pass frequency divider 1304 in curve C is 4.6 μF, the capacitance of the frequency division capacitor C of the high-pass frequency divider 1304 in curve D is 10 μF, the capacitance of the frequency division capacitor C of the high-pass frequency divider 1304 in curve E is 22 μF, and curve F is the electrical signal curve received by the second speaker 122 after using the high-pass frequency divider 1304 for second-order frequency division.

[0093] Please refer to FIG. 10, near 200Hz, the frequency response amplitude of curve A is about -62dB, the frequency response amplitude of curve B is about -101dB, the frequency response amplitude of curve C is about -98dB, the frequency response amplitude of curve D is about -92dB, and the frequency response amplitude of curve E is about -85dB. That is, compared with curve A representing the audio driving signal without frequency division processing, the amplitude of the signal component below 200Hz in the electrical signal corresponding to curve B is attenuated by about 39dB, the amplitude of the signal component below 200Hz in the electrical signal corresponding to curve C is attenuated by about 36dB, the amplitude of the signal component below 200Hz in the electrical signal corresponding to curve D is attenuated by about 30dB, and the amplitude of the signal component below 200Hz in the electrical signal corresponding to curve E is attenuated by about 23dB. That is, compared with the audio driving signal without frequency division processing (corresponding to curve A), the amplitudes of the signal components below 200Hz in the electrical signals after the excitation signal is processed by one capacitive element (corresponding to curves B, C, D and E) are all greatly attenuated. In this way, the low-frequency component in the electrical signal received by the second loudspeaker 122 is effectively suppressed, and the electrical signal after frequency division processing can effectively reduce the occurrence of the break-up phenomenon when the second loudspeaker 122 outputs sound.

[0094] In some embodiments, the capacitance value of the frequency division capacitor C can correspond to a theoretical frequency division point:

[0095] Wherein, f is the frequency division frequency, z is the rated impedance of the second loudspeaker 122, and C is the capacitance of the frequency division capacitor C. It can be understood that when the number of frequency division capacitors is multiple, the capacitance C calculated by formula (1) is the equivalent capacitance value of the multiple frequency division capacitors.

[0096] Because the structure of the second loudspeaker 122 has a magnetic circuit system and a coil, the coil will act as an inductance in the circuit and affect the frequency division point, resulting in a deviation between the actual frequency division point and the theoretical frequency division point. As shown in FIG. 10, the actual frequency division point corresponding to curve B (i.e., the frequency corresponding to the maximum point Mb of curve B) is near 15kHz, the actual frequency division point corresponding to curve C (i.e., the frequency corresponding to the maximum point Mc of curve C) is near 8kHz, the actual frequency division point corresponding to curve D (i.e., the frequency corresponding to the maximum point Md of curve D) is near 3.4kHz, and the actual frequency division point corresponding to curve E (i.e., the frequency corresponding to the maximum point Me of curve E) is near 1.5kHz. It can be known from formula (1) and curves C, D and E that the actual frequency division point is negatively correlated with the capacitance value of the frequency division capacitor.

[0097] Referring to FIG. 10, the curve F has a relatively large attenuation amplitude at a high frequency band (e.g., above 8 kHz), and the attenuation amplitude of the signal component of the electrical signal obtained by the second-order frequency division processing is also relatively large, which affects the normal output of the second speaker 122 at the high frequency band. In addition, using two frequency division capacitors causes the structure of the main control circuit board 13 to be more complex, thereby increasing the manufacturing cost and volume of the earphone 100. In summary, in order to simplify the circuit and reduce the complexity of the system, and to ensure the normal output of the second speaker 122 at the high frequency band, the high-pass frequency divider 1304 can adopt first-order frequency division, that is, the number of frequency division capacitors connected in series with the second speaker 122 can be one.

[0098] In some embodiments, if the number of frequency division capacitors connected in series with the second speaker 122 is one, in order to improve the frequency division effect and ensure the normal output of the second speaker 122 at the high frequency band, the capacitance value of the frequency division capacitor can range from 4.2 μF to 5.2 μF. In some embodiments, in order to further improve the frequency division effect and ensure the normal output of the second speaker 122 at the high frequency band, the capacitance value of the frequency division capacitor can range from 4.4 μF to 5.0 μF. In some embodiments, in order to further improve the frequency division effect and ensure the normal output of the second speaker 122 at the high frequency band, the capacitance value of the frequency division capacitor can range from 4.5 μF to 4.8 μF.

[0099] In some embodiments, the second back cavity 1204 of the second speaker 122 is in a closed state and does not communicate with the outside, which causes the air pressure between the second front cavity 1203 and the second back cavity 1204 to be unbalanced, and further causes the second speaker 122 to produce a broken sound at a low frequency band (e.g., below 200 Hz, such as 50-100 Hz).

[0100] Referring to FIG. 11, FIG. 11 is a structural schematic diagram of the second speaker 122 in some other embodiments of FIG. 7. The speaker shell 1223 of the second speaker 122 is provided with a communication hole 1205 that communicates the second back cavity 1204 with the outside of the second speaker 122, so as to alleviate the air pressure imbalance between the second front cavity 1203 and the second back cavity 1204 caused by the closed second back cavity 1204, and further to improve the broken sound phenomenon of the second speaker 122 at a low frequency band (e.g., below 200 Hz, such as 50-100 Hz) caused by the air pressure imbalance.

[0101] In some embodiments, the communication hole 1205 penetrates through the speaker housing 1223 to communicate with the second rear cavity 1204. For example, the communication hole 1205 can penetrate through the support frame of the speaker housing 1223 and communicate with the second rear cavity 1204, the support frame being located on the side of the speaker housing 1223 away from the second front cavity 1203. If the second speaker 122 is arranged in the first front cavity 1201 of the first speaker at this time, the communication hole 1205 can make the first front cavity 1201 and the second rear cavity 1204 communicate. Since the frequency range of the sound output by the second speaker 122 is higher, the high-frequency sound waves have the characteristic of sharp directivity, and when the first front cavity 1201 and the second rear cavity 1204 communicate, the sound waves radiated by the second rear cavity 1204 through the communication hole 1205 rarely radiate to the second front cavity 1203, so the arrangement of the communication hole 1205 will not affect the sound waves output by the first speaker 121, thereby improving the breaking phenomenon of the second speaker 122 without affecting the acoustic performance of the first speaker 121.

[0102] In some embodiments, referring to FIG. 12, which is a partial structure diagram of the movement module 10 in FIG. 11 in some other embodiments. The communication hole 1205 can also penetrate through the second magnetic circuit system 1222 and extend to the second diaphragm 1221, so that the second magnetic circuit system 1222 surrounds the communication hole 1205, so that the communication hole 1205 communicates with the second rear cavity 1204, more directly alleviates the phenomenon of air pressure imbalance between the second front cavity 1203 and the second rear cavity 1204, improves the function of the second rear cavity 1204, and thereby can improve the breaking phenomenon.

[0103] In some embodiments, the acoustic resistance at the communication hole 1205 can be 5×10 8 Pa·s / m-1.3×10 9 Pa·s / m, to avoid the problem that too small acoustic resistance causes the radiation sound pressure of the second rear cavity 1204 to increase, so that the sound waves radiated from the first front cavity 1201 of the first speaker 121 superimpose the sound waves radiated from the second rear cavity 1204 of the second speaker 122, causing the phase of the sound waves at the acoustic hole position to be extremely complex, affecting the listening effect, and at the same time preventing the effect that when the acoustic resistance is too large, the air pressure on the front and back sides of the second diaphragm 1221 (i.e. the air pressure between the second front cavity 1203 and the second rear cavity 1204) cannot be balanced, and the breaking problem cannot be improved. In some embodiments, the second speaker 122 can be provided with an acoustic resistance net 1226 in the communication hole 1205 to improve the acoustic resistance at the communication hole 1205 through the acoustic resistance net 1226, and to protect the sensitivity of the second speaker 122.

[0104] In some embodiments, the diameter of the communication hole 1205 can range from 0.8mm to 1.2mm, reducing the impact of the communication hole 1205 being too small on the air tightness, while reducing the impact of the communication hole 1205 being too large on the sensitivity of the second speaker 122. In some scenarios, limiting the diameter of the communication hole 1205 can also reduce the processing difficulty.

[0105] In some embodiments, the communication hole 1205 can be centrally arranged relative to the second speaker 122, for example the second diaphragm 1221, in the radial direction of the second speaker 122, for example the second diaphragm 1221. Here, the radial direction can be perpendicular to the axial direction of the second speaker 122, i.e. the direction perpendicular to the vibration direction of the second diaphragm 1221. Central arrangement means that the distance between the axis of the communication hole 1205 and the axis of the second speaker 122, for example the second diaphragm 1221, in the radial direction of the second speaker 122, for example the second diaphragm 1221, is less than 10% of the length of the second speaker 122, for example the second diaphragm 1221.

[0106] In some embodiments, the communication hole 1205 can not communicate the second back cavity 1204 with the first front cavity 1201, but directly communicate with the acoustic hole arranged on the core housing 11, for example the pressure relief hole 1103, and directly radiate high-frequency sound waves through the acoustic hole, for example the pressure relief hole 1103, so as to further reduce the influence of the sound waves radiated by the second back cavity 1204 on the sound waves radiated by the first front cavity 1201. In some embodiments, the aforementioned acoustic hole communicated with the communication hole 1205 can be part of the first sound outlet hole 1101, or part of the acoustic hole, for example the pressure relief hole 1103, communicated with the first back cavity 1202, or an independent acoustic hole that is distinguished from the presence of the aforementioned other acoustic holes. At this time, referring to FIG. 12, the communication hole 1205 can be communicated with the aforementioned acoustic hole through a communication pipe 123, so as to increase the sound path difference of the sound waves radiated by the second back cavity 1204, attenuate the radiated sound waves, avoid sound leakage, and affect the user's auditory experience.

[0107] It can be understood that the arrangement of the communication hole 1205 can improve the breaking sound phenomenon of the sound output of the second speaker 122 in the low frequency band (for example, below 200Hz, for example, 50-100Hz). Further, the communication hole 1205 can cooperate with the high-pass filter 1304 to improve the aforementioned breaking sound phenomenon. Of course, the aforementioned breaking sound phenomenon can also be improved by the communication hole 1205 without the high-pass filter 1304. In addition, when the communication hole 1205 cooperates with the high-pass filter 1304, the specific arrangement of the communication hole 1205 and the specific arrangement of the high-pass filter 1304 can be adjusted according to the specific situation.

[0108] Referring to FIG. 9, the main control circuit board 13 can be provided with a driving circuit 132 to drive the speaker assembly 12, such as the first speaker 121 and the second speaker 122. Further, the driving circuit 132 can mainly consist of a digital-to-analog conversion circuit 1321, and of course can also include a power amplifier circuit, a processor, etc. The specific manner of forming the driving circuit 132 by using the digital-to-analog conversion circuit 1321 and other circuits will not be described here.

[0109] The driving circuit 132 can be electrically connected with the terminal, such as the first terminal 1301 and the second terminal 1302, other terminals, etc. to achieve electrical connection with the speaker assembly 12, such as the first speaker 121 and the second speaker 122, to drive the speaker assembly 12, such as the first speaker 121 and the second speaker 122. That is, a low-pass frequency divider 1303, such as a frequency dividing inductor L, can be arranged between the driving circuit 132 and the first speaker 121. A high-pass frequency divider 1304, such as a capacitor C, can be arranged between the driving circuit 132 and the second speaker 122.

[0110] In some embodiments, the driving circuit 132 can achieve simultaneous driving of the first speaker 121 and the second speaker 122 by only one digital-to-analog conversion circuit 1321. That is, the driving circuit 132 can input the same audio driving signal to the first speaker 121 and the second speaker 122.

[0111] It can be understood that the earphone 100 can also include electronic components such as a battery, a sensor, an antenna, etc. to ensure normal operation of the earphone 100, and such electronic components can be arranged in the core module 10 and / or the hook-shaped structure 20 as needed, which will not be described here.

[0112] In the several embodiments provided in the present application, it should be understood that the disclosed methods and devices can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the division of the modules or units is merely a logical function division. In actual implementation, another division manner can be used. For example, a plurality of units or components can be combined or integrated into another system, or some features can be ignored or not executed.

[0113] The units described as separate components can or can not be physically separate, and the components shown as units can or can not be physical units, i.e., can be located in one place, or can be distributed on a plurality of network units. Part or all of the units can be selected according to actual needs to achieve the purpose of the present embodiment scheme.

[0114] In addition, each function unit in each embodiment of the present application can be integrated in one processing unit, or each unit can be physically present separately, or two or more units can be integrated in one unit. The integrated unit can be realized in the form of hardware or in the form of a software function unit.

[0115] The above is only the embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation using the content of the present application specification and drawings, or direct or indirect application in other related technical fields, is also included in the patent protection scope of the present application.

Claims

1. An earphone, wherein, The earphone includes a housing, a first speaker, a second speaker, and a driving circuit. The housing is used to house the first speaker and the second speaker, and the driving circuit is used to drive the first speaker and the second speaker. The frequency band of the sound output by the first speaker is at least partially lower than the frequency band of the sound output by the second speaker. The first loudspeaker includes a first diaphragm, which cooperates with the housing to form a first front cavity and a first rear cavity located on both sides of the first diaphragm. The second loudspeaker includes a second diaphragm and a loudspeaker housing, which cooperate with the loudspeaker housing and the housing to form a second front cavity and a second rear cavity located on both sides of the second diaphragm. The movement housing is provided with a first sound outlet for transmitting sound from the first front cavity to the outside of the movement housing, and a second sound outlet for transmitting sound from the second front cavity to the outside of the movement housing; The second speaker is further provided with a communication hole connecting the second rear cavity and the outside of the second speaker.

2. The headphones according to claim 1, wherein, When the driving circuit drives the second speaker, the operating frequency of the driving circuit includes a frequency band not higher than 200Hz.

3. The headphones according to claim 1 or 2, wherein, The driving circuit is configured to drive the first speaker and the second speaker simultaneously through the same digital-to-analog converter circuit.

4. The headphones according to any one of claims 1-3, wherein, The resonant frequency of the second speaker is not lower than 6kHz.

5. The headphones according to claim 1, wherein, The acoustic resistance at the connecting hole is 5×10. 8 Pa·s / m⁻¹.3×10⁻¹ 9 Pa·s / m, and / or, an acoustic barrier is provided at the connecting hole.

6. The headphones according to any one of claims 1-5, wherein, The second loudspeaker is also provided with a second magnetic circuit system, and the connecting hole passes through the second magnetic circuit system. The diameter of the connecting hole is 0.8mm-1.2mm.

7. The earphone according to claim 6, wherein, In the radial direction of the second diaphragm, the connecting hole is centered relative to the second diaphragm.

8. The headphones according to any one of claims 1-7, wherein, On a reference plane perpendicular to the axial direction of the first speaker, the orthographic projection of the second speaker on the reference plane at least partially overlaps with the orthographic projection of the first speaker on the reference plane, and the axial direction of the second speaker points towards the first speaker, with the connecting hole facing the interior of the housing.

9. The headphones according to claim 8, wherein, The earphone also includes a connecting tube disposed inside the housing of the mechanism, one end of the connecting tube being connected to the connecting hole, and the other end being connected to the outside of the housing of the mechanism.

10. The headphones according to claim 8, wherein, The second speaker is located inside the first front cavity, and the connecting hole connects the second rear cavity and the first front cavity.

11. The headphones according to any one of claims 1-10, wherein, The audio drive signal output by the drive circuit is configured to be directly input to the second speaker without undergoing frequency division processing.

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