Semiconductor light-emitting assembly and photoelectric integrated lighting device
By combining wave-shaped heat dissipation fins with a self-cleaning mechanism, the problems of low heat dissipation efficiency and easy clogging of dust screens in semiconductor lighting devices are solved, achieving efficient heat dissipation and low-cost maintenance.
Patent Information
- Application Number
- CN202511924809.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-19
- Publication Date
- 2026-02-06
AI Technical Summary
Existing semiconductor lighting devices have low heat dissipation efficiency, dust filters are prone to clogging, and their structures are redundant, making it difficult to meet the needs of miniaturized and integrated lighting.
The wave-shaped heat dissipation fins increase the heat dissipation area, and the airflow driven by the fan blades and the oscillation of the guide vanes form multi-directional uniform heat convection. The self-cleaning mechanism uses a reciprocating screw to drive a cleaning brush to remove the dust clogging the dust filter.
Significantly improves heat dissipation efficiency, avoids localized overheating, extends LED lamp life, reduces maintenance costs, ensures unobstructed airflow, and maintains heat dissipation performance over the long term.
Smart Images
Figure CN121474530A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application belongs to the technical field of semiconductor lighting, and particularly relates to a semiconductor light-emitting assembly and a photoelectric integrated lighting device. BACKGROUND
[0002] With the rapid development of semiconductor lighting technology (such as LED), it has been widely used in indoor and outdoor lighting, landscape decoration and other fields due to its advantages of energy saving, long service life, fast response and the like. However, the semiconductor light-emitting assembly will generate a large amount of heat when operating at high power, and if the heat is not dissipated in time, it will lead to accelerated light decay, shortened service life and even device damage, which seriously affects the stability and reliability of the lighting device.
[0003] At present, the heat dissipation scheme of the existing semiconductor lighting device mainly adopts the structure of fixed heat dissipation fins or single-direction fan, but has the following defects: firstly, the heat dissipation area of the fixed heat dissipation fins is limited, which is difficult to meet the heat dissipation demand of high-power devices; secondly, the airflow organization formed by the single-direction fan is single, which is easy to form local hot spots in the heat dissipation area, and the heat dissipation efficiency is low; thirdly, the dust screen is usually arranged at the air inlet of the device to prevent dust from entering, but the dust screen is easy to be blocked by dust after long-term use, which leads to reduced air intake and decreased heat dissipation performance, and manual cleaning needs to disassemble the device, which is high in maintenance cost and inconvenient to operate; fourthly, the heat dissipation and cleaning functions are usually designed independently, which is redundant in structure, occupies a large space, and is difficult to meet the miniaturization and integration of lighting demand.
[0004] Therefore, we provide a semiconductor light-emitting assembly and a photoelectric integrated lighting device to solve the above problems. SUMMARY
[0005] The present application aims to provide a semiconductor light-emitting assembly and a photoelectric integrated lighting device, which solves the problems of low heat dissipation efficiency and easy blocking of the dust screen in the prior art by the cooperation of the heat dissipation mechanism and the self-cleaning mechanism.
[0006] To solve the above technical problems, the present application is realized by the following technical scheme.
[0007] The application is a kind of semiconductor light-emitting assembly and photoelectric integrated lighting device, including a lamp box, a semiconductor light-emitting assembly and a light-transmitting cover, the semiconductor light-emitting assembly is arranged in the inner cavity of the lamp box, and the light-transmitting cover is fixedly connected to one side of the lamp box; the inner cavity of the lamp box is provided with a heat dissipation mechanism, the heat dissipation mechanism includes a heat dissipation frame fixedly connected to the inner cavity of the lamp box, a fan blade movably connected to the inner cavity of the heat dissipation frame through a connecting plate and a bearing seat, a rotating shaft rotatably connected to the inner wall of the heat dissipation frame through a bearing seat, and a wind guide blade fixedly connected to the surface of the rotating shaft; the inner cavity of the lamp box is also provided with a self-cleaning mechanism, the self-cleaning mechanism includes a mounting plate fixedly connected to one end of the heat dissipation frame, a reciprocating screw rod rotatably connected to one side of the mounting plate through a bearing seat, a sleeve threadedly connected to the surface of the reciprocating screw rod, and a cleaning assembly fixedly connected to the surface of the sleeve.
[0008] The application is further provided that the semiconductor light-emitting assembly includes a substrate, LED lamp beads, a heat-conducting plate, heat dissipation fins, a driving power supply and a control module, the LED lamp beads are fixedly connected to one side of the substrate, the heat-conducting plate is fixedly connected to the other side of the substrate, the driving power supply is arranged on one side of the substrate, the substrate is made of aluminum alloy and the surface is treated by anodic oxidation, the LED lamp beads are uniformly welded on the front side of the substrate, the heat-conducting plate is closely attached to the back side of the substrate through heat-conducting silicone, the shape of the heat dissipation fins is a wave-shaped fin and the material is copper, so as to improve the heat dissipation effect of the substrate, the driving power supply is an AC-DC constant current driving module, the control module integrates a temperature sensor and a PWM dimming chip, and is integrally injection molded with the substrate, when the LED lamp beads emit light, the heat is transmitted to the heat dissipation fins through the heat-conducting plate, the wave-shaped fin increases the heat dissipation area, the driving power supply supplies power for the LED lamp beads, the control module monitors the temperature in real time and adjusts the driving current to avoid overheating.
[0009] The application is further provided that the shape of the heat dissipation fins is a wave shape, and the control module is integrally arranged with the substrate.
[0010] The application is further provided that a driving motor is fixedly connected to one side of the heat dissipation frame, a first worm is fixedly connected to the output shaft of the driving motor, a first bevel gear is fixedly connected to the surface of the first worm, a second bevel gear is engaged with the surface of the first bevel gear, and the surface of the fan blade is fixedly connected to the shaft center of the second bevel gear, the first worm is fixedly connected to the output shaft of the driving motor through a shaft coupling, the first bevel gear is fixedly connected to the inner side surface of the heat dissipation frame, the first bevel gear is engaged with the second bevel gear, the output shaft of the driving motor drives the fan blade to rotate around the horizontal shaft through the first bevel gear and the second bevel gear, and the rotation of the fan blade drives the airflow to flow at high speed.
[0011] The present invention is further configured such that a support plate is fixedly connected to one side of the heat dissipation frame, a second worm is rotatably connected to the inner wall of the support plate through a bearing seat, a first worm wheel is fixedly connected to one end of the second worm, a guide post is fixedly connected to one side of the first worm wheel, a sliding frame is slidably connected to the surface of the guide post, and a through groove adapted to the sliding frame is opened on one side of the heat dissipation frame.
[0012] The invention is further configured such that a toothed plate is fixedly connected to one side of the sliding frame, a swing gear meshes with the surface of the toothed plate, the axis of the swing gear is fixedly connected to the surface of the rotating shaft, the support plate and the heat dissipation frame are integrally formed, the first worm drives the first worm wheel to rotate, the first worm wheel drives the toothed plate to move through the guide post and the sliding frame, the through groove allows the sliding frame to move in the vertical direction, the toothed plate drives the rotating shaft to rotate through the swing gear, and the rotating shaft drives the guide vane to swing, with the swing amplitude between ±30 degrees.
[0013] The invention is further configured such that a second worm wheel meshes with the surface of the second worm, and the shaft of the second worm wheel is fixedly connected to the surface of the reciprocating lead screw. The first worm drives the second worm to rotate through the first worm wheel, and the second worm drives the reciprocating lead screw to rotate through the second worm wheel. Through the two-stage reduction of the worm wheel and worm, the high-speed rotation is converted into the low-speed, high-torque rotation of the reciprocating lead screw, ensuring the stable operation of the cleaning mechanism.
[0014] The invention is further configured such that an air inlet groove is provided on the back of the light box, and a first dustproof mesh is provided in the inner cavity of the air inlet groove; an air outlet groove is provided on one side of the light box, and a second dustproof mesh is provided in the inner cavity of the air outlet groove. Since external gas enters the inner cavity of the light box through the air inlet groove and then exits through the air outlet groove, external dust is easily blocked on the outer surface of the first dustproof mesh. Since the gas is discharged, dust is not easily present on the surface of the first dustproof mesh. The reciprocating screw drives the cleaning component to move back and forth through the screw sleeve to clean the outer surface of the first dustproof mesh.
[0015] The present invention is further configured such that the cleaning assembly includes a limiting rod, a cleaning box, a spring, and a cleaning brush. The limiting rod is fixedly connected to the surface of the threaded sleeve, and the other end of the limiting rod extends through to the outside of the light box and is fixedly connected to the cleaning box. A spring is fixedly connected to the inner cavity of the cleaning box, and a cleaning brush is fixedly connected to the other end of the spring. The cleaning brush presses against the surface of the first dustproof mesh by the spring, adapting to the undulation of the mesh surface during movement, removing dust particles that clog the pores, and preventing dust from clogging the filter mesh, which would reduce the gas flow of external dust into the inner cavity of the light box and thus reduce the heat dissipation effect.
[0016] The present invention is further configured such that a limiting groove adapted to the limiting rod is formed on one side of the light box.
[0017] The present invention has the following beneficial effects.
[0018] 1. This invention increases the heat dissipation area by using wave-shaped heat dissipation fins. Combined with the airflow driven by the fan blades and the oscillating air curtain of the guide vanes, it forms a multi-directional uniform heat convection, which significantly improves heat dissipation efficiency, avoids local overheating, and extends the life of LED beads. The linkage transmission of the drive motor drives the cleaning component to move back and forth along the surface of the dustproof net. The cleaning brush, which is pressed by a spring, adaptively removes the dust clogging the dustproof net. No manual disassembly and maintenance are required, ensuring unobstructed air intake and reducing maintenance costs.
[0019] 2. This invention uses a single drive motor to drive the cooling fan blades via a first worm gear, while simultaneously linking a self-cleaning mechanism via a second worm gear, thereby reducing energy consumption and structural complexity. The worm gear pair converts high-speed rotation into low-speed, high-torque motion of the guide vanes and the cleaning brush, ensuring reliable operation.
[0020] 3. This invention uses a spring to keep the cleaning brush in close contact with the dustproof mesh, adapting to the undulations of the mesh surface, effectively removing dust that clogs the pores, ensuring stable airflow, and maintaining heat dissipation performance over a long period.
[0021] Of course, any product implementing this invention does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description
[0022] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below.
[0023] Figure 1 This is a perspective view of a semiconductor light-emitting component and an optoelectronic integrated lighting device.
[0024] Figure 2 This is an exploded view of a semiconductor light-emitting component and an optoelectronic integrated lighting device.
[0025] Figure 3 This is a schematic diagram of a semiconductor light-emitting component and a semiconductor light-emitting component in an optoelectronic integrated lighting device.
[0026] Figure 4 This is a diagram showing the engagement of the second worm gear and the second worm wheel in a semiconductor light-emitting component and an optoelectronic integrated lighting device.
[0027] Figure 5 This is a diagram showing the assembly of a first worm gear, guide post, and sliding frame in a semiconductor light-emitting component and optoelectronic integrated lighting device.
[0028] Figure 6 This is a diagram showing the fit between a toothed plate and a oscillating gear in a semiconductor light-emitting component and an optoelectronic integrated lighting device.
[0029] Figure 7 This is a diagram showing the engagement of a first bevel gear and a second bevel gear in a semiconductor light-emitting component and an optoelectronic integrated lighting device.
[0030] Figure 8 This is a schematic diagram of a cleaning component in a semiconductor light-emitting component and an optoelectronic integrated lighting device.
[0031] In the attached diagram: 1. Light box; 2. Semiconductor light-emitting component; 2001. Substrate; 2002. LED beads; 2003. Heat-conducting plate; 2004. Heat sink fins; 2005. Driver power supply; 2006. Control module; 3. Light-transmitting cover; 4. Heat dissipation frame; 5. Fan blade; 6. Shaft; 7. Air guide vane; 8. Mounting plate; 9. Reciprocating lead screw; 10. Sleeve; 11. Cleaning assembly; 1101. Limiting rod; 1102 1103. Cleaning box; 1104. Spring; 1105. Cleaning brush; 12. Drive motor; 13. First worm gear; 14. First bevel gear; 15. Second bevel gear; 16. Support plate; 17. Second worm gear; 18. First worm wheel; 19. Guide post; 20. Sliding frame; 21. Through groove; 22. Tooth plate; 23. Swing gear; 24. Second worm wheel; 25. First dustproof net; 26. Second dustproof net; 27. Limiting groove. Detailed Implementation
[0032] The technical solutions of the present invention will be described below with reference to the accompanying drawings. The described embodiments are only some embodiments of the present invention, and not all embodiments. Example 1
[0033] Please see Figures 1-8 This invention relates to a semiconductor light-emitting component 2 and an optoelectronic integrated lighting device, comprising a light box 1, a semiconductor light-emitting component 2, and a light-transmitting cover 3. The semiconductor light-emitting component 2 is disposed in the inner cavity of the light box 1, and the light-transmitting cover 3 is fixedly connected to one side of the light box 1. The semiconductor light-emitting component 2 includes a substrate 2001, LED beads 2002, a heat-conducting plate 2003, heat dissipation fins 2004, a driving power supply 2005, and a control module 2006. The LED beads 2002 are fixedly connected to one side of the substrate 2001, the heat-conducting plate 2003 is fixedly connected to the other side of the substrate 2001, the driving power supply 2005 is disposed on one side of the substrate 2001, the heat dissipation fins 2004 are wavy in shape, and the control module 2006 is integrated with the substrate 2001.
[0034] Further details: The semiconductor light-emitting component 2 is fixedly disposed in the middle and rear part of the inner cavity of the lamp box 1. The light-transmitting cover 3 is fixedly connected to the front opening of the lamp box 1 by sealant, forming a closed optical cavity. The substrate 2001 is made of aluminum alloy and its surface is anodized. The LED beads 2002 are uniformly soldered to the front side of the substrate 2001. The heat-conducting plate 2003 is tightly attached to the rear side of the substrate 2001 by thermal grease. The heat dissipation fins 2004 on the surface of the heat-conducting plate 2003 are wavy in shape and made of aluminum. 04 extends vertically along the rear side of the heat-conducting plate 2003. The driving power supply 2005 is an AC-DC constant current driving module. The control module 2006 integrates a temperature sensor and a PWM dimming chip and is integrally injection molded with the substrate 2001. When the LED lamp bead 2002 emits light, heat is transferred to the heat dissipation fins 2004 through the heat-conducting plate 2003. The wavy fins increase the heat dissipation area. The driving power supply 2005 supplies power to the LED lamp bead 2002. The control module 2006 monitors the temperature in real time and adjusts the driving current to avoid overheating. Example 2
[0035] Please see Figures 1-8 Based on Embodiment 1, the inner cavity of the light box 1 is provided with a heat dissipation mechanism, which includes a heat dissipation frame 4 fixedly connected to the inner cavity of the light box 1, a fan blade 5 movably connected to the inner cavity of the heat dissipation frame 4 through a connecting plate and a bearing seat, a rotating shaft 6 rotatably connected to the inner wall of the heat dissipation frame 4 through a bearing seat, a guide vane 7 fixedly connected to the surface of the rotating shaft 6, a drive motor 12 fixedly connected to one side of the heat dissipation frame 4, a first worm gear 13 fixedly connected to the output shaft of the drive motor 12, a first bevel gear 14 fixedly connected to the surface of the first worm gear 13, and a second bevel gear 15 meshing with the surface of the first bevel gear 14. The bevel gear 15 is fixedly connected to the surface of the fan blade 5 at its shaft center. A support plate 16 is fixedly connected to one side of the heat dissipation frame 4. A second worm gear 17 is rotatably connected to the inner wall of the support plate 16 through a bearing seat. A first worm wheel 18 is fixedly connected to one end of the second worm gear 17. A guide post 19 is fixedly connected to one side of the first worm wheel 18. A sliding frame 20 is slidably connected to the surface of the guide post 19. A through groove 21 adapted to the sliding frame 20 is opened on one side of the heat dissipation frame 4. A toothed plate 22 is fixedly connected to one side of the sliding frame 20. A swing gear 23 meshes with the surface of the toothed plate 22. The shaft center of the swing gear 23 is fixedly connected to the surface of the rotating shaft 6.
[0036] Further details: The output shaft of the drive motor 12 is fixedly connected to a first worm gear 13 via a coupling. The first worm gear 13 is fixedly connected to a first bevel gear 14 on the inner surface of the heat sink frame 4. The first bevel gear 14 meshes with a second bevel gear 15. The output shaft of the drive motor 12 drives the fan blade 5 to rotate around a horizontal axis via the first bevel gear 14 and the second bevel gear 15. The rotation of the fan blade 5 causes high-speed airflow. The support plate 16 is integrally formed with the heat sink frame 4. The first worm gear 13 drives the first worm wheel 18 to rotate. The first worm wheel 18 drives the toothed plate 22 to move via the guide post 19 and the sliding frame 20. The through slot 21 allows the sliding frame 20 to move vertically. The toothed plate 22 moves via a swinging tooth... Wheel 23 drives shaft 6 to rotate, shaft 6 drives guide vane 7 to swing, swing amplitude is between ±30 degrees. First worm 13 drives second worm 17 to rotate through first worm wheel 18. Second worm 17 drives reciprocating screw 9 to rotate through second worm wheel 24. Through two-stage reduction of worm wheel and worm, high-speed rotation is converted into low-speed, high-torque rotation of reciprocating screw 9, ensuring stable operation of cleaning mechanism. High-speed rotation of fan blade 5 facilitates the introduction of external gas into the inner cavity of lamp box 1. Then the gas comes into contact with heat dissipation fins 2004, quickly dissipating heat from semiconductor light-emitting component 2. Guide vane 7 can guide airflow, so that the heat dissipation air forms a swinging air curtain, further improving the heat dissipation effect. Example 3
[0037] Please see Figures 1-8 Based on Embodiments 1 and 2, the inner cavity of the lamp box 1 is further provided with a self-cleaning mechanism. The self-cleaning mechanism includes a mounting plate 8 fixedly connected to one end of the heat dissipation frame 4, a reciprocating screw 9 rotatably connected to one side of the mounting plate 8 via a bearing seat, a threaded sleeve 10 threadedly connected to the surface of the reciprocating screw 9, a cleaning assembly 11 fixedly connected to the surface of the threaded sleeve 10, a second worm gear 24 meshing with the surface of the second worm 17, and the shaft of the second worm gear 24 fixedly connected to the surface of the reciprocating screw 9. An air inlet groove is provided on the back of the lamp box 1, and a first dustproof mesh 25 is provided inside the air inlet groove. A vent groove is provided on one side of the box 1, and a second dustproof net 26 is provided in the inner cavity of the vent groove. The cleaning component 11 includes a limiting rod 1101, a cleaning box 1102, a spring 1103, and a cleaning brush 1104. The limiting rod 1101 is fixedly connected to the surface of the thread sleeve 10. The other end of the limiting rod 1101 extends through to the outside of the light box 1 and is fixedly connected to the cleaning box 1102. The inner cavity of the cleaning box 1102 is fixedly connected to the spring 1103. The other end of the spring 1103 is fixedly connected to the cleaning brush 1104. A limiting groove 27 adapted to the limiting rod 1101 is opened on one side of the light box 1.
[0038] Further explanation: Since external gas enters the inner cavity of the light box 1 through the air inlet slot and then exits through the air outlet slot, external dust is easily blocked on the outer surface of the first dustproof mesh 25. However, since the gas is discharged, the surface of the first dustproof mesh 25 is not prone to dust accumulation. The reciprocating screw 9 drives the cleaning component 11 to move back and forth through the screw sleeve 10 to clean the outer surface of the first dustproof mesh 25. The cleaning brush 1104 is pressed against the surface of the first dustproof mesh 25 by the spring 1103. During the movement, it adapts to the undulation of the mesh surface and removes dust particles that block the pores, thus preventing dust from clogging the filter and causing external dust to flow into the inner cavity of the light box 1, which would reduce the heat dissipation effect.
[0039] The working principle of this invention is as follows: When the LED bead 2002 is powered on and emits light, the control module 2006 monitors the temperature of the heat sink fins 2004 through the temperature sensor. When the temperature exceeds the threshold, the drive motor 12 starts, and the output shaft drives the first worm gear 13 to rotate. The first worm gear 13 drives the second bevel gear 15 to rotate through the first bevel gear 14. The second bevel gear 15 drives the fan blades 5 to rotate at high speed, drawing outside air into the inner cavity of the lamp box 1 from the air inlet slot through the first dustproof net 25. The airflow flows through the wave-shaped heat sink fins 2004 (increasing the contact area), and the heat is quickly carried away. Finally, the air is discharged from the air outlet slot through the second dustproof net 26.
[0040] During the heat dissipation process, the second worm gear 17 rotates synchronously with the second worm wheel 24. The first worm wheel 18 at the upper end of the second worm gear 17 drives the guide post 19 to rotate. The guide post 19 slides in the sliding frame 20, pushing the sliding frame 20 to move in the vertical direction. The toothed plate 22 on the front side of the sliding frame 20 drives the swing gear 23 to rotate (the swing angle is between ±30 degrees). The swing gear 23 drives the rotating shaft 6 to rotate, and the guide vane 7 swings accordingly, forming a left-right swinging airflow to uniformly cool the heat dissipation fins 2004.
[0041] Simultaneously, the second worm wheel 24 at the lower end of the second worm 17 drives the reciprocating screw 9 to rotate. The reciprocating screw 9 drives the threaded sleeve 10 to move downward. The threaded sleeve 10 pushes the cleaning box 1102 to move back and forth through the limit rod 1101. The spring 1103 inside the cleaning box 1102 is compressed. The cleaning brush 1104 contacts and rubs against the first dustproof mesh 25 to remove surface dust. The cleaning brush 1104 presses the surface of the first dustproof mesh 25 through the spring 1103. During movement, it adapts to the undulation of the mesh surface and removes dust particles that clog the pores. This prevents dust from clogging the filter and causing external dust to flow into the gas flow of the lamp box 1, which would reduce the heat dissipation effect.
[0042] The foregoing has only described certain exemplary embodiments of the present invention by way of illustration. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the foregoing drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.
Claims
1. A semiconductor light-emitting component (2) and an optoelectronic integrated lighting device, comprising a light box (1), a semiconductor light-emitting component (2), and a light-transmitting cover (3), characterized in that: The semiconductor light-emitting component (2) is disposed in the inner cavity of the lamp box (1), and the light-transmitting cover (3) is fixedly connected to one side of the lamp box (1); The inner cavity of the light box (1) is provided with a heat dissipation mechanism, which includes a heat dissipation frame (4) fixedly connected to the inner cavity of the light box (1), a fan blade (5) movably connected to the inner cavity of the heat dissipation frame (4) through a connecting plate and a bearing seat, a rotating shaft (6) rotatably connected to the inner wall of the heat dissipation frame (4) through a bearing seat, and a guide vane (7) fixedly connected to the surface of the rotating shaft (6). The inner cavity of the light box (1) is also provided with a self-cleaning mechanism, which includes a mounting plate (8) fixedly connected to one end of the heat dissipation frame (4), a reciprocating screw (9) rotatably connected to one side of the mounting plate (8) through a bearing seat, a threaded sleeve (10) threadedly connected to the surface of the reciprocating screw (9), and a cleaning component (11) fixedly connected to the surface of the threaded sleeve (10).
2. The semiconductor light-emitting component (2) and optoelectronic integrated lighting device according to claim 1, characterized in that: The semiconductor light-emitting component (2) includes a substrate (2001), LED beads (2002), a heat-conducting plate (2003), heat dissipation fins (2004), a driving power supply (2005), and a control module (2006). The LED beads (2002) are fixedly connected to one side of the substrate (2001), the heat-conducting plate (2003) is fixedly connected to the other side of the substrate (2001), and the driving power supply (2005) is disposed on one side of the substrate (2001).
3. The semiconductor light-emitting component (2) and optoelectronic integrated lighting device according to claim 2, characterized in that: The heat dissipation fins (2004) are wavy in shape, and the control module (2006) is integrated with the substrate (2001).
4. The semiconductor light-emitting component (2) and optoelectronic integrated lighting device according to claim 1, characterized in that: A drive motor (12) is fixedly connected to one side of the heat dissipation frame (4). A first worm (13) is fixedly connected to the output shaft of the drive motor (12). A first bevel gear (14) is fixedly connected to the surface of the first worm (13). A second bevel gear (15) meshes with the surface of the first bevel gear (14). The axis of the second bevel gear (15) is fixedly connected to the surface of the fan blade (5).
5. The semiconductor light-emitting component (2) and optoelectronic integrated lighting device according to claim 1, characterized in that: A support plate (16) is fixedly connected to one side of the heat dissipation frame (4). A second worm (17) is rotatably connected to the inner wall of the support plate (16) through a bearing seat. A first worm wheel (18) is fixedly connected to one end of the second worm (17). A guide post (19) is fixedly connected to one side of the first worm wheel (18). A sliding frame (20) is slidably connected to the surface of the guide post (19). A through slot (21) adapted to the sliding frame (20) is opened on one side of the heat dissipation frame (4).
6. The semiconductor light-emitting component (2) and optoelectronic integrated lighting device according to claim 5, characterized in that: A toothed plate (22) is fixedly connected to one side of the sliding frame (20), and a swing gear (23) meshes with the surface of the toothed plate (22). The axis of the swing gear (23) is fixedly connected to the surface of the rotating shaft (6).
7. A semiconductor light-emitting component (2) and an optoelectronic integrated lighting device according to claim 5, characterized in that: The second worm (17) has a second worm wheel (24) meshing on its surface, and the axis of the second worm wheel (24) is fixedly connected to the surface of the reciprocating screw (9).
8. The semiconductor light-emitting component (2) and optoelectronic integrated lighting device according to claim 1, characterized in that: The back of the light box (1) is provided with an air inlet groove, and the inner cavity of the air inlet groove is provided with a first dustproof net (25). The side of the light box (1) is provided with an air outlet groove, and the inner cavity of the air outlet groove is provided with a second dustproof net (26).
9. A semiconductor light-emitting component (2) and an optoelectronic integrated lighting device according to claim 1, characterized in that: The cleaning assembly (11) includes a limiting rod (1101), a cleaning box (1102), a spring (1103), and a cleaning brush (1104). The limiting rod (1101) is fixedly connected to the surface of the thread sleeve (10). The other end of the limiting rod (1101) extends through to the outside of the light box (1) and is fixedly connected to the cleaning box (1102). The inner cavity of the cleaning box (1102) is fixedly connected to the spring (1103), and the other end of the spring (1103) is fixedly connected to the cleaning brush (1104).
10. A semiconductor light-emitting component (2) and an optoelectronic integrated lighting device according to claim 9, characterized in that: A limiting groove (27) adapted to the limiting rod (1101) is provided on one side of the light box (1).