A polishing apparatus and a polishing method

Abstract

The application discloses a polishing device and a polishing method, relates to the technical field of workpiece polishing, and aims to solve the problem of high surface roughness of a twisted inner hole. The polishing device is used for polishing a workpiece with a complex inner channel, and the polishing device comprises a bearing structure for bearing the workpiece to be polished and a polishing structure provided with a plurality of liquid outlets. When the polishing structure is located in the complex inner channel, the polishing structure is spaced apart from the inner wall of the workpiece, and the liquid outlets are oriented towards the inner wall of the workpiece. A blowing structure is connected with the polishing structure and is used for driving the polishing structure to move in a single direction or reciprocatingly in the complex inner channel. An electrolyte supply structure is in communication with the polishing structure, and the electrolyte supply structure is used for supplying electrolyte for the polishing structure, and the electrolyte is sprayed out through the liquid outlets. A machining power source is electrically connected with the workpiece and the polishing structure respectively, an electromagnet power source is used for being electrically connected with a coil surrounding the outer wall of the workpiece, so that the workpiece has magnetism, and the magnetism of the polishing structure is the same as that of the workpiece.

Description

Technical Field

[0001] This application relates to the field of workpiece polishing technology, and in particular to a polishing apparatus and polishing method. Background Technology

[0002] Twisted internal holes typically refer to internal holes that are curved or zigzag-shaped in space. They are widely used in mechanical parts, such as conformal cooling channels in mold cavities, flow channels in turbochargers, and oil passages in hydraulic components. However, machining twisted internal holes is extremely complex, and manufacturing them using traditional methods is difficult. It requires first dividing the hole into sections, followed by welding or splicing. This method not only generates numerous weld seams but is also prone to leakage problems. Additive manufacturing, as a layer-by-layer digital manufacturing technology, has the significant advantage of being "bottom-up and tool-free," enabling the integral printing of twisted internal holes and external structures. This not only reduces process steps and tooling costs but is also particularly suitable for the production of highly complex parts, directly generating twisted internal holes that are difficult to complete in a single step using traditional cutting and drilling methods.

[0003] However, the surface roughness of twisted inner holes (i.e., the surface roughness of the workpiece's inner wall) produced by additive manufacturing is difficult to meet processing requirements. Therefore, how to reduce the surface roughness of twisted inner holes is a technical problem that the industry urgently needs to solve. Summary of the Invention

[0004] The purpose of this application is to provide a polishing apparatus and polishing method for reducing the roughness of the inner wall of a workpiece with complex internal channels and improving the quality of the workpiece.

[0005] To achieve the above objectives, in a first aspect, this application provides a polishing apparatus. This polishing apparatus is used to polish a workpiece having a complex internal channel penetrating the workpiece, and the workpiece having an inlet and an outlet. The polishing apparatus includes: a support structure, a polishing structure, an air blowing structure, an electrolyte supply structure, a processing power source, and an electromagnet power source. The support structure supports the workpiece to be polished, and the polishing structure has multiple outlets. When the polishing structure is located within the complex internal channel, the polishing structure is spaced apart from the inner wall of the workpiece, and the outlets face the inner wall of the workpiece. The air blowing structure is connected to the polishing structure and is used to drive the polishing structure to move in a single direction or reciprocate within the complex internal channel. The electrolyte supply structure is connected to the polishing structure and is used to provide electrolyte to the polishing structure; the electrolyte is sprayed out through the outlets. The processing power source is electrically connected to both the workpiece and the polishing structure, and the electromagnet power source is electrically connected to a coil surrounding the outer wall of the workpiece to make the workpiece magnetic; the magnetic properties of the polishing structure and the workpiece are the same.

[0006] In one implementation, the polishing structure has a through hole that penetrates the polishing structure along its height direction; along the height direction of the polishing structure, the polishing structure sequentially includes a first processing blade, a substrate, and a second processing blade; the substrate has multiple liquid outlets; the one-dimensional dimensions of the through hole located at the first processing blade and the one-dimensional dimensions of the through hole located at the second processing blade are both smaller than the one-dimensional dimensions of the through hole located at the substrate.

[0007] In one implementation, multiple liquid outlets are arranged in a spiral pattern on the substrate.

[0008] In one implementation, the polishing apparatus further includes a rotating structure for driving the polishing structure to rotate; the rotation direction of the polishing structure is opposite to the direction of the spiral arrangement.

[0009] In one implementation, the height of the liquid outlet ranges from 1.0 mm to 2.0 mm, and the height direction of the liquid outlet is consistent with the height direction of the polishing structure.

[0010] And / or, the inner wall of the substrate is coated with a ceramic insulating material;

[0011] And / or, the transverse cross-sectional shape of the polished structure is circular or elliptical.

[0012] In one implementation, the height of the first machining edge and the sum of the heights of the second machining edge are proportional to the distance between the polishing structure and the inner wall of the workpiece.

[0013] And / or, the sum of the heights of the first and second machining edges ranges from 1 mm to 5 mm; the distance between the polishing structure and the inner wall of the workpiece ranges from 0.1 mm to 0.5 mm.

[0014] In one implementation, the air-blowing structure includes:

[0015] The first air supply component is connected to the first processing blade through the first telescopic tube; the first air supply component provides gas to the polishing structure, and the polishing structure moves towards the outlet of the workpiece under the pushing action of the gas;

[0016] The second air supply component is connected to the second processing blade through the second telescopic tube; the second air supply component provides gas to the polishing structure, and the polishing structure moves towards the inlet of the workpiece under the push of the gas.

[0017] In one implementation, the substrate has a first end near the first machining edge and a second end near the second machining edge;

[0018] The electrolyte supply structure includes:

[0019] An electrolyte supply unit for containing electrolyte; the electrolyte supply unit has an inlet and an outlet.

[0020] The first conveying pipe, at least part of which is fitted inside the first telescopic pipe; the two ends of the first conveying pipe are respectively connected to the inlet of the electrolyte supply component and the first end of the substrate.

[0021] The second conveying pipe, at least part of which is fitted inside the second telescopic pipe; the two ends of the second conveying pipe are respectively connected to the drain port of the electrolyte supply component and the second end of the substrate.

[0022] The collecting component is mounted on the supporting structure, and the workpiece is located in the receiving cavity of the collecting component. An electrolyte delivery port is provided on the bottom of the collecting component near the supporting structure. The electrolyte delivery port is connected to the drain port of the electrolyte supply component through a pipeline.

[0023] In one implementation, the polishing apparatus further includes: a fixture, on which the workpiece is fixed, and the workpiece and the fixture are together mounted on a support structure; the height of the collecting element is greater than the sum of the height of the workpiece and the height of the fixture;

[0024] And / or, the workpiece is the anode and the polishing structure is the cathode.

[0025] Compared with the prior art, the beneficial effects of this application are as follows:

[0026] In the polishing apparatus provided in this application, the magnetism of the polishing structure is the same as that of the workpiece. During the polishing of the inner wall of the workpiece, the workpiece and the polishing structure repel each other, maintaining a constant processing gap throughout the polishing process, thereby ensuring processing stability and precision. Furthermore, during the entire polishing process, the workpiece and the polishing structure remain in a non-contact state, allowing the polishing structure to move freely within complex internal channels without interference, solving the problem of achieving "free" polishing in complex internal channels through electrolytic polishing. In other words, the polishing apparatus provided in this application can not only allow the polishing structure to move with a fixed curvature or segmented linear motion within complex internal channels, but also with any radius of curvature. Furthermore, the electrolyte supply structure provides electrolyte to the polishing structure, which is sprayed onto the inner wall of the workpiece through an outlet. The electrolyte is used to flush the inner wall of the workpiece, achieving electrochemical dissolution of the inner wall surface, thereby reducing the surface roughness of the inner wall. Furthermore, since the air blowing structure is connected to the polishing structure, it drives the polishing structure to move in a single direction or reciprocate within the complex internal channel. This ensures that most or all areas of the complex internal channel surface are polished, reducing the height difference between microwave peaks and valleys on the complex internal channel surface and improving the surface roughness of the workpiece's inner wall. In summary, when polishing the inner wall of a workpiece with a complex internal channel using the polishing device provided in this application, the electrolysis products and bubbles are rapidly discharged under the combined action of electrolyte flushing and the reciprocating motion of the polishing structure, achieving polishing of the complex internal channel surface, reducing the roughness of the workpiece's inner wall, and improving the quality of the workpiece.

[0027] Secondly, this application also provides a polishing method using the polishing apparatus described in the above-mentioned technical solution. The polishing method includes:

[0028] The workpiece to be polished is placed on a support structure; the workpiece has an inlet, an outlet and a complex internal channel, and coils are wound on the outer wall of the workpiece;

[0029] Turn on the processing power so that the workpiece is the anode and the polishing structure is the cathode;

[0030] Turn on the electromagnet power supply to make the workpiece magnetic; the magnetic properties of the polished structure are the same as those of the workpiece.

[0031] The polishing structure is placed in an initial position, which is outside the workpiece and close to the workpiece's inlet; the polishing structure is driven to rotate around its axis, and the electrolyte is sprayed out through the outlet. The axis of the polishing structure is aligned with the height direction of the polishing structure.

[0032] The air blowing structure is used to make the polishing structure move in a single direction or reciprocate within the path from the initial position to the final position until the inner wall surface of the workpiece reaches the preset mirror finish requirement; wherein, the final position is located outside the workpiece and near the workpiece's outlet; the path from the initial position to the final position includes the path where the complex internal channel is located.

[0033] Close the air blowing structure and cut off the processing power supply and electromagnet power supply;

[0034] Shut down the electrolyte supply structure.

[0035] Compared with the prior art, the beneficial effects of this application are as follows:

[0036] In the polishing apparatus provided in this application, the magnetism of the polishing structure is the same as that of the workpiece. During the polishing of the workpiece's inner wall, the workpiece and the polishing structure repel each other, maintaining a constant processing gap throughout the polishing process, thus ensuring processing stability and precision. Furthermore, electrolyte is sprayed onto the inner wall of the workpiece through the outlet, using the electrolyte to flush the inner wall and achieve electrochemical dissolution of the workpiece's inner wall surface, thereby reducing the surface roughness of the workpiece's inner wall. Moreover, since the polishing structure rotates around its own axis, it can perform circumferential processing on the inner wall of the workpiece. Furthermore, by utilizing the air-blowing structure, the polishing structure can move in a single direction or reciprocate along the path from the initial position to the final position. This allows most or all areas of the complex inner channel surface of the workpiece to be polished, reducing the height difference between microwave peaks and valleys on the complex inner channel surface, improving the surface roughness of the workpiece's inner wall, achieving one-step forming, and effectively solving the problem of insufficient repeatability accuracy caused by segmented processing due to changing fixtures and cathodes. In summary, when polishing the inner wall of a workpiece with complex internal channels using the polishing device provided in this application, the electrolytic products and bubbles are rapidly discharged under the combined action of electrolyte flushing and the reciprocating motion of the polishing structure, thereby achieving polishing of the complex internal channel surface of the workpiece, reducing the roughness of the inner wall of the workpiece, and improving the quality of the workpiece. Attached Figure Description

[0037] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0038] Figure 1 This is a schematic diagram showing the relative positional relationship between the polishing device and the workpiece in an embodiment of this application;

[0039] Figure 2 This is a cross-sectional schematic diagram of a portion of the polishing device in an embodiment of this application;

[0040] Figure 3 This is a schematic diagram of the polishing structure in an embodiment of this application;

[0041] Figure 4 Examples of embodiments in this application Figure 3 A sectional view;

[0042] Figure 5 This is a cross-sectional schematic diagram of the polishing structure and part of the workpiece in the embodiments of this application. Figure 1 ;

[0043] Figure 6 This is a cross-sectional schematic diagram of the polishing structure and part of the workpiece in the embodiments of this application. Figure 2 ;

[0044] Figure 7 This is a cross-sectional schematic diagram of the polishing structure and part of the workpiece in the embodiments of this application. Figure 3 ;

[0045] Figure 8 This is a cross-sectional schematic diagram of the workpiece in an embodiment of this application;

[0046] Figure 9 This is a top view showing the relative positional relationship between the polishing structure and the workpiece in the embodiments of this application;

[0047] Figure 10 This is a schematic diagram illustrating the relative positional relationship between the polishing structure and the workpiece in an embodiment of this application.

[0048] Figure 11 This is a partial structural diagram illustrating the relative positional relationship between the polishing device and the workpiece in an embodiment of this application. Figure 1 ;

[0049] Figure 12 This is a partial structural diagram illustrating the relative positional relationship between the polishing device and the workpiece in an embodiment of this application. Figure 2 ;

[0050] Figure 13 This is a partial structural diagram illustrating the relative positional relationship between the polishing device and the workpiece in an embodiment of this application. Figure 3 .

[0051] Figure label:

[0052] 1-Workpiece; 10-Complex internal channel; 2-Bearing structure; 3-Polishing structure; 30-Liquid outlet; 31-Through hole; 32-First machining edge; 33-Base; 34-Second machining edge; 4-Air blowing structure; 40-First air supply component; 41-First telescopic tube; 42-Second air supply component; 43-Second telescopic tube; 5-Electrolyte supply structure; 50-Electrolyte supply component; 51-First conveying pipe; 52-Second conveying pipe; 53-Collection component; 54-Pipeline; 6-Machining power supply; 7-Electromagnet power supply; 80-First base; 81-Machining edge; 82-Second base; 90-Clamp; 91-Coil; 92-Electrolyte; 93-Fixing component. Detailed Implementation

[0053] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit the scope of this application. It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on or indirectly on that other element. When an element is referred to as being "connected to" another element, it can be directly connected to or indirectly connected to that other element.

[0054] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise expressly specified. "Several" means one or more, unless otherwise expressly specified.

[0055] In the description of this application, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0056] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0057] Firstly, this application provides a polishing apparatus. See [link to application]. Figure 1 The polishing apparatus is used to polish a workpiece 1 having a complex internal channel 10 that penetrates the workpiece 1, which has an inlet and an outlet. It should be noted that the aforementioned "complex internal channel 10" can be understood as a twisted internal hole described in the background art, or other irregularly shaped internal holes, such as irregularly shaped internal holes. Here, a regular shape can be an internal hole that is cuboid, cube, cylinder, etc.

[0058] See Figure 1 and Figure 2The polishing device includes: a support structure 2, a polishing structure 3, an air blowing structure 4, an electrolyte supply structure 5, a processing power source 6, and an electromagnet power source 7. The support structure 2 supports the workpiece 1 to be polished. The polishing structure 3 has multiple outlets 30 and is magnetic. When the polishing structure 3 is located within the complex inner channel 10, it is spaced apart from the inner wall of the workpiece 1, with the outlets 30 facing the inner wall of the workpiece 1. The air blowing structure 4 is connected to the polishing structure 3 and drives it to move in a single direction or reciprocate within the complex inner channel 10. The electrolyte supply structure 5 is connected to the polishing structure 3 and provides electrolyte 92 to it, which is ejected through the outlets 30. The processing power source 6 is electrically connected to both the workpiece 1 and the polishing structure 3. The electromagnet power source 7 is electrically connected to a coil 91 surrounding the outer wall of the workpiece 1, so that the workpiece 1 is magnetic, and the magnetic properties of the polishing structure 3 are the same as those of the workpiece 1.

[0059] It should be noted that "the air blowing structure 4 is connected to the polishing structure 3 and is used to drive the polishing structure 3 to move in a single direction or reciprocate within the complex inner channel 10." This can be understood as: the air blowing structure 4 can drive the polishing structure 3 to move along the direction from the inlet to the outlet of the workpiece 1, or drive the polishing structure 3 to move along the direction from the outlet to the inlet of the workpiece 1, or drive the polishing structure 3 to reciprocate from the inlet to the outlet of the workpiece 1.

[0060] See Figure 1 and Figure 2In the polishing apparatus provided in this application, the magnetic properties of the polishing structure 3 and the workpiece 1 are the same. During the polishing of the inner wall of the workpiece 1, the workpiece 1 and the polishing structure 3 repel each other, ensuring a constant processing gap throughout the polishing process and thus guaranteeing processing stability and precision. Furthermore, during the entire polishing process, the workpiece 1 and the polishing structure 3 remain in a non-contact state, allowing the polishing structure 3 to move freely within the complex inner channel 10 without interference, solving the problem of achieving "free" polishing in electrolytic polishing of complex inner channels 10. In other words, the polishing apparatus provided in this application can not only allow the polishing structure 3 to move with a fixed curvature or segmented linear motion within the complex inner channel 10, but also with an arbitrary radius of curvature. Furthermore, the electrolyte supply structure 5 provides the polishing structure 3 with electrolyte 92, which is sprayed onto the inner wall of the workpiece 1 through the outlet 30. The electrolyte 92 is used to flush the inner wall of the workpiece 1, achieving electrochemical dissolution of the inner wall surface and reducing the surface roughness of the inner wall of the workpiece 1. Furthermore, since the air blowing structure 4 is connected to the polishing structure 3, it drives the polishing structure 3 to move in a single direction or reciprocate within the complex inner channel 10. This causes most or all of the surface area of ​​the complex inner channel 10 of the workpiece 1 to be polished, thus reducing the height difference between microwave peaks and valleys on the surface of the complex inner channel 10 and improving the surface roughness of the inner wall of the workpiece 1. In summary, when polishing the inner wall of a workpiece 1 with a complex inner channel 10 using the polishing device provided in this application, the electrolysis products and bubbles are rapidly discharged under the combined action of the electrolyte 92 rinsing and the reciprocating motion of the polishing structure 3, achieving polishing of the surface of the complex inner channel 10 of the workpiece 1, reducing the roughness of the inner wall of the workpiece 1, and improving the quality of the workpiece 1.

[0061] For example, the supporting structure can be a workbench. The shape, structure, and material of the supporting structure can be selected according to actual needs, and no specific limitations are made here.

[0062] The relevant parameters for the electrolyte, processing power supply, and electromagnet power supply can be selected according to actual needs, and no specific restrictions are made here.

[0063] In some embodiments, see Figure 1 The positive and negative terminals of the processing power supply 6 are electrically connected to the workpiece 1 and the polishing structure 3 respectively through the positive and negative terminals. At this time, the workpiece 1 is the anode and the polishing structure 3 is the cathode.

[0064] The material of the polishing structure can be selected according to the actual situation. For example, the material of the polishing structure can be one or more of AlNiCo, NdFeB or SamariumCo.

[0065] As one possible implementation, see Figures 2 to 4 The polishing structure 3 has a through hole 31 that penetrates the polishing structure 3 along the height direction P. That is, the polishing structure 3 has a hollow interior.

[0066] See Figures 2 to 5 Along the height direction P of the polishing structure 3, the polishing structure 3 sequentially includes a first processing blade 32, a substrate 33, and a second processing blade 34. The substrate 33 has multiple liquid outlets 30 for spraying electrolyte 92, promoting electrolyte renewal. The one-dimensional dimensions of the through-hole 31 located at the first processing blade 32 and the through-hole 31 located at the second processing blade 34 are both smaller than the one-dimensional dimension of the through-hole 31 located at the substrate 33. The first processing blade 32 and the second processing blade 34 are used to polish complex internal channels in the workpiece.

[0067] The aforementioned one-dimensional dimension can refer to the length, width, diameter, major axis, minor axis, or diagonal of the through hole, etc. When the cross-section of the through hole is circular, the one-dimensional dimension can refer to the diameter of the through hole. When the cross-section of the through hole is elliptical, the one-dimensional dimension can refer to the major axis or minor axis of the through hole, etc. When the cross-section of the through hole is square, the one-dimensional dimension can refer to the width of the through hole, etc.

[0068] See Figures 1 to 5 In this application, the polishing structure 3 includes a first processing blade 32 and a second processing blade 34 located at both ends, and a substrate 33 for spraying electrolyte 92 is located in the middle. This design ensures that the electrolyte 92 can fully scour the processing area. The processing area is the region corresponding to the first processing blade 32 and the second processing blade 34.

[0069] For details, see Figure 3 and Figure 6 If, along the height direction P of the polishing structure 3, the polishing structure 3 only includes the substrate 33 and the second processing blade 34, then the electrolyte ejected from the outlet of the substrate 33 will not only be sprayed onto the processing area corresponding to the second processing blade 34, but also onto areas outside the processing area, resulting in the loss of electrolyte 92. It should be noted that... Figure 6 The arrows in the diagram indicate the direction of electrolyte flow.

[0070] See Figure 3 and Figure 7 If we consider the height direction P of the polishing structure 3, the polishing structure 3 sequentially includes a first substrate 80, a processing blade 81, and a second substrate 82, with multiple liquid outlets on both the first substrate 80 and the second substrate 82. In this case, the polishing structure 3 is a structure with liquid spraying from both the top and bottom, and the processing blade 81 in the middle. In actual use, the electrolyte 92 sprayed from the first substrate 80 and the second substrate 82 will not only be sprayed onto the processing area corresponding to the processing blade 81, but also onto areas outside the processing area corresponding to the processing blade 81, resulting in the loss of electrolyte 92. It should be noted that... Figure 7 The arrows in the diagram indicate the direction of electrolyte flow.

[0071] If the polishing structure 3 is made into a structure with more than three layers, it will increase the manufacturing cost and difficulty of the polishing structure 3.

[0072] In summary, see Figures 1 to 5 In this application, the polishing structure 3 includes a first processing blade 32, a substrate 33 and a second processing blade 34 along the height direction P of the polishing structure 3. This can not only reduce or avoid the loss of electrolyte 92, improve the polishing efficiency of the workpiece 1 and reduce the polishing cost, but also reduce the manufacturing cost and manufacturing difficulty of the polishing structure 3.

[0073] There are many ways to arrange the above multiple liquid outlets. The following description uses two possible implementation methods as examples. It should be understood that the following description is for comprehension only and does not have any specific limitations.

[0074] Example 1: Multiple liquid outlets 30 are distributed in an array, such as a rectangular array, a triangular array, etc.

[0075] Example 2: See Figure 3 and Figure 4 Multiple outlets 30 are spirally arranged on the substrate 33. This increases the flow rate of the electrolyte 92 in the processing zone corresponding to the cutting edge, forming a stable flow field and allowing the electrolytic products to be discharged in a timely manner, thereby maintaining the stability of the processing.

[0076] In one alternative embodiment, the polishing apparatus further includes: a rotating structure ( Figures 1 to 13 (None are shown), the rotating structure is used to drive the polishing structure 3 to rotate.

[0077] In some embodiments, the polishing structure 3 reciprocates around its axis, allowing it to perform circumferential treatment on the inner wall of the workpiece 1. Furthermore, during rotation, the outlet 30 ejects electrolyte 92 at high speed, effectively preventing the accumulation of electrolytic products and localized electrolyte shortages, thereby avoiding short circuits, ablation marks, or step-like defects.

[0078] In some embodiments, the rotation direction of the polishing structure 3 is opposite to the spiral direction of the spiral arrangement. This allows for further increases in the flow rate within the processing zone, creating a more stable flow field and enabling timely discharge of electrolytic products, thereby maintaining the stability of the processing.

[0079] The aforementioned rotating structure can be a machine tool or other components, as long as it can drive the polishing structure to rotate. The machine tool is electrically or mechanically connected to the polishing structure to drive its rotation.

[0080] As one possible implementation, see Figure 3The height H1 of the outlet 30 ranges from 1.0 mm to 2.0 mm, and the height direction of the outlet 30 is consistent with the height direction P of the polishing structure 3. For example, the height H1 of the outlet 30 can be 1.0 mm, 1.1 mm, 1.2 mm, 1.3 mm, 1.4 mm, 1.5 mm, 1.6 mm, 1.7 mm, 1.8 mm, 1.9 mm, or 2.0 mm, etc. In this case, under the flushing of electrolyte 92 at a pressure of 2.0 MPa, it can be ensured that the outlet 30 does not deform.

[0081] In some embodiments, the height H1 of the outlet 30 is 1 mm.

[0082] See Figure 3 The shape of the outlet 30 can be set according to the actual situation, as long as it can ensure that the flow rate of the electrolyte 92 in the processing area can reach 20m / s to ensure that the electrolytic products can be discharged in time. For example, the shape of the outlet 30 can be circular, elliptical, rectangular, trapezoidal, parallelogram or a closed shape formed by line segments and arcs.

[0083] In some embodiments, a larger outlet size and a sparser layout are selected, which not only facilitates processing but also effectively reduces manufacturing costs.

[0084] As one possible implementation, the inner wall of the substrate is coated with a ceramic insulating material.

[0085] The transverse cross-sectional shape of the polishing structure can be set according to the actual situation. See [link to relevant documentation] as one possible implementation method. Figure 3 , Figure 4 , Figure 9 and Figure 10 The transverse cross-sectional shape of polishing structure 3 is circular or elliptical.

[0086] Based on the preceding description, in the actual polishing process, see... Figure 1 The polishing structure 3 and the inner wall of the workpiece 1 are distributed at intervals to avoid interference between the polishing structure 3 and the inner wall of the workpiece 1, making the polishing structure 3 more adaptable and suitable for processing different types of twisted holes.

[0087] As one possible implementation, see Figure 2 and Figure 12 The sum of the height H2 of the first machining edge 32 and the height H3 of the second machining edge 34 is proportional to the distance L1 between the polishing structure 3 and the inner wall of the workpiece 1.

[0088] If the distance between the polishing structure 3 and the inner wall of the workpiece 1 is too small, the electrolytic products will not be easily discharged. If the distance between the polishing structure 3 and the inner wall of the workpiece 1 is too large, the processing accuracy will be poor, which will in turn affect the polishing effect of the inner wall of the workpiece 1.

[0089] In one alternative approach, see Figure 2 The sum of the height H2 of the first machining edge 32 and the height H3 of the second machining edge 34 ranges from 1 mm to 5 mm. For example, the sum of the heights of the first machining edge 32 and the second machining edge 34 can be 1 mm, 1.5 mm, 2 mm, 2.5 mm, 3 mm, 3.5 mm, 4 mm, 4.5 mm, or 5 mm, etc. The specific dimensions of the heights of the first machining edge 32 and the second machining edge 34 are not specifically limited here, as long as they meet the actual needs.

[0090] When the above technical solution is adopted, since the sum of the heights of the first machining blade 32 and the second machining blade 34 is greater than or equal to 1 mm, it not only avoids the problem of poor electrolyte flow due to an excessively narrow gap between the polishing structure 3 and the inner wall of the workpiece 1, which would affect the discharge efficiency of electrolytic products in the area corresponding to the polishing structure 3, thus improving the surface quality of the inner wall of the workpiece 1, but also avoids short circuits, ablation marks, or step-like defects. Since the sum of the heights of the first machining blade 32 and the second machining blade 34 is less than or equal to 5 mm, it not only avoids unnecessary resource waste caused by an excessively large machining gap and uneven current density distribution, thus improving machining accuracy and efficiency, but also avoids increasing the consumption of electrolyte 92.

[0091] In one alternative approach, see Figure 12 The distance L1 between the polishing structure 3 and the inner wall of the workpiece 1 ranges from 0.1 mm to 0.5 mm. For example, the distance L1 between the polishing structure 3 and the inner wall of the workpiece 1 can be 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm, 0.3 mm, 0.35 mm, 0.4 mm, 0.45 mm or 0.5 mm, etc.

[0092] When the above technical solution is adopted, since the distance between the polishing structure 3 and the inner wall of the workpiece 1 is greater than or equal to 0.1 mm, it not only avoids the problem of poor flow of electrolyte 92 due to an excessively narrow processing gap, which would affect the discharge efficiency of electrolytic products in the area corresponding to the polishing structure 3, thus improving the surface quality of the inner wall of the workpiece 1, but also avoids short circuits, ablation marks, or step-like defects. Since the distance between the polishing structure 3 and the inner wall of the workpiece 1 is less than or equal to 0.5 mm, it not only avoids unnecessary resource waste caused by an excessively large processing gap and uneven current density distribution, thus improving processing accuracy and efficiency, but also avoids increasing the consumption of electrolyte 92.

[0093] In some embodiments, such as Figures 8 to 10The diagram shows the axis M of the bent hole in workpiece 1, the vertical section N perpendicular to the axis M, and the inner wall K at the minimum inner diameter of workpiece 1. The distance L4 between the polishing structure 3 and the inner wall K at the minimum inner diameter of workpiece 1 ranges from 0.1 mm to 0.5 mm.

[0094] As one possible implementation, see Figure 1 and Figure 2 The air-blowing structure 4 includes a first air supply component 40 and a second air supply component 42. The first air supply component 40 is connected to the first processing blade 32 via a first telescopic tube 41, and provides gas to the polishing structure 3. Under the impinging action of the gas, the polishing structure 3 moves towards the outlet of the workpiece 1. The second air supply component 42 is connected to the second processing blade 34 via a second telescopic tube 43, and provides gas to the polishing structure 3. Under the impinging action of the gas, the polishing structure 3 moves towards the inlet of the workpiece 1.

[0095] For example, see Figure 1 and Figure 2 One end of the first telescopic tube 41 is bonded to the first processing blade 32 or fixed to it using a fastener 93, and the same applies to the second telescopic tube 43. The fastener 93 can be a clip, bolt, etc.

[0096] See Figure 1 and Figure 2 The type of gas mentioned above can be selected according to the actual situation and is not specifically limited here. The first gas supply component 40 and the second gas supply component 42 can be gas sources. The material, size, etc. of the first telescopic pipe 41 and the second telescopic pipe 43 can be selected according to the actual situation, as long as the requirements are met, and are not specifically limited here. For example, the first telescopic pipe 41 and the second telescopic pipe 43 are telescopic flexible hoses.

[0097] As one possible implementation, see Figure 1 and Figure 2 The substrate 33 has a first end near the first processing blade 32 and a second end near the second processing blade 34. The electrolyte supply structure 5 includes: an electrolyte supply component 50, a first delivery pipe 51, a second delivery pipe 52, and a collection component 53.

[0098] See Figure 1 and Figure 2 The electrolyte supply unit 50 is used to contain the electrolyte 92, and the electrolyte supply unit 50 has an inlet and an outlet.

[0099] See Figure 1 and Figure 2At least a portion of the first delivery pipe 51 is fitted inside the first telescopic pipe 41, and both ends of the first delivery pipe 51 are connected to the inlet of the electrolyte supply component 50 and the first end of the substrate 33, respectively. For example, one end of the first delivery pipe 51 is bonded to the inner wall of the first end of the substrate or fixed together using a fastener 93. The fastener 93 can be a clip, bolt, etc.

[0100] See Figure 1 and Figure 2 At least a portion of the second delivery pipe 52 is fitted inside the second telescopic pipe 43, and both ends of the second delivery pipe 52 are connected to the drain port of the electrolyte supply component 50 and the second end of the substrate 33, respectively. For example, one end of the second delivery pipe 52 is bonded to the inner wall of the second end of the substrate or fixed together using a fastener 93. The fastener 93 can be a clip, bolt, etc.

[0101] See Figure 1 The collecting element 53 is disposed on the supporting structure 2, and the workpiece 1 is located in the receiving cavity of the collecting element 53. An electrolyte delivery port is provided on the collecting element 53 near the bottom of the supporting structure 2, and the electrolyte delivery port is connected to the drain port of the electrolyte supply element 50 via a pipe 54. For example, the pipe 54 is connected to a second delivery pipe 52, and both the pipe 54 and the second delivery pipe 52 are connected to the drain port of the electrolyte supply element 50.

[0102] In some embodiments, see Figure 1 The polishing device also includes a fixture 90. The workpiece 1 is positioned by the fixture 90 and fixed to it. The workpiece 1 and the fixture 90 are mounted together on the supporting structure 2. The height of the collecting element 53 is greater than the sum of the height of the workpiece 1 and the height of the fixture 90. This not only prevents the electrolyte 92 from splashing into the non-processing area, thus avoiding contamination of the non-processing area (which can be understood as the area excluding the collecting element 53), but also avoids the waste of electrolyte 92, achieving green recycling. The specific structure of the fixture 90 is not specifically limited here, as long as it meets the actual requirements.

[0103] See Figures 1 to 13In summary, in this application, when the polishing structure 3 is located within the complex inner channel 10, the polishing structure 3 is spaced apart from the inner wall of the workpiece 1, allowing for polishing of the workpiece 1. Compared to existing technologies, this application eliminates the need for a dedicated cathode (or combined cathode) for each type of bent hole machining. Furthermore, it eliminates the need to change the fixture 90, shortening the preparation cycle. Moreover, under the synergistic effect of the components included in the air blowing structure 4, the polishing structure 3 moves at high speed from the inlet to the outlet of the workpiece 1 and / or from the outlet to the inlet of the workpiece 1. This results in the polishing of most or all areas of the complex inner channel 10 surface of the workpiece 1, reducing the height difference between microwave peaks and valleys on the surface of the complex inner channel 10, improving the surface roughness of the inner wall of the workpiece 1, and achieving one-step forming. This effectively solves the problem of insufficient repeatability accuracy caused by segmented machining due to changing the fixture 90 and cathode.

[0104] Secondly, this application also provides a polishing method using the polishing apparatus described in the above technical solution. See also... Figures 1 to 13 The polishing method includes:

[0105] First, the workpiece 1 to be polished is placed on the support structure 2; the workpiece 1 has an inlet, an outlet and a complex internal channel 10, and a coil 91 is wound on the outer wall of the workpiece 1.

[0106] Next, turn on the processing power supply 6 so that the workpiece 1 is the anode and the polishing structure 3 is the cathode;

[0107] For example, the processing voltage of the processing power supply 6 is 10V to 40V. For instance, the processing voltage can be 10V, 15V, 20V, 25V, 30V, 32V, 35V, 38V, or 40V, etc.

[0108] In some embodiments, the processing power supply 6 may have a voltage of 20V and a current of 300A.

[0109] Next, the electromagnet power supply 7 is turned on so that the workpiece 1 with the coil 91 wound around it becomes magnetic, and the magnetism of the polishing structure 3 is the same as that of the workpiece 1.

[0110] For example, the voltage of the electromagnet power supply can be 20V and the current can be 300A.

[0111] Next, see Figure 11 The polishing structure 3 is placed in an initial position A, which is located outside the workpiece 1 and close to the inlet of the workpiece 1. The polishing structure 3 is driven to rotate around its axis, and the electrolyte 92 is sprayed out through the outlet 30. The axis of the polishing structure 3 is aligned with the height direction P of the polishing structure 3.

[0112] For example, the electrolyte 92 stored in the electrolyte supply unit 50 is delivered to the polishing structure 3 through the first delivery pipe 51. The rotating structure drives the polishing structure 3 to rotate at high speed around the axis of the polishing structure 3, and the electrolyte 92 is ejected at high speed through the outlet 30.

[0113] Next, see Figure 11 and Figure 12 The air blowing structure 4 is used to make the rotating polishing structure 3 move in a single direction or reciprocate along the path from the initial position A to the final position B until the inner wall surface of the workpiece 1 reaches the preset mirror finish requirement; wherein, the final position B is located outside the workpiece 1 and near the outlet of the workpiece 1. The path from the initial position A to the final position B includes the path of the complex inner channel 10.

[0114] With the above technical solution, compared to the polishing structure 3 rotating and spraying liquid from the inlet of workpiece 1, the polishing structure 3 in this application starts rotating and spraying liquid from the initial position A. This reduces the difference in mass between the inner wall at the inlet of workpiece 1 and the inner wall near the inlet of workpiece 1, and the inner wall in the middle region of workpiece 1, thus reducing the height difference between microwave peaks and valleys on the surface of the complex inner channel. Similarly, compared to the polishing structure 3 moving to the outlet of workpiece 1, the polishing structure 3 in this application moves to the termination position B. This reduces the difference in mass between the inner wall at the outlet of workpiece 1 and the inner wall near the outlet of workpiece 1, and the inner wall in the middle region of workpiece 1, thus reducing the height difference between microwave peaks and valleys on the surface of the complex inner channel. In summary, the above method not only improves the surface roughness of the inner wall of workpiece 1, but also improves the quality of workpiece 1.

[0115] For example, the first step is to activate the first air supply component 40 and deactivate the second air supply component 42. During this process, the polishing structure 3, propelled by continuous airflow, first moves from its initial position A, then sequentially passes through the inlet of the workpiece 1, then through the entire complex internal channel 10 to the outlet of the workpiece 1, and finally reaches the pre-set target position (i.e., the termination position B). Furthermore, the first telescopic tube 41 gradually extends to accommodate the movement of the polishing structure 3. The air pressure of the first air supply component 40 gradually increases to ensure a constant speed of the polishing structure 3 within the workpiece 1. For example, the speed of the polishing structure 3 within the workpiece 1 is 10 mm / min to 30 mm / min. For instance, the speed of the polishing structure 3 within the workpiece 1 could be 10 mm / min, 12 mm / min, 15 mm / min, 18 mm / min, 20 mm / min, 22 mm / min, 25 mm / min, 28 mm / min, or 30 mm / min, etc.

[0116] Step 2: Close the first air supply component 40 and start the second air supply component 42. During this process, under the continuous airflow, the polishing structure 3 first moves from its termination position B, then passes through the outlet of the workpiece 1, then through the entire complex internal channel 10 to the inlet of the workpiece 1, and finally arrives at the pre-set target position (i.e., the initial position A). The second telescopic tube 43 gradually extends to match the movement of the polishing structure 3. The air pressure of the second air supply component 42 gradually increases to ensure that the speed of the polishing structure 3 within the workpiece 1 remains constant. For example, the speed of the polishing structure 3 within the workpiece 1 is 10 mm / min to 30 mm / min. For instance, the speed of the polishing structure 3 within the workpiece 1 may be 10 mm / min, 12 mm / min, 15 mm / min, 18 mm / min, 20 mm / min, 22 mm / min, 25 mm / min, 28 mm / min, or 30 mm / min, etc.

[0117] During the polishing process, electrolyte 92 is sprayed at high speed through outlet 30 onto the inner wall of workpiece 1, and the distance between polishing structure 3 and inner wall of workpiece 1 ranges from 0.1mm to 0.5mm.

[0118] See Figure 11 and Figure 12 In some embodiments, the vertical distance L2 between the initial position A and the inlet of workpiece 1 is 0.1 mm to 1 mm, and the vertical distance L3 between the termination position B and the outlet of workpiece 1 is 0.1 mm to 1 mm. It should be noted that the vertical distance L2 between the initial position A and the inlet of workpiece 1, and the vertical distance L3 between the termination position B and the outlet of workpiece 1, may or may not be equal, and no specific limitation is made here. For example, the vertical distance L2 between the initial position A and the inlet of workpiece 1, or the vertical distance L3 between the termination position B and the outlet of workpiece 1, may be 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, or 1 mm, etc.

[0119] As one possible approach, the first and second steps described above are repeated to reduce the height difference between microwave peaks and valleys on the inner wall surface of workpiece 1, thereby improving its surface roughness until the inner wall surface of workpiece 1 meets the preset mirror finish requirements.

[0120] It is worth noting that, for the inlet and outlet of workpiece 1, a complete polishing process is achieved by the polishing structure moving from the inlet to the outlet, and vice versa. It is not necessary for the polishing structure to move from the inlet to the outlet and back to the inlet to complete a single polishing process. In actual polishing, when the inner wall surface of the workpiece reaches the preset mirror finish requirement, the polishing structure may be located at the inlet or the outlet of the workpiece. That is, when the inner wall surface of the workpiece reaches the preset mirror finish requirement, the relative position of the polishing structure and the workpiece is determined based on the actual situation and is not specifically limited here.

[0121] In some embodiments, see Figure 11 and Figure 12 First, the air blowing structure 4 is used to move the rotating polishing structure 3 from the initial position A to the final position B. Then, the air blowing structure 4 is used to move the rotating polishing structure 3 from the final position B to the initial position A. Next, the air blowing structure 4 is used again to move the rotating polishing structure 3 from the initial position A to the final position B. After the polishing structure 3 finishes moving, the inner wall surface of the workpiece 1 reaches the preset mirror finish requirement, and the polishing structure 3 stops working at the final position B.

[0122] Next, shut down the air blowing structure 4, and cut off the processing power supply 6 and the electromagnet power supply 7;

[0123] Next, shut down electrolyte supply structure 5.

[0124] See Figures 1 to 13In the polishing apparatus provided in this application, the magnetic properties of the polishing structure 3 and the workpiece 1 are the same. During the polishing of the inner wall of the workpiece 1, the workpiece 1 and the polishing structure 3 repel each other, maintaining a constant processing gap throughout the polishing process, thereby ensuring processing stability and precision. Furthermore, the electrolyte 92 is sprayed onto the inner wall of the workpiece 1 through the outlet 30, using the electrolyte 92 to flush the inner wall of the workpiece 1, achieving electrochemical dissolution of the surface of the inner wall of the workpiece 1, thereby reducing the surface roughness of the inner wall of the workpiece 1. Moreover, since the polishing structure 3 rotates around its axis, it can perform circumferential processing on the inner wall of the workpiece 1. Furthermore, by utilizing the air-blowing structure 4, the rotating polishing structure 3 can move in a single direction or reciprocate along the path from the initial position A to the final position B. This allows most or all of the surface area of ​​the complex inner channel 10 of the workpiece 1 to be polished, reducing the height difference between microwave peaks and valleys on the surface of the complex inner channel 10, improving the surface roughness of the inner wall of the workpiece 1, and achieving one-step forming. This effectively solves the problem of insufficient repeatability accuracy caused by changing the fixture 90 and cathode for segmented processing. In summary, when polishing the inner wall of a workpiece 1 with a complex inner channel 10 using the polishing device provided in this application, the electrolytic products and bubbles are rapidly discharged under the combined action of the electrolyte 92 rinsing and the reciprocating motion of the polishing structure 3, achieving polishing of the surface of the complex inner channel 10 of the workpiece 1, reducing the roughness of the inner wall of the workpiece 1, and improving the quality of the workpiece 1.

[0125] As one possible implementation, see Figure 13 During the polishing process described above, the electrolyte 92 stored in the electrolyte supply unit 50 flows from the inlet of the electrolyte supply unit 50 into the cavity of the polishing structure 3 through the first delivery pipe 51. Subsequently, a small portion of the electrolyte 92 flows into the second delivery pipe 52, while the majority of the electrolyte 92 is sprayed onto the inner wall of the workpiece 1. Next, the electrolyte 92 flows into the collection unit 53 and then to the electrolyte delivery port. Finally, the electrolyte 92 flowing out from the second delivery pipe 52 and the electrolyte delivery port merges together into the drain port of the electrolyte supply unit 50, entering the electrolyte supply unit 50. This electrolyte 92 flow pattern not only avoids electrolyte waste but also reduces the impact of the electrolyte 92 on non-processed areas. It should be noted that... Figure 13 The arrows in the diagram indicate the direction of electrolyte flow.

[0126] In one alternative approach, the electrolyte temperature is maintained between 20°C and 40°C, and the pressure is maintained between 0.5 MPa and 2 MPa throughout the process. For example, the electrolyte temperature can be 20°C, 22°C, 25°C, 28°C, 30°C, 32°C, 35°C, 38°C, or 40°C, and the pressure can be 0.5 MPa, 0.6 MPa, 0.7 MPa, 0.8 MPa, 0.9 MPa, 1 MPa, 1.1 MPa, 1.2 MPa, 1.3 MPa, 1.4 MPa, 1.5 MPa, 1.6 MPa, 1.7 MPa, 1.8 MPa, 1.9 MPa, or 2 MPa, etc.

[0127] In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0128] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A polishing apparatus, characterized in that, For polishing workpieces with complex internal channels penetrating the workpiece, the workpiece having an inlet and an outlet; the polishing apparatus includes: A support structure for supporting the workpiece to be polished; A polishing structure having multiple liquid outlets; when the polishing structure is located within the complex internal channel, the polishing structure is spaced apart from the inner wall of the workpiece, and the liquid outlets face the inner wall of the workpiece; An air blowing structure, connected to the polishing structure, is used to drive the polishing structure to move in a single direction or reciprocate within the complex internal channel. An electrolyte supply structure is connected to the polishing structure; the electrolyte supply structure is used to provide electrolyte to the polishing structure, and the electrolyte is sprayed out through the outlet. A processing power supply is used to electrically connect to the workpiece and the polishing structure, respectively. An electromagnet power supply is used to electrically connect to a coil surrounding the outer wall of the workpiece, so as to make the workpiece magnetic; the magnetic properties of the polishing structure are the same as those of the workpiece, so that the workpiece and the polishing structure repel each other during the polishing of the inner wall of the workpiece. The polishing structure has a through hole that extends through the polishing structure along its height direction. Along the height direction of the polishing structure, the polishing structure sequentially includes a first processing blade, a base, and a second processing blade; the base has a plurality of liquid outlets; the one-dimensional dimensions of the through holes located at the first processing blade and the through holes located at the second processing blade are both smaller than the one-dimensional dimensions of the through holes located at the base.

2. The polishing apparatus according to claim 1, characterized in that, The multiple liquid outlets are arranged in a spiral on the substrate.

3. The polishing apparatus according to claim 2, characterized in that, The polishing apparatus further includes: A rotating structure is used to drive the polishing structure to rotate; the rotation direction of the polishing structure is opposite to the direction of the spiral arrangement.

4. The polishing apparatus according to claim 1, characterized in that, The height of the liquid outlet ranges from 1.0 mm to 2.0 mm, and the height direction of the liquid outlet is consistent with the height direction of the polishing structure. And / or, the inner wall of the substrate is coated with a ceramic insulating material; And / or, the transverse cross-sectional shape of the polishing structure is circular or elliptical.

5. The polishing apparatus according to claim 1, characterized in that, The height of the first machining edge and the sum of the heights of the second machining edge are proportional to the distance between the polishing structure and the inner wall of the workpiece. And / or, the sum of the heights of the first and second processing blades ranges from 1 mm to 5 mm; the distance between the polishing structure and the inner wall of the workpiece ranges from 0.1 mm to 0.5 mm.

6. The polishing apparatus according to claim 1, characterized in that, The air blowing structure includes: The first air supply component is connected to the first processing blade through a first telescopic tube; the first air supply component provides gas to the polishing structure, and the polishing structure moves towards the outlet of the workpiece under the pushing action of the gas; The second air supply component is connected to the second processing blade via a second telescopic tube; the second air supply component provides gas to the polishing structure, and the polishing structure moves towards the inlet of the workpiece under the pushing action of the gas.

7. The polishing apparatus according to claim 6, characterized in that, The substrate has a first end near the first processing blade and a second end near the second processing blade; The electrolyte supply structure includes: An electrolyte supply unit for containing electrolyte; the electrolyte supply unit has an inlet and an outlet. The first delivery pipe, at least a portion of which is sleeved inside the first telescopic pipe; the two ends of the first delivery pipe are respectively connected to the inlet of the electrolyte supply component and the first end of the substrate; The second delivery pipe is at least partially sleeved inside the second telescopic pipe; the two ends of the second delivery pipe are respectively connected to the drain port of the electrolyte supply component and the second end of the substrate; A collection component is disposed on the supporting structure, and the workpiece is located in the receiving cavity of the collection component; the collection component has an electrolyte delivery port near the bottom of the supporting structure, and the electrolyte delivery port is connected to the drain port of the electrolyte supply component through a pipeline.

8. The polishing apparatus according to claim 7, characterized in that, The polishing device further includes: a clamp, on which the workpiece is fixed, and the workpiece and the clamp are together disposed on the supporting structure; the height of the collecting element is greater than the sum of the height of the workpiece and the height of the clamp; And / or, the workpiece is the anode and the polishing structure is the cathode.

9. A polishing method, characterized in that, The polishing apparatus according to any one of claims 1 to 8; the polishing method includes: The workpiece to be polished is placed on a support structure; the workpiece has an inlet, an outlet and a complex internal channel, and coils are wound on the outer wall of the workpiece; The processing power is turned on so that the workpiece is the anode and the polishing structure is the cathode; The electromagnet power supply is turned on to make the workpiece magnetic, and the magnetic properties of the polishing structure are the same as those of the workpiece. The polishing structure is placed in an initial position, which is located outside the workpiece and close to the inlet of the workpiece; the polishing structure is driven to rotate about its axis, and the electrolyte is sprayed out through the outlet, the axis of the polishing structure being consistent with the height direction of the polishing structure; The polishing structure is moved in a single direction or reciprocated within the path from the initial position to the final position using an air blowing structure until the inner wall surface of the workpiece reaches the preset mirror finish requirement; wherein, the final position is located outside the workpiece and near the workpiece's outlet; the path from the initial position to the final position includes the path where the complex inner channel is located. The air blowing structure is shut down, and the processing power supply and the electromagnet power supply are cut off. The electrolyte supply structure is shut down.

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