Loading lock

Abstract

The invention relates to a locking chamber for a substrate handling system, the locking chamber having an inlet locking flap and an outlet locking flap wherein the locking chamber is adapted and designed to introduce a ventilation gas into the interior of the locking chamber, wherein the locking chamber further has in its interior at least two parallel shielding plates, a transport device for transporting a substrate between the shielding plates, and a heating device, wherein the shielding plates have a material which is at least partially transparent at least in the infrared range. The invention also relates to a substrate handling system having such a locking chamber, and to a method for transferring a glass substrate from a low-pressure region into a region having a higher pressure by means of such a locking chamber.

Description

TECHNICAL FIELD

[0001] The present invention relates to a load lock and to a substrate handling system. In particular, the present invention relates to a load lock which is adapted for transferring large area glass substrates between two regions of different pressure, for example from a low pressure region to a region having atmospheric pressure. BACKGROUND

[0002] Load locks are generally used in systems in which substrates, for example glass substrates, are preferably subjected to treatment in a vacuum or in a process gas atmosphere.

[0003] For example, DE 10 2010 028 958 Al discloses a substrate handling system for vacuum coating of plate-shaped substrates, such as glass substrates. The described system has an entry load lock, a vacuum region and an exit load lock. A region for heating or cooling the substrates can also be provided in the vacuum region of the substrate handling system. The glass substrates are generally heated in the vacuum region for treatment. Depending on the type of treatment, the glass substrates are heated to at or above their softening point. A particular problem is the cooling of the glass substrates required after heating or the transfer of the glass substrates from the vacuum region via the entry load lock to the atmospheric pressure region, since this can cause undesired stresses to arise in the glass elements which can lead to deformation or even breakage. For this reason, the cooling in the vacuum section should generally be well controlled in order to reduce inhomogeneous heating or cooling and thus the introduction of undesired internal stresses.

[0004] Various devices are known from the prior art which solve the problem of uniform temperature distribution within a substrate. For example, DE 10 2009 037 299 Al discloses a treatment chamber for thermal treatment of planar substrates, the aim being to achieve a well-controlled cooling of the substrates in a load lock. It is disclosed that the heating or cooling will be carried out with the aid of preheated or pre-cooled gas from nozzles. Temperature control using gas can provide a time advantage compared to temperature control of the substrates via radiant energy. However, the described design is extremely complex in terms of technology and is therefore expensive to implement as a vacuum lock. In addition, the process is difficult to control within the process times which are often required, often less than one minute. This is in particular because of the gas introduction, which also increases the pressure in the lock, must be controlled with respect to the substrate temperature and cannot be carried out in a manner which is as time-efficient as possible.

[0005] Another method for heating or cooling a glass substrate is disclosed in WO 03 / 006390 Al. This method aims to simplify the structural design of a substrate handling system by using a warm or cooled gas stream in a load lock to heat or cool the glass substrate via convection, wherein the gas stream can be pre-conditioned to achieve a specific temperature within the chamber using heating elements or cooling elements. A glass substrate being transferred on a roller through the substrate handling system can then be exposed to the pre-heated gas stream by directing the pre-heated gas stream onto the glass substrate through nozzles arranged in partition walls above and below the glass substrate. Again, with this method, so-called lock filling cannot be performed in the most time-efficient manner, but the required temperature control of the glass substrate has to be considered.

[0006] A similar design is also disclosed in DE 698 12 251 T2. This disclosure shows an air system for heating a glass sheet during a heating cycle using both radiation from heating elements and a pre-heated gas stream for convection to heat the glass substrate to a desired target temperature.

[0007] Systems using pre-heated / pre-cooled gas or air to control the temperature of a glass substrate cannot be used in the vacuum area of a substrate handling system. Furthermore, the known systems cannot easily be used in a load lock, as their implementation is technically particularly complex. For example, the gas distribution above the substrate during lock filling is very complex, especially during the transition from molecular to laminar flow. Depending on the temperature conditions in the load lock and the thickness of the glass substrate, the known processes also cannot be controlled within the typical lock operation time of less than one minute, at least because the additional gas distribution volume has an impact on the pump-down time into the load lock or the time required to fill the load lock.

[0008] The patent specification EP 3 094 605 B1 shows a known system design for quenching and subsequently cooling a glass substrate using a gas stream from above and below and radiation heat from infrared emitters. The initial purpose of the system shown is to use the gas stream to rapidly cool the glass substrate from a temperature above the "strain point" to the "tempering point". Depending on the substrate type, this corresponds to a cooling of approximately 50 K to 250 K. The glass substrate can then be further cooled to its cooling point. The system comprises a temperature sensor which can be used to measure the temperature on the surface of the glass substrate so that the most time-efficient heating and cooling of the glass can be achieved. However, this known patent specification does not address the problem of how to control the temperature independently of the venting of the load lock or how the time-efficient venting of the load lock is combined with the described temperature control when the system is used in a load lock.

[0009] DE 34 27 057 discloses a system for generating a semiconductor layer structure. The system includes at least one carrier for holding a semiconductor wafer to be coated, a reaction chamber, a heating device, a loading station upstream of the reaction chamber, an unloading station downstream of the reaction chamber, and a conveyor device.

[0010] US 2021 / 0272839 A1 discloses an RTP system 100 having an RTP chamber, a rotatable carrier plate, a heat source, and a window containing quartz material.

[0011] DE 10 2009 011 495 discloses a method for continuously processing a planar substrate in a vacuum, wherein the substrate is transported along a transport direction in the substrate plane through at least one compartment of a vacuum system and processed in the process.

[0012] In the prior art, there is no known system that separates the problem of rapid pressure change in the loading lock from the problem of targeted temperature change of the substrate in the loading lock. Therefore, when using known systems, there is always a conflict between the objectives of rapid pressure change in the loading lock (by venting / evacuating) and controlled temperature change of the glass substrate in the loading lock (by temperature control and control of the amount of venting gas).

[0013] All known systems suffer from the following drawback: they cannot simultaneously ensure that, on the one hand, no undesirable internal stresses are generated in the glass substrate during the transition from vacuum to atmospheric conditions, or that the substrate does not crack, while on the other hand, short process times are maintained, i.e., short filling or pumping times in the lock. This problem is particularly severe with large-area glass substrates.

[0014] For this reason, there is a need for a loading lock for transferring a glass substrate between two regions with different pressures, such as a vacuum region and an atmospheric region, where the pressure can be changed rapidly, thereby avoiding or at least reducing the introduction of undesirable internal stresses into the glass substrate.

[0015] Existing technology cannot meet this need. Summary of the Invention

[0016] Therefore, the object of the present invention is to provide a process system that at least partially compensates for the disadvantages described above and / or at least partially meets the stated needs. In other words, the present invention aims to provide a loading lock that can be used to transfer a large-area glass substrate between two different pressure zones in the shortest possible time, while largely avoiding or at least reducing internal stress and deformation within the glass substrate.

[0017] This objective is achieved by means of a loading lock (i.e., a locking chamber, air / vacuum lock) for a substrate handling system, the loading lock having an inlet locking flap (i.e., an entry locking flap) and an outlet locking flap (i.e., an exit locking flap), wherein the loading lock includes thermal insulation and a pump system, and wherein the loading lock is adapted and configured to introduce ventilation gas into the interior of the loading lock, wherein the loading lock further includes within its interior two parallel shielding plates, a transport device for transporting the substrate between the shielding plates from the inlet locking flap to the outlet locking flap, and a heating device, wherein the shielding plates comprise a material that is at least partially transparent in at least the infrared range. Preferably, the shielding plates comprise a material that is at least partially transparent in the infrared range and / or a material that is not completely transparent.

[0018] Preferably, the loading lock can be adapted and configured to move a large-area glass substrate from the inlet locking flap to the outlet locking flap. Preferably, the large-area glass substrate has a diameter of at least 0.1 m. 2 More preferably at least 0.2 m 2 More preferably at least 0.3 m 2 More preferably at least 0.5 m 2 And particularly preferably at least 1.0 m 2 The area of ​​the glass substrate. The longest edge length of the glass substrate is preferably greater than 0.4 m, more preferably greater than 0.6 m, even more preferably greater than 0.9 m, and particularly preferably greater than 1.2 m. For such large-area glass substrates, targeted temperature control is particularly relevant in order to avoid or at least reduce stress incorporation in the hot glass substrate, such as internal stress. Therefore, targeted temperature control is even more relevant when the glass substrate is transferred between two regions of different pressure, particularly from a vacuum region to an atmospheric region. In the sense of this disclosure, the hot glass substrate may preferably be a glass substrate with a temperature of 300°C to 650°C.

[0019] Preferably, the intermediate space can be defined between two parallel shielding plates, and more preferably, the heating device is arranged outside the intermediate space. The intermediate space preferably has a relatively small gas volume. Preferably, the gas volume in the intermediate space can be at most 50% of the total gas volume of the lock, and more preferably at most 10% of the total gas volume of the lock. Preferably, the inner surfaces of the two parallel shielding plates can have a maximum distance of less than 70 mm, preferably less than 40 mm, and particularly preferably less than 15 mm. Preferably, the lock can be adjusted or set for a glass substrate with a specific substrate thickness. The distance between the inner surfaces of the two parallel shielding plates can preferably be less than ten times the substrate thickness, more preferably less than five times the substrate thickness, and most preferably less than twice the substrate thickness. Preferably, this allows the gas entering the space between the plates to be rapidly heated to the desired target temperature during ventilation of the lock.

[0020] Preferably, the two parallel shielding plates in the mounting lock can extend over an area at least corresponding to the area of ​​the glass substrate, more preferably at least 1.5 times the area of ​​the glass substrate, more preferably at least 2 times the area of ​​the glass substrate, more preferably at least 2.5 times the area of ​​the glass substrate, and more preferably at least 3 times the area of ​​the glass substrate. In other words, each of the two parallel shielding plates can preferably be at least 0.1 m in length. 2 More preferably at least 0.2 m 2 More preferably at least 0.3m 2 More preferably at least 0.5 m 2 More preferably at least 1.0 m 2 More preferably at least 1.5 m 2 More preferably at least 2.0 m 2 More preferably at least 2.5 m 2 And more preferably at least 3 m 2 Extending over the area.

[0021] Preferably, each of the two parallel shielding plates may consist of several individual plates. Therefore, it is preferable to more easily achieve large-area plate sizes exceeding the readily available sizes of the ceramic or other materials used for the shielding plates. In other words, the design can preferably be simplified, especially in the case of large-area shielding plates. Furthermore, the space formed between the shielding plates can preferably be better or more effectively covered over a larger area. Additionally, access to the intermediate space and / or the shielding plates can be simplified, which preferably facilitates maintenance.

[0022] Preferably, the transmittance variation of the shielding plates on their surfaces is less than 5%, more preferably less than 2%. Particularly preferred is that the shielding plates have a constant transmittance on their surfaces. Preferably, the optical transmittance of the shielding plates is greater than 30%, preferably greater than 40%, and particularly preferably greater than 60% at wavelengths in the spectral range of 0.5 µm to 5 µm. These transmittance values ​​have proven advantageous in order to preheat the shielding plates in a time-efficient manner and to introduce sufficient radiant energy into the intermediate space between the shielding plates to maintain or heat the glass substrate or gas located in the intermediate space to a desired temperature. Preferably, the optical transmittance of the shielding plates is less than 90%, preferably less than 85%, and particularly preferably less than 80% at wavelengths in the spectral range of 0.5 µm to 5 µm. Preferably, the shielding plates may comprise at least one of the following materials: ceramic, quartz glass, glass-ceramic, Schott Nextrema 712-3, Schott Nextrema 724-8, and Schott Nextrema 724-3. Shielding plates comprising these materials, individually or in combination, can be particularly well adapted to achieve a desired trade-off between the transmittance and absorptivity of the radiant energy emitted by the heating device. In other words, the use of one or more of the preferred materials, individually or in combination, allows for particularly fine tuning of the transmittance and absorptivity.

[0023] Preferably, at least one of the shielding plates may have a thickness of at least 2 mm, preferably at least 4 mm, and particularly preferably at least 6 mm. More preferably, at least one of the shielding plates may have a thickness of up to 20 mm, more preferably up to 10 mm, and particularly preferably up to 5 mm. Shielding plates with preferred thicknesses are preferably used as advantageous heat storage bodies. This can preferably facilitate preventing uncontrolled cooling of the glass substrate by moving it through the shielding plate via a loading lock, or facilitate reducing uncontrolled cooling of the glass substrate.

[0024] The heating device may preferably include one or more infrared sources, wherein the heating device may preferably include at least two types of infrared sources, the emission wavelength spectra of the at least two types of infrared sources may be different.

[0025] The heating device may preferably include a short-wave infrared emitter with a useful emission wavelength between 780 nm and 6500 nm, preferably between 1000 nm and 1400 nm, and / or a mid-wave infrared emitter with a useful emission wavelength between 1400 nm and 8000 nm, preferably between 1500 nm and 3000 nm. Preferably, the heating device having several different infrared sources can be specifically controlled so that different areas on the glass substrate or shielding plate can be heated to different degrees.

[0026] The heating device is preferably adapted and configured to heat the parallel shielding plates to a defined plate temperature, thereby preferably controlling the plate temperature in a targeted manner. Preferably, the temperature of the glass substrate transferred between the shielding plates can also be affected or controlled.

[0027] The parallel shielding plate may preferably extend horizontally along the longitudinal axis of the mounting lock. In the transverse direction, the parallel shielding plate may preferably have two peripheral regions and a central region located between the peripheral regions.

[0028] The heating device is preferably adapted to heat the intermediate space in the central and peripheral regions of the shielding plate to different degrees, preferably by means of segmented infrared emitters and more preferably by means of segmented short-wave and / or mid-wave infrared emitters. Preferably, the heating unit can be further adapted and configured to heat the peripheral region of the glass substrate, defined in the lateral direction of the plate, to a higher degree than the central region of the glass substrate. Preferably, this allows for a constant temperature distribution throughout the entire glass substrate located between the shielding plates, even though the temperature in the peripheral region of the glass substrate is generally more susceptible to temperature fluctuations than in the central region of the glass substrate.

[0029] Preferably, the heating device may be arranged at least partially and more preferably completely outside the intermediate space between the two parallel shielding plates. Preferably, this allows for keeping the intermediate space between the shielding plates small on the one hand, and on the other hand, the heating device heats both the shielding plates and the glass substrate in the same emission direction. This can also preferably facilitate a simple, robust, and / or cost-effective design for the system.

[0030] The transport unit may preferably include one or more transport rollers, wherein the lower shielding plate preferably includes openings through which the transport rollers may protrude at least partially.

[0031] The heating device can preferably be adapted and configured to heat the transport roller to a defined transport roller temperature, thereby preferably controlling the transport roller temperature in a targeted manner. The transport roller can preferably have a thermal conductivity of less than 2 W / mK, preferably less than 1 W / mK, and particularly preferably less than 0.5 W / mK. Additionally, the contact surface of a single transport roller can preferably be a maximum of 25 mm. 2 More preferably, the maximum is 9 mm. 2 And particularly preferably, the maximum size is 4 mm. 2 This preferably enables the prevention of temperature imbalances from being transmitted to the glass substrate via the transport rollers. In other words, this preferably enables the prevention of the glass substrate from being heated or cooled in an uncontrolled manner at the point where it rests on the transport rollers, or from having a temperature different from that in the surrounding area, thereby avoiding the formation of undesirable internal stresses in the glass substrate.

[0032] Preferably, the loading lock may have a lining of an opaque and / or partially transparent sheet for thermal insulation, preferably wherein the lining reduces heat flow from the interior of the chamber toward the chamber wall by more than 1.5 times, more preferably more than 2.5 times, and particularly preferably more than 3.5 times. The multiple preferably indicates the rate of reduction in heat flow from the interior of the chamber toward the chamber wall compared to a loading lock without a lining.

[0033] The pump system is preferably adapted to generate a pressure of less than 0.1 bar, more preferably less than 0.01 bar, inside the loading lock. Preferably, the pressure in the loading lock can be further increased. Preferably, ventilation gas at atmospheric pressure can be introduced into the loading lock, wherein it is further preferred that the ventilation gas is not preheated, and particularly preferred that the ventilation gas can be introduced at ambient temperature.

[0034] Therefore, according to the invention, it is preferable to provide a loading lock that can accommodate a glass substrate from a first (e.g., upstream) pressure region, the glass substrate having been heated to a first substrate temperature preferably close to the strain point. Additionally, the pressure in the loading lock can preferably be adjusted to the pressure in a second (e.g., downstream) pressure region. According to the invention, it can be ensured that the temperature of the glass substrate changes as little as possible or preferably not at all. According to the invention, this can preferably be achieved by heating the shielding plates to a temperature close to the first substrate temperature, preferably with a tolerance of 10 K from the first substrate temperature, before the glass substrate is introduced into the intermediate space. Once the glass substrate is located between the shielding plates in the lock, due to the translucency of the shielding plates, not only the shielding plates but also the glass substrate can be directly heated by means of a heating device. Therefore, it is preferable to measure the temperature in different regions of the glass substrate and adjust the heating of the glass substrate and the shielding plates accordingly, so that the temperature of the glass substrate is preferably kept constant. Therefore, it is preferable to prevent the formation of unwanted internal stress in the glass substrate and to prevent the glass substrate from cracking or breaking.

[0035] Preferably, the loading lock can be fully filled, i.e., ventilated, in a very short time. The venting time of the lock is preferably independent of the temperature control of the glass substrate. The venting gas penetrating the intermediate space between the shielding plates can reach the preset target temperature in a very short time, preferably without affecting the mechanical properties of the glass substrate. This can preferably be achieved through the small distance between the shielding plates and / or the semi-transparent nature of the shielding plates. The loading lock design according to the invention is preferably used to fully fill the loading lock, wherein during the filling period, the temperature of the glass substrate preferably changes only to a minimal extent, and more preferably not at all. This allows for extremely rapid filling, especially compared to known systems. Controlled cooling of the glass substrate can then preferably be performed under atmospheric conditions. Cooling under atmospheric conditions can be performed faster and with better control compared to in a vacuum or negative pressure region because the glass substrate is surrounded by gas. Therefore, cooling can be carried out in a time-efficient and well-controlled manner via convection according to a preset cooling curve.

[0036] Preferably, the loading lock may be adapted and / or configured to be coupled to the reaction chamber. More preferably, the loading lock may be adapted and configured to be used upstream and / or downstream of the reaction chamber in an inline system. Particularly preferred is that the loading lock is adapted to transfer a substrate into and / or out of the reaction chamber coupled to the loading lock.

[0037] The present invention further relates to a substrate handling system having a loading lock, preferably having a loading lock according to at least one of the above features. The substrate handling system may preferably be an in-line system and may include an upstream region coupled to the loading lock, preferably a negative pressure region, and a downstream region coupled to the loading lock, preferably having atmospheric pressure.

[0038] The upstream region may preferably have a temperature of at least 300°C, more preferably at least 450°C, and particularly preferably at least 600°C, and the downstream region may more preferably have an ambient temperature, i.e., a temperature of about 20°C, preferably between 15°C and 25°C. The upstream region may preferably be a reaction chamber.

[0039] The substrate handling system according to the invention, preferably equipped with a loading lock, can preferably have a particularly simple technical design. In particular, there is no need for complex preheating of the ventilation gas, and since the ventilation gas is not directly guided to the glass substrate through a ventilation nozzle, but rather the glass substrate is protected within a semi-transparent tunnel, there is no need for complex control of the ventilation valve. Therefore, the control of the ventilation valve can preferably be configured in a fairly simplified manner. In particular, the use of a semi-transparent tunnel preferably means that the heating unit, preferably an infrared emitter, can both heat and preheat the tunnel, and, when the glass substrate is located within the tunnel, can also heat the glass substrate itself or maintain it at a constant temperature by means of radiant heat. This combination preferably allows the loading lock to be vented, i.e., increasing the pressure within the loading lock, without substantially changing the temperature of the glass substrate located within the loading lock due to the supplied airflow. Preferably, the temperature variation of the glass substrate located within the loading lock is a maximum of 50 K, preferably a maximum of 40 K, more preferably a maximum of 30 K, more preferably a maximum of 20 K, and particularly preferably a maximum of 10 K. Such a small temperature difference in the glass substrate preferably ensures that no undesirable internal stress is generated in the glass, and in particular, effectively prevents deformation or cracking of the glass substrate.

[0040] The present invention also relates to a method for transferring a glass substrate from a low-pressure region to a higher-pressure region using a loading lock. The loading lock includes at least two parallel shielding plates made of a material that is at least partially transparent in at least the infrared range. The method includes:

[0041] 1. Heat the two parallel shielding plates to a predetermined plate temperature;

[0042] 2. The glass substrate is introduced from the low-pressure area into the intermediate space between the two parallel shielding plates of the mounting lock;

[0043] 3. Using ventilation gas to ventilate the loading lock; and

[0044] 4. Control (i.e., closed-loop control) the temperature in the intermediate space such that the temperature change of the glass substrate is at most 50K, preferably at most 40K, more preferably at most 30K and even more preferably at most 20K.

[0045] Preferably, the glass substrate has a first glass substrate temperature T when it is introduced into the loading lock. G In step 1, the parallel shielding plate is heated to a plate temperature T that meets the following requirements. P :

[0046] T G – 20 K < T P < T G +50K

[0047] Heating the translucent shielding plates to a plate temperature within a preferred range preferably ensures that the temperature of the glass substrate introduced into the intermediate space between the shielding plates does not change in an uncontrolled manner, preferably only to a minimum, and thus ensures that the mechanical properties of the glass substrate remain unchanged.

[0048] The method according to the present invention may further preferably include:

[0049] 5. The transport device used to introduce the glass substrate into the intermediate space is heated to a transport device temperature T that meets the following definition. T :

[0050] T G – 100 K < T T Preferably T G – 50 K < T T And particularly preferred T G – 20 K < T T .

[0051] By heating the transport rollers, unwanted temperature changes of the glass substrate can also be reliably minimized at the contact points of the glass substrate on the transport rollers.

[0052] The method can preferably be carried out in a loading lock according to the invention, which has at least one of the features mentioned above.

[0053] Step 1 of the process can preferably be performed using a short-wave infrared emitter with a useful emission wavelength between 780 nm and 6500 nm, more preferably between 1000 nm and 1400 nm. Step 5 of the method according to the invention can preferably be performed using a mid-wave infrared emitter with a useful emission wavelength between 1400 nm and 8000 nm, more preferably between 1500 nm and 3000 nm.

[0054] Preferably, in step 3, the venting gas may be at ambient temperature, and / or the venting gas may not be heated. Preferably, the first glass substrate temperature may be between 300°C and 650°C, more preferably between 450°C and 650°C, and particularly preferably between 500°C and 600°C, and / or the first glass substrate temperature may correspond to a temperature higher than the strain point of the glass substrate.

[0055] Preferably, the method according to the present invention can meet the following requirements:

[0056] T G – 10 K < T P < T G+30 K, preferably T G – 5 K < T P < T G +10 K.

[0057] In the method according to the invention, the glass substrate may preferably have a substrate thickness of up to 10 mm, more preferably up to 5 mm, and particularly preferably up to 3 mm.

[0058] The inner surfaces of the two shielding plates may preferably have a maximum distance from the glass substrate surface that is less than ten times the thickness of the substrate, more preferably less than five times the thickness of the substrate, and particularly preferably less than twice the thickness of the substrate, and / or the inner surfaces of the two shielding plates may have a maximum distance from the corresponding glass substrate surface that is less than 20 mm, more preferably less than 10 mm, and particularly preferably less than 5 mm.

[0059] The present invention can preferably be described by means of the following aspects:

[0060] 1. A loading lock for a substrate handling system, the loading lock having an inlet locking flap and an outlet locking flap, wherein the loading lock includes a thermal insulator and a pump system, and wherein the loading lock is adapted and configured to introduce ventilation gas into the interior of the loading lock, wherein the loading lock further includes within its interior at least two parallel shielding plates, a transport device for transporting a substrate between the shielding plates from the inlet locking flap to the outlet locking flap, and a heating device, wherein the shielding plates comprise a material that is at least partially transparent in at least the infrared range.

[0061] 2. The loading lock according to aspect 1, wherein the loading lock is adapted and configured to move a large-area glass substrate from the inlet locking flap to the outlet locking flap, wherein the large-area glass substrate has a diameter of at least 0.1m. 2 Preferably at least 0.3 m 2 And particularly preferably at least 0.5 m 2 The area.

[0062] 3. The loading lock according to any one of aspects 1 or 2, wherein the intermediate space may be defined between the two parallel shielding plates, and wherein the heating device is located outside the intermediate space.

[0063] 4. The loading lock according to any one of the preceding aspects, wherein the inner surfaces of the two parallel shields have a maximum distance of less than 70 mm, preferably less than 40 mm and particularly preferably less than 15 mm from each other.

[0064] 5. The loading lock according to any one of the foregoing aspects, wherein the optical transmittance of the shielding plate is greater than 30%, preferably greater than 60%, at wavelengths in the spectral range of 0.5 µm to 5 µm, and / or wherein the shielding plate comprises at least one of the following materials: quartz glass, glass ceramic, Schott NEXTREMA 712-3, Schott NEXTREMA 724-8, Schott NEXTREMA 724-3.

[0065] 6. The loading lock according to any one of the foregoing aspects, wherein at least one shielding plate has a thickness of at least 2 mm, preferably at least 4 mm, and / or wherein at least one shielding plate has a thickness of at most 20 mm, more preferably at most 10 mm, and particularly preferably at most 5 mm.

[0066] 7. The loading lock according to any one of the foregoing aspects, wherein the heating device comprises one or more infrared sources, preferably wherein the heating device comprises at least two types of infrared sources having different emission wavelength spectra.

[0067] 8. The loading lock according to any one of the foregoing aspects, wherein the heating device is adapted and configured to heat the parallel shielding plate to a defined plate temperature, thereby preferably controlling the plate temperature in a targeted manner.

[0068] 9. The loading lock according to any one of the foregoing aspects, wherein the parallel shield extends horizontally along the longitudinal axis of the lock, preferably wherein the parallel shield has two peripheral regions in the transverse direction and a central region located between the peripheral regions.

[0069] 10. The loading lock according to any one of the foregoing aspects, wherein the transport unit comprises one or more transport rollers, and wherein the lower shield preferably includes an opening through which the transport rollers can protrude at least partially.

[0070] 11. The loading lock according to aspect 10, wherein the heating device is adapted and configured to heat the transport roller to a defined transport roller temperature, thereby preferably controlling the transport roller temperature in a targeted manner.

[0071] 12. The loading lock according to any one of aspects 10 or 11, wherein the transport roller has a thermal conductivity of less than 2 W / mK, preferably less than 1 W / mK and particularly preferably less than 0.5 W / mK.

[0072] 13. The loading lock according to any one of aspects 10 to 12, wherein the contact surface of a single transport roller is at most 25 mm. 2Preferably, the maximum size is 9 mm. 2 And particularly preferably, the maximum size is 4 mm. 2 .

[0073] 14. The loading lock according to any one of the foregoing aspects, wherein the thermal insulation of the loading lock comprises a liner having an opaque and / or partially transparent sheet, preferably wherein the liner reduces the heat flow from the interior of the chamber toward the chamber wall by more than 1.5 times, more preferably more than 2.5 times, and particularly preferably more than 3.5 times.

[0074] 15. The loading lock according to any one of the foregoing aspects, wherein the pump system is adapted to generate a pressure of less than 0.1 bar, preferably less than 0.01 bar, inside the loading lock, and / or wherein the ventilation gas can be introduced at atmospheric pressure, preferably wherein the ventilation gas is not preheated, and more preferably wherein the ventilation gas can be introduced at ambient temperature.

[0075] 16. A substrate handling system having a loading lock according to any one of the preceding aspects, wherein the substrate handling system is preferably an inline system and has an upstream region coupled to the loading lock, preferably a negative pressure region, and a downstream region coupled to the loading lock, preferably having atmospheric pressure.

[0076] 17. The substrate processing system according to aspect 16, wherein a temperature of at least 300°C, preferably at least 450°C and particularly preferably at least 600°C is maintained in the upstream region, and / or wherein an ambient temperature is maintained in the downstream region.

[0077] 18. A method for transferring a glass substrate from a low-pressure region to a higher-pressure region using a loading lock, wherein the loading lock comprises at least two parallel shielding plates made of a material that is at least partially transparent in at least the infrared range, wherein the method comprises:

[0078] i. Heat the two parallel shielding plates to a predetermined plate temperature;

[0079] ii. Introduce the glass substrate from the low-pressure region into the intermediate space between the two parallel shielding plates of the loading lock;

[0080] iii. Venting the lock using a venting gas; and

[0081] iv. Control the temperature in the intermediate space so that the temperature change of the glass substrate is at most 50 K, preferably at most 30 K.

[0082] 19. The method according to aspect 18, wherein the glass substrate has a first glass substrate temperature T when it is introduced into the loading lock. G And wherein the parallel shielding plate is heated in step i to a plate temperature T that meets the following requirements. P :T G – 20 K < T P < T G +50 K.

[0083] 20. The method according to aspect 18 or 19, further comprising:

[0084] v. Heating the transport device used to introduce the glass substrate into the intermediate space to a transport device temperature T that meets the following definition. T :T G – 100 K < T T Preferably T G – 50 K < T T And particularly preferred T G – 20K < T T .

[0085] 21. The method according to any one of aspects 18 to 20, wherein the method is performed in a loading lock according to any one of aspects 1 to 15.

[0086] 22. The method according to any one of aspects 18 to 21, wherein in step iii, the ventilation gas has an ambient temperature, and / or wherein the ventilation gas is not preheated.

[0087] 23. The method according to any one of aspects 18 to 22, wherein the temperature of the first glass substrate corresponds to a temperature between 300°C and 650°C, preferably between 450°C and 650°C, and particularly preferably between 500°C and 600°C, and / or corresponds to a temperature above the softening point of the glass substrate.

[0088] 24. The method according to any one of aspects 18 to 23, wherein T G – 10 K < T P < T G +30 K, preferably T G – 5 K < T P < T G +10 K.

[0089] 25. The method according to any one of aspects 18 to 24, wherein the glass substrate has a substrate thickness of up to 10 mm, preferably up to 5 mm and particularly preferably up to 3 mm.

[0090] 26. The method according to aspect 25, wherein the inner surfaces of the two shielding plates have a maximum distance from the surface of the glass substrate that is less than ten times the thickness of the substrate, preferably less than five times the thickness of the substrate, and particularly preferably less than twice the thickness of the substrate, and / or wherein the inner surfaces of the two shielding plates have a maximum distance from the corresponding glass substrate surface that is less than 20 mm, preferably less than 10 mm, and particularly preferably less than 5 mm. Attached Figure Description

[0091] Preferred embodiments of the invention will now be described with reference to the following accompanying drawings. The drawings show:

[0092] Figure 1 : A 3D view of the loading lock in the exemplary embodiment, wherein it is partially sectioned; and

[0093] Figure 2 From Figure 1 The cross-sectional view of the loading lock cut along a plane parallel to the xz plane. Detailed Implementation

[0094] Figure 1 A 3D view of an exemplary loading lock according to the present invention is shown. The loading lock 1 extends longitudinally along the x-axis and laterally along the y-axis. To better represent the individual components inside the loading lock, the 3D view shown has a partially cut-out section. The loading lock 1 includes a chamber wall 11, an inlet locking flap 3 (i.e., entry locking flap 3), and an outlet locking flap 4 (i.e., exit locking flap 4). The inlet locking flap 3 and the outlet locking flap 4 are adapted to both hermetically seal the inlet or outlet opening of the loading lock 1 (closed state) and release the inlet or outlet opening (open state). Venting gas can be supplied to the loading lock via a venting connector 2 to saturate the lock. The venting gas is preferably nitrogen, which is stored at high pressure and supplied to the loading lock under pressure. Alternatively, ambient air at ambient pressure can be supplied to the loading lock. The loading lock can also be supplied via an exhaust connector 12 that can be connected to a vacuum pump (see [link to exhaust connector]). Figure 2 The vacuum is evacuated. Therefore, the loading lock can be used to switch between areas with negative pressure and areas with ambient pressure. In other words, a vacuum can be created inside the loading lock by means of the venting connector 12, and air or gas can be supplied to the loading lock via the venting connector 2 so that the loading lock reaches ambient pressure.

[0095] The loading lock 1 includes two reflective shields 5a and 5b inside, which act as a liner and reduce heat flow from the interior of the chamber toward the chamber wall. A large area exists between the reflective shields 5a and 5b through which the glass substrate 10 can be transferred from the lock inlet flap 3 to the lock outlet flap 4. However, according to the invention, this area decreases in the vertical direction (i.e., in the z-direction). This area is constrained by two translucent shielding plates 8a and 8b in the infrared range.

[0096] According to the present invention, the two shielding plates 8a and 8b should be preheatable so that the temperature in the intermediate space between the two shielding plates can be maintained as constant as possible, or the temperature of the glass substrate 10 moving through the intermediate space between the two shielding plates 8a and 8b can be kept constant. For this reason, the loading lock includes plate heating devices 6a and 6b, which are installed outside the intermediate space between the shielding plates. The plate heating devices 6a and 6b are adapted and configured to heat the shielding plates 8a and 8b on one hand, and the object between the shielding plates on the other hand. In this embodiment, the plate heating devices 6a and 6b are implemented by a plurality of short-wave infrared (IR) emitters arranged along the longitudinal direction of the loading lock 1. Each IR emitter extends in the lateral direction (i.e., the y-direction). The individual IR emitters are spaced apart from each other in the longitudinal direction (i.e., the x-direction).

[0097] As in Figure 1 As can be seen in the cross-section, recesses exist in the lower shielding plate 8b through which the so-called transport rollers 9 protrude, allowing the glass substrate 10 to be transported through the loading lock 1. In the illustrated embodiment, the transport rollers are implemented in such a way that the shaft extending in the transverse direction has individual shoulders, each shoulder representing a transport roller. Rotation of the shaft or shoulders causes the glass substrate 10 to be transported through the loading lock 1. Alternatively, individually controlled rollers mounted on the axis can also be used as transport rollers. See below for reference. Figure 2 Explain the precise structure of load lock 1 and the operation mode of load lock.

[0098] Figure 2 Showing from Figure 1A cross-section cut along the XZ plane of the loading lock 1 is visible. A glass substrate 10 is visible, situated between two shielding plates 8a and 8b, and transported through the loading lock 1. In addition to the plate heating devices 6a and 6b arranged above and below the shielding plates, additional roller heating devices 7 are visible. These roller heating devices are mid-wave infrared heaters capable of heating the transport rollers to a predetermined temperature. The two shielding plates 8a and 8b are made of an optically translucent material. This allows the plate heating devices 6a and 6b (in this case, short-wave IR emitters) to directly heat both the shielding plates 8a and 8b and the intermediate space between them or the glass substrate 10. The selection of a suitable material for the shielding plates depends on the wavelength emitted by the plate heating devices 6a and 6b. The material should be translucent within at least a portion of the emission wavelength range of the plate heating devices 6a and 6b, such that the plate heating devices 6a and 6b can directly heat both the shielding plates and any gas or glass substrate located between them. The translucent nature of the shielding material is particularly advantageous when the mounting lock 1 is not vented, as heat transfer in a vacuum can only be achieved through radiation. Once the mounting lock is filled with gas or air, the gas or air in the intermediate space between the shielding plates 8a and 8b heats up rapidly, primarily through convection. Therefore, the size of the intermediate space, and consequently the volume of gas tightly surrounding the glass substrate, as well as the thickness of the shielding plates, are particularly relevant for controlling or maintaining a constant temperature within the glass substrate.

[0099] The purpose of the loading lock is to introduce a glass substrate from an upstream region where the glass substrate has been heated to a temperature above its strain point into the loading lock, so as to subsequently change the pressure in the loading lock while ensuring that the temperature of the glass substrate remains as constant as possible. Preferably, the temperature change of the glass substrate is at most 50K, more preferably at most 20K, more preferably at most 10K, and particularly preferably at most 5K. In other words, during the locking process, i.e., during the filling of the lock, the temperature change of the first glass substrate in the loading lock 1 should not exceed 50K, preferably not more than 20K, preferably not more than 10K, preferably not more than 5K, and most preferably remain as constant as possible.

[0100] Preferably, before introducing one or more glass substrates 10 into the intermediate space between the shielding plates 8a and 8b, the translucent shielding plates 8a and 8b may have been heated to a predetermined temperature, such as the temperature of the first glass substrate. In the illustrated configuration, the transport rollers can also be heated to a predetermined temperature using a roller heating device, so that there is no temperature difference at the rollers. This ensures that temperature fluctuations in the glass substrates are minimized when the glass substrates are introduced into the loading lock and when the loading lock is filled.

[0101] In the illustrated configuration, preheating of the incoming ventilation gas is not absolutely necessary. This is primarily due to the fact that the ventilation connectors are located outside the reflective shields 5a and 5b, and particularly outside the translucent shields 8a and 8b. The glass substrate 10 located between the shields 8a and 8b is not exposed to any direct airflow. The air or gas flowing into the intermediate space between the shields 8a and 8b can heat up rapidly, preferably because the surfaces of the plates and substrate have a larger volume relative to the gas in the intermediate space.

[0102] The loading lock 1 according to the invention is configured to transfer a glass substrate from a low-pressure region to an atmospheric-pressure region using a method significantly different from that used to date and from loading locks developed for this purpose. As described in the introduction, known systems generally use a method of cooling by means of a ventilation gas during the venting of the loading lock. At first glance, this seems advantageous because the ventilation gas allows for heat exchange via convection faster than that possible using radiation energy with an infrared heating device in a vacuum. However, cooling using a ventilation gas has several disadvantages, and satisfactory solutions to these disadvantages have not yet been found. As mentioned at the beginning, particular attention must be paid to the deformation of the glass substrate, as well as the complex preheating and temperature control systems for the ventilation gas. In addition, according to the prior art, the time required to fully fill the loading lock depends on the desired cooling profile of the specific glass substrate located in the lock, and in particular on the thickness of the substrate. This interdependence arises because the filling of the loading lock and the cooling of the substrate are combined, especially because the ventilation gas introduced to fill the loading lock is also directly used to cool the substrate. Therefore, filling the lock cannot necessarily be based solely on the shortest filling time. There is a conflict between the goal of filling the glass substrate as quickly as possible and the goal of specifically cooling the substrate, where the cooling time depends in particular on the type and thickness of the glass substrate.

[0103] This invention resolves this objective conflict by using a loading lock, which maintains a substantially constant substrate temperature during the filling process. Therefore, cooling does not occur in a vacuum or locking region, but only downstream in a region where the glass substrate is ventilated. This makes the glass substrate easier to handle and allows the use of convection energy to cool it. The locking process itself (i.e., filling the loading lock) can be performed at short and preferably constant time intervals, preferably independent of the type and thickness of the glass substrate. Making the filling time independent of the type and thickness of the glass substrate can preferably be achieved by ensuring that the glass substrate does not cool during the filling process.

[0104] Therefore, the design of the illustrated loading lock 1 is primarily intended to keep the temperature of the glass substrate as constant as possible during the filling of the lock. Specifically, for this reason, semi-transparent shielding plates 8a and 8b are used. Advantageously, the shielding plates 8a and 8b are kept as close to each other as possible, i.e., the intermediate space between the shielding plates 8a and 8b is kept as small as possible. In the illustrated embodiment, the distance between the two semi-transparent shielding plates 8a and 8b is only two to three times the thickness of the substrate 10. Furthermore, it is preferable that the shielding plates 8a and 8b have a thickness that allows heat energy to be stored within them. In the illustrated embodiment, the thickness of the shielding plate 8a or 8b approximately corresponds to the thickness of the glass substrate 10. The semi-transparent nature of the shielding plates 8a and 8b has the effect that, on the one hand, the shielding plates 8a and 8b can be preheated by the plate heating devices 6a and 6b, and on the other hand, the plate heating devices 6a and 6b also directly transfer radiant energy to the glass substrate 10. By combining the preheating of shielding plates 8a and 8b to a target temperature with the targeted heating of the glass substrate 10 itself using plate heating devices 6a and 6b, the temperature of the glass substrate 10 in a vacuum can be kept constant by using the radiant energy of an infrared heater. Due to the extremely small intermediate space, when the loading lock is ventilated, only a small amount of gas seeps into the immediate vicinity of the glass substrate, allowing this amount of gas to be rapidly heated by the preheated shielding plates 8a and 8b, as well as by the glass substrate 10 and the plate heating devices 6a and 6b. This allows the temperature of the glass substrate to remain substantially constant even if the inflowing gas itself is not preheated. Preferably, the transport roller 9 can also be heated by means of a roller heating device 7 to ensure that the temperature within the glass substrate 10 remains as constant as possible, even in areas where the glass substrate rests on or moves on the transport roller.

[0105] Preferably, a temperature sensor additionally mounted in the loading lock 1 can measure the temperature of the glass substrate 10 throughout the locking process or during the venting process of the loading lock. Difficulties may arise when controlling the plate heating devices 6a, 6b and the roller heating device 7. Experience shows that the edges of the glass substrate are particularly susceptible to temperature fluctuations. For example, in an in-line system, if several glass substrates are sequentially introduced into the loading lock, it is almost impossible to determine the substrate temperature at the lateral edges of the glass substrate 10 (i.e., the edges extending in the y-direction). Only at the longitudinal edges (i.e., the edges extending in the x-direction) can a suitable sensor be used to determine the plate temperature with sufficient accuracy. Based on the plate temperature measured there, the temperature of the glass substrate in each region can be inferred. For this purpose, empirical values ​​depending on the substrate type and thickness can preferably be used as scaling factors. By controlling the edges of the glass substrate, a uniform temperature distribution within the glass substrate can be ensured. This guarantees that no additional stress is introduced into the glass substrate during the locking process. This effectively prevents deformation or breakage of the glass substrate, especially in the case of large-area glass substrates.

[0106] It may be useful to heat the peripheral region and the central region of the glass substrate 10 to different degrees. For this purpose, segmented infrared heaters can preferably be used. In the illustrated embodiment, the individual IR emitters of the plate heating devices 6a, 6b extending in the y-direction are preferably segmented in such a way that they can be controlled differently in individual segments spaced apart from each other in the y-direction.

[0107] Using the invention shown, a nearly constant transfer time can be achieved regardless of the plate thickness because only the pressure within the loading lock is changed, without altering the glass substrate temperature. In downstream processes, the glass substrate temperature can be rapidly and preferably easily changed under ambient pressure by convection, and various methods exist in the prior art for controlling stress in the glass under ambient conditions during cooling. Therefore, the loading lock shown can also be advantageously used in inline systems with stringent time requirements. In particular, the loading lock shown can be used to transfer the glass substrate through the loading lock within one minute. In other words, the loading lock according to the invention is adapted and configured to change the locking pressure by 0.9 bar within 60 seconds, preferably 50 seconds, and more preferably 0.99 bar. Preferably, the loading lock according to the invention is also adapted and configured such that the temperature change between the two shielding plates 8a, 8b is a maximum of 50 K, preferably a maximum of 20 K, more preferably a maximum of 10 K, and even more preferably a maximum of 5 K.

[0108] Therefore, in the loading lock 1 according to the invention, when the loading lock is closed, a vacuum or negative pressure can be generated by means of a pump connected to the exhaust connector 12. Preferably, the negative pressure generated in the loading lock corresponds to the pressure in the upstream region, preferably at a maximum of 0.1 bar and more preferably at a maximum of 0.01 bar. The interior of the loading lock, particularly the translucent shielding plates 8a and 8b, can be preheated to a first temperature T1 by means of radiant heat from the plate heating devices 6a and 6b, which preferably corresponds to the temperature in the upstream region or the temperature of the glass substrate 10 in the upstream region. Similarly, the transport roller 9 can preferably be preheated by means of the roller heating device 7. Subsequently, the inlet locking flap 3 can be opened, and the glass substrate 10 can be introduced into the loading lock from the upstream region. Then, the inlet locking flap 3 can be closed. The glass substrate 10 can be transferred from the inlet locking flap to the outlet lock by means of the transport roller 9 through the intermediate space between the shielding plates 8a and 8b. Simultaneously, preferably within one minute or less, ventilation gas can be introduced into the loading lock via the ventilation connector 2, allowing the pressure in the loading lock to reach the pressure level of the downstream region, preferably the ambient pressure. During the inflow of ventilation gas, the temperature of the glass substrate 10 is kept constant due to the special design of the loading lock, as described in detail above. The locking process can be completed by opening the outlet locking flap 4 and introducing the glass substrate 10, still at temperature T1, into the downstream region, where controlled cooling of the glass substrate can then be performed. Therefore, the entire locking process can preferably be performed independently of the substrate type and substrate thickness, and particularly within a very short time, more preferably within one minute or less.

[0109] The above description pertains to using loading lock 1 as an exit loading lock, i.e., for transferring the glass substrate from a negative pressure region to an ambient pressure region. Similarly, loading lock 1 can also be used as an entry loading lock, as those skilled in the art will understand. In this case, the loading lock is used to transfer the glass substrate from a region with ambient pressure to a low pressure region. Temperature control of the glass substrate can preferably be performed in the same manner as in the ventilated condition described above.

Claims

1. A loading lock for a substrate handling system, the loading lock having an inlet locking flap and an outlet locking flap, wherein the loading lock includes a thermal insulator and a pump system, and wherein the loading lock is adapted and configured to introduce ventilation gas into the interior of the loading lock, wherein the loading lock further includes within its interior at least two parallel shielding plates, a transport device for transporting a substrate between the shielding plates from the inlet locking flap to the outlet locking flap, and a heating device, wherein the shielding plates comprise a material that is at least partially transparent in at least the infrared range.

2. The loading lock of claim 1, wherein the loading lock is adapted and configured to move a large-area glass substrate from the inlet locking flap to the outlet locking flap, wherein the large-area glass substrate has a diameter of at least 0.1m. 2 Preferably at least 0.3 m 2 And particularly preferably at least 0.5 m 2 The surface.

3. The loading lock according to any one of claims 1 or 2, wherein the intermediate space may be defined between the two parallel shielding plates, and wherein the heating device is located outside the intermediate space.

4. The loading lock according to any one of the preceding claims, wherein the inner surfaces of the two parallel shields have a maximum distance of less than 70 mm, preferably less than 40 mm, and particularly preferably less than 15 mm between them.

5. The loading lock according to any one of the preceding claims, wherein the optical transmittance of the shielding plate is greater than 30%, preferably greater than 60%, at wavelengths in the spectral range of 0.5 µm to 5 µm, and / or wherein the shielding plate comprises at least one of the following materials: quartz glass, glass ceramic, Schott NEXTREMA 712-3, Schott NEXTREMA 724-8, Schott NEXTREMA 724-3.

6. The loading lock according to any one of the preceding claims, wherein at least one shielding plate has a thickness of at least 2 mm, preferably at least 4 mm, and / or wherein at least one shielding plate has a thickness of at most 20 mm, more preferably at most 10 mm, and particularly preferably at most 5 mm.

7. The loading lock according to any one of the preceding claims, wherein the heating device comprises one or more infrared sources, preferably wherein the heating device comprises at least two types of infrared sources having different emission wavelength spectra.

8. The loading lock according to any one of the preceding claims, wherein the heating device is adapted and configured to heat the parallel shielding plate to a defined plate temperature, thereby preferably controlling the plate temperature in a targeted manner.

9. The loading lock according to any one of the preceding claims, wherein the parallel shield extends horizontally along the longitudinal axis of the loading lock, preferably wherein the parallel shield has two peripheral regions and a central region located between the peripheral regions in the transverse direction.

10. The loading lock according to any one of the preceding claims, wherein the transport unit comprises one or more transport rollers, and wherein the lower shield preferably includes an opening through which the transport rollers can protrude at least partially.

11. The loading lock of claim 10, wherein the heating device is adapted and configured to heat the transport roller to a defined transport roller temperature, thereby preferably controlling the transport roller temperature in a targeted manner.

12. The loading lock according to any one of claims 10 or 11, wherein the transport roller has a thermal conductivity of less than 2 W / mK, preferably less than 1 W / mK, and particularly preferably less than 0.5 W / mK.

13. The loading lock according to any one of claims 10 to 12, wherein the contact surface of a single transport roller is at most 25 mm. 2 Preferably, the maximum size is 9 mm. 2 And particularly preferably, the maximum size is 4 mm. 2 .

14. The loading lock according to any one of the preceding claims, wherein the thermal insulation of the loading lock comprises a liner having an opaque and / or partially transparent sheet, preferably wherein the liner reduces the heat flow from the interior of the chamber toward the chamber wall by more than 1.5 times, more preferably more than 2.5 times, and particularly preferably more than 3.5 times.

15. The loading lock according to any one of the preceding claims, wherein the pump system is adapted to generate a pressure of less than 0.1 bar, preferably less than 0.01 bar, inside the loading lock, and / or wherein the ventilation gas can be introduced at atmospheric pressure, preferably wherein the ventilation gas is not preheated, and more preferably wherein the ventilation gas can be introduced at ambient temperature.

16. A substrate handling system having a loading lock according to any one of the preceding claims, wherein the substrate handling system is preferably an inline system and has an upstream region coupled to the loading lock, preferably having a negative pressure region, and a downstream region coupled to the loading lock, preferably having atmospheric pressure.

17. The substrate processing system of claim 16, wherein a temperature of at least 300°C, preferably at least 450°C and particularly preferably at least 600°C is maintained in the upstream region, and / or wherein an ambient temperature is maintained in the downstream region.

18. A method for transferring a glass substrate from a low-pressure region to a higher-pressure region using a loading lock, wherein the loading lock comprises at least two parallel shielding plates made of a material that is at least partially transparent in at least the infrared range, wherein the method comprises: i. Heat the two parallel shielding plates to a predetermined plate temperature; ii. Introduce the glass substrate from the low-pressure region into the intermediate space between the two parallel shielding plates of the loading lock; iii. Ventilating the loading lock using ventilation gas; and iv. Control the temperature in the intermediate space so that the temperature change of the glass substrate is at most 50 K, preferably at most 30 K.

19. The method of claim 18, wherein the glass substrate has a first glass substrate temperature T when it is introduced into the loading lock. G And wherein the parallel shielding plate is heated in step i to a plate temperature T that meets the following requirements. P : T G – 20 K < T P < T G + 50 K。 20. The method of claim 18 or 19, further comprising: v. Heating the transport device used to introduce the glass substrate into the intermediate space to a transport device temperature T that meets the following definition. T :T G – 100 K < T T Preferably T G – 50 K < T T And particularly preferred T G – 20 K <T T .

21. The method according to any one of claims 18 to 20, wherein the method is performed in a loading lock according to any one of claims 1 to 15.

22. The method according to any one of claims 18 to 21, wherein in step iii, the ventilation gas has an ambient temperature, and / or wherein the ventilation gas is not preheated.

23. The method according to any one of claims 18 to 22, wherein the temperature of the first glass substrate corresponds to a temperature between 300°C and 650°C, preferably between 450°C and 650°C, and particularly preferably between 500°C and 600°C, and / or corresponds to a temperature above the softening point of the glass substrate.

24. The method according to any one of claims 18 to 23, wherein T G – 10 K < T P < T G +30 K, preferably T G – 5 K < T P < T G +10 K.

25. The method according to any one of claims 18 to 24, wherein the glass substrate has a substrate thickness of up to 10 mm, preferably up to 5 mm and particularly preferably up to 3 mm.

26. The method of claim 25, wherein the inner surfaces of the two shielding plates have a maximum distance from the glass substrate surface that is less than 10 times the thickness of the substrate, preferably less than 5 times the thickness of the substrate, and particularly preferably less than 2 times the thickness of the substrate, and / or wherein the inner surfaces of the two shielding plates have a maximum distance from the corresponding glass substrate surface that is less than 20 mm, preferably less than 10 mm, and particularly preferably less than 5 mm.

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