Laminated busbar used for parallel connection of high-power switching devices and adjustable in height

Abstract

The invention discloses a height-adjustable laminated busbar for parallel connection of high-power switching devices. The height-adjustable laminated busbar comprises an inflow plate assembly, an outflow plate assembly and a plurality of groups of replaceable conductive cushion blocks, wherein the inflow plate assembly and the outflow plate assembly are arranged in a laminated manner; the inflow plate assembly comprises an input conductive plate and insulating layers covering the upper and lower surfaces of the input conductive plate. The outflow plate assembly comprises an output current-conducting plate and insulating layers covering the upper and lower surfaces of the output current-conducting plate; a first through connecting hole and a second through connecting hole are respectively formed in corresponding positions of the input conductive plate and the output conductive plate; the conductive cushion block is provided with a mounting block and a diversion block which are integrally arranged; the mounting blocks of part of the conductive cushion blocks penetrate through the first connecting holes, and the mounting blocks of the other part of the conductive cushion blocks penetrate through the second connecting holes. The height design of the conductive cushion block meets a specific mathematical relationship, and the conductive cushion block can serve as a series of standard parts to form an assembly library to meet the requirements of different application scenes. According to the invention, flexible and accurate adjustment of the installation height is realized, and the space utilization rate, the insulation safety and the system integration degree are improved.

Description

Technical Field

[0001] This invention relates to the field of stacked busbar technology, and more specifically to a stacked busbar for parallel connection of high-power switching devices with adjustable height. Background Technology

[0002] Multilayer busbars are made by separating multiple conductive sheets with an insulating film and then hot-pressing them into a robust, flat integral component. They can be considered the "highway network" of electronic equipment (especially high-power equipment), used to efficiently and reliably transmit electrical energy and signals. Compared with traditional cables and copper busbars, they have advantages such as low parasitic inductance, high power density, high reliability and consistency, and simplified assembly.

[0003] To overcome the current capacity limitations of individual power switching devices, improve the overall system current and power levels, reduce conduction losses and thermal stress, and enhance system redundancy and reliability, multiple power switching devices are typically connected in parallel in high-power applications. In some cases, faster response speeds, higher interference immunity, and system reliability are required for power switching devices, necessitating the direct mounting of the drive module on the device surface. However, while existing multilayer busbars employ insulating films to isolate the drive module from the busbar, they do not provide sufficient space for the drive module, hindering subsequent installation and commissioning. Furthermore, they do not offer adequate creepage distances and clearances, particularly for high-power switching devices, compromising safety performance.

[0004] Therefore, it is necessary to propose a stacked busbar that is highly adjustable for parallel connection of high-power switching devices. Summary of the Invention

[0005] To address the aforementioned problems, the present invention aims to provide a novel, height-adjustable, multilayer busbar for parallel connection of high-power switching devices. This multilayer busbar, through a modular conductive pad design, achieves flexible and convenient adjustment of the overall installation height. It not only creates ample installation and heat dissipation space for upper-layer drive modules and other equipment but also effectively increases the distance to ground of critical electrical components, improving the system's insulation safety, environmental adaptability, and maintainability.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is as follows: A stacked busbar for parallel connection of high-power switching devices with adjustable height includes a stacked inlet plate assembly and an outlet plate assembly, and multiple sets of replaceable conductive pads. The inlet plate assembly includes an input conductive plate and an insulating layer covering its upper and lower surfaces. The outlet plate assembly includes an output conductive plate and an insulating layer covering its upper and lower surfaces. Corresponding positions of the input and output conductive plates are respectively provided with a through-hole first connection hole and a second connection hole. The conductive pads have an integrally formed mounting block and a current guiding block. The mounting blocks of some of the conductive pads pass through the first connection hole, and the mounting blocks of other conductive pads pass through the second connection hole.

[0007] Furthermore, the inlet plate assembly further includes an upper insulating block with an inner hole, and the outlet plate assembly further includes a lower insulating block with an inner hole; the first connecting hole includes a plurality of first guide holes and a first clearance hole, and the upper insulating block is installed in the first clearance hole; the second connecting hole includes a plurality of second guide holes and second clearance holes, and the lower insulating block is installed in the second clearance hole; the second guide holes and the first clearance holes are vertically connected and vertically connected respectively.

[0008] Furthermore, the conductive pad includes a first set of pads and a second set of pads; the mounting block of the first set of pads passes through the corresponding first guide hole from top to bottom and extends into the second clearance hole, and its guide block is located in the inner hole of the lower insulating block; the mounting block of the second set of pads passes through the corresponding second guide hole from bottom to top and extends into the first clearance hole.

[0009] Furthermore, the mounting block of the conductive pad is interference-fitted with the first or second flow guide hole; the flow guide block of the conductive pad is clearance-fitted with the inner hole of the lower or upper insulating block.

[0010] Furthermore, the first set of pads includes a first pad and a second pad, and the second set of pads includes a third pad and a fourth pad; the total height of the second pad and the fourth pad is greater than the total height of the first pad and the third pad, so that the top of the second pad and the fourth pad can protrude from the upper surface of the stacked busbar to provide an external device connection interface.

[0011] Furthermore, the upper end of the mounting block of the second pad passes through the input conductive plate, and the upper end of the mounting block of the fourth pad passes through the input conductive plate and extends into the inner hole of the corresponding upper insulating block.

[0012] Furthermore, the height design of each pad block satisfies the following relationship: Let the thickness of the input conductive plate, output conductive plate, upper insulating block, and lower insulating block be α, and the thickness of each insulating layer be β; the current-conducting block heights of the first pad, second pad, third pad, and fourth pad are x1, x2, x3, and x4, respectively, and the heights of the first pad, second pad, third pad, and fourth pad are y1, y2, y3, and y4, respectively; the height of the bottom surface of the stacked busbar from the mounting surface of the power switching device is h1, and the height of the mounting surface of the external equipment from the upper surface of the stacked busbar is h2; in, h1=x3=x4=x1-α-3β=x2-α-3β; y1 = x1 + α + β; y2 = y4 = x2 + α + β + h2; y3 = x3 + α + 3β.

[0013] Furthermore, the top of the mounting block of the conductive pad is provided with a threaded hole for locking the stacked busbar to the power switching device by fasteners.

[0014] Furthermore, by selecting conductive pads with different structural dimensions, the height of the stacked busbar relative to the mounting plane of the power switching device can be adjusted, and installation space can be provided for external equipment.

[0015] Furthermore, the conductive pads are serialized standard parts, providing a variety of specifications with different guide block heights (x) and overall heights (y) to form a pad component library that can adapt to different installation height (h1, h2) requirements.

[0016] The beneficial effects of this invention are as follows: (1) Height is flexible and adjustable: By replacing the standardized conductive pads of different heights, the bottom installation height (h1) and the upper interface platform height (h2) of the busbar can be adjusted independently or as a whole, effectively adapting to the installation requirements of drive modules of different thicknesses, and optimizing the safety distance according to the insulation requirements.

[0017] (2) High space utilization: The space formed between the raised busbar body and the mounting surface can be used to arrange drive modules, auxiliary circuits or optimize air ducts, which significantly improves the three-dimensional integration and heat dissipation efficiency of the system.

[0018] (3) Enhanced safety and reliability: The increased electrical clearance and creepage distance, combined with the physical isolation of the upper and lower insulation blocks, greatly improve the long-term insulation reliability and safety of the busbar in high voltage and high dv / dt working environment.

[0019] (4) Functional integration and expansion: The protruding design of specific pads (such as the second and fourth pads) can be directly used as the interface point for voltage sampling, temperature monitoring or auxiliary power supply, which simplifies the external wiring of the system and improves reliability.

[0020] (5) Good modularity and versatility: The pads, insulating blocks, etc. are all standardized modular components, which can be flexibly added, removed and configured according to the number, model and layout of the parallel power switching devices. The production and assembly are simple and the versatility is strong. Attached Figure Description

[0021] The structure of the present invention will be further described in detail below with reference to the accompanying drawings.

[0022] Figure 1 This is a schematic diagram of the overall three-dimensional structure of one embodiment of the stacked busbar of the present invention.

[0023] Figure 2 for Figure 1 Exploded view of the embodiment shown.

[0024] Figure 3 This is a schematic diagram of the input conductive plate in this invention.

[0025] Figure 4 This is a schematic diagram of the output conductive plate in this invention.

[0026] Figure 5 This is a schematic diagram of the structure of the four types of pads in this invention.

[0027] Figure 6 This is a partial assembly cross-sectional view of the inlet terminal (connected to the input pole of the power switching device) in this invention.

[0028] Figure 7 This is a partial assembly cross-sectional view of the outflow end (connected to the output pole of the power switching device) in this invention.

[0029] Explanation of the labels in the diagram: 1-Input conductive plate; 101-Input terminal; 102-Shunting terminal; 10201-First guide hole; 10202-First clearance hole; 2-Output conductive plate; 201-Output terminal; 202-Bucket terminal; 20201-Second guide hole; 20202-Second clearance hole; 3-First insulating film; 4-Second insulating film; 5-Third insulating film; 6-Fourth insulating film; 7-Conductive pad; 701-First pad block; 70101-First mounting block; 70102-First flow guide block; 702-Second pad; 70201-Second mounting block; 70202-Second flow guide block; 703-Third pad block; 70301-Third mounting block; 70302-Third flow guide block; 704-Fourth pad block; 70401-Fourth mounting block; 70402-Fourth flow guide block; 8 - Upper insulating block; 9 - Lower insulating block. Detailed Implementation

[0030] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The described embodiments are merely some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings of this specification are merely for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the conditions under which the invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to the size, without affecting the effects and objectives achieved by the invention, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms such as "upper," "lower," "left," "right," and "middle" used in this specification are merely for clarity and are not intended to limit the scope of the invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of the invention's implementation.

[0032] In the description of this invention, it should be noted that, unless otherwise expressly specified and limited, the terms "connected" or "linked" should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral connection; it can refer to a mechanical connection or an electrical connection; it can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances. It should be noted that the terms "comprising," "including," or any other variations are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Example

[0033] like Figure 1 and Figure 2 As shown, the present invention provides a stacked busbar for parallel connection of high-power switching devices with adjustable height, which includes an inlet plate assembly, an outlet plate assembly, and multiple sets of replaceable conductive pads 7.

[0034] like Figure 3As shown, the current input plate assembly is an integrated module on the current input side, comprising an input conductive plate 1 and an upper insulating block 8 with an inner hole. The input conductive plate 1 is T-shaped and made of high-conductivity copper. It includes an input terminal 101 for connecting to the positive terminal of an external DC power supply and a shunt terminal 102 for evenly distributing current to each parallel branch. The shunt terminal 102 has several pairs of through holes arranged regularly, including a first guide hole 10201 for inserting and fixing the conductive pad 7, and a first clearance hole 10202 for accommodating and fixing the upper insulating block 8. The upper and lower surfaces of the shunt terminal 102 of the input conductive plate 1 are respectively covered with a first insulating film 3 and a second insulating film 4, both of which have holes at corresponding positions that correspond to (and are vertically aligned with) the through holes on the shunt terminal 102. The upper insulating block 8 has a circular annular structure with a circular inner hole penetrating its upper and lower surfaces.

[0035] like Figure 4 As shown, the output plate assembly is an integrated module on the current output side, comprising an output conductive plate 2 and a lower insulating block 9 with an inner hole. The output conductive plate 2 is also T-shaped, arranged symmetrically with the input conductive plate 1, and is made of high-conductivity copper. The output conductive plate 2 includes a busbar 202 for collecting current from each branch and an output terminal 201 for connecting the load. The busbar 202 is also machined with several through holes, including a second guide hole 20201 and a second clearance hole 20202. Simultaneously, the second guide hole 20201 is completely aligned with and passes through the first clearance hole 10202 on the input conductive plate 1 in its vertical projection (vertical direction); the second clearance hole 20202 is completely aligned with and passes through the first guide hole 10201. A third insulating film 5 and a fourth insulating film 6 are respectively covered on the upper and lower surfaces of the output conductive plate 2, both of which have holes at corresponding positions that correspond to (and are vertically aligned with) the through holes on the busbar 202. The lower insulating block 9 has a square ring structure with a square inner hole that extends through its upper and lower surfaces.

[0036] The inlet plate assembly and the outlet plate assembly are aligned by stacking and then hot-pressed together as a whole.

[0037] like Figure 5As shown, the conductive pad 7 is a key modular component for achieving height adjustment and electrical connection. In this embodiment, it is divided into four types according to its installation position and function: first pad 701, second pad 702, third pad 703 and fourth pad 704, wherein the first pad 701 and the second pad 702 are collectively referred to as the first group of pads, and the third pad 703 and the fourth pad 704 are collectively referred to as the second group of pads. Each type of pad is integrally manufactured from a mounting block (70101, 70201, 70301, 70401) and a flow guide block (70102, 70202, 70302, 70402). (The first pad 701 is composed of the first mounting block 70101 and the first flow guide block 70102; the second pad 702 is composed of the second mounting block 70201 and the second flow guide block 70202; the third pad 703 is composed of the third mounting block 70301 and the third flow guide block 70302; and the fourth pad 704 is composed of the fourth mounting block 70401 and the fourth flow guide block 70402.) Mounting blocks are typically cylindrical with internally threaded holes at their top (the internal threads extend to the bottom surface of the current guide block and penetrate the upper and lower surfaces of the pad block) for fastening the entire stacked busbar to the electrodes or mounting base of the power switching device using bolts; current guide blocks are typically square plates with their bottom surfaces for large-area contact with the electrode surfaces of the power switching device to conduct large currents.

[0038] like Figure 6 The partial cross-sectional view of the inlet end shown illustrates the assembly process. First, the lower insulating block 9 is pressed into the second clearance hole 20202 of the output conductive plate 2 for fixation. Subsequently, the first mounting block 70101 of the first pad 701 and the second mounting block 70201 of the second pad 702 are pressed upward from the bottom of the output conductive plate 2 into the corresponding first guide hole 10201 of the input conductive plate 1 using an interference fit, ensuring reliable electrical connection and mechanical fixation. Furthermore, the second mounting block 70201 of the second pad 702 continues to extend upward, with its top end passing through the hole in the insulating film layer on the input conductive plate 1 and the circular inner hole of the insulating block 8, and finally extending out of the circular inner hole of the upper insulating block 8, so that its top protrudes from the upper surface of the stacked busbar (in addition to the functions of guiding and locking, it can also provide an additional interface for connecting external devices, such as monitoring equipment). The first current-guiding block 70102 of the first pad 701 and the second current-guiding block 70202 of the second pad 702 pass upward through the through space formed by the insulating film hole and the second clearance hole 20202, and finally sit in the square inner hole of the lower insulating block 9. The current-guiding blocks of the first pad 701 and the second pad 702 are in clearance fit with the inner hole of the lower insulating block 9 for easy assembly. At the same time, the upper surface of the current-guiding blocks of both pads is in close contact with the lower surface of the input conductive plate 1 to conduct current.

[0039] like Figure 7The partial cross-sectional view of the outlet end shown illustrates that the upper insulating block 8 is first pressed into the first clearance hole 10202 of the input conductive plate 1 for fixation. Then, the third mounting block 70301 of the third pad 703 and the fourth mounting block 70401 of the fourth pad 704 are pressed upwards from the bottom of the output conductive plate 2 into the corresponding second guide hole 20201 of the output conductive plate 2, forming an interference fit. The third guide block 70302 of the third pad 703 and the fourth guide block 70402 of the fourth pad 704 are located below the output conductive plate 2, and the upper surfaces of both the third guide block 70302 and the fourth guide block 70402 are in close contact with the lower surface of the output conductive plate 2. The fourth mounting block 70401 of the fourth pad 704 continues to extend upward, with its top end passing through the hole in the insulating film layer on the input conductive plate 1 and the circular inner hole of the insulating block 8, and finally extending out of the circular inner hole of the upper insulating block 8, so that its top protrudes from the upper surface of the stacked busbar (in addition to the current guiding and locking functions, it can also provide an additional interface to connect external devices, such as monitoring devices).

[0040] The height of each pad is designed to meet the following relationship: Let the thickness of the input conductive plate 1, output conductive plate 2, upper insulating block 8, and lower insulating block 9 be α, and the thickness of each insulating layer be β; the heights of the current-conducting blocks (70102, 70202, 70302, 70402) of the first pad 701, the second pad 702, the third pad 703, and the fourth pad 704 be x1, x2, x3, and x4, respectively, and the heights of the first pad 701, the second pad 702, the third pad 703, and the fourth pad 704 be y1, y2, y3, and y4, respectively; the height of the bottom surface of the stacked busbar from the mounting surface of the power switching device is h1, and the height of the mounting surface of the external equipment (such as monitoring equipment) from the upper surface of the stacked busbar is h2; The relation is as follows: h1=x3=x4=x1-α-3β=x2-α-3β; y1 = x1 + α + β; y2 = y4 = x2 + α + β + h2; y3 = x3 + α + 3β. Current path:

[0041] The main power current flows as follows: external current flows into the input conductive plate 1 from the input terminal 101, and after being distributed by the shunt terminal 102, it is shunted through the first pad 701 and the second pad 702 at each of the first guide holes 10201. The specific path is as follows: the current flows from the input conductive plate 1 through the mounting blocks (70101, 70201) of the first set of pads (first pad 701 and second pad 702), reaches its guide blocks (70102, 70202), and then flows from the bottom surface of the guide blocks (70102, 70202) to the positive terminal of the parallel power switching device that is locked with it by bolts. After the current flows through the power switching device, it then flows out from the negative terminal and reaches the bottom surface of the guide blocks (70302, 70402) of the corresponding second set of pads (third pad 703 and fourth pad 704). The current then flows upward through the mounting blocks (70301, 70401) of the second set of pads to the busbar 202 of the output conductive plate 2, and finally flows out from the output terminal 201 to the load.

[0042] Height adjustment principle: The present invention can achieve stepless or stepped height adjustment by selecting conductive pads 7 of different specifications.

[0043] (1) Adjust the bottom height h1: The height h1 defines the distance from the bottom surface of the stacked busbar (i.e., the bottom surface of the lower insulating block 9 or the outer surface of the lower insulating film of the output conductive plate 2) to the mounting surface of the power switching device. According to the design relationship h1=x3=x4=x1-α-3β=x2-α-3β, to change h1, simply replace all four types of conductive pads 7 as a set, selecting the conductive pad 7 model with the new current-conducting block height (x1', x2', x3', x4'). For example, when more bottom space is required, select the conductive pad 7 with a larger current-conducting block height to meet different application scenarios and needs.

[0044] (2) Adjust the height h2 of the upper interface: Height h2 defines the relative height of the platform at the top of the conductive pads 7 (second pad 702 and fourth pad 704) protruding from the upper surface of the busbar, providing space for the installation of external equipment (such as monitoring equipment). According to the relationship y2 = y4 = x2 + α + β + h2, to change h2, the second pad 702 and fourth pad 704 can be independently replaced with models having new total heights (y2', y4'), while the first pad 701 and third pad 703 can remain unchanged. This provides convenience for flexibly adapting to upper-layer equipment of different thicknesses.

[0045] (3) Serialized implementation: To achieve the aforementioned height adjustment function, the conductive pad 7 is designed and manufactured in a standardized and serialized manner. Specifically, based on common installation height requirements (the range of h1 and h2 values) and according to the aforementioned formula, a series of pads 701, 702, 703, and 704 with different guide block heights (x1, x2, x3, x4) and overall heights (y1, y2, y3, y4) are calculated and produced in advance, forming a complete pad component library. In actual assembly applications, designers or users only need to determine the final required h1 and h2 values ​​to quickly select the four corresponding specifications of pads from the component library for assembly. This method transforms customized height adjustment into the selection of standard parts, greatly improving design flexibility and assembly efficiency, and facilitating large-scale production and inventory management, which is the key to the efficient and economical implementation of this technical solution.

[0046] In summary, this invention, through its ingenious cross-hole layout and highly modular and serialized pad design, successfully achieves convenient, flexible, and precise adjustment of the installation height of the stacked busbar. It effectively resolves the irreconcilable contradictions between drive module installation space, heat dissipation requirements, insulation safety, and the low-inductance, compact design of the busbar in high-power, multi-device parallel systems, demonstrating outstanding practicality, reliability, and broad application value.

[0047] Other aspects of this invention that are not detailed herein are all conventional techniques known to those skilled in the art.

[0048] It should be noted that the terms “comprising,” “including,” or any other variations are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0049] The scope of protection of this invention is not limited to the technical solutions disclosed in the specific embodiments. Any modifications, equivalent substitutions, improvements, etc., made to the above embodiments based on the technical essence of this invention shall fall within the scope of protection of this invention.

Claims

1. A stacked busbar for parallel connection of high-power switching devices with adjustable height, characterized in that: The device includes a stacked inlet plate assembly and an outlet plate assembly, as well as multiple sets of replaceable conductive pads (7); the inlet plate assembly includes an input conductive plate (1) and an insulating layer covering its upper and lower surfaces; the outlet plate assembly includes an output conductive plate (2) and an insulating layer covering its upper and lower surfaces; the corresponding positions of the input conductive plate (1) and the output conductive plate (2) are respectively provided with a through first connection hole and a second connection hole; the conductive pad (7) has an integrally formed mounting block and a flow guide block; a portion of the mounting block of the conductive pad (7) passes through the first connection hole, and another portion of the mounting block of the conductive pad (7) passes through the second connection hole.

2. The stacked busbar for parallel connection of high-power switching devices and with adjustable height according to claim 1, characterized in that: The inlet plate assembly further includes an upper insulating block (8), and the outlet plate assembly further includes a lower insulating block (9). The first connecting hole includes a plurality of first guide holes (10201) and first clearance holes (10202), and the upper insulating block (8) is installed in the first clearance hole (10202); The second connecting hole includes a plurality of second guide holes (20201) and a second clearance hole (20202), and the lower insulating block (9) is installed in the second clearance hole (20202); The second guide hole (20201) and the first clearance hole (10202) are vertically connected.

3. The stacked busbar for parallel connection of high-power switching devices and with adjustable height according to claim 2, characterized in that: The conductive pad (7) includes a first set of pads (701, 702) and a second set of pads (703, 704); the mounting block of the first set of pads passes through the corresponding first guide hole (10201) from top to bottom and extends into the second clearance hole (20202), and its guide block is located in the inner hole of the lower insulating block (9); the mounting block of the second set of pads passes through the corresponding second guide hole (20201) from bottom to top and extends into the first clearance hole (10202).

4. The stacked busbar for parallel connection of high-power switching devices and with adjustable height according to claim 3, characterized in that: The mounting block of the conductive pad (7) is interference-fitted with the first guide hole (10201) or the second guide hole (20201); the guide block of the conductive pad (7) is clearance-fitted with the inner hole of the lower insulating block (9) or the upper insulating block (8).

5. The stacked busbar for parallel connection of high-power switching devices and with adjustable height according to claim 3, characterized in that: The first set of pads includes a first pad (701) and a second pad (702), and the second set of pads includes a third pad (703) and a fourth pad (704); the total height of the second pad (702) and the fourth pad (704) is greater than the total height of the first pad (701) and the third pad (703), so that the top of the second pad (702) and the fourth pad (704) can protrude from the upper surface of the stacked busbar to provide an external device connection interface.

6. The stacked busbar for parallel connection of high-power switching devices and with adjustable height according to claim 5, characterized in that: The upper end of the mounting block of the second pad (702) passes through the input conductive plate (1), and the upper end of the mounting block of the fourth pad (704) passes through the input conductive plate (1) and extends into the inner hole of the corresponding upper insulating block (8).

7. The stacked busbar for parallel connection of high-power switching devices and with adjustable height according to claim 5, characterized in that: The height design of each pad (7) satisfies the following relationship: Let the thickness of the input conductive plate (1), output conductive plate (2), upper insulating block (8) and lower insulating block (9) be α, and the thickness of each insulating layer be β; the current-conducting block heights of the first pad (701), second pad (702), third pad (703) and fourth pad (704) are x1, x2, x3 and x4 respectively, and the heights of the first pad (701), second pad (702), third pad (703) and fourth pad (704) are y1, y2, y3 and y4 respectively; the height of the bottom surface of the stacked busbar from the mounting surface of the power switching device is h1, and the height of the mounting surface of the external equipment from the upper surface of the stacked busbar is h2; in, h1=x3=x4=x1-α-3β=x2-α-3β; y1 = x1 + α + β; y2 = y4 = x2 + α + β + h2; y3 = x3 + α + 3β.

8. The stacked busbar for parallel connection of high-power switching devices and with adjustable height according to claim 1, characterized in that: The top of the mounting block of the conductive pad (7) is provided with a threaded hole for locking the stacked busbar to the power switching device by fasteners.

9. The stacked busbar for parallel connection of high-power switching devices and with adjustable height according to claim 1, characterized in that: By selecting conductive pads (7) with different structural dimensions, the height of the stacked busbar relative to the mounting plane of the power switching device can be adjusted, and installation space can be provided for external equipment.

10. The stacked busbar for parallel connection of high-power switching devices and with adjustable height according to any one of claims 1-9, characterized in that: The conductive pad (7) is a series of standard parts, providing a variety of specifications with different guide block heights and overall heights to form a pad assembly library that can adapt to different installation height requirements.

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