Method of manufacturing display device and electronic device including the same

Abstract

The invention discloses a method of manufacturing a display device and an electronic device including the display device. A method of manufacturing a display device includes forming a release frame exposing an uppermost surface of a display stack, where the display stack includes a first stack and a second stack sequentially stacked, and the uppermost surface of the display stack is an upper surface of the second stack; coating first curable resin on the upper surface of the second lamination layer and the release frame adjacent to the upper surface of the second lamination layer; forming a flexible coating on the second stack by curing the first curable resin; and removing the release frame.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2024-0112771, filed on August 22, 2024, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0003] Some aspects of embodiments of this disclosure relate to methods of manufacturing a display device and electronic devices including a display device. Background Technology

[0004] A display device is a device for displaying images. A display device can be implemented as a stack of multiple layers having various functions. For example, a display device may include a second layer located on top of a first layer.

[0005] The information disclosed in this background section is only intended to enhance the understanding of the background art, and therefore, the information discussed in this background section does not necessarily constitute prior art. Summary of the Invention

[0006] In a display device, the planar area of ​​the second layer can be larger than that of the first layer. In this case, when the second layer is formed directly on the first layer (for example, the second layer is formed on the first layer using an inkjet coating method), the process for forming the portion of the second layer that is not supported by the first layer may become difficult.

[0007] Some aspects of embodiments of this disclosure include an efficient method for manufacturing a display device with relatively low process difficulty.

[0008] According to some embodiments of the present disclosure, a method of manufacturing a display device includes: forming a release frame that exposes the uppermost surface of a display stack, wherein the display stack includes a first stack and a second stack stacked in sequence, and the uppermost surface of the display stack is the upper surface of the second stack; applying a first curable resin to the upper surface of the second stack and the release frame adjacent to the upper surface of the second stack; forming a flexible coating on the second stack by curing the first curable resin; and removing the release frame.

[0009] According to some embodiments, in a plan view, the area of ​​the first stack can be greater than the area of ​​the second stack.

[0010] According to some embodiments, in a plan view, the edge of the first stack can completely surround the edge of the second stack.

[0011] According to some embodiments, in cross-section, the release frame can completely cover the side surface of the second stack.

[0012] According to some embodiments, when applying the first curable resin, a first step region and a second step region can be defined around the second stack. In cross-section, in the first step region, the upper surface of the release frame can be aligned with the upper surface of the second stack, and in cross-section, in the second step region, the upper surface of the release frame can be at a higher level than the upper surface of the second stack.

[0013] According to some embodiments, when forming the flexible coating, in the cross section, in the second step region, the upper surface of the release frame can be aligned with the upper surface of the flexible coating.

[0014] According to some embodiments, when applying the first curable resin, the first curable resin can be applied to the upper surface of the second laminate and the upper surface of the release frame that overlaps with the first step region.

[0015] According to some embodiments, when applying the first curable resin, the first curable resin may not be applied to the upper surface of the release frame that overlaps with the second step region.

[0016] According to some embodiments, in a plan view, the area of ​​the flexible coating can be larger than the area of ​​the second stack.

[0017] According to some embodiments, in a plan view, the edge of the flexible coating can completely surround the edge of the second stack.

[0018] According to some embodiments, the first curable resin may include siloxane materials and epoxy materials.

[0019] According to some embodiments, the first curable resin may be a UV-curable resin.

[0020] According to some embodiments, forming a release frame may include: securing a display stack with a clamp, the clamp including a lower clamp having a receiving space for receiving a first stack and an upper clamp on the lower clamp and surrounding a second stack; applying a second curable resin between the upper clamp and the second stack; pressurizing the second curable resin with a mold; and curing the second curable resin to form a release frame.

[0021] According to some embodiments, the mold may include a protruding surface that projects in the direction facing the second stack.

[0022] According to some embodiments, in a plan view, the area of ​​the protruding surface can be greater than the area of ​​the second stack.

[0023] According to some embodiments, the second curable resin may include siloxane-based materials.

[0024] According to some embodiments, the second curable resin may not be applied to the upper surface of the second laminate.

[0025] According to some embodiments, the display stack may further include: a flexible circuit board having one end on the first stack and spaced apart from the second stack; and a driver on the flexible circuit board.

[0026] According to some embodiments, when the display stack is secured with a clamp, the driver may be positioned between the upper clamp and the lower clamp.

[0027] According to some embodiments, the method may further include: after removing the release frame, applying a protective layer onto the flexible coating.

[0028] According to some embodiments of this disclosure, an electronic device includes: a processor for providing input image data; and a display device for displaying an image based on the input image data. The display device can be manufactured using the methods described above.

[0029] In a method of manufacturing a display device according to some embodiments of the present disclosure, a release frame may be used to support portions of a first curable resin coated with a relatively large planar area that are not supported by a second stack having a relatively small planar area. A flexible coating may be formed on the second stack by curing the first curable resin.

[0030] Correspondingly, the difficulty of forming a flexible coating with a relatively large planar area directly on a second stack with a relatively small planar area can be reduced. Attached Figure Description

[0031] The above and other aspects of embodiments of the present disclosure will become more apparent from the accompanying drawings, in which:

[0032] Figure 1 This is a perspective view illustrating a display device according to some embodiments of the present disclosure;

[0033] Figure 2 It is along Figure 1 A cross-sectional view taken from line I1-I1';

[0034] Figure 3 It is a diagram. Figure 2 A cross-sectional view of the panel layer;

[0035] Figures 4 to 25 This is a diagram illustrating a method of manufacturing a display device according to some embodiments of the present disclosure;

[0036] Figures 26 to 35 This is a diagram illustrating a method of manufacturing a display device according to some embodiments of the present disclosure;

[0037] Figure 36 This is a schematic block diagram illustrating an electronic device including a display device according to some embodiments of the present disclosure;

[0038] Figure 37 It is a diagram. Figure 36 The electronic device is a schematic diagram of an example of a smartphone; and

[0039] Figure 38 It is a diagram. Figure 36 The electronic device is a schematic diagram of an example of a tablet computer. Detailed Implementation

[0040] In the following description, aspects of some embodiments of the present disclosure are described in more detail with reference to the accompanying drawings. It should be noted that in the following description, only the parts necessary for understanding operation according to the present disclosure are described, and other parts are omitted so as not to obscure the subject matter of the disclosure. Furthermore, the present disclosure may be implemented in other forms and is not limited to the embodiments described herein. However, the embodiments described herein are provided to be described in sufficient detail to enable those skilled in the art to implement the technical spirit of the present disclosure.

[0041] Throughout this specification, the phrase "connected" to another part includes either a part being "directly connected" to the other part or a part being "indirectly connected" to the other part with another element intervening therebetween. The terminology used herein is for describing particular embodiments and is not intended to limit this disclosure. Throughout this specification, unless otherwise stated, the phrase "comprising" of a particular part means that the part may further include another component, without excluding the other component. "At least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" can be interpreted as one X, one Y, one Z, or any combination of two or more of X, Y, and Z (e.g., XYZ, XY, YZ, and XZ). Here, "and / or" includes all combinations of one or more of the corresponding constructions.

[0042] Here, terms such as “first” and “second” may be used to describe various components, but these components are not limited by these terms. These terms are used to distinguish one component from another. Therefore, the first component may refer to the second component within a certain scope without departing from the scope disclosed herein.

[0043] Spatial relative terms such as “below” and “above” are used for descriptive purposes to describe the relationship between one element or feature and another element(s) as shown in the accompanying drawings. In addition to the directions depicted in the drawings, spatial relative terms are intended to also include other orientations of the device in use, operation, and / or manufacture. For example, when the device shown in the figures is inverted, the element depicted as being “below” other elements or features is in an orientation “above” that other element or feature. Therefore, in this disclosure, the term “below” can include both above and below orientations. Furthermore, the device may face other orientations (e.g., rotated 90 degrees or in other orientations), and therefore the spatial relative terms used herein are interpreted accordingly.

[0044] Some aspects of the embodiments are described in further detail with reference to the accompanying drawings, which schematically illustrate preferred embodiments. Accordingly, it will be contemplated that the shape may vary, for example, depending on tolerances and / or manufacturing techniques. Therefore, the embodiments disclosed herein should not be construed as limited to the specific shapes shown, but should be interpreted as including variations in shape, for example, due to manufacturing processes. As mentioned above, the shapes shown in the drawings may not indicate the actual shape of areas of the device, and this embodiment is not limited thereto.

[0045] Figure 1 This is a perspective view illustrating a display device according to some embodiments of the present disclosure.

[0046] refer to Figure 1 The display device DD may include a display area DA and a non-display area NDA.

[0047] The display area DA can be the area where the image IM is displayed. For example, the display area DA can be implemented on a plane defined by a first direction DR1 and a second direction DR2. The third direction DR3 can be a direction perpendicular to or orthogonal to the first direction DR1 and the second direction DR2. In this specification, the phrase "in a plane" or "in a plan view" can refer to the direction of viewing from a third direction DR3 toward the display area DA.

[0048] The non-display area NDA can be arranged around the display area DA (e.g., on the periphery of the display area DA or outside the coverage area of ​​the display area DA). Various types of circuitry and lines can be provided in the non-display area NDA to generate and / or transmit the various signals required for displaying the image IM in the display area DA.

[0049] According to some embodiments, the display device DD can be a foldable display device. For example, the display device DD can be folded and unfolded like a book based on a folding axis FX parallel to the first direction DR1, without damaging the display device DD.

[0050] Figure 2 It is along Figure 1 The cross-sectional view taken from line I1-I1'.

[0051] refer to Figure 2 The display device DD may include a board 10, a lower protective layer 20, a panel layer PNL, an impact absorbing layer 30, a flexible coating 40, a first protective layer 50, a second protective layer 60, a first adhesive layer to a fourth adhesive layer PSAa, PSAb, PSAc and PSAd, a flexible circuit board 70 and a driver 80.

[0052] Plate 10 can have relatively high rigidity. Plate 10 can be used to support components located on plate 10.

[0053] The lower protective layer 20 may be located on the plate 10. The lower protective layer 20 can be used to prevent impurities from diffusing from the plate 10.

[0054] The first adhesive layer PSAa can be located between the lower protective layer 20 and the plate 10. The lower protective layer 20 and the plate 10 can be adhered to each other through the first adhesive layer PSAa.

[0055] The panel layer PNL may be located on the lower protective layer 20. The panel layer PNL may include various components for providing the image IM. See later. Figure 3 Describe the panel layer PNL in detail.

[0056] The second adhesive layer PSAb can be located between the panel layer PNL and the lower protective layer 20. The panel layer PNL and the lower protective layer 20 can be adhered to each other through the second adhesive layer PSAb.

[0057] The shock-absorbing layer 30 may be located on the panel layer PNL. The shock-absorbing layer 30 can protect components located beneath it from external forces. For example, the shock-absorbing layer 30 may include a material with excellent damping properties.

[0058] The third adhesive layer PSAc can be located between the impact absorbing layer 30 and the panel layer PNL. The impact absorbing layer 30 and the panel layer PNL can be adhered to each other through the third adhesive layer PSAc.

[0059] The flexible coating 40 can be located on the impact absorbing layer 30. The flexible coating 40 can have a higher rigidity than the impact absorbing layer 30 and can have relatively flexible properties.

[0060] The fourth adhesive layer PSAd can be located between the flexible coating 40 and the impact-absorbing layer 30. The flexible coating 40 and the impact-absorbing layer 30 can be adhered to each other through the fourth adhesive layer PSAd.

[0061] The first protective layer 50 may be located on the flexible coating 40. The first protective layer 50 may have a higher rigidity than the flexible coating 40. The first protective layer 50 may be used to protect components located beneath the first protective layer 50 from external forces. According to some embodiments, the first protective layer 50 may be referred to as a cover window. In this case, the first protective layer 50 may comprise glass or plastic.

[0062] The second protective layer 60 may be located on the first protective layer 50. The second protective layer 60 may be used to prevent or reduce traces (e.g., fingerprints) left by the user's contact with the display device DD.

[0063] One end of the flexible circuit board 70 may be located on the panel layer PNL. The driver 80 may be located on the flexible circuit board 70. The driver 80 can provide electrical signals via wires included in the flexible circuit board 70 and wires included in the panel layer PNL. Figure 3 The pixel circuit layer PCL Figure 3 The pixel circuit PXC.

[0064] According to some embodiments, a portion of the flexible circuit board 70 can be bent. Accordingly, the driver 80 located on the flexible circuit board 70 can be located below the board 10.

[0065] According to some embodiments, the various types of layers constituting the display device DD can have different areas (or sizes). For example, in Figure 2 On the cross section, the width of the second direction DR2 of the flexible coating 40 can be greater than the width of the second direction DR2 of the fourth adhesive layer PSAd located directly below the flexible coating 40.

[0066] Figure 3 It is a diagram. Figure 2 A cross-sectional view of the panel layer.

[0067] refer to Figure 3 The panel layer PNL may include a substrate SUB and a pixel circuit layer PCL, a display element layer DPL, an input sensing layer ISL, and an optical function layer LFL stacked sequentially on the substrate SUB along the third direction DR3.

[0068] The substrate SUB can be formed from an insulating material such as glass or resin. For example, the substrate SUB may include a glass substrate. As another example, the substrate SUB may include a polyimide (PI) substrate. As yet another example, the substrate SUB may include a silicon wafer substrate formed using semiconductor processes.

[0069] In embodiments, the substrate SUB can be formed of a flexible material that can be bent or folded, and can have a single-layer or multi-layer structure. For example, the flexible material may include at least one selected from polystyrene, polyvinyl alcohol, polymethyl methacrylate, polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, cellulose triacetate, and cellulose acetate propionate. However, embodiments according to this disclosure are not limited thereto.

[0070] The pixel circuit layer (PCL) can be located on the substrate (SUB). The PCL may include an insulating layer and semiconductor and conductive patterns located between the insulating layers. The semiconductor and conductive patterns of the PCL can function as circuit elements (e.g., transistors and / or capacitors) and lines. These circuit elements and lines can define a pixel circuit (PXC). Multiple pixel circuits (PXCs) can be provided.

[0071] The display element layer (DPL) can be located on the pixel circuit layer (PCL). The display element layer (DPL) can include light-emitting elements (LDs). The light-emitting elements (LDs) can be connected to the pixel circuits (PXCs) of the pixel circuit layer (PCL). The light-emitting elements (LDs) can emit light based on electrical signals provided by the pixel circuits (PXCs). Multiple light-emitting elements (LDs) can be provided.

[0072] The input sensing layer (ISL) may be located on the display element layer (DPL). The input sensing layer (ISL) may include sensing electrodes (TE). The sensing electrodes (TE) can sense input from the user of the display device (DD) (e.g., an external object such as the user's hand or a pen). Multiple sensing electrodes (TE) may be provided.

[0073] The optical functional layer (LFL) may be located on the input sensing layer (ISL). The LFL may include a light conversion pattern comprising color conversion particles and / or scattering particles. For example, the color conversion particles may include quantum dots. Quantum dots can alter the wavelength (or color) of light emitted from the display element layer (DPL). The LFL may further include a light scattering pattern with scattering particles. In embodiments, the light conversion pattern and light scattering pattern may be omitted.

[0074] The optical functional layer (LFL) may further include a color filter layer containing a color filter. The color filter can selectively transmit light of a specific wavelength (or a specific color). In some embodiments, the color filter layer may be omitted.

[0075] Figures 4 to 25 This is a diagram illustrating a method of manufacturing a display device according to some embodiments of the present disclosure. Figure 6 It is along Figure 5 The cross-sectional view taken from line J1-J1'. Figure 8 It is along Figure 7The cross-sectional view taken from line J2-J2'. Figure 10 It is along Figure 9 The cross-sectional view taken from line J3-J3'. Figure 12 It is along Figure 11 The cross-sectional view taken from line J4-J4'. Figure 14 It is along Figure 13 The cross-sectional view taken from line J5-J5'. Figure 16 It is along Figure 15 The cross-sectional view taken from line J6-J6'.

[0076] Figure 18 It is along Figure 17 The cross-sectional view taken from line J7-J7'. Figure 21 It is along Figure 20 The cross-sectional view taken from line J8-J8'. Figure 23 It is along Figure 22 The cross-sectional view taken from line J9-J9'. Figure 25 It is along Figure 24 A cross-sectional view taken from line J10-J10'. Although Figures 4 to 25 Various operations in a method of manufacturing a display device are illustrated, but the embodiments of this disclosure are not limited thereto, and the method may include additional or fewer operations, or the order of operations may be changed, without departing from the spirit and scope of the embodiments of this disclosure, unless otherwise stated or implied.

[0077] refer to Figure 4 The method of manufacturing the display device DD may include operations SS1 to SS10.

[0078] refer to Figure 5 and Figure 6 It can provide a display stack DST (operation SS1) including a first stack ST1 and a second stack ST2 sequentially stacked on a third-party DR3.

[0079] The first stack ST1 may include a lower protective layer 20, a second adhesive layer PSAb, and a panel layer PNL, stacked sequentially along the third direction DR3. The second stack ST2 may include a third adhesive layer PSAc, an impact-absorbing layer 30, and a fourth adhesive layer PSAd, stacked sequentially along the third direction DR3.

[0080] According to some embodiments, the planar areas of the lower protective layer 20 and the second adhesive layer PSAb may be equal (or substantially equal) to each other. In a plane (or in a plan view), the lower protective layer 20 and the second adhesive layer PSAb may completely (or substantially completely) overlap.

[0081] According to some embodiments, the planar area of ​​the panel layer PNL can be greater than the planar area of ​​the lower protective layer 20 and greater than the planar area of ​​the second adhesive layer PSAb.

[0082] According to some embodiments, the planar areas of the third adhesive layer PSAc, the shock-absorbing layer 30, and the fourth adhesive layer PSAd may be equal (or substantially equal) to each other. In a plane (or in a plan view), the third adhesive layer PSAc, the shock-absorbing layer 30, and the fourth adhesive layer PSAd may completely (or substantially completely) overlap.

[0083] According to some embodiments, the planar area of ​​the first stack ST1 may be larger than the planar area of ​​the second stack ST2. In this case, in the plane (or in a plan view), the edge of the first stack ST1 may completely surround the edge of the second stack ST2. For example, in the plane (or in a plan view), the edge of the panel layer PNL constituting the first stack ST1 may completely surround the edge of the fourth adhesive layer PSAd constituting the second stack ST2.

[0084] According to some embodiments, the display stacked DST may further include a flexible circuit board 70 and a driver 80.

[0085] One end of the flexible circuit board 70 may be located on the first stack ST1. For example, one end of the flexible circuit board 70 may be located on the panel layer PNL. The flexible circuit board 70 may be spaced apart from the second stack ST2.

[0086] The driver 80 may be located on the flexible circuit board 70. The driver 80 can provide electrical signals to the pixel circuit PXC of the pixel circuit layer PCL via lines included in the flexible circuit board 70 and lines included in the panel layer PNL.

[0087] refer to Figure 7 and Figure 8 The display shows that the stacked DST can be fixed by the jig (operation SS2).

[0088] According to some embodiments, the jig may include a lower jig JIG_L and an upper jig JIG_U.

[0089] The lower clamp JIG_L may include a receiving space AC for accommodating the first stack ST1. The receiving space AC may be pressed down in a direction opposite to the third direction DR3 and may have a shape corresponding to the shape of the first stack ST1. According to some embodiments, the horizontal height of the upper surface of the lower clamp JIG_L adjacent to the receiving space AC may be the same (or substantially the same) as the horizontal height of the upper surface of the panel layer PNL that is the uppermost surface of the first stack ST1.

[0090] The upper clamp JIG_U can be fastened to the lower clamp JIG_L. In this case, a portion of the flexible circuit board 70 and the driver 80 can be positioned between the upper clamp JIG_U and the lower clamp JIG_L.

[0091] The upper clamp JIG_U can be provided to surround the second stack ST2. In this case, in the plane (or in a plan view), the inner edge of the upper clamp JIG_U can be spaced apart from the edge of the second stack ST2 and can completely surround the edge of the second stack ST2. The upper clamp JIG_U can be spaced apart from the second stack ST2. In addition, the horizontal level of the upper surface of the upper clamp JIG_U can be higher than the horizontal level of the upper surface of the second stack ST2.

[0092] refer to Figure 9 and Figure 10 The second curable resin TSR can be applied between the upper jig JIG_U and the second stack ST2 (operation SS3).

[0093] According to some embodiments, the second curable resin TSR may include a siloxane-based material. For example, the second curable resin TSR may be polydimethylsiloxane (PDMS). The second curable resin TSR may be a thermosetting resin.

[0094] According to some embodiments, the second curable resin TSR may not be applied to the upper surface of the second stack ST2. The second curable resin TSR can be applied by inkjet printing using nozzle NZ_TSR, and in this case, the second curable resin TSR can be selectively applied to the separation space between the second stack ST2 and the upper clamp JIG_U.

[0095] refer to Figure 11 and Figure 12 The second curable resin TSR can be pressed using a mold (operation SS4).

[0096] According to some embodiments, the mold MOLD may include a protruding surface MOLD_PS that projects in the direction facing the second stack ST2. In a plane (or in a plan view), the area of ​​the protruding surface MOLD_PS may be larger than the area of ​​the second stack ST2. Additionally, in a plane (or in a plan view), the edge of the protruding surface MOLD_PS may completely surround the edge of the second stack ST2.

[0097] The protruding surface MOLD_PS of the mold MOLD can directly contact the entire upper surface of the second stack ST2. The side surface of the mold MOLD can directly contact the inner surface of the upper fixture JIG_U.

[0098] By applying pressure to the mold, the second curable resin TSR can be deformed into a shape corresponding to the shape of the mold.

[0099] refer to Figures 12 to 14 While the second curable resin TSR is pressed by the mold MOLD, heat H can be supplied from the heat source HS. Accordingly, the second curable resin TSR can be cured to form a release frame RFR (operation SS5). After this operation, the mold MOLD can be removed.

[0100] Release frame RFR can have the same characteristics as the reference. Figure 12 The shape described corresponds to the shape pressed by the mold (MOLD) of the second curable resin TSR. For example, according to some embodiments, a first step region STA1 and a second step region STA2 surrounding the second stack ST2 can be defined in a plane (or in a plan view). In the first step region STA1, in cross-section, the upper surface of the release frame RFR can be aligned with the upper surface of the second stack ST2. In the second step region STA2, in cross-section, the upper surface of the release frame RFR can be located at a horizontal height higher than the horizontal height of the upper surface of the second stack ST2. That is, the release frame RFR can have a step between the first step region STA1 and the second step region STA2. In cross-section, the release frame RFR can completely cover the side surface of the second stack ST2 and can expose the upper surface of the second stack ST2.

[0101] According to some embodiments, because the second curable resin TSR provided to form the release frame RFR comprises a siloxane-based material, the release frame RFR can have sufficient release force. That is, the release frame RFR can be easily separated from the display stack DST.

[0102] refer to Figure 15 and Figure 16 The first curable resin UCR can be applied to the upper surface of the second stack ST2 and the release frame RFR adjacent to the upper surface of the second stack ST2 (operation SS6).

[0103] According to some embodiments, the first curable resin UCR may include siloxane-based materials and epoxy-based materials. Siloxane-based materials can impart excellent rigidity to the first curable resin UCR. Epoxy-based materials can impart excellent flexibility to the first curable resin UCR. The first curable resin UCR may be a photocurable resin (e.g., a UV-curable resin).

[0104] According to some embodiments, a first curable resin UCR can be applied to the upper surface of the second laminate ST2 and the upper surface of the release frame RFR that overlaps with the first step region STA1. The first curable resin UCR may not be applied to the upper surface of the release frame RFR that overlaps with the second step region STA2. The first curable resin UCR can be applied by inkjet printing using a nozzle NZ_UCR, and in this case, the first curable resin UCR can be selectively applied to the area surrounded by the second step region STA2.

[0105] According to some embodiments, the planar area of ​​the first curable resin UCR can be larger than the planar area of ​​the second stack ST2. In the plane (or in a plan view), the edge of the first curable resin UCR can completely surround the edge of the second stack ST2. In this case, the portion of the first curable resin UCR not supported by the second stack ST2 can be supported by the release frame RFR.

[0106] As described above, in this operation, the release frame RFR can be used to support portions of the first curable resin UCR that cannot be supported solely by the second stack ST2, which has a relatively small planar area.

[0107] refer to Figure 17 and Figure 18 The light L can be provided from the light source LS. The light L can be, for example, UV light. Accordingly, the first curable resin UCR can be cured to form a flexible coating 40 on the second stack ST2 (operation SS7).

[0108] According to some embodiments, the area of ​​the flexible coating 40 may be larger than the area of ​​the second stack ST2 in a planar (or planar) view. The edge of the flexible coating 40 may completely surround the edge of the second stack ST2 in a planar (or planar) view.

[0109] As described above, in operation SS6, since the portion of the first curable resin UCR that cannot be supported solely by the second stack ST2 with a relatively small planar area is supported by the release frame RFR, the difficulty of the process for directly forming a flexible coating 40 with a relatively large planar area on the second stack ST2 with a relatively small planar area can be reduced.

[0110] According to some embodiments, because the first curable resin UCR provided to form the flexible coating 40 includes siloxane and epoxy materials, the flexible coating 40 can have sufficient rigidity and sufficient flexibility.

[0111] According to some embodiments, in the second step region STA2, the upper surface of the release frame RFR can be aligned with the upper surface of the flexible coating 40 in cross-section.

[0112] refer to Figures 19 to 21 The jig can be separated from the display stack DST and release frame RFR (operation SS8).

[0113] The separation of the jig can be performed, for example, by moving the upper jig JIG_U, which is fastened to the lower jig JIG_L, onto the third-party DR3, thereby separating the upper jig JIG_U from the lower jig JIG_L and dispersing the stack DST from the lower jig JIG_L.

[0114] refer to Figure 22 and Figure 23 It can remove the release frame RFR (operation SS9).

[0115] As described above, because the release frame RFR comprises a siloxane-based material and possesses sufficient release force, the release frame RFR can be easily separated from the display stack DST. For example, the release frame RFR can be removed from the display stack DST by physical methods.

[0116] refer to Figure 24 and Figure 25 A first protective layer 50 can be provided on the flexible coating 40 (operation SS10).

[0117] After this operation, further settings can be configured as needed. Figure 2 The operation of the various components constituting the display device DD is described. Accordingly, the display device DD can be provided.

[0118] Figures 26 to 35 This is a diagram illustrating a method of manufacturing a display device according to some embodiments of the present disclosure. Figure 27 It is along Figure 26 The cross-sectional view taken from line K1-K1'. Figure 29 It is along Figure 28 The cross-sectional view taken from line K2-K2'.

[0119] Figure 31 It is along Figure 30 The cross-sectional view taken from line K3-K3'. Figure 33 It is along Figure 32 The cross-sectional view taken from line K4-K4'. Figure 35 It is along Figure 34 The cross-sectional view taken from line K5-K5'. In the description Figures 26 to 35 The method for manufacturing a display device is mainly described and referenced. Figures 4 to 25 The differences between the described embodiments and those described herein are omitted and replaced with the above content.

[0120] refer to Figure 26 and Figure 27 Except for using the corresponding frame DST_FR for the explicit overlay instead of the explicit overlay DST, the reference can be performed in the same (or substantially the same) way. Figure 11 and Figure 12 The described operation is SS4. The display of the overlay corresponding to the frame DST_FR can be compared with... Figure 11 and Figure 12 The DST stacks shown in the figure have the same (or substantially the same) shape.

[0121] According to some embodiments, the stacked corresponding frame DST_FR can be integrally formed with the lower fixture JIG_L.

[0122] refer to Figures 27 to 29 Release frame RFR can be used with reference Figures 12 to 14 The described operation is formed using the same (or substantially the same) method as SS5. Here, because the display overlay corresponding frame DST_FR has the same (or substantially the same) shape as the display overlay DST, Figure 28 and Figure 29 The release frame RFR can also be used with Figure 13 and Figure 14 The release frames RFR have the same shape.

[0123] After this operation, the release frame RFR can be separated from other components.

[0124] refer to Figure 30 and Figure 31 After the display stack DST is secured to the lower jig JIG_L, the detachable release frame RFR can be provided (or formed) on the display stack DST secured to the lower jig JIG_L. In this case, compared with the reference... Figure 13 and Figure 14 Compared to the described operation, the upper clamp JIG_U can be omitted.

[0125] refer to Figures 32 to 35 ,refer to Figures 15 to 18 Operations SS6 and SS7 described herein can be performed in the same (or substantially the same) (or similar) manner. Accordingly, flexible coating 40 can be formed on the second stack ST2.

[0126] After this operation, refer to Figures 19 to 25 The operations described SS8, SS9 and SS10 can be performed in the same (or substantially the same) (or similar) manner.

[0127] Figure 36 This is a schematic block diagram illustrating an electronic device including a display device according to some embodiments of the present disclosure. Figure 37 It is a diagram. Figure 36The electronic device shown is a schematic diagram of an example of a smartphone. Figure 38 It is a diagram. Figure 36 The electronic device is a schematic diagram of an example of a tablet computer.

[0128] refer to Figures 36 to 38 The electronic device 1000 may include a processor 1010, a memory device 1020, a storage device 1030, an input / output (I / O) device 1040, a power supply 1050, and a display device 1060. The display device 1060 may be... Figures 1 to 2 The display device DD. The electronic device 1000 may further include various ports for communicating with video cards, sound cards, memory cards, USB devices, or other systems. According to some embodiments, such as Figure 37 As shown, the electronic device 1000 may be a smartphone. According to some embodiments, such as... Figure 38 As shown, electronic device 1000 may be a tablet computer. However, the foregoing example is illustrative, and electronic device 1000 is not necessarily limited to the foregoing example. For example, electronic device 1000 may be a cellular phone, video phone, smart tablet, smartwatch, vehicle navigation device, computer monitor, laptop computer, or head-mounted display device, etc.

[0129] Processor 1010 can perform specific calculations or tasks. According to some embodiments, processor 1010 may be a microprocessor, a central processing unit, or an application processor, etc. Processor 1010 can be connected to other components via address buses, control buses, and data buses, etc. According to some embodiments, processor 1010 can be connected to an expansion bus such as a peripheral component interconnect (PCI) bus. According to some embodiments, processor 1010 can provide input image data to display device 1060. Therefore, display device 1060 can display an image based on the input image data provided from processor 1010.

[0130] The memory device 1020 can store data required for performing operations of the electronic device 1000. The memory device 1020 can function as the working memory and / or buffer memory of the processor 1010. For example, the memory device 1020 may include one or more volatile memory devices such as dynamic random access memory (DRAM) devices, static random access memory (SRAM) devices, and mobile DRAM devices.

[0131] Storage device 1030 can store data in response to control signals or data from processor 1010. Storage device 1030 may include one or more non-volatile storage devices for retaining data even when electronic device 1000 is powered off. In some embodiments, storage device 1030 may include a solid-state drive (SSD), hard disk drive (HDD), or CD-ROM, etc.

[0132] I / O device 1040 may include input devices such as a keyboard, keypad, touchpad, touchscreen, and mouse, as well as output devices such as speakers and printers. According to some embodiments, display device 1060 may be integrated with I / O device 1040.

[0133] Power supply 1050 can supply the power required to operate electronic device 1000. For example, power supply 1050 may include a power management integrated circuit (PMIC). According to some embodiments, power supply 1050 can supply power to display device 1060.

[0134] The display device 1060 can display images in response to control signals or data from the processor 1010. The display device 1060 can be connected to other components via a bus or other communication link.

[0135] Although described with reference to the above embodiments, it will be understood that those skilled in the art can make various modifications and alterations to the disclosed embodiments without departing from the spirit and scope of the embodiments according to the present disclosure as described in the claims and their equivalents.

Claims

1. A method for manufacturing a display device, the method comprising: A release frame is formed to expose the uppermost surface of a display stack, wherein the display stack comprises a first stack and a second stack stacked sequentially, and the uppermost surface of the display stack is the upper surface of the second stack. A first curable resin is applied to the upper surface of the second stack and the release frame adjacent to the upper surface of the second stack; A flexible coating is formed on the second stack by curing the first curable resin; and Remove the release frame.

2. The method according to claim 1, wherein, In the plan view, the area of ​​the first stack is greater than the area of ​​the second stack.

3. The method according to claim 2, wherein, In the plan view, the edge of the first stack completely surrounds the edge of the second stack.

4. The method according to claim 1, wherein, In cross-section, the release frame completely covers the side surface of the second stack.

5. The method according to claim 1, wherein, When applying the first curable resin Defines a first step region surrounding the second stack and a second step region surrounding the first step region. In cross-section, in the first step region, the upper surface of the release frame is aligned with the upper surface of the second stack, and In the cross section, in the second step region, the upper surface of the release frame is at a higher level than the upper surface of the second stack.

6. The method according to claim 5, wherein, When forming the flexible coating In the cross-section, in the second step region, the upper surface of the release frame is aligned with the upper surface of the flexible coating.

7. The method according to claim 5, wherein, When applying the first curable resin The first curable resin is applied to the upper surface of the second layer and the upper surface of the release frame that overlaps with the first step region.

8. The method according to claim 7, wherein, When applying the first curable resin The first curable resin is not applied to the upper surface of the release frame that overlaps with the second step region.

9. The method according to claim 1, wherein, In the plan view, the area of ​​the flexible coating is larger than the area of ​​the second stack.

10. The method according to claim 9, wherein, In the plan view, the edge of the flexible coating completely surrounds the edge of the second stack.

11. The method according to claim 1, wherein, The first curable resin includes siloxane materials and epoxy materials.

12. The method according to claim 11, wherein, The first curable resin is a UV-curable resin.

13. The method according to claim 1, wherein, Forming the release frame includes: The display stack is secured with a clamp, wherein the clamp includes a lower clamp containing a receiving space for receiving the first stack and an upper clamp on the lower clamp and surrounding the second stack; A second curable resin is applied between the upper clamp and the second stack; Pressurize the second curable resin using a mold; and The second curable resin is cured to form the release frame.

14. The method according to claim 13, wherein, The mold includes a protruding surface that extends in the direction facing the second stack.

15. The method according to claim 14, wherein, In the plan view, the area of ​​the protruding surface is greater than the area of ​​the second stack.

16. The method according to claim 13, wherein, The second curable resin includes siloxane-based materials.

17. The method according to claim 13, wherein, The second curable resin is not applied to the upper surface of the second laminate.

18. The method according to claim 13, wherein, The display stack further includes: A flexible circuit board having one end on the first stack and spaced apart from the second stack; and The driver, on the flexible circuit board, wherein, When the display stack is secured with the clamps, the driver is positioned between the upper clamp and the lower clamp.

19. The method of claim 1, further comprising: After the release frame is removed, a protective layer is formed on the flexible coating.

20. An electronic device comprising: A processor used to provide input image data; as well as A display device is configured to display an image based on the input image, wherein... The display device is manufactured using the method according to any one of claims 1 to 19.

Images