Chip stacking structure processing method and device
By combining negative pressure evaporation and drying fluid, the problem of moisture corrosion between chip pins after soldering was solved, achieving efficient and safe drying of chip stack structures and avoiding structural damage.
Patent Information
- Application Number
- CN202411141948.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-19
- Publication Date
- 2026-03-06
AI Technical Summary
After chip soldering, it is difficult to effectively remove moisture between adjacent pins, leading to corrosion and rust. Existing high-speed rotation methods can easily cause rectangular panels to crack.
The method combines negative pressure evaporation and drying fluid. First, the moisture in the chip stack structure is evaporated into water vapor by negative pressure, and then the chip stack structure is dried by drying fluid such as hot nitrogen or isopropanol.
It effectively removes moisture from the chip stack structure, avoiding damage to the structure caused by excessively long surface drying time due to using hot nitrogen alone, while also shortening the drying time.
Smart Images
Figure CN121620283A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor technology, and more specifically, to a method and apparatus for processing chip stacking structures. Background Technology
[0002] With the continuous development of the semiconductor industry, the miniaturization and integration of integrated circuits are constantly improving, and chip manufacturers are actively developing 3D integrated circuits. For example, PLP (Panel-level packaging) integrates multiple chips onto a large rectangular panel, and then packages these chips together. A larger area means greater cost savings and higher packaging efficiency.
[0003] After the chips are soldered onto the rectangular panel, the solder resist needs to be cleaned. However, due to the large number of chips and the small pin spacing, moisture can easily accumulate between adjacent pins. If not dried in time, this can cause the pins to corrode and rust.
[0004] In existing technologies, rectangular panels are typically rotated at high speeds to dry the moisture between chip pins using the centrifugal force generated by the rotation, which can easily cause the rectangular panels to crack. Summary of the Invention
[0005] Embodiments of this application provide a chip stacking structure processing method and apparatus for processing soldered chip stacking structures.
[0006] In a first aspect, this application provides a chip stack structure processing method, comprising: placing the chip stack structure in a processing cavity; evacuating the processing cavity to make the pressure inside the processing cavity reach a first negative pressure value; maintaining the pressure inside the processing cavity below the first negative pressure value for a first time period, so that the moisture in the chip stack structure evaporates into water vapor; and continuously introducing a drying fluid into the processing cavity for a second time period to dry the water vapor, wherein the second time period is longer than the first time period.
[0007] Specifically, the first negative pressure value is less than or equal to 400 torr.
[0008] Specifically, the chip stack structure processing method further includes heating the chip stack structure if the pressure inside the processing cavity is greater than 1 torr and less than or equal to 400 torr.
[0009] Specifically, the first negative pressure value is 1 torr.
[0010] Specifically, the first time is within the range of 5-10 seconds.
[0011] Specifically, the second time is in the range of 30-60 seconds.
[0012] Specifically, the chip stack structure processing method further includes adjusting the position of the chip stack structure before introducing the drying fluid into the processing cavity, so that the distance between the chip stack structure and the drying fluid inlet is in the range of 5-10 mm.
[0013] Specifically, the drying fluid inlet is located on the top wall of the processing chamber.
[0014] Specifically, the chip stacking structure processing method further includes, after introducing a drying fluid into the processing cavity, evacuating the processing cavity again to remove moisture from the environment of the processing cavity.
[0015] Specifically, the chip stack structure processing method further includes cleaning the chip stack structure in the processing cavity before the pressure inside the processing cavity reaches a first negative pressure value by evacuating the processing cavity.
[0016] Specifically, the step of cleaning the chip stack structure in the processing chamber includes: evacuating the processing chamber to make the pressure inside the processing chamber reach a second negative pressure value; introducing cleaning fluid into the processing chamber, and immediately discharging the cleaning fluid after the amount of cleaning fluid reaches a preset amount; repeating the step of cleaning the chip stack structure in the processing chamber until the cleaning is completed.
[0017] Specifically, the first negative pressure value is less than the second negative pressure value.
[0018] Secondly, this application also provides a chip stack structure processing apparatus, comprising: a processing cavity for accommodating a chip stack structure; a vacuum unit connected to the processing cavity through a vacuum port; a drying unit connected to the processing cavity through a drying fluid inlet; and a controller configured to use the vacuum unit to vacuum the processing cavity to bring the pressure inside the processing cavity to a first negative pressure value, and to maintain the pressure inside the processing cavity below the first negative pressure value for a first time period, so that the moisture in the chip stack structure evaporates into water vapor, and to use the drying unit to continuously introduce drying fluid into the processing cavity for a second time period to dry the water vapor, wherein the second time period is longer than the first time period.
[0019] Specifically, the drying fluid inlet is located on the top wall of the processing chamber, and the device further includes a lifting assembly for raising or lowering the chip stack structure to move closer to or further away from the drying fluid inlet.
[0020] Specifically, it also includes a tray for supporting the chip stack structure, the tray being a heated tray.
[0021] Specifically, the processing chamber further includes a cleaning fluid inlet, and the chip stacking structure processing device further includes a cleaning unit connected to the cleaning fluid inlet, wherein the cleaning unit introduces cleaning fluid into the processing chamber through the cleaning fluid inlet.
[0022] Specifically, the processing cavity wall also includes a drain outlet, and the chip stacking structure processing device also includes a drainage unit connected to the drain outlet, the drainage unit discharging the cleaning fluid in the processing cavity through the drain outlet.
[0023] Specifically, the air extraction unit includes a first air extraction pump and a second air extraction pump with different output powers. The first air extraction pump extracts air from the processing chamber through the air extraction port to make the pressure inside the processing chamber reach a first negative pressure value, and the second air extraction pump extracts air from the processing chamber through the air extraction port to make the pressure inside the processing chamber reach a first negative pressure value.
[0024] Secondly, this application also provides a chip stack structure processing method, comprising: placing the chip stack structure in a processing cavity; evacuating the processing cavity to make the pressure inside the processing cavity reach a second negative pressure value, and cleaning the chip stack structure; evacuating the processing cavity to make the pressure inside the processing cavity reach a first negative pressure value, and drying the chip stack structure after cleaning, wherein the first negative pressure value is less than the second negative pressure value.
[0025] Fourthly, this application also provides a chip stack structure processing apparatus, comprising: a processing chamber for accommodating a chip stack structure; an air extraction unit connected to the processing chamber via an air extraction port; a drying unit connected to the processing chamber via a drying fluid inlet; and a controller configured to extract air from the processing chamber via the air extraction unit to achieve a second negative pressure value within the processing chamber and clean the chip stack structure, and to extract air from the processing chamber to achieve a first negative pressure value within the processing chamber and dry the cleaned chip stack structure via the drying unit, wherein the first negative pressure value is less than the second negative pressure value.
[0026] Specifically, the air extraction unit includes a first air extraction pump and a second air extraction pump with different output powers. The first air extraction pump extracts air from the processing chamber through the air extraction port to make the pressure inside the processing chamber reach a first negative pressure value, and the second air extraction pump extracts air from the processing chamber through the air extraction port to make the pressure inside the processing chamber reach a first negative pressure value.
[0027] The chip stack structure processing method of this application first uses negative pressure to evaporate the moisture in the gaps of the chip stack structure, allowing most of the moisture to leave the chip stack structure. Then, hot nitrogen is used to dry the chip stack structure, enabling both the surface and gaps of the chip stack structure to be dried simultaneously. Compared to directly drying the chip stack structure with hot nitrogen, this method shortens the drying time and avoids the situation where the surface of the chip stack structure is dried first, followed by the gaps, resulting in excessively long drying time for the surface and potential damage to the chip stack structure.
[0028] Other features and advantages of this application will become apparent from the following detailed description, or may be learned in part from practice of this application.
[0029] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description
[0030] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. It is obvious that the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort. In the drawings:
[0031] Figure 1 This schematic diagram illustrates a chip stacking structure processing apparatus according to an embodiment of the present application.
[0032] Figure 2 This schematic diagram illustrates a chip stacking structure processing apparatus according to an embodiment of the present application.
[0033] Figure 3 A schematic flowchart illustrating a chip stacking structure method according to an embodiment of this application is shown.
[0034] Figure 4 A flowchart illustrating a chip stacking structure method according to yet another embodiment of this application is shown.
[0035] Figure 5 The schematic diagram illustrates a flowchart of a chip stacking structure method according to another embodiment of this application.
[0036] Among them, 1. processing chamber, 11. air extraction port, 12. drying fluid inlet, 13. exhaust port, 14. drain port, 2. tray, 21. lifting pin, 3. chip stacking structure, 4. first air extraction pump, 5. second air extraction pump. Detailed Implementation
[0037] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided to make this application more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art.
[0038] Furthermore, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of this application. However, those skilled in the art will recognize that the technical solutions of this application can be practiced without one or more of the specific details, or other methods, components, apparatuses, steps, etc., can be employed. In other instances, well-known methods, apparatuses, implementations, or operations are not shown or described in detail to avoid obscuring various aspects of this application.
[0039] Please refer to Figure 1 This embodiment provides a chip stacking structure processing device for processing chip stacking structures.
[0040] like Figure 1 As shown, the chip stacking structure processing apparatus includes a processing chamber 1 and a tray 2 disposed within the processing chamber 1, the tray 2 being used to support the chip stacking structure. The chip stacking structure processing apparatus has a drying function. Specifically, the apparatus includes a vacuum unit, and the processing chamber wall has a vacuum port 11. The vacuum unit evacuates air from the processing chamber 1 through the vacuum port 11 to create a negative pressure state within the processing chamber 1. The boiling point of water under negative pressure is lower than that under normal pressure; therefore, the negative pressure in the processing chamber 1 allows moisture in the chip stacking structure to evaporate from the gaps, turning the moisture in the chip stacking structure into water vapor and reaching the environment of the processing chamber 1. Preferably, the air pressure inside the processing chamber 1 is below 30 torr, for example, it could be 25 torr, 10 torr, 5 torr, or 1 torr, to facilitate faster moisture evaporation.
[0041] The chip stacking structure processing apparatus also includes a drying unit. A drying fluid inlet 12 is provided on the top wall of the processing chamber, through which the drying unit introduces drying fluid into the processing chamber 1. For example, the drying fluid can be isopropanol (IPA), supercritical carbon dioxide, or nitrogen. The drying unit is either a drying fluid supply or a connecting component to the drying fluid supply.
[0042] The chip stack structure processing device also includes a controller, which is electrically connected to both an extraction unit and a drying unit. The controller is configured to control the extraction unit to extract air from the processing chamber 1, causing the pressure inside the processing chamber 1 to reach a first negative pressure value and maintain it for a first time, thereby causing moisture in the chip stack structure to evaporate into water vapor. The controller then sends a signal to the drying unit, causing the drying unit to continuously introduce drying fluid into the processing chamber 1 for a second time to dry the water vapor, wherein the second time is longer than the first time.
[0043] A lifting pin 21 is installed on tray 2. The lifting pin 21 is used to move the chip stack structure up and down, facilitating the loading and unloading of the chip stack structure from tray 2. The controller is also electrically connected to the lifting pin 21. Figure 2 As shown, when the drying unit introduces the drying fluid into the processing chamber 1 from the top wall of the processing chamber, the controller sends a lifting signal to the lifting pin 21, causing the lifting pin 21 to raise the chip stack structure to near the drying fluid inlet 12, thereby allowing the drying fluid to better dry the moisture in the chip stack structure. The drying fluid inlet 12, located on the top wall of the chamber, faces the chip stack structure directly, enabling better drying of the chip stack structure. There are multiple drying fluid inlets 12, evenly distributed above the tray 2, to better dry the chip stack structure on the tray 2.
[0044] The chip stacking structure processing device also includes an exhaust unit. An exhaust port 13 is provided in the processing chamber wall. The exhaust unit discharges moisture from the environment of the processing chamber 1 through the exhaust port 13 to prevent moisture from entering the chip stacking structure. The exhaust unit can be an exhaust pump, an exhaust pipe with an exhaust valve, or other structures with exhaust functions.
[0045] The chip stacking structure processing apparatus also has a cleaning function. Specifically, the chip stacking structure processing apparatus includes a cleaning unit, as described above. Figure 1The cleaning unit introduces cleaning fluid into the negative pressure processing chamber 1 through the drying fluid inlet 12. This negative pressure allows the cleaning fluid to more easily penetrate the gaps in the chip stack structure, resulting in better cleaning of the chip stack structure. The extraction unit uses the extraction port 11 to evacuate air from the processing chamber 1, achieving a second negative pressure value. The cleaning and drying processes share the same extraction port 11, simplifying the structure of the processing chamber 1. The chip stack structure processing apparatus also includes a drainage unit with a drainage port 14 on the processing chamber wall. The drainage unit discharges the cleaning fluid from the processing chamber 1 through the drainage port 14 to prevent excessive cleaning fluid from increasing the air pressure inside the processing chamber 1 and preventing the cleaning fluid from failing to penetrate the gaps in the chip stack structure. Since the processing chamber 1 is connected to atmospheric pressure when the drainage port 14 is open, the air pressure inside the processing chamber 1 is equal to atmospheric pressure. Therefore, if cleaning is not complete, air needs to be extracted from the processing chamber 1 again through the extraction port 11 to restore the negative pressure, and cleaning fluid is sprayed into the negative pressure processing chamber 1 again to clean the gaps in the chip stack structure until cleaning is finished. The cleaning unit is a cleaning fluid supply unit or a connecting unit to the cleaning fluid supply unit. The drainage unit is a drainage pump, a drainage pipe with a valve, or other structure with drainage function.
[0046] In other embodiments of this application, the processing chamber 1 has a cleaning fluid inlet, and the cleaning unit introduces cleaning fluid into the processing chamber 1, which is under negative pressure, through the cleaning fluid inlet. In other embodiments of this application, the exhaust unit uses an exhaust port 11 to exhaust moisture from the environment of the processing chamber 1. In other embodiments of this application, there are two exhaust ports 11, and different exhaust ports 11 are used for the cleaning process and the drying process.
[0047] In the above embodiments, the air extraction unit includes a first air extraction pump 4 and a second air extraction pump 5. The controller controls the first air extraction pump 4 to extract air from the processing chamber 1 to achieve a first negative pressure value, and the controller controls the second air extraction pump 5 to extract air from the processing chamber 1 to achieve a second negative pressure value. The first air extraction pump 4 and the second air extraction pump 5 have different output powers to avoid switching between outputs with large differences in the same negative pressure generating device. In other embodiments of this application, the air extraction pump that achieves the first negative pressure value and the air extraction pump that achieves the second negative pressure value in the processing chamber 1 are the same pump to simplify the structure.
[0048] In other embodiments of this application, the chip stack structure processing device only has a drying function, so the chip stack structure processing device does not need to be equipped with an air extraction unit, and the processing chamber 1 does not need to have a drain outlet 14. In other embodiments of this application, the chip stack structure processing device only has a drying function, and the tray 2 is a heating tray. During the process of evaporating moisture using negative pressure, the heating tray is used to heat the chip stack structure to accelerate the moisture evaporation rate.
[0049] Please refer to Figure 3 This embodiment provides a chip stacking structure processing method, which is executed by the chip stacking structure processing device described above, and is used to process chip stacking structures.
[0050] like Figure 3 As shown, the chip stacking structure processing method specifically includes the following steps:
[0051] S110: Place the chip stack structure on the tray.
[0052] S120: Evacuate the processing chamber to bring the pressure inside the processing chamber to the first negative pressure value, and keep the pressure inside the processing chamber below the first negative pressure value for a first time.
[0053] Because the rate of water evaporation is faster under negative pressure than under normal pressure, the processing chamber under the first negative pressure value can accelerate the evaporation of water in the gaps of the chip stack structure, so that the water turns into water vapor. Most of the water vapor will leave the chip stack structure and diffuse into the processing chamber environment.
[0054] The initial negative pressure value should be less than or equal to 400 torr to accelerate moisture evaporation. For example, it could be 25 torr, 10 torr, or 5 torr, with 1 torr being preferred to further accelerate moisture evaporation. The initial time should be within the range of 5-10 seconds, with the specific value set according to process requirements.
[0055] S130: Adjust the height of the chip stack structure so that the distance between the chip stack structure and the dry fluid inlet on the top wall of the processing cavity is within the range of 5-10mm.
[0056] S140: Hot nitrogen gas is continuously introduced into the processing chamber through the dry fluid inlet during the second time period, which is longer than the first time period.
[0057] After moisture evaporates from the gaps in the chip stack structure, some moisture may remain in the chip stack structure. Therefore, applying hot nitrogen gas to the chip stack structure can precisely dry it.
[0058] The second time is within the range of 30s-60s, and the specific value is set according to the process requirements.
[0059] In other embodiments of this application, hot nitrogen can be replaced with dry fluids such as isopropanol (IPA) or supercritical carbon dioxide.
[0060] S150: Extract water vapor from the treatment chamber.
[0061] After the chip stack structure is dried, the moisture in the processing cavity environment is removed to prevent the moisture in the processing cavity environment from affecting the drying effect of the chip stack structure.
[0062] In this embodiment, negative pressure is first used to evaporate moisture from the gaps in the chip stack structure, allowing most of the moisture to leave the chip stack structure. Then, hot nitrogen is used to dry the chip stack structure, enabling both the surface and gaps to be dried simultaneously. Compared to directly drying the chip stack structure with hot nitrogen, this method shortens the drying time and avoids the situation where the surface is dried first, followed by the gaps, resulting in excessively long drying time for the surface and potential damage to the chip stack structure.
[0063] In other embodiments of this application, if the drying fluid inlet is located on the sidewall of the processing chamber, then in step S130, the chip stack structure is moved toward the drying fluid inlet.
[0064] In other embodiments of this application, before step S120, a process of cleaning the chip stack structure is included, the specific steps of which are described below. Figure 4 .
[0065] S111: Evacuate the processing chamber to bring the pressure inside the processing chamber to the second negative pressure value.
[0066] The second negative pressure value is less than atmospheric pressure. Preferably, the second negative pressure value is greater than the first negative pressure value. Compared to the second negative pressure value being less than or equal to the first negative pressure value, this can prevent the cleaning liquid from evaporating too quickly and affecting the cleaning effect.
[0067] S112: Spray cleaning fluid onto the chip stack structure in the processing cavity until the cleaning fluid reaches the set amount. The set amount is set according to process requirements.
[0068] S113: Connect the processing chamber to atmospheric pressure so that the air pressure in the processing chamber is equal to atmospheric pressure.
[0069] S114: Drain the cleaning fluid from the treatment chamber.
[0070] S115: Repeat S111-S114 until the cleaning is complete.
[0071] Since the cleaning fluid occupies space within the processing chamber, prolonged residence of the cleaning fluid in the chamber while the gas volume remains constant will cause an increase in gas pressure and a larger secondary negative pressure. This prevents the cleaning fluid from being drawn into the chip stack structure under negative pressure, thus hindering the cleaning process. Therefore, this application employs repeated operations of evacuation, fluid supply, and drainage to ensure that the cleaning fluid is discharged from the processing chamber once a set volume is reached, maintaining minimal pressure fluctuations within the chamber and completing the cleaning process multiple times.
[0072] In this embodiment, performing the cleaning and drying processes in the same processing chamber can prevent the chip stack structure from being contaminated when changing processing chambers.
[0073] In other embodiments of this application, if the chip stack structure processing method only includes a drying process, then while step S120 is being executed, the chip stack structure is heated when the pressure inside the cavity is greater than 1 torr and less than or equal to 400 torr, so as to accelerate the evaporation of moisture in the chip stack structure.
[0074] Please refer to Figure 5 This embodiment provides a chip stacking structure processing method, which is executed by the chip stacking structure processing device described above, and is used to process chip stacking structures.
[0075] like Figure 5 As shown, the chip stacking structure processing method specifically includes the following steps:
[0076] S210: Place the chip stack structure on the tray.
[0077] S220: Evacuate the processing cavity to bring the pressure inside the processing cavity to the second negative pressure value, and clean the chip stack structure;
[0078] S230: Evacuate the processing chamber to bring the pressure inside the processing chamber to a first negative pressure value, and dry and clean the chip stack structure after completion, wherein the first negative pressure value is less than the second negative pressure value.
[0079] In this embodiment, the cleaning and drying processes of the chip stack structure are performed within the same processing cavity, which enables efficient execution of the cleaning and drying processes and effectively improves the efficiency and reliability of the cleaning process. The specific steps of the cleaning and drying processes are the same as those in the above embodiment and will not be repeated here.
[0080] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the embodiments disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein.
[0081] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.
Claims
1. A method for processing chip stacking structures, characterized in that, The method comprises: placing a chip stack structure in a processing chamber; pumping the processing chamber to a first negative pressure value; maintaining the pressure in the processing chamber below the first negative pressure value for a first time period to evaporate moisture in the chip stack structure into water vapor; and continuously supplying a drying fluid into the processing chamber for a second time period to dry the water vapor, the second time period being greater than the first time period.
2. The chip stack structure processing method of claim 1, wherein, The first negative pressure value is less than or equal to 400 torr.
3. The chip stack structure processing method of claim 2, wherein, The method further comprises heating the chip stack structure if the pressure in the processing chamber is greater than 1 torr and less than or equal to 400 torr.
4. The chip stack structure processing method of claim 2, wherein The first negative pressure value is 1 torr.
5. The chip stack structure processing method of claim 1, wherein The first time period is in a range of 5-10 seconds.
6. The chip stack structure processing method of claim 1, wherein The second time period is in a range of 30-60 seconds.
7. The chip stack processing method of claim 1, wherein The method further comprises adjusting a position of the chip stack structure to be within a range of 5-10 mm from a drying fluid inlet before the drying fluid is supplied into the processing chamber.
8. The chip stack structure processing method according to claim 7, wherein The drying fluid inlet is provided on a top wall of the processing chamber.
9. The chip stack structure processing method of claim 1, wherein The method further comprises pumping the processing chamber again to remove the water vapor from the processing chamber environment after the drying fluid is supplied into the processing chamber.
10. The chip stack structure processing method of claim 1, wherein The method further comprises cleaning the chip stack structure in the processing chamber before the processing chamber is pumped to the first negative pressure value.
11. The chip stack structure processing method of claim 10, wherein, The step of cleaning the chip stack structure in the processing chamber comprises: pumping the processing chamber to a second negative pressure value; supplying a cleaning liquid into the processing chamber, the cleaning liquid being removed from the processing chamber immediately after reaching a preset amount; and repeating the step of cleaning the chip stack structure in the processing chamber until the cleaning is completed.
12. The chip stack structure processing method of claim 11, wherein, The first negative pressure value is less than the second negative pressure value.
13. A chip stack structure processing apparatus characterized by comprising: The apparatus comprises: a processing chamber configured to accommodate a chip stack structure; a pumping unit connected to the processing chamber through a pumping port of the processing chamber; a drying unit connected to the processing chamber through a drying fluid inlet of the processing chamber; and a controller configured to pump the processing chamber to a first negative pressure value by the pumping unit, maintain the pressure in the processing chamber below the first negative pressure value for a first time period to evaporate moisture in the chip stack structure into water vapor, and continuously supply a drying fluid into the processing chamber for a second time period to dry the water vapor by the drying unit, the second time period being greater than the first time period.
14. The chip stack processing apparatus according to claim 13, wherein The drying fluid inlet is provided on a top wall of the processing chamber, and the apparatus further comprises a lifting assembly configured to raise or lower the chip stack structure to be close to or away from the drying fluid inlet.
15. The chip stack processing apparatus according to claim 14, wherein The apparatus further comprises a tray configured to carry the chip stack structure, the tray being a heating tray.
16. The chip stack structure processing apparatus according to claim 14, wherein The processing chamber further comprises a cleaning liquid inlet, and the apparatus further comprises a cleaning unit connected to the cleaning liquid inlet and configured to supply a cleaning liquid into the processing chamber through the cleaning liquid inlet.
17. The chip stack structure processing apparatus according to claim 16, wherein The processing cavity wall further comprises a drainage port, and the chip stack structure processing device further comprises a drainage unit connected to the drainage port, the drainage unit draining the cleaning liquid in the processing cavity through the drainage port.
18. The chip stack structure processing apparatus according to Claim 13, wherein The gas extraction unit comprises a first gas extraction pump and a second gas extraction pump with different output powers, the first gas extraction pump extracting gas from the processing cavity through the gas extraction port to make the pressure in the processing cavity reach a first negative pressure value, and the second gas extraction pump extracting gas from the processing cavity through the gas extraction port to make the pressure in the processing cavity reach a second negative pressure value.
19. A method of processing a chip stack structure, the method comprising: The method comprises the following steps: placing a chip stack structure in a processing cavity; extracting gas from the processing cavity to make the pressure in the processing cavity reach a second negative pressure value, and cleaning the chip stack structure; extracting gas from the processing cavity to make the pressure in the processing cavity reach a first negative pressure value, and drying the chip stack structure after cleaning, wherein the first negative pressure value is less than the second negative pressure value.
20. A chip stack structure processing apparatus, characterized by comprising: The method comprises: a processing cavity for accommodating a chip stack structure; a gas extraction unit connected to the processing cavity through a gas extraction port of the processing cavity; a drying unit connected to the processing cavity through a drying fluid inlet of the processing cavity; a controller configured to extract gas from the processing cavity through the gas extraction unit to make the pressure in the processing cavity reach a second negative pressure value, clean the chip stack structure, and extract gas from the processing cavity to make the pressure in the processing cavity reach a first negative pressure value, dry the chip stack structure after cleaning through the drying unit, wherein the first negative pressure value is less than the second negative pressure value.
21. The chip stack processing apparatus of claim 20, wherein, The gas extraction unit comprises a first gas extraction pump and a second gas extraction pump with different output powers, the first gas extraction pump extracting gas from the processing cavity through the gas extraction port to make the pressure in the processing cavity reach a first negative pressure value, and the second gas extraction pump extracting gas from the processing cavity through the gas extraction port to make the pressure in the processing cavity reach a first negative pressure value.