Radiation detector assembly and medical imaging device

Abstract

The embodiment of the invention provides a radiation detector assembly and medical imaging equipment, and the radiation detector assembly comprises a main circuit board which comprises a first region and a second region, the first region is provided with a detector element which is radiated by rays, and the second region is provided with a detector element which is radiated by rays; the second area is provided with a signal processing element for receiving a signal generated by the detector element; a thermal control assembly thermally coupled to a first region of the main circuit board; and a support assembly supporting the main circuit board and thermally coupled to the second region of the main circuit board.

Description

Technical Field

[0001] This application relates to the field of imaging equipment technology, and more particularly to a radiation detector assembly and a medical imaging device. Background Technology

[0002] Imaging equipment is used to scan objects (such as patients or workpieces) in a non-invasive or non-destructive manner to acquire images of the internal structures of anatomical tissues or regions of interest within the object, thereby aiding in diagnosis. Imaging equipment typically includes a circular scanning aperture for the object to be scanned to enter or exit, and a detector mounted along the entire circumference or a portion of the arc of the aperture, comprising multiple detector assemblies mounted on a rack.

[0003] For example, computed tomography (CT) equipment is typically used as a medical imaging device to scan patients and obtain cross-sectional medical images of areas of interest to assist doctors in diagnosis. CT equipment includes multiple detector assemblies that receive X-rays emitted from an X-ray tube and pass through the patient; the shape and number of these detector assemblies depend on clinical needs and the design of the CT system.

[0004] The detector components of a CT scanner typically include a pixelated scintillator and a photoelectric conversion device arranged sequentially along the X-ray transmission direction. The scintillator receives X-rays passing through the patient and generates light, while the photoelectric conversion device (e.g., a photodiode) converts the light generated by the scintillator into an electrical signal. Each detector component also includes a collimator to collimate the X-rays passing through the patient into a specific direction to avoid or reduce interference between the pixels of the scintillator. Each detector component also includes a signal circuit board for processing the electrical signals generated by the photoelectric conversion device.

[0005] The image quality of a CT system depends on various factors, including the detector. Typically, calibrating and imaging the detector at a known temperature yields good results, but the components within the detector are quite sensitive to temperature. To address this temperature sensitivity, current technologies often employ active heating to maintain temperature stability by heating the photoelectric conversion devices within the detector. However, during operation, the analog-to-digital converters (ADCs), FPGA chips, power chips, and other components on the circuit board generate significant heat, affecting the temperature of the photoelectric conversion devices.

[0006] It should be noted that the above introduction to the technical background is only for the purpose of providing a clear and complete explanation of the technical solution of this application and facilitating the understanding of those skilled in the art. Summary of the Invention

[0007] To address at least one of the aforementioned technical problems or other similar issues, embodiments of this application provide a radiation detector assembly and a medical imaging device. By partitioning or layering the circuit board in the detector assembly for temperature control, more precise thermal control is achieved, thereby improving the temperature stability of the photoelectric conversion device within the detector assembly.

[0008] According to one aspect of the embodiments of this application, a radiation detector assembly is provided, comprising:

[0009] The main circuit board includes a first region and a second region. The first region is equipped with a detector element that is subject to radiation, and the second region is equipped with a signal processing element that receives the signal generated by the detector element.

[0010] A thermal control component, thermally coupled to a first region of the main circuit board;

[0011] A support component that supports the main circuit board and is thermally coupled to a second region of the main circuit board.

[0012] According to another aspect of the embodiments of this application, a radiation detector assembly is also provided, comprising:

[0013] The main circuit board includes a first region in which detector elements subject to radiation are mounted;

[0014] From the circuit board, which includes a first signal processing element that processes signals received by the main circuit board;

[0015] A support component that supports the main circuit board and is thermally coupled to both the main circuit board and the slave circuit board.

[0016] According to another aspect of the embodiments of this application, a medical imaging device is provided, the medical imaging device having the radiation detector assembly described above.

[0017] Referring to the following description and accompanying drawings, specific implementation methods of the embodiments of this application are disclosed in detail, indicating how the principles of the embodiments of this application can be adopted. It should be understood that the implementation methods of this application are not limited in scope. Within the spirit and scope of the appended claims, the implementation methods of this application include many changes, modifications, and equivalents. Attached Figure Description

[0018] The accompanying drawings, which form part of the specification, are used to provide a further understanding of the embodiments of this application and illustrate the implementation methods of this application, together with the textual description, to explain the principles of this application. Obviously, the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other implementation methods based on these drawings without creative effort. In the drawings:

[0019] Figure 1 This is a schematic diagram of a CT device according to an embodiment of this application;

[0020] Figure 2 This is a schematic diagram of a CT imaging system according to an embodiment of this application;

[0021] Figure 3 This is a schematic diagram of a radiation detector assembly according to an embodiment of this application;

[0022] Figure 4 This is a schematic diagram of the thermal control component according to an embodiment of this application;

[0023] Figure 5 This is a schematic diagram of the supporting components in an embodiment of this application;

[0024] Figure 6 This is a schematic diagram of a radiation detector assembly according to an embodiment of this application. Detailed Implementation

[0025] Referring to the accompanying drawings, the foregoing and other features of the embodiments of this application will become apparent from the following description. Specific embodiments of this application are specifically disclosed in the description and drawings, illustrating partial implementations in which the principles of the embodiments of this application can be adopted. It should be understood that this application is not limited to the described embodiments; rather, the embodiments of this application include all modifications, variations, and equivalents falling within the scope of the appended claims.

[0026] In the embodiments of this application, the terms "first," "second," etc., are used to distinguish different elements by name, but do not indicate the spatial arrangement or chronological order of these elements, and these elements should not be limited by these terms. The term "and / or" includes any one or more of the terms listed in association and all combinations thereof. The terms "comprising," "including," "having," etc., refer to the presence of the stated features, elements, components, or assemblies, but do not exclude the presence or addition of one or more other features, elements, components, or assemblies.

[0027] In the embodiments of this application, the singular forms "a," "the," etc., including the plural forms, should be broadly understood as "a kind" or "a class" rather than limited to the meaning of "an." Furthermore, the term "the" should be understood to include both the singular and plural forms, unless the context explicitly indicates otherwise. Additionally, the term "according to" should be understood as "at least partially based on…," and the term "based on" should be understood as "at least partially based on…," unless the context explicitly indicates otherwise.

[0028] Features described and / or illustrated for one embodiment may be used in the same or similar manner in one or more other embodiments, combined with features in other embodiments, or substituted for features in other embodiments. The term "comprising / including" as used herein means the presence of a feature, integral, step, or component, but does not exclude the presence or addition of one or more other features, integrals, steps, or components.

[0029] The medical imaging device described in this application is applicable to a variety of medical imaging modalities, including but not limited to CT (computed tomography) imaging devices, PET (positron emission tomography)-CT, or any other suitable medical imaging device.

[0030] A system for acquiring medical image data may include the aforementioned medical imaging equipment, a separate computer connected to the medical imaging equipment, or a computer connected to an internet cloud, which is connected via the internet to the medical imaging equipment or a storage device for storing medical images. The imaging method may be implemented independently or in combination by the aforementioned medical imaging equipment, the computer connected to the medical imaging equipment, and the computer connected to the internet cloud. For example, a system for acquiring medical image data may be a CT imaging system, etc.

[0031] Exemplary examples are described below in conjunction with X-ray computed tomography (CT) imaging equipment. Those skilled in the art will understand that embodiments of this application can also be applied to other medical imaging equipment.

[0032] Figure 1 This is a schematic diagram of a CT device according to an embodiment of this application, illustrating the CT device 100. For example... Figure 1 As shown, the CT equipment 100 includes a scanning gantry 101 and a patient table 102; the scanning gantry 101 has an X-ray source 103 that projects an X-ray beam toward a detector assembly or collimator 104 on the opposite side of the scanning gantry 101. The subject 105 can lie flat on the patient table 102 and move into the scanning gantry opening 106 as the patient table 102 moves; medical image data of the subject 105 can be obtained by scanning with the X-ray source 103.

[0033] Figure 2 This is a schematic diagram of a CT imaging system according to an embodiment of this application, illustrating a block diagram of the CT imaging system 10. Figure 2 As shown, the system 10 includes a scanning gantry 12, on which an X-ray source 14 and a detector 18 are disposed opposite each other. The detector 18 consists of multiple detector components 20 and a data acquisition system (DAS) 26. The DAS 26 is used to convert the sampled analog attenuation data received by the multiple detector components 20 into digital signals for subsequent processing.

[0034] In some embodiments, system 10 is used to acquire projection data of the object to be inspected at different angles. Therefore, components on gantry 12 are used to rotate about rotation center 24 to acquire projection data. During rotation, X-ray radiation source 14 projects X-rays 16 that penetrate the object to be inspected toward detector 18. This attenuated X-ray beam data is preprocessed and used as projection data of the target volume of the object. Based on this projection data, an image of the object to be inspected can be reconstructed. The reconstructed image can display the internal features of the object to be inspected, including, for example, lesions, size, and shape of body tissue structures. Rotation center 24 of gantry also defines the center of scan domain 80.

[0035] In some embodiments, system 10 includes a control mechanism 30. The control mechanism 30 may include an X-ray controller 34 for providing power and timing signals to the X-ray radiation source 14. The control mechanism 30 may also include a gantry controller 32 for controlling the rotational speed and / or position of the gantry 12 based on imaging requirements. The control mechanism 30 may also include a bed controller 36 for driving the bed 28 to a suitable position to position the object to be inspected within the gantry 12, performing positioning scans, axial scans, bolt scans, or other scanning methods to acquire projection data of the target volume of the object to be inspected. Further, the bed 28 includes a drive unit, and the bed controller 36 can control the bed 28 by controlling the drive unit.

[0036] System 10 further includes an image reconstruction module 50. As described above, the DAS 26 samples and digitizes projection data acquired by multiple detector components 20. The image reconstruction module 50 then performs high-speed image reconstruction based on the sampled and digitized projection data. In some embodiments, the image reconstruction module 50 stores the reconstructed image in a storage device or mass storage device 46. Alternatively, the image reconstruction module 50 transmits the reconstructed image to a computer 40 to generate patient information for diagnosis and evaluation. For example, a first positioning image and a diagnostic profile image are generated based on projection data acquired by positioning scans, axial scans, bolt scans, or other scanning methods.

[0037] although Figure 2 The image reconstruction module 50 is illustrated as a separate entity, but in some embodiments, the image reconstruction module 50 may be part of the computer 40. Alternatively, the image reconstruction module 50 may not be present in the system 10, or the computer 40 may perform one or more functions of the image reconstruction module 50. Furthermore, the image reconstruction module 50 may be located locally or remotely and may be connected to the system 10 using wired or wireless networks. In some embodiments, computing resources centralized in a cloud network may be used for the image reconstruction module 50.

[0038] In some embodiments, system 10 further includes computer 40, to which images reconstructed by data and / or image reconstruction module 50 sampled and digitized by DAS26 are transmitted or processed. In some embodiments, computer 40 stores data and / or images in a storage device such as mass storage 46. Mass storage 46 may include hard disk drives, floppy disk drives, optical disc read / write (CD-R / W) drives, digital universal disk (DVD) drives, flash memory drives, and / or solid-state storage devices, etc. The processor in computer 40 determines a predicted profile image based on the first positioning image.

[0039] In some embodiments, computer 40 transmits the reconstructed image and / or other information to display 42, which is communicatively connected to computer 40 and / or image reconstruction module 50. Computer 40 may connect to local or remote displays, printers, workstations, and / or similar devices; for example, it may connect to such devices in a medical facility or hospital, or connect to remote devices via one or more configured wires or wireless networks such as the Internet and / or VPNs. For example, the display shows the predicted profile image and corresponding scan parameters.

[0040] Furthermore, computer 40 can provide commands and parameters to DAS 26 and control mechanisms 30 (including rack controller 32, X-ray controller 34, and bed controller 36) based on user-provided and / or system-defined commands to control system operations, such as data acquisition and / or processing. In some embodiments, computer 40 controls system operations based on user input; for example, computer 40 can receive user input, including commands, scan protocols, and / or scan parameters, through an operator console 48 connected to it. Operator console 48 may include a keyboard (not shown) and / or a touchscreen to allow users to input / select commands, scan protocols, and / or scan parameters.

[0041] In some embodiments, system 10 may include or be connected to an image storage and transmission system (PACS) (not shown). In some embodiments, the PACS is further connected to remote systems such as radiology information systems, hospital information systems, and / or internal or external networks (not shown) to allow operators located in different locations to provide commands and parameters, and / or access image data.

[0042] Computer 40 can be configured and / or arranged for use in different ways. For example, in some implementations, a single computer 40 may be used; in other implementations, multiple computers 40 are configured to work together (e.g., based on a distributed processing configuration) or individually, each computer 40 being configured to handle specific aspects and / or functions, and / or process data used to generate a model that is only used for a specific system 10. In some implementations, computer 40 may be local (e.g., co-located with one or more systems 10, such as within the same facility and / or the same local network); in other implementations, computer 40 may be remote and therefore accessible only via a remote connection (e.g., via the Internet or other available remote access technologies). In a particular implementation, computer 40 may be configured in a cloud-like manner and may be accessed and / or used in a manner substantially similar to that used for accessing and using other cloud-based systems.

[0043] The above illustrations depict devices and systems for acquiring medical imaging data (or medical images or medical image data) according to embodiments of this application, but this application is not limited thereto. Medical imaging devices may be CT equipment, PET-CT, or any other suitable imaging equipment. Storage devices may be located within the medical imaging device, on a server outside the medical imaging device, in a standalone medical image storage system (e.g., PACS, Picture Archiving and Communication System), and / or in a remote cloud storage system.

[0044] Furthermore, medical imaging workstations can be located locally on the medical imaging equipment, meaning they are situated close to the equipment, and both can be located in the same scanning room, radiology department, or within the same hospital. Meanwhile, the medical image cloud platform analysis system can be located away from the medical imaging equipment, for example, in the cloud where it communicates with the equipment.

[0045] As an example, after a medical institution completes an imaging scan using medical imaging equipment, the scanned data is stored in a storage device. A medical imaging workstation can directly read the scanned data and perform image processing through its processor. As another example, a medical image cloud platform analysis system can remotely access medical images stored in the storage device to provide "Software as a Service" (SaaS). SaaS can exist between hospitals, between hospitals and imaging centers, or between hospitals and third-party online medical service providers.

[0046] The above illustrations illustrate medical image scanning. The following detailed descriptions of embodiments of this application are provided in conjunction with the accompanying drawings. In the following embodiments, a CT scanner is used as an example for illustration; however, this description is equally applicable to other medical imaging devices. The detector in a CT scanner consists of multiple radiation detector assemblies. For example, these multiple radiation detector assemblies may have a flat panel form factor. These assemblies are mounted on a guide rail, which is integrally formed and has a certain curvature plate structure. It can be mounted on a gantry (or rotating gantry). The flat panel form factor of the radiation detector assembly refers to a shape where the size of the radiation receiving plane (or the radiation receiving plane facing the radiation source) is much larger than or several times larger than the size of the radiation detector assembly parallel to the radiation propagation path. For example, the length or width of a radiation detector assembly with a rectangular radiation receiving plane is much larger than its thickness. Multiple radiation detector assemblies are sequentially arranged on the guide rail along its extension direction, and are mounted using a specific method, such as through fixing holes in the guide rail and mechanical mounting. As previously described, multiple radiation detector assemblies are mounted on a frame via guide rails and rotate with the movement of the frame. The following embodiments illustrate one of the radiation detector assemblies as an example, but this application does not limit the scope of the embodiments.

[0047] This application provides a radiation detector assembly.

[0048] Figure 3 This is a schematic diagram of a radiation detector assembly according to an embodiment of this application. Other radiation detector assemblies in CT equipment have similar structures. Figure 3 As shown, the radiation detector assembly 300 includes:

[0049] The main circuit board 301 includes a first region 311 and a second region 312. The first region 311 is equipped with a detector element 313 that is subject to radiation, and the second region 312 is equipped with a signal processing element 314 that receives the signal generated by the detector element 313.

[0050] Thermal control component 302, which is thermally coupled to a first region 311 of main circuit board 301;

[0051] Support component 303 supports main circuit board 301 and is thermally coupled to second region 312 of main circuit board 301.

[0052] In some embodiments, the main circuit board 301 may be, for example, a printed circuit board. The detector element 313 subjected to radiation may include a photoelectric conversion device 221 (e.g., a photodiode) and a scintillator 222. The scintillator has a plurality of scintillator pixels configured to receive attenuated radiation for converting the radiation into visible light. The photoelectric conversion device 221 is optically coupled to the scintillator and is used to detect the light output from the corresponding scintillator pixel and convert it into an electrical signal. The detector element 313 may be located on one side of the main circuit board 301. Figure 3 The upper side of the main circuit board (the side directly exposed to radiation) is the side of the main circuit board that receives the radiation. The signal processing element 314, which receives the signal generated by the detector element 313, includes an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), a power supply chip, and an analog-to-digital converter (ADC), and can be located on the other side of the main circuit board 301. Figure 3 The lower side of the main circuit board 301 (the side not directly exposed to radiation) is the side of the main circuit board 301 that is not directly exposed to radiation. The thermal control component 302, the support component 303, and the signal processing element 314 are located on the same side of the main circuit board 301 that is not directly exposed to radiation. As mentioned above, the radiation detector assembly 300 can have a flat panel form factor, and correspondingly, the main circuit board 301 also has a flat panel shape (not shown in the top view), especially a flat panel shape with a large area. Therefore, a larger number or higher density of detector elements 313 can be installed on the main circuit board 301, thereby reducing the cost of the radiation detector assembly 300. In addition, the main circuit board 301 is parallel to the support component 303, which reduces the overall height of the radiation detector assembly 300 and realizes the flat panel configuration of the radiation detector assembly 300.

[0053] In some embodiments, the first region 311 and the second region 312 are non-overlapping regions. The first region 311 may be one or more connected or disconnected regions, and the second region 312 may be one or more connected or disconnected regions. Figure 3 As shown, the first region 311 is a region located in the middle of the main circuit board 301, and the second region 312 are two non-connected regions located on both sides of the first region 311. This is only an example, and the embodiments of this application are not intended to limit the scope. For example, the first region can be multiple non-connected regions, etc., which will not be listed here.

[0054] In some embodiments, a detector element 313 is mounted in a first region 311, and a thermal control component 302 is thermally coupled to the first region 311, meaning that the thermal control component 302 performs thermal control on the detector element 313. For example, it heats the detector element 313. A signal processing element 314 is mounted in a second region 312, and a support component 303 is thermally coupled to the second region 312. Since the signal processing element 314 generates a significant amount of heat, the support component 303 can dissipate heat from the signal processing element 314. In other words, the thermal control component 302 and the support component 303 perform temperature control in separate zones, thereby achieving more precise thermal control and improving the temperature stability of the photoelectric conversion device within the detector assembly. The thermal control component 302 and the support component 303 will be described in detail below.

[0055] Figure 4 This is a schematic diagram of the thermal control component 302 according to an embodiment of this application, as shown below. Figure 4 As shown, the thermal control assembly 302 includes an electric heater 401 and a thermally coupled element 402 for the first region 311 of the main circuit board 301. The electric heater 401 can be a thin-film heating resistor, connected to an external power source via a power line, converting electrical energy into heat energy. The thermally coupled element 402 is thermally coupled to both the electric heater 401 and the first region 311. The detector element 313 and the thermally coupled element 402 are both located in the first region, but on opposite sides of the main circuit board 301. The thermally coupled element 402 transfers the heat generated by the electric heater 401 to the detector element 313 mounted on the first region 311. The thermally coupled element 402 can be made of aluminum or copper, but this embodiment is not limited to this. The thermally coupled element 402 also serves to prevent electromagnetic interference.

[0056] In some embodiments, the heat-conducting element 402 may optionally include a plate-like structure made of a metal (e.g., aluminum or copper) heat-conducting material, through which the heat generated by the electric heater 401 can be uniformly transferred to the detector element 313 corresponding to the first region.

[0057] In some embodiments, optionally, a radiation shielding element 403 is further provided between the heat-conducting element 402 and the first region of the main circuit board 301. The radiation shielding element 403 may be a plate-like structure of tungsten, lead, lead alloy, or tungsten alloy, used to absorb rays that penetrate the main circuit board 301, thereby improving image imaging quality and preventing artifacts caused by circuit boards, etc., from appearing in the image.

[0058] In some embodiments, when heating of the detector element is required, the electric heater 401 can be controlled by a controller, and the controller can adjust the heating temperature of the electric heater 401. Optionally, the thermal control assembly 302 also includes a thermal sensor 404 mounted to the heat-conducting element 402. That is, the thermal sensor 404 can be located in a first region. Specifically, it can be located on the front and back of the detector element on the main circuit board 301, and thermally coupled to the detector element through the main circuit board 301, thereby accurately detecting the temperature of the detector element. The number of thermal sensors 404 can be one or more, used to detect the actual temperature of the detector element. The controller can also control the heating temperature of the electric heater of the thermal control assembly 302 according to the temperature detected by the thermal sensor 404, so that the temperature of the detector element is maintained at a preset operating temperature.

[0059] In some embodiments, the thermal control component 302 can be fixed to the side of the first region 311 of the main circuit board 301 that is not directly exposed to radiation by means of a thermally conductive part (e.g., thermally conductive adhesive).

[0060] Figure 5 This is a schematic diagram of the support component 303 according to an embodiment of this application. Figure 5 An end view or cross-sectional view of the support assembly 303 is shown. The support assembly 303 is generally elongated and located on the side of the main circuit board 301 that is not directly exposed to radiation. The length of the support assembly 303 is slightly longer than that of the main circuit board 301. It can be connected to the main circuit board 301 and the signal processing element 314 via a thermally conductive component (e.g., thermally conductive adhesive). The support assembly 303 can be made of a metallic thermally conductive material, such as aluminum or aluminum alloy, which can dissipate the heat generated by the signal processing element 314 into the surrounding air. As previously mentioned, the radiation detector assembly 300 can have a flat panel form factor, and correspondingly, the support assembly 303 also has a generally flat panel form factor (not shown in the top view). The main body of the support assembly 303 (e.g., the first receiving space 51 described below) is parallel to the main circuit board 301, thereby reducing the overall height of the radiation detector assembly 300 and achieving the flat panel form factor of the radiation detector assembly 300.

[0061] In some embodiments, such as Figure 3 As shown, the radiation detector assembly 300 can be mounted on the guide rail 71 via the support assembly 303, with both ends of the support assembly 303 fixedly connected to the guide rail 71. The support assembly 303 provides support for the main circuit board 301, or in other words, for the radiation detector assembly 300.

[0062] In some embodiments, such as Figure 5As shown, the support assembly 303 is provided with a first receiving space 51, and the thermal control assembly 302 is located in the first receiving space 51. That is, the first receiving space 51 is provided on the support assembly 303 near a first region of the main circuit board 301. The first receiving space 51 may include one or more receiving spaces that are connected or not connected, and their specific locations may correspond to the first region. For example, when the first region includes multiple non-connected regions, the first receiving space 51 also includes multiple non-connected receiving spaces, and each of the multiple regions of the first region corresponds one-to-one. Each receiving space accommodates the aforementioned thermal control assembly 302.

[0063] In some embodiments, such as Figure 5 As shown, the support assembly 303 has a second receiving space 52 at its connection with the main circuit board 301, and the signal processing element 314 is located in the second receiving space 52. The support assembly 303 is connected to the signal processing element 314 through a thermally conductive part (e.g., thermally conductive adhesive). The second receiving space 52 may include one or more receiving spaces that are connected or not connected, and their specific locations may correspond to the second region. For example, when the second region includes multiple non-connected regions, the second receiving space 52 also includes multiple non-connected receiving spaces, and each of the multiple regions in the second region corresponds one-to-one. Each receiving space accommodates one or more signal processing elements 314. In addition, the first receiving space 51 and the second receiving space 52 are not connected.

[0064] The inventors also discovered that in traditional CT detectors, because heat dissipation (cooling) and heating occur simultaneously, a significant amount of heat generated by the heater is released outside the detector via the cooling surface and carried away by the surrounding air. This necessitates increasing the heater power to compensate for heat loss. In this embodiment, a heat insulation element 405 is provided between the thermal control component 302 and the support component 303. By providing the heat insulation element 405, the thermal control component 302 is thermally isolated from the support component 303, which serves a heat dissipation function. This reduces the energy waste caused by the simultaneous heating and cooling during the temperature control process of the detector.

[0065] In some embodiments, the thermal control component 302 is included in the first receiving space 51, but the thermal control component 302 is not thermally coupled to the inner wall of the first receiving space 51. For example, as Figure 4As shown, the bottom of the thermal control assembly 302 is fixedly connected to the bottom inner wall of the first receiving space 51 of the support assembly 303 via a heat insulation element 405 (e.g., heat-insulating adhesive). The signal processing element 314 is contained in the second receiving space 52, but the signal processing element 314 and the second receiving space 52 do not need to be thermally isolated. Thus, the heat generated by the signal processing element 314 during operation can be released to the surrounding air through the support assembly 303. However, since the thermal control assembly 302 and the support assembly 303 are thermally isolated, the heat generated by the heating of the thermal control assembly 302 will not be released in large quantities to the outside of the detector assembly 300 along with the support assembly and carried away by the surrounding air. This improves the efficiency of the electric heater 401 and reduces energy consumption. In addition, the fixed connection of the bottom of the thermal control assembly 302 to the bottom inner wall of the first receiving space 51 of the support assembly 303 via heat-insulating adhesive can also support the thermal control assembly 302 and prevent the detector element (e.g., photoelectric conversion device) from deforming when the frame rotates.

[0066] In some embodiments, the thermal control component 302 within the first housing space 51 of the support assembly and the signal processing element 314 within the second housing space 52 are at least partially thermally isolated. For example, a gap is maintained between the inner wall of the first housing space 51 and the two sides of the thermal control component 302, and this gap can be filled with a medium with low thermal conductivity, such as air, or an insulating material. Therefore, the heat generated by the thermal control component 302 is not released in large quantities to the outside of the detector along with the support assembly and carried away by the surrounding air. This improves the efficiency of the electric heater 401 and reduces energy consumption. In some embodiments, housing the thermal control component 302 within the first housing space 51 and the signal processing element 314 within the second housing space 52 can also reduce the overall height of the radiation detector assembly 300, achieving a flat plate configuration for the radiation detector assembly 300.

[0067] In some embodiments, such as Figure 5 As shown, the support assembly 303 is also provided with a first heat sink 53. The first heat sink 53 can be disposed on the opposite side of the side of the support assembly connected to the main circuit board 301. For example, it can be disposed at both ends of the support assembly; this is merely an example. For example, the first heat sink 53 can also be disposed in the middle of the support assembly 303, or on both sides of the support assembly 303 in the width direction. This embodiment is not intended to be limiting. By providing the first heat sink 53, the heat dissipation effect of the support assembly 303 can be further improved.

[0068] In some embodiments, the radiation detector assembly 300 may further include a collimator 54 disposed on the surface of the detector element 313, the collimator 54 collimating rays emitted from the radiation source toward the detector element 313. The implementation of the collimator 54 is not limited.

[0069] Figure 6 This is a schematic diagram of a radiation detector assembly according to an embodiment of this application, and... Figure 3 The difference lies in that the radiation detector assembly 300 also includes a slave circuit board 61, which communicates with the signal processing element 314 of the main circuit board 301 and is thermally coupled to the support assembly 303 from one side of the slave circuit board 61. That is, the support assembly 303 is thermally coupled to both the main circuit board 301 and the slave circuit board 61, thereby enabling layered temperature control and achieving more precise thermal control.

[0070] In some embodiments, a signal processing element 611 (hereinafter referred to as the first signal processing element and the second signal processing element 314) is mounted on the circuit board 61. The first signal processing element may also include an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), a power supply chip, and an analog-to-digital converter (ADC), etc. The first signal processing element and the second signal processing element communicate with each other. The first signal processing element can receive signals generated by the detector element or receive signals processed by the second signal processing element via the second signal processing element. The first signal processing element is mounted on the other side of the circuit board 61. As mentioned above, the radiation detector assembly 300 may have a flat panel form factor, and correspondingly, the circuit board 61 also has a generally flat panel form factor (not shown in the top view), on which a high density of signal processing elements 611 can be mounted. Figure 6 As shown, the circuit board 61 is parallel to the support assembly 303, thereby reducing the overall height of the radiation detector assembly 300.

[0071] In some embodiments, the circuit board 61 is thermally coupled to the support assembly 303 via a thermally conductive first connection 62.

[0072] In some embodiments, to further improve heat dissipation, the radiation detector assembly also includes a second heat sink 63, which is thermally coupled from the circuit board 61 to the second heat sink 63 on the other side. For example, it is thermally coupled to the second heat sink 63 via a thermally conductive second connection 64. Figure 6 The second heat sink 63 shown extends slightly beyond the heat sink 53 in the direction of its heat sink fin extension. In other embodiments, the second heat sink 63 does not extend slightly beyond the first heat sink 53 in the direction of its heat sink fin extension, thereby reducing the overall height of the radiation detector assembly 300.

[0073] As can be seen from the above embodiments, the thermal control component 302 and the support component 303 perform temperature control in separate zones, thereby achieving more precise thermal control and improving the temperature stability of the photoelectric conversion device inside the detector component 300.

[0074] In addition, the support component 303 is thermally coupled to the main circuit board 301 and the slave circuit board 61 respectively, thereby enabling layered temperature control and achieving more precise thermal control.

[0075] Furthermore, the thermal control assembly 302 is thermally isolated from the support assembly 303, which serves as a heat dissipation component, by providing a heat insulation element 405. This reduces energy waste caused by the simultaneous heating and cooling of the detector assembly 300 during temperature control. Additionally, the heat insulation element 405 supports the thermal control assembly 302 and prevents deformation of the detector element (e.g., a photoelectric conversion device) during frame rotation.

[0076] In addition, the thermal control component 302 in the first containment space 51 of the support component 303 is at least partially thermally isolated from the signal processing element 314 in the second containment space 52, thereby reducing the energy waste caused by the simultaneous heating and cooling of the detector component 300 during the temperature control process.

[0077] This application also provides a radiation detector assembly (not shown), comprising: a main circuit board including a first region on which a detector element subject to radiation is mounted; a slave circuit board including a first signal processing element that processes signals received by the main circuit board; and a support assembly supporting the main circuit board and thermally coupled to both the main circuit board and the slave circuit board. The implementation of the main circuit board and slave circuit board can be referred to the foregoing embodiments, and will not be repeated here. By thermally coupling the support assembly to both the main circuit board and the slave circuit board, temperature control is achieved in layers, thereby enabling more precise thermal control. For example, the support assembly can be thermally coupled to the main circuit board via a thermally conductive portion (e.g., fixedly connected to the main circuit board via thermally conductive adhesive), and also thermally coupled to the slave circuit board via a thermally conductive first connection portion. The support assembly can be a long strip structure, similar to the support assembly in the foregoing embodiments, or other structures capable of thermally coupling to both the main circuit board and the slave circuit board; this application does not limit this to such a design.

[0078] In some embodiments, the radiation detector assembly may optionally include a thermal control component thermally coupled to a first region of the main circuit board.

[0079] In some embodiments, optionally, a thermal insulation element is provided between the thermal control component and the support component.

[0080] In some embodiments, the support component is provided with a first receiving space 51, and the thermal control component is located in the first receiving space. The implementation of the thermal control component can be referred to the foregoing embodiments, and will not be repeated here.

[0081] In some embodiments, optionally, the main circuit board further includes a second region where a second signal processing element is mounted; the support assembly has a second receiving space at its connection with the main circuit board, and the second signal processing element is located in the second receiving space. A thermal control component within the first receiving space of the support assembly is at least partially thermally isolated from the second signal processing element within the second receiving space. Detailed implementation can be found in the foregoing embodiments, and will not be repeated here.

[0082] This application also provides a medical imaging device. The medical imaging device of this application is, for example, a CT (computed tomography) imaging device, a PET-CT, or any other suitable medical imaging device. The medical imaging device includes a radiation detector assembly, the implementation of which can be referred to the radiation detector assembly in the foregoing embodiments, and will not be repeated here. The medical imaging device projects rays emitted by a radiation source onto the object being detected. The radiation detector assembly receives the attenuated rays from the object being detected and converts the rays into electrical signals. Based on the electrical signals generated by the radiation detector assembly, tomographic imaging of the object being detected is performed. This medical imaging device may also include other components, which can be found in [reference needed]. Figure 2 This will not be elaborated upon here.

[0083] The present application has been described above with reference to specific embodiments. However, those skilled in the art should understand that these descriptions are exemplary and not intended to limit the scope of protection of the present application. Those skilled in the art can make various modifications and variations to the present application based on the principles thereof, and these modifications and variations are also within the scope of the present application.

Claims

1. A radiation detector assembly, characterized by, The radiation detector assembly comprises: a main circuit board comprising a first region on which radiation-sensitive detector elements are mounted and a second region on which signal processing elements are mounted to receive signals generated by the detector elements; a thermal control assembly thermally coupled to the first region of the main circuit board; a support assembly supporting the main circuit board and thermally coupled to the second region of the main circuit board.

2. The radiation detector assembly of claim 1, wherein, A thermal isolation element is provided between the thermal control assembly and the support assembly.

3. The radiation detector assembly of claim 2, wherein, The support assembly is provided with a first receiving space in which the thermal control assembly is located.

4. The radiation detector assembly of claim 3, wherein, The support assembly is provided with a second receiving space at the connection with the main circuit board in which the signal processing elements are located.

5. The radiation detector assembly of claim 4, wherein, The thermal control assembly in the first receiving space of the support assembly and the signal processing elements in the second receiving space are at least partially thermally isolated.

6. The radiation detector assembly of claim 5, wherein, The thermal control assembly comprises an electric heater and a thermally conductive element thermally coupling the electric heater and the first region of the main circuit board.

7. The radiation detector assembly of claim 6, wherein, A radiation shielding element is provided between the thermally conductive element and the first region of the main circuit board.

8. The radiation detector assembly of claim 6, wherein, The thermal control assembly comprises a thermal sensor mounted to the thermally conductive element.

9. The radiation detector assembly of claim 8, wherein, The thermal control assembly, the signal processing elements and the support assembly are located on the same side of the main circuit board which is not directly exposed to radiation.

10. The radiation detector assembly of claim 9, wherein, The support assembly is provided with a first heat sink.

11. The radiation detector assembly of claim 1, wherein, The radiation detector assembly further comprises a slave circuit board in communication with the signal processing elements of the main circuit board and thermally coupled on one side to the support assembly.

12. The radiation detector assembly of claim 11, wherein, The radiation detector assembly further comprises a second heat sink thermally coupled on the other side to the slave circuit board.

13. A radiation detector assembly, characterized by The radiation detector assembly comprises: a main circuit board comprising a first region on which radiation-sensitive detector elements are mounted; a slave circuit board comprising first signal processing elements to process signals received by the main circuit board; a support assembly supporting the main circuit board and thermally coupled to the main circuit board and the slave circuit board, respectively.

14. The radiation detector assembly of claim 13, wherein, A thermal control assembly is thermally coupled to the first region of the main circuit board.

15. The radiation detector assembly of claim 14, wherein, A thermal isolation element is provided between the thermal control assembly and the support assembly.

16. The radiation detector assembly of claim 14, wherein, The support assembly is provided with a first receiving space in which the thermal control assembly is located.

17. The radiation detector assembly of claim 16, wherein, The thermal control assembly comprises an electric heater and a thermally conductive element thermally coupling the electric heater and the first region of the main circuit board.

18. The radiation detector assembly of claim 17, wherein, A radiation shielding element is provided between the thermally conductive element and the first region of the main circuit board.

19. The radiation detector assembly of claim 18, wherein, The thermal control assembly comprises a thermal sensor mounted to the thermally conductive element.

20. The radiation detector assembly of claim 19, wherein, The thermal control assembly, the first signal processing elements and the support assembly are located on the same side of the main circuit board which is not directly exposed to radiation.

21. The radiation detector assembly of claim 16, wherein, The main circuit board further comprises a second region on which second signal processing elements are mounted; the support assembly is provided with a second receiving space at the connection with the main circuit board in which the second signal processing elements are located.

22. The radiation detector assembly of claim 21, wherein, The thermal control component within the first receiving space of the support assembly is at least partially thermally isolated from the second signal processing element within the second receiving space.

23. A medical imaging device, characterized by Comprising: The radiation detector assembly of any of claims 1-22.

Images