Resin composition, prepreg and rigid-flex printed circuit board

Abstract

The invention provides a resin composition, a prepreg and a rigid-flex printed circuit board, and the resin composition comprises the following components in parts by weight: 10-100 parts of unsaturated double bond group-containing polyphenyl ether resin; 10 to 100 parts by weight of a bismaleimide resin; 5 to 40 parts by weight of a hydrogenated styrene-butadiene-styrene block copolymer; 5 to 40 parts by weight of an epoxidized isocyanurate compound; the epoxidized isocyanurate compound contains a structural formula (1), in the structural formula (1), X1, X2 and X3 are the same or different and are respectively selected from allyl and vinyl, and at least one of X1, X2 and X3 is shown in the specification; the resin composition with excellent low dielectric property, heat resistance, non-flowing property and high cohesiveness is obtained, and is suitable for the field of non-flowing prepregs with high cohesiveness and low dielectric property requirements.

Description

Technical Field

[0001] This invention relates to the field of electronic materials technology, and more particularly to a resin composition, a prepreg comprising the resin composition, and a rigid-flex plate. Background Technology

[0002] In the modern electronics industry, with the rapid development of technologies such as 5G communication and high-frequency, high-speed circuits, the requirements for the electrical performance of printed circuit board (PCB) substrates are becoming increasingly stringent. To address this challenge, researchers are constantly exploring new materials and technologies to improve the performance of electrical equipment. Among these, rigid-flex PCBs, due to their combination of rigid region stability and flexural region flexibility, are widely used in high-density interconnects, wearable devices, aerospace, and other fields. The performance of their key bonding material—low-flow prepreg—is crucial. That is, rigid-flex PCBs must not only possess good flexibility, allowing for bending and folding as needed, but also require low dielectric constant and dielectric loss. Dielectric properties are an important indicator of a material's insulation performance, determining the speed and degree of signal propagation within the material.

[0003] Currently, most low-flow or semi-flow prepregs on the market use systems such as epoxy resin, polyphenylene ether, and bismaleimide. Although they possess certain non-flowing properties, their dielectric constant (Dk) is generally between 4.2 and 4.8, and their dielectric loss (Df) is relatively high, making it difficult to meet the stringent requirements of low-loss and high-speed signal transmission in the 5G millimeter-wave band. Furthermore, these materials often suffer from insufficient adhesion, poor bonding with copper foil or cover film (CVL), and inaccurate flow control during high-temperature lamination, affecting the interlayer reliability and structural integrity of the final multilayer board.

[0004] Therefore, there is an urgent need to develop a low-flow prepreg that has ultra-low dielectric constant and dielectric loss, while also satisfying high adhesion and low resin flowability. Summary of the Invention

[0005] The purpose of this invention is to provide a resin composition, a prepreg comprising the resin composition, and a rigid-flex plate.

[0006] To achieve the above-mentioned objectives, the present invention adopts the following technical solution: a resin composition, by weight, comprising: Polyphenylene ether resin containing unsaturated double bonds: 10-100 parts by weight; Bismaleimide resin: 10-100 parts by weight; Hydrogenated styrene-butadiene-styrene block copolymer: 5-40 parts by weight; Epoxidized isocyanurate compounds: 5-40 parts by weight; The epoxidized isocyanurate compound contains structural formula (1): Structural formula (1), wherein X1, X2, and X3 are the same or different, and are selected from allyl, vinyl, or [other compounds]. And at least one of X1, X2 and X3 is .

[0007] As a further improvement of the present invention, the number average molecular weight of the polyphenylene ether resin containing unsaturated double bond groups is 1000-8000 g / mol.

[0008] As a further improvement of the present invention, the unsaturated double bonds in the polyphenylene ether resin containing unsaturated double bonds are vinyl, allyl, or methacrylate groups.

[0009] As a further improvement of the present invention, X1, X2 and X3 in the structural formula (1) contain one or two of the following: .

[0010] As a further improvement of the present invention, X1, X2 and X3 in the structural formula (1) contain allyl groups.

[0011] As a further improvement of the present invention, the number-average molecular weight of the hydrogenated styrene-butadiene-styrene block copolymer is 10,000 to 200,000.

[0012] As a further improvement of the present invention, the hydrogenated styrene-butadiene-styrene block copolymer contains the structural unit shown in structural formula (2): The structure is (2), where x, y, z, a, and b are the same or different, and are integers from 1 to 100 respectively.

[0013] As a further improvement of the present invention, the bismaleimide resin is selected from at least one of the following structures: Structural formula (3); Structural formula (4); Structural formula (5); Structural formula (6), where R2 is hydrogen, methyl, or ethyl, and R1 is methylene, ethylene, or... n is an integer from 1 to 10; Structure (7); The structure is (8), where n is an integer from 1 to 10; The structure is (9), where n is an integer from 1 to 10; The structural formula is (10), where R is hydrogen, methyl or ethyl, and n is an integer from 1 to 10.

[0014] To achieve the above-mentioned objectives, the present invention also provides a prepreg, comprising fiberglass cloth and the above-mentioned resin composition.

[0015] To achieve the above-mentioned objectives, the present invention also provides a rigid-flex plate, comprising the aforementioned prepreg.

[0016] Beneficial effects: Compared with the prior art, the present invention has the following advantages: The resin composition of this invention is formulated with polyphenylene ether resin, bismaleimide resin, hydrogenated styrene-butadiene-styrene block copolymer (SEBS), and an epoxidized isocyanurate compound. The polyphenylene ether resin and bismaleimide resin impart low dielectric and high heat resistance to the resin composition. The hydrogenated styrene-butadiene-styrene block copolymer is introduced to regulate the adhesive resistance and significantly improve the dielectric properties. The epoxidized isocyanurate compound is introduced as a crosslinking agent to enhance crosslinking and curing, while simultaneously enhancing the copper foil adhesion and CVL film adhesion properties of the composition. This results in a resin composition with excellent low dielectric, heat resistance, non-flowability, and high adhesion, suitable for the field of non-flowing prepregs requiring high adhesion and low dielectric, i.e., suitable for the preparation of rigid-flex boards. Detailed Implementation

[0017] The following describes specific implementation methods of the embodiments of the present invention. It should be noted that those skilled in the art can make several improvements and modifications without departing from the principles of the embodiments of the present invention, and these improvements and modifications are also considered to be within the protection scope of the embodiments of the present invention.

[0018] In this specification, "comprising" or "containing" means that, in addition to the components described, the resin composition may contain other components that can impart different properties to the resin composition.

[0019] This invention provides a resin composition comprising, by weight: Polyphenylene ether resin containing unsaturated double bonds: 10-100 parts by weight; Bismaleimide resin: 10-100 parts by weight; Hydrogenated styrene-butadiene-styrene block copolymer: 5-40 parts by weight; Epoxidized isocyanurate compounds: 5-40 parts by weight; The epoxidized isocyanurate compound contains structural formula (1): Structural formula (1), wherein X1, X2, and X3 are the same or different, and are selected from allyl, vinyl, or [other compounds]. And at least one of X1, X2 and X3 is .

[0020] The resin composition of this invention is formulated with polyphenylene ether resin, bismaleimide resin, hydrogenated styrene-butadiene-styrene block copolymer (SEBS), and an epoxidized isocyanurate compound. The polyphenylene ether resin and bismaleimide resin impart low dielectric and high heat resistance to the resin composition. The hydrogenated styrene-butadiene-styrene block copolymer is introduced to regulate the adhesive resistance and significantly improve the dielectric properties. The epoxidized isocyanurate compound is introduced as a crosslinking agent to enhance crosslinking and curing, while simultaneously enhancing the copper foil adhesion and CVL film adhesion properties of the composition. This results in a resin composition with excellent low dielectric, heat resistance, non-flowability, and high adhesion, suitable for the field of non-flowing prepregs requiring high adhesion and low dielectric, i.e., suitable for the preparation of rigid-flex boards.

[0021] In a preferred embodiment, the number-average molecular weight of the polyphenylene ether resin containing unsaturated double bonds is 1000–8000 g / mol. Specifically, the number-average molecular weight is determined by gel permeation chromatography based on polystyrene calibration, in accordance with GB / T 21863 2008.

[0022] In this preferred embodiment, a polyphenylene ether resin containing unsaturated double bonds with a number-average molecular weight of 1000–8000 g / mol is used. This specific molecular weight range ensures that the resin system has a low melt viscosity, which is beneficial for the full wetting and processing of the reinforcing material, while also providing sufficiently long molecular chains to construct a dense cross-linked network. This contributes to obtaining superior mechanical strength, dimensional stability, and lower dielectric loss after curing, thereby synergistically improving the overall performance of the prepreg.

[0023] In a preferred embodiment, the unsaturated double bonds in the polyphenylene ether resin containing unsaturated double bonds are vinyl, allyl, or methacrylate groups. Using vinyl, allyl, or methacrylate groups as the unsaturated double bonds in the polyphenylene ether resin provides suitable reactivity and curing rate. These groups can undergo efficient copolymerization and crosslinking with the active groups in the bismaleimide resin and epoxidized isocyanurate compound in the resin system, which is beneficial for forming a uniform and dense network structure, thereby improving the consistency of the heat resistance, mechanical strength, and dielectric properties of the final cured product.

[0024] In one specific embodiment, the polyphenylene ether resin containing unsaturated double bond groups is a compound with the structural formula (11): Structural formula (11).

[0025] In the above structural formula (11), R3, R4, R5, and R6 are each independently selected from hydrogen, C1-C8 straight-chain or branched alkyl groups. m and n represent the number of repeating units, each independently selected from integers from 1 to 100. A1 and A2 are each independently selected from any one of the following groups: , In this context, p and q are each independently selected from integers from 0 to 8, R7, R8, and R9 are each independently selected from hydrogen, C1-C8 straight-chain or branched alkyl groups, and M is selected from carbonyl, C6-C6, and C7-C8 straight-chain or branched alkyl groups. 18 aryl, C1-C 10 Straight-chain or branched alkylene groups.

[0026] In addition, in the above structural formula (11), Z is selected from X is selected from C1 to C2. 20 Straight-chain or branched alkylene groups, C3-C 20 Cyclohexene group, C2~C 20 heterocyclic hydrocarbon groups, or .

[0027] For example, the polyphenylene ether resin containing unsaturated double bonds can be selected from SA9000 (methacrylate-terminated) manufactured by SABIC, OPE-2St manufactured by Mitsubishi Gas, etc. (vinyl-terminated).

[0028] In a preferred embodiment, X1, X2, and X3 in the structural formula (1) contain one or two of the following: An appropriate amount was introduced into the molecule. This ensures a sufficient cross-linking reaction with the resin system, effectively improving the heat resistance and network strength of the cured product, while avoiding excessively rapid cross-linking or an overly rigid cross-linking network due to excessively high epoxy functionality. This helps maintain good process tolerance during processing and ultimately achieves a better balance between excellent mechanical properties and reliable interfacial adhesion in the cured product.

[0029] In a preferred embodiment, X1, X2, and X3 in the structural formula (1) contain allyl groups. Allyl groups possess moderate reactivity, enabling them to copolymerize with double bonds in the resin system (such as the unsaturated end groups of polyphenylene ether resin and the double bonds of bismaleimide), participating in the construction of a unified crosslinking network, without affecting process stability due to excessively vigorous reactions. Simultaneously, allyl groups can form a reactivity gradient with the epoxy groups in the molecule, achieving stepwise curing, which helps reduce internal stress, improve the toughness of the cured material, and further enhance chemical bonding with substrates such as copper foil, thereby synergistically improving the overall performance and reliability of the material.

[0030] In a preferred embodiment, the epoxidized isocyanurate compound is selected from compounds represented by structural formula (12) or / and structural formula (13): Structural formula (12); Structural formula (13). Both the epoxidized isocyanurate compounds shown in structural formulas (12) and (13) contain an allyl group and two... .

[0031] For example, the epoxidized isocyanurate compound may be MA-DGIC or DA-MGIC manufactured by Hefei Anbang Chemical Co., Ltd.

[0032] Specifically, the number-average molecular weight of the hydrogenated styrene-butadiene-styrene block copolymer is 10,000-200,000. SEBS in this molecular weight range achieves good dispersion and compatibility in resin systems. Its suitable molecular chain length effectively penetrates and toughens the rigid network formed by polyphenylene ether and bismaleimide, improving the material's impact resistance and flexibility, without causing excessively high system viscosity or processing difficulties due to excessively large molecular weight. Simultaneously, SEBS in this molecular weight range helps to more precisely control the resin's rheological behavior before curing, synergistically achieving low overflow and good impregnation effects, thereby ensuring that the final prepreg possesses excellent dielectric properties, mechanical reliability, and process adaptability.

[0033] In a preferred embodiment, the hydrogenated styrene-butadiene-styrene block copolymer contains structural units represented by structural formula (2): The structure is (2), where x, y, z, a, and b are the same or different, and are integers from 1 to 100 respectively.

[0034] For example, the hydrogenated styrene-butadiene-styrene block copolymer may be selected from SEBS series products manufactured by Kuraray or SEBS series products manufactured by Kraton.

[0035] In one specific embodiment, the maleimide resin is selected from at least one of the following structures: Structural formula (3); Structural formula (4); Structural formula (5); Structural formula (6), where R2 is hydrogen, methyl, or ethyl, and R1 is methylene, ethylene, or... n is an integer from 1 to 10; Structure (7); The structure is (8), where n is an integer from 1 to 10; The structure is (9), where n is an integer from 1 to 10; The structural formula is (10), where R is hydrogen, methyl or ethyl, and n is an integer from 1 to 10.

[0036] For example, the maleimide resin may be any one or more of the following grades: BMI-1000, BMI-1000H, BMI-1100, BMI-1100H, BMI-2000, BMI-2300, BMI-3000, BMI-3000H, BMI-4000H, BMI-5000, BMI-5100, BMI-7000, BMI-7000H manufactured by Yamato Chemical Co., Ltd.; BMI, BMI-70, BMI-80 manufactured by KI Chemical Co., Ltd.; MIR-3000, MIR-5000 manufactured by Nippon Kayaku Co., Ltd.; X9-450, X9-470, X9-480 manufactured by DIC Corporation of Japan; D936, D937, D939, D950 manufactured by Sichuan Dongcai Co., Ltd., etc.

[0037] In a preferred embodiment, the resin composition further contains 10-200 parts by weight of inorganic filler.

[0038] The inorganic filler is selected from at least one of spherical silica, aluminum hydroxide, alumina, talc, aluminum nitride, boron nitride, silicon carbide, barium sulfate, barium titanate, strontium titanate, calcium carbonate, calcium silicate, mica, and glass fiber powder.

[0039] In a preferred embodiment, the inorganic filler comprises silica. Specifically, the inorganic filler is surface-treated with a silane coupling agent, wherein the silane coupling agent is at least one of an aminosilane coupling agent, a carbon-carbon double-bond silane coupling agent, or an epoxysilane coupling agent. This significantly improves the dispersibility and compatibility of the inorganic filler in the resin composition, effectively preventing localized stress concentration and process defects caused by inorganic filler agglomeration; simultaneously, it greatly enhances the chemical bonding and interfacial adhesion between the inorganic filler and the resin, thereby more effectively transferring and dispersing stress when subjected to thermal or mechanical stress, inhibiting interfacial debonding and crack initiation, and significantly improving the mechanical strength and thermal fatigue resistance of the laminate.

[0040] In a preferred embodiment, the resin composition further comprises, by weight, 0.001 to 5 parts of dispersant and 0.001 to 10 parts by weight of coupling agent.

[0041] The dispersant is selected from BYK-161 and / or BYK-111 manufactured by BYK Corporation.

[0042] The coupling agent is selected from KBM-402, KBM-403, KBM-502, KBE-503, KBM-603, KBM-903, KBM-573, KBM-602, KBM-1003, etc., manufactured by Shin-Yue Chemical.

[0043] In a preferred embodiment, the resin composition further contains 5-60 parts by weight of a crosslinking agent. When an appropriate amount of crosslinking agent is added to the resin composition, the curing crosslinking density between the resins can be increased, further improving heat resistance and increasing the content of carbon-hydrogen bonds, effectively reducing the dielectric constant and dielectric loss.

[0044] Specifically, the crosslinking agent is selected from at least one of the following structures: , , , , .

[0045] In a preferred embodiment, the resin composition further contains 0.01-10 parts by weight of a curing accelerator.

[0046] Specifically, the curing accelerator is selected from any one or a combination of at least two of the following: acidic curing accelerators, organophosphorus curing accelerators, imidazole curing accelerators, pyridine curing accelerators, amine curing accelerators, peroxides, or organometallic salts. That is, the curing accelerator can be used alone or at least two can be mixed.

[0047] The acidic curing accelerators include p-toluenesulfonic acid, etc. The organophosphorus curing accelerators include triphenylphosphine, etc. The imidazole curing accelerators include imidazole or imidazole derivatives (e.g., 2-ethyl-4-methylimidazolium). The pyridine curing accelerators include pyridine or pyridine derivatives (e.g., 4-dimethylaminopyridine). The amine curing accelerators include secondary amine compounds, tertiary amine compounds, or quaternary ammonium salts. The peroxides include dicumyl peroxide, 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexyn-3, 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane, or α,α'-bis(tert-butylperoxy)dicumyl peroxide, etc. The organometallic salts include zinc naphthenate, cobalt naphthenate, tin octoate, or cobalt octoate, etc.

[0048] In a preferred embodiment, the resin composition further includes 5 to 50 parts by weight of a flame retardant, the flame retardant being selected from bromine-based flame retardants, phosphorus-based flame retardants, nitrogen-based flame retardants, etc.

[0049] The bromine-based flame retardant is selected from decabromodiphenyl ether, decabromodiphenyl ethane, styrene bromide, or tetrabromophthalamide.

[0050] The phosphorus-based flame retardant is selected from inorganic phosphorus, phosphate esters, phosphoric acid, hypophosphoric acid, phosphorus oxide, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO), and 10-(2,5-dihydroxyphenyl)-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO-HQ). (m is an integer from 1 to 5) Organophosphorus compounds such as 10-phenyl-9,10-dihydro-9-oxa-10-phosphenanthrene-10-oxide, tris(2,6-dimethylphenyl)phosphine, phosphazenes, and modified phosphazenes.

[0051] The nitrogen-based flame retardant is selected from triazine compounds, cyanuric acid compounds, isocyanic acid compounds, phenothiazine, etc.

[0052] For example, in one specific embodiment, the flame retardant is selected from the following: phosphazene retardants manufactured by Otsuka Chemicals of Japan, with the grades SPB-10, BP-PZ, PP-PZ, SPCN-100, SPV-100 and SPB-100L; phosphazene retardants manufactured by Fushimi Pharmaceuticals, with the grades FP-100, FP-300B and FP-390; phosphate ester retardants manufactured by Daihachi Chemicals, with the grades PX-200, PX-201 and PX-202; phosphate ester retardants manufactured by FRX of the United States, with the grades OL3001 and OL5000; phosphate retardants manufactured by Clariant, with the grades OP-935 and OP-930; and brominated flame retardants manufactured by Albemarle, with the grade SAYTEX8010.

[0053] The present invention also provides a prepreg prepared from the above-described resin composition, wherein the prepreg is a low-flow prepreg. Specifically, the present invention also provides a prepreg comprising fiberglass cloth and the above-described resin composition.

[0054] The fiberglass cloth is preferably made of split fiber or flat fiber. More preferably, the fiberglass cloth is made of E fiberglass cloth, T fiberglass cloth, S fiberglass cloth or Q fiberglass cloth.

[0055] Furthermore, when using glass fiber cloth, the glass fiber cloth generally requires chemical treatment to improve the interfacial bonding between the resin composition and the glass fiber cloth. The main method of this chemical treatment is coupling agent treatment. Preferably, the coupling agent used is a silane coupling agent containing double bonds or an aminosilane coupling agent to provide good adhesion and heat resistance.

[0056] The method for preparing the prepreg is as follows: Add the aforementioned resin composition to a mixing tank, add a diluent (solvent) to adjust the solid content to 40-70%, and stir until homogeneous to form a gel solution; The fiberglass cloth is impregnated in the above-mentioned adhesive solution to coat the fiberglass cloth with the adhesive solution. Then, the impregnated fiberglass cloth is baked at 100-200℃ for 3-10 minutes to dry, thereby obtaining the semi-cured sheet provided by the present invention.

[0057] Specifically, the solvent may be selected from at least one of acetone, butanone, toluene, methyl isobutyl ketone, N,N-dimethylformamide, N,N-dimethylacetamide, ethylene glycol methyl ether, propylene glycol methyl ether, benzene, toluene, xylene, and cyclohexane.

[0058] The present invention also provides a rigid-flex plate comprising the above-described prepreg.

[0059] The present invention will be described in detail below with reference to specific embodiments; of course, it should be understood that the embodiments in the present invention are not limited to these embodiments.

[0060] Examples 1-5 and Comparative Examples 1-3, wherein: Table 1: Ingredients of the Resin Composition

[0061] The polyphenylene ether resin is selected from Mitsubishi Gas's OPE-2St-1200, the bismaleimide resin is selected from Nippon Kayaku's MIR-5000, the hydrogenated styrene-butadiene-styrene block copolymer is selected from Kraton's G1726V, the epoxidized isocyanurate compound is selected from Anbang Chemical's MA-DGIC, the spherical silica is selected from Lianrui New Materials' S36028VA, the flame retardant is selected from Daihachi Chemical's PX-202, and the TAIC is selected from Evonik's TAIC.

[0062] The above embodiments and comparative examples 1-3 also disclose a low-flow prepreg, comprising a glass fiber cloth and a corresponding resin composition coated onto the glass fiber cloth by an impregnation method. The prepreg is prepared by the following method: According to the components and corresponding contents in Table 1, dissolve them with methyl ethyl ketone, stir and mix them evenly, and then dilute them into a glue solution with a solid content of 65wt%. E-glass fiber cloth was sequentially immersed in the adhesive solutions obtained in Examples 1-5 and Comparative Examples 1-3. After immersion, it was removed and placed in a 160°C forced-air drying oven for 3-6 minutes to prepare a low-flow semi-cured sheet.

[0063] Preparation of sample laminates for performance evaluation: (1) Preparation of laminate The prepregs prepared in Examples 1-4 and Comparative Examples 1-3 were cut to 300×300mm respectively. Then, an electrolytic copper foil was placed on each side of the prepreg, and they were stacked into a certain structure. They were then pressed in a vacuum hot press to obtain a laminate / copper clad laminate.

[0064] Performance evaluation methods: (1) Glue overflow: Measured according to IPC-TM650, 2.3.17.2; (2) CVL adhesion: The sample width was 10 mm, and the peel force tester was used for testing; (3) Powder shedding rate: The weight loss was calculated after 20 cuts were made with a utility knife on a 10cm×10cm prepreg sheet; (4) Tg: DMA was used, with a heating rate of 10℃ / min and a frequency of 10Hz; (5) Dk and Df: The dielectric properties at 10 GHz were tested using the planar method according to IPC-TM-650 2.5.5.9; (6) Peel strength: The peel strength of the metal capping layer was tested according to the experimental conditions of “after thermal stress” in IPC-TM-650 2.4.8.

[0065] Among them, the amount of adhesive overflow, CVL adhesion, and powder shedding rate were tested using prepreg, while Tg, Dk, Df, and peel strength were tested using laminate.

[0066] The properties of the prepregs obtained using the above Examples 1-5 and Comparative Examples 1-3, and the corresponding laminates are shown in Table 2 below.

[0067] Table 2

[0068] Note: In Table 2, " / " indicates that there are no test indicators.

[0069] Example 1 and Comparative Example 1 were compared in parallel. The resin composition in Comparative Example 1 did not contain hydrogenated styrene-butadiene-styrene block copolymer. Comparing the performance of the prepregs and laminates prepared from both, it was found that, compared to Comparative Example 1, the laminate prepared from the resin composition of Example 1 had lower Dk and Df values. The prepreg prepared from the resin composition of Example 1 had controllable and less adhesive overflow, achieving ultra-low adhesive overflow while providing moderate and tough CVL adhesion, meeting the processing requirements of rigid-flex boards. Furthermore, the prepreg prepared from the resin composition of Example 1 had a lower powder shedding rate, indicating higher toughness.

[0070] Example 4 and Comparative Example 2 were compared in parallel. The resin composition in Comparative Example 2 did not contain epoxidized isocyanurate compounds. Comparing the performance of the prepreg and laminate prepared by the two, it can be seen that the laminate prepared by the resin composition of Example 4 has higher peel strength than that of Comparative Example 2, and the prepreg prepared by the resin composition of Example 4 also has higher CVL adhesion.

[0071] Example 2 and Comparative Example 3 were compared in parallel, with Example 3 not containing bismaleimide resin. A comparison of the properties of the prepregs and laminates prepared from both examples showed that, compared to Comparative Example 3, the laminate prepared from the resin composition of Example 2 had a higher glass transition temperature and higher peel strength, while the prepreg prepared from the resin composition of Example 2 had higher CVL adhesion.

[0072] A parallel comparison was made between Example 5 and Example 4, and the content of epoxidized isocyanurate compound in Example 5 was higher than that in Example 4. A comparison of the performance of the prepreg and laminate prepared by both showed that, compared to Example 4, the laminate prepared from the resin composition of Example 5 had a higher glass transition temperature, lower Dk and Df values, and higher peel strength. The prepreg prepared from the resin composition of Example 5 had a lower powder shedding rate, indicating higher toughness.

[0073] It should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This way of describing the specification is only for clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0074] The detailed descriptions listed above are merely specific descriptions of feasible embodiments of the present invention, and are not intended to limit the scope of protection of the present invention. All equivalent embodiments or modifications made without departing from the spirit of the present invention should be included within the scope of protection of the present invention.

Claims

1. A resin composition, characterized by comprising: The resin composition comprises, by weight: an unsaturated double bond group-containing polyphenylene ether resin: 10 to 100 parts by weight; a bismaleimide resin: 10 to 100 parts by weight; a hydrogenated styrene-butadiene-styrene block copolymer: 5 to 40 parts by weight; an epoxidized isocyanurate compound: 5 to 40 parts by weight; the epoxidized isocyanurate compound contains a structural formula (1): Formula (1), wherein X1, X2and X3are the same or different and are selected from allyl, vinyl or , and at least one of X1, X2and X3is .

2. The resin composition according to claim 1, wherein the unsaturated double bond group-containing polyphenylene ether resin has a number average molecular weight of 1,000 to 8,000 g / mol.

3. The resin composition according to claim 1, wherein the unsaturated double bond group in the unsaturated double bond group-containing polyphenylene ether resin is a vinyl group, an allyl group, or a methacrylate group.

4. The resin composition according to Claim 1, wherein one or two of X1, X2and X3in the structural formula (1) contain 1 or 2 .

5. The resin composition according to Claim 1, wherein the structural formula (1) contains an allyl group in X1, X2, and X3.

6. The resin composition according to Claim 1, wherein the hydrogenated styrene-butadiene-styrene block copolymer has a number average molecular weight of 100,000 to 2,000,000.

7. The resin composition according to Claim 6, wherein the hydrogenated styrene-butadiene-styrene block copolymer contains a structural unit represented by a structural formula (2): Structure (2), wherein x, y, z, a, b are the same or different and each is an integer from 1 to 100.

8. The resin composition according to Claim 1, wherein the bismaleimide resin is selected from at least one of the following structures: Structural formula (3); Structural formula (4); Structural formula (5); Structure (6), R2is hydrogen, methyl or ethyl, R1is methylene, ethylene or , n is an integer from 1 to 10; Structure (7); Structure (8), n is an integer from 1 to 10; Structure (9), n is an integer from 1 to 10; Formula (10), R is hydrogen, methyl or ethyl, and n is an integer from 1 to 10.

9. A prepreg, characterized by: a glass fiber cloth and the resin composition according to any one of claims 1 to 8.

10. A rigid-flex printed circuit board, characterized by: a prepreg according to claim 9.

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