Liquid cooling semiconductor type vehicle-mounted refrigerator

Abstract

The invention relates to the technical field of vehicle-mounted refrigerators, and provides a liquid cooling semiconductor type vehicle-mounted refrigerator which comprises a vehicle-mounted refrigerator body and a vehicle-mounted refrigerator door body, and one side of the vehicle-mounted refrigerator door body is rotatably connected with the corresponding side of the vehicle-mounted refrigerator body through a hinge; an inner container is assembled in the vehicle-mounted refrigerator body, an installation cavity is formed between the vehicle-mounted refrigerator body and the inner container, a liquid cooling refrigeration module is arranged in the installation cavity and comprises a semiconductor chip, a hot end assembly and a cold end assembly, the hot end assembly is arranged on one side of the hot end of the semiconductor chip, and the cold end assembly is arranged on one side of the cold end of the semiconductor chip. The cold end assembly is arranged on one side of the cold end of the semiconductor chip. According to the vehicle-mounted refrigerator, the liquid cooling plate is adopted to replace traditional fin heat dissipation aluminum, on the premise that the heat dissipation performance is guaranteed and even improved, the size and the occupied space of a hot end heat dissipation system are greatly reduced, the structure of the whole vehicle-mounted refrigerator is more compact, and the vehicle-mounted refrigerator is easier to install and arrange in the limited space in a vehicle.

Description

Technical Field

[0001] This invention relates to the technical field of vehicle refrigerators, and in particular to a liquid-cooled semiconductor vehicle refrigerator. Background Technology

[0002] As an important product for enhancing the user experience in modern car cabins, the performance of car refrigerators directly affects the user experience. Currently, most mainstream car refrigerators on the market adopt a semiconductor refrigeration solution. The structural design of this type of refrigeration solution is as follows: a cooling block and an aluminum inner liner are arranged on one side of the semiconductor chip. The cooling block transfers the cold energy generated by the semiconductor chip to the aluminum inner liner, thereby achieving heat exchange with the air inside the refrigerator and achieving the purpose of refrigeration; on the other side of the semiconductor chip, heat dissipation fins and a cooling fan are arranged to dissipate the heat generated by the semiconductor chip during operation.

[0003] However, existing semiconductor-based car refrigerators have many performance defects that seriously affect their performance: First, the cooling effect is poor, and it cannot reach the freezing requirement of -6℃; second, the heat dissipation efficiency is low, and the combination structure of the heat sink fins and cooling fan on the other side of the semiconductor chip cannot dissipate heat quickly and efficiently, further restricting the improvement of cooling performance; third, in high-temperature environments (such as 30℃ and above), the cooling performance is further reduced, and the freezing effect cannot be achieved at all; fourth, the heat blown out by the cooling fan will be directly diffused into the car cabin when it is working, which not only affects the comfort of the passengers in the car, but also disrupts the temperature environment in the cabin, resulting in a poor user experience. Summary of the Invention

[0004] To address the aforementioned technical problems, this invention provides a liquid-cooled semiconductor-type vehicle refrigerator, comprising a vehicle refrigerator body and a vehicle refrigerator door. One side of the vehicle refrigerator door is rotatably connected to the corresponding side of the vehicle refrigerator body via a hinge. An inner liner is installed inside the vehicle refrigerator body, and an installation chamber is provided between the vehicle refrigerator body and the inner liner. A liquid-cooled refrigeration module is installed in the installation chamber. The liquid-cooled refrigeration module includes a semiconductor chip, a hot-end component, and a cold-end component. The hot-end component is disposed on the hot-end side of the semiconductor chip, and the cold-end component is disposed on the cold-end side of the semiconductor chip.

[0005] Furthermore, the hot-end assembly includes a liquid-cooled plate and a hot-end NTC. The liquid-cooled plate has a liquid-cooled flow channel and a flow channel guide plate inside, and the flow channel guide plate is fixed to the inner wall of the liquid-cooled flow channel by welding. The liquid-cooled plate has an inlet pipe and an outlet pipe that communicate with the liquid-cooled flow channel. The inlet pipe is used to connect to the vehicle's coolant system. The coolant flows through the liquid-cooled flow channel under the action of pressure difference and flows out from the outlet pipe. The hot-end NTC is installed on the inner side of the liquid-cooled plate and close to the semiconductor chip side. The signal line of the hot-end NTC is led out through a wiring harness and connected to the control unit to feed back the temperature signal of the coolant in the outlet pipe to the control unit.

[0006] Furthermore, the liquid cooling plate includes a substrate and a cover plate. Liquid cooling channels are formed on the substrate by a stamping process, and the cover plate is sealed to the substrate and the channel guide plate by a welding process to cover the liquid cooling channels and form a cooling channel.

[0007] Preferably, both the substrate and the cover plate are made of 1.5mm thick aluminum plates.

[0008] Furthermore, the cold end assembly includes a cold end NTC, a cold end fan, and cold end fins, with the cold end fan located above or below the cold end fins, and the cold end NTC fixed to the cold end fins by fasteners and close to the semiconductor chip side.

[0009] Furthermore, the lower end of the cold-end fin is provided with a bevel.

[0010] Furthermore, the liquid cooling module also includes heat insulation cotton, which has a second placement hole for placing a semiconductor chip, and the heat insulation cotton wraps around the semiconductor chip.

[0011] Furthermore, the liquid cooling module also includes an air guide shroud. One side of the air guide shroud is provided with a first placement groove for placing heat insulation cotton and a first placement hole for placing cold end fins. The first placement hole is provided with fixing parts on both sides for fixing the cold end fins. The other side of the air guide shroud is provided with a second placement groove for placing a cold end fan. The second placement groove and the first placement hole are arranged vertically.

[0012] Furthermore, the inner liner is provided with an air vent and an air guide hole on its side wall. The air guide hole corresponds to the position of the cold end fan. The cold end fan is used to draw in the air inside the inner liner through the air guide hole and blow it toward the cold end fins.

[0013] The air vent is located at the position corresponding to the lower end of the cold end fin, which is configured to send the cooled air back into the inner liner.

[0014] Furthermore, the outer side of the vehicle refrigerator door is provided with an arc-shaped structure that adapts to the arm support posture of the driver and passengers. The radius of curvature of the arc-shaped structure matches the curvature of the driver and passengers' arms when they are naturally placed.

[0015] Furthermore, the vehicle refrigerator is placed in the armrest box installation area between the driver's seat and the passenger seat of the car. The overall dimensions of the vehicle refrigerator are adapted to the spatial contour of this area, and it is fixedly connected to the vehicle body or seat frame through a preset installation interface.

[0016] The present invention has the following beneficial effects:

[0017] (1) The present invention uses a cold-end fan to force the air inside the box to flow through the cold-end fins, forming an efficient air circulation, which greatly improves the heat exchange efficiency and realizes rapid cooling inside the box.

[0018] (2) The hot end of the present invention adopts a liquid cooling plate for efficient heat dissipation, which can quickly remove the heat generated by the semiconductor chip. Under high temperature conditions, the temperature inside the box can also drop rapidly, meeting the user's need for deep cooling in hot weather.

[0019] (3) The cold end fan in this invention continuously blows the cold end fins, which accelerates the air flow on the fin surface and can effectively prevent condensation and frost caused by low temperature. This avoids the impact of frost on the operation of the fan and the cooling efficiency, and ensures the long-term stable operation of the system.

[0020] (4) Compared with traditional air-cooled fins, the cooling liquid circulation system inside the liquid cooling plate in this invention has higher heat exchange efficiency and more stable heat dissipation capability. It can continuously and efficiently remove the heat from the hot end of the semiconductor chip, ensuring that the chip works within a safe temperature range and extending its service life.

[0021] (5) In this invention, liquid cooling plates are used instead of traditional finned heat dissipation aluminum. While ensuring or even improving heat dissipation performance, the volume and space occupied by the hot end heat dissipation system are greatly reduced, making the structure of the entire vehicle refrigerator more compact and easier to install and arrange in the limited space inside the vehicle.

[0022] (6) The outer side of the vehicle refrigerator door in this invention is provided with an arc-shaped structure that is adapted to the arm support posture of the driver and passenger. The radius of curvature of the arc-shaped structure matches the fitting arc when the driver and passenger's arm is naturally placed. The width and height of the support surface are adapted to the ergonomic design, which can provide comfortable elbow support for the driver and passenger. At the same time, the arc-shaped structure is integrally formed with the door body, and its structural strength meets the support load requirements of the axle pillow.

[0023] (7) The present invention uses coolant for cooling, which can be achieved through a simple three-way pipe. There is no need to start the air conditioning compressor, thus avoiding the energy consumption of the compressor and significantly improving energy utilization efficiency. At the same time, it reduces the noise and vibration caused by the operation of the compressor, improving the stability of operation and user experience.

[0024] (8) The vehicle refrigerator of the present invention is placed in the armrest box installation area between the driver's seat and the passenger seat of the car. The overall size of the vehicle refrigerator is adapted to the spatial contour of the area. It is fixedly connected to the car body or seat frame through a preset installation interface (such as buckle, bolt hole) to replace the traditional armrest box structure. While realizing the refrigeration function, it also has the storage and support functions of the armrest box. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0026] Figure 2 This is a cross-sectional view of the present invention.

[0027] Figure 3 This is a schematic diagram of the liquid cooling module on the hot end component side in this invention.

[0028] Figure 4 This is a schematic diagram of the liquid cooling module on the cold end component side of the present invention.

[0029] Figure 5 This is an exploded view of the cooling module in this invention.

[0030] Figure 6 This is a schematic diagram of the air guide shroud on the hot end component side in this invention.

[0031] Figure 7 This is a schematic diagram of the air guide shroud on the cold end component side in this invention.

[0032] Figure 8 This is a schematic diagram of the vehicle-mounted refrigerator lid in this invention. Detailed Implementation

[0033] The technical solution of the present invention will be further described in detail below with reference to specific embodiments. However, these embodiments are not intended to limit the present invention. Any similar structures and similar variations of the present invention should be included in the protection scope of the present invention. The commas in the present invention all indicate the relationship between and. The English letters in the present invention are case-sensitive.

[0034] like Figure 1-4As shown, the present invention provides a liquid-cooled semiconductor vehicle refrigerator 1, including a vehicle refrigerator body 1 and a vehicle refrigerator door 2. One side of the vehicle refrigerator door 2 is rotatably connected to the corresponding side of the vehicle refrigerator body 1 via a hinge 20. The vehicle refrigerator door 2 is configured to rotate and open about the axis of rotation of the hinge in a direction away from the vehicle refrigerator body 1, thereby forming an open opening in the internal cavity of the vehicle refrigerator body 1 to enable access to the internal space of the vehicle refrigerator body 1. When the vehicle refrigerator door 2 is closed, it can fit against the sealing surface of the vehicle refrigerator body to ensure the airtightness of the vehicle refrigerator body. An inner liner 3 is installed inside the vehicle refrigerator body 1, and a cold cavity for accommodating items to be cooled is formed inside the inner liner 3. An installation chamber 5 is provided between the vehicle refrigerator body 1 and the inner liner 3, and a liquid cooling module 4 is provided in the installation chamber 5 for cooling the cold cavity. The liquid-cooled refrigeration module 4 includes a semiconductor chip 41, a hot-end component 42, and a cold-end component 43. The hot-end component 42 is disposed on the hot-end side of the semiconductor chip 41, and the cold-end component 43 is disposed on the cold-end side of the semiconductor chip 41. The semiconductor chip 41 operates based on the Peltier effect. When current passes through it, one end (cold end) absorbs heat, and the other end (hot end) releases heat. The hot-end component 42 is disposed on the hot-end side of the semiconductor chip 41 to release heat, and the cold-end component 43 is disposed on the cold-end side of the semiconductor chip 41. The semiconductor chip 41 has significant advantages such as small size, low energy consumption, fast cooling response speed, and no mechanical moving parts (quiet operation and low failure rate). It is very suitable for the small space and low noise operation requirements of vehicles, and the cooling temperature can be precisely controlled to meet the refrigeration and preservation requirements of different foods and beverages.

[0035] like Figure 5As shown, the hot-end component 42 includes a liquid cooling plate 421 and a hot-end NTC 422. The liquid cooling plate 421 has a liquid cooling channel and a channel guide plate 4211. The channel guide plate 4211 is fixed to the inner wall of the liquid cooling channel by welding. The shape and size of the liquid cooling channel are optimized to maximize the contact area between the coolant and the wall of the liquid cooling plate and improve the heat exchange efficiency. The liquid cooling plate 421 has an inlet pipe 4212 and an outlet pipe 4213 connected to the liquid cooling channel. The inlet pipe 4212 is used to connect to the vehicle's coolant system. The coolant flows through the liquid cooling channel under the action of pressure difference and flows out from the outlet pipe 4213. The liquid cooling plate 421 is used to efficiently absorb and remove the heat generated by the hot end of the semiconductor chip. As a core component for hot-end heat dissipation, the liquid cooling plate has the advantages of high heat dissipation efficiency, stable heat dissipation, and less influence from airflow in the vehicle environment compared with traditional air cooling methods. It can avoid the degradation or damage of the cooling performance of the semiconductor chip due to heat accumulation at the hot end. The hot-end NTC is installed inside the liquid cooling plate 421 and close to the semiconductor chip 41. The signal line of the hot-end NTC is led out through a wiring harness and connected to the control unit, which is used to feed back the temperature signal of the coolant in the outlet pipe 4213 to the control unit. The control unit is the core electronic control module used to receive the temperature signal of the hot-end NTC and perform closed-loop control of the operating status of the vehicle's coolant system. Its core function is to adjust the heat dissipation efficiency according to the coolant temperature feedback to ensure that the hot-end temperature of the semiconductor chip is stable within a preset operating range. The control unit can be an independent module or integrated into the vehicle controller (VCU), semiconductor chip driver controller, or coolant system main controller. The hot-end NTC has the advantages of high temperature measurement accuracy and fast response speed. Its real-time temperature feedback signal allows the control unit to accurately adjust the coolant flow or semiconductor chip operating power to achieve dynamic balance of hot-end heat dissipation, which not only ensures heat dissipation effect but also reduces energy consumption, and effectively prevents the coolant temperature from being too high and burdening the vehicle's cooling system.

[0036] The liquid cooling plate 421 includes a substrate 4214 and a cover plate 4215. Liquid cooling channels are formed on the substrate 4214 by a stamping process. The cover plate 4215 is sealed to the substrate 4214 and the channel guide plate by a welding process to cover the liquid cooling channels and form a cooling channel. The sealed connection design between the cover plate and the substrate can completely isolate external dust and moisture from entering the channel, avoid channel blockage or internal corrosion, and extend the service life of the liquid cooling plate.

[0037] Preferably, the substrate 4214 and the cover plate 4215 are both made of 1.5mm thick aluminum plates.

[0038] The cold-end assembly 43 includes a cold-end NTC 431, a cold-end fan 432, and cold-end fins 433. The cold-end fan 432 is located above or below the cold-end fins 433. The cold-end fan 432 is used to force airflow within the cold cavity through the cold-end fins 433 to achieve rapid heat exchange. The cold-end fins adopt a multi-fin dense arrangement design, which can effectively improve the cold transfer efficiency and extend the service life. The cold-end fins 433 are used to increase the contact area with air, efficiently transferring the cold energy from the cold end of the semiconductor chip 41 to the flowing air. The cold-end NTC is fixed to the cold-end fins 433 with fasteners and is close to the semiconductor chip 41. The cold-end NTC is used to monitor the temperature of the cold-end fins 433 in real time to provide feedback to the control system, accurately controlling the cooling temperature and preventing icing. The cold-end NTC temperature measurement range is wide and the error is small. Its real-time monitoring function allows the control system to dynamically adjust the working state of the semiconductor chip according to the cold-end temperature, achieving precise temperature control of ±0.5℃. This not only ensures the optimal preservation temperature for refrigerated items, but also effectively prevents refrigeration failure caused by icing at the cold end, thus improving product reliability.

[0039] The lower end of the cold end fin 433 is provided with a slope 4331, which can smoothly guide the vertically downward airflow to the horizontal direction (or a direction more conducive to entering the air vent), avoiding direct impact and allowing the airflow to enter the air vent array below more smoothly. By reducing airflow separation and eddies, more cold air can be effectively captured and sent into the air vent, instead of escaping to other areas or forming ineffective local circulation.

[0040] The liquid cooling plate 421 is also fixedly connected to the cold end fins 433 by fasteners, which enhances the structural rigidity of the entire liquid cooling module and ensures that the connection of each component is stable under the vibration environment of vehicle driving.

[0041] The liquid cooling module 4 also includes heat insulation cotton 44, which has a second placement hole 441 for placing a semiconductor chip. The heat insulation cotton 44 wraps around the semiconductor chip 41 to prevent heat back transfer between the hot end and the cold end, reduce cooling loss, and improve cooling efficiency.

[0042] like Figure 6-7As shown, the liquid-cooled refrigeration module 4 also includes an air guide shroud 45, which guides and constrains airflow, directing it along a designed path through the cold-end fins to achieve efficient heat exchange. One side of the air guide shroud 45 has a first placement groove 451 for placing insulation cotton 44 and a first placement hole 452 for placing the cold-end fins 433. The first placement hole 452 has fixing parts 4521 on both sides for fixing the cold-end fins 433. The other side of the air guide shroud 45 has a second placement groove 453 for placing the cold-end fan 432. The vertical arrangement of the second placement groove 453 and the first placement hole 452 allows airflow to directly reach the cold-end fins from the cold-end fan, minimizing the airflow path and resistance, further improving heat exchange efficiency. Furthermore, the precise matching of the second placement groove with the cold-end fan ensures stable fan installation and reduces vibration and noise during operation.

[0043] like Figure 2 As shown, the inner liner 3 is provided with an air vent 31 and an air guide hole 32 on its side wall. The air guide hole 32 corresponds to the position of the cold end fan 432. The cold end fan 432 is used to draw in the air inside the inner liner 3 through the air guide hole 32 and blow it toward the cold end fins 433.

[0044] The air vents 31 are arranged in an array and are located at the lower end of the cold end fins 433. The cold end fins 433 are configured to send the cooled air back into the inner liner 3.

[0045] like Figure 8 As shown, the outer side of the vehicle refrigerator door 2 is provided with an arc-shaped structure 21 adapted to the arm support posture of the driver and passenger. The radius of curvature of the arc-shaped structure 21 matches the natural curvature of the driver's and passenger's arms. Furthermore, the width and height of the support surface are ergonomically designed to provide comfortable elbow support for the driver and passenger. The arc-shaped structure is integrally formed with the door, and its structural strength meets the load requirements of the axle rest. The vehicle refrigerator is placed in the armrest storage area between the driver's seat and the passenger seat. The overall dimensions of the vehicle refrigerator are adapted to the spatial contour of this area. It is fixedly connected to the vehicle body or seat frame through preset installation interfaces (such as clips and bolt holes), replacing the traditional armrest storage structure. While achieving the refrigeration function, it also serves as a storage and support function of the armrest storage. This integrated design makes full use of the unused space between the driver's seat and the passenger seat, without taking up additional vehicle space. It replaces the traditional armrest box to achieve functional reuse and reduces the cost of vehicle interior components. The pre-set installation interface adopts a standardized design, which is compatible with the installation requirements of most mainstream models. It is easy to install and disassemble, and the connection is firm. It can effectively resist the inertial load under vehicle acceleration, braking and bumpy road conditions, and ensure installation stability.

[0046] To verify the cooling performance of this invention, a vehicle-mounted refrigerator with dimensions of 150mm × 168mm × 190mm was used for testing. The effective volume of the refrigerator was 4.8L, the cold-end fan operated at 9VDC voltage and a speed of 2100rpm, and the semiconductor chip was a dual-chip design operating at 12VDC voltage. The test was conducted at an ambient temperature of 30℃.

[0047] The testing steps are as follows:

[0048] 1. Power on the semiconductor chip of the car refrigerator (voltage 12VDC).

[0049] 2. Start the cold end fan (9VDC, 2100rpm).

[0050] 3. Cooling water under different operating conditions is introduced, with each operating condition having cooling water at 10℃, 15℃, 20℃, 25℃, 30℃, and 35℃, and combinations thereof with flow rates of 6L / min, 8L / min, and 4L / min;

[0051] 4. Continuously monitor and record the following within 30 minutes: the time it takes for the center temperature of the vehicle refrigerator to drop to 0℃, the time it takes for the center temperature of the vehicle refrigerator to drop to -6℃, the root temperature of the cold end fins when the center temperature of the vehicle refrigerator drops to -6℃, the middle temperature of the liquid cooling plate when the center temperature of the vehicle refrigerator drops to -6℃, the lowest temperature at the center of the vehicle refrigerator, and the time it takes for the center temperature of the vehicle refrigerator to drop to the lowest temperature. The test results for each operating condition are shown in Table 1.

[0052]

[0053] Table 1 clearly shows that at an ambient temperature of 30℃, when the cooling water temperature is 10℃ and the flow rate is 6L / min, the time for the center temperature of the vehicle refrigerator to drop to 0℃ is 5 minutes and 15 seconds, the time for the center temperature of the vehicle refrigerator to drop to -6℃ is 8 minutes and 10 seconds, the root temperature of the cold end fins is -14.7℃ when the center temperature of the vehicle refrigerator drops to -6℃, the middle temperature of the liquid cooling plate is 21.9℃, the lowest temperature that the center temperature of the vehicle refrigerator can drop is -11.93℃, and the time for the center temperature of the vehicle refrigerator to drop to the lowest temperature is 17 minutes and 20 seconds.

[0054] When the cooling water temperature is 10℃ and the flow rate is 8L / min, the time for the center temperature of the vehicle refrigerator to drop to 0℃ is 5 minutes, the time for the center temperature of the vehicle refrigerator to drop to -6℃ is 7 minutes and 15 seconds, the root temperature of the cold end fins is -13.6℃ when the center temperature of the vehicle refrigerator to drop to -6℃, the middle temperature of the liquid cooling plate is 24.35℃, the lowest temperature that the center temperature of the vehicle refrigerator can drop is -9.76℃, and the time for the center temperature of the vehicle refrigerator to drop to the lowest temperature is 10 minutes and 10 seconds.

[0055] When the cooling water temperature is 15℃ and the flow rate is 4L / min, the time for the center temperature of the vehicle refrigerator to drop to 0℃ is 6 minutes, the time for the center temperature of the vehicle refrigerator to drop to -6℃ is 9 minutes and 20 seconds, the root temperature of the cold end fins is -13.3℃ when the center temperature of the vehicle refrigerator to drop to -6℃, the middle temperature of the liquid cooling plate is 25.38℃, the lowest temperature that the center temperature of the vehicle refrigerator can drop is -11.8℃, and the time for the center temperature of the vehicle refrigerator to drop to the lowest temperature is 24 minutes and 35 seconds.

[0056] When the cooling water temperature is 15℃ and the flow rate is 6L / min, the time for the center temperature of the vehicle refrigerator to drop to 0℃ is 5 minutes and 30 seconds, the time for the center temperature of the vehicle refrigerator to drop to -6℃ is 8 minutes and 25 seconds, the root temperature of the cold end fins is -13.6℃ when the center temperature of the vehicle refrigerator drops to -6℃, the middle temperature of the liquid cooling plate is 24.37℃, the lowest temperature that the center temperature of the vehicle refrigerator can drop is -11.54℃, and the time for the center temperature of the vehicle refrigerator to drop to the lowest temperature is 21 minutes and 45 seconds.

[0057] When the cooling water temperature is 15℃ and the flow rate is 8L / min, the time for the center temperature of the vehicle refrigerator to drop to 0℃ is 5 minutes and 25 seconds, the time for the center temperature of the vehicle refrigerator to drop to -6℃ is 8 minutes, the root temperature of the cold end fins when the center temperature of the vehicle refrigerator drops to -6℃ is -13.8℃, the middle temperature of the liquid cooling plate when the center temperature of the vehicle refrigerator drops to -6℃ is 24.39℃, the lowest temperature that the center temperature of the vehicle refrigerator can drop is -12.11℃, and the time for the center temperature of the vehicle refrigerator to drop to the lowest temperature is 25 minutes and 45 seconds.

[0058] When the cooling water temperature is 20℃ and the flow rate is 6L / min, the time for the center temperature of the vehicle refrigerator to drop to 0℃ is 6 minutes and 20 seconds, the time for the center temperature of the vehicle refrigerator to drop to -6℃ is 11 minutes and 10 seconds, the root temperature of the cold end fins is -13.3℃ when the center temperature of the vehicle refrigerator to drop to -6℃, the middle temperature of the liquid cooling plate is 28.06℃, the lowest temperature that the center temperature of the vehicle refrigerator can drop is -8.65℃, and the time for the center temperature of the vehicle refrigerator to drop to the lowest temperature is 19 minutes and 45 seconds.

[0059] When the cooling water temperature is 25℃ and the flow rate is 4L / min, the time for the center temperature of the vehicle refrigerator to drop to 0℃ is 6 minutes and 20 seconds, and the lowest temperature at the center of the vehicle refrigerator can be reduced to -5.5℃.

[0060] When the cooling water temperature is 25℃ and the flow rate is 6L / min, the time for the center temperature of the vehicle refrigerator to drop to 0℃ is 7 minutes, the time for the center temperature of the vehicle refrigerator to drop to -6℃ is 22 minutes and 55 seconds, and the lowest temperature at the center of the vehicle refrigerator can be dropped to -6.1℃.

[0061] When the cooling water temperature is 25℃ and the flow rate is 8L / min, the time for the center temperature of the vehicle refrigerator to drop to 0℃ is 6 minutes and 45 seconds, the time for the center temperature of the vehicle refrigerator to drop to -6℃ is 17 minutes and 45 seconds, and the lowest temperature at the center of the vehicle refrigerator can be dropped to -6.6℃.

[0062] When the cooling water temperature is 30℃ and the flow rate is 4L / min, the time it takes for the center temperature of the vehicle refrigerator to drop to 0℃ is 9 minutes and 30 seconds, and the lowest temperature at the center of the vehicle refrigerator can be reduced to -3.4℃.

[0063] When the cooling water temperature is 30℃ and the flow rate is 6L / min, the time it takes for the center temperature of the vehicle refrigerator to drop to 0℃ is 9 minutes and 40 seconds, and the lowest temperature at the center of the vehicle refrigerator can be reduced to -4.2℃.

[0064] When the cooling water temperature is 30℃ and the flow rate is 8L / min, the time for the center temperature of the vehicle refrigerator to drop to 0℃ is 8 minutes and 50 seconds, and the lowest temperature at the center of the vehicle refrigerator can be reduced to -4.3℃.

[0065] When the cooling water temperature is 35℃ and the flow rate is 4L / min, the time for the center temperature of the vehicle refrigerator to drop to 0℃ is 9 minutes and 30 seconds, and the lowest temperature at the center of the vehicle refrigerator can be reduced to -0.5℃.

[0066] When the cooling water temperature is 35℃ and the flow rate is 6L / min, the time it takes for the center temperature of the vehicle refrigerator to drop to 0℃ is 10.15 minutes and 55 seconds, and the lowest temperature at the center of the vehicle refrigerator can be reduced to -1.6℃.

[0067] When the cooling water temperature is 35℃ and the flow rate is 8L / min, the time for the center temperature of the vehicle refrigerator to drop to 0℃ is 12 minutes and 20 seconds, and the lowest temperature at the center of the vehicle refrigerator can be reduced to -2.4℃.

[0068] As can be seen from the above, the cooling effect of the vehicle refrigerator in this invention is greatly affected by heat dissipation conditions such as water temperature and water flow. Overall, it performs well when the heat dissipation conditions are good, and its performance degrades significantly when the heat dissipation conditions are poor. When the cooling water temperature is between 10℃ and 20℃ and the water flow is matched (6-8L / min), the cooling effect is good. When the cooling water temperature is ≥25℃, the cooling performance degrades significantly. That is, when the cooling water temperature is low and the water flow is appropriate, the vehicle refrigerator of this invention can achieve a good refrigeration / light freezing effect.

[0069] Although preferred embodiments of this application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this application.

Claims

1. A liquid-cooled semiconductor on-board refrigerator characterized by comprising: The vehicle-mounted refrigerator comprises a vehicle-mounted refrigerator body and a vehicle-mounted refrigerator door body, one side of the vehicle-mounted refrigerator door body is rotatably connected with the corresponding side of the vehicle-mounted refrigerator body through a hinge; an inner container is arranged in the vehicle-mounted refrigerator body; an installation cavity is arranged between the vehicle-mounted refrigerator body and the inner container; a liquid cooling refrigeration module is arranged in the installation cavity; the liquid cooling refrigeration module comprises a semiconductor chip, a hot end assembly and a cold end assembly; the hot end assembly is arranged on the hot end side of the semiconductor chip; and the cold end assembly is arranged on the cold end side of the semiconductor chip.

2. The liquid-cooled semiconductor on-board refrigerator according to claim 1, characterized in that, The hot end assembly comprises a liquid cooling plate and a hot end NTC; the liquid cooling plate is internally provided with a liquid cooling flow channel and a flow channel guide plate; the flow channel guide plate is fixedly connected with the inner wall of the liquid cooling flow channel through welding; the liquid cooling plate is provided with an inlet pipe and an outlet pipe which are in communication with the liquid cooling flow channel; the inlet pipe is used for connecting the vehicle cooling liquid system; the cooling liquid flows through the liquid cooling flow channel under the action of pressure difference and flows out from the outlet pipe; the hot end NTC is installed on the inner side of the liquid cooling plate and close to the side of the semiconductor chip; the signal line of the hot end NTC is led out through a wire harness and connected to a control unit for feeding back the temperature signal of the cooling liquid in the outlet pipe to the control unit.

3. The liquid-cooled semiconductor on-board refrigerator according to claim 2, characterized in that, The liquid cooling plate comprises a base plate and a cover plate; the liquid cooling flow channel is formed on the base plate through a stamping process; and the cover plate is sealingly connected with the base plate and the flow channel guide plate through a welding process to cover the liquid cooling flow channel and form a cooling channel.

4. The liquid-cooled semiconductor on-board refrigerator according to claim 1, characterized in that, The cold end assembly comprises a cold end NTC, a cold end fan and a cold end fin; the cold end fan is located above or below the cold end fin; the cold end NTC is fixed on the cold end fin through a fastener and close to the side of the semiconductor chip.

5. The liquid-cooled semiconductor on-board refrigerator according to claim 4, characterized in that, The lower end of the cold end fin is provided with an inclined surface.

6. The liquid-cooled semiconductor on-board refrigerator according to claim 4, characterized in that, The liquid cooling refrigeration module further comprises heat insulation cotton; the heat insulation cotton is internally provided with a second placing hole for placing the semiconductor chip; and the heat insulation cotton is wrapped around the semiconductor chip.

7. The liquid-cooled semiconductor on-board refrigerator according to claim 6, characterized in that, The liquid cooling refrigeration module further comprises a wind guide cover; one side of the wind guide cover is provided with a first placing groove for placing the heat insulation cotton and a first placing hole for placing the cold end fin; both sides of the first placing hole are provided with fixing portions for fixing the cold end fin; the other side of the wind guide cover is provided with a second placing groove for placing the cold end fan; and the second placing groove is arranged above and below the first placing hole.

8. The liquid-cooled semiconductor on-board refrigerator according to claim 4, characterized in that, A wind port and a wind guide hole are arranged on the side wall of the inner container; the wind guide hole corresponds to the position of the cold end fan; and the cold end fan is used for sucking the air in the inner container into the wind guide hole and blowing it to the cold end fin. The wind port is located at the position corresponding to the lower end of the cold end fin; and the cold end fin is configured to send the cooled cold air back to the inner container.

9. The liquid-cooled semiconductor on-board refrigerator according to claim 1, characterized in that, An arc-shaped structure which matches the arm supporting posture of the driver and the passenger is arranged on the outer side of the vehicle-mounted refrigerator door body; the curvature radius of the arc-shaped structure matches the fitting arc when the arm of the driver and the passenger is naturally placed.

10. The liquid-cooled semiconductor on-board refrigerator according to claim 1, characterized in that, The vehicle-mounted refrigerator is placed in the handrest box installation area between the driver seat and the front passenger seat; the overall size of the vehicle-mounted refrigerator matches the space contour of the area; and the vehicle-mounted refrigerator is fixedly connected with the vehicle body or the seat framework through a pre-set installation interface.

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