Driving device, injection molding method of conductive assembly of driving device and camera module

Abstract

The invention discloses a driving device, an injection molding method of a conductive assembly of the driving device and a camera module. The driving device comprises a base, an anti-shake frame, a focusing carrier and at least three coils. The base comprises a base side wall, and a first conductive assembly is arranged in the base side wall. The base comprises a base side wall, and a first conductive assembly is arranged in the base side wall; the anti-shake frame is movably accommodated in the base; the focusing carrier is movably accommodated in the anti-shake frame, the focusing carrier is used for bearing an optical lens, and the optical lens defines an optical axis and an optical axis direction; at least two coils in the at least three coils are arranged on the side wall of the base, and the at least two coils are electrically connected with the first conductive assembly.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of camera modules, and more particularly, to a driving device, a method of injection molding of a conductive assembly of the driving device, and a camera module. BACKGROUND

[0002] With the continuous progress of technology, the functions of camera modules are becoming more and more diversified, such as optical image stabilization, optical focusing, optical zoom, etc. Optical image stabilization counteracts the shaking of the camera module by compensating for the movement of the optical lens or the image sensor, thereby making the image clearer. Optical focusing adjusts the distance between the image sensor and the optical lens through the optical lens or the image sensor, thereby making the imaging clear. Optical zoom changes the overall focal length of the lens by moving the lens inside the optical lens, adjusting the field of view of the imaging.

[0003] Correspondingly, when implementing optical image stabilization, optical focusing, and optical zoom, a driving assembly is needed to drive part of the components of the camera module, such as the optical lens or the image sensor. When the camera module has both optical image stabilization and optical focusing functions, different carriers and different driving assemblies need to be configured. In some current driving schemes, driving can be achieved through a coil and a magnet, and displacement measurement can also be achieved through a position sensing element.

[0004] Notably, in the driving scheme that achieves driving through a coil and a magnet, it is necessary to ensure that the coil and the position sensing element can be electrically connected. At present, the electrical connection of the coil and the position sensing element is mainly achieved through a flexible circuit board. However, the scheme of achieving the electrical connection of the coil and the position sensing element through the flexible circuit board has problems such as high cost, complicated assembly, and the influence of the reaction force of the flexible circuit board on the driving effect. SUMMARY

[0005] The main advantage of the present application is to provide a driving device, a method of injection molding of a conductive assembly of the driving device, and a camera module, wherein at least part of the conductive assembly of the driving device is embedded in the anti-shake frame and / or the base, which can protect the conductive assembly and avoid the conductive assembly being broken or short-circuited due to the movement of the anti-shake frame.

[0006] Another advantage of the present application is to provide a driving device, a method of injection molding of a conductive assembly of the driving device, and a camera module, wherein thanks to the fact that at least part of the conductive assembly of the driving device is embedded in the anti-shake frame and the base, the strength of the anti-shake frame and the base is improved.

[0007] Yet another advantage of the present application is to provide a driving device, an injection molding method of a conductive assembly of the driving device, and a camera module, wherein at least part of the conductive assembly of the driving device is embedded in the anti-shake frame and the base, and the embedded part of the conductive assembly in the anti-shake frame and the base does not occupy extra space beyond the anti-shake frame and the base, so that the overall size of the driving device can be reduced to a certain extent.

[0008] Yet another advantage of the present application is to provide a driving device, an injection molding method of a conductive assembly of the driving device, and a camera module, wherein the arrangement position and extension direction of each part of the conductive assembly of the driving device are designed to facilitate the electrical conduction from the inside to the outside of the driving assembly.

[0009] Yet another advantage of the present application is to provide a driving device, an injection molding method of a conductive assembly of the driving device, and a camera module, wherein the injection molding method for the conductive assembly of the driving device adopts a secondary injection molding method to form the anti-shake frame, so that the bending or deformation of the conductive assembly caused by a large impact force during the injection molding process can be avoided as much as possible, or problems such as position offset of the coil and the position sensing element can be avoided.

[0010] According to an aspect of the present application, a driving device is provided, comprising:

[0011] a base comprising a base side wall, wherein a first conductive assembly is arranged in the base side wall;

[0012] an anti-shake frame movably accommodated in the base;

[0013] a focusing carrier movably accommodated in the anti-shake frame, the focusing carrier being used to carry an optical lens, the optical lens defining an optical axis and an optical axis direction;

[0014] at least three coils, at least two of the at least three coils being arranged in the base side wall, and the at least two coils being electrically connected with the first conductive assembly.

[0015] In an embodiment of the driving device according to the present application, the first conductive assembly is bent and extended in the base side wall, and a part of the first conductive assembly is exposed to the outside of the base side wall to form a conductive pin to realize the conduction with an external circuit.

[0016] In an embodiment of the driving device according to the present application, the at least three coils include a focusing coil, a first anti-shake coil and a second anti-shake coil, the base side walls include a first base side wall, a second base side wall, a third base side wall and a fourth base side wall, wherein the first anti-shake coil is arranged on the first base side wall, the second anti-shake coil is arranged on the second base side wall, and the first anti-shake coil and the second anti-shake coil are electrically connected to the first conductive component.

[0017] In an embodiment of the driving device according to the present application, the focusing coil is arranged on the third base side wall, located at the adjacent side of the first anti-shake coil and the second anti-shake coil, and the focusing coil is electrically connected to the first conductive component.

[0018] In an embodiment of the driving device according to the present application, the anti-shake frame includes four frame side walls, a second conductive component is arranged in the four frame side walls, the second conductive component is bent and extends in the frame side walls, and the focusing coil is arranged on the four frame side walls and electrically connected to the second conductive component.

[0019] In an embodiment of the driving device according to the present application, an external conductive component is further included, the external conductive component is located between the base side walls and the frame side walls, and the external conductive component is electrically connected between the first conductive component and the second conductive component.

[0020] In an embodiment of the driving device according to the present application, a focusing position sensing element is further included, the focusing position sensing element is arranged on the same side as the focusing coil; the second conductive component includes at least four focusing sensing branches and at least two focusing coil branches, the at least two focusing coil branches are electrically connected to the focusing coil, and the at least four focusing sensing branches are electrically connected to the focusing position sensing element and the external conductive component.

[0021] In an embodiment of the driving device according to the present application, the anti-shake frame includes four frame corners located between the four frame side walls, the external conductive component includes four conductive springs, the four conductive springs are respectively arranged on the four frame corners, and the at least four focusing sensing branches are bent and extended in the horizontal direction and in the height direction in the frame side walls, so that the at least four focusing sensing branches are respectively electrically connected to the four conductive springs.

[0022] According to another aspect of the present application, a camera module is further provided, which includes the driving device, an optical lens and a photosensitive component as described above, wherein the optical lens is arranged on the photosensitive path of the photosensitive component.

[0023] According to yet another aspect of the present application, there is also provided a method of injection molding a conductive assembly for a drive device, comprising the steps of:

[0024] S110, forming a conductive assembly continuous strip, wherein the conductive assembly continuous strip comprises a plurality of coil branches and a plurality of sensing branches, and a plurality of connecting portions connected between the coil branches and the sensing branches;

[0025] S120, first injection molding around the plurality of coil branches and the plurality of sensing branches to form a first injection molded portion;

[0026] S130, mounting a coil and a position sensing element to the first injection molded portion, wherein the coil and the position sensing element are electrically connected to the coil branches and the sensing branches, respectively; and,

[0027] S140, second injection molding around the first injection molded portion to form a second injection molded portion, wherein the second injection molded portion covers the first injection molded portion.

[0028] Further objects and advantages of the present application will be more readily apparent from the following description of the preferred embodiments, when taken in conjunction with the accompanying drawings.

[0029] These and other objects, features and advantages of the present application will become apparent from the following detailed description of the application, when taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0030] The above and other objects, features and advantages of the present application will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings in which:

[0031] Figure 1 FIG. 1 illustrates a perspective view schematic diagram of a drive device according to an embodiment of the present application.

[0032] Figure 2 FIG. 2 illustrates an exploded view schematic diagram of a drive device according to an embodiment of the present application.

[0033] Figure 3 FIG. 3 illustrates a partial perspective view schematic diagram of a drive device according to an embodiment of the present application.

[0034] Figure 4 FIG. 4 illustrates another partial perspective view schematic diagram of a drive device according to an embodiment of the present application.

[0035] Figure 5Fig. 7 illustrates one of the partial perspective view schematic diagrams of the driving device according to the embodiment of the present application.

[0036] Figure 6 Fig. 8 illustrates another of the partial perspective view schematic diagrams of the driving device according to the embodiment of the present application.

[0037] Figure 7 Fig. 9 illustrates yet another of the partial perspective view schematic diagrams of the driving device according to the embodiment of the present application.

[0038] Figure 8 Fig. 10 illustrates still another of the partial perspective view schematic diagrams of the driving device according to the embodiment of the present application.

[0039] Figure 9 Fig. 11 illustrates a flowchart schematic diagram of the injection molding method of the conductive assembly according to the embodiment of the present application.

[0040] Figure 10 Fig. 12 illustrates a block schematic diagram of the camera module according to the embodiment of the present application.

[0041] In the figure: 1, camera module; 100, driving device; 200, optical lens; 300, photosensitive component; 10, outer shell; 11, base; 1101, base through hole; 111, bottom wall; 112, base side wall; 1121, first base side wall; 1102, first base groove; 1122, second base side wall; 1103, second base groove; 1123, third base side wall; 1124, fourth base side wall; 12, top cover; 1201, top cover through hole; 121, top wall; 122, top cover side wall; 20, focusing carrier; 201, carrier through hole; 21, first carrier side wall; 22, second carrier side wall; 23, third carrier side wall; 231, first carrier groove 231; 24, fourth carrier side wall; 30, anti-shake frame; 301, frame through hole; 31, first frame side wall; 32, second frame side wall; 33, third frame side wall; 34, fourth frame side wall; 341, first frame corner; 342, second frame corner; 343, third frame corner; 344, fourth frame corner; 40, focusing driving component; 410, focusing power supply part; 41, focusing coil; 411, focusing coil through hole 411; 42, focusing position sensing element; 43, focusing magnet; 50, anti-shake driving component; 510, first anti-shake power supply part; 51, first anti-shake driving component; 511, first anti-shake coil; 5111, first anti-shake coil through hole; 512, first anti-shake position sensing element; 513, first anti-shake magnet; 520, second anti-shake power supply part; 52, second anti-shake driving component; 521, second anti-shake coil; 5211, second anti-shake coil through hole; 522, second anti-shake position sensing element; 523, second anti-shake magnet; 540, magnetic yoke; 541, first magnetic yoke; 542, second magnetic yoke; 543, third magnetic yoke; 550, magnetic attraction piece; 60, conductive component; 6010, first conductive component; 601, conductive pin; 6011, focusing pin; 60111, first focusing pin; 60112, second focusing pin; 60113, third focusing pin; 60114, fourth focusing pin; 6012, anti-shake pin; 60121, one-way anti-shake coil pin; 60122, one-way anti-shake sensing pin; 60123, two-way anti-shake coil pin; 60123, two-way anti-shake sensing pin; 6020, second conductive component; 61, focusing conductive part; 611, first focusing coil branch; 612, second focusing coil branch; 613, first focusing sensing branch; 614, second focusing sensing branch; 615, third focusing sensing branch; 616, fourth focusing sensing branch; 610, focusing coil branch; 620, focusing sensing branch; 604, first focusing conductive end; 605, second focusing conductive end; 606, focusing sensing wire part; 62, anti-shake conductive part; 621, one-way anti-shake coil branch; 622, two-way anti-shake coil branch; 623, one-way anti-shake sensing branch; 624, two-way anti-shake sensing branch;63, external conductive assembly; 607, inner connecting end; 608, outer connecting end; 609, bending part; 631, first conductive spring; 632, second conductive spring; 633, third conductive spring; 634, fourth conductive spring; 64, conductive guiding part; 6401, first guiding end; 6402, second guiding end; 6403, extension part; 641, first conductive guiding part; 642, second conductive guiding part; 643, third conductive guiding part; 644, fourth conductive guiding part; 70, first supporting assembly; 71, guide rod; 80, second supporting assembly; 81, ball; 90, supporting piece; 560, damping piece; Z, optical axis direction; X, first direction; Y, second direction. DETAILED DESCRIPTION

[0042] Hereinafter, example embodiments according to the present application will be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are only a part but not all of the embodiments of the present application. It should be understood that the present application is not limited to the described embodiments.

[0043] In some current driving schemes, driving can be achieved by coils and magnets, and displacement measurement can also be achieved by position sensing elements, for example, a focusing carrier is driven by a focusing coil and a focusing magnet, a shake reduction frame is driven by a shake reduction coil and a shake reduction magnet, displacement of the focusing carrier is measured by a focusing position sensing element, and displacement of the shake reduction frame is measured by a shake reduction position sensing element.

[0044] It is worth noting that in the driving scheme in which driving is achieved by coils and magnets, it is necessary to ensure that the coils and the position sensing elements can be electrically connected. In theory, an electrical connection structure can be arranged between the focusing carrier and the shake reduction frame, and / or between the shake reduction frame and the base, however, the focusing carrier moves during optical focusing, and the shake reduction frame moves during optical shake reduction, making it difficult for the coils and the position sensing elements to be electrically connected with other components. Specifically, when arranging the electrical connection structure, not only the space limitation inside the driving device needs to be considered, but also the problem of short circuit during movement of the focusing carrier and the shake reduction frame needs to be avoided.

[0045] In one embodiment of the present application, the electrical conduction of the coil and the position sensing element is realized by a flexible circuit board. Specifically, in the scheme of realizing the electrical conduction of the coil and the position sensing element by the flexible circuit board, a focusing flexible circuit board can be arranged on the anti-shake frame, and the focusing coil and the focusing position sensing element are mounted on the focusing flexible circuit board; an anti-shake flexible circuit board is arranged on the base, and the anti-shake coil and the anti-shake position sensing element are mounted on the anti-shake flexible circuit board. The anti-shake flexible circuit board and the focusing flexible circuit board can be electrically connected to each other through an electrical connection structure and electrically connected to the electronic devices outside the driving device; or the anti-shake flexible circuit board and the focusing flexible circuit board are respectively electrically connected to the electronic devices outside the driving device.

[0046] In another embodiment of the present application, at least part of the structure of the conductive assembly can be embedded in the anti-shake frame and / or the base, which can protect the conductive assembly, avoid the conductive assembly being broken or short-circuited due to the movement of the anti-shake frame, and reduce the overall assembly complexity of the driving device; the arrangement position and the extension direction of each part of the conductive assembly of the driving device can be designed, so that the conductive assembly is easily electrically connected from the inside to the outside of the driving assembly.

[0047] Based on this, the present application provides a driving device, which comprises a base, an anti-shake frame, a focusing carrier and at least three coils. The base comprises a base side wall, and a first conductive assembly is arranged in the base side wall. The base comprises a base side wall, and a first conductive assembly is arranged in the base side wall; the anti-shake frame is movably accommodated in the base; the focusing carrier is movably accommodated in the anti-shake frame, and the focusing carrier is used for carrying an optical lens, the optical lens defines an optical axis and an optical axis direction; at least two coils of the at least three coils are arranged on the base side wall, and the at least two coils are electrically connected with the first conductive assembly.

[0048] After introducing the basic principle of the present application, the various non-limiting embodiments of the present application will be specifically introduced with reference to the accompanying drawings.

[0049] Schematic driving device

[0050] As Figures 1 to 8 shown, the driving device 100 according to the embodiment of the present application is illustrated. The driving device 100 optimizes the overall electrical conduction performance and structural stability of the conductive assembly 60 through the design of the conductive assembly 60, and improves the space utilization.

[0051] Specifically, as Figure 1 and Figure 2As shown, the driving device 100 comprises an outer housing 10, a focusing carrier 20, an anti-shake frame 30, a focusing driving assembly 40, an anti-shake driving assembly 50 and a conductive assembly 60. The focusing carrier 20 is movably accommodated in the anti-shake frame 30 and is configured to mount an optical lens 200 therein. The anti-shake frame 30 is movably accommodated in the outer housing 10. In the present application, the optical lens 200 defines an optical axis and an optical axis direction Z. The optical axis direction Z of the optical lens 200 refers to the direction in which the optical lens 200 conducts light. The height direction of the driving device 100 is consistent with the optical axis direction Z. The focusing driving assembly 40 is configured to drive the focusing carrier 20 to move relative to the anti-shake frame 30 along the optical axis direction Z to achieve an optical focusing function. The anti-shake driving assembly 50 is configured to drive the anti-shake frame 30 to move along a first direction X and a second direction Y and drive the focusing carrier 20 to move along the first direction X and the second direction Y, wherein the first direction X and the second direction Y are perpendicular to the optical axis direction Z, and the first direction X and the second direction Y are perpendicular to each other to achieve an optical anti-shake function. The conductive assembly 60 is conductively connected to the focusing driving assembly 40 and the anti-shake driving assembly 50, and the conductive assembly 60 is at least partially embedded in the anti-shake frame 30 and / or the outer housing 10.

[0052] In the embodiments of the present application, the outer housing 10 comprises a base 11 and a top cover 12. The top cover 12 covers the base 11. The base 11 has a base through hole 1101 which penetrates the base 11 in the optical axis direction Z. The inner diameter of the base through hole 1101 is greater than or equal to the outer diameter of the optical lens 200. The base 11 comprises a bottom wall 111 and a base side wall 112. The base side wall 112 extends upward from the bottom wall 111 and forms an accommodation cavity together with the bottom wall 111. The base 11 comprises four base side walls 112, including a first base side wall 1121, a second base side wall 1122, a third base side wall 1123 and a fourth base side wall 1124. The first base side wall 1121 and the third base side wall 1123 are opposite in the first direction X. The second base side wall 1122 and the fourth base side wall 1124 are opposite in the second direction Y.

[0053] The top cover 12 has a top cover through hole 1201 which penetrates the top cover 12 in the optical axis direction Z. The inner diameter of the top cover through hole 1201 is greater than or equal to the outer diameter of the optical lens 200 and corresponds to the base through hole 1101 in the optical axis direction Z. The top cover 12 comprises a top wall 121 and a top cover side wall 122. The top cover side wall 122 extends downward from the top wall 121.

[0054] The anti-shake frame 30 is movably housed within the base 11 of the outer housing 10. The anti-shake frame 30 has a frame through-hole 301 that penetrates the anti-shake frame 30 in the optical axis direction Z. The inner diameter of the frame through-hole 301 is greater than or equal to the outer diameter of the optical lens 200 and corresponds to the base through-hole 1101 in the optical axis direction Z. The anti-shake frame 30 includes four frame side walls, including a first frame side wall 31, a second frame side wall 32, a third frame side wall 33, and a fourth frame side wall 34. The first frame side wall 31 and the third frame side wall 33 are opposite in the first direction X, and the second frame side wall 32 and the fourth frame side wall 34 are opposite in the second direction Y. Adjacent frame side walls of the anti-shake frame 30 form frame corners, and the anti-shake frame 30 includes four frame corners between the four frame side walls, as shown in Figure 2 and Figure 3 The first frame corner 341 is formed at the intersection of the first frame side wall 31 and the second frame side wall 32; the second frame corner 342 is formed at the intersection of the second frame side wall 32 and the third frame side wall 33; the third frame corner 343 is formed at the intersection of the third frame side wall 33 and the fourth frame side wall 34; and the fourth frame corner 344 is formed at the intersection of the fourth frame side wall 34 and the first frame side wall 31.

[0055] The focus carrier 20 has a carrier through-hole 201 that penetrates the focus carrier 20 in the optical axis direction Z. The carrier through-hole 201 is adapted to mount the optical lens 200. The inner diameter of the carrier through-hole 201 is greater than or equal to the outer diameter of the optical lens 200 and corresponds to the base through-hole 1101 in the optical axis direction Z. The focus carrier 20 includes a first carrier side wall 21, a second carrier side wall 22, a third carrier side wall 23, and a fourth carrier side wall 24. The first carrier side wall 21 and the third carrier side wall 23 are opposite in the first direction X, and the second carrier side wall 22 and the fourth carrier side wall 24 are opposite in the second direction Y.

[0056] The first base side wall 1121, the first frame side wall 31 and the first carrier side wall 21 are located on the same side of the driving device 100 and are opposite in the first direction X; the second base side wall 1122, the second frame side wall 32 and the second carrier side wall 22 are located on the same side of the driving device 100 and are opposite in the second direction Y; the third base side wall 1123, the third frame side wall 33 and the third carrier side wall 23 are located on the same side of the driving device 100 and are opposite in the first direction X; the fourth base side wall 1124, the fourth frame side wall 34 and the fourth carrier side wall 24 are located on the same side of the driving device 100 and are opposite in the second direction Y.

[0057] The focus driving assembly 40 comprises a focus coil 41, a focus magnet 43 and a focus position sensing element 42. The focus coil 41 and the focus position sensing element 42 form a focus energization part 410 of the focus driving assembly 40; the focus coil 41 and the focus position sensing element 42 need to be electrically energized when the focus driving assembly 40 drives the focus carrier 20 to move.

[0058] The focus coil 41 and the focus magnet 43 are arranged in a transverse direction, which can reduce the height dimension of the driving device 100 to some extent compared with the case that the focus coil 41 and the focus magnet 43 are arranged in the optical axis direction Z. The transverse direction refers to a direction perpendicular to the optical axis direction Z. In the present application, the transverse direction is consistent with the horizontal direction.

[0059] Specifically, in an embodiment of the present application, the focus energization part 410 is arranged on the anti-vibration frame 30. The focus coil 41 and the focus magnet 43 are opposite in the first direction X, wherein the focus coil 41 is mounted on the anti-vibration frame 30, and the focus magnet 43 is mounted on the focus carrier 20.

[0060] More specifically, the focus coil 41 is mounted on the third frame side wall 33 of the anti-vibration frame 30, and the focus magnet 43 is mounted on the third carrier side wall 23 of the focus carrier 20.

[0061] A first frame groove can be formed on the third frame side wall 33, and the focus coil 41 is mounted in the first frame groove to reduce the transverse dimension of the driving device 100. A first carrier groove 231 can be formed on the third carrier side wall 23, and the focus magnet 43 is mounted in the first carrier groove 231 to reduce the transverse dimension of the driving device 100.

[0062] The focusing coil 41 has a focusing coil through hole 411. The focusing position sensing element 42 is opposite to the focusing magnet 43. The focusing position sensing element 42 is disposed on the same side of the focusing coil through hole 411. The focusing position sensing element 42 can be disposed in the focusing coil through hole 411. The focusing position sensing element 42 is used to detect the displacement of the focusing carrier 20. Specifically, the focusing position sensing element 42 detects the displacement of the focusing carrier 20 by sensing the magnetic field strength of the focusing magnet 43. In another embodiment of the present application, the focusing position sensing element 42 can also be located outside the focusing coil through hole 411, and the focusing position sensing element 42 is used to detect the displacement of the focusing carrier 20.

[0063] In an embodiment of the present application, the focusing position sensing element 42 is disposed on the anti-shake frame 30. When the focusing carrier 20 moves relative to the anti-shake frame 30, the relative position of the focusing position sensing element 42 and the focusing magnet 43 changes accordingly. The strength of the magnetic field of the focusing magnet 43 sensed by the focusing position sensing element 42 changes, and the position of the focusing carrier 20 can be determined. The focusing carrier 20 can be moved to the desired position by adjusting the current of the focusing coil 41. The focusing position sensing element 42 can be a Hall sensor (HS) or an integrated circuit (IC) element. The integrated circuit element is a separate integrated circuit element or an integrated circuit element containing a Hall sensor.

[0064] The focusing drive assembly 40 can also include capacitors, resistors, inductors, diodes, triodes, potentiometers, relays, and other electronic elements and electronic devices. The capacitors, resistors, inductors, diodes, triodes, potentiometers, relays, and other electronic elements and electronic devices can be disposed in the focusing coil through hole 411 of the focusing coil 41, or they can also be disposed outside the focusing coil through hole 411 of the focusing coil 41.

[0065] In a variant embodiment of the present application, the focusing coil 41 and the focusing magnet 43 are opposite in the first direction X, wherein the focusing coil 41 is mounted on the base 11, and the focusing magnet 43 is mounted on the focusing carrier 20; the focusing position sensing element 42 is disposed on the same side of the focusing coil through hole 411, and the focusing position sensing element 42 is disposed on the base 11. Specifically, the focusing coil 41 is mounted on the third base side wall 1123 of the base 11; the focusing magnet 43 is mounted on the third carrier side wall 23 of the focusing carrier 20; and the focusing position sensing element 42 is disposed on the third base side wall 1123.

[0066] A groove can be formed in the third base sidewall 1123, and the focusing coil 41 can be installed in the groove of the third base sidewall 1123 to reduce the lateral dimension of the driving device 100. A first carrier groove 231 can be formed in the third carrier sidewall 23, and the focusing magnet 43 can be installed in the first carrier groove 231 to reduce the lateral dimension of the driving device 100.

[0067] The anti-shake driving assembly 50 includes a first anti-shake driving assembly 51 and a second anti-shake driving assembly 52. The first anti-shake driving assembly 51 is configured to drive the anti-shake frame 30 to move along the first direction X and drive the focusing carrier 20 to move along the first direction X to perform anti-shake in the first direction X. The second anti-shake driving assembly 52 is configured to drive the anti-shake frame 30 to move along the second direction Y and drive the focusing carrier 20 to move along the second direction Y to perform anti-shake in the second direction Y.

[0068] The first anti-shake driving assembly 51 includes a first anti-shake coil 511, a first anti-shake magnet 513, and a first anti-shake position sensing element 512. The first anti-shake coil 511 and the first anti-shake position sensing element 512 form a first anti-shake energizing part 510 of the first anti-shake driving assembly 51; the first anti-shake coil 511 and the first anti-shake position sensing element 512 need to be electrically energized when the first anti-shake driving assembly 51 drives the anti-shake frame 30 to move.

[0069] The first anti-shake coil 511 and the first anti-shake magnet 513 are arranged in the lateral direction, which can reduce the height dimension of the driving device 100 to some extent compared with the arrangement of the first anti-shake coil 511 and the first anti-shake magnet 513 in the optical axis direction Z.

[0070] Specifically, in an embodiment of the present application, the first anti-shake energizing part 510 is arranged on the base 11. The first anti-shake coil 511 and the first anti-shake magnet 513 are opposite to each other in the first direction X, wherein the first anti-shake coil 511 is installed on the base 11, and the first anti-shake magnet 513 is installed on the anti-shake frame 30.

[0071] More specifically, the first anti-shake coil 511 is installed on the first base sidewall 1121 of the base 11, and the first anti-shake magnet 513 is installed on the outer surface of the first frame sidewall 31 of the anti-shake frame 30.

[0072] A first base recess 1102 can be formed in the first base sidewall 1121, and the first anti-vibration coil 511 can be installed in the first base recess 1102 to reduce the lateral dimension of the driving device 100. A second frame recess can be formed in the first frame sidewall 31, and the first anti-vibration magnet 513 can be installed in the second frame recess of the anti-vibration frame 30 to reduce the lateral dimension of the driving device 100.

[0073] The first anti-vibration coil 511 has a first anti-vibration coil through hole 5111. The first anti-vibration position sensing element 512 is disposed on the same side as the first anti-vibration coil 511. The first anti-vibration position sensing element 512 can be located in the first anti-vibration coil through hole 5111. The first anti-vibration position sensing element 512 is used to detect the displacement of the anti-vibration frame 30 in the first direction X. Specifically, the first anti-vibration position sensing element 512 detects the displacement of the anti-vibration frame 30 in the first direction X by sensing the magnetic field strength of the first anti-vibration magnet 513. In another embodiment of the present application, the first anti-vibration position sensing element 512 is located outside the first anti-vibration coil through hole 5111, and the first anti-vibration position sensing element 512 is used to detect the displacement of the anti-vibration frame 30 in the first direction X.

[0074] In the embodiment of the present application, the first anti-vibration position sensing element 512 is disposed on the base 11. When the first anti-vibration position sensing element 512 moves relative to the anti-vibration frame 30, the relative position of the first anti-vibration position sensing element 512 and the first anti-vibration magnet 513 changes accordingly, and the strength of the magnetic field of the first anti-vibration magnet 513 sensed by the first anti-vibration position sensing element 512 changes. The position of the anti-vibration frame 30 can be determined, and the anti-vibration frame 30 can be moved to the desired position by adjusting the current of the first anti-vibration coil 511. The first anti-vibration position sensing element 512 can be a Hall sensor (HS) or an integrated circuit (IC) element. The integrated circuit element is a separate integrated circuit element or an integrated circuit element containing a Hall sensor.

[0075] The first anti-vibration driving assembly 51 can further include capacitors, resistors, inductors, diodes, triodes, potentiometers, relays, and other electronic elements and electronic devices. The capacitors, resistors, inductors, diodes, triodes, potentiometers, relays, and other electronic elements and electronic devices can be disposed in the first anti-vibration coil through hole 5111 of the first anti-vibration coil 511, or they can be disposed outside the first anti-vibration coil through hole 5111 of the first anti-vibration coil 511.

[0076] The second anti-shake driving assembly 52 comprises a second anti-shake coil 521, a second anti-shake magnet 523 and a second anti-shake position sensing element 522. The second anti-shake coil 521 and the second anti-shake position sensing element 522 form a second anti-shake energizing part 520 of the second anti-shake driving assembly 52; the second anti-shake coil 521 and the second anti-shake position sensing element 522 need to be electrically energized when the second anti-shake driving assembly 52 drives the anti-shake frame 30 to move. The first anti-shake coil 511 and the second anti-shake coil 521 form an anti-shake coil of the anti-shake driving assembly 50; the first anti-shake magnet 513 and the second anti-shake magnet 523 form an anti-shake magnet of the anti-shake driving assembly 50; the first anti-shake position sensing element 512 and the second anti-shake position sensing element 522 are anti-shake position sensing elements of the anti-shake driving assembly 50. The first anti-shake energizing part 510 and the second anti-shake energizing part 520 form an anti-shake energizing part of the anti-shake driving assembly 50.

[0077] The second anti-shake coil 521 and the second anti-shake magnet 523 are arranged in the transverse direction, which can reduce the height dimension of the driving device 100 to some extent compared with the arrangement of the second anti-shake coil 521 and the second anti-shake magnet 523 in the optical axis direction Z.

[0078] Specifically, in an embodiment of the present application, the second anti-shake energizing part 520 is arranged on the base 11. The second anti-shake coil 521 and the second anti-shake magnet 523 are opposite in the second direction Y, wherein the second anti-shake coil 521 is mounted on the base 11, and the second anti-shake magnet 523 is mounted on the anti-shake frame 30.

[0079] More specifically, the second anti-shake coil 521 is mounted on the second base side wall 1122 of the base 11, and the second anti-shake magnet 523 is mounted on the outer surface of the second frame side wall 32 of the anti-shake frame 30.

[0080] A second base groove 1103 can be formed on the inner surface of the second base side wall 1122, and the second anti-shake coil 521 is mounted in the second base groove 1103 to reduce the transverse dimension of the driving device 100. A third frame groove can be formed on the outer surface of the second frame side wall 32, and the second anti-shake magnet 523 is mounted in the third frame groove of the anti-shake frame 30 to reduce the transverse dimension of the driving device 100.

[0081] Correspondingly, the driving device 100 comprises at least three coils and at least three magnets, wherein the at least three coils comprise the focusing coil 41, the first anti-shake coil 511 and the second anti-shake coil 521, and the at least three magnets comprise the focusing magnet 43, the first anti-shake magnet 513 and the second anti-shake magnet 523. At least two coils in the at least three coils, i.e., the first anti-shake coil 511 and the second anti-shake coil 521, are arranged on the bottom seat side wall 112.

[0082] The focusing coil 41 is located on the adjacent side of the first anti-shake coil 511 and the second anti-shake coil 521. The focusing magnet 43 is located on the adjacent side of the first anti-shake magnet 513 and the second anti-shake magnet 523. In this way, the focusing coil 41, the first anti-shake coil 511 and the second anti-shake coil 521 are respectively distributed on the third side, the first side and the second side of the driving device 100; and the focusing magnet 43, the first anti-shake magnet 513 and the second anti-shake magnet 523 are respectively distributed on the third side, the first side and the second side of the driving device 100.

[0083] On the one hand, since the focusing coil 41, the first anti-shake coil 511 and the second anti-shake coil 521 are respectively distributed on different sides of the driving device 100, and the focusing magnet 43, the first anti-shake magnet 513 and the second anti-shake magnet 523 are respectively distributed on different sides of the driving device 100, the focusing coil 41, the first anti-shake coil 511 and the second anti-shake coil 521 do not interfere with each other; the focusing magnet 43, the first anti-shake magnet 513 and the second anti-shake magnet 523 do not interfere with each other; on the other hand, the fourth side of the driving device 100 is not provided with coils and magnets, when the camera module 1 provided with the driving device 100 is installed on a terminal mobile device, if the terminal mobile device is provided with other camera modules, the side of the camera module 1 of the present application which is not provided with coils and magnets can be adjacent to the other camera modules, so as to avoid magnetic interference between multiple camera modules.

[0084] The first side of the driving device 100 refers to the side where the first bottom seat side wall 1121, the first carrier side wall 21 and the first frame side wall 31 are located; the second side of the driving device 100 refers to the side where the second bottom seat side wall 1122, the second carrier side wall 22 and the second frame side wall 32 are located; the third side of the driving device 100 refers to the side where the third bottom seat side wall 1123, the third carrier side wall 23 and the third frame side wall 33 are located; and the fourth side of the driving device 100 refers to the side where the fourth bottom seat side wall 1124, the fourth carrier side wall 24 and the fourth frame side wall 34 are located.

[0085] The second anti-shake coil 521 has a second anti-shake coil through hole 5211. The second anti-shake position sensing element 522 is disposed on the same side of the second anti-shake coil 521. The second anti-shake position sensing element 522 can be located in the second anti-shake coil through hole 5211. The second anti-shake position sensing element 522 is used to detect the displacement of the anti-shake frame 30 in the second direction Y. Specifically, the second anti-shake position sensing element 522 detects the displacement of the anti-shake frame 30 in the second direction Y by sensing the magnetic field strength of the second anti-shake magnet 523. In another embodiment of the present application, the second anti-shake position sensing element 522 is located outside the second anti-shake coil through hole 5211, and the second anti-shake position sensing element 522 is used to detect the displacement of the anti-shake frame 30 in the second direction Y.

[0086] In the embodiment of the present application, the second anti-shake position sensing element 522 is arranged on the base 11. When the second anti-shake position sensing element 522 moves relative to the anti-shake frame 30, the relative position of the second anti-shake position sensing element 522 and the second anti-shake magnet 523 changes accordingly. The strength of the magnetic field of the second anti-shake magnet 523 sensed by the second anti-shake position sensing element 522 changes, so that the position of the anti-shake frame 30 can be determined. The anti-shake frame 30 can be moved to the desired position by adjusting the current of the second anti-shake coil 521. The second anti-shake position sensing element 522 can be a Hall sensor (HS) or an integrated circuit (IC) element. The integrated circuit element is a separate integrated circuit element or an integrated circuit element containing a Hall sensor.

[0087] The second anti-shake driving assembly 52 can further include capacitors, resistors, inductors, diodes, transistors, potentiometers, relays and other electronic elements and electronic devices. The capacitors, resistors, inductors, diodes, transistors, potentiometers, relays and other electronic elements and electronic devices can be arranged in the second anti-shake coil through hole 5211 of the second anti-shake coil 521, or can also be arranged outside the second anti-shake coil through hole 5211 of the second anti-shake coil 521.

[0088] Correspondingly, the driving device 100 further includes at least three position sensing elements, wherein the at least three position sensing elements include the focusing position sensing element 42, the first anti-shake position sensing element 512, and the second anti-shake position sensing element 522. At least two position sensing elements in the at least three position sensing elements, i.e., the first anti-shake position sensing element 512 and the second anti-shake position sensing element 522, are arranged on the base side wall 112.

[0089] It is worth mentioning that the driving device 100 further comprises at least one magnetic yoke 540 for increasing the magnetic field strength and preventing magnetic leakage. The magnetic yoke 540 is located on the side of each magnet away from the coil. In the present application, the driving device 100 comprises a first magnetic yoke 541, a second magnetic yoke 542 and a third magnetic yoke 543, which correspond to the focusing coil 41, the first anti-shake coil 511 and the second anti-shake coil 521 respectively. The first magnetic yoke 541, the second magnetic yoke 542 and the third magnetic yoke 543 have an integrated structure. Further, the first magnetic yoke 541 can be embedded in the focusing carrier 20; the second magnetic yoke 542 and the third magnetic yoke 543 can be embedded in the anti-shake frame 30. It should be understood that the first magnetic yoke 541, the second magnetic yoke 542 and the third magnetic yoke 543 can also have a split structure.

[0090] The driving device 100 further comprises a magnetic attraction element 550. The magnetic attraction element 550 is located on the side of each coil away from the magnet. The attractive force between the magnetic attraction element 550 and each magnet causes the focusing carrier 20 and the anti-shake frame 30 to approach each other, and the focusing carrier 20 and the anti-shake frame 30 are in a pre-pressed state, which can improve the driving stability and prevent the focusing carrier 20 and the anti-shake frame 30 from falling. The magnetic attraction element 550 can be embedded in the anti-shake frame 30 or the base 11.

[0091] In theory, the focusing coil 41 and the focusing position sensing element 42 mounted on the anti-shake frame 30 or the base 11 can be provided with an electrical connection structure, and the anti-shake coil and the anti-shake position sensing element mounted on the base 11 can be provided with an electrical connection structure, and the electrical connection structure can be arranged in the gap between the anti-shake frame 30 and the base 11. However, considering that the space between the anti-shake frame 30 and the base 11 is limited, and the anti-shake frame 30 moves relative to the base 11 during the anti-shake process, the electrical connection structure is easily broken or short-circuited. In the present application, the electrical connection structure for connecting the focusing coil 41, the focusing position sensing element 42 and the electrical connection structure for connecting the anti-shake coil and the anti-shake position sensing element are embedded in the anti-shake frame 30 and the base 11 respectively, so as to protect the electrical connection structure by the anti-shake frame 30 and the base 11. Further, the present application designs the arrangement position and extension direction of each part of the conductive assembly 60 of the driving device 100 so that the conductive assembly 60 is easily electrically conducted from the inside to the outside of the driving assembly.

[0092] Accordingly, in the embodiment of the present application, the conductive assembly 60 includes a focusing conductive part 61, an anti-shake conductive part 62 and a plurality of external conductive assemblies 63. The focusing conductive part 61 is conductively connected to the focusing power supply part 410 of the focusing drive assembly 40. The anti-shake conductive part 62 is conductively connected to the anti-shake power supply part of the anti-shake drive assembly 50. Accordingly, the focusing conductive part 61 forms an electrical connection structure for connecting the focusing coil 41 and the focusing position sensing element 42; the anti-shake conductive part 62 forms an electrical connection structure for connecting the anti-shake coil and the anti-shake position sensing element. The external conductive assemblies 63 are connected to the focusing conductive part 61, and the external conductive assemblies 63 are located between the anti-shake frame 30 and the base 11. Specifically, the external conductive assemblies 63 are located between the frame side wall of the anti-shake frame 30 and the base side wall 112 of the base 11, as shown in Figure 3

[0093] It is worth mentioning that the external conductive assemblies 63 are exposed outside and above the anti-shake frame 30 and the base 11, and the external conductive assemblies 63 are electrically connected to the focusing conductive part 61 and the anti-shake conductive part 62 to conduct the circuit of the focusing coil 41 and the focusing position sensing element 42 inside the anti-shake frame 30 to the outside. Of course, the external conductive assemblies 63 can also be exposed outside and below the anti-shake frame 30 and the base 11 to be electrically connected to the focusing conductive part 61 and the anti-shake conductive part 62 through the external conductive assemblies 63.

[0094] Accordingly, the external conductive assemblies 63 are flexible and can be implemented as conductive springs to adapt to the movement of the anti-shake frame 30 along the direction perpendicular to the set optical axis direction Z. When the anti-shake frame 30 moves along the direction perpendicular to the set optical axis direction Z, the external conductive assemblies 63 can deform to avoid short circuit or open circuit and other situations. Further, it can be understood that the force generated by the deformation of the external conductive assemblies 63 is smaller than the reaction force generated by the flexible circuit board when the anti-shake frame 30 moves, and has less impact on the anti-shake effect.

[0095] In the embodiment of the present application, the planes where the focusing conductive part 61 and the anti-shake conductive part 62 are located are respectively parallel to the optical axis direction Z; and the plane where the external conductive assemblies 63 are located is perpendicular to the optical axis direction Z.

[0096] ​The focusing conductive part 61 is embedded in the anti-shake frame 30, and the anti-shake conductive part 62 is embedded in the base 11. In this way, the anti-shake frame 30 and the base 11 respectively protect the focusing conductive part 61 and the anti-shake conductive part 62, avoiding the focusing conductive part 61 and the anti-shake conductive part 62 from being broken or short-circuited, and improving the structural stability of the driving device 100.

[0097] Correspondingly, the focusing conductive part 61 and the anti-shake conductive part 62 are metal structures, and embedding the focusing conductive part 61 and the anti-shake conductive part 62 in the anti-shake frame 30 and the base 11 respectively can enhance the strength of the anti-shake frame 30 and the base 11, and improve the structural stability of the driving device 100.

[0098] In addition, since the focusing conductive part 61 and the anti-shake conductive part 62 are embedded in the anti-shake frame 30 and the base 11, no additional space is required for the focusing conductive part 61 and the anti-shake conductive part 62. In other words, the parts of the conductive assembly 60 embedded in the anti-shake frame 30 and the base 11 do not occupy additional space beyond the anti-shake frame 30 and the base 11. In this way, the space utilization of the driving device 100 can be improved, and the overall size of the driving device 100 can be reduced to a certain extent.

[0099] Embedding the focusing conductive part 61 and the anti-shake conductive part 62 in the anti-shake frame 30 and the base 11 respectively by insert molding can reduce the overall assembly complexity of the driving device 100.

[0100] Specifically, when the focusing coil 41, the focusing position sensing element 42, the anti-shake coil, and the anti-shake position sensing element are respectively mounted on the anti-shake frame 30 and the base 11, they can be more conveniently and conductively connected with the focusing conductive part 61 and the anti-shake conductive part 62 respectively.

[0101] More specifically, in an embodiment of the present application, a part of the focusing conductive part 61 and the anti-shake conductive part 62 will be exposed on the surface of the anti-shake frame 30 and the base 11 during insert injection molding. The exposed part of the focusing conductive part 61 and the anti-shake conductive part 62 facilitates welding with the focusing coil 41, the focusing position sensing element 42, the anti-shake coil, and the anti-shake position sensing element, so as to realize electrical connection.

[0102] In another embodiment of the present application, the first injection part is formed in the process of insert injection molding, wherein the focusing conductive part 61 and the anti-shake conductive part 62 are at least partially exposed in the first injection part, so that the exposed parts of the focusing conductive part 61 and the anti-shake conductive part 62 are convenient for welding with the focusing coil 41, the focusing position sensing element 42, the anti-shake coil and the anti-shake position sensing element to realize electrical connection. The second injection can be performed after the focusing conductive part 61 and the anti-shake conductive part 62 are electrically connected with the focusing coil 41, the focusing position sensing element 42, the anti-shake coil and the anti-shake position sensing element.

[0103] The external conductive assembly 63 is located between the anti-shake frame 30 and the base 11, which facilitates the external conductive assembly 63 to conduct the focusing conductive part 61 inside the driving assembly to the outside of the driving assembly.

[0104] Specifically, the focusing conductive part 61 and the anti-shake conductive part 62 are respectively embedded in the anti-shake frame 30 and the base 11 by insert molding process.

[0105] The focusing conductive part 61 includes a focusing coil branch 610 and a focusing sensing branch 620, wherein the focusing coil branch 610 is electrically connected to the focusing coil 41, and the focusing sensing branch 620 is electrically connected to the focusing position sensing element 42. The focusing coil branch 610 and the focusing sensing branch 620 are respectively embedded in the anti-shake frame 30.

[0106] The focusing coil branch 610 extends on the side of the focusing coil 41 away from the focusing magnet 43 and extends in the third frame side wall 33. The focusing sensing branch 620 extends on the side of the focusing position sensing element 42 away from the focusing magnet 43 and is bently extended from the third frame side wall 33 of the anti-shake frame 30 to the side wall adjacent to the third frame side wall 33 of the anti-shake frame 30.

[0107] In an embodiment of the present application, as shown in Figure 2 and Figures 5 to 8 The focusing conductive part 61 includes two focusing coil branches 610. The two focusing coil branches 610 are respectively a first focusing coil branch 611 and a second focusing coil branch 612. The first focusing coil branch 611 and the second focusing coil branch 612 are respectively electrically connected to the focusing coil 41 and embedded in the anti-shake frame 30. Specifically, the first focusing coil branch 611 and the second focusing coil branch 612 are respectively embedded in the third frame side wall 33 of the anti-shake frame 30.

[0108] Each of the focus sensing branches 620 has a first focus conductive end 604, a second focus conductive end 605, and a focus sensing wire part 606 extending between the first focus conductive end 604 and the second focus conductive end 605. The first focus conductive end 604 is connected to the focus position sensing element 42, and the second focus conductive end 605 is formed on the upper surface of the anti-shake frame 30 and electrically connected to the external conductive assembly 63.

[0109] The width of the focus sensing wire part 606 of the focus sensing branch 620 is 0.2-0.3 mm, so that more wires can be arranged in the anti-shake frame 30.

[0110] Each of the external conductive assemblies 63 has an inner connecting end 607, an outer connecting end 608, and a bending part 609 extending between the inner connecting end 607 and the outer connecting end 608. The inner connecting end 607 of the external conductive assembly 63 is formed on the anti-shake frame 30, specifically, on the upper surface of the anti-shake frame 30, and is electrically connected to the second focus conductive end 605 of the focus sensing branch 620. The outer connecting end 608 of the external conductive assembly 63 is formed on the base 11, specifically, on the upper surface of the base 11, and is electrically connected to the anti-shake conductive assembly 60.

[0111] In an embodiment of the present application, the focus conductive part 61 includes at least four focus sensing branches 620. The at least four focus sensing branches 620 include a first focus sensing branch 613, a second focus sensing branch 614, a third focus sensing branch 615, and a fourth focus sensing branch 616. The at least four focus sensing branches 620 are electrically connected between the focus position sensing element 41 and the external conductive assembly 63. The external conductive assembly 63 includes four conductive springs, which are a first conductive spring 631, a second conductive spring 632, a third conductive spring 633, and a fourth conductive spring 634, respectively. The first focus sensing branch 613, the second focus sensing branch 614, the third focus sensing branch 615, and the fourth focus sensing branch 616 are embedded in the anti-shake frame 30.

[0112] The four conductive springs are respectively disposed at the four corners of the frame and located on the top surface of the image stabilization frame 30. Correspondingly, the at least four focus sensing branches 620 extend in a horizontal direction (e.g., the first direction X and the second direction Y) and in a vertical direction along the sidewall of the frame, respectively extending between the focus position sensing element 42 and the four corners of the frame, so that the at least four focus sensing branches 620 are electrically connected to the four conductive springs.

[0113] It is worth mentioning that, in this application, at least four of the focus sensing branches 620 extend from one of the frame sidewalls to the four frame corners, and the four conductive springs are respectively disposed at the four frame corners, so that the at least four focus sensing branches 620 can be easily electrically connected to the four conductive springs.

[0114] The four conductive springs are respectively disposed at the four corners of the frame, and the focus position sensing element 42 is disposed on one of the frame sidewalls of the image stabilization frame 30. This makes two of the four frame corners closer to the frame sidewall where the focus position sensing element 42 is disposed, thereby making at least two of the at least four focus sensing branches 620 extending between one of the frame sidewalls and the four conductive springs shorter. This can reduce the total length of the at least four focus sensing branches 620 to a certain extent, thereby reducing the possibility of branch short circuits or interference.

[0115] At least two of the at least four focus sensing branches 620 extend from the frame sidewall where the focus position sensing element 42 is mounted to an adjacent frame sidewall, and the other at least two focus sensing branches 620 extend from the frame sidewall where the focus position sensing element 42 is mounted to another adjacent frame sidewall. In other words, at least two focus sensing branches 620 and the other at least two focus sensing branches 620 extend from the frame sidewall where the focus position sensing element 42 is mounted to different sides of the frame where the focus position sensing element 42 is mounted. This not only avoids interference between multiple different focus sensing branches 620, but also allows the focus sensing branches 620 to be designed with reasonable shapes and lengths, making the insert design within the image stabilization frame 30 more compact and reasonable.

[0116] Of the at least four focus sensing branches 620, the focus sensing branches 620 extending towards the frame sidewall without magnets are positioned lower than the focus sensing branches 620 extending towards the frame sidewall with magnets. Specifically, the frame sidewall with magnets is affected by the magnets on it and the ball bearings below it, resulting in less space available for arranging the focus sensing branches 620. Therefore, the portion of the focus sensing branches 620 extending towards the frame sidewall with magnets is positioned higher. The frame sidewall without magnets has more space available for arranging the focus sensing branches 620, with greater utilization. Correspondingly, the portion of the focus sensing branches 620 extending towards the frame sidewall without magnets is positioned lower.

[0117] Since the four conductive springs are located on the top surface of the image stabilization frame 30, the at least four focus sensing branches 620 need to extend not only horizontally but also vertically. The space on the at least four sidewalls of the frame is larger than the space on the bottom wall of the image stabilization frame 30, providing ample space for the extension of the at least four focus sensing branches 620 and the focus coil branch 610. This allows the at least four focus sensing branches 620 to be easily routed to approach the corners of the frame where the conductive springs to be connected are located, thus making the layout of the at least four focus sensing branches 620 and the focus coil branch 610 more flexible. The four conductive springs being located on the top surface of the image stabilization frame 30 facilitates assembly.

[0118] Specifically, the first conductive spring 631, the second conductive spring 632, the third conductive spring 633, and the fourth conductive spring 634 are respectively located at the third frame corner 343, the fourth frame corner 344, the second frame corner 342, and the first frame corner 341 of the image stabilization frame 30, and are located on the top surface of the image stabilization frame 30. Correspondingly, the first focus sensing branch 613, the second focus sensing branch 614, the third focus sensing branch 615, and the fourth focus sensing branch 616 bend and extend horizontally and vertically along the sidewall of the frame, respectively extending from the focus position sensing element 42 to the third frame corner 343, the fourth frame corner 344, the second frame corner 342, and the first frame corner 341, so as to be electrically connected to the first conductive spring 631, the second conductive spring 632, the third conductive spring 633, and the fourth conductive spring 634.

[0119] The focus position sensing element 42 is located on the side wall 33 of the third frame and is closer to the corner 343 of the third frame and the corner 342 of the second frame. Accordingly, the lengths of the first focus sensing branch 613 and the third focus sensing branch 615 are shorter than those of the second focus sensing branch 614 and the fourth focus sensing branch 616.

[0120] The first focus sensing branch 613 and the second focus sensing branch 614 extend from the third frame sidewall 33 to one side of the third frame sidewall 33, and then extend to the fourth frame sidewall 34 adjacent to the third frame sidewall 33. The third focus sensing branch 615 and the fourth focus sensing branch 616 extend from the third frame sidewall 33 to the other side of the third frame sidewall 33, and then extend to the second frame sidewall 32 adjacent to the third frame sidewall 33. This not only avoids interference between the first focus sensing branch 613, the second focus sensing branch 614, the third focus sensing branch 615 and the fourth focus sensing branch 616, but also allows for a reasonable shape and length design of the first focus sensing branch 613, the second focus sensing branch 614, the third focus sensing branch 615 and the fourth focus sensing branch 616, making the insert design within the image stabilization frame 30 more compact and reasonable.

[0121] The first focus sensing branch 613 is connected between the focus position sensing element 42 and the inner connection terminal 607 of the first conductive spring 631; the second focus sensing branch 614 is connected between the focus position sensing element 42 and the inner connection terminal 607 of the second conductive spring 632; the third focus sensing branch 615 is connected between the focus position sensing element 42 and the inner connection terminal 607 of the third conductive spring 633; ​​and the fourth focus sensing branch 616 is connected between the focus position sensing element 42 and the inner connection terminal 607 of the fourth conductive spring 634.

[0122] At least a portion of the first focus sensing branch 613 extends from the third frame sidewall 33 in the second direction Y toward the direction close to the fourth frame sidewall 34, and at least a portion extends upward in the optical axis direction Z, so as to be electrically connected to the first conductive spring 631 of the third frame corner 343.

[0123] The second focus sensing branch 614 extends from the third frame sidewall 33 to the fourth frame sidewall 34, and further to the fourth frame corner 344, and is electrically connected to the second conductive spring 632. Specifically, the second focus sensing branch 614 extends at least partially along the second direction Y towards the fourth frame sidewall 34, at least partially from the fourth frame sidewall 34 along the first direction X towards the first frame sidewall 31, and at least partially extends upward along the optical axis direction Z, so as to be electrically connected to the second conductive spring 632 at the fourth frame corner 344.

[0124] The fourth frame sidewall 34 is not equipped with a magnet, and correspondingly, at least a portion of the second focus sensing branch 614 located in the fourth frame sidewall 34 is at a lower height than the fourth focus sensing branch 616.

[0125] At least a portion of the third focus sensing branch 615 extends from the third frame sidewall 33 in the direction of the second direction Y toward the direction of the second frame sidewall 32, and at least a portion extends upward in the direction of the optical axis Z, so as to be electrically connected to the third conductive spring 633 at the corner 342 of the second frame.

[0126] The fourth focus sensing branch 616 extends from the third frame sidewall 33 to the second frame sidewall 32, and further to the first frame corner 341, and is electrically connected to the fourth conductive spring 634. Specifically, the fourth focus sensing branch 616 extends at least partially along the second direction Y towards the second frame sidewall 32, at least partially from the second frame sidewall 32 along the first direction X towards the first frame sidewall 31, and at least partially extends upward along the optical axis direction Z, so as to be electrically connected to the fourth conductive spring 634 at the first frame corner 341.

[0127] The second frame sidewall 32 is provided with a magnet, and correspondingly, at least a portion of the fourth focus sensing branch 616 located in the second frame sidewall 32 is at a higher height than at least a portion of the second focus sensing branch 614 located in the fourth frame sidewall 34.

[0128] It should be understood that the first focus sensing branch 613, the second focus sensing branch 614, the third focus sensing branch 615 and the fourth focus sensing branch 616 can be extended in other ways.

[0129] The horizontally extending portions of the first focus sensing branch 613, the second focus sensing branch 614, the third focus sensing branch 615, and the fourth focus sensing branch 616 are staggered at different heights to avoid interference between different focus sensing branches and to prevent short circuits.

[0130] The conductive component 60 further includes a conductive guide portion 64. The conductive guide portion 64 is electrically connected to the external conductive component 63, and then electrically connected to the focusing conductive portion 61 via the external conductive component 63, thereby electrically connecting to the focusing position sensing element 42. The conductive guide portion 64 has a first guide end 6401, a second guide end 6402, and an extension portion 6403, the extension portion 6403 extending between the first guide end 6401 and the second guide end 6402. Figure 3 and Figure 4 As shown, the first guide end 6401 of the conductive guide portion 64 is connected to the external connection end 608 of the external conductive component 63; the second guide end 6402 is exposed on the outer surface of the base 11 and forms a focusing pin 6011 to guide the focusing conductive portion 61 from the inside of the driving device 100 to the outside of the driving device 100, so that the focusing conductive portion 61 can be easily electrically connected to external devices, such as the circuit board of the photosensitive component 300. The width of the focusing pin 6011, i.e., the second guide end 6402, is greater than the width of the extension portion 6403 and greater than or equal to the width of the first guide end 6401. Specifically, the width of the focusing pin 6011 is 0.5mm-0.6mm to increase the welding area. The extension portion 6403 of the conductive guide portion 64 is embedded in the base 11. The second guide end 6402 of part of the conductive guide portion 64 extends to the outer surface of the second base sidewall 1122 of the base 11; the second guide end 6402 of part of the conductive guide portion 64 extends to the outer surface of the first base sidewall 1121 of the base 11, so that the focusing pin 6011 is concentrated on the side where the second base sidewall 1122 and the first base sidewall 1121 are located, so as to facilitate centralized conduction with external circuits.

[0131] The conductive component 60 includes four conductive guiding portions 64, which are a first conductive guiding portion 641, a second conductive guiding portion 642, a third conductive guiding portion 643, and a fourth conductive guiding portion 644.

[0132] The first conductive guide portion 641, the second conductive guide portion 642, the third conductive guide portion 643, and the fourth conductive guide portion 644 of the conductive component 60 are electrically connected to the first conductive spring 631, the second conductive spring 632, the third conductive spring 633, and the fourth conductive spring 634, respectively, so as to be electrically connected to the focus position sensing element 42.

[0133] The first guide end 6401 of the first conductive guide portion 641 is connected to the external connection end 608 of the first conductive spring 631; the second guide end 6402 of the first conductive guide portion 641 is exposed on the outer surface of the base 11 and forms a first focusing pin 60111. Figure 3 As shown, the first focusing pin 60111 extends to the outer surface of the first base sidewall 1121.

[0134] The first guide end 6401 of the second conductive guide portion 642 is connected to the external connection end 608 of the second conductive spring 632; the second guide end 6402 of the second conductive guide portion 642 is exposed on the outer surface of the base 11 and forms a second focusing pin 60112. Figure 3 As shown, the second focusing pin 60112 extends to the outer surface of the first base sidewall 1121.

[0135] The first guide end 6401 of the third conductive guide portion 643 is connected to the external connection end 608 of the third conductive spring 633; ​​the second guide end 6402 of the third conductive guide portion 643 is exposed on the outer surface of the base 11 and forms a third focusing pin 60113. Figure 3 As shown, the third focusing pin 60113 extends to the outer surface of the second base sidewall 1122.

[0136] The first guide end 6401 of the fourth conductive guide portion 644 is connected to the external connection end 608 of the fourth conductive spring 634; the second guide end 6402 of the fourth conductive guide portion 644 is exposed on the outer surface of the base 11 and forms a fourth focusing pin 60114. Figure 3 As shown, the fourth focusing pin 60114 extends to the outer surface of the first base sidewall 1121.

[0137] The anti-shake conductive part 62 is embedded in the side wall of the base 11 and connected to the anti-shake position sensing element and the anti-shake coil. The exposed portion of the anti-shake conductive part 62 and the outer surface of the base 11 form an anti-shake pin 6012 to facilitate the electrical connection of the anti-shake conductive component to an external device, such as the circuit board of the photosensitive component 300.

[0138] The image stabilization conductive portion 62 includes two unidirectional image stabilization coil branches 621, two bidirectional image stabilization coil branches 622, at least four unidirectional image stabilization sensing branches 623, and at least four bidirectional image stabilization sensing branches 624. Each unidirectional image stabilization coil branch 621 is conductively connected to the first image stabilization coil 511; each bidirectional image stabilization coil branch 622 is conductively connected to the second image stabilization coil 521; each unidirectional image stabilization sensing branch 623 is conductively connected to the first image stabilization position sensing element 512; and each bidirectional image stabilization sensing branch 624 is conductively connected to the second image stabilization position sensing element 522. In this embodiment, the focusing coil branch 610, the unidirectional image stabilization coil branch 621, and the bidirectional image stabilization coil branch 622 form a coil branch. The focusing sensing branch 620, the unidirectional image stabilization sensing branch 623, and the bidirectional image stabilization sensing branch 624 form a sensing branch.

[0139] Specifically, each of the unidirectional image stabilization coil branches 621 and each of the unidirectional image stabilization sensing branches 623 is embedded in the first base sidewall 1121 of the base 11, extending downwards from the first image stabilization coil 511 and the first image stabilization position sensing element 512 to the outer surface of the first base sidewall 1121 of the base 11, respectively. Figure 3 and Figure 4 As shown, the portions of the two unidirectional image stabilization coil branches 621 exposed on the outer surface of the first base sidewall 1121 of the base 11 form two unidirectional image stabilization coil pins 60121. The portions of at least four unidirectional image stabilization sensing branches 623 exposed on the outer surface of the first base sidewall 1121 of the base 11 form at least four unidirectional image stabilization sensing pins 60122.

[0140] Each of the bidirectional image stabilization coil branches 622 and each of the bidirectional image stabilization sensing branches 624 is embedded in the second base sidewall 1122 of the base 11, extending downwards from the second image stabilization coil 521 and the second image stabilization position sensing element 522 to the outer surface of the second base sidewall 1122 of the base 11, respectively. Figure 3 and Figure 4As shown, the portions of the two bidirectional image stabilization coil branches 622 exposed on the outer surface of the second base sidewall 1122 of the base 11 form two bidirectional image stabilization coil pins 60123. The portions of at least four bidirectional image stabilization sensing branches 624 exposed on the outer surface of the second base sidewall 1122 of the base 11 form at least four bidirectional image stabilization sensing pins 60124. The two unidirectional image stabilization coil pins 60121, the two bidirectional image stabilization coil pins 60123, the at least four unidirectional image stabilization sensing pins 60122 and the at least four bidirectional image stabilization sensing pins 60124 form an image stabilization pin 6012.

[0141] The focusing pin 6011 and the image stabilization pin 6012 are concentrated on both sides of the base 11, that is, on the side where the second base sidewall 1122 and the first base sidewall 1121 are located. This makes the drive device 100 connected to the external device in a concentrated manner from the side where the second base sidewall 1122 and the first base sidewall 1121 of the drive device 100 are located, making the electrical connection structure between the drive device 100 and the external device more compact.

[0142] In this embodiment of the application, the portion of the conductive component 60 located on the base 11 is defined as the first conductive component 6010, and the portion of the conductive component 60 located on the anti-shake frame 30 is defined as the second conductive component 6020.

[0143] Accordingly, in the embodiment of this application where the focusing power supply 410 is disposed on the image stabilization frame 30 and the first image stabilization power supply 510 and the second image stabilization power supply 520 are disposed on the base 11, the first conductive component 6010 includes the image stabilization conductive portion 62 and the conductive guide portion 64, and the second conductive component 6020 includes the focusing conductive portion 61. The external conductive component 63 is electrically connected between the first conductive component 6010 and the second conductive component 6020.

[0144] The first conductive component 6010 is at least partially embedded within the base sidewall 112; in other words, the first conductive component 6010 is disposed within the base sidewall 112. The first conductive component 6010 extends and bends within the base sidewall 112. In one embodiment of this application, at least two coils and at least two position sensing elements are disposed on the base sidewall 112. Accordingly, the at least two coils and the at least two position sensing elements are electrically connected to the first conductive component 6010 to achieve electrical conduction between the at least two coils and the at least two position sensing elements located on the base sidewall 112 and external circuits, respectively.

[0145] Specifically, the first conductive component 6010 is electrically connected via the anti-shake conductive portion 62 to the first anti-shake coil 511 and the second anti-shake coil 521 among the at least two coils, and to the first anti-shake position sensing element 512 and the second anti-shake position sensing element 522 among the at least two position sensing elements.

[0146] The first conductive component 6010 is electrically connected to the external conductive component 63 through the conductive guide portion 64, and then electrically connected to the focusing conductive portion 61, so as to the focusing position sensing element 42.

[0147] The structure of the image stabilization conductive portion 62 and its specific implementation in which it is electrically connected to the at least two coils and the at least two position sensing elements have been described in detail in the description of the image stabilization conductive portion 62 above, and will not be repeated here. The structure of the conductive guide portion 64 and its specific implementation in which it is electrically connected to the external conductive component 63 and then to the focusing conductive portion 61 have been described in detail in the description of the conductive guide portion 64 above, and will not be repeated here.

[0148] A portion of the first conductive component 6010 is exposed to the outside of the base sidewall 112 to form conductive pins 601, such as the focus pin 6011 and the image stabilization pin 6012, to enable conduction with external circuitry.

[0149] The second conductive component 6020 is at least partially embedded in the four frame sidewalls of the image stabilization frame 30; in other words, the second conductive component 6020 is disposed within the four frame sidewalls of the image stabilization frame 30. The second conductive component 6020 extends and bends within the four frame sidewalls of the image stabilization frame 30. In one embodiment of this application, the focusing coil 41 and the focusing position sensing element 42 are disposed on the four frame sidewalls. Accordingly, the focusing coil 41 and the focusing position sensing element 42 are electrically connected to the second conductive component 6020 to achieve electrical conduction between the focusing coil 41 and the focusing position sensing element 42 and external circuits, respectively.

[0150] Specifically, the second conductive component 6020 is electrically connected to the focusing coil 41 and the focusing position sensing element 42 through the focusing conductive portion 61.

[0151] The structure of the focusing conductive part 61 and the specific implementation of its electrical connection to the focusing coil 41 and the focusing position sensing element 42 have been described in detail in the above description of the focusing conductive part 61, and will not be repeated here.

[0152] It is worth mentioning that, as described above, in a modified embodiment of this application, the focusing coil 41 is mounted on the base 11, and the focusing magnet 43 is mounted on the focusing carrier 20; the focusing position sensing element 42 is disposed on the base 11. Specifically, in this modified embodiment, the focusing coil 41 and the focusing position sensing element 42 are mounted on the third base sidewall 1123 of the base 11.

[0153] When the focusing coil 41 and the focusing position sensing element 42 are mounted on the base 11, the first conductive component 6010 can be provided only in the base 11, and the second conductive component 6020 does not need to be provided in the image stabilization frame 30. The external conductive component 63 is provided between the base 11 and the image stabilization frame 30, and the conductive guide portion 64 does not need to be provided in the base 11.

[0154] Accordingly, the first conductive component 6010 includes the focusing conductive portion 61 and the image stabilization conductive portion 62. The focusing conductive portion 61 is conductively connected to the focusing power supply portion 410 of the focusing drive assembly 40. The image stabilization conductive portion 62 is conductively connected to the image stabilization power supply portion of the image stabilization drive assembly 50. The focusing conductive portion 61 and the image stabilization conductive portion 62 are embedded in the base 11. Specifically, at least a portion of the focusing conductive portion 61 and at least a portion of the image stabilization conductive portion 62 are embedded in the side wall 112 of the base.

[0155] The focusing conductive portion 61 includes a focusing coil branch 610 and a focusing sensing branch 620, wherein the focusing coil branch 610 is conductively connected to the focusing coil 41, and the focusing sensing branch 620 is conductively connected to the focusing position sensing element 42. The focusing coil branch 610 and the focusing sensing branch 620 are respectively embedded in the base 11, and at least a portion of the focusing coil branch 610 and at least a portion of the focusing sensing branch 620 are respectively embedded in the side wall 112 of the base.

[0156] The focusing coil branch 610 extends on the side of the focusing coil 41 opposite to the focusing magnet 43 and extends within the third base sidewall 1123. The focusing sensing branch 620 extends on the side of the focusing position sensing element 42 opposite to the focusing magnet 43 and extends from the third base sidewall 1123 of the base 11 in a bent manner toward the sidewall adjacent to the third base sidewall 1123 of the base 11.

[0157] The focusing conductive part 61 includes two focusing coil branches 610. The two focusing coil branches 610 are a first focusing coil branch 611 and a second focusing coil branch 612. The first focusing coil branch 611 and the second focusing coil branch 612 are electrically connected to the focusing coil 41 and are embedded in the base 11. Specifically, the first focusing coil branch 611 and the second focusing coil branch 612 are embedded in the third base sidewall 1123 of the base 11.

[0158] The first focusing coil branch 611 is electrically connected to one end of the focusing coil 41 and the focusing position sensing element 42, and the second focusing coil branch 612 is electrically connected to the other end of the focusing coil 41 and the focusing position sensing element 42. That is, the current of the focusing coil 41 is controlled by the focusing position sensing element 42 through the first focusing coil branch 611 and the second focusing coil branch 612.

[0159] The focusing conductive portion 61 includes at least four focusing sensing branches 620. The at least four focusing sensing branches 620 include a first focusing sensing branch 613, a second focusing sensing branch 614, a third focusing sensing branch 615, and a fourth focusing sensing branch 616. The first focusing sensing branch 613, the second focusing sensing branch 614, the third focusing sensing branch 615, and the fourth focusing sensing branch 616 are electrically connected to the focusing position sensing element 42 and are embedded in the base 11.

[0160] Specifically, the specific extension methods of the first focus sensing branch 613, the second focus sensing branch 614, the third focus sensing branch 615, and the fourth focus sensing branch 616 within the base 11 are not limited to this application. In one example of this application, the first focus sensing branch 613 extends from the third base sidewall 1123 to the fourth base sidewall 1124, and then to the first base sidewall 1121. The second focus sensing branch 614 extends from the third base sidewall 1123 to the fourth base sidewall 1124, and then to the first base sidewall 1121. The third focus sensing branch 615 extends from the third base sidewall 1123 to the second base sidewall 1122. The fourth focus sensing branch 616 extends from the third base sidewall 1123 to the second base sidewall 1122, and then to the first base sidewall 1121.

[0161] The structure of the anti-shake conductive part 62 and the specific implementation of its electrical connection to the at least two coils and the at least two position sensing elements have been described in detail in the above description of the anti-shake conductive part 62, and will not be repeated here.

[0162] In this application, the driving device 100 further includes a first support component 70 and a second support component 80. The first support component 70 is used to provide support for the focusing carrier 20 when it moves along the optical axis direction Z. The second support component 80 is used to provide support for the image stabilization frame 30 when it moves along the first direction X and the second direction Y.

[0163] The first support component 70 is a fixed support component. When the focusing carrier 20 moves, the first support component 70 does not move. Accordingly, the first support component 70 fixes the focusing carrier 20 to move along the optical axis direction Z.

[0164] The first support component 70 is disposed on the side where the focusing drive component 40 is located. The focusing carrier 20 has a small torque that causes tilting or offset, making it less prone to tilting during focusing, thereby ensuring image sharpness and focusing accuracy. Furthermore, due to the reduced tilt of the focusing carrier 20, the focusing drive component 40 can respond to focusing commands more quickly, achieving fast and accurate focusing.

[0165] In one embodiment of this application, the focusing drive assembly 40 and the first support assembly 70 are both disposed on the side of the third carrier sidewall 23 of the focusing carrier 20.

[0166] The first support assembly 70 includes at least one guide rod 71, the length of which extends in the same direction as the optical axis Z. The length of the guide rod 71 is greater than the travel distance of the inner carrier 30 along the optical axis Z, so that the focusing carrier 20 can be supported within the travel distance.

[0167] The drive device 100 further includes a support member 90, which is located on the image stabilization frame 30. The guide rod 71 is clamped between the image stabilization frame 30 and the support member 90 in the optical axis direction Z.

[0168] In one example of this application, the first support assembly 70 includes two guide rods 71. The two guide rods 71 ​​are disposed on the side of the third carrier sidewall 23 of the focusing carrier 20, between the third carrier sidewall 23 of the focusing carrier 20 and the third frame sidewall 33 of the image stabilization frame 30.

[0169] In this application, a single-layer rolling support assembly is used to guide and support the anti-shake frame 30, which can reduce the height of the drive device 100 to a certain extent. The second support assembly 80 is disposed between the anti-shake frame 30 and the base 11.

[0170] The second support component 80 includes at least one ball bearing 81. At least one transverse guide groove is provided between the anti-shake frame 30 and the base 11, and the ball bearing 81 is rotatably disposed in the transverse guide groove. The transverse guide groove includes a one-way transverse groove and a two-way transverse groove. The length direction of the one-way transverse groove is aligned with the first direction X, allowing the one-way transverse groove to guide the ball bearing 81 and the anti-shake frame 30 to move along the first direction X; the length direction of the two-way transverse groove is aligned with the second direction Y, allowing the two-way transverse groove to guide the ball bearing 81 and the anti-shake frame 30 to move along the second direction Y. The one-way transverse groove is formed on the lower surface of the anti-shake frame 30. The second transverse groove is formed on the inner surface of the bottom wall 111 of the base 11.

[0171] The drive device 100 further includes a plurality of damping elements 560. At least one of the damping elements 560 is arranged on the top of the focusing carrier 20 to provide cushioning and prevent the focusing carrier 20 from directly impacting other components and being damaged when it moves along the optical axis direction Z; at least one of the damping elements 560 is arranged on the side wall of the image stabilization frame 30 to provide cushioning and prevent the image stabilization frame 30 from directly impacting other components and being damaged when it moves along the first direction X and the second direction Y.

[0172] It is worth mentioning that this application uses a two-stage injection molding process to form the anti-shake carrier and the base 11, which can minimize the risk of bending or deformation of the conductive component 60 due to large impact forces during the injection molding process, or problems such as positional displacement of the coil and position sensing element. Accordingly, this application proposes a method for manufacturing the anti-shake frame 30.

[0173] Injection molding method for illustrative conductive components

[0174] like Figure 9 As shown, an injection molding method for a conductive component according to an embodiment of this application is illustrated. The injection molding method for the conductive component includes the following steps: S110, forming a continuous strip of conductive component, wherein the continuous strip of conductive component includes a plurality of coil branches and a plurality of sensing branches, and a plurality of connecting portions connected between the coil branches and the sensing branches; S120, performing a first injection molding around the plurality of coil branches and the plurality of sensing branches to form a first injection molded portion; S130, mounting a coil and a position sensing element to the first injection molded portion, wherein the coil and the position sensing element are electrically connected to the coil branches and the sensing branches, respectively; and S140, performing a second injection molding around the first injection molded portion to form a second injection molded portion, wherein the second injection molded portion covers the first injection molded portion.

[0175] In step S110, a continuous strip of conductive components is formed. Specifically, multiple coil branches and multiple sensing branches are interconnected using auxiliary materials to form a continuous strip.

[0176] In this embodiment of the application, the coil branch and the sensing branch required for a single conductive component are defined as a conductive unit.

[0177] All the coil branches and all the sensing branches of the continuous strip can be the coil branches and sensing branches required to form a single conductive component. In this way, the continuous strip ultimately forms a conductive unit.

[0178] All the coil branches and all the sensing branches of the continuous strip can also be the coil branches and sensing branches required to form multiple conductive components. For example, some of the coil branches and some of the sensing branches are required to form one conductive component; some of the coil branches and some of the sensing branches are required to form another conductive component. In this way, the continuous strip can be used to batch form multiple conductive units.

[0179] Accordingly, the continuous strip of the conductive component includes at least one of the conductive units.

[0180] During the formation of the continuous conductive component strip, positioning holes can be formed on the continuous strip to form the final continuous conductive component strip. In subsequent process steps, the continuous conductive component strip can be positioned by passing positioning pins through the positioning holes, and multiple continuous strips can be positioned simultaneously, avoiding the problem of low positioning efficiency caused by repeated positioning. When the continuous strip has multiple conductive units, multiple positioning holes can be formed on the continuous strip; at least one positioning hole is formed on each conductive unit.

[0181] Specifically, the positioning holes can be formed on the continuous strip by stamping or by other methods.

[0182] Accordingly, step S110 includes the following steps: S111, connecting multiple coil branches and multiple sensing branches together with auxiliary materials to form a continuous strip; S112, forming positioning holes on the continuous strip.

[0183] In step S120, a first injection molding is performed around the plurality of coil branches and the plurality of sensing branches to form a first injection-molded portion. Specifically, the first injection molding is performed around the plurality of coil branches and the plurality of sensing branches such that the injection molding material covers the plurality of coil branches and the plurality of sensing branches, forming at least one small injection-molded block at each of the plurality of coil branches and the plurality of sensing branches, thereby forming part of the conductive component. After the first injection molding, the at least one small injection-molded block is in a flat state, that is, it is laid flat on the same plane.

[0184] It is worth mentioning that during the first injection molding process surrounding the multiple coil branches and multiple sensing branches, the two ends of each coil branch and the two ends of each sensing branch are exposed on the outer surface of the first injection molded part to facilitate subsequent contact and electrical connection with the coil and position sensing element. The two ends of the coil branch are the first lead end and the second lead end, respectively. The two ends of the sensing branch are the first conductive end and the second conductive end, respectively. After forming the first injection molded part, it is necessary to separate the second conductive end from the auxiliary material, that is, to separate the connecting part connected to the second conductive end from the second conductive end, so that the second conductive end is in a free state.

[0185] In step S130, the coil and position sensing element are mounted on the first injection molding part. Specifically, the coil and position sensing element are horizontally mounted on the small injection molding block, and the coil and position sensing element can be welded to the corresponding coil branch and sensing branch, respectively, so that the coil and the position sensing element are electrically connected to the coil branch and the sensing branch, respectively.

[0186] The sensing branch can be bent, causing the sensing branch and / or the at least one small injection block to change from a flat state to a bent state, whereby the sensing branch changes from each part being in the same plane to at least two adjacent parts being in planes that form an angle. Accordingly, multiple parts of the sensing branch extend from different sidewalls of the conductive component.

[0187] In step S140, a second injection molding is performed around the first injection molding portion to form a second injection molding portion. Specifically, during the first injection molding around the plurality of coil branches and the plurality of sensing branches in step S120, the continuous strip of the conductive component needs to be positioned and fixed through the positioning holes to prevent deformation and displacement of the coil branches and the sensing branches. After the first injection molding portion is formed, positioning marks exist on the surface of the first injection molding portion. During the second injection molding process around the first injection molding portion, the second injection molding portion covers the first injection molding portion, covering the positioning marks and forming a flat surface, so that the finally formed conductive component has a flat surface. During the second injection molding process around the first injection molding portion, the injection molding material can also cover the coil and the position sensing element, surrounding the coil and the position sensing element to form a groove for accommodating the coil and the position sensing element. A portion of the surface of the second injection molding portion forms the sidewall of the groove.

[0188] It is worth mentioning that the anti-shake frame 30 can be injection molded using the same injection molding method as the conductive component, and the base 11 can also be injection molded using the same method. The following examples illustrate embodiments of injection molding the anti-shake frame 30 and the base 11 using the same method as the conductive component.

[0189] In one example of this application, the image stabilization frame 30 is injection molded using the injection molding method of the conductive component. In step S110, a continuous strip of conductive component is formed. Specifically, the continuous strip of conductive component includes a plurality of focusing coil branches 610 and a plurality of focusing sensing branches 620, as well as a plurality of connecting portions connecting the focusing coil branches 610 and the focusing sensing branches 620. Specifically, the plurality of focusing coil branches 610 and the plurality of focusing sensing branches 620 are interconnected by auxiliary materials to form a continuous strip. More specifically, the continuous strip of conductive component includes two focusing coil branches 610 and at least four focusing sensing branches 620. The two focusing coil branches 610 are respectively a first focusing coil branch 611 and a second focusing coil branch 612. The at least four focus sensing branches 620 include a first focus sensing branch 613, a second focus sensing branch 614, a third focus sensing branch 615, and a fourth focus sensing branch 616.

[0190] In this example, the focus coil branch 610 and the focus sensing branch 620 required for a single image stabilization frame 30 are defined as a first conductive unit.

[0191] All the focusing coil branches 610 and all the focusing sensing branches 620 of the continuous strip can be the focusing coil branches 610 and the focusing sensing branches 620 required to form a single image stabilization frame 30. In this way, the continuous strip ultimately forms a first conductive unit.

[0192] All the focusing coil branches 610 and all the focusing sensing branches 620 of the continuous strip can also be the focusing coil branches 610 and the focusing sensing branches 620 required to form multiple image stabilization frames 30. For example, some of the focusing coil branches 610 and some of the focusing sensing branches 620 are the focusing coil branches 610 and the focusing sensing branches 620 required to form one image stabilization frame 30; some of the focusing coil branches 610 and some of the focusing sensing branches 620 are the focusing coil branches 610 and the focusing sensing branches 620 required to form another image stabilization frame 30. In this way, the continuous strip can be used to batch form multiple first conductive units.

[0193] Accordingly, the continuous strip of the conductive component includes at least one of the first conductive units.

[0194] During the formation of the continuous conductive component strip, positioning holes can be formed on the continuous strip to form the final continuous conductive component strip. In subsequent process steps, the continuous conductive component strip can be positioned by passing positioning pins through the positioning holes, and multiple continuous strips can be positioned simultaneously, avoiding the problem of low positioning efficiency caused by repeated positioning. When the continuous strip has multiple first conductive units, multiple positioning holes can be formed on the continuous strip; at least one positioning hole is formed on each first conductive unit.

[0195] Specifically, the positioning holes can be formed on the continuous strip by stamping or by other methods.

[0196] Accordingly, step S110 includes the following steps: S111A, connecting the plurality of focusing coil branches 610 and the plurality of focusing sensing branches 620 together with auxiliary materials to form a continuous strip; S112A, forming positioning holes on the continuous strip.

[0197] In step S120, a first injection molding is performed around the plurality of coil branches and the plurality of sensing branches to form a first injection-molded portion. Specifically, a first injection molding is performed around the plurality of focusing coil branches 610 and the plurality of focusing sensing branches 620 to form the first injection-molded portion. More specifically, the first injection molding is performed around the plurality of focusing coil branches 610 and the plurality of focusing sensing branches 620 such that the injection molding material covers at least a portion of the plurality of focusing coil branches 610 and the plurality of focusing sensing branches 620, forming at least one injection-molded block at the plurality of focusing coil branches 610 and the plurality of focusing sensing branches 620, thereby forming a part of the image stabilization frame 30. Accordingly, the first injection-molded portion includes the first injection-molded block.

[0198] It is worth mentioning that during the first injection molding process surrounding the plurality of focusing coil branches 610 and the plurality of focusing sensing branches 620, two ends of each focusing coil branch 610 and two ends of each focusing sensing branch 620 are exposed on the outer surface of the first injection-molded part to facilitate subsequent contact and electrical connection with the focusing coil 41 and the focusing position sensing element 42. The two ends of the focusing coil branch 610 are respectively a first lead end and a second lead end. The two ends of the focusing sensing branch 620 are respectively a first conductive end and a second conductive end. After forming the first injection-molded part, it is necessary to separate the second conductive end from the auxiliary material, that is, to separate the connecting part connected to the second conductive end from the second conductive end, so that the second conductive end is in a free state.

[0199] In step S130, the coil and the position sensing element are mounted on the first injection molding part. Specifically, the focusing coil 41 and the focusing position sensing element 42 are mounted on the first injection molding part. More specifically, the focusing coil 41 and the focusing position sensing element 42 are horizontally mounted on the first injection molding block, and the focusing coil 41 and the focusing position sensing element 42 can be welded to the corresponding focusing coil branch 610 and the focusing sensing branch 620, respectively, so that the focusing coil 41 and the focusing position sensing element 42 are electrically connected to the focusing coil branch 610 and the focusing sensing branch 620, respectively. In this example, the focusing coil 41 is welded to the first focusing coil branch 611 and the second focusing coil branch 612 respectively by welding, and the focusing position sensing element 42 is welded to the first focusing sensing branch 613, the second focusing sensing branch 614, the third focusing sensing branch 615 and the fourth focusing sensing branch 616 respectively by welding.

[0200] The focus sensing branch 620 can be bent, so that the focus sensing branch 620 changes from the flat state to the bent state. The focus sensing branch changes from each part being in the same plane to at least two adjacent parts of the focus sensing branch being in planes that form an angle.

[0201] Accordingly, at least a portion of the first focus sensing branch 613 extends from the subsequently formed third frame sidewall 33 in the second direction Y toward the direction close to the fourth frame sidewall 34, and at least a portion extends upward in the optical axis direction Z. The second focus sensing branch 614 extends from the third frame sidewall 33 to the subsequently formed fourth frame sidewall 34. At least a portion of the third focus sensing branch 615 extends from the subsequently formed third frame sidewall 33 in the second direction Y toward the direction close to the second frame sidewall 32. The fourth focus sensing branch 616 extends from the subsequently formed third frame sidewall 33 to the subsequently formed second frame sidewall 32.

[0202] In step S140, a second injection molding is performed around the first injection molding portion to form a second injection molding portion. Specifically, during the first injection molding in step S120 around the plurality of focusing coil branches 610 and the plurality of focusing sensing branches 620, the continuous strip of the conductive component needs to be positioned and fixed through the positioning holes to prevent deformation and displacement of the focusing coil branches 610 and the focusing sensing branches 620. After the first injection molding portion is formed, positioning marks exist on the surface of the first injection molding portion. During the second injection molding process around the first injection molding portion, the second injection molding portion covers the first injection molding portion, which can cover the positioning marks and form a flat surface, so that the finally formed image stabilization frame 30 has a flat surface. During the second injection molding process around the first injection molding portion, the injection molding material can also cover the focusing coil 41 and the focusing position sensing element 42, forming a groove around the focusing coil 41 and the focusing position sensing element 42 to accommodate the focusing coil 41 and the focusing position sensing element 42. A portion of the surface of the second injection molding part forms the sidewall of the groove.

[0203] The image stabilization frame 30 is formed after the second injection molding, and the plurality of focusing coil branches 610 and the plurality of focusing sensing branches 620 are embedded in the frame sidewall of the image stabilization frame 30.

[0204] In another example of this application, the base 11 is injection molded using the injection molding method for the conductive component. In step S110, a continuous strip of the conductive component is formed. Specifically, the continuous strip of the conductive component includes a plurality of unidirectional anti-shake coil branches 621, a plurality of bidirectional anti-shake coil branches 622, a plurality of unidirectional anti-shake sensing branches 623, a plurality of bidirectional anti-shake sensing branches 624, and a plurality of conductive guide portions 64. More specifically, the plurality of unidirectional anti-shake coil branches 621, the plurality of bidirectional anti-shake coil branches 622, the plurality of unidirectional anti-shake sensing branches 623, the plurality of bidirectional anti-shake sensing branches 624, and the plurality of conductive guide portions 64 are interconnected by auxiliary materials to form a continuous strip. The plurality of unidirectional image stabilization coil branches 621 include two unidirectional image stabilization coil branches 621; the plurality of bidirectional image stabilization coil branches 622 include two bidirectional image stabilization coil branches 622; the plurality of unidirectional image stabilization sensing branches 623 include at least four unidirectional image stabilization sensing branches 623; the plurality of bidirectional image stabilization sensing branches 624 include at least four bidirectional image stabilization sensing branches 624; the plurality of conductive guide portions 64 include a first conductive guide portion 641, a second conductive guide portion 642, a third conductive guide portion 643, and a fourth conductive guide portion 644.

[0205] In this example, the plurality of unidirectional stabilization coil branches 621, the plurality of bidirectional stabilization coil branches 622, the plurality of unidirectional stabilization sensing branches 623, the plurality of bidirectional stabilization sensing branches 624, and the plurality of conductive guide portions 64 required for a single base 11 are defined as a second conductive unit.

[0206] All the unidirectional stabilization coil branches 621, all the bidirectional stabilization coil branches 622, all the unidirectional stabilization sensing branches 623, all the bidirectional stabilization sensing branches 624, and all the conductive guide portions 64 of the continuous strip can be the plurality of unidirectional stabilization coil branches 621, the plurality of bidirectional stabilization coil branches 622, the plurality of unidirectional stabilization sensing branches 623, the plurality of bidirectional stabilization sensing branches 624, and the plurality of conductive guide portions 64 required to form a single base 11. Thus, the continuous strip ultimately forms a second conductive unit.

[0207] All the unidirectional anti-shake coil branches 621, all the bidirectional anti-shake coil branches 622, all the unidirectional anti-shake sensing branches 623, all the bidirectional anti-shake sensing branches 624, and all the conductive guide portions 64 of the continuous strip can also be the plurality of unidirectional anti-shake coil branches 621, the plurality of bidirectional anti-shake coil branches 622, the plurality of unidirectional anti-shake sensing branches 623, the plurality of bidirectional anti-shake sensing branches 624, and the plurality of conductive guide portions 64 required to form a plurality of the bases 11. For example, some of the plurality of unidirectional anti-shake coil branches 621, some of the plurality of bidirectional anti-shake coil branches 622, some of the plurality of unidirectional anti-shake sensing branches 623, some of the plurality of bidirectional anti-shake sensing branches 624, and some of the plurality of conductive guide portions 64 are... The plurality of unidirectional stabilization coil branches 621, the plurality of bidirectional stabilization coil branches 622, the plurality of unidirectional stabilization sensing branches 623, the plurality of bidirectional stabilization sensing branches 624, and the plurality of conductive guide portions 64 required to form one of the bases 11; and some of the plurality of unidirectional stabilization coil branches 621, some of the plurality of bidirectional stabilization coil branches 622, some of the plurality of unidirectional stabilization sensing branches 623, some of the plurality of bidirectional stabilization sensing branches 624, and some of the plurality of conductive guide portions 64 are the plurality of unidirectional stabilization coil branches 621, the plurality of bidirectional stabilization coil branches 622, the plurality of unidirectional stabilization sensing branches 623, the plurality of bidirectional stabilization sensing branches 624, and the plurality of conductive guide portions 64 required to form another base 11. Thus, the continuous strip can be used to batch form a plurality of the second conductive units.

[0208] Accordingly, the continuous strip of the conductive component includes at least one of the second conductive units.

[0209] During the formation of the continuous conductive component strip, positioning holes can be formed on the continuous strip to form the final continuous conductive component strip. In subsequent process steps, the continuous conductive component strip can be positioned by passing positioning pins through the positioning holes, and multiple continuous strips can be positioned simultaneously, avoiding the problem of low positioning efficiency caused by repeated positioning. When the continuous strip has multiple second conductive units, multiple positioning holes can be formed on the continuous strip; at least one positioning hole is formed on each second conductive unit.

[0210] Specifically, the positioning holes can be formed on the continuous strip by stamping or by other methods.

[0211] Accordingly, step S110 includes the following steps: S111B, connecting the plurality of unidirectional image stabilization coil branches 621, the plurality of bidirectional image stabilization coil branches 622, the plurality of unidirectional image stabilization sensing branches 623, the plurality of bidirectional image stabilization sensing branches 624 and the plurality of conductive guiding portions 64 together with auxiliary materials to form a continuous strip; S112B, forming positioning holes on the continuous strip.

[0212] In step S120, a first injection molding is performed around the plurality of coil branches and the plurality of sensing branches to form a first injection molded part. Specifically, a first injection molding is performed around the plurality of unidirectional image stabilization coil branches 621, the plurality of bidirectional image stabilization coil branches 622, the plurality of unidirectional image stabilization sensing branches 623, and the plurality of bidirectional image stabilization sensing branches 624 to form the first injection molded part. More specifically, a first injection molding process is performed around the plurality of unidirectional image stabilization coil branches 621, the plurality of bidirectional image stabilization coil branches 622, the plurality of unidirectional image stabilization sensing branches 623, and the plurality of bidirectional image stabilization sensing branches 624, such that the injection molding material at least partially covers the plurality of unidirectional image stabilization coil branches 621, the plurality of bidirectional image stabilization coil branches 622, the plurality of unidirectional image stabilization sensing branches 623, and the plurality of bidirectional image stabilization sensing branches 624. A second injection molding block is formed at the plurality of unidirectional image stabilization coil branches 621 and the plurality of unidirectional image stabilization sensing branches 623, and a third injection molding block is formed at the plurality of bidirectional image stabilization coil branches 622 and the plurality of bidirectional image stabilization sensing branches 624, thereby forming a part of the base 11. Correspondingly, the first injection molding portion includes the second injection molding block and the third injection molding block. After the first injection molding, the second injection molding block and the third injection molding block are in a flat state, that is, flat on the same plane.

[0213] It is worth mentioning that during the first injection molding process surrounding the plurality of unidirectional image stabilization coil branches 621, the plurality of bidirectional image stabilization coil branches 622, the plurality of unidirectional image stabilization sensing branches 623, and the plurality of bidirectional image stabilization sensing branches 624, two ends of each unidirectional image stabilization coil branch 621, two ends of each bidirectional image stabilization coil branch 622, two ends of each unidirectional image stabilization sensing branch 623, two ends of each bidirectional image stabilization sensing branch 624, and two ends of each conductive guide portion 64 are exposed on the outer surface of the first injection molding part to facilitate subsequent electrical connection with the first image stabilization coil 511, the second image stabilization coil 521, the first image stabilization position sensing element 512, and the second image stabilization position sensing element 522.

[0214] In step S130, the coil and the position sensing element are installed in the first injection molding part. Specifically, the first anti-shake coil 511, the second anti-shake coil 521, the first anti-shake position sensing element 512, and the second anti-shake position sensing element 522 are installed in the first injection molding part. More specifically, the first image stabilization coil 511 and the first image stabilization position sensing element 512 are mounted on the second injection molding block; the second image stabilization coil 521 and the second image stabilization position sensing element 522 are mounted on the third injection molding block. The first image stabilization coil 511, the first image stabilization position sensing element 512, the second image stabilization coil 521, and the second image stabilization position sensing element 522 are respectively welded to the corresponding plurality of unidirectional image stabilization coil branches 621, the plurality of unidirectional image stabilization sensing branches 623, the plurality of bidirectional image stabilization coil branches 622, and the plurality of bidirectional image stabilization sensing branches 624, so that the first image stabilization coil 511, the first image stabilization position sensing element 512, the second image stabilization coil 521, and the second image stabilization position sensing element 522 are electrically connected to the plurality of unidirectional image stabilization coil branches 621, the plurality of unidirectional image stabilization sensing branches 623, the plurality of bidirectional image stabilization coil branches 622, and the plurality of bidirectional image stabilization sensing branches 624. In this example, the first image stabilization coil 511 is soldered to the two unidirectional image stabilization coil branches 621 respectively; the first image stabilization position sensing element 512 is soldered to the at least four unidirectional image stabilization sensing branches 623 respectively; the second image stabilization coil 521 is soldered to the two bidirectional image stabilization coil branches 622 respectively; and the second image stabilization position sensing element 522 is soldered to the at least four bidirectional image stabilization sensing branches 624 respectively.

[0215] The unidirectional image stabilization sensing branch 623 and the bidirectional image stabilization sensing branch 624 can be bent, causing the second and third injection molded blocks to change from a flat state to a bent state. Adjacent second and third injection molded blocks change from being on the same plane to forming an angle between the planes of the second and third injection molded blocks. Accordingly, the two unidirectional image stabilization coil branches 621 and the at least four unidirectional image stabilization sensing branches 623 are located on the subsequently formed first base sidewall 1121. The two bidirectional image stabilization coil branches 622 and the at least four bidirectional image stabilization sensing branches 624 are located on the subsequently formed second base sidewall 1122.

[0216] The first conductive guide portion 641 extends at least partially from the subsequently formed fourth base sidewall 1124, first downward along the optical axis direction Z, to the subsequently formed bottom wall 111, and then extends to the subsequently formed first base sidewall 1121. The second conductive guide portion 642 extends at least partially from the subsequently formed fourth base sidewall 1124, first downward along the optical axis direction Z, to the subsequently formed bottom wall 111, and then extends to the subsequently formed first base sidewall 1121. The third conductive guide portion 643 is located on the subsequently formed second base sidewall 1122. The fourth conductive guide portion 644 extends at least partially from the subsequently formed second base sidewall 1122, first downward along the optical axis direction Z, to the subsequently formed bottom wall 111, and then extends to the subsequently formed first base sidewall 1121.

[0217] In step S140, a second injection molding is performed around the first injection molding portion to form a second injection molding portion. Specifically, during the first injection molding in step S120 around the plurality of unidirectional anti-shake coil branches 621, the plurality of bidirectional anti-shake coil branches 622, the plurality of unidirectional anti-shake sensing branches 623, and the plurality of bidirectional anti-shake sensing branches 624, the continuous strip of the conductive component needs to be positioned and fixed through the positioning holes. After the first injection molding portion is formed, positioning marks are present on the surface of the first injection molding portion. During the second injection molding process around the first injection molding portion, the second injection molding portion covers the first injection molding portion, which can cover the positioning marks and form a flat surface, so that the final molded base 11 has a flat surface. During the second injection molding process around the first injection portion, the injection molding material may also cover the first anti-shake coil 511, the second anti-shake coil 521, the first anti-shake position sensing element 512, and the second anti-shake position sensing element 522, forming a groove around them to accommodate the first anti-shake coil 511, the second anti-shake coil 521, the first anti-shake position sensing element 512, and the second anti-shake position sensing element 522. A portion of the surface of the second injection portion forms the sidewall of the groove.

[0218] After the second injection molding, the base 11 is formed, and the plurality of unidirectional anti-shake coil branches 621, the plurality of bidirectional anti-shake coil branches 622, the plurality of unidirectional anti-shake sensing branches 623, the plurality of bidirectional anti-shake sensing branches 624 and the plurality of conductive guiding parts 64 are embedded in the base side wall 112 of the base 11.

[0219] Indicative camera module 1

[0220] According to the driving device 100 described in this application, this application proposes a camera module 1. The camera module 1 includes an optical lens 200, a driving device 100, and a photosensitive component 300. The driving device 100 is mounted on the photosensitive component 300. The optical lens 200 is mounted on the driving device 100 and is located on the light-sensing path of the photosensitive component 300.

[0221] The driving device 100 is used to drive the entire optical lens 200 to achieve autofocus and optical image stabilization.

[0222] The photosensitive component 300 includes a circuit board, a photosensitive chip, and at least one electronic component. The photosensitive surface of the photosensitive chip faces the optical lens 200 to receive light emitted from the optical lens 200. In one specific example, the photosensitive chip is fixed to the side of the circuit board facing the optical lens 200. The at least one electronic component can be implemented as a passive electronic device such as a capacitor or resistor, or an active electronic device such as a diode or a memory chip, and the at least one electronic component can be disposed on the side of the circuit board facing the optical lens 200. In one specific example, the photosensitive chip is electrically connected to the circuit board via at least one lead.

[0223] In some examples of this application, the camera module 1 further includes a filter assembly disposed on the optical path of the photosensitive component 300, so that the camera module 1 can filter out unwanted stray light (e.g., infrared light) through the filter assembly. For example, the filter assembly is disposed between the optical lens 200 and the photosensitive component 300. In a specific example, the filter assembly includes a bracket and a filter element. The bracket is supported on the photosensitive component 300, and the filter element is fixed on the bracket.

[0224] In summary, the manufacturing method of the driving device 100 and its image stabilization frame 30, and the camera module 1 according to the embodiments of this application have been explained. At least a portion of the conductive component 60 of the driving device 100 is embedded in the image stabilization carrier and the base 11, which can protect the conductive component 60 and prevent the conductive component 60 from being broken or short-circuited due to the movement of the image stabilization carrier.

[0225] Those skilled in the art should understand that the embodiments of the present invention described above and shown in the accompanying drawings are merely examples and do not limit the present invention. The objectives of the present invention have been fully and effectively achieved. The functions and structural principles of the present invention have been demonstrated and explained in the embodiments, and any variations or modifications may be made to the implementation of the present invention without departing from the stated principles.

Claims

1. A drive device characterized by comprising: The application relates to a driving device for an optical lens, comprising: a base, comprising a base sidewall, wherein a first conductive assembly is arranged in the base sidewall; a shakeproof frame movably accommodated in the base; a focusing carrier movably accommodated in the shakeproof frame, the focusing carrier being used for carrying an optical lens, the optical lens defining an optical axis and an optical axis direction; at least three coils, at least two of the at least three coils being arranged in the base sidewall, and the at least two coils being electrically connected with the first conductive assembly.

2. The drive apparatus according to claim 1, characterized by The first conductive assembly is bent and extended in the base sidewall, and a part of the first conductive assembly is exposed outside the base sidewall to form a conductive pin, so as to realize conduction with an external circuit.

3. The drive apparatus according to claim 2, characterized by The at least three coils comprise a focusing coil, a first shakeproof coil and a second shakeproof coil, the base sidewall comprises a first base sidewall, a second base sidewall, a third base sidewall and a fourth base sidewall, wherein the first shakeproof coil is arranged in the first base sidewall, the second shakeproof coil is arranged in the second base sidewall, and the first shakeproof coil and the second shakeproof coil are electrically connected with the first conductive assembly.

4. The drive apparatus according to claim 3, characterized by The focusing coil is arranged in the third base sidewall and located at the adjacent side of the first shakeproof coil and the second shakeproof coil, and the focusing coil is electrically connected with the first conductive assembly.

5. The drive apparatus according to claim 3, characterized by The shakeproof frame comprises four frame sidewalls, a second conductive assembly is arranged in the four frame sidewalls, the second conductive assembly is bent and extended in the frame sidewalls, and the focusing coil is arranged in the four frame sidewalls and electrically connected with the second conductive assembly.

6. The drive apparatus according to claim 5, characterized by Further comprising an external conductive assembly, the external conductive assembly is located between the base sidewall and the frame sidewall, and the external conductive assembly is electrically connected between the first conductive assembly and the second conductive assembly.

7. The drive apparatus according to claim 6, characterized by Further comprising a focusing position sensing element, the focusing position sensing element is arranged on the same side of the focusing coil; the second conductive assembly comprises at least four focusing sensing branches and at least two focusing coil branches, the at least two focusing coil branches are electrically connected with the focusing coil, and the at least four focusing sensing branches are electrically connected with the focusing position sensing element and the external conductive assembly.

8. The drive apparatus according to claim 7, characterized by The shakeproof frame comprises four frame corners located between the four frame sidewalls, the external conductive assembly comprises four conductive spring sheets, the four conductive spring sheets are arranged in the four frame corners respectively, the at least four focusing sensing branches are bent and extended in the frame sidewalls in a horizontal direction and in a height direction, so that the at least four focusing sensing branches are electrically connected with the four conductive spring sheets respectively.

9. An image capture module, comprising: The application relates to a driving device for an optical lens, comprising: the driving device as claimed in any one of claims 1 to 8; an optical lens; a photosensitive assembly, wherein the optical lens is arranged on a photosensitive path of the photosensitive assembly.

10. A method of injection molding an electrically conductive assembly, the method comprising: The application relates to a driving device for an optical lens, comprising: S110, a conductive assembly continuous strip is formed, wherein the conductive assembly continuous strip comprises a plurality of coil branches, a plurality of sensing branches and a plurality of connecting parts connected between the coil branches and the sensing branches. S120, first injection molding is performed around the plurality of coil branches and the plurality of sensing branches to form a first injection molding part; S130, the coil and the position sensing element are installed on the first injection molding part, wherein the coil and the position sensing element are electrically connected with the coil branch and the sensing branch respectively; and S140, second injection molding is performed around the first injection molding part to form a second injection molding part, wherein the second injection molding part covers the first injection molding part.

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