Integrated forming die for three-clamping-petal bracket

Abstract

The invention discloses an integrated forming die for a three-clamping-petal bracket, and relates to the technical field of ammunition support forming dies. The mold comprises an upper mold body, a lower mold body and a clamping petal co-connection forming assembly arranged between the upper mold body and the lower mold body. The clamping petal co-connection forming assembly comprises three mounting cavities formed in the lower die, three press-fitting cores, a connecting piece used for being bonded with the three clamping petals to enable the three clamping petals to form an integrated structure, and a connecting cavity formed in the lower die and communicating with the three mounting cavities. The timed pushing structure is used for pushing the connecting piece upwards to abut against the bottom of the clamping petal in the cooling stage, and weak connection between the connecting piece and the clamping petal is achieved; the three clamping petals formed in the same batch are connected into an integrated structure through the connecting pieces, it is guaranteed that a worker can take the three clamping petals formed in the same batch, the difference of the clamping petals in different batches due to fluctuation of technological parameters is avoided, and the risk that the clamping petals are staggered in the subsequent injection molding procedure is reduced.

Description

Technical Field

[0001] This invention relates to the field of cartridge molding mold technology, and in particular to an integrated molding mold for a typical cartridge with a three-slot bracket structure. Background Technology

[0002] The sabot is a key component of a discarding sabot armor-piercing projectile. Currently, most sabots are divided into three or four segments along their longitudinal axis, which can hold the projectile body tightly, enabling it to obtain the best initial velocity, support and guide its flight, and after leaving the barrel, the sabot separates from the projectile body.

[0003] Currently, the production of spring clips mainly adopts compression molding technology. For example, patent CN216658972U discloses a compression mold for forming composite material spring clip grooves, including a lower mold, an upper mold, and a pre-compression module. The lower mold forming block has three lower mold forming cavities with a forming angle of 120°. This compression mold can form three 120° composite material spring clip grooves at one time, and then the three spring clip grooves are combined into a complete spring clip groove, which greatly improves production efficiency. Patent CN220429109U discloses a compression mold with an ejection mechanism. By setting the cooperation between the upper mold, the lower mold, and the mold ejection rod, the automatic demolding of the mold and the automatic ejection of the composite material product are realized, which solves the problem that the spring clip groove forming piece is prone to warping and deformation during demolding, causing demolding difficulties.

[0004] However, the aforementioned existing technologies still have the following shortcomings: While existing sabot molding dies can form multiple sabot segments at once, each segment remains independent after molding. In mass production, after molding, the segments are typically stacked with segments from other batches before proceeding to the next process, where three segments are randomly selected to assemble the sabot. Because different batches of sabots can vary slightly during their molding process due to minor fluctuations in resin content, fiber distribution, and process parameters, the assembled sabot may suffer from mismatched segment sizes or properties, affecting overall performance. Specifically, when three segments from different batches are combined, the fitting precision and mechanical properties between the segments are difficult to guarantee, thus impacting the sabot's ejection uniformity and the projectile's flight stability.

[0005] Furthermore, during the subsequent injection molding process, when positioning and assembling the card flaps, slight dimensional differences between different batches of card flaps can easily lead to card flap misalignment, affecting the overall quality and performance of the sabot.

[0006] Therefore, how to ensure that the three clips that make up the same sabot are formed from the same batch and that the dimensions and performance of the three clips are highly consistent is a technical problem that needs to be solved in this field. Summary of the Invention

[0007] To address the shortcomings of existing technologies, this invention provides a three-piece integrated molding mold for a spring clip. By molding the three pieces simultaneously in one mold and connecting them into a single structure using connectors, it ensures that workers can retrieve the three pieces molded in the same batch, reducing the risk of misalignment of the pieces during positioning and assembly in subsequent injection molding processes.

[0008] To achieve the above objectives, the present invention provides the following technical solution: A three-piece integrated molding die for a spring clip includes: an upper die; and a lower die. A card-shaped joint forming assembly, disposed between the upper mold and the lower mold, includes: Three mounting cavities are provided in the lower mold for forming three clips; Three press-fitting cores are provided on the upper mold and correspond one-to-one with the three mounting cavities; A connector is used to bond to the three card flaps during the card flap forming process so that the three card flaps form an integral structure; A connecting cavity is provided in the lower mold and communicates with the three mounting cavities, for placing the connector and making the connector contact the three snap-fit ​​pieces.

[0009] Preferably, the connecting cavity is connected to the bottom of the mounting cavity and is located on the axis of symmetry of the mounting cavity.

[0010] Preferably, the connector has a thin-walled structure.

[0011] Preferably, it further includes a timed pushing structure, which is located below the lower mold and acts longitudinally on the connector, for pushing the connector upward during the cooling stage to abut against the bottom of the three card segments, so as to achieve a weak connection between the connector and the three card segments.

[0012] Preferably, a movable cavity extends downward below the connecting cavity to allow the connector to move longitudinally.

[0013] Preferably, the timing push structure includes a cylinder and a push frame connected to the cylinder. The push frame has push rods corresponding to the bottom of the three mounting cavities, and the push rods can move through the lower mold.

[0014] Preferably, it also includes a pressure block, which is detachably fitted into the connecting cavity, and is used to press against the upper end of the connecting member when the connecting member abuts against the bottom of the card flap, so as to prevent the connecting member from deforming.

[0015] Preferably, there are two pressure blocks, which are respectively embedded between two sets of adjacent mounting cavities into the connecting cavity, and the bottom end of the pressure block is coplanar with the bottom of the mounting cavity.

[0016] Preferably, a temperature sensor is also installed inside the lower mold. The temperature sensor is electrically connected to the cylinder and is used to start the cylinder when the temperature inside the mold reaches a set temperature.

[0017] Preferably, an installation mold is detachably installed within the installation cavity, and an installation groove is formed on the installation mold for installing multiple spring pieces that make up the snap-fit. It also includes a positioning assembly to ensure accurate assembly of the upper mold and the lower mold. The positioning assembly has multiple sets distributed at the corners of the mold, each set including a positioning hole and a positioning post for insertion and mating. The positioning hole is located in the center of the boss of the upper mold, and the positioning post protrudes from the center of the cavity of the lower mold, with the boss and cavity fitting together.

[0018] Compared with the prior art, the beneficial effects of the present invention are: (1) By setting up a card-slot co-molding component, the present invention simultaneously molds three card slots in three mounting cavities, and places connecting parts in the connecting cavities so that the connecting parts are bonded to the three card slots during the card slot molding process to form an integrated structure. This ensures that the workers can obtain 100% of the three card slots molded in the same batch, avoiding the differences between different batches of card slots due to slight fluctuations in resin content, fiber distribution and process parameters, and reducing the risk of card slot misalignment during positioning and assembly in the subsequent injection molding process.

[0019] (2) By setting the connecting cavity on the axis of symmetry of the mounting cavity and connecting it to the bottom, the connecting parts are connected at symmetrical positions on the outer peripheral walls of the three card segments, ensuring that the stress generated during the card segment forming process is evenly distributed and avoiding affecting the use of the finished product.

[0020] (3) By setting a timed push structure, the connector is pushed to abut against the bottom of the card piece during the cooling stage. The residual heat is used to achieve the melting and bonding of only the surface layer of the connector and the card piece, forming a weak connection, which facilitates the subsequent complete removal of the connector.

[0021] (4) By setting up a pressure block and a timed push structure to cooperate, a balanced resistance is formed at the upper and lower ends of the connector, so as to prevent the connector from bending and deforming upward during the heating and cooling process, and to ensure that the stress distribution of the card is not affected.

[0022] (5) By setting a temperature sensor connected to the cylinder electrical signal, precise control is achieved, ensuring that the cylinder pushes the connecting piece only when the set temperature is reached during the cooling stage, thus ensuring that the connecting piece and the card plate form a stable weak connection.

[0023] (6) By setting a detachable installation mold, the formed card piece can be separated from the installation cavity through the installation mold, making it easy to remove the formed card piece; by setting a positioning component, the upper mold and the lower mold are accurately assembled, ensuring the quality of card piece forming. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure in Example 1 where the three springs are formed into a single unit through connecting parts; Figure 2 This is a schematic diagram of the disassembled structure of the molding die in Example 1; Figure 3 This is a schematic diagram of the internal structure of the card flap and the connector when they are engaged in Example 1; Figure 4 This is a schematic diagram of the connecting strip and pressure block that cooperate with each other in Example 1; Figure 5 This is a schematic diagram of the structure of the spring clip and mounting mold used in Example 1. Figure 6 This is a partial internal structure diagram of the card flap and connector in Example 2.

[0025] Figure label: 01, 011, 10, 20, 30, 30, 40, 50, 50, 60, 70, 80, 80, 80, 90, 10, 20, 10, 20, 31, 32, 33, 34, 35, 36, 36, 36, 36, 41, 41, 42, 42, 61, 62, 63, 64, 71, 72, 71, 72, 71, 72, 90, 10, 11, 12, 12, 13, 14, 15, 16, 16, 17, 18, 19, 10 ... Detailed Implementation

[0026] Example 1: This embodiment is mainly used for producing the card segment 01 that makes up the cartridge tray. In existing mass production, after the card segment 01 is formed and taken out, it is usually stacked together with card segments from other batches before entering the next process. Three card segments are randomly taken out from the stacked card segments to form the cartridge tray. However, these three different batches of card segments are prone to differences in resin content, fiber distribution and process parameters during their respective molding processes. This can lead to the overall performance of the cartridge tray being affected by the mismatch in card segment size or performance after assembly.

[0027] Therefore, this embodiment provides a three-piece integrated molding mold for a spring clip, which adopts a one-mold three-piece molding method, and further improves upon this method. Specifically, during the batch molding process of the three spring clips 01, a connector 33 that can be manually or automatically disconnected is added, so that under heating and pressurization conditions, the connector 33 can melt and adhere to the three spring clips 01 together. After cooling, the mold is removed, realizing the integrated structure of the three spring clips (e.g., Figure 1 As shown in the figure, this ensures that the worker can obtain all three card segments formed in the same batch, reducing the risk of card segment misalignment during positioning and assembly in subsequent injection molding processes.

[0028] Specifically, refer to Figure 2 , Figure 3 The integrated molding die includes an upper mold 10 designed as a male mold and a lower mold 20 designed as a female mold, and a snap-fit ​​molding assembly 30 is provided between the two.

[0029] refer to Figure 2 The card-lobe co-connecting molding assembly 30 is the core structural design of this mold, mainly used to achieve the integrated connection of the three card lobes, including: Three mounting cavities 31 are equally spaced at the center of the lower mold 20. Each cavity has a fan-shaped mounting groove 361 for mounting multiple elastic pieces 011 that form the snap-fit ​​segments to initially assemble them into the snap-fit ​​segment shape (e.g., ...). Figure 5 (as shown) Three press-fitting cores 32 are located at the center of the upper mold 10 and correspond one-to-one with the three mounting cavities 31. Their outer walls have multiple continuous toothed grooves so that when they are tightly pressed into the mounting cavities 31, they can form toothed grooves on the inner wall of the card flap for engaging with the spring core. The connector 33 is separable from the outer wall of the card flap and is used to melt and bond with the three card flaps during the card flap forming process; The connecting cavity 34 is located in the lower mold 20 and communicates with the three mounting cavities 31, and it passes through the upper end of the lower mold 20 so that the connector 33 can be inserted and removed together with the clip. Among them, you can refer to Figure 4 The connector 33 is a thin-walled structure, which can be easily removed in subsequent processes. Specifically, it can be rod-shaped or strip-shaped.

[0030] The connection principle between the three card segments and the connector 33 achieved by the above structure is as follows: The connector 33 is placed into the connecting cavity 34, and the spring piece that makes up the card flap is installed in the mounting groove 361. The upper mold 10 is closed, and then the card flap is formed by heating and pressing. During the forming process, the connector 33 contacts the outer end wall of the card flap, so that the two are bonded together during the melting and cooling process, thereby completing the integrated structure of the three card flaps.

[0031] Further, refer to Figure 3 The connecting cavity 34 communicates with the bottom of the mounting cavity 31 and is located on the axis of symmetry of the mounting cavity 31. This ensures that the connecting member 33, after connection, is positioned symmetrically on the outer peripheral walls of the three latches (e.g., Figure 1 As shown in the figure, this ensures that the stress generated during the card flap forming process is evenly distributed, so as to avoid affecting the use of the finished product.

[0032] To ensure a more thorough breakage between the connector 33 and the three card segments during the subsequent removal process, it is preferable to make the connection between the connector 33 and the three card segments a weak connection during the molding process. Therefore, this embodiment also incorporates a timed pushing structure 40 (e.g., Figure 2 (As shown), further reference Figure 3 It is positioned below the lower mold 20 and acts longitudinally on the connector 33. During the cooling stage of this mold, the connector 33 can be pushed upward to abut against the bottom of the three clips, and the residual heat can be used to achieve surface melting and bonding between the two. Correspondingly, a movable cavity 35 that allows the connector 33 to move longitudinally is formed below the connecting cavity 34.

[0033] Specifically, refer to Figure 3 The timed pushing structure 40 includes a cylinder 41 and a pushing frame 42 connected thereto. The pushing frame 42 has a pushing rod 421 corresponding to the bottom of the three mounting cavities 361, so that the connecting piece 33 can mainly form three force points and bond with the forming point of the clip at these three force points, thereby facilitating subsequent removal. The pushing rod 421 can move through the lower mold 20 into the movable cavity 35.

[0034] To prevent the connector 33 from deforming during the bonding and cooling process, which would affect the stress distribution of the snap-fit, the connecting cavity 34 can also be detachably fitted with a pressure block 50, as shown in the reference. Figure 3 , Figure 4 There are two of them, which are respectively inserted into the connecting cavity 34 from between two sets of adjacent mounting cavities 31. At this time, the bottom end of the pressure block 50 is coplanar with the bottom of the mounting groove 361. Therefore, when the connector 33 abuts against the bottom of the card flap, the bottom ends of the two pressure blocks 50 abut horizontally against the upper end of the connector 33, and form a balanced resistance with the upward thrust provided by the timed pushing structure 40. Thus, the connector is prevented from bending and deforming upward during the heating and cooling process.

[0035] Further, refer to Figure 3 , Figure 4 The length of the bottom end of the pressure block 50 is the distance between the fan-shaped bottom points of two adjacent mounting slots 361. Therefore, the upper region of the connector 33 is either in contact with and adhered to the snap-fit ​​or in contact with and adhered to the pressure block 50, with no empty space, further preventing the connector 33 from bending and deforming upward.

[0036] Since the connecting piece 33 will also melt due to the high temperature and pressure inside the mold, in order to prevent it from sticking to the push rod 421 or the pressure block 50 after melting and cooling, making it difficult to separate, both the push rod 421 and the pressure block 50 are made of metal. This ensures that even if they are connected to the connecting piece 33, the connection is weak, and the strength of this connection is much weaker than that with the retaining clip. Therefore, when the cylinder 41 contracts and moves the push rod downward, it can be separated from the connecting piece 33; and the connecting piece 33 and the pressure block 50 can also be separated under a certain amount of manual force.

[0037] Preferably, a temperature sensor (not shown in the figure) is also installed inside the lower mold 20 to monitor the internal temperature of the mold in real time. It is also electrically connected to the cylinder 41, and the temperature sensor automatically activates only when the temperature inside the mold reaches the set maximum temperature. This temperature sensor enables precise control, ensuring that the cylinder 41 is activated only when the temperature is reached during the cooling phase, and further ensuring that the temperature at this point allows for a weak connection between the connecting piece 33 and the retaining flap.

[0038] The process of achieving a weak connection between connector 33 and the three card flaps using the above structure is as follows: The connector 33 is inserted through the connecting cavity 34 into the bottom of the movable cavity 35, and then the pressure block 50 is inserted in sequence to place the spring piece. At this time, there is a certain gap between the connector 33 and the bottom of the spring piece. Then, heat and pressure are applied to make the spring piece form a snap flap and then cool it. When the cooling temperature reaches the set temperature of the temperature sensor, the cylinder 41 is started and the pusher 42 pushes the connector 33 up to abut against the bottom of the snap flap. Then, the residual heat of cooling is used to make the connector 33, which is not fully shaped, and the snap flap achieve a weak connection with only the surface layer.

[0039] In this embodiment, as Figure 5 As shown, the mounting cavity 361 is formed in the mounting mold 36, and the mounting mold 36 is detachably installed in the mounting cavity 31 (see reference). Figure 2 This configuration allows the formed card flap to be disengaged from the mounting cavity 31 via the mounting mold 36, thus facilitating the removal of the formed card flap.

[0040] Further, refer to Figure 3 To facilitate the removal of the installation mold 36, detachable demolding clearance blocks 80 are provided on both sides of the installation cavity 31. The demolding clearance blocks 80 can be removed using locking screws, thereby freeing up space on both sides of the installation cavity 31, making it easier for workers to remove the installation mold 36.

[0041] To ensure the quality of the card flap forming, it is also necessary to ensure precise mold closing between the upper mold 10 and the lower mold 20. Therefore, refer to... Figure 2 A positioning component 60 and a mold closing protection component 70 are also provided between the upper mold 10 and the lower mold 20.

[0042] in: The positioning component 60 is used to ensure the accurate assembly of the upper mold 10 and the lower mold 20. It has four sets and is distributed at the four corners of the mold. Each set includes a positioning hole 61 and a positioning post 62 that are inserted and fitted. The positioning hole 61 is opened in the middle of the boss 63 of the upper mold 10, and the positioning post 62 protrudes in the middle of the cavity 64 of the lower mold 20. The boss 63 and the cavity 64 are fitted together to further ensure the accurate positioning of the two.

[0043] The mold closing guarantee component 70 is used to further guarantee the achievement of mold closing requirements, and it includes a lateral accuracy fine-tuning group 71 and a height fine-tuning group 72.

[0044] Specifically, the lateral precision fine-tuning group 71 is provided in four sets corresponding to the four cavities 64, including parallel side pads 711 provided on the two mutually perpendicular sidewalls of the cavity 64. By tightly fitting the two perpendicular sidewalls of the boss 63 with the parallel side pads 711 after mold closing, the gap that may exist when the boss 63 and the cavity 64 are originally fitted is eliminated, thereby ensuring the lateral relative precision of the upper mold 10 and the lower mold 20.

[0045] The height fine-tuning group 72 is provided with four groups corresponding to the four edges of the upper end of the upper mold 10, including the lower parallel pad 721. By precision grinding the upper surface of the lower parallel pad 721, the upper mold 10 and the lower parallel pad 721 are absolutely parallel when they come into contact and meet the preset mold closing gap, thereby ensuring that the height after mold closing meets the requirements.

[0046] Example 2: Based on Example 1, this embodiment adjusts the timing of inserting the connector 33, and therefore the corresponding structure is also adjusted accordingly, as follows.

[0047] refer to Figure 6 One side of the movable cavity 35 is extended outward to penetrate the side wall of the lower mold 20, and an insertion channel 90 is formed in the lower mold 20. Therefore, during the cooling stage after the card flap is formed, the connector 33 can be pushed into the movable cavity 35 from the relatively narrow insertion channel 90 with the help of a tool, and then pushed up by the timed pushing structure 40 until it contacts and adheres to the card flap.

[0048] The advantage of using the method of this embodiment to achieve bonding is that it can eliminate the influence of high temperature and high pressure on the connector 33 during the forming process of the card flap. The bonding between the two relies only on the residual heat of the card flap in its semi-molten state. Therefore, on the basis of achieving an integrated connection between the connector and the three card flaps, the connection strength between the two is further weakened, which is conducive to the complete removal of the connector 33 in the subsequent process.

[0049] The above description is merely a specific example of the present invention and does not constitute any limitation on the present invention. Obviously, those skilled in the art, after understanding the content and principles of the present invention, may make various modifications and changes in form and detail without departing from the principles and structure of the present invention; however, these modifications and changes based on the spirit of the present invention are still within the scope of protection of the claims of the present invention.

Claims

1. A three-piece integrated molding die for a breechblock, comprising: Upper mold (10); lower mold (20); characterized in that it further includes: a card-shaped joint forming assembly (30), disposed between the upper mold (10) and the lower mold (20), comprising: Three mounting cavities (31) are provided in the lower mold (20) for forming three card flaps (01); Three press-fitting cores (32) are provided on the upper mold (10) and are matched one-to-one with the three mounting cavities (31); A connector (33) is used to bond to the three card segments (01) during the forming process of the card segments (01) so that the three card segments (01) form an integral structure; A connecting cavity (34) is provided in the lower mold (20) and communicates with the three mounting cavities (31) for placing the connector (33) and making the connector (33) contact the three clips (01).

2. The three-piece integrated molding mold for the sabot according to claim 1, characterized in that, The connecting cavity (34) is connected to the bottom of the mounting cavity (31) and is located on the axis of symmetry of the mounting cavity (31).

3. The three-piece integrated molding mold for the sabot according to claim 1, characterized in that, The connector (33) has a thin-walled structure.

4. The three-piece integrated molding mold for the sabot according to any one of claims 1-3, characterized in that, It also includes a timed push structure (40), which is located below the lower mold (20) and acts longitudinally on the connector (33) to push the connector (33) upward during the cooling stage to abut against the bottom of the three card segments (01) so as to achieve a weak connection between the connector (33) and the three card segments (01).

5. The three-piece integrated molding mold for the sabot according to claim 4, characterized in that, The connecting cavity (34) extends downward to form a movable cavity (35), which allows the connector (33) to move longitudinally.

6. The three-piece integrated molding mold for the sabot according to claim 4, characterized in that, The timed push structure (40) includes a cylinder (41) and a push frame (42) connected to the cylinder (41). The push frame (42) has push rods (421) corresponding to the bottom of the three mounting cavities (31). The push rods (421) can move through the lower mold (20).

7. The three-piece integrated molding die for the sabot according to claim 6, characterized in that, It also includes a pressure block (50), which is detachably fitted into the connecting cavity (34) and used to press against the upper end of the connecting member (33) when the bottom of the connecting member (33) abuts against the card flap (01) to prevent the connecting member (33) from deforming.

8. The three-piece integrated molding mold for the sabot according to claim 7, characterized in that, Two pressure blocks (50) are provided, which are respectively inserted into the connecting cavity (34) from between two adjacent sets of mounting cavities (31), and the bottom end of the pressure block (50) is coplanar with the bottom of the mounting cavity (31).

9. The three-piece integrated molding mold for the sabot according to claim 6, characterized in that, A temperature sensor is also installed inside the lower mold (20). The temperature sensor is electrically connected to the cylinder (41) and is used to start the cylinder (41) when the temperature inside the mold reaches the set temperature.

10. The three-piece integrated molding mold for the sabot according to claim 1, characterized in that, An installation mold (36) is detachably installed inside the installation cavity (31). An installation groove (361) is formed on the installation mold (36). The installation groove (361) is used to install multiple spring pieces (011) that make up the card flap (01). It also includes a positioning component (60) to ensure accurate assembly of the upper mold (10) and the lower mold (20); the positioning component (60) is provided in multiple sets and distributed at the corners of the mold, each set including a positioning hole (61) and a positioning post (62) for insertion and matching, the positioning hole (61) is opened in the middle of the boss (63) of the upper mold (10), the positioning post (62) protrudes in the middle of the cavity (64) of the lower mold (20), and the boss (63) and the cavity (64) are fitted together.

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