Method for enabling optical fiber module interface radiator to closely fit indium heat-conducting sheet

Abstract

The invention provides a method for enabling an optical fiber module interface radiator to be closely attached to an indium heat-conducting sheet. The method comprises the steps that the surface of a nickel-plated layer of the interface radiator is polished to form a rough surface; preliminarily forming an indium heat-conducting sheet on the rough surface; then the workpiece is placed on a jig platform, and a mirror surface roller is arranged on the jig platform; providing a PET (Polyethylene Terephthalate) sheet which is positioned between the surface of the indium heat-conducting sheet and the mirror roller; the method comprises the following steps: pressing an indium heat-conducting sheet into a roller under the roller pressure of 40-110kgf, riveting the bottom of the indium heat-conducting sheet into a rough surface which is tightly combined with the interface radiator, so that a gap and air do not exist on the combined surface, and the top surface of the indium heat-conducting sheet is a flat smooth surface, is attached to the surface of the interface radiator and is tightly combined and molded into an indium heat-conducting thin layer; the surface of the indium heat conduction thin layer is coated with an anti-oxidation coating with the thickness of 1-5 microns; therefore, the indium heat-conducting material can be tightly adhered to the surface of the interface radiator without an adhesive, the interface radiator has excellent drawing resistance and friction resistance, and the influence of thermal resistance caused by air and the adhesive is reduced.

Description

Technical Field

[0001] This invention relates to a method for tightly bonding an indium thermally conductive sheet to an interface heat sink of an optical fiber module, and more particularly to a method for tightly bonding the indium thermally conductive sheet to the surface of the interface heat sink and for long-term oxidation resistance. Background Technology

[0002] With the continuous expansion of network communication system transmission capacity and speed, as well as the widespread application of AI application models such as ChatGPT, the demand for computing power is constantly increasing. This also places higher demands on high-speed interconnection within data centers, leading to a continuous increase in bandwidth and speed requirements. To meet these needs, the Octal Small Form Factor eXtra DensePluggable module (OSFP-XD) has emerged as a novel fiber optic module packaging form. It integrates the optical receiver and optical transmitter of the fiber optic communication process into a single module, enabling simultaneous message reception and transmission. It supports global communication network architecture upgrades to 1.6T, providing an ideal solution for next-generation data center construction. While this type of fiber optic module (or optical module) features high density and miniaturization, the increased density of optoelectronic components within the module also leads to increased power consumption. These factors can lead to increased heat generation inside the fiber optic module, resulting in very high operating temperatures. This can significantly reduce the performance of temperature-sensitive electro-optic / photoelectric conversion components and chips within the fiber optic module, and may even cause the entire fiber optic module to malfunction or fail.

[0003] like Figure 1 The diagram shows the appearance of an existing fiber optic module 10, which has an interface heat sink 11 on its surface. When the existing fiber optic module 10 is in use, it continuously receives and transmits signals, and the internal operation generates a lot of heat, which can cause high-temperature damage to the surrounding electronic components. Therefore, the interface heat sink 11 is necessary to dissipate heat.

[0004] like Figure 2A and Figure 2BThe diagram shows a schematic of an interface heat sink 11. The inner side of the interface heat sink 11 consists of heat dissipation fins 111, and the upper surface 112 is flat for easy insertion and removal from the connector. Currently, a common heat dissipation method involves attaching a metal heat-conducting sheet 13 to the upper surface 112 using adhesive tape 12. However, using adhesive tape 12 to attach the metal heat-conducting sheet 13 results in a poor surface adhesion, allowing air to seep in, and the adhesive itself introduces thermal resistance, thus failing to improve heat dissipation. Furthermore, the combination of the tape 12 and the metal heat-conducting sheet 13 creates a relatively thick, raised layer (t1). Consequently, after repeated insertions and removals of the fiber optic module 10, the metal heat-conducting sheet 13 is easily damaged by friction and pressure, thus reducing the lifespan of the fiber optic module 10.

[0005] In view of the above-mentioned problems, the present invention actively researches and improves the invention, with the main objective of resolving the aforementioned deficiencies. Summary of the Invention

[0006] The main objective of this invention is to provide a method for sealing an indium thermally conductive sheet onto the interface heat sink of an optical fiber module. This method allows the indium thermally conductive sheet to be sealed onto the surface of the interface heat sink without the need for adhesives. It has excellent pull-out resistance and abrasion resistance, is not easily damaged, can improve the service life of the optical fiber module, reduce the thermal resistance caused by air and adhesives, and solve the problem of easy oxidation of indium thermally conductive materials, thereby improving heat dissipation efficiency.

[0007] To achieve the above objectives, the present invention provides a method for sealing an indium thermally conductive sheet in an interface heat sink for an optical fiber module. The steps include: a) providing an interface heat sink for an optical fiber module, the surface of which has a nickel plating layer; b) polishing the surface of the nickel plating layer of the interface heat sink to form a rough surface; c) providing an indium thermally conductive sheet; d) initially forming the indium thermally conductive sheet into a thin sheet on the rough surface; e) placing the interface heat sink on a fixture platform, the fixture platform being provided with a mirror-finished roller; f) providing a PET sheet, which is positioned between the surface of the indium thermally conductive sheet and the mirror-finished roller; g) reciprocatingly pressing the indium thermally conductive sheet with the mirror-finished roller, the surface of which is mirror-polished, and the PET sheet serving as the contact medium between the roller and the indium thermally conductive sheet, thereby pressing the indium thermally conductive sheet with a roller pressure of 40-110 kgf to improve its sealing properties. Its surface smoothness; h) Extend and adhere the indium thermal conductive sheet to the rough surface of the interface heat sink, and use the mirror roller to press the indium thermal conductive sheet back and forth, so that the bottom of the indium thermal conductive sheet is riveted (bite) into the rough surface, tightly bonded to the upper surface of the interface heat sink, so that there are no gaps or air at the bonding surface, resulting in lower thermal resistance, and the top surface of the indium thermal conductive sheet is flat and smooth, attached to the upper surface of the interface heat sink, and tightly formed into an indium thermal conductive thin layer, and the thickness (t2) of the indium thermal conductive thin layer protruding from the upper surface of the interface heat sink is 0.02mm to 0.1mm; i) Remove the PET sheet, exposing the entire surface of the indium thermal conductive thin layer; j) Coat the surface of the indium thermal conductive thin layer with a 1 to 5μm anti-oxidation coating to prevent oxidation of the indium thermal conductive thin layer; k) Apply a protective film; l) Complete.

[0008] Based on the aforementioned features, in step c), the indium thermally conductive sheet may include a sheet-like body that has been die-cut into a predetermined shape and degreased.

[0009] As described above, the interface heat sink structure manufactured according to the above method includes: an interface heat sink having a nickel-plated layer on its surface, on which a rough surface is formed; an indium thermally conductive sheet, which is fitted to the rough surface to form a thin sheet on the rough surface, such that the indium thermally conductive sheet is pressed by a roller and its bottom is riveted (bitten) into the rough surface, tightly bonded to the upper surface of the interface heat sink, so that there are no gaps or air at the bonding surface, resulting in lower thermal resistance, and the top surface of the indium thermally conductive sheet is flat and smooth, attached to the upper surface of the interface heat sink, tightly formed into an indium thermally conductive thin layer, and the thickness (t2) of the indium thermally conductive thin layer protruding from the surface of the interface heat sink is 0.02 mm to 0.1 mm; and an anti-oxidation coating of 1 to 5 μm, coated on the surface of the indium thermally conductive thin layer.

[0010] Based on the aforementioned features, the interface heat sink includes inner heat dissipation fins and a flat upper surface for easy insertion and removal into the connector.

[0011] By employing the aforementioned technical means, the present invention has the following beneficial effects:

[0012] I. This invention utilizes indium thermal conductive material tightly bonded to the surface of the optical fiber interface heat sink. Its heat dissipation performance can replace that of traditional thermal conductive materials currently used in interface heat sinks. Furthermore, the indium thermal conductive sheet has excellent pull-out resistance and abrasion resistance, is not easily damaged, and can improve the service life of the optical fiber module.

[0013] Second, the present invention uses a special method to rivet and press the indium thermal conductive sheet tightly onto the interface heat sink, eliminating the need for adhesive to fix the thermal conductive sheet. Furthermore, the indium thermal conductive sheet has a certain degree of ductility and gap-filling ability, and can minimize surface thermal resistance, thereby improving heat dissipation capacity. After being pressed by rollers, it is tightly bonded to the surface of the interface heat sink, reducing the thermal resistance caused by air and adhesives, thus enhancing the heat dissipation effect.

[0014] Third, the present invention involves brushing / immersing an anti-oxidation coating on the surface of the indium thermal conductive material, which can solve the problem of indium oxidation. The coating thickness is 1-5 μm. This film thickness can reduce the thermal resistance of the metal sheet (the thermal resistance before and after coating application is 0.121℃ / W and 0.069℃ / W, respectively). Under an aging environment of 85℃ / 85%RH, the thermal resistance can be maintained for more than 30 days, which is equivalent to extending the shelf life from 6 months before treatment to more than 10 years under storage conditions (30℃ / 60%RH). This has the effect of extending the service life of the indium thermal conductive sheet. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the appearance of an existing optical fiber module.

[0016] Figure 2A An exploded view of a metal heat-conducting sheet attached to the interface heat sink of an existing fiber optic module.

[0017] Figure 2B This is an external view of a metal heat-conducting sheet attached to an optical fiber module, which is a prior art technology.

[0018] Figure 2C for Figure 2B An enlarged sectional view of the part indicated by 2C.

[0019] Figure 3 This is a flowchart of the method of the present invention.

[0020] Figure 4A This is an exploded perspective view of a preferred embodiment of the present invention, showing that the indium thermal conductive sheet is a sheet-like body.

[0021] Figure 4B This is a perspective view of a preferred embodiment of the present invention.

[0022] Figure 4C To display Figure 4B Enlarged sectional view of section 4C-4C.

[0023] Figure 5A An exploded view of the interface heat sink and fixture platform of the present invention is shown.

[0024] Figure 5B This is a schematic diagram showing the interface heat sink of the present invention placed on the fixture platform.

[0025] Figure 6A This is a schematic diagram illustrating the mirror roller pressing of the indium thermal conductive sheet of the present invention.

[0026] Figure 6B This is a schematic diagram showing the indium thermal conductive sheet of the present invention extended and riveted onto the rough surface of the interface heat sink.

[0027] Figure 7 This is a perspective view showing the appearance of the indium thermally conductive thin-film coated with fluorinated liquid protective coating of the present invention.

[0028] Figure 8 To display Figure 7 Enlarged sectional view of the part indicated by 8 in the middle.

[0029] Explanation of icon numbers:

[0030] 10-Fiber optic module; 11-Interface heat sink; 111-Heat sink fins; 112-Nickel plating layer; 113-Rough surface; 20-Indium thermal conductive sheet; 20a-Indium thermal conductive thin layer; 21-PET sheet; 30-Jig platform; 40-Mirror roller; 50-Antioxidant coating. Detailed Implementation

[0031] The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different embodiments, and various details in this specification can be modified and changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0032] first, Figure 3 Flowchart and accompanying Figures 4A to 8 As shown, the present invention provides a method for sealing an indium thermally conductive sheet in a fiber optic module interface heat sink, the implementation steps of which include:

[0033] a) Step S11: "Provide an interface heat sink 11 for an optical fiber module", such as Figures 4A-4B As shown; in this embodiment, the interface heat sink 11 includes an inner heat dissipation fin 111, the surface of which has a nickel plating layer 112, and the upper surface of which is flat to facilitate insertion and removal into the connection port.

[0034] b) Step S12: "Grind the nickel plating layer 112 of the interface heat sink 11 to form a rough surface 113". This step involves using sandpaper or a grinding machine to grind the area where the thermal conductive material is attached to the nickel plating layer 112 of the interface heat sink 11. The purpose is to increase the roughness of the area. The fine dents can increase the adhesion of the thermal conductive material when it is attached.

[0035] c) Step S13: "Provide an indium thermal conductive sheet 20", such as Figures 4A to 4C As shown, in this embodiment, the indium heat-conducting sheet 20 comprises a sheet-like body die-cut into a predetermined shape and degreased. This step involves immersing the indium heat-conducting sheet 20 in a degreasing solvent for approximately 10 minutes, removing excess solvent from the surface using a lint-free cloth, and then drying it in an oven. In this embodiment, the degreasing solvent used may include ethyl acetate, petroleum ether, etc., but is not limited to these.

[0036] d) Step S14: "Initially form the indium thermal conductive sheet 20 on the rough surface 113". Since indium metal has a thermal conductivity of 86 W / mK and is 4 times softer than lead, the ductility, gap-filling properties, and thermal conductivity of the indium thermal conductive sheet 20 make it an ideal compressible thermal interface material, minimizing surface thermal resistance and thus improving thermal conductivity. However, a crucial issue is how to securely attach the indium thermal conductive sheet 20 to the nickel plating layer 112 of the interface heat sink 11 without affecting the insertion and removal of the fiber optic module. Therefore, the main technical feature of this invention lies in overcoming this technical problem.

[0037] e) Step S15: "Place the interface heat sink 11 on a fixture platform 30, which is equipped with a mirror roller 40." Figures 5A-5B As shown, this step involves die-cutting the indium heat-conducting sheet 20 into a shape and size that matches the rough surface 113. In this embodiment, the indium heat-conducting sheet 20, in accordance with the shape of the interface heat sink 11, is a shape that is slightly narrower at the front and rear ends, but is not limited to this.

[0038] f) Step S16: "Provide a PET sheet 21 and place it between the surface of the indium heat-conducting sheet 20 and the mirror roller 40". In this embodiment, the material characteristic of the PET sheet 21 is that there is no adhesive on the surface, so it will not stick to the surface of the indium heat-conducting sheet 20. Its function is to assist the pressing process of the mirror roller 40 and improve the surface flatness of the indium heat-conducting sheet 20.

[0039] g) Step S17: "Pressing back and forth with the mirror roller 40", as shown Figure 6A and Figure 6BAs shown, this step involves mirror polishing the surface of the mirror roller 40 and using the PET sheet 21 as the contact medium between it and the indium heat-conducting sheet 20. The indium heat-conducting sheet 20 is then pressed by roller pressure of 40-110 kgf to improve its surface flatness. The roller pressure will vary depending on the shape of the fiber optic module 10.

[0040] h). Step S18: "Extend and adhere the indium thermally conductive sheet 20 to the rough surface 113 of the interface heat sink 11, forming an indium thermally conductive thin layer 20a." Figure 6A and Figure 6B As shown, the mirror roller 40 is used to repeatedly press the indium thermal conductive sheet 20, so that the bottom of the indium thermal conductive sheet 20 is riveted (bitten) into the rough surface 113 and tightly bonded to the upper surface of the interface heat sink 11, so that there are no gaps or air at the bonding surface, resulting in lower thermal resistance. The top surface of the indium thermal conductive sheet 20 is flat and smooth and attached to the upper surface of the interface heat sink 11, forming an indium thermal conductive thin layer 20a. The thickness (t2) of the indium thermal conductive thin layer 20a protruding from the surface of the interface heat sink 11 is 0.02mm to 0.1mm. In this way, the heat dissipation surface of the indium thermal conductive sheet 20 is much higher than that of traditional TIM adhesive (the thermal conductivity of commonly used TIM adhesive is less than 10W / mK). According to comparative tests, the high thermal conductivity and thermal interface material design of the indium thermal conductive sheet 20 enable it to transfer the heat generated by the heat source more quickly and evenly, thereby improving the heat dissipation efficiency of the entire system. Compared to traditional thermal adhesives, indium thermal pads have lower thermal resistance during heat conduction, allowing heat to flow more smoothly and reducing localized heat buildup, thus achieving lower junction temperatures and a more uniform temperature distribution.

[0041] i) Step S19: "Tear off the PET sheet to expose the surface of the indium thermally conductive thin layer 20c". This step involves using the mirror roller 40 to repeatedly press the indium thermally conductive sheet 20, so that the bottom of the indium thermally conductive sheet 20 is riveted (bitten) into the rough surface 113 and tightly bonded to the upper surface of the interface heat sink 11. The bonding surface has no gaps or air, resulting in lower thermal resistance. The top surface of the indium thermally conductive sheet 20 is flat and smooth, attached to the upper surface of the interface heat sink 11. When the pressing process is completed, the PET sheet needs to be peeled off. Since the PET sheet has no adhesive, it will not stick to the surface of the indium thermally conductive sheet 20, so it is easy to remove. Sometimes it may even be adsorbed on the surface of the mirror roller 40, making it easy to remove from the surface of the indium thermally conductive thin layer 20a.

[0042] j) Step S20: "A 1-5 μm anti-oxidation coating 50 is applied to the surface of the indium thermally conductive thin layer 20c," as shown. Figure 8As shown, this step is to prevent the indium thermally conductive layer 20a from oxidizing; and the film thickness can reduce the thermal resistance of the indium thermally conductive sheet 20 (the thermal resistance before and after coating application is 0.121℃ / W and 0.069℃ / W, respectively), and can last for more than 30 days under an aging environment of 85℃ / 85%RH, which is equivalent to extending the shelf life from 6 months before treatment to more than 10 years under storage conditions (30℃ / 60%RH). In this embodiment, the anti-oxidation coating 50 may include a fluorinated liquid coating, but is not limited to this.

[0043] k) Step S21: "Apply protective film". This step is to prevent the surface of the interface heat sink 11 from being damaged during the process from the factory to the consumer. The protective film (not shown) can be made of a commercially available material that can be peeled off by hand, and will not be described in detail.

[0044] l) Step S19: "Complete". For example... Figure 7 and Figure 8 As shown, the indium thermally conductive thin layer 20a is flat and tightly adhered to the upper surface of the interface heat sink 11, and has an anti-oxidation coating 50. Its thickness (t2) protruding from the surface of the interface heat sink 11 is only about 0.02 to 0.1 mm. This is significantly less than the thickness (t1) of over 0.15 mm when using adhesive tape to attach metal heat sinks, thus not affecting the insertion and removal of the fiber optic module 10. Furthermore, it penetrates into the surface of the nickel plating layer 112 of the interface heat sink 11, almost becoming an integral part, making the overall structure more stable.

[0045] As described above, the interface heat sink structure fabricated using the above method includes:

[0046] An interface heat sink 11 has a nickel plating layer 112 on its surface, and a rough surface 113 is formed on the nickel plating layer 112.

[0047] An indium thermally conductive material 20, in conjunction with the roughened surface 113, forms a thin sheet on the roughened surface 113. The indium thermally conductive material 20 is pressed by a roller, and its bottom is riveted (bitten) into the roughened surface, tightly bonded to the upper surface of the interface heat sink 11. This ensures the bonding surface is free of gaps and air, resulting in lower thermal resistance. The top surface of the indium thermally conductive sheet 20 is flat and smooth, adhered to the upper surface of the interface heat sink 11, forming a tightly bonded indium thermally conductive thin layer 20a. The thickness (t2) of the indium thermally conductive thin layer 20a protruding from the upper surface of the interface heat sink 11 is 0.02 mm to 0.1 mm.

[0048] An antioxidant coating 50 of 1-5 μm is applied to the surface of the indium thermally conductive thin layer 20a.

[0049] By employing the aforementioned technical means, the present invention has the following beneficial effects:

[0050] I. The present invention utilizes an indium thermal conductive sheet 20 tightly bonded to the surface of the interface heat sink 11 of the optical fiber module 10. Its heat dissipation performance can replace the current solution of using traditional thermal conductive materials in the interface heat sink. Furthermore, the indium thermal conductive sheet 20 has excellent pull-out resistance and abrasion resistance, is not easily damaged, and can improve the service life of the optical fiber module 10.

[0051] Second, the present invention uses a special method to rivet and press the indium heat-conducting sheet 20 onto the interface heat sink 11, without the need for adhesive to fix the indium heat-conducting sheet 20. The indium heat-conducting sheet 20 has a certain degree of ductility and can minimize surface thermal resistance, thereby improving heat dissipation capacity. After being pressed by the pressure roller, it is tightly attached to the surface of the interface heat sink 11, reducing the thermal resistance caused by air and adhesive, and improving the heat dissipation effect.

[0052] Third, the present invention applies an anti-oxidation coating 50 to the surface of the indium heat-conducting sheet 20 by brushing / immersion, which can solve the problem of indium oxidation. The coating thickness is 1-5 μm. This film thickness can reduce the thermal resistance of the indium heat-conducting sheet 20 and has the effect of extending the service life of the indium heat-conducting sheet 20.

[0053] The accompanying drawings and descriptions disclosed above are merely preferred embodiments of the present invention. Modifications or equivalent changes made by those skilled in the art in accordance with the spirit and scope of the present invention should still be included within the patent scope of the present invention.

Claims

1. A method for sealing an indium thermally conductive sheet in a fiber optic module interface heat sink, characterized in that, The steps include: a) Provide an interface heat sink for an optical fiber module, the surface of which has a nickel plating layer; b) Polish the nickel plating layer of the heat sink at this interface to create a rough surface; c) Provide an indium thermal conductive sheet; d) Initially form the indium thermal conductive sheet on the rough surface; e) Place the interface heat sink on a fixture platform, which is equipped with a mirror roller; f) Provide a PET sheet positioned between the surface of the indium thermally conductive sheet and the mirror roller; g). The mirror roller is used to press the indium heat-conducting sheet back and forth. The surface of the mirror roller is mirror polished and the PET sheet is used as the contact medium between the roller and the indium heat-conducting sheet. The indium heat-conducting sheet is pressed by roller pressure of 40-110 kgf to improve its surface flatness. h) The indium thermal conductive sheet is extended and pressed tightly against the rough surface of the interface heat sink using the mirror roller. The bottom of the indium thermal conductive sheet is riveted into the rough surface and tightly bonded to the upper surface of the interface heat sink, so that there are no gaps or air at the bonding surface, resulting in lower thermal resistance. The top surface of the indium thermal conductive sheet is flat and smooth and attached to the upper surface of the interface heat sink, forming a thin indium thermal conductive layer. The thickness of the thin indium thermal conductive layer protruding from the upper surface of the interface heat sink is 0.02mm to 0.1mm. i) Peel off the PET sheet to expose the surface of the indium thermally conductive thin layer; j) Apply a 1-5 μm anti-oxidation coating to the surface of the indium thermally conductive thin layer to prevent oxidation of the indium thermally conductive thin layer; k) Apply a protective film; l). Completed.

2. The method for sealing an indium thermally conductive sheet to a fiber optic module interface heat sink as described in claim 1, characterized in that, In step c), the indium thermally conductive sheet comprises a sheet-like body that has been die-cut into a predetermined shape and degreased.

3. The method for sealing an indium thermally conductive sheet in an optical fiber module interface heat sink as described in claim 1, wherein the resulting interface heat sink structure is characterized in that, Includes: An interface heat sink has a nickel plating layer on its surface, and a rough surface is formed on the nickel plating layer. An indium thermally conductive sheet, in conjunction with the roughened surface, forms a thin sheet on the roughened surface. The indium thermally conductive sheet is then pressed by a roller, and its bottom is riveted (bitten) into the roughened surface, tightly bonding to the upper surface of the interface heat sink. This ensures the bonding surface is free of gaps and air, resulting in lower thermal resistance. The top surface of the indium thermally conductive sheet is flat and smooth, adhered to the upper surface of the interface heat sink, forming a tightly bonded indium thermally conductive thin layer. The thickness of this indium thermally conductive thin layer protruding from the upper surface of the interface heat sink is 0.02 mm to 0.1 mm. An antioxidant coating of 1-5 μm is applied to the surface of the indium thermally conductive thin layer.

4. The interface of the fiber optic module interface heat sink with indium thermal conductive sheet as described in claim 3, characterized in that, The interface heat sink includes inner heat dissipation fins, the upper surface of which is flat to facilitate plugging and unplugging into the connector.

Images