Communication equipment and gain adjusting module thereof

Abstract

The invention provides a communication device and a gain adjustment module thereof, the gain adjustment module is applied to the communication device, and the gain adjustment module comprises a circuit board structure and a fixing structure used for fixing the circuit board structure; wherein the thickness of the circuit board structure in the electromagnetic wave propagation direction is smaller than a preset value; the circuit board structure comprises at least one substrate structure, each substrate structure comprises a carrier and a gain adjusting unit arranged on a preset surface of the carrier, and the carrier is made of an insulating material with the dielectric constant smaller than a first preset value. And the gain adjusting unit is made of a metal material of which the conductive constant is greater than a second preset value. According to the antenna, the gain adjusting module which is low in cost and simple in structure is designed, the purpose of high gain of the antenna is achieved, and the overall product performance is effectively improved.

Description

Technical Field

[0001] This disclosure relates to the field of communication equipment technology, and in particular to a communication device and its gain adjustment module. Background Technology

[0002] Antenna gain is used to measure the ability of an antenna to transmit and receive signals in a specific direction. A communication network or system composed of high-gain omnidirectional antennas can improve the signal coverage and capacity of the communication network or system, thereby giving users a better user experience.

[0003] Currently, the common methods to improve antenna gain are MIMO (Multiple-Input Multiple-Output) and Massive MIMO (Very Large Scale Antenna). However, MIMO and Massive MIMO methods require an increase in the number of antenna radiating elements, which increases the overall cost and size of the antenna, thus limiting its use in some fields where size is a critical factor. Summary of the Invention

[0004] The technical problem to be solved by this disclosure is to overcome the aforementioned defects in the prior art, and the purpose is to provide a communication device and its gain adjustment.

[0005] This disclosure solves the above-mentioned technical problems through the following technical solution:

[0006] This disclosure provides a gain adjustment module, which is applied in a communication device. The gain adjustment module includes a circuit board structure and a fixing structure for fixing the circuit board structure.

[0007] The circuit board structure includes at least one substrate structure, the substrate structure includes a carrier, and a gain adjustment unit disposed on a predetermined surface of the carrier, the carrier includes an insulator, and the gain adjustment unit includes a conductor.

[0008] Preferably, the sum of the thickness of the circuit board structure along the electromagnetic wave propagation direction and the distance between it and the communication device is within a preset thickness range;

[0009] The preset thickness range is determined based on the wavelength of the electromagnetic wave;

[0010] And / or, the carrier includes a flat plate structure, and the preset surface is one side of the flat plate structure;

[0011] In each of the substrate structures, the preset surface is oriented toward the antenna radiating element in the communication device.

[0012] Preferably, the fixing structure includes at least one fixing component, each of the fixing components being used to fix one of the substrate structures;

[0013] Each of the substrate structures is arranged in parallel and / or at equal intervals along the same direction;

[0014] or,

[0015] The fixing structure includes a columnar hollow structure, and several layers of parallel groove structures are provided on the inner sidewall of the hollow structure, with each layer of groove structure corresponding to a substrate structure.

[0016] Preferably, the fixing structure includes a first outer shell and a second outer shell, and the substrate structure module includes a first substrate structure, a second substrate structure and a third substrate structure;

[0017] The first substrate structure is disposed on the inner side of the first outer shell, the third substrate structure is disposed on the inner side of the second outer shell, and the third substrate structure is disposed at the closing point of the first outer shell and the second outer shell. After the first outer shell and the second outer shell are closed, they press against the edge of the second substrate structure to fix the second substrate structure.

[0018] The first substrate structure, the second substrate structure, and the third substrate structure are arranged in parallel and / or at equal intervals along the same direction.

[0019] Preferably, the first substrate structure is fixedly attached to the inner side of the first housing using adhesive, and the second substrate structure is fixedly attached to the inner side of the second housing using adhesive.

[0020] And / or,

[0021] The outer edge of the carrier in the third substrate structure is provided with a fixing member for strengthening the fixation.

[0022] Preferably, the first housing is provided with a plurality of first connectors, and the second housing is provided with a plurality of second connectors that mate with each of the first connectors.

[0023] Each of the first connectors and the corresponding second connectors are fixedly connected by a snap fastener or screw.

[0024] Preferably, the number of substrate structures in the circuit board structure is determined based on the frequency band of the communication device;

[0025] And / or, the size of the circuit board structure is equal to or greater than the size of the antenna radiating element.

[0026] Preferably, the direction of the electric field formed in the gain adjustment unit is parallel to the direction of the electric field of the electromagnetic wave in the preset direction;

[0027] The gain adjustment unit includes several metal wires arranged in a preset manner.

[0028] Preferably, the metal wire comprises a regular-shaped or irregular-shaped metal wire.

[0029] Preferably, the regular shapes include rectangles, squares, triangles, circles, ellipses, rhombuses, polygons, and intersecting shapes;

[0030] The irregular shape includes any irregular shape other than the regular shape.

[0031] Preferably, the gain adjustment unit includes a plurality of metal wires arranged in parallel and spaced apart along a first preset direction and arranged in spaced apart along a second preset direction.

[0032] Preferably, the metal wires in the first preset direction are evenly spaced based on a first preset spacing;

[0033] And / or, the metal wires in the second preset direction are spaced equally between each other based on a second preset spacing.

[0034] Preferably, when the gain adjustment unit is a rectangular structure, the first preset direction is the length direction;

[0035] The spacing range corresponding to the first preset spacing is 0.003mm-5mm;

[0036] And / or, the spacing range corresponding to the second preset spacing is 0.003mm-5mm;

[0037] And / or, the widths of the different metal wires are all the same;

[0038] And / or, all of the different metal wires are made of the same material.

[0039] Preferably, the gain adjustment unit is disposed concurrently with the carrier, or the gain adjustment unit is disposed in a local area of ​​the carrier;

[0040] And / or,

[0041] The carrier includes a flat plate structure, and the preset surface is one side of the flat plate structure.

[0042] Preferably, the material of the metal wire includes at least one of copper, silver paste, tin, or conductive ink;

[0043] And / or, the material of the carrier includes at least one of PI (polyimide), PET (polyethylene terephthalate), FR4 (glass fiber epoxy resin material), or resin;

[0044] And / or, the gain adjustment unit is disposed on the carrier using any one of the following methods: copper clad laminate etching, additive method, metal pad printing, metal inkjet printing, metal printing, conductive ink printing, in-mold injection molding, and vacuum plating.

[0045] This disclosure also provides a communication device, which includes the gain adjustment module as described above.

[0046] Based on common knowledge in the field, the preferred conditions described can be combined arbitrarily to obtain the preferred embodiments of this disclosure.

[0047] The positive and progressive effects of this disclosure are as follows:

[0048] In this disclosure, by cleverly designing the substrate structure and incorporating it within the gain adjustment module, each substrate structure becomes polarized under the influence of an external electromagnetic field upon power-up. This generates an enhanced electric field in the direction of electromagnetic wave propagation, thereby increasing the gain in that direction. This approach eliminates the need to add antenna radiating elements to the communication equipment, reducing investment costs and preserving the original dimensions of the communication equipment, thus ensuring its applicability across various scenarios. Furthermore, this substrate structure offers advantages such as low cost, simple structure, ease of manufacturing, and convenient installation, resulting in superior overall performance of the gain adjustment module. In other words, high antenna gain is achieved through a low-cost, simple structure, effectively improving the overall product performance of the communication equipment. Attached Figure Description

[0049] Figure 1 This is a schematic diagram of the gain adjustment module of Embodiment 1 of this disclosure;

[0050] Figure 2 This is a first structural schematic diagram of the substrate structure according to Embodiment 1 of this disclosure;

[0051] Figure 3 This is a second structural schematic diagram of the substrate structure of Embodiment 1 of this disclosure;

[0052] Figure 4 This is a first structural schematic diagram of the gain adjustment module according to Embodiment 2 of this disclosure;

[0053] Figure 5 This is a schematic diagram of the fixing structure of Embodiment 2 of this disclosure;

[0054] Figure 6 This is a schematic diagram of the second structure of the gain adjustment module according to Embodiment 2 of this disclosure;

[0055] Figure 7 This is a schematic diagram of the third structure of the gain adjustment module in Embodiment 2 of this disclosure;

[0056] Figure 8 This is a schematic diagram of the fourth structure of the gain adjustment module in Embodiment 2 of this disclosure;

[0057] Figure 9 This is a partially enlarged schematic diagram of the square metal wire on the substrate structure of Embodiment 2 of this disclosure;

[0058] Figure 10 This is a partially enlarged schematic diagram of the cross-shaped metal wires on the substrate structure of Embodiment 2 of this disclosure;

[0059] Figure 11 This is a partially enlarged structural diagram of the “×” shaped metal wire on the substrate structure of Embodiment 2 of this disclosure;

[0060] Figure 12 This is a schematic diagram of the communication device according to Embodiment 3 of this disclosure;

[0061] Figure 13 This is a first schematic diagram showing the relative arrangement of the antenna and substrate structure in Embodiment 3 of this disclosure;

[0062] Figure 14 This is a second schematic diagram showing the relative arrangement of the antenna and substrate structure in Embodiment 3 of this disclosure;

[0063] Figure 15 This is a third schematic diagram showing the relative arrangement of the antenna and substrate structure in Embodiment 3 of this disclosure;

[0064] Figure 16 for Figure 15 A schematic diagram of the electric and magnetic field directions on the substrate structure. Detailed Implementation

[0065] The present disclosure is further illustrated below by way of embodiments, but the present disclosure is not limited to the scope of the embodiments described herein.

[0066] Example 1

[0067] like Figure 1 As shown, the gain adjustment module of this embodiment is applied in a communication device. The gain adjustment module includes a circuit board structure 1 and a fixing structure 2 for fixing the circuit board structure 1.

[0068] The thickness of the circuit board structure 1 along the direction of electromagnetic wave propagation, plus the distance between it and the communication equipment, is within a preset thickness range; specifically, the preset thickness range is generally determined based on the wavelength of the electromagnetic wave.

[0069] like Figure 2 and 3As shown, the circuit board structure 1 includes at least one substrate structure 3, the substrate structure 3 includes a carrier 4, and a gain adjustment unit 5 disposed on a preset surface of the carrier 4; the carrier 4 includes an insulator, and the gain adjustment unit 5 includes a conductor.

[0070] Specifically, the carrier 4 is made of an insulating material with a dielectric constant less than a first preset value, and the gain adjustment unit 5 is made of a metallic material with a conductivity constant greater than a second preset value.

[0071] The substrate structure 3 will be set in different shapes according to different frequency bands of the communication equipment. The number and relative distance of the substrate structures 3 set in the gain adjustment module will also have different combinations according to the frequency band and form of the communication equipment. The specific settings and combinations can be determined according to actual needs, and will not be elaborated here.

[0072] The gain adjustment module is located in the communication equipment. It can be located around the antenna radiating element in the communication equipment or placed between two antenna radiating elements (i.e., two antenna radiating elements share one gain adjustment module).

[0073] The specific distance between the gain adjustment module and the antenna radiating element in the communication equipment can be set or adjusted according to actual conditions. Preferably, the sum of the overall thickness of the gain adjustment module and its distance from the antenna radiating element needs to be less than or equal to a preset range (such as a range determined based on one-quarter of the wavelength of the electromagnetic wave, which can be slightly greater than or slightly less than one-quarter of the wavelength of the electromagnetic wave). That is, the gain adjustment module needs to be set within a certain position range to ensure the gain effect of the antenna.

[0074] In addition, the gain adjustment unit 5 in each substrate structure 3 is an entire array structure. The gain adjustment unit 5 is laid on the carrier 4, which is used to support, fix and hold the gain adjustment unit 5.

[0075] The shape, size, and thickness of the carrier 4 can be designed or adjusted according to the needs of the actual scenario, without specific limitations, as long as it can be used in the specific scenario. One or more preset surfaces of the carrier 4 are provided with a gain adjustment unit 5; preferably, it is sufficient to provide a gain adjustment unit 5 on one preset surface of the carrier 4, which is enough to meet the needs of the actual scenario, thereby achieving reasonable design and reducing investment costs.

[0076] In addition, the carrier 2 is made of insulating materials with low dielectric constant (such as dielectric constant less than 15) such as PI, PET, FR4 or resin. Of course, the carrier 4 can be made of one insulating material or multiple insulating materials. The gain adjustment unit 3 is made of highly conductive materials such as copper, silver paste, tin or conductive ink. Of course, the gain adjustment unit 5 can be made of one conductive material or multiple highly conductive materials.

[0077] It should be noted that, depending on the internal structure of the communication equipment, each substrate structure 3 in the circuit board structure can be installed separately in the communication equipment, relying on the structure of the communication equipment as a fixing structure to achieve the fixing effect; alternatively, the substrate structure 3 can be directly fabricated on the housing of the communication equipment, that is, the housing can be used as a carrier 4. The specific method can be designed or adjusted according to actual needs.

[0078] In this solution, by cleverly designing the substrate structure 3, and incorporating the substrate structure 3 within the gain adjustment module, each substrate structure 3 becomes polarized under the influence of an external electromagnetic field upon power-up. This generates an enhanced electric field in the direction of electromagnetic wave propagation, thereby increasing the gain in that direction. This approach eliminates the need to add antenna radiating elements to the communication equipment, reducing investment costs and preserving the original dimensions of the communication equipment, thus ensuring its applicability across various scenarios. Furthermore, the substrate structure 3 offers advantages such as low cost, simple structure, ease of manufacturing, and convenient installation, resulting in superior overall performance of the gain adjustment module. In other words, high antenna gain is achieved through a low-cost, simple structure, effectively improving the overall product performance of the communication equipment.

[0079] Example 2

[0080] The gain adjustment module in this embodiment is a further improvement on embodiment 1, specifically:

[0081] In a feasible solution, such as Figure 2 and 3 As shown, the carrier 4 includes a flat plate structure, with a preset surface being one side of the flat plate structure; wherein, the preset surface of each substrate structure 3 faces the antenna radiating element in the communication device. Figure 2 In the middle, E represents the direction of the electric field.

[0082] In this disclosure, the carrier 4 is a flat plate structure, and the preset surface is one side of the flat plate structure. At this time, the gain adjustment unit 5 is also a flat plate structure laid on the flat plate structure, which makes the structure simple, occupies little space and is aesthetically pleasing. In addition, the preset surface in each substrate structure 3 is set towards the antenna radiation unit in the communication device, so that the direction of the electric field formed is parallel to the direction of the electric field of the electromagnetic wave in the preset direction, effectively ensuring that the electromagnetic wave forms an enhanced electric field in the direction of propagation, so as to improve the gain in that direction.

[0083] In addition, the fixing structure 2 can be set according to actual needs, as long as it can fix the corresponding substrate structure.

[0084] In a feasible solution, such as Figure 4 As shown, the fixing structure 2 includes at least one fixing component 6. When multiple fixing components are included, they are spaced apart, and each fixing component 6 is used to fix a substrate structure 3.

[0085] In this design, each substrate structure 3 is arranged in parallel and / or equidistantly along the same direction. The specific shape and material of the fixing component 6 are not limited, as long as it can fix the substrate structure 3. When there are two or more substrate structures 3, these substrate structures 3 are arranged in parallel along the same direction, so that the direction of the formed electric field is parallel to the direction of the electric field of the electromagnetic wave in the preset direction. Furthermore, these substrate structures 3 can also be equidistant, achieving a reasonable and aesthetically pleasing structural design.

[0086] In a feasible solution, such as Figure 5 As shown, the fixing structure includes a columnar hollow structure, and several layers of parallel groove structures 7 are provided on the inner sidewall of the hollow structure. Each layer of groove structure 7 corresponds to a substrate structure 3.

[0087] In this design, several sets of parallel groove structures 7 are provided on the inner wall of the columnar hollow structure. By inserting these substrate structures 3 into these groove structures, the effect of sequentially parallel and equidistantly arranged along the same direction is achieved. Of course, these substrate structures 3 can also be fixed in other ways, which will not be elaborated here.

[0088] In a feasible solution, such as Figure 6 As shown, the fixing structure 2 includes a first outer shell a and a second outer shell b. Figure 6 With the first outer shell a and the second outer shell b in the open state, three substrate structures 11, 12, and 13 are provided between the fixing structures. Substrate structures 11 and 12 are fixed to the inner surfaces of the first outer shell a and the second outer shell b (e.g., using double-sided adhesive). Figure 7As shown, this illustrates the structural state after the first outer shell a and the second outer shell b are closed. At this point, the closed portion of the first outer shell a and the second outer shell b presses against the substrate structure 13, thus fixing the substrate structure 13. Figure 8 As shown, this is another integral shape structure after the first outer shell a and the second outer shell b are closed; wherein, both the first outer shell a and the second outer shell b are made of plastic.

[0089] Specifically, the first substrate structure is fixedly attached to the inner side of the first housing with adhesive, and the second substrate structure is fixedly attached to the inner side of the second housing with adhesive.

[0090] In this solution, double-sided adhesive can be applied to the inner surfaces of the first and second outer shells to fix the first and second substrate structures onto them. The adhesive can be applied to the entire inner surface for easy operation and reliable fixation; alternatively, it can be applied to two or four opposite sides of the inner surface, achieving a more reliable fixation while avoiding unnecessary material waste and reducing costs. Furthermore, this solution achieves effective fixation of the metal plate without the need for a complex structure, ensuring a simplified and low-cost overall gain adjustment module.

[0091] In one feasible embodiment, a fastener for reinforcing fixation is provided at the outer edge of the carrier 4 in the third substrate structure.

[0092] The fastener can be a reinforcing unit located on the outer edge of one or two sides of the carrier 4, or the fastener can be integrated into the outer edge of the carrier 4, i.e., the reinforcing unit is arranged around the inside of the carrier 4. The material of the reinforcing unit can be the same as that of the carrier 4. No fasteners are required in other areas of the outer edge of the carrier 4 to avoid unnecessary cost investment and reduce the introduction of other factors that affect the gain effect.

[0093] In this scheme, the carrier 4 in the third substrate structure is different from the carrier 4 in the first substrate structure and the second substrate structure. Specifically, since the third substrate structure is sandwiched between the first shell and the second shell, its outer edge needs to have a certain thickness and hardness. By setting a ring of fixing parts at the outer edge of the carrier 4 in the third substrate structure, the collapse or deformation caused by the weak structure in the middle of the third substrate structure can be prevented, thereby affecting the performance.

[0094] In one feasible embodiment, a first housing is provided with a plurality of first connectors, and a second housing is provided with a plurality of second connectors that mate with each of the first connectors.

[0095] Each first connector and its corresponding second connector are fixedly connected by a snap-fit ​​or screw.

[0096] In this solution, the first outer shell and the second shell need to be closed to press against the outer edge of the third substrate structure for fixation. The first outer shell and the second shell can be fixedly connected in any way, as long as fixation can be achieved; for example, one side of the first outer shell and the second shell can be hinged and fixed, and the other side can be fixed by snap-fit; the number and position of the snap-fit ​​can be set or adjusted according to actual needs.

[0097] Furthermore, the materials of the first and second outer shells include, but are not limited to, plastic, and the shapes and thicknesses of the first and second outer shells are not limited. The inner surface depths of the first and second outer shells can be set to be the same, so that after these substrate structures 3 are placed on the fixing structure 2, the first, second, and third substrate structures can be equidistantly arranged, achieving a reasonable and aesthetically pleasing structural design.

[0098] Of course, the fixing structure 2 is not limited to the above-listed methods, and can be any structure, as long as it can provide a good fixing effect on the substrate structure, which will not be elaborated here.

[0099] In this solution, through the ingenious design of the fixing structure, the first substrate structure, the second substrate structure, and the third substrate structure are stably and reliably fixed on the basis of a simple structure. In addition, the fixing structure also has the advantages of being easy to place and remove these substrate structures and being easy to operate.

[0100] In one feasible scheme, the number of substrate structures 3 in circuit board structure 1 is determined based on the frequency band of the communication device.

[0101] In this scheme, the substrate structure 3 will be set with different shapes according to different frequency bands of the communication equipment. The number and relative distance of the substrate structure 3 set in the gain adjustment module will also have different combinations according to the frequency band and form of the communication equipment. The specific settings and combinations can be determined according to actual needs, and will not be elaborated here.

[0102] In one feasible solution, the size of the circuit board structure 1 is equal to or greater than the size of the antenna radiating element.

[0103] In this scheme, the shape and size of the substrate structure 3 are matched and set based on the shape and size of the antenna radiating element; preferably, the shape and size of the substrate structure 3 are close to (equal to or slightly larger than) the shape and size of the antenna radiating element, so as to form an enhanced electric field for the electromagnetic wave in the direction of propagation, thereby achieving the effect of improving the gain in that direction.

[0104] In one feasible scheme, the direction of the electric field formed in the gain adjustment unit 5 is parallel to the direction of the electric field of the electromagnetic wave in the preset direction;

[0105] Among them, the gain adjustment unit 3 includes several metal wires 4 arranged according to a preset arrangement method, that is, the gain adjustment unit 3 with different forms can be set, as long as it can achieve the effect of meeting high gain.

[0106] In an implementable solution, the metal wire 4 includes a metal wire with a regular shape or an irregular shape.

[0107] Specifically, the regular shape includes a rectangle, a square (see Figure 9 , square shape), a triangle, a circle, an ellipse, a rhombus, a polygon, a cross shape (such as a "plus" shape, see Figure 11 , "times" shape, see Figure 12 , "square" shape, etc.); among them, Ex and Ey are the directions of the electric field.

[0108] The irregular shape includes any other irregular shape except the regular shape; for example, a circle along a preset direction is provided.

[0109] In an implementable solution, as Figure 3 and 9 shown, the gain adjustment unit 3 includes several metal wires arranged in parallel and at intervals in sequence along a first preset direction and arranged at intervals in sequence along a second preset direction. For example, the gain adjustment unit 3 is composed of several rectangular or square metal wires set with a certain length, a certain width, and a certain distance, such as Figure 3 and Figure 9 the metal wires in are squares.

[0110] Specifically, the setting density of each metal wire 4 in the first preset direction and the second preset direction can be designed or adjusted according to actual needs.

[0111] Among them, the overall external dimension of the substrate structure 1 can be determined according to factors such as the external dimension of the communication device and the distance from the communication device, and the design of the several metal wires 4 can also be adaptively designed along with the overall external dimension of the substrate structure.

[0112] In the present disclosure, through the setting of several metal wires arranged in parallel and at intervals in sequence along a first preset direction and arranged at intervals in sequence along a second preset direction, a planar structure is formed, and the electric field direction formed by this planar structure is parallel to the electric field direction of the electromagnetic wave in the preset direction, so that the substrate structure 1 can be polarized under the influence of an external electromagnetic field, and the electromagnetic wave forms an enhanced electric field in the propagation direction, so as to achieve the effect of increasing the gain in this direction.

[0113] In an implementable solution, as Figure 3 and 9As shown, the metal wires 4 in the first preset direction are evenly spaced based on the first preset spacing;

[0114] The metal wires 4 in the second preset direction are set at equal intervals based on the second preset spacing.

[0115] In this disclosure, metal wires with a preset direction are designed to be equidistant according to a set spacing, which simplifies the operation of making the metal wire array. The resulting gain adjustment unit has a simple structure and a regular and orderly structure, ensuring the aesthetics of the structure.

[0116] In a feasible solution, such as Figure 3 and 9 As shown, when the gain adjustment unit 3 has a rectangular structure, the first preset direction is the length direction and the second preset direction is the width direction;

[0117] The first preset spacing corresponds to a spacing range of 0.003mm-5mm; for example, the first preset spacing can be set to 3mm.

[0118] The second preset spacing corresponds to a spacing range of 0.003mm-5mm; for example, the second preset spacing can be set to 0.3mm.

[0119] In this disclosure, for the gain adjustment unit with a rectangular structure, the specific spacing range of the metal wires in the length and width directions is clearly constrained. Within this constraint range, it can be ensured that the direction of the formed electric field is parallel to the electric field direction of the electromagnetic wave in the preset direction, so as to more effectively form an enhanced electric field and achieve a high gain effect on the electromagnetic wave in the set direction.

[0120] Furthermore, by further constraining the specific spacing of the gain adjustment units in the length and width directions of the rectangular structure, it can be further ensured that the direction of the formed electric field is parallel to the direction of the electric field of the electromagnetic wave in the preset direction, which can more effectively form an enhanced electric field to achieve a high gain effect on the electromagnetic wave in the set direction.

[0121] In one feasible solution, the widths of the different metal wires 4 are all the same;

[0122] The width range is 0.003mm-5mm; for example, the width can be set to 0.3mm.

[0123] In one feasible solution, the different metal wires 4 are made of the same material; of course, the different metal wires 4 can also be made of different materials.

[0124] Of course, the width and material of each metal wire 4 can be set separately according to actual needs to achieve flexible design.

[0125] By using the same materials and spacing for different metal wires, a consistent manufacturing process can be maintained, thereby effectively saving production costs.

[0126] In this disclosure, for the gain adjustment unit, the width range of the metal wires in the length and width directions is clearly constrained. Within this constraint range, it can be ensured that the direction of the formed electric field is parallel to the electric field direction of the electromagnetic wave in the preset direction, which can more effectively form an enhanced electric field to achieve a high gain effect on the electromagnetic wave in the set direction. In addition, constraining the width of the metal wires in the length and width directions to be the same also makes the structure regular and orderly to a certain extent, ensuring the aesthetics of the structure.

[0127] In one feasible solution, the gain adjustment unit 3 is arranged to coincide with the carrier 2, such as... Figure 3 and 9 As shown, both the gain adjustment unit 3 and the carrier 2 are rectangular structures and are arranged overlappingly; or the gain adjustment unit 3 is arranged in a local area of ​​the carrier 2, that is, contained within the preset surface of the carrier.

[0128] Specifically, the shape and size of the gain adjustment unit 3 are generally designed according to the shape and size of the carrier 2. For example, if the carrier 2 is a rectangular structure of size A, then the gain adjustment unit 3 is also a rectangular structure of size A. Or if the carrier 2 is a triangular structure of size B, then the gain adjustment unit 3 is also a triangular structure of size B, so as to just cover one side of the carrier 2. The gain adjustment unit 3 can also be slightly smaller than the carrier 2.

[0129] Of course, the shape of the carrier 2 and the shape of the gain adjustment unit 3 can be different. For example, the carrier 2 is a rectangular structure of size A, while the gain adjustment unit 3 is a triangular structure.

[0130] In this disclosure, the gain adjustment unit is not limited to a specific shape, but can be flexibly designed and can be any shape that can meet the usage requirements to satisfy the usage needs of different practical scenarios.

[0131] In one feasible embodiment, carrier 2 includes a flat plate structure, with the preset surface being one side of the flat plate structure, as detailed below. Figure 3 and 9 .

[0132] In this disclosure, the carrier is a flat plate structure, and the preset surface is one side of the flat plate structure. At this time, the gain adjustment unit is also a flat plate structure laid on the flat plate structure, which makes the structure simple, occupies little space and is aesthetically pleasing.

[0133] In one feasible solution, the gain adjustment unit 3 is mounted on the carrier 2 using methods such as copper clad laminate etching (FPC or PCB manufacturing process; where FPC or PCB are both process technologies), addition method, metal pad printing (e.g., if the metal is silver, silver paste is transferred onto the plastic shell or other insulating material), metal spraying (e.g., if the metal is silver), metal printing (e.g., if the metal is silver), conductive ink printing, in-mold injection molding, vacuum plating, etc.

[0134] In this disclosure, the gain adjustment unit is integrated into the carrier using the above-described process, ensuring the stability, reliability, and aesthetics of the structure.

[0135] Example 3

[0136] like Figure 12 As shown, the communication device 100 in this embodiment includes the gain adjustment module 200 described in the above embodiment. The communication device includes antenna devices, etc.

[0137] like Figure 13 As shown, each substrate structure of the gain adjustment module uses regularly shaped metal wires (such as...). Figure 3 , Figure 9 , Figure 10 , Figure 11 Each substrate structure is arranged in the direction shown in the figure. Preferably, each substrate structure is equidistant in the same direction. Of course, there can also be a certain distance offset, so that the direction of the electric field formed is parallel to the direction of the electric field of the electromagnetic wave in the preset direction, thereby improving the antenna gain.

[0138] like Figure 14 and Figure 15 As shown, each substrate structure of the gain adjustment module uses regularly shaped or irregularly shaped metal wires (such as...). Figure 14 The irregular shapes in Figure 15 The substrate is a regular square shape (but it can also be any other feasible structure, which will not be elaborated here). Each substrate structure is set in the direction shown in the figure. Preferably, each substrate structure is equidistant in the same direction, but there can also be a certain distance offset.

[0139] by Figure 15 Taking the substrate structure shown as an example, the principle of its gain improvement is explained:

[0140] for Figure 15 For each square in the combination Figure 16d1 is the electric field direction corresponding to the electromagnetic wave in the preset direction. This direction is parallel to the side of the square. The square metal structure can enhance the electric field in this direction. d2 is the magnetic field direction of the electromagnetic wave passing through the square in the preset direction. The square metal structure can enhance the magnetic field in this direction. That is, the substrate structure achieves a projection that is parallel to the incoming wave electric field in a certain direction and perpendicular to the incoming wave magnetic field in another direction. This allows the antenna gain to be improved by cutting through the metal structure on the substrate structure with magnetic flux.

[0141] Specifically, the communication device 100 may include one or more gain adjustment modules 200, which can be configured according to the antenna radiating element. The gain adjustment module 200 may be specifically designed according to the standardized installation interface of different communication devices 100 to achieve a good adaptation effect and realize a higher gain.

[0142] In addition, the placement position, quantity, and distance of the gain adjustment module 200 from the antenna radiating element in the communication device 100 can be determined based on the frequency band of the communication device 100, simulation, actual testing, etc., thereby changing the antenna pattern and achieving a better gain improvement effect.

[0143] The following table illustrates this (Gain represents gain, Freq represents frequency):

[0144]

[0145]

[0146] Referring to the table above, which shows the gain test data before and after adding the gain adjustment module, it can be seen that the gain increase varies slightly at different frequencies, and the gain increase is above 2dBi across the entire frequency band. This means that the antenna gain can be effectively improved to a certain extent with lower cost and a simpler structure.

[0147] In this solution, the communication device is equipped with the aforementioned gain adjustment module, which, once powered on, causes each upper substrate structure to polarize under the influence of an external electromagnetic field. This creates an enhanced electric field in the direction of electromagnetic wave propagation, thereby increasing the gain in that direction. For example, the gain of a single antenna can be increased by more than 2 dBi. This method eliminates the need to add antenna radiating elements to the communication device, thus reducing investment costs. It also does not change the original size of the communication device, ensuring its applicability across various scenarios. In other words, it achieves high antenna gain through a low-cost, simple structure, effectively improving the overall performance of the communication device.

[0148] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

Claims

1. A gain adjustment module, characterized in that, The gain adjustment module is used in communication equipment. The gain adjustment module includes a circuit board structure and a fixing structure for fixing the circuit board structure. The circuit board structure includes at least one substrate structure, the substrate structure includes a carrier, and a gain adjustment unit disposed on a predetermined surface of the carrier, the carrier includes an insulator, and the gain adjustment unit includes a conductor.

2. The gain adjustment module as described in claim 1, characterized in that, The sum of the thickness of the circuit board structure along the electromagnetic wave propagation direction and the distance between it and the communication device is within a preset thickness range. The preset thickness range is determined based on the wavelength of the electromagnetic wave; And / or, the carrier includes a flat plate structure, and the preset surface is one side of the flat plate structure; In each of the substrate structures, the preset surface is oriented toward the antenna radiating element in the communication device.

3. The gain adjustment module as described in claim 2, characterized in that, The fixing structure includes at least one fixing component, and each fixing component is used to fix one of the substrate structures; Each of the substrate structures is arranged in parallel and / or at equal intervals along the same direction; or, The fixing structure includes a columnar hollow structure, and several layers of parallel groove structures are provided on the inner sidewall of the hollow structure, with each layer of groove structure corresponding to a substrate structure.

4. The gain adjustment module as described in claim 2, characterized in that, The fixing structure includes a first outer shell and a second outer shell, and the substrate structure module includes a first substrate structure, a second substrate structure and a third substrate structure; The first substrate structure is disposed on the inner side of the first outer shell, the third substrate structure is disposed on the inner side of the second outer shell, and the third substrate structure is disposed at the closing point of the first outer shell and the second outer shell. After the first outer shell and the second outer shell are closed, they press against the edge of the second substrate structure to fix the second substrate structure. The first substrate structure, the second substrate structure, and the third substrate structure are arranged in parallel and / or at equal intervals along the same direction.

5. The gain adjustment module as described in claim 4, characterized in that, The first substrate structure is fixedly attached to the inner side of the first housing using adhesive, and the second substrate structure is fixedly attached to the inner side of the second housing using adhesive. And / or, The outer edge of the carrier in the third substrate structure is provided with a fixing member for strengthening the fixation.

6. The gain adjustment module as described in claim 4, characterized in that, The first outer casing is provided with a plurality of first connectors, and the second outer casing is provided with a plurality of second connectors that mate with each of the first connectors. Each of the first connectors and the corresponding second connectors are fixedly connected by a snap fastener or screw.

7. The gain adjustment module as described in claim 2, characterized in that, The number of substrate structures in the circuit board structure is determined based on the frequency band of the communication device. And / or, the size of the circuit board structure is equal to or greater than the size of the antenna radiating element.

8. The gain adjustment module as described in any one of claims 1-7, characterized in that, The direction of the electric field generated in the gain adjustment unit is parallel to the direction of the electric field of the electromagnetic wave in the preset direction. The gain adjustment unit includes several metal wires arranged in a preset manner.

9. The gain adjustment module as described in claim 8, characterized in that, The metal wires include metal wires with regular or irregular shapes.

10. The gain adjustment module as described in claim 9, characterized in that, The regular shapes include rectangles, squares, triangles, circles, ellipses, rhombuses, polygons, and intersections; The irregular shape includes any irregular shape other than the regular shape.

11. The gain adjustment module as described in claim 9, characterized in that, The gain adjustment unit includes a plurality of metal wires arranged in parallel and spaced apart along a first preset direction and arranged in spaced apart along a second preset direction.

12. The gain adjustment module as described in claim 11, characterized in that, The metal wires in the first preset direction are equally spaced based on a first preset spacing. And / or, the metal wires in the second preset direction are spaced equally between each other based on a second preset spacing.

13. The gain adjustment module as described in claim 12, characterized in that, When the gain adjustment unit is a rectangular structure, the first preset direction is the length direction; The spacing range corresponding to the first preset spacing is 0.003mm-5mm; And / or, the spacing range corresponding to the second preset spacing is 0.003mm-5mm; And / or, the widths of the different metal wires are all the same; And / or, all of the different metal wires are made of the same material.

14. The gain adjustment module as described in claim 1, characterized in that, The gain adjustment unit is disposed concurrently with the carrier, or the gain adjustment unit is disposed in a local area of ​​the carrier; And / or, The carrier includes a flat plate structure, and the preset surface is one side of the flat plate structure.

15. The gain adjustment module as described in claim 1, characterized in that, The material of the metal wire includes at least one of copper, silver paste, tin, or conductive ink; And / or, the material of the carrier includes at least one of PI, PET, FR4 or resin; And / or, the gain adjustment unit is disposed on the carrier using any one of the following methods: copper clad laminate etching, additive method, metal pad printing, metal inkjet printing, metal printing, conductive ink printing, in-mold injection molding, and vacuum plating.

16. A communication device, characterized in that, The communication device includes the gain adjustment module as described in any one of claims 1-15.

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