Shell assembly, preparation method thereof and terminal equipment

Abstract

The invention relates to the technical field of terminal equipment, in particular to a shell assembly, a preparation method thereof and terminal equipment. The shell assembly comprises a shell body and a heat dissipation decoration layer located on the inner side of the shell body. The heat dissipation decoration layer comprises a shielding heat dissipation sheet, a wrapping supporting film and a texture film. The covering supporting film covers the shielding heat dissipation sheet, and the texture film is located on the surface of the side, away from the shielding heat dissipation sheet, of the covering supporting film and is closer to the shell body relative to the covering supporting film. The traditional heat dissipation layer and the decorative film are integrally designed, so that the internal space of the terminal equipment is saved, and the heat dissipation and light and thin requirements of the terminal equipment are met.

Description

Technical Field

[0001] This application relates to the field of terminal equipment technology, and in particular to a housing component, its manufacturing method, and a terminal device. Background Technology

[0002] In current terminal devices such as mobile phones, tablets, and laptops, CPU or GPU chips typically employ dynamic power control to enhance performance, adjusting power consumption based on the needs of running programs. For instance, when launching large programs or documents, a brief overclocking process can significantly increase power consumption to achieve higher performance, shorten program launch time, and improve user experience. This places higher demands on the temperature rise of the terminal device. Furthermore, the charging strategies of high-power wired fast charging and wireless charging are also directly related to the overall temperature rise of the device. Reducing the overall temperature rise can effectively extend the high-power charging time, thereby shortening the time to fully charge the device.

[0003] The ultra-high thermal conductivity of heat dissipation materials can achieve rapid energy dissipation, thereby reducing the overall temperature rise of the device. Moreover, the more heat dissipation materials used, the better the heat dissipation effect. However, the size of terminal devices is limited, and the demand for thinner and lighter devices is becoming increasingly strong. This means that the internal space available for heat dissipation materials in terminal products is very limited. How to balance the needs of heat dissipation and thinner and lighter devices is an important research topic. Summary of the Invention

[0004] Based on this, this application provides a housing component, its manufacturing method, and a terminal device, with the aim of balancing the needs of heat dissipation and thinness in the terminal device.

[0005] The first aspect of this application provides a housing assembly, the technical solution of which is as follows:

[0006] A housing assembly includes a housing body and a heat-dissipating decorative layer located inside the housing body;

[0007] The heat dissipation decorative layer includes a heat shield, a covering support film, and a textured film; the covering support film covers the heat shield, and the textured film is located on the side of the covering support film away from the heat shield and is closer to the shell body than the covering support film.

[0008] The second aspect of this application provides a method for manufacturing a housing assembly, the technical solution of which is as follows:

[0009] A method for manufacturing a housing assembly includes the following steps:

[0010] Use a covering support film to cover the heat sink;

[0011] A textured film is formed on the surface of the covering support film away from the shielding heat sink to prepare a heat dissipation decorative layer;

[0012] The heat dissipation decorative layer is fixed to the inside of the shell body, wherein the textured film is closer to the shell body than the covering support film.

[0013] A third aspect of this application provides a terminal device, the technical solution of which is as follows:

[0014] A terminal device includes a display module, a circuit board, a battery, and a housing assembly as described above; the display module and the housing assembly enclose a receiving space, and the circuit board and the battery are located within the receiving space.

[0015] This application has the following beneficial effects:

[0016] To balance the heat dissipation and slim design requirements of terminal devices, this application integrates the traditional heat dissipation layer and decorative film into a single design. A heat sink with shielding function is used, which, while dissipating heat, also conceals the internal components of the terminal device, allowing the textured layer to be displayed and highlighted on the outer shell of the terminal device. Simultaneously, the supporting film not only covers the shielding heat sink to prevent it from detaching but also supports the formation of the textured film. This integrated design eliminates the need for a supporting film and ink shielding layer found in traditional decorative films, thus saving internal space in the terminal device. This saved internal space benefits the reduction of overall temperature rise without increasing the overall thickness, and also contributes to a slimmer and lighter design without compromising heat dissipation. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application and to more completely understand this application and its beneficial effects, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A front view of the structure of a housing assembly according to one embodiment;

[0019] Figure 2 for Figure 1 Cross-sectional view of section A-A';

[0020] Figure 3 A cross-sectional view of the housing assembly along section A-A' of another embodiment;

[0021] Figure 4A cross-sectional view of the housing assembly along section A-A' of another embodiment;

[0022] Figure 5 for Figure 4 A schematic diagram of the fabrication process of the housing component;

[0023] Figure 6 A schematic diagram of the structure for shielding the heat sink;

[0024] Figure 7 A schematic diagram of the structure after the heat sink is covered with a supporting film;

[0025] Figure 8 A schematic diagram of the structure of the intermediate product after the notch is restored by laser cutting the adhesive layer, coating layer, texture film and covering support film;

[0026] Figure 9 This is a schematic diagram of the housing assembly and battery of the terminal device in Comparative Example 1;

[0027] Figure 10 This is a schematic diagram of the housing assembly and battery of the terminal device in Example 1. Detailed Implementation

[0028] The present application will be further described in detail below with reference to specific embodiments. The present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this application.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0030] the term

[0031] Unless otherwise stated or in case of conflict, the terms or phrases used in this application shall have the following meanings:

[0032] In this application, the terms "optionally," "optionally," and "optional" refer to options that are optional, meaning they can be selected from either "with" or "without." If multiple "optional" options appear in a technical solution, unless otherwise specified and there are no contradictions or mutual constraints, each "optional" option is independent.

[0033] In this application, the terms "first aspect," "second aspect," "third aspect," and "fourth aspect," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or quantity, nor should they be construed as implicitly indicating the importance or quantity of the indicated technical features. Moreover, "first," "second," "third," and "fourth," etc., serve only a non-exhaustive enumeration purpose and should be understood not to constitute a closed limitation on quantity.

[0034] In this application, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0035] In this application, when an element is referred to as "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. It should also be understood that, in interpreting the connection or positional relationship of elements, although not explicitly described, connection and positional relationships are interpreted to include a range of error, which should be within the acceptable deviation range of a specific value as determined by a person skilled in the art.

[0036] Traditionally, the heat dissipation layer and the decorative film are two separate structures. Compared to the decorative film, the heat dissipation layer is closer to the interior of the terminal device and is used to dissipate heat from the internal components of the terminal product. The decorative film generally includes a support film, a texture film, and an ink masking layer. The ink masking layer is located on the side of the texture film closer to the heat dissipation layer and masks the internal components of the terminal device so that the texture pattern can be observed on the outside of the terminal device. At the same time, the texture film needs to be formed by ultraviolet (UV) transfer under the support of the support film. Therefore, the texture film is usually located on the support film.

[0037] This application overcomes the limitation of the independent structures of the heat dissipation layer and the decorative film, and integrates the two structures into one to form the technical solution of this application, as detailed below:

[0038] The first aspect of this application provides a housing assembly, please refer to... Figure 1 and Figure 2In one embodiment, the housing assembly 100 includes a housing body 11 and a heat dissipation decorative layer 12 located on the housing body 11; the heat dissipation decorative layer 12 includes a shielding heat sink 121, a covering support film 122 and a textured film 123; the covering support film 122 covers the shielding heat sink 121, and the textured film 123 is located on the side surface of the covering support film away from the shielding heat sink 121 and is closer to the housing body 11 than the covering support film 122.

[0039] This embodiment integrates the traditional heat dissipation layer and decorative film into a single design. The heat sink 121, which provides shielding, not only dissipates heat but also conceals the internal components of the terminal device, allowing the textured layer 123 to be displayed and highlighted on the outside of the terminal device's casing 11. Simultaneously, the supporting film 123 not only covers the shielding heat sink 121 to prevent it from detaching but also supports the formation of the textured film 123. Through this integrated design, the resulting heat-dissipating decorative layer 12 eliminates the need for a traditional supporting film and ink shielding layer, thus saving internal space in the terminal device. This saved internal space benefits the device by reducing temperature rise without increasing overall thickness and by contributing to a thinner and lighter design without compromising heat dissipation.

[0040] Optionally, the heat dissipation decorative film 12 is distributed across the entire surface of the shell body 11, resulting in a larger heat dissipation area.

[0041] Understandably, the heat dissipation decorative layer 12 dissipates local heat generated by the terminal product evenly. That is, when the housing component 11 is assembled with internal components (including circuit boards, batteries, etc.) into a terminal device, the heat generated locally by a certain component will be evenly distributed in all positions of the heat dissipation decorative layer 12 after contacting the heat dissipation decorative layer.

[0042] Optionally, the visible light transmittance of the shielding heat sink 121 is ≤1%. For example, the visible light transmittance of the shielding heat sink 121 is 1%, 0.9%, 0.1%, 0.01%, 0.001%, etc. The lower the visible light transmittance of the shielding heat sink 121, the better the shielding effect and the better it can highlight the texture pattern.

[0043] Alternatively, the material of the heat sink is graphite. Graphite has both high thermal conductivity and low visible light transmittance, making it a suitable material for heat sinks, providing both good heat dissipation and shielding effects. Furthermore, graphite has high strength, supporting subsequent processes such as UV transfer of the textured film, electroplating, debubbling, and lamination.

[0044] Optionally, the shell body includes an electromagnetic interference (EMI) protection area, and the shielding heat sink is disposed in the EMI protection area with an opening. Graphite is conductive and has electromagnetic shielding properties. To avoid the influence of graphite on electromagnetic fields, the shielding heat sink has an opening in the EMI protection area to prevent electromagnetic interference in that area. The EMI protection area can be the area corresponding to an antenna, wireless charging coil, etc.

[0045] The thermal conductivity of the heat sink improves with increasing thickness. Considering the requirements for thinner and lighter terminal devices, the thickness of the heat sink can optionally be 1μm to 150μm. For example, the thickness of the heat sink can be 1μm, 12μm, 32μm, 60μm, 70μm, 80μm, 90μm, 100μm, or 150μm.

[0046] Graphite is prone to shedding and detaching, so coating it with a supporting film can prevent this. Optionally, the supporting film is made of polyethylene terephthalate (PET). The PET film not only coats the graphite to prevent shedding and detachment, but also provides insulation. Furthermore, the PET film supports the formation of the textured film and has explosion-proof properties. Optionally, the PET film is black to further enhance the textured pattern.

[0047] Optionally, the thickness of the supporting film on both sides of the shielding heat sink is independently 5 μm to 30 μm. For example, the thickness of the supporting film on both sides of the shielding heat sink is independently 5 μm, 10 μm, 20 μm, 22 μm, 25 μm, 28 μm, or 30 μm. It is understood that, in addition to shielding the front and back sides of the heat sink, the supporting film also covers the sides of the heat sink, with a thickness of 2 μm to 60 μm. For example, the thickness of the side coating is 2 μm, 10 μm, 20 μm, 22 μm, 25 μm, 28 μm, 40 μm, 50 μm, or 60 μm.

[0048] Optionally, the thickness of the texture layer is 1 μm to 15 μm. For example, the thickness of the texture layer is 1 μm, 5 μm, 10 μm, 12 μm, or 15 μm.

[0049] Optionally, the heat-dissipating decorative layer further includes a coating layer located on the surface of the textured film away from the covering support film. The coating layer, situated above the textured pattern of the textured layer, imparts color to the textured pattern, and combined with the shielding of the heat sink, allows the user to observe a rich pattern on the outside of the casing. The coating layer can be made of metal. In another embodiment, please refer to... Figure 3The housing assembly 200 includes a housing body 21 and a heat dissipation decorative layer 22 located on the housing body 21; the heat dissipation decorative layer 22 includes a shielding heat sink 221, a covering support film 222, a textured film 223, and a coating layer 224; the covering support film 222 covers the shielding heat sink 221, the textured film 223 is located on the surface of the covering support film away from the shielding heat sink 221, and the coating layer 224 is located on the surface of the textured film 223 away from the covering support film 222. The textured film 223 is closer to the housing body 21 than the covering support film 222, and the coating layer 224 is closer to the housing body 21 than the textured film 223.

[0050] Optionally, the thickness of the coating layer is 0.1 μm to 1.5 μm. For example, the thickness of the coating layer is 0.1 μm, 0.5 μm, 1 μm, 1.2 μm, or 1.5 μm.

[0051] With the integrated heat dissipation decorative layer design described above, compared to the traditional separate structure of heat dissipation layer and decorative film, the thickness can be reduced while maintaining the same heat dissipation effect. Optionally, the thickness of the heat dissipation decorative layer is 12.1μm~226.5μm. For example, the thickness of the heat dissipation decorative layer is 12.1μm, 20μm, 40μm, 60μm, 80μm, 90μm, 100μm, 110μm, 120μm, 130μm, 140μm, 150μm, 160μm, 170μm, 180μm, 200μm, and 226.5μm. This is beneficial for the overall thinner and lighter design of the device. At the same time, if the total thickness of the housing assembly remains unchanged, the theoretically reduced thickness can be used to thicken the heat sink in the heat dissipation decorative layer, thereby improving the heat dissipation effect.

[0052] Optionally, the housing assembly further includes an adhesive layer located between the housing body and the heat-dissipating decorative layer, bonding the two together. In yet another embodiment, see [link to another embodiment]. Figure 4 The housing assembly 300 includes a housing body 31, a heat dissipation decorative layer 32 located on the housing body 31, and an adhesive layer 33 located between the housing body 31 and the heat dissipation decorative layer 32. The heat dissipation decorative layer 32 includes a shielding heat sink 321, a covering support film 322, a texture film 323, and a coating layer 324. The covering support film 322 covers the shielding heat sink 321. The texture film 323 is located on the surface of the covering support film away from the shielding heat sink 321. The coating layer 324 is located on the surface of the texture film 323 away from the covering support film 322. The texture film 323 is closer to the housing body 31 than the covering support film 322, and the coating layer 324 is closer to the housing body 31 than the texture film 323.

[0053] Optionally, the adhesive layer is an optical adhesive layer (OCA).

[0054] Optionally, the thickness of the adhesive layer is 2μm to 50μm. For example, the thickness of the adhesive layer is 2μm, 10μm, 15μm, 18μm, 20μm, 30μm, 40μm, or 50μm.

[0055] Optionally, the housing assembly further includes a camera trim piece, the housing body having a notch corresponding to the camera trim piece, the camera trim piece being located on the outside of the housing body and connected to the edge of the notch.

[0056] The integrated design of the aforementioned heat dissipation decorative layer can improve the utilization of space in the whole machine, and achieve a high degree of integration between the thinness and lightness of the whole machine and the high thermal conductivity function. It takes into account the heat dissipation and thinness requirements of terminal devices, and can avoid problems such as reduced frame rate in games and reduced current when charging due to the overheating of the whole machine while achieving a thin and light overall design.

[0057] A second aspect of this application provides a method for manufacturing a housing assembly, which can be used in the manufacturing of the aforementioned housing assembly. Please refer to... Figure 5 ,for Figure 4 The schematic diagram of the fabrication process for the housing assembly shown includes the following steps:

[0058] S10. Use a covering support film to cover the heat sink.

[0059] Optionally, the material of the heat sink is graphite. Because graphite sheets have high temperature resistance, they cannot be processed using traditional laser cutting. This embodiment uses a die-cutting method to process the graphite sheets. The preparation method of the heat sink includes the following steps:

[0060] Graphite sheets are die-cut according to the shape and size of the shell body, and openings are die-cut at positions corresponding to the electromagnetic interference protection area of ​​the shell body to avoid airflow in the electromagnetic interference protection area.

[0061] In this process, graphite sheets are die-cut according to the shape and size of the shell body. Optionally, the shell body has a notch corresponding to the camera decorative part, and the die-cut heat sink also has a notch corresponding to the camera decorative part. Please refer to [link to relevant documentation]. Figure 6 This is a schematic diagram of the structure of the heat sink 321 obtained by die-cutting graphite sheet in this embodiment, wherein 321A is the notch and 321B is the opening.

[0062] Optionally, after covering the heat sink with a supporting film, the supporting film covers the notch and the opening. See also... Figure 7 This is a schematic diagram of the structure after the heat sink 321 is covered by the covering support film 322. The notch can be restored later by laser cutting the covering support film.

[0063] S20. A textured film is formed on the surface of the covering support film away from the shielding heat sink to prepare a heat dissipation decorative layer.

[0064] Optionally, the textured film can be formed by ultraviolet (UV) transfer. The textured film can be formed on the supporting film via UV transfer before the notch is restored by laser cutting. This allows for whole-sheet processing and is a mature technology. The notch is then restored by laser cutting of the textured film and the supporting film.

[0065] Optionally, the preparation of the heat-dissipating decorative layer further includes the following step: electroplating a coating layer on the textured film. The coating layer can be formed on the textured film by electroplating before laser cutting the supporting film to restore the gap; this allows for whole-sheet processing and is a mature technology. Subsequently, the gap is restored by laser cutting the coating layer, the textured film, and the supporting film.

[0066] S30. Fix the heat dissipation decorative layer to the inside of the shell body, wherein the textured film is closer to the shell body than the covering support film.

[0067] Optionally, an adhesive layer is bonded between the shell body and the heat dissipation decorative layer to fix the heat dissipation decorative layer inside the shell body.

[0068] Further, optionally, fixing the heat-dissipating decorative layer to the inner side of the shell body includes the following steps:

[0069] S31. An adhesive layer is attached to the heat dissipation decorative layer to obtain an intermediate product.

[0070] The adhesive layer can be applied before the laser-cut support film is used to reconstruct the gap, allowing for a single-sheet operation; this is a mature process. After applying the adhesive layer, the gap is reconstructed by laser cutting the adhesive layer, coating layer, textured film, and support film. Please refer to [link to relevant documentation]. Figure 8 This is a schematic diagram of the structure of an intermediate product after the notch is restored by laser cutting of the adhesive layer, coating layer, textured film and covering support film.

[0071] Understandably, the textured film is closer to the adhesive layer than the covering support film, and the coating layer is closer to the adhesive layer than the textured film.

[0072] S32. The intermediate product is attached to the shell body.

[0073] Understandably, the adhesive layer of the intermediate product is attached to the shell body.

[0074] Optionally, the housing body has a notch corresponding to the camera trim, and the preparation of the housing assembly further includes the step of forming a camera trim on the outside of the housing body that connects to the edge of the notch.

[0075] The aforementioned method for manufacturing the housing assembly integrates the processes for the heat dissipation layer and the decorative film, consolidating the process steps. This saves space in the entire device, improves space utilization, and achieves a high degree of integration between a thinner and lighter design and high thermal conductivity functionality. Furthermore, the production line is mature and cost-effective.

[0076] A third aspect of this application provides a terminal device. In one embodiment, the terminal device includes a display module, a circuit board, a battery, and a housing assembly as described above; the display module and the housing assembly enclose a receiving space, and the circuit board and the battery are located within the receiving space.

[0077] Optionally, the circuit board includes a motherboard, a charging board, and a sound cavity board. The heat dissipation decorative layer of the housing assembly is close to the circuit board and battery. Heat generated locally by the circuit board and battery, upon contact with the heat dissipation decorative layer, is evenly distributed throughout the entire layer. Considering that a larger heat dissipation area results in better heat dissipation, the heat dissipation decorative layer of the housing assembly is distributed across the entire surface of the housing body. In this case, both the circuit board and battery of the terminal device are covered by the heat dissipation decorative layer.

[0078] Understandably, a certain amount of space is reserved between the battery and the housing assembly for battery expansion. In this case, compared to the traditional method of bonding a heat dissipation layer to the battery with adhesive and then leaving a certain amount of space between the battery and the housing assembly, the heat dissipation decorative layer in this embodiment is integrated into the housing assembly, which eliminates the need for adhesive between the battery and the heat dissipation layer, further saving internal space of the entire device.

[0079] The terminal equipment of this application includes, but is not limited to, devices configured to receive / transmit communication signals via wired connections (such as via the Public Switched Telephone Network (PSTN), Digital Subscriber Line (DSL), digital cable, direct cable connection, and / or another data connection / network) and / or via a wireless interface (e.g., for cellular networks, wireless local area networks (WLAN), digital television networks such as DVB-H networks, satellite networks, AM-FM broadcast transmitters, and / or another communication terminal). A communication terminal configured to communicate via a wireless interface may be referred to as a "wireless communication terminal," "wireless terminal," or "mobile terminal." Examples of mobile terminals include, but are not limited to, satellite or cellular phones; personal communication system (PCS) terminals that can combine cellular radiotelephone with data processing, fax, and data communication capabilities; PDAs that may include radiotelephones, pagers, Internet / intranet access, web browsers, notepads, calendars, and / or Global Positioning System (GPS) receivers; and conventional laptop and / or handheld receivers or other electronic devices including radiotelephone transceivers. A mobile phone is a terminal device configured with a cellular communication module.

[0080] The following description is further illustrated with specific embodiments and comparative examples. Unless otherwise specified, the raw materials involved in the following specific embodiments and comparative examples are all commercially available. Unless otherwise specified, the instruments used are all commercially available. Unless otherwise specified, the processes involved are conventionally selected by those skilled in the art.

[0081] Comparative Example 1 and Example 1

[0082] Comparative Example 1 and Embodiment 1 provide the structure of a housing assembly and battery for a terminal device. Please refer to [link / reference]. Figure 9 and Figure 10 The terminal device in Comparative Example 1 includes a battery 10, a heat dissipation layer 20, and a housing assembly 400. The heat dissipation layer 20 is located above the battery 10 and includes a graphite heat sink 201 and a PET coating film 202. The PET coating film 202 covers the graphite heat sink 201. The side of the heat dissipation layer 20 away from the battery 10 is spaced apart from the housing assembly 400, and the spaced area is the battery expansion space 10A. The housing assembly 400 includes a housing body 41, a decorative film 42 located on the housing body 41, and an OCA layer 43 located between the housing body 41 and the decorative film 42. Along the direction away from the housing body 41, the decorative film 42 includes a PET substrate 421, a textured film 422, a coating layer 423, and an ink masking layer 424 stacked sequentially.

[0083] The terminal device of Embodiment 1 includes a battery 10 and a housing assembly 300. The battery 10 is the same as the battery 10 of Comparative Example 1. The battery 10 and the housing assembly 300 are spaced by the same battery expansion space 10A as in Comparative Example 1. The housing assembly 300 includes a housing body 31, a heat dissipation decorative layer 32 on the housing body 31, and an OCA layer 33 between the housing body 31 and the heat dissipation decorative layer 32. The heat dissipation decorative layer 32 includes a graphite heat sink 321, a PET coating film 322, a textured film 323, and a coating layer 324. The PET coating film 322 covers the graphite heat sink 321. The textured film 323 is located on the surface of the PET coating film 322 away from the graphite heat sink 321. The coating layer 324 is located on the surface of the textured film 323 away from the PET coating film 322. The textured film is closer to the housing body 31 than the PET coating film 322, and the coating layer 324 is closer to the housing body 31 than the textured film 323.

[0084] The thicknesses of the above-mentioned functional membranes are shown in Table 1.

[0085] Table 1

[0086]

[0087] It can be seen that, compared with Comparative Example 1, under the condition that the thickness of the graphite heat sink is the same and the heat dissipation effect is the same, the thickness of the terminal device in Example 1 can be reduced by 74μm, which is conducive to the overall thinning and lightening of the device.

[0088] Furthermore, the thermal resistance is calculated using the formula: R = d / (kA), where R is the thermal resistance (°C / W), d is the length of energy transmission (m), k is the thermal conductivity of the material (W / m°C), and A = l × t is the cross-sectional area (m²). 2 It can be seen that when the thickness of the graphite heat sink increases from 38μm to 112μm, the thermal resistance decreases by: (R1-R2) / R1 = (t2-t1) / t2 = 66%. That is, compared with Comparative Example 1, with the overall thickness of the terminal device remaining unchanged, the thermal resistance can be reduced by 66% when the thickness of the graphite heat sink in Example 1 is increased from 38μm to 112μm (an increase of 74μm), and the heat dissipation effect is greatly improved.

[0089] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0090] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A housing assembly, characterized in that, Includes a shell body and a heat-dissipating decorative layer located inside the shell body; The heat dissipation decorative layer includes a heat shield, a covering support film, and a textured film; the covering support film covers the heat shield, and the textured film is located on the side of the covering support film away from the heat shield and is closer to the shell body than the covering support film.

2. The housing assembly according to claim 1, characterized in that, The visible light transmittance of the shielding heat sink is less than 1%.

3. The housing assembly according to claim 2, characterized in that, The material of the shielding heat sink is graphite.

4. The housing assembly according to claim 3, characterized in that, The shell body includes an electromagnetic interference protection area, and the shielding heat sink is disposed in the electromagnetic interference protection area in an open manner.

5. The housing assembly according to claim 3, characterized in that, The thickness of the shielding heat sink is 1μm to 150μm.

6. The housing assembly according to claim 1, characterized in that, The material of the coating support film is polyethylene terephthalate.

7. The housing assembly according to any one of claims 1 to 6, characterized in that, The thickness of the heat dissipation decorative layer is 12.1μm~226.5μm.

8. The housing assembly according to claim 7, characterized in that, The heat dissipation decorative layer also includes a coating layer, which is located on the surface of the textured film away from the covering support film.

9. The housing assembly according to claim 8, characterized in that, Includes at least one of the following features: (1) The thickness of the supporting film covering both sides of the shielding heat sink is 5μm~30μm; (2) The thickness of the textured film is 1μm~15μm; (3) The thickness of the coating layer is 0.1μm~1.5μm.

10. The housing assembly according to any one of claims 1 to 6, 8 to 9, characterized in that, The housing assembly further includes an adhesive layer located between the housing body and the heat-dissipating decorative layer.

11. The housing assembly according to any one of claims 1 to 6, 8 to 9, characterized in that, The housing assembly also includes a camera trim piece, the housing body having a notch corresponding to the camera trim piece, the camera trim piece being located on the outside of the housing body and connected to the edge of the notch.

12. A method for preparing a housing assembly, characterized in that, Includes the following steps: Use a covering support film to cover the heat sink; A textured film is formed on the surface of the covering support film away from the shielding heat sink to prepare a heat dissipation decorative layer; The heat dissipation decorative layer is fixed to the inside of the shell body, wherein the textured film is closer to the shell body than the covering support film.

13. The method for preparing the housing assembly according to claim 12, characterized in that, The material of the shielding heat sink is graphite, and the preparation method of the shielding heat sink includes the following steps: Graphite sheets are die-cut according to the shape and size of the shell body, and openings are die-cut at positions corresponding to the electromagnetic interference protection area of ​​the shell body to avoid airflow in the electromagnetic interference protection area.

14. The method for preparing the housing assembly according to claim 13, characterized in that, The shielding heat sink has a notch corresponding to the camera decorative piece, and the covering support film covers the notch and the opening. The preparation of the housing assembly also includes the step of restoring the notch by laser cutting.

15. The method for preparing the housing assembly according to claim 12, characterized in that, The preparation of the heat dissipation decorative layer further includes the following step: electroplating a coating layer on the textured film.

16. The method for preparing the housing assembly according to any one of claims 12 to 15, characterized in that, An adhesive layer is bonded between the shell body and the heat dissipation decorative layer to fix the heat dissipation decorative layer to the inside of the shell body.

17. The method for preparing the housing assembly according to any one of claims 12 to 15, characterized in that, The housing body has a notch corresponding to the camera decorative element, and the preparation of the housing assembly further includes the following step: forming a camera decorative element on the outside of the housing body that is connected to the edge of the notch.

18. A terminal device, characterized in that, It includes a display module, a circuit board, a battery, and a housing assembly as described in any one of claims 1 to 11; the display module and the housing assembly are arranged to form a receiving space, and the circuit board and the battery are located within the receiving space.

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