Resin composition, display device, and electronic apparatus

Abstract

The invention relates to a resin composition, a display device, and an electronic apparatus. The resin composition may include: a urethane (meth) acrylate including two (meth) acryloyl groups and having a weight average molecular weight of about 10,000 g / mol to about 40,000 g / mol in an amount of about 1 wt% to about 10 wt%; a monofunctional (meth) acrylate monomer composition having a weight average molecular weight of about 500 g / mol or less in an amount of about 80 wt% to about 97 wt%; and a siloxane surfactant in an amount of from about 0.01 wt% to about 0.5 wt%. The monofunctional (meth) acrylate monomer composition may include a first monomer having a hydroxyl group in an amount of greater than about 0 wt% and about 20 wt% based on the total weight of the resin composition, and a second monomer different from the first monomer, thereby exhibiting excellent coating properties up to an edge portion, and excellent flexibility and peel strength are provided after curing.

Description

[0001] Cross Reference to Related Applications

[0002] This application claims priority to and the benefit of Japanese Patent Application No. JP 2024-160129 filed September 17, 2024, the contents of which are incorporated herein by reference in their entirety. TECHNICAL FIELD

[0003] The present disclosure relates to a resin composition, a display device, and an electronic device, and more particularly, to a resin composition, a display device including an adhesive member formed of the resin composition, and an electronic device. BACKGROUND

[0004] Various display devices for multimedia devices such as televisions, mobile phones, computers such as tablet computers, navigation systems, and game consoles are being developed. Recently, display devices including flexible display members capable of being folded, bent, or rolled, display devices to which various functions are applied, display devices including a stepped portion as a display device including a printed layer for design, and the like are being developed. A resin composition for adhesion that can be used to form an adhesive member applied to various forms of display devices needs excellent coating quality for members for various forms of display devices. SUMMARY

[0005] The present disclosure provides a resin composition having excellent coating properties.

[0006] The present disclosure also provides a display device having an adhesive member that is tightly fixed without lifting even at an end portion and has excellent flexibility to have improved reliability, and the present disclosure provides an electronic device including the display device.

[0007] Embodiments of the inventive concept provide a resin composition including: a urethane (meth)acrylate including two (meth)acryl groups and having a weight average molecular weight of about 10,000 g / mol or more and about 40,000 g / mol or less, in an amount of about 1 wt% or more and about 10 wt% or less, based on a total weight of the resin composition; a mono-functional (meth)acrylate monomer composition, in an amount of about 80 wt% or more and about 97 wt% or less; and a silicone surfactant, in an amount of about 0.01 wt% or more and about 0.5 wt% or less, wherein the mono-functional (meth)acrylate monomer composition includes: a first mono-functional (meth)acrylate monomer having a hydroxyl group and having a weight average molecular weight of about 500 g / mol or less, included in an amount of more than about 0 wt% and about 20 wt% or less, based on the total weight of the resin composition; and at least one second mono-functional (meth)acrylate monomer different from the first mono-functional (meth)acrylate monomer and having a weight average molecular weight of about 500 g / mol or less.

[0008] In embodiments, the resin composition can have a droplet surface tension of about 25 mN / m or more and about 30 mN / m or less.

[0009] In embodiments, the first mono-functional (meth)acrylate monomer can be included in an amount of about 10 wt% or more and about 20 wt% or less, based on a total weight of the resin composition.

[0010] In embodiments, the resin composition can be of a solvent-free type, i.e., can be free of a solvent.

[0011] In embodiments, the resin composition can have a viscosity of about 5 mPa·s or more and about 20 mPa·s or less at about 30℃.

[0012] In embodiments, the urethane (meth)acrylate and each of the first mono-functional (meth)acrylate monomer and the second mono-functional (meth)acrylate monomer can have a glass transition temperature of less than about 0℃.

[0013] In embodiments, the first mono-functional (meth)acrylate monomer can include 4-hydroxybutyl acrylate.

[0014] In embodiments, the second mono-functional (meth)acrylate monomer can include at least one of 2-ethylhexyl acrylate, 2-ethylhexyl diglycol acrylate, and tetrahydrofurfuryl acrylate.

[0015] In some embodiments, the resin composition may further include a photopolymerization initiator.

[0016] In the embodiments, the resin composition may be provided by inkjet printing or dispensing.

[0017] In an embodiment of the present invention, a display device includes a display module, a window disposed on the display module, and an adhesive member disposed between the display module and the window and formed of the resin composition.

[0018] In an embodiment, the adhesive member may have a storage modulus of about 0.01 MPa or greater and about 0.1 MPa or less at about 25°C.

[0019] In an embodiment, the adhesive member can have an adhesive strength of approximately 800 gf / 25 mm or greater to a glass substrate or polyethylene terephthalate (PET) film at approximately 25°C.

[0020] In an embodiment, the lower surface of the window adjacent to the adhesive member may include glass, and the upper surface of the display module adjacent to the adhesive member may include polyethylene terephthalate (PET), and the resin composition may have a droplet surface tension of about 25 mN / m or greater and about 30 mN / m or less for polyethylene terephthalate (PET).

[0021] In one embodiment, the display module may be foldable relative to at least one folding axis.

[0022] In an embodiment, the display device may further include a light control layer disposed between the adhesive member and the window, and an optical adhesive layer disposed between the light control layer and the window, wherein the optical adhesive layer may include a polymer derived from the resin composition.

[0023] In an embodiment of the present invention, an electronic device includes a display device comprising at least one adhesive member disposed between adjacent first and second members and formed of the aforementioned resin composition.

[0024] In this embodiment, the display device may be a vehicle display device, a television, a monitor, a game console, a tablet computer, a mobile phone, a camera, a laptop computer, a personal computer, a personal digital assistant, or a billboard. Attached Figure Description

[0025] The accompanying drawings are included to provide a further understanding of the inventive concept, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the inventive concept and, together with the description, serve to explain the principles of the inventive concept. In the drawings:

[0026] Figure 1A This is a perspective view showing the unfolded state of the display device according to an embodiment;

[0027] Figure 1B This is a perspective view illustrating the folding operation of the display device according to an embodiment;

[0028] Figure 1C This is a plan view showing the folded state of the display device according to an embodiment;

[0029] Figure 1D This is a perspective view illustrating the folding operation of the display device according to an embodiment;

[0030] Figure 2 This is an exploded perspective view of the display device according to an embodiment;

[0031] Figure 3 It is shown that... Figure 2 A cross-sectional view of the portion corresponding to line I-I';

[0032] Figure 4 This is a cross-sectional view showing a portion of a display device according to an embodiment;

[0033] Figure 5A This is an exemplary diagram illustrating the steps of providing a resin composition according to an embodiment;

[0034] Figure 5B This is an illustrative diagram showing the steps following the bonding of the adhesive members according to an embodiment;

[0035] Figure 6 This is a diagram schematically illustrating the coating characteristics of the resin composition according to an embodiment;

[0036] Figure 7 This is a cross-sectional view of a display device according to another embodiment of the present invention;

[0037] Figure 8 This is a cross-sectional view of a display device according to another embodiment of the present invention. Detailed Implementation

[0038] The inventive concept can have various modifications and forms, and specific embodiments of the inventive concept are shown in the accompanying drawings and described in detail in this specification. However, this is not intended to limit the inventive concept to the specific forms disclosed, but should be understood to include all modifications, equivalents, or substitutions falling within the spirit and technical scope of the inventive concept.

[0039] In this specification, it will be understood that when an element (or region, layer, or portion, etc.) is referred to as being "on" another element, "connected to" or "coupled to" another element, the element may be directly disposed on, directly connected to or coupled to the other element, or other elements may be disposed between the element and the other element.

[0040] The same reference numerals or symbols always refer to the same elements. In the drawings, the thickness, scale, and dimensions of the elements are exaggerated for the purpose of effectively describing the technical content. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed elements.

[0041] It will be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, the elements are not limited by these terms. These terms are used only to distinguish one element from another. For example, a first element discussed below may be referred to as a second element without departing from the scope of the inventive concept. Similarly, a second element may be referred to as a first element. Unless the context clearly indicates otherwise, the singular expressions “a,” “an,” and “the” are intended to include the plural forms as well.

[0042] Additionally, terms such as "below," "under," "on the lower side," "above," "above," or "on the upper side" may be used to describe the relationship between the elements shown in the accompanying drawings. These terms are relative concepts and are based on the directions indicated in the drawings.

[0043] It will be further understood that when the terms “comprises and / or comprising,” “includes and / or including,” and “has and / or having” are used in this specification, it indicates the presence of the stated features, numbers, steps, operations, elements, components, or combinations thereof, but does not exclude the possibility of the presence or addition of one or more other features, numbers, steps, operations, elements, components, and / or combinations thereof.

[0044] In this specification, "direct placement" may mean that there is no additional layer, film, region, or substrate between one part of a layer, film, region, or substrate and another part of it. For example, "direct placement" may mean placement between two layers or two components without the use of additional components such as adhesive members.

[0045] In this specification, "-class" may mean including the material named. For example, "polyimide polymers" includes or contains polyimide.

[0046] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It will be further understood that, unless expressly defined herein, terms (such as those defined in common dictionaries) shall be interpreted as having a meaning consistent with their meaning in the context of the relevant field and shall not be interpreted in an idealized or overly formalized sense.

[0047] In the following description, the resin composition according to the embodiments, as well as the display device and electronic device according to the embodiments, will be described with reference to the accompanying drawings.

[0048] For example, the electronic device may include a display device and a control component (not shown) for controlling the display device. The electronic device according to an embodiment can be activated in response to an electrical signal. The electronic device may include a display device according to an embodiment. For example, the electronic device may include: large-size display devices, including televisions, monitors, or billboards; and small-to-medium-size display devices, including personal computers, laptops, personal digital assistants, vehicle displays such as car navigation systems, mobile phones, tablet computers, game consoles, portable electronic devices, or cameras. However, the embodiments are not limited thereto.

[0049] Figure 1A The example shown is a display device DD that is a mobile phone. Figure 1A This is a perspective view showing the unfolded state of the display device DD according to an embodiment.

[0050] The display device DD may include a first display surface FS defined by a first orientation axis DR1 and a second orientation axis DR2 intersecting the first orientation axis DR1. The display device DD may provide an image IM to a user through the first display surface FS. The image IM may include still images and moving images. The display device DD may display the image IM towards a third orientation axis DR3 through the first display surface FS, which is parallel to each of the first orientation axis DR1 and the second orientation axis DR2.

[0051] In this disclosure, the first direction axis DR1 and the second direction axis DR2 may intersect each other, and the third direction axis DR3 may be the normal direction of the plane defined by the first direction axis DR1 and the second direction axis DR2. The thickness direction of the display device DD may be parallel to the third direction axis DR3 and may be indicated by the same reference numerals. The front surface (or upper surface) and the rear surface (or lower surface) may be opposite to each other on the third direction axis DR3, and the normal direction of each of the front surface (or upper surface) and the rear surface (or lower surface) may be parallel to the third direction axis DR3. The front surface (or upper surface) refers to the surface adjacent to the first display surface FS, and the rear surface (or lower surface) refers to the surface spaced apart from the first display surface FS. In addition, the rear surface (or lower surface) refers to the surface close to the second display surface RS, which will be described below. The upper side refers to the direction close to the first display surface FS, and the lower side refers to the direction away from the first display surface FS.

[0052] A cross section refers to a surface parallel to the thickness direction DR3, and a plane refers to a surface perpendicular to the thickness direction DR3. A plane is defined by the first directional axis DR1 and the second directional axis DR2.

[0053] In this specification, the directions indicated by the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3 can be relative concepts and therefore can be changed to other directions. Furthermore, the directions indicated by the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3 can be described as first direction DR1, second direction DR2, and third direction DR3, and can be indicated by the same reference numerals or symbols.

[0054] The display device DD can detect external inputs applied from the outside. External inputs can include various types of inputs provided from outside the display device DD. For example, external inputs can include not only external inputs applied through contact with a part of the user's body (such as a hand), but also external inputs applied near or adjacent to the display device DD at a predetermined distance (e.g., hovering). Furthermore, external inputs can take various forms such as force, pressure, temperature, and light.

[0055] The display device DD may include a first display surface FS and a second display surface RS. The first display surface FS may include a first active region F-AA, a first peripheral region F-NAA, and an electronic module region EMA. The second display surface RS may be defined as a surface opposite to at least a portion of the first display surface FS. That is, the second display surface RS may be defined as a portion of the rear surface of the display device DD.

[0056] The first active region F-AA can be a region that is activated in response to an electrical signal. The first active region F-AA can be a region on which an image IM is displayed, and it is a region capable of detecting various types of external inputs.

[0057] The first peripheral region F-NAA may be adjacent to the first active region F-AA. The first peripheral region F-NAA may have a predetermined color. The first peripheral region F-NAA may surround the first active region F-AA. Therefore, the shape of the first active region F-AA may be substantially defined by the first peripheral region F-NAA. However, this is just an example, and the first peripheral region F-NAA may also be set to be adjacent only to one side of the first active region F-AA, and may also be omitted.

[0058] Various electronic modules can be disposed in the Electronic Module Area (EMA). For example, the electronic module may include at least one of a camera, a speaker, a light detection sensor, and a thermal detection sensor. The EMA can detect external objects received via the Display Surface (FS) and the Rear Surface (RS), or provide sound signals such as speech to the outside via the Display Surface (FS) and the RS. The electronic module may also include multiple components and is not limited to any one embodiment.

[0059] The electronic module region EMA can be surrounded by a first peripheral region F-NAA. However, this is an example and is not limited to any one embodiment. For example, the electronic module region EMA can be surrounded by a first active region F-AA and a first peripheral region F-NAA, and the electronic module region EMA can be disposed within the first active region F-AA.

[0060] In an embodiment, the display device DD may be a flexible display device. The display device DD according to an embodiment may include at least one folded region FA and a plurality of non-folded regions NFA1 and NFA2 extending from the folded region FA. For example, a first non-folded region NFA1, a folded region FA, and a second non-folded region NFA2 may be defined along a second direction DR2. In an embodiment, the display device DD may include a first non-folded region NFA1 and a second non-folded region NFA2 spaced apart from each other along the second direction DR2, with the folded region FA between the first non-folded region NFA1 and the second non-folded region NFA2. For example, the first non-folded region NFA1 may be disposed on one side of the folded region FA along the second direction DR2, and the second non-folded region NFA2 may be disposed on the other side of the folded region FA along the second direction DR2.

[0061] Figure 1AThe illustration shows an embodiment of a display device DD including a folded region FA, but the embodiment is not limited thereto, and multiple folded regions may be defined in the display device DD. For example, the display device according to the embodiment may include two or more folded regions, and may also include three or more non-folded regions, with each folded region disposed between the multiple non-folded regions.

[0062] Figure 1B This is a perspective view illustrating the folding operation of the display device DD according to an embodiment. Figure 1C This is a plan view showing the folded state of the display device DD according to an embodiment. Figure 1D This is a perspective view illustrating the folding operation of the display device DD according to an embodiment.

[0063] refer to Figure 1B According to an embodiment, the display device DD can be folded relative to a first folding axis FX1 extending in a first direction DR1. When the display device DD is folded, the folding region FA can have a predetermined curvature and radius of curvature. The display device DD can be folded relative to the first folding axis FX1 to deform into an inward folded state in which the first non-folded region NFA1 and the second non-folded region NFA2 face each other and the first display surface FS is not exposed to the outside.

[0064] refer to Figure 1C In the inward-folded state of the display device DD according to an embodiment, the user can view the second display surface RS. At this time, the second display surface RS may include a displayed image (e.g., Figure 1A The second active region R-AA of the image (IM) is a region that is activated in response to an electrical signal. The second active region R-AA can be a region on which the image is displayed, and is a region capable of detecting various types of external inputs.

[0065] The second peripheral region R-NAA may be adjacent to the second active region R-AA. The second peripheral region R-NAA may have a predetermined color. The second peripheral region R-NAA may surround the second active region R-AA. Additionally, although not shown in the figures, the display device DD may also include an electronic module region (e.g., an electronic module having various components) also disposed on the second display surface RS. Figure 1A The electronic module area (EMA) in the embodiment is not limited to any one of the embodiments.

[0066] refer to Figure 1DAccording to an embodiment, the display device DD can be folded relative to a second folding axis FX2 extending in a first direction DR1. The display device DD can be folded relative to the second folding axis FX2 and can be deformed into an outward folded state, such that the first display surface FS is exposed to the outside. In an embodiment, the display device DD can be provided to perform a repeated operation from unfolding to inward folding or outward folding, but the embodiment is not limited thereto.

[0067] Figures 1A-1D An exemplary illustration shows a display device DD folded relative to a folding axis FX1 or FX2, but the number of folding axes and the corresponding number of non-folded areas are not limited thereto. For example, the display device DD may be folded relative to multiple folding axes such that a portion of the first display surface FS and a portion of the second display surface RS face each other. Additionally, it is shown that the first folding axis FX1 and the second folding axis FX2 are parallel to the long side of the display device DD, but the embodiment is not limited thereto, and the first folding axis FX1 and the second folding axis FX2 may be parallel to the short side of the display device DD.

[0068] In the display device DD, when the display device DD is in such a state Figure 1C In the folded state shown, the first non-folded region NFA1 and the second non-folded region NFA2 can be defined as portions having display surfaces FS and RS respectively parallel to the plane defined by the first direction axis DR1 and the second direction axis DR2, and the folded region FA can be defined as the region between the first non-folded region NFA1 and the second non-folded region NFA2. The folded region FA may include a curved surface portion that is bent to have a predetermined curvature in the folded state.

[0069] Figure 2 This is an exploded perspective view showing a display device DD according to an embodiment. (Reference) Figure 2 According to an embodiment, the display device DD may include a display module DM, a window WP disposed on the display module DM, and an adhesive member AP disposed between the display module DM and the window WP. Additionally, the display device DD may also include a support member SM disposed below the display module DM, a protective layer PF disposed on the window WP, and a housing HAU that accommodates the display module DM.

[0070] The housing HAU can comprise a material with relatively high rigidity. For example, the housing HAU can comprise multiple frames and / or multiple plates comprising glass, plastic (i.e., polymer), or metal. The housing HAU can provide a predetermined housing space. The display module DM can be housed within the housing space and thus protected from external impacts.

[0071] The support member SM may comprise a metallic or polymeric material. For example, the support member SM may comprise stainless steel, aluminum, or alloys thereof. Optionally, the support member SM may also comprise carbon fiber reinforced plastic (CFRP), etc. However, the embodiments are not limited thereto, and the support member SM may comprise non-metallic materials (such as plastic, glass fiber reinforced plastic, or glass) or a combination of at least two different materials. Contrary to what is shown in the accompanying drawings, the support member SM may also be omitted.

[0072] Although not shown in the accompanying drawings, the display device DD may also include a padding layer, a shielding layer, or other layers disposed beneath the support member SM. The padding layer may include an elastomer such as sponge, foam, or polyurethane. The shielding layer may be an electromagnetic shielding layer, and other layers may be heat dissipation layers, etc.

[0073] The display module DM can be activated in response to an electrical signal. Upon activation, the display module DM can be positioned on the first display surface FS (see...). Figure 1A The image IM is displayed in (see) Figure 1A The display module DM can define a display area AA-DM and a non-display area NAA-DM. The display area AA-DM can be an area that is activated in response to an electrical signal. The non-display area NAA-DM can be an area adjacent to at least one side of the display area AA-DM. In the non-display area NAA-DM, circuitry or wiring for driving the display area AA-DM can be provided.

[0074] An adhesive member AP can be disposed on the display module DM. The display module DM and the window WP can be bonded to each other via the adhesive member AP. The adhesive member AP can contact the lower surface of the window WP and the upper surface of the display module DM. In an embodiment, the adhesive member AP can be made of a resin composition according to an embodiment described below (e.g., Figure 5A and Figure 6 The resin composition (RC) is formed in the process. Figure 2 The illustration shows an adhesive member AP disposed between the window WP and the display module DM, but the embodiment is not limited thereto. The adhesive member AP, formed from the resin composition according to the embodiment, can be disposed between any two adjacent components or layers (e.g., padding layer, shielding layer or other layers, protective layer PF, window WP, and housing HAU, etc.) included in the display device DD. Therefore, at least one adhesive member AP can be included in the display device DD.

[0075] The adhesive member AP according to the embodiments may include a polymer derived from the resin composition according to the embodiments. In the embodiments, the adhesive member AP can be formed by providing the resin composition according to the embodiments described below and then photocuring the resin composition according to the embodiments described below. The adhesive member AP formed from the resin composition according to the embodiments can be configured to sufficiently cover bends and steps, etc., on one surface of each of the display module DM and the adjacent window WP. In addition, the adhesive member AP according to the embodiments can be provided with a substantially uniform thickness according to the viscosity, surface tension and adhesive properties of the resin composition according to the embodiments up to the portion adjacent to the edge region of the display module DM and the window WP, thereby exhibiting excellent bonding properties.

[0076] The window WP may include a glass substrate. The window WP can protect the display module DM, etc. The image IM generated in the display module DM (see...) Figure 1A It can penetrate the window WP to provide access to the user. For example, the window WP may include ultra-thin glass (UTG).

[0077] The window WP may include a transmissive region TA and a border region BZA. The transmissive region TA may overlap with at least a portion of the display region AA-DM of the display module DM. The transmissive region TA may be an optically transparent region. Image IM (see...) Figure 1A It can be provided to the user through the transmission area TA.

[0078] Compared to the transmission region TA, the border region BZA can be a region with relatively low light transmittance. The border region BZA can define the shape of the transmission region TA. The border region BZA can be adjacent to the transmission region TA and can surround the transmission region TA.

[0079] The border area BZA may have a predetermined color. The border area BZA may cover the non-display area NAA-DM of the display module DM to prevent the non-display area NAA-DM from being seen from the outside. However, the embodiments are not limited to what is shown in the figures, and the border area BZA may also be configured to be adjacent only to one side of the transmissive area TA, and at least a portion of the border area BZA may be omitted.

[0080] The protective layer PF can be a functional layer protecting one surface (e.g., the top surface) of the window WP. The protective layer PF may include polyethylene terephthalate (PET). The protective layer PF may include an anti-fingerprint coating, a hard coating, an antistatic agent, etc. Simultaneously, an auxiliary adhesive layer (not shown) may be disposed between the window WP and the protective layer PF, and the auxiliary adhesive layer (not shown) may include a resin composition RC derived from the embodiments described below (see [link to example]). Figure 5A and Figure 6The polymer. Unlike what is shown in the accompanying drawings, the protective layer PF may also be omitted.

[0081] Figure 3 It is shown that... Figure 2 A cross-sectional view of the portion corresponding to line I-I'. Figure 3 This can be a cross-sectional view of the display device DD according to an embodiment. Figure 3 For ease of description, the housing HAU is omitted, and the support member SM, display module DM, adhesive member AP, window WP, and protective layer PF are shown.

[0082] refer to Figure 3 The support member SM may include a first support portion MP1 overlapping a first non-folded region NFA1 and a second support portion MP2 overlapping a second non-folded region NFA2. The first support portion MP1 and the second support portion MP2 may be spaced apart from each other by folded regions FA. The first support portion MP1 and the second support portion MP2 may not overlap with folded regions FA. Contrary to what is shown in the figures, at least a portion of the first support portion MP1 and at least a portion of the second support portion MP2 may overlap with folded regions FA.

[0083] The display module DM may include a display panel DP and an input sensing component TP disposed on the display panel DP. The display panel DP may include a substrate BS, a circuit layer DP-CL disposed on the substrate BS, a display element layer DP-EL disposed on the circuit layer DP-CL, and an encapsulation layer TFE covering the display element layer DP-EL. An adhesive component AP may be disposed between the display panel DP and the window WP. The adhesive component AP may also be disposed between the input sensing component TP and the window WP.

[0084] Figure 3 The components and their arrangement shown in the display panel DP are illustrative, and the components and their arrangement of the display panel DP are not limited thereto. For example, the display panel DP may include liquid crystal display elements, and in this case, the encapsulation layer TFE may be omitted.

[0085] The substrate BS can provide a substrate surface on which the circuit layer DP-CL is disposed. The substrate BS can be a flexible substrate capable of being bent, folded, or rolled. The substrate BS can be a glass substrate, a metal substrate, or a polymer substrate, or a combination of materials. However, the embodiments are not limited thereto, and the substrate BS can include inorganic layers, organic layers, or composite material layers.

[0086] The circuit layer DP-CL may include insulating layers, semiconductor patterns, and conductive patterns such as signal lines. For example, the circuit layer DP-CL may include light-emitting elements (EDs) for driving the display element layer DP-EL (see [link to documentation]).Figure 4 ( ) switching transistors and driving transistors.

[0087] The display element layer DP-EL may include light-emitting elements ED (see...) Figure 4 For example, light-emitting elements (ED) (see...) Figure 4 This can include organic light-emitting materials, inorganic light-emitting materials, organic-inorganic light-emitting materials, quantum dots, quantum rods, micro light-emitting diodes (LEDs) or nano LEDs.

[0088] A TFE (Transmission Equipment) encapsulation layer can be disposed on the display element layer (DP-EL). The TFE protects the DP-EL from moisture, oxygen, and / or foreign substances such as dust particles. The TFE may include at least one inorganic layer. Alternatively, the TFE may include at least one organic layer and at least one inorganic layer. For example, the TFE may include inorganic, organic, and inorganic layers stacked sequentially.

[0089] The input sensing component TP can be disposed between the display panel DP and the window WP. For example, the input sensing component TP can be directly disposed on the encapsulation layer TFE of the display panel DP.

[0090] In this specification, "a component directly sets / provides" on another component means that no intermediate component is set / provided between the two components. That is, "a component directly sets / provides" on another component means that the two components are "in contact" with each other.

[0091] The input sensing component TP can detect external input and convert it into a predetermined input signal, and can provide the input signal to the display panel DP. For example, in the display device DD according to an embodiment, the input sensing component TP can be a touch sensing component that detects touch. The input sensing component TP can recognize direct touch by a user, indirect touch by a user, direct touch by an object, or indirect touch by an object, etc.

[0092] The input sensing component TP can detect at least one of the location and intensity (pressure) of a touch applied from an external source. In embodiments, the input sensing component TP can have various structures or may include various materials, and is not limited to any one embodiment. For example, the input sensing component TP can detect external input capacitively. The display panel DP can receive input signals from the input sensing component TP and can generate an image corresponding to the input signals (e.g., Figure 1A (Image IM in the image).

[0093] The window WP may include a substrate layer BL and a printed layer BM. Although not shown in the figures, the window WP may also include at least one functional layer (not shown) provided on the substrate layer BL. For example, the functional layer (not shown) may be a hard coating or an anti-fingerprint coating, etc., but the embodiments are not limited thereto.

[0094] The substrate layer BL may include an optically transparent insulating material. The substrate layer BL may be a glass substrate or a plastic (i.e., polymer) substrate. For example, the substrate layer BL may be a reinforced glass substrate. Additionally, the substrate layer BL may have a sufficiently small thickness to enable folding operations.

[0095] The substrate layer BL can be an ultrathin glass (UTG) substrate. Additionally, the window WP can include a flexible polymer. For example, the substrate layer BL can be made of polyimide, polyacrylate, polymethyl methacrylate, polycarbonate, polyethylene terephthalate, polyethylene naphthalate, polyvinylidene chloride, polyvinylidene fluoride, polystyrene, ethylene vinyl alcohol copolymer, or combinations thereof. However, the embodiments are not limited thereto, and any general materials and / or forms known in the relevant art as cover windows can be used without limitation.

[0096] The printed layer BM can be disposed on one surface of the substrate layer BL. The printed layer BM can be provided as a pattern layer on the lower surface of the substrate layer BL adjacent to the display module DM. The printed layer BM can be disposed on the boundary region of the substrate layer BL. The printed layer BM can be an ink-printed layer. Alternatively, the printed layer BM can be a layer comprising pigments or dyes. In the window WP, the border region BZA can be the portion in which the printed layer BM is disposed.

[0097] Step SP-a may be present between the portion of the printed layer BM and the substrate layer BL where the printed layer BM is not provided. The adhesive member AP may be formed from the resin composition according to the embodiment and may be bonded to the window WP at the step SP-a portion without lifting.

[0098] The adhesive component AP can have a thickness T0 of approximately 10 micrometers (μm) or larger and approximately 500 μm or smaller, approximately 10 μm or larger and approximately 300 μm or smaller, or approximately 10 μm or larger and approximately 100 μm or smaller. For example, the thickness T0 of the adhesive component AP can be approximately 10 μm or larger and approximately 50 μm or smaller. However, this is just an example, and the thickness T0 of the adhesive component AP is not limited to this.

[0099] In an embodiment, the adhesive member AP may have a storage modulus of approximately 0.01 MPa or greater and approximately 0.1 MPa or less at approximately 25°C. The storage modulus can be measured using an MCR302 (Anton Paar) dynamic viscoelasticity measuring instrument. The adhesive member AP according to the embodiment, having a storage modulus of approximately 0.01 MPa or greater and approximately 0.1 MPa or less at approximately 25°C, can exhibit excellent flexibility and therefore can easily undergo repeated folding and unfolding operations. Therefore, the adhesive member AP according to the embodiment can be applied to a flexible display device DD.

[0100] In the embodiments, the adhesive member AP can have a 180° peel strength of approximately 800 g-forces per 25 mm (gf / 25 mm) or greater against at least one of the glass substrate and the polymer substrate at approximately 25°C. The polymer substrate may include polyethylene terephthalate (PET). The adhesive member AP according to the embodiments can have a 180° peel strength of approximately 800 gf / 25 mm or greater against at least one of the glass substrate and the polymer substrate at approximately 25°C, and therefore can exhibit excellent adhesive reliability.

[0101] Because the adhesive member AP according to the embodiment has a storage modulus of about 0.01 MPa or greater and about 0.1 MPa or less, and has a 180° peel strength of about 800 gf / 25 mm or greater for at least one of the glass substrate and the polymer substrate at about 25°C, peeling and damage are minimized and / or do not occur during bending, and therefore, the adhesive member AP can be suitably applied to the flexible display device DD.

[0102] In this embodiment, the adhesive member AP can contact the lower surface of the window WP and the upper surface of the display module DM. For example, the lower surface of the window WP can be made of glass, and the upper surface of the display module DM can be made of polyethylene terephthalate (PET).

[0103] Figure 4 This is a cross-sectional view showing a portion of a display device according to an embodiment. Specifically, Figure 4 It is shown in detail Figure 3 A cross-sectional view of the display module DM. Figure 4 The construction of the display module DM shown is an example, and the embodiments are not limited thereto.

[0104] exist Figure 4In this specification, the substrate BS may comprise a single layer or multiple layers. For example, the substrate BS may comprise a first synthetic polymer layer, multiple or single-layer inorganic layers, and a second synthetic polymer layer disposed on the multiple or single-layer inorganic layers. The first and second synthetic polymer layers may each comprise a polyimide polymer or a polymer composition. Additionally, the first and second synthetic polymer layers may each comprise at least one of the following: cured acrylic resin, methacrylic resin, polyisoprene resin, ethylene resin, epoxy resin, urethane resin, cellulose resin, siloxane resin, polyamide resin, and perylene resin. In this specification, "~~" type resin refers to a functional group or cured product including "~~".

[0105] The display panel DP may include transistors (TR) and light-emitting elements (ED). The transistors (TR) and light-emitting elements (ED) may be disposed on the substrate (BS). Figure 4 A transistor TR is shown, but the display panel DP may include a plurality of transistors for driving the light-emitting element ED and at least one capacitor.

[0106] The circuit layer DP-CL can be disposed on the substrate BS. The circuit layer DP-CL may include a shielding electrode BML, a transistor TR, a connection electrode CNE, and multiple insulating layers BFL and INS1 to INS6. The multiple insulating layers BFL and INS1 to INS6 may include a buffer layer BFL and first insulating layers INS1 to sixth insulating layers INS6. However, Figure 4 The stacked structure of the DP-CL circuit layer shown is an example, and the stacked structure of the DP-CL circuit layer can be changed according to the construction of the display panel DP and the process of the DP-CL circuit layer.

[0107] A shielding electrode BML can be disposed on the substrate BS. The shielding electrode BML can overlap with the transistor TR. The shielding electrode BML can block light incident on the transistor TR from the bottom of the display panel DP and protect the transistor TR. The shielding electrode BML can include a conductive material. When a voltage is applied to the shielding electrode BML, the threshold voltage of the transistor TR disposed on the shielding electrode BML can be maintained. However, the embodiments are not limited thereto, and the shielding electrode BML can be a floating electrode. The shielding electrode BML can also be omitted.

[0108] A buffer layer BFL can be disposed on a substrate BS to cover the shielding electrode BML. The buffer layer BFL may include an inorganic layer. The buffer layer BFL can improve the adhesion between the semiconductor pattern or conductive pattern disposed on the buffer layer BFL and the substrate BS.

[0109] A transistor TR may include a source S1, a channel C1, a drain D1, and a gate G1. The source S1, channel C1, and drain D1 of the transistor TR may be formed from a semiconductor pattern. The semiconductor pattern of the transistor TR may include polycrystalline silicon, amorphous silicon, or metal oxide, and any material may be applied to it without limitation, as long as it has semiconductor properties, and is not limited to any particular embodiment.

[0110] A semiconductor pattern can include multiple regions divided according to their electrical conductivity. Regions of the semiconductor pattern that are doped with dopant or where the metal oxide is reduced can have high conductivity and can essentially serve as the source and drain electrodes of a transistor TR. Regions of the semiconductor pattern with high conductivity can correspond to the source S1 and drain D1 of the transistor TR. Undoped or lightly doped regions of the semiconductor pattern, or regions where the metal oxide is not reduced and have low conductivity, can correspond to the channel C1 (or active portion) of the transistor TR.

[0111] The first insulating layer INS1 can be disposed on the buffer layer BFL by covering the semiconductor pattern of the transistor TR. The gate G1 of the transistor TR can be disposed on the first insulating layer INS1. In the plane, the gate G1 can overlap with the channel C1 of the transistor TR. The gate G1 can be used as a mask in the process of doping the semiconductor pattern of the transistor TR.

[0112] The second insulating layer INS2 can be disposed on the first insulating layer INS1 by covering the gate G1. The third insulating layer INS3 can be disposed on the second insulating layer INS2.

[0113] The connection electrode CNE may include a first connection electrode CNE1 and a second connection electrode CNE2 for electrically connecting the transistor TR to the light-emitting element ED. However, the construction of the connection electrode CNE for electrically connecting the transistor TR and the light-emitting element ED is not limited thereto, and either the first connection electrode CNE1 and the second connection electrode CNE2 may be omitted, or additional connection electrodes may be further included.

[0114] The first connecting electrode CNE1 can be disposed on the third insulating layer INS3. The first connecting electrode CNE1 can be connected to the drain electrode D1 through the first contact hole CH1 passing through the first insulating layer INS1 to the third insulating layer INS3. The fourth insulating layer INS4 can be disposed on the third insulating layer INS3 by covering the first connecting electrode CNE1. The fifth insulating layer INS5 can be disposed on the fourth insulating layer INS4.

[0115] The second connecting electrode CNE2 can be disposed on the fifth insulating layer INS5. The second connecting electrode CNE2 can be connected to the first connecting electrode CNE1 through the second contact hole CH2 passing through the fourth insulating layer INS4 and the fifth insulating layer INS5. The sixth insulating layer INS6 can be disposed on the fifth insulating layer INS5 by covering the second connecting electrode CNE2.

[0116] The first insulating layer INS1 to the sixth insulating layer INS6 may each comprise an inorganic layer or an organic layer. For example, the inorganic layer may comprise at least one of alumina, titanium dioxide, silicon dioxide, silicon oxynitride, zirconium oxide, and hafnium oxide. The organic layer may comprise at least one of acrylic resins, methacrylic resins, polyisoprene resins, ethylene resins, epoxy resins, urethane resins, cellulose resins, siloxane resins, polyamide resins, and perylene resins.

[0117] The display element layer DP-EL may include a pixel-defining film (PDL) and a light-emitting element (ED). The light-emitting element ED may include a first electrode (AE), a hole control layer (HCL), a light-emitting layer (EML), an electronic control layer (TCL), and a second electrode (CE).

[0118] The first electrode AE ​​can be disposed on the sixth insulating layer INS6. The first electrode AE ​​can be connected to the second connecting electrode CNE2 through the third contact hole CH3 passing through the sixth insulating layer INS6. The first electrode AE ​​can be electrically connected to the drain D1 of the transistor TR through the first connecting electrode CNE1 and the second connecting electrode CNE2.

[0119] The first electrode AE ​​may comprise a metallic material, a metallic alloy, or a conductive compound. The first electrode AE ​​may be an anode or a cathode. However, the embodiments are not limited thereto. Additionally, the first electrode AE ​​may be a pixel electrode. The first electrode AE ​​may be a transmissive electrode, a semi-transmissive / semi-reflective electrode, or a reflective electrode. The first electrode AE ​​may comprise: at least one selected from Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti, W, In, Sn, and Zn; a compound selected from at least two of them; a mixture selected from at least two of them; or an oxide thereof.

[0120] When the first electrode AE ​​is a transmission electrode, it may comprise a transparent metal oxide, such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), etc. When the first electrode AE ​​is a semi-transmissive / semi-reflective electrode or a reflective electrode, it may comprise Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti, W, or compounds or mixtures thereof (e.g., mixtures of Ag and Mg), or materials having a multilayer structure such as LiF / Ca (a stacked structure of LiF and Ca) or LiF / Al (a stacked structure of LiF and Al). Optionally, the first electrode AE ​​may have a multilayer structure comprising a reflective or semi-transmissive / semi-reflective film containing the aforementioned materials and a transparent conductive film, such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), etc. For example, the first electrode AE ​​may have a three-layer structure of ITO / Ag / ITO, but is not limited thereto. Furthermore, the embodiments are not limited thereto, and the first electrode AE ​​may include the aforementioned metallic material, a combination of at least two metallic materials selected from the aforementioned metallic materials, or an oxide of the aforementioned metallic material, etc.

[0121] A pixel-defining film (PDL) can be disposed on a sixth insulating layer (INS6). A light-emitting opening (PX_OP) exposing a portion of the first electrode (AE) can be defined in the pixel-defining film (PDL). The portion of the first electrode (AE) exposed by the light-emitting opening (PX_OP) can be defined as the light-emitting region (LA).

[0122] The display area AA-DM of the display module DM can include a light-emitting area LA and a light-blocking area NLA. The area where the pixel limiting film PDL is located can correspond to the light-blocking area NLA. The light-blocking area NLA can surround the light-emitting area LA within the display area AA-DM.

[0123] A hole control layer (HCL) can be disposed on the first electrode (AE) and the pixel-defining film (PDL). The hole control layer (HCL) can be provided as a common layer overlapping the light-emitting region (LA) and the light-blocking region (NLA). Alternatively, the hole control layer (HCL) can be provided only in the region corresponding to the light-emitting opening (PX_OP). The hole control layer (HCL) can include at least one of a hole transport layer, a hole injection layer, and an electron blocking layer. The hole control layer (HCL) can include known hole injection materials and / or known hole transport materials.

[0124] The luminescent layer (EML) can be disposed on the hole control layer (HCL). The EML can be disposed in the region corresponding to the luminescent opening (PX_OP). Alternatively, the EML can be provided as a common layer. The EML can include organic and / or inorganic luminescent materials. The EML can emit light of any color, including red, green, and blue. For example, the EML can emit blue light.

[0125] An electron control layer (TCL) can be disposed on the light-emitting layer (EML). The TCL can be provided as a common layer overlapping the light-emitting region (LA) and the light-blocking region (NLA). Alternatively, the TCL can be provided only in the region corresponding to the light-emitting opening (PX_OP). The TCL can include at least one of an electron transport layer, an electron injection layer, and a hole blocking layer. The TCL can include known electron injection materials and / or known electron transport materials.

[0126] The second electrode CE can be disposed on the electronic control layer TCL. The second electrode CE can be provided as a common layer overlapping the light-emitting region LA and the light-blocking region NLA.

[0127] The second electrode CE can be a common electrode. The second electrode CE can be a cathode or an anode, but the embodiments are not limited thereto. For example, if the first electrode AE ​​is an anode, the second electrode CE can be a cathode, and if the first electrode AE ​​is a cathode, the second electrode CE can be an anode.

[0128] The second electrode CE can be a transmission electrode, a semi-transmission / semi-reflection electrode, or a reflection electrode. When the second electrode CE is a transmission electrode, it can include a transparent metal oxide, such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), etc.

[0129] When the second electrode CE is a semi-transmissive / semi-reflective electrode or a reflective electrode, the second electrode CE may include Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti, Yb, W, or compounds or mixtures thereof (e.g., AgMg, AgYb, or MgYb), or a material having a multilayer structure such as LiF / Ca or LiF / Al. Optionally, the second electrode CE may have a multilayer structure, which includes a reflective or semi-transmissive / semi-reflective film comprising the above-mentioned materials and a transparent conductive film, wherein the transparent conductive film includes indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), etc. For example, the second electrode CE may include the above-mentioned metallic materials, a combination of at least two metallic materials selected from the above-mentioned metallic materials, or oxides of the above-mentioned metallic materials, etc.

[0130] An encapsulation layer TFE can be disposed on the second electrode CE to cover the light-emitting element ED. The encapsulation layer TFE may include multiple thin films. For example, the encapsulation layer TFE may include multiple inorganic films disposed on the second electrode CE and an organic film disposed between the multiple inorganic films. The inorganic films can protect the light-emitting element ED from moisture / oxygen, and the organic films can protect the light-emitting element ED from foreign substances such as dust particles.

[0131] The input sensing component TP may include a first sensing insulating layer IL1, a second sensing insulating layer IL2, and a third sensing insulating layer IL3. The input sensing component TP may include at least one conductive layer disposed on the sensing insulating layers. The input sensing component TP may include a first conductive layer CDL1 and a second conductive layer CDL2.

[0132] A first sensing insulating layer IL1 may be disposed on the encapsulation layer TFE. The first sensing insulating layer IL1 may include at least one inorganic insulating layer. The first sensing insulating layer IL1 may be in contact with the encapsulation layer TFE. Alternatively, the first sensing insulating layer IL1 may be omitted, and in this case, the first conductive layer CDL1 may be in contact with the encapsulation layer TFE.

[0133] A first conductive layer CDL1 may be disposed on a first sensing insulating layer IL1. The first conductive layer CDL1 may include a plurality of first conductive patterns. The plurality of first conductive patterns may be disposed on the first sensing insulating layer IL1. A second sensing insulating layer IL2 may be disposed on the first sensing insulating layer IL1 to cover at least a portion of the first conductive layer CDL1.

[0134] A second conductive layer CDL2 may be disposed on a second sensing insulating layer IL2. The second conductive layer CDL2 may include a plurality of second conductive patterns. The plurality of second conductive patterns may be disposed on the second sensing insulating layer IL2. The plurality of second conductive patterns may be connected to a plurality of first conductive patterns respectively through contact holes formed in the second sensing insulating layer IL2.

[0135] The plurality of first conductive patterns in the first conductive layer CDL1 and the plurality of second conductive patterns in the second conductive layer CDL2 can each be respectively disposed corresponding to the light-blocking region NLA. The plurality of first conductive patterns in the first conductive layer CDL1 and the plurality of second conductive patterns in the second conductive layer CDL2 can each correspond to a grid pattern.

[0136] The third sensing insulating layer IL3 can be disposed on the second sensing insulating layer IL2 and can cover the second conductive layer CDL2. The second sensing insulating layer IL2 and the third sensing insulating layer IL3 can each include an inorganic insulating layer or an organic insulating layer.

[0137] The first conductive layer CDL1 and the second conductive layer CDL2 can each have a monolayer structure, or they can have a structure of multiple layers stacked along the third direction DR3. The monolayer conductive layers CDL1 and CDL2 can include metal layers or transparent conductive layers. The metal layer can include molybdenum, silver, titanium, copper, aluminum, or alloys thereof. The transparent conductive layer can include transparent conductive oxides, such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium tin zinc oxide (ITZO). Alternatively, the transparent conductive layer can include conductive polymers such as poly(3,4-ethylenedioxythiophene) (PEDOT), metal nanowires, or graphene.

[0138] The multilayer conductive layers CDL1 and CDL2 may include a metal layer. The metal layer may have a three-layer structure, such as titanium (Ti) / aluminum (Al) / titanium (Ti). The multilayer conductive layers CDL1 and CDL2 may include at least one metal layer and at least one transparent conductive layer.

[0139] Figure 5A This is an exemplary diagram illustrating the steps of providing a resin composition RC according to an embodiment.

[0140] Figure 5B This is an exemplary diagram illustrating the steps following the bonding of the adhesive member AP according to an embodiment.

[0141] Figure 6 This is a diagram schematically illustrating the coating characteristics of the resin composition RC according to an embodiment.

[0142] refer to Figure 5AAccording to the embodiments, the resin composition RC can be applied to a surface of a substrate in a liquid state (i.e., a flowable state). Figure 5A The illustration shows an example of a display module DM to which the resin composition RC is provided as a substrate, but the embodiments are not limited thereto, and the resin composition RC may be provided to the window WP in a liquid state (see [link to documentation]). Figure 3 ( ) a surface, and then a photocuring process can be performed.

[0143] A resin composition RC can be applied to one surface of the display module DM, and at this time, the fluid resin composition RC in a liquid state can be applied to the outer edge portion of the display module DM. That is, the edge of the applied resin composition RC and the edge of the display module DM can be substantially side-by-side in cross-section. In this specification, substantially the same includes having the same physical values ​​and having differences within the tolerance range in the process.

[0144] The resin composition RC according to the embodiments can be provided by an inkjet printing method or a drop coating method. The resin composition RC according to the embodiments can be readily discharged from an inkjet printing apparatus or a drop coating apparatus, and can be controlled to have an appropriate viscosity for adjusting the amount to be discharged.

[0145] For example, the resin composition RC can have a viscosity of about 5 MPa·s or greater and about 20 mPa·s or less. The viscosity of the resin composition RC can be measured at a temperature of about 30°C according to the method of JIS K2283 described below. Because the resin composition RC according to the embodiment has a viscosity of about 5 mPa·s or greater and about 20 mPa·s or less at a temperature of about 30°C, the resin composition RC can be readily discharged from a device such as a nozzle NZ and can be applied in a uniform amount and / or with a uniform thickness. When the viscosity of the resin composition RC is less than about 5 mPa·s at a temperature of about 30°C, there is a tendency for variations in discharge amount and / or thickness after application. When the viscosity of the resin composition RC is greater than about 20 mPa·s at a temperature of about 30°C, poor discharge and clogging of the nozzle NZ may occur.

[0146] Because the resin composition RC is provided by inkjet printing or drop coating, the resin composition RC can have properties that facilitate application in display devices (DD). Figure 1A The characteristics of components of various shapes in ) . Meanwhile, Figure 5A The illustration shows the use of nozzle NZ to provide the resin composition RC according to an embodiment to the display module DM, but the apparatus for providing the resin composition RC is not limited thereto.

[0147] The resin composition RC according to the embodiments may include a curable prepolymer, a monofunctional monomer composition, and a siloxane surfactant, and may also include a photopolymerization initiator. The curable prepolymer may be photopolymerizable, and according to the embodiments, may have two (meth)acryloyl groups in one molecule of the curable prepolymer. The monofunctional monomer composition may be two or more monomers having one (meth)acryloyl group in one molecule. In this specification, the term "(meth)acryloyl" refers to acryloyl or methacryloyl group.

[0148] The resin composition RC according to the embodiments may include a curable prepolymer having a weight-average molecular weight of about 10,000 g / mol or greater and about 40,000 g / mol or less. The resin composition RC according to the embodiments may include at least one urethane (meth)acrylate as a curable prepolymer having a weight-average molecular weight of about 10,000 g / mol or greater and about 40,000 g / mol or less. For example, the resin composition RC according to the embodiments may include one urethane (meth)acrylate having the aforementioned weight-average molecular weight of about 10,000 g / mol or greater and about 40,000 g / mol or less as a curable prepolymer. Alternatively, the resin composition RC according to the embodiments may include two or more different urethane (meth)acrylates, each having a weight-average molecular weight of about 10,000 g / mol or greater and about 40,000 g / mol or less, and having different weight-average molecular weights as curable prepolymers. The urethane (meth)acrylate included in the resin composition RC according to the embodiments may have a glass transition temperature (Tg) of less than about 0°C.

[0149] A urethane (meth)acrylate having a weight-average molecular weight of about 10,000 g / mol or greater and about 40,000 g / mol or less can be a curable prepolymer in a state with a relatively high degree of polymerization. When a urethane (meth)acrylate having the above-mentioned weight-average molecular weight is included in the resin composition RC, the resin composition RC can maintain a high degree of polymerization even after photocuring and can exhibit excellent flexibility. Therefore, the adhesive member AP formed from the resin composition RC according to the embodiment can have excellent adhesion and flexibility.

[0150] For example, urethane (meth)acrylates may include at least one of UF-C051 (urethane acrylate, a product of Kyoisha Chemical Co., Ltd.) and UV3300B (urethane acrylate, a product of Mitsubishi Chemical Holdings). However, this is an example, and the urethane (meth)acrylates included in the resin composition RC are not limited thereto.

[0151] Based on the total weight of the resin composition RC, the resin composition RC according to the embodiments may include an amount of urethane (meth)acrylate of about 1 wt% or more and about 10 wt% or less. For example, based on 100 wt% of the resin composition RC, the resin composition RC may include an amount of urethane (meth)acrylate of about 1 wt% or more and about 10 wt% or less. When the resin composition RC according to the embodiments includes an amount of urethane (meth)acrylate within the above range, the resin composition RC can meet the above viscosity range at a temperature of about 30°C, and therefore can be suitably dispensed by inkjet printing or drop coating methods to be uniformly applied to the substrate.

[0152] The resin composition RC according to the embodiments may include a monofunctional monomer composition, wherein each monofunctional monomer has a weight-average molecular weight of about 500 g / mol or less. For example, the monofunctional monomer may be a monofunctional (meth)acrylate monomer. The resin composition RC according to the embodiments may include a monofunctional (meth)acrylate monomer composition having a weight-average molecular weight of about 500 g / mol or less as a monofunctional monomer. For example, the weight-average molecular weight of the monofunctional (meth)acrylate monomer may be about 100 g / mol or greater and about 500 g / mol or less. The monofunctional (meth)acrylate monomers included in the resin composition RC according to the embodiments may have a glass transition temperature (Tg) of less than about 0°C.

[0153] In the resin composition RC according to the embodiments, the monofunctional (meth)acrylate monomer composition may include a first monomer and at least one second monomer different from the first monomer, wherein each of the first and second monomers has a weight-average molecular weight of about 500 g / mol or less. The first monomer may have a hydroxyl group, and the second monomer may not have a hydroxyl group. In the embodiments, the first monomer may be a hydroxyl-containing monofunctional (meth)acrylate monomer. The second monomer may include at least one of alicyclic monofunctional (meth)acrylate monomers and alkyl monofunctional (meth)acrylate monomers. The resin composition RC according to the embodiments may include both the first monomer and the second monomer. For example, the resin composition RC according to the embodiments may include 4-hydroxybutyl acrylate as the first monomer, but the embodiments are not limited thereto. The resin composition RC according to the embodiments may include two or more monofunctional monomers with different weight-average molecular weights as the second monomer. For example, the resin composition RC according to the embodiments may include two or more of 2-ethylhexyl acrylate, 2-ethylhexyl diethylene glycol acrylate, and tetrahydrofurfuryl acrylate as the second monomer. Specifically, the resin composition RC according to the embodiments may include all of 2-ethylhexyl acrylate, 2-ethylhexyl diethylene glycol acrylate and tetrahydrofurfuryl acrylate as a second monomer, but the embodiments are not limited thereto.

[0154] In the embodiments, the monofunctional (meth)acrylate monomers included in the resin composition RC may have a glass transition temperature (Tg) less than about 0°C. The first monomer and the second monomer may each have a glass transition temperature less than about 0°C.

[0155] Based on the total weight of the resin composition RC, the resin composition RC according to the embodiments may include an amount of approximately 80 wt% or more and approximately 97 wt% or less of a monofunctional monomer composition. For example, based on 100 wt% of the resin composition RC, the resin composition RC may include an amount of approximately 80 wt% or more and approximately 97 wt% or less of a monofunctional (meth)acrylate monomer composition. The amount of the monofunctional (meth)acrylate monomer composition included in the resin composition RC may be the sum of the amount of the first monomer and the amount of the second monomer. That is, in the resin composition RC according to the embodiments, based on 100 wt% of the resin composition RC, the sum of the amount of the first monomer and the amount of the second monomer may be approximately 80 wt% or more and approximately 97 wt% or less.

[0156] When the amount of the monofunctional (meth)acrylate monomer composition included in the resin composition RC according to the embodiment falls within the above range, the resin composition RC can meet the above viscosity range at a temperature of about 30°C, and can therefore be appropriately dispensed by inkjet printing or drop coating methods to be applied to the substrate with a uniform thickness.

[0157] In the embodiments, based on the total weight of the resin composition RC, it may include a first monomer in an amount of about 20 wt% or less, or greater than about 0 wt% and about 20 wt% or less. For example, based on 100 wt% of the resin composition RC, it may include a first monomer in an amount of about 10 wt% or greater and about 20 wt% or less.

[0158] When the first monomer is included in an amount within the aforementioned range, the resin composition RC according to the embodiments can have increased cohesive strength and increased adhesion to glass, thereby suppressing glass peeling. When the amount of the first monomer included in the resin composition RC is greater than about 20 wt%, the adhesion to glass may decrease, while the cohesive strength of the cured resin composition RC increases, thereby leading to glass peeling. This is because, since excess hydroxyl groups contribute to glass adhesion, hydrogen bonds are formed between the hydroxyl groups and are included in the cured resin product. Furthermore, when the first monomer is not included in the resin composition RC, the cohesive strength and adhesion to glass are significantly reduced, thereby leading to glass peeling.

[0159] When the surface tension of the resin composition RC according to the embodiment is about 25 mN / m or greater and about 30 mN / m or less, the resin composition RC can be uniformly applied without overflowing beyond the substrate. When the surface tension of the resin composition RC is greater than about 30 mN / m, the application on the substrate may be uneven. When the surface tension of the resin composition RC is less than about 25 mN / m, the resin composition RC may overflow beyond the substrate.

[0160] The resin composition RC according to the embodiments may include a silicon (Si)-containing surfactant. In the resin composition RC according to the embodiments, the surfactant may include a siloxane unit, i.e., a siloxane surfactant. For example, the siloxane surfactant may include at least one of BYK-1797 (polyether-modified expandable polysiloxane, a product of BYK Chemie) and BYK-378 (polyether-modified dimethyl polysiloxane, a product of BYK Chemie).

[0161] In the resin composition RC according to the embodiments, based on the total weight of the resin composition RC, an amount of siloxane surfactant may be included, approximately 0.01 wt% or more and approximately 0.5 wt% or less. When the amount of siloxane surfactant included in the resin composition RC is less than approximately 0.01 wt%, it may not exhibit a pinning effect that inhibits liquid movement, causing the resin composition RC to leak from the substrate. Additionally, when the amount of siloxane surfactant in the resin composition RC according to the embodiments is greater than approximately 0.5 wt%, the surface tension of the resin composition RC may decrease, and therefore, when the resin composition RC is applied, the resin composition RC may have increased spreadability and may therefore overflow beyond the substrate.

[0162] The resin composition RC according to the embodiments may include a photopolymerization initiator. The photopolymerization initiator according to the embodiments may be a free radical polymerization initiator. The resin composition RC according to the embodiments may include one photopolymerization initiator, or two or more photopolymerization initiators that are different from each other. When the resin composition RC includes multiple photopolymerization initiators, the different photopolymerization initiators may be activated, for example, by ultraviolet (UV) radiation in different center wavelength ranges. Based on the total weight of the resin composition RC, the resin composition RC according to the embodiments may include approximately 0.01 wt% or more and approximately 5 wt% or less of a photopolymerization initiator, but the amount of photopolymerization initiator included in the resin composition RC is not limited thereto.

[0163] For example, the resin composition RC according to the embodiments may include phenyl bis(2,4,6-trimethylbenzoyl)phosphine oxide as a photopolymerization initiator, but the embodiments are not limited thereto.

[0164] The resin composition RC according to the embodiments may include other known photoinitiators as photopolymerization initiators. For example, the photopolymerization initiator may be at least one of 2,2-dimethoxy-1,2-diphenylethane-1-one, 1-hydroxy-cyclohexyl-phenyl ketone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 2-hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methyl-1-propanone, and 2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propanoyl)-benzyl]-phenyl}-2-methylpropane-1-one.

[0165] Alternatively, the photopolymerization initiator can be at least one of 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropane-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-1-butanone, 2-dimethylamino-2-(4-methyl-benzyl)-1-(4-morpholino-4-yl-phenyl)-butane-1-one, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, [1-(4-phenylthiobenzoyl)heptylamino]benzoate, [1-[9-ethyl-6-(2-methylbenzoyl)carbazole-3-yl]ethyleneamino]acetate, and bis(2,4-cyclopentadienyl)bis[2,6-difluoro-3-(1-pyrrole)phenyl]titanium (IV).

[0166] The resin composition RC according to the embodiments may be solvent-free, that is, the resin composition RC may be substantially or completely solvent-free. For example, the resin composition RC may not contain volatile organic solvents. The resin composition RC according to the embodiments may be provided as a solvent-free type. When the solvent-free resin composition RC is provided by inkjet printing or drop coating, the ease of discharge can be improved. In addition, when the solvent-free resin composition RC is used in the process for manufacturing adhesive components AP, unlike resin compositions containing volatile organic solvents, the heating process for drying volatile organic solvents can be omitted, thereby improving process efficiency. The resin composition RC according to the embodiments may not contain solvents (e.g., volatile organic solvents) and may have a viscosity of about 15 mPa·s or greater and about 20 mPa·s or less, which can be applied by inkjet printing or drop coating.

[0167] The resin composition RC according to the embodiments can have a surface tension of about 25 mN / m or greater and about 30 mN / m or less. Therefore, the resin composition RC according to the embodiments can spread with sufficient wettability to cover the edge portion of the substrate, while at the same time, the flowability of the droplets can be controlled so that the resin composition RC maintains its coating shape without overflowing outside the substrate.

[0168] refer to Figure 6 When the resin composition RC according to the embodiment has a droplet surface tension of about 25 mN / m or greater and about 30 mN / m or less, the contact angle θ of the droplets used for the lower film SUB is... IN It can be approximately 10° or greater and approximately 20° or less. Contact angle θ IN This can correspond to the contact angle approximately 2 seconds after the resin composition RC is provided onto the lower film SUB. The resin composition RC according to the embodiment can have a shape that retains the droplet while having a contact angle θ of approximately 10° or greater and approximately 20° or less for the lower film SUB.IN .

[0169] In an embodiment, the lower film SUB may comprise polyethylene terephthalate (PET). Specifically, the resin composition RC according to the embodiment has a droplet surface tension of approximately 25 mN / m or greater and approximately 30 mN / m or less for polyethylene terephthalate (PET), and a droplet contact angle θ of approximately 10° or greater and approximately 20° or less for polyethylene terephthalate (PET). IN In this embodiment, the display module DM (see...) Figure 5A The upper surface of the provided resin composition RC may include polyethylene terephthalate (PET).

[0170] The resin composition RC according to the embodiment can provide a pinning effect that controls the flowability of droplets, so that the resin composition RC applied with such surface tension characteristics does not overflow to the outside of the substrate, and can bond the adhesive surface even at the edge portions without lifting, thereby exhibiting excellent adhesive properties.

[0171] That is, the resin composition RC according to the embodiment can have a contact angle θ controlled to have a predetermined range when applied to a substrate. IN The surface tension of the resin composition RC can be used to limit the flowability of the droplets, thereby easily controlling the coating area of ​​the resin composition RC.

[0172] After applying the resin composition RC, ultraviolet light can be applied to the resin composition RC. Therefore, the resin composition RC can be photocured and formed into an adhesive component AP (see [link to product]). Figure 5B ).

[0173] The step of providing ultraviolet light to the resin composition RC can be performed by providing the resin composition RC to the upper surface of the display module DM and then directly irradiating the resin composition RC with ultraviolet light. Alternatively, the step of providing ultraviolet light to the resin composition RC can be performed by providing the resin composition RC to the display module DM and placing the window WP (see...) Figure 5B The process involves placing the resin composition RC on the coated surface and then irradiating it with ultraviolet light through the upper surface of the window WP.

[0174] Alternatively, the resin composition RC can be applied to the lower surface of the window WP, and ultraviolet light can be directly irradiated onto the resin composition RC applied to the lower surface of the window WP. In this case, the resin composition RC can be irradiated and cured with ultraviolet light, and then the display module DM can be bonded to the resin composition RC.

[0175] When the resin composition is RC-cured before the window WP is set, ultraviolet light can be provided to form the adhesive member AP, then the window WP is set, and afterwards, pressure PR is applied to the window WP (see...). Figure 5B This allows for the lamination of the display module DM and the window WP when the adhesive component AP is located between the display module DM and the window WP.

[0176] Alternatively, when the upper surface of the window WP is irradiated with ultraviolet light to form the adhesive component AP after the window WP is set, pressure PR can also be applied to the window WP to laminate the display module DM and the window WP when the adhesive component AP has a uniform thickness.

[0177] refer to Figure 5B After lamination, the adhesive member AP can be configured to fully cover one surface of the display module DM. In a display device DD according to an embodiment, including the adhesive member AP formed from the resin composition RC according to an embodiment (see [example]),... Figure 3 In this embodiment, because the adhesive member AP has a uniform thickness extending to the edge portion, warping at the interface between components adjacent to the adhesive member AP can be minimized. Therefore, the display device DD according to the embodiment, including the adhesive member AP formed from the resin composition RC according to the embodiment, can have excellent reliability characteristics.

[0178] Figure 7 This is a cross-sectional view of a display device DD-a according to another embodiment of the present invention. In the following text, in... Figure 7 The description of the display device DD-a shown in the figure will no longer include the descriptions of the previously referenced [reference]. Figures 1A-6 The description repeats the same content, and the main focus will be on the differences.

[0179] Reference Figure 2 and Figure 3 Compared to the described display device DD, Figure 7 The display device DD-a shown may further include a light control layer PP and an optical adhesive layer AP-a. According to an embodiment, the display device DD-a may further include a light control layer PP disposed between the adhesive member AP and the window WP, and an optical adhesive layer AP-a disposed between the light control layer PP and the window WP. The light control layer PP may include a polarizer or a color filter layer.

[0180] The optical adhesive layer AP-a may include a resin composition RC derived from the embodiments (see [example]). Figure 5AThe optical adhesive layer AP-a can be formed from the resin composition RC according to the embodiments. The optical adhesive layer AP-a formed from the resin composition RC according to the embodiments can have a storage modulus of about 0.01 MPa or greater and about 0.1 MPa or less at about 25°C. The optical adhesive layer AP-a can have a 180° peel strength of about 800 gf / 25 mm or greater for at least one of the glass substrate and the polymer substrate at about 25°C. This includes the resin composition RC derived from the embodiments (see [example]). Figure 5A and Figure 6 The optical adhesive layer AP-a of the polymer can have excellent flexibility and excellent adhesion reliability.

[0181] Figure 8 This is a cross-sectional view of a display device DD-b according to another embodiment of the present invention. In the following, regarding the embodiment according to... Figure 8 In the description of the display device DD-b of the embodiment shown, the descriptions previously referenced to Figures 1 to 12 will no longer be included. Figure 7 The description repeats the same content, and the main focus will be on the differences.

[0182] Reference Figure 2 and Figure 3 Compared to the described display device DD, according to Figure 8 The display device DD-b of the embodiment shown may further include a light control layer PP, an optical adhesive layer AP-a, and an interlayer adhesive layer PIB. (Compared with...) Figure 7 The display device DD-a shown in the embodiment is the same, according to Figure 8 The display device DD-b of the embodiment shown may further include a light control layer PP disposed between the adhesive member AP and the window WP, and an optical adhesive layer AP-a disposed between the light control layer PP and the window WP.

[0183] In the display device DD-b according to an embodiment, the adhesive member AP can be disposed between the display panel DP and the input sensing component TP. That is, the input sensing component TP may not be directly disposed on the display panel DP, and the display panel DP and the input sensing component TP can be bonded to each other through the adhesive member AP. For example, the adhesive member AP can be disposed on the encapsulation layer TFE of the display panel DP (see...). Figure 3 Between the input sensing component TP and the input sensing component TP.

[0184] An interlayer adhesive layer (PIB) can be disposed below the light control layer (PP). The PIB can be disposed between the input sensing component (TP) and the light control layer (PP), and can include an adhesive material that is excellent in preventing moisture penetration. For example, the PIB can include polyisobutylene. The PIB can be disposed on the input sensing component (TP) to prevent corrosion of the sensing electrodes of the TP. The display device DD-b according to an embodiment can include a resin composition RC according to an embodiment (see embodiment). Figure 5A The optical adhesive layer AP-a and adhesive component AP are formed, and the display device DD-b including the optical adhesive layer AP-a and adhesive component AP can have excellent reliability.

[0185] In the following, with reference to examples and comparative examples, resin compositions and adhesive members formed from resin compositions according to embodiments of the present invention will be described in detail. Furthermore, the examples below are intended to aid in understanding the inventive concept, and the scope of the inventive concept is not limited thereto.

[0186] Example

[0187] 1. Preparation of resin composition

[0188] Table 1 lists the compositional components and contents of the resin compositions according to Examples 1 to 3 and Comparative Examples 1 to 8. The resin compositions according to the Examples and Comparative Examples were prepared by measuring each of the various materials listed in Table 1 in weight (g) on ​​a light-blocking polyethylene (PE) container and stirring the materials at approximately 1000 rpm for approximately 30 minutes using a planetary centrifugal mixer and deaerator (products of SHASHIN KAGAKU). In Table 1, “Ex” indicates an example, and “CEx” indicates a comparative example.

[0189] Table 1

[0190]

[0191] The compounds listed in Table 1 above are as follows.

[0192] <Cureable prepolymers>

[0193] UF-C051: Carbamate acrylate (Tg = approximately -43°C, product of Kyoei Chemical Co., Ltd.)

[0194] UV-3300B: Carbamate acrylate (Tg = approximately -30°C, a product of Mitsubishi Chemical Holdings).

[0195] CN-371NS: Amine-modified (meth)acrylate curable prepolymer (Sartomer product)

[0196] UV-3700B: Carbamate acrylate (Tg = approximately -6°C, a product of Mitsubishi Chemical Holdings).

[0197] <Monofunctional Monomer>

[0198] 2-EHA: 2-Ethylhexyl acrylate (product of Toagosei Co., Ltd.), Tg = approximately -80°C

[0199] IBXA: Isoborneol acrylate (product of Osaka Organic Chemical Industry Ltd.), Tg = approximately 97°C

[0200] 4-HBA-LT: 4-Hydroxybutyl acrylate (product of Osaka Organic Chemicals Co., Ltd.), Tg = approximately -40°C

[0201] SYA-4: 10-Hydroxydecyl Acrylate (Sumitomo Chemical product), Tg = approximately -55°C

[0202] IDAA: Isodecyl acrylate (product of Osaka Organic Chemicals Co., Ltd.), Tg = approximately -43℃

[0203] EHDG-AK: 2-Ethylhexyl diethylene glycol acrylate (product of Kyoei Chemical Co., Ltd.), Tg = approximately -70℃

[0204] THF-A: Tetrahydrofurfuryl acrylate (product of Kyoei Chemical Co., Ltd.), Tg = approximately -12℃

[0205] <Multifunctional Monomer>

[0206] Viscoat#195: 1,4-Butanediol diacrylate (product of Osaka Organic Chemical Industry Co., Ltd.)

[0207] Photopolymerization initiators

[0208] Omnirad 819: Phenylenol bis(2,4,6-trimethylbenzoyl)phosphine oxide (a product of IGM Resin)

[0209] Omnirad TPO-H: 2,4,6-Trimethylbenzoyl-diphenylphosphine oxide (a product of IGM Resin)

[0210] <surfactants>

[0211] BYK-1797: Polyether-modified foamed polysiloxane (a product of BYK Chemie)

[0212] BYK-378: Polyether-modified dimethylpolysiloxane (a product of BYK Chemie)

[0213] ACS-380: Acryloyl-vinyl copolymer (product of Kyoei Chemicals Co., Ltd.)

[0214] BYK-UV3500: Polyether-modified acryloyl-containing polydimethylsiloxane (a product of BYK Chemie).

[0215] The properties of the resin composition and the properties of the adhesive components formed by curing the resin composition were evaluated, and the results are listed in Table 2 below. The evaluation method for each property is as follows.

[0216] <Viscosity Measurement>

[0217] In Table 2, the viscosity of the resin composition was measured using a viscometer TVE-25L (a product of TOKISANGYO Co., Ltd.) at a speed of approximately 50 rpm and a temperature of approximately 30°C, according to the JISK2283 method.

[0218] <Evaluation of Inkjet Coating>

[0219] A PET film with an adhesive layer is bonded to a glass plate, and then used... An inkjet printer applied the resin composition according to each of the examples and comparative examples onto a PET film at a printhead temperature of approximately 30°C. Subsequently, ultraviolet light was irradiated onto the applied resin composition, and the appearance of the cured film was observed. In Table 2 below, “◎” corresponds to the absence of leakage or thickness deviation in the applied resin composition, and “X” corresponds to the inability to discharge (coating defect).

[0220] <Measurement of Energy Storage Modulus>

[0221] A PET film (PANAC Corporation NP1000A) after demolding and a silicone rubber sheet (Tigers Polymer Corporation) with holes of approximately 8 mm diameter were sequentially stacked on a glass slide S1112 (Matsunami Glass Ind., Ltd.). A resin composition according to each of the examples and comparative examples was loaded into the holes of the silicone rubber sheet at approximately 28 μL. Ultraviolet light was irradiated onto the loaded resin compositions according to each of the examples and comparative examples, such that the total amount of light provided by an ultraviolet LED lamp with peaks at approximately 405 nm and approximately 365 nm became approximately 4000 mJ / cm². 2 The resin compositions were cured according to each of the example and comparative examples. Thus, measurement samples with a diameter of approximately 8 mm and a thickness of approximately 500 μm were obtained. The measurement samples of the resin compositions prepared using a dynamic viscoelasticity measuring device (Anton Paar MCR302) were cured, and then the storage modulus was measured at approximately 25 °C.

[0222] The energy storage modulus was measured at a frequency of approximately 1 Hz and at a heating rate of approximately 2 °C / min from approximately -50 °C to approximately 80 °C.

[0223] <Appearance evaluation after joining the cover glass>

[0224] The resin compositions according to each of the examples and comparative examples were coated onto a PET film to a thickness of approximately 50 μm using an inkjet printer. Subsequently, the resin compositions were irradiated with ultraviolet light, such that the amount of light provided by an ultraviolet LED lamp with a peak at approximately 405 nm to approximately 365 nm became approximately 1000 mJ / cm². 2 The resin compositions according to each of the examples and comparative examples were cured. Soda-lime glass (approximately 30 μm thick) was bonded to the cured resin composition and treated for approximately 5 minutes at approximately 30°C and approximately 0.5 MPa using an automated heating and pressurizing treatment apparatus (product name: Chiyoda Electronics Ltd. "ACS-230"). The obtained laminate was irradiated with ultraviolet light using an ultraviolet LED lamp with peaks at approximately 405 nm and approximately 365 nm, resulting in a total light intensity of approximately 4000 mJ / cm² on the glass. 2 The appearance of the laminate was observed using an optical microscope. In Table 2 below, "◎" corresponds to cases where there is no leakage of the resin composition or the cured resin composition on the outside, or no peeling of the covering glass.

[0225] <Measurement of peel strength>

[0226] The laminate used for appearance evaluation after the cover glass was bonded was used as a sample to measure peel strength. Peel strength was measured using a tension tester (Model 5965, Instron) at a peel angle of approximately 180° and a rate of approximately 300 mm / min. Peel strength was measured approximately three times at approximately 25°C, and an average of approximately 50 mm peels was obtained. This value was multiplied by approximately 1.25 to obtain the peel strength over a width of approximately 25 mm, and the results are listed in Table 2.

[0227] <Measurement of Surface Tension>

[0228] The liquid surface tension of the resin compositions according to the examples and comparative examples was measured using a contact angle meter (Drop Master DMo-601 from Kyowa Interface Science Co., Ltd.) by the pendant drop method.

[0229] Table 2

[0230]

[0231]

[0232] Referring to the evaluation results of Examples 1 to 3 and Comparative Examples 1 to 8 in Table 2, the resin compositions of the examples have a viscosity of about 5 mPa·s or greater and about 20 mPa·s or less at about 30°C, and exhibit excellent coating characteristics that allow for uniform thickness application using inkjet printing. Furthermore, according to each of Examples 1 to 3, the storage modulus is about 0.01 MPa or greater and less than about 0.1 MPa at about 25°C, and the peel strength is about 800 gf / 25 mm or greater, thus exhibiting excellent properties that allow for application in flexible displays without peeling or damage during bending. Moreover, because the resin compositions of the examples have a surface tension of about 25 mN / m or greater and about 30 mN / m or less, the resin compositions can be characterized by a droplet contact angle with PET of about 0° or greater and about 20° or less. Therefore, the resin composition according to each example exhibits sufficient wettability to the coating surface and spreads to the edge portion of the coating surface while forming a shape that does not overflow to the outside of the substrate.

[0233] In contrast, the resin composition according to Comparative Example 1 includes more than about 10 wt% of urethane (meth)acrylate and has high viscosity, which causes defects during emission when using an inkjet printer.

[0234] In Comparative Example 2, because the amount of the siloxane surfactant is greater than about 0.5 wt%, the surface tension is less than about 25 mN / m. Therefore, in Comparative Example 2, due to the low surface tension, the applied resin composition overflows to the outside of the substrate, resulting in contamination, and exhibits a high storage modulus and significantly reduced peel strength compared to the examples.

[0235] In Comparative Example 3, because no siloxane surfactants are included, the flowability is unrestricted at the edge portions, causing the resin composition to overflow onto the outside of the substrate, thus resulting in contamination.

[0236] In the case of Comparative Example 4, because the resin composition contains an excess of the first monomer with hydroxyl groups, the cohesive force increases, resulting in an increase in the storage modulus. Therefore, in the bonding of the cover glass, the PET and the cover glass do not bond to each other through the cured resin composition. In addition, because the surfactant included in the resin composition according to Comparative Example 4 contains acryloyl groups, no pinning effect is exhibited, and the resin composition overflows to the outside of the substrate (PET film), resulting in contamination.

[0237] According to each of Comparative Examples 5 and 6, the resin composition includes approximately 40 wt% or more of a first monomer having hydroxyl groups. Due to high surface tension, irregularities are formed during the coating of the resin composition, resulting in uneven thickness. Additionally, according to Comparative Example 5, without a siloxane surfactant, the resin composition overflows beyond the substrate (PET film), forming surface irregularities. In the case of Comparative Example 6, although a siloxane surfactant is included, the high surface tension reduces the wettability of the substrate to which the resin composition is coated, resulting in portions of the substrate not being coated with the resin composition and forming surface irregularities.

[0238] According to Comparative Example 7, because the resin composition includes approximately 21 wt% of a first monomer having hydroxyl groups, the cohesive force of the resin composition is increased, but the adhesion to the glass is reduced, resulting in the peeling off of the cover glass.

[0239] According to Comparative Example 8, because the resin composition does not contain a first monomer having hydroxyl groups, the adhesion to the glass is significantly reduced, resulting in the peeling off of the cover glass.

[0240] In embodiments, the electronic device may include a display device, and the display device may include at least one adhesive member disposed between adjacent components and formed of a resin composition. The display device may include an adhesive member between a display panel and a window. The adhesive member may be formed by photocuring the resin composition according to embodiments. The resin composition according to embodiments may include urethane (meth)acrylate, a monofunctional (meth)acrylate monomer composition, and a siloxane surfactant, each within a specific range, and the monofunctional (meth)acrylate monomer composition may include a first monomer having hydroxyl groups and a second monomer different from the first monomer, in an amount greater than about 0 wt% and about 20 wt% or less based on the total weight of the resin composition. Therefore, the resin composition according to embodiments may have excellent coating properties for the substrate to be coated, and the resin composition may have the property of spreading to the edge portions of the substrate with sufficient wetting through a pinning effect without overflowing beyond the substrate.

[0241] Furthermore, by including an adhesive member formed from the resin composition according to the embodiment, the electronic device and display device according to the embodiment can have excellent bonding characteristics even at the edges of members adjacent to the adhesive member, and can have excellent bonding reliability and flexibility.

[0242] The resin composition according to the embodiments may include curable prepolymers, monofunctional monomer compositions, and siloxane surfactants in a specific range, and the amount of a first monomer having hydroxyl groups included in the monofunctional monomer composition may be adjusted so that the resin composition does not leak to the outside of the substrate to be coated, and can exhibit excellent coating characteristics up to the edge portion of the substrate to be coated, and the resin composition may have viscosity characteristics that allow it to be easily coated using inkjet printing methods, etc.

[0243] The display device according to the embodiment may include an adhesive member formed from the above-described resin composition, thereby maintaining the connection between the modules and components of the display device without lifting at the edges, thus exhibiting excellent reliability characteristics. Furthermore, the adhesive member formed from the aforementioned resin composition can possess excellent flexibility and is therefore usefully applicable to flexible display devices.

[0244] The electronic device according to the embodiments may include a display device, and therefore can provide excellent reliability.

[0245] The embodiments of the present invention have been described above with reference to the present invention concept. However, it will be understood by those skilled in the art or those of ordinary skill that various modifications and changes can be made to the present invention concept, as long as such modifications and changes do not depart from the spirit and technical scope of the present invention concept set forth in the claims.

[0246] Therefore, the technical scope of the present invention is not limited to what is stated in the detailed description of the specification, but should be determined by the claims.

Claims

1. A resin composition, wherein, The resin composition includes: an amount of 1 wt% or more and 10 wt% or less of a urethane (meth)acrylate including two (meth)acryloyl groups and having a weight average molecular weight of 10,000 g / mol or more and 40,000 g / mol or less; an amount of 80 wt% or more and 97 wt% or less of a monofunctional (meth)acrylate monomer composition; and an amount of 0.01 wt% or more and 0.5 wt% or less of a silicone surfactant, wherein the monofunctional (meth)acrylate monomer composition includes: an amount of greater than 0 wt% and 20 wt% or less, based on the total weight of the resin composition, of a first monofunctional (meth)acrylate monomer including a hydroxyl group and having a weight average molecular weight of 500 g / mol or less, and at least one second monofunctional (meth)acrylate monomer different from the first monofunctional (meth)acrylate monomer and having a weight average molecular weight of 500 g / mol or less. The resin composition has a droplet surface tension of 25 mN / m or more and 30 mN / m or less.

2. The resin composition according to claim 1, wherein, The first monofunctional (meth)acrylate monomer is present in an amount of 10 wt% or more and 20 wt% or less, based on the total weight of the resin composition.

3. The resin composition according to claim 1, wherein, The resin composition is free of a solvent.

4. The resin composition according to claim 1, wherein, The resin composition has a viscosity of 5 mPa s or more and 20 mPa s or less at 30°C.

5. The resin composition according to claim 1, wherein, Each of the urethane (meth)acrylate and the first monofunctional (meth)acrylate monomer and the second monofunctional (meth)acrylate monomer has a glass transition temperature of less than 0°C.

6. The resin composition according to claim 1, wherein, The first monofunctional (meth)acrylate monomer includes 4-hydroxybutyl acrylate.

7. The resin composition according to claim 1, wherein The second monofunctional (meth)acrylate monomer includes at least one of 2-ethylhexyl acrylate, 2-ethylhexyl diglycol acrylate, and tetrahydrofurfuryl acrylate.

8. The resin composition according to claim 1, wherein, The resin composition further includes a photopolymerization initiator.

9. The resin composition according to claim 1, wherein, The display device includes:

10. A display device, wherein, a display module; a window disposed on the display module; and an adhesive member disposed between the display module and the window and formed of the resin composition according to any one of claims 1 to 9. The adhesive member has a storage modulus of 0.01 MPa or more and 0.1 MPa or less at 25°C.

11. The display device of claim 10, wherein, The adhesive member has an adhesive strength of 800 gf / 25 mm or more for a glass substrate or a polyethylene terephthalate film at 25°C.

12. The display device of claim 10, wherein, 13. The display device of claim 10, wherein a lower surface of the window adjacent to the adhesive member includes glass, an upper surface of the display module adjacent to the adhesive member includes polyethylene terephthalate, and the resin composition has a droplet surface tension of 25 mN / m or more and 30 mN / m or less for the polyethylene terephthalate. ​ 14. The display device of claim 10, wherein, The display device further includes a light control layer disposed between the adhesive member and the window and an optical adhesive layer disposed between the light control layer and the window, wherein the optical adhesive layer includes a polymer derived from the resin composition according to any one of claims 1 to 9.

15. An electronic device, comprising: The electronic device includes: a display device including at least one adhesive member disposed between first and second adjacent members of the display device and formed from the resin composition according to any one of claims 1 to 9.

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