Electric fluid jet chip based on glass substrate and forming method
By combining two substrates, the potential difference between the electrode ring and the boss is used to drive the functional liquid to be ejected, which solves the problem of insufficient precision of the bottom surface of the boss and realizes high-precision and flexible multi-hole controllable printing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-02-11
- Publication Date
- 2026-03-20
AI Technical Summary
In the existing technology, the etching process of the substrate cannot guarantee the flatness of the bottom surface of the groove, resulting in insufficient precision of the bottom surface of the boss, which affects the stable forming and spraying accuracy of the Taylor cone.
The structure uses a combination of two substrates. The bottom surface of the first substrate is machined with an annular groove to form a boss, and spray holes are formed on the boss. The second substrate is fixed on the bottom surface to form an electrode structure. The functional liquid is driven to be sprayed out by the potential difference between the electrode ring and the boss, avoiding the need to place additional electrodes on the substrate to be printed.
Ensuring the precision of the boss's bottom surface makes the Taylor cone formed by the functional fluid on the boss more stable, resulting in better spray consistency and enabling multi-hole controllable printing, thus improving printing accuracy and flexibility.
Smart Images
Figure CN121697347A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the field of inkjet printing technology, and in particular to an electrowetting chip based on a glass substrate and a forming method. BACKGROUND
[0002] As an additive manufacturing direct writing technology, inkjet printing has the advantages of no need for masks, flexible production, high material utilization rate, etc., and has good application prospects in the fields of printed display, printed circuit, printed solar cell, etc. The electrowetting printing technology uses electric field force as the main driving force, which greatly enhances the driving ability of the ink, and can print high-viscosity ink. At the same time, since the liquid meniscus locally occurs, the size of the generated ink droplet can be much smaller than the nozzle diameter, thereby significantly improving the printing resolution. The electrowetting inkjet printing technology overcomes the two major shortcomings of traditional inkjet printing technology and has broad application prospects.
[0003] In the related art, a groove is processed on the bottom surface of the substrate, and a ring-shaped groove is processed in the groove to form a boss, and a through jet hole is opened on the boss. The electrodes are arranged on the bottom surface of the substrate. Due to the arrangement of the groove, the jet hole nozzle has a height difference with the electrode, that is, the jet hole nozzle and the electrode have a potential difference. That is, the functional liquid in the jet hole can be ejected by using the electric field force.
[0004] Before the functional liquid is ejected, the functional liquid is first attached to the bottom surface of the boss, forms a Taylor cone, and then is ejected, so the processing precision of the bottom surface of the boss affects the forming effect of the Taylor cone, and further affects the ejection precision.
[0005] When the groove is formed on the bottom surface of the substrate by etching process, the bottom surface of the groove is the bottom surface of the boss. Since the existing etching process cannot guarantee the flatness of the groove bottom surface, the flatness of the bottom surface of the boss is difficult to guarantee, and the functional liquid cannot form a stable Taylor cone on the bottom surface of the boss, resulting in poor printing precision. SUMMARY
[0006] The embodiment of the present application provides an electrowetting chip based on a glass substrate and a forming method to solve the problem that the precision of the boss surface cannot be guaranteed in the related art, and the Taylor cone cannot be stably formed, which affects the printing precision.
[0007] In a first aspect, an electrowetting chip based on a glass substrate and a forming method are provided, which include: A first substrate, the bottom surface of the first substrate is provided with a plurality of ring-shaped grooves to form a plurality of bosses, and the bottom surface of each boss is coaxially provided with a through jet hole; A second substrate, a surface of the second substrate is provided with a plurality of through ejection windows, the second substrate is connected to a bottom surface of the first substrate, a plurality of the ejection windows are coaxially corresponding to a plurality of the annular grooves respectively, and a plurality of the ejection windows are communicated with a plurality of the annular grooves respectively; An electrode structure, the electrode structure comprises a plurality of electrode rings, a plurality of the electrode rings are connected to a bottom surface of the second substrate, and a plurality of the electrode rings are respectively surrounded by a plurality of the ejection windows, the electrode ring and the boss corresponding to the electrode ring have a potential difference.
[0008] In some embodiments, the first substrate comprises a glass substrate or a silicon plate. The second substrate comprises a glass substrate.
[0009] In some embodiments, the glass substrate-based electrofluidic jet chip further comprises a bonding structure, the first substrate and the second substrate are connected through the bonding structure; the bonding structure comprises two layers of gold layers, the bottom surface of the first substrate and the top surface of the second substrate are both arranged with a gold layer, and the first substrate and the second substrate are connected through the bonding of the two layers of the gold layers.
[0010] In some embodiments, an outer diameter of the ejection window is not less than an outer diameter of the annular groove.
[0011] In some embodiments, the electrode structure further comprises a plurality of lead wires, a plurality of the lead wires are connected to the bottom surface of the second substrate, a plurality of the lead wires are electrically connected with a plurality of the electrode rings respectively, and a plurality of the lead wires are electrically connected with an external flexible circuit board.
[0012] In some embodiments, a surface of the first substrate is further provided with a plurality of first through holes; a surface of the second substrate is further provided with a plurality of second through holes, a plurality of the first through holes are communicated with a plurality of the second through holes respectively; The first through hole and the second through hole are arranged with a conductive ring, a bottom of the conductive ring is electrically connected with the lead wire, and a top of the conductive ring is electrically connected with the external flexible circuit board.
[0013] In some embodiments, the glass substrate-based electrofluidic jet chip further comprises a passivation layer, the passivation layer covers surfaces of the electrode ring and the lead wire.
[0014] In some embodiments, the glass substrate-based electrofluidic jet chip further comprises a hydrophobic layer, the hydrophobic layer covers the passivation layer, a bottom surface of the boss and a bottom surface of the second substrate.
[0015] The technical scheme provided by the application has the beneficial effects of: The embodiment of the application provides a glass substrate-based electrohydrodynamic jet chip, which is combined by two substrates, a ring-shaped groove is formed on the bottom surface of the first substrate to form a boss, and a jet hole is formed on the boss. The functional liquid enters the jet hole from above the first substrate, and under the action of the electric field force, the functional liquid first forms a Taylor cone on the bottom surface of the boss, and then is jetted out. Since the bottom surface of the boss is not processed, the bottom surface of the boss is the original bottom surface of the first substrate, the flatness of the surface of the first substrate is relatively good after leaving the factory, and the bottom surface of the boss for forming the Taylor cone is not processed in the subsequent jet chip forming process, so that the accuracy of the bottom surface of the boss is ensured, the Taylor cone formed on the boss by the functional liquid is more stable, the jet consistency is better, and the printing accuracy is ensured.
[0016] The second substrate is fixed on the bottom surface of the first substrate, the functional liquid is jetted out through the jet window, the electrode structure is formed on the bottom surface of the second substrate, the voltage is applied to the electrode structure, a potential difference is formed between each electrode ring of the electrode structure and the corresponding boss, and the electric field force can be used to drive the functional liquid in the jet hole to be jetted out. The arrangement of the second substrate provides installation space for the electrode structure, and the distance between the electrode structure and the boss is pulled apart, so that the potential difference requirement between the boss and the electrode structure is met. After the electrode structure is powered on, the functional liquid in the jet hole can be driven to be jetted out, and there is no need to additionally arrange an electrode at the substrate to be printed, so that the printing height adjustment is flexible.
[0017] The plurality of electrode rings correspond to different jet holes respectively, the voltage of the different electrode rings is controlled, so that the individual control of the plurality of jet holes is realized, and the multi-hole controllable printing is realized.
[0018] In a second aspect, a forming method of a glass substrate-based electrohydrodynamic jet chip is provided, which is used for forming the glass substrate-based electrohydrodynamic jet chip as described above, and includes the following steps. Two glass substrates are obtained as the first substrate and the second substrate respectively; A plurality of ring-shaped grooves and a plurality of jet holes are formed on the first substrate by laser-induced etching; A plurality of jet windows are formed on the second substrate by laser-induced etching; Gold deposition is performed on the bottom surface of the first substrate and the top surface of the second substrate respectively, and then metal bonding is realized by using a metal bonding process; An electrode structure is patterned on the bottom surface of the second substrate; A passivation layer is deposited on the surface of the electrode structure; A hydrophobic layer is formed on the surface of the passivation layer, the bottom surface of the boss, and the bottom surface of the second substrate.
[0019] In some embodiments, after forming the plurality of annular grooves and the plurality of ejection holes on the first substrate by laser-induced etching, the method further comprises forming a plurality of first through holes on the first substrate by laser-induced etching. In some embodiments, after forming the plurality of ejection windows on the second substrate by laser-induced etching, the method further comprises forming a plurality of second through holes on the second substrate by laser-induced etching. In some embodiments, after patterning the bottom surface of the second substrate to form the electrode structure, the method further comprises depositing a conductive ring in the first through holes and the second through holes.
[0020] Another embodiment of the present application provides a method for forming a glass substrate-based electrofluidic ejection chip. Since the method is based on the glass substrate-based electrofluidic ejection chip described above, the method has the same advantages as the glass substrate-based electrofluidic ejection chip, which will not be described here again. BRIEF DESCRIPTION OF DRAWINGS
[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.
[0022] Figure 1 Part of the schematic diagram of the glass substrate-based electrofluidic ejection chip provided by the embodiments of the present application; Figure 2 Part of the schematic diagram of the glass substrate-based electrofluidic ejection chip provided by another embodiment of the present application.
[0023] In the figure: 1, first substrate; 1a, annular groove; 1b, ejection hole; 1c, first through hole; 11, boss; 2, second substrate; 2a, ejection window; 2b, second through hole; 3, electrode structure; 31, electrode ring; 32, lead wire; 4, gold layer; 5, passivation layer; 6, hydrophobic layer; 7, conductive ring. DETAILED DESCRIPTION
[0024] In order to make the purpose, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.
[0025] The embodiment of the application provides a glass substrate-based electro-fluid jet chip and a forming method, which use the original bottom surface of the substrate as the bottom surface of the convex platform, guarantee the surface precision of the bottom surface of the convex platform, improve the stability and consistency of the Taylor cone of the functional liquid formed on the bottom surface of the convex platform, and guarantee the printing precision. The application solves the problem in the related art that the precision of the surface of the convex platform cannot be guaranteed, the Taylor cone cannot be stably formed, and the printing precision is affected.
[0026] Reference Figure 1 A glass substrate-based electro-fluid jet chip comprises a first substrate 1, a second substrate 2 and an electrode structure 3. The first substrate 1 is provided with a jet hole 1b, the second substrate 2 is attached to the bottom surface of the first substrate 1, and the electrode structure 3 is arranged on the bottom surface of the second substrate 2. The electrode structure 3 is used to apply voltage to the functional liquid in the first substrate 1, and the electric field force is used to make the functional liquid jet out.
[0027] Reference Figure 1 In the embodiment, a plurality of annular grooves 1a are formed on the bottom surface of the first substrate 1 to form a plurality of convex platforms 11, and the plurality of convex platforms 11 are arrayed. Preferably, the plurality of convex platforms 11 are distributed in multiple rows, and the convex platforms 11 in each row are staggered. The bottom surface of each convex platform 11 is coaxially provided with a penetrating jet hole 1b.
[0028] Specifically, a plurality of annular grooves 1a and jet holes 1b are processed on the bottom surface of the first substrate 1 by laser-induced etching. At this time, after the convex platform 11 is formed, the bottom surface of the convex platform 11 is the original surface of the first substrate 1.
[0029] In this way, the flatness of the surface of the first substrate 1 is relatively good after the first substrate 1 is shipped. In the subsequent jet chip forming process, the bottom surface of the convex platform 11 for forming the Taylor cone is not processed, so that the precision of the bottom surface of the convex platform 11 is guaranteed, the Taylor cone of the functional liquid formed on the convex platform 11 is more stable, the jet consistency is better, and the printing precision is guaranteed.
[0030] It should be noted that when the first substrate 1 is processed by an upstream manufacturer, a mature, multi-step, micron to nanometer ultra-precision processing chain, especially a chemical mechanical polishing technology, is used. The flatness and roughness of the surface of the first substrate 1 are both very good. The bottom surface of the convex platform 11 is not processed, so that the flatness and roughness of the bottom surface of the convex platform 11 are both good, thereby guaranteeing the stable formation of the Taylor cone.
[0031] In addition, if the bottom surface of the boss 11 is processed by etching or other means, since etching processing is essentially a "destructive" or "carving" process, its mission is to change the surface topography. While pursuing high aspect ratio, accurate pattern transfer, high selectivity, the physical and chemical limitations of its process principle (such as loading effect, directionality trade-off, material non-uniformity) determine that it is difficult to provide a super-smooth, super-flat surface in the global range as polishing. Therefore, etching processing will cause the bottom surface of the boss 11 to have poor topography, which will affect the quality of the Taylor cone formation and in turn affect the printing accuracy.
[0032] In this embodiment, the first substrate 1 includes a glass substrate or a silicon plate.
[0033] With reference to Figure 1 The second substrate 2 is connected to the bottom surface of the first substrate 1, and a plurality of ejection windows 2a are formed on the surface of the second substrate 2. The ejection windows 2a are processed by laser-induced etching. The plurality of ejection windows 2a are coaxially corresponding to the plurality of annular grooves 1a, respectively, and the plurality of ejection windows 2a are in communication with the plurality of annular grooves 1a, respectively.
[0034] The glass substrate-based electrofluidic chip further comprises a bonding structure, and the first substrate 1 and the second substrate 2 are connected through the bonding structure. The bonding structure comprises two layers of gold layers 4, and the bottom surface of the first substrate 1 and the top surface of the second substrate 2 are both arranged with the gold layers 4, and the first substrate 1 and the second substrate 2 are connected through the bonding of the two layers of gold layers 4.
[0035] Specifically, the gold layers 4 are arranged on the bonding surfaces of the first substrate 1 and the second substrate 2 by a deposition process.
[0036] In this way, the first substrate 1 and the second substrate 2 are connected in a bonding manner, ensuring that the first substrate 1 and the second substrate 2 are firmly combined and have better integrity.
[0037] With reference to Figure 1 The outer diameter of the ejection window 2a is not less than the outer diameter of the annular groove 1a.
[0038] Preferably, the outer diameter of the ejection window 2a is equal to the outer diameter of the annular groove 1a.
[0039] In this way, it is ensured that the ejection window 2a is unobstructed, ensuring that the functional liquid passes through the ejection window 2a smoothly, and the functional liquid is not easily attached to the inner wall of the ejection window 2a, thereby ensuring the stability of printing.
[0040] With reference to Figure 1The electrode structure 3 is arranged on the bottom surface of the second substrate 2, and the electrode structure 3 applies voltage to the functional liquid in the ejection hole 1b on the bottom surface of the second substrate 2. Specifically, the electrode structure 3 includes a plurality of electrode rings 31, each of which is connected to the bottom surface of the second substrate 2 and surrounds a corresponding ejection window 2a. A potential difference is formed between the electrode ring 31 and the corresponding boss 11, so that the functional liquid in the ejection hole 1b is driven out by the electric field force.
[0041] In this way, the second substrate 2 is fixed to the bottom surface of the first substrate 1, and the functional liquid is ejected through the ejection window 2a. By forming the electrode structure 3 on the bottom surface of the second substrate 2 and applying voltage to the electrode structure 3, a potential difference is formed between each electrode ring 31 of the electrode structure 3 and the corresponding boss 11, so that the functional liquid in the ejection hole 1b is driven out by the electric field force. The arrangement of the second substrate 2 provides installation space for the electrode structure 3 and increases the distance between the electrode structure 3 and the boss 11, meeting the requirement for the potential difference between the boss 11 and the electrode structure 3. After the electrode structure 3 is powered on, the functional liquid in the ejection hole 1b can be driven out, and there is no need to additionally arrange electrodes at the substrate to be printed, so that the printing height can be flexibly adjusted.
[0042] In addition, a plurality of electrode rings 31 are arranged to correspond to different ejection holes 1b, and the voltage of different electrode rings 31 is controlled to realize the individual control of the plurality of ejection holes 1b and realize the controllable multi-hole printing.
[0043] In this embodiment, the second substrate 2 includes a glass substrate, which has insulation performance and is not easy to be broken by high voltage. The electrode structure 3 is directly arranged on the bottom surface of the second substrate 2, so that a potential difference is formed between the electrode structure 3 and the boss 11.
[0044] In other embodiments, when the second substrate 2 is a silicon plate, a dielectric layer needs to be arranged on the bottom surface of the second substrate 2, and the electrode structure 3 is arranged on the bottom surface of the dielectric layer. The insulation of the dielectric layer can also establish a potential difference between the electrode structure 3 and the boss 11. The dielectric layer is processed in the form of deposition, and the dielectric layer is silicon nitride.
[0045] Wherein, since the electrode ring 31 is arranged around the ejection window 2a, a gap is formed between the boss 11 and the electrode ring 31, and after the functional liquid forms a Taylor cone on the surface of the boss 11, the functional liquid is not easy to spread to the electrode ring 31 due to the effects of the annular groove 1a and the ejection window 2a, thereby avoiding corroding the electrode ring 31, ensuring the cleanliness of the electrode ring 31, and ensuring the controllability of the electric field force. The ejection surface of the boss 11 is higher than the bottom of the annular groove 1a, so as to ensure that the functional liquid is attached to the ejection surface of the boss 11 to form a Taylor cone, the functional liquid is not easy to spread to the bottom of the annular groove 1a, and the functional liquid is not easy to accumulate and attach to the circumferential outer side of the boss 11, so as to keep the ejection surface of the boss 11 in a clean state, which is not easy to affect the formation of the subsequent Taylor cone, and ensures the ejection accuracy of the corresponding ejection hole 1b.
[0046] Wherein, the electrode structure 3 further comprises a plurality of lead wires 32, the plurality of lead wires 32 are connected to the bottom surface of the second substrate 2, the plurality of lead wires 32 are respectively electrically connected to the plurality of electrode rings 31, and the plurality of lead wires 32 are electrically connected to the external flexible circuit board.
[0047] In the embodiment, the electrode ring 31 and the lead wire 32 are processed in a deposition form.
[0048] The material of the electrode ring 31 and the lead wire 32 comprises one or more of gold, silver, copper, aluminum, and chromium.
[0049] In this way, a plurality of electrode rings 31 are arranged to correspond to different ejection holes 1b, and the voltage of different electrode rings 31 is controlled, so as to realize the individual control of the plurality of ejection holes 1b, and realize the multi-hole controllable printing.
[0050] Referring to Figure 2 In some embodiments, a plurality of first through holes 1c are further formed in the surface of the first substrate 1. A plurality of second through holes 2b are further formed in the surface of the second substrate 2, and the plurality of first through holes 1c are respectively communicated with the plurality of second through holes 2b. Specifically, the hole diameter of the first through hole 1c is the same as the hole diameter of the second through hole 2b, and the plurality of first through holes 1c are coaxially arranged with the plurality of second through holes 2b.
[0051] A conductive ring 7 is arranged in the first through hole 1c and the second through hole 2b, the bottom of the conductive ring 7 is electrically connected to the lead wire 32, and the top of the conductive ring 7 is electrically connected to the external flexible circuit board.
[0052] Referring to Figure 2 Specifically, the material of the conductive ring 7 is the same as the material of the lead wire 32 and the electrode ring 31. The conductive ring 7 is made of a deposition process, that is, the conductive ring 7 is deposited in the first through hole 1c and the second through hole 2b. The conductive ring 7 is electrically connected to the lead wire 32.
[0053] Preferably, the plurality of first through holes 1c are arranged close to the edge of the first substrate 1, and the plurality of second through holes 2b are arranged close to the edge of the second substrate 2.
[0054] In this way, the first substrate 1 is connected with the external flexible circuit board, and the form of the external voltage is more flexible.
[0055] Referring to Figure 1 The glass substrate-based electrofluidic chip further comprises a passivation layer 5 covering the surface of the electrode ring 31 and the lead 32.
[0056] Specifically, the material of the passivation layer 5 is silicon dioxide, and the passivation layer 5 is formed on the surface of the electrode ring 31 and the lead 32 by a glue spraying and metal stripping process to protect the electrode ring 31 and the lead 32. In the embodiment, the end of the lead 32 away from the electrode ring 31 is not covered by the passivation layer 5 to reserve a connection position with the flexible circuit board.
[0057] Referring to Figure 1 Specifically, the glass substrate-based electrofluidic chip further comprises a hydrophobic layer 6 covering the passivation layer 5, the bottom surface of the boss 11 and the bottom surface of the second substrate 2.
[0058] Specifically, the material of the hydrophobic layer 6 includes parylene, and the hydrophobic layer 6 is formed on the bottom of the second substrate 2 by a sputtering process to cover the structure of the bottom surface of the second substrate 2, i.e., the surface of the passivation layer 5, the bottom surface of the second substrate 2 and the bottom surface of the boss 11. In the embodiment, the end of the lead 32 away from the electrode ring 31 is shielded by a mask, and the hydrophobic layer 6 is formed by sputtering. The end of the lead 32 is not covered by the hydrophobic layer 6 to reserve a connection position with the flexible circuit board.
[0059] In this way, the arrangement of the hydrophobic layer 6 makes the functional liquid more stable to form a meniscus on the bottom surface of the boss 11, and prevents overflow of the functional liquid.
[0060] The glass substrate-based electrofluidic chip provided by the embodiment comprises two substrates. An annular groove 1a is formed on the bottom surface of the first substrate 1 to form a boss 11, and a jet hole 1b is formed on the boss 11. The functional liquid enters the jet hole 1b from above the first substrate 1, and forms a Taylor cone on the bottom surface of the boss 11 under the action of an electric field force, and then is jetted out. Since the bottom surface of the boss 11 is not processed, the bottom surface of the boss 11 is the original bottom surface of the first substrate 1. After the first substrate 1 is manufactured, the flatness of the surface is relatively good. In the subsequent forming process of the electrofluidic chip, the bottom surface of the boss 11 for forming the Taylor cone is not processed, so that the accuracy of the bottom surface of the boss 11 is guaranteed, the Taylor cone formed by the functional liquid on the boss 11 is more stable, the jet consistency is better, and the printing accuracy is guaranteed.
[0061] The second substrate 2 is fixed to the bottom surface of the first substrate 1. The functional liquid is sprayed out through the spray window 2a. An electrode structure 3 is formed on the bottom surface of the second substrate 2. By applying a voltage to the electrode structure 3, a potential difference is formed between each electrode ring 31 and its corresponding boss 11. The functional liquid in the spray hole 1b can then be driven out by the electric field force. The arrangement of the second substrate 2 provides installation space for the electrode structure 3 and increases the distance between the electrode structure 3 and the boss 11, satisfying the potential difference requirement between the boss 11 and the electrode structure 3. After the electrode structure 3 is energized, the liquid in the spray hole 1b can be driven out. There is no need to arrange additional electrodes on the substrate to be printed, so the printing height can be adjusted flexibly.
[0062] Multiple electrode rings 31 are used to correspond to different jet holes 1b. By controlling the voltage of different electrode rings 31, the multiple jet holes 1b can be controlled individually, thus realizing multi-hole controllable printing.
[0063] Another embodiment of this application provides a method for forming an electrofluid jet chip based on a glass substrate, used to form the electrofluid jet chip based on a glass substrate as described above. The method includes the following steps S100-S700.
[0064] S100: Obtain two glass substrates as the first substrate 1 and the second substrate 2, respectively.
[0065] S200, multiple annular grooves 1a and multiple jet holes 1b are formed on the first substrate 1 by laser-induced etching.
[0066] S300, Multiple jet windows 2a are formed on the second substrate 2 by laser-induced etching.
[0067] S400: Gold deposition is performed on the bottom surface of the first substrate 1 and the top surface of the second substrate 2, respectively. Then, a metal bonding process is used to achieve metal bonding between the first substrate 1 and the second substrate 2.
[0068] S500, an electrode structure 3 is formed by patterning on the bottom surface of the second substrate 2.
[0069] S600, deposit a passivation layer 5 on the surface of electrode structure 3.
[0070] S700, a hydrophobic layer 6 is formed on the surface of the passivation layer 5, the bottom surface of the boss 11, and the bottom surface of the second substrate 2.
[0071] In step S100, two glass substrates are obtained as the first substrate 1 and the second substrate 2, respectively.
[0072] Specifically, the first substrate 1 is selected as a glass substrate or a silicon plate, and the second substrate 2 is selected as a glass substrate. Preferably, the first substrate 1 and the second substrate 2 are both glass substrates.
[0073] In step S200, a plurality of annular grooves 1a and a plurality of ejection holes 1b are formed on the first substrate 1 by laser-induced etching.
[0074] Specifically, the annular grooves 1a and the ejection holes 1b are processed separately or together.
[0075] In some embodiments, after the annular grooves 1a and the ejection holes 1b are processed, a plurality of first through holes 1c are formed on the first substrate 1 by laser-induced etching.
[0076] In step S300, a plurality of ejection windows 2a are formed on the second substrate 2 by laser-induced etching.
[0077] Specifically, the diameter of the ejection window 2a is not less than the outer diameter of the annular groove 1a.
[0078] Further, in some embodiments, after the ejection window 2a is processed, a plurality of second through holes 2b are formed on the second substrate 2 by laser-induced etching. The aperture of the second through hole 2b is consistent with the aperture of the first through hole 1c.
[0079] In step S400, gold deposition is performed on the bottom surface of the first substrate 1 and the top surface of the second substrate 2, respectively, and then metal bonding process is used to achieve metal bonding of the first substrate 1 and the second substrate 2.
[0080] Specifically, when the first substrate 1 and the second substrate 2 are bonded, the annular groove 1a and the ejection window 2a are coaxial one by one, and the first through hole 1c and the second through hole 2b are coaxial one by one.
[0081] In step S500, an electrode structure 3 is patterned on the bottom surface of the second substrate 2.
[0082] Specifically, the electrode structure 3 is patterned by deposition process. That is, on the bottom of the second substrate 2, a plurality of electrode rings 31 are formed around a plurality of ejection windows 2a, and a plurality of lead wires 32 electrically connected to the electrode rings 31 are formed.
[0083] In some embodiments, when the first through hole 1c and the second through hole 2b are formed, after the electrode structure 3 is patterned on the bottom surface of the second substrate 2, a conductive ring 7 is deposited in the first through hole 1c and the second through hole 2b. The material of the conductive ring 7 is consistent with the material of the electrode ring 31 and the lead wire.
[0084] In step S600, a passivation layer 5 is deposited on the surface of the electrode structure 3.
[0085] Specifically, a passivation layer 5 is deposited on the surface of the electrode ring 31 and the lead 32, the passivation layer 5 is preferably silicon dioxide, and the thickness of the passivation layer 5 is preferably 300-500 nanometers. The passivation layer 5 is covered on the surface of the electrode ring 31 and the lead 32 by using a glue spraying and metal stripping process to protect the electrode ring 31 and the lead 32. In the embodiment, the end of the lead 32 away from the electrode ring 31 is not covered by the passivation layer 5 to reserve a connection position with the flexible circuit board.
[0086] S700, a hydrophobic layer 6 is formed on the surface of the passivation layer 5, the bottom surface of the boss 11, and the bottom surface of the second substrate 2.
[0087] Specifically, the material of the hydrophobic layer 6 includes parylene, which is covered on the bottom surface of the second substrate 2 by a sputtering process to cover the structure of the bottom surface of the second substrate 2, i.e., the surface of the passivation layer 5, the bottom surface of the second substrate 2, and the bottom surface of the boss 11. Preferably, the thickness of the hydrophobic layer 6 includes 1-5 micrometers. In the embodiment, the end of the lead 32 is shielded by a mask, and the hydrophobic layer 6 is formed by sputtering.
[0088] In this way, the arrangement of the hydrophobic layer 6 causes the functional liquid to form a Taylor cone on the bottom surface of the boss 11 to prevent the functional liquid from overflowing.
[0089] Another embodiment of the present application provides a forming method of a glass substrate-based electrofluidic jet chip. Since the forming method is based on the glass substrate-based electrofluidic jet chip, the beneficial effects of the forming method are consistent with those of the glass substrate-based electrofluidic jet chip, which will not be described here.
[0090] In the description of the present application, it should be noted that the terms "upper", "lower", and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. Unless otherwise explicitly specified and limited, the terms "mounting", "connecting", and "connecting" should be understood broadly, for example, it can be a fixed connection, or a detachable connection, or an integral connection; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or a connection between two elements inside. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0091] It should be noted that in this application, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
[0092] The above description is merely a specific embodiment of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.
Claims
1. A current-electro-jet chip based on a glass substrate, characterized in that, It includes: The first substrate has a plurality of annular grooves on its bottom surface to form a plurality of protrusions, and each of the protrusions has a through injection hole coaxially formed on its bottom surface. The second substrate has a plurality of through-hole spray windows on its surface. The second substrate is connected to the bottom surface of the first substrate. The plurality of spray windows are coaxially corresponding to the plurality of annular grooves, and the plurality of spray windows are connected to the plurality of annular grooves. The electrode structure includes multiple electrode rings, each of which is connected to the bottom surface of the second substrate and surrounds multiple injection windows. There is a potential difference between the electrode rings and the corresponding bosses.
2. The electrofluid-jet chip based on a glass substrate according to claim 1, characterized in that, The first substrate includes a glass substrate or a silicon substrate; The second substrate includes a glass substrate.
3. The electrofluid-jet chip based on a glass substrate according to claim 1, characterized in that, It also includes a bonding structure, through which the first substrate and the second substrate are connected; the bonding structure includes two gold layers, with gold layers disposed on the bottom surface of the first substrate and the top surface of the second substrate, and the first substrate and the second substrate are connected by bonding the two layers.
4. The electrofluid-jet chip based on a glass substrate according to claim 1, characterized in that, The outer diameter of the spray window is not less than the outer diameter of the annular groove.
5. The electrofluid-jet chip based on a glass substrate according to claim 1, characterized in that, The electrode structure also includes multiple leads, each of which is connected to the bottom surface of the second substrate. The multiple leads are electrically connected to multiple electrode rings, and each of the multiple leads is electrically connected to an external flexible circuit board.
6. The electrofluid-jet chip based on a glass substrate according to claim 1, characterized in that, The surface of the first substrate is further provided with a plurality of first through holes; the surface of the second substrate is further provided with a plurality of second through holes, and the plurality of first through holes are respectively connected to the plurality of second through holes; Conductive rings are arranged inside the first and second through holes. The bottom of the conductive rings is electrically connected to the lead wire, and the top of the conductive rings is electrically connected to the external flexible circuit board.
7. The electrofluid-jet chip based on a glass substrate according to claim 6, characterized in that, It also includes a passivation layer that covers the electrode ring and the lead surface.
8. The electrofluid-jet chip based on a glass substrate according to claim 7, characterized in that, It also includes a hydrophobic layer that covers the passivation layer, the bottom surface of the boss, and the bottom surface of the second substrate.
9. A method for forming an electrofluid jet chip based on a glass substrate, characterized in that, For forming the electrofluid-jet chip based on a glass substrate as described in claim 1; comprising the following steps: Two glass substrates are obtained and used as the first substrate and the second substrate, respectively. Multiple annular grooves and multiple jet holes are formed on the first substrate by laser-induced etching. Multiple spray windows are formed on the second substrate by laser-induced etching. Gold deposition is performed on the bottom surface of the first substrate and the top surface of the second substrate, and then a metal bonding process is used to achieve metal bonding between the first substrate and the second substrate. An electrode structure is patterned on the bottom surface of the second substrate; A passivation layer is deposited on the surface of the electrode structure; A hydrophobic layer is formed on the surface of the passivation layer, the bottom surface of the boss, and the bottom surface of the second substrate.
10. The method for forming an electrofluid-jet chip based on a glass substrate according to claim 9, characterized in that, After forming multiple annular grooves and multiple jet holes on the first substrate by laser-induced etching, the method further includes forming multiple first through holes on the first substrate by laser-induced etching. After forming multiple spray windows on the second substrate by laser-induced etching, the method further includes forming multiple second through holes on the second substrate by laser-induced etching. After the electrode structure is patterned on the bottom surface of the second substrate, conductive rings are deposited in the first and second through holes.