Copper alloy, method for producing the same, and elastic electronic component

Abstract

The application provides a copper alloy, a preparation method thereof and an elastic electronic component, and relates to the technical field of copper alloys.The copper alloy comprises the following elements in percentage by mass: the content of Ti element is 2.70-4.20%, the content of Y element is 0.010-0.030%, the content of La element is 0.010-0.030%, the content of B element is 0.010-0.020%, the total content of unavoidable impurities is less than or equal to 0.01%, and the balance is Cu element and M element; wherein, the M element is Fe element or P element, when the M element is Fe element, the content of Fe element is 0.28-0.45%, and when the M element is P element, the content of P element is 0.05-0.15%. The copper alloy has excellent tensile strength, hardness, elastic modulus and conductivity.

Description

Technical Field

[0001] This invention relates to the field of copper alloy technology, and more specifically, to a copper alloy, its preparation method, and a flexible electronic component. Background Technology

[0002] With the development of modern communication technology towards high speed, wide bandwidth, and low latency, there is a growing demand for ultra-large scale, high density, integration, and irregular shapes in electronic components. Among various copper alloys, elastic copper alloys, as a very important functional material, are mainly used to manufacture various high-strength conductive elastic elements. They play a role in information collection and conversion, energy storage and release in the elastic components of various precision instruments, and are widely used in precision equipment in aerospace, electronics, and power transmission industries. As industrial production increases its consumption of copper alloys, the performance requirements for elastic copper alloys in various fields are also rising. Beryllium bronze is the copper-based elastic alloy with the longest service history, the most mature technology, and the best overall performance, and is known as the "King of Elastic Non-ferrous Metals." However, this alloy has drawbacks such as high raw material costs, strict heat treatment requirements, large heat treatment deformation, poor high-temperature relaxation resistance, and the generation of toxic beryllium oxides during processing. In recent years, both domestic and international efforts have been focused on finding new environmentally friendly copper alloys to replace beryllium bronze. Therefore, developing a copper alloy with excellent mechanical properties, electrical conductivity, elasticity, and high-temperature performance has significant engineering and practical value.

[0003] Cu-Ti alloys possess mechanical properties comparable to beryllium bronze, superior bending and processing performance, higher heat resistance, and better stress relief properties. Their comprehensive advantages in performance, environmental friendliness, resource efficiency, and cost make them a promising environmentally friendly alternative to Cu-Be alloys. Cu-Ti alloys are typical age-hardening copper alloys, and their strength can be very high through appropriate deformation heat treatment processes. However, if the elastic modulus does not increase accordingly, they will exhibit a "strong but not rigid" characteristic. That is, they can withstand great forces without breaking (high strength), but are easily bent (low stiffness). In many applications, stiffness is an equally important, or even more important, indicator than strength. Furthermore, a key problem with this alloy system is that while strength is improved, electrical conductivity is difficult to significantly increase. Whether produced by leading international Japanese companies or domestically produced Cu-Ti alloy sheets and strips by various Chinese companies, when the tensile strength reaches above 1000 MPa, the corresponding electrical conductivity is generally below 15% IACS, which severely limits its wider application. Therefore, improving the elastic modulus and conductivity of Cu-Ti alloys is to achieve synergistic development of the alloy's strength, stiffness, and conductivity, resulting in superior overall performance.

[0004] Since the elastic modulus is a key intrinsic parameter characterizing a material's resistance to elastic deformation, achieving a synergistic improvement in the strength, elastic modulus, and conductivity of copper alloys requires fundamental optimization of alloy composition design and deformation heat treatment processes. By combining microalloying (such as introducing elements that can form high-modulus, low-solution-strengthening precipitates) with advanced deformation heat treatment regimes (such as combining intense plastic deformation with precise aging control), the aim is to maximize the precipitation of high-strength, high-modulus precipitates while minimizing the concentration of dissolved Ti in the matrix, thereby effectively improving electrical conductivity without sacrificing strength and rigidity.

[0005] Based on the performance requirements of next-generation high-strength, high-elasticity, and conductive copper alloy electronic components, and considering that the key factors affecting the improvement of alloy strength, elastic modulus, and conductivity are still composition and processing, achieving a synergistic improvement in the overall performance of this alloy requires innovation in composition design and the development of corresponding preparation and processing technologies. Therefore, it is necessary to develop a high-strength, high-elasticity, and conductive copper alloy material and its preparation technology that do not increase alloy production costs while possessing excellent comprehensive performance, thereby better meeting the urgent needs of high-tech fields for this type of material. Summary of the Invention

[0006] The main objective of this invention is to provide a copper alloy, its preparation method, and an elastic electronic component, in order to solve the problem that copper alloys in the prior art are difficult to simultaneously achieve high tensile strength, hardness, elastic modulus, and conductivity.

[0007] To achieve the above objectives, according to one aspect of the present invention, a copper alloy is provided, comprising, by mass percentage, the following elements: Ti content of 2.70-4.20%, Y content of 0.010-0.030%, La content of 0.010-0.030%, B content of 0.010-0.020%, unavoidable total impurity content ≤0.01%, and the balance being Cu and M; wherein M is Fe or P, and when M is Fe, the Fe content is 0.28-0.45%; and when M is P, the P content is 0.05-0.15%.

[0008] Further, by mass percentage, the copper alloy comprises the following elements: Ti content of 3.10~3.60%, Fe content of 0.28~0.35%, Y content of 0.010~0.020%, La content of 0.010~0.020%, B content of 0.010~0.015%, unavoidable impurities ≤0.01%, and the balance being Cu; or, by mass percentage, the copper alloy comprises the following elements: Ti content of 3.10~3.60%, P content of 0.05~0.10%, Y content of 0.020~0.030%, La content of 0.020~0.030%, B content of 0.010~0.015%, unavoidable impurities ≤0.01%, and the balance being Cu.

[0009] Furthermore, the mass ratio of Ti to Fe is (3.3~3.5):(0.28~0.35); or the mass ratio of Ti to P is (3.25~3.45):(0.05~0.10).

[0010] Furthermore, the copper alloy has a tensile strength of 1000~1200MPa; and / or, an electrical conductivity of 15~19%IACS; and / or, an elastic modulus of 130~140GPa; and / or, a Vickers hardness of 330~370HV.

[0011] According to another aspect of the present invention, a method for preparing the aforementioned copper alloy is provided, the method comprising: sequentially subjecting the copper alloy metal raw materials to melting, casting, heat treatment, hot rolling, online solution treatment, first cold rolling, solution treatment, second cold rolling, first aging treatment, third cold rolling and second aging treatment according to a specified ratio to obtain a copper alloy.

[0012] Furthermore, the heat treatment temperature is 750~850℃; and / or, the heat treatment holding time is 2~8h; and / or, the hot rolling temperature is 740~850℃; and / or, the material temperature at the end of hot rolling is 700~800℃; and / or, the total rolling ratio of hot rolling is 78~86%.

[0013] Furthermore, the deformation amount of the first cold rolling is 70~80%; and / or, the solution treatment temperature is 850~950℃; and / or, the solution treatment holding time is 1~10min.

[0014] Furthermore, the deformation amount of the second cold rolling is 45~60%; and / or, the temperature of the first aging treatment is 375~475℃; and / or, the holding time of the first aging treatment is 1~8h.

[0015] Furthermore, the deformation amount of the third cold rolling is 45~60%; and / or, the temperature of the second aging treatment is 350~475℃; and / or, the holding time of the second aging treatment is 1~8h; and / or, the melting is carried out in a vacuum electromagnetic induction melting furnace at a temperature of 1150~1300℃, a melting time of 40~70min, and a melting power of 30~70kW; and / or, the temperature of the melt during casting is 1200~1250℃.

[0016] According to another aspect of the present invention, a flexible electronic component is provided, which contains the aforementioned copper alloy.

[0017] Applying the technical solution of this invention, when titanium is present in the copper alloy, the copper alloy microstructure is mainly a face-centered cubic Cu-based solid solution. This phase is very stable at room temperature, has good plasticity and conductivity, and can generate a β′-Cu4Ti phase with a high Young's modulus, which helps to improve the strength, hardness, elastic modulus, and electrical conductivity of the copper alloy. When the titanium content is too high, it is not conducive to improving the conductivity of the alloy; when the titanium content is too low, it is not conducive to improving the strength of the copper alloy. The presence of Fe helps to refine the grain structure of the copper alloy, and Fe and Ti can form Fe- and Ti-rich precipitates, occupying the nucleation sites of discontinuous precipitates and inhibiting the precipitation of discontinuous precipitates, thereby improving the strength and stress relaxation resistance of the alloy. Although the presence of Fe has a significant impact on the electrical conductivity of the copper alloy, the formation of a large number of Fe-rich particles also consumes Ti in the matrix, thus offsetting the influence of Fe on the conductivity of the alloy as much as possible. Fe, as an element with a high density parameter, can cause lattice shrinkage in copper-based alloy solid solutions, thereby increasing the elastic modulus of the solid solution. Fe can couple with Ti to form high-modulus precipitates (such as Fe2Ti phase) and reduce the number of dissolved Ti atoms, which helps improve the strength and elastic modulus of the alloy. The presence of phosphorus (P) not only refines the grains but also induces the Zener pinning effect at grain boundaries, thereby increasing the alloy strength. In addition, P forms the TiP phase with dissolved Ti atoms in the matrix, which not only plays a precipitation strengthening role but also purifies the matrix, reduces lattice distortion, and reduces electron scattering, thus improving the conductivity of copper alloys. Furthermore, the presence of phosphorus helps improve the tensile / compressive stiffness of copper alloys. In addition, the presence of P can reduce the oxygen content inside the melt and reduce internal defects in the alloy, thereby improving the elastic modulus to some extent. Excessive P not only affects the strength of copper alloys but also generates large and numerous P-rich phases, which adversely affects the conductivity and elongation of the alloy. The presence of titanium (Y) helps refine the grain size and enhance the interfacial bonding between titanium and copper. Stronger interfacial bonding helps disperse stress concentration points, reduces the likelihood of crack propagation, improves the overall mechanical properties of the copper alloy, and promotes a denser atomic arrangement, further enhancing the material's strength and toughness. The presence of titanium (La) helps improve the electrical conductivity of the copper alloy. La enhances electron delocalization through its 4f electron orbitals, forming a low-resistivity interface with titanium (Ti), increasing the probability of electron tunneling and ultimately improving conductivity. The presence of boron (B) not only refines the alloy grain size but also inhibits the formation and growth of discontinuous precipitates, thereby increasing the alloy's hardness and tensile strength. Furthermore, B segregation at grain boundaries helps improve the elongation at break of the copper alloy. Because B atoms are smaller than the matrix copper (Cu), their presence helps promote lattice contraction, thus increasing the alloy's elastic modulus.Controlling the content of each element in the copper alloy within the above-mentioned range helps to improve the synergistic effect between the elements, thereby helping to improve the tensile strength, hardness, elastic modulus and electrical conductivity of the copper alloy. Attached Figure Description

[0018] The accompanying drawings, which form part of this application, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:

[0019] Figure 1 A metallographic diagram of the copper alloy in Embodiment 4 of this application is shown;

[0020] Figure 2 A metallographic diagram of the copper alloy in Embodiment 8 of this application is shown;

[0021] Figure 3 The metallographic structure of the copper alloy in Comparative Example 1 of this application is shown. Detailed Implementation

[0022] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0023] Terminology Explanation: In this application, IACS refers to the International Standard for Annealed Copper.

[0024] As analyzed in the background section of this application, it is difficult for copper alloys in the prior art to simultaneously achieve high tensile strength, hardness, elastic modulus and conductivity. In order to solve the above problems, this application provides a copper alloy, a method for preparing the same, and an elastic electronic component.

[0025] In a typical embodiment of this application, a copper alloy is provided, comprising the following elements by mass percentage: Ti content of 2.70-4.20%, Y content of 0.010-0.030%, La content of 0.010-0.030%, B content of 0.010-0.020%, unavoidable total impurity content ≤0.01%, and the balance being Cu and M; wherein M is Fe or P, and when M is Fe, the Fe content is 0.28-0.45%; when M is P, the P content is 0.05-0.15%.

[0026] In the copper alloy of this application, the presence of titanium results in a copper alloy microstructure primarily composed of a face-centered cubic Cu-based solid solution. This phase is highly stable at room temperature, exhibiting good plasticity and electrical conductivity. It can generate a β′-Cu4Ti phase with a high Young's modulus, which helps improve the strength, hardness, elastic modulus, and electrical conductivity of the copper alloy. However, excessive titanium content is detrimental to improving the alloy's electrical conductivity, while insufficient titanium content is detrimental to improving its strength. The presence of Fe helps refine the grain structure of the copper alloy, and Fe and Ti can form Fe- and Ti-rich precipitates that occupy nucleation sites of discontinuous precipitates, inhibiting their precipitation and thus improving the alloy's strength and resistance to stress relaxation. Although the presence of Fe significantly affects the electrical conductivity of the copper alloy, the formation of a large number of Fe-rich particles also consumes Ti in the matrix, thereby minimizing the impact of Fe on the alloy's conductivity. Fe, as an element with a high density parameter, can cause lattice shrinkage in copper-based alloy solid solutions, thereby increasing the elastic modulus of the solid solution. Fe can couple with Ti to form high-modulus precipitates (such as Fe2Ti phase) and reduce the number of dissolved Ti atoms, which helps improve the strength and elastic modulus of the alloy. The presence of phosphorus (P) not only refines the grains but also induces the Zener pinning effect at grain boundaries, thereby increasing the alloy strength. In addition, P forms the TiP phase with dissolved Ti atoms in the matrix, which not only plays a precipitation strengthening role but also purifies the matrix, reduces lattice distortion, and reduces electron scattering, thus improving the conductivity of copper alloys. Furthermore, the presence of phosphorus helps improve the tensile / compressive stiffness of copper alloys. In addition, the presence of P can reduce the oxygen content inside the melt and reduce internal defects in the alloy, thereby improving the elastic modulus to some extent. Excessive P not only affects the strength of copper alloys but also generates large and numerous P-rich phases, which adversely affects the conductivity and elongation of the alloy. The presence of titanium (Y) helps refine the grain size and enhance the interfacial bonding between titanium and copper. Stronger interfacial bonding helps disperse stress concentration points, reduces the likelihood of crack propagation, improves the overall mechanical properties of the copper alloy, and promotes a denser atomic arrangement, further enhancing the material's strength and toughness. The presence of titanium (La) helps improve the electrical conductivity of the copper alloy. La enhances electron delocalization through its 4f electron orbitals, forming a low-resistivity interface with titanium (Ti), increasing the probability of electron tunneling and ultimately improving conductivity. The presence of boron (B) not only refines the alloy grain size but also inhibits the formation and growth of discontinuous precipitates, thereby increasing the alloy's hardness and tensile strength. Furthermore, B segregation at grain boundaries helps improve the elongation at break of the copper alloy. B atoms are smaller than the matrix copper (Cu), and their presence helps promote lattice contraction, thus increasing the alloy's elastic modulus. Controlling the content of each element in the copper alloy within the above-mentioned ranges helps enhance the synergistic effects between the elements, thereby improving the tensile strength, hardness, elastic modulus, and electrical conductivity of the copper alloy.

[0027] To further improve the tensile strength, hardness, elastic modulus, and electrical conductivity of the copper alloy, in some embodiments of this application, the copper alloy comprises the following elements by mass percentage: Ti content of 3.10~3.60%, Fe content of 0.28~0.35%, Y content of 0.010~0.020%, La content of 0.010~0.020%, B content of 0.010~0.015%, unavoidable impurities ≤0.01%, and the balance being Cu; or, by mass percentage, the copper alloy comprises the following elements: Ti content of 3.10~3.60%, P content of 0.05~0.10%, Y content of 0.020~0.030%, La content of 0.020~0.030%, B content of 0.010~0.015%, unavoidable impurities ≤0.01%, and the balance being Cu.

[0028] In some embodiments of this application, the mass ratio of Ti to Fe is (3.3~3.5):(0.28~0.35); or the mass ratio of Ti to P is (3.25~3.45):(0.05~0.10).

[0029] Controlling the mass ratio of Ti to Fe within the aforementioned range helps to further refine the grains. This is achieved by forming Fe- and Ti-rich precipitates that occupy nucleation sites for discontinuous precipitates, thus inhibiting their formation and enhancing the alloy's strength and resistance to stress relaxation. Furthermore, it helps the alloy achieve both high strength and electrical conductivity, promoting the formation of high-modulus precipitates such as Fe₂Ti, thereby further improving the alloy's elastic modulus. Controlling the mass ratio of Ti to P within the aforementioned range also helps to promote the formation of the TiP phase, further hindering dislocation movement, increasing the alloy's hardness and tensile strength, and consuming some of the dissolved Ti, thus contributing to the alloy's high strength and electrical conductivity.

[0030] In some embodiments of this application, the mass ratio of Y element to La element is 1:(0.67~1.5).

[0031] Controlling the mass ratio of Y to La within the above range helps to enhance their synergistic effect, thereby helping to purify the melt and refine the grains, which in turn helps to further improve the tensile strength, hardness, elastic modulus and conductivity of copper alloys.

[0032] In some embodiments of this application, the tensile strength of the copper alloy is 1000~1200MPa; and / or, the electrical conductivity of the copper alloy is 15~19%IACS; and / or, the elastic modulus of the copper alloy is 130~140GPa; and / or, the Vickers hardness of the copper alloy is 330~370HV.

[0033] Copper alloys with the aforementioned tensile strength, electrical conductivity, elastic modulus, and hardness are better able to meet the requirements of flexible electronic components and are more suitable for use in flexible electronic components.

[0034] In another typical embodiment of this application, a method for preparing the aforementioned copper alloy is provided. The method includes: sequentially smelting, casting, heat treatment, hot rolling, online solution treatment, first cold rolling, solution treatment, second cold rolling, first aging treatment, third cold rolling, and second aging treatment according to the proportions to obtain the copper alloy.

[0035] This application establishes the original microstructure of the alloy through melting and casting. Heat treatment helps to fully diffuse solute elements in the alloy, eliminates compositional inhomogeneities in the as-cast alloy, allows alloying elements to dissolve into the matrix, reduces local property differences, and improves the uniformity of the microstructure. Hot rolling helps to break up the as-cast structure, eliminate internal defects, and refine grains, thereby improving the mechanical and machinability of the copper alloy. In-line solution treatment helps to supersaturate the alloying elements in the matrix, providing sufficient driving force and solute atoms for subsequent aging treatment. First cold rolling helps to change the microstructure of the alloy, increase the dislocation density inside the material, refine the grains, provide more nucleation sites for subsequent aging treatment, accelerate precipitation kinetics, and increase the stored energy within the alloy, thereby helping to improve the strength of the copper alloy and reduce the temperature of subsequent aging treatment. Solution treatment helps to fully dissolve the coarse grain boundary reaction precipitates and granular precipitates generated after casting and hot working, further refining the grains, and also providing a more uniform structure for subsequent cold working and aging treatment. The second and third cold rolling processes help to further increase the dislocation density inside the material, refine the grains, and improve the strength and hardness of the alloy; they also provide a large number of nucleation sites for subsequent aging treatment, promoting the precipitation of fine, dispersed precipitates. The first and second aging treatments help to completely release the deformation energy, further improving the strength, stiffness, and conductivity of the copper alloy.

[0036] In some embodiments of this application, online solution treatment involves directly water cooling the material after the final hot rolling pass.

[0037] In some embodiments of this application, the heat treatment temperature is 750~850°C; and / or, the heat treatment holding time is 2~8h; and / or, the hot rolling temperature is 740~850°C; and / or, the material temperature at the end of hot rolling is 700~800°C; and / or, the total rolling ratio of hot rolling is 78~86%.

[0038] Controlling the temperature and time of heat treatment within the aforementioned range helps promote element diffusion and solid solution, eliminate casting defects, and avoid overheating and performance deterioration. Controlling the hot rolling temperature within the aforementioned range helps effectively utilize the material's high-temperature plasticity, altering its shape and size through rolling, while simultaneously breaking down the as-cast structure, promoting grain refinement, and thus improving the alloy's mechanical properties. It also provides a good foundation for subsequent cold working and aging treatments. Controlling the material temperature at the end of hot rolling within the aforementioned range facilitates online solid solution treatment, utilizing the residual heat of hot rolling to further promote the solid solution of alloying elements, providing a driving force for precipitate formation. Controlling the total rolling ratio of hot rolling within the aforementioned range helps increase the dislocation density within the material, thereby improving the alloy's strength. It also provides more nucleation sites for subsequent aging treatment, accelerating the precipitation kinetics process, further improving the alloy's overall performance, and helps break down the original microstructure, promoting the formation of a more uniform and finer grain structure in subsequent processing, creating conditions for precipitate optimization during subsequent aging treatment.

[0039] In some embodiments of this application, the preparation method further includes performing a first milling treatment on the material after online solution treatment, followed by a first cold rolling. Preferably, the first milling treatment is a double milling treatment, in which the thickness removed from the upper and lower surfaces is 0.2~0.5mm. And / or, the preparation method further includes performing a second milling treatment on the material after solution treatment, followed by a second cold rolling. Preferably, the second milling treatment is a double milling treatment, in which the thickness removed from the upper and lower surfaces is 0.1~0.3mm.

[0040] Milling is a process that removes oxide scale and defects from the alloy surface through machining. This improves surface quality, reduces the adverse effects of surface defects on subsequent cold working deformation of the alloy, and consequently affects material properties. It provides a clean and smooth alloy surface for subsequent processing steps.

[0041] In some embodiments of this application, the deformation amount of the first cold rolling is 70-80%; and / or, the solution treatment temperature is 850-950°C, preferably 870-920°C; and / or, the solution treatment holding time is 1-10 min, preferably 3-8 min, and the cooling method after solution treatment is water cooling.

[0042] Controlling the deformation amount during the first cold rolling within the aforementioned range helps introduce a large number of dislocations into the alloy, increasing the dislocation density. This, in turn, helps improve the hardness and tensile strength of the copper alloy and creates abundant nucleation sites for the formation of precipitates during subsequent aging treatment. This, in turn, promotes the formation of fine, uniform precipitates, thereby improving the overall properties of the alloy. Controlling the temperature and time of the solution treatment within the aforementioned range helps improve the homogeneity of the solid solution, thus providing a good microstructure basis for subsequent cold working and aging treatment.

[0043] In some embodiments of this application, the deformation amount of the second cold rolling is 45~60%; and / or, the temperature of the first aging treatment is 375~475℃, preferably 425~475℃; and / or, the holding time of the first aging treatment is 1~8h, preferably 2~6h, and the cooling method of the material after the first aging treatment is air cooling.

[0044] Controlling the deformation amount during the second cold rolling process within the aforementioned range helps to further increase the dislocation density within the material, refine the grains, improve the strength and hardness of the alloy, while reducing work hardening caused by excessive deformation and maintaining the material's plasticity. Controlling the temperature and time of the first aging treatment within the aforementioned range helps to promote the precipitation of supersaturated solute atoms in the alloy, forming fine, uniformly distributed precipitates, thereby improving the material's strength, stiffness, and electrical conductivity.

[0045] In some embodiments of this application, the deformation amount of the third cold rolling is 45-60%; and / or, the temperature of the second aging treatment is 350-475°C, preferably 350-450°C; and / or, the holding time of the second aging treatment is 1-8 hours, preferably 2-5 hours, and the cooling method of the material after the second aging treatment is air cooling; and / or, the melting is carried out in a vacuum electromagnetic induction melting furnace, the melting temperature is 1150-1300°C, the melting time is 40-70 minutes, and the melting power is 30-70 kW; and / or, the temperature of the melt during casting is 1200-1250°C.

[0046] Controlling the deformation amount during the third cold rolling process within the aforementioned range helps to further strengthen the internal microstructure of the material, improving its strength and hardness. Controlling the temperature and time of the second aging treatment within the aforementioned range helps to improve the maturation stability of the precipitated phases, thereby contributing to improved alloy strength, stiffness, and electrical conductivity. Using a vacuum electromagnetic induction melting furnace helps to effectively purify the melt and remove harmful impurities, thus helping to reduce defects such as porosity and inclusions in the ingot. Controlling the melting temperature and time within the aforementioned range helps to improve the overall uniformity of the melt. Controlling the melt temperature during casting within the aforementioned range is beneficial for the formation of equiaxed crystals and inhibits the growth of coarse columnar crystals.

[0047] In some embodiments of this application, the melting process includes: first heating at a power of 30kW for 10-20 minutes, then increasing the power to 50kW and heating for 10-20 minutes, then adjusting the power to 70kW to heat the melt to 1200-1250°C, then reducing the power to 50kW to raise the temperature of the melt to 1275-1300°C, stirring the melt for 30-90 seconds, reducing the power to 0, stopping heating, and lowering the temperature of the melt to 1150°C, then adjusting the power to 50kW to raise the temperature of the melt to 1275-1300°C. This constitutes one cycle, and then the melt is stirred again. The previous operation is repeated 2-3 times, and the entire process takes 40-70 minutes.

[0048] By using different electromagnetic melting frequencies, the melt flows under the action of electromagnetic force, making the flow field and temperature field more uniform, thereby ensuring the uniform distribution of alloying elements in the melt and minimizing element segregation.

[0049] In another typical embodiment of this application, a flexible electronic component is provided, which contains the aforementioned copper alloy.

[0050] Because the copper alloy of this application possesses excellent strength and elastic modulus, the elastic electronic components can withstand greater mechanical stress and maintain good performance even after undergoing multiple mechanical stress cycles. This helps to enhance the fatigue resistance of the elastic electronic components and extend their service life. The high conductivity of the copper alloy contributes to higher signal transmission efficiency and lower resistance within the elastic electronic components, reducing energy loss and heat generation, and improving the overall performance and energy efficiency of electronic devices.

[0051] The beneficial effects of this application will be further illustrated below with reference to the embodiments.

[0052] Example 1

[0053] (a) Melting and Casting: Melting was carried out in a vacuum electromagnetic induction melting furnace. The target copper alloy composition, as shown in Table 1, was prepared by mass percentage, with Ti added as a Cu-20Ti master alloy, Fe as a Cu-20Fe master alloy, La as a Cu-10La master alloy, Y as a Cu-10Y master alloy, B as a Cu-4B master alloy, and Cu as cathode copper. After complete melting, the holding temperature was 1300℃. The entire melt was thoroughly stirred during the melting process, which lasted for 60 minutes. First, heat at a low power of 30KW for 10 minutes, then increase the power to 50KW and heat for 15 minutes. Next, adjust the power to 70KW and heat the melt to 1250℃. Then, reduce the power to 50KW and slowly raise the temperature to 1300℃. Stir the melt with a high-power electromagnetic stirrer for 90 seconds, then reduce the power to 0, stop heating, disconnect the contactor, and allow the temperature to drop to 1150℃. Press and hold the contactor to close it, adjust the power to 50KW, and heat to 1300℃. This completes one cycle. Then, continue stirring the melt with a high-power electromagnetic stirrer and repeat the previous operation twice. Finally, cast the melt into an ingot at a temperature of 1200℃.

[0054] (b) Heat treatment, hot rolling and online solution treatment: The ingot is placed in a walking beam furnace for heat treatment at 800°C and held for 4 hours. Then the ingot is sent to a hot rolling mill at 800°C, with a hot rolling deformation of 85%. The final rolling temperature is controlled at 750°C, and the hot-rolled plate is water-cooled online.

[0055] (c) Milling: Mill the surface of the solution-treated alloy obtained in step (b) to remove the oxide scale generated on the surface. Mill 0.3 mm off the top and bottom surfaces respectively.

[0056] (d) First cold rolling: The plate after milling in step (c) is subjected to a first cold rolling with a rolling deformation of 75%.

[0057] (e) Solution treatment: The cold-rolled sheet obtained in step (d) is subjected to solution treatment at a temperature of 880°C and a holding time of 5 min, and then water-cooled.

[0058] (f) Milling: Mill the surface of the water-cooled plate in step (e) to remove the oxide scale generated on the surface. Mill 0.2 mm off the top and bottom surfaces respectively.

[0059] (g) Second cold rolling and first aging treatment: The plate after milling in step (f) is subjected to a second cold rolling with a rolling deformation of 55%; the plate after the second cold rolling is subjected to a first aging treatment with an aging temperature of 450°C and an aging time of 4 hours, and then air cooling.

[0060] (h) Third cold rolling and second aging treatment: The plate after air cooling in step (g) is subjected to a third cold rolling with a rolling deformation of 50%; the plate after the third cold rolling is subjected to a second aging treatment with an aging temperature of 400℃ and an aging time of 4h, and then air cooling is performed to obtain a copper alloy.

[0061] Example 2

[0062] The difference from Example 1 is that (a) melting and casting: melting was carried out in a vacuum electromagnetic induction melting furnace, and the target copper alloy composition shown in Table 1 was prepared by mass percentage, wherein Ti was added in the form of Cu-20Ti master alloy, Fe in the form of Cu-20Fe master alloy, La in the form of Cu-10La master alloy, Y in the form of Cu-10Y master alloy, B in the form of Cu-4B master alloy, and Cu in the form of cathode copper. After complete melting, the holding temperature was 1300°C. The entire melt was thoroughly stirred during the melting process, and the entire melting time was 60 minutes. During the refining process, the melt is first heated at a low power of 30KW for 10 minutes, then the power is increased to 50KW for 15 minutes. The power is then adjusted to 70KW to heat the melt to 1250℃, and then reduced to 50KW to allow the temperature to rise slowly to 1300℃. The melt is then stirred with a high-power electromagnetic stirrer for 90 seconds, the power is reduced to 0, heating is stopped, the contactor is disconnected, and the temperature drops to 1150℃. The contactor is then closed by pressing and holding the button, the power is adjusted to 50KW, and the melt is heated to 1300℃. This completes one cycle. The melt is then stirred with a high-power electromagnetic stirrer and the previous operation is repeated twice. Finally, the melt is cast into an ingot at a temperature of 1200℃.

[0063] (b) Heat treatment, hot rolling and online solution treatment: The ingot is placed in a walking beam furnace for heat treatment at 800°C and held for 4 hours. Then the ingot is sent to a hot rolling mill at 800°C, with a hot rolling deformation of 85%. The final rolling temperature is controlled at 750°C, and the hot-rolled plate is water-cooled online.

[0064] (c) Milling: Mill the surface of the solution-treated alloy obtained in step (b) to remove the oxide scale generated on the surface. Mill 0.3 mm off the top and bottom surfaces respectively.

[0065] (d) First cold rolling: The plate after milling in step (c) is subjected to a first cold rolling with a rolling deformation of 75%.

[0066] (e) Solution treatment: The cold-rolled sheet obtained in step (d) is subjected to solution treatment at a temperature of 880°C and a holding time of 5 min, and then water-cooled.

[0067] (f) Milling: Mill the surface of the water-cooled plate in step (e) to remove the oxide scale generated on the surface. Mill 0.2 mm off the top and bottom surfaces respectively.

[0068] (g) Second cold rolling and first aging treatment: The plate after milling in step (f) is subjected to a second cold rolling with a rolling deformation of 55%; the plate after the second cold rolling is subjected to a first aging treatment with an aging temperature of 450°C and an aging time of 4 hours, and then air cooling.

[0069] (h) Third cold rolling and second aging treatment: The plate after air cooling in step (g) is subjected to a third cold rolling with a rolling deformation of 50%; the plate after the third cold rolling is subjected to a second aging treatment with an aging temperature of 425℃ and an aging time of 3h, and then air cooling is performed to obtain a copper alloy.

[0070] Example 3

[0071] The difference from Example 1 is that (a) melting and casting: melting was carried out in a vacuum electromagnetic induction melting furnace, and the target copper alloy composition shown in Table 1 was prepared by mass percentage, wherein Ti was added in the form of Cu-20Ti master alloy, Fe in the form of Cu-20Fe master alloy, La in the form of Cu-10La master alloy, Y in the form of Cu-10Y master alloy, B in the form of Cu-4B master alloy, and Cu in the form of cathode copper. After complete melting, the holding temperature was 1275°C. The entire melt was thoroughly stirred during the melting process, and the entire melting time was 50 minutes. During the refining process, the melt is first heated at a low power of 30KW for 10 minutes, then the power is increased to 50KW for another 10 minutes. The power is then adjusted to 70KW to heat the melt to 1250℃, and then reduced to 50KW to allow the temperature to rise slowly to 1275℃. The melt is then stirred with a high-power electromagnetic stirrer for 70 seconds, the power is reduced to 0, heating is stopped, the contactor is disconnected, and the temperature drops to 1150℃. The contactor is then closed by pressing and holding the button, the power is adjusted to 50KW, and the melt is heated to 1275℃. This completes one cycle. The melt is then stirred with a high-power electromagnetic stirrer and the previous operation is repeated twice. The melt is then cast into an ingot at a temperature of 1225℃.

[0072] (b) Heat treatment, hot rolling and online solution treatment: The ingot is placed in a walking beam furnace for heat treatment at 780°C for 3 hours. Then the ingot is sent to a hot rolling mill at 780°C with a hot rolling deformation of 80%. The final rolling temperature is controlled at 730°C. The hot-rolled plate is then water-cooled online.

[0073] (c) Milling: Mill the surface of the solution-treated alloy obtained in step (b) to remove the oxide scale generated on the surface. Mill 0.2 mm off the top and bottom surfaces respectively.

[0074] (d) First cold rolling: The plate after milling in step (c) is subjected to a first cold rolling with a rolling deformation of 78%.

[0075] (e) Solution treatment: The cold-rolled sheet obtained in step (d) is subjected to solution treatment at a temperature of 850°C and a holding time of 8 min, and then cooled with water.

[0076] (f) Milling: Mill the surface of the water-cooled plate in step (e) to remove the oxide scale generated on the surface. Mill 0.2 mm off the top and bottom surfaces respectively.

[0077] (g) Second cold rolling and first aging treatment: The plate after milling in step (f) is subjected to a second cold rolling with a rolling deformation of 55%; the plate after the second cold rolling is subjected to a first aging treatment with an aging temperature of 450°C and an aging time of 4 hours, and then air cooling.

[0078] (h) Third cold rolling and second aging treatment: The plate after air cooling in step (g) is subjected to a third cold rolling with a rolling deformation of 45%; the plate after the third cold rolling is subjected to a second aging treatment with an aging temperature of 450℃ and an aging time of 4h, and then air cooling is performed to obtain a copper alloy.

[0079] Example 4

[0080] The difference from Example 1 is that (a) melting and casting: melting was carried out in a vacuum electromagnetic induction melting furnace, and the target copper alloy composition shown in Table 1 was prepared by mass percentage, wherein Ti was added in the form of Cu-20Ti master alloy, Fe in the form of Cu-20Fe master alloy, La in the form of Cu-10La master alloy, Y in the form of Cu-10Y master alloy, B in the form of Cu-4B master alloy, and Cu in the form of cathode copper. After complete melting, the holding temperature was 1300°C. The entire melt was thoroughly stirred during the melting process, and the entire melting time was 60 minutes. During the refining process, the melt is first heated at a low power of 30KW for 10 minutes, then the power is increased to 50KW for 15 minutes. The power is then adjusted to 70KW to heat the melt to 1250℃, and then reduced to 50KW to allow the temperature to rise slowly to 1300℃. The melt is then stirred with a high-power electromagnetic stirrer for 90 seconds, the power is reduced to 0, heating is stopped, the contactor is disconnected, and the temperature drops to 1150℃. The contactor is then closed by pressing and holding the button, the power is adjusted to 50KW, and the melt is heated to 1300℃. This completes one cycle. The melt is then stirred with a high-power electromagnetic stirrer and the previous operation is repeated twice. Finally, the melt is cast into an ingot at a temperature of 1200℃.

[0081] (b) Heat treatment, hot rolling and online solution treatment: The ingot is placed in a walking beam furnace for heat treatment at 820°C for 4 hours. Then the ingot is sent to a hot rolling mill at 820°C with a hot rolling deformation of 83%. The final rolling temperature is controlled at 750°C. The hot-rolled plate is then water-cooled online.

[0082] (c) Milling: Mill the surface of the solution-treated alloy obtained in step (b) to remove the oxide scale generated on the surface. Mill 0.3 mm off the top and bottom surfaces respectively.

[0083] (d) First cold rolling: The plate after milling in step (c) is subjected to a first cold rolling with a rolling deformation of 75%.

[0084] (e) Solution treatment: The cold-rolled sheet obtained in step (d) is subjected to solution treatment at a temperature of 880°C and a holding time of 5 min, and then water-cooled.

[0085] (f) Milling: Mill the surface of the water-cooled plate in step (e) to remove the oxide scale generated on the surface. Mill 0.2 mm off the top and bottom surfaces respectively.

[0086] (g) Second cold rolling and first aging treatment: The plate after milling in step (f) is subjected to a second cold rolling with a rolling deformation of 50%; the plate after the second cold rolling is subjected to a first aging treatment with an aging temperature of 450°C and an aging time of 4 hours, and then air cooling.

[0087] (h) Third cold rolling and second aging treatment: The plate after air cooling in step (g) is subjected to a third cold rolling with a rolling deformation of 50%; the plate after the third cold rolling is subjected to a second aging treatment with an aging temperature of 450℃ and an aging time of 4h, and then air cooling is performed to obtain a copper alloy.

[0088] Example 5

[0089] The difference from Example 1 is that (a) melting and casting: melting was carried out in a vacuum electromagnetic induction melting furnace, and the target copper alloy composition shown in Table 1 was prepared by mass percentage, wherein Ti was added in the form of Cu-20Ti master alloy, Fe in the form of Cu-20Fe master alloy, La in the form of Cu-10La master alloy, Y in the form of Cu-10Y master alloy, B in the form of Cu-4B master alloy, and Cu in the form of cathode copper. After complete melting, the holding temperature was 1290°C. The entire melt was thoroughly stirred during the melting process, and the entire melting time was 45 minutes. During the refining process, the melt is first heated at a low power of 30KW for 10 minutes, then the power is increased to 50KW for another 10 minutes. The power is then adjusted to 70KW to heat the melt to 1250℃, and then reduced to 50KW to allow the temperature to rise slowly to 1290℃. The melt is then stirred with a high-power electromagnetic stirrer for 50 seconds, the power is reduced to 0, heating is stopped, the contactor is disconnected, and the temperature drops to 1150℃. The contactor is then closed by pressing and holding the button, the power is adjusted to 50KW, and the melt is heated to 1290℃. This completes one cycle. The melt is then stirred with a high-power electromagnetic stirrer and the previous operation is repeated twice. Finally, the melt is cast into an ingot at a temperature of 1200℃.

[0090] (b) Heat treatment, hot rolling and online solution treatment: The ingot is placed in a walking beam furnace for heat treatment at 840°C for 4 hours. Then the ingot is sent to a hot rolling mill at 800°C with a hot rolling deformation of 85%. The final rolling temperature is controlled at 750°C. The hot-rolled plate is then water-cooled online.

[0091] (c) Milling: Mill the surface of the solution-treated alloy obtained in step (b) to remove the oxide scale generated on the surface. Mill 0.3 mm off the top and bottom surfaces respectively.

[0092] (d) First cold rolling: The plate after milling in step (c) is subjected to a first cold rolling with a rolling deformation of 70%.

[0093] (e) Solution treatment: The cold-rolled sheet obtained in step (d) is subjected to solution treatment at a temperature of 880°C and a holding time of 8 min, and then cooled with water.

[0094] (f) Milling: Mill the surface of the water-cooled plate in step (e) to remove the oxide scale generated on the surface. Mill 0.2 mm off the top and bottom surfaces respectively.

[0095] (g) Second cold rolling and first aging treatment: The plate after milling in step (f) is subjected to a second cold rolling with a rolling deformation of 60%; the plate after the second cold rolling is subjected to a first aging treatment with an aging temperature of 450°C and an aging time of 3 hours, and then air cooling.

[0096] (h) Third cold rolling and second aging treatment: The plate after air cooling in step (g) is subjected to a third cold rolling with a rolling deformation of 45%; the plate after the third cold rolling is subjected to a second aging treatment with an aging temperature of 400℃ and an aging time of 3h, and then air cooling is performed to obtain a copper alloy.

[0097] Example 6

[0098] The difference from Example 1 is that (a) melting and casting: melting was carried out in a vacuum electromagnetic induction melting furnace, and the target copper alloy composition shown in Table 1 was prepared by mass percentage, wherein Ti was added in the form of Cu-20Ti master alloy, P in the form of Cu-14P master alloy, La in the form of Cu-10La master alloy, Y in the form of Cu-10Y master alloy, B in the form of Cu-4B master alloy, and Cu in the form of cathode copper. After complete melting, the holding temperature was 1300°C. The entire melt was thoroughly stirred during the melting process, and the entire melting time was 60 minutes. During the process, the melt is first heated at a low power of 30KW for 10 minutes, then the power is increased to 50KW for 15 minutes, then the power is adjusted to 70KW to heat the melt to 1250℃, then the power is reduced to 50KW to allow the temperature to rise slowly to 1300℃, the melt is stirred with a high-power electromagnetic stirrer for 80 seconds, the power is reduced to 0, heating is stopped, the contactor is disconnected, and the temperature drops to 1150℃. The contactor is then closed by pressing and holding, the power is adjusted to 50KW, and the temperature is heated to 1300℃. This is one cycle. Then the melt is stirred with a high-power electromagnetic stirrer and the previous operation is repeated twice. The melt is then cast into an ingot at a temperature of 1200℃.

[0099] (b) Heat treatment, hot rolling and online solution treatment: The ingot is placed in a walking beam furnace for heat treatment at 820°C for 4 hours. Then the ingot is sent to a hot rolling mill at 820°C with a hot rolling deformation of 85%. The final rolling temperature is controlled at 760°C. The hot-rolled plate is then water-cooled online.

[0100] (c) Milling: Mill the surface of the solution-treated alloy obtained in step (b) to remove the oxide scale generated on the surface. Mill 0.3 mm off the top and bottom surfaces respectively.

[0101] (d) First cold rolling: The plate after milling in step (c) is subjected to a first cold rolling with a rolling deformation of 75%.

[0102] (e) Solution treatment: The cold-rolled sheet obtained in step (d) is subjected to solution treatment at a temperature of 850°C and a holding time of 5 min, and then water-cooled.

[0103] (f) Milling: Mill the surface of the water-cooled plate in step (e) to remove the oxide scale generated on the surface. Mill 0.2 mm off the top and bottom surfaces respectively.

[0104] (g) Second cold rolling and first aging treatment: The plate after milling in step (f) is subjected to a second cold rolling with a rolling deformation of 45%; the plate after the second cold rolling is subjected to a first aging treatment with an aging temperature of 450°C and an aging time of 2 hours, and then air cooling.

[0105] (h) Third cold rolling and second aging treatment: The plate after air cooling in step (g) is subjected to a third cold rolling with a rolling deformation of 50%; the plate after the third cold rolling is subjected to a second aging treatment with an aging temperature of 400℃ and an aging time of 4h, and then air cooling is performed to obtain a copper alloy.

[0106] Example 7

[0107] The difference from Example 1 is that (a) melting and casting: melting was carried out in a vacuum electromagnetic induction melting furnace, and the target copper alloy composition shown in Table 1 was prepared by mass percentage, wherein Ti was added in the form of Cu-20Ti master alloy, P in the form of Cu-14P master alloy, La in the form of Cu-10La master alloy, Y in the form of Cu-10Y master alloy, B in the form of Cu-4B master alloy, and Cu in the form of cathode copper. After complete melting, the holding temperature was 1275°C. The entire melt was thoroughly stirred during the melting process, and the entire melting time was 45 minutes. During the process, the melt is first heated at a low power of 30KW for 10 minutes, then the power is increased to 50KW for another 10 minutes. The power is then adjusted to 70KW to heat the melt to 1225℃. Subsequently, the power is reduced to 50KW to allow the temperature to rise slowly to 1275℃. The melt is then stirred with a high-power electromagnetic stirrer for 50 seconds. The power is then reduced to 0, heating is stopped, the contactor is disconnected, and the temperature drops to 1150℃. The contactor is then closed by pressing and holding the button, the power is adjusted to 50KW, and the melt is heated to 1275℃. This completes one cycle. The melt is then stirred with a high-power electromagnetic stirrer and the previous operation is repeated twice. Finally, the melt is cast into an ingot at a temperature of 1210℃.

[0108] (b) Heat treatment, hot rolling and online solution treatment: The ingot is placed in a walking beam furnace for heat treatment at 800°C for 5 hours. Then the ingot is sent to a hot rolling mill at 800°C with a hot rolling deformation of 80%. The final rolling temperature is controlled at 740°C. The hot-rolled plate is then water-cooled online.

[0109] (c) Milling: Mill the surface of the solution-treated alloy obtained in step (b) to remove the oxide scale generated on the surface. Mill 0.3 mm off the top and bottom surfaces respectively.

[0110] (d) First cold rolling: The plate after milling in step (c) is subjected to first cold rolling, and the rolling deformation is 80%.

[0111] (e) Solution treatment: The cold-rolled sheet obtained in step (d) is subjected to solution treatment at a temperature of 860°C and a holding time of 5 min, and then cooled with water.

[0112] (f) Milling: Mill the surface of the water-cooled plate in step (e) to remove the oxide scale generated on the surface. Mill 0.2 mm off the top and bottom surfaces respectively.

[0113] (g) Second cold rolling and first aging treatment: The plate after milling in step (f) is subjected to a second cold rolling with a rolling deformation of 55%; the plate after the second cold rolling is subjected to a first aging treatment with an aging temperature of 450°C and an aging time of 2 hours, and then air cooling.

[0114] (h) Third cold rolling and second aging treatment: The plate after air cooling in step (g) is subjected to a third cold rolling with a rolling deformation of 45%; the plate after the third cold rolling is subjected to a second aging treatment with an aging temperature of 400℃ and an aging time of 2h, and then air cooling is performed to obtain a copper alloy.

[0115] Example 8

[0116] The difference from Example 1 is that (a) melting and casting: melting was carried out in a vacuum electromagnetic induction melting furnace, and the target copper alloy composition shown in Table 1 was prepared by mass percentage, wherein Ti was added in the form of Cu-20Ti master alloy, P in the form of Cu-14P master alloy, La in the form of Cu-10La master alloy, Y in the form of Cu-10Y master alloy, B in the form of Cu-4B master alloy, and Cu in the form of cathode copper. After complete melting, the holding temperature was 1300°C. The entire melt was thoroughly stirred during the melting process, and the entire melting time was 60 minutes. During the process, the melt is first heated at a low power of 30KW for 10 minutes, then the power is increased to 50KW for 15 minutes, then the power is adjusted to 70KW to heat the melt to 1250℃, then the power is reduced to 50KW to allow the temperature to rise slowly to 1300℃, the melt is stirred with a high-power electromagnetic stirrer for 90 seconds, the power is reduced to 0, heating is stopped, the contactor is disconnected, and the temperature drops to 1150℃. The contactor is then closed by pressing and holding, the power is adjusted to 50KW, and the temperature is heated to 1300℃. This is one cycle. Then the melt is stirred with a high-power electromagnetic stirrer and the previous operation is repeated twice. The melt is then cast into an ingot at a temperature of 1200℃.

[0117] (b) Heat treatment, hot rolling and online solution treatment: The ingot is placed in a walking beam furnace for heat treatment at 820°C for 4 hours. Then the ingot is sent to a hot rolling mill at 820°C with a hot rolling deformation of 83%. The final rolling temperature is controlled at 750°C. The hot-rolled plate is then water-cooled online.

[0118] (c) Milling: Mill the surface of the solution-treated alloy obtained in step (b) to remove the oxide scale generated on the surface. Mill 0.3 mm off the top and bottom surfaces respectively.

[0119] (d) First cold rolling: The plate after milling in step (c) is subjected to a first cold rolling with a rolling deformation of 75%.

[0120] (e) Solution treatment: The cold-rolled sheet obtained in step (d) is subjected to solution treatment at a temperature of 880°C and a holding time of 5 min, and then water-cooled.

[0121] (f) Milling: Mill the surface of the water-cooled plate in step (e) to remove the oxide scale generated on the surface. Mill 0.2 mm off the top and bottom surfaces respectively.

[0122] (g) Second cold rolling and first aging treatment: The plate after milling in step (f) is subjected to a second cold rolling with a rolling deformation of 50%; the plate after the second cold rolling is subjected to a first aging treatment with an aging temperature of 450°C and an aging time of 2 hours, and then air cooling.

[0123] (h) Third cold rolling and second aging treatment: The plate after air cooling in step (g) is subjected to a third cold rolling with a rolling deformation of 50%; the plate after the third cold rolling is subjected to a second aging treatment with an aging temperature of 400℃ and an aging time of 4h, and then air cooling is performed to obtain a copper alloy.

[0124] Example 9

[0125] The difference from Example 1 is that (a) melting and casting: melting was carried out in a vacuum electromagnetic induction melting furnace, and the target copper alloy composition shown in Table 1 was prepared by mass percentage, wherein Ti was added in the form of Cu-20Ti master alloy, P in the form of Cu-14P master alloy, La in the form of Cu-10La master alloy, Y in the form of Cu-10Y master alloy, B in the form of Cu-4B master alloy, and Cu in the form of cathode copper. After complete melting, the holding temperature was 1280°C. The entire melt was thoroughly stirred during the melting process, and the entire melting time was 60 minutes. During the process, the melt is first heated at a low power of 30KW for 10 minutes, then the power is increased to 50KW for 15 minutes. Then the power is adjusted to 70KW to heat the melt to 1250℃. Subsequently, the power is reduced to 50KW to allow the temperature to rise slowly to 1280℃. The melt is then stirred with a high-power electromagnetic stirrer for 90 seconds. The power is then reduced to 0, heating is stopped, the contactor is disconnected, and the temperature drops to 1150℃. The contactor is then closed by pressing and holding the button, the power is adjusted to 50KW, and the melt is heated to 1280℃. This completes one cycle. The melt is then stirred with a high-power electromagnetic stirrer and the previous operation is repeated twice. Finally, the melt is cast into an ingot at a temperature of 1200℃.

[0126] (b) Heat treatment, hot rolling and online solution treatment: The ingot is placed in a walking beam furnace for heat treatment at 820°C for 4 hours. Then the ingot is sent to a hot rolling mill at 820°C with a hot rolling deformation of 83%. The final rolling temperature is controlled at 750°C. The hot-rolled plate is then water-cooled online.

[0127] (c) Milling: Mill the surface of the solution-treated alloy obtained in step (b) to remove the oxide scale generated on the surface. Mill 0.3 mm off the top and bottom surfaces respectively.

[0128] (d) First cold rolling: The plate after milling in step (c) is subjected to a first cold rolling with a rolling deformation of 75%.

[0129] (e) Solution treatment: The cold-rolled sheet obtained in step (d) is subjected to solution treatment at a temperature of 880°C and a holding time of 5 min, and then water-cooled.

[0130] (f) Milling: Mill the surface of the water-cooled plate in step (e) to remove the oxide scale generated on the surface. Mill 0.2 mm off the top and bottom surfaces respectively.

[0131] (g) Second cold rolling and first aging treatment: The plate after milling in step (f) is subjected to a second cold rolling with a rolling deformation of 50%; the plate after the second cold rolling is subjected to a first aging treatment with an aging temperature of 450°C and an aging time of 2 hours, and then air cooling.

[0132] (h) Third cold rolling and second aging treatment: The plate after air cooling in step (g) is subjected to a third cold rolling with a rolling deformation of 50%; the plate after the third cold rolling is subjected to a second aging treatment with an aging temperature of 375℃ and an aging time of 4h, and then air cooling is performed to obtain a copper alloy.

[0133] Example 10

[0134] The difference from Example 1 is that (a) melting and casting: melting was carried out in a vacuum electromagnetic induction melting furnace, and the target copper alloy composition shown in Table 1 was prepared by mass percentage, wherein Ti was added in the form of Cu-20Ti master alloy, P in the form of Cu-14P master alloy, La in the form of Cu-10La master alloy, Y in the form of Cu-10Y master alloy, B in the form of Cu-4B master alloy, and Cu in the form of cathode copper. After complete melting, the holding temperature was 1290°C. The entire melt was thoroughly stirred during the melting process, and the entire melting time was 40 minutes. During the process, the melt is first heated at a low power of 30KW for 10 minutes, then the power is increased to 50KW for another 10 minutes. The power is then adjusted to 70KW to heat the melt to 1250℃. Subsequently, the power is reduced to 50KW to allow the temperature to rise slowly to 1290℃. The melt is then stirred with a high-power electromagnetic stirrer for 30 seconds. The power is then reduced to 0, heating is stopped, the contactor is disconnected, and the temperature drops to 1150℃. The contactor is then closed by pressing and holding the button, the power is adjusted to 50KW, and the melt is heated to 1290℃. This completes one cycle. The melt is then stirred with a high-power electromagnetic stirrer and the previous operation is repeated twice. Finally, the melt is cast into an ingot at a temperature of 1250℃.

[0135] (b) Heat treatment, hot rolling and online solution treatment: The ingot is placed in a walking beam furnace for heat treatment at 840°C for 3 hours. Then the ingot is sent to a hot rolling mill at 840°C with a hot rolling deformation of 85%. The final rolling temperature is controlled at 750°C. The hot-rolled plate is then water-cooled online.

[0136] (c) Milling: Mill the surface of the solution-treated alloy obtained in step (b) to remove the oxide scale generated on the surface. Mill 0.3 mm off the top and bottom surfaces respectively.

[0137] (d) First cold rolling: The plate after milling in step (c) is subjected to a first cold rolling with a rolling deformation of 70%.

[0138] (e) Solution treatment: The cold-rolled sheet obtained in step (d) is subjected to solution treatment at a temperature of 850°C and a holding time of 10 min, and then cooled with water.

[0139] (f) Milling: Mill the surface of the water-cooled plate in step (e) to remove the oxide scale generated on the surface. Mill 0.2 mm off the top and bottom surfaces respectively.

[0140] (g) Second cold rolling and first aging treatment: The plate after milling in step (f) is subjected to a second cold rolling with a rolling deformation of 60%; the plate after the second cold rolling is subjected to a first aging treatment with an aging temperature of 400℃ and an aging time of 4h, and then air cooling.

[0141] (h) Third cold rolling and second aging treatment: The plate after air cooling in step (g) is subjected to a third cold rolling with a rolling deformation of 45%; the plate after the third cold rolling is subjected to a second aging treatment with an aging temperature of 350℃ and an aging time of 6h, and then air cooling is performed to obtain a copper alloy.

[0142] Example 11

[0143] The difference from Example 4 is that the proportions of Cu-20Ti master alloy, Cu-20Fe master alloy, Cu-10La master alloy, Cu-10Y master alloy, Cu-4B master alloy and cathode copper were adjusted to obtain a copper alloy. By mass percentage, the copper alloy contains the following elements: Ti 3.10%, Fe 0.35%, Y 0.010%, La 0.020%, B 0.010%, unavoidable impurities ≤0.01%, and the balance is Cu.

[0144] Example 12

[0145] The difference from Example 4 is that the proportions of Cu-20Ti master alloy, Cu-20Fe master alloy, Cu-10La master alloy, Cu-10Y master alloy, Cu-4B master alloy and cathode copper were adjusted to obtain a copper alloy. By mass percentage, the copper alloy contains the following elements: Ti 3.60%, Fe 0.28%, Y 0.020%, La 0.010%, B 0.015%, unavoidable impurities ≤0.01%, and the balance is Cu.

[0146] Example 13

[0147] The difference from Example 4 is that the proportions of Cu-20Ti master alloy, Cu-20Fe master alloy, Cu-10La master alloy, Cu-10Y master alloy, Cu-4B master alloy and cathode copper were adjusted to obtain a copper alloy. By mass percentage, the copper alloy contains the following elements: Ti 2.70%, Fe 0.45%, Y 0.010%, La 0.030%, B 0.010%, unavoidable impurities ≤0.01%, and the balance is Cu.

[0148] Example 14

[0149] The difference from Example 4 is that the proportions of Cu-20Ti master alloy, Cu-20Fe master alloy, Cu-10La master alloy, Cu-10Y master alloy, Cu-4B master alloy and cathode copper were adjusted to obtain a copper alloy. By mass percentage, the copper alloy contains the following elements: Ti 4.20%, Fe 0.28%, Y 0.030%, La 0.010%, B 0.020%, unavoidable impurities ≤0.01%, and the balance is Cu.

[0150] Example 15

[0151] The difference from Example 8 is that the proportions of Cu-20Ti master alloy, Cu-14P master alloy, Cu-10La master alloy, Cu-10Y master alloy, Cu-4B master alloy and cathode copper were adjusted to obtain a copper alloy. By mass percentage, the copper alloy contains the following elements: Ti 3.10%, P 0.10%, Y 0.020%, La 0.030%, B 0.010%, unavoidable impurities ≤0.01%, and the balance is Cu.

[0152] Example 16

[0153] The difference from Example 8 is that the proportions of Cu-20Ti master alloy, Cu-14P master alloy, Cu-10La master alloy, Cu-10Y master alloy, Cu-4B master alloy and cathode copper were adjusted to obtain a copper alloy. By mass percentage, the copper alloy contains the following elements: Ti 3.60%, P 0.05%, Y 0.030%, La 0.020%, B 0.015%, unavoidable impurities ≤0.01%, and the balance is Cu.

[0154] Example 17

[0155] The difference from Example 8 is that the proportions of Cu-20Ti master alloy, Cu-14P master alloy, Cu-10La master alloy, Cu-10Y master alloy, Cu-4B master alloy and cathode copper were adjusted to obtain a copper alloy. By mass percentage, the copper alloy contains the following elements: Ti 2.70%, P 0.15%, Y 0.010%, La 0.030%, B 0.010%, unavoidable impurities ≤0.01%, and the balance is Cu.

[0156] Example 18

[0157] The difference from Example 8 is that the proportions of Cu-20Ti master alloy, Cu-14P master alloy, Cu-10La master alloy, Cu-10Y master alloy, Cu-4B master alloy and cathode copper were adjusted to obtain a copper alloy. By mass percentage, the copper alloy contains the following elements: Ti 4.20%, P 0.05%, Y 0.030%, La 0.010%, B 0.020%, unavoidable impurities ≤0.01%, and the balance is Cu.

[0158] Comparative Example 1

[0159] The difference from Example 1 is that (a) melting and casting: melting is carried out in a vacuum electromagnetic induction melting furnace, and the target copper alloy composition shown in Table 1 is prepared by mass percentage, wherein Ti is added in the form of Cu-20Ti master alloy and Cu is added in the form of cathode copper. After complete melting, the holding temperature is 1300°C. The entire melt is thoroughly stirred during the melting process, and the entire melting time is 60 min. During the melting process, the low power of 30KW is first used for heating for 10 min, and then the power is increased to 50KW for heating for 1 minute. After 5 minutes, adjust the power to 70KW to heat the melt to 1250℃, then reduce the power to 50KW to slowly raise the temperature to 1300℃. Stir the melt with a high-power electromagnetic stirrer for 90 seconds, then reduce the power to 0, stop heating, disconnect the contactor, and lower the temperature to 1150℃. Press and hold the contactor to close it, adjust the power to 50KW, and heat to 1300℃. This completes one cycle. Then, continue stirring the melt with a high-power electromagnetic stirrer and repeat the previous operation twice. Finally, cast the melt into an ingot at a temperature of 1200℃.

[0160] (b) Heat treatment, hot rolling and online solution treatment: The ingot is placed in a walking beam furnace for heat treatment at 820°C for 4 hours. Then the ingot is sent to a hot rolling mill at 820°C with a hot rolling deformation of 83%. The final rolling temperature is controlled at 750°C. The hot-rolled plate is then water-cooled online.

[0161] (c) Milling: Mill the surface of the solution-treated alloy obtained in step (b) to remove the oxide scale generated on the surface. Mill 0.3 mm off the top and bottom surfaces respectively.

[0162] (d) First cold rolling: The plate after milling in step (c) is subjected to a first cold rolling with a rolling deformation of 75%.

[0163] (e) Solution treatment: The cold-rolled sheet obtained in step (d) is subjected to solution treatment at a temperature of 880°C and a holding time of 5 min, and then water-cooled.

[0164] (f) Milling: Mill the surface of the water-cooled plate in step (e) to remove the oxide scale generated on the surface. Mill 0.2 mm off the top and bottom surfaces respectively.

[0165] (g) Second cold rolling and first aging treatment: The plate after milling in step (f) is subjected to a second cold rolling with a rolling deformation of 50%; the plate after the second cold rolling is subjected to a first aging treatment with an aging temperature of 450°C and an aging time of 4 hours, and then air cooling.

[0166] (h) Third cold rolling and second aging treatment: The plate after air cooling in step (g) is subjected to a third cold rolling with a rolling deformation of 50%; the plate after the third cold rolling is subjected to a second aging treatment with an aging temperature of 375℃ and an aging time of 2h, and then air cooling is performed to obtain a copper alloy.

[0167] Comparative Example 2

[0168] The difference from Example 1 is that (a) melting and casting: melting was carried out in a vacuum electromagnetic induction melting furnace, and the target copper alloy composition shown in Table 1 was prepared by mass percentage, wherein Ti was added in the form of Cu-20Ti master alloy, Fe in the form of Cu-20Fe master alloy, La in the form of Cu-10La master alloy, Y in the form of Cu-10Y master alloy, B in the form of Cu-4B master alloy, and Cu in the form of cathode copper. After complete melting, the holding temperature was 1300°C. The entire melt was thoroughly stirred during the melting process, and the entire melting time was 60 minutes. During the refining process, the melt is first heated at a low power of 30KW for 10 minutes, then the power is increased to 50KW for 15 minutes. The power is then adjusted to 70KW to heat the melt to 1250℃, and then reduced to 50KW to allow the temperature to rise slowly to 1300℃. The melt is then stirred with a high-power electromagnetic stirrer for 90 seconds, the power is reduced to 0, heating is stopped, the contactor is disconnected, and the temperature drops to 1150℃. The contactor is then closed by pressing and holding the button, the power is adjusted to 50KW, and the melt is heated to 1300℃. This completes one cycle. The melt is then stirred with a high-power electromagnetic stirrer and the previous operation is repeated twice. Finally, the melt is cast into an ingot at a temperature of 1200℃.

[0169] (b) Heat treatment, hot rolling and online solution treatment: The ingot is placed in a walking beam furnace for heat treatment at 820°C for 4 hours. Then the ingot is sent to a hot rolling mill at 820°C with a hot rolling deformation of 83%. The final rolling temperature is controlled at 750°C. The hot-rolled plate is then water-cooled online.

[0170] (c) Milling: Mill the surface of the solution-treated alloy obtained in step (b) to remove the oxide scale generated on the surface. Mill 0.3 mm off the top and bottom surfaces respectively.

[0171] (d) First cold rolling: The plate after milling in step (c) is subjected to a first cold rolling with a rolling deformation of 75%.

[0172] (e) Solution treatment: The cold-rolled sheet obtained in step (d) is subjected to solution treatment at a temperature of 880°C and a holding time of 5 min, and then water-cooled.

[0173] (f) Milling: Mill the surface of the water-cooled plate in step (e) to remove the oxide scale generated on the surface. Mill 0.2 mm off the top and bottom surfaces respectively.

[0174] (g) Second cold rolling and first aging treatment: The plate after milling in step (f) is subjected to a second cold rolling with a rolling deformation of 50%; the plate after the second cold rolling is subjected to a first aging treatment with an aging temperature of 450°C and an aging time of 4 hours, and then air cooling.

[0175] (h) Third cold rolling and second aging treatment: The plate after air cooling in step (g) is subjected to a third cold rolling with a rolling deformation of 50%; the plate after the third cold rolling is subjected to a second aging treatment with an aging temperature of 450℃ and an aging time of 4h, and then air cooling is performed to obtain a copper alloy.

[0176] Comparative Example 3

[0177] The difference from Example 1 is that (a) melting and casting: melting was carried out in a vacuum electromagnetic induction melting furnace, and the target copper alloy composition shown in Table 1 was prepared by mass percentage, wherein Ti was added in the form of Cu-20Ti master alloy, P in the form of Cu-14P master alloy, La in the form of Cu-10La master alloy, Y in the form of Cu-10Y master alloy, B in the form of Cu-4B master alloy, and Cu in the form of cathode copper. After complete melting, the holding temperature was 1300°C. The entire melt was thoroughly stirred during the melting process, and the entire melting time was 60 minutes. During the process, the melt is first heated at a low power of 30KW for 10 minutes, then the power is increased to 50KW for 15 minutes, then the power is adjusted to 70KW to heat the melt to 1250℃, then the power is reduced to 50KW to allow the temperature to rise slowly to 1300℃, the melt is stirred with a high-power electromagnetic stirrer for 90 seconds, the power is reduced to 0, heating is stopped, the contactor is disconnected, and the temperature drops to 1150℃. The contactor is then closed by pressing and holding, the power is adjusted to 50KW, and the temperature is heated to 1300℃. This is one cycle. Then the melt is stirred with a high-power electromagnetic stirrer and the previous operation is repeated twice. The melt is then cast into an ingot at a temperature of 1200℃.

[0178] (b) Heat treatment, hot rolling and online solution treatment: The ingot is placed in a walking beam furnace for heat treatment at 820°C for 4 hours. Then the ingot is sent to a hot rolling mill at 820°C with a hot rolling deformation of 83%. The final rolling temperature is controlled at 750°C. The hot-rolled plate is then water-cooled online.

[0179] (c) Milling: Mill the surface of the solution-treated alloy obtained in step (b) to remove the oxide scale generated on the surface. Mill 0.3 mm off the top and bottom surfaces respectively.

[0180] (d) First cold rolling: The plate after milling in step (c) is subjected to a first cold rolling with a rolling deformation of 75%.

[0181] (e) Solution treatment: The cold-rolled sheet obtained in step (d) is subjected to solution treatment at a temperature of 880°C and a holding time of 5 min, and then water-cooled.

[0182] (f) Milling: Mill the surface of the water-cooled plate in step (e) to remove the oxide scale generated on the surface. Mill 0.2 mm off the top and bottom surfaces respectively.

[0183] (g) Second cold rolling and first aging treatment: The plate after milling in step (f) is subjected to a second cold rolling with a rolling deformation of 50%; the plate after the second cold rolling is subjected to a first aging treatment with an aging temperature of 450°C and an aging time of 2 hours, and then air cooling.

[0184] (h) Third cold rolling and second aging treatment: The plate after air cooling in step (g) is subjected to a third cold rolling with a rolling deformation of 50%; the plate after the third cold rolling is subjected to a second aging treatment with an aging temperature of 375℃ and an aging time of 4h, and then air cooling is performed to obtain a copper alloy.

[0185] Test method:

[0186] Tensile strength: The room temperature tensile test was conducted in accordance with GB / T 228.1-2021 Metallic materials, tensile testing - Part 1: Room temperature test method, on an electronic universal mechanical performance testing machine, using a standard dumbbell-shaped specimen for tensile testing;

[0187] Elastic modulus: The elastic modulus of copper-titanium alloy was measured using the dynamic resonance method. The test was conducted according to GB / T22315-2008 "Metallic Materials - Test Method for Elastic Modulus and Poisson's Ratio".

[0188] Vickers hardness: The Vickers hardness test is conducted according to the test method specified in the national standard GB / T 4340.1-2009 Metallic materials Vickers hardness test - Part 1: Test method;

[0189] Conductivity: The conductivity of the alloy was tested according to the method specified in the national standard GB / T 32791-2016 "Eddy Current Test Method for Conductivity of Copper and Copper Alloys".

[0190] The copper alloys prepared in the examples and comparative examples were tested for tensile strength, elastic modulus, Vickers hardness and electrical conductivity. The test results are shown in Table 1.

[0191] Table 1

[0192]

[0193] Table 2

[0194]

[0195] As shown in Table 2, the material in Comparative Example 1 contains only copper and titanium, with an excessively high Ti content. This results in a copper alloy with high strength and hardness, but low electrical conductivity and poor overall performance. In Comparative Example 2, Fe is added to the copper alloy, and the Fe content is high. Fe combines with Ti atoms to form coarse second-phase particles, reducing the solid solution limit of Ti atoms. This leads to a decrease in the content of the β′-Cu4Ti phase formed in the later stages of aging, reducing the strengthening effect. Furthermore, the presence of the large second phase worsens the alloy's bending workability, and the material's electrical conductivity is also poor. In Comparative Example 3, P is added to the copper alloy, and the P content is high. Excess P forms intermetallic compounds such as Cu3P. These compounds are typically very hard and brittle, distributed in a network or lamellar pattern at grain boundaries, negatively impacting the alloy's processing performance. The alloy's strength and electrical conductivity are also significantly reduced.

[0196] Figure 1 This is a metallographic diagram of the copper alloy in Example 4 of this application. Figure 2 This is a metallographic diagram of the copper alloy in Example 8 of this application. Figure 3The image shows the metallographic structure of the copper alloy in Comparative Example 1 of this application. Comparing the three images, it can be seen that: the material in Comparative Example 1 contains only copper and titanium, resulting in a slightly larger grain size in the alloy. Cellular reactions occur at the grain boundaries, generating discontinuous precipitates that grow into the grains, gradually forming needle-like structures. Blocky precipitates can also be observed within the grains. In contrast, Example 4, with the addition of appropriate amounts of Fe, La, Y, and B elements, results in a finer grain size in the alloy. While obvious deformation bands and blocky precipitates still exist within the grains, no obvious discontinuous precipitates were found. This indicates that the addition of Fe, La, Y, and B elements effectively refines the grain structure of the copper alloy and effectively suppresses the precipitation of discontinuous precipitates. The addition of Fe, La, Y, and B elements increases the number density of dislocation bands and deformation bands after cold rolling, resulting in superior mechanical properties. Furthermore, while the introduction of Fe, La, Y, and B elements increases the variety of elements dissolved in the matrix, the Fe2Ti phase formed by Fe and Ti also helps to purify the matrix to some extent. Therefore, although the alloy's conductivity decreases slightly, it remains at a good level. Regarding the elastic modulus, the addition of Fe causes the lattice of the copper-based alloy solid solution to shrink, increasing the elastic modulus. Fe and Ti form high-modulus precipitates (such as the Fe2Ti phase) and reduce the number of dissolved Ti atoms, thus increasing the alloy's elastic modulus. In Example 8, appropriate amounts of P, La, Y, and B elements were added. The TiP phase formed after adding phosphorus altered the original precipitation sequence and acted as a core for heterogeneous nucleation, promoting more uniform titanium precipitation. This not only optimized the internal structure of the alloy but also further improved its overall performance. Overall, Example 8 achieves solid solution strengthening and precipitation strengthening through the combined action of TiP precipitates and dissolved titanium. Although dissolved titanium and phosphorus atoms have some influence on conductivity, phosphorus is oriented to form TiP nano-precipitates, while the residual titanium matrix remains dissolved, thus synergistically optimizing the strength-conductivity balance. Regarding the elastic modulus, phosphorus (P) is added, as it has a very strong affinity for titanium (Ti) and preferentially forms stable TiP intermetallic compounds. TiP is a very hard, brittle ceramic phase with a high elastic modulus, much higher than that of the copper matrix and precipitates such as Cu4Ti, thus increasing the alloy's elastic modulus. Furthermore, adding an appropriate amount of P can reduce the oxygen content inside the melt, reducing internal defects in the alloy and thereby improving the alloy's elastic modulus to some extent.

[0197] As can be seen from the above description, the embodiments of the present invention achieve the following technical effects:

[0198] In the copper alloy of this application, the presence of titanium results in a copper alloy microstructure primarily composed of a face-centered cubic Cu-based solid solution. This phase is highly stable at room temperature, exhibiting good plasticity and electrical conductivity. It can generate a β′-Cu4Ti phase with a high Young's modulus, which helps improve the strength, hardness, elastic modulus, and electrical conductivity of the copper alloy. However, excessive titanium content is detrimental to improving the alloy's electrical conductivity, while insufficient titanium content is detrimental to improving its strength. The presence of Fe helps refine the grain structure of the copper alloy, and Fe and Ti can form Fe- and Ti-rich precipitates that occupy nucleation sites of discontinuous precipitates, inhibiting their precipitation and thus improving the alloy's strength and resistance to stress relaxation. Although the presence of Fe significantly affects the electrical conductivity of the copper alloy, the formation of a large number of Fe-rich particles also consumes Ti in the matrix, thereby minimizing the impact of Fe on the alloy's conductivity. Fe, as an element with a high density parameter, can cause lattice shrinkage in copper-based alloy solid solutions, thereby increasing the elastic modulus of the solid solution. Fe can couple with Ti to form high-modulus precipitates (such as Fe2Ti phase) and reduce the number of dissolved Ti atoms, which helps improve the strength and elastic modulus of the alloy. The presence of phosphorus (P) not only refines the grains but also induces the Zener pinning effect at grain boundaries, thereby increasing the alloy strength. In addition, P forms the TiP phase with dissolved Ti atoms in the matrix, which not only plays a precipitation strengthening role but also purifies the matrix, reduces lattice distortion, and reduces electron scattering, thus improving the conductivity of copper alloys. Furthermore, the presence of phosphorus helps improve the tensile / compressive stiffness of copper alloys. In addition, the presence of P can reduce the oxygen content inside the melt and reduce internal defects in the alloy, thereby improving the elastic modulus to some extent. Excessive P not only affects the strength of copper alloys but also generates large and numerous P-rich phases, which adversely affects the conductivity and elongation of the alloy. The presence of titanium (Y) helps refine the grain size and enhance the interfacial bonding between titanium and copper. Stronger interfacial bonding helps disperse stress concentration points, reduces the likelihood of crack propagation, improves the overall mechanical properties of the copper alloy, and promotes a denser atomic arrangement, further enhancing the material's strength and toughness. The presence of titanium (La) helps improve the electrical conductivity of the copper alloy. La enhances electron delocalization through its 4f electron orbitals, forming a low-resistivity interface with titanium (Ti), increasing the probability of electron tunneling and ultimately improving conductivity. The presence of boron (B) not only refines the alloy grain size but also inhibits the formation and growth of discontinuous precipitates, thereby increasing the alloy's hardness and tensile strength. Furthermore, B segregation at grain boundaries helps improve the elongation at break of the copper alloy. B atoms are smaller than the matrix copper (Cu), and their presence helps promote lattice contraction, thus increasing the alloy's elastic modulus. Controlling the content of each element in the copper alloy within the above-mentioned ranges helps enhance the synergistic effects between the elements, thereby improving the tensile strength, hardness, elastic modulus, and electrical conductivity of the copper alloy.

[0199] The above are merely embodiments of the present invention and are not intended to limit the invention. Those skilled in the art will recognize that the present invention can have various modifications and variations. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A copper alloy, characterized in that, The copper alloy comprises the following elements by weight percentage: The content of Ti is 2.70~4.20%, the content of Y is 0.010~0.030%, the content of La is 0.010~0.030%, the content of B is 0.010~0.020%, the total content of unavoidable impurities is ≤0.01%, and the balance is Cu and M; wherein, the M element is Fe or P, when the M element is Fe, the Fe element content is 0.28~0.45%; when the M element is P, the P element content is 0.05~0.15%; the tensile strength of the copper alloy is 1000~1200MPa, the electrical conductivity of the copper alloy is 15~19%IACS, and the elastic modulus of the copper alloy is 130.8~140GPa.

2. The copper alloy according to claim 1, characterized in that, The M element is Fe. The copper alloy comprises the following elements by mass percentage: Ti content of 3.10~3.60%, Fe content of 0.28~0.35%, Y content of 0.010~0.020%, La content of 0.010~0.020%, B content of 0.010~0.015%, unavoidable impurities ≤0.01%, and the balance being Cu. Alternatively, the M element may be the P element, and the copper alloy may comprise the following elements by mass percentage: the Ti element content is 3.10~3.60%, the P element content is 0.05~0.10%, the Y element content is 0.020~0.030%, the La element content is 0.020~0.030%, the B element content is 0.010~0.015%, the total unavoidable impurity content is ≤0.01%, and the balance is the Cu element.

3. The copper alloy according to claim 1, characterized in that, The mass ratio of Ti to Fe is (3.3~3.5):(0.28~0.35); or the mass ratio of Ti to P is (3.25~3.45):(0.05~0.10).

4. The copper alloy according to any one of claims 1 to 3, characterized in that, The Vickers hardness of the copper alloy is 330~370HV.

5. A method for preparing a copper alloy according to any one of claims 1 to 4, characterized in that, The preparation method includes: The copper alloy raw materials are sequentially subjected to melting, casting, heat treatment, hot rolling, online solution treatment, first cold rolling, solution treatment, second cold rolling, first aging treatment, third cold rolling and second aging treatment according to the proportions to obtain the copper alloy.

6. The method for preparing the copper alloy according to claim 5, characterized in that, The heat treatment temperature is 750~850℃; and / or, the heat treatment holding time is 2~8h; and / or, the hot rolling start temperature is 740~850℃, and the material temperature at the end of the hot rolling is 700~800℃; and / or, the total rolling ratio of the hot rolling is 78~86%.

7. The method for preparing the copper alloy according to claim 5, characterized in that, The deformation amount of the first cold rolling is 70~80%; and / or, the temperature of the solution treatment is 850~950℃; and / or, the holding time of the solution treatment is 1~10min.

8. The method for preparing the copper alloy according to any one of claims 5 to 7, characterized in that, The deformation amount of the second cold rolling is 45~60%; and / or, the temperature of the first aging treatment is 375~475℃; and / or, the holding time of the first aging treatment is 1~8h.

9. The method for preparing the copper alloy according to any one of claims 5 to 7, characterized in that, The deformation amount of the third cold rolling is 45~60%; and / or, the temperature of the second aging treatment is 350~475℃; and / or, the holding time of the second aging treatment is 1~8h; And / or, the melting is carried out in a vacuum electromagnetic induction melting furnace, the melting temperature is 1150~1300℃, the melting time is 40~70min, and the melting power is 30~70kW; and / or, the temperature of the melt during casting is 1200~1250℃.

10. A flexible electronic component, characterized in that, The flexible electronic component contains a copper alloy as described in any one of claims 1 to 4.

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