Test board anti-reverse insertion structure for radio frequency chip and radio frequency chip testing device

Abstract

The application discloses a test board anti-reverse insertion structure for a radio frequency chip and a radio frequency chip testing device, and relates to the technical field of chip testing. The test board anti-reverse insertion structure for the radio frequency chip comprises a test board and a base panel arranged below the test board, further comprises an anti-reverse insertion structure, a clamping limiting device and a debris removal device, the clamping limiting device is used for clamping and limiting the anti-reverse insertion structure when the anti-reverse insertion structure moves downwards and simultaneously driving the debris removal device to operate, and the clamping limiting device removes debris from the insertion position of the anti-reverse insertion structure. The application can avoid the misinsertion or reverse insertion of the test board, prolong the service life of the positioning pin and the sleeve block, and only needs to replace the worn positioning pin or sleeve block to restore the accuracy after the wear of the positioning pin and the sleeve block, thereby reducing the test cost and equipment maintenance cost, facilitating the replacement operation of the test board, improving the test efficiency in the manufacturing process of the electric vehicle, and ensuring the clean and stable test environment.

Description

Technical Field

[0001] This invention relates to the field of chip testing technology, specifically to a test board anti-reverse insertion structure for radio frequency (RF) chips and an RF chip testing device. Background Technology

[0002] Radio frequency (RF) chips are widely used in electric vehicles, mainly because they serve as the core of wireless communication. By integrating functional modules such as RF front-end and baseband processing, they provide vehicles with key capabilities such as vehicle-to-everything (V2X) communication, satellite positioning, and sensor data fusion, supporting the intelligent, connected, and safe development of electric vehicles. They have become a core component of electric vehicles.

[0003] In the production of electric vehicles, the radio frequency (RF) chips installed inside them need to be tested to ensure the stability and safety of the vehicle's operation. The RF chip test board, as a key carrier in the chip testing process, directly determines the accuracy and reliability of the test results through its installation accuracy and stability, making it a core component of the RF chip testing system. Currently, RF chip test boards are installed and positioned using anti-reverse insertion structures to prevent incorrect or reverse insertion, thus avoiding equipment damage or test failure due to misoperation.

[0004] In the prior art, Chinese Patent No. CN219320349U discloses a reverse insertion prevention structure for a test board for radio frequency chips, including a chip clamping device. One end of the chip clamping device is fixedly connected to a clamp, and the end of the clamp away from the chip clamping device is fixedly connected to a first chip connector and a second chip connector that are spaced apart. The end of the first chip connector away from the clamp is electrically connected to a first test board, and the end of the second chip connector away from the clamp is electrically connected to a second test board. The first test board and the second test board are respectively provided with a first interface and a second interface.

[0005] In the aforementioned prior art, under frequent insertion and removal conditions, the metal locating pins and locating grooves on the metal base in the anti-reverse insertion structure are prone to wear due to dry friction. During insertion and removal, the two components easily scrape against each other, generating metal debris. If the fit between the two components is unreasonable (e.g., too tight), it will further cause squeezing friction, leading to plastic deformation of the metal surface. After long-term use, the misalignment friction caused by the decrease in positioning accuracy will also cause the metal surface layer to peel off, generating metal debris of different particle sizes. In addition, when the test board comes into contact with surrounding metal components (such as RF connector terminals, guide blocks, and metal fasteners on the board) during insertion, removal, or vibration, the generated metal debris will also enter the joint between the locating pins and locating grooves during the operation. These metal shavings exacerbate the mechanical wear of the locating pins and locating slots, causing the gap between them to gradually increase, significantly reducing the positioning accuracy of the test board. This necessitates the replacement of the locating pins and locating slots after a period of use. Since the locating pins are fixed to the test board and the locating slots are located on the base, the test board and base must be replaced simultaneously during replacement. This not only increases the testing costs of automobile manufacturing but also raises the maintenance costs of the manufacturing equipment.

[0006] Therefore, how to reduce testing and equipment maintenance costs in the electric vehicle manufacturing process while preventing reverse insertion is an urgent problem to be solved. Summary of the Invention

[0007] To address the shortcomings of the prior art, this invention provides a reverse insertion prevention structure for a test board used for radio frequency (RF) chips and an RF chip testing device.

[0008] To achieve the above objectives, this invention provides a reverse insertion prevention structure for a test board of an RF chip, including a test board and a base panel disposed below it, as well as a reverse insertion prevention structure, a locking and limiting device, and a debris removal device. The locking and limiting device is used to lock and limit the reverse insertion prevention structure when it moves downward, and simultaneously drives the debris removal device to operate and remove debris from the insertion position of the reverse insertion prevention structure. The reverse insertion prevention structure includes a guide block, which is mounted on the base panel to guide the test board to prevent reverse insertion; it also includes a connecting post, a positioning pin, and a sleeve block. The connecting post is movably locked onto the test board, the positioning pin is detachably threaded to the connecting post, and movably inserted into the sleeve block to control the reverse insertion of the test board. The device provides rigid anti-reverse insertion protection. The locking and limiting device includes a rotating sleeve, a telescopic rod, and locking components. The rotating sleeve is rotatably mounted on the outside of the upper part of the telescopic rod and is inserted into it. Two sets of locking components are arranged side-by-side and symmetrically. The telescopic rod rotates the rotating sleeve, driving the two sets of locking components to lock and limit the positioning pin. The locking and limiting device also includes an unlocking structure located in the connecting column, used to horizontally push the locking components locked onto the positioning pin and release the limit. When the telescopic rod retracts, it pressurizes and blows air into the debris removal device to remove debris from the sleeve block. When the telescopic rod retracts and extends, it draws air into the debris removal device to remove debris from the sleeve block.

[0009] Furthermore, two test plates are arranged side by side with a gap between them, and both test plates are located above the base panel; two guide blocks are arranged in a staggered manner, one guide block is engaged with one end of one test plate, and the other guide block is engaged with the other end of another test plate, and each of the two test plates is provided with a guide groove; both the guide block and the guide groove are arc-shaped.

[0010] Furthermore, the connecting post includes a top block, a limiting block, and a connecting part. Two limiting blocks are arranged side by side with a gap between them, and each is fixed to the outer edge of the bottom of the top block and inserted into the test plate. The connecting part is fixed to the middle part of the bottom of the top block, and its outer surface is provided with external threads, penetrating through the test plate. The positioning pin includes a connecting pad, a pin body, and a protrusion. The pin body is fixed to the middle part of the bottom of the connecting pad, and the protrusion is fixed to the outer wall of the pin body. The connecting pad and the pin body are sleeved to the outside of the connecting part, and the pin body is threadedly connected to the connecting part. The upper part of the sleeve block is hexagonal and is located between the base panel and the test plate, and is snapped into the connecting pad. The sleeve block has a positioning groove adapted to the positioning pin, and the lower part of the sleeve block is threadedly connected to the base panel. The connecting pad is located between the test plate and the base panel, and its bottom has a hexagonal groove adapted to the top of the sleeve block.

[0011] Furthermore, the unlocking structure includes a plug rod, an elastic element, and a crossbar. The lower end of the plug rod is inserted into the top block and the connecting part, and is threadedly connected to the top block and the connecting part. Two elastic elements are arranged side by side and symmetrically. The lower end of the plug rod is located between the two elastic elements. The crossbar is located in the connecting part and passes through the two elastic elements. The plug rod includes a rotating rod and a pressing block fixed at its lower end. The pressing block is in the shape of an inverted trapezoidal frustum. The elastic element includes a push block and a connecting spring. The side of the push block near the pressing block is provided with an inclined surface that matches its inclination angle. The connecting spring is fixed between the outer side of the lower part of the push block and the inner wall of the connecting part, and is sleeved on the outside of the crossbar.

[0012] Furthermore, the telescopic rod includes a movable rod, a lever, an air cylinder, and a lifting spring. The lower end of the movable rod extends into the air cylinder, and the upper end of the movable rod is located below the sleeve block. The lever is fixed on the outer wall of the upper part of the movable rod and connected to the rotating sleeve. The lifting spring is located on the lower part of the movable rod and outside the air cylinder.

[0013] Furthermore, the rotating sleeve includes a sleeve post, a disc, and a sliding groove. The disc is fixed to the upper end of the sleeve post and is fitted onto the outside of the telescopic rod. The sleeve post is rotatably connected to a bracket. The sliding groove is opened on the sleeve post and connected to the lever. The sliding groove is in the shape of a quarter spiral. Two slots are symmetrically opened on the outer circumference of the disc, and protrusions are fixed in the slots.

[0014] Furthermore, the snap-fit ​​component includes a snap-fit ​​plate, a fixing rod, a second connecting spring, and a mounting box. The mounting box is fixed to the bottom of the base panel. The snap-fit ​​plate is movably disposed in the mounting box, with one end extending to the outside of the mounting box and movably inserted into the positioning pin. The second connecting spring is fixed between the other end of the snap-fit ​​plate and the inner wall of the mounting box. The fixing rod is fixed to the bottom of the snap-fit ​​plate and passes through the bottom of the mounting box. After the rotating sleeve rotates 90 degrees from its initial position, it snaps into the slot and engages with the protrusion. The fixing rod has a groove that matches the protrusion.

[0015] Furthermore, the debris removal device includes a filter box, an air supply pipe, and a debris removal pipe. One end of the air supply pipe is connected to an air cylinder, and the other end is connected to the debris removal pipe. The debris removal pipe is annular and has air inlets along its circumference. The debris removal pipe is located at the bottom of the base panel and below the sleeve block. The filter box is installed on the air supply pipe to filter the metal debris entering the air supply pipe when the metal debris is sucked up by negative pressure.

[0016] An RF chip testing apparatus includes a base body located at the bottom of a base panel, and further includes a heat dissipation device, a fixture device, connectors, a processing device, and a mixed digital-analog tester. The heat dissipation device is located on the base body and is used to dissipate heat from the structures above and below the base panel. The fixture device is located above two test boards, and two connectors are arranged side by side and respectively mounted on the corresponding test boards. The fixture device is mounted on the two connectors. The processing device and the mixed digital-analog tester are both located outside the base body. The processing device is electrically connected to the two test boards, and the fixture device, the mixed digital-analog tester, and the processing device are electrically connected in sequence.

[0017] Furthermore, the heat dissipation device includes a blower heat dissipation component, a heat dissipation mesh, and a wind-cooling device. The blower heat dissipation component is installed on one side of the base body and extends into its interior to deliver cool air into the base body. The heat dissipation mesh is located on the lower side of the other side of the base body. The wind-cooling device is located outside the base body and is connected to the blower heat dissipation component.

[0018] The present invention has the following beneficial effects:

[0019] (1) The anti-reverse insertion structure of the test board for radio frequency chips is used in conjunction with the positioning pin, the debris removal device and the telescopic rod. When the test board drives the positioning pin to press down for installation, the telescopic rod contracts to generate pressurized airflow to blow air into the positioning groove to remove debris. When the test board is disassembled and lifted, the telescopic rod resets to generate negative pressure suction, which sucks in the residual metal debris and filters it through the filter box. This effectively avoids the insertion wear caused by metal debris and other particles, thereby reducing the increase in contact resistance or radio frequency signal attenuation caused by insertion wear, extending the service life of the positioning pin and the sleeve, and reducing the testing cost and equipment maintenance cost in the electric vehicle manufacturing process.

[0020] (2) The anti-reverse insertion structure of the test board for radio frequency chips forms an irreversible anti-misfit installation barrier by using the primary guidance and anti-misfit of the guide block and guide groove, combined with the secondary rigid anti-reverse insertion of the protrusion on the positioning pin and the positioning groove on the sleeve block. This prevents the test board from being mistakenly inserted or inserted in reverse. The positioning pin and the sleeve block adopt a detachable threaded connection. When the key positioning components are worn due to long-term use, it is not necessary to replace the entire test board or base. Only the worn positioning pin or sleeve block needs to be replaced to restore accuracy, which reduces the testing cost and equipment maintenance cost.

[0021] (3) The anti-reverse insertion structure of the test board for radio frequency chips is achieved by pressing down the positioning pin through the test board. Under the drive of the telescopic rod, the rotating sleeve rotates, thereby automatically pushing the snap-fit ​​into the positioning pin to achieve a firm mechanical lock. This ensures that the test board will not shift during subsequent vibration or testing, and the connection is reliable. When disassembling, the snap-fit ​​can be pushed out through the internal elastic element by simply rotating the insertion rod, which easily releases the lock and makes the test board replacement operation simple and fast, thus improving the testing efficiency in the electric vehicle manufacturing process.

[0022] (4) The RF chip testing device integrates the anti-reverse insertion structure, heat dissipation device, fixture device, connector, processing device and digital-analog hybrid tester to build a stable and reliable testing environment. The heat dissipation device can not only dissipate the heat that penetrates into the base panel during operation, avoiding the RF link impedance shift and temporary performance degradation of the chip caused by the heat of the test board, fixture device and the RF chip under test, but also remove the heat of the extended circuit inside the base body and the accumulated dust, so as to avoid the heat dissipation effect and test signal transmission affected by the heat of the link or the accumulation of dust during the test, and ensure that the test environment is clean and stable.

[0023] Of course, any product implementing this invention does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure of the present invention;

[0025] Figure 2 This is a schematic diagram of the internal structure of the base body of the present invention;

[0026] Figure 3 This is a schematic diagram of the structure of the test board and the base panel of the present invention;

[0027] Figure 4 This is a schematic diagram of the connection between the test board and the positioning pin of the present invention;

[0028] Figure 5 This is a schematic diagram of the connection structure of the connecting column, insert rod, and positioning pin of the present invention;

[0029] Figure 6 This is a schematic diagram illustrating the disconnection of the connecting column, insert rod, and positioning pin of the present invention.

[0030] Figure 7 This is a schematic diagram of the structure of the sleeve block during disassembly of the present invention;

[0031] Figure 8 This is a schematic diagram of the structure when the positioning pin and the positioning groove of the present invention are connected;

[0032] Figure 9 For the present invention Figure 8 A structural diagram from another perspective;

[0033] Figure 10 This is a schematic diagram of the internal structure of the air cylinder of the present invention;

[0034] Figure 11 This is a schematic diagram of the structure of the positioning pin and sleeve block during disassembly of the present invention;

[0035] Figure 12 For the present invention Figure 4 Schematic diagram of the structure at point A;

[0036] Figure 13 For the present invention Figure 7 Schematic diagram of the structure at point B;

[0037] Figure 14 For the present invention Figure 10 A schematic diagram of the structure at point C.

[0038] In the diagram, 1. Test plate; 2. Base panel; 3. Guide block; 4. Guide groove; 5. Connecting column; 501. Top block; 502. Limiting block; 503. Connecting part; 6. Insert rod; 601. Rotating rod; 602. Pressing block; 7. Push block; 8. Connecting spring one; 9. Crossbar; 10. Positioning pin; 1001. Connecting pad; 1002. Pin body; 1003. Protrusion; 11. Sleeve block; 12. Positioning groove; 13. Movable rod; 14. Toggle rod; 15. Rotating sleeve; 1501. Sleeve column; 1 502, Disc; 1503, Slide; 1504, Protrusion; 1505, Slot; 16, Bracket; 17, Connecting Plate; 18, Fixing Rod; 19, Connecting Spring II; 20, Mounting Box; 21, Air Cylinder; 22, Lifting Spring; 23, Filter Box; 24, Air Supply Pipe; 25, Debris Removal Pipe; 26, Base Body; 27, Air Blower Heat Dissipation Components; 28, Heat Dissipation Grid; 29, Air Cooling Device; 30, Clamping Device; 31, Connector; 32, Processing Device; 33, Digital-Analog Hybrid Testing Machine. Detailed Implementation

[0039] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0040] In the description of this invention, it should be understood that the terms "opening", "upper", "lower", "thickness", "top", "middle", "length", "inner", "around", etc., which indicate orientation or positional relationship, are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting this invention.

[0041] Please see Figures 1-14 The present invention provides a technical solution: a test board anti-reverse insertion structure for radio frequency chips, including a test board 1 and a base panel 2 disposed below it, and also including an anti-reverse insertion structure, a snap-fit ​​limiting device and a debris removal device. The snap-fit ​​limiting device is used to snap-fit ​​and limit the anti-reverse insertion structure when it moves down, and at the same time drive the debris removal device to operate to remove debris from the insertion position of the anti-reverse insertion structure.

[0042] The test plate 1 is equipped with four sets of anti-reverse insertion structures, snap-fit ​​limiting devices, and debris removal devices, each located at one of the four corners of the test plate 1. The snap-fit ​​limiting device snaps into and limits the anti-reverse insertion structure, thus limiting the installation of the test plate 1 and preventing it from shifting during subsequent testing. The debris removal device removes metal debris from the positioning groove 12, reducing wear between the positioning pin 10 and the positioning groove 12, thereby extending the service life of the positioning pin 10 and the sleeve block 11, reducing the frequency of replacement, and lowering operating costs.

[0043] The anti-reverse insertion structure includes a guide block 3, which is installed on the base panel 2 to guide the test plate 1 to prevent reverse insertion; it also includes a connecting post 5, a positioning pin 10, and a sleeve block 11. The connecting post 5 is movably locked onto the test plate 1, and the positioning pin 10 is detachably threaded to the connecting post 5 and movably plugged into the sleeve block 11 to rigidly prevent reverse insertion of the test plate 1.

[0044] Specifically, there are two test plates 1 arranged side by side with a gap between them, and both test plates 1 are located above the base panel 2; there are two guide blocks 3 arranged in a staggered manner, one guide block 3 is engaged with one end of one test plate 1, and the other guide block 3 is engaged with the other end of another test plate 1, and each of the two test plates 1 is provided with a guide groove 4; both the guide block 3 and the guide groove 4 are arc-shaped.

[0045] In this embodiment, the protrusions 1003 in the positioning pins 10 connected to the two test plates 1 face the same direction, but the guide grooves 4 on the two test plates 1 are in different positions (that is, the protrusions 1003 at the bottom of one test plate 1 face the direction of the guide groove 4 on that test plate 1, and the protrusions 1003 at the bottom of the other test plate 1 face the opposite direction of the guide groove 4 on it), and the radii of the two guide blocks 3 are different, with the radius of the guide block 3 on one side being smaller than that on the other side. Similarly, the radii of the corresponding guide grooves 4 are also different.

[0046] By setting the two guide blocks 3 with different radii and the orientation of the protrusions 1003, a foolproof effect is achieved. If the tester does not observe the size of the guide groove 4 or the orientation of the protrusions 1003 in the positioning pin 10, and attempts to insert a test plate 1 with a larger guide groove 4 into a position with a smaller guide block 3, it will be difficult to insert because the orientation of the protrusions 1003 in the bottom positioning pin 10 does not match the corresponding positioning groove 12. Similarly, if a test plate 1 with a smaller guide groove 4 is placed on the base panel 2, it will be difficult to insert directly because the guide block 3 does not match the guide groove 4.

[0047] When the tester observes the size of the guide groove 4, they only need to ensure that the guide groove 4 is aligned with the matching guide block 3. The guide block 3 then completes the insertion of the test plate 1. There is no need to flip the test plate 1 to observe the orientation of the protrusion 1003 in the positioning pin 10 at its bottom, thus shortening the time for manual judgment and improving the efficiency of installation and testing. Furthermore, the guide block 3 guides the test plate 1 downwards to prevent it from shifting, ensuring that the positioning pin 10 can be inserted into the positioning groove 12 in one go. This avoids the misalignment of the test plate 1 causing the positioning pin 10 to not be inserted into the positioning groove 12, which could give the tester the false impression that it has been inserted backwards.

[0048] Specifically, the connecting post 5 includes a top block 501, a limiting block 502, and a connecting part 503. Two limiting blocks 502 are arranged side by side and spaced apart, and each is fixed to the bottom outer edge of the top block 501 and inserted into the test plate 1. The connecting part 503 is fixed to the bottom middle part of the top block 501, and has an external thread on its outer surface and penetrates through the test plate 1.

[0049] The positioning pin 10 includes a connecting pad 1001, a pin body 1002, and a protrusion 1003. The pin body 1002 is fixed to the middle part of the bottom of the connecting pad 1001, and the protrusion 1003 is fixed to the outer wall of the pin body 1002. The connecting pad 1001 and the pin body 1002 are sleeved to the outside of the connecting part 503, and the pin body 1002 is threadedly connected to the connecting part 503.

[0050] The upper part of the sleeve 11 is hexagonal and is located between the base panel 2 and the test plate 1, and is snapped into the connecting pad 1001. The sleeve 11 has a positioning groove 12 that matches the positioning pin 10. The lower part of the sleeve 11 is threaded to the base panel 2. The connecting pad 1001 is located between the test plate 1 and the base panel 2, and has a hexagonal groove at the bottom that matches the top of the sleeve 11.

[0051] In this embodiment, the protrusion 1003 is a rectangular column, but in actual use, it can also be an arc column or a triangular column, etc. When the limiting block 502 is inserted into the test plate 1, it can limit the connection part 503. The connection part 503 is threadedly connected to the positioning pin 10, which allows the positioning pin 10 and the sleeve block 11 to be replaced when the gap between the positioning pin 10 and the positioning groove 12 becomes too large due to wear after long-term use, without having to replace the test plate 1 and the base panel 2. This is convenient to use and avoids the problem of increased testing costs in the electric vehicle manufacturing process due to replacing the test plate 1 and the base panel 2.

[0052] The connecting pad 1001 fits snugly against the test plate 1 and the base panel 2, reducing direct contact between the test plate 1 and the base panel 2, preventing wear between them, and thus reducing wear on the test plate 1 and the base panel 2. Furthermore, the connecting pad 1001 is secured to the outer upper part of the sleeve 11, preventing the protruding upper part of the sleeve 11 from affecting the test plate 1. The hexagonal design of the upper part of the sleeve 11 allows it to be unscrewed from the base panel 2 using a wrench or similar tool for easy replacement.

[0053] The locking and limiting device includes a rotating sleeve 15, a telescopic rod, and locking components. The rotating sleeve 15 is rotatably disposed on the outside of the upper part of the telescopic rod and is plugged into it. Two sets of locking components are arranged side by side and symmetrically. The telescopic rod moves the rotating sleeve 15 to rotate, thereby driving the two sets of locking components to limit and lock the positioning pin 10.

[0054] When the telescopic rod retracts, it is used to pressurize and blow air into the debris removal device to remove debris from the sleeve block 11. When the telescopic rod returns to its original position and extends, it is used to draw air into the debris removal device under negative pressure to remove debris from the sleeve block 11.

[0055] Specifically, the telescopic rod includes a movable rod 13, a lever 14, an air cylinder 21, and a lifting spring 22. The lower end of the movable rod 13 extends into the air cylinder 21, and the upper end of the movable rod 13 is located below the sleeve block 11. The lever 14 is fixed on the outer wall of the upper part of the movable rod 13 and connected to the rotating sleeve 15. The lifting spring 22 is located on the lower part of the movable rod 13 and outside the air cylinder 21.

[0056] The debris removal device includes a filter box 23, an air supply pipe 24, and a debris removal pipe 25. One end of the air supply pipe 24 is connected to the air cylinder 21, and the other end is connected to the debris removal pipe 25. The debris removal pipe 25 is annular and has an air port along its circumference. The debris removal pipe 25 is located at the bottom of the base panel 2 and below the sleeve block 11. The filter box 23 is installed on the air supply pipe 24 and is used to filter the metal debris entering the air supply pipe 24 when the metal debris is sucked up by negative pressure.

[0057] In this embodiment, the air cylinder 21 is installed in the base body 26, and the bottom of the movable rod 13 is provided with a movable plug that fits against the inner wall of the air cylinder 21 to ensure the sealing between the movable plug and the air cylinder 21. The filter box 23 is provided with a filter screen to filter the metal debris carried in the gas inhaled during the descaling process.

[0058] When the positioning pin 10 moves down, it squeezes the movable rod 13, which moves down and drives the lever 14 and the movable plug to move down. The lifting spring 22 contracts, and the movable plug squeezes the gas in the air cylinder 21 outward. The gas is transported from the air supply pipe 24 to the debris removal pipe 25 and discharged from the air port to blow air into the positioning groove 12 to remove debris. When the positioning pin 10 can no longer move down, the movable rod 13 also stops moving down, and the debris removal pipe 25 stops blowing air to remove debris.

[0059] When the unlocking structure separates the snap plate 17 from the positioning pin 10, the fixing rod 18 separates from the rotating sleeve 15, the test plate 1 is lifted and moved upward, causing the positioning pin 10 to move upward, the lifting spring 22 is stretched and reset, the movable rod 13 drives the movable plug to move upward, and the gas is sucked into the air cylinder 21 from the debris removal pipe 25 and the air supply pipe 24. At this time, the positioning groove 12 is sucked to remove debris, and the metal debris sucked into the air supply pipe 24 is filtered through the filter box 23.

[0060] By removing debris from the positioning groove 12 during the downward installation and upward disassembly of the positioning pin 10, metal debris that has fallen into the positioning groove 12 is removed. This prevents wear caused by metal debris in the positioning groove 12 during long-term insertion and removal between the positioning groove 12 and the positioning pin 10, thereby avoiding a decrease in positioning accuracy due to the presence of metal debris, extending the service life of the positioning pin 10 and the sleeve 11, reducing the number of replacements of the positioning pin 10 and the sleeve 11, and lowering replacement costs.

[0061] Specifically, the rotating sleeve 15 includes a sleeve post 1501, a disc 1502, and a sliding groove 1503. The disc 1502 is fixed to the upper end of the sleeve post 1501 and is sleeved onto the outside of the telescopic rod. The sleeve post 1501 is rotatably connected to a bracket 16. The sliding groove 1503 is opened on the sleeve post 1501 and connected to the lever 14. The sliding groove 1503 is in the shape of a quarter spiral. Two slots 1505 are symmetrically opened on the outer periphery of the disc 1502. A protrusion 1504 is fixed in the slot 1505.

[0062] In this embodiment, the slot 1505 and the protrusion 1504 are oriented perpendicular to the lever 14. When the lever 14 moves down with the moving rod 13, the sliding groove 1503 causes the sleeve 1501 to rotate, thereby driving the disc 1502 to rotate. The disc 1502 rotates 90 degrees, and the slot 1505 gradually rotates to the position of the fixing rod 18. The fixing rod 18 is inserted into the slot 1505, and its groove engages with the protrusion 1504 in the slot 1505, limiting and locking the disc 1502, thereby locking the rotating sleeve 15.

[0063] Specifically, the snap-fit ​​component includes a snap-fit ​​plate 17, a fixing rod 18, a connecting spring 19, and a mounting box 20. The mounting box 20 is fixed to the bottom of the base panel 2. The snap-fit ​​plate 17 is movably disposed in the mounting box 20, with one end extending to the outside of the mounting box 20 and movably inserted into the positioning pin 10. The connecting spring 19 is fixed between the other end of the snap-fit ​​plate 17 and the inner wall of the mounting box 20. The fixing rod 18 is fixed to the bottom of the snap-fit ​​plate 17 and passes through the bottom of the mounting box 20. After the rotating sleeve 15 rotates 90 degrees from its initial position, it is snapped into the slot 1505 and snapped with the protrusion 1504. The fixing rod 18 has a groove that matches the protrusion 1504.

[0064] In this embodiment, when the slot 1505 is rotated to the position of the fixed rod 18, the connecting spring 19 is reset and stretched, causing the snap-fit ​​plate 17 and the fixed rod 18 to move forward. The fixed rod 18 is snapped into the slot 1505, and at the same time, the snap-fit ​​plate 17 is inserted into the positioning pin 10 and extends into the connecting part 503 to limit the positioning pin 10, thereby realizing the limited installation of the test plate 1.

[0065] The locking and limiting device also includes an unlocking structure in the connecting post 5, which is used to horizontally push the locking part locked on the positioning pin 10 to release the limit.

[0066] Specifically, the unlocking structure includes a rod 6, an elastic element, and a crossbar 9. The lower end of the rod 6 is inserted into the top block 501 and the connecting part 503, and is threadedly connected to the top block 501 and the connecting part 503. Two elastic elements are arranged side by side and symmetrically. The lower end of the rod 6 is located between the two elastic elements. The crossbar 9 is located in the connecting part 503 and passes through the two elastic elements. The rod 6 includes a rotating rod 601 and a pressing block 602 fixed at its lower end. The pressing block 602 is in the shape of an inverted trapezoidal frustum.

[0067] The elastic element includes a push block 7 and a connecting spring 8. The push block 7 has an inclined surface on the side near the pressing block 602 that matches its inclination angle. The connecting spring 8 is fixed between the lower part of the push block 7 facing outward and the inner wall of the connecting part 503, and is sleeved on the outside of the crossbar 9.

[0068] In this embodiment, the trapezoidal frustum shape of the extrusion block 602 allows it to press down on the two push blocks 7 as the rotating rod 601 rotates and moves downward when the positioning pin 10 needs to be released. This compresses the first connecting spring 8, and the push blocks 7 move outward on the crossbar 9, pushing the snap-fit ​​plate 17 and compressing the second connecting spring 19 until the extrusion block 602 can no longer move downward. At this point, the snap-fit ​​plate 17 separates from the positioning pin 10, and the test plate 1 can be lifted upward for disassembly, facilitating the installation and removal of the test plate 1.

[0069] RF chip testing equipment, see [link / reference] Figures 1-2 The system includes a base body 26 located at the bottom of the base panel 2, and also includes a heat dissipation device, a clamping device 30, a connector 31, a processing device 32, and a digital-analog hybrid tester 33. The heat dissipation device is located on the base body 26 and is used to blow air to dissipate heat from the structure above and below the base panel 2. The clamping device 30 is located above the two test plates 1. There are two connectors 31 arranged side by side and respectively set on the corresponding test plates 1. The clamping device 30 is set on the two connectors 31. The processing device 32 and the digital-analog hybrid tester 33 are both located outside the base body 26. The processing device 32 is electrically connected to the two test plates 1. The clamping device 30, the digital-analog hybrid tester 33, and the processing device 32 are electrically connected in sequence.

[0070] Specifically, the heat dissipation device includes a blower heat dissipation component 27, a heat dissipation mesh 28, and an air cooling device 29. The blower heat dissipation component 27 is installed on one side of the base body 26 and extends into its interior to deliver cool air into the base body 26. The heat dissipation mesh 28 is located on the other side of the base body 26 at a lower position. The air cooling device 29 is located outside the base body 26 and is connected to the blower heat dissipation component 27.

[0071] In this embodiment, the heat dissipation mesh 28 is located on the lower side of the base body 26, so that when the air-blowing heat dissipation component 27 blows air into the base body 26, it can dissipate the heat that has penetrated into the base panel 2 during operation, preventing the test board 1, the fixture device 30 and the RF chip under test from experiencing RF link impedance shift and temporary degradation of chip performance due to heat generation. It can also remove the heat and accumulated dust from the extended circuits inside the base body 26, preventing the heat dissipation effect and test signal transmission from being affected by link heating or dust accumulation during the test, and ensuring a clean and stable test environment.

[0072] Furthermore, the dust in the base body 26 is blown towards the heat dissipation mesh 28 and out of the heat dissipation mesh 28, so as to avoid the dust accumulating in the base body 26 and affecting the heat dissipation effect of the test board 1, thereby affecting the test effect of the RF chip.

[0073] The clamping device 30, as the core component that directly contacts the chip, is used to achieve mechanical positioning of the chip, and at the same time, it completes the signal transfer between the chip and the external link with the help of internal conductive probes or radio frequency transmission lines.

[0074] Connector 31 solves the interface matching problem between different fixture devices 30 and fixed test board 1 through a standardized interface, while ensuring signal transmission without attenuation between fixture device 30 and test board 1 with a low-loss structure.

[0075] The processing device 32 serves as the central hub of the testing system. On the one hand, it coordinates the testing process and sends control commands to the test board 1 and the digital-analog hybrid tester 33 to trigger test actions. On the other hand, it collects and processes the raw data returned by the test board 1 (such as filtering, noise reduction, and index conversion), compares it with the pass / fail standards to determine whether the chip is qualified, and feeds back the results.

[0076] The digital-analog hybrid tester 33 is used to provide core conditions for testing, generating RF excitation signals, DC power supply signals and digital control signals, simulating the actual working environment of the chip, and measuring the chip's output RF parameters (such as frequency accuracy and harmonic distortion), analog parameters and digital functions to ensure the comprehensiveness of the test and the reliability of the data.

[0077] During use, observe the size of the guide groove 4 on the test plate 1 with connector 31 installed, and insert it into the corresponding guide block 3 on the base panel 2, so that the positioning pin 10 is inserted into the corresponding positioning groove 12. After insertion, press down on the four corners of the test plate 1, causing the positioning pin 10 to move down in the positioning groove 12, squeezing the movable rod 13. The movable rod 13 moves down, driving the lever 14 and the movable plug to move down, the lifting spring 22 contracts, and the movable plug squeezes the gas in the air cylinder 21 outward. The air is supplied from the air supply pipe 24 to the debris removal pipe 25 and discharged from the air outlet. The air is blown into the positioning groove 12 to remove debris. During this process, the lever 14 moves the rotating sleeve 15 to rotate 90 degrees, so that the slot 1505 rotates to the position of the fixed rod 18. The connecting spring 19 is reset and stretched, so that the fixed rod 18 is inserted into the slot 1505. At the same time, the snap plate 17 is inserted into the positioning pin 10 and extends into the connecting part 503 to limit the positioning pin 10, thereby realizing the limited installation of the test plate 1.

[0078] After the test board 1 is installed, the control fixture device 30 is connected to the two connectors 31. Once connected, the test can be performed. During the test, the air cooling device 29 operates, delivering cold air to the base body 26 through the blower heat sink 27. This not only dissipates the heat that permeates onto the base panel 2 during operation, but also removes the heat from the extended circuits inside the base body 26 and the accumulated dust. This prevents the heat dissipation effect and test signal transmission from being affected by link heating or dust accumulation during the test, ensuring a clean and stable test environment.

[0079] When it is necessary to disassemble the test plate 1, the rotating rod 601 drives the pressing block 602 to move down and rotate to press the two push blocks 7. The connecting spring 1 8 is compressed, and the push block 7 moves outward on the crossbar 9, pushing the snap plate 17. The connecting spring 2 19 is compressed until the pressing block 602 can no longer move down. At this time, the snap plate 17 separates from the positioning pin 10, and the test plate 1 can be lifted up and disassembled.

[0080] During this process, the positioning pin 10 moves upward, the lifting spring 22 stretches and resets, the movable rod 13 drives the movable plug to move upward, the lever 14 moves the rotating sleeve 15 to reset and rotate, and the movable rod 13 draws gas from the debris removal pipe 25 and the gas delivery pipe 24 into the air cylinder 21. At this time, air is drawn into the positioning groove 12 to remove debris, and the metal debris drawn into the gas delivery pipe 24 is filtered through the filter box 23. When the positioning pin 10 needs to be replaced, it can be unscrewed from the connecting column 5.

[0081] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0082] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A reverse insertion prevention structure for a test board used for radio frequency chips, comprising a test board (1) and a base panel (2) disposed below it, characterized in that, It also includes an anti-reverse insertion structure, a snap-fit ​​limiting device, and a debris removal device. The snap-fit ​​limiting device is used to snap-fit ​​and limit the anti-reverse insertion structure when it moves down, and at the same time drives the debris removal device to operate and remove debris from the insertion position of the anti-reverse insertion structure. The anti-reverse insertion structure includes a guide block (3), which is installed on the base panel (2) to guide the test plate (1) to prevent reverse insertion; it also includes a connecting column (5), a positioning pin (10) and a sleeve block (11). The connecting column (5) is movably locked on the test plate (1), the positioning pin (10) is detachably threaded to the connecting column (5) and movably plugged into the sleeve block (11) to rigidly prevent reverse insertion of the test plate (1); The locking and limiting device includes a rotating sleeve (15), a telescopic rod and a locking member. The rotating sleeve (15) is rotatably disposed on the outside of the upper part of the telescopic rod and is plugged into it. Two sets of locking members are arranged side by side and symmetrically. The telescopic rod pushes the rotating sleeve (15) to rotate, thereby driving the two sets of locking members to limit and lock the positioning pin (10). The locking and limiting device also includes an unlocking structure provided in the connecting post (5) for horizontally pushing the locking part locked on the positioning pin (10) to release the limit; When the telescopic rod retracts, it is used to pressurize and blow air into the debris removal device to remove debris from the sleeve block (11). When the telescopic rod retracts and stretches, it is used to draw air into the debris removal device to remove debris from the sleeve block (11).

2. The reverse insertion prevention structure for a test board for an RF chip according to claim 1, characterized in that: The test plates (1) are arranged side by side with a gap between them, and both test plates (1) are located above the base panel (2); The guide block (3) is provided in two offset positions. One guide block (3) is connected to one end of a test plate (1), and the other guide block (3) is connected to the other end of another test plate (1). Guide grooves (4) are provided on both test plates (1). Both the guide block (3) and the guide groove (4) are arc-shaped.

3. The reverse insertion prevention structure for a test board for an RF chip according to claim 1, characterized in that: The connecting post (5) includes a top block (501), a limiting block (502), and a connecting part (503). Two limiting blocks (502) are arranged side by side and spaced apart, and each is fixed to the outer edge of the bottom of the top block (501) and inserted into the test plate (1). The connecting part (503) is fixed to the middle part of the bottom of the top block (501), and its outer surface is provided with external threads and penetrates through the test plate (1). The positioning pin (10) includes a connecting pad (1001), a pin body (1002), and a protrusion (1003). The pin body (1002) is fixed to the middle part of the bottom of the connecting pad (1001), and the protrusion (1003) is fixed to the outer wall of the pin body (1002). The connecting pad (1001) and the pin body (1002) are sleeved to the outside of the connecting part (503), and the pin body (1002) is threadedly connected to the connecting part (503). The upper part of the sleeve (11) is hexagonal and is located between the base panel (2) and the test plate (1), and is snapped into the connecting pad (1001). The sleeve (11) has a positioning groove (12) that is compatible with the positioning pin (10). The lower part of the sleeve (11) is threadedly connected to the base panel (2). The connecting pad (1001) is located between the test plate (1) and the base panel (2), and has a hexagonal groove at the bottom that matches the top of the sleeve block (11).

4. The reverse insertion prevention structure for a test board for an RF chip according to claim 3, characterized in that: The unlocking structure includes a plug (6), an elastic element, and a crossbar (9). The lower end of the plug (6) is inserted into the top block (501) and the connecting part (503) and is threadedly connected to the top block (501) and the connecting part (503). There are two elastic elements arranged side by side and symmetrically. The lower end of the plug (6) is located between the two elastic elements. The crossbar (9) is located in the connecting part (503) and passes through the two elastic elements. The insertion rod (6) includes a rotating rod (601) and a pressing block (602) fixed at its lower end. The pressing block (602) is in the shape of an inverted trapezoidal frustum. The elastic element includes a push block (7) and a connecting spring (8). The push block (7) has an inclined surface that matches the inclination angle of the pressing block (602). The connecting spring (8) is fixed between the lower part of the push block (7) facing outward and the inner wall of the connecting part (503), and is sleeved on the outside of the crossbar (9).

5. The reverse insertion prevention structure for a test board for an RF chip according to claim 1, characterized in that: The telescopic rod includes a movable rod (13), a lever (14), an air cylinder (21), and a lifting spring (22). The lower end of the movable rod (13) extends into the air cylinder (21), and the upper end of the movable rod (13) is located below the sleeve block (11). The lever (14) is fixed on the outer wall of the upper part of the movable rod (13) and connected to the rotating sleeve (15). The lifting spring (22) is located on the lower part of the movable rod (13) and outside the air cylinder (21).

6. The reverse insertion prevention structure for a test board for an RF chip according to claim 5, characterized in that: The rotating sleeve (15) includes a sleeve post (1501), a disc (1502) and a sliding groove (1503). The disc (1502) is fixed on the upper end of the sleeve post (1501) and is sleeved to the outside of the telescopic rod. The sleeve post (1501) is rotatably connected to a bracket (16). The sliding groove (1503) is opened on the sleeve post (1501) and connected to the lever (14). The sliding groove (1503) is in the shape of a quarter spiral. The disk (1502) has two symmetrical slots (1505) on its outer periphery, and a protrusion (1504) is fixed in the slot (1505).

7. The reverse insertion prevention structure for a test board for an RF chip according to claim 6, characterized in that: The snap-fit ​​component includes a snap-fit ​​plate (17), a fixing rod (18), a connecting spring (19), and a mounting box (20). The mounting box (20) is fixed to the bottom of the base panel (2). The snap-fit ​​plate (17) is movably disposed in the mounting box (20), and one end extends to the outside of the mounting box (20) and can be movably inserted into the positioning pin (10). The connecting spring (19) is fixed between the other end of the snap-fit ​​plate (17) and the inner wall of the mounting box (20). The fixing rod (18) is fixed to the bottom of the snap-fit ​​plate (17) and passes through the bottom of the mounting box (20). After the rotating sleeve (15) rotates 90 degrees from its initial position, it is snapped into the slot (1505) and snapped with the protrusion (1504). The fixing rod (18) has a groove that matches the protrusion (1504).

8. The reverse insertion prevention structure for a test board for an RF chip according to claim 1, characterized in that: The debris removal device includes a filter box (23), an air supply pipe (24), and a debris removal pipe (25). One end of the air supply pipe (24) is connected to the air cylinder (21), and the other end is connected to the debris removal pipe (25). The debris removal pipe (25) is annular and has an air inlet along its circumference. The debris removal pipe (25) is located at the bottom of the base panel (2) and below the sleeve block (11). The filter box (23) is installed on the air supply pipe (24) to filter the metal debris entering the air supply pipe (24) when the metal debris is sucked up by negative pressure.

9. A radio frequency chip testing device, characterized in that, The anti-reverse insertion structure for the test board of the radio frequency chip applied in any one of claims 1-8 includes a base body (26) disposed at the bottom of the base panel (2), and also includes a heat dissipation device, a clamping device (30), a connector (31), a processing device (32) and a digital-analog hybrid tester (33). The heat dissipation device is located on the base body (26) and is used to blow air to dissipate heat from the structure above and below the base panel (2); The clamping device (30) is located above the two test plates (1), and there are two connectors (31) arranged side by side and respectively set on the corresponding test plates (1). The clamping device (30) is set on the two connectors (31). The processing device (32) and the digital-analog hybrid tester (33) are respectively located outside the base body (26). The processing device (32) is electrically connected to the two test boards (1). The fixture device (30), the digital-analog hybrid tester (33) and the processing device (32) are electrically connected in sequence.

10. The radio frequency chip testing apparatus according to claim 9, characterized in that: The heat dissipation device includes a blower heat dissipation component (27), a heat dissipation mesh (28), and a wind-cooling device (29). The blower heat dissipation component (27) is installed on one side of the base body (26) and extends into its interior to deliver cold air into the base body (26). The heat dissipation mesh (28) is located on the other side of the base body (26) at a lower position. The wind-cooling device (29) is located outside the base body (26) and is connected to the blower heat dissipation component (27).

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