Quartz crystal resonator wafer arranging and cleaning device

Abstract

The invention relates to the field of resonator production equipment, in particular to a quartz crystal resonator wafer arranging and cleaning device. The technical problems that in an existing wafer ultrasonic cleaning technology, cleaning liquid and impurities are difficult to effectively separate, secondary pollution is likely to be caused, cleaning process linkage is not smooth, cross contamination of liquid between grooves is caused, the cleaning efficiency is low, thorough dead-corner-free cleaning cannot be conducted on a wafer and a bearing appliance at the same time, and additional cleaning procedures need to be added are solved. According to the technical scheme, the quartz crystal resonator wafer arranging and cleaning device comprises a damping seat, a mobile control unit and the like; a moving control unit is connected to the damping seat; a plurality of first partition plates are arranged on the right portion of the multi-stage cleaning tank to form a plurality of cleaning liquid tanks, the cleaning baskets enter the cleaning liquid tanks in sequence, synchronous cleaning of the two sides of the wafer is achieved in cooperation with ultrasonic waves, the wafer cleaning efficiency and the cleaning effect are improved, and the cleaning work of residual impurities in the cleaning baskets is reduced.

Description

Technical Field

[0001] This invention relates to the field of resonator manufacturing equipment, and more particularly to a quartz crystal resonator wafer arrangement and cleaning device. Background Technology

[0002] A quartz crystal resonator is an electronic device that achieves stable frequency output based on piezoelectric characteristics. It typically consists of a quartz chip, a support base, a sealed shell, and conductive adhesive. It plays a role in frequency control and selection in various oscillation and filtering circuits and is widely used in communication devices, audio-visual products, timing instruments, information terminals, and everyday electronic products.

[0003] The core of a quartz crystal resonator is the quartz crystal wafer. Its production process mainly involves cutting the quartz into appropriate sizes and then plating silver onto both sides of the crystal as electrodes. The uniformity of the plating directly affects the resonator's performance. Therefore, before plating the quartz crystal wafer, it is necessary to thoroughly clean it to remove impurities such as grease and particles from its surface. An existing patent (CN210586174U) describes a resonator wafer cleaning device that mentions achieving thorough cleaning of the quartz crystal wafer through a multi-stage cleaning method. However, it does not consider the limitations of ultrasonic cleaning in handling adhering substances on the quartz crystal wafer. Furthermore, in existing ultrasonic cleaning technology, the cleaning fluid and impurities are difficult to separate effectively, easily causing secondary contamination. The cleaning process is not smoothly connected, leading to cross-contamination between tanks, low cleaning efficiency, and the inability to simultaneously perform thorough, dead-angle-free cleaning of both the wafer and the supporting device, requiring additional cleaning steps. Summary of the Invention

[0004] To overcome the shortcomings of existing ultrasonic cleaning technologies for wafers, such as difficulty in effectively separating cleaning fluid from impurities, easy secondary pollution, poor connection of cleaning process, cross-contamination of liquid between tanks, low cleaning efficiency, inability to thoroughly clean wafers and carriers simultaneously without dead angles, and the need to add additional cleaning steps, this invention provides a quartz crystal resonator wafer arrangement and cleaning device.

[0005] The technical solution is as follows: A quartz crystal resonator wafer cleaning device includes a shock-absorbing base and a moving control unit; the moving control unit is connected to the shock-absorbing base; it also includes cleaning baskets, a multi-stage cleaning tank, first partitions, and pumps; the moving control unit is detachably connected to several cleaning baskets; the multi-stage cleaning tank is fixedly connected to the shock-absorbing base; the moving control unit is used to drive all the cleaning baskets to move within the multi-stage cleaning tank; several first partitions are provided within the multi-stage cleaning tank; each first partition is equipped with an ultrasonic transducer; the height of each first partition is less than the depth of the multi-stage cleaning tank; the first partitions divide the right side of the multi-stage cleaning tank into several cleaning liquid tanks; the first partitions divide the left side of the multi-stage cleaning tank into several clean water tanks; the first partitions separate the rear part of the multi-stage cleaning tank into an interval slot; the first partitions separate the front part of the multi-stage cleaning tank into a drying tank, a material platform, and a dust removal tank; two pumps are installed within the multi-stage cleaning tank; the two pumps are respectively connected to the cleaning liquid tank and the clean water tank.

[0006] Preferably, the mobile control unit includes an electric push rod, a ring-shaped electric guide rail, an electric slider, and an electric clamp; two electric push rods are installed on the left and right sides of the shock absorber; all the telescopic parts of the electric push rods are fixedly connected to the ring-shaped electric guide rail; several electric sliders are slidably connected on the ring-shaped electric guide rail; each electric slider is fixedly connected to an electric clamp; each electric clamp corresponds to a cleaning basket.

[0007] Preferably, the system also includes sliders, limiting ropes, springs, and magnetic plates; the cleaning basket has several limiting grooves; four sliders are slidably connected to the cleaning basket; several limiting ropes connect each slider to non-adjacent sliders; all the limiting ropes form a grid, with each intersection of the grid corresponding to a limiting groove; a silicone anti-slip pad is provided on the side of the cleaning basket away from the limiting ropes; each slider is fixedly connected to a spring; all springs are fixedly connected to the cleaning basket; a magnetic plate is fixedly connected to the side of each slider away from the spring; several iron plates are provided on the cleaning basket; each iron plate corresponds to a magnetic plate.

[0008] Preferably, a safety net is installed on the side of each limiting groove away from the limiting rope.

[0009] Preferably, the height of the first partition on the right side gradually increases from front to back.

[0010] Preferably, the height of the first partition on the left gradually decreases from front to back.

[0011] Preferably, the system also includes a second partition, an air pump, a first conduit, and a second conduit; the second partition is fixedly connected to the front of the multi-stage cleaning tank; the second partition divides the space formed by the front of the multi-stage cleaning tank and the shock absorber into two sealed air chambers; an air pump is installed in the right air chamber; the air pump exhaust port is connected to the left air chamber; the air pump intake port is connected to the right air chamber; two sets of first conduits are installed in the dust removal tank, each set containing several first conduits; the right air chamber is connected to all the first conduits; two sets of second conduits are installed in the drying tank, each set containing several second conduits; the left air chamber is connected to all the second conduits; each first and second conduit has several air holes, each air hole has a filter screen, and each air hole corresponds to a limiting groove; each second conduit has an internal heater.

[0012] Preferably, the system also includes transfer boxes, filter baskets, and filter plates; two transfer boxes are fixedly connected to the left and right sides of the inner side of the multi-stage cleaning tank; the front and rear of the cleaning liquid tank are each connected to a transfer box; the front and rear of the clear water tank are each connected to a transfer box; the inlet and outlet of each pump are each connected to a transfer box on the same side; the position where the outlet of each pump is connected to the transfer box is higher than the position where the inlet of the pump is connected to another transfer box; each transfer box connected to the outlet of each pump has a filter basket detachably connected to it; and each filter basket contains a filter plate.

[0013] Preferably, the filter plate is inclined inside the filter basket, with the side away from the pump being lower than the side near the pump.

[0014] Preferably, the system also includes a first replenishing pipe and a second replenishing pipe; the first replenishing pipe is connected to the rear of the shock absorber; a transfer box connected to the rear of the cleaning fluid tank is connected to the first replenishing pipe; the second replenishing pipe is connected to the front of the shock absorber; and a transfer box connected to the front of the clean water tank is connected to the second replenishing pipe.

[0015] The beneficial effects of this invention are as follows: 1. This invention forms several cleaning liquid tanks by setting several first partitions on the right side of the multi-stage cleaning tank. The cleaning basket enters each cleaning liquid tank in sequence, and ultrasonic waves are used to achieve simultaneous cleaning of the wafer on both sides. By setting the first partitions at different heights, the impurities washed down are intercepted without affecting the circulation of the cleaning liquid. The cleaning basket only limits the wafer, and the flowing cleaning liquid fully separates the wafer from the impurities. This achieves all-round cleaning of the wafer and the cleaning basket without dead angles, improves the wafer cleaning efficiency and cleaning effect, and reduces the cleaning work of cleaning the impurities remaining in the cleaning basket.

[0016] 2. By setting up a partition tank, most of the residual cleaning solution on the cleaning basket and wafer is drained. A clean water tank is set up so that after the cleaning solution on the wafer is cleaned, it is directly rinsed with clean water to further remove residual impurities and cleaning solution on the wafer, ensuring the cleaning effect of the wafer.

[0017] 3. By setting up an air pump, the air in the dust removal tank is extracted and then sprayed into the drying tank. This not only allows for pre-extraction and dust removal of the wafers, reducing the amount of dust and impurities entering the cleaning solution and lowering the frequency of cleaning solution replacement, but also allows the extracted air to be filtered, heated, and then used to dry the cleaned wafers. This achieves integrated cleaning and drying operations, effectively avoiding the need to transfer the wafers to the drying equipment for further drying after drying, which can easily lead to wafer contamination during the transfer process and affect the wafer processing effect and efficiency. Attached Figure Description

[0018] Figure 1 This is a first-view three-dimensional structural schematic diagram of the quartz crystal resonator wafer arrangement and cleaning device of the present invention; Figure 2 This is a second perspective three-dimensional structural schematic diagram of the quartz crystal resonator wafer arrangement and cleaning device of the present invention; Figure 3 This is a schematic diagram showing the installation position of the cleaning basket according to the present invention; Figure 4 This is a first-view perspective three-dimensional structural diagram of the cleaning basket of the present invention; Figure 5 This is a schematic diagram of the magnetic sheet mounting position according to the present invention; Figure 6 This is a two-dimensional structural diagram of the cleaning basket of the present invention from a second perspective. Figure 7 This is a schematic diagram of the three-dimensional structure of the multi-stage cleaning tank of the present invention; Figure 8 This is a top view of the multi-stage cleaning tank of the present invention; Figure 9 This is a schematic diagram of the internal structure of the transfer box of the present invention.

[0019] Explanation of reference numerals in the attached drawings: 1-Shock damper, 2-Electric push rod, 3-Annular electric guide rail, 4-Electric slider, 5-Electric clamp, 6-Cleaning basket, 7-Slide bar, 8-Limiting rope, 9-Spring, 10-Magnetic sheet, 11-Multi-stage cleaning tank, 12-First partition, 13-Transfer box, 14-Pump, 15-First replenishment pipe, 16-Second replenishment pipe, 17-Second partition, 18-Air pump, 19-First conduit, 20-Second conduit, 21-Filter basket, 22-Filter plate, 601-Limiting groove, 1101-Cleaning liquid tank, 1102-Interval groove, 1103-Clean water tank, 1104-Drying tank, 1105-Material platform, 1106-Dust removal tank, 1107-Air chamber. Detailed Implementation

[0020] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. Example

[0021] A quartz crystal resonator wafer arrangement and cleaning device, according to Figures 1-8 As shown, it includes a shock absorber base 1 and a movement control unit; the movement control unit is connected to the shock absorber base 1. It also includes a cleaning basket 6, a multi-stage cleaning tank 11, a first partition 12, and a pump 14; a mobile control unit is detachably connected to several cleaning baskets 6; a multi-stage cleaning tank 11 is fixedly mounted on a shock-absorbing base 1; several first partitions 12 are arranged inside the multi-stage cleaning tank 11; each first partition 12 is equipped with an ultrasonic transducer; the height of each first partition 12 is less than the depth of the multi-stage cleaning tank 11; the first partition 12 divides the right side of the multi-stage cleaning tank 11 into several cleaning liquid tanks. 1101; The first partition 12 divides the left part of the multi-stage cleaning tank 11 into several clean water tanks 1103; The first partition 12 divides the rear part of the multi-stage cleaning tank 11 into an inter-slot 1102; The first partition 12 divides the front part of the multi-stage cleaning tank 11 into a drying tank 1104, a material platform 1105, and a dust removal tank 1106; Two pumps 14 are installed in the multi-stage cleaning tank 11, distributed on the left and right; The two pumps 14 are respectively connected to the cleaning liquid tank 1101 and the clean water tank 1103.

[0022] The mobile control unit includes an electric push rod 2, an annular electric guide rail 3, an electric slider 4, and an electric clamp 5; two electric push rods 2 are installed on the left and right sides of the shock absorber 1, distributed front and back; the telescopic parts of all the electric push rods 2 are fixedly connected to the annular electric guide rail 3; several electric sliders 4 are slidably connected on the annular electric guide rail 3; each electric slider 4 is fixedly connected to an electric clamp 5; each electric clamp 5 corresponds to a cleaning basket 6.

[0023] It also includes a slider 7, a limiting rope 8, a spring 9, and a magnetic piece 10; the cleaning basket 6 has several limiting grooves 601; four rectangular sliders 7 are slidably connected to the cleaning basket 6; several limiting ropes 8 are connected between each slider 7 and non-adjacent sliders 7; all the limiting ropes 8 form a grid, and each intersection of the grid corresponds to a limiting groove 601; a silicone anti-slip pad is provided on the side of the cleaning basket 6 away from the limiting ropes 8; a spring 9 is fixedly connected to each slider 7; all springs 9 are fixedly connected to the cleaning basket 6; a magnetic piece 10 is fixedly connected to the side of each slider 7 away from the spring 9; several iron pieces are provided on the cleaning basket 6; each iron piece corresponds to a magnetic piece 10.

[0024] Each limiting groove 601 has a barrier net on the side away from the limiting rope 8, which is used to limit the wafer and facilitate the cleaning of the wafer.

[0025] The height of the first partition 12 on the right side gradually increases from front to back.

[0026] The height of the first partition 12 on the left gradually decreases from front to back.

[0027] It also includes a second partition 17, an air pump 18, a first conduit 19, and a second conduit 20; the multi-stage cleaning tank 11 is fixedly connected to the front of the second partition 17; the second partition 17 divides the space formed by the front of the multi-stage cleaning tank 11 and the shock absorber 1 into two sealed air chambers 1107; the right air chamber 1107 is equipped with an air pump 18; the exhaust port of the air pump 18 is connected to the left air chamber 1107; the suction port of the air pump 18 is connected to the right air chamber 1107; two sets of first conduits 19 are installed in the dust removal tank 1106, each set containing There are several vertically distributed first conduits 19; the right air chamber 1107 is connected to all the first conduits 19; the drying tank 1104 is equipped with two sets of second conduits 20, each set containing several vertically distributed second conduits 20; the left air chamber 1107 is connected to all the second conduits 20; each first conduit 19 and each second conduit 20 is provided with several air holes, each air hole is provided with a filter screen, and each air hole corresponds to a limiting groove 601; each second conduit 20 is provided with a heater.

[0028] First, the cleaning basket 6 is placed horizontally, with its silicone anti-slip pad in contact with the workbench surface to ensure stability. Then, the operator moves each slider 7, causing the magnetic piece 10 on the slider 7 to adhere to the iron plate of the cleaning basket 6. The spring 9 is stretched and deformed, causing the intersection of the limiting ropes 8 to move away from the position of the limiting groove 601. At this time, the external robotic arm can place the wafers into the limiting grooves 601 one by one. The wafers are placed on the net of the limiting grooves 601. Then, the operator moves each slider 7, causing the magnetic piece 10 to separate from the iron plate. The spring 9 returns to its original position, simultaneously driving the slider 7 to reset, so that the intersection of the limiting ropes 8 is back in the position of the limiting grooves 601. At this time, the wafers are located between the grid formed by the limiting ropes 8 and the net. When it is necessary to remove the wafers later, simply control the movement of the slider 7 to remove the limiting of the wafers. Combined with the automated loading and unloading of the production line, this achieves rapid loading and unloading of wafers, effectively improving the efficiency of wafer cleaning.

[0029] Then, the cleaning basket 6 is erected and moved to the position of the material table 1105. The cleaning basket 6 is clamped and fixed by the electric clamp 5. The electric slider 4 drives the electric clamp 5 and the cleaning basket 6 on it to move on the annular electric guide rail 3. When the cleaning basket 6 reaches the position of the side baffle of the bottom material table 1105, all the electric push rods 2 are controlled to extend, so that the cleaning basket 6 moves upward. After the cleaning basket 6 is higher than the multi-stage cleaning tank 11, the electric slider 4 continues to move, so that the cleaning basket 6 reaches the top of the dust removal tank 1106. Then, all the electric push rods 2 are controlled to retract, so that the cleaning basket 6 enters the dust removal tank 1106. The air pump 18 is started. The air pump 18 draws air from the dust removal tank 1106 through the first conduit 19 to pre-treat the wafers in the cleaning basket 6, reduce the amount of dust and impurities brought into the cleaning liquid tank 1101, and increase the frequency of subsequent cleaning of the cleaning liquid tank 1101.

[0030] Next, the electric push rod 2 is extended again, causing the cleaning basket 6 to move above the first cleaning fluid tank 1101. The cleaning basket 6 is then lowered into the cleaning fluid tank 1101, and the ultrasonic transducer on the first partition 12 is activated to perform ultrasonic cleaning on the wafers in the cleaning basket 6 in conjunction with the cleaning fluid. Since the cleaning basket 6 is placed vertically, the wafers are also in a vertical position. The mesh and the cross-shaped limiting ropes 8 on the cleaning basket 6 can limit the wafers, and the large gaps in the mesh and the cross-shaped limiting ropes 8 allow the cleaning fluid to pass through. Entering the limiting groove 601, the cleaning fluid fully contacts the wafer, thereby achieving simultaneous cleaning of the wafer on both sides. Compared with the existing technology of clamping and fixing the wafer for cleaning, this effectively reduces cleaning dead zones. Moreover, compared with the existing technology of scattering a large number of wafers in the cleaning carrier for simultaneous cleaning, it effectively avoids the problem of wafers scratching each other, resulting in wafer scratches and a high defect rate. Several first partitions 12 are set on the right side of the multi-stage cleaning tank 11, dividing the right side of the multi-stage cleaning tank 11 into multiple... The cleaning basket 6 is then removed from the front cleaning fluid tank 1101 and moved backwards. A pump 14 is installed next to the cleaning fluid tank 1101. The inlet of the pump 14 is connected to the front of the cleaning fluid tank 1101, and the outlet of the pump 14 is connected to the rear of the cleaning fluid tank 1101. This allows the cleaning fluid to circulate within the cleaning fluid tank 1101. Viewed from above, the cleaning fluid flows clockwise. The height of the first partition 12 gradually increases from front to back. Therefore, when cleaning the basket... During the cleaning of the wafers in cleaning basket 6, if the dust and impurities washed off from the wafers in cleaning basket 6 are intercepted in the cleaning liquid tank 1101 during the flow process, the cleaning liquid can pass over the first partition 12 and continue to flow forward. Since cleaning basket 6 moves counterclockwise, the cleaning liquid tank 1101 at the front has the most impurities washed off, and the impurities in the cleaning liquid decrease as it moves further back. As cleaning basket 6 moves, the wafers in cleaning basket 6 can be ultrasonically cleaned step by step, gradually improving the cleanliness of the wafers and effectively improving the quality of wafer cleaning.

[0031] Considering that cleaning solution residue remains on the wafer or cleaning basket 6 after wafer cleaning, subsequent rinsing with clean water is necessary. Therefore, several clean water tanks 1103 are set on the left side of the multi-stage cleaning tank 11 to clean the residual cleaning solution on the wafer and cleaning basket 6. The cleaning basket 6 is then moved further and transferred to the partition tank 1102. After the cleaning basket 6 enters the partition tank 1102, it moves within the partition tank 1102, during which most of the cleaning solution is drained. Then, the cleaning basket 6 is transferred to the last clean water tank 1103. At this point, the ultrasonic transducer on the first partition 12 is activated again, and the cleaning basket 6 and wafer are ultrasonically cleaned again, achieving further cleaning of the cleaning basket 6 and wafer, further reducing impurities and cleaning solution residue on the cleaning basket 6 and wafer. Then, the cleaning basket 6 is controlled to continue moving forward, so that the cleaning basket 6 enters each clean water tank 1103 in sequence. In actual use, the number of first partitions 12 can be adjusted according to the viscosity of the cleaning solution and the specifications of the wafers to achieve optimal cleaning efficiency. A pump 14 is also installed next to the clean water tank 1103. The inlet of the pump 14 is connected to the rear of the clean water tank 1103, and the outlet of the pump 14 is connected to the front of the clean water tank 1103, thus realizing the circulation of clean water. Looking from top to bottom, the clean water flows clockwise, while the height of the first partitions 12 gradually decreases from front to back, allowing the clean water to pass over the first partitions 12 and continue to flow backward. Since the cleaning basket 6 moves counterclockwise, the clean water tank 1103 at the back has the most impurities washed off, and the clean water has fewer impurities as it moves forward. As the cleaning basket 6 moves, the wafers in the cleaning basket 6 can be ultrasonically cleaned step by step, gradually reducing the impurities and cleaning solution residue on the wafers and the cleaning basket 6, effectively further improving the quality of wafer cleaning.Finally, the washing basket 6 is transferred to the drying tank 1104. When the air pump 18 is working, the air chamber 1107 on the right is under negative pressure. Therefore, the air chamber 1107 on the right draws in air from the dust removal tank 1106 through the first conduit 19. After the air is filtered, the air pump 18 extracts the gas. The air pump 18 is a rotary vane pump. The rotor rotates eccentrically in the pump chamber, forming a periodically changing volume space. When the vanes rotate continuously in the pump chamber, they draw in gas. The gas moves towards the exhaust port in the pump chamber, and the volume on the exhaust port side gradually decreases, compressing the gas that has been drawn in. The gas can be compressed in the air pump 18, thus pumping the extracted gas into the air chamber 1107 on the left. Then, the heater in the second conduit 20 is activated, and the pressurized air in the air chamber 1107 on the left is pumped in. When the air is sprayed through the second conduit 20, it is heated before being sprayed out from the air holes on the second conduit 20. This allows for hot air drying of the cleaning basket 6 and the wafers in the drying tank 1104, effectively removing moisture from the cleaning basket 6 and the wafers. Then, the cleaning basket 6 is transferred to the material table 1105, where an external robotic arm can remove the cleaned cleaning basket 6 and the wafers inside. The cleaning basket 6 is then re-fixed onto the corresponding electric clamp 5. This achieves integrated operation of dust removal cleaning liquid cleaning and clean water cleaning and drying, facilitating coordination with the production line and enabling efficient and orderly wafer cleaning. It eliminates the need to remove the wafers and send them into the drying equipment for drying, effectively reducing processing steps and minimizing wafer contamination during transfer.

[0032] Example 2: Based on Example 1, according to Figure 1 , Figure 2 and Figures 7-9 As shown, it also includes a transfer box 13, a filter basket 21, and a filter plate 22; two transfer boxes 13 are fixedly connected to the left and right sides of the inner side of the multi-stage cleaning tank 11; the front and rear of the cleaning liquid tank 1101 are each connected to a transfer box 13; the front and rear of the clear water tank 1103 are each connected to a transfer box 13; the inlet and outlet of each pump 14 are each connected to a transfer box 13 on the same side; the position where the outlet of each pump 14 is connected to the transfer box 13 is higher than the position where the inlet of the pump 14 is connected to another transfer box 13; a filter basket 21 is detachably connected to each transfer box 13 connected to the outlet of each pump 14; a filter plate 22 is provided in each filter basket 21.

[0033] The filter plate 22 is inclined inside the filter basket 21, and the side away from the pump 14 is lower than the side close to the pump 14.

[0034] It also includes a first replenishing pipe 15 and a second replenishing pipe 16; the rear of the shock absorber 1 is connected to the first replenishing pipe 15; the transfer box 13 connected to the rear of the cleaning fluid tank 1101 is connected to the first replenishing pipe 15; the front of the shock absorber 1 is connected to the second replenishing pipe 16; the transfer box 13 connected to the front of the clean water tank 1103 is connected to the second replenishing pipe 16.

[0035] Based on the above embodiments, considering the need to circulate the cleaning solution and water, so that impurities on the wafer and cleaning basket 6 can be more easily removed from the wafer and cleaning basket 6 under ultrasonic cleaning combined with the assistance of flowing cleaning solution and water, but impurities are also prone to circulate along with the cleaning solution and water during circulation, a transfer box 13 is set up. When the pump 14 is started, the cleaning solution in the foremost cleaning solution tank 1101 enters the corresponding transfer box 13. The pump 14 then extracts the cleaning solution from the transfer box 13 and pumps it to the rear transfer box 13. The cleaning solution is filtered. In basket 21, impurities in the cleaning solution are intercepted on filter plate 22, thus preventing impurities from re-entering the cleaning solution tank 1101 during the cleaning solution circulation process and contaminating the wafers and cleaning basket 6. Furthermore, setting filter plate 22 in an inclined shape not only increases the filtration area but also effectively prevents impurities from clogging the mesh on filter plate 22 during circulation, thus avoiding obstruction of the circulation process. This would reduce the liquid level of the cleaning solution in the multi-stage cleaning tank 11, ultimately leading to insufficient contact between the wafers and the cleaning solution at the top of the cleaning basket 6, affecting the cleaning efficiency and quality of the wafers.

[0036] The same principle applies to the clear water tank 1103, which purifies the clear water and ensures the clean water cleaning process is circulated. During the circulation of the cleaning solution, some cleaning solution is carried into the interval tank 1102, resulting in the loss of cleaning solution. Therefore, the first replenishment pipe 15 can be set to replenish the cleaning solution to the multi-stage cleaning tank 11 in real time. The first replenishment pipe 15 is set at the transfer box 13. The cleaning solution can also impact the impurities on the filter plate 22, causing the impurities to accumulate at the bottom of the inclined filter plate 22, further preventing the filter plate 22 from being blocked by impurities and affecting the stable operation of the circulation process. Similarly, the second replenishment pipe 16 is set to replenish the clear water. Since the cleaning solution needs to be rinsed again with clear water after cleaning the wafer, the cleaning solution impurities in the clear water will accumulate during the circulation process. The clear water needs to be replaced regularly to completely remove impurities and cleaning solution from the wafer and the cleaning basket 6, ensuring the cleaning effect of the wafer.

[0037] The technical principles of the embodiments of the present invention have been described above with reference to specific examples. These descriptions are merely for explaining the principles of the embodiments of the present invention and should not be construed as limiting the scope of protection of the embodiments of the present invention in any way. Based on the explanation herein, those skilled in the art can conceive of other specific embodiments of the present invention without creative effort, and these embodiments will all fall within the scope of protection of the embodiments of the present invention.

Claims

1. A quartz crystal resonator wafer arrangement and cleaning device, comprising a shock-absorbing base (1) and a movement control unit; the movement control unit is connected to the shock-absorbing base (1); characterized in that, It also includes cleaning baskets (6), multi-stage cleaning tanks (11), first partitions (12), and pumps (14); a mobile control unit is detachably connected to several cleaning baskets (6); a multi-stage cleaning tank (11) is fixedly attached to a shock-absorbing base (1); the mobile control unit is used to move all the cleaning baskets (6) within the multi-stage cleaning tank (11); several first partitions (12) are provided within the multi-stage cleaning tank (11); each first partition (12) is equipped with an ultrasonic transducer; the height of each first partition (12) is less than the depth of the multi-stage cleaning tank (11); the first partitions (12) separate the multi-stage cleaning... The right part of the tank (11) is divided into several cleaning liquid tanks (1101); the first partition (12) divides the left part of the multi-stage cleaning tank (11) into several clean water tanks (1103); the first partition (12) divides the rear part of the multi-stage cleaning tank (11) into an inter-slot (1102); the first partition (12) divides the front part of the multi-stage cleaning tank (11) into a drying tank (1104), a material platform (1105) and a dust removal tank (1106); two pumps (14) are installed in the multi-stage cleaning tank (11); the two pumps (14) are connected to the cleaning liquid tank (1101) and the clean water tank (1103) respectively.

2. The quartz crystal resonator wafer arrangement and cleaning device according to claim 1, characterized in that, The mobile control unit includes an electric push rod (2), an annular electric guide rail (3), an electric slider (4), and an electric clamp (5); two electric push rods (2) are installed on the left and right sides of the shock absorber (1); the telescopic parts of all the electric push rods (2) are fixedly connected to the annular electric guide rail (3); several electric sliders (4) are slidably connected on the annular electric guide rail (3); each electric slider (4) is fixedly connected to an electric clamp (5); each electric clamp (5) corresponds to a cleaning basket (6).

3. The quartz crystal resonator wafer arrangement and cleaning device according to claim 2, characterized in that, It also includes a slider (7), a limiting rope (8), a spring (9), and a magnetic piece (10); the cleaning basket (6) has several limiting grooves (601); four sliders (7) are slidably connected to the cleaning basket (6); several limiting ropes (8) are connected between each slider (7) and a non-adjacent slider (7); all the limiting ropes (8) form a grid, and each intersection of the grid corresponds to a limiting groove (601); a silicone anti-slip pad is provided on the side of the cleaning basket (6) away from the limiting ropes (8); a spring (9) is fixedly connected to each slider (7); all the springs (9) are fixedly connected to the cleaning basket (6); a magnetic piece (10) is fixedly connected to the side of each slider (7) away from the spring (9); several iron pieces are provided on the cleaning basket (6); each iron piece corresponds to a magnetic piece (10).

4. The quartz crystal resonator wafer arrangement and cleaning device according to claim 3, characterized in that, Each limiting groove (601) has a barrier net installed on the side away from the limiting rope (8).

5. The quartz crystal resonator wafer cleaning device according to claim 1, characterized in that, The height of the first partition (12) on the right side gradually increases from front to back.

6. The quartz crystal resonator wafer arrangement and cleaning device according to claim 5, characterized in that, The height of the first partition (12) on the left gradually decreases from front to back.

7. The quartz crystal resonator wafer arrangement and cleaning device according to claim 1, characterized in that, It also includes a second partition (17), an air pump (18), a first conduit (19), and a second conduit (20); the front of the multi-stage cleaning tank (11) is fixedly connected to the second partition (17); the second partition (17) divides the space formed by the front of the multi-stage cleaning tank (11) and the shock absorber (1) into two sealed air chambers (1107); an air pump (18) is installed in the right air chamber (1107); the exhaust port of the air pump (18) is connected to the left air chamber (1107); the air intake port of the air pump (18) is connected to the right air chamber (1107); two sets of first-stage cleaning tanks (1106) are installed in the dust removal tank (1106). A conduit (19) is provided, and each group contains several first conduits (19); the air chamber (1107) on the right is connected to all the first conduits (19); the drying tank (1104) is equipped with two groups of second conduits (20), each group containing several second conduits (20); the air chamber (1107) on the left is connected to all the second conduits (20); each first conduit (19) and second conduit (20) is provided with several air holes, each air hole is provided with a filter screen, and each air hole corresponds to a limiting groove (601); each second conduit (20) is provided with a heater.

8. A quartz crystal resonator wafer arrangement and cleaning device according to claim 7, characterized in that, It also includes a transfer box (13), a filter basket (21) and a filter plate (22); two transfer boxes (13) are fixedly connected to the left and right sides of the inner side of the multi-stage cleaning tank (11); the front and rear of the cleaning liquid tank (1101) are connected to one transfer box (13); the front and rear of the clear water tank (1103) are connected to one transfer box (13); the inlet and outlet of each pump (14) are connected to a transfer box (13) on the same side; the position where the outlet of each pump (14) is connected to the transfer box (13) is higher than the position where the inlet of the pump (14) is connected to another transfer box (13); a filter basket (21) is detachably connected to each transfer box (13) connected to the outlet of each pump (14); a filter plate (22) is provided in each filter basket (21).

9. A quartz crystal resonator wafer arrangement and cleaning device according to claim 8, characterized in that, The filter plate (22) is inclined inside the filter basket (21), and the side away from the pump (14) is lower than the side close to the pump (14).

10. A quartz crystal resonator wafer arrangement and cleaning device according to claim 9, characterized in that, It also includes a first replenishing pipe (15) and a second replenishing pipe (16); the rear of the shock absorber (1) is connected to the first replenishing pipe (15); the transfer box (13) connected to the rear of the cleaning fluid tank (1101) is connected to the first replenishing pipe (15); the front of the shock absorber (1) is connected to the second replenishing pipe (16); the transfer box (13) connected to the front of the clean water tank (1103) is connected to the second replenishing pipe (16).

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