Copper-aluminum composite board and forging process of copper-aluminum composite board

Abstract

The invention discloses a copper-aluminum composite board and a forging process of the copper-aluminum composite board, and relates to the technical field of composite material forging, the copper-aluminum composite board comprises an aluminum board and a copper board, the aluminum board is provided with an opening matched with the outline of the copper board, the copper board is arranged in the opening of the aluminum board through hot forging, and the peripheral surface of the copper board is metallurgically bonded with the inner wall of the opening through hot forging; the aluminum plate and the copper plate form a metallurgical bonding interface through hot forging and pressing, seamless attachment is achieved, the characteristic of high shear strength is achieved between the aluminum plate and the copper plate, the thermal resistance of the contact interface of the aluminum plate and the copper plate is low, and the heat conduction efficiency between the copper plate and the aluminum plate is high. The aluminum plate serves as a main body to cover the low-heating area, and the supporting and basic heat dissipation requirements are met by means of the characteristics of being light, low in cost and good in heat dissipation effect. The copper plate accurately corresponds to the chip of the optical module, and a directional heat dissipation channel is formed by virtue of a high heat conductivity coefficient, so that differentiated adaptation of strong heat dissipation of a high heating area and light weight and low cost of a low heating area is realized.

Description

Technical Field

[0001] This invention relates to the field of copper and aluminum forging technology, and in particular to a copper-aluminum composite plate and a forging process for the copper-aluminum composite plate. Background Technology

[0002] An optical module is an active optoelectronic device that performs optical-to-electrical and electro-optical conversions, and is an important functional module of optical communication equipment. With the continuous improvement of technical specifications such as bandwidth and transmission distance in optical communication equipment, the requirements for the performance and integration of optical modules are becoming increasingly stringent, and the power consumption of optical modules is also increasing. Research has revealed that the core chip inside the optical module is the main power-generating component, and it releases a large amount of heat during operation. This makes the heat flux density of the chip area much higher than that of other passive structural areas inside the optical module, resulting in significant differences in heat dissipation requirements between the two.

[0003] However, most optical module cover plates on the market currently adopt a uniform heat dissipation structure design, with their heat dissipation capacity evenly distributed across the entire structure. This makes it impossible to tailor the design to the specific heat dissipation needs of different areas within the optical module. This design flaw directly leads to two problems: First, for high-heat areas such as chips, the heat dissipation capacity of existing cover plates is often insufficient, and heat accumulation can cause a decrease in chip efficiency, a shortened lifespan, and even module failure. Second, for low-heat passive areas, the heat dissipation capacity of the cover plate is excessive, resulting in redundant and wasteful material and structural design, and also contradicting the development trend of lightweight and low-cost optical modules.

[0004] Therefore, it is necessary to propose a new technical solution to address the above problems. Summary of the Invention

[0005] To overcome the shortcomings mentioned above, the present invention aims to provide a technical solution that can solve the above problems.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a forging process for a copper-aluminum composite plate, wherein the copper-aluminum composite plate is forged by a forging press, the forging press is equipped with a forming mold, the forming mold includes an upper mold and a lower mold fixedly installed on the forging press, the lower mold has a forming groove matching the contour of the copper-aluminum composite plate, and the upper mold is provided with a punch matching the forming groove, comprising the following steps: S1: Aluminum and copper plates are available; S2: Heat the aluminum plate, copper plate and forming mold respectively, wherein the aluminum plate and forming mold are heated to a first preset temperature and the copper plate is heated to a second preset temperature, so that the metal molecules inside the aluminum plate and copper plate are in a highly active state. S3: Place the aluminum plate and copper plate into the forming groove; S4: Start the forging press, close the upper and lower dies, and forge the copper and aluminum plates; S5: The forging press maintains pressure continuously, allowing copper and aluminum atoms to diffuse and fuse at the interface until the contact surface between the copper plate and the aluminum plate is metallurgically bonded.

[0007] As a further aspect of the present invention: an opening matching the contour of the copper plate is machined on the aluminum plate, and in S3, the aluminum plate is first placed into the forming groove, and then the copper plate is placed into the opening. During the forging process of S4-S5, the peripheral surface of the copper plate is in close contact with the inner wall of the opening, and with continuous forging, the peripheral surface of the copper plate is metallurgically bonded to the inner wall of the opening of the aluminum plate.

[0008] As a further aspect of the present invention: in S2, the second preset temperature is higher than the first preset temperature; During the pressure holding process of S5, the copper plate heats the aluminum material on the inner wall of the opening to near its melting point through thermal conduction. This further enhances the activity of the metal molecules in the aluminum material on the inner wall of the opening, accelerates the diffusion and fusion of copper and aluminum atoms at the interface, and improves the metallurgical bonding effect.

[0009] As a further aspect of the present invention: in S2, the first preset temperature is between 450°C and 500°C; The second preset temperature is between 650℃ and 700℃, which softens the copper plate and increases its plasticity; In S5, heat conduction occurs between the copper plate and the aluminum plate, raising the temperature of the aluminum material at the inner wall of the opening to 600~650℃, so that the aluminum material at the inner wall of the opening is in a semi-molten state and forms a metallurgical bond with the edge of the copper plate.

[0010] As a further aspect of the present invention: the thickness of the copper plate is slightly greater than the thickness of the aluminum plate; In S4 to S5, since the thickness of the copper plate is slightly greater than that of the aluminum plate, the copper plate will expand laterally during the continuous pressing of the forming mold, and exert extrusion pressure on the inner wall around the opening, thereby improving the metallurgical bonding effect between the aluminum material in the semi-molten state in the inner wall of the opening and the edge of the copper plate.

[0011] As a further aspect of the present invention: the edge of one side of the copper plate extends outwards to form a first edging; In S3, the copper plate is first placed in the forming groove of the lower mold, and the first edge is placed against the bottom wall of the forming groove with the first edge facing down. Then, the aluminum plate is placed in the forming groove, and the opening is fitted with the copper plate, so that during the forging process of S4 to S5, the contact surface between the first edge and the aluminum plate forms a metallurgical bond.

[0012] As a further embodiment of the present invention: the aluminum plate is provided with a first edge-sealing groove opened along the edge of the opening; In the placement of the aluminum plate and copper plate in S3, after the aluminum plate is placed in the forming groove, the first edge-sealing groove and the first edge-sealing are engaged.

[0013] As a further aspect of the present invention: after the aluminum plate and copper plate are placed in step S3, the top of the copper plate protrudes from the surface of the aluminum plate. Wherein, the second edge groove is formed along the edge of the opening on the side of the aluminum plate opposite to the first edge groove; During the forging process from S4 to S5, under the continuous pressure of the upper die, the part of the copper plate protruding from the aluminum plate undergoes extension deformation according to the shape of the second edge groove, forming a second edge that fits into the second edge groove.

[0014] The present invention also proposes a copper-aluminum composite plate, wherein the copper-aluminum composite plate is manufactured using the forging process of the copper-aluminum composite plate described above. The copper-aluminum composite plate includes an aluminum plate and a copper plate. An opening matching the contour of the copper plate is formed on the aluminum plate. The copper plate is hot-forged to metallurgically bond its peripheral surface to the inner wall of the opening.

[0015] As a further aspect of the present invention: the two ends of the copper plate are respectively formed with a first edge and a second edge that wrap around the edge of the opening; The aluminum plate has a first edge groove and a second edge groove respectively opened along the edge of the opening on both sides, and the first edge groove and the second edge groove are respectively fitted into the first edge groove and the second edge groove, so that the surfaces of the aluminum plate and the copper plate are flush.

[0016] Compared with the existing technology, the beneficial effects of this technical solution are as follows: When this copper-aluminum composite plate is applied in the cover plate of the optical module, the aluminum plate, as the main body, covers the low heat generation area, and its lightweight, low cost and good heat dissipation effect meet the requirements of shell support and basic heat dissipation. The copper plate is precisely embedded in the opening and corresponds to the chip of the optical module. With its high thermal conductivity, it forms a directional heat dissipation channel, realizing a differentiated adaptation of strong heat dissipation in the high heat generation area and lightweight and low cost in the low heat generation area. Meanwhile, the aluminum plate and copper plate are metallurgically bonded through a heated forging process, resulting in a gapless and oxide-free interface with low contact thermal resistance. The heat from the chip can be quickly transferred from the copper plate to the entire aluminum plate, further improving the heat dissipation and cooling effect on the chip. Furthermore, the overall rigidity is improved due to the metallurgical bonding, which can effectively resist vibration and impact during the transportation and use of the optical module, preventing the copper plate and aluminum plate from loosening and separating.

[0017] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a flow chart of the forging process of the present invention; Figure 2 This is a schematic diagram of the product structure of the present invention; Figure 3 This is a schematic diagram of the structure of the aluminum plate and copper plate after disassembly in this invention; Figure 4 This is a schematic diagram of the structure of the aluminum plate of the present invention; Figure 5 This is a schematic diagram of the structure of the copper plate of the present invention; Figure 6 This is a schematic diagram of the upper mold of the present invention.

[0020] Figure 7 This is a schematic diagram of the lower mold structure of the present invention; The corresponding labels in the attached diagram are explained as follows: 1. Aluminum plate; 11. Opening; 12. First edge banding groove; 13. Second edge banding groove; 2. Copper plate; 21. First edge banding; 22. Second edge banding; 3. Upper mold; 31. Punch; 4. Lower mold; 41. Forming groove; 42. Bottom groove. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] Please see Figure 1-7 A forging process for a copper-aluminum composite plate, wherein the copper-aluminum composite plate is forged by a forging press, the forging press is equipped with a forming mold, the forming mold includes an upper mold 3 and a lower mold 4 fixedly installed on the forging press, the lower mold 4 has a forming groove 41 that matches the contour of the copper-aluminum composite plate, and the upper mold 3 is provided with a punch 31 that matches the forming groove 41, characterized by including the following steps: S1: Provide aluminum plate 1 and copper plate 2; the aluminum plate 1 is preferably made of 6061 aluminum alloy, which is lightweight, low cost, moderate thermal conductivity, and has good plasticity and structural stability in the range of 450℃-500℃, making it suitable as the main support structure of the optical module cover; the thickness of the aluminum plate 1 is set according to the design requirements of the optical module shell.

[0023] The copper plate 2 is preferably made of T2 pure copper, which has a thermal conductivity much higher than that of aluminum plate and can quickly dissipate heat from the chip. S2: Heat aluminum plate 1, copper plate 2 and forming mold respectively. Aluminum plate 1 and forming mold are heated to a first preset temperature, and copper plate 2 is heated to a second preset temperature, so that the metal molecules inside aluminum plate 1 and copper plate 2 are in a highly active state. The heating of aluminum plate 1 and copper plate 2 is completed by heating furnace, while the heating of upper mold 3 and lower mold 4 is achieved by resistance wire on forging press. Specifically, resistance wire is equipped at the mounting position of upper mold 3 and lower mold 4 on forging press. When upper mold 3 and lower mold 4 are installed and fixed, the upper mold 3 and lower mold 4 can be heated by activating the resistance wire. S3: Place aluminum plate 1 and copper plate 2 in forming groove 41. A hole matching the outline of copper plate can be processed on aluminum plate, and copper plate 2 can be fitted into the hole 11. During the placement process, aluminum plate is first placed into forming groove, and then copper plate is placed into hole. S4: Start the forging press, so that the upper die 3 and the lower die 4 are closed, and the copper plate 2 and the aluminum plate 1 are forged. During the forging process, the peripheral surface of the copper plate 2 is in close contact with the inner wall of the opening 11. The forging pressure is 50-60 tons. S5: The forging press maintains pressure continuously, and copper and aluminum atoms diffuse and fuse at the interface until the peripheral surface of the copper plate 2 is metallurgically bonded to the inner wall of the opening 11 of the aluminum plate 1. The forging time can be 15 to 20 seconds to ensure that the peripheral surface of the copper plate 2 and the inner wall of the opening 11 are fully forged and bonded.

[0024] Preferably, in S2, the second preset temperature is higher than the first preset temperature; During the pressure holding process of S5, the copper plate 2 heats the aluminum material on the inner wall of the opening 11 to near its melting point through heat conduction, which further enhances the metal molecules of the aluminum material on the inner wall of the opening 11, accelerates the diffusion and fusion of copper and aluminum atoms at the interface, and improves the metallurgical bonding effect.

[0025] Preferably, in S2, the first preset temperature is between 450°C and 500°C.

[0026] Preferably, in S2, the second preset temperature is between 650°C and 700°C, which softens the copper plate 2 and increases its plasticity.

[0027] Preferably, in S5, heat conduction occurs between the copper plate 2 and the aluminum plate 1, causing the temperature of the aluminum material at the inner wall of the opening 11 to rise to 600~650℃.

[0028] Specifically, by separately heating the aluminum plate 1 and copper plate 2 before forging, the metal molecules inside both plates become active. The temperature of aluminum plate 1 is between 450℃ and 500℃, close to its melting point of 660℃, while the temperature of copper plate 2 is between 650℃ and 700℃, similar to the melting point of aluminum plate 1. At 650℃-700℃, copper plate 2 softens. Simultaneously, the temperature of the forming die is consistent with that of aluminum plate 1, preventing a rapid temperature drop. Therefore, when the forming die is driven by the forging press to forge aluminum plate 1 and copper plate 2, the metal molecules inside both plates remain highly active and undergo initial bonding throughout the process. Meanwhile, in copper plate 2... During the process of contact between the peripheral surface of the copper plate 2 and the inner wall of the opening 11 of the aluminum plate 1, the temperature of the aluminum material at the inner wall of the opening 11 rises to 600~650℃ through heat conduction. This further enhances the activity of the metal molecules of the aluminum material at the inner wall of the opening 11, accelerates the diffusion and fusion of copper and aluminum atoms at the interface, and improves the metallurgical bonding effect. Finally, under the action of forging pressure, a metallurgical bonding interface is formed between the peripheral surface of the copper plate 2 and the inner wall of the opening 11, achieving seamless bonding. This gives the aluminum plate 1 and the copper plate 2 high shear strength and low thermal resistance at the metallurgical bonding interface, thus increasing the heat conduction efficiency between the copper plate 2 and the aluminum plate 1. During the forging process, the temperature rise in other areas of aluminum plate 1 is lower than that of the inner wall of opening 11, which keeps the structure of aluminum plate 1 stable throughout the forging process. When this copper-aluminum composite plate is used as a cover plate for an optical module, the position of the copper plate 2 during the assembly process precisely corresponds to and fits the chip of the optical module. The aluminum plate serves as the main body of the optical module's outer shell, providing both physical protection and structural support. It also assists in heat dissipation through its thermal conductivity. The high thermal conductivity of the copper plate 2 quickly dissipates the heat generated by the chip, solving the problem of excessively high temperature in the chip area of ​​the optical module. At the same time, heat from other areas inside the optical module is dissipated to the outside through the aluminum plate 1. The copper plate 2, through its tight connection with the aluminum plate 1, can quickly conduct the heat it absorbs to the entire aluminum plate 1, thereby increasing the heat dissipation area and improving heat dissipation efficiency. This achieves a differentiated heat dissipation effect, with precise and strong heat dissipation in the chip area and adaptation to non-heat-prone areas. Furthermore, aluminum plate 1 is lighter and cheaper than copper plate 2, which reduces the weight and cost of optical module production, in line with the development trend of miniaturization and high density of optical modules.

[0029] Based on the above embodiments, it is further proposed that the thickness of the copper plate 2 is slightly greater than the thickness of the aluminum plate 1; In S4 to S5, since the thickness of copper plate 2 is slightly greater than that of aluminum plate 1, and the plasticity of copper plate 2 is improved at 650℃-700℃, during the continuous pressing of copper plate 2 by the forging die, copper plate 2 will expand laterally and exert extrusion pressure on the inner wall around the opening 11, thereby improving the metallurgical bonding effect between the aluminum material in the semi-molten state in the inner wall of the opening 11 and the edge of copper plate 2.

[0030] Specifically, when the forging die continuously presses down on the copper plate 2, because the thickness of the copper plate 2 is greater than that of the aluminum plate, the deformation in the thickness direction is constrained by the die. Furthermore, the plasticity of the copper plate 2 is enhanced at 650℃-700℃. Therefore, the copper plate 2 will undergo lateral expansion in the radial direction (inner wall direction of the opening 11). This expansion force directly acts on the aluminum material in the semi-molten state at 600~650℃ on the inner wall of the opening 11, causing the semi-molten aluminum material to tightly adhere to the edge of the copper plate 2 and fill its micro gaps. The principle is to use the thickness difference to provide sufficient plastic deformation material. Through the continuous extrusion force generated by the lateral expansion, the diffusion and fusion of copper and aluminum atoms at the interface are accelerated, the integrity of the metallurgical bond is strengthened, the bonding strength of the copper-aluminum interface is improved, the interface voids are reduced, and the contact thermal resistance is lowered.

[0031] Based on the above embodiments, it is further proposed that the edge of one side of the copper plate 2 extends outward to the surrounding area with a first edging 21; In S3, the copper plate 2 is first placed in the forming groove 41 of the lower mold 4, and the first edge 21 is placed downwards against the bottom wall of the forming groove 41. Then, the aluminum plate 1 is placed in the forming groove 41, and the opening 11 is fitted with the copper plate 2, so that during the forging process from S4 to S5, the contact surface between the first edge 21 and the aluminum plate 1 forms a metallurgical bond.

[0032] Specifically, the copper plate 2 is first placed in the forming groove 41 of the lower mold 4, and the first edge 21 is attached to the bottom wall of the forming groove 41 with the first edge facing down. Then, the aluminum plate 1 is placed in the forming groove 41, and the opening 11 is fitted with the copper plate 2. The aluminum plate 1 is positioned in the forming groove 41. Then, the upper mold 3 and the lower mold 4 are closed and forged, so that the edge of the copper plate 2 and the inner wall of the opening 11, and the first edge 21 and the surface of the aluminum plate 1 are simultaneously metallurgically bonded, increasing the contact area between copper and aluminum, forming a double bonding structure in the circumferential and end face, and enhancing the interface's anti-peeling ability.

[0033] Based on the above embodiments, it is further proposed that the aluminum plate 1 is provided with a first edge-sealing groove 12 opened along the edge of the opening 11; In S3, when aluminum plate 1 and copper plate 2 are placed, after aluminum plate 1 is placed in forming groove 41, the first edge groove 12 and the first edge 21 are fitted together.

[0034] Specifically, the width and depth of the first edge groove 12 are precisely matched with the dimensions of the first edge 21 of the copper plate 2, so that during the forging process, the first edge 21 and the inner wall of the first edge groove 12, the circumference of the copper plate 2 and the inner wall of the opening 11 are simultaneously pressed and bonded, and a stable metallurgical bond is formed simultaneously, so that the surface of the first edge 21 is flush with the surface of the aluminum plate 1.

[0035] Based on the above embodiments, it is further proposed that the thickness difference between the copper plate 2 and the aluminum plate 1 is 3mm~3.5mm, so that after the placement of the aluminum plate 1 and the copper plate 2 in S3 is completed, the top of the copper plate 2 protrudes from the surface of the aluminum plate 1. Wherein, the aluminum plate 1 has a second edge groove 13 opened along the edge of the opening 11 on one side away from the first edge groove 12; During the forging process from S4 to S5, under the continuous pressure of the upper die 3, the part of the copper plate 2 that protrudes from the aluminum plate 1 is stretched and deformed according to the shape of the second edge groove 13, forming the second edge 22 that fits into the second edge groove 13.

[0036] Specifically, the 3mm~3.5mm thickness difference between the copper plate 2 and the aluminum plate provides sufficient material for the extension and forming of the second edge 22. During the forging process from S4 to S5, the protruding part of the copper plate 2 faces upward, and the upper die 3 applies pressure to extend this part along the second edge groove 13 to form the second edge 22, thus completing the double-sided edge forming, realizing a symmetrical bidirectional edge structure, ensuring the flatness of the two sides of the composite material, and further increasing the contact area and improving the bonding strength. During the forging process, there is a time difference in the heat conduction and temperature rise of the inner wall of the opening 11 between the copper plate 2 and the aluminum plate 1: the copper plate 2 itself is already in a high-temperature softened state of 650℃~700℃ (with excellent plasticity), while the aluminum material inside the opening 11 takes about 3~6 seconds to heat up from the initial 450℃~500℃ to a semi-molten state of 600~650℃ (depending on the thickness of the aluminum plate 1 and the copper plate 2). Therefore, in the initial stage of forging, the aluminum material inside the opening 11 has not fully reached a semi-molten state. While maintaining a certain structural rigidity in the molten state, the pressure of the upper mold 3 first acts on the protruding part of the softened copper plate 2, forging it to complete the extension and shaping along the second edge groove 13, avoiding the collapse or deformation of the edge of the opening 11 due to the premature softening of the aluminum plate 1; after the heat conduction is completed in the following 3 to 6 seconds, when the aluminum material on the inner wall of the opening 11 reaches the semi-molten state, the formed second edge 22 and the groove wall of the second edge groove 13, the peripheral surface of the copper plate 2 and the inner wall of the opening 11 simultaneously form a stable metallurgical bond.

[0037] A copper-aluminum composite plate is provided. The copper-aluminum composite plate is produced using the copper-aluminum composite plate forging process described above. The copper-aluminum composite plate includes an aluminum plate 1 and a copper plate 2. An opening 11 matching the contour of the copper plate 2 is provided on the aluminum plate 1. The copper plate 2 is hot-forged and pressed into the opening 11 of the aluminum plate 1, and the copper plate 2 is hot-forged and pressed to make its peripheral surface metallurgically bonded to the inner wall of the opening 11.

[0038] Specifically, when this copper-aluminum composite plate is used in the cover plate of the optical module, the aluminum plate 1 serves as the main body to cover the low-heat area, utilizing its lightweight, low-cost, and good heat dissipation characteristics to meet the requirements of shell support and basic heat dissipation; the copper plate 2 is precisely embedded in the opening 11 and corresponds to the chip of the optical module, forming a directional heat dissipation channel with its high thermal conductivity, achieving a differentiated adaptation of strong heat dissipation in the high-heat area and lightweight and low-cost in the low-heat area. Meanwhile, aluminum plate 1 and copper plate 2 are metallurgically bonded through a heating and forging process, resulting in a gapless and oxide-free interface with low contact thermal resistance. The heat from the chip can be quickly transferred from copper plate 2 to the entire aluminum plate 1, further enhancing the heat dissipation and cooling effect on the chip. Furthermore, the overall rigidity is improved due to the metallurgical bonding, which can effectively resist vibration and impact during the transportation and use of the optical module, preventing copper plate 2 and aluminum plate 1 from loosening and separating.

[0039] Based on the above embodiments, it is further proposed that the two ends of the copper plate 2 are respectively formed with a first edge 21 and a second edge 22 that wrap around the edge of the opening 11; The aluminum plate 1 has a first edge groove 12 and a second edge groove 13 respectively opened along the edge of the opening 11 on both sides, and the first edge 21 and the second edge 22 are respectively fitted into the first edge groove 12 and the second edge groove 13, so that the surfaces of the aluminum plate 1 and the copper plate 2 are flush.

[0040] Specifically, the first edge 21 and the second edge 22 at both ends of the copper plate 2 are precisely fitted with the first edge groove 12 and the second edge groove 13 on both sides of the aluminum plate 1, forming a three-dimensional connection structure of circumferential fitting and double-sided end face fitting. The bidirectional edge structure greatly expands the contact area between copper and aluminum, and the fitting design forms a mechanical interlocking effect, which works synergistically with the metallurgical combination. At the same time, the symmetrical structure balances thermal stress and mechanical stress, avoids connection failure caused by interface stress concentration, enhances the connection strength and interface shear strength between copper and aluminum, prevents loosening and peeling of the copper-aluminum interface during long-term use, ensures the continuity of the heat dissipation path and the reliability of the structure, and the structure with flat double-sided surfaces is adapted to the precision assembly requirements of optical modules.

[0041] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A forging process for a copper-aluminum composite plate, wherein the copper-aluminum composite plate is forged by a forging press, the forging press is equipped with a forming die, the forming die includes an upper die and a lower die fixedly installed on the forging press, the lower die has a forming groove matching the contour of the copper-aluminum composite plate, and the upper die is provided with a punch matching the forming groove, characterized in that... Includes the following steps: S1: Aluminum and copper plates are available; S2: Heat the aluminum plate, copper plate and forming mold respectively, wherein the aluminum plate and forming mold are heated to a first preset temperature and the copper plate is heated to a second preset temperature, so that the metal molecules inside the aluminum plate and copper plate are in a highly active state. S3: Place the aluminum plate and copper plate into the forming groove; S4: Start the forging press, close the upper and lower dies, and forge the copper and aluminum plates; S5: The forging press maintains pressure continuously, allowing copper and aluminum atoms to diffuse and fuse at the interface until the contact surface between the copper plate and the aluminum plate is metallurgically bonded.

2. The forging process of the copper-aluminum composite plate according to claim 1, characterized in that, An opening matching the contour of the copper plate is machined on the aluminum plate. In S3, the aluminum plate is first placed into the forming groove, and then the copper plate is placed into the opening. During the forging process of S4-S5, the peripheral surface of the copper plate is in close contact with the inner wall of the opening, and with continuous forging, the peripheral surface of the copper plate is metallurgically bonded to the inner wall of the opening of the aluminum plate.

3. The forging process of the copper-aluminum composite plate according to claim 2, characterized in that, In S2, the second preset temperature is higher than the first preset temperature; During the pressure holding process of S5, the copper plate heats the aluminum material on the inner wall of the opening to near its melting point through thermal conduction. This further enhances the activity of the metal molecules in the aluminum material on the inner wall of the opening, accelerates the diffusion and fusion of copper and aluminum atoms at the interface, and improves the metallurgical bonding effect.

4. The forging process of the copper-aluminum composite plate according to claim 3, characterized in that, In S2, the first preset temperature is between 450℃ and 500℃; The second preset temperature is between 650℃ and 700℃, which softens the copper plate and increases its plasticity; In S5, heat conduction occurs between the copper plate and the aluminum plate, raising the temperature of the aluminum material at the inner wall of the opening to 600~650℃, so that the aluminum material at the inner wall of the opening is in a semi-molten state and forms a metallurgical bond with the edge of the copper plate.

5. The forging process of the copper-aluminum composite plate according to claim 4, characterized in that, The thickness of the copper plate is slightly greater than that of the aluminum plate; In S4 to S5, since the thickness of the copper plate is slightly greater than that of the aluminum plate, the copper plate will expand laterally during the continuous pressing of the forming mold, and exert extrusion pressure on the inner wall around the opening, thereby improving the metallurgical bonding effect between the aluminum material in the semi-molten state in the inner wall of the opening and the edge of the copper plate.

6. The forging process of the copper-aluminum composite plate according to claim 5, characterized in that, The copper plate has a first edging extending outwards from one side edge in all directions; In S3, the copper plate is first placed in the forming groove of the lower mold, and the first edge is placed against the bottom wall of the forming groove with the first edge facing down. Then, the aluminum plate is placed in the forming groove, and the opening is fitted with the copper plate, so that during the forging process of S4 to S5, the contact surface between the first edge and the aluminum plate forms a metallurgical bond.

7. The forging process of the copper-aluminum composite plate according to claim 6, characterized in that, The aluminum plate is provided with a first edge-sealing groove along the edge of the opening; In the placement of the aluminum plate and copper plate in S3, after the aluminum plate is placed in the forming groove, the first edge-sealing groove and the first edge-sealing are engaged.

8. The forging process of the copper-aluminum composite plate according to claim 7, characterized in that, After the placement of the aluminum and copper plates in S3 is completed, the top of the copper plate protrudes from the surface of the aluminum plate. Wherein, the second edge groove is formed along the edge of the opening on the side of the aluminum plate opposite to the first edge groove; During the forging process from S4 to S5, under the continuous pressure of the upper die, the part of the copper plate protruding from the aluminum plate undergoes extension deformation according to the shape of the second edge groove, forming a second edge that fits into the second edge groove.

9. A copper-aluminum composite plate, characterized in that, The copper-aluminum composite plate is manufactured using the forging process described in any one of claims 1 to 8. The copper-aluminum composite plate includes an aluminum plate and a copper plate. An opening matching the contour of the copper plate is formed on the aluminum plate. The copper plate is hot-forged to metallurgically bond its circumference to the inner wall of the opening.

10. The copper-aluminum composite plate according to claim 9, characterized in that, The copper plate has a first edging and a second edging formed at both ends to wrap around the edge of the opening; The aluminum plate has a first edge groove and a second edge groove respectively opened along the edge of the opening on both sides, and the first edge groove and the second edge groove are respectively fitted into the first edge groove and the second edge groove, so that the surfaces of the aluminum plate and the copper plate are flush.

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