Die pressing device for producing digital-to-analog conversion chip

Abstract

The invention belongs to the technical field of chip processing, and discloses a mold pressing device for producing a digital-to-analog conversion chip, which comprises a base, a demolding mechanism, a mold pressing mechanism, a mold pressing mechanism, a mold pressing mechanism, a mold pressing mechanism, a mold pressing mechanism, a mold pressing mechanism, a mold pressing mechanism and a mold pressing mechanism, and the outer wall of the top end of the base is fixedly connected with a top plate; the vibrating mechanism is mounted at the movable end of the air cylinder on the outer wall of the top plate; wherein the demolding mechanism comprises a fixed block, the inner wall of the fixed block is slidably connected with a sliding block, the outer wall of the sliding block is fixedly connected with a guide block, the inner wall of the sliding block is rotatably connected with a roller, the inner wall of the fixed block is rotatably connected with a rotating block, and a pull rope is wound on the outer wall of the rotating block; through the cooperation of structures such as the fixed block and the sliding block, in the upward moving and resetting process of the upper mold, the supporting plate can support the sliding block to move upwards, the two sets of lower molds are pulled to move towards the two sides through the pull rope, a chip and the lower molds can be effectively separated, and therefore the problem that the chip and the lower molds adhere to each other and are inconvenient to take down is solved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of chip processing, and specifically relates to a compression molding device for digital-to-analog conversion chip production. BACKGROUND

[0002] The digital-to-analog conversion chip is an integrated circuit for converting digital signals into analog signals, and is widely used in audio equipment, communication systems, industrial control and other fields. Its performance directly affects the precision and speed of signal conversion.

[0003] The compression molding device for digital-to-analog conversion chip production is a device for molding components such as chips, lead frames and other components by encapsulating materials such as epoxy resin in a molten state under high temperature and high pressure. It can realize the sealing protection, mechanical support and electrical isolation of the chip, and is a key device for forming the chip shell in the semiconductor packaging process.

[0004] During the compression molding process of the chip, the encapsulating material such as epoxy resin will change into a molten state with high flowability and viscosity under high temperature and high pressure. They fill the mold cavity and wrap the chip and lead frame. The encapsulating material may adhere to the inner wall of the mold cavity under the action of pressure and temperature, making it difficult to separate the encapsulating body from the mold cavity after solidification. In some existing technologies, the chip needs to be taken out manually by the operator through other tools or manually after adhesion, which is relatively inconvenient. The temperature of the mold cavity may be high enough to cause hand burns. Therefore, the compression molding device for digital-to-analog conversion chip production is proposed to solve the above problems. SUMMARY

[0005] To solve the problems in the background art, the application provides a compression molding device for digital-to-analog conversion chip production.

[0006] To achieve the above purpose, the application provides the following technical scheme: a compression molding device for digital-to-analog conversion chip production, comprising a base, a top plate fixedly connected to the top end outer wall of the base, a demolding mechanism arranged on the outer wall of the base, and a vibration mechanism installed on the movable end of the cylinder of the outer wall of the top plate.

[0007] The demolding mechanism comprises a fixed block, a sliding block slidably connected to the inner wall of the fixed block, a guide block fixedly connected to the outer wall of the sliding block, a roller rotatably connected to the inner wall of the sliding block, and a rotating block rotatably connected to the inner wall of the fixed block. A pull rope is wound around the outer wall of the rotating block. A moving block is elastically connected to the inner wall of the base through a return spring. A telescopic rod is fixedly connected to the inner wall of the base. An extrusion plate is fixedly connected to the outer wall of the telescopic rod.

[0008] Preferably, a guide groove is formed in the inner wall of the fixed block. A lower mold is slidably connected to the outer wall of the base. The movable end of the telescopic rod is hinged to the inner wall of the lower mold through a hinge rod.

[0009] Preferably, the fixing block is fixedly connected to the inner wall of the base, the guide block is in contact with the inner wall of the guide groove, and the two ends of the pull rope are fixedly connected to the outer walls of the moving block and the slider, respectively.

[0010] Preferably, one end of the reset spring is fixedly connected to the outer wall of the moving block, the other end of the reset spring is fixedly connected to the inner wall of the base, the moving block is slidably connected to the inner wall of the base, and the moving block is fixedly connected to the bottom outer wall of the lower mold.

[0011] Preferably, one end of the hinge rod is fixedly connected to the movable end of the telescopic rod, the other end of the hinge rod is hinged to the inner wall of the lower mold, and the movable end of the telescopic rod is fixedly connected to the bottom outer wall of the extrusion plate.

[0012] Preferably, the demolding mechanism further includes a triggering component, which includes a connecting block. A triggering rod is fixedly connected to the outer wall of the connecting block, and a rotating shaft is elastically connected to the inner wall of the triggering rod via a spiral spring. A support plate is fixedly connected to the outer wall of the rotating shaft.

[0013] Preferably, one end of the spiral spring is fixedly connected to the outer wall of the rotating shaft, the other end of the spiral spring is fixedly connected to the inner wall of the trigger rod, and the rotating shaft is rotatably connected to the inner wall of the trigger rod.

[0014] Preferably, the vibration mechanism includes a connecting plate, the inner wall of which is elastically connected to an inclined rod via a telescopic spring, the outer wall of which is hinged to a striking plate via a connecting rod, and a protrusion fixedly connected to the top outer wall of the fixed block, the outer wall of which has a groove.

[0015] Preferably, the connecting plate is fixedly connected to the movable end of the cylinder on the outer wall of the top plate, the connecting plate is fixedly connected to the outer wall of the upper mold, the inclined rod is slidably connected in the inner wall of the connecting plate and the connecting block, and the two ends of the connecting rod are respectively hinged to the outer wall of the inclined rod and the striking plate.

[0016] Preferably, one end of the telescopic spring is fixedly connected to the outer wall of the inclined rod, the other end of the telescopic spring is fixedly connected to the inner wall of the connecting plate, the inclined rod is engaged with the groove, and the striking plate is slidably connected to the inner wall of the connecting plate.

[0017] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0018] This invention, through the cooperation of structures such as fixed blocks and sliders, completes the molding process. During the process of the upper mold moving upward and resetting, the support plate will lift the slider upward. By pulling the two sets of lower molds to the sides through the pull rope, the chip can be effectively separated from the lower mold, thereby avoiding the problem of the chip sticking to the lower mold and being inconvenient to remove.

[0019] This invention, through the combination of structures such as extrusion plates and hinge rods, allows the extrusion plates to push the chip upwards by flipping the hinge rods when the two sets of lower molds move to the sides, thereby further separating the chip from the mold cavity of the lower mold. Furthermore, when the operator removes the chip, their hands do not need to touch the lower mold, thus avoiding the problem of burns caused by the high temperature of the mold.

[0020] This invention, through the cooperation of structures such as a connecting plate and a striking plate, allows the connecting plate to gradually separate from the protrusion when the upper mold moves upward. During the movement of the connecting plate, the protrusion drives the inclined rod to move back and forth laterally, causing the striking plate to continuously strike and vibrate the inner wall of the connecting plate. This further avoids the problem of the chip sticking to the upper mold and being difficult to remove. Combined with the demolding mechanism, this improves the demolding efficiency. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0022] Figure 2 This is a schematic diagram of the demolding mechanism and vibration mechanism of the present invention;

[0023] Figure 3 This is a schematic diagram of the cross-sectional structure of the lower mold and base of the present invention;

[0024] Figure 4 This is a schematic diagram of the cross-sectional structure of the lower mold, fixing block, and protrusion of the present invention;

[0025] Figure 5 This is a schematic diagram of the cross-sectional structure of the connecting block of the present invention;

[0026] Figure 6 This is a schematic cross-sectional view of the base, lower mold, and fixing block of the present invention;

[0027] Figure 7 This is a cross-sectional structural diagram of the connecting plate, connecting block, and protrusion of the present invention.

[0028] In the picture:

[0029] 100. Base;

[0030] 200. Demolding mechanism; 201. Fixed block; 202. Slider; 203. Roller; 204. Guide block; 205. Guide groove; 206. Rotating block; 207. Pull rope; 208. Moving block; 209. Return spring; 210. Telescopic rod; 211. Hinge rod; 212. Extrusion plate;

[0031] 2001. Connecting block; 2002. Trigger rod; 2003. Scroll spring; 2004. Rotating shaft; 2005. Support plate;

[0032] 300. Vibration mechanism; 301. Connecting plate; 302. Protrusion; 303. Groove; 304. Inclined rod; 305. Telescopic spring; 306. Connecting rod; 307. Beating plate;

[0033] 400, lower mold; 500, top plate; 600, upper mold. Detailed Implementation

[0034] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0035] like Figures 1 to 7 As shown, the present invention provides a molding device for manufacturing digital-to-analog converter chips, including a base 100, a top plate 500 fixedly connected to the outer wall of the top end of the base 100, and further including: a demolding mechanism 200, which is disposed on the outer wall of the base 100; and a vibration mechanism 300, which is installed on the movable end of a cylinder on the outer wall of the top plate 500.

[0036] The demolding mechanism 200 includes a fixed block 201, a slider 202 slidably connected to the inner wall of the fixed block 201, a guide block 204 fixedly connected to the outer wall of the slider 202, a roller 203 rotatably connected to the inner wall of the slider 202, a rotating block 206 rotatably connected to the inner wall of the fixed block 201, a pull rope 207 wound around the outer wall of the rotating block 206, a moving block 208 elastically connected to the inner wall of the base 100 via a return spring 209, a telescopic rod 210 fixedly connected to the inner wall of the base 100, and an extrusion plate 212 fixedly connected to the outer wall of the telescopic rod 210.

[0037] like Figures 2 to 4 , Figure 6 As shown, the inner wall of the fixing block 201 is provided with a guide groove 205, the outer wall of the base 100 is slidably connected to the lower mold 400, and the movable end of the telescopic rod 210 is hinged to the inner wall of the lower mold 400 through the hinge rod 211.

[0038] With the above scheme: the chip to be pressed into shape can be placed in the lower mold 400, and the upper mold 600 can be driven downward by the movable end of the air cylinder on the top plate 500 to press the chip, the lower mold 400 is provided with two groups, and under normal circumstances, the two groups of lower molds 400 are attached to form a whole, the demolding mechanism 200 can automatically drive the two groups of lower molds 400 to move apart to the two sides during the process of completing the pressing of the upper mold 600 and moving upward and resetting, and drive the extrusion plate 212 to move upward, so that the chip after pressing can be better avoided from sticking to the lower mold 400, and the problem of being inconvenient for the operator to take out, and the way when demolding, the operator's hand does not need to touch the mold cavity of the lower mold 400, avoiding the problem of the operator's hand being scalded by high temperature in the pressing process; when the two groups of lower molds 400 are attached, the top end of the extrusion plate 212 is flush with the bottom of the mold cavity of the lower mold 400.

[0039] As shown in Figures 2 to 4 , Figure 6 , the inner wall of the fixed block 201 is provided with a guide groove 205, the outer wall of the base 100 is slidably connected with a lower mold 400, the movable end of the telescopic rod 210 is hingedly connected with the inner wall of the lower mold 400 through a hinge rod 211; the fixed block 201 is fixedly connected in the inner wall of the base 100, the guide block 204 is in contact with the inner wall of the guide groove 205, and the two ends of the pull rope 207 are respectively fixedly connected with the outer wall of the moving block 208 and the sliding block 202; one end of the reset spring 209 is fixedly connected with the outer wall of the moving block 208, and the other end of the reset spring 209 is fixedly connected with the inner wall of the base 100, the moving block 208 is slidably connected with the inner wall of the base 100, and the moving block 208 is fixedly connected with the outer wall of the bottom end of the lower mold 400; one end of the hinge rod 211 is fixedly connected with the movable end of the telescopic rod 210, and the other end of the hinge rod 211 is hingedly connected with the inner wall of the lower mold 400, and the movable end of the telescopic rod 210 is fixedly connected with the outer wall of the bottom end of the extrusion plate 212.

[0040] Adopt the above scheme: the fixed block 201 is fixed on both sides of the base 100, the sliding block 202 can move obliquely in the inner wall of the fixed block 201, the moving track is the same as the guide groove 205, the guide block 204 is used for guiding when the sliding block 202 moves; when the upper die 600 moves down and contacts the lower die 400, the supporting plate 2005 in the trigger assembly will move to the lower side of the sliding block 202, and when the upper die 600 moves up and resets, the sliding block 202 will move up, and under the action of the guide block 204, the sliding block 202 will move obliquely upwards and move into the inner wall of the fixed block 201; under normal circumstances, the return spring 209 makes the moving block 208 drive the two lower dies 400 to be in a close state due to the elastic force, the telescopic rod 210 is in a contraction state when the lower die 400 passes through the hinged rod 211, the position of the extrusion plate 212 is fixed, and the top outer wall is flush with the bottom of the lower die 400; when the sliding block 202 moves obliquely upwards, one end of the pull rope 207 will be pulled to move, the pull rope 207 moves to rotate the rotating block 206, which reduces friction, the other end pulls the moving block 208 and the lower die 400 to move to the two sides, the return spring 209 is stretched under stress, so that the two groups of lower dies 400 are separated, the hinged rod 211 moves synchronously in the separation process, the end of the hinged rod 211 hinged with the telescopic rod 210 will move up, the hinged rod 211 is flipped as a whole and drives the movable end of the telescopic rod 210 and the extrusion plate 212 to move up synchronously, the top outer wall of the extrusion plate 212 protrudes from the bottom of the die cavity of the lower die 400, that is, the chip can be lifted upwards, and the two groups of lower dies 400 will be separated from the chip, further avoiding adhesion.

[0041] As shown in Figure 5 and Figure 6 The demolding mechanism 200 further includes a trigger assembly, and the trigger assembly includes a connecting block 2001. The outer wall of the connecting block 2001 is fixedly connected with a trigger rod 2002. The inner wall of the trigger rod 2002 is elastically connected with a rotating shaft 2004 through a volute spring 2003. The outer wall of the rotating shaft 2004 is fixedly connected with a supporting plate 2005. One end of the volute spring 2003 is fixedly connected with the outer wall of the rotating shaft 2004. The other end of the volute spring 2003 is fixedly connected with the inner wall of the trigger rod 2002. The rotating shaft 2004 is rotatably connected with the inner wall of the trigger rod 2002.

[0042] Adopting the above scheme: the trigger assembly is used to drive the sliding block 202 to move, under normal circumstances, the volute spring 2003 makes the rotating shaft 2004 and the supporting plate 2005 in a certain position due to the elastic force, the supporting plate 2005 and the trigger rod 2002 are in a vertical state, and the bottom of the supporting plate 2005 is in contact with the inner wall of the bottom end of the trigger rod 2002, the supporting plate 2005 cannot be turned down but can be turned up; the movable end of the air cylinder drives the connecting block 2001 to move downwards, and drives the upper die 600 to move downwards synchronously to press the die, in the moving process, the outer wall of the bottom end of the supporting plate 2005 first contacts the outer wall of the sliding block 202, due to the fact that the sliding block 202 cannot move downwards, the supporting plate 2005 is turned up under the extrusion, the rotating shaft 2004 rotates to make the volute spring 2003 shrink under the stress, when the supporting plate 2005 moves to the lower side of the sliding block 202, the rotating shaft 2004 and the supporting plate 2005 are reversely rotated and reset due to the elastic force of the volute spring 2003, and the trigger assembly returns to the initial state; in the resetting process of the upward movement of the upper die 600, the supporting plate 2005 supports the sliding block 202 to move upwards, and the supporting plate 2005 will not be turned down, the supporting plate 2005 is in contact with the rollers 203 in the inner wall of the bottom end of the sliding block 202, in the process that the sliding block 202 moves to the inner wall of the fixed block 201 in the oblique upper direction, the rollers 203 rotate along the surface of the supporting plate 2005, so that the two lower dies 400 can be automatically driven to move to the two sides when the upper die 600 moves upwards to reset, and the extrusion plate 212 is driven to move upwards to lift the chip; after the supporting plate 2005 is completely separated from the rollers 203, the two lower dies 400 and the moving block 208 are driven to move to the middle under the action of the resetting spring 209, the lower die 400 is reset, the hinge rod 211 is reversely turned to drive the extrusion plate 212 to move downwards to reset, the sliding block 202 is pulled downwards by the pull rope 207, and the demolding mechanism 200 returns to the initial state as a whole.

[0043] As shown in Figure 7 The vibration mechanism 300 includes a connecting plate 301, the inner wall of the connecting plate 301 is elastically connected with an inclined rod 304 through a telescopic spring 305, the outer wall of the inclined rod 304 is hinged with a beating plate 307 through a connecting rod 306, the top outer wall of the fixed block 201 is fixedly connected with a protrusion 302, and the outer wall of the protrusion 302 is provided with a groove 303

[0044] Adopting the above scheme: the vibration mechanism 300 is used to vibrate the upper die 600 during demolding, so as to further avoid the adhesion of the chip to the upper die 600 after pressing, and in the upward movement of the upper die 600, the beating plate 307 can be continuously reciprocated vertically, and the vibration can be generated after the beating plate 307 contacts the inner wall of the connecting plate 301, so that the chip is separated from the upper die 600, and in combination with the effect of the demolding mechanism 200, the problem that the chip is difficult to be taken out after being pressed can be effectively avoided.

[0045] As shown in Figure 7As shown, the connecting plate 301 is fixedly connected with the movable end of the cylinder on the outer wall of the top plate 500, the connecting plate 301 is fixedly connected with the outer wall of the upper mold 600, the inclined rod 304 is slidingly connected in the inner wall of the connecting block 2001 and the connecting plate 301, the two ends of the connecting rod 306 are respectively hingedly connected with the outer wall of the inclined rod 304 and the beating plate 307, one end of the extension spring 305 is fixedly connected with the outer wall of the inclined rod 304, the other end of the extension spring 305 is fixedly connected with the inner wall of the connecting plate 301, the inclined rod 304 is clamped with the groove 303, and the beating plate 307 is slidingly connected in the inner wall of the connecting plate 301.

[0046] By adopting the above scheme, the outer wall of the connecting block 2001 is provided with a through groove, during the descending process of the upper mold 600, the protrusion 302 is inserted into the through groove, and the inclined rod 304 is inserted into the inner wall of the groove 303; when the upper mold 600 is reset by ascending, the inclined rod 304 is in turn in contact with the outer wall of the plurality of grooves 303 and protrusions 302, the groove 303 can extrude the inclined surface to move to the inner wall of the connecting block 2001 and compress the extension spring 305, and when the inclined rod 304 moves to the position corresponding to the groove 303, the extension spring 305 drives the inclined rod 304 to pop out and be clamped with the groove 303, so that the inclined rod 304 can continuously reciprocate and move horizontally during the ascending process of the upper mold 600; when the inclined rod 304 moves, the connecting rod 306 and the end hingedly connected with the inclined rod 304 move synchronously, and the other end drives the beating plate 307 to move, since the beating plate 307 is slidingly connected with the inner wall of the connecting plate 301, only vertical movement is allowed, so that the beating plate 307 can reciprocate and move vertically when the connecting rod 306 flips, and the beating plate 307 continuously beats the inner wall of the connecting plate 301, so that the upper mold 600 can vibrate, the separation of the chip from the upper mold 600 is accelerated, and the chip does not need to be manually demolded and taken down by the operator when the chip is adhered to the upper mold 600, which is more convenient.

[0047] The working principle and use process of the present application are as follows:

[0048] The chip to be compression molded is placed in the cavity of the two sets of lower molds 400 in a bonded state, and then the cylinder on the outer wall of the top plate 500 is started, the movable end of the cylinder drives the connecting plate 301, the upper mold 600 and the trigger assembly to move downward synchronously, during the downward movement, the protrusion 302 is inserted into the through groove of the connecting block 2001, the supporting plate 2005 of the trigger assembly first contacts the outer wall of the sliding block 202, since the sliding block 202 cannot move downward, the supporting plate 2005 is extruded to flip upward, the rotating shaft 2004 rotates and compresses the volute spring 2003, until the supporting plate 2005 moves to the lower side of the sliding block 202, the elastic force of the volute spring 2003 drives the supporting plate 2005 to reset, and the trigger assembly returns to the initial state; continue to move downward until the upper mold 600 is bonded with the lower mold 400, and the compression molding of the chip is completed.

[0049] After the mold is completed, the movable end of the cylinder drives the upper mold 600, the connecting plate 301 and the trigger assembly to reset upwards, and in this process, the demolding mechanism 200 and the vibration mechanism 300 are synchronized to achieve the demolding effect; the sliding block 202 is moved upwards by the supporting plate 2005, and because the supporting plate 2005 cannot be turned downwards, and the bottom roller 203 of the sliding block 202 is in contact with the surface of the supporting plate 2005, under the guidance of the fixed block 201 guide groove 205 and the guide block 204, the sliding block 202 moves along the upward inclined track to the inner wall of the fixed block 201, and at the same time, the sliding block 202 pulls one end of the pull rope 207 to move, and after the pull rope 207 is guided by the rotating block 206, the other end of the moving block 208 is pulled to move, so that the moving block 208 drives the two groups of lower molds 400 to separate to the two sides, and the reset spring 209 is stretched.

[0050] On the other hand, when the upper mold 600 moves upwards to reset, the inclined rod 304 moves upwards with the connecting plate 301, and the inclined rod 304 alternately contacts the outer wall of the plurality of grooves 303 and the protrusions 302, the grooves 303 generate extrusion on the inclined rod 304, so that the inclined rod 304 moves to the inner wall of the connecting block 2001 and compresses the telescopic spring 305, when the inclined rod 304 corresponds to the position of the groove 303, the telescopic spring 305 drives the inclined rod 304 to pop out and be clamped into the groove 303, so that the inclined rod 304 moves reciprocatingly along the horizontal direction; when the inclined rod 304 moves, it drives the beating plate 307 to move reciprocatingly vertically through the connecting rod 306, the beating plate 307 constantly beats the inner wall of the connecting plate 301, so that the upper mold 600 vibrates, avoiding the chip from being adhered to the upper mold, and accelerating the chip to separate from the upper mold, so that the demolding effect of the chip after the mold pressing can be improved from two aspects, the problem that the chip is adhered to the mold and needs to be manually taken down by the operator can be effectively avoided, and when the operator takes out the chip, the hand does not need to contact the mold, avoiding the problem that the mold may be high in temperature and cause scalding.

[0051] When the upper mold 600 continues to move upwards, after the supporting plate 2005 of the trigger assembly and the bottom roller 203 of the sliding block 202 are completely separated, the reset spring 209 drives the moving block 208 to move to the middle due to the elastic force, drives the two groups of lower molds 400 to re-adhere, and in the moving process of the lower mold 400, the hinged rod 211 is reversely turned, the telescopic rod 210 is pushed to contract, and the extrusion plate 212 moves downwards to be flush with the bottom of the cavity of the lower mold 400; at the same time, the sliding block 202 moves obliquely downwards along the track of the guide groove 205 by the pull rope 207, and returns to the initial position.

[0052] It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting; it is not intended to exclude myriad other embodiments of the present application that other inventors can develop based on the same general inventive concepts embodied by the described embodiments. That is, although the present application is described in terms of particular embodiments and illustrative figures, it should be apparent that the scope of the present application is not limited to these specific embodiments.

[0053] While the embodiments of the application have been shown and described herein, it will be understood by those skilled in the art that many changes, modifications, substitutions and alterations to these embodiments can be made without departing from the principles and spirits of the application, and it is intended that the scope of the application be limited solely by the scope of the appended claims and the equivalents thereof.

Claims

1. A molding apparatus for manufacturing digital-to-analog converter chips, comprising a base (100), characterized in that: The top outer wall of the base (100) is fixedly connected to a top plate (500), and also includes: A demolding mechanism (200) is disposed on the outer wall of the base (100); Vibration mechanism (300), which is installed on the movable end of the cylinder on the outer wall of the top plate (500); The demolding mechanism (200) includes a fixed block (201), a slider (202) is slidably connected to the inner wall of the fixed block (201), a guide block (204) is fixedly connected to the outer wall of the slider (202), a roller (203) is rotatably connected to the inner wall of the slider (202), a rotating block (206) is rotatably connected to the inner wall of the fixed block (201), a pull rope (207) is wound around the outer wall of the rotating block (206), a moving block (208) is elastically connected to the inner wall of the base (100) through a return spring (209), a telescopic rod (210) is fixedly connected to the inner wall of the base (100), and an extrusion plate (212) is fixedly connected to the outer wall of the telescopic rod (210).

2. The molding apparatus for manufacturing digital-to-analog converter chips according to claim 1, characterized in that: The inner wall of the fixing block (201) is provided with a guide groove (205), the outer wall of the base (100) is slidably connected with the lower mold (400), and the movable end of the telescopic rod (210) is hinged to the inner wall of the lower mold (400) through the hinge rod (211).

3. The molding apparatus for manufacturing digital-to-analog converter chips according to claim 1, characterized in that: The fixing block (201) is fixedly connected to the inner wall of the base (100), the guide block (204) is in contact with the inner wall of the guide groove (205), and the two ends of the pull rope (207) are fixedly connected to the outer walls of the moving block (208) and the slider (202), respectively.

4. The molding apparatus for manufacturing digital-to-analog converter chips according to claim 1, characterized in that: One end of the reset spring (209) is fixedly connected to the outer wall of the moving block (208), the other end of the reset spring (209) is fixedly connected to the inner wall of the base (100), the moving block (208) is slidably connected to the inner wall of the base (100), and the moving block (208) is fixedly connected to the bottom outer wall of the lower mold (400).

5. The molding apparatus for manufacturing digital-to-analog converter chips according to claim 2, characterized in that: One end of the hinge rod (211) is fixedly connected to the movable end of the telescopic rod (210), the other end of the hinge rod (211) is hinged to the inner wall of the lower mold (400), and the movable end of the telescopic rod (210) is fixedly connected to the bottom outer wall of the extrusion plate (212).

6. The molding apparatus for manufacturing digital-to-analog converter chips according to claim 1, characterized in that: The demolding mechanism (200) further includes a triggering component, which includes a connecting block (2001). A trigger rod (2002) is fixedly connected to the outer wall of the connecting block (2001). A rotating shaft (2004) is elastically connected to the inner wall of the trigger rod (2002) via a spiral spring (2003). A support plate (2005) is fixedly connected to the outer wall of the rotating shaft (2004).

7. The molding apparatus for manufacturing digital-to-analog converter chips according to claim 6, characterized in that: One end of the spiral spring (2003) is fixedly connected to the outer wall of the rotating shaft (2004), and the other end of the spiral spring (2003) is fixedly connected to the inner wall of the trigger rod (2002). The rotating shaft (2004) is rotatably connected to the inner wall of the trigger rod (2002).

8. The molding apparatus for manufacturing digital-to-analog converter chips according to claim 1, characterized in that: The vibration mechanism (300) includes a connecting plate (301), the inner wall of the connecting plate (301) is elastically connected to an inclined rod (304) by a telescopic spring (305), the outer wall of the inclined rod (304) is hinged to a striking plate (307) by a connecting rod (306), and a protrusion (302) is fixedly connected to the top outer wall of the fixed block (201), and a groove (303) is provided on the outer wall of the protrusion (302).

9. The molding apparatus for manufacturing digital-to-analog converter chips according to claim 8, characterized in that: The connecting plate (301) is fixedly connected to the movable end of the cylinder on the outer wall of the top plate (500), the connecting plate (301) is fixedly connected to the outer wall of the upper mold (600), the inclined rod (304) is slidably connected in the inner wall of the connecting plate (301) and the connecting block (2001), and the two ends of the connecting rod (306) are respectively hinged to the outer wall of the inclined rod (304) and the striking plate (307).

10. The molding apparatus for manufacturing digital-to-analog converter chips according to claim 8, characterized in that: One end of the telescopic spring (305) is fixedly connected to the outer wall of the inclined rod (304), and the other end of the telescopic spring (305) is fixedly connected to the inner wall of the connecting plate (301). The inclined rod (304) is engaged with the groove (303), and the striking plate (307) is slidably connected in the inner wall of the connecting plate (301).

Images