LED packaging structure and packaging method of patterned light conversion material

Abstract

The invention relates to the technical field of LED packaging, and particularly discloses an LED packaging structure of a patterned light conversion material, which comprises a substrate, a light reflecting layer, a fluorescent bonding layer, a light conversion layer, a light-emitting element and a lens layer, the light-emitting element is fixed on the surface of the substrate in an inverted manner, the light conversion layer is provided with a groove, the light conversion layer is buckled on the surface of the light-emitting element through one side with the groove, the light conversion layer and the light-emitting element are adhered and fixed through the fluorescent bonding layer, and the fluorescent bonding layer is filled in the groove. The light reflecting layer is fixed on the surface of the substrate and arranged on the periphery of the light-emitting element, and the lens layer is buckled on the surface of the substrate. The fluorescent bonding layer is filled into the groove of the light conversion layer, and the fluorescent bonding layer also participates in the light conversion process. According to the structure, light emitted by the light-emitting element can be in full contact with fluorescent substances in the light conversion layer and the fluorescent bonding layer.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of LED packaging, in particular to a LED packaging structure and packaging method of patterned light conversion material. BACKGROUND

[0002] In the field of LED lighting, the traditional LED packaging structure has many problems. For example, the fluorescent powder is directly coated on the surface of the light emitting element, which can easily cause uneven light color and affect the lighting effect. In addition, the organic fluorescent film used in the traditional packaging technology often has defects such as air holes, uneven thickness, etc., which can cause light decay or light failure phenomenon, thereby reducing the service life and brightness of the LED. Moreover, the traditional packaging structure is complex, the utilization rate of light conversion material is low, which causes waste of raw materials and high production cost, and is not conducive to high-yield production. Therefore, it is of great practical significance to develop a new type of LED packaging structure and packaging method. SUMMARY

[0003] In order to overcome the problems in the prior art, the purpose of the present application is to provide a LED packaging structure and packaging method of patterned light conversion material.

[0004] The technical scheme adopted by the present application to solve its technical problems is: a LED packaging structure of patterned light conversion material, comprising: a substrate, a light reflection layer, a fluorescent adhesive layer, a light conversion layer, a light emitting element, and a lens layer. The light emitting element is fixed in reverse on the surface of the substrate, the light conversion layer is provided with a groove, the light conversion layer is buckled on the surface of the light emitting element through the side with the groove, and the light conversion layer and the light emitting element are fixed and adhered by the fluorescent adhesive layer, the light reflection layer is fixed on the surface of the substrate and is arranged at the periphery of the light emitting element, and the fluorescent adhesive layer is filled into the groove, and the lens layer is buckled on the surface of the substrate.

[0005] The main working principle of the LED packaging structure of patterned light conversion material is: the LED packaging structure of patterned light conversion material comprises a substrate, a light reflection layer, a fluorescent adhesive layer, a light conversion layer, a light emitting element, and a lens layer. The light emitting element is fixed in reverse on the surface of the substrate, and the light reflection layer is fixed on the surface of the substrate and arranged at the periphery of the light emitting element. Its main role is to reflect the light scattered to the surrounding of the light emitting element, change the propagation direction of the light, make the light originally scattered to the side direction as much as possible to the direction of the lens layer, reduce the loss of light, improve the light extraction efficiency, and thereby enhance the light output intensity of the whole LED packaging structure.

[0006] The light conversion layer has grooves and is fastened to the surface of the light-emitting element via one side with the grooves. The light conversion layer contains fluorescent material. When blue light emitted by the light-emitting element strikes the light conversion layer, the fluorescent material emits light of different wavelengths, achieving color conversion. For example, if the light-emitting element emits blue light, the fluorescent material in the light conversion layer can partially or completely convert it into other colors such as yellow. By combining and proportioning different fluorescent materials, various colors of light output can be achieved to meet different lighting or display needs. The fluorescent adhesive layer not only serves to bond and fix the light conversion layer and the light-emitting element, ensuring the stability and reliability of the entire structure and preventing relative movement or separation between the light conversion layer and the light-emitting element; simultaneously, the fluorescent adhesive layer fills the grooves in the light conversion layer and also contains a certain amount of fluorescent material, which can participate in the light conversion process, assisting the light conversion layer to achieve more efficient and uniform light color conversion, thus improving the overall light conversion effect.

[0007] The lens layer is attached to the substrate surface and serves to converge and shape the light after it has been reflected by the light-reflecting layer and converted by the light-converting layer. The lens layer can be designed into different shapes according to design requirements, changing the propagation path of light through the principle of refraction, so that the light is emitted at a specific angle and distribution, thereby optimizing the optical performance of the LED packaging structure and meeting the requirements of light distribution and intensity for different application scenarios.

[0008] In summary, this LED packaging structure generates light through a light-emitting element, reduces light loss through a light-reflecting layer, achieves light color conversion through a light conversion layer, enhances structural stability and assists in light conversion through a fluorescent bonding layer, and finally focuses and shapes the light through a lens layer, working together to achieve efficient, stable light output with specific optical properties.

[0009] Preferably, the area of ​​the groove is smaller than the area of ​​the light-emitting element.

[0010] Preferably, the diameter of the groove is at least 10 μm smaller than the diameter of the light-emitting element.

[0011] Preferably, the depth of the groove is 1μm-50μm, and the opening diameter of the groove is 0.1mm-5mm.

[0012] Preferably, the light conversion layer and the fluorescent adhesive layer contain phosphor, which is one of yellow phosphor or green phosphor and red phosphor.

[0013] Preferably, the thickness of the substrate is 0.1mm-1.0mm, and the substrate is one of a ceramic substrate, a metal-based copper-clad laminate, or a glass substrate.

[0014] Preferably, the light-reflecting layer is silver paste, aluminum film, or TiO2 reflective coating.

[0015] A packaging method for an LED packaging structure using patterned light conversion material, for producing an LED packaging structure using any of the patterned light conversion materials described above, includes the following steps: S1. Provide a mold core, the molding surface of which is provided with preset patterned concave and convex dots, and prepare phosphor adhesive, light-emitting element, substrate, light-reflecting layer material, and lens layer material; wherein, the substrate thickness is 0.1mm-1.0mm, and the material is one of ceramic substrate, metal-based copper-clad laminate or glass substrate; the light-reflecting layer material is silver paste, aluminum film or TiO2 reflective coating; S2. Apply phosphor adhesive to the molding surface of the mold core by scraping, and control the scraping speed and force to ensure that the phosphor adhesive is coated evenly. Then, cure the material to form a light conversion layer material with a structure corresponding to the patterned bumps. The curing temperature and time are set according to the characteristics of the phosphor adhesive. S3. Perform a cutting operation along the middle position of the protrusions on the light conversion layer initial material, using high-precision cutting equipment to ensure accurate cutting, to obtain multiple light conversion layers with grooves, the groove depth being 1μm-50μm, the opening diameter being 0.1mm-5mm, and the groove diameter being at least 10μm smaller than the diameter of the light-emitting element; S4. Perform point testing on the light conversion layer, and based on the feedback of the point testing results, screen and classify the thickness of the light conversion layer in 5μm increments. S5. Apply a fluorescent adhesive layer containing different proportions of phosphor to the surface of the light-emitting element, and add YAG-based phosphor in proportions of 6%, 7%, and 8% of the total mass of the adhesive layer for grading. The phosphor is either green, yellow, or red. S6. The sorted light conversion layer is inverted and installed on the surface of the light-emitting element with the groove facing the light-emitting element. The corresponding proportion of phosphor adhesive layer is applied to the surface of the light-emitting element. Ensure that the light conversion layer and the light-emitting element are accurately centered and aligned. The phosphor adhesive layer is filled into the groove and applied evenly without air bubbles. S7. A light-reflecting layer is provided around the light-emitting element; S8. Attach the lens layer to the substrate surface to ensure that the lens layer and the underlying structure are tightly fitted without gaps, forming a complete encapsulated LED structure.

[0016] Preferably, in S6, the light conversion layer and the light-emitting element are accurately aligned in the center. The structure coated with the fluorescent adhesive layer is cured at 150°C for 60 minutes to complete the bonding of the light conversion layer and the light-emitting element.

[0017] Compared with the prior art, the beneficial effects of the present invention are: This invention utilizes a fluorescent adhesive layer filled into the grooves of the light conversion layer, with the fluorescent adhesive layer also participating in the light conversion process. This structure allows the light emitted by the light-emitting element to fully contact the fluorescent material in the light conversion layer and the fluorescent adhesive layer, achieving more efficient light color conversion. For example, to convert blue light into white light, by rationally designing the types and proportions of fluorescent materials in the light conversion layer and the fluorescent adhesive layer, white light output with high color purity, stable color coordinates, and excellent color rendering index can be obtained. Due to the tight adhesion between the light conversion layer and the light-emitting element and the uniform filling of the fluorescent adhesive layer, the light can be uniformly converted across the entire emission surface, avoiding problems such as local color deviation or uneven brightness. It also corrects the landing point deviation caused by differences in the thickness of the light conversion layer, achieving precise control of the color point landing point of a single LED chip. Furthermore, it optimizes the uniformity of side-emitting light, ensuring the color uniformity and brightness consistency of the emitted light from the LED packaging structure, meeting the high light quality requirements of high-end lighting and display applications. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This diagram illustrates the LED packaging structure of the patterned light conversion material and steps S5, S6, S7, and S8 of the packaging method for the LED packaging structure of the patterned light conversion material. Figure 2 S1 and S2 are the packaging methods for the LED packaging structure of the patterned light conversion material; Figure 3 S3 and S4 are the packaging methods for the LED packaging structure of the patterned light conversion material.

[0020] 1. Substrate; 2. Light-reflecting layer; 3. Fluorescent adhesive layer; 4. Light conversion layer; 40. Groove; 5. Light-emitting element; 6. Lens layer; 7. Mold core; 8. Squeegee; 9. Phosphor adhesive. Detailed Implementation

[0021] To better understand the above-mentioned objectives, features, and advantages of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. Many specific details are set forth in the following description to provide a thorough understanding of the present invention; the described embodiments are merely some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0023] Example 1 This embodiment discloses an LED packaging structure for patterned light conversion materials, such as... Figure 1 As shown, it includes a substrate 1, a light-reflecting layer 2, a fluorescent adhesive layer 3, a light-converting layer 4, a light-emitting element 5, and a lens layer 6. The light-emitting element 5 is flip-mounted and fixed on the surface of the substrate 1.

[0024] The light conversion layer 4 has a groove 40 and is fastened to the surface of the light-emitting element 5 via the side with the groove 40. The light conversion layer 4 contains fluorescent material. When the light-emitting element 5 emits blue light that shines on the light conversion layer 4, the fluorescent material emits light of different wavelengths, achieving color conversion. For example, if the light-emitting element 5 emits blue light, the fluorescent material in the light conversion layer 4 can partially or completely convert it into other colors such as yellow light. By combining and proportioning different fluorescent materials, multiple colors of light output can be achieved to meet different lighting or display needs. The fluorescent adhesive layer 3 not only serves to adhere and fix the light conversion layer 4 and the light-emitting element 5, ensuring the stability and reliability of the entire structure and preventing relative movement or separation between the light conversion layer 4 and the light-emitting element 5, but also fills the groove 40 of the light conversion layer 4, further enhancing the tightness of the connection between the light conversion layer 4 and the light-emitting element 5. Furthermore, the fluorescent adhesive layer 3 itself contains a certain amount of fluorescent material, which can participate in the light conversion process, assisting the light conversion layer 4 in achieving more efficient and uniform light color conversion, and improving the overall light conversion effect. The light-reflecting layer 2 is fixed to the surface of the substrate 1 and disposed around the light-emitting element 5. Its main function is to reflect the light emitted by the light-emitting element 5 in all directions, change the direction of light propagation, and direct the light that was originally scattered to the sides or other directions toward the lens layer 6 as much as possible, thereby reducing light loss, improving light emission efficiency, and thus enhancing the light output intensity of the entire LED packaging structure. Lens layer 6 is attached to the surface of substrate 1 and serves to converge and shape the light after it has been reflected by light reflection layer 2 and converted by light conversion layer 4. Lens layer 6 can be designed into different shapes according to design requirements, and changes the propagation path of light through the principle of refraction, so that the light is emitted at a specific angle and distribution, thereby optimizing the optical performance of the LED packaging structure and meeting the requirements of light distribution and intensity for different application scenarios.

[0025] In summary, this LED packaging structure generates light through the light-emitting element 5, reduces light loss through the light-reflecting layer 2, achieves light color conversion through the light conversion layer 4 and the fluorescent bonding layer 3, and finally focuses and shapes the light through the lens layer 6, working together to achieve efficient, stable light output with specific optical performance.

[0026] In some optional embodiments, the groove 40 is smaller than the light-emitting element 5, which ensures that the light conversion layer 4 is fastened to the surface of the light-emitting element 5, and that the edge of the light-emitting element 5 has sufficient contact area to adhere to the fluorescent adhesive layer 3, thus ensuring the stability and reliability of the encapsulation structure.

[0027] In some optional embodiments, the difference between the diameter of the groove 40 and the diameter of the light-emitting element 5 is specified to be at least 10 μm, further refining the dimensional relationship between the groove 40 and the light-emitting element 5. This dimensional design ensures that the light conversion layer 4 and the light-emitting element 5 have sufficient contact area to ensure that the fluorescent adhesive layer 3 can be fully filled and play its adhesive and light conversion auxiliary roles.

[0028] In some optional embodiments, the depth of the groove 40 is 1μm-50μm, and the opening diameter of the groove 40 is 0.1mm-5mm. Insufficient filling of the fluorescent adhesive layer 3 will prevent it from fully exerting its adhesive and light conversion auxiliary functions; excessive depth will increase the fabrication difficulty of the light conversion layer 4 and affect the connection stability between the light conversion layer 4 and the light-emitting element 5. The opening diameter range of 0.1mm-5mm takes into account the size of the light-emitting element 5 and the light conversion requirements. An opening diameter that is too small is not conducive to the filling of the fluorescent adhesive layer 3 and the uniform conversion of light; an opening diameter that is too large may affect the tightness of the connection between the light conversion layer 4 and the light-emitting element 5 and the stability of the overall structure.

[0029] In some optional embodiments, the light conversion layer 4 contains one of yellow, green, and red phosphors. The yellow phosphor is aluminate, Y3(Al,Ga)5O12:Ce, rare earth aluminate, Ga-YAG, rare earth aluminate, or β-Sialon; the green phosphor is GNYAG, LuAG, Ga-YAG, Y3(Al,Ga)5O12:Ce, aluminate, phosphosilicate, rare earth silicate, oxynitride, or silicon-based nitride; and the red phosphor is KSF, Nitride, nitride, silicon-based nitride, α-Sialon, or (SrCa)AlSiN3:Eu. By selecting appropriate phosphor types according to different application scenarios and light color requirements, the light conversion layer 4 can achieve efficient and accurate light color conversion.

[0030] In some optional embodiments, the thickness of substrate 1 is 0.1mm-1.0mm, and substrate 1 is one of ceramic substrate 1, metal-based copper-clad laminate, or glass substrate 1. The thickness range of 0.1mm-1.0mm is determined under the premise of ensuring that substrate 1 has sufficient mechanical strength and heat dissipation performance. If the thickness is too thin, the mechanical strength of substrate 1 is insufficient, and it is easy to deform or be damaged during use; if the thickness is too thick, it will increase the overall thickness of the packaging structure, which is not conducive to the miniaturization and thinning design of the product, and will also increase the material cost. Among them, ceramic substrate 1 has excellent insulation performance, thermal stability, and chemical stability, which can effectively dissipate heat, reduce the heat accumulation generated by the light-emitting element 5, and improve the reliability and service life of LED; metal-based copper-clad laminate combines the high thermal conductivity of metal substrate 1 and the high electrical conductivity of copper-clad laminate, which can quickly conduct heat away and provide good electrical connection performance, making it suitable for high-power LED packaging; glass substrate 1 has good transparency and optical performance, low light loss, and certain mechanical strength and thermal stability, and can be used in some LED packaging structures with high optical performance requirements.

[0031] In some optional embodiments, the light-reflecting layer 2 is silver paste, aluminum film, or TiO2 reflective coating. Silver has extremely high reflectivity; after silver paste is applied to the surface of substrate 1 to form the light-reflecting layer 2, it can reflect most of the light back, improving light extraction efficiency. Simultaneously, silver paste has good adhesion and conductivity, allowing it to bond well with substrate 1 and contributing to heat dissipation to some extent. Aluminum film has high reflectivity and good mechanical properties; by forming the aluminum film light-reflecting layer 2 on the surface of substrate 1 through processes such as evaporation and sputtering, it can effectively reflect light, and the aluminum film has uniform thickness, stable reflection effect, and relatively low cost. TiO2 has a high refractive index; when light shines on the TiO2 reflective coating, it will be reflected and scattered on the coating surface, thereby reflecting the light back into the encapsulation structure, improving light extraction efficiency. The TiO2 reflective coating also has good chemical stability and weather resistance, allowing for long-term use in various environments.

[0032] Example 2 A packaging method for an LED packaging structure using a patterned light conversion material, for producing an LED packaging structure using any of the aforementioned patterned light conversion materials, such as... Figures 1-3 As shown, it includes the following steps: S1. A mold core 7 is provided, the molding surface of which is provided with preset patterned recesses, and phosphor adhesive 9, light-emitting element 5, substrate 1, light-reflecting layer 2 material, and lens layer 6 material are prepared; wherein, the substrate 1 has a thickness of 0.1mm-1.0mm and is made of one of ceramic substrate 1, metal-based copper-clad laminate or glass substrate 1; the light-reflecting layer 2 material is silver paste, aluminum film or TiO2 reflective coating; S2. Apply the phosphor adhesive 9 to the molding surface of the mold core 7 using a scraper 8, controlling the scraping speed and pressure to ensure that the phosphor adhesive 9 is evenly coated. After curing, a light conversion layer 4 with a structure corresponding to the patterned bumps is formed. The curing temperature and time are set according to the characteristics of the phosphor adhesive 9. S3. Perform a cutting operation along the middle position of the protrusions on the light conversion layer 4. Use high-precision cutting equipment to ensure accurate cutting and obtain multiple light conversion layers 4 with grooves 40. The groove 40 has a depth of 1μm-50μm, an opening diameter of 0.1mm-5mm, and the diameter of the groove 40 is at least 10μm smaller than the diameter of the light-emitting element 5. S4. Perform point testing on the light conversion layer 4, and based on the feedback of the point testing results, screen and classify the thickness of the light conversion layer 4 in grading intervals of 5μm each. S5. Apply a fluorescent adhesive layer 3 containing different proportions of phosphor to the surface of the light-emitting element 5. Add phosphor in proportions of 6%, 7%, and 8% of the total mass of the adhesive layer for grading. The phosphor contains one of yellow, green, or red phosphor. The yellow phosphor is aluminate, Y3(Al,Ga)5O12:Ce, rare earth aluminate, Ga-YAG, rare earth aluminate, or β-Sialon; the green phosphor is GNYAG, LuAG, Ga-YAG, Y3(Al,Ga)5O12:Ce, aluminate, phosphosilicate, rare earth silicate, oxynitride, or silicon-based nitride; the red phosphor is KSF, Nitride, nitride, silicon-based nitride, α-Sialon, or (SrCa)AlSiN3:Eu. Selecting the appropriate phosphor type according to different application scenarios and light color requirements enables the light conversion layer 4 to achieve efficient and accurate light color conversion. S6. The sorted light conversion layer 4 is upside down and installed on the surface of the light-emitting element 5 with the groove 40 facing the light-emitting element 5 and the fluorescent adhesive layer 3 with the corresponding phosphor ratio is applied. Ensure that the light conversion layer 4 and the light-emitting element 5 are accurately centered and aligned, and that the fluorescent adhesive layer 3 is filled into the groove 40 and applied evenly without air bubbles. S7. A light-reflecting layer 2 is provided around the light-emitting element 5; S8. Attach the lens layer 6 to the surface of the substrate 1 to ensure that the lens layer 6 is tightly fitted with the underlying structure without gaps, forming a complete encapsulated LED structure.

[0033] During the solidification process of the phosphor adhesive 9, due to its material properties, the phosphor adhesive 9 tends to agglomerate towards the center, resulting in a thicker center compared to the sides, causing uneven thickness. If light conversion layers 4 of varying thicknesses are installed onto the light-emitting element 5, it will affect the overall luminous quality. To solve this problem, this solution involves separating the initial material and then classifying the thickness of the light conversion layer 4 into 5μm intervals. Different proportions of phosphor adhesive layer 3 are used to bond the light conversion layers 4 according to their thickness, thereby offsetting the uneven luminous quality caused by different thicknesses and improving the overall luminous quality.

[0034] In some optional embodiments, in S6, the light conversion layer 4 and the light-emitting element 5 are accurately aligned in the center, and the structure coated with the fluorescent adhesive layer 3 is cured at 150°C for 60 minutes to complete the bonding of the light conversion layer 4 and the light-emitting element 5.

[0035] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Therefore, any modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. An LED packaging structure for a patterned light conversion material, characterized in that, include: Substrate, light-reflecting layer, fluorescent adhesive layer, light-converting layer, light-emitting element, lens layer; The light-emitting element is flip-mounted and fixed on the surface of the substrate. The light conversion layer has a groove. The light conversion layer is fastened to the surface of the light-emitting element through the side with the groove. The light conversion layer and the light-emitting element are bonded and fixed by the fluorescent adhesive layer. The light reflection layer is fixed on the surface of the substrate and disposed around the light-emitting element. The fluorescent adhesive layer fills the groove. The lens layer is fastened to the surface of the substrate.

2. The LED packaging structure of the patterned light conversion material according to claim 1, characterized in that, The area of ​​the groove is smaller than the area of ​​the light-emitting element.

3. The LED packaging structure of the patterned light conversion material according to claim 2, characterized in that, The diameter of the groove is at least 10 μm smaller than the diameter of the light-emitting element.

4. The LED packaging structure of the patterned light conversion material according to claim 2, characterized in that, The groove has a depth of 1μm-50μm and an opening diameter of 0.1mm-5mm.

5. The LED packaging structure of the patterned light conversion material according to claim 1, characterized in that, The light conversion layer contains phosphor, which is one of yellow, green, or red phosphor.

6. The LED packaging structure of the patterned light conversion material according to claim 1, characterized in that, The thickness of the substrate is 0.1mm-1.0mm, and the substrate is one of a ceramic substrate, a metal-based copper-clad laminate, or a glass substrate.

7. The LED packaging structure of the patterned light conversion material according to claim 1, characterized in that, The light-reflecting layer is silver paste, aluminum film, or TiO2 reflective coating.

8. A packaging method for an LED packaging structure of a patterned light conversion material, used to produce an LED packaging structure of the patterned light conversion material according to any one of claims 1-7, characterized in that, Includes the following steps: S1. Provide a mold core, the molding surface of which is provided with preset patterned dimples, and prepare phosphor adhesive, light-emitting element, substrate, light reflective layer material, and lens layer material; wherein, the substrate thickness is 0.1mm-1.0mm, and the material is one of ceramic substrate, metal-based copper-clad laminate or glass substrate; the light reflective layer material is silver paste, aluminum film or TiO2 reflective coating. S2. Apply phosphor adhesive to the molding surface of the mold core by scraping, and control the scraping speed and force to ensure that the phosphor adhesive is coated evenly. Then, cure the material to form a light conversion layer material with a structure corresponding to the patterned bumps. The curing temperature and time are set according to the characteristics of the phosphor adhesive. S3. Perform a cutting operation along the middle position of the protrusions on the light conversion layer initial material, using high-precision cutting equipment to ensure accurate cutting, to obtain multiple light conversion layers with grooves, the groove depth being 1μm-50μm, the opening diameter being 0.1mm-5mm, and the groove diameter being at least 10μm smaller than the diameter of the light-emitting element; S4. Perform point testing on the light conversion layer, and based on the feedback of the point testing results, screen and classify the thickness of the light conversion layer in 5μm increments. S5. Apply a fluorescent adhesive layer containing different proportions of phosphor to the surface of the light-emitting element, and add YAG-based phosphor in proportions of 6%, 7%, and 8% of the total mass of the adhesive layer for grading. The phosphor is either green, yellow, or red. S6. The sorted light conversion layer is inverted and installed on the surface of the light-emitting element with the groove facing the light-emitting element. The corresponding proportion of phosphor adhesive layer is applied to the surface of the light-emitting element. Ensure that the light conversion layer and the light-emitting element are accurately centered and aligned. The phosphor adhesive layer is filled into the groove and applied evenly without air bubbles. S7. A light-reflecting layer is provided around the light-emitting element; S8. Attach the lens layer to the substrate surface to ensure that the lens layer and the underlying structure are tightly fitted without gaps, forming a complete encapsulated LED structure.

9. The packaging method for the LED packaging structure of the patterned light conversion material according to claim 8, characterized in that, In step S6, the light conversion layer and the light-emitting element are accurately aligned in the center. The structure coated with the fluorescent adhesive layer is cured at 150°C for 60 minutes to complete the bonding of the light conversion layer and the light-emitting element.

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