Substrate centering device and substrate centering method

Abstract

The invention provides a substrate centering device, which is used for centering a square substrate, and comprises two centering operation assemblies which respectively act on two vertex angles of the substrate in a preselected diagonal direction; each centering operation assembly comprises a first arm and a second arm which are parallel to each other, and the two centering operation assemblies are configured as follows: one centering operation assembly firstly moves linearly to a target position to act on one vertex angle of the preselected diagonal line; the other centering operation assembly linearly moves to a target position to act on the other vertex angle of the pre-selected diagonal line, so that the center of the substrate is overlapped with the rotating center of the substrate; each centering operation assembly takes an intersection point from an extension line of the first arm and an extension line of the second arm to two sides of a corresponding vertex angle of the substrate at a preset position as a target position, and the two centering operation assemblies act on two vertex angles in a pre-selected diagonal direction of the substrate so as to correct the position of the substrate; the position of the substrate is accurately and quickly positioned.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of semiconductor, and relates to a substrate centering device and a substrate centering method. BACKGROUND

[0002] In a substrate processing process, the substrate needs to be accurately positioned before the process of the substrate can be facilitated. For example, when the substrate is subjected to edge cleaning, the substrate is accurately positioned, and the position of the nozzle spraying chemical liquid relative to the substrate can be accurately controlled. If the substrate is not positioned accurately, when the substrate is rotated, the position of the nozzle spraying chemical liquid relative to the substrate is not accurate, which affects the edge cleaning effect of the substrate, such as uneven edge cleaning width, etc. Before the substrate is subjected to other process treatments, the substrate also needs to be positioned first. Therefore, accurately positioning the substrate has become one of the technical problems to be solved by those skilled in the art.

[0003] Therefore, in view of the problems existing in the prior art, the present application is designed by the inventor with years of experience in this field, and actively studies and improves, thus the substrate centering device and the substrate centering method are provided. SUMMARY

[0004] In view of the above-mentioned shortcomings of the prior art, the purpose of the present application is to provide a substrate centering device and a substrate centering method to solve the problem of inaccurate positioning of the substrate in the prior art.

[0005] To achieve the above-mentioned purposes and other related purposes, the present application provides a substrate centering device for square substrate centering operation, comprising:

[0006] a substrate holding member for holding and rotating the substrate;

[0007] two centering operation assemblies acting on two top corners in a preselected diagonal direction of the substrate, respectively;

[0008] Each centering operation assembly comprises a first arm and a second arm parallel to each other, and the first arm and the second arm of each centering operation assembly make linear motion on both sides of a middle parallel line determined by the first arm and the second arm, so that each centering operation assembly acts on the corresponding top corner in the preselected diagonal direction of the two top corners, and the middle parallel line passes through the rotation center of the substrate.

[0009] The two centering operation components are configured such that one centering operation component first moves in a straight line to the target position to act on one apex of the preselected diagonal, and the other centering operation component then moves in a straight line to the target position to act on the other apex of the preselected diagonal, so that the center of the substrate coincides with the rotation center of the substrate. Each centering operation component determines the target position by the intersection of the extension lines of the first arm and the extension lines of the second arm to the two sides of the corresponding apex of the substrate at the preset position.

[0010] Optionally, the intersection point does not exceed the midpoint of the edge of the substrate to which the corresponding arm acts.

[0011] Optionally, the end of the first arm is provided with a first roller for contacting the substrate, and the end of the second arm is provided with a second roller for contacting the substrate. The first roller and the second roller are configured to maintain contact with the substrate and rotate synchronously when they contact the substrate and displace the substrate.

[0012] Optionally, the length of the first arm is configured according to the stroke of the first roller, and the length of the second arm is configured according to the stroke of the second roller.

[0013] Optionally, at the target position of the centering operation component, the distance Y1 between the end of the first arm and the corresponding apex angle in the linear movement direction of the first arm and the distance Y2 between the end of the second arm and the corresponding apex angle in the linear movement direction of the second arm satisfy the following formula:

[0014]

[0015] Wherein, the side of the first arm that acts on the substrate is called the first side, the side of the second arm that acts on the substrate is called the second side, a is the side length of the first side, b is the side length of the second side, and L is the distance between the first arm and the second arm.

[0016] Optionally, the arm length L1 of the first arm and the arm length L2 of the second arm satisfy the following formula:

[0017]

[0018] Where R is the radius of the first roller and the second roller.

[0019] Optionally, each of the centering operation components further includes a support portion for supporting the first arm and the second arm, and a drive portion for driving the support portion to translate so that the first arm and the second arm move linearly.

[0020] Optionally, each of the centering operation components further includes a flexible protective cover for protecting the drive unit, the flexible protective cover extending along the translational direction of the support unit so that the flexible protective cover extends and retracts synchronously when the support unit translates.

[0021] Optionally, the length of the side of the first arm acting on the substrate is a, and the length of the side of the second arm acting on the substrate is b. If a = b, the lengths of the first arm and the second arm are configured to be equal; if a > b, the length of the first arm is configured to be greater than the length of the second arm; if a < b, the length of the first arm is configured to be less than the length of the second arm.

[0022] To achieve the above and other related objectives, this application also provides a substrate alignment method applicable to a substrate alignment apparatus. The substrate alignment apparatus includes a substrate holding member for holding and rotating the substrate, and two alignment operation components acting on two vertices in a preselected diagonal direction of the substrate. Each alignment operation component includes a first arm and a second arm that are parallel to each other. The method includes:

[0023] A centering operation component moves linearly to a target position to act on a vertices in a preselected diagonal direction of the substrate;

[0024] Another centering operation component moves linearly to the target position to act on another apex in the preselected diagonal direction, so that the center of the substrate coincides with the rotation center of the substrate;

[0025] Each centering operation component has its first and second arms, which are parallel to each other, moving in a straight line along both sides of a middle parallel line defined by the first and second arms, so that each centering operation component acts on the corresponding vertex of the two vertexes in the pre-selected diagonal direction. The middle parallel line passes through the rotation center of the substrate. Each centering operation component determines the target position by the intersection of the extension lines of the first and second arms to the corresponding vertex of the substrate located at the preset position.

[0026] Optionally, the intersection point does not exceed the midpoint of the edge of the substrate to which each arm acts.

[0027] Optionally, the end of the first arm is provided with a first roller for contacting the substrate, and the end of the second arm is provided with a second roller for contacting the substrate. The method further includes maintaining the first roller and the second roller in contact with the substrate and rotating synchronously when the first roller and the second roller contact the substrate and displace the substrate.

[0028] Optionally, the length of the first arm is configured according to the stroke of the first roller, and the length of the second arm is configured according to the stroke of the second roller.

[0029] Optionally, at the target position of the centering operation component, the distance Y1 between the end of the first arm and the corresponding apex angle in the linear movement direction of the first arm and the distance Y2 between the end of the second arm and the corresponding apex angle in the linear movement direction of the second arm satisfy the following formula:

[0030]

[0031] Wherein, the side of the first arm that acts on the substrate is called the first side, the side of the second arm that acts on the substrate is called the second side, a is the side length of the first side, b is the side length of the second side, and L is the distance between the first arm and the second arm.

[0032] Optionally, the arm length L1 of the first arm and the arm length L2 of the second arm satisfy the following formula:

[0033]

[0034] Where R is the radius of the first roller and the second roller.

[0035] As described above, in the substrate alignment device and substrate alignment method of the present invention, two alignment operation components act on the two vertices of the pre-selected diagonal direction of the substrate to correct the position of the substrate. The alignment operation of the four sides of the substrate is completed by each of the two alignment operation components translating once, which simplifies the substrate alignment operation process and moves the substrate accurately to the alignment position. Attached Figure Description

[0036] Figure 1 This is a schematic diagram of the substrate alignment device in an embodiment of the present invention when it is not aligned.

[0037] Figure 2 This is a schematic diagram showing the state of the substrate alignment device and the substrate when the alignment operation is completed in one embodiment of the present invention.

[0038] Figure 3 This is a schematic diagram of the centering operation component in one embodiment of the present invention.

[0039] Figure 4 For the present invention Figure 3 Detailed diagram of the Chinese embodiment.

[0040] Figure 5 This is a schematic diagram of the centering operation of two centering operation components in the prior art. Detailed Implementation

[0041] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0042] In the detailed description of embodiments of the present invention, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged and not to scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. In actual fabrication, the three-dimensional spatial dimensions of length, width, and depth should be included.

[0043] For ease of description, spatial relation terms such as “below,” “under,” “lower,” “below,” “below,” “above,” “upper,” and “above” may be used herein to describe the relationship between an element or feature shown in the accompanying drawings and other elements or features. It will be understood that these spatial relation terms are intended to include directions other than those depicted in the drawings for devices in use or operation. Furthermore, when a layer is referred to as being “between” two layers, it can be the only layer between the two layers, or there may be one or more layers in between. The phrase “between” as used herein includes both endpoint values.

[0044] In the context of this application, the structure described above the first feature may include embodiments in which the first and second features are formed in direct contact, or embodiments in which additional features are formed between the first and second features, such that the first and second features may not be in direct contact.

[0045] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the present invention. Therefore, the illustrations only show components related to the present invention and are not drawn according to the actual number, shape, and size of components in implementation. In actual implementation, the type, quantity, and proportion of each component can be arbitrarily changed, and the component layout may be more complex. The substrate alignment device and substrate alignment method described below are used for the operation of substrates in the field of semiconductor wafers or flat panel displays (FPDs).

[0046] refer to Figure 1As shown, the substrate alignment device includes two alignment operation components 1 that perform alignment operations on the substrate W, and a substrate holding member 3 that holds and rotates the substrate W. In this application, the substrate W is square or rectangular. The alignment operation in this application involves the two alignment operation components 1 correcting the position of the substrate W so that the center o of the substrate coincides with the rotation center o' of the substrate W. At this point, the substrate is in the aligned position. Before processing the substrate, the substrate W needs to be positioned so that its center o coincides with its rotation center o' to ensure accurate positioning of the substrate W during rotation. The substrate holding member 3 drives the substrate W to rotate around an axis passing through the rotation center o'.

[0047] Reference Figure 3 and combined Figure 1 The centering operation assembly 1 includes two parallel arms 13, a support portion 12 for supporting the two arms 13, and a drive portion 11 for translating the support portion 12 to translate the two arms 13. Each arm 13 has a roller 14 at its end for contacting the substrate W. When the two centering operation assemblies 1 are used to perform a centering operation on the substrate W, the substrate W is displaced, and the roller 14 in contact with the substrate W rotates synchronously to prevent damage caused by friction between the centering operation assembly 1 and the edge of the substrate W. The roller 14 is preferably made of a material that is not easily deformed and free of impurities such as metal, such as ceramic. The drive portion 11 includes a power unit (not shown) that provides power to the support portion 12 and a horizontal slide rail (not shown) for guiding the support portion 12 to slide horizontally. The support portion 12 slides along the horizontal slide rail so that the two arms 13 connected to the support portion 12 are simultaneously driven to slide towards or away from the substrate W. The power unit can be an electric cylinder, a pneumatic cylinder, a motor, etc. The centering operation component 1 also includes a flexible protective cover 15 disposed above the drive unit 11 to protect the drive unit 11. Both ends of the flexible protective cover 15 are fixed, and the support unit 12 extends outward from the drive unit 11 and passes through the flexible protective cover 15. Specifically, the flexible protective cover 15 extends along the translational direction of the support unit 12, so that the flexible protective cover 15 synchronously extends and retracts when the support unit 12 is driven to translate by the power unit. The drive unit 11 can be disposed outside or inside the process cavity 2. Preferably, the drive unit 11 can be disposed outside the process cavity 2 for convenient later inspection and maintenance. In this preferred embodiment, the process cavity 2 has an opening of a certain length so that the support unit 12 passes through the opening and moves linearly along the extension direction of the opening. The flexible protective cover 15 can prevent the drive unit 11 from being corroded by the raw materials used to process the substrate W inside the process cavity 2. For example, the raw materials containing dilute sulfuric acid may corrode the drive unit 11.

[0048] like Figure 1As shown, the two arms 13 of the centering operation component 1 move linearly along the middle parallel line D defined by the two arms 13 and act on one of the two vertices of the substrate W in the pre-selected diagonal direction. Specifically, the two arms move linearly along their respective extension directions indicated by D1 and D2, where the first arm 131 extends in the direction of D2 and the second arm 132 extends in the direction of D1. The middle parallel line between the first arm 131 and the second arm 132 is indicated by the mark D. The middle parallel line D passes through the rotation center o' of the substrate. Through the centering operation of the centering operation component 1, the center o of the substrate coincides with the rotation center o' of the substrate. The two centering operation components 1 are used to operate the two vertices of the pre-selected diagonal direction of the substrate W. Each centering operation component 1 is used to contact the two sides of the corresponding vertices to move the substrate W so that the center o of the substrate coincides with the rotation center o' of the substrate. One centering operation component 1 acts on the two sides of one vertices, and the other centering operation component 1 acts on the two sides of the other vertices. Since the two vertices being acted upon are located on the same diagonal, the centering operation of the four sides of the substrate is completed by each of the two centering operation components 1 translating once, thus avoiding the following: Figure 5 As shown, after aligning one set of opposite edges of the substrate W by translating once, the two alignment operation components 1 need to translate once more to align the other set of opposite edges. Therefore, it can be seen that using the substrate alignment device and method of this application simplifies the substrate alignment process. The alignment operation performed by the two alignment operation components 1 on the substrate W is as follows: one alignment operation component 1 moves linearly towards the substrate W to a target position, and the other alignment operation component 1 then moves linearly towards the substrate W to the target position to correct the position of the substrate W, so that when the substrate moves to the preset position, the center of the substrate coincides with the center of rotation of the substrate. The two alignment operation components act on the two vertices of a pre-selected diagonal direction, and the target position of the alignment operation component is determined by the relative position of the corresponding vertices of the pre-selected diagonal direction when the alignment operation component and the substrate are in the preset position, thus realizing the substrate alignment operation. The target position of each alignment operation component 1 will be described in detail below. It should be understood that if the side lengths of two adjacent sides of the same substrate are different, the position of each vertex of the substrate relative to the centering operation component 1 will also be different. Therefore, the target position of the centering operation component needs to be determined according to the two vertexes of the pre-selected diagonal direction of the substrate, and the centering operation can only be achieved by acting on the two vertexes of the pre-selected diagonal direction.

[0049] like Figure 2As shown, after the two centering operation components 1 center the substrate W, the substrate W is moved to a preset centering position. At this time, the two rollers 141 and 142 of each centering operation component 1 are clamped on both sides of the corresponding apex corner of the substrate W. Each centering operation component 1 includes a first arm 131, a second arm 132, a first roller 141 located at the end of the first arm 131 and acting on side a of the substrate, and a second roller 142 located at the end of the second arm 132 and acting on side b of the substrate. During the centering operation, one centering operation component first moves linearly to the target position to act on one apex corner of the pre-selected diagonal, and the other centering operation component then moves linearly to the target position to act on the other apex corner of the pre-selected diagonal, so that the center of the substrate coincides with the rotation center of the substrate. The target position of each centering operation component is the intersection of the two sides of the corresponding apex corner when the extension lines of the first arm and the second arm reach the preset position of the substrate. A specific example is given using one of the centering operation components as an illustration. Figure 4 As shown, after the centering operation component moves to the target position and performs centering operation on the substrate, the substrate has been moved to the preset centering position. At this time, the target position of the first arm 131 is determined by the intersection point a1 of the extension line 131a of the first arm 131 and the side a of the substrate, and the target position of the second arm 132 is determined by the intersection point b1 of the extension line 132b of the second arm 132 and the side b of the substrate, thus finally determining the target position of the centering operation component. When the first arm 131 and the second arm 132 are in the target position, the linear movement direction of the first arm 131 and the second arm 132 (refer to...) Figure 1 The distances between the ends of the first arm 131 and the second arm 132 and the apex of the substrate W are Y2 and Y1, respectively. The length of side a (the first side) is a, the length of side b (the second side) is b, and the angle between side b and the pre-selected diagonal when the substrate is in a preset position is θ. The radii of both the first roller 141 and the second roller 142 are R. The distance between the first arm 131 and the second arm 132 is L, and the distance between the first arm 131 and the second arm 132 and the intermediate parallel line D is L / 2. Therefore, we obtain...

[0050] Y1*tanθ+R / cosθ=L / 2

[0051] So,

[0052] Y1=(L / 2-R / cosθ) / tanθ

[0053] Combining trigonometric functions tanθ = a / b is calculated to obtain the result.

[0054]

[0055] Similarly,

[0056]

[0057] Therefore, we obtain

[0058]

[0059] Transforming the above two equations respectively yields

[0060]

[0061] Subtracting the corresponding sides of the two equations obtained above, we get...

[0062] 2aY1-2bY2=bL-aL

[0063] The distances Y2 and Y1 between the ends of the first arm 131 and the second arm 132 and the apex of the substrate W are found to be related by the following equation.

[0064]

[0065] From the relationship between Y1 and Y2 above, if the two sides a and b of the substrate are equal, then Y2 = Y1; if a > b, then Y2 > Y1; if a < b, then Y2 < Y1. The arm lengths of the first arm 131 and the second arm 132 can be configured according to the stroke of the first roller 141 and the second roller 142. To prevent the substrate W from interfering with the centering operation component 1 during transfer to the process cavity 2 or during rotation, the centering operation component 1 retracts to a position outside the maximum range of motion of the apex corner of the substrate W when the substrate centering operation is completed or not. Therefore, the arm length L1 of the first arm 131 is configured such that, in addition to the distance R + Y2 from the position where the first roller 141 contacts the substrate at the substrate centering position to the vertex A corresponding to the affected apex corner of the substrate, the distance from the outside of the corresponding vertex along the D1 direction to the corresponding vertex A is also added. Therefore, the arm length L1 of the first arm 131 is greater than or equal to R + Y2. Similarly, the arm length L2 of the second arm 132 is configured to be greater than or equal to R+Y1. Exemplarily, in some embodiments, to protect the alignment operation component 1, the alignment operation component 1 can be moved outside the process cavity 2 after the substrate alignment operation is completed or before the alignment operation. Therefore, based on the stroke of the first roller 141 and the second roller 142, as... Figure 4In this process, the lengths of the first arm 131 and the second arm 132 need to be increased by the length S0 from the substrate vertex A to the outside of the process cavity 2. That is, at this point, the arm lengths L1 and L2 of the first arm 131 and the second arm 132 are R+Y2+S0 and R+Y1+S0, respectively. Therefore, comparing the arm lengths L1 and L2 of the first arm 131 and the second arm 132 is equivalent to comparing Y2 and Y1. Thus, if the two sides a and b of the substrate are equal, then the arm lengths of the first arm 131 and the second arm 132 are equal; if a>b, then the arm length L1 of the first arm 131 is greater than the arm length L2 of the second arm 132; if a<b, then the arm length L1 of the first arm 131 is less than the arm length L2 of the second arm 132.

[0066] Similarly, in another centering operation component 1, the first arm 131 and the first roller 141 act on the side (first side), and the second arm 132 and the second roller 142 act on the b side (second side). The arm length is set in the same way as the centering operation component mentioned above, and will not be repeated here.

[0067] In summary, from another perspective, the substrate alignment method includes the following steps:

[0068] (1) A centering operation component moves linearly to the target position to act on a vertex of the diagonal opposite to the substrate;

[0069] (2) Another centering operation component moves in a straight line to the target position to act on the other apex of the corresponding diagonal so that the center of the substrate coincides with the rotation center of the substrate. The first arm and the second arm of each centering operation component move in a straight line along the two sides of the middle parallel line determined by the first arm and the second arm, so that each centering operation component acts on the apex corresponding to the preselected diagonal of the substrate. The middle parallel line passes through the rotation center of the substrate. Each centering operation component determines the target position by the intersection of the two sides of the apex corresponding to the preset position of the substrate when the extension line of the first arm and the extension line of the second arm reach the preset position of the substrate.

[0070] In step (2), as Figure 4As shown, the substrate is in a preset alignment position. Taking one alignment operation component as an example, the target position of the first arm 131 is determined based on the position of the intersection point a1 of the extension line 131a of the first arm 131 and side a (first side) relative to the first arm 131. Similarly, the target position of the second arm 132 is determined based on the position of the intersection point b1 of the extension line 131b of the second arm 131 and side b (second side) relative to the second arm 132. This yields the target position of one alignment operation component. The target position setting for the other alignment operation component is the same as described above and will not be repeated here. Preferably, to avoid excessive distance between the first arm 131 and the second arm 132, which would increase the space occupied by the alignment operation component, the intersection point a1 does not exceed the midpoint of side a, and the intersection point b1 does not exceed the midpoint of side b.

[0071] Further details of this method embodiment can be found in the preceding description of the substrate alignment device, and will not be elaborated upon here.

[0072] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A substrate alignment device for aligning square substrates, characterized in that, include: A substrate holder for holding and rotating the substrate; Two centering operation components act on the two vertices of the preselected diagonal direction of the substrate, respectively; Each centering operation component includes a first arm and a second arm that are parallel to each other. The first arm and the second arm of each centering operation component move in a straight line along both sides of the middle parallel line determined by the first arm and the second arm, so that each centering operation component acts on the corresponding vertex of the two vertexes in the preselected diagonal direction. The middle parallel line passes through the rotation center of the substrate. The two centering operation components are configured such that one centering operation component first moves in a straight line to the target position to act on one apex of the preselected diagonal, and the other centering operation component then moves in a straight line to the target position to act on the other apex of the preselected diagonal, so that the center of the substrate coincides with the rotation center of the substrate. Each centering operation component determines the target position by the intersection of the extension lines of the first arm and the extension lines of the second arm to the two sides of the corresponding apex of the substrate at the preset position.

2. The substrate alignment device according to claim 1, characterized in that, The intersection point does not exceed the midpoint of the edge of the substrate to which the corresponding arm acts.

3. The substrate alignment device according to claim 1, characterized in that, The first arm has a first roller at its end for contacting the substrate, and the second arm has a second roller at its end for contacting the substrate. The first roller and the second roller are configured to remain in contact with the substrate and rotate synchronously when they contact the substrate and cause the substrate to move.

4. The substrate alignment device according to claim 3, characterized in that, The length of the first arm is configured according to the stroke of the first roller, and the length of the second arm is configured according to the stroke of the second roller.

5. The substrate alignment device according to claim 3, characterized in that, At the target position of the centering operation component, the distance Y1 between the end of the first arm and the corresponding apex angle in the linear movement direction of the first arm and the distance Y2 between the end of the second arm and the corresponding apex angle in the linear movement direction of the second arm satisfy the following formula: Wherein, the side of the first arm that acts on the substrate is called the first side, the side of the second arm that acts on the substrate is called the second side, a is the side length of the first side, b is the side length of the second side, and L is the distance between the first arm and the second arm.

6. The substrate alignment device according to claim 5, characterized in that, The length L1 of the first arm and the length L2 of the second arm satisfy the following formula: Where R is the radius of the first roller and the second roller.

7. The substrate alignment device according to claim 1, characterized in that, Each of the centering operation components further includes a support portion for supporting the first arm and the second arm, and a drive portion for driving the support portion to translate so that the first arm and the second arm move linearly.

8. The substrate alignment device according to claim 7, characterized in that, Each of the centering operation components also includes a flexible protective cover for protecting the drive unit, the flexible protective cover extending along the translational direction of the support unit so that the flexible protective cover extends and retracts synchronously when the support unit translates.

9. The substrate alignment device according to claim 1, characterized in that, The length of the side of the first arm acting on the substrate is a, and the length of the side of the second arm acting on the substrate is b. If a = b, the lengths of the first arm and the second arm are configured to be equal; if a > b, the length of the first arm is configured to be greater than the length of the second arm. If a < b, the length of the first arm is configured to be shorter than the length of the second arm.

10. A substrate alignment method, applicable to a substrate alignment apparatus, the substrate alignment apparatus comprising a substrate holding member for holding and rotating the substrate, and two alignment operation components acting on two vertex corners respectively in a preselected diagonal direction of the substrate, wherein, Each centering operation component includes a first arm and a second arm that are parallel to each other, characterized in that the method includes: A centering operation component moves linearly to a target position to act on a vertices in a preselected diagonal direction of the substrate; Another centering operation component moves linearly to the target position to act on another apex in the preselected diagonal direction, so that the center of the substrate coincides with the rotation center of the substrate; Each centering operation component has its first and second arms, which are parallel to each other, moving in a straight line along both sides of a middle parallel line defined by the first and second arms, so that each centering operation component acts on the corresponding vertex of the two vertexes in the pre-selected diagonal direction. The middle parallel line passes through the rotation center of the substrate. Each centering operation component determines the target position by the intersection of the extension lines of the first and second arms to the corresponding vertex of the substrate located at the preset position.

11. The substrate alignment method according to claim 10, characterized in that, The intersection point does not exceed the midpoint of the edge of the substrate to which each arm acts.

12. The substrate alignment method according to claim 10, characterized in that, The first arm has a first roller at its end for contacting the substrate, and the second arm has a second roller at its end for contacting the substrate. The method further includes maintaining the first roller and the second roller in contact with the substrate and rotating synchronously when the first roller and the second roller contact the substrate and displace the substrate.

13. The substrate alignment method according to claim 12, characterized in that, The length of the first arm is configured according to the stroke of the first roller, and the length of the second arm is configured according to the stroke of the second roller.

14. The substrate alignment method according to claim 12, characterized in that, At the target position of the centering operation component, the distance Y1 between the end of the first arm and the corresponding apex angle in the linear movement direction of the first arm and the distance Y2 between the end of the second arm and the corresponding apex angle in the linear movement direction of the second arm satisfy the following formula: Wherein, the side of the first arm that acts on the substrate is called the first side, the side of the second arm that acts on the substrate is called the second side, a is the side length of the first side, b is the side length of the second side, and L is the distance between the first arm and the second arm.

15. The substrate alignment method according to claim 14, characterized in that, The length L1 of the first arm and the length L2 of the second arm satisfy the following formula: Where R is the radius of the first roller and the second roller.

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