X-ray detector

Abstract

The present invention provides an X-ray detector including: a sensor assembly including a sensor substrate, a phosphor layer or a photoelectric substance layer disposed on a front surface of the sensor substrate; a first waterproof film coating the sensor assembly; and a second waterproof film which coats the first waterproof film and is formed of a material different from that of the first waterproof film.

Description

TECHNICAL FIELD

[0001] The present application relates to an X-ray detector. BACKGROUND

[0002] Recently, a digital detector is widely used for X-ray photography.

[0003] When moisture or oil penetrates into the inside of an X-ray detector, the performance of the X-ray detector can be degraded. In order to prevent such performance degradation, a sealing structure is applied, but the existing sealing structure has a problem in that the waterproof or oil-proof effect is insufficient. SUMMARY

[0004] TECHNICAL PROBLEM The technical problem of the present application is to provide an X-ray detector having a sealing structure capable of effectively preventing moisture or oil from penetrating.

[0005] TECHNICAL SOLUTION In order to achieve the technical problem as described above, the present application provides an X-ray detector including a sensor assembly including a sensor substrate, a phosphor layer or a photoelectric substance layer disposed at a front surface of the sensor substrate, a first waterproof film coating the sensor assembly, and a second waterproof film coating the first waterproof film and formed of a different material from the first waterproof film.

[0006] The first waterproof film can surround the entire sensor assembly, and the second waterproof film can cover the front of the first waterproof film.

[0007] Further, an upper electrode can be formed below the phosphor layer or on the photoelectric substance layer, and the upper electrode can extend to the outside of the phosphor layer or the outside of the photoelectric substance layer.

[0008] One of the first waterproof film and the second waterproof film can be formed of parylene, and the other of the first waterproof film and the second waterproof film can be formed of silicon resin or epoxy resin.

[0009] One of the first waterproof film and the second waterproof film formed of parylene can be configured as a single layer film of parylene C or as a double layer film of parylene N and parylene C.

[0010] Further, a sealant can cover the phosphor layer or the photoelectric substance layer.

[0011] The sealant can be a common upper electrode made of a metal material and applying a bias voltage to the photoelectric substance layer.

[0012] An electromagnetic wave shielding sheet can be further included, which is attached along a surface of the encapsulant and the sensor assembly.

[0013] A protective cover can be further included, which is a housing space in which the sensor assembly coated with the first waterproof film and the second waterproof film is inserted, and is formed of a waterproof material, and a filler, which fills the housing space in which the sensor assembly is inserted, and is formed of a waterproof material.

[0014] A housing can be further included, which includes a first housing and a second housing that define an inner space in which the protective cover in which the sensor assembly is inserted is inserted, and a bonding agent that bonds the first housing and the second housing.

[0015] Inventive Effects According to the present application, a phosphor layer or a photoelectric substance layer, which is vulnerable to moisture, can be surrounded and tightly sealed by a plurality of sealing members, and in particular, after a detector module in a state sealed by the sealing members is disposed in a protective cover, sealing is performed by filling with a filler.

[0016] As described above, since the X-ray detector is equipped with a sealing structure that can substantially completely and firmly seal a phosphor layer or a photoelectric substance layer, it is possible to prevent moisture or oil from penetrating into the phosphor layer or the photoelectric substance layer at a very high level.

[0017] Therefore, it is possible to prevent defects caused by penetration of moisture or oil at the time of manufacturing, thereby maximizing the yield. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 FIG. 1 is a cross-sectional view schematically showing a configuration of an X-ray detector according to a first embodiment of the present application.

[0019] Figure 2 FIG. 2 is a cross-sectional view schematically showing a detector module of the X-ray detector according to the first embodiment of the present application.

[0020] Figure 3 FIG. 3 is a cross-sectional view schematically showing a sensor assembly and a sealing structure body that seals the same according to the first embodiment of the present application.

[0021] Figure 4 FIG. 4 is a cross-sectional view schematically showing a structure in which an upper electrode extending to an outer side of a phosphor layer is equipped in the X-ray detector according to the first embodiment of the present application.

[0022] Figure 5 FIG. 5 is a cross-sectional view schematically showing a configuration of an X-ray detector according to a second embodiment of the present application.

[0023] Figure 6This is a schematic cross-sectional view of the detector module of an X-ray detector according to a second embodiment of the present invention.

[0024] Figure 7 This is a schematic cross-sectional view of a sensor assembly and a sealing structure thereof according to a second embodiment of the present invention.

[0025] Figure 8 This is a schematic cross-sectional view of a structure in an X-ray detector according to a second embodiment of the present invention, which is equipped with an upper electrode extending outward from the photoelectric material layer. Detailed Implementation

[0026] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0027] [First Embodiment]

[0028] Figure 1 This is a schematic cross-sectional view illustrating the configuration of an X-ray detector according to a first embodiment of the present invention. Figure 2 This is a schematic cross-sectional view of the detector module of an X-ray detector according to a first embodiment of the present invention. Figure 3 This is a schematic cross-sectional view of a sensor assembly and a sealing structure thereof according to a first embodiment of the present invention.

[0029] Reference Figures 1 to 3 According to this embodiment, the X-ray detector 10 can be configured, for example, to convert incident X-rays into visible light and then into electrical signals in an indirect conversion manner.

[0030] This X-ray detector 10 may include a detector module 100, a boot (or module cover) 400, and a housing (or outer housing) 500.

[0031] The detector module 100 may include a sensor assembly 110 and multiple sealing components for sealing the sensor assembly 110.

[0032] First, the sensor assembly 110 may include a sensor substrate 120, a driving circuit board 130, and a phosphor layer 140.

[0033] The phosphor layer 140 can be disposed in the direction of X-ray irradiation (or incident) in front of the sensor substrate 120. In other words, the phosphor layer 140 can be disposed on the upper surface of the front surface of the sensor substrate 120. As described above, the phosphor layer 140 can convert the incident X-rays into visible light.

[0034] The phosphor layer 140 can be constructed using, for example, cesium iodide (CsI) or gadolinium oxysulfide (GOS or Gadox), but is not limited to these.

[0035] For example, the phosphor layer 140 can be fabricated in the form of a film and can be attached to the light incident surface, which is the upper surface of the sensor panel 120. As another example, the phosphor layer 140 can be formed on the light incident surface of the sensor panel 120 by a deposition process or the like.

[0036] The sensor substrate 120 may include an active region that serves as a region for receiving and detecting visible light generated from the phosphor layer 140, and an active region located outside the active region. This sensor substrate 120 may be constructed using a complementary metal-oxide-semiconductor (CMOS) substrate or a thin-film transistor (TFT).

[0037] Although not specifically shown, a pixel array with multiple pixels can be formed in the active region of the sensor substrate 120, and these multiple pixels can be arranged in a matrix form along multiple row lines and multiple column lines.

[0038] Each pixel can contain a photodetector element (or photodiode or photosensor) that detects incident visible light and generates a corresponding electrical signal.

[0039] The driving circuit board 130 can be arranged behind the sensor substrate 120, in other words, it can be located on the opposite side of the phosphor layer 140, across the sensor substrate 120. The driving circuitry for driving the sensor substrate 120 can be mounted on the driving circuit board 130 as described above.

[0040] Additionally, a connector 135 for connecting to external system circuitry can be mounted on the drive circuit board 130. A cable CA is connected to the connector 135 as described above, and can be electrically connected to the external system circuitry via this cable CA.

[0041] As described above, the sensor assembly 110 according to this embodiment can be configured as a stacked structure of a driving circuit board 130, a sensor substrate 120, and a phosphor layer 140.

[0042] Additionally, the phosphor layer 140 can be formed as an edge exposing the front surface of the sensor substrate 120. In other words, the edge region of the sensor substrate 120 may not be covered by the phosphor layer 140, and the region inside the edge region may be covered by the phosphor layer 140.

[0043] Relatedly, as an example, the phosphor layer 140 may be arranged corresponding to the active region of the sensor substrate 120, and the non-active region located at the edge of the sensor substrate 120 may be exposed without being covered by the phosphor layer 140.

[0044] The sensor assembly 110 constructed as described above can be configured to be sealed by a plurality of sealing components.

[0045] In this regard, as an example, a sealant 210, a sealing tape (or an electromagnetic wave shielding sheet) 220, a first waterproof membrane (or a first coating film) 230, and a second waterproof membrane (or a second coating film) 240 may be arranged from the sensor assembly 110 toward the outside.

[0046] The sealant 210 can be formed to cover the phosphor layer 140. Relatedly, as an example, the sealant material can be deposited under vacuum conditions via a sputtering process. As described above, the sealant 210 can directly seal the phosphor layer 140.

[0047] The sealant material can be metal, such as aluminum or gold, but is not limited to these.

[0048] Thus, the sealant 210 can cover the upper and side surfaces of the phosphor layer 140, thereby sealing the phosphor layer 140 from the outside. In addition, when the sealant 210 is formed under vacuum, it can prevent the penetration of additional moisture or oil and remove air bubbles inside the phosphor layer 140.

[0049] Additionally, in this embodiment, as Figure 4 As shown, the upper electrode UE of the photodetector element can be configured to extend outward from below the phosphor layer 140. Relatedly, the upper electrode UE of the photodetector element to which a bias voltage (or reverse voltage) is applied can be substantially formed throughout the entire active region, extending outward from the phosphor layer 140 located above it.

[0050] As described above, the upper electrode UE portion extending outward can be covered and contacted by the sealant 210.

[0051] Thus, the phosphor layer 140 is surrounded by the sealant 210 and the upper electrode UE, thereby achieving a completely sealed state. This sealing structure further prevents moisture or oil from penetrating into the phosphor layer 140.

[0052] The sealing tape 220 can be applied along the surface of the sensor assembly 110 on which the sealant 210 is formed. In this regard, as an example, the sealing tape 220 can be formed to cover the upper and side surfaces of the sealant 210, the upper edge surface of the sensor substrate 120, the side surfaces of the sensor substrate 120 and the drive circuit board 130, and the lower edge surface of the drive circuit board 130.

[0053] The sealing tape 220 attached to the lower surface of the drive circuit board 130 can be configured to contact the grounding terminal of the drive circuit board 130. This sealing tape 220 can be formed using a shielding material with electromagnetic wave shielding properties.

[0054] As described above, by applying the sealing tape 220, noise in front of the sensor substrate 120 can be minimized. Furthermore, the sealing tape 220 can prevent surface scratches on the phosphor layer 140.

[0055] The first waterproof membrane 230 may, for example, be formed to cover the entire outer surface of the sensor assembly 110 to which the sealing tape 220 is attached.

[0056] As an example, the first waterproof membrane material can be coated onto the entire outer surface of the sensor assembly 110 to which the sealing tape 220 is attached. Thus, the upper, side, and lower surfaces of the sensor assembly 110 to which the sealing tape 220 is attached can be completely sealed by the first waterproof membrane 230.

[0057] This first waterproof membrane 230 can be formed, for example, using parylene. In this case, the first waterproof membrane 230 can be formed using at least one of parylene C and parylene N.

[0058] For example, the first waterproof membrane 230 can be formed as a single-layer membrane of parylene C. In this case, the first waterproof membrane can have a thickness of about 15 μm or less.

[0059] As another example, the first waterproof membrane 230 can be formed using a double-layer (or mixed-layer) membrane of parylene N and parylene C. In this case, in the first waterproof membrane 230, a primary waterproof membrane of parylene N is first formed, which may have a thickness of less than about 2 μm, and then a secondary waterproof membrane of parylene C is formed, which may have a thickness of about 10 μm.

[0060] As described above, by forming the first waterproof membrane 230, micropores and other defects that may exist during the formation of the sealant 210 and the sealing tape 220 can be filled. Furthermore, the first waterproof membrane 230 has excellent resistance to gases and chemicals, thereby preventing their penetration.

[0061] The second waterproof membrane 240 may, for example, be formed to cover the front surface (or upper surface) of the sensor assembly 110 sealed by the first waterproof membrane 230. As another example, the second waterproof membrane 240 may be formed to cover the entire outer surface of the first waterproof membrane 230.

[0062] As an example, the second waterproof membrane material can be coated on the front surface of the first waterproof membrane 230. Thus, the front of the sensor assembly 110 can be sealed by the first waterproof membrane 230 and the second waterproof membrane 240.

[0063] This second waterproof membrane 240 can be formed using a different material than the internal first waterproof membrane 230. For example, the second waterproof membrane 240 can be formed using silicone resin or epoxy resin. The second waterproof membrane 240 can be formed by coating with a liquid substance or by spraying.

[0064] As described above, by additionally forming a second waterproof membrane 240, moisture penetration can be further prevented. Furthermore, due to the formation of the second waterproof membrane 240, the flatness of the front portion of the sensor substrate 120 can be substantially improved, thereby minimizing image distortion caused by poor surface conditions.

[0065] Furthermore, the materials used to form the first waterproof membrane 230 and the second waterproof membrane 240 can be interchanged. In other words, the first waterproof membrane 230 can be formed using silicone resin or epoxy resin, and the second waterproof membrane 240 can be formed using parylene.

[0066] The detector module 100 configured as described above can be inserted into and housed within the protective cover 400. The protective cover 400 may have an internal housing space into which the detector module 100 can be inserted.

[0067] The protective cover 400 can be made of waterproof material, such as silicone resin, but is not limited to this.

[0068] As described above, after the detector module 100 is inserted into the protective cover 400, a filler 300 can be injected into the receiving space of the protective cover 400. Thus, the receiving space of the protective cover 400 with the detector module 100 inserted can be filled with the filler 300. In other words, the space between the inner surface of the protective cover 400 and the detector module 100 can be filled with the filler 300.

[0069] As described above, after the filler 300 is injected, the filler 300 is cured by a curing process in a vacuum chamber, for example.

[0070] As described above, by using filler 300 to fill the containment space inside the protective cover 400 into which the detector module 100 is inserted, the air, gas, and gaps inside the protective cover 400 that may affect the detector module 100 can be minimized.

[0071] The filler 300 can be formed, for example, using a substantially oil-free polymer material that serves as a waterproofing material. As an example, the filler 300 can be formed using epoxy resin, but is not limited to this. Furthermore, the epoxy resin forming the filler 300 can be an epoxy resin having the same composition as the second waterproof membrane 240, but is not limited to this.

[0072] As described above, the detector module 100 housed within the protective cover 400 can be encapsulated using the housing 500.

[0073] In this regard, the housing 500 can be constructed using an upper housing (or a first housing) 510 and a lower housing 520, and provides internal storage space by combining the upper housing 510 and the lower housing 520.

[0074] The detector module 100, which is combined with the protective cover 400, can be inserted into and housed in the internal storage space of the housing 500.

[0075] In this regard, as an example, a detector 100, which is combined with a protective cover 400, can be installed inside the lower housing 520, and then the upper housing 510 can be covered and combined with the lower housing 520.

[0076] In order to join and fix the upper housing 510 and the lower housing 520 together, an adhesive (or sealant) 550 can be used. This can be achieved by applying the adhesive 550 along the inner joining portion of the upper housing 510 and the lower housing 520.

[0077] This adhesive 550 can be made of waterproof materials, such as epoxy resin, but is not limited to them.

[0078] This adhesive 550 can be arranged to fit closely (or contact) the side surface of the corresponding protective cover 400.

[0079] Additionally, a cushioning agent 560 may be sandwiched between the front surface of the protective cover 400 and the inner surface of the corresponding housing 500. This cushioning agent 560 may, for example, be formed using epoxy resin as a waterproof material, similar to the adhesive 550.

[0080] As described above, in the X-ray detector of this embodiment, the phosphor layer, which is susceptible to moisture, can be surrounded and tightly sealed by multiple sealing components. In particular, after the detector module, which is sealed by the sealing components, is placed inside the protective cover, it is sealed by filling with a filler.

[0081] As described above, since the X-ray detector is equipped with a sealing structure that can substantially completely and firmly seal the phosphor layer, it can prevent moisture or oil from penetrating into the phosphor layer to an extremely high level.

[0082] Therefore, defects caused by the penetration of moisture or oil during manufacturing can be prevented, thereby maximizing the yield rate.

[0083] [Second Embodiment]

[0084] Figure 5 This is a schematic cross-sectional view illustrating the configuration of an X-ray detector according to a second embodiment of the present invention. Figure 6 This is a schematic cross-sectional view of the detector module of an X-ray detector according to a second embodiment of the present invention. Figure 7 This is a schematic cross-sectional view of a sensor assembly and a sealing structure thereof according to a second embodiment of the present invention.

[0085] In this embodiment, specific descriptions of configurations that are the same as or similar to those in the first embodiment described above may be omitted.

[0086] Reference Figures 5 to 7 The X-ray detector 10 according to this embodiment differs from the first embodiment in that it can be configured as a direct conversion method that directly detects incident X-rays and converts them into electrical signals.

[0087] The X-ray detector 10 may include a detector module 100, a protective cover (or module cover) 400, and a housing (or outer housing) 500.

[0088] The detector module 100 may include a sensor assembly 110 and multiple sealing components for sealing the sensor assembly 110.

[0089] First, the sensor assembly 110 may include a sensor substrate 120, a photoelectric material layer (or light guide layer) 150, and a driving circuit board 130.

[0090] As described above, the X-ray detector 10 of this embodiment differs from the first embodiment in that, since it is configured as a direct conversion method, it may not include the phosphor layer of the first embodiment. Instead, a photoelectric material layer 150 that directly detects X-rays and generates electrical signals may be arranged.

[0091] The photoelectric material layer 150 can be formed on the upper surface of the sensor substrate 120, for example, it can be formed using perovskite, but is not limited thereto.

[0092] Additionally, although not specifically shown, a lower electrode can be formed below the photoelectric material layer 150, on a pixel-by-pixel basis. Furthermore, as... Figure 8 As shown, an upper electrode UE can also be formed on the photoelectric material layer 150.

[0093] Alternatively, the sensor substrate 120 can be constructed using a complementary metal-oxide-semiconductor (CMOS) substrate or a thin-film transistor (TFT).

[0094] The driving circuit board 130 can be arranged behind the sensor substrate 120; in other words, it can be located on the opposite side of the photoelectric material layer 150, separated from the sensor substrate 120. The driving circuitry for driving the sensor substrate 120 can be mounted on the driving circuit board 130 as described above.

[0095] Additionally, a connector 135 for connecting to external system circuitry can be mounted on the drive circuit board 130. A cable CA is connected to the connector 135 as described above, and can be electrically connected to the external system circuitry via this cable CA.

[0096] As described above, the sensor assembly 110 according to this embodiment can be configured as a stacked structure of a drive circuit board 130, a sensor substrate 120, and a photoelectric material layer 150.

[0097] Furthermore, the photoelectric material layer 150 can be formed as an edge exposing the front surface of the sensor substrate 120. In other words, the edge region of the sensor substrate 120 may not be covered by the photoelectric material layer 150, and the region inside the edge region may be covered by the photoelectric material layer 150.

[0098] In this regard, as an example, the photomaterial layer 150 may be arranged corresponding to the active region of the sensor substrate 120, and the non-active region located at the edge of the sensor substrate 120 may be exposed without being covered by the photomaterial layer 150.

[0099] The sensor assembly 110 constructed as described above can be configured to be sealed by a plurality of sealing components.

[0100] Relatedly, as an example, a sealant 210, a sealing tape (or an electromagnetic wave shielding sheet) 220, a first waterproof membrane (or a first coating film) 230, and a second waterproof membrane (or a second coating film) 240 may be arranged from the sensor assembly 110 toward the outside.

[0101] The sealant 210 can be formed to cover the photoelectric material layer 150. Relatedly, as an example, the sealant material can be deposited under vacuum conditions via a sputtering process. As described above, the sealant 210 can directly seal the photoelectric material layer 150.

[0102] The sealant material can be metal, such as aluminum or gold, but is not limited to these.

[0103] Therefore, the sealant 210 can cover the upper and side surfaces of the photomaterial layer 150, thereby sealing the photomaterial layer 150 from the outside. Furthermore, when the sealant 210 is formed under vacuum, it can prevent the penetration of additional moisture or oil and remove air bubbles inside the photomaterial layer 150. In this case, the sealant 210 can also function as the upper electrode of the photomaterial layer 150. That is, the sealant 210 is a metallic material in direct contact with the photomaterial layer 150, and it, together with the lower electrodes of each pixel unit below the photomaterial layer 150, serves as a common upper electrode for applying a bias voltage (or reverse voltage) to the photomaterial layer 150.

[0104] Additionally, in this embodiment, as Figure 8 As shown, the upper electrode UE of the photodetector element can be separately provided and configured to extend outward from the photomaterial layer 150. In this regard, the upper electrode UE of the photodetector element to which a bias voltage (or reverse voltage) is applied can be substantially formed throughout the active region, and this upper electrode UE can extend outward from the photomaterial layer 150 located below it.

[0105] As described above, the upper electrode UE extending outward can be covered and contacted by the sealant 210.

[0106] As described above, the photoelectric material layer 150 can be double-covered by the sealant 210 and the upper electrode UE, thereby achieving a more sealed state. This sealing structure further prevents moisture or oil from penetrating into the photoelectric material layer 150.

[0107] The sealing tape 220 can be applied along the surface of the sensor assembly 110 on which the sealant 210 is formed. In this regard, as an example, the sealing tape 220 can be formed to cover the upper and side surfaces of the sealant 210, the upper edge surface of the sensor substrate 120, the side surfaces of the sensor substrate 120 and the drive circuit board 130, and the lower edge surface of the drive circuit board 130.

[0108] The sealing tape 220 attached to the lower surface of the drive circuit board 130 can be configured to contact the grounding terminal of the drive circuit board 130. This sealing tape 220 can be formed using a shielding material with electromagnetic wave shielding properties.

[0109] As described above, by applying the sealing tape 220, noise in front of the sensor substrate 120 can be minimized. Furthermore, the sealing tape 220 can prevent surface scratches on the photoelectric material layer 150.

[0110] The first waterproof membrane 230 may, for example, be formed to cover the entire outer surface of the sensor assembly 110 to which the sealing tape 220 is attached.

[0111] As an example, the first waterproof membrane material can be coated onto the entire outer surface of the sensor assembly 110 to which the sealing tape 220 is attached. Thus, the upper, side, and lower surfaces of the sensor assembly 110 to which the sealing tape 220 is attached can be completely sealed by the first waterproof membrane 230.

[0112] This first waterproof membrane 230 can be formed, for example, using parylene. In this case, the first waterproof membrane 230 can be formed using at least one of parylene C and parylene N.

[0113] For example, the first waterproof membrane 230 can be formed as a single-layer membrane of parylene C. In this case, the first waterproof membrane can have a thickness of about 15 μm or less.

[0114] As another example, the first waterproof membrane 230 can be formed as a bilayer (or mixed membrane) of parylene N and parylene C. In this case, in the first waterproof membrane 230, a primary waterproof membrane of parylene N is first formed, which may have a thickness of less than about 2 μm, and then a secondary waterproof membrane of parylene C is formed, which may have a thickness of about 10 μm.

[0115] As described above, by forming the first waterproof membrane 230, micropores and other defects that may exist during the formation of the sealant 210 and the sealing tape 220 can be filled. Furthermore, the first waterproof membrane 230 has excellent resistance to gases and chemicals, thereby preventing their penetration.

[0116] The second waterproof membrane 240 may, for example, be formed to cover the front surface (or upper surface) of the sensor assembly 110 sealed by the first waterproof membrane 230. As another example, the second waterproof membrane 240 may be formed to cover the entire outer surface of the first waterproof membrane 230.

[0117] As an example, the second waterproof membrane material can be coated on the front surface of the first waterproof membrane 230. Thus, the front of the sensor assembly 110 can be sealed by the first waterproof membrane 230 and the second waterproof membrane 240.

[0118] This second waterproof membrane 240 can be formed using a different material than the internal first waterproof membrane 230. For example, the second waterproof membrane 240 can be formed using silicone resin or epoxy resin. The second waterproof membrane 240 can be formed by coating with a liquid substance or by spraying.

[0119] As described above, by additionally forming a second waterproof membrane 240, moisture penetration can be further prevented. Furthermore, due to the formation of the second waterproof membrane 240, the flatness of the front portion of the sensor substrate 120 can be substantially improved, thereby minimizing image distortion caused by poor surface conditions.

[0120] Furthermore, the materials used to form the first waterproof membrane 230 and the second waterproof membrane 240 can be interchanged. In other words, the first waterproof membrane 230 can be formed using silicone resin or epoxy resin, and the second waterproof membrane 240 can be formed using parylene.

[0121] The detector module 100 configured as described above can be inserted into and housed within the protective cover 400. The protective cover 400 may have an internal housing space into which the detector module 100 can be inserted.

[0122] The protective cover 400 may be formed using a waterproof material (e.g., silicone resin), but is not limited to this.

[0123] As described above, after the detector module 100 is inserted into the protective cover 400, a filler 300 can be injected into the receiving space of the protective cover 400. Thus, the receiving space of the protective cover 400 with the detector module 100 inserted can be filled with the filler 300. In other words, the space between the inner surface of the protective cover 400 and the detector module 100 can be filled with the filler 300.

[0124] As described above, after the filler 300 is injected, the filler 300 is cured, for example, by a curing process in a vacuum chamber.

[0125] As described above, by using filler 300 to fill the containment space inside the protective cover 400 into which the detector module 100 is inserted, the air, gas, and gaps inside the protective cover 400 that may affect the detector module 100 can be minimized.

[0126] The filler 300 can be formed, for example, using a substantially oil-free polymer material that serves as a waterproofing material. As an example, the filler 300 can be formed using epoxy resin, but is not limited to this. Furthermore, the epoxy resin forming the filler 300 can be an epoxy resin having the same composition as the second waterproof membrane 240, but is not limited to this.

[0127] As described above, the detector module 100 housed within the protective cover 400 can be encapsulated using the housing 500.

[0128] In this regard, the housing 500 can be constructed using an upper housing (or a first housing) 510 and a lower housing 520, and provides internal storage space by combining the upper housing 510 and the lower housing 520.

[0129] The detector module 100, which is combined with the protective cover 400, can be inserted into and housed in the internal storage space of the housing 500.

[0130] In this regard, as an example, the detector 100 combined with the protective cover 400 can be installed inside the lower housing 520, and can then cover the upper housing 510 and be combined with the lower housing 520.

[0131] In order to join and fix the upper housing 510 and the lower housing 520 together, an adhesive (or sealant) 550 can be used. This can be achieved by applying the adhesive 550 along the inner joining portion of the upper housing 510 and the lower housing 520.

[0132] This binder 550 can be made of waterproof materials (e.g., epoxy resin), but is not limited to them.

[0133] This adhesive 550 can be arranged to fit closely (or contact) the side surface of the corresponding protective cover 400.

[0134] Additionally, a cushioning agent 560 may be sandwiched between the front surface of the protective cover 400 and the inner surface of the corresponding housing 500. This cushioning agent 560 may, for example, be formed using epoxy resin as a waterproof material, similar to the adhesive 550.

[0135] As described above, in the X-ray detector of this embodiment, the photoelectric material layer that is susceptible to moisture can be surrounded and tightly sealed by multiple sealing components. In particular, after the detector module, which is sealed by the sealing components, is placed inside the protective cover, it is sealed by filling with a filler.

[0136] As described above, since the X-ray detector is equipped with a sealing structure that can substantially completely and firmly seal the photoelectric material layer, it can prevent moisture or oil from penetrating into the photoelectric material layer to an extremely high level.

[0137] Therefore, defects caused by the penetration of moisture or oil during manufacturing can be prevented, thereby maximizing the yield rate.

[0138] The above-described embodiments of the present invention are examples of the present invention, and free modifications can be made within the scope of the spirit of the present invention. Therefore, the present invention includes modifications of the present invention within the scope of the appended claims and their equivalents.

Claims

1. An X-ray detector, characterized in that, include: A sensor assembly includes a sensor substrate and a phosphor layer or photoelectric material layer disposed on the front surface of the sensor substrate. A first waterproof membrane is coated onto the sensor assembly; as well as The second waterproof membrane is coated with the first waterproof membrane and formed using a different substance than the first waterproof membrane.

2. The X-ray detector as described in claim 1, characterized in that, The first waterproof membrane surrounds the entire sensor assembly. The second waterproof membrane covers the front of the first waterproof membrane.

3. The X-ray detector as described in claim 1, characterized in that, Also includes: The upper electrode is formed below the phosphor layer or on the photoelectric material layer. The upper electrode extends to the outside of the phosphor layer or the outside of the photoelectric material layer.

4. The X-ray detector as described in claim 1, characterized in that, One of the first waterproof membrane and the second waterproof membrane is formed using parylene, and the other of the first waterproof membrane and the second waterproof membrane is formed using silicone resin or epoxy resin.

5. The X-ray detector as described in claim 4, characterized in that, The first waterproof membrane and the second waterproof membrane formed using parylene are either a single-layer membrane composed of parylene C or a double-layer membrane composed of parylene N and parylene C.

6. The X-ray detector as claimed in claim 1, characterized in that, Also includes: A sealant is used to cover the phosphor layer or the photoelectric material layer.

7. The X-ray detector as claimed in claim 6, characterized in that, The sealant is made of a metallic material and serves as a common upper electrode that applies a bias voltage to the photomaterial layer.

8. The X-ray detector as claimed in claim 6, characterized in that, Also includes: An electromagnetic wave shielding sheet is attached along the surface of the sealant and sensor assembly.

9. The X-ray detector as claimed in claim 1, characterized in that, Also includes: A protective cover, comprising an internal receiving space for inserting sensor assemblies coated with the first and second waterproof membranes, and formed using a waterproof material. A filler is used to fill the receiving space into which the sensor assembly is inserted, and the filler is formed using a waterproof material.

10. The X-ray detector as claimed in claim 9, characterized in that, Also includes: The housing includes a first housing and a second housing, the first housing and the second housing defining an internal space for housing the protective shield in which the sensor assembly is inserted. A binder is used to bond the first shell and the second shell.

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