Lens module and electronic device

Abstract

A lens module and an electronic device, the lens module comprising: a circuit board including a windowing structure penetrating from an upper surface to a lower surface; the lens barrel is arranged on the upper surface of the circuit board; the optical lens group is arranged in the lens barrel and corresponds to the windowing structure, the optical lens group comprises a first lens to an Nth lens, and the Nth lens is the lens, closest to the image side, of the optical lens group; the optical sensor is arranged and electrically connected to the lower surface of the circuit board and corresponds to the windowing structure of the circuit board; wherein one end part of the lens barrel facing the image side is provided with an annular convex block, the annular convex block surrounds the central shaft, and the annular convex block is closer to the image side than the image side surface of the Nth lens.

Description

Technical Field

[0001] This invention relates to a lens module, and more particularly to an electronic device having a lens module. Background Technology

[0002] Currently, the main packaging processes in the lens module industry include Chip Scale Package (CSP), Chip On Board (COB), and Flip Chip (FC).

[0003] Chip-scale packaging (CSP) typically uses wafer-level glass to bond to the wafer and uses dikes to separate the image sensor chips between them. Then, through-silicon vias (TSV) or T-shaped metal contacts on the sidewalls of the ground wafer are created using the pad area. After extending the traces on the back of the wafer, a ball grid array (BGA) is fabricated. The resulting optical sensor unit is then cut to form a single hermetically sealed cavity. The rear end is then assembled into a modular structure using surface mount technology (SMT). Chip-on-board (COB) involves bonding the ground and cut wafer backside to pads on a printed circuit board, using metal wires to mount a support with an infrared glass plate and a lens, forming an assembled structure. Flip-chip packaging (FC) connects all metal bumps to the pads of a printed circuit board (PCB) in one go through the action of thermo-ultrasound, forming a package structure. The rear end uses surface mount technology to form a modular structure through the pads or solder balls on the outside of the printed circuit board.

[0004] Figure 1 This is a cross-sectional schematic diagram of a prior art lens module, showing that the optical sensor is packaged in a chip-on-a-bed (COB) package. Please refer to... Figure 1 The lens module 9 includes a lens barrel 91, an optical lens group 92, and an optical sensor 93. The lens barrel 91 is mounted on a circuit board 90, the optical lens group 92 is disposed within the lens barrel 91, and the optical sensor 93 is disposed on and electrically connected to the circuit board 90. However, the height of the lens module 9 described above no longer meets the requirements for a low module height. In other packaging processes, flip-chip packaging (FC) can achieve a lower module height and better signal transmission quality.

[0005] Therefore, there is a need to provide a lens module that can meet the aforementioned requirements. Summary of the Invention

[0006] One object of the present invention is to provide a lens module in which the annular protrusion can prevent the image-side surface of the Nth lens from being easily scratched or damaged by foreign objects.

[0007] In accordance with the above objectives, the present invention provides a lens module that defines a central axis, an object side, and an image side located opposite the object side, and includes: a circuit board having an upper surface and a lower surface opposite to each other, and including a window structure extending from the upper surface to the lower surface; a lens barrel disposed on the upper surface of the circuit board; an optical lens group disposed within the lens barrel and corresponding to the window structure, wherein the optical lens group includes a first lens to an Nth lens sequentially from the object side to the image side, the Nth lens being the lens closest to the image side of the optical lens group, N being an integer greater than 0, and the Nth lens including an image side surface; an optical sensor disposed and electrically connected to the lower surface of the circuit board and corresponding to the window structure of the circuit board; wherein an annular protrusion is provided at one end of the lens barrel facing the image side, the annular protrusion surrounding the central axis, and the annular protrusion being closer to the image side than the image side surface of the Nth lens.

[0008] Optionally, the distance between the position of the annular protrusion closest to the image side and the image side surface of the Nth lens is between 0.01 and 0.6 mm.

[0009] Optionally, if the image-side surface of the Nth lens does not extend into the window structure, the thickness of the annular protrusion is between 0.01 and 0.6 mm.

[0010] Alternatively, the annular protrusion extends into the window structure.

[0011] Optionally, the annular bump is a rectangular annular bump or a circular annular bump surrounding the central axis.

[0012] Optionally, the annular protrusion includes a first arc-shaped portion and a second arc-shaped portion, and the first arc-shaped portion and the second arc-shaped portion are symmetrically arranged.

[0013] Optionally, the annular protrusion includes two tangential edges that are planar.

[0014] Optionally, the optical lens group further includes a circular plate disposed on the image-side surface of the Nth lens, and the annular protrusion is closer to the image side than the circular plate.

[0015] Optionally, the optical lens group further includes a circular plate disposed on the image-side surface of the Nth lens, and the circular plate is flush with the end of the lens barrel, and the annular protrusion is closer to the image side than the end.

[0016] The present invention further provides an electronic device, comprising: a housing; the lens module disposed within the housing; and a control element disposed within the housing and electrically connected to the optical sensor.

[0017] The lens module of the present invention can be made shorter, especially when paired with a flip-chip optical sensor, reducing the overall module height by approximately 0.15 mm to 0.20 mm and allowing for a reduction in the thickness of its electronic components (e.g., the screen of an electronic device). According to the lens module of the present invention, the annular bump prevents the image-side surface of the Nth lens from being easily scratched or damaged by foreign objects. Furthermore, the annular bump can extend into the window structure, thereby improving the positioning accuracy of the lens module on the circuit board. Attached Figure Description

[0018] Figure 1 This is a cross-sectional schematic diagram of a lens module from the prior art.

[0019] Figure 2 This is a cross-sectional schematic diagram of the lens module according to the first embodiment of the present invention.

[0020] Figure 3 This is a cross-sectional schematic diagram of the lens barrel and optical lens group of the lens module according to the first embodiment of the present invention.

[0021] Figure 4 This is a three-dimensional schematic diagram of the lens barrel and optical lens group of a lens module according to an embodiment of the present invention.

[0022] Figure 5 This is a side view of the lens barrel and optical lens group of a lens module according to an embodiment of the present invention.

[0023] Figure 6 This is a three-dimensional schematic diagram of the lens barrel and optical lens group of a lens module according to another embodiment of the present invention.

[0024] Figure 7 This is a side view of the lens barrel and optical lens group of a lens module according to another embodiment of the present invention.

[0025] Figure 8A This is a bottom view of the lens barrel and optical lens group of a lens module according to another embodiment of the present invention.

[0026] Figure 8B This is a bottom view schematic diagram of the lens barrel and optical lens group of a lens module according to another embodiment of the present invention.

[0027] Figure 9 This is a cross-sectional schematic diagram of the lens barrel and optical lens group of the lens module according to the second embodiment of the present invention.

[0028] Figure 10This is a planar schematic diagram of the circular flat plate of the optical lens group of the lens module according to the second embodiment of the present invention.

[0029] Figure 11 This is a cross-sectional schematic diagram of the lens barrel and optical lens group of the lens module according to the third embodiment of the present invention.

[0030] Figure 12 This is a cross-sectional schematic diagram of an electronic device according to an embodiment of the present invention.

[0031] In the picture: 1 Lens module; 10 Circuit board; 101 Upper surface; 102 Lower surface; 103 Window structure; 11 Lens barrel; 110 End; 111 Annular protrusion; 1111 Straight cut edge; 1112 First arc-shaped portion; 1113 Second arc-shaped portion; 12 Optical lens group; 120 Nth lens; 1201 Image side surface; 121 First lens; 122 Second lens; 123 Third lens; 124 Circular plate; 124' Circular plate; 13 Optical sensor; 2 Electronic device; 20 Housing; 21 Control components; 9 Lens module; 90 Circuit board; 91 Lens barrel; 92 Optical lens group; 93 Optical sensor; CL center axis; L1 distance; L2 thickness; L3 thickness; OS object side; SS source side. Detailed Implementation

[0032] To make the above-mentioned objectives, features and characteristics of the present invention more apparent and understandable, the relevant embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0033] Figure 2 This is a cross-sectional schematic diagram of the lens module according to the first embodiment of the present invention. Figure 3 This is a cross-sectional schematic diagram of the lens barrel and optical lens group of the lens module according to the first embodiment of the present invention. Please refer to... Figure 2 and Figure 3 The lens module 1 defines a central axis CL, an object-side OS, and an image-side IS located opposite the object-side OS, and includes: a circuit board 10, a lens barrel 11, an optical lens group 12, and an optical sensor 13. The circuit board 10 has an upper surface 101 and a lower surface 102 opposite to each other, and includes a window structure 103 extending from the upper surface 101 to the lower surface 102. The thickness L2 of the circuit board 10 can be approximately 0.3 mm. The lens barrel 11 is disposed on the upper surface 101 of the circuit board 10.

[0034] The optical lens group 12 is disposed within the lens barrel 11 and corresponds to the window structure 103. The optical lens group 12 includes, sequentially from the object side OS to the image side IS, a first lens to an Nth lens 120. The Nth lens 120 is the lens of the optical lens group 12 closest to the image side, where N is an integer greater than 0, and the Nth lens 120 includes an image-side surface 1201. For example, the optical lens group 12 may include, sequentially from the object side OS to the image side IS, a first lens 121 to a third lens 123. The third lens 123 (i.e., the Nth lens 120) is the lens of the optical lens group 12 closest to the image side IS. The lens module 1 further includes multiple optical elements disposed within the lens barrel 11, which may be spacers, filters (e.g., infrared filters, infrared bandpass filters, or other optical band filters), or light-shielding elements (e.g., aperture diaphragms or diaphragms used to correct edge rays).

[0035] The optical sensor 13 is disposed on and electrically connected to the lower surface 102 of the circuit board 10, and corresponds to the window structure 13 of the circuit board 10. The optical sensor 13 may be an image sensor, and its thickness L3 may be approximately 0.3 mm.

[0036] The lens module height of the present invention can be reduced, especially when paired with a flip-chip type optical sensor, the overall module height can be reduced by about 0.15mm to 0.20mm, and the screen thickness of the electronic device can be reduced.

[0037] Please refer to this again. Figure 2 An annular protrusion 111 is provided at one end 110 of the lens barrel 11 facing the image side IS. The annular protrusion 111 surrounds the central axis CL and is closer to the image side IS than the image side surface 1201 of the Nth lens 120, thereby preventing the image side surface 1201 of the Nth lens 120 from being easily scratched or damaged by foreign objects. The distance L1 between the position of the annular protrusion 111 closest to the image side IS and the image side surface 1201 of the Nth lens 120 can be between 0.01 and 0.6 mm. If the image side surface 1201 of the Nth lens 120 does not extend into the window structure 103, the thickness of the annular protrusion 111 can be between 0.01 and 0.6 mm. Furthermore, the annular protrusion 111 can extend into the window structure 103, thereby improving the positioning accuracy of the lens module 1 on the circuit board 10.

[0038] Figure 4 This is a three-dimensional schematic diagram of the lens barrel and optical lens group of a lens module according to an embodiment of the present invention. Figure 5 This is a side view schematic diagram of the lens barrel and optical lens group of a lens module according to an embodiment of the present invention. Please refer to... Figure 2 , Figure 4 and Figure 5 The annular protrusion 111 is a rectangular annular protrusion surrounding the central axis CL. The rectangular annular protrusion is easy to manufacture and can prevent the image-side surface 1201 of the Nth lens 120 from being easily scratched or damaged by foreign objects.

[0039] Figure 6 This is a three-dimensional schematic diagram of the lens barrel and optical lens group of a lens module according to another embodiment of the present invention. Figure 7 This is a side view schematic diagram of the lens barrel and optical lens group of a lens module according to another embodiment of the present invention. Please refer to... Figure 2 , Figure 6 and Figure 7 The annular protrusion 111 is a circular annular protrusion surrounding the central axis CL. This circular annular protrusion is easy to manufacture and can prevent the image-side surface 1201 of the Nth lens 120 from being easily scratched or damaged by foreign objects.

[0040] Figure 8A This is a bottom view schematic diagram of the lens barrel and optical lens group of a lens module according to another embodiment of the present invention. Please refer to... Figure 2 and Figure 8A The annular protrusion 111 includes two chamfered edges 1111, which are planar. The lens module 1 is reduced to the lens barrel 11 in a specific direction, thereby enabling the lens module 1 to be used in narrow-bezel electronic devices (such as narrow-bezel mobile phones). Figure 8B This is a bottom view schematic diagram of the lens barrel and optical lens group of a lens module according to another embodiment of the present invention. Please refer to... Figure 2 and Figure 8B The annular protrusion 111 includes first and second arcuate portions 1112 and 1113, which are symmetrically arranged. The lens module 1 is reduced along a specific direction to the lens barrel 11 and the optical lens group 12, thereby enabling the lens module 1 to be used in ultra-narrow bezel electronic devices (such as ultra-narrow bezel mobile phones).

[0041] Figure 9 This is a cross-sectional schematic diagram of the lens barrel and optical lens group of the lens module according to the second embodiment of the present invention. Figure 10 This is a planar schematic diagram of the circular flat plate of the optical lens group of the lens module according to the second embodiment of the present invention. Please refer to... Figure 2 , Figure 9 and Figure 10 The optical lens group 12 further includes a circular plate 124 (e.g., a filter), the outer diameter of which is the same as the outer diameter of the Nth lens 120. The circular plate 120 is disposed in the non-optical area of ​​the image-side surface 1201 of the Nth lens 120, and the annular protrusion 111 is closer to the image-side surface IS than the circular plate 120, thereby preventing the risk that the image-side surface 1201 of the Nth lens 120 is easily scratched or damaged by foreign objects.

[0042] Figure 11 This is a cross-sectional schematic diagram of the lens barrel and optical lens group of the lens module according to the third embodiment of the present invention. Please refer to... Figure 2 and Figure 11 The optical lens group 12 further includes a circular plate 124' (e.g., a filter). The outer diameter of the circular plate 124' is the same as the outer diameter of the Nth lens 120. The circular plate 124' is disposed in the non-optical area of ​​the image-side surface 1201 of the Nth lens 120. The circular plate 120' is flush with the end 110 of the lens barrel 11, and the annular protrusion 111 is closer to the image-side surface 1201 than the end 110, thereby preventing the risk that the image-side surface 1201 of the Nth lens 120 is easily scratched or damaged by foreign objects.

[0043] According to the lens module of the present invention, the annular bump can prevent the image-side surface of the Nth lens from being easily scratched or damaged by foreign objects. Furthermore, the annular bump can extend into the window structure, thereby improving the positioning accuracy of the lens module on the circuit board.

[0044] Figure 12 This is a cross-sectional schematic diagram of an electronic device according to an embodiment of the present invention. The electronic device 2 includes: a housing 20, a lens module 1 of the present invention, and a control element 21. The lens module 1 is disposed within the housing 20. The control element 21 is disposed within the housing 20 and electrically connected to the optical sensor of the lens module 1. The electronic device of the present invention can be a mobile phone, a laptop, etc. The lens module provided by the present invention can be applied to electronic imaging systems in photography, surveillance, automation equipment, vehicle surround view systems, and Internet of Things (IoT) devices as needed, but is not limited thereto.

[0045] In summary, this description merely presents preferred embodiments or examples of the technical means employed by the present invention to solve the problem, and is not intended to limit the scope of the present invention. All changes and modifications that conform to the wording of the present invention patent application or are equivalent to those made within the scope of the present invention patent are covered by the present invention patent.

Claims

1. A lens module, which defines a central axis, an object side and an image side located opposite the object side, characterized in that, And comprising: a circuit board having an upper surface and a lower surface opposite to each other, and comprising a window structure penetrating from the upper surface to the lower surface; a lens barrel disposed on the upper surface of the circuit board; an optical lens assembly disposed in the lens barrel and corresponding to the window structure, wherein the optical lens assembly comprises a first lens to an Nth lens in sequence from the object side to the image side, the Nth lens being the lens closest to the image side of the optical lens assembly, N being an integer greater than 0, and the Nth lens comprising an image side surface; an optical sensor disposed on and electrically connected to the lower surface of the circuit board and corresponding to the window structure of the circuit board; wherein the lens barrel is provided with a ring-shaped protrusion at an end thereof toward the image side, the ring-shaped protrusion surrounding the central axis, and the ring-shaped protrusion being closer to the image side than the image side surface of the Nth lens. 2.The lens module of claim 1, wherein, The distance between the position of the ring-shaped protrusion closest to the image side and the image side surface of the Nth lens is between 0.01 and 0.6 mm. 3.The lens module of claim 1, wherein, If the image side surface of the Nth lens does not extend into the window structure, the thickness of the ring-shaped protrusion is between 0.01 and 0.6 mm. 4.The lens module of claim 1, wherein, The ring-shaped protrusion extends into the window structure. 5.The lens module of claim 1, wherein, The ring-shaped protrusion is a rectangular ring-shaped protrusion or a circular ring-shaped protrusion surrounding the central axis. 6.The lens module of claim 1, wherein, The ring-shaped protrusion comprises a first arc-shaped portion and a second arc-shaped portion, and the first arc-shaped portion and the second arc-shaped portion are symmetrically arranged. 7.The lens module of claim 1, wherein, The ring-shaped protrusion comprises two cut edges, and the two cut edges are planar. 8.The lens module of claim 1, wherein, The optical lens assembly further comprises a circular flat plate disposed on the image side surface of the Nth lens, and the ring-shaped protrusion is closer to the image side than the circular flat plate. 9.The lens module of claim 1, wherein, The optical lens assembly further comprises a circular flat plate disposed on the image side surface of the Nth lens, and the circular flat plate is flush with the end of the lens barrel, and the ring-shaped protrusion is closer to the image side than the end.

10. An electronic device, comprising: Comprising: a housing; the lens module of any one of claims 1 to 9 disposed in the housing; and a control element disposed in the housing and electrically connected to the optical sensor.

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