Display device and method of manufacturing same

Abstract

One embodiment of the present invention discloses a display device. The display device includes: a substrate; a pixel driving circuit portion disposed on the substrate; an organic insulating layer disposed on the pixel driving circuit portion and defining a first opening therein; a first conductive organic film accommodated in the first opening to be electrically connected to the pixel driving circuit portion; and an inorganic light emitting diode disposed on the organic insulating layer and including a first electrode in which at least a portion of the first electrode is accommodated in the first conductive organic film.

Description

Technical Field

[0001] One or more embodiments relate to a display device and a method of manufacturing a display device, and more specifically, to a stretchable display device and a method of manufacturing a stretchable display device. Background Technology

[0002] With the development of display devices that can visually display various electrical signals, a variety of display devices with excellent characteristics (such as thinness, light weight, and low power consumption) have been introduced. As an example, flexible display devices that can be folded or rolled into a roll shape have been developed. Research and development of stretchable display devices that can be changed into various shapes have been actively carried out. Summary of the Invention Technical issues

[0003] One or more embodiments include a display device, such as a stretchable display device. Solution to the problem

[0004] According to one or more embodiments, a display device includes: a substrate; a pixel driving circuit portion disposed on the substrate; an organic insulating layer disposed on the pixel driving circuit portion and defining a first opening therein; a first conductive organic film housed in the first opening for electrical connection to the pixel driving circuit portion; and an inorganic light-emitting diode disposed on the organic insulating layer and including a first electrode, wherein at least a portion of the first electrode is housed in the first conductive organic film.

[0005] The upper surface of the first conductive organic film can be recessed from the top surface of the organic insulating layer.

[0006] The thickness of the first electrode can be greater than the height difference between the upper surface of the first conductive organic film and the top surface of the organic insulating layer.

[0007] The first conductive organic film may include carbon black material.

[0008] The display device may further include: a first connecting electrode disposed between the pixel driving circuit portion and the first conductive organic film, and electrically connecting the pixel driving circuit portion to the first conductive organic film.

[0009] The first connecting electrode may include at least one of indium tin oxide (“ITO”), indium zinc oxide (“IZO”), and molybdenum (Mo).

[0010] The display device may further include a second conductive organic film separate from the first conductive organic film, an organic insulating layer may further define a second opening separate from the first opening and accommodating the second conductive organic film, and an inorganic light-emitting diode may further include a second electrode separate from the first electrode and having at least a portion contained in the second conductive organic film.

[0011] The upper surface of the second conductive organic film can be recessed from the top surface of the organic insulating layer.

[0012] The thickness of the second electrode can be greater than the height difference between the upper surface of the second conductive organic film and the top surface of the organic insulating layer.

[0013] The second conductive organic film may include carbon black material.

[0014] The display device may further include: a second connecting electrode disposed between the pixel driving circuit portion and the second conductive organic film, and connected to the second conductive organic film.

[0015] The second connecting electrode may include at least one of indium tin oxide (ITO), indium zinc oxide (IZO), and molybdenum (Mo).

[0016] The display device may further include a counter electrode disposed on an inorganic light-emitting diode, wherein the inorganic light-emitting diode may further include a second electrode that is separate from the first electrode and electrically connected to the counter electrode.

[0017] The display device may further include: a conductive organic film layer disposed on an organic insulating layer to cover the organic insulating layer in non-display areas.

[0018] According to one or more embodiments, a method of manufacturing a display device includes: disposing a pixel driving circuit portion on a substrate; disposing an organic insulating layer on the pixel driving circuit portion; etching the organic insulating layer to form a first opening; disposing a first conductive organic film in the first opening for electrical connection to the pixel driving circuit portion; and disposing an inorganic light-emitting diode on the organic insulating layer, wherein disposing the inorganic light-emitting diode includes accommodating at least a portion of a first electrode of the inorganic light-emitting diode in the first conductive organic film.

[0019] Etching the organic insulating layer to form the first opening may include dry etching the organic insulating layer using etching gas.

[0020] Setting the first conductive organic film may include: setting a conductive organic film material on an organic insulating layer; soft baking the conductive organic film material; and developing the conductive organic film material.

[0021] Containing at least a portion of the first electrode within the first conductive organic film may include: pressing the first electrode against the first conductive organic film; and heating the first conductive organic film.

[0022] Heating the first conductive organic film may include heating the first conductive organic film to 120 degrees Celsius (°C) to 140 degrees Celsius (°C).

[0023] The first conductive organic film may include carbon black material.

[0024] The method may further include: etching an organic insulating layer to form a second opening separate from the first opening; and disposing of a second conductive organic film in the second opening, wherein disposing of an inorganic light-emitting diode may further include accommodating at least a portion of the second electrode of the inorganic light-emitting diode in the second conductive organic film, and the second electrode may be separate from the first electrode.

[0025] Etching the organic insulating layer to form the first opening and etching the organic insulating layer to form the second opening can be performed simultaneously.

[0026] The placement of a first conductive organic film in the first opening and the placement of a second conductive organic film in the second opening can be performed simultaneously.

[0027] Containing at least a portion of the first electrode in the first conductive organic film and containing at least a portion of the second electrode in the second conductive organic film can be performed simultaneously.

[0028] The method may further include: setting a counter electrode on an inorganic light-emitting diode, and setting the inorganic light-emitting diode may further include electrically connecting a second electrode of the inorganic light-emitting diode to the counter electrode, and the second electrode may be separate from the first electrode.

[0029] These and / or other aspects will become apparent and more readily understood from the following detailed description of the embodiments, the accompanying drawings, and the claims. Beneficial effects of the invention

[0030] According to an embodiment, a display device can be provided that can effectively prevent damage due to stress concentration and is configured to be stretched in all directions.

[0031] According to the embodiments, fine patterning of the conductive organic film electrically connected to the pixel driving circuit portion can be performed, and the inorganic light-emitting diode can be connected to the conductive organic film even at low temperature and low pressure.

[0032] However, this effect is an example, and this disclosure is not limited to this effect. Attached Figure Description

[0033] Figure 1 This is a schematic perspective view of a stretchable display device according to an embodiment.

[0034] Figure 2a and Figure 2b It is one of them Figure 1 A perspective view of a stretchable display device stretched in a first direction.

[0035] Figure 2c It is shown that Figure 1A perspective view of the stretchable display device in a state where it is stretched in a second direction.

[0036] Figure 2d It is shown that Figure 1 A perspective view of a stretchable display device stretched in a first direction and a second direction.

[0037] Figure 2e It is shown that Figure 1 A perspective view of a stretchable display device stretched upwards in a third-party view.

[0038] Figure 3 This is a schematic plan view of a stretchable display device according to an embodiment.

[0039] Figure 4a It is part of a stretchable display device according to an embodiment (i.e., Figure 3 Enlarged plan view of area IV.

[0040] Figure 4b It is part of a stretchable display device according to an embodiment (i.e., Figure 3 Enlarged plan view of area IV.

[0041] Figure 4c It is part of a stretchable display device according to an embodiment (i.e., Figure 3 Enlarged plan view of area IV.

[0042] Figure 5 This is a schematic cross-sectional view of a first island portion and a first bridging portion arranged in the display area of ​​a stretchable display device according to an embodiment.

[0043] Figures 6a to 6c These are equivalent circuit diagrams of sub-pixels of a stretchable display device according to an embodiment.

[0044] Figure 7 This is a schematic cross-sectional view of a portion of a display device according to an embodiment.

[0045] Figure 8 According to the embodiments Figure 7 An enlarged view of area A.

[0046] Figure 9 According to the embodiments Figure 7 A magnified view of area B.

[0047] Figure 10 This is a schematic cross-sectional view of a part of a display device according to another embodiment.

[0048] Figures 11a to 11h This is a schematic cross-sectional view of a method for manufacturing a display device according to an embodiment.

[0049] Figure 12 This is a schematic cross-sectional view of a part of a display device according to yet another embodiment.

[0050] Figures 13a to 1 3h is a schematic cross-sectional view of a method for manufacturing a display device according to another embodiment.

[0051] Figures 14a to 14g These are schematic perspective views of embodiments of electronic devices including a stretchable display device according to an embodiment. Detailed Implementation

[0052] Because this disclosure allows for various modifications and numerous embodiments, certain embodiments will be illustrated in the accompanying drawings and described in the written description. The effects and features of this disclosure, as well as methods for implementing them, will be elucidated with reference to the embodiments described in detail below with reference to the accompanying drawings. However, this disclosure is not limited to the following embodiments and can be implemented in various forms.

[0053] In the following description, embodiments will be referenced to the accompanying drawings, wherein the same reference numerals always refer to the same elements and repeated descriptions thereof are omitted.

[0054] While terms such as "first" and "second" can be used to describe various components, these components are not necessarily limited to these terms. The terms are used to distinguish one component from another.

[0055] Unless the context clearly indicates otherwise, the singular forms “a” and “as used herein” are intended to include the plural forms as well.

[0056] It will be understood that the terms “comprising” and / or “including” as used herein specify the presence of a feature or element of a statement, but do not preclude the addition of one or more other features or elements.

[0057] To be further understood, when a layer, zone, or element is referred to as being "on" another layer, zone, or element, it can be directly or indirectly on that other layer, zone, or element. That is, for example, an intermediary layer, zone, or element can exist.

[0058] For ease of illustration, the dimensions of the elements in the accompanying drawings may be exaggerated or reduced. By way of example, for ease of description, the dimensions and thicknesses of each element shown in the drawings are arbitrarily represented, and therefore, this disclosure is not necessarily limited thereto.

[0059] The x-axis, y-axis, and z-axis are not limited to the three axes of a Cartesian coordinate system and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or they can represent different directions that are not perpendicular to each other.

[0060] Where a particular embodiment can be implemented differently, a specific process sequence can be performed in a different order than that described. As an example, two processes described consecutively can be performed substantially simultaneously, and can be performed in reverse order.

[0061] Figure 1 This is a schematic perspective view of the display device 1 according to an embodiment. Figure 2a and Figure 2b It is one of them Figure 1 A perspective view of the display device 1 in a stretched state in a first direction. Figure 2c It is shown that Figure 1 A perspective view of the display device 1 in a stretched state in the second direction. Figure 2d It is shown that Figure 1 A perspective view of the display device 1 in a stretched state in the first and second directions. Figure 2e It is shown that Figure 1 A perspective view of the display device 1 stretched in a third direction (e.g., the y-direction or the -y-direction).

[0062] refer to Figure 1 The display device 1 may include a display area DA and a non-display area NDA. The display area DA may include multiple pixels. The display device 1 may be configured to display a preset image by using light emitted from the multiple pixels. The non-display area NDA may be arranged outside the display area DA. The non-display area NDA may surround the entire display area DA.

[0063] The display device 1 can be stretched or contracted in various directions. The display device 1 can be stretched in a first direction (e.g., the x-direction and / or the -x-direction) due to external forces applied by an external object or the user. In one embodiment, as... Figure 2a and Figure 2b As shown, the display area DA and / or non-display area NDA of the display device 1 can be stretched in a first direction (e.g., the x-direction and / or the -x-direction). As an example, such as... Figure 2a As shown, the display area DA and / or the non-display area NDA can be stretched in the x and -x directions, or as... Figure 2b As shown, it is stretched in the x-direction while being fixed on one side of the display device 1.

[0064] The display device 1 can be stretched in a second direction (e.g., the y-direction and / or the -y-direction) due to external forces applied by an external object or a user. In one embodiment, as... Figure 2cAs shown, the display area DA and / or the non-display area NDA of the display device 1 can be stretched in the y-direction and the -y-direction. In another embodiment, the display area DA and / or the non-display area NDA can be stretched in the y-direction or the -y-direction while one side of the display device 1 is fixed.

[0065] The display device 1 can be stretched in, for example, a first direction (e.g., the x-direction and / or the -x-direction) and a second direction (e.g., the y-direction and / or the -y-direction) due to external forces applied by an external object or a part of the human body. Figure 2d As shown, the display area DA and / or the non-display area NDA of the display device 1 can be stretched in the ±x and ±y directions.

[0066] The display device 1 can be stretched in a third direction (e.g., the z-direction or -z-direction) due to an external force applied by an external object or human body. In one embodiment, in Figure 2e The diagram shows a portion of the display device 1 (e.g., a portion of the display area DA) protruding in the z-direction. In another embodiment, a portion of the display device 1 (e.g., a portion of the display area DA) may protrude in the z-direction (or may be recessed in the z-direction).

[0067] Despite Figures 2a to 2e The illustration shows the display device 1 being stretched upwards in a first direction, a second direction, and / or a third direction, but the embodiment is not limited thereto. In another embodiment, the display device 1 can be transformed into various shapes, such as being bent or twisted along two or more axes.

[0068] Figure 3 This is a schematic plan view of the display device 1 according to an embodiment. As used herein, "plan view" is a view of the substrate 100 in the thickness direction (i.e., the z-axis direction).

[0069] Multiple pixels can be arranged in the display area DA of the display device 1. Each pixel may include a sub-pixel configured to emit light of a different color. A light-emitting element corresponding to each sub-pixel may be arranged in the display area DA. Circuitry may be arranged in a non-display area NDA surrounding the display area DA, wherein the circuitry is configured to provide electrical signals to the light-emitting elements arranged in the display area DA and transistors electrically connected to the light-emitting elements. A gate driving circuit GDC may be arranged in a first non-display area NDA1 and a second non-display area NDA2, respectively, arranged on two opposite sides with the display area DA between them. The gate driving circuit GDC may include a driver configured to provide electrical signals to the gate electrode of each of the transistors electrically connected to the light-emitting elements. Although in Figure 3The diagram shows a gate drive circuit (GDC) arranged in the first non-display area NDA1 and the second non-display area NDA2, but the embodiment is not limited thereto. In another embodiment, the gate drive circuit (GDC) may be arranged in one of the first non-display area NDA1 and the second non-display area NDA2.

[0070] The data drive circuitry (DDC) can be arranged in a third non-display area (NDA3) and / or a fourth non-display area (NDA4), respectively, connecting the first non-display area (NDA1) to the second non-display area (NDA2). In one embodiment, in Figure 3 The diagram shows the data drive circuit DDC arranged in the fourth non-display area NDA4. In another embodiment, the data drive circuit DDC may be arranged in the third non-display area NDA3 and the fourth non-display area NDA4, respectively.

[0071] Despite Figure 3 The diagram shows a data drive circuit DDC arranged in the fourth non-display area NDA4 of the display device 1, but the embodiment is not limited thereto. In another embodiment, the display device 1 may further include a flexible circuit board (not shown) electrically connected via terminal portions (not shown) arranged in the fourth non-display area NDA4, and the data drive circuit DDC may be arranged on the flexible circuit board.

[0072] In one embodiment, the elongation rate of the non-display area NDA can be equal to or less than the elongation rate of the display area DA. In one embodiment, the elongation rate of the non-display area NDA can be different for each of its regions. As an example, although the first non-display area NDA1, the second non-display area NDA2, and the third non-display area NDA3 can have substantially the same elongation rate, the elongation rate of the fourth non-display area NDA4 can be less than the elongation rate of each of the first non-display area NDA1, the second non-display area NDA2, and the third non-display area NDA3.

[0073] Figure 4a It is a part of the display device 1 according to the embodiment (i.e., Figure 3 Enlarged plan view of area IV.

[0074] refer to Figure 4a The display device 1 may include a first island portion 11 and a first bridging portion 12, wherein the first island portions 11 are separated from each other in a first direction (e.g., the x direction or the -x direction) and a second direction (e.g., the y direction or the -y direction), and the first bridging portion 12 connects adjacent first island portions 11.

[0075] Each first island portion 11 may be connected to a plurality of first bridging portions 12. As an example, each first island portion 11 may be connected to four first bridging portions 12. Two first bridging portions 12 may be arranged on two opposite sides of the first island portion 11 in a first direction (e.g., the x-direction or the -x-direction), and the remaining two first bridging portions 12 may be arranged on two opposite sides of the first island portion 11 in a second direction (e.g., the y-direction or the -y-direction). In one embodiment, the four first bridging portions 12 may be connected to the four lateral sides of the first island portion 11, respectively. Each of the four first bridging portions 12 may be adjacent to a corresponding corner of the first island portion 11.

[0076] The first bridging portions 12 can be separated from each other by first openings CS1 arranged between the first bridging portions 12. In one embodiment, first openings CS1 having a generally H shape in a first direction (e.g., the x-direction or -x-direction) and a generally I shape having a shape rotated 90 degrees from the H shape can be arranged repeatedly and alternately. The two opposite ends of each first bridging portion 12 can be connected to each of the adjacent first island portions 11, and one lateral side of each first bridging portion 12 can be separated from one lateral side of an adjacent first island portion 11 and / or one lateral side of another first bridging portion 12 by the first openings CS1.

[0077] In non-display areas (e.g., Figure 4a In the first non-display area NDA1 shown in the figure, the display device 1 may include a second island portion 21 that is separate from each other and a second bridging portion 22 that connects the adjacent second island portions 21.

[0078] Each second island portion 21 may extend in a first direction (e.g., the x-direction or the -x-direction). The second island portions 21 may separate from each other in a second direction (e.g., the y-direction or the -y-direction) intersecting the first direction (e.g., the x-direction or the -x-direction). Each second island portion 21 may include a reference... Figure 3 The described gate drive circuit GDC (see Figure 2) driver.

[0079] The second bridging portion 22 may have a serpentine shape. The length of the second bridging portion 22 may be greater than the shortest distance between adjacent second island portions 21 in a second direction (e.g., the y-direction or the -y-direction). In one embodiment, the second bridging portion 22 may have a generally omega (Ω) shape that protrudes in a first direction (e.g., the x-direction or the -x-direction). The second bridging portions 22 may be arranged between adjacent second island portions 21 and separated from each other.

[0080] The second bridging portions 22 between adjacent second island portions 21 can be separated from each other by a second opening CS2. Between adjacent second island portions 21, the second opening CS2 and the second bridging portions 22 can be arranged alternately in a first direction (e.g., the x-direction or the -x-direction). The second opening CS2 can have the same shape. The two opposite ends of each second bridging portion 22 can be connected to each of the adjacent second island portions 21, and one lateral side of each second bridging portion 22 can be separated from one lateral side of an adjacent second island portion 21 and / or one lateral side of another second bridging portion 22 by the second opening CS2.

[0081] A second island portion 21 arranged in the first non-display area NDA1 can correspond to a first island portion 11 arranged in multiple rows in the display area DA. As an example, a second island portion 21 arranged in the first non-display area NDA1 can correspond to the first island portion 11 in the i-th row and the first island portion 11 in the (i+1)-th row of the display area DA (here, i is a positive number greater than 0). Although in Figure 4a The diagram shows a second island portion 21 corresponding to two rows of first island portions 11, but the embodiment is not limited thereto. In another embodiment, a second island portion 21 arranged in the first non-display area NDA1 may correspond to n rows of first island portions 11 arranged in the display area DA (here, n is a positive number equal to or greater than 3).

[0082] A non-display area (e.g., a first non-display area NDA1) may include a first sub-non-display area SNDA1 and a second sub-non-display area SNDA2 between the first sub-non-display area SNDA1 and the display area DA. A second island portion 21 and a second bridging portion 22 are disposed in the first sub-non-display area SNDA1. A third bridging portion 23 may be disposed in the second sub-non-display area SNDA2, wherein the third bridging portion 23 connects the display area DA to the first sub-non-display area SNDA1. One end of the third bridging portion 23 may be connected to the second island portion 21 and / or the second bridging portion 22, and the other end of the third bridging portion 23 may be connected to the first island portion 11 and / or the first bridging portion 12.

[0083] The third bridging portion 23 may have a serpentine shape. In one embodiment, the shape of the third bridging portion 23 may differ from the shape of each of the first bridging portion 12 and the second bridging portion 22. In one embodiment, as... Figure 4aAs shown, the third bridging portion 23 may have a generally omega (Ω) shape that protrudes in a second direction (e.g., the y-direction or the -y-direction). The third bridging portions 23 may have a symmetrical structure such that one of adjacent third bridging portions 23 arranged in the second direction (e.g., the y-direction or the -y-direction) protrudes in the y-direction and the other protrudes in the -y-direction. A repeating structure of third openings CS3 and fourth openings CS4 of different shapes may be provided between the third bridging portions 23. The width of the third bridging portion 23 may differ from the width of the first bridging portion 12 and the width of the second bridging portion 22. In one embodiment, the width of the third bridging portion 23 may be greater than the width of the first bridging portion 12 and less than the width of the second bridging portion 22.

[0084] exist Figure 4a The diagram shows that the second island portion 21 and the second bridging portion 22 in the non-display area NDA (e.g., the first non-display area NDA1) have shapes that are different from the shapes of the first island portion 11 and the first bridging portion 12 in the display area DA. In another embodiment, the second island portion 21 and the second bridging portion 22 in the non-display area NDA may have the same shapes as the first island portion 11 and the first bridging portion 12 in the display area DA.

[0085] Figure 4b It is a part of the display device 1 according to the embodiment (i.e., Figure 3 Enlarged plan view of area IV.

[0086] refer to Figure 4b The display device 1 includes a first island portion 11 and a first bridging portion 12 in a display area DA. The first island portions 11 are separated from each other, and the first bridging portions 12 are separated from each other through a first opening CS1 and connect adjacent first island portions 11. Figure 4b The structure of the display area DA in the above reference can be compared with that of the above reference. Figure 4a The structures of the described display area DA are the same.

[0087] The display device 1 may include a second island portion 21 and a second bridging portion 22 disposed in a non-display area (e.g., a first non-display area NDA1). In one embodiment, the second island portion 21 and the second bridging portion 22 may each have a shape substantially the same as that of the first island portion 11 and the first bridging portion 12.

[0088] The second island portions 21 may be separated from each other in a first direction (e.g., x-direction or -x-direction) and a second direction (e.g., y-direction or -y-direction) within a non-display area (e.g., the first non-display area NDA1). Each of the second bridging portions 22 may connect adjacent second island portions 21. The second bridging portions 22 may be separated from each other by a second opening CS2 arranged between the second bridging portions 22.

[0089] The second opening CS2 may have a shape substantially the same as that of the first opening CS1. As an example, second openings CS2 with a generally H shape and second openings CS2 with a generally I shape may be arranged alternately and repeatedly in a non-display area (e.g., a first non-display area NDA1). The two opposite ends of each second bridging portion 22 may be connected to each of the adjacent second island portions 21, and one lateral side of each second bridging portion 22 may be separated from one lateral side of an adjacent second island portion 21 and / or one lateral side of another second bridging portion 22 by the second opening CS2.

[0090] Each second island portion 21 can be connected to four second bridging portions 22. Each second island portion 21 may include references. Figure 3 The described gate drive circuit GDC (see Figure 2) driver.

[0091] The second island portion 21 arranged in a row in the first non-display area NDA1 can correspond to the first island portion 11 arranged in a row in the display area DA. As an example, the second island portion 21 arranged in the i-th row in the first direction (e.g., the x-direction or the -x-direction) in the first non-display area NDA1 can correspond to the first island portion 11 arranged in the same row (e.g., the i-th row) in the display area DA (where i is a positive number greater than 0).

[0092] Display device 1 may include a third bridging portion 23 disposed in a second sub-non-display area SNDA2, wherein the third bridging portion 23 connects display area DA to a first sub-non-display area SNDA1. The non-display area (e.g., the first non-display area NDA1) may include the first sub-non-display area SNDA1 and the second sub-non-display area SNDA2. A second island portion 21 and a second bridging portion 22 are disposed in the first sub-non-display area SNDA1. The second sub-non-display area SNDA2 includes the third bridging portion 23 and is disposed between the first sub-non-display area SNDA1 and the display area DA. The third bridging portion 23 may be substantially the same as the first bridging portion 12 and the second bridging portion 22. As an example, the width of the third bridging portion 23 may be the same as the width of the first bridging portion 12 and the width of the second bridging portion 22.

[0093] Figure 4c It is a part of the display device 1 according to the embodiment (i.e., Figure 3 Enlarged plan view of area IV.

[0094] refer to Figure 4c The display device 1 may include a first island portion 11 and a first bridging portion 12, wherein the first island portions 11 are separated from each other in a first direction (e.g., the x direction or the -x direction) and a second direction (e.g., the y direction or the -y direction), and the first bridging portion 12 connects adjacent first island portions 11 in the display area DA.

[0095] The first bridging portions 12 can be separated from each other by a first opening CS1 arranged between the first bridging portions 12. The first bridging portions 12 can have a curved shape. As an example, as shown in FIG4c, the first bridging portions 12 can have a generally “letter S” shape.

[0096] Each first island portion 11 may be connected to a plurality of first bridging portions 12. As an example, each first island portion 11 may be connected to four first bridging portions 12. Two first bridging portions 12 may be arranged on two opposite sides of the first island portion 11 in a first direction (e.g., the x-direction or the -x-direction), and the remaining two first bridging portions 12 may be arranged on two opposite sides of the first island portion 11 in a second direction (e.g., the y-direction or the -y-direction). The four first bridging portions 12 may be connected to the four lateral sides of the first island portion 11. Each of the four first bridging portions 12 may be adjacent to a corner of the first island portion 11.

[0097] The display device 1 may include a second island portion 21 and a second bridging portion 22 connecting adjacent second island portions 21, wherein the second island portion 21 is in Figure 4c The first non-display area NDA1 shown is separated from each other in a first direction (e.g., the x direction or -x direction) and a second direction (e.g., the y direction or -y direction).

[0098] The second bridging portions 22 can be separated from each other by a second opening CS2 arranged between the second bridging portions 22. The second bridging portions 22 can have a serpentine shape. As an example, Figure 4cAs shown, the second bridging portion 22 may have an approximate "letter S" shape. The size and / or width of the second bridging portion 22 may differ from the size and / or width of the first bridging portion 12. As an example, the size and / or width of the second bridging portion 22 may be larger than the size and / or width of the first bridging portion 12. The radius of curvature of the arcuate portion of the second bridging portion 22 may differ from the radius of curvature of the arcuate portion of the first bridging portion 12. As an example, the radius of curvature of the arcuate portion of the second bridging portion 22 may be larger than the radius of curvature of the arcuate portion of the first bridging portion 12.

[0099] Each second island portion 21 may be connected to a plurality of second bridging portions 22. Each second island portion 21 may be connected to four second bridging portions 22. Two second bridging portions 22 may be arranged on two opposite sides of the second island portion 21 in a first direction (e.g., the x-direction or the -x-direction), and the remaining two second bridging portions 22 may be arranged on two opposite sides of the second island portion 21 in a second direction (e.g., the y-direction or the -y-direction). In one embodiment, the four second bridging portions 22 may be connected to the four lateral sides of the second island portion 21. Each second bridging portion 22 may be connected to the central portion of each lateral side of the second island portion 21.

[0100] The second island portion 21 arranged in a row in the first non-display area NDA1 can correspond to the first island portion 11 arranged in multiple rows in the display area DA. As an example, the second island portion 21 arranged in a row in the first non-display area NDA1 can correspond to the first island portion 11 in the i-th row and the first island portion 11 in the (i+1)-th row of the display area DA (here, i is a positive number greater than 0). In another embodiment, the second island portion 21 in a row can correspond to the first island portion 11 in n rows (here, n is a positive number equal to or greater than 3).

[0101] A non-display area (e.g., a first non-display area NDA1) may include a first sub-non-display area SNDA1 and a second sub-non-display area SNDA2 between the first sub-non-display area SNDA1 and the display area DA. A second island portion 21 and a second bridging portion 22 are disposed in the first sub-non-display area SNDA1. A third bridging portion 23 may be disposed in the second sub-non-display area SNDA2, wherein the third bridging portion 23 connects the display area DA to the first sub-non-display area SNDA1. One end of the third bridging portion 23 may be connected to the second island portion 21, and the other end of the third bridging portion 23 may be connected to the first island portion 11. As an example, one end of the third bridging portion 23 may be connected to the center portion of a lateral side of the second island portion 21, and the other end of the third bridging portion 23 may be connected to the center portion of a lateral side of the first island portion 11.

[0102] The third bridging portion 23 may have a curved shape. In one embodiment, the shape of the third bridging portion 23 may differ from the shape of each of the first bridging portion 12 and the second bridging portion 22. The width of the third bridging portion 23 may differ from the width of the first bridging portion 12 and the width of the second bridging portion 22. The width of the third bridging portion 23 may be greater than the width of the first bridging portion 12 and less than the width of the second bridging portion 22. In a second direction (e.g., the y-direction or the -y-direction), a third opening CS3 and a fourth opening CS4 with different shapes may be alternately arranged between the third bridging portions 23.

[0103] Figure 5 This is a schematic cross-sectional view of the first island portion 11 and the first bridging portion 12 arranged in the display area DA of the display device 1 according to an embodiment.

[0104] refer to Figure 5 The first island portion 11 and the first bridging portion 12, arranged in the display area DA, may be separated from each other, with a first opening CS1 between them. The first island portion 11 may include light-emitting elements (LEDs) and circuitry (e.g., a pixel driving circuit portion PC electrically connected to and configured to drive the LEDs). The first bridging portion 12 may include wiring WL electrically connected to the pixel driving circuit portions PC, which are respectively arranged on adjacent first island portions 11.

[0105] The first island portion 11 is described as follows, wherein: a buffer layer 111 comprising an inorganic insulating material may be disposed on the substrate 100, and a pixel driving circuit portion PC may be disposed on the buffer layer 111. An insulating layer IL comprising an inorganic insulating material and / or an organic insulating material may be disposed between the pixel driving circuit portion PC and the light-emitting element LED. The light-emitting element LED may be disposed on the insulating layer IL and electrically connected to the pixel driving circuit portion PC. The light-emitting element LED may be configured to emit light of different colors or emit light of the same color. In one embodiment, the light-emitting element LED may be configured to emit red light, green light, and blue light, respectively. In one embodiment, the light-emitting element LED may be configured to emit white light. In another embodiment, the light-emitting element LED may be configured to emit red light, green light, blue light, and white light, respectively.

[0106] Substrate 100 may include polymeric resins such as polyethersulfone, polyarylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyimide, polycarbonate, cellulose triacetate, and cellulose acetate propionate. In one embodiment, substrate 100 may include a single layer comprising the polymeric resin. In another embodiment, substrate 100 may have a multilayer structure comprising a base layer and a barrier layer, wherein the base layer comprises the aforementioned polymeric resins, and the barrier layer comprises an inorganic insulating material. The substrate 100 comprising the polymeric resin is flexible, rollable, or bendable.

[0107] In one embodiment, although in Figure 5 The diagram shows three pixel driving circuit sections PC arranged in the first island section 11 and three light-emitting elements LEDs respectively connected to the pixel driving circuit sections PC, but the embodiment is not limited to this. In another embodiment, the number of pixel driving circuit sections PC and the number of light-emitting elements LED arranged in the first island section 11 can be one, two, four or more.

[0108] The encapsulation layer 300 can be disposed on the light-emitting element (LED) and can protect the LED from external forces and / or moisture transmission. The encapsulation layer 300 may include an inorganic encapsulation layer and / or an organic encapsulation layer. In one embodiment, the encapsulation layer 300 may have a structure comprising an inorganic encapsulation layer including an inorganic insulating material, an organic encapsulation layer including an organic insulating material, and a stack of inorganic encapsulation layers including an inorganic insulating material. In another embodiment, the encapsulation layer 300 may include organic materials, such as resins. In one embodiment, the encapsulation layer 300 may include urethane epoxy resin or acrylate. The encapsulation layer 300 may include a photosensitive material, such as a photoresist.

[0109] The first bridging portion 12 is described as follows, wherein an insulating layer IL comprising an organic insulating material may be disposed on the substrate 100. Unlike the first island portion 11, the first bridging portion 12, which deforms relatively greatly when the display device 1 is stretched, may not include a layer comprising an inorganic insulating material that is prone to cracking.

[0110] In one embodiment, the substrate 100 corresponding to the first bridging portion 12 may have the same stacking structure as the substrate 100 corresponding to the first island portion 11. In one embodiment, the substrate 100 corresponding to the first bridging portion 12 and the substrate 100 corresponding to the first island portion 11 may include polymer resin layers formed simultaneously during the same process. In another embodiment, the substrate 100 corresponding to the first bridging portion 12 may have a different stacking structure than the substrate 100 corresponding to the first island portion 11. In one embodiment, the substrate 100 corresponding to the first bridging portion 12 may have a multilayer structure including a base layer comprising a polymer resin and a barrier layer comprising an inorganic insulating material, and the substrate 100 corresponding to the first bridging portion 12 may have a polymer resin layer structure without a layer comprising an inorganic insulating material.

[0111] As described above, the wiring WL of the first bridging portion 12 can be a signal line (e.g., gate line, data line, etc.) configured to provide electrical signals to transistors included in the pixel driving circuit portion PC of the first island portion 11, or a voltage line (e.g., drive voltage line, initialization voltage line, etc.) configured to provide voltage. An encapsulation layer 300 may also be disposed on the first bridging portion 12. In another embodiment, the encapsulation layer 300 may not be present in the first bridging portion 12.

[0112] refer to Figures 4a to 4c and Figure 5 The substrate 100 corresponding to the first island portion 11 and the substrate 100 corresponding to the first bridging portion 12 can be connected to each other. In other words, the above... Figures 4a to 4c The floor plan shown can be compared with Figure 5 The plan view of the substrate 100 is substantially the same. In other words, the substrate 100 may include a region corresponding to the first island portion 11, a region corresponding to the first bridging portion 12, and an opening 100OP1 having the same shape as the first opening CS1.

[0113] Similarly, the encapsulation layer 300 corresponding to the first island portion 11 and the encapsulation layer 300 corresponding to the first bridging portion 12 can be connected to each other. As an example, the above... Figures 4a to 4c The plan view shown may be substantially the same as the plan view of the encapsulation layer 300. In other words, the encapsulation layer 300 may include a region corresponding to the first island portion 11, a region corresponding to the first bridging portion 12, and an opening 300OP1 having the same shape as the first opening CS1.

[0114] The circuit light-emitting element layer 200 between the substrate 100 and the encapsulation layer 300 may include a buffer layer 111, a pixel driving circuit portion PC, wiring WL, an insulating layer IL, and a light-emitting element LED. Similar to the substrate 100, the layer on top of the substrate 100 has... Figures 4a to 4cThe plan view shown may be substantially the same as the plan view of the circuit light-emitting element layer 200. In other words, the circuit light-emitting element layer 200 may include an opening 200OP1 having the same shape as the first opening CS1.

[0115] Figures 6a to 6c These are equivalent circuit diagrams of the sub-pixels of the display device 1 according to the embodiments.

[0116] refer to Figure 6a The light-emitting element (LED) corresponding to the sub-pixel can be electrically connected to the pixel driving circuit section PC, and the pixel driving circuit section PC can include a first transistor T1, a second transistor T2, and a storage capacitor Cst. The pixel driving circuit section PC can be electrically connected to signal lines and voltage lines. The signal lines can include gate lines (such as the first scan line SL1) and data lines DL. The voltage lines can include a first voltage line VDDL.

[0117] The second transistor T2 can be electrically connected to the first scan line SL1 and the data line DL. The first scan line SL1 can be configured to provide a first scan signal GW1 to the gate electrode of the second transistor T2. The second transistor T2 can be configured to transmit a data signal Dm to the first transistor T1 according to the first scan signal GW1 input from the first scan line SL1, wherein the data signal Dm is input from the data line DL.

[0118] The storage capacitor Cst can be electrically connected to the second transistor T2 and the first voltage line VDDL, and can be configured to store a voltage corresponding to the difference between the voltage transmitted from the second transistor T2 and the first power voltage VDD supplied by the first voltage line VDDL.

[0119] The first transistor T1 is a driving transistor and can be configured to control the driving current flowing through the light-emitting element LED. The first transistor T1 can be connected to a first voltage line VDDL and a storage capacitor Cst. The first transistor T1 can be configured to control the driving current flowing from the first voltage line VDDL to the light-emitting element LED in response to the voltage value stored in the storage capacitor Cst. The light-emitting element LED can be configured to emit light with a preset brightness based on the driving current. The first electrode of the light-emitting element LED can be electrically connected to the first transistor T1, and the second electrode of the light-emitting element LED can be electrically connected to a second voltage line VSSL configured to supply a second power voltage VSS.

[0120] Despite Figure 6a The pixel driving circuit section PC shown includes two transistors and a storage capacitor, but the pixel driving circuit section PC may include three or more transistors.

[0121] refer to Figure 6bThe pixel driving circuit PC may include a first transistor T1, a second transistor T2, a third transistor T3, a fourth transistor T4, a fifth transistor T5, a sixth transistor T6, a seventh transistor T7, and a storage capacitor Cst.

[0122] The pixel driving circuit section PC is electrically connected to signal lines and voltage lines. Signal lines may include gate lines (such as the first scan line SL1, second scan line SL2, third scan line SL3, fourth scan line SL4, and transmit control line EML) and data lines DL. Voltage lines may include a first initialization voltage line VIL1, a second initialization voltage line VIL2, and a first voltage line VDDL.

[0123] A first voltage line VDDL can be configured to transmit a first electrical voltage VDD to a first transistor T1. A first initialization voltage line VIL1 can be configured to transmit a first initialization voltage Vint to the pixel driving circuit section PC, wherein the first initialization voltage Vint initializes the first transistor T1. A second initialization voltage line VIL2 can be configured to transmit a second initialization voltage Vaint to the pixel driving circuit section PC, wherein the second initialization voltage Vaint initializes the first electrode of the light-emitting element LED.

[0124] The first transistor T1 can be electrically connected to the first voltage line VDDL via the fifth transistor T5, and can be electrically connected to the light-emitting element LED via the sixth transistor T6. The first transistor T1 acts as a driving transistor, receiving the data signal Dm according to the switching operation of the second transistor T2, and supplying driving current to the light-emitting element LED.

[0125] The second transistor T2 serves as a data write transistor and is electrically connected to the first scan line SL1 and the data line DL. The second transistor T2 can be connected to the first voltage line VDDL via the fifth transistor T5. The second transistor T2 is turned on according to the first scan signal GW transmitted through the first scan line SL1 and performs a switching operation to transmit the data signal Dm to the first node N1, the data signal Dm being transmitted through the data line DL.

[0126] The third transistor T3 is electrically connected to the first scan line SL1 and is electrically connected to the light-emitting element LED through the sixth transistor T6. The third transistor T3 can be turned on according to the first scan signal GW to provide a diode connection to the first transistor T1, wherein the first scan signal GW is transmitted through the first scan line SL1.

[0127] The fourth transistor T4 serves as the first initialization transistor and is electrically connected to the first initialization voltage line VIL1. The fourth transistor T4 can be turned on according to the third scan signal GI to initialize the gate voltage of the first transistor T1 by transmitting the first initialization voltage Vint to the gate electrode of the first transistor T1, wherein the first initialization voltage Vint comes from the first initialization voltage line VIL1 and the third scan signal GI is transmitted through the third scan line SL3. The third scan signal GI may correspond to the first scan signal of another pixel driving circuit section arranged in the row preceding the relevant pixel driving circuit section.

[0128] The fifth transistor T5 can be an operation control transistor, and the sixth transistor T6 can be an emitter control transistor. The fifth transistor T5 and the sixth transistor T6 can be electrically connected to the emitter control line EML, and the emitter control signal EM transmitted through the emitter control line EML is simultaneously turned on, and a current path can be formed so that the drive current flows from the first voltage line VDDL to the light-emitting element LED.

[0129] The seventh transistor T7 serves as the second initialization transistor and can be electrically connected to the second scan line SL2, the second initialization voltage line VIL2, and the sixth transistor T6. The seventh transistor T7 is turned on according to the second scan signal GB transmitted through the second scan line SL2 and is configured to transmit the second initialization voltage Vaint from the second initialization voltage line VIL2 to the first electrode of the light-emitting element LED, thereby initializing the first electrode of the light-emitting element LED.

[0130] The storage capacitor Cst includes a first electrode CE1 and a second electrode CE2. The first electrode CE1 is electrically connected to the gate electrode of the first transistor T1, and the second electrode CE2 is electrically connected to the first voltage line VDDL. The storage capacitor Cst can maintain the voltage applied to the gate electrode of the first transistor T1 by storing and holding a voltage corresponding to the voltage difference between the two opposite ends of the first voltage line VDDL and the gate electrode of the first transistor T1.

[0131] refer to Figure 6c The pixel driving circuit PC may include a first transistor T1, a second transistor T2, a third transistor T3, a fourth transistor T4, a fifth transistor T5, a sixth transistor T6, a seventh transistor T7, an eighth transistor T8, a ninth transistor T9, a storage capacitor Cst, and an auxiliary capacitor Ca.

[0132] The pixel driving circuit section PC is electrically connected to signal lines and voltage lines. Signal lines may include gate lines (such as the first scan line SL1, second scan line SL2, third scan line SL3, fourth scan line SL4, and transmit control line EML) and data lines DL. Voltage lines may include a first initialization voltage line VIL1, a second initialization voltage line VIL2, a sustaining voltage line VSL, and a first voltage line VDDL.

[0133] A first voltage line VDDL can be configured to transmit a first power voltage VDD to a first transistor T1. A first initialization voltage line VIL1 can be configured to transmit a first initialization voltage Vint to the pixel driving circuit section PC, wherein the first initialization voltage Vint initializes the first transistor T1. A second initialization voltage line VIL2 can be configured to transmit a second initialization voltage Vaint to the pixel driving circuit section PC, wherein the second initialization voltage Vaint initializes the first electrode of the light-emitting element LED. A sustaining voltage line VSL can be configured to provide a sustaining voltage VSUS to the second node N2 (e.g., the second electrode CE2 of the storage capacitor Cst) during the initialization and data write sections.

[0134] The first transistor T1 can be electrically connected to the first voltage line VDDL via the fifth transistor T5 and the eighth transistor T8, and can be electrically connected to the light-emitting element LED via the sixth transistor T6. The first transistor T1 acts as a driving transistor, receives the data signal Dm according to the switching operation of the second transistor T2, and can supply driving current to the light-emitting element LED.

[0135] The second transistor T2 is electrically connected to the first scan line SL1 and the data line DL, and is electrically connected to the first voltage line VDDL through the fifth transistor T5 and the eighth transistor T8. The second transistor T2 can be turned on according to the first scan signal GW transmitted through the first scan line SL1, and can perform a switching operation to transmit the data signal Dm to the first node N1, wherein the data signal Dm is transmitted through the data line DL.

[0136] The third transistor T3 is electrically connected to the first scan line SL1 and to the light-emitting element LED via the sixth transistor T6. The third transistor T3 can be turned on according to the first scan signal GW to compensate the threshold voltage of the first transistor T1 by diode connection, wherein the first scan signal GW is transmitted through the first scan line SL1.

[0137] The fourth transistor T4 is electrically connected to the third scan line SL3 and the first initialization voltage line VIL1. It is turned on according to the third scan signal GI transmitted through the third scan line SL3, and the voltage of the gate electrode of the first transistor T1 is initialized by transmitting the first initialization voltage Vint to the gate electrode of the first transistor T1, wherein the first initialization voltage Vint comes from the first initialization voltage line VIL1. The third scan signal GI can correspond to the first scan signal of another pixel driving circuit section arranged in the row preceding the relevant pixel driving circuit section.

[0138] The fifth transistor T5, the sixth transistor T6, and the eighth transistor T8 can be electrically connected to the emitter control line EML. The emitter control signal EM transmitted through the emitter control line EML is simultaneously turned on, and a current path can be formed so that the drive current flows from the first voltage line VDDL to the light-emitting element LED.

[0139] The seventh transistor T7 serves as the second initialization transistor and can be electrically connected to the second scan line SL2, the second initialization voltage line VIL2, and the sixth transistor T6. The seventh transistor T7 is turned on according to the second scan signal GB transmitted through the second scan line SL2 and is configured to transmit the second initialization voltage Vaint from the second initialization voltage line VIL2 to the first electrode of the light-emitting element LED, thereby initializing the first electrode of the light-emitting element LED.

[0140] The ninth transistor T9 can be electrically connected to the second scan line SL2, the second electrode CE2 of the storage capacitor Cst, and the sustaining voltage line VSL. The ninth transistor T9 can be turned on according to the second scan signal GB transmitted through the second scan line SL2, and is configured to transmit the sustaining voltage VSUS to the second node N2 (e.g., the second electrode CE2 of the storage capacitor Cst) during the initialization segment and the data write segment.

[0141] Each of the eighth transistor T8 and the ninth transistor T9 can be electrically connected to the second node N2 (e.g., the second electrode CE2 of the storage capacitor Cst). In one embodiment, during the initialization and data write phases, the eighth transistor T8 can be turned off and the ninth transistor T9 can be turned on, and during the transmit phase, the eighth transistor T8 can be turned on and the ninth transistor T9 can be turned off. Because the sustaining voltage VSUS is transmitted to the second node N2 during the initialization and data write phases, the uniformity of the brightness of the display device corresponding to the voltage drop of the first voltage line VDDL (e.g., long-range uniformity (“LRU”)) can be improved.

[0142] The storage capacitor Cst includes a first electrode CE1 and a second electrode CE2. The first electrode CE1 is electrically connected to the gate electrode of the first transistor T1, and the second electrode CE2 is electrically connected to the eighth transistor T8 and the ninth transistor T9.

[0143] An auxiliary capacitor Ca can be electrically connected to the sixth transistor T6, the sustaining voltage line VSL, and the first electrode of the light-emitting element LED. When the seventh transistor T7 and the ninth transistor T9 are turned on, the auxiliary capacitor Ca stores and maintains a voltage corresponding to the voltage difference between the first electrode of the light-emitting element LED and the sustaining voltage line VSL, thereby preventing the black state brightness from increasing when the sixth transistor T6 is turned off.

[0144] Figure 7 This is a schematic cross-sectional view of a portion of the display device 1 according to an embodiment.

[0145] Figure 7 Can be used as a reference Figure 1 , Figures 2a to 2e , Figure 3 , Figures 4a to 4c and Figure 5 The description of the display area DA (see Figure 1 (Corresponding to) Specifically, Figure 7 Can be used as a reference Figures 4a to 4c and Figure 5 The first island section 11 (see description) Figure 4a )correspond.

[0146] refer to Figure 7 The display device 1 according to the embodiment may include a substrate 100, a buffer layer 201, a pixel driving circuit portion PC, an inorganic insulating layer IIL, an organic insulating layer OIL, a first connecting electrode CM1, a second connecting electrode CM2, a first conductive organic film 215, a second conductive organic film 217, an inorganic light-emitting diode mLED, a dam layer BKL, an encapsulation layer 300, and a filter panel 400.

[0147] Substrate 100 may include various materials. Specifically, substrate 100 may include glass, metal, organic materials, etc. In one embodiment, substrate 100 may include a flexible material. As an example, substrate 100 may include a bendable, foldable, or rollable material. The flexible material of substrate 100 may be ultrathin glass, metal, or plastic. When substrate 100 includes plastic, substrate 100 may include polyimide (“PI”). As another example, substrate 100 may include different kinds of plastic materials. Reference Figure 7 The substrate 100 described above can be referenced. Figure 5 The substrate 100 described (see Figure 5 )correspond.

[0148] A buffer layer 201 may be disposed on the substrate 100. The buffer layer 201 prevents impurities from penetrating the semiconductor layer of the thin-film transistor. (Reference) Figure 7 The described buffer layer 201 can be referenced above. Figure 5 The described buffer layer 111 (see Figure 5 )correspond.

[0149] The inorganic insulating layer IIL can be disposed on the buffer layer 201. That is, the inorganic insulating layer IIL can be disposed above the substrate 100. The inorganic insulating layer IIL may include inorganic insulating materials containing silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, etc. The inorganic insulating layer IIL may include a single layer or multiple layers containing the above materials.

[0150] The inorganic insulating layer IIL may include a gate insulating layer 203, a first interlayer insulating layer 205, and a second interlayer insulating layer 207. The first interlayer insulating layer 205 may be disposed on the gate insulating layer 203, and the second interlayer insulating layer 207 may be disposed on the first interlayer insulating layer 205. That is, in a third direction (e.g., the z-direction) away from the substrate 100, the gate insulating layer 203, the first interlayer insulating layer 205, and the second interlayer insulating layer 207 may be disposed sequentially.

[0151] The pixel driving circuit portion PC can be disposed on the buffer layer 201. That is, the pixel driving circuit portion PC can be disposed above the substrate 100. The pixel driving circuit portion PC may include a thin-film transistor (TFT) and a storage capacitor (Cst).

[0152] A thin-film transistor (TFT) may include a semiconductor layer Act, a gate electrode GE, a source electrode SE, and a drain electrode DE. In this embodiment, although a top-gate TFT is shown where the gate electrode GE is disposed above the semiconductor layer Act and a gate insulating layer 203 is located between them, in another embodiment, the TFT may be a bottom-gate TFT.

[0153] The semiconductor layer Act may include polycrystalline silicon. Alternatively, the semiconductor layer Act may include amorphous silicon, oxide semiconductor, or organic semiconductor. The gate electrode GE may include a low-resistance metallic material. The gate electrode GE may include a conductive material comprising molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and have a single-layer or multi-layer structure comprising the above materials.

[0154] The source electrode SE and drain electrode DE may each comprise a highly conductive material. The source electrode SE and drain electrode DE may each comprise a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may comprise a single layer or multiple layers comprising the above materials. In one embodiment, the source electrode SE and drain electrode DE may each comprise a multilayer of Ti / Al / Ti.

[0155] The storage capacitor Cst may include a lower electrode CE1 and an upper electrode CE2, which overlap each other in a planar view and are separated by a first interlayer insulating layer 205. In the planar view, the storage capacitor Cst may overlap with a thin-film transistor (TFT). Regarding this, in Figure 7 The diagram shows the gate electrode GE of the thin-film transistor TFT serving as the lower electrode CE1 of the storage capacitor Cst. In another embodiment, in a plan view, the storage capacitor Cst may not overlap with the thin-film transistor TFT. The storage capacitor Cst may be covered by a second interlayer insulating layer 207.

[0156] refer to Figure 7 The pixel driving circuit section described in the PC can be compared with the reference. Figure 5 The pixel driving circuit section PC described (see Figure 5 )correspond.

[0157] An organic insulating layer (OIL) can be disposed on an inorganic insulating layer (IIL). The organic insulating layer (OIL) can cover the pixel driving circuit portion (PC). The organic insulating layer (OIL) can include organic insulating materials comprising general-purpose polymers (such as polymethyl methacrylate (“PMMA”) or polystyrene (“PS”), polymer derivatives having phenolic groups, acrylic polymers, imide polymers, aryl ether polymers, amide polymers, fluorinated polymers, p-xylene polymers, vinyl alcohol polymers, or blends thereof.

[0158] The organic insulating layer (OIL) may include a first organic insulating layer 209, a second organic insulating layer 211, and a third organic insulating layer 213. The first organic insulating layer 209 may cover the pixel driving circuit portion (PC), the second organic insulating layer 211 may be disposed on the first organic insulating layer 209, and the third organic insulating layer 213 may be disposed on the second organic insulating layer 211. That is, in a third direction (e.g., the z-direction) away from the substrate 100, the first organic insulating layer 209, the second organic insulating layer 211, and the third organic insulating layer 213 may be sequentially disposed. All three organic insulating layers may comprise the same material or different materials. However, various modifications are possible.

[0159] To form the first organic insulating layer 209, the second organic insulating layer 211, and the third organic insulating layer 213, a liquid organic material is coated, and then a masking process and a developing process can be performed to form contact holes. As described above, because the first organic insulating layer 209, the second organic insulating layer 211, and the third organic insulating layer 213 are formed by curing the liquid organic material, their upper surfaces can be formed to be substantially flat.

[0160] refer to Figure 7 The inorganic insulating layer IIL and organic insulating layer OIL described above can be referenced. Figure 5 The insulating layer IL described (see Figure 5 )correspond.

[0161] The first connecting electrode CM1 can be disposed on the organic insulating layer OIL and electrically connected to the pixel driving circuit section PC. The first connecting electrode CM1 can be electrically connected to the reference above. Figures 6a to 6c The first voltage line described is VDDL (see...) Figure 6a ).

[0162] The first connecting electrode CM1 may include a 1-1 connecting electrode CM1-1 and a 1-2 connecting electrode CM1-2. The 1-1 connecting electrode CM1-1 may be disposed between the first organic insulating layer 209 and the second organic insulating layer 211, and may contact the pixel driving circuit portion PC. The 1-2 connecting electrode CM1-2 may be disposed on the 1-1 connecting electrode CM1-1. The 1-2 connecting electrode CM1-2 may be disposed between the second organic insulating layer 211 and the third organic insulating layer 213, and may contact the 1-1 connecting electrode CM1-1.

[0163] The second connecting electrode CM2 can be disposed on the organic insulating layer OIL. As an example, the second connecting electrode CM2 can be disposed between the second organic insulating layer 211 and the third organic insulating layer 213. The second connecting electrode CM2 can be connected to the reference above. Figures 6a to 6c The second voltage line VSSL described (see...) Figure 6a ).

[0164] Despite Figure 7 The diagram shows that the first connecting electrode CM1-1 and the second connecting electrode CM2 are arranged in different layers and the first connecting electrode CM1-2 and the second connecting electrode CM2 are arranged in the same layer. However, this is just an example and the arrangement of the first connecting electrode CM1 and the second connecting electrode CM2 is not limited to this.

[0165] An organic insulating layer (OIL) may define a first opening OP1 and a second opening OP2 therein. The first opening OP1 and the second opening OP2 may be separate from each other.

[0166] In the plan view, the first opening OP1 may overlap with the first connecting electrode CM1. The first opening OP1 may penetrate the organic insulating layer OIL to contact the first connecting electrode CM1. As an example, the first opening OP1 may penetrate the third organic insulating layer 213. The first opening OP1 may be surrounded by the organic insulating layer OIL and the first connecting electrode CM1.

[0167] In the plan view, the second opening OP2 may overlap with the second connecting electrode CM2. The second opening OP2 may penetrate the organic insulating layer OIL to contact the second connecting electrode CM2. As an example, the second opening OP2 may penetrate the third organic insulating layer 213. The second opening OP2 may be surrounded by the organic insulating layer OIL and the second connecting electrode CM2.

[0168] The first conductive organic film 215 can be housed in the first opening OP1 for electrical connection to the pixel driving circuit portion PC. As an example, the first conductive organic film 215 can contact a first connection electrode CM1 electrically connected to the pixel driving circuit portion PC. That is, the first connection electrode CM1 can be disposed between the pixel driving circuit portion PC and the first conductive organic film 215 to connect the pixel driving circuit portion PC to the first conductive organic film 215.

[0169] The first conductive organic film 215 may include a carbon black material. In this case, the first connecting electrode CM1 may include at least one of indium tin oxide (ITO), indium zinc oxide (IZO), and molybdenum (Mo) that is conductive to the first conductive organic film 215. As an example, the upper surface of the 1-2 connecting electrode CM1-2 may be treated with at least one of indium tin oxide (ITO), indium zinc oxide (IZO), and molybdenum (Mo).

[0170] The second conductive organic film 217 can be housed in the second opening OP2 and contact the second connecting electrode CM2. The second conductive organic film 217 can be disposed on the same layer as the first conductive organic film 215. The second connecting electrode CM2 can be disposed between the pixel driving circuit portion PC and the second conductive organic film 217, and can be connected to the second conductive organic film 217. The second conductive organic film 217 can be electrically connected to the second connecting electrode CM2. Because the second opening OP2 houses the second conductive organic film 217, the second conductive organic film 217 can be separated from the first conductive organic film 215.

[0171] The second conductive organic film 217 comprises the same material as the first conductive organic film 215, and the second connecting electrode CM2 may comprise the same material as the first connecting electrode CM1. The second conductive organic film 217 may comprise a carbon black material. In this case, the second connecting electrode CM2 may comprise at least one of indium tin oxide (ITO), indium zinc oxide (IZO), and molybdenum (Mo) that conducts electricity to the second conductive organic film 217. As an example, the upper surface of the second connecting electrode CM2 may be treated with at least one of indium tin oxide (ITO), indium zinc oxide (IZO), and molybdenum (Mo).

[0172] An inorganic light-emitting diode (mLED) can be configured to emit a first light L1 and may include a first electrode 241, a first semiconductor layer 242, an intermediate layer 243, a second semiconductor layer 244, and a second electrode 245.

[0173] A first semiconductor layer 242 can be disposed on the first electrode 241, an intermediate layer 243 can be disposed on the first semiconductor layer 242, and a second semiconductor layer 244 can be disposed on the intermediate layer 243. That is, the intermediate layer 243 can be disposed between the first semiconductor layer 242 and the second semiconductor layer 244. Furthermore, the second electrode 245 can be separated from the first electrode 241, and the second semiconductor layer 244 can be disposed on the second electrode 245. The first electrode 241, the first semiconductor layer 242, the intermediate layer 243, the second semiconductor layer 244, and the second electrode 245 can be electrically connected to each other.

[0174] At least a portion of the first electrode 241 may be housed in and electrically connected to the first conductive organic film 215. Additionally, at least a portion of the second electrode 245 may be housed in and electrically connected to the second conductive organic film 217.

[0175] In one embodiment, the first semiconductor layer 242 may include a p-type semiconductor layer. The p-type semiconductor layer may include semiconductor materials with a composition of InxAlyGa1-x-yN (0≤x≤1, 0≤y≤1, 0≤x+y≤1) (such as GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, etc.), and may be doped with p-type dopants (such as Mg, Zn, Ca, Sr, Ba, etc.).

[0176] As an example, the second semiconductor layer 244 may include an n-type semiconductor layer. The n-type semiconductor layer may include semiconductor materials (such as GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, etc.) with the composition InxAlyGa1-x-yN (0≤x≤1, 0≤y≤1, 0≤x+y≤1), and may be doped with n-type dopants (such as Si, Ge, Sn, etc.).

[0177] Intermediate layer 243 is a region where electrons and holes recombine. Due to electron and hole recombination, intermediate layer 243 transitions to lower energy levels and can generate light with corresponding wavelengths. In one embodiment, for example, intermediate layer 243 may comprise a semiconductor material having the composition InxAlyGa1-x-yN (0≤x≤1, 0≤y≤1, 0≤x+y≤1) and may be formed as a single quantum well structure or a multiple quantum well structure (“MQW”). Alternatively, intermediate layer 243 may comprise a quantum wire structure or a quantum dot structure.

[0178] Despite Figure 7 The document describes a first semiconductor layer 242 comprising a p-type semiconductor layer and a second semiconductor layer 244 comprising an n-type semiconductor layer; however, the embodiments are not limited thereto. In another embodiment, the first semiconductor layer 242 may comprise an n-type semiconductor layer, and the second semiconductor layer 244 may comprise a p-type semiconductor layer.

[0179] The dam layer BKL can be disposed on the organic insulating layer OIL. The dam layer BKL may include insulating material and define openings exposing the first opening OP1 and the second opening OP2. That is, an inorganic light-emitting diode mLED can be disposed in the openings disposed in the dam layer BKL.

[0180] The encapsulation layer 300 can be disposed on the inorganic light-emitting diode (mLED) and the barrier layer BKL. The inorganic light-emitting diode (mLED) can be covered by the encapsulation layer 300. The encapsulation layer 300 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. In one embodiment, the encapsulation layer 300 may include a first inorganic encapsulation layer 301, an organic encapsulation layer 303, and a second inorganic encapsulation layer 305 stacked in sequence.

[0181] Each of the first inorganic encapsulation layer 301 and the second inorganic encapsulation layer 305 may include at least one inorganic insulating material. The inorganic insulating material may include alumina, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and / or silicon oxynitride. The organic encapsulation layer 303 may include polymeric materials. Polymeric materials may include acrylic resins, epoxy resins, polyimide, and polyethylene. Acrylic resins may include, for example, polymethyl methacrylate, polyacrylic acid, etc.

[0182] refer to Figure 7 The described encapsulation layer 300 can be referenced above. Figure 5 The encapsulation layer 300 described (see...) Figure 5 )correspond.

[0183] The filter panel 400 can be disposed on the encapsulation layer 300. That is, the filter panel 400 can be disposed above the inorganic light-emitting diode mLED. The filter panel 400 may include a color converter 401, a color filter 403, and a light-shielding portion 405.

[0184] Color converter 401 can be configured to convert a first light L1 into a second light L2, wherein the first light L1 is emitted from an inorganic light-emitting diode (mLED). The second light L2 can be light of a different or the same color as the first light L1. The first light L1 emitted from the inorganic light-emitting diode (mLED) can be blue light. Color converter 401 can be configured to convert the blue first light L1 into red, green, or blue. Color filter 403 can be disposed on color converter 401. Color filter 403 can have the same color as the light converted by color converter 401. Accordingly, the second light L2 converted by color converter 401 can be improved in purity while passing through color filter 403 and emitted to the outside. Light-shielding portion 405 can surround color converter 401 and color filter 403. Light-shielding portion 405 can include a black matrix.

[0185] Color converter 401 may include quantum dots and scattering particles. The quantum dots may have a core-shell structure comprising a core comprising nanocrystals and a shell surrounding the core. The core of the quantum dots may be one of group II-VI compounds, group III-V compounds, group IV-VI compounds, group IV elements, group IV compounds, and combinations thereof. The scattering particles may include TiO2.

[0186] Figure 8 This is a schematic cross-sectional view of a portion of the display device 1 according to an embodiment. Specifically, Figure 8 yes Figure 7 An enlarged view of area A.

[0187] refer to Figure 7 and Figure 8 The first conductive organic film 215 can be disposed in the first opening OP1. The first conductive organic film 215 can contact the third organic insulating layer 213, the 1-2 connecting electrode CM1-2, and the first electrode 241. The shape of the first conductive organic film 215 can correspond to the shape of the first opening OP1.

[0188] The upper surface 215U of the first conductive organic film 215 may be recessed from the top surface 213T of the organic insulating layer OIL. A height difference H1 in a third direction (e.g., the z-direction or the -z-direction) may be formed between the upper surface 215U of the first conductive organic film 215 and the top surface 213T of the organic insulating layer OIL. Here, "top surface" is the highest of a plurality of upper surfaces having a plurality of heights. That is, a step difference may be formed between the first conductive organic film 215 and the third organic insulating layer 213. In this structure, the first conductive organic film 215 may not protrude from the organic insulating layer OIL.

[0189] At least a portion of the first electrode 241 may be contained within the first conductive organic film 215. The lower portion of the first electrode 241 may be in contact with the first conductive organic film 215. The lower surface of the first electrode 241 may be immersed in the first conductive organic film 215.

[0190] The thickness D241 of the first electrode 241 can be greater than the height difference H1 in a third direction (e.g., the z-direction or -z-direction) between the upper surface 215U of the first conductive organic film 215 and the top surface 213T of the organic insulating layer OIL. Accordingly, the first semiconductor layer 242 disposed on the first electrode 241 can be separated from the first conductive organic film 215. That is, only the first electrode 241 of the inorganic light-emitting diode can be in contact with the first conductive organic film 215.

[0191] Figure 9 This is a schematic cross-sectional view of a portion of the display device 1 according to an embodiment. Specifically, Figure 9 yes Figure 7 A magnified view of area B.

[0192] refer to Figure 7 and Figure 9 The second conductive organic film 217 can be disposed in the second opening OP2. The second conductive organic film 217 can contact the third organic insulating layer 213, the second connecting electrode CM2, and the second electrode 245. The shape of the second conductive organic film 217 can correspond to the shape of the second opening OP2.

[0193] The upper surface 217U of the second conductive organic film 217 can be recessed from the top surface 213T of the organic insulating layer OIL. A height difference H2 can be formed between the upper surface 217U of the second conductive organic film 217 and the top surface 213T of the organic insulating layer OIL. That is, a step difference can be formed between the second conductive organic film 217 and the third organic insulating layer 213. In this structure, the second conductive organic film 217 does not need to protrude from the organic insulating layer OIL.

[0194] At least a portion of the second electrode 245 may be contained within the second conductive organic film 217. The lower portion of the second electrode 245 may be in contact with the second conductive organic film 217. The lower surface of the second electrode 245 may be immersed in the second conductive organic film 217.

[0195] The thickness D245 of the second electrode 245 can be greater than the height difference H2 between the upper surface 217U of the second conductive organic film 217 and the top surface 213T of the organic insulating layer OIL. Accordingly, the second semiconductor layer 244 disposed on the second electrode 245 can be separated from the second conductive organic film 217. That is, only the second electrode 245 of the inorganic light-emitting diode can be in contact with the second conductive organic film 217.

[0196] Figure 10 This is a schematic cross-sectional view of a portion of the display device 1 according to an embodiment.

[0197] Figure 10 Can be used as a reference Figure 1 , Figures 2a to 2e , Figure 3 , Figures 4a to 4c and Figure 5 The description of the display area DA (see Figure 1 (Corresponding to) Specifically, Figure 10 Can be used as a reference Figures 4a to 4c and Figure 5 The first island section 11 (see description) Figure 4a )correspond.

[0198] exist Figure 10 In, with Figure 7 The same reference numerals in the accompanying drawings denote the same components, and therefore, repeated descriptions are omitted.

[0199] refer to Figure 10 The display device 1 according to the embodiment may include a substrate 100, a buffer layer 201, a pixel driving circuit portion PC, an inorganic insulating layer IIL, an organic insulating layer OIL, a first connecting electrode CM1, a second connecting electrode CM2, a first conductive organic film 215, a second conductive organic film 217, an inorganic light-emitting diode mLED, a dam layer BKL, an encapsulation layer 300, and a filter panel 400.

[0200] The substrate 100 may include various materials. The substrate 100 may include flexible materials. As an example, the substrate 100 may include materials that are bendable, foldable, or rollable.

[0201] A buffer layer 201 may be disposed on the substrate 100. The buffer layer 201 can prevent impurities from penetrating the semiconductor layer of the thin-film transistor.

[0202] The inorganic insulating layer IIL can be disposed on the buffer layer 201. That is, the inorganic insulating layer IIL can be disposed above the substrate 100.

[0203] The inorganic insulating layer IIL may include a gate insulating layer 203, a first interlayer insulating layer 205, and a second interlayer insulating layer 207. The first interlayer insulating layer 205 may be disposed on the gate insulating layer 203, and the second interlayer insulating layer 207 may be disposed on the first interlayer insulating layer 205.

[0204] The pixel driving circuit portion PC can be disposed on the buffer layer 201. That is, the pixel driving circuit portion PC can be disposed above the substrate 100. The pixel driving circuit portion PC may include a thin-film transistor (TFT) and a storage capacitor (Cst).

[0205] A thin-film transistor (TFT) may include a semiconductor layer Act, a gate electrode GE, a source electrode SE, and a drain electrode DE. The semiconductor layer Act may include polycrystalline silicon. The gate electrode GE may include a low-resistance metallic material. The source electrode SE and the drain electrode DE may each include a material with high conductivity.

[0206] The storage capacitor Cst may include a lower electrode CE1 and an upper electrode CE2, which overlap each other in a plan view and a first interlayer insulating layer 205 is located between them. In the plan view, the storage capacitor Cst may overlap with a thin-film transistor (TFT).

[0207] An organic insulating layer (OIL) can be disposed on an inorganic insulating layer (IIL). The organic insulating layer (OIL) can cover the pixel driving circuit portion (PC). The organic insulating layer (OIL) may include a first organic insulating layer (209), a second organic insulating layer (211), and a third organic insulating layer (213). The first organic insulating layer (209) can cover the pixel driving circuit portion (PC), the second organic insulating layer (211) can be disposed on the first organic insulating layer (209), and the third organic insulating layer (213) can be disposed on the second organic insulating layer (211).

[0208] The first connecting electrode CM1 can be disposed on the organic insulating layer OIL and can be electrically connected to the pixel driving circuit section PC. The first connecting electrode CM1 can be connected to the reference above. Figures 6a to 6c The first voltage line described is VDDL (see...) Figure 6c ).

[0209] The first connecting electrode CM1 may include a 1-1 connecting electrode CM1-1 and a 1-2 connecting electrode CM1-2. The 1-1 connecting electrode CM1-1 may be disposed between the first organic insulating layer 209 and the second organic insulating layer 211, and may contact the pixel driving circuit portion PC. The 1-2 connecting electrode CM1-2 may be disposed on the 1-1 connecting electrode CM1-1. The 1-2 connecting electrode CM1-2 may be disposed between the second organic insulating layer 211 and the third organic insulating layer 213, and may contact the 1-1 connecting electrode CM1-1.

[0210] The second connecting electrode CM2 can be disposed on the organic insulating layer OIL. As an example, the second connecting electrode CM2 can be disposed between the second organic insulating layer 211 and the third organic insulating layer 213. The second connecting electrode CM2 can be connected to the reference above. Figures 6a to 6c The second voltage line VSSL described (see...) Figure 6c ).

[0211] An organic insulating layer (OIL) may define a first opening OP1 and a second opening OP2 therein. The first opening OP1 and the second opening OP2 may be separate from each other.

[0212] In the plan view, the first opening OP1 may overlap with the first connecting electrode CM1. The first opening OP1 may penetrate the organic insulating layer OIL to contact the first connecting electrode CM1. As an example, the first opening OP1 may penetrate the third organic insulating layer 213. The first opening OP1 may be surrounded by the organic insulating layer OIL and the first connecting electrode CM1.

[0213] In the plan view, the second opening OP2 may overlap with the second connecting electrode CM2. The second opening OP2 may penetrate the organic insulating layer OIL to contact the second connecting electrode CM2. As an example, the second opening OP2 may penetrate the third organic insulating layer 213. The second opening OP2 may be surrounded by the organic insulating layer OIL and the second connecting electrode CM2.

[0214] The first conductive organic film 215 can be housed in the first opening OP1 for electrical connection to the pixel driving circuit portion PC. As an example, the first conductive organic film 215 can contact a first connection electrode CM1 electrically connected to the pixel driving circuit portion. That is, the first connection electrode CM1 can be disposed between the pixel driving circuit portion PC and the first conductive organic film 215 to connect the pixel driving circuit portion PC to the first conductive organic film 215.

[0215] The first conductive organic film 215 may include a carbon black material. In this case, the first connecting electrode CM1 may include at least one of indium tin oxide (ITO), indium zinc oxide (IZO), and molybdenum (Mo) that are conductive to the first conductive organic film 215.

[0216] The second conductive organic film 217 can be housed in the second opening OP2 and can contact the second connecting electrode CM2. The second conductive organic film 217 can be disposed on the same layer as the first conductive organic film 215. The second connecting electrode CM2 can be disposed between the pixel driving circuit portion PC and the second conductive organic film 217 and can be connected to the second conductive organic film 217. The second conductive organic film 217 can be electrically connected to the second connecting electrode CM2. Because the second opening OP2 houses the second conductive organic film 217, the second conductive organic film 217 can be separated from the first conductive organic film 215.

[0217] The second conductive organic film 217 comprises the same material as the first conductive organic film 215, and the second connecting electrode CM2 may comprise the same material as the first connecting electrode CM1. The second conductive organic film 217 may comprise carbon black. In this case, the second connecting electrode CM2 may comprise at least one of indium tin oxide (ITO), indium zinc oxide (IZO), and molybdenum (Mo) that conducts electricity to the second conductive organic film 217.

[0218] An inorganic light-emitting diode (mLED) can be configured to emit a first light L1 and may include a first electrode 241, a first semiconductor layer 242, an intermediate layer 243, a second semiconductor layer 244, and a second electrode 245.

[0219] A first semiconductor layer 242 can be disposed on the first electrode 241, an intermediate layer 243 can be disposed on the first semiconductor layer 242, and a second semiconductor layer 244 can be disposed on the intermediate layer 243. That is, the intermediate layer 243 can be disposed between the first semiconductor layer 242 and the second semiconductor layer 244. Furthermore, the second electrode 245 can be separated from the first electrode 241, and the second semiconductor layer 244 can be disposed on the second electrode 245. The first electrode 241, the first semiconductor layer 242, the intermediate layer 243, the second semiconductor layer 244, and the second electrode 245 can be electrically connected to each other.

[0220] At least a portion of the first electrode 241 may be housed in and electrically connected to the first conductive organic film 215. Additionally, at least a portion of the second electrode 245 may be housed in and electrically connected to the second conductive organic film 217.

[0221] The dam layer BKL can be disposed on the organic insulating layer OIL. The dam layer BKL may include insulating material and includes openings exposing a first opening OP1 and a second opening OP2. That is, an inorganic light-emitting diode mLED can be disposed in the openings disposed in the dam layer BKL.

[0222] The encapsulation layer 300 can be disposed on the inorganic light-emitting diode (mLED) and the barrier layer BKL. The inorganic light-emitting diode (mLED) can be covered by the encapsulation layer 300. The encapsulation layer 300 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. In one embodiment, the encapsulation layer 300 may include a first inorganic encapsulation layer 301, an organic encapsulation layer 303, and a second inorganic encapsulation layer 305 stacked in sequence.

[0223] The filter panel 400 can be disposed on the encapsulation layer 300. That is, the filter panel 400 can be disposed above the inorganic light-emitting diode mLED. The filter panel 400 may include a color filter 403 and a light-shielding portion 405.

[0224] The first light L1 emitted by the inorganic light-emitting diode mLED can be red, green, or blue. The color filter 403 can have the same color as the first light L1 emitted by the inorganic light-emitting diode mLED. Accordingly, the first light L1 emitted by the inorganic light-emitting diode mLED can be improved in purity while passing through the color filter 403 and emitted to the outside. A light-shielding portion 405 can surround the color filter 403. The light-shielding portion 405 can include a black matrix.

[0225] Figures 11a to 11h This is a schematic cross-sectional view of the display device 1 according to an embodiment.

[0226] refer to Figures 11a to 11h This can describe a method for manufacturing display device 1.

[0227] exist Figures 11a to 11h In, with Figures 7 to 10 The same reference numerals in the accompanying drawings denote the same components, and therefore, repeated descriptions are omitted.

[0228] First, refer to Figures 11a to 11e The method of manufacturing the display device 1 may include providing a pixel driving circuit portion PC above a substrate 100, providing an organic insulating layer OIL on the pixel driving circuit portion PC, etching the organic insulating layer OIL to form a first opening OP1, and etching the organic insulating layer OIL to form a second opening OP2 separate from the first opening OP1.

[0229] The pixel driving circuit section PC can be disposed on the substrate 100 within the display area DA. An organic insulating layer OIL can be disposed on the pixel driving circuit section PC. The organic insulating layer OIL can also be disposed on the substrate 100 within the display area DA and the non-display area NDA to cover the pixel driving circuit section PC. Alternatively, the organic insulating layer OIL can be disposed on an inorganic insulating layer IIL within the display area DA and the non-display area NDA.

[0230] Each of etching the organic insulating layer OIL to form a first opening OP1 and etching the organic insulating layer OIL to form a second opening OP2 may include dry etching of the organic insulating layer OIL using an etching gas. Specifically, etching the organic insulating layer OIL to form a first opening OP1 and etching the organic insulating layer OIL to form a second opening OP2 may be performed simultaneously.

[0231] refer to Figure 11a The photoresist material PRM can be disposed on the organic insulating layer OIL. Specifically, the photoresist material PRM can be disposed in both the display area DA and the non-display area NDA of the display device 1. The photoresist material PRM can be a photosensitive material.

[0232] refer to Figure 11b A photomask PM can be disposed above the photoresist material PRM. The photomask PM may include a mask opening OPM and can be arranged in both the display area DA and the non-display area NDA of the display device 1. Light LT can be emitted from the photomask PM toward the photoresist material PRM. That is, the photoresist material PRM can be exposed. As an example, the light LT can be ultraviolet light. A portion of the light LT can be blocked by the photomask PM, and the remainder of the light LT can pass through the mask opening OPM to reach the photoresist material PRM.

[0233] The photoresist material PRM disposed in the display area DA can be divided into a first part PRM1 and a second part PRM2, wherein the first part PRM1 is in contact with the light LT, and the second part PRM2 is not in contact with the light LT. The solubility of the first part PRM1 of the photoresist material PRM can be reduced. That is, the first part PRM1 of the photoresist material PRM can be cured by the light LT. All photoresist materials PRM disposed in the non-display area NDA can be kept out of contact with the light LT. That is, the photoresist materials PRM disposed in the non-display area NDA can be left uncured by the light LT.

[0234] refer to Figure 11c Photoresist material PRM (see Figure 11b The photoresist material (PRL) can be developed into a patterned photoresist layer. In the display area DA, the photoresist material PRM (see...) Figure 11b The first part of the cured PRM1 (see) Figure 11b The second part of PRM2, which is not cured, can be retained (see...). Figure 11b The photoresist layer (PRL) can be removed. Finally, in the display area (DA), the photoresist layer (PRL) may include a light-aperture (OPP). In the non-display area (NDA), the photoresist material (PRM) (see...) Figure 11b ) can be removed.

[0235] refer to Figure 11d In the planar view, the organic insulating layer OIL, which overlaps with the photoresist layer PRL's photo-aperture OPP, can be dry-etched using an etching gas. That is, only the organic insulating layer OIL in the display area DA of the display device 1 can be etched. When the organic insulating layer OIL is dry-etched, the first opening OP1 and the second opening OP2 can be formed within the organic insulating layer OIL. The first connecting electrode CM1 can be exposed from the organic insulating layer OIL through the first opening OP1, and the second connecting electrode CM2 can be exposed from the organic insulating layer OIL through the second opening OP2.

[0236] refer to Figure 11e It can remove the photoresist layer PRL (see Figure 11d Finally, the first opening OP1 and the second opening OP2 can be formed in the organic insulating layer OIL.

[0237] Although reference Figures 11a to 11e A negative photoresist material whose solubility decreases upon contact with light LT is described, but this is merely an example; a positive photoresist material whose solubility increases upon contact with light LT can also be used.

[0238] Because Figures 11a to 11e The organic insulating layer OIL can be etched and dry etching using etching gas can be performed, so the shape and size of the first opening OP1 and the second opening OP2 can be precisely adjusted. That is, in operation, detailed patterning of the organic insulating layer OIL exposing the first connecting electrode CM1 and the second connecting electrode CM2 can be performed.

[0239] refer to Figures 11f to 11g The method of manufacturing the display device 1 may include setting a first conductive organic film 215 in a first opening OP1 and setting a second conductive organic film 217 in a second opening OP2. Specifically, setting the first conductive organic film 215 in the first opening OP1 and setting the second conductive organic film 217 in the second opening OP2 may be performed simultaneously.

[0240] First, refer to Figure 11fEach of the first conductive organic film 215 disposed in the first opening OP1 and the second conductive organic film 217 disposed in the second opening OP2 may include a conductive organic film material 219 disposed on an organic insulating layer OIL, a soft-baked conductive organic film material 219, and a dry conductive organic film material 219.

[0241] A conductive organic film material 219 can be integrally disposed in the display area DA and the non-display area NDA of the display device 1. The conductive organic film material 219 may include carbon black material. The conductive organic film material 219 disposed in the display area DA can be accommodated in the first opening OP1 and the second opening OP2, and is in contact with the first connecting electrode CM1 and the second connecting electrode CM2.

[0242] Soft baking and drying can be performed on the entire display area DA and non-display area NDA of the display device 1. In soft baking, the photoresist material PRM can be cured by receiving heat. In drying, the photoresist material PRM can be dried inside a vacuum chamber. Accordingly, in drying, the solvent of the photoresist material PRM can be removed by evaporation.

[0243] refer to Figure 11g Each of the first conductive organic film 215 disposed in the first opening OP1 and the second conductive organic film 217 disposed in the second opening OP2 may include developing the conductive organic film material 219.

[0244] When the conductive organic film material 219 is developed, it can be removed from the display area DA of the display device 1, except for the first conductive organic film 215 disposed in the first opening OP1 and the second conductive organic film 217 disposed in the second opening OP2.

[0245] Furthermore, in the non-display area NDA of the display device 1, the conductive organic film material 219 may not need to be removed, or the degree of removal may be less compared to the display area DA. The degree of removal of the conductive organic film material 219 in the non-display area NDA can be determined by referring to… Figure 11f The soft baking and drying operations are described. Accordingly, a conductive organic film layer 221 covering the organic insulating layer OIL can be formed on the organic insulating layer OIL in the non-display area NDA.

[0246] The conductive organic film layer 221 can block light in the non-display area NDA. Because the conductive organic film layer 221 for blocking light is simultaneously disposed in the non-display area NDA during the process of disposing the first conductive organic film 215 and the second conductive organic film 217 in the display area DA, the manufacturing process of the display device 1 can be simplified.

[0247] refer to Figure 11h The method of manufacturing display device 1 may include setting an inorganic light-emitting diode mLED.

[0248] Setting an inorganic light-emitting diode (mLED) may include accommodating at least a portion of the first electrode 241 in a first conductive organic film 215 and at least a portion of the second electrode 245 in a second conductive organic film 217.

[0249] Specifically, at least a portion of the first electrode 241 can be housed in the first conductive organic film 215 and at least a portion of the second electrode 245 can be housed in the second conductive organic film 217 simultaneously.

[0250] Containing at least a portion of the first electrode 241 in the first conductive organic film 215 may include pressing the first electrode 241 into the first conductive organic film 215 and heating the first conductive organic film 215. Containing at least a portion of the second electrode 245 in the second conductive organic film 217 may include pressing the second electrode 245 into the second conductive organic film 217 and heating the second conductive organic film 217.

[0251] Specifically, pressing the first electrode 241 onto the first conductive organic film 215 and pressing the second electrode 245 onto the second conductive organic film 217 can be performed simultaneously. Additionally, heating the first conductive organic film 215 and heating the second conductive organic film 217 can be performed simultaneously.

[0252] Heating the first conductive organic film 215 may include heating the first conductive organic film 215 to 120 degrees Celsius (°C). Additionally, heating the second conductive organic film 217 may include heating the second conductive organic film 217 to 120 degrees Celsius (°C). That is, the first conductive organic film 215 and the second conductive organic film 217 can be heated to the same temperature.

[0253] Because the first electrode 241 is attached to the first conductive organic film 215 and the second electrode 245 is attached to the second conductive organic film 217, the temperature and pressure applied to the display device 1 can be reduced. In other words, because each of the first electrode 241 and the second electrode 245 is pressed onto an organic material including carbon black instead of an inorganic material, the temperature and pressure required to attach the first electrode 241 and the second electrode 245 can be reduced. Accordingly, thermal deformation or damage to at least one of the substrate 100, the inorganic insulating layer 1IL, the organic insulating layer OIL, and the inorganic light-emitting diode mLED due to high temperature can be reduced.

[0254] Due to the height difference between the top surface 213T of the organic insulating layer OIL and the first conductive organic film 215, the overflow of the first conductive organic film 215 from the first opening OP1 can be reduced during the process of accommodating at least a portion of the first electrode 241 within the first conductive organic film 215. Furthermore, due to the height difference between the top surface 213T of the organic insulating layer OIL and the second conductive organic film 217, the overflow of the second conductive organic film 217 from the second opening OP2 can be reduced during the process of accommodating at least a portion of the second electrode 245 within the second conductive organic film 217.

[0255] A method of manufacturing display device 1 may include depositing an encapsulation layer 300 on an inorganic light-emitting diode mLED (see [link to encapsulation layer]). Figure 7 ) and in the encapsulation layer 300 (see Figure 7 A filter panel 400 is installed on the surface (see) Figure 7 This is a reference. Figure 7 and Figure 9 Described. Accordingly, its detailed description is omitted.

[0256] Figure 12 This is a schematic cross-sectional view of a portion of the display device 1 according to an embodiment.

[0257] Figure 12 Can be used as a reference Figure 1 , Figures 2a to 2e , Figure 3 , Figures 4a to 4c and Figure 5 The description of the display area DA (see Figure 1 (Corresponding to) Specifically, Figure 12 Can be used as a reference Figures 4a to 4c and Figure 5 The first island section 11 (see description) Figure 4a )correspond.

[0258] exist Figure 12 In, with Figure 7 and Figure 10 The same reference numerals in the accompanying drawings denote the same components, and therefore, repeated descriptions are omitted.

[0259] refer to Figure 12 The display device 1 according to the embodiment may include a substrate 100, a buffer layer 201, a pixel driving circuit portion PC, an inorganic insulating layer IIL, an organic insulating layer OIL, a first connecting electrode CM1, a first conductive organic film 215, an inorganic light-emitting diode mLED, a dam layer BKL, and a counter electrode 223.

[0260] The substrate 100 may include various materials. The substrate 100 may include flexible materials. As an example, the substrate 100 may include materials that are bendable, foldable, or rollable.

[0261] A buffer layer 201 may be disposed on the substrate 100. The buffer layer 201 can prevent impurities from penetrating the semiconductor layer of the thin-film transistor.

[0262] The inorganic insulating layer IIL can be disposed on the buffer layer 201. That is, the inorganic insulating layer IIL can be disposed above the substrate 100.

[0263] The inorganic insulating layer IIL may include a gate insulating layer 203, a first interlayer insulating layer 205, and a second interlayer insulating layer 207. The first interlayer insulating layer 205 may be disposed on the gate insulating layer 203, and the second interlayer insulating layer 207 may be disposed on the first interlayer insulating layer 205.

[0264] The pixel driving circuit portion PC can be disposed on the buffer layer 201. That is, the pixel driving circuit portion PC can be disposed above the substrate 100. The pixel driving circuit portion PC may include a thin-film transistor (TFT) and a storage capacitor (Cst).

[0265] A thin-film transistor (TFT) may include a semiconductor layer Act, a gate electrode GE, a source electrode SE, and a drain electrode DE. The semiconductor layer Act may include polycrystalline silicon. The gate electrode GE may include a low-resistance metallic material. The source electrode SE and the drain electrode DE may each include a material with high conductivity.

[0266] The storage capacitor Cst may include a lower electrode CE1 and an upper electrode CE2, which overlap each other in a plan view and a first interlayer insulating layer 205 is located between them. In the plan view, the storage capacitor Cst may overlap with a thin-film transistor (TFT).

[0267] An organic insulating layer (OIL) can be disposed on an inorganic insulating layer (IIL). The organic insulating layer (OIL) can cover the pixel driving circuit portion (PC). The organic insulating layer (OIL) may include a first organic insulating layer (209), a second organic insulating layer (211), and a third organic insulating layer (213). The first organic insulating layer (209) can cover the pixel driving circuit portion (PC), the second organic insulating layer (211) can be disposed on the first organic insulating layer (209), and the third organic insulating layer (213) can be disposed on the second organic insulating layer (211).

[0268] The first connecting electrode CM1 can be disposed on the organic insulating layer OIL and can be electrically connected to the pixel driving circuit section PC. The first connecting electrode CM1 can be connected to the reference above. Figures 6a to 6c The first voltage line described is VDDL (see...) Figure 6c ).

[0269] The first connecting electrode CM1 may include a 1-1 connecting electrode CM1-1 and a 1-2 connecting electrode CM1-2. The 1-1 connecting electrode CM1-1 may be disposed between the first organic insulating layer 209 and the second organic insulating layer 211, and in contact with the pixel driving circuit portion PC. The 1-2 connecting electrode CM1-2 may be disposed on the 1-1 connecting electrode CM1-1. The 1-2 connecting electrode CM1-2 may be disposed between the second organic insulating layer 211 and the third organic insulating layer 213, and in contact with the 1-1 connecting electrode CM1-1.

[0270] The organic insulating layer OIL may include a first opening OP1. In a plan view, the first opening OP1 may overlap with the first connecting electrode CM1. The first opening OP1 may extend through the organic insulating layer OIL to contact the first connecting electrode CM1. As an example, the first opening OP1 may extend through a third organic insulating layer 213. The first opening OP1 may be surrounded by the organic insulating layer OIL and the first connecting electrode CM1.

[0271] The first conductive organic film 215 can be housed in the first opening OP1 for electrical connection to the pixel driving circuit portion PC. As an example, the first conductive organic film 215 can contact a first connection electrode CM1 electrically connected to the pixel driving circuit portion PC. That is, the first connection electrode CM1 can be disposed between the pixel driving circuit portion PC and the first conductive organic film 215 to connect the pixel driving circuit portion PC to the first conductive organic film 215.

[0272] The first conductive organic film 215 may include a carbon black material. In this case, the first connecting electrode CM1 may include at least one of indium tin oxide (ITO), indium zinc oxide (IZO), and molybdenum (Mo) that are conductive to the first conductive organic film 215.

[0273] An inorganic light-emitting diode (mLED) may include a first electrode 241, a first semiconductor layer 242, an intermediate layer 243, a second semiconductor layer 244, and a second electrode 245.

[0274] A first semiconductor layer 242 can be disposed on the first electrode 241, an intermediate layer 243 can be disposed on the first semiconductor layer 242, a second semiconductor layer 244 can be disposed on the intermediate layer 243, and a second electrode 245 can be disposed on the second semiconductor layer 244. That is, the intermediate layer 243 can be disposed between the first semiconductor layer 242 and the second semiconductor layer 244. The first electrode 241, the first semiconductor layer 242, the intermediate layer 243, the second semiconductor layer 244, and the second electrode 245 can be electrically connected to each other.

[0275] At least a portion of the first electrode 241 may be housed in and electrically connected to the first conductive organic film 215. A dam layer BKL may be disposed on an organic insulating layer OIL. The dam layer BKL may include an insulating material and include an opening exposing the first opening OP1. That is, an inorganic light-emitting diode mLED may be disposed in the opening disposed in the dam layer BKL.

[0276] The counter electrode 223 can be disposed on the inorganic light-emitting diode mLED. The counter electrode 223 can be supported by a diaphragm layer BKL and electrically connected to the second electrode 245 of the inorganic light-emitting diode mLED. The counter electrode 223 can be electrically connected to the reference above. Figures 6a to 6c The described configuration is for supplying a second electrical voltage VSS (see...) Figure 6a The second voltage line VSSL (see) Figure 6a ).

[0277] Encapsulation layer 300 (see) Figure 7 ) can be set on counter electrode 223, and filter panel 400 (see Figure 7 ) can be set in the encapsulation layer 300 (see Figure 7 On the reference, Figure 7 and Figure 9 Described. Accordingly, its detailed description is omitted.

[0278] Figures 13a to 1 3h is a schematic cross-sectional view of the display device 1 according to an embodiment.

[0279] refer to Figures 13a to 1 3h describes a method for manufacturing display device 1.

[0280] exist Figures 13a to 1 During the 3 hours, with Figures 7 to 12 The same reference numerals in the accompanying drawings denote the same parts, and therefore, repeated descriptions are omitted.

[0281] First, refer to Figure 13a The method of manufacturing the display device 1 may include providing a pixel driving circuit portion PC on a substrate 100, providing an organic insulating layer OIL on the pixel driving circuit portion PC, and etching the organic insulating layer OIL to form a first opening OP1. Etching the organic insulating layer OIL to form the first opening OP1 may include dry etching the organic insulating layer OIL using an etching gas.

[0282] refer to Figure 13b A method for manufacturing the display device 1 may include disposing a first conductive organic film 215 in a first opening OP1. The first conductive organic film 215 may include a carbon black material. The first conductive organic film 215 may be accommodated in the first opening OP1 and in contact with a first connecting electrode CM1.

[0283] refer to Figure 13c The method of manufacturing the display device 1 may include setting an inorganic light-emitting diode mLED on an organic insulating layer OIL and setting a counter electrode 223 on the inorganic light-emitting diode mLED.

[0284] Setting an inorganic light-emitting diode (mLED) may include accommodating at least a portion of the first electrode 241 within a first conductive organic film 215. Accommodating at least a portion of the first electrode 241 within the first conductive organic film 215 may include pressing the first electrode 241 against the first conductive organic film 215 and heating the first conductive organic film 215.

[0285] Because the counter electrode 223 is disposed on the inorganic light-emitting diode mLED, the second electrode 245 of the inorganic light-emitting diode mLED can be electrically connected to the counter electrode 223. In this case, the counter electrode 223 can be supported by the embankment layer BKL.

[0286] A method of manufacturing display device 1 may include providing an encapsulation layer 300 on counter electrode 223 (see [link to encapsulation layer]). Figure 7 ) and in the encapsulation layer 300 (see Figure 7 A filter panel 400 is installed on the surface (see) Figure 7 This is a reference. Figure 7 and Figure 9 Described. Accordingly, its detailed description is omitted.

[0287] Additionally, although reference Figures 13a to 13c The display area DA of display device 1 has been described, but the non-display area NDA of display device 1 can also be referenced. Figures 11a to 11h The process described above. That is, finally, in the non-display area NDA, a conductive organic film layer 221 for blocking light can be disposed on the organic insulating layer OIL.

[0288] The display device 1 according to the embodiment can be used in various electronic devices capable of displaying images. Here, electronic device means a device that uses electricity and can display a preset image.

[0289] Figures 14a to 14g These are schematic perspective views of embodiments of electronic devices including a display device according to embodiments.

[0290] refer to Figure 14a The display device according to the embodiment can be used in a wearable electronic device 3100 that can be worn on a part of a user's body. The wearable electronic device 3100 may include a main body portion 3110 and a display 3120 provided to the main body portion 3110. The display device according to the embodiment can be used as the display 3120 of the wearable electronic device 3100. Figure 14a As shown, the wearable electronic device 3100 is deformable. In one embodiment, depending on the user's choice, the wearable electronic device 3100 can be used as a smartwatch or a smartphone.

[0291] Figure 14b A medical electronic device 3200 is shown. In one embodiment, the medical electronic device 3200 may include a main body portion 3210 and an emitting portion 3220. A display device according to an embodiment may be used as the emitting portion 3220 of the medical electronic device 3200. The emitting portion 3220 may be configured to emit light (e.g., infrared and visible light) in a preset wavelength band toward a patient's body. In one embodiment, the main body portion 3210 may include a stretchable fibrous material and may have a structure that can be worn on the body of a user using the emitting portion.

[0292] Figure 14c An educational electronic device 3300 is shown. In one embodiment, the educational electronic device 3300 may include a display 3320 provided within a frame 3310. The display 3320 may use a display device according to an embodiment. Images such as a sea with waves, a snow-covered mountain, or a volcano with flowing lava can be provided by the display 3320, and in this case, the display 3320 may extend in the height direction (e.g., the z-direction) to reflect the height of the waves, mountain, or volcano. In one embodiment, a portion of the display 3320 may three-dimensionally represent the movement of lava by sequentially changing its height in the direction of lava flow. The educational electronic device 3300 may include a plurality of pins 3330 (or travel portions) disposed on the back of the display 3320, such that the display 3320 extends in the height direction. As the pins 3330 move in a third direction (e.g., the z-direction or the -z-direction), the image displayed on the display 3320 can be implemented to have three-dimensional height. Although Figure 14c An educational electronic device 3300 is described, but the purpose of the electronic device is not limited as long as the electronic device provides preset image information.

[0293] although Figures 14a to 14c The electronic device shown is described as a shape-variable electronic device, but the embodiments are not limited thereto. As in the embodiments described below, the display device according to the embodiments can be used in electronic devices in which the portion capable of displaying images (e.g., a screen) is fixed.

[0294] Figure 14dA robot 3400, as an electronic device according to an embodiment, is shown. The robot 3400 can move or identify objects using a camera portion 3440 and display preset images to a user via displays 3420 and 3430. In one embodiment, because the display device according to the embodiment can be stretched in various directions as described above, the display device can be assembled to a main frame having a hemispherical shape, and therefore, the robot 3400 may include displays 3420 and 3430 having hemispherical shapes.

[0295] Figure 14e A vehicle display device 3500, as another electronic device according to an embodiment, is shown. The vehicle display device 3500 may include an instrument panel 3510, a central information display (“CID”) 3520, and / or a passenger display. Because the display device according to the embodiment can be stretched in various directions, it can be used as an instrument panel 3510, a CID 3520, and / or a passenger display regardless of the shape of the vehicle's interior frame.

[0296] Despite Figure 14e The instrument panel 3510, CID 3520, and / or the passenger display are shown to be separate from each other, but the embodiment is not limited thereto. In another embodiment, two or more of the instrument panel 3510, CID 3520, and / or the passenger display may be integrally connected.

[0297] In one embodiment, the vehicle display device 3500 may include a button 3540 capable of displaying a preset image. (See reference) Figure 14e An enlarged view shows that the button 3540, having a hemispherical shape, may include an object 3542 and a display device disposed on the object 3542, the object 3542 providing a tactile feedback when moving in the z-direction or -z-direction. In one embodiment, if the object 3542 has a three-dimensional rounded surface, the display device may also have a three-dimensional rounded surface.

[0298] Figure 14f The electronic device shown according to an embodiment is an electronic device 3600 for advertising or display. In one embodiment, the electronic device 3600 for advertising or display can be mounted on a structure 3610 such as a wall or column. The structure 3610 includes, for example, Figure 14f In the case of an uneven surface as shown, the electronic device 3600 for advertising or display can also be disposed along the uneven surface of the structure 3610. In one embodiment, the electronic device 3600 for advertising or display can be mounted on the structure 3610 using a heat-shrink film or the like.

[0299] Figure 14gThe electronic device shown according to an embodiment is a controller 3700. The controller 3700 may include image-type buttons. As an example, the controller 3700 may include first button areas to third button areas 3720, 3730, and 3740, in which a portion of a display 3710 protrudes (or collapses in the z-direction) in the z-direction or -z-direction. In one embodiment, the first button area 3720 and the third button area 3740 may protrude in the z-direction, and the second button area 3730 may protrude (or collapse in the z-direction) in the -z-direction.

[0300] It should be understood that the embodiments described herein are to be considered in a descriptive sense only and are not intended to be limiting. The description of features or aspects within each embodiment should generally be considered applicable to other similar features or aspects in other embodiments. Although one or more embodiments have been described with reference to the figures, those skilled in the art will understand that various changes in form and detail may be made therein without departing from the spirit and scope defined by the appended claims.

Claims

1. A display device, comprising: substrate; The pixel driving circuit is disposed on the substrate; An organic insulating layer is disposed on the pixel driving circuit portion and defines a first opening therein; A first conductive organic film is housed in the first opening to be electrically connected to the pixel driving circuit portion; as well as An inorganic light-emitting diode is disposed on the organic insulating layer and includes a first electrode. At least a portion of the first electrode is contained within the first conductive organic film.

2. The display device according to claim 1, wherein the upper surface of the first conductive organic film is recessed from the top surface of the organic insulating layer.

3. The display device according to claim 2, wherein the thickness of the first electrode is greater than the height difference between the upper surface of the first conductive organic film and the top surface of the organic insulating layer.

4. The display device according to claim 1, wherein the first conductive organic film comprises carbon black material.

5. The display device according to claim 1, further comprising: A first connecting electrode is disposed between the pixel driving circuit portion and the first conductive organic film, and the pixel driving circuit portion is electrically connected to the first conductive organic film.

6. The display device according to claim 5, wherein the first connecting electrode comprises at least one of indium tin oxide (ITO), indium zinc oxide (IZO), and molybdenum (Mo).

7. The display device according to claim 1, further comprising a second conductive organic film separate from the first conductive organic film. The organic insulating layer further defines a second opening, separate from the first opening and accommodating the second conductive organic film, and The inorganic light-emitting diode further includes a second electrode, which is separate from the first electrode and has at least a portion contained within the second conductive organic film.

8. The display device according to claim 7, wherein the upper surface of the second conductive organic film is recessed from the top surface of the organic insulating layer.

9. The display device according to claim 8, wherein the thickness of the second electrode is greater than the height difference between the upper surface of the second conductive organic film and the top surface of the organic insulating layer.

10. The display device according to claim 7, wherein the second conductive organic film comprises a carbon black material.

11. The display device according to claim 7, further comprising: The second connecting electrode is disposed between the pixel driving circuit portion and the second conductive organic film, and is connected to the second conductive organic film.

12. The display device according to claim 11, wherein the second connecting electrode comprises at least one of indium tin oxide (ITO), indium zinc oxide (IZO), and molybdenum (Mo).

13. The display device according to claim 1, further comprising a counter electrode disposed on the inorganic light-emitting diode, The inorganic light-emitting diode further includes a second electrode that is separate from the first electrode and electrically connected to the counter electrode.

14. The display device according to claim 1, further comprising: A conductive organic film layer is disposed on the organic insulating layer to cover the organic insulating layer in the non-display area.

15. A method of manufacturing a display device, the method comprising: A pixel driving circuit is disposed on the substrate; An organic insulating layer is disposed on the pixel driving circuit portion; Etching the organic insulating layer to form the first opening; A first conductive organic film is disposed in the first opening to be electrically connected to the pixel driving circuit portion; as well as An inorganic light-emitting diode is disposed on the organic insulating layer. The setting of the inorganic light-emitting diode includes accommodating at least a portion of the first electrode of the inorganic light-emitting diode in the first conductive organic film.

16. The method of claim 15, wherein etching the organic insulating layer to form the first opening comprises dry etching the organic insulating layer using an etching gas.

17. The method of claim 15, wherein setting the first conductive organic film comprises: A conductive organic film material is disposed on the organic insulating layer; Soft baking of the conductive organic film material; as well as The conductive organic film material is then developed.

18. The method of claim 15, wherein accommodating at least a portion of the first electrode within the first conductive organic film comprises: Press the first electrode against the first conductive organic film; as well as The first conductive organic film is heated.

19. The method of claim 18, wherein heating the first conductive organic film comprises heating the first conductive organic film to 120 degrees Celsius (°C) to 140 degrees Celsius.

20. The method of claim 15, wherein the first conductive organic film comprises a carbon black material.

21. The method of claim 15, further comprising: The organic insulating layer is etched to form a second opening separate from the first opening; as well as A second conductive organic film is disposed in the second opening. The setting of the inorganic light-emitting diode further includes accommodating at least a portion of the second electrode of the inorganic light-emitting diode in the second conductive organic film, and the second electrode is separate from the first electrode.

22. The method of claim 21, wherein the etching of the organic insulating layer to form the first opening and the etching of the organic insulating layer to form the second opening are performed simultaneously.

23. The method of claim 21, wherein the provision of the first conductive organic film in the first opening and the provision of the second conductive organic film in the second opening are performed simultaneously.

24. The method of claim 21, wherein the accommodating of at least a portion of the first electrode in the first conductive organic film and the accommodating of at least a portion of the second electrode in the second conductive organic film are performed simultaneously.

25. The method of claim 15, further comprising: A counter electrode is disposed on the inorganic light-emitting diode. The setting of the inorganic light-emitting diode further includes electrically connecting the second electrode of the inorganic light-emitting diode to the counter electrode, and the second electrode being separate from the first electrode.

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