Low-shrinkage high-reliability epoxy molding compound and preparation method thereof

Abstract

The invention relates to a low-shrinkage high-reliability epoxy molding compound and a preparation method thereof.By introducing octaphenyltetrasilanol double-splint type polysilsesquioxane and utilizing a nano cage-shaped organic-inorganic hybrid structure of the octaphenyltetrasilanol double-splint type polysilsesquioxane, a finally obtained compound has the characteristics of low curing shrinkage rate, low water absorption rate, high bonding strength, excellent mechanical strength and the like after being cured; the stability of the glass transition temperature, the linear expansion coefficient and other performance is maintained, and the material is suitable for the fields such as microelectronic packaging and high-end insulating materials which have strict requirements on comprehensive performance.

Description

Technical Field

[0001] This invention relates to the field of electronic packaging materials, specifically to a low-shrinkage, high-reliability epoxy molding compound and its preparation method. Background Technology

[0002] Epoxy molding compound (EMC), as a key microelectronic packaging material, primarily serves to protect semiconductor chips. Currently, electronic products are rapidly iterating and upgrading towards high performance, multifunctionality, high reliability, thinness, lightweight, and portability, with an increasingly significant trend towards mass adoption and widespread use. This development will undoubtedly drive the microelectronic packaging industry to innovate towards thinner, lighter, higher-density, more reliable, and higher-performance products, thus placing more stringent and entirely new requirements on microelectronic packaging materials.

[0003] In the field of materials, shrinkage refers to the dimensional changes of a material over a specific period of time. For thermosetting resins, shrinkage mainly falls into two categories: chemical shrinkage during the curing reaction; during curing, molecules rearrange into a more compact structure, triggering chemical shrinkage, which is an inherent characteristic of the curing process; and thermal expansion and contraction during high-temperature processing and cooling, reflow soldering, and high-low temperature shocks. The thermal expansion and contraction of EMC during temperature changes is affected by factors such as the coefficient of thermal expansion, processing temperature, and cooling rate. Microelectronic packaging has extremely high precision requirements, and EMC shrinkage can cause deformation and warping, directly affecting packaging quality. If the shrinkage rate is too high, stress will be generated inside the package, leading to chip delamination from the packaging material, cracking of the molding compound or solder joints, seriously affecting the performance and reliability of electronic products. On the other hand, excessively high water absorption or low interface strength can also easily cause delamination failure of the packaging material after reflow soldering. Therefore, as a primary packaging material, improving the high-temperature and high-humidity reliability of epoxy molding compounds, ensuring stable performance in extreme environments, and reducing shrinkage to ensure packaging precision and quality are issues that cannot be ignored during use. Summary of the Invention

[0004] To address reliability issues in epoxy molding compounds caused by curing shrinkage and cooling thermal shrinkage, such as stress concentration, chip peeling, and cracking of the molding compound or solder joints, this invention introduces an octaphenyltetrasilanol double-clip polysilsesquioxane (Ph-POSS). Its unique structure enables synergistic control of both types of shrinkage: firstly, the double-clip cage structure provides high rigidity, restricting the free rearrangement of epoxy molecules during curing and reducing chemical shrinkage at the molecular level; secondly, the steric hindrance effect of the peripheral phenyl groups inhibits the thermal motion of the molecular chains, reducing thermal shrinkage during cooling. Simultaneously, the silanol groups react chemically with the epoxy groups of the epoxy matrix to form stable chemical bonds, preventing interfacial peeling caused by shrinkage stress and further suppressing shrinkage by chemically "locking" the molecular chains.

[0005] As an inorganic / organic hybrid nanomaterial (structural unit 2nm), the innovative advantages of octaphenyltetrasilanol double-clamp type POSS are: (1) Double-clamp cage structure: The high rigidity of the Si-O core directly restricts molecular rearrangement, and the double-clamp structure enhances thermal stability, breaking through the limitation of traditional POSS that only controls a certain type of shrinkage, and can reduce chemical shrinkage and thermal shrinkage at the same time; (2) Synergistic effect of organic groups: The steric hindrance of phenyl and the reactivity of silanol are combined to reduce thermal shrinkage and avoid interface peeling through chemical bonding, which is different from the "physical filling" mode of conventional POSS; (3) Nano-dispersion: The 2nm structure uniformly fills the gaps between matrix molecules, reducing shrinkage space without stress concentration, and improving the secondary defects caused by the agglomeration of traditional fillers; (4) Structural designability: The composition of octaphenyltetrasilanol balances compatibility and reactivity, ensuring uniform dispersion and effective function in epoxy matrix without sacrificing the basic performance of the cured product.

[0006] The following technical solution is specifically adopted:

[0007] A low-shrinkage, high-reliability epoxy molding compound and its preparation method are disclosed. The EMC components and their contents are as follows: 0.5-1.0 wt% octaphenyltetrasilyl alcohol double-laminated polysilsesquioxane (Ph-POSS), 3-13 wt% epoxy resin, 2-10 wt% phenolic resin, 0.1-0.8 wt% coupling agent, 0.1-1.5 wt% stress absorber, 80-90 wt% inorganic filler, 0.1-0.3 wt% curing accelerator, 0.1-0.3 wt% adhesive aid, 0.15-0.5 wt% ion trapping agent, 0.1-0.5 wt% colorant, 0.2-0.5 wt% wax additive, and 0.5-3 wt% flame retardant.

[0008] Furthermore, the structure of the octaphenyltetrasilyl alcohol double-clamp type polysilsesquioxane Ph-POSS is as follows:

[0009]

[0010] Ph-POSS structure

[0011] Ph-POSS contains silanol groups, which can participate in the curing reaction of epoxy resin, acting as additional crosslinking points to increase network density, improve crosslinking density, and more effectively reduce the migration and enrichment of POSS.

[0012] Furthermore, the epoxy resin is selected from any one or more of the following structural formulas:

[0013]

[0014] (Dicyclopentadiene phenolic epoxy resin, abbreviated as DCPD, epoxy equivalent: 250-280g / eq)

[0015]

[0016] (Biphenyl-type phenolic epoxy resin, abbreviated as MAR, epoxy equivalent: 270-280g / eq)

[0017]

[0018] (Tetramethylbiphenyl epoxy resin, abbreviated as BP, epoxy equivalent: 180-190 g / eq)

[0019]

[0020] (Tetramethylbisphenol F type epoxy resin, epoxy equivalent: 185-195g / eq)

[0021]

[0022] (2,2'-Dimethyl-5,5'-Di-tert-butyl diphenyl sulfide epoxy resin, epoxy equivalent: 245-255 g / eq)

[0023] Epoxy Resin Structure

[0024] Preferably, in the low-shrinkage, high-reliability epoxy molding compound, the epoxy resin contains not only:

[0025] It also contains one or more of the following structures:

[0026] ,

[0027] ,

[0028] ,

[0029] The epoxy equivalent of each structure is the same as above.

[0030] The use of multiple epoxy resins in combination can better meet the requirements of high temperature, high strength, and low moisture absorption. The "n" in the epoxy resin structural formula is controlled by the epoxy equivalent. Further optimization involves using a combination of BP epoxy resin, MAR epoxy resin, and DCPD epoxy resin in a mass ratio of 1:2-3:2-3.

[0031] Furthermore, the phenolic resin is selected from any one or more of the following structural formulas:

[0032]

[0033] (Linear phenol-formaldehyde resin, hydroxyl equivalent: 105-110 g / eq)

[0034]

[0035] (XYLOK phenolic resin, hydroxyl equivalent: 165-175 g / eq)

[0036]

[0037] (Dicyclopentadienol resin, hydroxyl equivalent: 140-165 g / eq)

[0038]

[0039] (Biphenyl alkylphenol resin, hydroxyl equivalent: 200-205 g / eq)

[0040] Phenolic resin structural formula

[0041] In the structural formula of phenolic resin, "n" is controlled by the hydroxyl equivalent.

[0042] Furthermore, the coupling agent is selected from any one or more of N-phenyl-3-aminopropyltrimethoxysilane, (3-mercaptopropyl)trimethoxysilane, γ-glycidyl etheroxypropyltrimethoxysilane, bis-[γ-(triethoxysilane)propyl]tetrasulfide, and 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane.

[0043] Furthermore, the stress absorber is any one or more of the following: carboxyl-terminated liquid nitrile rubber (CTBN), polybutadiene core-shell rubber, silicone core-shell rubber, coumarone resin, epoxy and polyether modified polydimethylsiloxane, polyether modified silicone oil, and epoxidized polybutadiene. The liquid additive needs to be premixed with the phenolic resin to prepare an intermediate. Optionally, the core-shell rubber used is MZ-120 core-shell rubber from Kaneka Corporation of Japan, where the core is rubber and the shell is methyl methacrylate (MMA). This is merely an example of an optional stress absorber; unless other stress absorbers are explicitly specified in the embodiments, this core-shell rubber is used as the stress absorber.

[0044] Furthermore, the inorganic filler is spherical silica powder. Preferably, the median particle size of the spherical silica powder is 15-30 μm.

[0045] Furthermore, the curing accelerator is any one or more of imidazole and its derivatives, tri(tetra)phenylphosphine and its derivatives, organic amine compounds and phosphonium salt compounds.

[0046] Further, the bonding aid is any one or more of 3-amino-5-mercapto-1,2,4-triazole, 4,4'-dithiodimorpholine, and epoxy functional group silane oligomers (oligomers of γ-glycidoxypropyltrimethoxysilane with a degree of polymerization of 3-4). Preferably, the bonding aid is any one or more of 4,4'-dithiodimorpholine and γ-glycidoxypropyltrimethoxysilane oligomers with a degree of polymerization of 3-4, used in combination with 3-amino-5-mercapto-1,2,4-triazole. Wherein, 3-amino-5-mercapto-1,2,4-triazole is a copper bonding aid, and the oligomers of 3-amino-5-mercapto-1,2,4-triazole, 4,4'-dithiodimorpholine, and γ-glycidoxypropyltrimethoxysilane with a degree of polymerization of 3-4 are interfacial bonding aids.

[0047] Furthermore, the ion scavenger is any one or more of anion scavengers, magnesium aluminum hydrotalcite, and cationic scavengers; the colorant is carbon black.

[0048] Furthermore, the wax additive is selected from any one or more of oxidized polyethylene wax, montan wax, lignite ester, lignite acid, stearate metal salt, stearate ester, fatty acid glyceride wax, maleic anhydride grafted polyethylene wax, cannabal wax, and PTFE modified polyethylene wax.

[0049] Furthermore, the flame retardant is selected from any one or more of zinc borate and phosphazene flame retardants.

[0050] Furthermore, the EMC preparation includes the following steps:

[0051] (1) Dissolve the phenolic resin, then add octaphenyltetrasilyl alcohol double-clamp type polysilsesquioxane, stir to form a homogeneous phase and discharge to obtain the intermediate.

[0052] (2) Add inorganic filler to a high-speed mixer, spray coupling agent and stir to mix evenly, then add epoxy resin, intermediate, stress absorber, curing accelerator, adhesive, ion capture agent, colorant, wax additive and flame retardant in sequence and stir evenly to obtain premixed powder.

[0053] (3) The premixed powder is melt-mixed, extruded, crushed and homogenized using a twin-screw extruder to produce low-shrinkage and high-reliability epoxy molding compound;

[0054] Preferably, the temperature of the melt mixing is 80-110°C.

[0055] Preferably, the inorganic filler is silica micropowder with different particle sizes.

[0056] A further step is:

[0057] Shrinkage testing was conducted using a true density meter: under a helium atmosphere, the true density of the powdered epoxy molding compound before curing and the true density of the cured block after coarse crushing were measured respectively; the true density meter preferably is the Anton Paar Ultrapyc series fully automatic true density analyzer.

[0058] Terminology Explanation

[0059] Cut-off particle size: When sieving filler particles by size, a certain screen aperture will "cut" the particles into two parts - one part passes through the screen and the other part is blocked by the screen. This aperture is called the "cut-off particle size".

[0060] Compared with the prior art, the present invention has achieved at least the following beneficial effects:

[0061] This invention addresses two root causes of EMC shrinkage through a dual-sandwich structure and a synergistic design with organic phenyl groups, supplemented by interfacial additives and low-hygroscopic resins (such as DCPD epoxy resin, tetramethylbiphenyl epoxy resin, and biphenyl phenolic epoxy resin). It reduces shrinkage while maintaining the core performance of the packaging material and improves reliability in high-temperature and high-humidity environments. This provides a more reliable material solution for high-precision fields such as semiconductor packaging and has significant application potential in the trend of thinner and higher-density microelectronic packaging. Detailed Implementation

[0062] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0063] All raw materials used in the preparation of epoxy molding compounds in this invention are commercially available products; the methods used in this invention, unless otherwise specified, are methods commonly used in the art. Materials were weighed according to Table 1.

[0064] Table 1. Composition of each embodiment and comparative example formulation (unit: parts by mass)

[0065]

[0066] Note: For ease of comparison, Ph-POSS intermediates have been broken down into specific formulation contents. Spherical silica powder 1 is a powder with a 45μm cut and a D50 of 14.5μm; spherical silica powder 2 is an ultrafine powder with a 3μm cut and a D50 of 0.54μm; "cut" refers to the cut particle size of the spherical silica powder. 3-Amino-5-mercapto-1,2,4-triazole is a copper binder, and the oligomer of γ-glycidoxypropyltrimethoxysilane with a degree of polymerization of 3-4 is an interfacial binder.

[0067] After the materials are weighed, since the overall size of the octaphenyltetrasilyl alcohol double-clamped polysilsesquioxane Ph-POSS is at the nanoscale, in order to effectively disperse it evenly and avoid agglomeration, it needs to be premixed with solid phenolic resin to prepare an intermediate. The specific preparation steps are as follows: Weigh 100 parts of solid XLOYK phenolic resin into a reaction vessel, slowly stir and heat until the solid resin is completely dissolved, and when it reaches 150°C, slowly add 25 parts of Ph-POSS while stirring, adding it completely in 3-5 minutes, and gradually raise the temperature to stabilize at 150°C. After stirring at a uniform speed for 30 minutes, when the liquid becomes a homogeneous phase, discharge and cool it, pulverize it at an ambient temperature below 5°C, and finally pass it through a 40-mesh sieve to obtain the intermediate.

[0068] After the intermediate is prepared, silica powder of different particle sizes is added to a high-speed mixer, and a coupling agent is sprayed on before mixing. Then, epoxy resin, intermediate, stress absorber, curing accelerator, binder, ion trap, colorant, wax additive, and flame retardant are added sequentially and stirred until homogeneous to obtain a premixed powder (high-speed mixer speed controlled at 300-600 rpm / min, temperature <30℃, total mixing time 10-20 min). Next, the premixed powder is melt-blended (temperature 80-110℃), extruded, pulverized, and homogenized using a twin-screw extruder to finally obtain a low-shrinkage, high-reliability epoxy molding compound.

[0069] The prepared epoxy molding compound samples were subjected to performance tests, and the test results for each example and comparative example are shown in Table 2. The relevant test methods are as follows:

[0070] (1) Gelation time: Heat the hot plate to 175℃±1℃, take 0.5g~1g of epoxy molding compound sample and place it on the hot plate, then press it into a 6-10cm shape with a flat spatula.2 For thin slices, start timing from the moment they begin to melt. Use a needle-shaped stirring tip or a flat spatula to continuously scrape away the material. The sample gradually changes from a molten state to a gel state as the endpoint. Read the time required. Repeat the same operation three times and take the average value.

[0071] (2) Spiral flow length: Using a flow molding die made according to ASTM D3123-1998, the die temperature was kept at 175 degrees Celsius, the injection pressure was 6.9 MPa, the injection curing time was 80 s, 15-18 g of epoxy molding compound was weighed and poured into the mold cavity for injection molding test flow length, and the test was repeated three times and the average value was taken.

[0072] (3) Glass transition temperature and linear thermal expansion coefficient: The epoxy molding compound was molded at 175°C using an injection molding machine, and then cured at 175°C for 6 hours. The temperature was then measured using a thermomechanical analyzer (TMA probe method). According to GB / T 19466.2-2004 standard, the thermal expansion of the molded sample was measured when the temperature increased, and the Tg and linear thermal expansion coefficient were obtained from the measurement results.

[0073] (4) Bending strength and bending modulus: The epoxy molding compound was molded into a rectangular strip of 80mm*15mm*4mm at 175℃ using an injection molding machine. After curing at 175℃ for 6 hours, the bending strength and bending modulus of the standard strip were tested by a universal testing machine with a span of 60mm.

[0074] (5) Shrinkage rate: The density ρ1 of the epoxy molding compound before curing and the density ρ2 of the sample after curing for 6 hours were measured using a true density tester. (After curing, the sample should be broken into small pieces to avoid the influence of internal pore defects.) The shrinkage rate was calculated by the formula (ρ2-ρ1) / ρ1×100%.

[0075] (6) Water absorption rate: The epoxy molding compound was molded into small round samples of 50mm*3mm at 175℃ using an injection molding machine. After curing at 175℃ for 6 hours, the initial weight m1 was weighed. Then, it was placed in a high temperature and high pressure cooking test chamber. The test conditions were 121℃, 2atm, and 24h. After the test, the sample was taken out, dried, and weighed m2. The water absorption rate was calculated by the formula (m2-m1) / m1×100% to obtain the PCT 24h water absorption rate.

[0076] (7) Adhesion strength: The epoxy molding compound was pressed into adhesive strength test blocks at 160°C using an injection molding machine and an adhesive force mold. After curing at 175°C for 6 hours, the adhesive strength was tested using a push-pull force tester (testing began after the room temperature sample was placed in place, and the high temperature sample was placed for 30 seconds to allow the copper sheet to conduct heat fully before testing). Four blocks of each sample were tested at the same temperature and the average value was taken.

[0077] Table 2 Performance test results of each embodiment and comparative example

[0078]

[0079] As shown in Table 2, the performance test data indicates that, compared with Comparative Example 1, the addition of Ph-POSS significantly reduced the curing shrinkage and flexural modulus without negatively impacting the overall mechanical strength and the stability of the glass transition temperature (Tg). The reduction in shrinkage and modulus effectively alleviates reliability issues such as interface delamination, chip peeling, and warping caused by stress concentration during curing.

[0080] As can be seen from the comparison between Example 1 and Comparative Example 2, the introduction of the interface bonding agent significantly enhances the bonding strength of the epoxy molding compound to copper, and the bonding strength at 260°C is also significantly improved, effectively improving the interface reliability under reflow soldering or high-temperature aging environments.

[0081] Compared with Example 1, Comparative Example 3 did not use Ph-POSS, interfacial bonding agent, or copper bonding agent, therefore it had a high flexural modulus, high shrinkage rate, and poor adhesion to copper. Compared with Comparative Example 1, neither Comparative Example 3 nor Comparative Example 1 used Ph-POSS or interfacial bonding agent, and Comparative Example 3 did not use copper bonding agent. Therefore, Comparative Example 3 had a worse adhesion to copper than Comparative Example 1.

[0082] As can be seen from the comparison between Example 1 and Comparative Example 4, the epoxy molding compound using dicyclopentadiene phenol epoxy resin (DCPD epoxy resin) has a significantly lower PCT 24h water absorption rate, which effectively reduces the risk of moisture absorption and corrosion failure.

[0083] As can be seen from the data of Examples 1-4 and Comparative Examples 1-4 in Table 2, the technical solution of the present invention can not only significantly reduce the curing shrinkage rate and modulus of epoxy molding compound, and alleviate the reliability risks such as delamination and warping caused by excessive internal stress; it can also effectively improve the interfacial bonding strength and significantly reduce the water absorption rate of PCT, thereby reducing the failure probability in reflow soldering and high temperature and high humidity environments, and providing a high reliability solution for microelectronic packaging.

[0084] Although the invention has been described herein with reference to several illustrative embodiments, it should be understood that many other modifications and implementations can be devised by those skilled in the art, which will fall within the scope and spirit of the principles disclosed herein. More specifically, various variations and modifications can be made to the components and / or layout of the subject matter combination within the scope of this disclosure. Besides variations and modifications to the components and / or layout, other uses will be apparent to those skilled in the art.

Claims

1. A low-shrinkage, high-reliability epoxy molding compound, characterized in that, It comprises the following components: 0.5-1.0 wt% octaphenyltetrasilyl alcohol double-layer polysilsesquioxane, 3-13 wt% epoxy resin, 2-10 wt% phenolic resin, 0.1-0.8 wt% coupling agent, 0.1-1.5 wt% stress absorber, 80-90 wt% inorganic filler, 0.1-0.3 wt% curing accelerator, 0.1-0.3 wt% adhesive aid, 0.15-0.5 wt% ion scavenger, 0.1-0.5 wt% colorant, 0.2-0.5 wt% wax additive, and 0.5-3 wt% flame retardant.

2. The low-shrinkage, high-reliability epoxy molding compound according to claim 1, characterized in that, The structure of octaphenyltetrasilyl alcohol double-layer polysilsesquioxane is as follows: 。 3. The low-shrinkage, high-reliability epoxy molding compound and its preparation method according to claim 2, characterized in that, The epoxy resin is selected from any one or more of the following structural formulas: (Epoxy equivalent: 250-280g / eq) (Epoxy equivalent: 270-280 g / eq) (Epoxy equivalent: 180-190g / eq) (Epoxy equivalent: 185-195g / eq) (Epoxy equivalent: 245-255g / eq).

4. The low-shrinkage, high-reliability epoxy molding compound according to claim 2, characterized in that, The epoxy resin contains: (Epoxy equivalent: 250-280 g / eq), and the epoxy resin further contains any one or more of the following structures: (Epoxy equivalent: 270-280 g / eq) (Epoxy equivalent: 180-190g / eq) (Epoxy equivalent: 185-195g / eq) (Epoxy equivalent: 245-255g / eq).

5. The low-shrinkage, high-reliability epoxy molding compound according to claim 3 or 4, characterized in that, The phenolic resin is selected from any one or more of the following structural formulas: (Hydroxy equivalent: 105-110 g / eq) (Hydroxy equivalent: 165-175 g / eq) (Hydroxy equivalent: 140-165 g / eq) (Hydroxy equivalent: 200-205 g / eq).

6. The low-shrinkage, high-reliability epoxy molding compound according to claim 5, characterized in that, The bonding agent is any one or more of 3-amino-5-mercapto-1,2,4-triazole, 4,4'-dithiodimorpholine, and epoxy functional group silane oligomers.

7. The low-shrinkage, high-reliability epoxy molding compound according to claim 5, characterized in that, The adhesive is any one or more of the oligomers of 4,4'-dithiodimorpholine and γ-glycidoxypropyltrimethoxysilane with a degree of polymerization of 3-4, used in combination with 3-amino-5-mercapto-1,2,4-triazole.

8. The low-shrinkage, high-reliability epoxy molding compound according to claim 6 or 7, characterized in that, The coupling agent is selected from any one or more of N-phenyl-3-aminopropyltrimethoxysilane, (3-mercaptopropyl)trimethoxysilane, γ-glycidyl etheroxypropyltrimethoxysilane, bis-[γ-(triethoxysilane)propyl]tetrasulfide, and 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane; The stress-absorbing agent is selected from any one or more of the following: carboxyl-terminated liquid nitrile rubber, polybutadiene core-shell rubber, organosilicon core-shell rubber, coumarone resin, epoxy and polyether modified polydimethylsiloxane, polyether modified silicone oil, and epoxidized polybutadiene. The inorganic filler is spherical silica micropowder; The curing accelerator is any one or more of imidazole and its derivatives, tri(tetra)phenylphosphine and its derivatives, organic amine compounds and phosphonium salt compounds; The ion scavenger is any one or more of anion scavengers, magnesium aluminum hydrotalcite, and cationic scavengers; The colorant is carbon black; The wax additive is selected from any one or more of the following: oxidized polyethylene wax, montan wax, lignite ester, lignite acid, stearate metal salt, stearate ester, fatty acid glyceride wax, maleic anhydride grafted polyethylene wax, cannabal wax, and PTFE modified polyethylene wax. The flame retardant is selected from any one or more of zinc borate and phosphazene flame retardants.

9. The method for preparing the low-shrinkage, high-reliability epoxy molding compound according to any one of claims 1 to 8, characterized in that, The preparation includes the following steps: (1) Dissolve the phenolic resin, then add octaphenyltetrasilyl alcohol double-clamp type polysilsesquioxane, stir to form a homogeneous phase and then discharge to obtain the intermediate; (2) Add inorganic filler to a high-speed mixer, spray coupling agent and stir to mix evenly, then add epoxy resin, intermediate, stress absorber, curing accelerator, adhesive, ion capture agent, colorant, wax additive and flame retardant in sequence and stir evenly to obtain premixed powder. (3) The premixed powder is melt-mixed, extruded, crushed and homogenized using a twin-screw extruder to produce low-shrinkage and high-reliability epoxy molding compound.

10. The method for preparing low-shrinkage, high-reliability epoxy molding compound according to claim 9, characterized in that, The melting and mixing temperature is 80-110℃.

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