Elastic force sensor unit

Abstract

The invention discloses an elastic force sensor unit, and the force sensor unit is provided with a thin film force sensing component, and the thin film force sensing component is arranged between an upper layer thin film substrate and a lower layer thin film substrate. The lower protection layer is arranged on the lower surface of the lower film substrate, the upper protection layer is arranged on the upper surface of the upper film substrate, and the upper protection layer and / or the lower protection layer can help to prevent creases or wrinkles possibly appearing on the force sensor unit. Based on the increase of the thickness / hardness of the stack material layer, the phenomenon that the elastic force sensor unit is completely folded is not likely to occur, and the probability that the elastic force sensor unit is folded is reduced in the reasonable use period of the force sensor unit.

Description

Technical Field

[0001] The present invention relates to a force sensor unit, and more particularly to an elastic force sensor unit having at least one protective layer provided on the upper or lower surface of the elastic force sensor unit, the protective layer being used to prevent or reduce the chance of creases appearing on the surface of the elastic force sensor unit. Background Technology

[0002] Figure 1A-1B and Figure 2 This displays a traditional force sensor pad and its force sensor unit.

[0003] Figure 1A A top view of a traditional force sensor pad. Figure 1A The conventional force sensor pad 100 includes multiple force sensor units 15 arranged in a matrix. Circuit 12 electrically couples a thin-film force sensing component 11 to multiple gold fingers 13. These gold fingers 13 transmit the force signals detected by the force sensor units 15 to an external control unit for further processing.

[0004] Figure 1B Side view of a traditional force sensor pad. Figure 1B This shows a side view of a conventional force sensor pad 100. For example, when a patient lies on a force sensor pad 100, it is used to assess the distribution of the patient's body force. For example, areas where the patient has not moved for a long time are prone to bedsores, and this can provide a treatment reference. After prolonged use by the patient, wrinkles W may appear on the force sensor pad 100, and the formation of wrinkles W will affect the accuracy of the pressure detection signal and its service life.

[0005] Figure 2 show Figure 1A Cross-sectional view of line A-A' in the middle. Figure 2 The diagram shows a cross-sectional view of two force sensor units 15 in the structure of the force sensor pad 100. The diagram shows a stack of an upper thin-film substrate 14T and a lower thin-film substrate 14B, with two thin-film force sensing components 11 sandwiched between them. Each thin-film force sensing component 11 is responsible for measuring the force applied to the corresponding force sensor unit 15 from the top or bottom. The thickness of the conventional force sensor pad 100 is approximately 0.05-2.00 mm.

[0006] Figure 1B One of the drawbacks of traditional force sensor cushions is that, after prolonged use, the force sensor cushion 100 may develop wrinkles. Summary of the Invention

[0007] In view of the above-mentioned shortcomings of the prior art, according to the embodiments of the present invention, it is desirable to provide an elastic force sensor unit that can ensure that the elastic force sensor pad will not develop creases or wrinkles after long-term use for a certain period of time.

[0008] According to an embodiment, the present invention provides an elastic force sensor unit, comprising:

[0009] Upper thin-film substrate;

[0010] Lower thin-film substrate;

[0011] A thin-film force sensing component, sandwiched between the upper thin-film substrate and the lower thin-film substrate; and

[0012] A lower protective layer is disposed below the lower thin-film substrate; wherein

[0013] The thin-film force sensing component has a reaction area, and when force is applied to this area from the top or bottom, the thin-film force sensing component will output a corresponding reaction signal.

[0014] This invention discloses a force sensor pad composed of multiple elastic force sensor units, which can be used to measure the distribution of body force of a patient lying on the pad. However, after prolonged use, force sensor pads may develop creases, wrinkles, or folds. These creases, wrinkles, or folds will lead to inaccurate force measurements and shorten the lifespan of the force sensor pad. This invention discloses a thin-film elastic force sensor pad, including an upper thin-film substrate and a lower thin-film substrate, with multiple thin-film force sensing components sandwiched between the upper and lower thin-film substrates. An upper protective layer is provided on the upper surface of the upper thin-film substrate, and a lower protective layer is provided on the lower surface of the lower thin-film substrate. This design ensures that the elastic force sensor pad will not develop creases or wrinkles after a certain period of long-term use. Attached Figure Description

[0015] Figure 1A-1B and Figure 2 This displays a traditional force sensor pad and force sensor unit, wherein:

[0016] Figure 1A A top view of a traditional force sensor pad;

[0017] Figure 1B Side view of a traditional force sensor pad;

[0018] Figure 2 for Figure 1A Cross-sectional view of line A-A' in the middle.

[0019] Figure 3 This illustrates a first embodiment of the present invention.

[0020] Figure 4 This illustrates a second embodiment of the present invention.

[0021] Figure 5-6 This illustrates a third embodiment of the present invention.

[0022] Figure 7 This invention illustrates a fourth embodiment.

[0023] Figure 8-9 This illustrates the fifth embodiment of the present invention.

[0024] Figure 10 The sixth embodiment of the present invention is shown.

[0025] Figure 11-12 The seventh embodiment of the present invention is shown.

[0026] Figure 13 This illustrates the eighth embodiment of the present invention.

[0027] Figure 14 This shows the position of the fixing unit of the present invention.

[0028] Wherein: 100 is the force sensor pad; 11 is the thin-film force sensing component; 12 is the circuit; 13 is the gold finger; 14T is the upper thin-film substrate; 14B is the lower thin-film substrate; 15 is the force sensor unit; 201-208 are elastic force sensor pads; 21T is the upper protective layer; 21B is the lower protective layer; 23C is the radiation-cured resin column; 23P is the fixing pin; 23T is the suture thread; 251-258 are elastic force sensor units; CM is the radiation curing machine; RA is the reaction area; SA is the upper surface area / lower surface area; SM is the sewing machine; W is the wrinkle. Detailed Implementation

[0029] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. These embodiments should be understood as illustrative only and not as limiting the scope of protection of the present invention. After reading the description of the present invention, those skilled in the art can make various alterations or modifications to the present invention, and these equivalent changes and modifications also fall within the scope defined by the claims of the present invention.

[0030] The elastic force sensor pad of the present invention has at least the following performance characteristics:

[0031] (1) It can maintain measurement accuracy in high-temperature environments, especially in the range of -40℃ to 85℃;

[0032] (2) It can operate reliably in high humidity environments, especially in the range of 10% to 90% RH; and

[0033] (3) Elastic ability to resist deformation under high pressure, especially in the range of 0 to 10 MPa.

[0034] In addition to the aforementioned medical applications, the elastic force sensor pad of the present invention can also be applied in other fields, such as industrial automation, sports equipment, and smart furniture.

[0035] First Embodiment

[0036] Figure 3 This illustrates a first embodiment of the present invention.

[0037] Figure 3 This diagram shows a cross-sectional view of two force sensor units 251 of a thin-film elastic force sensor pad 201, which is designed to measure force magnitude with high accuracy and reliability. The elastic force sensor pad 201 includes an upper thin-film substrate 14T and a lower thin-film substrate 14B. A plurality of thin-film force sensing components 11 are sandwiched between the upper thin-film substrate 14T and the lower thin-film substrate 14B; each thin-film force sensing component 11 is responsible for detecting the force applied to it from the top or bottom. The thin-film force sensing components 11 are electrically coupled to a first circuit (not shown) on the upper thin-film substrate 14T and a second circuit (not shown) on the lower thin-film substrate 14B, thereby allowing them to transmit the measured force magnitude via the first and second circuits to an external control unit for further processing.

[0038] To enhance the durability and elasticity of the elastic force sensor pad 201, the present invention provides a lower protective layer 21B on the lower surface of the lower thin film substrate 14B. The lower protective layer 21B has a Young's modulus of 0.1-200 GPa. Young's modulus is a measure of material stiffness. In this case, the provision of the lower protective layer 21B can help prevent the formation of creases, folds, or wrinkles on the bottom of the force sensor unit 251.

[0039] A lower protective layer 21B is disposed below the corresponding thin-film force sensing component 11, and the lower protective layer 21B is aligned with the upper thin-film force sensing component 11. The thin-film force sensing component 11 has a reaction area, and when a force is applied to the reaction area from the top or bottom, the thin-film force sensing component will output a corresponding reaction signal. The reaction area has a reaction area RA.

[0040] The lower surface area SA of the lower protective layer 21B is approximately 0.4-2.5 times the reaction area RA of the thin-film force sensing component 11. The lower protective layer 21B helps the force sensor unit 251 resist the formation of creases, folds, or wrinkles at the bottom.

[0041] In a typical design, the lower protective layer 21B has a lower surface area SA that is approximately the same as the reaction area RA of the thin-film force sensing component 11.

[0042] Second Embodiment

[0043] Figure 4 This illustrates a second embodiment of the present invention.

[0044] Figure 4 A cross-sectional view showing the two force sensor units 252 of the thin-film elastic force sensor pad 202.

[0045] Figure 4 Is Figure 3 Based on this, an upper protective layer 21T is further provided on the upper surface of the upper thin film substrate 14T.

[0046] The upper protective layer 21T has no circuitry and its Young's modulus is 0.1-200 GPa. Young's modulus is a measure of material stiffness, and in this case, the upper protective layer 21T can help the force sensor unit 252 resist the formation of creases, folds, or wrinkles from the top.

[0047] The upper protective layer 21T is disposed on the corresponding thin film force sensing component 11, and the upper protective layer 21T is aligned with the thin film force sensing component 11 below.

[0048] The upper surface area SA of the upper protective layer 21T is approximately 0.4-2.5 times the reaction area RA of the thin-film force sensing component 11; the upper protective layer 21T can help the force sensor unit 252 resist the formation of creases, folds or wrinkles from the top.

[0049] In a typical design, the upper protective layer 21T has an upper surface area SA that is approximately the same as the reaction area RA of the thin-film force sensing component 11.

[0050] Third Embodiment

[0051] Figure 5-6 This illustrates a third embodiment of the present invention.

[0052] Figure 5 A cross-sectional view showing the two force sensor units 253 of the thin-film elastic force sensor pad 203.

[0053] like Figure 5As shown, in order to prevent misalignment between the upper thin film substrate 14T and the lower thin film substrate 14B, at least one fixing pin 23P is prepared, and then the fixing pin 23P is inserted and passes through the upper thin film substrate 14T and the lower thin film substrate 14B; the fixing pin 23P fixes the two substrates in place to prevent misalignment.

[0054] Figure 5 The retaining pin 23P can be made of metal or non-metal. The retaining pin 23P can be inserted into the upper thin film substrate 14T and the lower thin film substrate 14B using a hammer, stapler or similar tool.

[0055] Figure 6 The fixing pin 23P is inserted into the upper thin film substrate 14T and the lower thin film substrate 14B to fix the two substrates in place and prevent possible misalignment between the two substrates.

[0056] In a typical embodiment, the length of the retaining pin 23P is approximately the same as the total thickness of the upper thin film substrate 14T and the lower thin film substrate 14B.

[0057] Fourth embodiment

[0058] Figure 7 This invention illustrates a fourth embodiment.

[0059] Figure 7 A cross-sectional view showing the two force sensor units 254 of the thin-film elastic force sensor pad 204.

[0060] Figure 7 Is Figure 6 Based on this, an upper protective layer 21T is further provided on top of the upper thin film substrate 14T.

[0061] Fifth embodiment

[0062] Figures 8-9 This illustrates the fifth embodiment of the present invention.

[0063] Figure 8 A cross-sectional view of two force sensor units 254 showing the thin-film elastic force sensor pad 205.

[0064] We can use a radiation curing machine CM to cure the upper thin film substrate 14T and the lower thin film substrate 14B at designated positions to create radiation-cured resin pillars that function as fixing pins.

[0065] Figure 9 This shows the formation of radiation-cured resin columns.

[0066] The radiation-cured resin pillar 23C can be manufactured by subjecting a designated location to infrared or ultraviolet radiation. During this process, the upper thin-film substrate 14T and the lower thin-film substrate 14B are exposed to radiation at the designated location, causing them to cure and form the radiation-cured resin pillar 23C.

[0067] Figure 9 The radiation-cured resin column 23C is shown. Its function is the same as that of the fixing pin 23P, which is used to fix the upper thin film substrate 14T and the lower thin film substrate 14B in place to prevent them from being misaligned.

[0068] In a typical embodiment, the radiation-cured resin column 23C has a length that is approximately the same as the total thickness of the upper thin film substrate 14T and the lower thin film substrate 14B.

[0069] Sixth Embodiment

[0070] Figure 10 The sixth embodiment of the present invention is shown.

[0071] Figure 10 A cross-sectional view of two force sensor units 256 showing the thin-film elastic force sensor pad 206.

[0072] Figure 10 Is Figure 9 Based on this, an upper protective layer 21T is further provided on top of the upper thin film substrate 14T.

[0073] Seventh Embodiment

[0074] Figure 11-12 The seventh embodiment of the present invention is shown.

[0075] Figure 11 A cross-sectional view of two force sensor units 257 showing the thin-film elastic force sensor pad 207.

[0076] We use a sewing machine SM to sew the upper thin film substrate 14T and the lower thin film substrate 14B together through the sewing thread 23T.

[0077] Figure 12 Showing the condition of suture 23T.

[0078] The sutures 23T connect the upper thin film substrate 14T and the lower thin film substrate 14B. These sutures 23T function similarly to the retaining pins 23P to keep the upper thin film substrate 14T and the lower thin film substrate 14B in place and prevent them from becoming misaligned.

[0079] Eighth embodiment

[0080] Figure 13 This illustrates the eighth embodiment of the present invention.

[0081] Figure 13 A cross-sectional view of two force sensor units 258 showing the thin-film elastic force sensor pad 208.

[0082] Figure 13 Is Figure 12 Based on this, an upper protective layer 21T is further provided on top of the upper thin film substrate 14T.

[0083] In a typical embodiment, the length of the suture 23T is approximately the same as the total thickness of the upper thin film substrate 14T and the lower thin film substrate 14B. This ensures that the suture 23T can firmly hold the upper thin film substrate 14T and the lower thin film substrate 14B in place and prevent them from becoming misaligned.

[0084] The upper protective layer 21T and the lower protective layer 21B each have a Young's modulus of 0.1-200 GPa.

[0085] The thickness of the upper protective layer 21T or the lower protective layer 21B is approximately between 0.1 and 2.0 mm. This thickness helps the elastic force sensor unit resist wrinkles while maintaining the thinness and lightness of the entire unit.

[0086] The materials of the upper protective layer 21T and the lower protective layer 21B can be flexible, non-flexible, or a combination thereof.

[0087] The materials of the upper protective layer 21T and the lower protective layer 21B can be metal, non-metal, or a combination thereof. The choice of materials depends on the requirements of the product application.

[0088] The total thickness of the upper protective layer 21T and the lower protective layer 21B is approximately between 0.2 and 4.0 mm. This thickness ensures that the elastic force sensor pad remains thin and lightweight while still maintaining its strength and flexibility.

[0089] In the elastic force sensor units 251-258, the thickness of the upper protective layer 21T and the thickness of the lower protective layer 21B can be the same or different. In a typical design, the ratio of the thickness of the upper protective layer 21T to the thickness of the lower protective layer 21B is approximately between 0.5 and 2. For example, the ratio of 0.1 mm to 0.2 mm is 0.5; the ratio of 1 mm to 1 mm is 1; and the ratio of 1.6 mm to 0.8 mm is 2.

[0090] Figure 14 This shows the position of the fixing unit of the present invention.

[0091] Figure 14The display fixing unit 23X (23P, 23C, 23T) is set in a designated position to avoid contact with the circuitry of the elastic force sensor pad 20X (201-208).

Claims

1. An elastic force sensor unit, characterized in that, include: Upper thin-film substrate; Lower thin-film substrate; A thin-film force sensing component is sandwiched between the upper thin-film substrate and the lower thin-film substrate; as well as A lower protective layer is disposed below the lower thin film substrate; in The thin-film force sensing component has a reaction area, and when force is applied to this area from the top or bottom, the thin-film force sensing component will output a corresponding reaction signal.

2. The elastic force sensor unit as described in claim 1, characterized in that, The lower surface area of ​​the lower protective layer is approximately 0.4 to 2.5 times the reaction area of ​​the thin-film force sensing component.

3. The elastic force sensor unit as described in claim 2, characterized in that, The lower surface area of ​​the lower protective layer is approximately the same as the reaction area of ​​the thin-film force sensing component.

4. The elastic force sensor unit as described in claim 3, characterized in that, The thickness of the lower protective layer is approximately between 0.1 and 2.0 mm.

5. The elastic force sensor unit as described in claim 4, characterized in that, The Young's modulus of the material of the lower protective layer is 0.1-200 GPa.

6. The elastic force sensor unit as described in claim 5, characterized in that, The material of the lower protective layer is flexible, non-flexible, or a combination thereof.

7. The elastic force sensor unit as described in claim 6, characterized in that, The material of the lower protective layer is metal, non-metal, or a combination thereof.

8. The elastic force sensor unit as described in claim 1, characterized in that, Also includes: An upper protective layer is disposed on the upper surface of the upper thin film substrate.

9. The elastic force sensor unit as described in claim 8, characterized in that, The upper protective layer has an upper surface area that is approximately 0.4 to 2.5 times the reaction area of ​​the thin-film force sensing component.

10. The elastic force sensor unit as claimed in claim 9, characterized in that, The upper protective layer has an upper surface area that is approximately the same as the reaction area of ​​the thin-film force sensing component.

11. The elastic force sensor unit as claimed in claim 10, characterized in that, The upper protective layer has a thickness of approximately 0.1-2.0 mm.

12. The elastic force sensor unit as claimed in claim 11, characterized in that, The total thickness of the upper protective layer and the lower protective layer is approximately between 0.2 and 4.0 mm.

13. The elastic force sensor unit as described in claim 12, characterized in that, The thickness of the upper protective layer is approximately between 0.5 and 2 compared to the thickness of the lower protective layer.

14. The elastic force sensor unit as described in claim 13, characterized in that, The Young's modulus of the material of the upper protective layer is 0.1-200 GPa.

15. The elastic force sensor unit as described in claim 8, characterized in that it further includes... include: At least one fixing unit penetrates through the upper thin film substrate and the lower thin film substrate to prevent misalignment of the two substrates.

16. The elastic force sensor unit as claimed in claim 15, characterized in that, The fixing unit is a suture, a metal needle, or a radiation-cured resin column.

17. The elastic force sensor unit as claimed in claim 16, characterized in that, The radiation-cured resin column is either an IR radiation-cured resin column or a UV radiation-cured resin column.

18. The elastic force sensor unit as claimed in claim 16, characterized in that, The length of the fixing unit is approximately equal to the total thickness of the upper thin film substrate plus the lower thin film substrate.

19. An elastic force sensor unit, characterized in that, include: Upper thin-film substrate; Lower thin-film substrate; A thin-film force sensing component is sandwiched between the upper thin-film substrate and the lower thin-film substrate; as well as At least one fixing unit penetrates through the upper thin film substrate and the lower thin film substrate to prevent misalignment of the two substrates.

20. The elastic force sensor unit as claimed in claim 19, characterized in that, Also includes: An upper protective layer is disposed on the upper surface of the upper thin film substrate.

21. The elastic force sensor unit as described in claim 20, characterized in that, Also includes: A lower protective layer is disposed on the lower surface of the lower thin film substrate.

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