Sound source localization sensor and sound source localization method

Abstract

The invention provides a sound source localization sensor and a sound source localization method, and relates to the technical field of sensors. The sound source positioning sensor comprises a vibration measurement optical part, a photoelectric vibration measurement part and a light resistance vibration measurement part. The vibration measurement optical part generates a horizontal 360-degree annular light beam through an annular shading plate, the horizontal 360-degree annular light beam is divided into two paths by a spectroscope after being reflected by a vibration measurement reflective film, vertical transmission light is sent to the photoelectric vibration measurement part, and horizontal reflection light is sent to the light resistance vibration measurement part. The photoelectric vibration measurement part adopts a gradually-changed shading layer and a fan-shaped photoelectric plate with more than or equal to 360 pixels, so that the angular resolution of 1 degree is realized; and the light resistance vibration measurement part dynamically regulates and controls the light transmittance of an electric control light resistance material through a pixelated three-layer structure, and acquires an auxiliary verification signal by using a 850 nm invisible laser transceiving array. And fusing double-path information, and finally outputting a high-precision azimuth angle. The scheme has the advantages of fast response, strong anti-interference, and no blind area in all directions.

Description

Technical Field

[0001] This application relates to the field of sound source localization technology, and in particular to a sound source localization sensor and a sound source localization method. Background Technology

[0002] Sound source localization technology determines the spatial location of a sound source by detecting the propagation characteristics of sound signals. It has significant applications in industrial production (such as equipment fault diagnosis), environmental monitoring (such as noise source tracing), and security (such as abnormal sound source early warning). Currently, mainstream sound source localization technologies are mainly divided into two categories: acoustic and optical. Acoustic sound source localization technology relies on microphone arrays to receive sound signals and calculate the sound source location through signal delay difference. However, it is greatly affected by environmental noise and its localization accuracy drops significantly in complex sound fields (such as multiple sound sources superimposed or echo environments). Optical sound source localization technology is mostly based on the principle of laser vibration measurement. It uses the changes in optical signals caused by sound-driven object vibration to locate the sound source. It has the advantage of strong anti-interference ability. However, existing optical technologies mostly use a single photoelectric conversion structure, which has problems such as slow response speed and limited localization direction coverage (it is difficult to achieve 360-degree horizontal plane coverage). It cannot meet the accurate localization requirements of impact sound sources (instantaneous and highly directional). Summary of the Invention

[0003] In view of this, the purpose of this application is to overcome the shortcomings of the prior art and provide a sound source localization sensor and a sound source localization method. By designing a multi-unit collaborative structure and combining photoelectric conversion and photoresist control technology, it can achieve rapid and accurate localization of impact sound sources in a 360-degree horizontal plane, while improving anti-interference ability and the range of applicable scenarios.

[0004] This application provides the following technical solution: In a first aspect, embodiments of this application provide a sound source localization sensor, which includes a vibration measurement optical part, a photoelectric vibration measurement part, and a photoresistive vibration measurement part; The output terminal of the vibration measurement optical part is connected to the photoelectric vibration measurement part and the photoresistive vibration measurement part respectively, and is used to split and transmit the reflected optical signal modulated by the sound source vibration to the photoelectric vibration measurement part and the photoresistive vibration measurement part; The vibration measurement optical component includes a laser emitter, a concave lens, a convex lens, an annular light shield, a first prism, a vibration measurement reflective film, a second prism, and a beam splitter arranged sequentially along the optical path, as well as a reflector disposed on the horizontal reflection optical path of the beam splitter. The laser emitted by the laser emitter is diverged by the concave lens and converged by the convex lens to form a collimated beam. After passing through the annular light shield, only a 360° annular beam in the horizontal plane is retained. This annular beam is refracted by the first prism and then vertically illuminates the vibration measuring reflective film. When a sound source is present, the vibration-measuring reflective film area corresponding to the direction of the sound source is displaced due to acoustic vibration, causing the reflected light to carry the sound source's directional information; the reflected light is refracted by the second prism and then incident on the beam splitter, where it is divided into vertically transmitted light and horizontally reflected light. The vertically transmitted light is input to the photoelectric vibration measurement section, and the horizontally reflected light is input to the photoresistive vibration measurement section after being reflected by the reflector.

[0005] In some embodiments of the first aspect, the photoelectric vibration measurement section includes a gradient light-shielding layer, a fan-shaped photoelectric plate, a voltage differential comparator, and an electro-optic trajectory synthesizer that are connected in sequence. The gradient opaque layer has a continuously varying transmittance in the radial direction; The vertically transmitted light passes through the gradient light-blocking layer and is projected onto the fan-shaped photoelectric plate, causing the fan-shaped photoelectric plate to output a voltage signal corresponding to the position of the light. The voltage differential comparator determines the spot offset direction based on the voltage difference in each region and outputs the azimuth information; The electro-optic trajectory synthesizer synthesizes the initial direction angle of the sound source based on the orientation information.

[0006] In some embodiments of the first aspect, the photoresist vibration measurement section includes pixelated and vertically stacked pixel optoelectronic boards, a differential circuit layer and an electrically controlled photoresist material, as well as two sets of opposing laser transceiver arrays; In this configuration, a first laser transmitter array is positioned opposite a first laser receiver array, a second laser transmitter array is positioned opposite a second laser receiver array, and the electrically controlled photoresist material is located between the two sets of laser transmission and reception paths. The horizontal reflected light shines on the pixel photoelectric plate, and each pixel converts the light intensity into a voltage signal and inputs it to the differential circuit layer at the corresponding position; The differential circuit layer outputs a non-zero voltage when the illumination changes, driving the electronically controlled photoresist material at the corresponding position to dynamically adjust the transmittance. The probe light emitted by the two sets of laser emitter arrays passes through the electrically controlled photoresist material and is received by the corresponding laser receiver array, which then outputs an auxiliary judgment signal to verify the direction of the sound source.

[0007] In some embodiments of the first aspect, the light-transmitting area of ​​the annular light-shielding plate is a 360° closed ring, allowing only the annular beam of light in the horizontal plane to pass through, and the annular beam of light in space appears as two parallel thin beams, used to achieve omnidirectional sound source excitation and reflection.

[0008] In some embodiments of the first aspect, the fan-shaped photoelectric plate is composed of a plurality of photoelectric pixel units evenly distributed along the circumference, each pixel unit corresponding to a fixed angle range with an angle resolution of 1° to 5°.

[0009] In some embodiments of the first aspect, the transmittance of the electro-controlled photoresist material is negatively correlated with the applied voltage: when the output voltage of the differential circuit layer increases, the transmittance of the corresponding region decreases.

[0010] In some embodiments of the first aspect, the laser emitted by the first laser emitter array and the second laser emitter array are of the same wavelength and are in the invisible light band, so as to avoid interfering with the vertically transmitted light and horizontally reflected light in the main optical path.

[0011] In some embodiments of the first aspect, the vibration-measuring reflective film is a flexible, highly reflective film attached to a rigid support ring, with a natural frequency higher than 10kHz, suitable for the high-frequency vibration response of impact-type transient sound sources.

[0012] In some embodiments of the first aspect, the pixel optoelectronic plate, the differential circuit layer, and the electrically controlled photoresist material are arranged in a concentric circle array in a horizontal plane, with no less than 360 pixels, to achieve orientation sensing with a 1° angular resolution.

[0013] Secondly, embodiments of this application also provide a sound source localization method, applied to a sound source localization sensor as described in any of the above embodiments, the sound source localization method comprising: The laser emitter is activated to generate a collimated beam that is diverged by a concave lens and converged by a convex lens, and then the 360° annular beam in the horizontal plane is filtered out by an annular light shield. The annular beam is refracted by the first prism and then shines perpendicularly onto the vibration-measuring reflective film; when there is an impact-type sound source, the vibration-measuring reflective film in the direction of the sound source undergoes mechanical vibration, modulating the propagation direction of the reflected light; The modulated reflected light is refracted by the second prism and then incident on the beam splitter, where it is divided into vertically transmitted light and horizontally reflected light, which are then sent to the photoelectric vibration measurement section and the photoresistance vibration measurement section, respectively. In the photoelectric vibration measurement section, vertically transmitted light is modulated by a gradient shading layer and then projected onto a fan-shaped photoelectric plate to generate an orientation-dependent voltage signal. The direction of light spot offset is located by a voltage differential comparator, and the preliminary direction of the sound source is output by an electro-optic trajectory synthesizer. In the photoresist vibration measurement section, horizontal reflected light illuminates the pixel photoelectric plate, and its output signal is processed by the differential circuit layer to dynamically adjust the transmittance of the electrically controlled photoresist material; two sets of laser transceiver arrays penetrate the material, and the receiving end outputs an auxiliary verification signal according to the spatial change of light intensity. By combining the preliminary direction with the auxiliary verification signal, the location of the sound source in the 360° horizontal plane is finally determined.

[0014] The embodiments of this application have the following advantages: This application provides a sound source localization sensor. A laser beam emitted from a laser emitter is collimated by passing through a concave lens (diverging) and a convex lens (converging). This beam then passes through an annular light-shielding plate, which filters out the central light spot, retaining only the annular beam covering 360° in the horizontal plane. This annular beam is refracted by a first prism and then vertically illuminates a sound-sensitive vibration-measuring reflective diaphragm, thereby achieving synchronous optical monitoring of sound excitation in all horizontal directions. When a sound wave (especially an impact-type sound wave) arrives, it causes a slight vibration in the vibration-measuring reflective diaphragm. The vibration amplitude is greatest in the corresponding area of ​​the vibration-measuring reflective diaphragm located in a specific direction of the sound source. This vibration causes a change in the optical path of the reflected light illuminating that area, thereby modulating the direction information of the sound source into the reflected light signal. The reflected light carrying azimuth information is refracted by the second prism and then split into two paths by the beam splitter: one path (vertical transmitted light) enters the photoelectric vibration measurement section: this unit quickly detects changes in the intensity or frequency of the reflected light through photoelectric conversion, thereby obtaining the temporal characteristics and vibration intensity of the acoustic vibration. It is mainly used to determine the presence and approximate energy of the sound source, and due to its fast response speed, it is particularly suitable for capturing transient impact sounds. The other path (horizontal reflected light, after reflection by a mirror) enters the photoresistivity vibration measurement section: this unit, based on the photoresistivity effect (light changes the material's resistance), can accurately determine the specific azimuth angle that causes the maximum vibration, i.e., the direction of the sound source, by detecting subtle changes in the position of the reflected light spot on the photosensitive material. Through the coordinated work of the photoelectric vibration measurement section and the photoresistivity vibration measurement section, the system can integrate the intensity of the vibration signal (from the photoelectric unit) and the precise azimuth angle (from the photoresist unit) to ultimately achieve rapid and accurate positioning of the sound source within a 360-degree horizontal plane.

[0015] Compared with existing technologies, the sound source localization sensor and method provided in this application achieve 360-degree horizontal plane coverage without blind spots. Through innovative optical design, a ring-shaped monitoring area covering the entire horizontal plane is formed, solving the problem of limited directional coverage in traditional optical sound source localization technologies. Furthermore, it enhances the localization capability of impact sound sources, combining the advantages of photoelectric vibration measurement and photoresistive vibration measurement technologies. It can quickly respond to and accurately capture impact sound events with strong transients and clear directions, meeting the precise localization requirements that existing technologies struggle to address. Additionally, it enhances anti-interference capabilities and environmental adaptability. As an optical localization technology, it is inherently less susceptible to direct effects from ambient airborne acoustic noise (such as background noise and multiple sound source superposition) and complex sound fields (such as echoes), inheriting the advantages of optical methods in strong resistance to electromagnetic and acoustic interference. The collaborative operation of the dual units can also further suppress misjudgments through information comparison.

[0016] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A schematic diagram of the structure of a sound source localization sensor provided in an embodiment of this application is shown; Figure 2 A schematic diagram of the vibration measurement optical section of a sound source localization sensor provided in an embodiment of this application is shown. Figure 3 A schematic diagram of the photoelectric vibration measurement section of a sound source localization sensor provided in an embodiment of this application is shown. Figure 4 A schematic diagram of the optical impedance vibration measurement section of a sound source localization sensor provided in an embodiment of this application is shown.

[0019] Explanation of key component symbols: 1-Vibration measurement optics; 101-Laser emitter; 102-Concave lens; 103-Convex lens; 104-Light shield; 105-Prism; 106-Vibration measurement reflective film; 107-Prism; 108-Beam splitter; 109-Reflector; 110-Vertical transmitted light; 111-Horizontal reflected light; 2- Photoelectric vibration measurement section; 201- Gradient light-blocking layer; 202- Fan-shaped photoelectric plate; 203- Voltage differential comparator; 204- Electro-optic trajectory synthesizer; 3-Optical resist vibration measurement section; 301-Pixel optoelectronic board; 302-Differential circuit layer; 303-Electrically controlled photoresist material; 304-First laser emitter array; 305-Second laser emitter array; 306-First laser receiver array; 307-Second laser receiver array. Detailed Implementation

[0020] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0021] It should be noted that when an element is said to be "fixed" to another element, it can be directly on the other element or there may be an intervening element. When an element is said to be "connected" to another element, it can be directly connected to the other element or there may be an intervening element. Conversely, when an element is said to be "directly" on another element, there is no intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0022] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0023] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the template description is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0025] Among related technologies, sound source localization technology determines the spatial location of a sound source by detecting the propagation characteristics of sound signals. It has significant applications in industrial production (such as equipment fault diagnosis), environmental monitoring (such as noise source tracing), and security (such as abnormal sound source early warning). Currently, mainstream sound source localization technologies are mainly divided into two categories: acoustic and optical. Acoustic sound source localization technology relies on microphone arrays to receive sound signals and calculate the sound source location through signal delay difference. However, it is greatly affected by environmental noise and its localization accuracy drops significantly in complex sound fields (such as multiple sound sources superimposed or echo environments). Optical sound source localization technology is mostly based on the principle of laser vibration measurement. It uses the changes in optical signals caused by sound-driven object vibration to locate the sound source. It has the advantage of strong anti-interference ability. However, existing optical technologies mostly use a single photoelectric conversion structure, which has problems such as slow response speed and limited localization direction coverage (it is difficult to achieve 360-degree horizontal plane coverage). It cannot meet the accurate localization requirements of impact sound sources (instantaneous and highly directional).

[0026] As shown in Figure 1 to Figure 4 As shown, in order to solve the above-mentioned technical problems, this application provides a sound source localization sensor, which includes a vibration measuring optical part 1, a photoelectric vibration measuring part 2, and a photoresistive vibration measuring part 3; The output terminal of the vibration measurement optical part 1 is connected to the photoelectric vibration measurement part 2 and the photoresistive vibration measurement part 3 respectively, and is used to split and transmit the reflected optical signal modulated by the sound source vibration to the photoelectric vibration measurement part 2 and the photoresistive vibration measurement part 3. The vibration measurement optical part 1 includes a laser emitter 101, a concave lens 102, a convex lens 103, an annular light shield 104, a first prism 105, a vibration measurement reflective film 106, a second prism 105, and a beam splitter 108 arranged sequentially along the optical path, as well as a reflector 109 disposed on the horizontal reflected light 111 path of the beam splitter 108. The laser emitted by the laser emitter 101 is diverged by the concave lens 102 and converged by the convex lens 103 to form a collimated beam. It passes through the annular light shield 104 and retains only a 360° annular beam in the horizontal plane. The annular beam is refracted by the first prism 105 and then vertically illuminates the vibration measuring reflective film 106. When a sound source is present, the area of ​​the vibration-measuring reflective film 106 corresponding to the direction of the sound source is displaced due to acoustic vibration, so that the reflected light carries the sound source location information; the reflected light is refracted by the second prism 105 and then incident on the beam splitter 108, and is divided into vertically transmitted light 110 and horizontally reflected light 111. The vertically transmitted light 110 is input to the photoelectric vibration measurement section 2, and the horizontally reflected light 111 is input to the photoresistance vibration measurement section 3 after being reflected by the reflector 109.

[0027] In these embodiments, a sound source localization sensor is provided, which includes three main parts: a vibration measurement optical part 1, a photoelectric vibration measurement part 2, and a photoresistive vibration measurement part 3.

[0028] Vibration measurement optical section 1 is arranged sequentially along the main optical path as follows: Laser emitter 101; Concave lens 102 is used to initially diverge the laser beam; The convex lens 103, located behind the concave lens 102, recollides the diverging light into a parallel beam. The annular light shield 104 is located behind the convex lens 103, with a central opening that allows only the annular light beam distributed in a 360° horizontal plane to pass through, effectively shielding stray light in the vertical direction. The first prism 105 is used to refract the horizontal ring beam downward by 90° so that it is vertically incident on the vibration measuring reflective film 106 below. The vibration-measuring reflective film 106 is a flexible, high-reflectivity film (such as an aluminized PET film), which is fixed above the area to be monitored. Its surface can generate micron-level vibrations with changes in sound pressure. The second prism 105 (symmetrically arranged with the first prism 105) is used to refract the beam carrying vibration information reflected by the vibration measuring reflective film 106 upward back to the original optical path. Beam splitter 108 is located on the output light path of second prism 105 and splits the incident light into two paths: one path is transmitted vertically and the other path is reflected horizontally. The reflector 109 is located at the end of the horizontal reflected light path 111 of the beam splitter 108, and is used to fold the beam by 90° and guide it to the optical damping section 3.

[0029] The key to this optical structure is that by combining a ring-shaped light-shielding plate 104, a double prism 105, and a beam splitter 108, it achieves 360° omnidirectional acoustic vibration detection and simultaneously sends the same reflected signal to two vibration measurement units based on different principles, thus balancing response speed and anti-interference capability.

[0030] The photoelectric vibration measurement section 2 receives vertically transmitted light 110 from the beam splitter 108, and includes a photodetector, a signal conditioning circuit, and an analog-to-digital converter module.

[0031] When a sound source is emitted from one direction, the corresponding area of ​​the vibration-measuring reflective film 106 experiences an instantaneous displacement due to sound pressure, resulting in modulation of the phase / intensity of the reflected light. This modulated light is transmitted through the beam splitter 108 and received by the photodetector, converting it into an electrical signal. Since the photoelectric conversion response time can reach the nanosecond level, this unit is suitable for rapidly capturing the start time and intensity of impact-type sound sources.

[0032] The photoresistor vibration measurement section 3 receives horizontal reflected light 111 reflected by the reflector 109, and includes a photoresistor array, a constant current source drive circuit, and a multi-channel voltage acquisition module.

[0033] Because the resistance of a photoresistor changes with light intensity and has high sensitivity (especially in the low-frequency range), when the vibration of the vibration-measuring reflective film 106 at a certain location causes a local increase or decrease in the intensity of reflected light, the resistance of the photoresistor at the corresponding location changes significantly, thus forming a directional characteristic in the voltage output. Although its response speed (milliseconds) is slower than that of a photodetector, its spatial resolution is strong, which can help determine the precise azimuth angle of a sound source.

[0034] In this embodiment, the photoelectric vibration measurement unit 2 is used to trigger the positioning start, and the photoresistive vibration measurement unit 3 is used for precise orientation positioning. The two work together to achieve a fast response and high-precision positioning effect.

[0035] This application utilizes a dual confirmation mechanism of photoelectric vibration measurement section 2 and photoresistive vibration measurement section 3, coupled with an angle-corresponding design of the fan-shaped photoelectric plate 202, to effectively improve the accuracy of sound source localization. Compared with traditional acoustic localization technology, it can better meet the requirements of high-precision localization. Furthermore, it adopts a fast-response design, enabling timely capture of instantaneous impact sound sources. The entire process uses optical signals as the transmission and processing carrier, unaffected by environmental noise interference, and the auxiliary laser uses invisible light to avoid optical path conflicts, adapting to complex sound field environments. Additionally, the ring structure design achieves omnidirectional horizontal coverage, overcoming the directional coverage limitations of traditional sensors. Simultaneously, the stacked layout of each unit results in a compact overall structure, allowing for flexible installation in various scenarios such as industrial equipment and environmental monitoring stations, demonstrating high adaptability.

[0036] In some embodiments, the photoelectric vibration measurement section 2 includes a gradient light-shielding layer 201, a fan-shaped photoelectric plate 202, a voltage differential comparator 203, and an electro-optical trajectory synthesizer 204, which are connected in sequence. The gradient light-shielding layer 201 has a continuously varying transmittance in the radial direction. Vertically transmitted light 110 passes through the gradient light-shielding layer 201 and is projected onto the fan-shaped photoelectric plate 202, causing the fan-shaped photoelectric plate 202 to output a voltage signal corresponding to the illumination position. The voltage differential comparator 203 determines the light spot offset direction based on the voltage difference in each region and outputs azimuth information. The electro-optical trajectory synthesizer 204 synthesizes the preliminary azimuth angle of the sound source based on the azimuth information.

[0037] Based on the aforementioned Embodiment 1, this embodiment optimizes the internal structure of the photoelectric vibration measurement part 2 to improve the analytical accuracy and response consistency of the sound source direction angle.

[0038] The gradient light-blocking layer 201 is a circular thin film structure, fixed downstream of the vertical transmission light path 110 of the beam splitter 108 and directly above the fan-shaped photoelectric plate 202. This layer is created by depositing metal oxides on a transparent quartz substrate using a coating process, giving it a continuously varying transmittance in the radial direction. For example, the transmittance of the central region is 90%, the transmittance of the middle ring region linearly decreases to 30%, and the transmittance of the outer region remains stable at 10%.

[0039] This design ensures that even if the incident light spot experiences a slight shift due to vibration, the light intensity distribution after passing through the layer will asymmetrically decrease with respect to the direction and magnitude of the shift, thereby enhancing position sensitivity.

[0040] For example, the fan-shaped photoelectric plate 202 consists of four identical fan-shaped photodiode units, evenly distributed along the circumference. Each unit covers 90°, i.e., 0°–90°, 90°–180°, 180°–270°, and 270°–360°. Insulating isolation slots are provided between adjacent fan-shaped photodiode units to avoid crosstalk. Each photodiode unit independently outputs a current signal, which is converted into a voltage signal after transimpedance amplification.

[0041] When the vertically transmitted light 110 carrying the sound source's location information passes through the gradient light-blocking layer 201, it is projected onto the surface of the fan-shaped photoelectric plate 202 to form an off-center light spot. For example, if the sound source is located at a 45° angle, the center of the light spot is offset towards the first quadrant, significantly higher than other channels.

[0042] The voltage differential comparator 203 receives four voltage signals and performs the following differential operation to calculate the difference in the X-axis direction: .

[0043] Calculate the difference in the Y-axis direction: .

[0044] By analyzing the signs and ratios of the differences in the X-axis and Y-axis directions, the quadrant and approximate angle of the light spot offset can be determined. For example: If the difference in the X-axis direction and the difference in the Y-axis direction are both greater than 0, then the sound source is determined to be located in the first quadrant.

[0045] The preliminary estimate of the azimuth angle is: .

[0046] For example, the comparator is built using a high-speed operational amplifier with a response delay of less than 200 ns, making it suitable for transient signal processing of impact sound sources.

[0047] The electro-optic trajectory synthesizer 204 is an embedded microcontroller (such as the STM32H7 series) with a built-in orientation fusion algorithm module. This module receives the X-axis direction difference, Y-axis direction difference, and original voltage amplitude output from the voltage differential comparator 203, and combines them with a pre-stored spot-orientation mapping calibration table (obtained through calibration experiments) to perform nonlinear compensation on the initial orientation angle, and finally outputs the initial orientation angle of the sound source.

[0048] In some embodiments, the photoresist vibration measurement section 3 includes a pixelated and vertically stacked pixel optoelectronic board 301, a differential circuit layer 302, and an electrically controlled photoresist material 303, as well as two sets of opposing laser transceiver arrays. In this configuration, the first laser transmitter array 304 is positioned opposite the first laser receiver array 306, the second laser transmitter array 305 is positioned opposite the second laser receiver array 307, and the electrically controlled photoresist material 303 is located between the two sets of laser transmission and reception paths. The horizontal reflected light 111 irradiates the pixel photoelectric plate 301, and each pixel converts the light intensity into a voltage signal and inputs it to the differential circuit layer 302 at the corresponding position. The differential circuit layer 302 outputs a non-zero voltage when the illumination changes, driving the electronically controlled photoresist material 303 at the corresponding position to dynamically adjust the light transmittance. The probe light emitted by the two sets of laser emitter arrays passes through the electrically controlled photoresist material 303 and is received by the corresponding laser receiver array, which then outputs an auxiliary judgment signal to verify the direction of the sound source.

[0049] Based on the aforementioned embodiments, this embodiment deeply optimizes the photoresistivity measurement component 3 by introducing a pixelated sensing-response closed-loop structure and a dual-axis laser-assisted verification mechanism, significantly improving the anti-interference capability and spatial resolution accuracy of sound source direction determination. The aforementioned components are stacked vertically in the vertical direction to form a multi-layer integrated structure.

[0050] The pixel optoelectronic board 301 is located on the top layer of the photoresistor vibration measurement section 3, and directly receives the horizontally reflected light 111 reflected by the reflector 109. This optoelectronic board is fabricated using CMOS technology and has a pixel array, with each pixel containing a PIN photodiode and a readout transistor. When modulated light carrying sound source location information shines onto the board surface, each pixel outputs a corresponding analog voltage signal (V_{i,j}) (i,j=1......16) based on the local light intensity.

[0051] For example, if the sound source is located at a 120° angle, the pixel area corresponding to the 120° angle will have the highest light intensity and the output voltage will be significantly higher than that of the surrounding pixels.

[0052] The differentiating circuit layer 302 is located directly below the pixel optoelectronic board 301 and consists of an array of differentiating amplifiers corresponding to each pixel. Each differentiating circuit receives the voltage signal of the corresponding pixel and amplifies its time derivative, i.e., outputs:

[0053] Where k is the gain coefficient (typically 10). 4 V·s -1 ).

[0054] Because the light intensity modulation caused by impact sound sources has a fast rise time, the differentiating circuit only outputs a non-zero voltage pulse at the instant of light intensity change, while the output is zero under steady-state light intensity. This characteristic effectively suppresses ambient light drift and continuous noise interference.

[0055] The electrochromic photoresist material 303 is located below the differential circuit layer 302 and is an electrochromic thin film whose transmittance is continuously adjustable with the applied voltage. Each micro-region (corresponding to a pixel position) is independently connected to the output of the differential circuit above through a microelectrode.

[0056] When a sudden change in light intensity is detected in a pixel area, the corresponding differential circuit outputs positive / negative voltage pulses, driving the electronically controlled photoresist material 303 in that area to instantly decrease or increase its transmittance, forming a dynamic light-shielding pattern consistent with the direction of the sound source.

[0057] Two sets of orthogonally opposed laser transceiver arrays are set on both sides of the electro-controlled photoresist material 303: The first laser emitter array 304 and the first laser receiver array 306 are positioned opposite each other along the X-axis (e.g., from 0° to 180°).

[0058] The second laser emitter array 305 and the second laser receiver array 307 are positioned opposite each other along the Y-axis (e.g., 90° to 270°).

[0059] Two arrays continuously emit low-power probe light, which is collected by the receiver after passing through the electrically controlled photoresist material 303. Because the electrically controlled photoresist material 303 has formed a dynamic light-blocking pattern according to the orientation of the sound source, the probe light will experience a direction-dependent attenuation distribution as it passes through. For example: If the sound source is in the 120° direction, the right channel in the X-axis array will have greater attenuation, and the upper channel in the Y-axis array will have more significant attenuation. Light intensity vector output by the receiver array:

[0060]

[0061] After analysis by the processor, an auxiliary azimuth angle can be calculated independently.

[0062] This auxiliary signal is used to verify the rationality of the initial direction angle output by the photoelectric vibration measurement section 2. It provides redundant positioning capability when strong electromagnetic interference causes the photoelectric unit to fail. It also improves the system's robustness in multi-source or reverberant environments.

[0063] In some embodiments, the light-transmitting area of ​​the annular light-shielding plate 104 is a 360° closed ring, allowing only the annular beam of light in the horizontal plane to pass through, and the annular beam of light in space appears as two parallel thin beams, which are used to achieve omnidirectional sound source excitation and reflection.

[0064] In these embodiments, the annular light-shielding plate 104 is prepared on a stainless steel sheet using a high-precision metal etching process. Its light-transmitting area is a 360° closed ring without any gaps or breaks, ensuring continuous omnidirectional light flux in the horizontal plane.

[0065] Furthermore, the annular light-transmitting area is not a single wide ring, but rather consists of two concentric, equally wide, and precisely spaced thin annular slits.

[0066] When the parallel laser beam, collimated by the convex lens 103, illuminates the annular light-shielding plate 104, only the two narrow annular slits allow light to pass through, thus forming two parallel, coaxial, and narrow annular beams in space, located on the same horizontal plane. After being refracted by the first prism 105, these two beams are projected vertically downwards onto the surface of the vibration-measuring reflective film 106, forming a double-ring illumination area.

[0067] In some embodiments, the fan-shaped photoelectric plate 202 is composed of multiple photoelectric pixel units evenly distributed along the circumference, each pixel unit corresponding to a fixed angle range with an angle resolution of 1° to 5°.

[0068] In these embodiments, the fan-shaped photoelectric plate 202 is not composed of four large sectors, but is further subdivided into multiple independent photoelectric pixel units evenly distributed along the circumference. Each pixel unit occupies a fixed azimuth angle range, thereby achieving higher angular resolution.

[0069] For example, this embodiment uses 72 photoelectric pixel units arranged circumferentially along a circular base with a diameter of 12mm. The center angle between adjacent pixels is 5°. The photosensitive area of ​​a single pixel unit is fan-shaped with a radial width of 2mm and a circumferential arc length corresponding to a 5° viewing angle. Each pixel unit integrates an independent PIN photodiode and readout circuit. The output signal is sent sequentially to the subsequent voltage differential comparator 203 via a multiplexer.

[0070] Since each pixel unit only responds to the incident light intensity within its fixed angular range, when the modulated light spot shifts to one direction due to the vibration of the sound source, only a few adjacent pixels (usually 2–3) produce significant voltage output. Through interpolation algorithms (such as the centroid method or Gaussian fitting), the actual azimuth resolution can be further improved to within 0.5°.

[0071] Furthermore, all pixel units are fabricated using the same process to ensure consistent response. Edge pixels are equipped with optical barriers to prevent crosstalk interference and ensure reliable angle determination.

[0072] In some embodiments, the transmittance of the electrically controlled photoresist material 303 is negatively correlated with the applied voltage: when the output voltage of the differential circuit layer 302 increases, the transmittance of the corresponding region decreases.

[0073] In these embodiments, the electro-optical photoresist material 303 is a functional thin film with a negative electro-optic effect, whose transmittance decreases monotonically with increasing applied voltage. This characteristic works in conjunction with the output signal of the differential circuit layer 302 to achieve dynamic masking feedback for acousto-optic intensity modulation.

[0074] For example, in this embodiment, lithium-doped tungsten trioxide is selected as the electrochromic photoresist material 303, which is deposited on a flexible PET substrate by magnetron sputtering to form a continuous thin film with a thickness of 300 nm. This material has excellent electrochromic properties in the visible and near-infrared band (e.g., 600 to 900 nm).

[0075] When the differential circuit layer 302 detects a rapid increase in the light intensity of a pixel area (such as a sudden increase in reflected light caused by an impact sound source), it outputs a positive voltage pulse. This voltage is applied to both ends of the thin film in the corresponding area, driving the Li... + Ions insert into the crystal lattice, initiating an electrochemical reaction to generate Li. x WO3 exhibits a deep blue color, a reduced optical bandgap, and enhanced absorption, causing its transmittance at the 850 nm probe wavelength to rapidly decrease from an initial 85% to below 20%. Conversely, when the light intensity decreases or returns to a steady state, the output of the differentiating circuit approaches zero, and the material undergoes Li deintercalation under self-relaxation or reverse bias. + The light transmittance gradually recovers.

[0076] In some embodiments, the lasers emitted by the first laser emitter array 304 and the second laser emitter array 305 have the same wavelength and are in the invisible light band, so as to avoid interfering with the vertically transmitted light 110 and the horizontally reflected light 111 in the main optical path.

[0077] In these embodiments, both the first laser emitter array 304 and the second laser emitter array 305 use invisible light laser sources of the same wavelength to ensure the consistency of the detection signals and avoid crosstalk to the positioning beam in the main optical path.

[0078] For example, both arrays use vertical-cavity surface-emitting lasers with a center wavelength of 850 nm, which belongs to the near-infrared invisible light band. This wavelength is invisible to the human eye and does not affect the operating environment. Furthermore, the laser wavelength is separated from that of the main optical path; the laser emitter 101 in the main optical path (used to excite the vibration-measuring reflective film 106) uses 650 nm visible red light, facilitating system debugging and optical path alignment. The photodetector can distinguish wavelengths. The fan-shaped photoelectric plate 202 in the photoelectric vibration measurement section 2 uses a silicon-based photodiode, which has a high responsivity at 650 nm, but a significantly reduced responsivity at 850 nm. At the same time, a 650 nm narrow-bandpass filter can be added to the front end of the photoelectric vibration measurement section 2 to effectively block the 850 nm probe light from entering, thus achieving optical isolation.

[0079] In addition, electrically controlled photoresist material 303 (such as Li) x WO3 exhibits excellent electrochromic response in both the 650 nm and 850 nm bands, thus the same modulation pattern can be applied to both the main optical path reflected light and the auxiliary probe light simultaneously, ensuring consistency between perception and verification.

[0080] In some embodiments, the vibration-measuring reflective film 106 is a flexible, highly reflective film attached to a rigid support ring, with a natural frequency higher than 10kHz, suitable for high-frequency vibration response of impact-type transient sound sources.

[0081] In these embodiments, the vibration-measuring reflective film 106 is a flexible high-reflectivity film, one side of which is deposited with a high-reflectivity metal layer, and the other side is attached to a rigid support ring by a low-stress adhesive to form a tensioned drum structure.

[0082] For example, the flexible film substrate is a 25μm thick biaxially oriented polyethylene terephthalate (PET) with a 50 nm thick high-purity aluminum film vacuum-deposited on its surface, achieving an overall reflectivity of over 92% at a wavelength of 650 nm. The rigid support ring is made of 6061-T6 aluminum alloy, with an inner diameter of 50 mm and a ring width of 5 mm, and its surface is anodized to enhance adhesion stability.

[0083] The film is uniformly bonded to the inner edge of the support ring using an annular UV-curable adhesive. After applying appropriate tension, it is cured to keep the film surface flat and pre-tensioned. This structural design allows the first-order natural frequency of the vibration-measuring reflective film 106 to be achieved.

[0084] Since the energy of typical impact sound sources (such as metal impact, explosion, and arc discharge) is mainly concentrated in the 2 kHz-15 kHz frequency band and the rise time is often less than 1 ms, the vibration measuring reflective film 106 in this embodiment can avoid resonance distortion and achieve linear, fast, and phase-lag-free vibration following response because its natural frequency is much higher than the upper limit of the excitation frequency.

[0085] In addition, the flexible film is lightweight and has low damping, and can generate submicron displacement under transient sound pressure, which is sufficient to modulate the intensity and phase of the reflected laser and meet the requirements of high-sensitivity optical detection.

[0086] In some embodiments, the pixel optoelectronic board 301, the differential circuit layer 302, and the electrically controlled photoresist material 303 are arranged in a concentric circle array in the horizontal plane, with no less than 360 pixels, in order to achieve orientation perception with a resolution of 1°.

[0087] In these embodiments, the pixel optoelectronic plate 301, the differential circuit layer 302, and the electronically controlled photoresist material 303 are arranged in a strictly aligned concentric circle array in the horizontal plane, and the three correspond one-to-one in the radial and circumferential directions to form a vertically penetrating pixel column.

[0088] For example, the entire sensing area is a circular effective area, with 360 independent pixel units evenly distributed along the circumference. The center angle between adjacent pixels is 1°, satisfying the design requirement of "no less than 360 pixels". Each pixel unit occupies the same fan-shaped area in the radial direction, and the three-layer structure is vertically stacked within this area: Top layer: Pixel photoelectric board 301, containing 360 independent PIN photodiodes; Middle layer: Differentiating circuit layer 302, integrating 360 miniature differentiating amplifiers; Bottom layer: Electro-controlled photoresist material 303 (such as Li) x The WO3 thin film is divided into 360 electrically isolated fan-shaped electrochromic units, each of which is connected to the output of the differential circuit above through a micro-via.

[0089] This concentric array structure ensures that the modulated light spot incident from any direction only excites a small number of pixels (usually 1–3) at the corresponding angle. After differential processing, its output precisely drives the electronically controlled photoresist unit at the same angle to change the transmittance, thereby faithfully reproducing the optical characteristics of the sound source's orientation in space.

[0090] With 360 pixels, the system's theoretical angular resolution is 1°. Combined with a centroid interpolation algorithm, the actual azimuth angle can be further subdivided to within 0.2°. In addition, all pixel units adopt a circular symmetrical layout, which avoids the problem of uneven response in oblique orientation of rectangular arrays and ensures consistent 360° omnidirectional positioning performance.

[0091] In some embodiments, this application also provides a sound source localization method, applied to a sound source localization sensor as described in any of the above embodiments. The sound source localization method includes the following steps: Step S100: Start the laser emitter 101 to generate a collimated beam that is diverged by the concave lens 102 and converged by the convex lens 103, and filter out the 360° annular beam in the horizontal plane through the annular light shield 104.

[0092] Step S200: The annular beam is refracted by the first prism 105 and then shines perpendicularly onto the vibration measuring reflective film 106; when there is an impact-type sound source, the vibration measuring reflective film 106 in the direction of the sound source undergoes mechanical vibration, modulating the propagation direction of the reflected light.

[0093] Step S300: The modulated reflected light is refracted by the second prism 105 and then incident on the beam splitter 108, where it is divided into vertically transmitted light 110 and horizontally reflected light 111, which are then sent to the photoelectric vibration measurement section 2 and the photoresistance vibration measurement section 3, respectively.

[0094] Step S400: In the photoelectric vibration measurement section 2, the vertically transmitted light 110 is modulated by the gradient shading layer 201 and projected onto the fan-shaped photoelectric plate 202 to generate an orientation-related voltage signal; the voltage differential comparator 203 locates the light spot offset direction, and the electro-optic trajectory synthesizer 204 outputs the preliminary direction of the sound source. Step S500: In the photoresist vibration measurement section 3, the horizontal reflected light 111 irradiates the pixel photoelectric plate 301, and its output signal is processed by the differential circuit layer 302 to dynamically adjust the transmittance of the electrically controlled photoresist material 303; two sets of laser transceiver arrays penetrate the material, and the receiving end outputs an auxiliary verification signal according to the spatial change of light intensity. Step S600: Combine the preliminary direction with the auxiliary verification signal to finally determine the location of the sound source in the 360° horizontal plane.

[0095] In these embodiments, step S100: the laser emitter 101 is activated, and the emitted laser light is dispersed by the concave lens 102 and converged by the convex lens 103 in sequence, and adjusted into a preset light shape; the light light passes through the light shield 104, and only the circular light light in the horizontal plane is retained. Step S200: The circular light obtained in step S100 is refracted by prism 105 and then shines perpendicularly onto the surface of vibration measuring reflective film 106. When there is an impact-type sound source, the vibration measuring reflective film 106 in the direction of the sound source will generate mechanical vibration under the driving force of the sound signal. This vibration will cause the reflected light at the corresponding position to vibrate synchronously, so that the reflected light carries the position information of the sound source. Step S300: The reflected light carrying the sound source location information in step S200 is refracted by prism 105 and transmitted to beam splitter 108; beam splitter 108 divides the reflected light into vertically transmitted light 110 and horizontally reflected light 111. Vertically transmitted light 110 directly enters photoelectric vibration measurement section 2, and horizontally reflected light 111 enters photoresistance vibration measurement section 3 after being reflected by mirror 109. Step S400: Operation of photoelectric vibration measurement section 2: Vertical transmitted light 110 illuminates the gradient shading layer 201. Due to the gradual change in transmittance along the diameter of the gradient shading layer 201, the light passes through the gradient shading layer 201 and forms illumination areas of different intensities on the fan-shaped photoelectric plate 202. The fan-shaped photoelectric plate 202 converts the illumination intensity into a corresponding voltage signal. If a sound source exists in a certain direction, the vibration of the reflected light in that direction will cause a radial displacement of the transmission position of the light on the gradient shading layer 201, thereby causing a change in the voltage signal of the corresponding area of ​​the fan-shaped photoelectric plate 202. The voltage differential comparator 203 compares the voltage signals of each area of ​​the fan-shaped photoelectric plate 202 to locate the specific location of the voltage change. The electro-optical trajectory synthesizer synthesizes the preliminary direction of the sound source based on this location information. Step S500: Operation of the photoresist vibration measurement section 3: Horizontal reflected light 111 (after reflection by mirror 109) illuminates the pixel photoelectric plate 301. Each pixel of the pixel photoelectric plate 301 converts the light intensity into a voltage signal and transmits it to the corresponding differential circuit layer 302. If the light received by a pixel is stable, the differential circuit layer 302 outputs 0 voltage, and the transmittance of the corresponding position of the electrically controlled photoresist material 303 remains unchanged. If the light received by a pixel changes due to the influence of the sound source, the differential circuit layer 302 outputs a non-zero voltage, controlling the change of the transmittance of the corresponding position of the electrically controlled photoresist material 303. Two sets of laser emitter arrays 101 are activated. The light signals emitted by both are received by the corresponding laser receiver arrays 306 after passing through the electrically controlled photoresist material 303. The two sets of laser receiver arrays 306 output auxiliary judgment signals according to the intensity change of the received light signals to verify the preliminary direction of the sound source obtained in step S400, and finally determine the precise position of the sound source.

[0096] In all examples shown and described herein, any specific values ​​should be interpreted as merely exemplary and not as limitations; therefore, other examples of exemplary embodiments may have different values.

[0097] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0098] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these modifications and improvements all fall within the protection scope of this application.

Claims

1. A sound source localization sensor, characterized in that, The sound source localization sensor includes a vibration measurement optical part (1), a photoelectric vibration measurement part (2), and a photoresist vibration measurement part (3). The output end of the vibration measurement optical part (1) is connected to the photoelectric vibration measurement part (2) and the photoresist vibration measurement part (3) respectively, and is used to transmit the reflected optical signal modulated by the sound source vibration to the photoelectric vibration measurement part (2) and the photoresist vibration measurement part (3). The vibration measurement optical part (1) includes a laser emitter (101), a concave lens (102), a convex lens (103), an annular light shield (104), a first prism (105), a vibration measurement reflective film (106), a second prism (105), and a beam splitter (108) arranged sequentially along the optical path, as well as a reflector (109) disposed on the horizontal reflection light (111) path of the beam splitter (108). The laser emitted by the laser emitter (101) is diverged by the concave lens (102) and converged by the convex lens (103) to form a collimated beam. It passes through the annular light shield (104) and retains only a 360° annular beam in the horizontal plane. The annular beam is refracted by the first prism (105) and then vertically illuminates the vibration measuring reflective film (106). When a sound source is present, the area of ​​the vibration-measuring reflective film (106) corresponding to the direction of the sound source is displaced due to acoustic vibration, so that the reflected light carries the sound source orientation information; the reflected light is refracted by the second prism (105) and then incident on the beam splitter (108), and is divided into vertically transmitted light (110) and horizontally reflected light (111). The vertically transmitted light (110) is input to the photoelectric vibration measurement section (2), and the horizontally reflected light (111) is input to the photoresistance vibration measurement section (3) after being reflected by the reflector (109).

2. The sound source localization sensor according to claim 1, characterized in that, The photoelectric vibration measurement section (2) includes a gradient shading layer (201), a fan-shaped photoelectric plate (202), a voltage differential comparator (203), and an electro-optical trajectory synthesizer (204) that are connected in sequence. The gradient shading layer (201) has a continuously varying transmittance in the radial direction; The vertically transmitted light (110) passes through the gradient light-blocking layer (201) and is projected onto the fan-shaped photoelectric plate (202), causing the fan-shaped photoelectric plate (202) to output a voltage signal corresponding to the position of the light. The voltage differential comparator (203) determines the spot offset direction based on the voltage difference in each region and outputs the azimuth information; The electro-optic trajectory synthesizer (204) synthesizes the preliminary direction angle of the sound source based on the orientation information.

3. The sound source localization sensor according to claim 1, characterized in that, The photoresist vibration measurement section (3) includes a pixelated and vertically stacked pixel optoelectronic board (301), a differential circuit layer (302), and an electrically controlled photoresist material (303), as well as two sets of opposing laser transceiver arrays; Among them, the first laser transmitter array (304) is opposite to the first laser receiver array (306), the second laser transmitter array (305) is opposite to the second laser receiver array (307), and the electrically controlled photoresist material (303) is located between the two sets of laser transmission and reception paths; The horizontal reflected light (111) irradiates the pixel photoelectric plate (301), and each pixel converts the light intensity into a voltage signal and inputs it to the differential circuit layer (302) at the corresponding position. The differential circuit layer (302) outputs a non-zero voltage when the illumination changes, driving the electronically controlled photoresist material (303) at the corresponding position to dynamically adjust the transmittance; The probe light emitted by the two sets of laser emitter arrays passes through the electrically controlled photoresist material (303) and is received by the corresponding laser receiver array, which outputs an auxiliary judgment signal for verifying the direction of the sound source.

4. The sound source localization sensor according to claim 1, characterized in that, The light-transmitting area of ​​the annular light-shielding plate (104) is a 360° closed ring, allowing only the annular beam of light in the horizontal plane to pass through. The annular beam of light appears as two parallel thin beams in space, which are used to achieve omnidirectional sound source excitation and reflection.

5. The sound source localization sensor according to claim 2, characterized in that, The fan-shaped photoelectric plate (202) is composed of multiple photoelectric pixel units evenly distributed along the circumference. Each pixel unit corresponds to a fixed angle range with an angle resolution of 1° to 5°.

6. The sound source localization sensor according to claim 3, characterized in that, The transmittance of the electronically controlled photoresist material (303) is negatively correlated with the applied voltage: when the output voltage of the differential circuit layer (302) increases, the transmittance of the corresponding region decreases.

7. The sound source localization sensor according to claim 3, characterized in that, The first laser emitter array (304) and the second laser emitter array (305) emit lasers with the same wavelength and in the invisible light band to avoid interfering with the vertically transmitted light (110) and horizontally reflected light (111) in the main optical path.

8. The sound source localization sensor according to claim 1, characterized in that, The vibration-measuring reflective film (106) is a flexible high-reflectivity film attached to a rigid support ring. Its natural frequency is higher than 10kHz, making it suitable for high-frequency vibration response of impact transient sound sources.

9. The sound source localization sensor according to claim 7, characterized in that, The pixel optoelectronic plate (301), the differential circuit layer (302) and the electrically controlled photoresist material (303) are arranged in a concentric circle array in the horizontal plane, with no less than 360 pixels, so as to achieve orientation perception with a resolution of 1°.

10. A sound source localization method, applied to a sound source localization sensor as described in any one of claims 1 to 9, characterized in that, The sound source localization method includes: The laser emitter (101) is activated to generate a collimated beam that is diverged by a concave lens (102) and converged by a convex lens (103), and the 360° annular beam in the horizontal plane is filtered out by an annular light shield (104). The annular beam is refracted by the first prism (105) and then shines perpendicularly onto the vibration measuring reflective film (106); when there is an impact-type sound source, the vibration measuring reflective film (106) in the direction of the sound source undergoes mechanical vibration, modulating the propagation direction of the reflected light; The modulated reflected light is refracted by the second prism (105) and then incident on the beam splitter (108), where it is divided into vertically transmitted light (110) and horizontally reflected light (111), which are then sent to the photoelectric vibration measurement section (2) and the photoresistance vibration measurement section (3), respectively. In the photoelectric vibration measurement section (2), the vertically transmitted light (110) is modulated by the gradient shading layer (201) and projected onto the fan-shaped photoelectric plate (202) to generate a directional voltage signal; the direction of the light spot offset is located by the voltage differential comparator (203), and the preliminary direction of the sound source is output by the electro-optic trajectory synthesizer (204); In the photoresist vibration measurement section (3), horizontal reflected light (111) irradiates the pixel photoelectric plate (301), and its output signal is processed by the differential circuit layer (302) to dynamically adjust the transmittance of the electronically controlled photoresist material (303); two sets of laser transceiver arrays penetrate the material, and the receiving end outputs an auxiliary verification signal according to the spatial change of light intensity; By combining the preliminary direction with the auxiliary verification signal, the location of the sound source in the 360° horizontal plane is finally determined.

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