Electric connection structure formed by flexible circuit board and flexible pressure sensing pad with same

Abstract

The invention discloses an electric connection structure formed by a flexible circuit board and a flexible pressure sensing pad with the electric connection structure, and relates to the technical field of automobile accessories. The electric connection structure is provided with an internal connection area and an external connection area, the electric connection structure comprises a conductive circuit layer, the conductive circuit layer comprises at least one circuit wire, and the two ends of the circuit wire are located in the internal connection area and the external connection area respectively; the conductive circuit layer comprises at least one first conductive sheet and a second conductive sheet matched with the first conductive sheet. The internal connection area is electrically connected with at least one conductor loop in the pad; the external connection area is connected with at least one conductor of the wire harness to form an electric connection relation. According to the electric connection structure, the internal connection area and the external connection area are separated, so that the problem of short circuit caused by clustering is avoided. The flexible circuit board is adopted as an electric connection structure, so that automatic production is facilitated, the process requirement is relatively low, the function integration level is conveniently increased, and additional parts are reduced.

Description

Technical Field

[0001] This invention relates to the field of automotive parts technology, and in particular to an electrical connection structure made of a flexible circuit board, a flexible pressure sensing pad, and a seat. Background Technology

[0002] With the development of technology, multi-point sensors have been widely used in the market. This has led to changes in the lead structure of sensors; due to the large number of sensing points, the number of sensing wires is also greater. Wiring is required between the internal sensing wires and the external wiring harness. The most common connection method is terminal connection, but direct soldering is also used.

[0003] When using terminal connections, the connection points between the sensor wire and the external wiring harness require soldering. This process is demanding, unsuitable for automated soldering, and bundling all connectors together before covering them with ring terminals can easily cause short circuits at the connection points. Direct soldering between the sensor wire and the external wiring harness results in insufficient durability and makes it difficult to withstand prolonged cyclic pressure. Therefore, there is room for improvement in the electrical connection structure. Summary of the Invention

[0004] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes an electrical connection structure composed of a flexible circuit board, which is both convenient for automated processing and ensures durability.

[0005] The present invention also aims to provide a flexible pressure sensing pad and seat having an electrical connection structure composed of the above-mentioned flexible circuit board.

[0006] According to an embodiment of the present invention, an electrical connection structure is formed by a flexible circuit board, wherein the electrical connection structure has spaced-apart internal connection areas and external connection areas. The electrical connection structure includes a conductive line layer, the conductive line layer including at least one circuit trace, the two ends of the circuit trace being located in the internal connection area and the external connection area, respectively; the conductive line layer includes at least one first conductive sheet and a second conductive sheet adapted thereto.

[0007] The inner connection area is electrically connected to at least one conductor loop in the pad through the first conductive sheet; the outer connection area is electrically connected to at least one conductor of the wire harness through the second conductive sheet.

[0008] The electrical connection structure constructed from a flexible circuit board according to embodiments of the present invention disperses the internal connection area and the external connection area, avoiding short circuit problems caused by clustering. Using a flexible circuit board as the electrical connection structure facilitates automated production, has relatively low process requirements, and also facilitates increased functional integration while reducing additional components.

[0009] In some embodiments, at least a portion of the electrical connection structure is the flexible circuit board.

[0010] The flexible circuit board includes a first flexible insulating layer and a second flexible insulating layer stacked together, and also includes a conductive line layer sandwiched between the two. At least one of the first flexible insulating layer and the second flexible insulating layer is provided with a first wiring hole located in the inner connection area and a second wiring hole located in the outer connection area; The circuit trace includes a first circuit trace with its two ends located at the first wiring hole and the second wiring hole, respectively. The end of the conductor circuit is located at the first wiring hole to connect to the first conductive sheet, and the end of the conductor is located at the second wiring hole to connect to the second conductive sheet.

[0011] In some embodiments, the circuit traces and the first and second conductive sheets at both ends are integrally formed metal sheets.

[0012] In some embodiments, there are multiple first wiring holes and multiple second wiring holes, and multiple circuit traces are arranged in a one-to-one correspondence with the second wiring holes.

[0013] In some embodiments, a plurality of the first wiring holes are evenly spaced in a row, and a plurality of the second wiring holes are evenly spaced in a row; The spacing between adjacent first wiring holes is greater than the spacing between adjacent second wiring holes.

[0014] In some specific embodiments, both the first wiring hole and the second wiring hole are located on the first flexible insulating layer; Alternatively, the first wiring hole is located on the first flexible insulating layer, and the second wiring hole is located on the second flexible insulating layer.

[0015] In some specific embodiments, the electrical connection structure further includes a functional module, which is electrically connected to the external connection area.

[0016] Specifically, the functional modules include at least one of the following: a storage module, a filtering module, a thermal balance module, and a humidity balance module.

[0017] In some embodiments, the conductor of the wire harness is an electric wire, and the end of the electric wire is connected to the external connection area to form an electrical connection. Alternatively, the electrical connection structure includes a first connector located in the external connection area, and the wire harness has a second connector at the connector end, the second connector being plugged into the first connector; Alternatively, the electrical connection structure includes a first connector located in the external connection area, wherein the conductor of the wire harness is a wire, and the end of the wire is connected to the first connector to form an electrical connection.

[0018] According to an embodiment of the present invention, an electrical connection structure is formed by a flexible circuit board, wherein the electrical connection structure is provided with an internal connection area and an external connection area spaced apart. The electrical connection structure includes a conductive line layer, the conductive line layer includes at least one circuit trace, and the two ends of the circuit trace are respectively located in the internal connection area and the external connection area; The conductive circuit layer includes at least one first conductive sheet and a second conductive sheet adapted thereto; The internal connection area is electrically connected to at least one conductor loop in the pad through the first conductive sheet; The electrical connection structure further includes a first connector disposed in the external connection area. The first connector is connected to the second conductive sheet, and the first connector is used to connect to at least one conductor of the wire harness to form an electrical connection.

[0019] In some embodiments, the electrical connection structure is provided with an internal connection area and an external connection area spaced apart; The electrical connection structure includes a conductive line layer, the conductive line layer includes at least one circuit trace, and the two ends of the circuit trace are respectively located in the internal connection area and the external connection area; The internal connection area is connected to at least one conductor loop in the pad to form an electrical connection; At least a portion of the electrical connection structure is the flexible circuit board, which includes a first flexible plate. The external connection area is located on the first flexible plate and is connected to the controller to form an electrical connection.

[0020] Specifically, the first flexible plate is a long strip, the external connection area is located at one end of the first flexible plate, and the end of the first flexible plate with the external connection area constitutes a connector for plugging into the controller.

[0021] Furthermore, the flexible circuit board includes a second flexible plate connected to the first flexible plate, and the inner connection area is located on the second flexible plate.

[0022] A flexible pressure sensing pad according to an embodiment of the present invention includes: two protective layers; at least one substrate layer sandwiched between the two protective layers; two sets of conductor circuits located between the two protective layers and disposed on the substrate layer; a pressure-sensitive layer sandwiched between the two sets of conductor circuits; an electrical connection structure for replacing terminals, the electrical connection structure disposed on the substrate layer, at least a portion of the electrical connection structure being an electrical connection structure formed by a flexible circuit board as described in the above embodiment, one end of each conductor circuit being connected to the inner connection area; and a wire harness located outside the protective layers, one end of the wire harness being a connector end extending between the two protective layers and connected to the outer connection area.

[0023] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0024] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a diagram showing the connection relationship between the electrical connection structure of some embodiments and the conductor circuit inside the pad and the wiring harness outside the pad; Figure 2 These are exploded views of the electrical connection structure, the conductor circuit inside the pad, and the wiring harness outside the pad in some embodiments; Figure 3 These are exploded and cross-sectional comparison diagrams of the electrical connection structures of some embodiments; Figure 4 These are exploded and cross-sectional comparison diagrams of the electrical connection structures of other embodiments; Figure 5 These are circuit schematics of electrical connection structures with functional modules in some embodiments; Figure 6 These are structural diagrams of the electrical connection structure with functional modules in some embodiments; Figure 7 These are structural diagrams of the electrical connection structure with functional modules in other embodiments; Figure 8 These are structural diagrams of electrical connection structures with functional modules in some embodiments; Figure 9 These are structural diagrams of the filtering modules in some embodiments; Figure 10 This is a front view of the flexible pressure sensing pad functional module in some embodiments; Figure 11 This is a front view of the flexible pressure sensing pad strip functional module in some other embodiments; Figure 12This is a front view of the flexible pressure sensing pad functional module in some embodiments; Figure 13 This is an exploded view of some embodiments of the electrical connection structure and wire harness connected via connector joints; Figure 14 These are structural diagrams of other embodiments where the electrical connection structure is connected to the wire harness; Figure 15 These are structural diagrams of some embodiments where the electrical connection structure is a rigid-flex PCB. Figure 16 These are structural diagrams of some embodiments of a flexible pressure sensing pad where the electrical connection structure consists of a separate flexible circuit board and a rigid circuit board. Figure 17 These are structural diagrams of some embodiments of the electrical connection structure when positioning holes are provided; Figure 18 This is an exploded view of the electrical connection structure of some embodiments connected on a flexible pressure sensing pad; Figure 19 This is an exploded view of a flexible pressure sensing pad according to some embodiments; Figure 20 This is an exploded view of a flexible pressure-sensing pad according to another embodiment; Figure 21 These are diagrams illustrating the connection methods of electrical connection structures and conductor loops 30 located on both sides of the substrate layer in some embodiments. Figure 22 This is a wiring structure diagram of a flexible pressure sensing pad in some embodiments, where the wiring harness and electrical connection structure are located on both sides of the substrate layer. Figure 23 This is a diagram of another wiring structure in a flexible pressure sensing pad according to some embodiments, where the wiring harness and electrical connection structure are located on both sides of the substrate layer. Figure 24 These are exploded views of the electrical connection structures and connections of the inner conductor circuit and the outer controller in some embodiments. Figure 25 yes Figure 24 The diagram shows the connection relationship between the electrical connection structure and the conductor circuit inside the pad and the wire harness outside the pad. Figure 26 This is a diagram showing the connection relationship between the flexible pressure sensing pad and the controller in some embodiments; Figure 27 These are structural diagrams of some embodiments of a seat arrangement with a flexible pressure-sensing pad.

[0025] Figure label: Seat 1000 Flexible pressure sensing pad 100 Protective layer 10 Substrate layer 20, first substrate layer 21, perforated hole 211, second substrate layer 22, first wire through hole 25, second wire through hole 26, mating hole 27. Conductor loop 30, sensor wire 31 Pressure-sensitive layer 40, pressure-sensitive sheet 44 Electrical connection structure 50, flexible circuit board 50a, first flexible plate 50a-1, second flexible plate 50a-2, rigid circuit board 50b, internal connection area Q1, external connection area Q2. First circuit board 51, second circuit board 52 Circuit trace 54, first circuit trace 541, second circuit trace 542, conductive sheet 55, first conductive sheet 551, second conductive sheet 552. Fixing hole 501, positioning hole 502, flexible insulating layer 503, first flexible insulating layer 503-1, second flexible insulating layer 503-2, conductive circuit layer 504, covering layer 505, first wiring hole 506, second wiring hole 507. Wire harness 60, connector 61, conductor 62 Functional module 70, storage module 71, filtering module 72, thermal balance module 73, humidity balance module 74. Wire 81, connector structure 82, first connector 821, second connector 822, snap fastener 83, adhesive layer 84, controller 85. Detailed Implementation

[0026] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0027] In the description of this invention, it should be understood that the terms "center," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, features defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0028] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0029] The electrical connection structure 50 formed by a flexible circuit board 50a according to an embodiment of the present invention is described below with reference to the accompanying drawings.

[0030] The electrical connection structure 50 formed by the flexible circuit board 50a according to an embodiment of the present invention is shown in reference to... Figure 1 and Figure 2 The electrical connection structure 50 is provided with an internal connection area Q1 and an external connection area Q2 spaced apart. The internal connection area Q1 is connected to at least one conductor loop 30 in the pad to form an electrical connection relationship, and the external connection area Q2 is connected to at least one conductor 62 of the wire harness 60 to form an electrical connection relationship.

[0031] In this application, the electrical connection structure 50 is used to connect different parts of the electrical device, equivalent to a terminal block in a traditional electrical device. The conductor loop 30 within the pad can be a signal processing and control loop; for example, if a sensor is installed within the pad, the electrical connection structure 50 is used to transmit the signal detected by the sensor within the pad to the wiring harness 60. Figure 2 The controller 85 shown. The conductor circuit 30 within the pad can be an energy transmission and power supply circuit, for example, the conductor circuit 30 is connected to a power device, or the conductor circuit 30 itself is a heating wire, and the electrical connection structure 50 is used to supply power to the power device within the pad through the wiring harness 60. The conductor circuit 30 within the pad can also be a protection and monitoring circuit, for example, an overcurrent protector is installed within the pad, and the electrical connection structure 50 is used to control the current flow of the wiring harness 60 according to the status of the overcurrent protector.

[0032] In this application, a flexible circuit board 50a is used as the electrical connection structure 50. The conductor circuit 30 inside the pad and the wire harness 60 outside the pad are flexibly connected, which can reduce the foreign object feeling at the connection point, ensure the durability of the connection point, enable the connection point to withstand long-term cyclic pressure, and extend its service life.

[0033] Furthermore, using flexible circuit board 50a for wiring is a more mature and automated process compared to traditional terminal connections, with relatively lower process requirements. Additionally, the electrical connection structure 50 can separate the internal connection area Q1 and the external connection area Q2, preventing short circuits caused by clustering, and also facilitating increased functional integration while reducing additional components.

[0034] In some embodiments, such as Figure 2 As shown, at least a portion of the electrical connection structure 50 is a flexible circuit board 50a. The flexible circuit board 50a includes a first flexible insulating layer 503-1 and a second flexible insulating layer 503-2 stacked together, and a conductive line layer 504 sandwiched between them. The conductive line layer 504 includes circuit traces 54, at least a portion of which connects the inner connection area Q1 and the outer connection area Q2, enabling the transmission of current or signals. The structure of the flexible circuit board 50a, namely the first flexible insulating layer 503-1, the second flexible insulating layer 503-2, and the circuit traces 54 sandwiched between them, provides flexibility and reduces the risk of breakage.

[0035] Specifically, the structure of the circuit trace 54 sandwiched between the first flexible insulating layer 503-1 and the second flexible insulating layer 503-2 allows for free bending, folding, and twisting along with the carrier, enabling it to conform to complex curved surfaces or narrow gaps within the equipment. The coverage of the two flexible insulating layers 503 exhibits excellent flexibility and fatigue resistance; when the circuit trace 54 in the bending area is laid parallel to the bending direction, it can withstand tens of thousands of bends without breaking. The line width and spacing of the circuit trace 54 can be precisely controlled, enabling high-density wiring and meeting the impedance matching requirements for high-speed signal transmission.

[0036] In some specific embodiments, such as Figure 2 As shown, at least one of the first flexible insulating layer 503-1 and the second flexible insulating layer 503-2 has a first wiring hole 506 located in the inner connection area Q1 and a second wiring hole 507 located in the outer connection area Q2. The circuit trace 54 includes a first circuit trace 541 with its two ends located in the first wiring hole 506 and the second wiring hole 507, respectively. The end of the conductor loop 30 is located in the first wiring hole 506 to connect to the circuit trace 54, and the end of the conductor 62 is located in the second wiring hole 507 to connect to the circuit trace 54.

[0037] In other words, a first wiring hole 506 or a second wiring hole 507 can be provided on any flexible insulating layer 503. The position of the hole serves as the receiving position for the connection, which facilitates positioning and improves the protection of the connection structure. For example, the end of the conductor circuit 30 is welded to the circuit trace 54, and the solder joint is located in the first wiring hole 506. On the one hand, the first wiring hole 506 serves as a positioning hole to facilitate positioning and automated welding. On the other hand, the first wiring hole 506 can protect the solder joint at this location and prevent the solder joint from wearing down and causing an open circuit.

[0038] In some specific embodiments, the positions of the first wiring hole 506 and the second wiring hole 507 can be flexibly selected as needed.

[0039] Reference Figure 3Alternatively, only the first flexible insulating layer 503-1 has a first wiring hole 506 located in the inner connection area Q1 and a second wiring hole 507 located in the outer connection area Q2, and the second flexible insulating layer 503-2 is a non-porous layer.

[0040] Alternatively, the first flexible insulating layer 503-1 may be provided with a first wiring hole 506 located in the inner connection area Q1 and a second wiring hole 507 located in the outer connection area Q2, and the second flexible insulating layer 503-2 may also be provided with a first wiring hole 506 located in the inner connection area Q1 and a second wiring hole 507 located in the outer connection area Q2.

[0041] Or refer to Figure 4 The first flexible insulating layer 503-1 is provided with a first wiring hole 506 located in the inner connection area Q1, and the second flexible insulating layer 503-2 is provided with a second wiring hole 507 located in the outer connection area Q2.

[0042] Alternatively, the first flexible insulating layer 503-1 may have a first wiring hole 506 located in the inner connection area Q1 and a second wiring hole 507 located in the outer connection area Q2, while the second flexible insulating layer 503-2 may have only a second wiring hole 507 located in the outer connection area Q2, or the second flexible insulating layer 503-2 may have only a first wiring hole 506 located in the inner connection area Q1.

[0043] Alternatively, the second flexible insulating layer 503-2 may have a first wiring hole 506 located in the inner connection area Q1 and a second wiring hole 507 located in the outer connection area Q2, while the first flexible insulating layer 503-1 may only have a second wiring hole 507 located in the outer connection area Q2, or the first flexible insulating layer 503-1 may only have a first wiring hole 506 located in the inner connection area Q1.

[0044] This increases the variety of possible positions for the internal connection area Q1 and the external connection area Q2 on the flexible circuit board 50a.

[0045] Specifically, the conductive circuit layer 504 can be a wire layer composed of multiple circuit traces 54, for example in... Figure 2 In the conductive circuit layer 504, there are multiple independent first circuit traces 541. Alternatively, the conductive circuit layer 504 can be arranged by printing or etching, for example, multiple independent circuit traces 54 can be formed by printing on a conductive circuit board.

[0046] The circuit trace 54 can be bonded or pressed between the first flexible insulating layer 503-1 and the second flexible insulating layer 503-2. For example, the first flexible insulating layer 503-1 and the second flexible insulating layer 503-2 can be bonded together, with the circuit trace 54 sandwiched between the first flexible insulating layer 503-1 and the second flexible insulating layer 503-2. Alternatively, the circuit trace 54 can be bonded or pressed only onto the first flexible insulating layer 503-1, and then the second flexible insulating layer 503-2 can be bonded or pressed onto the first flexible insulating layer 503-1.

[0047] In some embodiments, such as Figures 2-4 As shown, the flexible circuit board 50a includes a first flexible insulating layer 503-1 and a second flexible insulating layer 503-2 stacked together, and a conductive line layer 504 sandwiched between the two. The conductive line layer 504 includes circuit traces 54, at least a portion of which connects between the inner connection area Q1 and the outer connection area Q2. The conductive line layer 504 also includes a conductive sheet 55 connected to at least one end of the circuit traces 54, thereby increasing the connection area at the connection point between the circuit traces 54 and the conductor loop 30 or the outer conductor 62, improving connection reliability, and reducing the risk of open circuit.

[0048] The conductive circuit layer 504 includes at least one circuit trace 54, at least one first conductive piece 551, and a matching second conductive piece 552. The first conductive piece 551 is located in the inner connection area Q1 to connect with at least one conductor loop 30 within the pad. The second conductive piece 552 is located in the outer connection area Q2 to connect with at least one conductor 62 of the wire harness 60 to form an electrical connection. The conductive pieces 55 at both ends of the circuit trace 54 provide double protection for the continuity of the circuit trace 54.

[0049] Optionally, the circuit trace 54 and the first conductive sheet 551 and the second conductive sheet 552 at both ends are integrally formed metal sheets, which facilitates cutting and forming and reduces processing steps. Of course, the solution of this application is not limited to this. In some solutions, the circuit trace 54 and the conductive sheet 55 at the end are connected by welding.

[0050] Optionally, at least one of the first conductive sheet 551 and the second conductive sheet 552 may be a solder pad. For example, the first conductive sheet 551 may be soldered to the end of the conductor loop 30 within the pad, or the second conductive sheet 552 may be soldered to the conductor 62 of the wire harness 60. The soldering reliability is high, and the durability is strong. The solder pad can be soldered on one side or both sides.

[0051] In some specific embodiments, such as Figure 2As shown, there are multiple first wiring holes 506 and multiple second wiring holes 507, and multiple circuit traces 54 are arranged in a one-to-one correspondence with the second wiring holes 507. In this way, the circuit traces 54 are connected one-to-one with the multiple conductors 62 of the wire harness 60, realizing independent signal transmission or independent power supply control.

[0052] Specifically, multiple first wiring holes 506 are evenly spaced in a row, and multiple second wiring holes 507 are evenly spaced in a row. This arrangement facilitates control of the wiring point positions during automated wiring and reduces the risk of short circuits.

[0053] Specifically, the spacing between adjacent first wiring holes 506 is greater than the spacing between adjacent second wiring holes 507. This is understandable because the second wiring holes 507 are connected to conductors 62 of the wire harness 60, and the conductors 62 ultimately converge to form the wire harness 60. Therefore, setting the spacing between the second wiring holes 507 is smaller facilitates the concentration of the wires. Conversely, setting the spacing between the first wiring holes 506 is larger helps improve the accuracy of wiring to the conductor loop 30 within the pad.

[0054] In some specific embodiments, reference is made to Figure 4 At least a portion of the electrical connection structure 50 is a flexible circuit board 50a. The flexible circuit board 50a includes a first flexible insulating layer 503-1 and a second flexible insulating layer 503-2 stacked together, and a conductive wiring layer 504 sandwiched between the two. The conductive wiring layer 504 includes circuit traces 54. At least one side of the electrical connection structure 50 is provided with a cover layer 505, such as... Figure 4 In this structure, a cover layer 505 can be provided on both sides of the first flexible insulating layer 503-1 and the second flexible insulating layer 503-2 to improve the sealing of the electrical connection structure 50 and enhance the safety of the connection.

[0055] Specifically, when the conductor circuit 30 within the pad is connected to the electrical connection structure 50, the end of the conductor circuit 30 can extend between the first flexible insulating layer 503-1 and its outer cover layer 505, and then the end of the conductor circuit 30 is connected to the inner connection area Q1. The cover layer 505 provides coverage and protection for the end of the conductor circuit 30, reducing wear at the connection point.

[0056] Of course, the protective structure of the electrical connection structure 50 is not limited to the cover layer 505. It can also be that at least one side of the electrical connection structure 50 is provided with a reinforcing plate. The reinforcing plate can adopt a reinforcing plate structure known in the prior art to improve the strength.

[0057] Alternatively, at least one side of the electrical connection structure 50 may have a conformal coating. The conformal coating may be formed by spraying, dipping, brushing, or other methods, and then cured to form a uniform protective film. Optionally, the conformal coating may be made of at least one of acrylic resin, polyurethane, epoxy resin, or silicone resin.

[0058] Alternatively, the conformal coating can be a common conformal coating in the field, providing moisture-proof, mildew-proof, and salt spray-proof protection, while also offering dust-proof, corrosion-proof, leakage-proof, and aging-slowing functions, significantly improving the reliability and service life of the electrical connection structure 50 in harsh environments.

[0059] In some specific embodiments, such as Figure 1 and Figure 5 As shown, the electrical connection structure 50 has a spaced-out internal connection area Q1 and an external connection area Q2. The internal connection area Q1 is connected to the inner conductor loop 30 to form an electrical connection, and the external connection area Q2 is connected to the conductor 62 of the wire harness 60 to form an electrical connection. The electrical connection structure 50 also includes a functional module 70, which is electrically connected to the external connection area Q2. In this way, the functionality of the electrical connection structure 50 can be expanded to meet the needs of functional integration such as removing the influence of temperature, detecting water ingress, and storing information.

[0060] Specifically, functional module 70 can be one or at least two. Specifically, functional module 70 includes at least one of the following: storage module 71, filtering module 72, thermal balance module 73, and humidity balance module 74. Of course, other modules, such as circuit protection modules like fuses, can be selected for functional module 70 as needed.

[0061] Optionally, such as Figures 6-8 As shown, functional module 70 includes a storage module 71, which can store preset programs or cached data. For example, data from the flexible pressure sensing pad 100 can be temporarily cached.

[0062] Optionally, such as Figures 6-8 As shown, functional module 70 includes a thermal balance module 73, which contains a thermistor for transmitting temperature signals to balance the effects of temperature. For example, it can balance the effect of temperature on the pressure-sensitive layer 40 of the flexible pressure sensing pad 100.

[0063] Optionally, such as Figure 7 As shown, functional module 70 includes a humidity balancing module 74, which contains a humidity-sensitive resistor for transmitting humidity signals to balance the effects of humidity. For example, it can balance the effect of humidity on the pressure-sensitive layer 40 of the flexible pressure sensing pad 100. Further optionally, when functional module 70 includes the humidity balancing module 74, and the humidity balancing module 74 is disposed on the flexible circuit board 50a, the flexible circuit board 50a has a hole at the location of the humidity-sensitive resistor for sensing. Correspondingly, as described below, the flexible pressure sensing pad 100 is provided with the humidity balancing module 74, and the flexible pressure sensing pad 100 has a hole at the location of the humidity-sensitive resistor for sensing.

[0064] Optionally, the functional module 70 includes a filtering module 72, which includes, but is not limited to, capacitor filtering, RC / LC filtering, active filtering, ceramic / crystal filtering, EMI filtering, etc.

[0065] In some specific embodiments, such as Figure 1 As shown, at least a portion of the electrical connection structure 50 is a flexible circuit board 50a. The flexible circuit board 50a includes a first flexible insulating layer 503-1 and a second flexible insulating layer 503-2 stacked together, and a conductive line layer 504 sandwiched between them. The conductive line layer 504 includes circuit traces 54, at least a portion of which connects the inner connection area Q1 and the outer connection area Q2 to achieve current or signal transmission. A functional module 70 is sandwiched between the first flexible insulating layer 503-1 and the second flexible insulating layer 503-2, such as... Figures 6-8 As shown, the functional module 70 is mounted on the flexible circuit board 50a. The circuit trace 54 also includes a second circuit trace 542, one end of which is connected to the functional module 70, and the other end is located in the external connection area Q2.

[0066] Specifically, the functional module 70 is mounted on the flexible circuit board 50a and is protected by the flexible circuit board 50a. Optionally, the functional module 70 can be fixed to the first flexible insulating layer 503-1 or the second flexible insulating layer 503-2 by means of welding, bonding, or pressing. The functional module 70 can be connected on one side (such as by welding or bonding) or on both sides.

[0067] In other specific embodiments, a functional module 70 is provided outside the first flexible insulating layer 503-1 and the second flexible insulating layer 503-2. The electrical connection structure 50 further includes a wire 81, one end of which is connected to the functional module 70, and the other end extends to the flexible circuit board 50a and connects to the inner connection area Q1. When the functional module 70 and the flexible circuit board 50a are separately disposed, the functional module 70 can be directly disposed on the carrier. For example, the flexible circuit board 50a can be fixed to the substrate layer 20 by adhesive bonding, snap-fit ​​fixing, or press-fit bonding, and the functional module 70 can also be fixed to the substrate layer 20 by adhesive bonding, snap-fit ​​fixing, or press-fit bonding. Figure 11 In the process, the flexible circuit board 50a is fixed to the substrate layer 20, which serves as a carrier, by the adhesive layer 84.

[0068] like Figure 10This diagram illustrates an electrical connection structure 50 applied to a flexible pressure sensing pad 100. The electrical connection structure 50 has spaced-apart internal connection areas Q1 and external connection areas Q2. The internal connection area Q1 is electrically connected to the conductor loop 30 of the flexible pressure sensing pad 100, and the external connection area Q2 is electrically connected to the conductor 62 of the wiring harness 60. The functional module 70 is a humidity balancing module 74, which is a separate structure from the flexible circuit board 50a. Figure 11 This illustrates another electrical connection structure 50 applied to a flexible pressure sensing pad 100. Figure 11 The electrical connection structure 50 and Figure 10 The electrical connection structures 50 are basically the same, except that the conductor circuits 30 are different in shape. Figure 12 This illustrates another electrical connection structure 50 applied to a flexible pressure sensing pad 100. Figure 12 The electrical connection structure 50 and Figure 10 The electrical connection structures 50 are basically the same, except that the conductor circuits 30 are different in shape.

[0069] In some embodiments, such as Figure 1 As shown, the electrical connection structure 50 has spaced-apart internal connection area Q1 and external connection area Q2. The internal connection area Q1 is connected to the inner conductor loop 30 to form an electrical connection, while the external connection area Q2 is connected to the conductor 62 of the wire harness 60 to form an electrical connection. The conductor 62 of the wire harness 60 is a wire, and the end of the wire is connected to the external connection area Q2 to form an electrical connection. In other words, each wire of the wire harness 60 can be directly and fixedly connected to the external connection area Q2 without the need for a structural adapter. This reduces the number of parts and improves compactness.

[0070] In other embodiments, such as Figure 13 As shown, the electrical connection structure 50 has a spaced-out internal connection area Q1 and an external connection area Q2. The internal connection area Q1 is connected to the inner conductor loop 30 to form an electrical connection, and the external connection area Q2 is connected to the conductor 62 of the wire harness 60 to form an electrical connection. The electrical connection structure 50 includes a first connector 821 located in the external connection area Q2, and a second connector 822 located at the connector plate end 61 of the wire harness 60. The second connector 822 is plugged into the first connector 821, and the first connector 821 and the second connector 822 are pluggable connector structures 82. In this way, the wire harness 60 is integrated into the second connector 822 at the connector plate end 61, and the pluggable connection of the first connector 821 and the second connector 822 can be easily disconnected when needed for convenient testing.

[0071] In some embodiments, such as Figure 14As shown, the electrical connection structure 50 has a spaced-out internal connection area Q1 and an external connection area Q2. The internal connection area Q1 is connected to the inner conductor loop 30 to form an electrical connection, and the external connection area Q2 is connected to the conductor 62 of the wire harness 60 to form an electrical connection. The electrical connection structure 50 includes a first connector 821 located in the external connection area Q2. The conductor 62 of the wire harness 60 is a wire, and the end of the wire is connected to the first connector 821 to form an electrical connection. That is, the wire harness 60 is integrated into the first connector 821 at the connector end 61. When it is necessary to connect the wire harness 60 to the electrical connection structure 50, the first connector 821 can be connected to the external connection area Q2. Although the first connector 821 cannot be arbitrarily plugged in or removed, the first connector 821 can protect the end of the wire harness 60 and reduce the risk of the wire end breaking when the wire harness 60 is under stress.

[0072] In some embodiments, such as Figure 1 As shown, the electrical connection structure 50 has a spaced-out internal connection area Q1 and an external connection area Q2. The internal connection area Q1 is connected to the inner conductor loop 30 to form an electrical connection, and the external connection area Q2 is connected to the conductor 62 of the wire harness 60 to form an electrical connection. The entire electrical connection structure 50 is a flexible circuit board 50a.

[0073] Optionally, the electrical connection structure 50 is a single unit, consisting entirely of a flexible circuit board 50a.

[0074] In other embodiments, such as Figure 15 As shown, the electrical connection structure 50 is a rigid-flex board, meaning that the electrical connection structure 50 is a one-piece structure, but part of the electrical connection structure 50 is a flexible circuit board 50a and part is a rigid circuit board 50b. This allows structures with relatively insufficient compressive strength to be placed on the rigid circuit board 50b.

[0075] Specifically, such as Figure 15 As shown, the electrical connection structure 50 has a spaced-apart internal connection area Q1 and external connection area Q2. The internal connection area Q1 is connected to the inner conductor loop 30 to form an electrical connection, and the external connection area Q2 is connected to the conductor 62 of the wire harness 60 to form an electrical connection. The internal connection area Q1 is disposed on the flexible circuit board 50a, and the external connection area Q2 is disposed on the rigid circuit board 50b.

[0076] In some embodiments, such as Figure 16 As shown, the electrical connection structure 50 includes a first circuit board 51 and a second circuit board 52, which are separate components. Optionally, at least one of the first circuit board 51 and the second circuit board 52 is fixed to the carrier by adhesive, snap-fit, or press-fit composite fixation. For example, both the first circuit board 51 and the second circuit board 52 are snap-fit ​​fixed to the substrate layer 20.

[0077] Both the first circuit board 51 and the second circuit board 52 are flexible circuit boards 50a. Alternatively, the electrical connection structure 50 includes a phase-separated flexible circuit board 50a and a rigid circuit board 50b. Figure 16 In the circuit, the electrical connection structure 50 has a spaced-out internal connection area Q1 and an external connection area Q2. The internal connection area Q1 is connected to the inner conductor loop 30 to form an electrical connection, and the external connection area Q2 is connected to the conductor 62 of the wire harness 60 to form an electrical connection. The flexible circuit board 50a has the internal connection area Q1 and the external connection area Q2, and the internal connection area Q1 and the external connection area Q2 on the flexible circuit board 50a are connected by a first circuit trace 541. The rigid circuit board 50b has a functional module 70 and an external connection area Q2, and the functional module 70 and the external connection area Q2 on the rigid circuit board 50b are connected by a second circuit trace 542.

[0078] In some embodiments, the electrical connection structure 50 is provided with a fixing hole 501 or a positioning hole 502 for fixing or positioning the connection to the carrier.

[0079] like Figure 17 and Figure 18 In some specific embodiments shown, a positioning hole 502 is provided on the flexible circuit board 50a, and a buckle 83 can pass through the positioning hole 502 to connect to the mating hole 27 of the substrate layer 20, which serves as a carrier, thereby achieving the positioning of the flexible circuit board 50a and the carrier.

[0080] For example, in some specific embodiments, such as Figures 6-8 As shown, a row of fixing holes 501 are provided on the flexible circuit board 50a. The flexible circuit board 50a is connected to the carrier at the fixing holes 501 to form a connecting line.

[0081] In some embodiments, such as Figures 24-26 As shown, the electrical connection structure 50 is provided with an internal connection area Q1 and an external connection area Q2 spaced apart. The internal connection area Q1 is connected to at least one conductor loop 30 in the pad to form an electrical connection relationship, and the external connection area Q2 is connected to an external electrical device to form an electrical connection relationship.

[0082] Specifically, the electrical connection structure 50 includes a conductive line layer 504, which includes at least one circuit trace 54, with the two ends of the circuit trace 54 located in the inner connection area Q1 and the outer connection area Q2, respectively.

[0083] Reference Figure 23 and Figure 24 At least a portion of the electrical connection structure 50 is a flexible circuit board 50a, which includes a first flexible sheet 50a-1. For example... Figure 26As shown, the external connection area Q2 is located in the first flexible plate 50a-1, and the external connection area Q2 is connected to the controller 85 to form an electrical connection relationship.

[0084] Therefore, this application uses a flexible circuit board 50a as the electrical connection structure 50, and flexibly connects the conductor circuit 30 inside the pad to the controller 85 outside the pad. This reduces the foreign object sensation at the wiring point, ensures the durability of the wiring point, and enables the wiring point to withstand long-term cyclic pressure, resulting in a longer service life. Moreover, the first flexible board 50a-1 extends out to directly connect to the controller 85, eliminating the need for a separate wiring harness 60, reducing wiring, and further improving reliability.

[0085] Specifically, such as Figure 26 As shown, the first flexible plate 50a-1 is a long strip. The external connection area Q2 is located at one end of the first flexible plate 50a-1. The end of the first flexible plate 50a-1 with the external connection area Q2 forms a connector for plugging into the controller 85. In this way, a part of the electrical connection structure 50 (i.e., the first flexible plate 50a-1) is directly used as the wiring harness 60, which facilitates the installation layout.

[0086] Furthermore, the flexible circuit board 50a includes a second flexible plate 50a-2 connected to the first flexible plate 50a-1, and the inner connection area Q1 is located on the second flexible plate 50a-2. In this way, the inner connection area Q1 and the outer connection area Q2 are located on the same flexible circuit board 50a, which also facilitates the overall processing.

[0087] Specifically, the flexible circuit board 50a includes a first flexible insulating layer 503-1 and a second flexible insulating layer 503-2 stacked together, and a conductive line layer 504 sandwiched between the two. The conductive line layer 504 includes circuit traces 54, at least a portion of which connects the inner connection area Q1 and the outer connection area Q2. A portion of the first flexible insulating layer 503-1, the second flexible insulating layer 503-2, and the conductive line layer 504 constitute the first flexible insulating layer 503-1, and a portion constitutes the second flexible board 50a-2.

[0088] In some specific embodiments, such as Figure 2 As shown, at least one of the first flexible insulating layer 503-1 and the second flexible insulating layer 503-2 has a first wiring hole 506 located in the inner connection area Q1. The circuit trace 54 includes a first circuit trace 541. The end of the conductor loop 30 is located at the first wiring hole 506 to connect to the circuit trace 54.

[0089] Optionally, the conductive line layer 504 includes at least one circuit trace 54, at least one first conductive piece 551, and a matching second conductive piece 552. The first conductive piece 551 is located in the inner connection area Q1 to connect with at least one conductor loop 30 within the pad. The second conductive piece 552 is located in the outer connection area Q2 to connect with the controller 85 to form an electrical connection. The placement of the conductive pieces 55 at both ends of the circuit trace 54 provides double protection for the conductivity of the circuit trace 54.

[0090] Furthermore, the electrical connection structure 50 also includes a functional module 70, which is electrically connected to the external connection area Q2. This expands the functionality of the electrical connection structure 50, meeting the needs for integrated functions such as temperature-induced interference removal, water ingress detection, and information storage. Specifically, the functional module 70 can be one or at least two. Specifically, the functional module 70 includes at least one of the following: a storage module 71, a filtering module 72, a thermal balancing module 73, and a humidity balancing module 74. Of course, other modules, such as circuit protection modules like fuses, can be selected for the functional module 70 as needed.

[0091] The flexible pressure sensing pad 100 according to an embodiment of the present invention is described below with reference to the accompanying drawings. The flexible pressure sensing pad 100 may employ an electrical connection structure 50 formed by the flexible circuit board 50a in any of the above embodiments, and the structure of the electrical connection structure 50 will not be described in detail below.

[0092] The flexible pressure sensing pad 100 according to an embodiment of the present invention, with reference to Figure 19 It includes: two protective layers 10 and at least one substrate layer 20, with the substrate layer 20 sandwiched between the two protective layers 10.

[0093] The flexible pressure sensing pad 100 also includes two sets of conductor circuits 30 and a pressure-sensitive layer 40. The two sets of conductor circuits 30 are located between two protective layers 10 and are disposed on the substrate layer 20. The pressure-sensitive layer 40 is sandwiched between the two sets of conductor circuits 30.

[0094] The flexible pressure sensing pad 100 also includes an electrical connection structure 50 for replacing terminals. The electrical connection structure 50 is disposed on the substrate layer 20. At least a portion of the electrical connection structure 50 is an electrical connection structure 50 formed by the flexible circuit board 50a of the above embodiment. One end of the conductor loop 30 is connected to the inner connection area Q1.

[0095] The flexible pressure sensing pad 100 also includes a wiring harness 60, which is located outside the protective layer 10. One end of the wiring harness 60 is a connector end 61, which extends between the two protective layers 10 and connects to the external connection area Q2. Specifically, the other end of the wiring harness 60 is a controller 85.

[0096] The flexible pressure sensing pad 100 is used for pressure detection. When pressure is detected, the flexible pressure sensing pad 100 outputs a corresponding electrical signal. When pressure is lost, the flexible pressure sensing pad 100 returns to its initial state.

[0097] This flexible pressure sensing pad 100 can be used in various pressure detection scenarios, such as seat occupancy detection on a vehicle seat 1000. When a passenger sits on the seat 1000, the pressure on the seat 1000 triggers the flexible pressure sensing pad 100 to generate an electrical signal, thus determining that the seat is occupied. If the seatbelt is not in use at this time, the vehicle issues a "fasten seatbelt" signal reminder. When the passenger leaves and the pressure is released, the signal of the flexible pressure sensing pad 100 resets, thus determining that the seat is empty. By detecting pressure changes on the seat 1000 using the flexible pressure sensing pad 100, real-time monitoring of the vehicle seat occupancy status can be achieved.

[0098] The core of the flexible pressure sensing pad 100 is to change the electrical characteristics of the pressure-sensitive layer 40 by applying external force. For example, it can change the electrical parameters of the pressure-sensitive layer 40 such as resistance, capacitance, and voltage to achieve pressure detection. Its structural design needs to take into account flexibility, sensitivity, and stability.

[0099] In this application, the main body of the flexible pressure sensing pad 100 adopts a multi-layer composite structure, including a protective layer 10, a substrate layer 20, a conductor circuit 30, and a pressure-sensitive layer 40. Among them, the substrate layer 20 supports the conductor circuit 30, the pressure-sensitive layer 40, and the electrical connection structure 50, providing flexibility and support, ensuring that the sensor can conform to curved surfaces such as the foam of a car seat 1000.

[0100] The pressure-sensitive layer 40 is the core component of the sensor. When external force is applied, the pressure-sensitive layer 40 will undergo physical deformation, which in turn causes changes in electrical parameters. This is the key to realizing pressure-to-electrical signal conversion.

[0101] The two sets of conductor circuits 30 are configured to connect the pressure-sensitive layer 40 to construct a pressure detection circuit, transmitting the electrical signal generated by the pressure-sensitive layer 40 to the electrical connection structure 50. Optionally, the conductor circuits 30 can be made of materials such as graphene electrodes, carbon paste electrodes, metal thin films, or conductive polymers, possessing good conductivity and flexibility.

[0102] The outermost two sides of the main body of the flexible pressure sensing pad 100 are protective layers 10, which serve as insulation, protection, and encapsulation. The protective layers 10 are made of a material with good flexibility and elasticity, which can deform under small pressure and return to its initial state after the pressure is removed.

[0103] One end of the wire harness 60 is a connector end 61, located outside the main body of the flexible pressure sensing pad 100, and is used to output electrical signals. In this application, the terminal connection between the wire harness 60 and the conductor circuit 30 is replaced by an electrical connection structure 50. In particular, at least a portion of the electrical connection structure 50 is a flexible circuit board 50a. The flexible connection at the wiring point can reduce the foreign object sensation at the wiring point, ensure the durability of the wiring point, enable the wiring point to withstand long-term cyclic pressure, and extend its service life.

[0104] In this application, the structure of the conductor circuit 30 is not limited. Conductive yarn, conductive metal cloth, and metal foil can typically be used. Therefore, the conductor circuit 30 is connected to the electrical connection structure 50 via a wiring method that is easier to mechanize and more reliable than a terminal crimping method.

[0105] For example, conductor circuit 30 can be a metal wire such as copper or aluminum wire; it can also be a conductive layer formed by printing, such as a printed silver layer, a printed carbon layer, or a conductive ink layer. In addition, conductive fabrics, metal films, or composite conductive adhesives can also be used.

[0106] In some embodiments, the flexible pressure sensing pad 100 uses multiple sensing points to form a pressure sensing array, which can realize multi-point pressure distribution detection, such as the seat cushion and backrest zone monitoring of the seat 1000. Each sensing point outputs a signal independently to accurately capture pressure changes.

[0107] Specifically, when using multi-point pressure distribution detection, the conductor circuit 30 employs a wire structure, which saves more material. The shape of the wire distribution on each layer of conductor circuit 30 is not limited.

[0108] In some specific embodiments, such as Figure 19 As shown, the electrical connection structure 50 and the two sets of conductor circuits 30 are located on the same side of the substrate layer 20. This simplifies the number of layers in the flexible pressure sensing pad 100 and reduces its thickness.

[0109] Specifically, the electrical connection structure 50 and the two sets of conductor loops 30 are located on the same side of the substrate layer 20. All conductor loops 30 adopt a linear structure and are separated from each other, and are only connected in the pressure-sensitive layer 40. Different conductor loops 30 can even overlap at the pressure-sensitive layer 40 to achieve a path.

[0110] In other specific embodiments, such as Figure 19 As shown, the electrical connection structure 50 and at least one conductor loop 30 are located on opposite sides of the same substrate layer 20, which allows the substrate layer 20 to be used for insulation and isolation, reducing the risk of short circuits.

[0111] In some alternative embodiments, such as Figure 21As shown, the electrical connection structure 50 and at least one conductor loop 30 are located on opposite sides of the same substrate layer 20, which has a first through-hole 25 for the end of the conductor loop 30 to pass through. In this way, the electrical connection structure 50 can be fixed on the substrate layer 20, and the end of the conductor loop 30 does not need to bypass the substrate layer 20, avoiding the wire from protruding from the flexible pressure sensing pad 100 and becoming exposed due to winding.

[0112] In some specific embodiments, such as Figure 19 As shown, the conductors 62 of the electrical connection structure 50 and the wire harness 60 are located on the same side of the substrate layer 20. This avoids wire entanglement.

[0113] In other specific embodiments, such as Figure 22 and Figure 23 As shown, the electrical connection structure 50 and the wire harness 60 are located on opposite sides of the same substrate layer 20, which has a second through-hole 26 for the connector end 61 of the wire harness 60 to pass through. The connector end 61 does not need to bypass the substrate layer 20, avoiding wire wrapping that would cause the connector end 61 to protrude from the flexible pressure sensing pad 100 and become exposed.

[0114] In some embodiments, such as Figure 19 As shown, the substrate layer 20 includes a first substrate layer 21. Two sets of conductor loops 30 are located on the same side of the first substrate layer 21 and are spaced apart. This saves on the number of layers and reduces the thickness.

[0115] In other embodiments, such as Figure 20 As shown, the substrate layer 20 includes a first substrate layer 21. Two sets of conductor circuits 30 are located on both sides of the first substrate layer 21. The first substrate layer 21 has perforations 211, and the varistor layer 40 is located at the perforations 211. This helps to separate the two sets of conductor circuits 30 with the help of the first substrate layer 21, thereby improving the insulation protection.

[0116] Optionally, the two conductor loops 30 are located on both sides of the first substrate layer 21, and the varistor layer 40 is a single layer and is disposed on one side of the first substrate layer 21. Or as... Figure 20 As shown, the pressure-sensitive layer 40 is a double layer and is disposed on both sides of the first substrate layer 21. In this way, the pressure-sensitive layer 40 is located on both sides of the first substrate layer 21 to sense pressure deformation, thereby further improving the pressure detection accuracy.

[0117] In some specific embodiments, such as Figure 20 As shown, there are multiple perforations 211, and each pressure-sensitive layer 40 includes multiple pressure-sensitive sheets 44 corresponding to the multiple perforations 211. This ensures the overall toughness of the first substrate layer 21 and reduces the risk of breakage.

[0118] In some specific embodiments, such as Figure 20As shown, the substrate layer 20 includes at least one second substrate layer 22, which is disposed on at least one side of the first substrate layer 21. This improves the reliability of protection for the pressure-sensitive layer 40 and the conductor circuit 30.

[0119] In some embodiments, the flexible pressure sensing pad 100 employs a multi-point pressure sensing structure.

[0120] For example in Figure 19 and Figure 20 In this embodiment, the flexible pressure sensing pad 100 has nine sensing points arranged in three rows and three columns on its main body. The pressure-sensitive layer 40 includes nine pressure-sensitive sheets 44, distributed on the nine sensing points. Each set of conductor loops 30 includes three sensing lines 31, with the three sensing lines 31 in the same layer spaced apart to avoid short circuits. Each sensing line 31 of one set of conductor loops 30 passes through a row of three sensing points, and each sensing line 31 of another set of conductor loops 30 passes through a column of three sensing points, so that two sets of conductor loops 30 pass through each sensing point and are connected to both sides of the pressure-sensitive layer 40. At each sensing point, the sensing line 31 forms a ring to increase the contact area with the pressure-sensitive layer 40 and improve connection reliability.

[0121] The seat 1000 according to an embodiment of the present invention is provided with the flexible pressure sensing pad 100 of the above embodiments. The flexible pressure sensing pad 100 includes the structure of the flexible pressure sensing pad 100 in any of the above embodiments, and the specific structure of the flexible pressure sensing pad 100 will not be described in detail below.

[0122] specifically refer to Figure 27 The Seat 1000 is equipped with a flexible pressure-sensing pad 100, which can accurately adapt to the curved shape of the Seat 1000 and the dynamic sitting posture changes of the driver and passengers, and has significant advantages in terms of comfort, safety and intelligence.

[0123] The flexible pressure sensing pad 100 is made of soft and flexible material, which can perfectly conform to the curved contours of the car seat 1000 without compromising the comfort of the seat 1000. At the same time, it can realize multi-point distributed pressure acquisition, accurately capturing the pressure distribution in different areas of the seat 1000, such as the pressure values ​​at the front and rear of the seat cushion and the sides of the backrest, providing high-precision data support for subsequent function optimization.

[0124] It can accurately determine whether the seat is occupied or whether heavy objects are placed on it, avoiding the problem of traditional gravity sensors misinterpreting the situation, such as triggering seat belt reminders when a backpack is placed on the seat.

[0125] The use of seat 1000 is complex, requiring it to withstand long-term sitting pressure, friction, and changes in temperature and humidity. The flexible pressure sensing pad 100 is typically made of wear-resistant and anti-aging flexible materials such as polyimide and conductive rubber, exhibiting good fatigue resistance. The flexible pressure sensing pad 100 is thin and lightweight, allowing it to be directly embedded in the seat 1000's foam layer or sewn into the seat 1000's fabric without requiring significant modifications to the seat 1000's structure, thus having minimal impact on the overall vehicle's lightweight design.

[0126] Other components of the seat 1000 according to embodiments of the present invention, such as heat dissipation devices, are known in their structure and principle to those skilled in the art and will not be described in detail here.

[0127] Optionally, the pressure-flexible pressure-sensing pad 100 can be disposed inside the foam of the seat cushion, or in the contact layer between the seat cushion and the frame of the seat 1000.

[0128] The seat 1000 according to an embodiment of the present invention may include a heating pad, on which the electrical connection structure 50 described in the above embodiment is disposed.

[0129] The conductor circuit 30 of the heating pad is a heating wire. The conductor circuit 30 is connected to the inner connection area Q1 of the electrical connection structure 50, and the conductor 62 of the wire harness 60 is connected to the outer connection area Q2 of the electrical connection structure 50. A controller 85 is installed on the heating pad, and multiple temperature sensors are provided to form multi-point temperature detection.

[0130] In some specific embodiments, the controller 85 of the heating pad is a PID controller, and the first type of algorithm used is a multi-sensor fusion PID + temperature gradient prediction control algorithm.

[0131] This algorithm is based on real-time sampling of temperature data from multiple sensors. It eliminates interference through fusion filtering and combines temperature gradient prediction to achieve proactive control, thereby improving temperature response sensitivity and steady-state control accuracy.

[0132] Specifically, the first type of algorithm can employ a multi-sensor data fusion model. This involves assuming the heating pad is deployed... One temperature sensor ( ), No. Each sensor at time The sampled value The merged data for: .

[0133] Among them, the weighting coefficient Dynamic adjustment: .

[0134] For the first Real-time variance of each sensor (calculated using a sliding window): .

[0135] ( (Length of the sliding window, ranging from 5 to 8). To avoid the denominator being 0.

[0136] Alternatively, the first type of algorithm can employ a temperature gradient prediction model. This model calculates the forward difference gradient based on fused data. : .

[0137] The sampling period is 0.1~0.3s, and the prediction is... After a certain time ( ) temperature :

[0138] This is the gradient correction coefficient, used to suppress prediction overshoot.

[0139] Alternatively, the first type of algorithm can employ a PID integrated predictive correction control law. Specifically, the control target is Tref (user-set temperature), and the PID output... : .

[0140] Predicted correction term : .

[0141] Total control output (heating power duty cycle, 0~1): .

[0142] This is a saturation function, which limits the output range.

[0143] The definitions of the parameters involved in the first type of algorithm model mentioned above are as follows:

[0144] Employing the first type of algorithm, multi-sensor weighted fusion reduces single-point interference and improves sampling accuracy by 30%. Furthermore, gradient prediction enables proactive control, reducing response latency from 0.8s to within 0.2s. The combination of PID control and predictive correction achieves a steady-state error ≤ ±0.3℃.

[0145] In some specific embodiments, the controller 85 of the heating pad adopts a second type of algorithm, which is an adaptive fuzzy-PID temperature closed-loop control algorithm.

[0146] Its core objective is to dynamically adjust PID parameters through fuzzy logic to adapt to changes in heating characteristics under different ambient temperatures and seat materials, thereby achieving sensitive control and precise temperature control under all operating conditions.

[0147] Specifically, the second type of algorithm can use fuzzy input and membership function.

[0148] Two fuzzy input quantities are defined: Temperature error (Domain of discourse: [-5℃, 5℃], fuzzy subsets: NB, NM, NS, ZO, PS, PM, PB); Error change rate (Domain of discourse: [-2℃ / s, 2℃ / s], fuzzy subsets: NB, NM, NS, ZO, PS, PM, PB).

[0149] The membership function adopts Gaussian form: .

[0150] in For the center of the fuzzy subset, Width (e.g., NB center = -5), ZO center = 0 ).

[0151] Alternatively, the second type of algorithm can use fuzzy rules and parameter adjustment models.

[0152] Fuzzy rule base (7×7=49 rules in total), core rule example: like and ,but ; like and ,but ; like and ,but ; Parameter adjustment formula ( (Initial PID parameters): ; ; ;

[0153] For fuzzy inference output (defuzzing using the centroid method): For the first The trigger strength of the rule, This is the parameter increment for the rule output.

[0154] Alternatively, the second type of algorithm can use a variable integral PID control law. To avoid integral saturation, an integral separation coefficient is introduced. : .

[0155] The output is controlled by the integral separation threshold. .

[0156] The definitions of the parameters involved in the second type of algorithm model mentioned above are as follows:

[0157] The second type of algorithm is adopted, and the fuzzy logic dynamically adapts the PID parameters, ensuring stable control accuracy within the ambient temperature range of -10~30℃. Integral separation suppresses overshoot, and there is no overshoot during the heating process, with a steady-state error of ≤±0.2℃. It is not sensitive to small fluctuations in the sensor, and the response speed is improved by 25%.

[0158] In some specific embodiments, the controller 85 of the heating pad employs a third type of algorithm, namely a Kalman filter-based model predictive control (MPC) algorithm.

[0159] Its core objective is to achieve noise-robust temperature estimation through Kalman filtering, perform multi-step prediction and rolling optimization based on the dynamic model of the heating system, balance response speed and control accuracy, and adapt to high-frequency sampling scenarios of sensors.

[0160] Specifically, the third type of algorithm can employ a system dynamic model.

[0161] Discrete state equations of the heating system (state) Output ): ; .

[0162] in: ( (where the system time constant is...) ( (The full-power heating temperature rise rate is taken as 4~6℃ / s). (The output is directly the temperature); Process noise (Gaussian white noise, variance) ); Measurement noise (Gaussian white noise, variance) ).

[0163] Specifically, the third type of algorithm can also use Kalman filtering for estimation.

[0164] Prediction step: ; .

[0165] Update steps: , ; .

[0166] For a moment The optimal temperature estimate, To estimate the covariance.

[0167] Specifically, the third type of algorithm can also employ MPC rolling optimization.

[0168] Prediction Time Domain Control time domain Optimize the objective function: .

[0169] Constraints: , .

[0170] in (The further the prediction step, the smaller the weight). (Inhibition control quantity mutation).

[0171] The optimal control sequence is obtained by solving a quadratic programming problem. Only execute the current step. The next moment, it will be optimized again.

[0172] The definitions of the parameters involved in the third type of algorithm model mentioned above are as follows:

[0173] The third type of algorithm is adopted, and Kalman filtering suppresses sensor noise, with an estimation accuracy 40% higher than that of direct sampling. MPC multi-step prediction avoids local optima, and the heating speed is fast and there is no overshoot. The steady-state error is ≤ ±0.1℃, the control sensitivity is the highest, and it can be adapted to high-frequency sampling above 100Hz.

[0174] Comparison and summary of three algorithms

[0175] All algorithms are adapted to hardware-level parameters (such as sampling period and number of sensors) and can be directly ported to the heating pad control circuit board (MCU main frequency ≥ 8MHz can run), realizing closed-loop optimization of "sensing-computation-control".

[0176] In the description of this specification, references to terms such as "embodiment," "example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0177] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. An electrical connection structure made of a flexible circuit board, characterized in that, The electrical connection structure (50) is provided with an internal connection area (Q1) and an external connection area (Q2) spaced apart. The electrical connection structure (50) includes a conductive line layer (504), the conductive line layer (504) includes at least one circuit trace (54), and the two ends of the circuit trace (54) are located in the inner connection area (Q1) and the outer connection area (Q2), respectively. The conductive circuit layer (504) includes at least one first conductive sheet (551) and a second conductive sheet (552) adapted thereto. The inner connection area (Q1) is electrically connected to at least one conductor circuit (30) in the pad through the first conductive sheet (551); The external connection area (Q2) is electrically connected to at least one conductor (62) of the wire harness (60) through the second conductive sheet (552).

2. The electrical connection structure formed by the flexible circuit board according to claim 1, characterized in that, At least a portion of the electrical connection structure (50) is the flexible circuit board (50a). The flexible circuit board (50a) includes a first flexible insulating layer (503-1) and a second flexible insulating layer (503-2) stacked together, with the conductive circuit layer (504) sandwiched between the two. At least one of the first flexible insulating layer (503-1) and the second flexible insulating layer (503-2) is provided with a first wiring hole (506) located in the inner connection area (Q1) and a second wiring hole (507) located in the outer connection area (Q2). The circuit trace (54) includes a first circuit trace (541) with its two ends located at the first wiring hole (506) and the second wiring hole (507) respectively. The end of the conductor circuit (30) is located at the first wiring hole (506) to connect to the first conductive piece (551), and the end of the conductor (62) is located at the second wiring hole (507) to connect to the second conductive piece (552).

3. The electrical connection structure formed by the flexible circuit board according to claim 1, characterized in that, The circuit trace (54) and the first conductive sheet (551) and the second conductive sheet (552) at both ends are integrally formed metal sheets.

4. The electrical connection structure formed by the flexible circuit board according to claim 2, characterized in that, There are multiple first wiring holes (506) and multiple second wiring holes (507), and multiple circuit traces (54) are arranged in a one-to-one correspondence with the second wiring holes (507).

5. The electrical connection structure formed by the flexible circuit board according to claim 3, characterized in that, A plurality of first wiring holes (506) are evenly spaced in a row, and a plurality of second wiring holes (507) are evenly spaced in a row; The spacing between adjacent first wiring holes (506) is greater than the spacing between adjacent second wiring holes (507).

6. The electrical connection structure formed by the flexible circuit board according to claim 1, characterized in that, Also includes: Functional module (70), which is electrically connected to the external connection area (Q2).

7. The electrical connection structure formed by the flexible circuit board according to claim 6, characterized in that, The functional module (70) includes at least one of the following: storage module (71), filtering module (72), thermal balance module (73), and humidity balance module (74).

8. The electrical connection structure formed by the flexible circuit board according to any one of claims 1-7, characterized in that, The conductor (62) of the wire harness (60) is an electric wire, and the end of the electric wire is connected to the external connection area (Q2) to form an electrical connection. Alternatively, the electrical connection structure (50) includes a first connector (821) provided in the external connection area (Q2), and the wire harness (60) has a second connector (822) at the connector end (61), the second connector (822) being plugged into the first connector (821); Alternatively, the electrical connection structure (50) includes a first connector (821) located in the external connection area (Q2), wherein the conductor (62) of the wire harness (60) is a wire, and the end of the wire is connected to the first connector (821) to form an electrical connection.

9. An electrical connection structure made of a flexible circuit board, characterized in that, The electrical connection structure (50) is provided with an internal connection area (Q1) and an external connection area (Q2) spaced apart. The electrical connection structure (50) includes a conductive line layer (504), the conductive line layer (504) includes at least one circuit trace (54), and the two ends of the circuit trace (54) are located in the inner connection area (Q1) and the outer connection area (Q2), respectively. The conductive circuit layer (504) includes at least one first conductive sheet (551) and a second conductive sheet (552) adapted thereto. The inner connection area (Q1) is electrically connected to at least one conductor circuit (30) in the pad through the first conductive sheet (551); The electrical connection structure (50) further includes a first connector (821) disposed in the external connection area (Q2), the first connector (821) being connected to the second conductive sheet (552), and the first connector (821) being used to connect to at least one conductor (62) of the wire harness (60) to form an electrical connection relationship.

10. An electrical connection structure made of a flexible circuit board, characterized in that, The electrical connection structure (50) is provided with an internal connection area (Q1) and an external connection area (Q2) spaced apart. The electrical connection structure (50) includes a conductive line layer (504), the conductive line layer (504) includes at least one circuit trace (54), and the two ends of the circuit trace (54) are located in the inner connection area (Q1) and the outer connection area (Q2), respectively. The inner connection area (Q1) is connected to at least one conductor loop (30) in the pad to form an electrical connection; At least a portion of the electrical connection structure (50) is the flexible circuit board (50a), the flexible circuit board (50a) includes a first flexible plate (50a-1), the external connection area (Q2) is located on the first flexible plate (50a-1), and the external connection area (Q2) is connected to the controller (85) to form an electrical connection relationship.

11. The electrical connection structure formed by the flexible circuit board according to claim 10, characterized in that, The first flexible plate (50a-1) is a long strip-shaped sheet. The external connection area (Q2) is located at one end of the first flexible plate (50a-1). The end of the first flexible plate (50a-1) with the external connection area (Q2) forms a connector for plugging into the controller (85).

12. The electrical connection structure formed by the flexible circuit board according to claim 10, characterized in that, The flexible circuit board (50a) includes a second flexible plate (50a-2) connected to the first flexible plate (50a-1), and the inner connection area (Q1) is located on the second flexible plate (50a-2).

13. A flexible pressure sensing pad (100), characterized in that, include: Two protective layers (10); At least one substrate layer (20) sandwiched between two protective layers (10); Two sets of conductor circuits (30) are located between the two protective layers (10) and disposed on the substrate layer (20); A pressure-sensitive layer (40) is sandwiched between the two sets of conductor circuits (30); An electrical connection structure (50) for replacing terminals is provided on the substrate layer (20). The electrical connection structure (50) is an electrical connection structure made of a flexible circuit board according to any one of claims 1-12. One end of the conductor loop (30) is connected to the inner connection area (Q1). The wire harness (60) is located outside the protective layer (10). One end of the wire harness (60) is a connector end (61), which extends between the two protective layers (10) and connects to the external connection area (Q2). The other end of the wire harness (60) is provided with a controller (85).

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