A tin storage device for photovoltaic module diode processing

Abstract

This invention relates to the field of diode processing technology, and more particularly to a tin storage device for processing photovoltaic module diodes. The device includes a belt conveyor, a housing fixedly connected to the side wall of the belt conveyor, a linear actuator fixedly connected to the side wall of the housing, a moving end of the linear actuator fixedly connected to the top of a first electric push rod, a vacuum suction pen connected to the lower end of the first electric push rod, and a magnetic block fixedly connected to the lower side wall of the first electric push rod. A placement frame is fixedly connected to the side wall of the belt conveyor. This invention utilizes the power of the belt movement to automatically drive a drive gear to rotate during the process of moving the tin block from the tin block's pick-up area to the processing area between the ultrasonic vibrator and the tin block. This causes a grinding plate to reciprocate and grind the contact area between the tin block and the heat sink, making the contact surface smooth, increasing the contact area between the subsequent tin block and the heat sink, ensuring close contact between the subsequent tin block and the heat sink, and promoting the effective transfer of ultrasonic energy.

Description

Technical Field

[0001] This invention relates to the field of diode processing technology, and in particular to a tin storage device for processing photovoltaic module diodes. Background Technology

[0002] Patent CN116638169A discloses a novel photovoltaic module diode tin storage device, including a base platform. Two positioning frames are connected to the top of the base platform, and the interior of each positioning frame is used to engage a frame. Adjustment slots are provided on both the left and right sides of one side of the top of the base platform. Processing components are symmetrically arranged at both ends of the base platform, and each processing component corresponds to one of the adjustment slots. In operation, the left linear module is activated to move the vacuum suction pen above the fixed block storing the tin.

[0003] Patent CN220028944U discloses a field of photovoltaic module diode processing. It includes a workbench with a processing assembly and a processing area on its top. The processing assembly includes a robotic arm (first arm) and a robotic arm (second arm) arranged sequentially on the workbench. The processing area includes a conveyor belt for transporting a frame on which a photovoltaic module is mounted. A solder block storage area is located on the outside of the conveyor belt on the workbench.

[0004] In the aforementioned prior art, a vacuum suction pen and an ultrasonic vibration head are respectively set at the left and right ends of the worktable. The heat sink and the solder block are transferred from left to right to the processing area by a belt. However, in this transfer area, the surface of the contact area between the solder block and the heat sink is not treated to reduce the contact area between the solder block and the heat sink in the future. Summary of the Invention

[0005] Therefore, the present invention provides a tin storage device for processing photovoltaic module diodes to solve the above-mentioned technical problems.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a tin storage device for photovoltaic module diode processing, comprising a belt conveyor, a housing fixedly connected to the side wall of the belt conveyor, a linear actuator fixedly connected to the side wall of the housing, a moving end of the linear actuator fixedly connected to the top of a first electric push rod, a vacuum suction pen connected to the lower end of the first electric push rod, and a magnetic block fixedly connected to the side wall of the lower end of the first electric push rod; a placement frame fixedly connected to the side wall of the belt conveyor, a connecting rod fixedly connected to the housing, the connecting rod fixedly connected to the top of a second electric push rod, and an ultrasonic vibration head connected to the lower end of the second electric push rod; the support frame of the belt conveyor from left to right... The right side is fixedly connected to a first meshing rack, a second meshing rack, and a third meshing rack; a placement assembly is connected to the belt conveyor; the placement assembly includes a base, which is connected to the belt conveyor, and a drive shaft is rotatably connected to the base. The drive shaft is fixedly connected to the center of the first gear, which meshes with the first meshing rack. A first groove is recessed inward on the base, and a bidirectional screw is rotatably connected to the first groove. The bidirectional screw is fixedly connected to the drive shaft, and drive plates are threaded to the left and right ends of the bidirectional screw. The drive plates are slidably connected to the first groove. A connecting assembly is rotatably connected to the base, and an upper clamping assembly is connected to the upper end of the base.

[0007] Preferably, the upper clamping assembly includes a mouth-shaped frame, which is fixedly connected to the upper end of the base. Telescopic rods are fixedly connected to the left and right ends of the mouth-shaped frame. A repulsion plate is connected to the moving end of the telescopic rod. A second groove is embedded in the mouth-shaped frame. The outer rod and inner rod of the telescopic rod are connected by a spring. The side wall of the outer rod is fixedly connected to the contact plate.

[0008] Preferably, the connecting assembly includes a connecting gear, which is rotatably connected to the base and connected to the column. A guide rod is connected to the side wall of the column, and the guide rod consists of an inner cylinder and an outer cylinder.

[0009] Preferably, the other end of the guide rod is connected to the grinding plate, the grinding plate has a hollowed-out suction cavity, a drive gear is rotatably connected to the column, the drive gear is fixedly connected to a set of connecting rods on the first connecting rod group, and the other end of the first connecting rod group is rotatably connected to the connecting rod and the grinding plate.

[0010] Preferably, a suction frame is fixedly connected to the column, a piston plate is slidably connected inside the suction frame, the connecting gear is fixedly connected to one end of the connecting rod on the second connecting rod group, and the other end of the second connecting rod group is rotatably connected to the side wall of the piston plate.

[0011] Preferably, the base has a filter chamber at its bottom, a filter screen is fixedly connected in the filter chamber, and the column has a first transmission chamber and a second transmission chamber, the first transmission chamber being connected to the suction chamber in the grinding plate.

[0012] Preferably, the other end of the first transmission cavity is connected to the filter screen inside the filter cavity.

[0013] Preferably, one end of the second transmission chamber is connected to the suction frame via a one-way valve, and the other end of the second transmission chamber is connected to the upper end of the filter chamber. The suction frame is provided with an exhaust one-way valve.

[0014] Preferably, the placement assembly is provided in multiple sets, and the multiple sets of placement assemblies are respectively placed on the belt of the belt conveyor.

[0015] Preferably, the drive gear meshes with the second meshing rack, and the connecting gear meshes with the third meshing rack.

[0016] The beneficial effects of this invention are:

[0017] This invention utilizes a vacuum suction pen to pick up solder blocks. Through precise control of a linear driver and a first electric push rod, the solder blocks can be accurately removed from the placement frame and placed in a designated position. The cooperation between the magnetic block and the repulsion plate ensures that the solder blocks are automatically clamped and fixed after placement, ensuring the stability of the solder blocks during processing and improving processing accuracy.

[0018] This invention utilizes the power of a belt to automatically drive a drive gear to rotate during the process of moving the solder block from the area where it is picked up to the processing area of ​​the ultrasonic vibrating head and the solder block. This causes the grinding plate to reciprocate and grind the contact area between the solder block and the heat sink, making the contact surface flat, increasing the contact area between the subsequent solder block and the heat sink, ensuring close contact between the subsequent solder block and the heat sink, and promoting the effective transmission of ultrasonic energy.

[0019] The polishing plate in this invention automatically and simultaneously sucks up the generated particles during the polishing process of the solder block and the heat sink, increasing the flatness and cleanliness of the connection area between the solder block and the heat sink.

[0020] This invention, through the cooperation of a belt conveyor, a placement component, a first meshing rack, a second meshing rack, and a third meshing rack, can automatically clamp and fix the solder block and the heat sink, and grind and clean the connection area between the solder block and the heat sink as the placement component is moved to various processing areas by the belt conveyor. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the three-dimensional structure of the present invention. Figure 1 .

[0022] Figure 2This is a schematic diagram of the three-dimensional structure of the present invention. Figure 2 .

[0023] Figure 3 This is a schematic diagram of the three-dimensional structure of the present invention. Figure 3 .

[0024] Figure 4 This is a schematic diagram of the placement component structure of the present invention. Figure 1 .

[0025] Figure 5 This is a schematic diagram of the placement component structure of the present invention. Figure 2 .

[0026] Figure 6 This is a schematic diagram of the placement component structure of the present invention. Figure 3 .

[0027] Figure 7 This is a schematic diagram of the connecting component structure of the present invention.

[0028] Figure 8 This is a schematic diagram of the first groove structure of the present invention.

[0029] Figure 9 This is a cross-sectional view of the placement component of the present invention.

[0030] The components include: belt conveyor-1, housing-2, linear actuator-3, first electric push rod-4, vacuum suction pen-5, magnetic block-6, placement frame-7, connecting rod-8, second electric push rod-9, ultrasonic vibrating head-10, placement assembly-11, first meshing rack-12, second meshing rack-13, third meshing rack-14, base-111, drive shaft-112, first gear-113, first groove-114, bidirectional screw-115, drive plate-1151, connecting assembly-116, upper clamping assembly-117, and mouth. Frame-1171, Telescopic rod-1172, Repulsion plate-1173, Second groove-1174, Contact plate-1175, Connecting gear-1161, Column-1162, Guide rod-1163, Grinding plate-1164, Suction chamber-1165, Drive gear-1166, First connecting rod assembly-11661, Suction frame-1167, Piston plate-11671, Second connecting rod assembly-1168, First transmission chamber-1169, Second transmission chamber-11610, Filter chamber-11611, Filter screen-11612. Detailed Implementation

[0031] To further explain the technical solution of the present invention, a detailed description is provided below through specific embodiments.

[0032] like Figure 1As shown, the present invention provides a tin storage device for processing photovoltaic module diodes, including a belt conveyor 1, a housing 2 fixedly connected to the side wall of the belt conveyor 1, a linear driver 3 fixedly connected to the side wall of the housing 2, a moving end of the linear driver 3 fixedly connected to the top of a first electric push rod 4, a vacuum suction pen 5 connected to the lower end of the first electric push rod 4, the vacuum suction pen 5 being used to adsorb the tin block required for processing, and a magnetic block 6 fixedly connected to the lower side wall of the first electric push rod 4; a controller is provided on the belt conveyor 1, the controller being used to electrically connect with the electrical components.

[0033] like Figure 1-9 As shown in this embodiment, a placement frame 7 is fixedly connected to the side wall of the belt conveyor 1. The placement frame 7 is used to store the solder blocks required for processing. A connecting rod 8 is fixedly connected to the outer shell 2. The connecting rod 8 is fixedly connected to the top of the second electric push rod 9. An ultrasonic vibration head 10 is connected to the lower end of the second electric push rod 9. The second electric push rod 9 is used to drive the ultrasonic vibration head 10 to move up and down and adjust the position of the ultrasonic vibration head 10 so that the ultrasonic vibration head 10 contacts the solder block.

[0034] like Figure 1-9 As shown in this embodiment, the support frame of the belt conveyor 1 is fixedly connected from left to right with a first meshing rack 12, a second meshing rack 13, and a third meshing rack 14.

[0035] The drive gear 1166 meshes with the second meshing rack 13, and the connecting gear 1161 meshes with the third meshing rack 14.

[0036] like Figure 1-9 As shown in this embodiment, a placement assembly 11 is connected to the belt conveyor 1. The placement assembly 11 includes a base 111, which is connected to the belt conveyor 1. The base 111 is moved by the belt on the belt conveyor 1 to adjust the processing position of the workpiece.

[0037] Among them, a drive shaft 112 is rotatably connected to the base 111. The drive shaft 112 is fixedly connected to the center of the first gear 113. The first gear 113 meshes with the first meshing rack 12, so that when the base 111 moves, the first meshing rack 12 automatically drives the first gear 113 to rotate.

[0038] The base 111 has a recessed first groove 114 to provide placement space. A bidirectional screw 115 is rotatably connected in the first groove 114. The bidirectional screw 115 is fixedly connected to the drive shaft 112. The left and right ends of the bidirectional screw 115 are threaded with drive plates 1151 to facilitate clamping and fixing the heat sink. When the base 111 is reset and moved to the front end of the processing, the first gear 113 is manually turned. The first gear 113 drives the two sets of drive plates 1151 to unfold and reset. The column 1162 can also be turned to reset and rotate, so that the column 1162 drives the grinding plate 1164 to move and reset to above the base 111.

[0039] Specifically, the drive plate 1151 is slidably connected to the first groove 114, the base 111 is rotatably connected to the connecting component 116, and the upper end of the base 111 is connected to the upper clamping component 117.

[0040] like Figure 1-9 As shown, in this embodiment, the upper clamping component 117 includes an orifice frame 1171, the bottom of which is hollowed out to facilitate the downward sliding of the solder block.

[0041] The orifice frame 1171 is fixedly connected to the upper end of the base 111, providing installation support for the orifice frame 1171. Telescopic rods 1172 are fixedly connected to the left and right ends inside the orifice frame 1171. The moving end of the telescopic rod 1172 is connected to a repulsion plate 1173, which is composed of magnets. A second groove 1174 is embedded inside the orifice frame 1171. The outer rod and the inner rod of the telescopic rod 1172 are connected by a spring. When the outer rod moves, the spring is compressed, so that the spring provides the power to reset the movement of the outer rod in the future. The side wall of the outer rod is fixedly connected to the contact plate 1175.

[0042] like Figure 1-9 As shown, in this embodiment, the connecting component 116 includes a connecting gear 1161, which is rotatably connected to the base 111 and connected to the column 1162. A guide rod 1163 is connected to the side wall of the column 1162. The guide rod 1163 is composed of an inner cylinder and an outer cylinder. There are two sets of guide rods 1163. The two sets of guide rods 1163 are respectively connected to the left and right ends of the grinding plate 1164 to provide guidance for the movement of the grinding plate 1164.

[0043] The other end of the guide rod 1163 is connected to the grinding plate 1164. The grinding plate 1164 is hollowed out to form a suction cavity 1165. The grinding plate 1164 is provided with multiple sets of through holes, which communicate with the suction cavity 1165 to facilitate the suction of particles into the suction cavity 1165. A drive gear 1166 is rotatably connected to the column 1162. The drive gear 1166 is fixedly connected to a set of connecting rods on the first connecting rod group 11661. The other end of the first connecting rod group 11661 is rotatably connected to the grinding plate 1164. The two sets of connecting rods in the first connecting rod group 11661 are rotatably connected to each other.

[0044] like Figure 1-9 As shown in this embodiment, a suction frame 1167 is fixedly connected to the column 1162, and a piston plate 11671 is slidably connected inside the suction frame 1167. The connecting gear 1161 is fixedly connected to one end of the connecting rod on the second connecting rod assembly 1168, and the other end of the second connecting rod assembly 1168 is rotatably connected to the side wall of the piston plate 11671. The second connecting rod assembly 1168 is used to push the piston plate 11671 to reciprocate.

[0045] The base 111 has a filter chamber 11611 at the bottom, and a filter screen 11612 is fixedly connected in the filter chamber 11611. The filter screen 11612 is L-shaped. The column 1162 has a first transmission chamber 1169 and a second transmission chamber 11610. The first transmission chamber 1169 is connected to the suction chamber 1165 in the grinding plate 1164. The other end of the first transmission chamber 1169 is connected to the filter screen 11612 in the filter chamber 11611. One end of the second transmission chamber 11610 is connected to the suction frame 1167 through a one-way valve. The other end of the second transmission chamber 11610 is connected to the upper end of the filter chamber 11611. The suction frame 1167 is equipped with an exhaust one-way valve.

[0046] The placement component 11 is provided in multiple sets, and the multiple sets of placement components 11 are placed on the belt of the belt conveyor 1 to facilitate the placement of multiple workpieces one by one.

[0047] This invention provides a tin storage device for processing photovoltaic module diodes, the specific working method of which is as follows:

[0048] First, during processing, the heat sink is placed in the first groove 114 inside the base 111, and then the belt conveyor 1 is controlled to move the base 111. When the base 111 moves, it drives the first gear 113 to mesh with the first meshing rack 12. The first meshing rack 12 drives the first gear 113 to rotate. The first gear 113 drives the bidirectional screw 115 to rotate. The bidirectional screw 115 drives the two sets of drive plates 1151 to move closer to each other to automatically clamp and fix the heat sink.

[0049] When the base 111 moves below the vacuum pen 5, the linear actuator 3 drives the first electric push rod 4 to move. The first electric push rod 4 then moves the vacuum pen 5 above the placement frame 7. The first electric push rod 4 then moves the vacuum pen 5 downwards, and the vacuum pen 5 picks up the solder block. Then it moves upwards to reset and move above the base 111.

[0050] Second, the first electric push rod 4 drives the vacuum suction pen 5 to move downward, and the vacuum suction pen 5 drives the solder block to move downward. The solder block moves downward and inserts into the second groove 1174. The magnetic block 6 repels the repulsion plate 1173, causing the two sets of repulsion plates 1173 to slide outward under magnetic force, causing the two sets of contact plates 1175 to move outward. Then, the vacuum suction pen 5 loses its attraction to the solder block, and the solder block is placed inside the second groove 1174. Then, the vacuum suction pen 5 and the magnetic block 6 are controlled to move upward. The magnetic block 6 loses its pushing force on the repulsion plate 1173. The repulsion plate 1173 automatically resets with the assistance of the telescopic rod 1172. The repulsion plate 1173 drives the contact plate 1175 to clamp and fix the solder block.

[0051] Third, the control belt conveyor 1 drives the base 111 to move, the drive gear 1166 meshes with the second meshing rack 13, the drive gear 1166 rotates, the drive gear 1166 drives the first linkage group 11661 to rotate, the first linkage group 11661 drives the grinding plate 1164 to move back and forth, the upper and lower ends of the grinding plate 1164 contact the solder block and the heat sink, and at the same time the grinding plate 1164 grinds the contact area between the solder block and the heat sink, so that the contact area between the solder block and the heat sink is flat, which facilitates subsequent connection;

[0052] While the drive gear 1166 rotates, it drives the second linkage group 1168 to rotate. The second linkage group 1168 drives the piston plate 11671 to reciprocate inside the suction frame 1167. The piston plate 11671 draws air from the suction chamber 1165 inside the grinding plate 1164 through the first transmission chamber 1169 and the second transmission chamber 11610, so that the suction chamber 1165 draws and recovers the particulate matter generated on the surface of the grinding plate 1164 into the filter screen 11612 of the filter chamber 11611.

[0053] Fourth, control the belt conveyor 1 to continue moving. The belt conveyor 1 drives the connecting gear 1161 on the base 111 to mesh with the third meshing rack 14. The connecting gear 1161 rotates under force, and the connecting gear 1161 drives the column 1162 to rotate outward, so that the column 1162 drives the grinding plate 1164 to separate from the solder block and the heat sink, so that the gap between the solder block and the heat sink is hollowed out.

[0054] When the base 111 moves below the second electric push rod 9, the second electric push rod 9 drives the ultrasonic vibrating head 10 to move downward. The ultrasonic vibrating head 10 contacts the solder block and pushes the solder block downward to contact the heat sink below. The solder block and the heat sink are bonded by high-frequency vibration. Then, the second electric push rod 9 is controlled to move upward, and the belt conveyor 1 is controlled to drive the base 111 to move away from the work station.

[0055] This invention utilizes a vacuum pen 5 to pick up solder blocks. Through precise control of a linear driver 3 and a first electric push rod 4, the solder blocks can be accurately removed from the placement frame 7 and placed in a designated position. The cooperation between the magnetic block 6 and the repulsion plate 1173 ensures that the solder blocks are automatically clamped and fixed after placement, thus ensuring the stability of the solder blocks during processing and improving processing accuracy.

[0056] The present invention utilizes the power of the belt to automatically drive the drive gear 1166 to rotate during the process of moving the solder block from the area where the solder block is picked up to the processing area between the ultrasonic vibration head 10 and the solder block. This causes the grinding plate 1164 to reciprocate and grind the contact area between the solder block and the heat sink, making the contact surface flat and ensuring that the solder block and the heat sink are in close contact afterward, thus promoting the effective transmission of ultrasonic energy.

[0057] In the present invention, the polishing plate 1164 automatically and simultaneously sucks up the generated particles during the polishing process of the solder block and the heat sink, thereby increasing the flatness and cleanliness of the connection area between the solder block and the heat sink.

[0058] The present invention, through the cooperation of belt conveyor 1, placement component 11, first meshing rack 12, second meshing rack 13, and third meshing rack 14, can automatically perform grinding and cleaning on the clamping and fixing of solder blocks and heat sinks and the connection area between solder blocks and heat sinks during the process of belt conveyor 1 driving placement component 11 to move to various processing areas.

[0059] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A tin storage device for processing photovoltaic module diodes, comprising a belt conveyor (1), a housing (2) fixedly connected to the side wall of the belt conveyor (1), a linear driver (3) fixedly connected to the side wall of the housing (2), the moving end of the linear driver (3) being fixedly connected to the top of a first electric push rod (4), a vacuum pen (5) being connected to the lower end of the first electric push rod (4), and a magnetic block (6) being fixedly connected to the side wall of the lower end of the first electric push rod (4). Its features are: The side wall of the belt conveyor (1) is fixedly connected to a placement frame (7), and the outer shell (2) is fixedly connected to a connecting rod (8). The connecting rod (8) is fixedly connected to the top of the second electric push rod (9), and the lower end of the second electric push rod (9) is connected to an ultrasonic vibration head (10). The support frame of the belt conveyor (1) is fixedly connected from left to right with a first meshing rack (12), a second meshing rack (13), and a third meshing rack (14). The belt conveyor (1) is connected to a placement assembly (11); The placement assembly (11) includes a base (111), which is connected to the belt conveyor (1). A drive shaft (112) is rotatably connected to the base (111). The drive shaft (112) is fixedly connected to the center of the first gear (113). The first gear (113) meshes with the first meshing rack (12). A first groove (114) is recessed inward on the base (111). A bidirectional screw (115) is rotatably connected in the first groove (114). The bidirectional screw (115) is fixedly connected to the drive shaft (112). A drive plate (1151) is threaded to the left and right ends of the bidirectional screw (115). The drive plate (1151) is slidably connected in the first groove (114). A connecting assembly (116) is rotatably connected to the base (111). An upper clamping assembly (117) is connected to the upper end of the base (111). The connecting assembly (116) includes a connecting gear (1161), which is rotatably connected to the base (111) and connected to the column (1162). A guide rod (1163) is connected to the side wall of the column (1162), and the guide rod (1163) is composed of an inner cylinder and an outer cylinder. The other end of the guide rod (1163) is connected to the grinding plate (1164). The grinding plate (1164) has a hollowed-out suction cavity (1165). A drive gear (1166) is rotatably connected to the column (1162). The drive gear (1166) is fixedly connected to a set of connecting rods on the first connecting rod group (11661). The other end of the first connecting rod group (11661) is rotatably connected to the connecting rod and the grinding plate (1164). The polishing plate (1164) moves back and forth to polish the contact area between the solder block and the heat sink, making the contact surface flat and increasing the contact area between the subsequent solder block and the heat sink.

2. The tin storage device for photovoltaic module diode processing according to claim 1, characterized in that: The upper clamping assembly (117) includes an orifice frame (1171), which is fixedly connected to the upper end of the base (111). Telescopic rods (1172) are fixedly connected to the left and right ends of the orifice frame (1171). A repulsion plate (1173) is connected to the moving end of the telescopic rod (1172). A second groove (1174) is embedded in the orifice frame (1171). The outer rod and inner rod of the telescopic rod (1172) are connected by a spring. The side wall of the outer rod is fixedly connected to the contact plate (1175).

3. The tin storage device for photovoltaic module diode processing according to claim 1, characterized in that: A suction frame (1167) is fixedly connected to the column (1162), and a piston plate (11671) is slidably connected inside the suction frame (1167). The connecting gear (1161) is fixedly connected to one end of the connecting rod on the second connecting rod group (1168), and the other end of the second connecting rod group (1168) is rotatably connected to the side wall of the piston plate (11671).

4. The tin storage device for photovoltaic module diode processing according to claim 1, characterized in that: The base (111) has a filter chamber (11611) at the bottom, and a filter screen (11612) is fixedly connected inside the filter chamber (11611). The column (1162) has a first transmission chamber (1169) and a second transmission chamber (11610). The first transmission chamber (1169) is connected to the suction chamber (1165) inside the grinding plate (1164).

5. The tin storage device for photovoltaic module diode processing according to claim 4, characterized in that: The other end of the first transmission cavity (1169) is connected to the filter screen (11612) inside the filter cavity (11611).

6. The tin storage device for photovoltaic module diode processing according to claim 5, characterized in that: One end of the second transmission chamber (11610) is connected to the suction frame (1167) through a one-way valve, and the other end of the second transmission chamber (11610) is connected to the upper end of the filter chamber (11611). The suction frame (1167) is provided with an exhaust one-way valve.

7. The tin storage device for photovoltaic module diode processing according to claim 1, characterized in that: The placement component (11) is provided in multiple sets, and the multiple sets of placement components (11) are respectively placed on the belt of the belt conveyor (1).

8. The tin storage device for photovoltaic module diode processing according to claim 1, characterized in that: The drive gear (1166) meshes with the second meshing rack (13), and the connecting gear (1161) meshes with the third meshing rack (14).

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