An automatic sealing system and method for circuit boards

Abstract

This invention discloses an automatic sealing system and method for circuit boards, relating to the field of printed circuit technology. The method includes: acquiring a set of device height points, extracting a centerline coordinate set, a width set, and a no-coating coordinate set; calculating the entry cutoff level based on the centerline coordinate set and the width set, calculating the drift candidate coordinate set based on the device height point set and the width set, and generating a restricted deposition partition table; generating a restricted deposition command based on the restricted deposition partition table, the entry cutoff level, and the drift candidate coordinate set; driving the nozzle along the entry barrier trajectory to form an entry barrier layer according to the restricted deposition command, forming a barrier band outside the no-coating coordinate set, and injecting deposition according to the injection and discharge sequence and the guiding airflow sequence, and suppressing the drift candidate coordinate set according to the recovery airflow sequence; and outputting sealing record data. This invention can cope with the switching of material transport mechanisms caused by narrow channel geometry, avoiding the limitations of traditional two-dimensional trajectory optimization.

Description

Technical Field

[0001] This invention relates to the field of printed circuit technology, and more specifically, to an automatic sealing system and method for circuit boards. Background Technology

[0002] In consumer electronics, automotive electronics, and industrial control, circuit boards often integrate various devices of different heights, with some devices spaced close together to adjacent devices, forming numerous narrow channel structures. To ensure the operational stability of circuit boards in complex working environments, selective encapsulation treatment is required for critical areas. This involves forming a protective layer on the device surface, pins, pads, and other areas to resist corrosion from external factors such as dust, moisture, and chemical media.

[0003] Currently, selective encapsulation of circuit boards mostly employs spraying or dispensing processes. These processes control the movement path of the nozzle or needle through a preset motion trajectory, while simultaneously adjusting process parameters such as the height from the board, the incident angle, the amount of adhesive dispensed, or the spray pressure to achieve a predetermined thickness of encapsulating material deposition in the target area. This type of process is based on a two-dimensional planar layout for planning the work trajectory. By optimizing the trajectory density or increasing the number of coats, the uniformity of the encapsulation coverage is improved, meeting basic protection requirements.

[0004] In actual operation, when the nozzle or needle moves into the aforementioned narrow channel area, the clearance height from the board or the incident angle needs to be increased or decreased to avoid collisions with surrounding tall devices. This adjustment causes the sprayed mist or dispensing micelles to be blocked and intercepted by the side walls of the devices on both sides of the channel before entering the channel entrance. This results in the actual amount of sealing material deposited inside the shaded area not matching the spray range and unit area deposition amount specified outside the channel. At the same time, the sealing material will experience secondary rebound after impacting the device side wall, and some material will also undergo local backflow under the guidance of the side wall. The fine droplets carried during the rebound and backflow will be redeposited on the outside of the channel or the upwind area, resulting in a thinner material deposition thickness inside the shaded area, a thicker material accumulation at the edge of the channel entrance, and unexpected material deposition in some areas far from the target area.

[0005] Because the geometry of the narrow channel alters the transport mechanism of the sealing material, it transforms the original free deposition mode into a confined deposition mode. Existing processes only optimize parameters based on two-dimensional planar trajectories without considering the influence of channel geometry on the material transport mechanism. Under different combinations of device height differences, channel widths, and nozzle postures, it is impossible to adapt to changes in material deposition patterns. Even if adjustments are made by refining the trajectory or increasing the number of recoatings, it is difficult to fundamentally solve the aforementioned uneven deposition problem.

[0006] The aforementioned conditions result in insufficient sealant protection for critical areas such as the root of device leads and the edges of pads within the shaded areas of the circuit board. These areas, exposed to a complex environment for extended periods, are susceptible to corrosion, oxidation, or mechanical damage, affecting the stability of the circuit board's electrical connections. Material buildup and unintended drift deposits at the channel entry edges may cover restricted areas on the circuit board, interfering with the normal operation of adjacent devices and causing electrical short circuits or poor contact. Furthermore, multiple recoatings increase material loss, further amplifying the risk of entry buildup and restricted area contamination, leading to a higher product defect rate.

[0007] In view of this, the present invention proposes an automatic sealing system and method for circuit boards to solve the above problems. Summary of the Invention

[0008] To overcome the aforementioned deficiencies of the prior art and achieve the above objectives, the present invention provides the following technical solution: an automatic sealing method for a circuit board, comprising:

[0009] The device height is collected to obtain a device height point set, and the centerline coordinate set, width set, and blackout coordinate set are extracted from the device height point set;

[0010] The entry cutoff level is calculated based on the centerline coordinate set and the width set. The drift candidate coordinate set is calculated based on the device height point set and the width set. A restricted deposition partition table is generated based on the entry cutoff level, the drift candidate coordinate set, and the no-coating coordinate set.

[0011] Based on the confined deposition zoning table and the inlet cutoff level, the separation height sequence and the incident angle sequence are generated. Based on the drift candidate coordinate set, the injection and discharge sequence, the guiding airflow sequence, the recovery airflow sequence and the inlet blocking trajectory are generated and combined to obtain the confined deposition command.

[0012] The nozzle or needle is driven according to the separation height sequence, incident angle sequence and restricted deposition command. The nozzle or needle forms an inlet barrier layer along the inlet barrier trajectory. The inlet barrier layer forms a continuous barrier band outside the forbidden coating coordinate set to restrict the sealing material from entering the corresponding area of ​​the forbidden coating coordinate set. The injection deposition is carried out according to the injection discharge sequence and the guiding airflow sequence. The drift candidate coordinate set is suppressed according to the recovery airflow sequence.

[0013] Output the final solid seal record data.

[0014] Furthermore, the injection-out sequence is used for injection deposition.

[0015] Furthermore, methods for obtaining the centerline coordinate set, width set, and blackout coordinate set include:

[0016] The positioning camera is used to frame the circuit board, extract the image position of the preset reference mark on the circuit board, and obtain the reference coordinates of the circuit board by combining the circuit board clamping position. The preset safety height is then set according to the reference coordinates of the circuit board.

[0017] Under the constraints of the circuit board reference coordinates and the preset safety height, the drive nozzle or needle is used to scan along the preset safety height. The distance sensor from the board collects the height of the device point by point. The coordinates of the collected points are determined by the circuit board reference coordinates to form a set of device height points.

[0018] Extract the device outline boundary based on the device height point set;

[0019] The centerline coordinate set is extracted from the circuit board reference coordinates based on the device outline boundary. The width set is the sum of the lateral distances from each coordinate point on the centerline coordinate set to the device outline boundaries on both sides, and the width set is formed in the order of the centerline coordinate set.

[0020] Align the coordinate set of the blackout area with the coordinate set of device height points under the circuit board reference coordinate system, and extract the coordinates of the device height points that fall within the range of the blackout area coordinate set to form the blackout coordinate set.

[0021] Furthermore, methods for generating constrained sedimentary zoning tables include:

[0022] The entrance direction of the narrow passage is determined based on the centerline coordinate set, and the centerline coordinate set is sequentially calibrated in the entrance direction to obtain the entrance endpoint and continuous coordinate sequence. The width set corresponding to the continuous coordinate sequence is read, and the entrance segment width sequence is selected from the continuous coordinate sequence according to the preset entrance length.

[0023] The reference width range of the deep section of the channel is determined based on the inlet segment width sequence and width set, and the inlet cutoff level is determined based on the inlet segment width sequence and reference width range.

[0024] The device outline boundary neighborhood is determined based on the device height point set and width set. The height gradient change set is extracted based on the device outline boundary neighborhood. The drift-prone area is determined based on the height gradient change set and width set. The drift-prone area coordinates under the circuit board reference coordinates are summarized to obtain the drift candidate coordinate set.

[0025] In the circuit board reference coordinate system, the proximity determination of the drift candidate coordinate set and the uncoated coordinate set is performed to obtain the drift sensitive coordinate points;

[0026] Using the centerline coordinate set as an index, the narrow channel is segmented and labeled based on the inlet cutoff level, drift candidate coordinate set, forbidden coating coordinate set, and drift sensitive coordinate points to obtain a restricted sedimentation zoning table.

[0027] Furthermore, the restricted sedimentary zoning table includes the entrance cutoff section, the deep section of the channel, and the drift-sensitive section.

[0028] Furthermore, methods for obtaining constrained deposition instructions include:

[0029] Read the entry cutoff level and establish a list of coordinate ranges for the entry cutoff segment, the deep channel segment, and the drift-sensitive segment based on the centerline coordinate set;

[0030] The range of values ​​for the height-off-board sequence and the range of values ​​for the incident angle sequence are determined based on the list of entry cutoff levels and coordinate ranges. The height-off-board sequence and the incident angle sequence are obtained by assigning values ​​to the segmented positions of the entry cutoff segment, the deep channel segment, and the drift-sensitive segment in the list of coordinate ranges.

[0031] Under the reference coordinates of the circuit board, the set of coordinates to be restricted and the buffer distance to be restricted are read. The drift candidate coordinate set and the set of coordinates to be restricted are determined to obtain the drift sensitive coordinate points. The entrance blocking trajectory is generated based on the drift sensitive coordinate points.

[0032] The drift candidate coordinate set is mapped to the coordinate range list to obtain the centerline coordinate set position set. Based on the centerline coordinate set position set, the injection coordinate range is generated in the deep section of the channel and the discharge rhythm is assigned to obtain the injection and discharge sequence.

[0033] The guiding airflow sequence is generated based on the centerline coordinate set and the recovery airflow sequence is generated based on the drift-sensitive coordinate points. The restricted deposition command is obtained by combining the off-plate height sequence, incident angle sequence, injection and discharge sequence, guiding airflow sequence, recovery airflow sequence and inlet barrier trajectory.

[0034] Furthermore, the method of driving the nozzle or needle according to the sequence of clearance height, the sequence of incident angles, and the restricted deposition command, and forming an inlet barrier layer along the inlet barrier trajectory, wherein the inlet barrier layer forms a continuous barrier band outside the inlet coating coordinate set, to restrict the entry of the sealing material into the corresponding area of ​​the inlet coating coordinate set includes:

[0035] Under the reference coordinates of the circuit board, the restricted deposition instructions are read, and the position order is taken as the coordinate order of the center line coordinate set and the action order is taken as the action order to obtain a continuous action sequence.

[0036] The nozzle or needle is driven to move along the inlet barrier trajectory based on a continuous action sequence and perform inlet barrier layer deposition within the coordinate range covered by the inlet barrier trajectory. The inlet barrier trajectory maintains a no-coating buffer distance from the no-coating coordinate set.

[0037] Furthermore, the method of performing injection deposition according to the injection-out sequence and the guiding gas flow sequence, and suppressing the drift candidate coordinate set according to the recovery gas flow sequence includes:

[0038] Based on the continuous action sequence, the nozzle or needle is driven to enter the centerline coordinate set corresponding to the deep section of the channel, and injection deposition is performed according to the injection and discharge sequence and the guiding airflow sequence;

[0039] The nozzle or needle is driven to move along the centerline coordinate set corresponding to the drift candidate coordinate set based on a continuous action sequence, and directional recovery is performed on the area corresponding to the drift candidate coordinate set according to the recovery airflow sequence.

[0040] According to the time sequence of the restricted deposition command, the separation height sequence, incident angle sequence, injection and discharge sequence, guide airflow sequence and recovery airflow sequence are switched between segments, and a transition length is introduced at the adjacent boundary of the inlet cut-off segment, the deep channel segment and the drift sensitive segment.

[0041] Furthermore, methods for outputting sealed record data include:

[0042] Using the circuit board reference coordinates as a unified coordinate basis, the device height point set, center line coordinate set, width set and anti-coating coordinate set are normalized. The entry cutoff level, drift candidate coordinate set and restricted deposition partition table are associated and organized according to the coordinate order of the center line coordinate set. The restricted deposition command is used as the time sequence carrier to obtain the basic content of the solid seal record data.

[0043] The coordinate order of the centerline coordinate set is used as the recording order of the solidified record data. Record coordinate points are selected on the centerline coordinate set according to the sampling interval, and the width set value is obtained synchronously at the record coordinate points. Based on the correlation between the record coordinate points and the inlet truncation level, the segmented labeling of the restricted sedimentation partition table and the proximity relationship of the drift candidate coordinate set, the coordinate granularity expression of the solidified record data is obtained.

[0044] Based on the restricted sedimentation zoning table, the starting and ending coordinates of the inlet cut-off segment, the deep channel segment, and the drift-sensitive segment are marked in the solidification record data. The inlet cut-off level and the inlet cut-off segment are recorded in pairs. The drift-sensitive coordinate points are marked based on the no-coating buffer distance between the drift candidate coordinate set and the no-coating coordinate set, and the relative positional relationship between the inlet blocking trajectory and the no-coating coordinate set is recorded.

[0045] Record the time sequence of the nozzle or needle forming the inlet barrier layer along the inlet barrier trajectory according to the time sequence of the restricted deposition command, the time sequence of injection deposition according to the injection-discharge sequence and the guiding airflow sequence, and the time sequence of the candidate coordinate set for suppressing drift according to the recovery airflow sequence. Record the values ​​of the plate height sequence and the incident angle sequence, as well as the corresponding values ​​of the injection-discharge sequence, guiding airflow sequence, or recovery airflow sequence at the recorded coordinate points. Record the transition length when there is a segment switching between the inlet cut-off section, the deep section of the channel, and the drift-sensitive section.

[0046] The basic content, coordinate granularity, segmentation annotation, and time sequence records of the solidified record data are summarized to form the final solidified record data and output.

[0047] An automated sealing system for circuit boards includes:

[0048] The data acquisition module is used to collect the device height to obtain the device height point set, and extract the center line coordinate set, width set, and blackout coordinate set from the device height point set;

[0049] The region partitioning module is used to calculate the entry cutoff level based on the centerline coordinate set and the width set, calculate the drift candidate coordinate set based on the device height point set and the width set, and generate a restricted deposition partitioning table based on the entry cutoff level, the drift candidate coordinate set and the no-coating coordinate set.

[0050] The instruction generation module generates a separation height sequence and an incident angle sequence based on the confined deposition zoning table and the inlet cutoff level. It also generates an injection and discharge sequence, a guide airflow sequence, a recovery airflow sequence, and an inlet blockage trajectory based on the drift candidate coordinate set. These are combined to obtain the confined deposition instruction.

[0051] The instruction execution module is used to drive the nozzle or needle according to the separation height sequence, incident angle sequence and restricted deposition instruction. The nozzle or needle forms an inlet barrier layer along the inlet barrier trajectory. The inlet barrier layer forms a continuous barrier band outside the restricted coating coordinate set to restrict the sealing material from entering the corresponding area of ​​the restricted coating coordinate set. It performs injection deposition according to the injection discharge sequence and the guiding airflow sequence, and suppresses the drift candidate coordinate set according to the recovery airflow sequence.

[0052] The results output module is used to output the final solidification record data.

[0053] Compared with the prior art, the technical effects and advantages of the automatic sealing system and method for circuit boards of the present invention are as follows:

[0054] This invention collects the height of circuit board components to form a set of component height points, extracts the centerline coordinate set, width set, and anti-coating coordinate set from these points, and combines these data to calculate the inlet cutoff level and drift candidate coordinate set. This generates a restricted deposition partition table containing the inlet cutoff section, the deep section of the channel, and the drift-sensitive section. Furthermore, it generates a sequence of off-board height, incident angle, injection and discharge, guiding airflow, recovery airflow, and inlet blocking trajectory adapted to each partition. These sequences are combined to form a restricted deposition command, which drives the nozzle or needle to form an inlet blocking layer, completes injection deposition and drift suppression, and finally outputs solidification record data.

[0055] This invention effectively addresses the switching of material transport mechanisms caused by narrow channel geometry, avoids the limitations of traditional two-dimensional trajectory optimization, and solves problems such as insufficient coverage inside the shadow area, accumulation at the channel entrance edge, and unexpected drift deposition contamination of the restricted coating area. It improves the uniformity and accuracy of the sealing coverage, reduces material loss and product defect rate, and the resulting sealing record data provides a reliable basis for subsequent process reuse, ensuring the protection effect and electrical connection stability of key parts of the circuit board. Attached Figure Description

[0056] Figure 1 This is a schematic diagram of an automatic sealing system for a circuit board according to an embodiment of the present invention;

[0057] Figure 2 This is a flowchart of an automatic sealing method for a circuit board according to an embodiment of the present invention;

[0058] Figure 3 This is a flowchart of a method for generating a restricted deposition partition table according to an embodiment of the present invention. Detailed Implementation

[0059] The technical solutions of the embodiments of the present invention will be described in detail, clearly, and completely below with reference to the accompanying drawings. It should be particularly noted that the specific embodiments described below are only for better illustrating and explaining the technical solutions of the present invention, and are intended to enable those skilled in the art to better understand and implement the present invention, and should not be construed as limiting the scope of protection of the present invention. Without departing from the spirit and substance of the present invention, those skilled in the art can modify, adjust, or make equivalent substitutions based on the content disclosed in the present invention, and these should all be considered within the scope of protection of the present invention.

[0060] Example 1:

[0061] Please see Figure 1 As shown, this embodiment discloses an automatic sealing system for circuit boards, including a data acquisition module, a region division module, an instruction generation module, an instruction execution module, and a result output module. Each module is connected via wired or wireless means to achieve data transmission.

[0062] The data acquisition module is used to collect the device height to obtain the device height point set, and extract the center line coordinate set, width set, and blackout coordinate set from the device height point set.

[0063] The process involves obtaining a set of device height points around the device height, and then extracting the centerline coordinate set, width set, and blackout coordinate set from the device height point set. This can be implemented using the following sub-steps.

[0064] A positioning camera is used to capture the image of the circuit board, extracting the image position of a preset reference mark on the board. This image, combined with the board's mounting position, yields the board's reference coordinates. These coordinates unify the coordinate source of the component height points, preventing misalignment between the scanning position of the nozzle or needle and the actual position of the components. Subsequently, a preset safety height is set based on these coordinates. This safety height covers the space above the tallest component on the board and meets the usable range of the distance sensor. For example, the preset safety height ranges from 2 mm to 20 mm, using a larger value when there is a significant height difference between components and a smaller value when the height difference is small. Through this process, the board reference coordinates and the preset safety height jointly constrain the scanning starting point and scanning posture, reducing the collision risk caused by positional deviations when the nozzle or needle enters narrow channel areas. This reduces, from the source, the restricted and uneven deposition caused by the forced increase in distance height due to collision avoidance.

[0065] Under the constraints of the circuit board reference coordinates and the preset safety height, the drive nozzle or needle is used to scan along the preset safety height. During the scanning process, the movement direction of the nozzle or needle is kept consistent with the coordinate axis of the circuit board reference coordinates so that the device height point set and the subsequent centerline coordinate set and width set are expressed in the same coordinate system under the circuit board reference coordinates. Before the scanning starts, a reference plane on the circuit board surface is established based on the circuit board reference coordinates. The reference plane on the circuit board surface is obtained by selecting a number of reference sampling points on the circuit board surface by the off-board distance sensor. The reference sampling points are selected in areas outside the anti-coating coordinate set and where the device height point set is expected to be at a low height. The number of reference sampling points is 3 to 20. For circuit boards with smaller sizes, 3 to 8 points are selected, and for circuit boards with larger sizes, 8 to 20 points are selected. The reference plane on the circuit board surface is obtained based on the reference sampling points, and the preset safety height and the distance measurement value of the off-board distance sensor are uniformly converted into the height relative to the reference plane on the circuit board surface to offset the overall height offset caused by circuit board clamping tilt and circuit board warping. Subsequently, during the scanning process, the device height is collected point by point by an off-board ranging sensor. The device height is calculated by converting the distance difference between the current ranging value of the nozzle or needle and the reference ranging value of the corresponding position on the reference plane of the circuit board surface. The coordinates of the collection points are determined by the reference coordinates of the circuit board, forming a device height point set. The sampling interval is 0.2 mm to 2 mm, 0.2 mm to 0.8 mm when the narrow channel is dense, and 0.8 mm to 2 mm when the narrow channel is sparse, to ensure that the device height point set has sufficient spatial resolution at the channel boundary. Through the above processing, the device height point set records the device height distribution with the reference plane of the circuit board surface as a unified zero point under the reference coordinates of the circuit board. The systematic deviation introduced by the circuit board clamping tilt and circuit board warping is weakened, and the height occlusion and side wall position in the narrow channel can be objectively characterized, thus providing a usable geometric basis for subsequent reduction of insufficient shadow area coverage and entrance accumulation.

[0066] The device outline boundary is extracted based on the device height point set. The device outline boundary is determined by the height variation zone of the device height point set on the circuit board plane. Specifically, boundary point sets are formed at locations where the device height difference between adjacent acquisition points reaches a preset boundary height difference range. These boundary point sets are then connected and combined according to the circuit board reference coordinates to obtain the device outline boundary. The preset boundary height difference range is 0.2 mm to 2 mm, with a larger value used when the device surface has significant undulations and a smaller value used when the device surface is relatively flat, to avoid mistaking local undulations at the top of the device for the device outline boundary. Through this process, the device outline boundary is directly obtained from the device height point set, reflecting the true position of the device sidewalls on both sides of narrow channels. This reduces inaccurate channel entrance judgment caused by outline boundary offset, and minimizes the underestimation of material thickness after being cut off by the sidewalls at the entrance and the underestimation of thickness at the entrance edge.

[0067] Based on the device outline boundaries, a centerline coordinate set and a width set are extracted in the circuit board reference coordinate system. The centerline coordinate set is the set of equidistant trajectory points between opposing device outline boundaries, continuously generated along the extension direction of the narrow channel to form the centerline coordinate set. The width set is the sum of the lateral distances from each coordinate point on the centerline coordinate set to the device outline boundaries on both sides, and formed in the order of the centerline coordinate set. When multiple sets of opposing device outline boundaries exist at the same location, the set with the smallest width is preferentially selected as the width set of the narrow channel to cover the channel segment most prone to confined deposition. Through the above processing, the centerline coordinate set and the width set elevate the narrow channel from a two-dimensional layout to a spatial description consistent with the device height point set. The subsequent sealing process can constrain the channel scale based on the centerline coordinate set and the width set, no longer relying solely on increasing the density of two-dimensional planar trajectories to cover the narrow channel. This provides a calculable channel scale basis for mitigating insufficient shadow area coverage and drift deposition in confined deposition modes.

[0068] A no-coating coordinate set is extracted based on the device height point set and the circuit board reference coordinates, and then transformed to the circuit board reference coordinates through reference identifier matching. The no-coating coordinate set corresponds to the no-coating region coordinate set, which is the set of locations on the circuit board where the deposition of encapsulating material needs to be avoided. Specifically, the no-coating region coordinate set and the device height point set are aligned in the circuit board reference coordinates, and the coordinates of the device height point set falling within the range of the no-coating region coordinate set are extracted to form the no-coating coordinate set. When the boundary of the no-coating region coordinate set is adjacent to the device outline boundary, the no-coating coordinate set is extended by 0.2 mm to 1 mm along the outer side of the boundary of the no-coating region coordinate set. A larger value is taken when the risk of material accumulation at the edge of the narrow channel entrance is high, and a smaller value is taken when the risk is low, so as to cover the potential deposition locations of bounce and backflow at the entrance. Through the above processing, the no-coating coordinate set is expressed by the same coordinate system as the device height point set, which can provide clear spatial constraints in areas where accumulation and drift deposition are likely to occur at the entrance of narrow channels, thereby reducing the risk of electrical short circuits or poor contact caused by unexpected material deposition entering the no-coating region.

[0069] The region partitioning module is used to calculate the entry cutoff level based on the centerline coordinate set and the width set, calculate the drift candidate coordinate set based on the device height point set and the width set, and generate a restricted deposition partition table based on the entry cutoff level, the drift candidate coordinate set and the no-coating coordinate set.

[0070] Please see Figure 3 As shown, the process of calculating the entry cutoff level based on the centerline coordinate set and width set, calculating the drift candidate coordinate set based on the device height point set and width set, and generating a restricted deposition partition table based on the entry cutoff level, drift candidate coordinate set, and blackout coordinate set can be implemented in the following sub-steps.

[0071] The entrance direction of each narrow channel is determined based on the centerline coordinate set, and the centerline coordinate set is sequentially calibrated along the entrance direction to obtain the entrance endpoint and a continuous coordinate sequence along the entrance direction. Simultaneously, the width set corresponding one-to-one with this continuous coordinate sequence is read to obtain the entrance segment width sequence. The entrance segment width sequence is taken from the coordinate range of the centerline coordinate set closest to the entrance endpoint, and the coordinate range is determined by a preset entrance length, for example, 3 mm to 25 mm. When the device height point set shows dense changes in device height near the entrance, the range is 3 mm to 10 mm; when the device height point set shows sparse changes in device height near the entrance, the range is 10 mm to 25 mm. Through this process, the entrance endpoint, entrance direction, and entrance segment width sequence are unified under the same coordinate system of the centerline coordinate set. This concentrates the geometric contraction and changes at the entrance of the narrow channel into a controllable entrance segment range, reducing the interference of width changes outside the entrance segment on the entrance truncation judgment, thereby reducing the risk of thinner material deposition thickness inside the shaded area due to the entrance being truncated by the sidewall.

[0072] The entry truncation level is calculated based on the overall distribution of the entry segment width sequence and the width set. The entry truncation level is determined by comparing the entry segment width sequence and the width set. First, a reference width range for the deep section of the channel is selected from the width set. The deep section of the channel is a continuous coordinate range away from the entry endpoint from the centerline coordinate set. The reference width range is the width set within this continuous coordinate range, and the median of the reference width range is used to determine the reference width. Next, the equivalent entry width is determined from the entry segment width sequence. The equivalent entry width is taken as the lower quartile of the entry segment width sequence to reduce the interference of local widening of the entry segment on the judgment. The equivalent entry width is compared with the reference width, and the entry narrowing degree is determined based on the ratio of the equivalent entry width to the reference width. It is then graded according to a preset narrowing ratio, ranging from 0.6 to 0.9. A higher grading corresponds to a ratio of the equivalent entry width to the reference width not greater than 0.6, and a grading of the equivalent entry width to the reference width not greater than 0.6. The shape corresponds to the intermediate level of the entrance narrowing degree. The case where the ratio of the entrance equivalent width to the reference width is greater than 0.8 and not greater than 0.9 corresponds to the lower level of entrance narrowing degree. Based on the entrance narrowing degree classification, the entrance truncation level is further determined by combining the continuous length of the entrance segment width sequence. The continuous length is the coordinate length in the entrance segment width sequence that continuously satisfies the ratio of the entrance equivalent width to the reference width not greater than the preset narrowing ratio. The preset continuous length is 1 mm to 8 mm. If the continuous length is not less than the preset continuous length, the entrance truncation level is increased by one level. If the continuous length is less than the preset continuous length, the entrance truncation level remains unchanged. The value of the preset continuous length follows the selection rule of the fluctuation range of the width set near the entrance. When the fluctuation range of the width set near the entrance is small, the preset continuous length is 4 mm to 8 mm. When the fluctuation range of the width set near the entrance is large, the preset continuous length is 1 mm to 4 mm. Through the above processing, the inlet cutoff level is directly obtained from the centerline coordinate set and the width set. The comparison caliber of the inlet narrowing degree and the judgment caliber of the continuous length are clearly defined. Without relying on additional data, the geometric contraction degree of the narrow channel inlet can be uniformly classified. Thus, for channels with higher inlet cutoff levels, material accumulation at the inlet edge is preferentially suppressed and the probability of insufficient material deposition in the shaded area is reduced.

[0073] The candidate coordinate set for drift is calculated based on the device height point set and width set. First, at each coordinate point corresponding to the centerline coordinate set, the device outline boundary neighborhood on both sides of the channel is determined according to the width set. The device outline boundary neighborhood is the collection point coordinates that match the device height point set within half the width range of the centerline coordinate set in the horizontal direction. Then, the height gradient change set is extracted within the device outline boundary neighborhood. The height gradient change set is the height gradient value obtained by dividing the device height difference between adjacent device height point sets by the distance between adjacent collection points. Collection points whose height gradient value is not less than the ratio of a preset lower limit of height difference to the sampling distance are recorded as height gradient points. The preset lower limit of height difference is 0.2 mm to 2 mm, and the sampling distance is 0.2 mm to 2 mm. Subsequently, the concentration of height gradient points in the device outline boundary neighborhood is determined. The concentration determination establishes a determination window centered on the coordinate points of the centerline coordinate set. The axial length of the determination window along the centerline coordinate set is 1 mm to 8 mm. The proportion of height gradient points to the collection points in the device outline boundary neighborhood within the determination window is counted. The proportion is not less than the preset concentration ratio. The example is denoted as a concentrated distribution of height gradient changes, with a preset concentration ratio of 0.3 to 0.8. For cases where the device height point set changes densely and the sidewalls of the channel are more continuous, the ratio is 0.5 to 0.8. For cases where the device height point set changes sparsely and the sidewalls of the channel are less continuous, the ratio is 0.3 to 0.5. The height gradient change set and width set are then jointly screened. Areas where the width set is no greater than the preset lower limit and the height gradient change set is concentrated are denoted as drift-prone areas. The coordinates of these drift-prone areas under the circuit board reference coordinates are summarized to form a drift candidate coordinate set. This drift candidate coordinate set is a set of coordinates under the circuit board reference coordinates used to characterize the risk of secondary rebound and local backflow of the sealing material near the sidewalls of the narrow channel, leading to drift deposition to the outside of the channel. The preset lower limit of the width is 0.5 mm to 5 mm. When the narrow channel is mainly composed of fine-pitch devices, the preset lower limit of the width is 0.5 mm to 2 mm. When the narrow channel is mainly composed of connector housings and adjacent devices, the preset lower limit of the width is 2 mm to 5 mm. Through the above processing, the drift candidate coordinate set is obtained by the device height point set and width set together. The extraction scope and concentration judgment scope of the height gradient change set are clearly defined, which can identify the spatial areas where secondary rebound and local backflow are more likely to occur after the material hits the sidewall in advance, thereby reducing the risk of unexpected material deposition and covering the restricted area on the outside of the channel or the upwind side.

[0074] A drift risk constraint relationship is established based on the drift candidate coordinate set and the forbidden coating coordinate set, and this constraint relationship is introduced into the generation process of the restricted deposition zoning table. Specifically, under the circuit board reference coordinates, the drift candidate coordinate set and the forbidden coating coordinate set are determined by proximity determination. The proximity determination is constrained by a preset forbidden coating buffer distance. Coordinate points in the drift candidate coordinate set that fall within the buffer range of the forbidden coating coordinate set are marked as drift-sensitive coordinate points. The set of drift-sensitive coordinate points is used to determine the drift-sensitive segment. The preset forbidden coating buffer distance is, for example, 0.2 mm to 2 mm, and is determined according to the entry cutoff level. The entry cutoff level is divided into 3 levels: Level 1, Level 2, and Level 3. When the entry cutoff level is Level 3, the preset forbidden coating buffer distance is 1 mm to 2 mm; when the entry cutoff level is Level 2, the preset forbidden coating buffer distance is 0.6 mm to 1 mm; and when the entry cutoff level is Level 1, the preset forbidden coating buffer distance is 0.2 mm to 0.6 mm. Through the above processing, the spatial relationship between the drift candidate coordinate set and the no-coating coordinate set is quantified into drift-sensitive coordinate points, which can further link the risk of drift deposition from channel geometry problems to the constraints of the no-coating area, reducing the probability of electrical short circuits or poor contact caused by accumulation at the entrance edge and drift deposition entering the no-coating area.

[0075] A restricted sedimentation zoning table is generated based on the inlet cutoff level, the drift candidate coordinate set, and the forbidden fresco coordinate set. The restricted sedimentation zoning table uses the centerline coordinate set as an index to segment and label each narrow channel along the coordinate sequence of the centerline coordinate set. The inlet segment corresponding to the inlet cutoff level is labeled as the inlet cutoff segment, and the length of the inlet cutoff segment is determined by the inlet segment width sequence and the preset inlet length. The coordinate range in the centerline coordinate set that is outside the inlet cutoff segment and not covered by drift-sensitive coordinate points is labeled as the deep segment of the channel. The coordinate range in the centerline coordinate set that corresponds to the drift candidate coordinate set and contains drift-sensitive coordinate points is labeled as the drift-sensitive segment. Simultaneously, the correspondence between the inlet cutoff level and the drift candidate coordinate set, and the correspondence between the forbidden fresco coordinate set and the drift-sensitive segment are recorded in the restricted sedimentation zoning table. Through the above processing, the restricted deposition partition table unifies the restricted deposition risk caused by the entry cutoff level and the drift deposition risk caused by the drift candidate coordinate set into the same partition expression. It can distinguish different risk sources for narrow channel entry cutoff sections, deep channel sections and drift-sensitive sections, reduce the exposure of device pin roots and pad edges inside the shadow area due to insufficient material deposition, and at the same time reduce the risk of entry edge accumulation and drift deposition covering the uncoated coordinate set.

[0076] The instruction generation module generates a separation height sequence and an incident angle sequence based on the confined deposition zoning table and the inlet cutoff level. It also generates an injection discharge sequence, a guide airflow sequence, a recovery airflow sequence, and an inlet blocking trajectory based on the drift candidate coordinate set, and combines them to obtain the confined deposition instruction.

[0077] Based on the confined deposition zoning table and the inlet cutoff level, a separation height sequence and an incident angle sequence are generated. Based on the drift candidate coordinate set, an injection / discharge sequence, a guide airflow sequence, a recovery airflow sequence, and an inlet blocking trajectory are generated. These are combined to obtain the confined deposition command, which can be implemented according to the following sub-steps.

[0078] Read the inlet cutoff segment, deep segment, and drift-sensitive segment of each narrow channel in the restricted sedimentation zoning table, and read the corresponding inlet cutoff level for each narrow channel. Using the centerline coordinate set as an index, establish coordinate range lists for the inlet cutoff segment, deep segment, and drift-sensitive segment. Each record in the coordinate range list includes start and end coordinates and is associated with the inlet cutoff level. The inlet cutoff level is used to determine the extension length of the coordinate range list of the inlet cutoff segment in the direction of the inlet endpoint. The extension length is 1 mm to 6 mm. The width set is 3 mm to 6 mm when it is small and continuously small near the inlet, and 1 mm to 3 mm when the width set fluctuates greatly near the inlet. The lower limit of the clearance height of the inlet cutoff section is determined based on the coordinate range list and the device height point set. This lower limit is jointly determined by the maximum height of the device height point set corresponding to the inlet cutoff section and a preset minimum safety clearance. The preset minimum safety clearance ranges from 0.3 mm to 2 mm; for cases where the device height point set varies densely and the device outline at the inlet is densely packed, it ranges from 1 mm to 2 mm; for cases where the device height point set varies sparsely and the device outline at the inlet is sparsely packed, it ranges from 0.3 mm to 1 mm. The lower limit of the clearance height constrains the reachable space of the nozzle or needle near the inlet endpoint, avoiding collision risks due to insufficient collision avoidance at the inlet cutoff section. Through this process, the restricted deposition risk of narrow channels is transformed into a segmented coordinate range that includes inlet cutoff level constraints and lower limit clearance constraints, reducing the coexistence of insufficient material deposition in the shaded area and inlet accumulation caused by the superposition of inlet cutoff and collision avoidance lifting at the inlet of narrow channels.

[0079] The distance from the plate and the incident angle sequence are generated based on the list of entry cutoff levels and coordinate ranges. First, the value ranges of the distance from the plate and the incident angle sequence are determined. The distance from the plate is 0.8 mm to 12 mm. When the maximum height of the device height points on both sides of the narrow channel is high, the distance from the plate is 6 mm to 12 mm. When the maximum height of the device height points on both sides of the narrow channel is low, the distance from the plate is 0.8 mm to 6 mm. The incident angle sequence is 20 degrees to 80 degrees. When the width set is small and the entry cutoff level is high, the distance from the plate is 20 degrees to 50 degrees. When the width set is large and the entry cutoff level is low, the distance from the plate is 50 degrees to 80 degrees. Based on the entry cutoff level, within the aforementioned value range, the relative distribution relationship between the clearance height sequence and the incident angle sequence for the entry cutoff segment, the deep channel segment, and the drift-sensitive segment is determined. The clearance height sequence corresponding to the entry cutoff segment takes a smaller value range than that of the deep channel segment and the drift-sensitive segment, and the clearance height sequence corresponding to the entry cutoff segment is not less than the lower limit of the clearance height. The incident angle sequence corresponding to the entry cutoff segment takes a value range biased towards the extension direction of the centerline coordinate set and together with the lower limit of the clearance height satisfies the preset minimum safety clearance constraint. The clearance height sequence near the entry endpoint takes a continuous change to reduce the discrete jumps of collision avoidance lifting. The clearance height sequence corresponding to the deep channel segment takes a middle value range, and the incident angle sequence corresponding to the deep channel segment takes a value range consistent with the centerline coordinate set. The clearance height sequence corresponding to the drift-sensitive segment takes a larger value range than that of the deep channel segment and remains continuous near the drift candidate coordinate set. The incident angle sequence corresponding to the drift-sensitive segment takes a value range that reduces lateral spraying. Through the above processing, the distance height sequence within the entrance truncation section is subject to a collision avoidance lower limit as a hard constraint and is minimized within the hard constraint range. The incident angle sequence within the entrance truncation section works in conjunction with the distance height sequence to meet the preset minimum safety gap constraint. The sidewall truncation of fog or micelles caused by the entrance truncation is reduced, the probability of thinner deposition inside the shadow area and thicker accumulation at the entrance edge is reduced, and the collision risk at the entrance is kept within a controlled range.

[0080] An entry barrier trajectory is generated based on a drift candidate coordinate set. First, the paint-free coordinate set is read in the circuit board reference coordinate system. A paint-free buffer distance is established using this coordinate set as the boundary. For example, the paint-free buffer distance is 0.2 mm to 2 mm. When the entry cutoff level is high and the drift candidate coordinate set is close to the paint-free coordinate set, it is 1 mm to 2 mm; when the entry cutoff level is low and the drift candidate coordinate set is far from the paint-free coordinate set, it is 0.2 mm to 1 mm. Then, proximity determination is performed between the drift candidate coordinate set and the paint-free coordinate set. The coordinate points of the drift candidate coordinate set that satisfy the paint-free buffer distance constraint are marked as drift-sensitive coordinate points. An entry barrier trajectory is generated outside the boundary of the paint-free coordinate set along the distribution direction of the drift-sensitive coordinate points. The entry barrier trajectory is a set of continuous trajectory coordinate points, and the trajectory coordinate points maintain the paint-free buffer distance from the paint-free coordinate set. The width of the entry barrier trajectory is, for example, 0.2 mm to 1 mm. When the device outline boundaries near the blackout coordinate set are relatively dense, it is 0.2 mm to 0.5 mm; when the device outline boundaries near the blackout coordinate set are relatively sparse, it is 0.5 mm to 1 mm. This step forms a clear spatial barrier boundary around the blackout coordinate set, reducing the risk of short circuits or poor contact caused by material accumulation and drift deposition at the entry edge expanding outwards from the blackout coordinate set.

[0081] An injection / ejection sequence is generated based on the drift candidate coordinate set. First, the drift candidate coordinate set is mapped to a list of coordinate ranges for the centerline coordinate set, resulting in the centerline coordinate set position set corresponding to the drift candidate coordinate set. A transition length is reserved outside the position set, for example, 0.5 mm to 5 mm. This transition length is 0.5 mm to 2 mm when the width set is small and the device height point set changes densely, and 2 mm to 5 mm when the width set is large and the device height point set changes sparsely. Subsequently, multiple injection coordinate ranges are generated within the deep section of the channel according to the position sequence of the centerline coordinate set. Each injection coordinate range avoids the drift-sensitive section and maintains a gap with the inlet cutoff section, for example, 0.5 mm to 4 mm. The gap is 2 mm to 4 mm for higher inlet cutoff levels and 0.5 mm to 2 mm for lower inlet cutoff levels. Each injection coordinate range is assigned a discharge rhythm, primarily consisting of short, multiple discharges. The number of short, multiple discharges ranges from 2 to 12. When the width set is small and the drift candidate coordinate set is dense, the number of discharges is 6 to 12; when the width set is large and the drift candidate coordinate set is sparse, the number of discharges is 2 to 6, forming an injection-discharge sequence. This step transforms the material delivery in the deep section of the channel from a single continuous discharge to segmented injection-discharge, reducing rebound and backflow accumulation after a single impact on the sidewall, thereby mitigating the coexistence of thin deposition within the shaded area and drift deposition outside the channel.

[0082] Based on the drift candidate coordinate set, a guiding airflow sequence and a recovery airflow sequence are generated, and combined with the clearance height sequence, incident angle sequence, injection / discharge sequence, and inlet barrier trajectory to obtain a confined deposition command. The guiding airflow sequence is arranged along the inlet direction of the centerline coordinate set, and a larger value is assigned to the centerline coordinate set position set corresponding to the inlet cutoff section and the deep section of the channel, for example, a value of 0.2 to 1.5. When the inlet cutoff level is high, a value of 0.8 to 1.5 is used, and when the inlet cutoff level is low, a value of 0.2 to 0.8 is used to form traction along the channel direction at the entrance of the narrow channel. The recovery airflow sequence is arranged around the drift candidate coordinate set, and a larger value is assigned to the drift sensitive section and the area around the drift sensitive coordinate point, for example, a value of 0.2 to 2. When the proximity between the drift candidate coordinate set and the uncoated coordinate set is high, a value of 1 to 2 is used, and when the proximity is low, a value of 0.2 to 1 is used to form directional recovery on the outside of the channel. Subsequently, the clearance height sequence and incident angle sequence are aligned with the guiding airflow sequence and recovery airflow sequence according to the centerline coordinate set index. The injection / emission sequence and inlet barrier trajectory are then concatenated according to the coordinate range list to form a restricted deposition instruction. This instruction includes a unified time sequence of the clearance height sequence, incident angle sequence, injection / emission sequence, guiding airflow sequence, recovery airflow sequence, and inlet barrier trajectory. This step incorporates both restricted deposition risk and drift deposition risk into the same restricted deposition instruction, reducing insufficient protection caused by the difficulty of material entry into deeper sections of the channel, while also reducing the risk of drift deposition covering the restricted coating coordinate set due to rebound and backflow.

[0083] The instruction execution module is used to drive the nozzle or needle according to the separation height sequence, incident angle sequence and restricted deposition instruction. The nozzle or needle forms an inlet barrier layer along the inlet barrier trajectory. The inlet barrier layer forms a continuous barrier band outside the restricted coating coordinate set to restrict the sealing material from entering the corresponding area of ​​the restricted coating coordinate set. It performs injection deposition according to the injection discharge sequence and the guiding airflow sequence, and suppresses the drift candidate coordinate set according to the recovery airflow sequence.

[0084] The nozzle or needle is driven by a sequence of plate height, incident angle, and restricted deposition command, and an inlet barrier layer is formed along the inlet barrier trajectory. The injection deposition and drift suppression are completed according to the injection discharge sequence, the guiding airflow sequence, and the recovery airflow sequence. This can be implemented in the following sub-steps.

[0085] Read the off-board height sequence, incident angle sequence, inlet blocking trajectory, injection / ejection sequence, guide airflow sequence, and recycle airflow sequence from the confined deposition command, and align these contents uniformly under the circuit board reference coordinates. The alignment method is to use the coordinate order of the centerline coordinate set as the position order and the time order given by the confined deposition command as the action order, thereby obtaining the off-board height sequence value and incident angle sequence value corresponding to each position of the nozzle or needle, and obtaining the injection / ejection sequence value, guide airflow sequence value, and recycle airflow sequence value corresponding to that position. The recommended difference between adjacent values ​​of the off-board height sequence is 0.1 mm to 2 mm. For narrow channels with dense changes in device height points and small width sets, the difference should be 0.1 mm to 0.6 mm. For narrow channels with sparse changes in device height points and large width sets, the difference should be 0.6 mm to 2 mm. This is to avoid the nozzle or needle from rapidly changing the off-board height sequence near narrow channels, which would cause additional collision avoidance lifting. Through the above processing, the restricted deposition command is converted into a continuous action sequence consistent with the circuit board reference coordinates, reducing the forced elevation of the nozzle or needle at the narrow channel entrance due to the discontinuous elevation sequence, and reducing insufficient material deposition in the shadow area caused by the mist or micelles being cut off by the sidewall before the entrance.

[0086] The nozzle or needle is driven to move along the inlet barrier trajectory according to a continuous action sequence, and inlet barrier layer deposition is performed within the coordinate range covered by the inlet barrier trajectory. The inlet barrier trajectory maintains a coating-free buffer distance from the coating-free coordinate set in the circuit board reference coordinates. The coating-free buffer distance is recommended to be 0.2 mm to 2 mm. When the inlet cutoff level is high and the drift candidate coordinate set is close to the coating-free coordinate set, it is 1 mm to 2 mm. When the inlet cutoff level is low and the drift candidate coordinate set is far from the coating-free coordinate set, it is 0.2 mm to 1 mm. The trajectory width of the inlet barrier trajectory is recommended to be 0.2 mm to 1 mm. In areas with dense device outline boundaries and small width sets, it is 0.2 mm to 0.5 mm. In areas with sparse device outline boundaries and large width sets, it is 0.5 mm to 1 mm. During inlet barrier layer deposition, the distance from the board height sequence takes the smaller value range corresponding to the inlet cutoff level, and the incident angle sequence takes the value range biased towards the inlet direction of the center line coordinate set to reduce lateral spraying near the inlet and maintain a clear boundary of the inlet barrier layer. Through the above treatment, the entrance barrier layer forms a continuous restriction zone outside the no-coating coordinate set, reducing the probability of material accumulation at the channel entrance edge expanding outwards into the no-coating coordinate set, and reducing the risk of short circuits or poor contact caused by the deposition and coverage of the no-coating coordinate set by unexpected materials.

[0087] After the inlet barrier layer is formed, the nozzle or needle is driven into the centerline coordinate set corresponding to the deep section of the channel according to the continuous action sequence obtained in the first step, and injection deposition is performed according to the injection-discharge sequence and the guiding airflow sequence. The injection-discharge sequence is mainly short-duration multiple times, with a recommended number of 2 to 12 times. For narrow channels with a small width set and a dense drift candidate coordinate set, 6 to 12 times are used, and for narrow channels with a large width set and a sparse drift candidate coordinate set, 2 to 6 times are used. The guiding airflow sequence is arranged along the inlet direction of the centerline coordinate set, and takes a larger value range at the position corresponding to the inlet cutoff section and the deep section of the channel. The recommended value of the guiding airflow sequence is 0.2 to 1.5. When the inlet cutoff level is high, 0.8 to 1.5 is used, and when the inlet cutoff level is low, 0.2 to 0.8 is used. During the injection deposition process, the clearance height sequence takes the middle value range corresponding to the deep section of the channel, and the incident angle sequence takes the value range consistent with the centerline coordinate set to reduce sidewall impact and reduce the source of rebound. Through the above processing, the material transport in the narrow channel is changed from restricted deposition dominated by inlet cut-off to injection deposition dominated by guided airflow sequence traction and segmented injection sequence injection, reducing the probability of thin material deposition at the root of device pins and edge of pads inside the shadow area.

[0088] After the injection deposition covers the deep section of the channel, the nozzle or needle moves along the centerline coordinate set corresponding to the drift candidate coordinate set according to the separation height sequence and the incident angle sequence, and performs directional recovery of the area corresponding to the drift candidate coordinate set according to the recovery airflow sequence. The recovery airflow sequence is arranged around the drift candidate coordinate set, taking a larger value range in the area adjacent to the drift candidate coordinate set and the uncoated coordinate set. The recommended value for the recovery airflow sequence is 0.2 to 2. When the drift candidate coordinate set is close to the uncoated coordinate set and the uncoated buffer distance is a large value, the recovery airflow sequence is 1 to 2. When the drift candidate coordinate set is far from the uncoated coordinate set and the uncoated buffer distance is a small value, the recovery airflow sequence is 0.2 to 1. At the same time, the incident angle sequence takes a value range that reduces lateral spraying at the corresponding position of the drift sensitive section, and the separation height sequence takes a larger value range at the corresponding position of the drift sensitive section, so as to reduce the material impacting the sidewall and flowing back along the sidewall and redepositing outside the channel. Through the above processing, the small droplets carried by the rebound and reflux corresponding to the drift candidate coordinate set are guided away from the easy deposition area by the recovery airflow sequence, reducing the probability of unexpected material deposition on the outer side of the channel or the upwind side and covering the uncoated coordinate set.

[0089] During the continuous execution of the inlet barrier layer, injection deposition, and drift suppression, the separation height sequence, incident angle sequence, injection discharge sequence, guide airflow sequence, and recovery airflow sequence are switched between segments according to the time sequence given by the restricted deposition command. A transition length is introduced at the adjacent boundaries of the inlet cutoff section, the deep channel section, and the drift-sensitive section. The recommended transition length is 0.5 mm to 5 mm. When the width set is small and the device height point set changes densely, the length is 0.5 mm to 2 mm. When the width set is large and the device height point set changes sparsely, the length is 2 mm to 5 mm. Within the transition length range, the adjacent value difference of the separation height sequence and the adjacent value difference of the incident angle sequence are both taken to be small. The recommended adjacent value difference of the incident angle sequence is 2 degrees to 15 degrees. When the inlet cutoff level is high, the length is 2 degrees to 8 degrees. When the inlet cutoff level is low, the length is 8 degrees to 15 degrees to reduce local spraying and local accumulation at the inlet edge due to attitude switching. At the same time, the coating-free buffer distance between the inlet barrier layer and the coating-free coordinate set is kept constant to maintain the restrictive effect of the inlet barrier layer on the coating-free coordinate set. Through the above treatment, the switching of actions inside and outside the narrow channel is completed within the transition length, reducing the probability of excessive material accumulation at the entrance edge and drift deposition and diffusion, and reducing the simultaneous occurrence of insufficient protection in the shadow area and contamination of the restricted coordinate set.

[0090] The results output module is used to output the final solidification record data.

[0091] Using the circuit board reference coordinates as a unified coordinate basis, the coordinates of the device height point set, centerline coordinate set, width set, and blackout coordinate set are normalized. The inlet cutoff level, drift candidate coordinate set, and restricted deposition partition table are then correlated and organized according to the coordinate order of the centerline coordinate set. Simultaneously, the sequence of board clearance height, incident angle, injection / ejection, guiding airflow, and recovery airflow, along with the inlet obstruction trajectory, are organized. Restricted deposition commands are used as the temporal sequence carrier for the above data, resulting in the basic content of the sealant record data. The risk information corresponding to the inlet cutoff level and drift candidate coordinate set of narrow channels is consistently expressed with the constraint information of the blackout coordinate set under the same coordinate system, reducing inlet accumulation expansion and drift deposition offset caused by inconsistent coordinate sources.

[0092] The coordinate order of the centerline coordinate set is used as the recording order of the sealed record data. Recording coordinate points are selected on the centerline coordinate set according to the sampling interval, and the width set is synchronously measured at the recording coordinate points. For example, the sampling interval is 0.2 mm to 2 mm. For narrow channels with a small width set and dense changes in device height points, the interval is 0.2 mm to 0.8 mm. For narrow channels with a large width set and sparse changes in device height points, the interval is 0.8 mm to 2 mm. Then, at each recording coordinate point, the inlet truncation level, the segmentation label of the confined deposition partition table, and the proximity relationship of the drift candidate coordinate set are associated to form the coordinate granularity expression of the sealed record data. The recording coordinate points provide sufficient spatial resolution for the narrow channel inlet and sidewall neighborhood, reducing the difficulty in locating the source of deposition heterogeneity caused by the inlet truncation section and drift-sensitive section being masked by coarse-grained recording.

[0093] Based on the confined deposition zoning table, the starting and ending coordinates of the inlet cutoff section, the deep channel section, and the drift-sensitive section are marked in the solidification record data, and the inlet cutoff level and the inlet cutoff section are recorded in pairs. Simultaneously, based on the no-coating buffer distance between the drift candidate coordinate set and the no-coating coordinate set, the drift-sensitive coordinate points are marked in the solidification record data, and the relative positional relationship between the inlet barrier trajectory and the no-coating coordinate set is recorded. The no-coating buffer distance is, for example, 0.2 mm to 2 mm; 1 mm to 2 mm when the inlet cutoff level is high and the drift candidate coordinate set is close to the no-coating coordinate set; and 0.2 mm to 1 mm in other cases. This clarifies the risk of material accumulation at the inlet edge and the risk of contamination of the no-coating coordinate set in the form of segmented boundaries, reducing the obscuration of the no-coating coordinate set due to unclear inlet barrier layer limitations, and reducing the unexpected material deposition and diffusion caused by unclear drift candidate coordinate set boundaries.

[0094] According to the time sequence of the restricted deposition command, the time sequence of the nozzle or needle forming the inlet barrier layer along the inlet barrier trajectory is recorded in the solidification record data. The time sequence of the nozzle or needle performing injection deposition according to the injection-emission sequence and the guide airflow sequence is also recorded. The time sequence of the nozzle or needle suppressing the drift candidate coordinate set according to the recovery airflow sequence is also recorded. At the recorded coordinate point corresponding to each time sequence, the values ​​of the separation height sequence and the incident angle sequence are recorded simultaneously. The values ​​of the injection-emission sequence, the guide airflow sequence, or the recovery airflow sequence corresponding to these values ​​are also recorded. When there is an inter-segment switching between the inlet cut-off section, the deep section of the channel, and the drift-sensitive section, the transition length is recorded in the solidification record data. The transition length is, for example, 0.5 mm to 5 mm. When the width set is small and the device height point set changes densely, it is 0.5 mm to 2 mm. In other cases, it is 2 mm to 5 mm. Transparenting the intra-segment values ​​and inter-segment switching process of the plate height sequence and incident angle sequence reduces local spraying and local accumulation at the entrance edge caused by excessively rapid inter-segment switching, while also reducing drift deposition shift caused by attitude changes near drift-sensitive segments.

[0095] The aforementioned basic content, coordinate granularity expression, segment boundary annotation, and time sequence records are summarized to form the final sealing record data. This final sealing record data includes the circuit board reference coordinates, device height point set, centerline coordinate set, width set, blackout coordinate set, inlet cutoff level, drift candidate coordinate set, restricted deposition partition table, off-board height sequence, incident angle sequence, injection / ejection sequence, guiding airflow sequence, recovery airflow sequence, inlet barrier trajectory, coordinate range corresponding to the inlet barrier layer, coordinate range corresponding to injection deposition, and the time sequence of restricted deposition commands. The final sealing record data is then output. This unifies the two key risks of inlet cutoff and drift deposition in the narrow channel restricted deposition mode with blackout coordinate set constraints and the nozzle or needle's off-board height sequence and incident angle sequence into a reusable process basis, reducing the probability of thinner shadow area deposition and blackout coordinate set contamination occurring simultaneously in different batches within the same narrow channel.

[0096] Example 2:

[0097] Please see Figure 2 As shown, this embodiment provides an automatic sealing method for circuit boards, including:

[0098] The device height is collected to obtain a device height point set, and the centerline coordinate set, width set, and blackout coordinate set are extracted from the device height point set;

[0099] The entry cutoff level is calculated based on the centerline coordinate set and the width set. The drift candidate coordinate set is calculated based on the device height point set and the width set. A restricted deposition partition table is generated based on the entry cutoff level, the drift candidate coordinate set, and the no-coating coordinate set.

[0100] Based on the confined deposition zoning table and the inlet cutoff level, the separation height sequence and the incident angle sequence are generated. Based on the drift candidate coordinate set, the injection and discharge sequence, the guiding airflow sequence, the recovery airflow sequence and the inlet blocking trajectory are generated and combined to obtain the confined deposition command.

[0101] The nozzle or needle is driven according to the separation height sequence, incident angle sequence and restricted deposition command. The nozzle or needle forms an inlet barrier layer along the inlet barrier trajectory. The inlet barrier layer forms a continuous barrier band outside the forbidden coating coordinate set to restrict the sealing material from entering the corresponding area of ​​the forbidden coating coordinate set. The injection deposition is carried out according to the injection discharge sequence and the guiding airflow sequence. The drift candidate coordinate set is suppressed according to the recovery airflow sequence.

[0102] Output the final solid seal record data.

[0103] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

[0104] In conclusion, the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An automatic sealing method for circuit boards, characterized in that, include: The device height is collected to obtain a device height point set, and the centerline coordinate set, width set, and blackout coordinate set are extracted from the device height point set; The entry cutoff level is calculated based on the centerline coordinate set and the width set. The drift candidate coordinate set is calculated based on the device height point set and the width set. A restricted deposition partition table is generated based on the entry cutoff level, the drift candidate coordinate set, and the no-coating coordinate set. Based on the confined deposition zoning table and the inlet cutoff level, a separation height sequence and an incident angle sequence are generated. Based on the drift candidate coordinate set, an injection discharge sequence, a guide airflow sequence, a recovery airflow sequence, and an inlet blocking trajectory are generated. The separation height sequence, incident angle sequence, injection discharge sequence, guide airflow sequence, recovery airflow sequence, and inlet blocking trajectory are combined to obtain the confined deposition command. The nozzle or needle is driven according to the separation height sequence, incident angle sequence and restricted deposition command. The nozzle or needle forms an inlet barrier layer along the inlet barrier trajectory. The inlet barrier layer forms a continuous barrier band outside the forbidden coating coordinate set to restrict the sealing material from entering the corresponding area of ​​the forbidden coating coordinate set. The injection deposition is carried out according to the injection discharge sequence and the guiding airflow sequence. The drift candidate coordinate set is suppressed according to the recovery airflow sequence. Output the final solid seal record data.

2. The automatic sealing method for a circuit board according to claim 1, characterized in that, The injection-out sequence is used for injection deposition.

3. The automatic sealing method for a circuit board according to claim 1, characterized in that, Methods for obtaining the centerline coordinate set, width set, and blackout coordinate set include: The positioning camera is used to frame the circuit board, extract the image position of the preset reference mark on the circuit board, and obtain the reference coordinates of the circuit board by combining the circuit board clamping position. The preset safety height is then set according to the reference coordinates of the circuit board. Under the constraints of the circuit board reference coordinates and the preset safety height, the drive nozzle or needle is used to scan along the preset safety height. The distance sensor from the board collects the height of the device point by point. The coordinates of the collected points are determined by the circuit board reference coordinates to form a set of device height points. Extract the device outline boundary based on the device height point set; The centerline coordinate set is extracted from the circuit board reference coordinates based on the device outline boundary. The width set is the sum of the lateral distances from each coordinate point on the centerline coordinate set to the device outline boundaries on both sides, and the width set is formed in the order of the centerline coordinate set. Align the coordinate set of the blackout area with the coordinate set of device height points under the circuit board reference coordinate system, and extract the coordinates of the device height points that fall within the range of the blackout area coordinate set to form the blackout coordinate set.

4. The automatic sealing method for a circuit board according to claim 1, characterized in that, Methods for generating restricted sedimentary partition tables include: The entrance direction of the narrow passage is determined based on the centerline coordinate set, and the centerline coordinate set is sequentially calibrated in the entrance direction to obtain the entrance endpoint and continuous coordinate sequence. The width set corresponding to the continuous coordinate sequence is read, and the entrance segment width sequence is selected from the continuous coordinate sequence according to the preset entrance length. The reference width range of the deep section of the channel is determined based on the inlet segment width sequence and width set, and the inlet cutoff level is determined based on the inlet segment width sequence and reference width range. The device outline boundary neighborhood is determined based on the device height point set and width set. The height gradient change set is extracted based on the device outline boundary neighborhood. The drift-prone area is determined based on the height gradient change set and width set. The drift-prone area coordinates under the circuit board reference coordinates are summarized to obtain the drift candidate coordinate set. In the circuit board reference coordinate system, the proximity determination of the drift candidate coordinate set and the uncoated coordinate set is performed to obtain the drift sensitive coordinate points; Using the centerline coordinate set as an index, the narrow channel is segmented and labeled based on the inlet cutoff level, drift candidate coordinate set, forbidden coating coordinate set, and drift sensitive coordinate points to obtain a restricted sedimentation zoning table.

5. The automatic sealing method for a circuit board according to claim 1, characterized in that, The restricted sedimentary zoning table includes the entrance cutoff section, the deep section of the channel, and the drift-sensitive section.

6. The automatic sealing method for a circuit board according to claim 5, characterized in that, Methods for obtaining constrained deposition instructions include: Read the entry cutoff level and establish a list of coordinate ranges for the entry cutoff segment, the deep channel segment, and the drift-sensitive segment based on the centerline coordinate set; The range of values ​​for the height-off-board sequence and the range of values ​​for the incident angle sequence are determined based on the list of entry cutoff levels and coordinate ranges. The height-off-board sequence and the incident angle sequence are obtained by assigning values ​​to the segmented positions of the entry cutoff segment, the deep channel segment, and the drift-sensitive segment in the list of coordinate ranges. Under the reference coordinates of the circuit board, the set of coordinates to be restricted and the buffer distance to be restricted are read. The drift candidate coordinate set and the set of coordinates to be restricted are determined to obtain the drift sensitive coordinate points. The entrance blocking trajectory is generated based on the drift sensitive coordinate points. The drift candidate coordinate set is mapped to the coordinate range list to obtain the centerline coordinate set position set. Based on the centerline coordinate set position set, the injection coordinate range is generated in the deep section of the channel and the discharge rhythm is assigned to obtain the injection and discharge sequence. The guiding airflow sequence is generated based on the centerline coordinate set and the recovery airflow sequence is generated based on the drift-sensitive coordinate points. The restricted deposition command is obtained by combining the off-plate height sequence, incident angle sequence, injection and discharge sequence, guiding airflow sequence, recovery airflow sequence and inlet barrier trajectory.

7. The automatic sealing method for a circuit board according to claim 5, characterized in that, The nozzle or needle is driven according to the sequence of clearance height, the sequence of incident angles, and the restricted deposition command. The nozzle or needle forms an inlet barrier layer along the inlet barrier trajectory. The inlet barrier layer forms a continuous barrier band outside the inlet coating coordinate set. The method to restrict the entry of the sealing material into the corresponding area of ​​the inlet coating coordinate set includes: Under the reference coordinates of the circuit board, the restricted deposition instructions are read, and the position order is taken as the coordinate order of the center line coordinate set and the action order is taken as the action order to obtain a continuous action sequence. The nozzle or needle is driven to move along the inlet barrier trajectory based on a continuous action sequence and perform inlet barrier layer deposition within the coordinate range covered by the inlet barrier trajectory. The inlet barrier trajectory maintains a no-coating buffer distance from the no-coating coordinate set.

8. The automatic sealing method for a circuit board according to claim 1, characterized in that, The method of injection deposition based on the injection-out sequence and the guiding gas flow sequence, and suppression of drift candidate coordinate sets based on the recovery gas flow sequence, includes: Based on the continuous action sequence, the nozzle or needle is driven to enter the centerline coordinate set corresponding to the deep section of the channel, and injection deposition is performed according to the injection and discharge sequence and the guiding airflow sequence; The nozzle or needle is driven to move along the centerline coordinate set corresponding to the drift candidate coordinate set based on a continuous action sequence, and directional recovery is performed on the area corresponding to the drift candidate coordinate set according to the recovery airflow sequence. According to the time sequence of the restricted deposition command, the separation height sequence, incident angle sequence, injection and discharge sequence, guide airflow sequence and recovery airflow sequence are switched between segments, and a transition length is introduced at the adjacent boundary of the inlet cut-off segment, the deep channel segment and the drift sensitive segment.

9. The automatic sealing method for a circuit board according to claim 1, characterized in that, Methods for outputting sealed record data include: Using the circuit board reference coordinates as a unified coordinate basis, the device height point set, center line coordinate set, width set and anti-coating coordinate set are normalized. The entry cutoff level, drift candidate coordinate set and restricted deposition partition table are associated and organized according to the coordinate order of the center line coordinate set. The restricted deposition command is used as the time sequence carrier to obtain the basic content of the solid seal record data. The coordinate order of the centerline coordinate set is used as the recording order of the solidified record data. Record coordinate points are selected on the centerline coordinate set according to the sampling interval, and the width set value is obtained synchronously at the record coordinate points. Based on the correlation between the record coordinate points and the inlet truncation level, the segmented labeling of the restricted sedimentation partition table and the proximity relationship of the drift candidate coordinate set, the coordinate granularity expression of the solidified record data is obtained. Based on the restricted sedimentation zoning table, the starting and ending coordinates of the inlet cut-off segment, the deep channel segment, and the drift-sensitive segment are marked in the solidification record data. The inlet cut-off level and the inlet cut-off segment are recorded in pairs. The drift-sensitive coordinate points are marked based on the no-coating buffer distance between the drift candidate coordinate set and the no-coating coordinate set, and the relative positional relationship between the inlet blocking trajectory and the no-coating coordinate set is recorded. Record the time sequence of the nozzle or needle forming the inlet barrier layer along the inlet barrier trajectory according to the time sequence of the restricted deposition command, the time sequence of injection deposition according to the injection-discharge sequence and the guiding airflow sequence, and the time sequence of the candidate coordinate set for suppressing drift according to the recovery airflow sequence. Record the values ​​of the plate height sequence and the incident angle sequence, as well as the corresponding values ​​of the injection-discharge sequence, guiding airflow sequence, or recovery airflow sequence at the recorded coordinate points. Record the transition length when there is a segment switching between the inlet cut-off section, the deep section of the channel, and the drift-sensitive section. The basic content, coordinate granularity, segmentation annotation, and time sequence records of the solidified record data are summarized to form the final solidified record data and output.

10. An automatic sealing system for a circuit board, used to implement the automatic sealing method for a circuit board according to any one of claims 1-9, characterized in that, include: The data acquisition module is used to collect the device height to obtain the device height point set, and extract the center line coordinate set, width set, and blackout coordinate set from the device height point set; The region partitioning module is used to calculate the entry cutoff level based on the centerline coordinate set and the width set, calculate the drift candidate coordinate set based on the device height point set and the width set, and generate a restricted deposition partitioning table based on the entry cutoff level, the drift candidate coordinate set and the no-coating coordinate set. The instruction generation module generates a separation height sequence and an incident angle sequence based on the confined deposition zoning table and the inlet cutoff level. It also generates an injection and discharge sequence, a guide airflow sequence, a recovery airflow sequence, and an inlet blocking trajectory based on the drift candidate coordinate set. The separation height sequence, incident angle sequence, injection and discharge sequence, guide airflow sequence, recovery airflow sequence, and inlet blocking trajectory are combined to obtain the confined deposition instruction. The instruction execution module is used to drive the nozzle or needle according to the separation height sequence, incident angle sequence and restricted deposition instruction. The nozzle or needle forms an inlet barrier layer along the inlet barrier trajectory. The inlet barrier layer forms a continuous barrier band outside the restricted coating coordinate set to restrict the sealing material from entering the corresponding area of ​​the restricted coating coordinate set. It performs injection deposition according to the injection discharge sequence and the guiding airflow sequence, and suppresses the drift candidate coordinate set according to the recovery airflow sequence. The results output module is used to output the final solidification record data.

Images