Self-heat-dissipation type pump valve module for automobile seat

Abstract

The invention discloses a self-heat-dissipation type pump valve module for an automobile seat, and the self-heat-dissipation type pump valve module comprises an air source body which comprises a driving part and a compression assembly, the driving part is provided with a first driving end and a second driving end, and the first driving end is connected with the compression assembly; the thermal action control valve group is connected with the air source body and controls opening and closing through the thermal actuation memory alloy wire; and the airflow driving part is arranged at the second driving end, can rotate along with the second driving end and is used for driving air at the position of the thermal actuating memory alloy wire to flow so as to dissipate heat when the self-heat-dissipation type pump valve module is arranged in the automobile seat and works. According to the self-heat-dissipation type pump valve module, the driving piece is used for driving the compression assembly to compress gas and also used for driving the airflow driving part to dissipate heat, the heat dissipation effect of the thermal actuation memory alloy wire in the limited space is improved, the accuracy and sensitivity of driving opening and closing of the thermal actuation memory alloy wire are improved, and the service life of the thermal actuation memory alloy wire is prolonged. And the self-heat-dissipation type pump valve module is simple in overall structure and small in occupied space.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of vehicles, and more particularly to a self-heat-dissipation pump valve module for a car seat. BACKGROUND

[0002] The pump valve module generates heat during operation, and the pump valve module is mainly used to be installed in the cavity of the car seat cushion or backrest, so that the pump valve module is in a volume-limited space, which causes the heat to easily accumulate in the pump valve module and cannot be discharged, and the heat continues to rise. However, the normal operation of the pump valve module requires a certain temperature range, so how to dissipate heat is a problem to be solved.

[0003] In the related art, a heat dissipation fan is additionally provided for heat dissipation, but the heat dissipation fan occupies a large space in the car seat, and it is difficult to meet the installation requirements of the narrow installation space in the car seat. SUMMARY

[0004] The present application aims to at least solve one of the technical problems existing in the prior art. To this end, the present application provides a self-heat-dissipation pump valve module for a car seat, which can dissipate heat from the heat-actuated memory alloy wire and occupies a small space.

[0005] The self-heat-dissipation pump valve module for a car seat according to the embodiment of the present application comprises: a gas source body comprising a driving member and a compression assembly, the driving member being provided with a first driving end and a second driving end, the first driving end being connected with the compression assembly to drive the compression assembly to compress gas; a heat-acting control valve group connected with the gas source body, the heat-acting control valve group being controlled to open and close by a heat-actuated memory alloy wire; and an airflow driving part provided on the second driving end and rotatable with the second driving end, for driving air flow at the heat-actuated memory alloy wire to dissipate heat when the self-heat-dissipation pump valve module is arranged inside the car seat and operates.

[0006] According to the self-heat-dissipation pump valve module of the embodiment of the present application, the driving member of the gas source body is not only used to drive the compression assembly to compress gas, but also used to drive the airflow driving part to dissipate heat, which is conducive to improving the heat dissipation effect of the heat-actuated memory alloy wire in the limited space, improving the accuracy and sensitivity of the opening and closing of the heat-actuated memory alloy wire, and the overall structure of the self-heat-dissipation pump valve module is simple and occupies a small space, which is conducive to meeting the installation requirements of the limited space of the car seat.

[0007] In addition, the self-heat-dissipation pump valve module according to the above-mentioned embodiments of the present application can also have the following additional technical features: According to some embodiments of the present invention, the thermal action control valve assembly includes a valve body, the valve body being disposed axially at one end of the air source body in the drive member, the thermally actuated memory alloy wire being located radially on one side of the air source body in the drive member, one end of the thermally actuated memory alloy wire being connected to the valve body in the axial direction of the drive member, and the airflow drive part being located axially on one side of the thermally actuated memory alloy wire in the drive member.

[0008] According to some embodiments of the present invention, there are multiple thermal action control valve groups, and the thermally actuated shape memory alloy wires of the multiple thermal action control valve groups are located on the periphery of the gas source body.

[0009] According to some embodiments of the present invention, the self-cooling pump valve module further includes a circuit board, wherein the airflow driving part is located between the circuit board and the driving member, or the driving member and the airflow driving part are respectively located on both sides of the circuit board.

[0010] According to some embodiments of the present invention, the driving member and the airflow driving part are respectively disposed on both sides of the circuit board, the circuit board is provided with mounting through holes, the second driving end passes through the mounting through holes and is connected to the airflow driving part, and the thermally actuated memory alloy wire is electrically connected to the circuit board.

[0011] According to some embodiments of the present invention, a self-cooling pump valve module includes a mounting base mounted on the side of the circuit board near the airflow drive unit, the mounting base defining a receiving cavity in which the airflow drive unit is located.

[0012] According to some embodiments of the present invention, one of the circuit board and the mounting base is provided with a mounting hole, and the other is provided with a mounting post inserted into the mounting hole.

[0013] According to some embodiments of the present invention, the mounting base has a cavity inlet communicating with the receiving cavity, and the mounting base has a cavity outlet or forms a cavity outlet after being mounted with the circuit board, wherein the cavity inlet is located on the side of the airflow driving part facing away from the circuit board, and / or the cavity inlet is located on the side of the airflow driving part close to the circuit board.

[0014] According to some embodiments of the present invention, the circuit board is provided with ventilation holes.

[0015] According to some embodiments of the present invention, the mounting base has a cavity inlet communicating with the receiving cavity, and the mounting base forms a cavity outlet after being installed with the circuit board. A flow guide is provided between the cavity inlet or the cavity outlet and the thermo-actuated memory alloy wire, and the flow guide is used to guide the airflow between the cavity inlet or the cavity outlet and the thermo-actuated memory alloy wire.

[0016] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0017] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a schematic diagram of the structure of a self-cooling pump-valve module according to an embodiment of the present invention; Figure 2 This is an exploded view of a self-cooling pump-valve module according to an embodiment of the present invention; Figure 3 This is a partial structural schematic diagram of a self-heating pump-valve module according to an embodiment of the present invention. Figure 4 This is a partially exploded view of a self-heating pump-valve module according to an embodiment of the present invention; Figure 5 This is a cross-sectional view of a self-cooling pump-valve module according to some embodiments of the present invention; Figure 6 yes Figure 5 A partially enlarged structural diagram; Figure 7 This is a cross-sectional view of a self-cooling pump-valve module according to other embodiments of the present invention; Figure 8 yes Figure 7 The center circle shows an enlarged structural diagram at point A. Figure 9 yes Figure 7 The middle circle shows an enlarged structural diagram at point B.

[0018] Figure label: Self-cooling pump and valve module 100; Housing 10; Air inlet 11; First air inlet 111; Second air inlet 112; Air outlet 12; Flow space 13; First shell portion 14; Second shell portion 15; Sealing element 16; Air source 20; driving component 21; first driving end 211; second driving end 212; compression assembly 22; Thermally controlled valve assembly 30; valve body 31; thermo-actuated shape memory alloy wire 32; valve seat 33; Airflow drive unit 40; Mounting base 50; receiving cavity 51; cavity inlet 52; cavity outlet 53; mounting post 54; Circuit board 60; mounting hole 61; ventilation hole 62; mounting through hole 63; Sheath 70; Gas supply device 80; First direction F1; Second direction F2; Third direction F3. Detailed Implementation

[0019] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0020] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, features defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more. In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0021] The following description, with reference to the accompanying drawings, describes a self-cooling pump-valve module 100 for automotive seats according to an embodiment of the present invention.

[0022] like Figures 1-7 As shown, a self-cooling pump valve module 100 for automotive seats according to an embodiment of the present invention includes: an air source 20, a thermal control valve group 30, and an airflow drive unit 40.

[0023] Specifically, the air source 20 includes a driving component 21 and a compression assembly 22. The driving component 21 has a first driving end 211 and a second driving end 212. The first driving end 211 is connected to the compression assembly 22 to drive the compression assembly 22 to compress gas. A thermal control valve assembly 30 is connected to the air source 20 and is controlled to open and close by a thermo-actuated shape memory alloy wire 32. An airflow driving part 40 is located at the second driving end 212 and can rotate with the second driving end 212. When the self-cooling pump valve module 100 is located inside the car seat and is working, it drives the airflow at the thermo-actuated shape memory alloy wire 32 to dissipate heat.

[0024] The drive unit 21 can be, but is not limited to, an electric motor, and the compression assembly 22 can include a crank connecting rod, a pulley or gear-driven piston, a worm gear, or a scroll moving disk and a scroll stationary disk, etc. The gas source 20 is used to provide driving force for the airflow, and drives the compression assembly 22 to compress the gas through the drive unit 21, thereby providing power for the gas flow.

[0025] The first drive end 211 and the second drive end 212 can be, but are not limited to, a rotatable drive shaft, a reciprocating linearly movable telescopic rod, etc. Taking a rotatable drive shaft as an example, the first drive end 211 and the second drive end 212 can be along the same axial direction of the same drive shaft (e.g., Figure 5 The two ends of the first direction F1 shown can also be different drive shafts; and the first drive end 211 and the second drive end 212 can move synchronously or asynchronously; the arrangement of the first drive end 211 and the second drive end 212 can also be flexibly set as needed.

[0026] In some embodiments, the first drive end 211 and the second drive end 212 are coaxial. For example, the first drive end 211 and the second drive end 212 can be the two ends of the same drive shaft, or two drive shafts arranged coaxially. By arranging them coaxially, the space occupied by the first drive end 211 and the second drive end 212 in the radial direction of the drive member 21 can be reduced, which is beneficial to reducing the overall radial dimension of the self-cooling pump valve module 100 and meeting the installation requirements of the narrow space inside the car seat, for example, the radial direction of the self-cooling pump valve module 100 can be arranged along the thickness direction of the backrest of the car seat.

[0027] In some embodiments, the first drive end 211 and the second drive end 212 rotate simultaneously during operation. When the first drive end 211 rotates, it drives the compression assembly 22 to compress the gas. During this period, the heat generated by the self-cooling pump valve module 100 is higher. When the second drive end 212 rotates, it can drive the airflow drive unit 40 to dissipate heat. This allows for heat dissipation during periods of high heat generation to improve the heat dissipation effect, and for the absence of heat dissipation during periods of low heat generation to reduce energy consumption.

[0028] The thermally controlled valve assembly 30 refers to a component that uses changes in heat to achieve opening and closing control. Specifically, the length of the thermally actuated shape memory alloy wire 32 can change with its own temperature. For example, the thermal control valve assembly 30 may include a valve seat 33, a valve body 31, and a thermo-actuated shape memory alloy wire 32. The valve seat 33 has a channel that communicates with the flow path of the gas source 20. The valve body 31 is movably disposed in the channel of the valve seat 33. The two ends of the thermo-actuated shape memory alloy wire 32 form a circuit with the circuit board 60 through electrical connection terminals and the middle part is connected to the valve body 31. The circuit board 60 controls the energization state of the thermo-actuated shape memory alloy wire 32 to change the temperature of the thermo-actuated shape memory alloy wire 32. At low temperatures, the thermo-actuated shape memory alloy wire 32 softens and can be stretched. The valve body 31 can be reset under the action of the return spring and block the channel of the valve seat 33. At high temperatures, the length of the thermo-actuated shape memory alloy wire 32 shortens, and the pulling force on the valve body 31 increases. The valve body 31 can move to open the channel of the valve seat 33 under the action of the pulling force. Thus, the opening and closing of the thermal control valve assembly 30 can be driven by the change in length to realize the switching of the flow path.

[0029] The airflow drive unit 40 can be a fan, impeller, or oscillating blade, such as a suction fan, blower fan, axial fan, or centrifugal fan, as long as it can drive the flow of gas.

[0030] The self-cooling pump valve module 100 is located inside the seat cushion or backrest of a car seat. When it is working, it generates heat. However, the interior space of a car seat is limited, which means that the self-cooling pump valve module 100 is operating in a limited space. If the heat generated during its operation is not dissipated in time, the temperature of the environment where the thermally actuated memory alloy wire 32 is located will increase. The ambient temperature affects the temperature of the thermally actuated memory alloy wire 32, thereby affecting the opening and closing control of the thermally actuated memory alloy wire 32 on the thermally actuated control valve assembly 30. For example, when it is necessary to close the channel, the high ambient temperature causes the length of the thermally actuated memory alloy wire 32 to shorten, thus making it impossible to keep it closed.

[0031] Based on this, this application provides an airflow drive unit 40 at the second drive end 212 of the drive unit 21. The airflow drive unit 40 rotates under the drive of the second drive end 212, and drives the airflow at the thermo-actuated memory alloy wire 32 through rotation. This airflow removes the heat near the thermo-actuated memory alloy wire 32, preventing the ambient temperature from being too high and affecting the normal operation of the thermo-actuated memory alloy wire 32. This is beneficial to improving the accuracy and sensitivity of the opening and closing control of the thermal control valve group 30, preventing the self-heating pump valve module 100 from failing due to excessive heat during operation, ensuring that the self-heating pump valve module 100 can work normally, greatly improving work efficiency and service life, and enhancing the user experience.

[0032] Furthermore, in this application, the airflow drive unit 40 is driven to rotate by the drive member 21 used to drive the compressed gas of the compression assembly 22, which diversifies the function of the drive member 21. There is no need to set up a separate fan and drive structure for heat dissipation, which not only reduces the number of parts, but also makes the overall structure more compact, which is more conducive to meeting the installation requirements of the small installation space of car seats, while reducing costs.

[0033] In embodiments of the present invention, components such as the air source 20, the thermal control valve group 30, and the airflow drive unit 40 can be directly installed inside the cavity of the car seat, or they can be integrated into the same housing 10 and then installed inside the car seat. For example Figures 1-3 and Figures 5-7 As shown, the self-cooling pump valve module 100 also includes a housing 10. The housing 10 is provided with an air inlet 11 and an air outlet 12. Components such as the air source 20, the thermal action control valve group 30, and the airflow drive unit 40 are installed inside the housing 10. When the self-cooling pump valve module 100 is working, the airflow drive unit 40 rotates to drive the air flow inside the housing 10 to dissipate heat from the thermally actuated shape memory alloy wire 32. Specifically, external air enters the housing 10 through the air inlet 11, dissipates heat from the thermally actuated shape memory alloy wire 32, and then flows out through the air outlet 12.

[0034] By setting the housing 10, components such as the air source 20, the thermal control valve group 30, and the airflow drive unit 40 can be shielded and protected. Furthermore, the space inside the housing 10 can guide and limit the airflow driven by the airflow drive unit 40, allowing the airflow to better contact the thermally actuated shape memory alloy wire 32 and improving the heat dissipation effect of the thermally actuated shape memory alloy wire 32.

[0035] According to an embodiment of the present invention, the self-cooling pump valve module 100 for automotive seats has a driving component 21 of the air source 20 that not only drives the compression assembly 22 to compress gas, but also drives the airflow driving part 40 to dissipate heat. This is beneficial to improving the heat dissipation effect of the thermally actuated memory alloy wire 32 within the limited space, and improving its accuracy and sensitivity in driving opening and closing. Furthermore, the self-cooling pump valve module 100 has a simple overall structure and occupies little space, which is beneficial to meeting the installation requirements of automotive seats in limited spaces.

[0036] According to some embodiments of the present invention, such as Figure 2 and Figures 5-9 As shown, the thermal control valve assembly 30 includes a valve body 31, which is axially positioned relative to the drive member 21 (e.g., ...). Figure 5 As shown in the first direction F1, the thermo-actuated memory alloy wire 32 is located on one side of the air source body 20 in the radial direction of the drive member 21. The end of the thermo-actuated memory alloy wire 32 in the axial direction of the drive member 21 is connected to the valve body 31. The airflow drive part 40 is located on one side of the thermo-actuated memory alloy wire 32 in the axial direction of the drive member 21.

[0037] In the above embodiment, during the rotation of the airflow drive unit 40 driven by the drive member 21, the airflow drive unit 40 can generally drive the airflow to flow along the axial direction of the drive member 21, thereby flowing from one end of the thermo-actuated memory alloy wire 32 to the other end, thus carrying away the heat around the entire thermo-actuated memory alloy wire 32, making the entire thermo-actuated memory alloy wire 32 less prone to control failure due to excessively high ambient temperature. Furthermore, the airflow can not only flow through the thermo-actuated memory alloy wire 32, but also through other components of the self-cooling pump valve module 100, such as the air source body 20, thereby also providing heat dissipation for other components and improving the overall service life.

[0038] For example Figures 5-9 As shown, the drive component 21 is oriented vertically, the valve body 31 is located above the air source body 20, the airflow drive unit 40 is located below the air source body 20, and the thermo-actuated shape memory alloy wire 32 is located on the left or right side of the air source body 20. The upper end of the thermo-actuated shape memory alloy wire 32 is connected to the valve body 31, and the lower end is located above the airflow drive unit 40. Driven by the airflow drive unit 40, the airflow can flow vertically through the thermo-actuated shape memory alloy wire 32 to dissipate heat from the entire thermo-actuated shape memory alloy wire 32.

[0039] In some embodiments, such as Figure 2 and Figure 3 As shown, there are multiple thermally actuated control valve assemblies 30, and the thermally actuated shape memory alloy wires 32 of the multiple thermally actuated control valve assemblies 30 are located around the gas source body 20. For example, they can be located in the left-right direction of the gas source body 20 (e.g., Figure 3 On both sides of the second direction (as shown in F2), multiple thermally actuated shape memory alloy wires 32 on each side are arranged along the front-back direction (as shown in F2). Figure 3 The arrangement is shown in the middle third direction (F3).

[0040] By arranging multiple thermo-mechanical memory alloy wires 32 around the air source body 20, the airflow drive unit 40 can simultaneously drive the airflow around the multiple thermo-mechanical memory alloy wires 32, thereby simultaneously dissipating heat from the multiple thermo-mechanical memory alloy wires 32. This improves the control accuracy and sensitivity of the multiple thermo-mechanical memory alloy wires 32 and helps to reduce the number of required airflow drive units 40, thereby reducing costs and space occupation.

[0041] In some embodiments, such as Figure 1 and Figure 5 As shown, the air inlet 11 includes a first air inlet 111, which faces the connection between the valve body 31 and the thermally actuated shape memory alloy wire 32.

[0042] At the connection between the valve body 31 and the thermo-mechanical memory alloy wire 32 (e.g., the thermo-mechanical memory alloy wire 32 is wound around the valve body 31), the thermo-mechanical memory alloy wire 32 is located within the limited space of the valve body 31, which leads to a high concentration of heat generation. When current passes through the thermo-mechanical memory alloy wire 32, Joule heating is generated, causing it to undergo a phase change and contraction, while also making the connection a concentrated heat source. By directing the first air inlet toward the connection between the valve body 31 and the thermo-mechanical memory alloy wire 32, the external low-temperature air entering the housing 10 can first flow through the connection, thereby improving the heat dissipation effect at the connection between the valve body 31 and the thermo-mechanical memory alloy wire 32.

[0043] In some embodiments, such as Figure 1 As shown, the air inlet 11 includes a second air inlet 112, and multiple second air inlets 112 are spaced apart axially around the drive member 21. By providing multiple second air inlets 112, the total air intake area and air volume can be increased, thereby improving the heat dissipation effect. Furthermore, with a fixed total air intake area, the flow area of ​​each second air inlet 112 can be smaller to reduce the impact on the structural strength of the housing 10.

[0044] In some embodiments, such as Figure 1 and Figures 5-7 As shown, the air inlet 11 and the air outlet 12 are located on opposite sides of the thermo-mechanical memory alloy wire 32 along the axial direction of the drive member 21. For example, the air inlet 11 is on the upper side of the thermo-mechanical memory alloy wire 32, and the air outlet 12 is on the lower side of the thermo-mechanical memory alloy wire 32; or the air inlet 11 is on the lower side of the thermo-mechanical memory alloy wire 32, and the air outlet 12 is on the upper side of the thermo-mechanical memory alloy wire 32. In the above embodiment, the thermo-mechanical memory alloy wire 32 is located between the air inlet 11 and the air outlet 12, allowing airflow to pass through the thermo-mechanical memory alloy wire 32 more effectively, thus improving the overall heat dissipation effect of the thermo-mechanical memory alloy wire 32.

[0045] In some embodiments of the present invention, such as Figures 1-3 and Figures 5-7 As shown, the housing 10 includes a first housing portion 14 and a second housing portion 15 that are interlocked, and the first housing portion 14 and the second housing portion 15 are sealed together by a sealing member 16.

[0046] The housing 10 defines the inner cavity by the snap-fitting of the split first housing part 14 and the second housing part 15, which makes it easier to install components such as the air source 20, the airflow drive part 40 and the thermal control valve group 30. Furthermore, the sealing element 16 seals the mating area of ​​the first housing part 14 and the second housing part 15, making it difficult for the airflow flowing into the housing 10 from the air inlet 11 to leak from the mating gap between the first housing part 14 and the second housing part 15. External air is also less likely to enter the housing 10 from the mating gap between the first housing part 14 and the second housing part 15 and affect the flow direction of the heat dissipation airflow inside the housing 10. This ensures that the flow rate and direction of the heat dissipation airflow through the thermally actuated shape memory alloy wire 32 are stable, which is beneficial to improving the heat dissipation effect.

[0047] It should be noted that the first shell 14 and the second shell 15 can be arranged along the axial direction of the driving member 21 and interlocked with each other, or they can be arranged along the radial direction of the driving member 21 and interlocked with each other; the first shell 14 can be a single piece or a separate piece formed by connecting multiple shells; the second shell 15 can be a single piece or a separate piece formed by connecting multiple shells.

[0048] According to some embodiments of the present invention, such as Figures 2-7 As shown, the self-heating pump valve module 100 also includes a circuit board 60, which can be used to control the working state of the self-heating pump valve module 100. For example, the thermo-actuated memory alloy wire 32 can be electrically connected to the circuit board 60 to form a circuit. The opening and closing of the thermo-actuated memory alloy wire 32 can be controlled by the circuit board 60 supplying and disconnecting power to the thermo-actuated memory alloy wire 32.

[0049] Furthermore, in some embodiments, the airflow driving unit 40 can be located between the circuit board 60 and the driving member 21, that is, the airflow driving unit 40 and the driving member 21 are located on the same side of the circuit board 60, either both on the upper side or both on the lower side of the circuit board 60, making it convenient to connect the second driving end 212 of the driving member 21 to the airflow driving unit 40. Moreover, the airflow driving unit 40 is close to the circuit board 60, enabling it to drive airflow near the circuit board 60, thereby dissipating heat from the circuit board 60 and reducing the risk of high-temperature damage to electronic components on the circuit board 60.

[0050] It should be noted that, in the above embodiments, the second driving end 212 of the driving member 21 may be spaced apart from the circuit board 60, such as extending into the space between the circuit board 60 and the driving member 21 and having a gap with the circuit board 60; or the second driving end 212 of the driving member 21 may be connected to the circuit board 60, such as a bearing provided between the second driving end 212 and the circuit board 60, so that the second driving end 212 can rotate smoothly relative to the circuit board 60.

[0051] In other embodiments, such as Figures 5-7As shown, the drive member 21 and the airflow drive unit 40 can be located on opposite sides of the circuit board 60. For example, the drive member 21 is located on the upper side of the circuit board 60, and the airflow drive unit 40 is located on the lower side of the circuit board 60.

[0052] In the above embodiments, the airflow drive unit 40 can be disposed as close as possible to the end of the entire self-heating pump valve module 100, thereby driving airflow over a larger range of the self-heating pump valve module 100 and improving the heat dissipation effect of the entire self-heating pump valve module 100; and the airflow drive unit 40 is disposed close to the circuit board 60, which can also drive airflow near the circuit board 60, thereby dissipating heat from the circuit board 60 and reducing the risk of high-temperature damage to electronic components on the circuit board 60.

[0053] In some embodiments where the driving member 21 and the airflow driving part 40 are respectively provided on both sides of the circuit board 60, refer to... Figures 5-7 As shown, the circuit board 60 may be provided with a mounting through hole 63. The second drive end 212 passes through the mounting through hole 63 and is connected to the airflow drive unit 40. The thermo-actuated memory alloy wire 32 is electrically connected to the circuit board 60. By providing the mounting through hole 63, the connection between the second drive end 212 and the airflow drive unit 40 is convenient. Furthermore, the circuit board 60 and the second drive end 212 do not need to be radially offset in the drive component 21, thereby reducing the overall radial dimension and radial space occupied, and reducing the distance between the circuit board 60 and the airflow drive unit 40, thus improving the heat dissipation effect of the circuit board 60.

[0054] In the embodiments of this application, there may be one or more circuit boards 60. Multiple circuit boards 60 may be spaced apart along the axial direction of the drive member 21, so that the radial dimension of each circuit board 60 along the drive member 21 can be smaller, thereby reducing the radial space occupied. Depending on actual needs, adjacent circuit boards 60 may be electrically connected via connecting terminals.

[0055] The airflow drive unit 40 can be located on the side of the plurality of circuit boards 60 closest to the drive member 21 or on the side away from the drive member 21, or the airflow drive unit 40 can be located between two circuit boards 60. One or more circuit boards 60 located between the airflow drive unit 40 and the drive member 21 may be provided with mounting through holes 63, so that the second drive end 212 can pass through the mounting through holes 63 and connect to the airflow drive unit 40.

[0056] Optionally, the second drive end 212 may be clearance-fitted with the wall of the mounting through hole 63, or a bearing may be provided, or a protective sleeve 70 may be provided and the second drive end 212 may be rotatable relative to the protective sleeve 70, so as to reduce the impact of the rotation of the second drive end 212 on the structural stability of the circuit board 60.

[0057] According to some embodiments of the present invention, such as Figures 2-7As shown, the self-cooling pump-valve module 100 includes a mounting base 50, which is mounted on the side of the circuit board 60 near the airflow drive unit 40. For example, if the airflow drive unit 40 is located on the upper side of the circuit board 60, then the mounting base 50 is located on the upper side of the circuit board 60; if the airflow drive unit 40 is located on the lower side of the circuit board 60, then the mounting base 50 is located on the lower side of the circuit board 60. The mounting base 50 defines a receiving cavity 51, within which the airflow drive unit 40 is located.

[0058] The airflow drive unit 40 can be shielded and protected by the mounting base 50. The airflow drive unit 40 is located in the receiving cavity 51, which can drive the air flow in the receiving cavity 51. Then, the air flow in other areas can be driven through the cavity opening of the receiving cavity 51. It is easier for the airflow drive unit 40 to generate pressure difference and drive the airflow.

[0059] In the embodiments of this application, the connection methods between the circuit board 60 and the mounting base 50 include, but are not limited to, snap-fit, plug-in, and fastener connection. For example... Figure 4 As shown, one of the circuit board 60 and the mounting base 50 is provided with a mounting hole 61, and the other of the circuit board 60 and the mounting base 50 is provided with a mounting post 54 inserted into the mounting hole 61.

[0060] The circuit board 60 and the mounting base 50 can be connected by inserting the mounting post 54 into the mounting hole 61. The connection method is simple and does not easily obstruct the cavity inlet 52 and cavity outlet 53 of the mounting base, making the structure of the mounting base 50 simpler.

[0061] In some embodiments, such as Figures 3-7 As shown, the mounting base 50 has a cavity inlet 52 communicating with the receiving cavity 51, and the mounting base 50 has a cavity outlet 53, or the cavity outlet 53 is formed after the mounting base 50 is installed with the circuit board 60. Driven by the airflow drive unit 40, air can flow into the receiving cavity 51 through the cavity inlet 52 and then flow out through the cavity outlet 53. The airflow path is more orderly, which helps to improve the airflow effect of the entire self-cooling pump valve module 100, thereby improving the heat dissipation effect.

[0062] In some specific embodiments, such as Figure 7 As shown, the cavity inlet 52 can be located on the side of the airflow drive unit 40 away from the circuit board 60, so that the airflow drive unit 40 can draw air from the environment; correspondingly, the cavity outlet 53 can be located on the radial side of the airflow drive unit 40 (the airflow drive unit 40 can be a centrifugal fan), or it can be located on the side of the airflow drive unit 40 facing the circuit board 60 (the airflow drive unit 40 can be an axial fan).

[0063] In some embodiments including housing 10, reference continues to... Figure 7The air inlet 11 of the housing 10 can be located on the end wall directly opposite the cavity inlet 52, so that after the external air flows into the housing 10 through the air inlet 11, it can flow directly through the cavity inlet 52 to the airflow drive part 40, which helps to reduce the air intake resistance.

[0064] In some other specific embodiments, the cavity inlet 52 is located on the side of the airflow drive unit 40 near the circuit board 60, so that the airflow drive unit 40 can draw air from the vicinity of the circuit board 60 and blow it into the environment; correspondingly, the cavity outlet 53 can be located on the radial side of the airflow drive unit 40 (the airflow drive unit 40 can be a centrifugal fan), or it can be located on the side of the airflow drive unit 40 away from the circuit board 60 (the airflow drive unit 40 can be an axial fan).

[0065] In some embodiments, including the housing 10 and with the cavity outlet 53 located on the radial side of the airflow drive section 40, such as Figure 5 and Figure 6 As shown, the air outlet 12 of the housing 10 can be arranged radially opposite to the cavity outlet 53 along the drive member 21, so that the airflow blown out of the cavity outlet 53 can be blown out more smoothly through the air outlet 12, thereby reducing the airflow resistance and improving the overall heat dissipation effect.

[0066] Furthermore, in some embodiments where the airflow drive unit 40 is an axial fan, the rotation direction of the second drive end 212 can be switched by controlling the current direction of the drive member 21, thereby changing the rotation direction of the airflow drive unit 40 and thus changing the airflow pattern. For example, when the axial fan is located on the underside of the circuit board 60, it draws air from the circuit board 60 and blows air towards the side opposite to the circuit board 60 when rotating clockwise, and it draws air from the side opposite to the circuit board 60 and blows air towards the circuit board 60 when rotating counterclockwise.

[0067] In some embodiments, such as Figures 4-7 As shown, the circuit board 60 is provided with ventilation holes 62. The ventilation holes 62 allow airflow to pass through the circuit board 60, which not only reduces the airflow resistance at the airflow drive unit 40, but also increases the airflow through the circuit board 60, thereby improving the heat dissipation effect of the circuit board 60.

[0068] In some embodiments where there are multiple circuit boards 60, at least the circuit board 60 adjacent to the airflow drive unit 40 is provided with ventilation holes 62 to improve the effect of reducing the airflow resistance of the airflow drive unit 40.

[0069] For example Figure 5 and Figure 6As shown, the airflow drive unit 40 is a centrifugal fan and the mounting base 50 has an opening at one end facing the circuit board 60 as a cavity inlet 52. Driven by the airflow drive unit 40, the airflow passes through the ventilation hole 62 of the circuit board 60 from top to bottom and flows axially to the airflow drive unit 40 through the cavity inlet 52. By providing the ventilation hole 62, the air intake resistance at the cavity inlet 52 can be reduced.

[0070] According to some embodiments of the present invention, the mounting base 50 has a cavity inlet 52 communicating with the receiving cavity 51, and the mounting base 50 has a cavity outlet 53, or forms a cavity outlet 53 after being mounted with the circuit board 60. A flow guide may be provided between the cavity inlet 52 or the cavity outlet 53 and the thermo-actuated shape memory alloy wire 32, the flow guide being used to guide the airflow between the cavity inlet 52 or the cavity outlet 53 and the thermo-actuated shape memory alloy wire 32.

[0071] For example, the guide located between the cavity inlet 52 and the thermo-actuated memory alloy wire 32 can allow the airflow to flow through the thermo-actuated memory alloy wire 32 and then to the cavity inlet 52; the guide located between the cavity outlet 53 and the thermo-actuated memory alloy wire 32 can allow the airflow blown out of the cavity outlet 53 to flow through the thermo-actuated memory alloy wire 32.

[0072] Therefore, the airflow guide can allow the airflow driven by the airflow drive unit 40 to flow better through the thermally actuated memory alloy wire 32, thereby specifically dissipating heat from the thermally actuated memory alloy wire 32, and ensuring the heat dissipation effect of the thermally actuated memory alloy wire 32 even when the airflow is small.

[0073] Optionally, the specific structure of the flow guide is not limited. For example, the flow guide can be the entire housing 10, or a part of the housing 10, or the flow guide can be a shell structure connected to the car seat and surrounding the self-cooling pump valve module 100, as long as an air passage can be formed between the cavity inlet 52 or the cavity outlet 53 and the thermally actuated memory alloy wire 32.

[0074] The self-cooling pump-valve module 100 according to some specific embodiments of the present invention is described in detail below with reference to the accompanying drawings. It is to be understood that the following description is merely illustrative and should not be construed as limiting the invention.

[0075] like Figures 1-6 As shown, the self-cooling pump valve module 100 for automotive seats according to the first embodiment of the present invention is installed in the cavity of the automotive seat and includes a housing 10, an air source 20, a plurality of thermal control valve assemblies 30, an airflow drive unit 40, a mounting base 50, and two circuit boards 60 disposed within the housing 10. The air source 20 includes a drive member 21 and a compression assembly 22, and the thermal control valve assembly 30 includes a valve seat 33, a valve body 31, and a thermally actuated shape memory alloy wire 32.

[0076] The valve seat 33, compression assembly 22, drive member 21, circuit board 60 and airflow drive unit 40 are arranged sequentially from top to bottom. The drive member 21 is provided with a drive shaft, the upper end of which is formed as a first drive end 211 and the lower end of which is formed as a second drive end 212. The first drive end 211 is connected to the compression assembly 22 and is used to drive the compression assembly 22 to compress gas; the valve seat 33 is provided with a channel communicating with the flow channel of the compression assembly 22, and the outlet of the channel can be connected to the gas-using device 80 to supply gas to the gas-using device 80; the gas-using device 80 can be an air bag in a car seat, etc., for lumbar support, leg support, side wing adjustment or for massage; the valve body 31 is movably inserted into the valve seat 33; a flow space 13 is formed between the gas source body 20 and the housing 10, located radially outside the gas source body 20; the thermo-actuated memory alloy wire 32 is located in the flow space 13 and is generally U-shaped, with the two ends of the U-shape at the bottom and electrically connected to the circuit board 60, and the middle part of the U-shape at the top and connected to the valve body 31; the thermo-actuated memory alloy wire 32 is energized and de-energized under the control of the circuit board 60 to drive the valve body 31 to move, thereby realizing the switching of the channel of the valve seat 33.

[0077] The bottom circuit board 60 is provided with a ventilation hole 62. Below the circuit board 60 is a mounting base 50. The mounting base 50 has a cavity inlet 52 located above the airflow driving part 40. The cavity inlet 52 is directly opposite to the ventilation hole 62. The mounting base 50 and the circuit board 60 cooperate to define a cavity outlet 53. The cavity outlet 53 is located on the radial side of the airflow driving part 40.

[0078] The upper end of the housing 10 is provided with an air inlet 11 and the lower end is provided with an air outlet 12. The air outlet 12 is located on the side wall of the housing 10 and is opposite to the cavity outlet 53. The air inlet 11 includes a first air inlet 111 and a second air inlet 112. The first air inlet 111 is directly opposite the connection between the valve body 31 and the thermo-actuated memory alloy wire 32 in the vertical direction. There are multiple second air inlets 112 and they are arranged along the periphery of the top wall of the housing 10.

[0079] The airflow drive unit 40 is a centrifugal fan with top air intake and side air exhaust. Driven by the airflow drive unit 40, external air flows into the housing 10 through the first air inlet 111 and the second air inlet 112 at the top, and flows along the flow space 13 through the thermo-actuated shape memory alloy wire 32 for heat dissipation. Then, it flows downward to the circuit board 60. The airflow flows through the gap between the circuit board 60 and the side wall of the housing 10, the ventilation hole 62 of the circuit board 60, and the cavity inlet 52 to the airflow drive unit 40, and then is blown out radially outward through the cavity outlet 53 and the air outlet 12. In this way, the housing 10 is circulated with the outside air, and heat dissipation is achieved for the thermo-actuated shape memory alloy wire 32, the circuit board 60, the air source body 20, and other components.

[0080] like Figure 7The diagram shows a self-cooling pump valve module 100 for automotive seats according to a second embodiment of the present invention. The difference between this module and the first embodiment is that the top wall of the housing 10 has an air outlet 12, which is directly opposite the connection between the valve body 31 and the thermo-actuated memory alloy wire 32. The mounting base 50 has a cavity inlet 52 located below the airflow drive unit 40, and the bottom wall of the housing 10 has an air inlet 11 opposite to the cavity inlet 52. Driven by the airflow drive unit 40, external air flows into the housing 10 through the bottom air inlet 11 and flows through the cavity inlet 52 to the airflow drive unit 40. Then, it flows radially outward through the cavity outlet 53 to the flow space 13, flows along the flow space 13 past the thermo-actuated memory alloy wire 32, and flows upward to the connection between the valve body 31 and the thermo-actuated memory alloy wire 32. After heat dissipation, it flows out through the top air outlet 12.

[0081] In both the first and second embodiments described above, the airflow drive unit 40 can drive external air into the housing 10 and remove the heat around the thermally actuated shape memory alloy wire 32, enabling the thermally actuated shape memory alloy wire 32 to operate within a suitable temperature range. This greatly improves the accuracy and sensitivity of the channel opening and closing control, extends the overall service life, and the airflow drive unit 40 is integrated into the second drive end 212 of the drive component 21. This eliminates the need for a separate heat dissipation structure outside the housing 10 and a separate drive structure, which helps to save costs and space.

[0082] Other configurations and operations of the self-cooling pump-valve module 100 according to embodiments of the present invention are known to those skilled in the art and will not be described in detail here.

[0083] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0084] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A self-cooling pump valve module for automotive seats, characterized in that, include: The gas source body (20) includes a driving component (21) and a compression assembly (22). The driving component (21) is provided with a first driving end (211) and a second driving end (212). The first driving end (211) is connected to the compression assembly (22) to drive the compression assembly (22) to compress gas. A thermal action control valve assembly (30) is connected to the gas source body (20), and the thermal action control valve assembly (30) is controlled to open and close by a thermally actuated shape memory alloy wire (32). Airflow drive unit (40), which is located at the second drive end (212) and can rotate with the second drive end (212), is used to drive the airflow at the thermo-actuated memory alloy wire (32) for heat dissipation when the self-heating pump valve module (100) is located inside the car seat and is working.

2. The self-cooling pump valve module for automotive seats according to claim 1, characterized in that, The thermal action control valve assembly (30) includes a valve body (31), which is axially located at one end of the air source body (20) of the drive member (21). The thermo-actuated memory alloy wire (32) is located radially on one side of the air source body (20) of the drive member (21). One end of the thermo-actuated memory alloy wire (32) is connected to the valve body (31) axially on the drive member (21). The airflow drive unit (40) is located axially on one side of the thermo-actuated memory alloy wire (32) of the drive member (21).

3. The self-cooling pump valve module for automotive seats according to claim 2, characterized in that, There are multiple thermal action control valve groups (30), and the thermally actuated memory alloy wires (32) of the multiple thermal action control valve groups (30) are located on the periphery of the gas source body (20).

4. The self-cooling pump valve module for automotive seats according to any one of claims 1-3, characterized in that, It also includes a circuit board (60), the airflow drive unit (40) is located between the circuit board (60) and the drive member (21), or the drive member (21) and the airflow drive unit (40) are located on both sides of the circuit board (60).

5. The self-cooling pump valve module for automotive seats according to claim 4, characterized in that, The driving component (21) and the airflow driving part (40) are respectively disposed on both sides of the circuit board (60). The circuit board (60) is provided with a mounting through hole (63). The second driving end (212) passes through the mounting through hole (63) and is connected to the airflow driving part (40). The thermo-actuated memory alloy wire (32) is electrically connected to the circuit board (60).

6. The self-cooling pump valve module for automotive seats according to claim 4, characterized in that, Includes a mounting base (50) mounted on the side of the circuit board (60) near the airflow drive unit (40), the mounting base (50) defining a receiving cavity (51) in which the airflow drive unit (40) is located.

7. The self-cooling pump valve module for automotive seats according to claim 6, characterized in that, One of the circuit board (60) and the mounting base (50) is provided with a mounting hole (61), and the other is provided with a mounting post (54) inserted into the mounting hole (61).

8. The self-cooling pump valve module for automotive seats according to claim 6, characterized in that, The mounting base (50) has a cavity inlet (52) communicating with the receiving cavity (51), and the mounting base (50) has a cavity outlet (53) or forms a cavity outlet (53) after being mounted with the circuit board (60). The cavity inlet (52) is located on the side of the airflow drive unit (40) facing away from the circuit board (60), and / or the cavity inlet (52) is located on the side of the airflow drive unit (40) close to the circuit board (60).

9. The self-cooling pump valve module for automotive seats according to claim 8, characterized in that, The circuit board (60) is provided with ventilation holes (62).

10. The self-cooling pump valve module for automotive seats according to claim 6, characterized in that, The mounting base (50) has a cavity inlet (52) communicating with the receiving cavity (51). The mounting base (50) has a cavity outlet (53) or forms a cavity outlet (53) after being installed with the circuit board (60). A flow guide is provided between the cavity inlet (52) or the cavity outlet (53) and the thermo-actuated memory alloy wire (32). The flow guide is used to guide the airflow between the cavity inlet (52) or the cavity outlet (53) and the thermo-actuated memory alloy wire (32).

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